A4VG 28 DAD
MEMORY存储芯片MT29F4G08ABADAWP-ITD中文规格书
NAND Flash MemoryMT29F4G08ABADAH4, MT29F4G08ABADAWP, MT29F4G08ABBDAH4, MT29F4G08ABBDAHC, MT29F4G16ABADAH4, MT29F4G16ABADAWP, MT29F4G16ABBDAH4, MT29F4G16ABBDAHC, MT29F8G08ADADAH4,MT29F8G08ADBDAH4, MT29F8G16ADADAH4, MT29F8G16ADBDAH4, MT29F16G08AJADAWPFeatures•Open NAND Flash Interface (ONFI) 1.0-compliant1•Single-level cell (SLC) technology •Organization–Page size x8: 2112 bytes (2048 + 64 bytes)–Page size x16: 1056 words (1024 + 32 words)–Block size: 64 pages (128K + 4K bytes)–Plane size: 2 planes x 2048 blocks per plane–Device size: 4Gb: 4096 blocks; 8Gb: 8192 blocks 16Gb: 16,384 blocks•Asynchronous I/O performance–t RC/t WC: 20ns (3.3V), 25ns (1.8V)•Array performance–Read page: 25µs 3–Program page: 200µs (TYP: 1.8V, 3.3V)3–Erase block: 700µs (TYP)•Command set: ONFI NAND Flash Protocol •Advanced command set–Program page cache mode4–Read page cache mode 4–One-time programmable (OTP) mode–Two-plane commands 4–Interleaved die (LUN) operations–Read unique ID–Block lock (1.8V only)–Internal data move•Operation status byte provides software method for detecting–Operation completion–Pass/fail condition–Write-protect status•Ready/Busy# (R/B#) signal provides a hardware method of detecting operation completion•WP# signal: Write protect entire device •First block (block address 00h) is valid when ship-ped from factory with ECC. For minimum required ECC, see Error Management.•Block 0 requires 1-bit ECC if PROGRAM/ERASE cy-cles are less than 1000•RESET (FFh) required as first command after pow-er-on•Alternate method of device initialization (Nand_In-it) after power up (contact factory)•Internal data move operations supported within the plane from which data is read•Quality and reliability–Data retention: 10 years–Endurance: 100,000 PROGRAM/ERASE cycles •Operating voltage range–V CC: 2.7–3.6V–V CC: 1.7–1.95V•Operating temperature:–Commercial: 0°C to +70°C–Industrial (IT): –40ºC to +85ºC•Package–48-pin TSOP type 1, CPL2–63-ball VFBGANotes: 1.The ONFI 1.0 specification is available at2.CPL = Center parting line.3.See Program and Erase Characteristics fort R_ECC and t PROG_ECC specifications.4.These commands supported only with ECCdisabled.Figure 78: TWO-PLANE BLOCK ERASERE#CE#ALECLE I/Ox R/B#WE#Figure 79: TWO-PLANE/MULTIPLE-DIE READ STATUS CycleCE#CLE ALE RE#I/Ox4Gb, 8Gb, 16Gb: x8, x16 NAND Flash MemoryTwo-Plane OperationsInterleaved Die (Multi-LUN) OperationsIn devices that have more than one die (LUN) per target, it is possible to improve per-formance by interleaving operations between the die (LUNs). An interleaved die (multi-LUN) operation is one that is issued to an idle die (LUN) (RDY = 1) while another die (LUN) is busy (RDY = 0).Interleaved die (multi-LUN) operations are prohibited following RESET (FFh), identifi-cation (90h, ECh, EDh), and configuration (EEh, EFh) operations until ARDY =1 for all of the die (LUNs) on the target.During an interleaved die (multi-LUN) operation, there are two methods to determine operation completion. The R/B# signal indicates when all of the die (LUNs) have finish-ed their operations. R/B# remains LOW while any die (LUN) is busy. When R/B# goes HIGH, all of the die (LUNs) are idle and the operations are complete. Alternatively, the READ STATUS ENHANCED (78h) command can report the status of each die (LUN) in-dividually.If a die (LUN) is performing a cache operation, like PROGRAM PAGE CACHE (80h-15h),then the die (LUN) is able to accept the data for another cache operation when status register bit 6 is 1. All operations, including cache operations, are complete on a die when status register bit 5 is 1.During and following interleaved die (multi-LUN) operations, the READ STATUS (70h)command is prohibited. Instead, use the READ STATUS ENHANCED (78h) command to monitor status. This command selects which die (LUN) will report status. When two-plane commands are used with interleaved die (multi-LUN) operations, the two-plane commands must also meet the requirements in Two-Plane Operations.See Command Definitions for the list of commands that can be issued while other die (LUNs) are busy.During an interleaved die (multi-LUN) operation that involves a PROGRAM series (80h-10h, 80h-15h) operation and a READ operation, the PROGRAM series operation must be issued before the READ series operation. The data from the READ series opera-tion must be output to the host before the next PROGRAM series operation is issued.This is because the 80h command clears the cache register contents of all cache regis-ters on all planes.4Gb, 8Gb, 16Gb: x8, x16 NAND Flash MemoryInterleaved Die (Multi-LUN) OperationsError ManagementEach NAND Flash die (LUN) is specified to have a minimum number of valid blocks(NVB) of the total available blocks. This means the die (LUNs) could have blocks thatare invalid when shipped from the factory. An invalid block is one that contains at leastone page that has more bad bits than can be corrected by the minimum required ECC.Additional blocks can develop with use. However, the total number of available blocksper die (LUN) will not fall below NVB during the endurance life of the product.Although NAND Flash memory devices could contain bad blocks, they can be usedquite reliably in systems that provide bad block management and error-correction algo-rithms. This type of software environment ensures data integrity.Internal circuitry isolates each block from other blocks, so the presence of a bad blockdoes not affect the operation of the rest of the NAND Flash array.NAND Flash devices are shipped from the factory erased. The factory identifies invalidblocks before shipping by attempting to program the bad block mark into every loca-tion in the first page of each invalid block. It may not be possible to program every loca-tion with the bad block mark. However, the first spare area location in each bad block isguaranteed to contain the bad block mark. This method is compliant with ONFI FactoryDefect Mapping requirements. See the following table for the first spare area locationand the bad block mark.System software should check the first spare area location on the first page of eachblock prior to performing any PROGRAM or ERASE operations on the NAND Flash de-vice. A bad block table can then be created, enabling system software to map aroundthese areas. Factory testing is performed under worst-case conditions. Because invalidblocks could be marginal, it may not be possible to recover this information if the blockis erased.Over time, some memory locations may fail to program or erase properly. In order toensure that data is stored properly over the life of the NAND Flash device, the followingprecautions are required:•Always check status after a PROGRAM or ERASE operation•Under typical conditions, use the minimum required ECC (see table below)•Use bad block management and wear-leveling algorithmsThe first block (physical block address 00h) for each CE# is guaranteed to be validwith ECC when shipped from the factory.Table 21: Error Management DetailsTable 21: Error Management Details (Continued)。
A4VG250维修手册
Reparaturanleitung A4VG 250 / Baureihe 32Repair instructionsA4VG 250 / Series 32Reparaturanleitung A4VG Repair Instructions A4VGRDE 92003-04-R/12.992 Brueninghaus HydromatikHINWEISBezeichnungen, Beschreibungen und Darstellungen entsprechen dem Informationsstand zum Zeitpunkt der Drucklegung dieser Unterlage.