FT7522L6X;中文规格书,Datasheet资料

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NC7ST32L6X中文资料

Note 3: CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. (See Figure 2.) CPD is related to ICCD dynamic operating current by the expression: ICCD = (C PD) (VCC) (fIN) + (ICCstatic).

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NC7ST32
AC Electrical Characteristics
Symbol tPLH, tPHL Parameter Propagation Delay VCC (V) 5.0 4.5 5.5 tTLH, tTHL CIN CPD Input Capacitance Power Dissipation Capacitance Output Transition Time 5.0 4.5 5.5 Open 5.0 Min TA = +25°C Typ 4.3 6.1 6.5 12.0 5.4 10.7 4 11 10 2 6 Max 12 17 16 27 14 26 10 25 21 10 31 26 20 31 18 30 ns ns pF pF (Note 3) Figure 2 CL = 15 pF CL = 50 pF Figures 1, 3 ns CL = 50 pF TA = −40°C to +85°C Min Max Units ns Conditions CL = 15 pF Figures 1, 3 Fig. No.

ST752手册

STSitronixST752217 x 96 Dot Matrix LCD Controller/DriverVer 1.0c 1/45 2002/07/10O V E R V I E WThe ST7522 family of dot matrix LCD drivers are designed for the display of characters and graphics. The drivers generate LCD drive signals derived from bit mapped data stored in an internal RAM.The drivers are available in two configurations The ST7522 family drivers incorporate innovative circuit design strategies to achieve very low power dissipation at a wide range of operating voltages. These features give the designer a flexible means of implementing small to medium size LCD displays for compact, low power systems.The ST7522 which is able to drive 1 line of 6 Chinese characters or 2 lines of 12 Chinese characters each linewith two ST7522.F E A T U R E SzFast 8-bit MPU interface compatible with 80- and 68- family microcomputers and serial interface z Clock synchronous serial interface z Many command setDisplay data Read/Write, display ON/OFF,Normal/Reverse display mode, page address set , column address set , status read , display all points ON/OFF, LCD bias set, electronic volume, read/modify/write, segment driver direction select, power saver, static indicator, adjustable OSC frequency, booster input voltage select, follower input voltage and amplified ratio selectable z 4 static indicator and 96 icon availablez Total 118 (segment + common + static) drive sets z Wide range of supply voltagesV DD – V SS ：2.7 to 5.5 V V DD – V 5：3.5 to 7.0 V V DD – V CAP3 ：3.5 to 7.0 V z Low-power CMOSz 64 level digital contrast controlClock frequency Product nameOn-Chip ExternalNumber of COM Numberof SEG Bias DutyST7522D 1.2KHz,2.4KHz (When VDD=3.0V)2.8KHz17961/5,1/6 1/17,1/33Ver 1.0c 9/45 2002/07/10The Serial InterfaceWhen the serial interface has been selected (P/S = “L”) then when the chip is in active state (CS1―= “L” and CS2 = “H”) the serial data input (SI) and the serial clock input (SCL) can be received. The serial data is read from the serial data input pin in the rising edge of the serial clocks D7, D6 through D0, in this order. This data is converted to 8 bits parallel data in the rising edge of the eighth serial clock for the processing. TheA0 input is used to determine whether or the serial data input is display data or command data; when A0 = “H”, the data is display data, and when A0 = “L” then the data is command data. The A0 input is read and used for detection every 8th rising edge of the serial clock after the chip becomes active. Figure 1 is a serial interface signal chart.Figure 1* When the chip is not active, the shift registers and the counter are reset to their initial states. * Reading is not possible while in serial interface mode.