ATTACHING METHOD FOR PELLET WITH SOLDER
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专利名称：ATTACHING METHOD FOR PELLET WITH SOLDER
发明人：MIMATA TSUTOMU,ABE YOSHUKI
申请号：JP18200380
申请日：19801224
公开号：JPH028460B2
公开日：
19900223
专利内容由知识产权出版社提供
摘要：PURPOSE:To enable the attachment of a pellet inexpensively with high efficiency and good adhesive performance by spraying an inert gas hot jet to a solder piece to melt and spread the solder, and pressing the pellet on the solder. CONSTITUTION:A lead frame 14 is placed on a heat block 10 which contains a heater 12. A hard frame 14 is heated by the heater 12. A solder foil 16 is pressed by a vacuum collet 18 to the pellet mounting surface in a temporarily attached state. The foil 16 is further heated in an inert gas. When the lead frame becomes the predetermined temperature, inert gas hot jet 22 capable of melting the solder is sprayed from a jet nozzle 20 to the solder foil. A pellet 26 is pressed by a pyramidal collet 24 to the molten and spread solder to perform a srubbing operation. Thus, the pellet can be effectively bonded to the pellet mounting surface of the lead frame 14.
申请人：HITACHI LTD
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