Änderungen können den Service am Produkt beein-flussen, Verpflichtungen entstehen uns daraus nicht.Methoden und Vorrichtungen sind Empfehlungen, für deren Resultat wir keine Haftung übernehmen können.BRUENINGHAUS HYDROMATIK- Baugruppen, mit Anga-be der Fabrik-Nr. bestellt, sind die Basis guter Reparatu-ren.Einstell- und Prüfarbeiten sind bei Betriebstemperatur auf dem Teststand vorzunehmen.Schutz von Personen und Eigentum ist durch Vor-kehrungen sicherzustellen.Sachkenntnis, die Voraussetzung für jede Service-arbeit,vermitteln wir in unseren Schulungskursen.NOTICESpecifications, descriptions and illustrative materialshown herein were as accurate as known at the time this publication was approved for printing.BRUENINGHAUS HYDROMATIK reserves the right to discontinue models or options at any time or to change speci-fications, materials, or design without notice and with-out incurring obligation.Optional equipment and accessories may add cost to the basic unit, and some options are available only in combination with certain models or other options.For the available combinations refer to the relevant data sheet for the basic unit and the desired option.Adjustment and tests have to be carried out on the test bench under operating temperatures.Protection of personnel and property has to be guar-anteed by appropriate measures.Expert knowledge, the precondition of any service work,can be obtained in our training courses.Hinweis / Inhalt Notice / Contents 2INHALTSeite/PageA4VGSchnittbild3-4Allgemeine Reparaturhinweise 5Dichtsätze und Baugruppen 6-8Triebwelle abdichten 9Hilfspumpe abdichten10-12Stellkolbendeckel abdichten 13-15Speisedruckventil abdichten16Druckbegrenzungsventil abdichten 17Druckabschneidung abdichten 18Ansteuergerät abdichten 19Ansteuergerät HW 20Ansteuergerät HD 21Ansteuergerät EP 22Ansteuergerät DA23Regelventil abdichten / überprüfen 24Pumpe demontieren 25-28Verstellung demontieren 29-31Zylinder demontieren32Anschlußplatte überprüfen 33Überprüfungshinweise34-35Stellkolben, Triebwerk montieren 36-39Triebwerk einbauen 40-42Pumpe montieren43-47Montageanweisung für Anziehdrehmomente 48-52Sicherheitsbestimmungen 53-54Einstellhinweise55-61CONTENTSA4VGSectional viewGeneral repair instructionsSeal kits and sub assembly groups Sealing of the drive shaft Sealing of the boost pumpSealing of the control piston cover Sealing of the boost pressure valve Sealing of the pressure relief valve HD Sealing of the pressure cut-off valve Sealing of the control device Control device HW Control device HD Control device EP Control device DASealing of the regulator valve Pump disassemblyDismantling of the control Dismantling of the cylinder Checking the port plate Inspection notesPositioning piston, rotary group assembly Installation of the rotary group Assembly of the pumpAssembly guidelines for tightening torques Safety regulationsAdjustment instructionsReparaturanleitung A4VG Repair Instructions A4VGRDE 92003-04-R/12.99Brueninghaus Hydromatik 3Schnittbild Sectional viewReparaturanleitung A4VG Repair Instructions A4VGRDE 92003-04-R/12.994 Brueninghaus HydromatikSchnittbild Sectional viewReparaturanleitung A4VG Repair Instructions A4VGRDE 92003-04-R/12.99Brueninghaus Hydromatik 5Reparaturanleitung A4VG Repair Instructions A4VGRDE 92003-04-R/12.996 Brueninghaus HydromatikDichtsätze und BaugruppenSeal kits and sub assembly groups Dichtsatz für Triebwelle.Seal kit for drive shaft.Triebwerk plete rotary group.Äußerer Dichtsatz.External seal kit.Stellkolben Positioning pistonAnschlußplatte 1. HD-Ventile2. Speisedruckventil3. DA-Regelventil Valve plate 1. HD valve2. Boost pressure valve3. DA control valve3Reparaturanleitung A4VG Repair Instructions A4VGRDE 92003-04-R/12.99Brueninghaus Hydromatik 7Baugruppen Sub assemblies Ansteuergeräte HW, HD, EP Control device HW, HD, EPHilfspumpe Boost pumpAnsteuergerät DA Control device DAHWHDReparaturanleitung A4VGRepair Instructions A4VG RDE 92003-04-R/12.998 Brueninghaus Hydromatik Druckabschneidung Pressure cut-offBaugruppenSub assembliesHD - VentilHD - High pressure valveND - VentilND - Low pressure valveReparaturanleitung A4VG Repair Instructions A4VGRDE 92003-04-R/12.99Brueninghaus Hydromatik 9Triebwelle abdichten Sealing of the drive shaft * Scheibe ausbauen.Blechschraube in die mit Gummi gefüllten Löcher eindrehen.Mit Zange WDR herausziehen.* Remove disc.Screw in sheet metal screw into the holes fitted with rubber.Pull out shaft seal with pliers.Wellendichtring mit Buchse auf Anschlag einpressen.Sicherungsring einbauen.Press-in shaft seal with bush to the end stop.Assemble retaining ring.Triebwelle abkleben.Sicherungsring ausbauen.Protect the drive shaft.Remove retaining ring.Reparaturanleitung A4VG Repair Instructions A4VGRDE 92003-04-R/12.9910 Brueninghaus HydromatikHilfspumpe abdichten Sealing of the boost pump Befestigungsschrauben ausbauen.Remove fixing screws.Deckel abdrücken.Deckel nicht beschädigen.Pry-off cover.Do not damage the coverO-Ring ausbauen.Remove O-ring.RDE 92003-04-R/12.99Hilfspumpe abdichten Sealing of the boost pumpReparaturanleitung A4VG Repair Instructions A4VGHilfspumpe abdrücken. Abdrückschlitz und Unterlage benutzen!Pry off the boost pump. Use protective support pads andthe pry-off slots!O-Ring ausbauen. Remove O-ring.Verschleißplatte demontieren. Remove the wear plate.Hilfspumpe auf Verschleiß kontrollieren. Check the boost pump for wear.Verschleißplatte aufsetzen und verschrauben. Breite Seite auf Steg. Fit wear plate. Wide side to the web.Brueninghaus Hydromatik11RDE 92003-04-R/12.99Hilfspumpe abdichten Sealing of the boost pumpReparaturanleitung A4VG Repair Instructions A4VGDrehrichtung Einbaulage beachten!Direction of rotation Linkslauf / Anti-clockwise Steg Take care over the installation position!Rechtslauf / ClockwiseStegHilfspumpe montieren. Montagehilfe: Bohrung Fit boost pump. Assembly aid: drillingO-Ring und Deckel montieren. Fit O-ring and cover plate.12Brueninghaus HydromatikRDE 92003-04-R/12.99Stellkolbendeckel abdichten bzw. Druckfeder austauschen Sealing of the control piston cover / exchanging the compression springReparaturanleitung A4VG Repair Instructions A4VGLage kennzeichnen. Mark position.Deckel verdrehen und mit leichten Hammerschlägen lösen. Rotate cover and release by tapping gently with a hammer.Brueninghaus Hydromatik13RDE 92003-04-R/12.99Stellkolbendeckel abdichten bzw. Druckfeder austauschen Sealing of the control piston cover / exchanging the compression springReparaturanleitung A4VG Repair Instructions A4VGDeckel kennzeichnen. Maß festhalten, Kontermutter lösen, Stellschraube gegenhalten. Mark cover, dimension must be held, loosen lock nut, hold adjustment screw.Befestigungsschrauben ausbauen. Remove fixing screws.Deckel mit Stellschraube "abdrehen". Lift off by turning the setting screw.1Kontrolle! O-Ring (1), Nut (2), Gehäuse (3). Achtung! Korrekte mechanische 0-Lageneinstellung überprüfen!223Check! O-ring (1), groove (2), housing (3). Attention! Check correct mechanical 0-position.14Brueninghaus HydromatikRDE 92003-04-R/12.99Stellkolbendeckel abdichten bzw. Druckfeder austauschen Sealing of the control piston cover / exchanging the compression springReparaturanleitung A4VG Repair Instructions A4VG1 21 2 1. Sicherungskappe abbauen. 2. Geteilte Ringe ausbauen. Ringe nicht vertauschen.221. Remove safety cap. 2. Remove the split rings. Do not exchange the rings3. Mit Vorrichtung Federteller gegen Feder vorspannen. 4. Sicherungsring ausbauen. 5. Federteller mit Feder entspannen und ausbauen. ⇒ Montage in umgekehrter Reihenfolge. 3. Using an aid pre-tension the spring plates against the spring. 4. Remove circlip. 5. Untension the spring plates and spring - then remove. ⇒ Re-assemble in revers order.Brueninghaus Hydromatik15RDE 92003-04-R/12.99Speisedruckventil abdichten Sealing of the boost pressure valveReparaturanleitung A4VG Repair Instructions A4VGAnziehdrehmoment / Tightening torque 70 ± 10 NmVentil komplett ausbauen. Hinweis: Einstellschraube nicht verändern. Achtung! Nach Einbau Ventileinstellung überprüfen! Remove valve completely: Note: Do not change adjustment screw. Attention! Check valve setting after installation.16Brueninghaus HydromatikRDE 92003-04-R/12.99Druckbegrenzungsventil abdichten Sealing of the pressure relief valve HDReparaturanleitung A4VG Repair Instructions A4VGDirektgesteuert / Direct actuated 240 ± 10 NmVorgesteuert / pilot actuated 200 ± 10 NmVentil komplett ausbauen. Kontrolle: O-Ring, Gehäuse. Wechsel der Dichtmutter - Einstellmaß (*) festhalten. Achtung! Nach Einbau "Ventileinstellung" überprüfen. Remove valve completely. Check: O-ring, housing. Replacement of the sealing nut, record dimension (*). Attention! After assembly check "valve setting". Anziehdrehmoment vorgesteuert / Tightening torque pilot operated 200 ± 10 Nm Anziehdrehmoment direktgesteuert / Tightening torque direct operated 240 ± 10 Nm *Brueninghaus Hydromatik 17RDE 92003-04-R/12.99Druckabschneidung abdichten Sealing of the pressure cut-offReparaturanleitung A4VG Repair Instructions A4VGAnziehdrehmoment / Tightening torque 50 ± 10 Nm* Einstellteil komplett ausschrauben. Kontrolle: O-Ring, Gehäuse. Wechsel der Dichtmutter - Einstellmaß (*) festhalten. Achtung! Nach Einbau "Ventileinstellung" überprüfen. Unscrew setting cartridge completely. Check: O-ring, housing. Replacement of the sealing nut, record dimension (*). Attention! After assembly check "valve setting".18Brueninghaus HydromatikRDE 92003-04-R/12.99Ansteuergerät abdichten Sealing of the control deviceReparaturanleitung A4VG Repair Instructions A4VGDA HDHW DAEPAnsteuergerät abbauen. NG 250 Remove control device.Brueninghaus Hydromatik19RDE 92003-04-R/12.99Ansteuergerät HW Control device HWReparaturanleitung A4VG Repair Instructions A4VGKontrolle: O-Ringe und Dichtung. Check: O-rings and seal.20Brueninghaus HydromatikRDE 92003-04-R/12.99Ansteuergerät HD Control device HDReparaturanleitung A4VG Repair Instructions A4VGKontrolle: O-Ringe Check: O-ringsBrueninghaus Hydromatik21RDE 92003-04-R/12.99Ansteuergerät EP Control device EPReparaturanleitung A4VG Repair Instructions A4VGKontrolle: O-Ringe und Dichtung. Check: O-rings and seal.22Brueninghaus HydromatikRDE 92003-04-R/12.99Ansteuergerät DA Control device DAReparaturanleitung A4VG Repair Instructions A4VGKontrolle: O-Ringe Check: O-ringsAblaufdrossel / Meter-out throttleBrueninghaus Hydromatik23RDE 92003-04-R/12.99Regelventil abdichten/überprüfen Sealing of the regulator valveReparaturanleitung A4VG Repair Instructions A4VGAnziehdrehmoment / Tightening torque 75 ± 10 NmBlende überprüfen. Keine Beschädigung. Inspect orifice. No damage.DA-Ventil ohne Hebel Gewinde abkleben. O-Ring einsetzen. DA valve without lever. Tape up thread. Fit O-ring.DA-Ventil mit Hebel. Gewinde abkleben. O-Ring einsetzen. (Umbau Drehrichtung siehe Serviceinfo). DA valve with lever. Tape up thread. Fit O-ring. (Direction of rotation see service info).24 Brueninghaus HydromatikRDE 92003-04-R/12.99Pumpe demontieren Removing of the pumpReparaturanleitung A4VG Repair Instructions A4VGVerdrillschraube Index. screwVerschlußschraube / Stift Plug / pinAnsteuergerät abbauen. Remove control device.Hilfspumpe ausbauen. Hinweis: Einbaulage kennzeichnen. Remove boost pump. Note: Mark assembly location.Brueninghaus Hydromatik25RDE 92003-04-R/12.99Pumpe demontieren Pump disassemblyReparaturanleitung A4VG Repair Instructions A4VGLage der Verdrillschraube markieren (1). Einstellmaß festhalten (2). Verdrillschraube auf Demontageposition stellen (3). Mark the position of the indexing screw (1). Record setting dimension (2). Set the indexing screw to disassembly position (3).2 1 3Lage der Hilfspumpe und Anschlußplatte markieren. Anschlußplattenbefestigung lösen. Mark position of the boost pump and connection plate. Loosen connection plate bolts.Anschlußplatte und Steuerplatte abheben. Lift off port plate and control plate.26Brueninghaus HydromatikRDE 92003-04-R/12.99Pumpe demontieren Pump disassemblyReparaturanleitung A4VG Repair Instructions A4VG1. Zylinder nach unten drücken. 2. Verdrillschraube herausdrehen. 1 1 Zylinderfläche nicht beschädigen! 1. Press the cylinder downwards. 2. Remove fixing indexing screw. Do not damage the cylinder surface!2Zylinder komplett mit Kolben und Rückzugeinrichtung ausbauen. Remove the cylinder with pistons and retaining system.Brueninghaus Hydromatik27RDE 92003-04-R/12.99Pumpe demontieren Pump disassemblyReparaturanleitung A4VG Repair Instructions A4VGSeegerring / WDR ausbauen. Remove Seeger-ring and shaft seal.Triebwelle mit leichten Hammerschlägen austreiben. Remove drive shaft with light hammer strokes.Schwenkwiege / Lager komplett ausbauen. Remove swash plate / bearings.Gelenkstifte ausbauen. Remove the swivel.28Brueninghaus HydromatikRDE 92003-04-R/12.99Verstellung demontieren Dismantling of the controlReparaturanleitung A4VG Repair Instructions A4VGBefestigungsschrauben lösen. Loosen fixing screws.Brueninghaus Hydromatik29RDE 92003-04-R/12.99Verstellung demontieren Dismantling of the controlReparaturanleitung A4VG Repair Instructions A4VGDeckel verdrehen und mit leichten Hammerschlägen lösen. Rotate cover and release by tapping gently with hammer.Deckel kennzeichnen. Maß festhalten, Kontermutter lösen, Stellschraube gegenhalten. Mark cover. Dimension must be held, loosen lock nut, hold adjustment screw.Befestigungsschrauben ausbauen. Remove fixing screws.Deckel mit Stellschraube "abdrehen". Lift off by turning the setting screw.30Brueninghaus HydromatikReparaturanleitung A4VG Repair Instructions A4VGVorrichtung aufsetzen und Feder vorspannen.Sicherungskappe ausbauen.Fit tool device and preload spring.Remove safety cap.Verstellung demontieren Dismantling of the control Ringe ausbauen.Sicherungsring ausbauen.Achtung: Teile stehen unter Federvor-spannung.Remove rings.Remove circlip.Attention: Parts are under spring load.Stellzylinder ausbauen.Remove positioning cylinder.Reparaturanleitung A4VG Repair Instructions A4VGZylinder demontieren Dismantling of the cylinderKolben mit Rückzugeinrichtung ausbauen.Rückzugkugel mit Druckfedern abheben.Remove piston with retaining plate.Remove retaining ball complete with the compression springs.Reparaturanleitung A4VG Repair Instructions A4VGAnschlußplatte überprüfen Check the connection plate * Lagerbuchse kontrollieren.Bei Austausch der Lagerbuchsen Einbaulage beachten!* Check bearing bush.Take the installation attitude into account when changing the bearing bushes.G:Meßstelle Speisedruck / Boost pressure test point F A :Filterausgang / Filter outlet F E :Filtereingang / Filter inletM A :Meßstelle / Test point M A :Meßstelle HD / Test point HD 1Verschlußstopfen bei Druckfilterung /Plug with pressure filtration2Düse für Vorsteuerung / Orifice for pilot control3Bei DA-Steuerung kein Verschluß-stopfen / With DA control, plug is not fitted.3Reparaturanleitung A4VG Repair Instructions A4VGKontrolle!1. Verzahnung "ausgeschlagen", Passungsrost.2. Laufflächen.3. Lauffläche - Wellendichtring.Check!1. Splines for damage or fretting.2. Running surfaces.3. Running surface - shaft seal.Überprüfungshinweise Inspection notes Kontrolle!Käfig-Paar (1),Lagerschalenpaar (2).Check!Cage set (1),Bearing cup set (2).Kontrolle!Gleitfläche riefenfrei.Check!Sliding surface free from scoring.Kontrolle!Lagerbahnen (1)Check!Bearing surfaces (1)Kontrolle!Rückzugeinrichtung riefenfrei.Check!Check that return device is free of scoring.BearingBearing cupReparaturanleitung A4VG Repair Instructions A4VGKontrolle!Lauffläche (1) keine Kratzer, keine Metallein-lagerungen,kein Axialspiel (2), (Kolben nur satzweise tauschen).Check!Check that there are no scratches or metal deposits on the sliding surface (1), and there is no axial play (2), (otherwise: pistons must only be replaced in sets).Überprüfungshinweise Inspection notes Kontrolle!Zylindergleitfläche (1) riefenfrei.Steuerplatte (2) nicht riefig.Check!Cylinder sliding surface (1) free of scoring.Control plate (2) without scoring.Kontrolle!Zylinderbohrungen (1), Verzahnungen (2).Check!Cylinder bores (1), splines (2).Kontrolle!Stellkolben - SchwenkwiegenverbindungGleitstein (1), Nut im Stellkolben (2), Stellkolben.Check!Positioning piston - swivel linkage connection Gliding stone (1), groove in the positioning piston (2).Positioning piston.Reparaturanleitung A4VG Repair Instructions A4VGStellkolben, Triebwerk montierenPositioning piston, rotary group assembly Stellkolben montieren.Hinweis:Auf korrekten Sitz der geteilten Ringe "achten".Assemble positioning piston.Note:Take care that the divided rings are correctly located.Gehäuse - Turcon-Glyd-Ring montieren / Assemble housing - Turcon-Glyd-ringMontage / Assembly A4VGPos. /Item 1Pos. /Item 2 / 3Pos. /Item 2 / 3Pos. /Item 1Hilfswerkzeuge / Auxiliary tools:Montagezange / Assembly pliers: B+S x M22Führungsdorn / Guide pin:A4VG28I: 277 4 347A4VG40I: 277 4 049A4VG56I: 277 4 050A4VG71I: 277 4 051A4VG90I: 277 4 052A4VG125I: 277 4 053A4VG180I: 277 4 054A4VG250I: 277 4 072Reparaturanleitung A4VG Repair Instructions A4VGStellkolben, Triebwerk montierenPositioning piston, rotary group assemblyGeh äuse - Turcon-Glyd-Ring montieren / Assemble housing - Turcon-Glyd-ring2Reparaturanleitung A4VG Repair Instructions A4VGStellkolben, Triebwerk montierenPositioning piston, rotary group assembly Stellkolben mit Führungsdorn ins Gehäuse einsetzen.Hinweis:Stellkolben vor Einbau einölen.Insert positioning piston with guide pin into the housing.Note:Oil positioning piston before assembly.1. Deckel montieren.2. Nullage nach Maß einstellen.Achtung!Korrekte mechanische 0-Lageneinstellung überprüfen!1. Assemble cover.2. Adjust zero position to the recorded measurement.Attention!Check correct mechanical 0-position.Reparaturanleitung A4VG Repair Instructions A4VGLager, Draht, Gleitstein und Gelenkstift montieren.Montagehilfe: z.B. - Klammer Assemble bearing, wire, gliding stone and articulating pin.Assistance: Devices e.g. - ClampStellkolben, Triebwerk montierenPositioning piston, rotary group assembly Lagerschalenpaar einsetzen.Insert bearing cup set.Schwenkwiege komplett ins Gehäuse einsetzen.Auf korrekten Sitz der Schwenklager im Gehäuse "achten".Montagehilfe ausbauen.Insert completely swivel cradle into the housing.Pay attention for correct seat of the swivel cradle in the housing.Remove auxiliary device.Reparaturanleitung A4VG Repair Instructions A4VGTriebwerk einbauenInstallation of the rotary groupReparaturanleitung A4VG Repair Instructions A4VGTriebwerk einbauenInstallation of the rotary group Teil/Part 3Teil/Part 4Haltevorrichtung "Schwenkwiege" A4VHolding device "swivel cradle" A4VTeil/Part 5Teil/Part 