* Caution is required on the SCL signal when it comes to line-end reflections and external noise. We recommend that operation be rechecked on the actual equipment.The Chip SelectThe ST7522 Series chips have two chip select terminals: CS1―and CS2. The MPU interface or the serial interface is enabled only when CS1―= “L” and CS2 = “H”.When the chip select is inactive, D0 to D7 enter a high impedance state, and the A0, RD ―, and WR ―inputs are inactive. When the serial interface is selected, the shift register and the counter are reset.CS1CS2SI SCL A0D7D6D5D4D3D2D1D0D7D6D5D4D3Common Timing Generator Circuit Generates common timing signals and FR frame signals from the CL basic clock. The 1/17 or l/33 duty (forST7522)can be selected by the Duty Select command. If the l/33 duty is selected for the ST7522 , the l/33 and l/ 17 duties are provided by two chips consisting of the master and slave chips in the common multi-chip mode. Display Data Latch CircuitThis latch stores one line of display data for use by the LCD driver interface circuitry. The output of this latch is controlled by the Display ON/OFF.FR SIGNAL (Master output)Master Common Slaver Common 01231415161718313201Ver 1.0c 13/45 2002/07/10Ver 1.0c 17/45 2002/07/10The Reset CircuitWhen the RES ―input comes to the “L” level, these LSIs return to the default state. Their default states are as follows: 1. Display OFF 2. Static drive is turned OFF.3. ADC select: Normal (ADC command D0 = 0)4. Display all point on is select to normal5. Display normal/reverse is select to normal6. Power control register: (D2, D0) = (0, 0)7. Serial interface internal register data clear8. 1/6 bias is selected9. 1/17 duty is selected. 10. Read modify write OFF11. Column address set to Address 0 12. Page address set to Page 0 13. Start line set to first line14. Electronic contrast register = 35H(max:3FH) 15. OSC frequency set = 08H 16. Follower input voltage set =02H 17. Follower amplified ratio = 06H 18. Booster input voltage set = 00HWhen the power is turned on, the IC internal state becomes unstable, and it is necessary to initialize it using the RES ―terminal.After the initialization, each input terminal should be controlled normally.While RES ―is “L,” the oscillator works but the display timing generator stops, and the CL, FR, terminals are fixed to “H.” The terminals D0 to D7 are not affected.ST7522Booster input voltage set (Double Byte Command)This command is designed to select different level of the input voltage to booster. In 5V application system, it’s better to reduce the input voltage of booster to make sure that the output voltage of booster will not be over the specification range of VDD-Vcap3. This command is a two byte command used as a pair with the booster input voltage mode set command and the booster input voltage register set command, and both commands must be issued one after the other. See the power control explanation for details.The booster input voltage mode setA0 0―RD 1WR 0―D7 1D6 1D5 1D4 1D3 0D2 0D1 0D0 0Booster input voltage register set.A0 0―RD 1WR 0―D7 Jbst1D6 Jbst0D5 0D4 0D3 0D2 0D1 0D0 0Default value=“00H”Jbst1 0 0 1 1Jbst0 0 1 0 1VSS2 1*VSS(default) 4/5*VSS 3/5*VSS 2/5*VSSVDD-Vcap37Operating range5Booster input voltage parameter3For Vcap3 voltage level setup formula:(booster must on of power control command) (used booster input voltage set command)1 1 3 5 7Vcap3=VSS2 x 2(booster must on of power control command)VDDOperating voltage range of Vss and Vcap3 systemBooster VDDVcap3Vcap3=VSS2 x 2 B (power control command)input voltage jbst[1:0]VSS2VSSVer 1.0c 31/45 2002/07/10ST7522Reference circuit examples:When used 2x step-up voltage circuit, the “Power control” command must set to 2DH and adjust “Booster input