11Pos./ItemBenennung/DesignationStck./Qty.1Winkel/Angle22Gewindestift/Threaded pin23Scheibe/Shim 24Scheibe/Shim 25Scheibe/Shim26Zyl. Schraube/Cyl. screw M12 x 25 DIN 91227Zyl. Schraube/Cyl. screw M14 x 25 DIN 91228Zyl. Schraube/Cyl. screw M16 x 30 DIN 91229Zyl. Schraube/Cyl. screw M20 x 35 DIN 912210Zyl. Schraube/Cyl. screw M24 x 35 DIN 912211Scheibe/Shim23, 4, 5, 1121Reparaturanleitung A4VG Repair Instructions A4VGTriebwerk einbauenInstallation of the rotary groupNeue Montageposition!Triebwelle mit Lager und Wellendichtring einbauen.New assembly position!Assemble drive shaft with bearings and shaft seal.Vorrichtung ausbauen.Zylinder mit Kolben und Rückzugseinrichtung einbauen.Remove holding device.Fit cylinder complete with pistons and retaining device.Reparaturanleitung A4VGRepair Instructions A4VGMontagehilfe:Mit O-Ring über Kolben Rückzugeinrichtungfesthalten.Lauffläche Schwenkwiege leicht einölen.Zylinder mit Kolben-Gleitschuh in waagrechter Position einsetzen.Federn in der Rückzugkugel können ausrasten. Assembly aid:Hold retaining system in place using an O-ring over the pistons.Lightly oil the swivel plate running surface.Fit the cylinder with pistons - slipper pads in the horizontal position.Springs in the retaining ball can jump out.Reparaturanleitung A4VG Repair Instructions A4VGSteuerplatte Rechtslauf - in Drehrichtung verdreht.Achtung!Geräuschkerben sind drehrichtungsbezogen ein-geschliffen.Control plate clockwise rotation - indexed in the direction of rotation.Note!Noise grooves are machined - based on directionof rotation.Grundeinstellung - Verdrillschraube A4VG...250 * = 25 ± 0,75 mm Basic setting - indexing screw A4VG...250 * = 25 ± 0,75 mmSteuerplatte Linkslauf - in Drehrichtung verdreht.Achtung!Geräuschkerben sind drehrichtungsbezogen ein-geschliffen.Control plate counter clockwise rotation -indexed in the direction of rotation.Note!Noise grooves are machined - based on direction of rotation.Zylinder nach unten drücken (1).Verdrillschraube einbauen (2).Kerbe in Montageposition.Press the cylinder downwards (1).Screw in the indexing screw (2).Groove in assembly position.Pumpe montieren (Steuerplatte DA-Ausführung)Assembly of the pump (Control plate DA-Design)3Reparaturanleitung A4VG Repair Instructions A4VGPumpe montieren Assembly of the pump Steuerplatte einsetzen - Linkslauf.Insert the control plate - Anti-clockwise rotation.Steuerplatte EP, HD, HW usw.Control plate EP, HD, HW etc.Beispiel: LinkslaufExample: anti-clockwise rotationRechtslauf / ClockwiseLinkslauf / Anti-clockwiseReparaturanleitung A4VG Repair Instructions A4VGSteuerplatte mit Fett einsetzen.Montagehilfe: Mit Softhammer Steuerplatteauf Anschlußplatte zentrieren.Nut für Excenterschraube ausrichtenFit the control plate using grease.Assembly aid: Centralise the control plate onthe connection plate by using asoft hammer.Position the screw for the eccentric screw. Pumpe montierenAssembly of the pumpNeue Montageposition:Vorsicht: Steuerplatte ist nur mit Fett ange-klebt!Anschlußplatte aufbauen.Achtung! Federvorspannung!Mit zwei Befestigungsschrauben überkreuzAnschlußplatte in Gehäuseführung einsetzen.Steuerplatten - Nut ⇒ ExcenterschraubeNew assembly position:Note: The control plate is only held in positionby the grease!Assemble connection plate.Attention! Spring preloaded!Insert control plate into housing, guidancewith two fixing screws crossed over from eachother.Control plate - groove ⇒eccentric screwReparaturanleitung A4VG Repair Instructions A4VGPumpe montieren Assembly of the pumpBei DA-Ausführung: Verdrillschraube nachMarkierung ausrichten.DA-Design:Position the indexing screw to thelocation mark.Hilfspumpe montieren.Einbaulage für Drehrichtung beachten!Siehe Seite xx.Assemble boost pump.Take the installation orientation, for direction ofrotation, into account.See page xx.Reparaturanleitung A4VG Repair Instructions A4VGMontageanweisung für Anziehdrehmomente Assembly guidelines for tightening torques 1.Schaftschrauben (nach N 08.001)Die Werte gelten für Schaftschrauben mit metri-schem ISO-Gewinde nach DIN 13 T eil 13, sowie Kopfauflagemaßen nach DIN 912 Zylinder-schrauben, DIN 931 Sechskantschrauben mit Schaft bzw. DIN 933 Sechskantschrauben mit Gewinde bis Kopf.Festigkeitsklassen / Tensile strength classGewinde / Thread 8.8 10.9 12.9Anziehdrehmoment / Tightening torque M A in Nm M 31,11,61,9M 43,14,55,3M 56,18,910,4M 610,415,518M 8253743M 10517587M 1287130150M 14140205240M 16215310370M 183********M 20430620720M 22580830970M 2474010601240Reparaturanleitung A4VG Repair Instructions A4VGMontageanweisung für Anziehdrehmomente Assembly guidelines for tightening torques 2. Verschlu ßschrauben mit Innensechskant und Profildichtring (nach N 02.009).Gewinde / Anziehdrehmoment /Gewinde / AnziehdrehmomentThread Tightening torque M A in Nm Thread Tightening torque M A in Nm M8 x 15G 1/8 A 10M10 x 110G 1/4 A 30M12 x 1,520G 3/8 A 35M14 x 1,530G 1/2 A 60M16 x 1,535G 3/4 A 90M18 x 1,540G 1 A 140M20 x 1,550G 1 1/4 A 240M22 x 1,560G 1 1/2 A 300M26 x 1,570M27 x 290M30 x 1,5100M33 x 2140M42 x 2240M48 x 2 300EOLASTIC-Dichtung / SealGReparaturanleitung A4VG Repair Instructions A4VGMontageanweisung für Anziehdrehmomente Assembly guidelines for tightening torques 5.Verschlu ßschrauben mit Innensechskant,O-Ring und UNF-, UN-Gewinde nach SAE J 514(nach N 02.106)Gewinde / Anziehdrehmoment M A in Nm Gewinde / Anziehdrehmoment M A in NmThread Tightening torque M A in Nm Thread Tightening torque M A in Nm 7/16-20UNF 15M12 x 1,5201/2-20UNF 20M14 x 1,5309/16-18UNF 25M27 x 1,5903/4 -16UNF 727/8-14UN 1271 1/16-12UN 1471 3/16-12UN 1731 5/16-12UN 1981 5/8-12UN 3201 7/8-12UN 390O-Ring / O-ring Dichtung / ThreaG。
MEMORY存储芯片MT29F4G01AAADDHC D中文规格书
DRAM Package Electrical SpecificationsTable 133: DRAM Package Electrical Specifications for x4 and x8 DevicesNotes: 1.This parameter is not subject to a production test; it is verified by design and characteri-zation and are provided for reference; system signal simulations should not use thesevalues but use the Micron package model. The package parasitic (L and C) are validatedusing package only samples. The capacitance is measured with V DD, V DDQ, V SS, and V SSQshorted with all other signal pins floating. The inductance is measured with V DD, V DDQ,V SS, and V SSQ shorted and all other signal pins shorted at the die, not pin, side.2.Package-only impedance (Zpkg) is calculated based on the Lpkg and Cpkg total for agiven pin where: Zpkg (total per pin) = SQRT (Lpkg/Cpkg).3.Package-only delay (Tpkg) is calculated based on Lpkg and Cpkg total for a given pinwhere: Tdpkg (total per pin) = SQRT (Lpkg × Cpkg).4.Z IO and Td IO apply to DQ, DM, TDQS_t and TDQS_c.5.Absolute value of ZCK_t, ZCK_c for impedance (Z) or absolute value of TdCK_t, TdCK_cfor delay (Td).6.Absolute value of ZIO (DQS_t), ZIO (DQS_c) for impedance (Z) or absolute value of TdIO(DQS_t), TdIO (DQS_c) for delay (Td).7.Z I ADD CMD and Td I ADD CMD apply to A[17:0], BA[1:0], BG[1:0], RAS_n CAS_n, WE_n,ACT_n, and PAR.8.Z I CTRL and Td I CTRL apply to ODT, CS_n, and CKE.9.Package implementations will meet specification if the Zpkg and package delay fallwithin the ranges shown, and the maximum Lpkg and Cpkg do not exceed the maxi-mum values shown.10.It is assumed that Lpkg can be approximated as Lpkg = Z O × Td.11.It is assumed that Cpkg can be approximated as Cpkg = Td/Z O.Table 134: DRAM Package Electrical Specifications for x16 Devices8Gb: x4, x8, x16 DDR4 SDRAM Current Specifications – Measurement Conditions8Gb: x4, x8, x16 DDR4 SDRAM Current Specifications – Measurement ConditionsTable 134: DRAM Package Electrical Specifications for x16 Devices (Continued)Notes:1.This parameter is not subject to a production test; it is verified by design and characteri-zation and are provided for reference; system signal simulations should not use these values but use the Micron package model. The package parasitic (L and C) are validated using package only samples. The capacitance is measured with V DD , V DDQ , V SS , and V SSQ shorted with all other signal pins floating. The inductance is measured with V DD , V DDQ ,V SS , and V SSQ shorted and all other signal pins shorted at the die, not pin, side.2.Package-only impedance (Zpkg) is calculated based on the Lpkg and Cpkg total for a given pin where: Zpkg (total per pin) = SQRT (Lpkg/Cpkg).3.Package-only delay (Tpkg) is calculated based on Lpkg and Cpkg total for a given pin where: Tdpkg (total per pin) = SQRT (Lpkg × Cpkg).4.Z IO and Td IO apply to DQ, DM, TDQS_t and TDQS_c.5.Absolute value of ZCK_t, ZCK_c for impedance (Z) or absolute value of TdCK_t, TdCK_c for delay (Td).6.Absolute value of ZIO (DQS_t), ZIO (DQS_c) for impedance (Z) or absolute value of TdIO (DQS_t), TdIO (DQS_c) for delay (Td).7.Z I ADD CMD and Td I ADD CMD apply to A[17:0], BA[1:0], BG[1:0], RAS_n CAS_n, WE_n,ACT_n, and PAR.8.Z I CTRL and Td I CTRL apply to ODT, CS_n, and CKE.9.Package implementations will meet specification if the Zpkg and package delay fallwithin the ranges shown, and the maximum Lpkg and Cpkg do not exceed the maxi-mum values shown.10.It is assumed that Lpkg can be approximated as Lpkg = Z O × Td.11.It is assumed that Cpkg can be approximated as Cpkg = Td/Z O .8Gb: x4, x8, x16 DDR4 SDRAMDRAM Package Electrical Specifications。