voltage set” command of Vcap3’s full range. When used 1x step-up voltage circuit, the “Power control” command must set to 29H; the “Booster input voltage set” command is not action at this operation.VDD M/S CAP1 Cb CAP2 Cb VDD VSS VDD C1 C2 C3 C4 C5 V1 V2 V3 V4 V5 C1 C2 C3 C4 C5 CAP3 VDD VSS VDD V1 V2 V3 V4 V5 Open CAP2 CAP3 Open CAP1VDD M/SVDD=0V VSS=-3VVDD=0V VSS=-3VVcap3=Jbst[1,0] x (VSS-VDD) x 2 2x step-up voltage circuit (Power control=2DH)Vcap3=(VSS-VDD) x 1 1x step-up voltage circuit (Power control=29H)Ver 1.0c32/452002/07/10ST7522Static Indicator (Double Byte Command)This command controls the static drive system indicator display. The static indicator display is controlled by this command only, and is independent of other display control commands. This is used when one of the static indicator liquid crystal drive electrodes is connected to the COMS terminal, and the other is connected to the S1~S4 terminal. A different pattern is recommended for the static indicator electrodes than for the dynamic drive electrodes. If the pattern is too close, it can result in deterioration of the liquid crystal and of the electrodes. The static indicator ON command is a double byte command paired with the static indicator register set command, and thus one must execute one after the other. (The static indicator OFF command is a single byte command.)Static Indicator ON/OFFWhen the static indicator ON command is entered, the static indicator register set command is enabled. Once the static indicator ON command has been entered, no other command aside from the static indicator register set command can be used. This mode is cleared when data is set in the register by the static indicator register set command. A0 0―RD 1WR 0―D7 1D6 0D5 1D4 0D3 1D2 1D1 0D0 SS=1: Indicator on S=0: Indicator off (default)Static Indicator Register SetThis command sets four bits of data into the static indicator register, and is used to set the static indicator into a on/off mode A0 0―RD 1WR 0―D7 0D6 0D5 0D4 0D3 S1D2 S2D1 S3D0 S4the command selection the S1-S4 static indicator on or off. Sn=1: Sn -> on Sn=0: Sn -> Off(default)Static Indicator Register Set SequenceStatic indicator mode setOffOnStatic indicator register setNoChange complete?YesVer 1.0c33/452002/07/10ST7522Power Save (Compound Command)When the display all points ON is performed while the display is in the OFF mode, the power saver mode is entered, thus greatly reducing power consumption. The power saver mode has two different modes: the sleep mode and the standby mode. When all static indicator is OFF, it is the sleep mode that is entered. When the static indicator is ON, it is the standby mode that is entered. In the sleep mode and in the standby mode, the display data is saved as is the operating mode that was ineffect before the power saver mode was initiated, and the MPU is still able to access the display data RAM.Static indicator off(Static off only)Static indicator on(Static on + Static register set)Display off Display all point onDisplay off Display all point onSleep modeDisplay on or Display all point offStand by modeDisplay on or Display all point offSleep cancelStand by cancelSleep ModeThis stops all operations in the LCD display system, and as long as there are no accesses from the MPU, the consumption current is reduced to a value near the static current. The internal modes during sleep mode are as follows: 1. The oscillator circuit and the LCD power supply circuit are halted. 2. All liquid crystal drive circuits are halted, and the segment and common drive outputs output a VDD level.Standby ModeThe duty LCD display system operations are halted and only the static drive system for the indicator continues to operate, providing the minimum required consumption current for the static drive. The internal modes are in the following states during standby mode. 1. The LCD power supply circuits are halted. The oscillator circuit continues to operate. 2. The duty drive system liquid crystal drive circuits are halted and the segment and common driver outputs output a VDD level. * When the master is turned on, the oscillator circuit is operable immediately after the powering on. * When the master/slave mode, into Sleep or Standby mode have to at same time.Ver 1.0c34/452002/07/10ST7522Software ExampleCondition: 1. VDD=5.0V 2. Use Winbond W78E52-40 at 16MHz crystal(compatible intel 8051 MPU) 3. Use Mater and Slave mode(ST7522D x 2) 4. |VCAP3|=(5x2)x3/5=6V 5. |V5|=[600KΩ/(1MΩ+200KΩ)]x2x5=5V;ResetCLR RES ;Reset ST7522D(Master & Slave) CALL DELAY ; SETB RES CALL DELAY ; ;------------------------------------------------------------------------------------------------------------------------------------------------------------------;Initial LCD CLR CS1 ;Enable chip 1(low active) CLR CS2 ;Enable chip 2(low active) MOV CALL MOV CALL MOV CALL MOV CALL MOV CALL MOV CALL MOV CALL MOV CALL MOV CALL MOV CALL MOV CALL MOV CALL CALL MOV CALL A,#11110001B WRINS A,#10001000B WRINS A,#11111000B WRINS A,#00000001B WRINS A,#00100000B WRINS A,#11110000B WRINS A,#10000000B WRINS A,#00101111B WRINS A,#10101001B WRINS A,#10100010B WRINS A,#10000001B WRINS A,#00110101B WRINS DELAY200mS A,#10101111B WRINS . . . . ;OSC frequency set ; ;Frame about 80.6Hz/OSC frequency about 2.6KHz ; ;Follower input voltage set ; ;V5 input voltage=3/6*VSS ; ;Follower amplified ratio ;Ratio=2 ;Booster input voltage set ; ;VSS2=3/5 *VSS ; ;Power control ; ;Duty select ; ;LCD bias set ; ;Electronic contrast set ; ;Contrast register=35H ; ;Delay 200mS for booster & follower stable ;Display on ;Ver 1.0c35/452002/07/10ST7522ABSOLUTE MAXIMUM RATINGSCharacteristicsPower supply voltage LCD driver voltage Input voltage Operating temperature Storage temperatureSymbolVDD Vcap3 VIN TA TSTOValue-0.3 to +7.0 -7.0 to +0.3 -0.3 to VDD+0.3 -40 to +85 -55 to +125UnitV V V ℃ ℃DC CHARACTERISTICSUnless otherwise specified, VSS = 0 V, VDD = 3.0 VItemOperating Voltage Step up output voltage Voltage follower circuit operating Voltage V5 accuracy High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage Input leakage current Output leakage current Liquid Crystal Driver ON Resistance Internal Oscillator Oscillator Frequency External Input RECOMMANDSymbolVDD Vcap3 V5 V5 VIHC VILC VOHC VOLC ILI ILO RON fOSCCondition(Relative to VDD) (Relative to VDD) IOH = –0.5 mA IOL = 0.5 mA VIN = VDD or VSS Ta = 25°C (Relative V5 = –6.0 V To VDD) Ta = 25°C 1/33DutyMin.2.7 -7 -7 -7 0.7 VDD Vss 0.8VDD Vss -1 -1 2 2Rating Typ. Max.3.0 5.5 -3.5 -3.5 7 VDD 0.9 VDD 0.2 VDD 2 1 1.6 2.0 3UnitV V V % V V uA uA KΩApplicable PinVDD*1 CAP3 V5 V5 *2 *3 *4 *5 SEGn COMn *6kHz 3.5CLfCLVer 1.0c36/452002/07/10ST7522• Dynamic Consumption Current, During Display, with the Internal Power Supply OFF Current consumed by total ICs when an external power supply is used. Display Pattern OFF Ta = 25°C Vcap3=-6V Item ST7522 Display Pattern Checker Ta = 25°C Vcap3=-6V Item ST7522 Symbol IDD Condition VDD=3.0 V, VDD-V5=-5.0V VDD=5.0 V, VDD-V5=-5.0V Min. Rating Typ. 15 40 Max. 20 50 Unit μA Notes *7 Symbol IDD Condition VDD=3.0 V, VDD-V5=-5.0V VDD=5.0 V, VDD-V5=-5.0V Min. Rating Typ. 10 35 Max. 15 45 Unit μA Notes *7• Dynamic Consumption Current, During Display, with the Internal Power Supply ON Display