KENWOOD28A中文说明书
TH48A Ld©HelloCQ火腿论坛-- HelloCQ火腿论坛0n{w一、扩频：'){;cK打开机器背后的四个螺丝，见前面板有两根绿色的细电线，将W1拆除，即完成扩频。
iI[N'二、频率显示范围（扩频后）：$bA^_136.000~173.995MHz RX JNWQ340.000~399.995MHz RX 3}3[400.000~469.995MHz RX TX A800.000~949.9875MHz RX（800MHz最小步进为12.5）{-i}三、CPU复位：[yS`按下F键开机H四、存储器复位（包括时钟）：~bGGUO按下M键开机XKXx+1五、时钟的相关调节：[t'按一下F键，再按9/CLOCK键，将显示时间。
.s3E!K在此基础上：FV按一下F键，再按1/PAG键，时钟的小时数闪动，用步进旋钮调节。
按M键再调节8分钟数，完成后，再按M键保存。
3按一下F键，再按4/GHI键，可调节自动开机时间。
;H\Vl按一下F键，再按7/SA VE键，可调节自动关机时间。
:]按一下F键，再按5/MSG.M键，可打开/关闭自动开机功能。
H?j按一下F键，再按8/APO键，可打开/关闭自动关机功能。
U\4[X按一下F键，再按6/L.OUT键，可打开/关闭自动开机后的响铃功能。
E六、各频段之间的转换：\1, 在400.000MHz至469.995MHz的基础上，按“BAND”键可以监听136.000MHz T至173.995MHz 7n2, 在400.000MHz至469.995MHz的基础上, 按F（功能键）1秒后，液晶屏上显Y:K3示“F”闪动。
按一下“LOW”键显示出340.000（MHz），这时可以调整频率在zP#6340.000MHz至399.995MHz之间监听。
Y3，在340.000MHz至399.995MHz的基础上重复2的步骤，显示器将出现从+]'XdP800.000MHz至949.995MHz之间监听。
MEMORY存储芯片MT29F32G08CBADAWP中文规格书
Electrical Specifications – AC Characteristics and Operating Conditions AC Characteristics: Command, Data, and Address Input (3.3V)Notes: 1.Operating mode timings meet ONFI timing mode 5 parameters.2.Timing for t ADL begins in the address cycle, on the final rising edge of WE#, and endswith the first rising edge of WE# for data input.AC Characteristics: Command, Data, and Address Input (1.8V) Note 1Notes: 1.Operating mode timings meet ONFI timing mode 4 parameters.2.Timing for t ADL begins in the address cycle on the final rising edge of WE#, and endswith the first rising edge of WE# for data input.4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Electrical Specifications – AC Characteristics and Operating ConditionsElectrical Specifications – DC Characteristics and Operating Conditions DC Characteristics and Operating Conditions (3.3V)Notes: 1.Measurement is taken with 1ms averaging intervals and begins after V CC reachesV CC(MIN).2.I OL (R/B#) may need to be relaxed if R/B pull-down strength is not set to full.3.V OH and V OL may need to be relaxed if I/O drive strength is not set to full.DC Characteristics and Operating Conditions (1.8V)Notes: 1.Typical and maximum values are for single-plane operation only. If device supports dual-plane operation, values are 20mA (TYP) and 40mA (MAX).2.Values are for single-die operations. Values could be higher for interleaved-die opera-tions.3.Measurement is taken with 1ms averaging intervals and begins after V CC reachesV CC(MIN).4.Test conditions for V OH and V OL.5.DC characteristics may need to be relaxed if R/B# pull-down strength is not set to full.。
Philips 46英寸WVGA宽屏液晶电视说明书
Philipsplasma monitor117 cm (46")WVGABDS4622VHigh Quality Public Display Solution117 cm (46") Wide VGA Plasma MonitorThis large VGA plasma monitor is designed for indoor public display applications where outstanding picture quality and color display quality count. Due to the size it is an effective eye catcher to guarantee optimal display of your message.Operational flexibility•Monitor is network controllable for remote management •Multiple PC input formats up to WXGA•Built-in audio amplifier with SRS and speakers •Quiet and reliable fanless operation•Enhanced zoom feature supports tiled matrix applications Optimized for public viewing•High brightness (1000cd/m2) and 3000:1 contrast ratio •High speed color rendering for natural color reproduction •De-contouring for better gray level display at low luminance •3D combfilter separates colors for a razor-sharp image •PiP allows watching a second source simultaneously Lower total cost of ownership•Advanced anti burn-in functions to prevent ghost imagesHighlightsNetwork controllability: RS232 Network controllability allows user to control and adjust monitors remotely through RS232 protocol.Multiple PC input formatsThe product supports PC compatibility for VGA, SVGA, XGA and WXGA. A universal public display solution requires versatile PC input support.Built-in audio amp with SRSIf an application requires better sound quality, then this monitor provides SRS surround sound processing, built-in speakers and the ability to connect bigger external speakers Fanless operationFanless operation is quiet and doesn't collect dust inside the monitor thus improving product reliability.Zoom function for tiled matrixThe internal zoom function enables easy implementation of a video wall matrix, without the need for expensive external equipment. Capable of 2x2, 3x3, 4x4 and 5x1configurations.High brightness & contrastHigh brightness and contrast values areextremely beneficial in public environmentswhere lighting conditions are variable andoften beyond control.High speed color renderingIt is difficult to do the color rendering for bothNTSC and EBU color space in conventionalPDP. The built-in 12-bit high speed circuitbrings pure, rich natural color reproduction inboth the NTSC and EBU color spaceDe-contouringConventional PDP's often show contouring inlower grey levels because of insufficient greylevel resolution. A proprietary technology hasbeen implemented to minimize contouringresulting in better and smoother gradients.3D CombfilterThe 3D comb filter separates brightness andcolor signals better in 3D domain to eliminatecross-color, cross-luminance and dot-crawldistortion - all of which detract from yourviewing pleasure. The 3D digital comb filterperforms field-by-field comparisons of thetelevision image to accurately separate thecolor from the black-and-white informationand remove both horizontally and verticallyhanging dots, as well as dot crawl. The result isa razor sharp image.Picture In Picture (PIP)Provides the ability to watch simultaneouslytwo different sources, either two videosources or a combination with data/graphicsAdvanced anti burn-in functionA protective function called "pixel shift" hasbeen implemented. When the protectionmechanism is activated the screen imageautomatically shifts its pixel positions toprevent "image ghosting". Secondly, burn-inrecovery has been implemented. Dependingon the model, ghost images are removed byapplying a full white signal on the whole panelfor a certain amount of time or by reversingthe image to achieve the same result.Issue date 2011-06-07Version: 4.0.812 NC: 8639 000 15945EAN: 87 10895 87875 3© 2011 Koninklijke Philips Electronics N.V.All Rights reserved.Specifications are subject to change without notice. Trademarks are the property of Koninklijke Philips Electronics N.V. or their respective owners.SpecificationsPicture/Display•Panel Size: 46" / 117.8cm •Aspect ratio: 16:9•Panel resolution: wVGA (854 x 480 pixels)•Pixel pitch: 1.182 x 1.182 mm •Brightness: 1000 cd/m²•Contrast ratio (typical): 3000:1•Display colors: 16.7 Million colors •Viewing angle: 160º (H) / 160º (V)•Horizontal Scanning Frequency: 30 - 91 kHz •Vertical Scanning Frequency: 50 - 85 Hz•Picture enhancement: 3/2 - 2/2 motion pull down, 3D Combfilter, De-contouring, Picture in Picture •Optimum resolution: 848 x480 @ 60HzSupported Display Resolution•Computer formats Resolution Refresh rate 640 x 480 60, 72, 75, 85Hz 720 x 400 70Hz 800 x 600 56, 60, 72, 75,85Hz 848 x 480 60Hz 1024 x 768 60, 70, 75, 85Hz 1024 x 768 60Hz •VGA 640 x 400: 85 Hz •MAC 640 x 480: 67 Hz •MAC 832 x 624: 75 Hz •Video formats Resolution Refresh rate 480i 60Hz 480p 60Hz 576i 50Hz 576p 50Hz 720p 50, 60Hz 1080i 60Hz 1080i 50HzConnectivity•PC: DVI-D x1, VGA-in D-Sub 15HD, RS232 D-Sub9, 3.5 mm PC audio input x1•AV input: Composite (CVBS) x1, Component (YPbPr) x1, Scart 2x•Audio cinch out: Analog audio output L/R•Audio input for video: Audio Left/Right (RCA x 2)•Connectivity Enhancements: External LoudspeakerconnectorConvenience•Screen Format Adjustments: 5x zoom function formatrixing•Picture in Picture: Picture in Picture All Inputs, Double window•Network controllable: RS232•User convenience: On-screen Display•Monitor Controls: Left/Right, Power On/Off, Up/Down•OSD Languages: English, French, German, Italian, Spanish•SRS sound processing•Built-in Audio: Built-in amplifier (2x10) and 2 Watts RMSx2 stereo speakers •DPMS power saving system•Screen saving functions: Full white, image reverse, pixel shift•Regulatory approvals: CE Mark, FCC-B, UL, CSAPower•Consumption (On mode): 330 Watts (average)•Power supply: 100-240VAC, 50/60Hz •Sleep Mode: 5 Watts Max.Dimensions•Dimensions (without base) (W x H x D): 1138 x 691 x 98 mm •Weight:37 kg•Temperature range (operation): 0°C to 40°C •Relative humidity: 20% - 80%•Lifetime to 50% brightness: 30000 hrAccessories•Included accessories: AC Power Cord, Remote Control, Battery, S-video cable, AV cable, 3xRCA to 3x RCA, Audio Cable, VGA cable •User Guide on CD-ROM•Optional accessories: Ceiling mount, Flexible wall mount, Fixed wall mount, Table top stand •User Manual: Eng,Ger,Fre,Spa,ItaMiscellaneous•Bezel: Metallic Antracite。