Pattern OFF Ta = 25°C Vcap3=-6V Item ST7522 Symbol IDD Condition VDD=3.0 V, VDD-V5=-5.0V VDD=5.0 V, VDD-V5=-5.0V Min. Rating Typ. 60 120 Max. 70 130 Unit μA Notes *7Display Pattern Checker Ta = 25°C Vcap3=-6V Item ST7522 Symbol IDD Condition VDD=3.0 V, VDD-V5=-5.0V VDD=5.0 V, VDD-V5=-5.0V Min. Rating Typ. 65 130 Max. 80 150 Unit μA Notes *7• Consumption Current at Time of Power Saver Mode, VSS = 0 V, VDD = 3.0 V ± 10% Ta = 25°C Item Sleep mode Standby Mode Symbol IDD IDD Condition Min. Rating Typ. 5 10 Max. 10 15 Unit μA Notes -References for items market with * *1 While a broad range of operating voltages is guaranteed, performance cannot be guaranteed if there are sudden fluctuations to the voltage while the MPU is being accessed. *2 The A0, D0 to D5, D6 (SCL), D7 (SI), RD (E), WR (R/W), CS1, CS2, CLS, CL, FR, M/S, C86, P/S , and RES terminals. *3 The D0 to D7, FR and CL terminals. ― ― ― ― *4 The A0, RD (E), WR (R/W), CS1, CS2, CLS, M/S, C86, P/S, and RES terminals. *5 Applies when the D0 to D5, D6 (SCL), D7 (SI), CL, and FR terminals are in a high impedance state. *6 These are the resistance values for when a 0.1 V voltage is applied between the output terminal SEGn or COMn and the various power supply terminals (V 1 , V 2 , V 3 , and V 4 ). These are specified for the operating voltage (3) range. RON = 0.1 V /ΔI (Where ΔI is the current that flows when 0.1 V is applied while the power supply is ON.) *7 It indicates the current consumed on ICs alone when the internal oscillator circuit and display are turned on. Does not include the current due to the LCD panel capacity and wiring capacity. Applicable only when there is no access from the MPU.――――Ver 1.0c37/452002/07/10ST7522TIMING CHARACTERISTICS68 InterfaceA0 R/WtAW6 tAH6CS1 CS2tCYC6 tEWHR,tEWHW tEWLR,tEWLWEtDS6 tDH6D0 to D7 (Write)tACC6tOH6D0 to D7 (Read)Item Address hold time Address setup time System cycle time Data setup time Data hold time Access time Output disable time Enable H pulse time Read Write Read WriteSignal A0 A0 A0 D0 to D7 D0 to D7 D0 to D7 D0 to D7 ESymbolConditionVDD=2.7 to 4.5V Rating Min. Max. — — — — — 90 1100 — — — —(Ta = –40 to 85°C ) VDD=4.5 to 5.5V Rating Units Min. 10 10 3500 25 10 — — 160 160 140 1200 Max. — — — — — 60 1100 — — — — ns ns nstAH6 tAW6 tCYC6 tDS6 tDH6 tACC6 tOH6 tEWHR tEWHW tEWLR tEWLW— — —10 25 4400 25 10 — — 260 260 200 2300CL = 100 pFns—nsEnable L pulse timeE—ns*1 All timing is specified using 20% and 80% of VDD as the reference. ― *2 tEWLW and tEWLR are specified as the overlap between CS1 being “L” (CS2 = “H”) and E.Ver 1.0c38/452002/07/10ST752280 InterfaceA0tAW8 tAH8CS1 CS2tCYC8 tCCLR,tCCLW tCCHR,tCCHWWR,RDtDS8 tDH8D0 to D7 (Write)tACC8tOH8D0 to D7 (Read)Item Address hold time Address setup time System cycle time Control L pulse width (WR) Control L pulse width (RD ) Control H pulse width (WR) Control H pulse width (RD ) Data setup time Address hold timeSignal A0 A0SymbolCondition — —VDD=2.7 to 4.5V Rating Min. Max. — — — — — — — — — 70 1200 10 10 3400 350 530(Ta = –40 to 85°C ) VDD=4.5 to 5.5V Rating Units Min. 10 10 1300 160 200 1100 530 10 10 — — Max. — — — — — ns — — — — 70 1100 ns ns ns nstAH8 tAW8 tCYC8 tCCLW tCCLR—WR—RD——WR——RD—tCCHW tCCHR tDS8 tDH8 tACC8 tOH8— CL = 100 pF1100 730 25 10 — ———D0 to D7 D0 to D7—RD access timeOutput disable time*1 All timing is specified using 20% and 80% of VDD as the reference. ― ― ― *2 tCCLW and tCCLR are specified as the overlap between CS1 being “L” (CS2 = “H”) and WR and RD being at the “L” level.Ver 1.0c39/452002/07/10ST7522Serial InterfacetCSS tCSHCS1 CS2tSAStSAHA0tSCYC tSLW tSHWSCLtSDStSDHSIItem Serial Clock Period SCL “H” pulse width SCL “L” pulse width Address setup time Address hold time Data setup time Data hold time CS-SCL timeSignalSymbolConditionVDD=2.7 to 4.5V Rating Min. Max. — — — — — — — — —(Ta = –40 to 85°C ) VDD=4.5 to 5.5V Rating Units Min. Max. 400 300 120 0 100 0 100 40 1000 — — — — — — — — — ns ns ns nstSCYCSCL500 — 100 200 — — — 0 100 0 120 60 2200tSHW tSLW tSAS tSAH tSDS tSDH tCSS tCSHA0 SI CS*1 All timing is specified using 20% and 80% of VDD as the standard.Ver 1.0c40/452002/07/10。

T1620-600W;T1620-700W;T1630-600W;中文规格书,Datasheet资料

October 2011Doc ID 3759 Rev 11/8T1620W, T1630WSnubberless™ 16A TriacsFeatures■I T(RMS) = 16 A■V DRM / V RRM = 600, 700 and 800 V ■I GT = 20 to 30 mADescriptionBased on ST’s Snubberless technology providing high commutation performances, theT1620-600W/700W/800W and T1630-600W are especially recommended for use with inductive loads such as rice cookers. They comply with UL standards (ref. E81734).TM : Snubberless is a trademark of STMicroelectronicsCharacteristics T1620W, T1630W2/8Doc ID 3759 Rev 11 CharacteristicsTable 1.Absolute maximum ratingsSymbol ParameterValue Unit I T(RMS)On-state rms current (full sine wave)T c = 80 °C 16A I TSM Non repetitive surge peak on-state current (full cycle, T j initial = 25 °C) F = 50 Hz t = 20 ms 200A F = 60 Hz t = 16.7 ms218I ²t I ²t Value for fusingt p = 10 ms220A ²s dI/dtCritical rate of rise of on-state current I G = 2 x I GT , t r≤ 100 nsF = 120 HzT j = 125 °C 50A/µs V DSM /V RSM Non repetitive surge peak off-statevoltage t p = 10 ms T j = 25 °C V DRM /V RRM+ 100V I GM Peak gate currentt p = 20 µsT j = 125 °C 4A P G(AV)Average gate power dissipation T j = 125 °C 1W T stgT jStorage junction temperature range Operating junction temperature range- 40 to + 150- 40 to + 125°CTable 2.Electrical characteristics (T j = 25 °C, unless otherwise specified)Symbol Test conditionsQuadrantValueUnitT1620T1630I GT (1)V D = 12 V R L = 30 ΩI - II - III MAX.2030mA V GT I - II - III MAX. 1.3V V GD V D = V DRM , R L = 3.3 k Ω, T j = 125 °C I - II - IIIMIN.0.2V I H (2)I T = 250 mA MAX.3550mA I LI G = 1.2 I GTI - III MAX.7080mA II 80100dV/dt (2)V D = 67% V DRM, gate open, T j = 125 °C MIN.300500V/µs (dI/dt)c(2)Without snubber, T j = 125 °CMIN.8.511A/ms 1.minimum I GT is guaranted at 5% of I GT max.2.for both polarities of A2 referenced to A1.T1620W, T1630W CharacteristicsDoc ID 3759 Rev 13/8Table 3.Static characteristicsSymbol Test conditionsValue Unit V T (1)I TM = 22.5 A, t p = 380 µs T j = 25 °C MAX. 1.4V V TO (1)Threshold voltage T j = 125 °C MAX.0.85V R D (1)Dynamic resistance T j = 125 °C MAX.250m ΩI DRM I RRMV DRM = V RRMT j = 25 °C MAX.5µA T j = 125 °C1mA1.for both polarities of A2 referenced to A1.Table 4.Thermal resistanceSymbol ParameterValue Unit R th(j-c)Junction to case (AC) (360° conduction angle) 3.1 °C/W R th(j-a)Junction to ambient60°C/WFigure 1.Maximum power dissipation versusFigure 2.On-state rms current versus caseFigure 3.Relative variation of thermalFigure 4.On-state characteristicsCharacteristicsT1620W, T1630W4/8Doc ID 3759 Rev 1Figure 9.Relative variation of critical rate of decrease of main current versus junctionFigure 5.Surge peak on-state current versus Figure 6.Non-repetitive surge peak on-state Figure 7.Relative variation of I GT ,I H , I L vs junction temperature Figure 8.Relative variation of critical rate of decrease of main current versusT1620W, T1630W Ordering information schemeDoc ID 3759 Rev 15/82 Ordering information schemeTable 5.Product SelectorPart Numbers Voltage (xxx)SensitivityTypePackage600 V700 V800 VT1620-600W X20 mASnubberless ISOWA TT220ABT1620-700W XT1620-800W