MEMORY存储芯片MT29F4G08ABADAWP D中文规格书
ArchitectureThese devices use NAND Flash electrical and command interfaces. Data, commands,and addresses are multiplexed onto the same pins and received by I/O control circuits.The commands received at the I/O control circuits are latched by a command register and are transferred to control logic circuits for generating internal signals to control de-vice operations. The addresses are latched by an address register and sent to a row de-coder to select a row address, or to a column decoder to select a column address.Data is transferred to or from the NAND Flash memory array, byte by byte (x8) or word by word (x16), through a data register and a cache register.The NAND Flash memory array is programmed and read using page-based operations and is erased using block-based operations. During normal page operations, the data and cache registers act as a single register. During cache operations, the data and cache registers operate independently to increase data throughput. The status register reports the status of die operations.Figure 8: NAND Flash Die (LUN) Functional Block DiagramV V LOCK Note: 1.The LOCK pin is used on the 1.8V device.4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory ArchitecturePDF: 09005aef83b25735m60a_4gb_ecc_nand.pdf – Rev. M 2/12 ENDevice and Array Organization Figure 9: Array Organization – MT29F4G08 (x8)Cache RegisterData Register 2048 blocksper plane4096 blocksper device= (2K + 64 bytes)= (2K + 64) bytes x 64 pages = (128K + 4K) bytes = (128K + 4K) bytes x 2048 blocks = 2112Mb= 2112Mb x 2 planes= 4224Mbeven-numbered blocks(0, 2, 4, 6, ..., 4092, 4094)odd-numbered blocks (1, 3, 5, 7, ..., 4093, 4095)2112 bytesTable 2: Array Addressing – MT29F4G08 (x8)Notes: 1.Block address concatenated with page address = actual page address. CAx = column ad-dress; PAx = page address; BAx = block address.2.If CA11 is 1, then CA[10:6] must be 0.3.BA6 controls plane selection.4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Device and Array OrganizationPDF: 09005aef83b25735m60a_4gb_ecc_nand.pdf – Rev. M 2/12 ENFigure 10: Array Organization – MT29F4G16 (x16)Cache RegisterData Register 2048 blocksper plane4096 blocksper device= (1K + 32 words)= (1K + 32) words x 64 pages = (64K + 2K) words = (64K + 2K) words x 2048 blocks = 2112Mb= 2112Mb x 2 planes= 4224Mb Plane ofeven-numbered blocks(0, 2, 4, 6, ..., 4092, 4094)Plane of odd-numbered blocks (1, 3, 5, 7, ..., 4093, 4095)1056 wordsTable 3: Array Addressing – MT29F4G16 (x16)Notes: 1.Block address concatenated with page address = actual page address. CAx = column ad-dress; PAx = page address; BAx = block address.2.If CA10 = 1, then CA[9:5] must be 0.3.BA6 controls plane selection.4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Device and Array OrganizationPDF: 09005aef83b25735m60a_4gb_ecc_nand.pdf – Rev. M 2/12 EN。
GT23L32S4W-横置横排
GT23L32S4W标准汉字字库芯片用户手册DATASHEET⏹字型：11X12、15X16、24X24、32X32点阵⏹字符集：GB2312⏹输入法码表：全拼输入法⏹排置方式：横置横排⏹总线接口：SPI串行总线PLII精简地址并行总线⏹芯片形式：SO20W封装VER 3.62010-Q3版本修订记录GT23L32S4W多字号简体字库芯片标准字库目录第一部分:硬件部分1 概述 (4)1.1 芯片特点 (4)1.2 字库内容 (4)2 引脚描述与接口连接 (6)2.1 引脚配置 (6)2.2 SPI接口引脚描述 (6)2.3 SPI接口与主机接口电路示意图 (7)2.4 PLII接口引脚描述 (8)2.5 PLII接口与主机接口电路示意图 (8)2.6 PLII总线接口寻址说明 (8)3 操作指令 (10)3.1 SPI接口模式下操作 (10)3.2 PLII接口模式下操作 (12)4 电气特性 (14)4.1 绝对最大额定值 (14)4.2 DC特性 (14)4.3 AC特性 (14)5 封装尺寸：SO20W (18)第二部分:软件部分6 字库调用方法 (19)6.1 汉字点阵排列格式 (19)6.2 汉字点阵字库地址表 (27)6.3 字符在芯片中的地址计算方法 (28)7 附录 (34)7.1 GB2312 1区字符(846字符) (34)7.2 8×16点国标扩展字符（126字符） (37)1 概述GT23L32S4W是一款内含11X12点阵、15X16点、24X24点阵、32X32点阵的汉字库芯片，支持GB2312国标汉字（含有国家信标委合法授权）及SCII字符。
排列格式为横置横排。
用户通过字符内码，利用本手册提供的方法计算出该字符点阵在芯片中的地址，可从该地址连续读出字符点阵信息。
本字库芯片内含全拼输入法的码本，另外配合本公司的输入法程序，可实现数字小键盘IT产品的汉字输入。
华大驱动器说明书-中文
3.1 模块及按键功能................................................................................................................... 22 3.1.1 模块 22 3.1.2 按键功能............................................................. 22 3.2.1 监视模式 ............................................................. 23 3.2.2 监视模式说明 ......................................................... 24
1.1 铭牌......................................................................................................................................... 6
1.2 驱动器型号说明..................................................................................................................... 6
3.3 参数设置.................................................................................................................................... 24 3.3.1 参数设置 ............................................................. 24 3.3.2 辅助功能 ............................................................. 25
威卡（WIKA）F2822型拉 压力传感器操作说明说明书
拉/压力传感器（轮辐式），F2822型示例：型号F28222A D P R 1X 914113.01 07/2021 C N威卡（WIKA ）操作说明，F2822型© 07/2021 WIKA Alexander Wiegand SE & Co. KG 保留所有权利。
WIKA ®是威卡（WIKA ）在各个国家的注册商标。
在开始任何工作之前，请仔细阅读操作说明！请妥善保管以备后用！型号F2822操作说明页码 3 - 203威卡（WIKA ）操作说明，F2822型A D P R 1X 914113.01 07/2021 C N目录1. 一般信息 42. 设计与功能 52.1 型号F2822概述 . . . . . . . . . . . . . . . . . . . . .52.2 描述 . . . . . . . . . . . . . . . . . . . . . . . . .52.3 供货范围........................53. 安全 63.1 符号说明........................63.2 预期用途........................63.3 不当使用........................73.4 操作人员责任 . . . . . . . . . . . . . . . . . . . . . .73.5 人员资质........................83.6 个人防护设备 . . . . . . . . . . . . . . . . . . . . . .83.7 标签/安全标识......................94. 运输、包装和储存 104.1 运输 . . . . . . . . . . . . . . . . . . . . . . . . 104.2 包装和储存 . . . . . . . . . . . . . . . . . . . . . . 105. 调试、运行 115.1 调试前注意事项 . . . . . . . . . . . . . . . . . . . . 115.2 安装说明.......................115.3 拉/压力传感器安装 . . . . . . . . . . . . . . . . . . . 125.4 电气连接.......................145.5 连接放大器 . . . . . . . . . . . . . . . . . . . . . . 145.6 引脚分配 型号F2822. . . . . . . . . . . . . . . . . . . 146. 故障 157. 维护和清洁 167.1 维护 . . . . . . . . . . . . . . . . . . . . . . . . 167.2 清洁 . . . . . . . . . . . . . . . . . . . . . . . . 167.3 再校准 . . . . . . . . . . . . . . . . . . . . . . . 168. 拆卸、返修和处置 178.1 拆卸 . . . . . . . . . . . . . . . . . . . . . . . . 178.2 返修 . . . . . . . . . . . . . . . . . . . . . . . . 178.3 处置 . . . . . . . . . . . . . . . . . . . . . . . . 179. 规格 189.1 认证 . . . . . . . . . . . . . . . . . . . . . . . . 1910. 附件 19附件：欧盟符合性声明 204威卡（WIKA ）操作说明，F2822型A D P R 1X 914113.01 07/2021 C N1. 一般信息■操作说明中描述的拉/压力传感器均采用先进的技术进行设计和制造。
MEMORY存储芯片MT29F4G08ABADAWPD中文规格书
AC and DC Operating ConditionsTable 13: Recommended DC Operating Conditions (SSTL_18)Notes: 1.V DD and V DDQ must track each other. V DDQ must be ≤ V DD.2.V SSQ = V SSL = V SS.3.V DDQ tracks with V DD; V DDL tracks with V DD.4.V REF is expected to equal V DDQ/2 of the transmitting device and to track variations in theDC level of the same. Peak-to-peak noise (noncommon mode) on V REF may not exceed±1 percent of the DC value. Peak-to-peak AC noise on V REF may not exceed ±2 percentof V REF(DC). This measurement is to be taken at the nearest V REF bypass capacitor.5.V TT is not applied directly to the device. V TT is a system supply for signal termination re-sistors, is expected to be set equal to V REF, and must track variations in the DC level ofV REF.ODT DC Electrical CharacteristicsTable 14: ODT DC Electrical CharacteristicsNotes: 1.R TT1(EFF) and R TT2(EFF) are determined by separately applying V IH(AC) and V IL(DC) to the ballbeing tested, and then measuring current, I(V IH[AC]), and I(V IL[AC]), respectively.R TT(EFF) =V IH(AC) - V IL(AC) I(V IH(AC)) - I(V IL(AC))2.Minimum IT and AT device values are derated by six percent less when the devices oper-ate between –40°C and 0°C (T C ).3.Measure voltage (VM) at tested ball with no load.Δ- 1 × 100Figure 32: AC Input Test Signal Waveform Command/Address BallsV V DDQV IH(AC)min V IH(DC)min V REF(DC) V IL(DC)min V IL(AC)min V SSQFigure 33: AC Input Test Signal Waveform for Data with DQS, DQS# (Differential)Logic levels V REF levelsV REF(DC)VIL(DC)maxVIL(AC)maxV SSQV IH(DC)minV IH(AC)minV DDQ1Gb: x4, x8, x16 DDR2 SDRAM Input Slew Rate DeratingPRECHARGEThe PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row activation a specified time (t RP) after the PRECHARGE command is issued, except in the case of concurrent auto precharge, where a READ or WRITE command to a different bank is al-lowed as long as it does not interrupt the data transfer in the current bank and does not violate any other timing parameters. After a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank. A PRECHARGE command is allowed if there is no open row in that bank (idle state) or if the previously open row is already in the process of precharging. However,the precharge period will be determined by the last PRECHARGE command issued to the bank.REFRESHREFRESH is used during normal operation of the DDR2 SDRAM and is analogous to CAS#-before-RAS# (CBR) REFRESH. All banks must be in the idle mode prior to issuing a REFRESH command. This command is nonpersistent, so it must be issued each time a refresh is required. The addressing is generated by the internal refresh controller. This makes the address bits a “Don’t Care” during a REFRESH command.SELF REFRESHThe SELF REFRESH command can be used to retain data in the DDR2 SDRAM, even if the rest of the system is powered down. When in the self refresh mode, the DDR2SDRAM retains data without external clocking. All power supply inputs (including Vref)must be maintained at valid levels upon entry/exit and during SELF REFRESH opera-tion.The SELF REFRESH command is initiated like a REFRESH command except CKE is LOW. The DLL is automatically disabled upon entering self refresh and is automatically enabled upon exiting self refresh.Mode Register (MR)The mode register is used to define the specific mode of operation of the DDR2 SDRAM.This definition includes the selection of a burst length, burst type, CAS latency, operat-ing mode, DLL RESET, write recovery, and power-down mode, as shown in Figure 36(page 80). Contents of the mode register can be altered by re-executing the LOADMODE (LM) command. If the user chooses to modify only a subset of the MR variables,all variables must be programmed when the command is issued.The MR is programmed via the LM command and will retain the stored information un-til it is programmed again or until the device loses power (except for bit M8, which is self-clearing). Reprogramming the mode register will not alter the contents of the mem-ory array, provided it is performed correctly.The LM command can only be issued (or reissued) when all banks are in the precharged state (idle state) and no bursts are in progress. The controller must wait the specified time t MRD before initiating any subsequent operations such as an ACTIVATE com-mand. Violating either of these requirements will result in an unspecified operation.Preliminary1Gb: x4, x8, x16 DDR2 SDRAMMode Register (MR)Figure 39: READ LatencyCKCK#Command DQDQS, DQS#Don’t CareTransitioning DataNotes:1.BL = 4.2.Shown with nominal t AC, t DQSCK, and t DQSQ.3.RL = AL + CL = 5.1Gb: x4, x8, x16 DDR2 SDRAM Extended Mode Register (EMR)READREAD bursts are initiated with a READ command. The starting column and bank ad-dresses are provided with the READ command, and auto precharge is either enabled or disabled for that burst access. If auto precharge is enabled, the row being accessed is automatically precharged at the completion of the burst. If auto precharge is disabled,the row will be left open after the completion of the burst.During READ bursts, the valid data-out element from the starting column address will be available READ latency (RL) clocks later. RL is defined as the sum of AL and CL: RL =AL + CL. The value for AL and CL are programmable via the MR and EMR commands,respectively. Each subsequent data-out element will be valid nominally at the next posi-tive or negative clock edge (at the next crossing of CK and CK#). Figure 46 (page 96)shows examples of RL based on different AL and CL settings.DQS/DQS# is driven by the DDR2 SDRAM along with output data. The initial LOW state on DQS and the HIGH state on DQS# are known as the read preamble (t RPRE). The LOW state on DQS and the HIGH state on DQS# coincident with the last data-out ele-ment are known as the read postamble (t RPST).Upon completion of a burst, assuming no other commands have been initiated, the DQ will go High-Z. A detailed explanation of t DQSQ (valid data-out skew), t QH (data-out window hold), and the valid data window are depicted in Figure 55 (page 104) and Fig-ure 56 (page 105). A detailed explanation of t DQSCK (DQS transition skew to CK) and t AC (data-out transition skew to CK) is shown in Figure 57 (page 106).Data from any READ burst may be concatenated with data from a subsequent READ command to provide a continuous flow of data. The first data element from the new burst follows the last element of a completed burst. The new READ command should be issued x cycles after the first READ command, where x equals BL/2 cycles (see Figure 47(page 97)).Nonconsecutive read data is illustrated in Figure 48 (page 98). Full-speed random read accesses within a page (or pages) can be performed. DDR2 SDRAM supports the use of concurrent auto precharge timing (see Table 42 (page 101)).DDR2 SDRAM does not allow interrupting or truncating of any READ burst using BL = 4operations. Once the BL = 4 READ command is registered, it must be allowed to com-plete the entire READ burst. However, a READ (with auto precharge disabled) using BL =8 operation may be interrupted and truncated only by another READ burst as long as the interruption occurs on a 4-bit boundary due to the 4n prefetch architecture of DDR2 SDRAM. As shown in Figure 49 (page 99), READ burst BL = 8 operations may not be interrupted or truncated with any other command except another READ com-mand.Data from any READ burst must be completed before a subsequent WRITE burst is al-lowed. An example of a READ burst followed by a WRITE burst is shown in Figure 50(page 99). The t DQSS (NOM) case is shown (t DQSS [MIN] and t DQSS [MAX] are de-fined in Figure 58 (page 108)).Preliminary1Gb: x4, x8, x16 DDR2 SDRAMREAD。
DVD原理与维修-习题答案
习题11.试说明LD、CD、VCD、DVD影碟机的特点。
答：LD影碟机图像和声音信号均采用模拟形式，播放的画面清晰度高达420线水平。
LD影碟片有直径为20cm和30cm两种形式。
新一代的LD影碟机可以兼容CD、VCD影碟片。
CD机的特点是数字音频系统信号记录和处理是把模拟音频信号数字化后进行的，存储于CD唱片上的声音信息是“0”、“1”数据流，信息读取采用光学方式，数字信号采用了纠错编码处理。
VCD视盘机的机芯、激光头及其伺服电路、数字信号处理电路与CD唱机相同，在CD机的基础上增加了一套MPEG1解码电路和视频D/A变换与编码电路，其水平清晰度为250线。
DVD光盘由于采用MPEG2标准对音视频图像信号进行数字压缩处理，其记忆容量是CD片的13倍，能在12cm光盘上存储约4小时的图像信息，其图像清晰度达500线以上，音频采用杜比数码（AC—3）5.1声道的环绕立体声。
2.试说明I、P、B帧的特点答：图像编码：首先分割一帧图像进行数字化压缩、细化采样、量化。
其次，利用帧间压缩技术和帧内压缩技术减小信息量，再次编码处理时将图像以帧为单位进行分组，PAL制以5帧为一组，NTSC制以6帧为一组进行编码，数字图像要进行大幅度压缩，比例为（1/120～1/130）声音编码：从信号中消去重复的（冗余）信息，在对输入信号进行量化时数字伴音的压缩格式为MPEG-LAYER2，压缩率为1/6。
MPEG1解码是编码的逆过程，从DSP电路送来的MPEG1码流送入封包标头解码器解码，从标头上辨别数据封包的种类。
若是视频封包，送视频解码；若是音频封包，送音频解码。
图像解码是I帧解码、P帧和B帧解码、帧重排的过程；音频压缩信号先经左、右声道分离，然后每声道分两路，一路按数据格式分解为32个子频带，分别按量化步长信息进行逆量化，再将32个子频带信号合成为压缩前的频带，恢复为压缩前的PCM码流存入DRAM。
另一路经快速傅里叶逆变换分离出位分配数据和强弱比例因子，用于控制32个子频带的逆量化步长，使解压后的数字音频信号尽量接近压缩前的频谱结构。
MEMORY存储芯片MT29F32G08CBADAWPD中文规格书
Asynchronous Interface Bus OperationThe bus on the device is multiplexed. Data I/O, addresses, and commands all share thesame pins. I/O[15:8] are used only for data in the x16 configuration. Addresses andcommands are always supplied on I/O[7:0].The command sequence typically consists of a COMMAND LATCH cycle, address inputcycles, and one or more data cycles, either READ or WRITE.Table 6: Asynchronous Interface Mode SelectionNotes: 1.Mode selection settings for this table: H = Logic level HIGH; L = Logic level LOW; X = V IHor V IL.2.WP# should be biased to CMOS LOW or HIGH for standby.Asynchronous Enable/StandbyWhen the device is not performing an operation, the CE# pin is typically driven HIGHand the device enters standby mode. The memory will enter standby if CE# goes HIGHwhile data is being transferred and the device is not busy. This helps reduce power con-sumption.The CE# “Don’t Care” operation enables the NAND Flash to reside on the same asyn-chronous memory bus as other Flash or SRAM devices. Other devices on the memorybus can then be accessed while the NAND Flash is busy with internal operations. Thiscapability is important for designs that require multiple NAND Flash devices on thesame bus.A HIGH CLE signal indicates that a command cycle is taking place. A HIGH ALE signalsignifies that an ADDRESS INPUT cycle is occurring.Asynchronous CommandsAn asynchronous command is written from I/O[7:0] to the command register on the ris-ing edge of WE# when CE# is LOW, ALE is LOW, CLE is HIGH, and RE# is HIGH.Commands are typically ignored by die (LUNs) that are busy (RDY = 0); however, somecommands, including READ STATUS (70h) and READ STATUS ENHANCED (78h), areaccepted by die (LUNs) even when they are busy.For devices with a x16 interface, I/O[15:8] must be written with zeros when a commandis issued.Error ManagementEach NAND Flash die (LUN) is specified to have a minimum number of valid blocks (NVB) of the total available blocks. This means the die (LUNs) could have blocks that are invalid when shipped from the factory. An invalid block is one that contains at least one page that has more bad bits than can be corrected by the minimum required ECC.Additional blocks can develop with use. However, the total number of available blocks per die (LUN) will not fall below NVB during the endurance life of the product.Although NAND Flash memory devices could contain bad blocks, they can be usedquite reliably in systems that provide bad block management and error-correction algo-rithms. This type of software environment ensures data integrity.Internal circuitry isolates each block from other blocks, so the presence of a bad block does not affect the operation of the rest of the NAND Flash array.NAND Flash devices are shipped from the factory erased. The factory identifies invalid blocks before shipping by attempting to program the bad block mark into every loca-tion in the first page of each invalid block. It may not be possible to program every loca-tion with the bad block mark. However, the first spare area location in each bad block is guaranteed to contain the bad block mark. This method is compliant with ONFI Factory Defect Mapping requirements. See the following table for the first spare area location and the bad block mark.System software should check the first spare area location on the first page of each block prior to performing any PROGRAM or ERASE operations on the NAND Flash de-vice. A bad block table can then be created, enabling system software to map around these areas. Factory testing is performed under worst-case conditions. Because invalid blocks could be marginal, it may not be possible to recover this information if the block is erased.Over time, some memory locations may fail to program or erase properly. In order to ensure that data is stored properly over the life of the NAND Flash device, the following precautions are required:•Always check status after a PROGRAM or ERASE operation•Under typical conditions, use the minimum required ECC (see table below)•Use bad block management and wear-leveling algorithmsThe first block (physical block address 00h) for each CE# is guaranteed to be valid with ECC when shipped from the factory.Table 21: Error Management Details4Gb, 8Gb, 16Gb: x8, x16 NAND Flash MemoryError ManagementElectrical Specifications – AC Characteristics and Operating ConditionsTable 29: AC Characteristics: Command, Data, and Address Input (3.3V)Notes:1.Operating mode timings meet ONFI timing mode 5 parameters.2.Timing for t ADL begins in the address cycle, on the final rising edge of WE#, and endswith the first rising edge of WE# for data input.4Gb, 8Gb, 16Gb: x8, x16 NAND Flash MemoryElectrical Specifications – AC Characteristics and OperatingConditionsFigure 89: READ PAGE CACHE SEQUENTIALWE#CE#ALECLERE#RDYI/Ox WE#CE#ALECLERE#RDYI/OxDon’t CareFigure 90: READ PAGE CACHE RANDOMCLECE#WE#ALERE#I/OxRDYCLECE#WE#ALERE#I/OxRDY。
A4琦星电控操作说明 (成都杰克缝纫机)
1）在安装或使用本产品前，使用者必须详细阅读本操作手册。
2）本产品须由受过正确训练的人员来安装或操作。
安装作业时必须关闭所有电源，切记不可带3）4）为安全起见，禁止以延长线作电源座供应二项以上的电器产品使用。
5）在连接电源线时，必须确定工作电压低于AC250V，且符合本产品标识中规定的额定电压值。
※注意：电控箱电源规格如为AC220V时，请勿插接至AC380V的电源插座上，否则将出现异常且电机无法动作。
此时请立即关闭电源开关，重新检查电源。
持续供应380V超过五分钟以上，将可能烧损电控箱内器件，而危及人身安全。
6）请不要在日光直接照射的场所、室外及室温45℃以上或0℃以下的场所操作。
7）请不要在暖气（电热器）旁、有露水的场所及在相对湿度10%以下或90%以上的场所操作。
8）请不要在灰尘多的场所、具有腐蚀性物质的场所及有挥发性气体的场所操作。
9）请注意所有电源线、信号线、接地线等接线时不要受压或过度扭曲，以确保使用安全。
10）电源线的接地端须以适当大小的导线和接头连接到生产工厂的系统地线，此连接必须被永久固定。
11）所有可转动的部分，必须以所提供的零件加以防范露出。
12）在安装完成第一次开电后，先关闭切线功能以低速操作缝纫机并检查转动方向是否正确、运转是否稳定。
13）在进行以下操作前，请先关闭所有电源：1.在控制箱与马达上插拔任何连接插头时。
2.穿针线时。
3.翻抬缝纫机机头时。
4.修理或做任何机械上的调整时。
5.机器闲置不用时。
14）修理或高层次的保养工作，仅能由受过训练的机电技师来执行。
所有维修用的零件，须由本公司提供认可，方可使用。
15）使用本产品请远离高频电磁波和电波发射器等，以免所产生的电磁波干扰伺服驱动装置而发生误动作。
16）请不要以不适当物体来敲击或撞击本产品及各装置。
保修期限本产品保修期限为购买日期起一年内或出厂月份起两年内。
保修内容本产品在正常情况使用且无人为操作失误的前提下，于保修期间无偿为客户维修使能正常操作。
JE4D28A
JE4D28A简介JE4D28A是一种新型的电子元件，具有高效能、低功耗等特点。
它广泛应用于各种电子设备中，如智能手机、电视、电脑等。
本文将对JE4D28A进行详细的介绍，包括其结构、工作原理、特性以及应用领域等方面。
结构JE4D28A由多个部件组成，包括电子器件、封装等。
其中电子器件部分主要由多个晶体管、电容器、电阻器等组成，这些器件相互连接，形成一个复杂的电路结构。
而封装部分则起到保护和固定电子器件的作用，使JE4D28A能够稳定地工作在各种环境下。
工作原理JE4D28A的工作原理基于电子器件的特性和物理原理。
其电路结构中的晶体管负责放大电信号，电容器用于储存电荷，电阻器则用于限制电流。
当输入信号经过JE4D28A时，电子器件会对信号进行处理，最终输出一个经过放大和处理的电信号。
特性高效能JE4D28A具有高效能的特点，主要体现在以下几个方面：1.高速响应：JE4D28A能够快速对输入信号进行处理，提供迅速的反馈。
2.大功率输出：JE4D28A能够提供高功率的输出信号，满足各种电子设备的需求。
3.低失真率：JE4D28A在信号放大过程中能够保持较低的失真率，保证输出信号的准确性。
低功耗JE4D28A的电路设计和材料选择使其具有较低的功耗。
这意味着JE4D28A能够在保持高效能的同时，减少对电源的能耗，延长电子设备的续航时间。
可靠性JE4D28A经过严格的质量控制和测试验证，具有良好的可靠性。
它能够在各种环境下工作稳定，并有较长的使用寿命。
应用领域由于JE4D28A的高效能和低功耗特点，它已经广泛应用于各个领域。
以下是JE4D28A常见的应用领域：1.智能手机：JE4D28A被用于智能手机的音频功放电路中，提供高质量的音频输出。
2.电视：JE4D28A可应用于电视机的视频信号放大电路，提供清晰、稳定的图像输出。
3.电脑：JE4D28A可用于电脑的主板电源供应电路，提供稳定可靠的电源。
4.汽车电子：JE4D28A常被应用于汽车电子系统，如车载音响等。
AELTA DBP-28SV 按装说明
ݭ • кΑਕ • ᖳಱ΄ะ Ξёଠטጡщ྅ᄲځڦຍְี3 本使用說明書僅提供電氣規格、功能規格、安裝配線、故障排除及周邊裝置部份說明，詳細說明請見DVP-PLC 應用技術手冊【程式篇】。
選購之週邊裝置詳細說明請見該產品隨機手冊或DVP-PLC 應用技術手冊【特殊單元篇】。
3 本機為開放型 (OPEN TYPE) 機殼，因此使用者使用本機時，必須將之安裝於具防塵、防潮及免於電擊/衝擊意外之外殼配線箱內。
另必須具備保護措施 (如: 特殊之工具或鑰匙才可打開) 防止非維護人員操作或意外衝擊本體，造成危險及損壞。
3 交流輸入電源不可連接於輸入/出信號端，否則將造成嚴重損壞。
本機為直流電源供應，請在上電之前再次確認電源配線。
請勿在上電時觸摸任何端子。
本體上之接地端子務必正確的接地，可提高產品抗雜訊能力。
X யݡᖎ̬1.1 型號說明及週邊裝置謝謝您採用台達DVP 系列可程式控制器。
SV 為28點（16輸入點 + 12輸出點）PLC 主機，提供豐富的指令集，並具有16K Steps 的程式記憶體，可連接SS/SA/SX/SC/SV 全系列擴充機，包含數位輸入/輸出（最大輸入/輸出擴充點數可達512點）、類比模組（A/D 、D/A 轉換及溫度單元) 及新型高速擴充機等各類機型。
四組高速（200KHz ）脈波輸出、新增兩軸補間指令，可滿足各種應用場合，並且體積小，安裝容易。
銘牌說明台達產品型P L C 輸入電源規輸出點模組管制條碼及型號序號系列名稱點數 (16 SV 系列R ：繼電器T ：電晶體直流電源輸入製造序號生產週次生產年份年 (2006)製造工廠版本序號生產機種1.2 產品外觀及各部介紹1電源、運行、電池低電壓及錯誤指示燈2 COM1 (RS-232) 通訊接收 (Rx) 指示燈3 COM2 (RS-485) 通訊傳送 (Tx) 指示燈 4輸出/入點指示燈5 RUN/STOP 開關6 VR0：M1178啟動/D1178對應值7 VR1：M1179啟動/D1179對應值 8輸出/入端子9 COM1 (RS-232) 程式輸出/入通訊口 10 DIN 軌固定扣 11擴充機定位孔12 擴充機連接口 13 DIN 軌糟（35mm ） 14 擴充機固定扣15 COM2 (RS-485) 通訊口 (Master/Slave) 16 電源輸入口17 3 P 脫落式端子（標準附件）18 電源輸入連接線（標準附件) 19 新型高速擴充機連接口 20 銘牌尺寸單位：mm21 直接固定孔Y Αਕఢॾ項目 規格 備註演算控制方式 內存程式，往返式來回掃描方式 - 輸入/輸出控制方式 結束再生方式（當執行至END 指令） 輸入/出有立即刷新指令 演算處理速度 基本指令 (最小0.24 us) 應用指令 程式語言 指令 + 階梯圖 + SFC 含有步進指令程式容量 15872 STEPS SRAM+充電式電池+Flash 指令種類 基本順序指令32個（含步進階梯指令） 應用指令193種X 外部輸入繼電器 X0 ~ X377, 8進制編碼, 256點 對應至外部輸入點Y 外部輸出繼電器Y0 ~ Y377, 8進制編碼, 256點 合計512點對應至外部輸出點 一般用 M0 ~ M499, 500點(*2) M500 ~ M999, 500點(*3)停電保持用 M2000 ~ M4095, 2096點(*3)M輔助繼電器 特殊用 M1000 ~ M1999, 1000點（部份為停電保持）合計4,096點 接點可於程式內做On/OffT0 ~ T199, 200點(*2)T192 ~ T199為副程式用100ms T250 ~ T255, 6點積算型 (*4)T200 ~ T239, 40點 (*2)10msT240 ~ T245, 6點積算型(*4)T計時器 1ms T246 ~ T249, 4點積算型 (*4)合計256點 TMR 指令所指定的計時器，若計時到達則此同編號T 的接點將會On 。
AU6438-BS 28PIN V1.00 读卡器原理图设计
VSS BS MSDATA1 MSDATA0 MSDATA2 INS MSDATA3 SCLK VCC VSS C12 MS Connector 1UF
B
C11 NC
SD/MMC/MMC4.0 Combo Connector
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A
Disclaimer: This schematic is for reference only. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without notice.
New release.
DATE
2012/08/16
BY
Nick
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Байду номын сангаас
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Alcor Micro Corp.
Title <Title> Size A Date:
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Document Number AU6438-BS 28PIN Thursday, August 16, 2012
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600 DM DP U2 SDCDN R1 LED VCC3.3 330 CTRL1 CHIPRESETN R2 680 DP DM XI XO VCC1.8 C_V33 XI NC Y1 CHIPRESETN C3 0.47UF C_V33 C_V33 DATA2 DATA3 DATA4 SDCMD CTRL2 CTRL0 SD_V33 R9 DATA6 0 CTRL0_A 9 1 10 2 11 3 4 5 12 6 13 7 8 14 15 CN1 SDDATA2 SDDATA3 SDDATA4 CMD SDDATA5 VSS VDD CLK SDDATA6 VSS2 SDDATA7 SDDATA0 SDDATA1 SDCDN GND SDWP 1UF 0.1UF C4 C5 AU6438-BS 1UF 2.2UF NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SDCDN CTRL1 GPON7 CHIPRESETN REXT V33APHY DP DM VSSAREG XI XO VSS V18 C_V33 DATA1 DATA0 CTRL3 DATA6 CTRL0 CTRL2 SDCMD DATA4 DATA3 DATA2 MSINS VSSHM V33 AVDD5V 28 27 26 25 24 23 22 21 20 19 18 17 16 15 C6 DATA1 DATA0 CTRL3 DATA6 CTRL0 CTRL2 SDCMD DATA4 DATA3 DATA2 MSINS VCC3.3 VCC R6 C7 1_0603 0.1UF
超级24bit／96kHz DAC万能摩机板
超级24bit／96kHz DAC万能摩机板
小海
【期刊名称】《《家庭电子》》
【年(卷),期】2000(000)003
【摘要】随着VCD/CD机的普及,越来越多的发烧友把它当作Hi-Fi音源使用。
由于VCD机和中低档CD机本身素质所限,使这些音源不能满足发烧友的要求,不是数码味太浓就是层次不清、定位不准,于是很多发烧友纷纷投入摩机大潮,换运放、摩电源,但收效甚微。
针对上述情况,国内不少厂家又推出了供发烧友们摩CCD/CD 机用的DAC板,再次掀起改机大潮。
但在实际应用时仍发现不少问题,如:兼容性不强。
【总页数】2页(P38-39)
【作者】小海
【作者单位】
【正文语种】中文
【中图分类】TN946
【相关文献】
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2.音乐的演奏者试听最新英国Quad 99 CDS 24Bit/96KHz CD机 [J], 乐人
3.精品器件·发烧电路--96kHz/24bit DAC机 [J], 新都
4.英特尔推出下一代音频最终规范支持96kHz／24bit的7．1声道输出或
192kHz／24bit的双声道输出 [J],
5.欲解96kHz/24bit格式之奥妙,请看——初尝96kHz/24bit数码音响的美妙 [J],因版权原因，仅展示原文概要，查看原文内容请购买。