XT1630-600WX30 mAPackage mechanical data T1620W, T1630W3 Package mechanical data●Epoxy meets UL94, V0●Recommended torque 0.4 to 0.6 N·mIn order to meet environmental requirements, ST offers these devices in different grades ofECOPACK® packages, depending on their level of environmental compliance. ECOPACK®specifications, grade definitions and product status are available at: .ECOPACK® is an ST trademark.6/8Doc ID 3759 Rev 1T1620W, T1630W Ordering InformationDoc ID 3759 Rev 17/84 Ordering Information5 Revision historyTable 7.Ordering informationOrder code Marking PackageWeightBase qtyDelivery modeT1620-600W T1620600W ISOWA TT220AB2.3 g50TubeT1620-700W T1620700W T1620-800W T1620800W T1630-600WT1630600WTable 8.Document revision historyDate RevisionChangesMar-20042Last update.18-Oct-20113Insert T1620-700W, Insert 700 V in fig.10,deleted T1630-800W.T1620W, T1630WPlease Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2011 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America8/8Doc ID 3759 Rev 1分销商库存信息:STMT1620-600W T1620-700W T1630-600W。

DF752资料

APPLICATIONSs Induction Heating s A.C. Motor Drives s Inverters And Choppers s Weldings High Frequency Rectification s UPSFEATURESs Double Side Cooling s High Surge Capability s Low Recovery ChargeVOLTAGE RATINGSKEY PARAMETERS V RRM 2500V I F(AV)1050A I FSM 12000A Q r 1000µC t rr 6.0µsCURRENT RATINGSSymbolParameterConditionsDouble Side Cooled I F(AV)Mean forward current I F(RMS)RMS valueI FContinuous (direct) forward currentSingle Side Cooled (Anode side)I F(AV)Mean forward current I F(RMS)RMS valueI FContinuous (direct) forward currentUnitsMax.Half wave resistive load, T case = 65o C 1050A T case = 65o C 1660A T case = 65o C1500AHalf wave resistive load, T case = 65o C 686A T case = 65o C 1078A T case = 65o C933A 2500240022002000DF752 25DF752 24DF752 22DF752 20ConditionsV RSM = V RRM + 100VLower voltage grades available.Type NumberRepetitive PeakReverse VoltageV RRM VOutline type code: M779b.See Package Details for further information.DF752Fast Recovery DiodeReplaces March 1998 version, DS4212-3.4DS4548 - 3.2 January 2000SURGE RATINGSConditions Max.Units 12.0kA 720 x 103A 2s I 2t for fusingI 2t Surge (non-repetitive) forward current I FSM ParameterSymbol 10ms half sine; with 0% V RRM, T j = 150oC9.6kA 460 x 103A 2sI 2t for fusingI 2tSurge (non-repetitive) forward current I FSM 10ms half sine; with 50% V RRM, T j = 150oCTHERMAL AND MECHANICAL DATAdc ConditionsMax.UnitsoC/W -0.069Anode dcClamping force 15kN with mounting compound Thermal resistance - case to heatsinkR th(c-h)0.01Double side -Single sideThermal resistance - junction to caseR th(j-c)Single side cooledSymbolParameter-0.02oC/WoC/W Cathode dc-0.076oC/W Double side cooled-0.036oC/WT stg Storage temperature range -55175oCkN16.513.5Clamping force-T vj Virtual junction temperature On-state (conducting)-150oC Min.t rr 60Symbol Typ.Units ParameterV FM Forward voltage I RRM Peak reverse current Reverse recovery time Q RA1Recovered charge (50% chord)I RM Reverse recovery current K Soft factor V TO Threshold voltage r T Slope resistance V FRMForward recovery voltagedi/dt = 1000A/µs, T j = 125o C --VAt T vj = 150o C-0.45m ΩAt T vj = 150o C -0.9V ----330A -1000µC - 6.0µsAt V RRM , T case = 150o C-mAAt 2000A peak, T case = 25o C - 1.8V ConditionsMax.I F = 1000A, di RR /dt = 100A/µs T case = 150o C, V R = 100VCHARACTERISTICSDEFINITION OF K FACTOR AND QRA1CURVESFig.2 Maximum (limit) forward characteristicsFig.4 Typical reverse recovery current vs rate of rise of reverse currentFig.5 Maximum (limit) transient thermal impedance - junction to case - ˚C/WPACKAGE DETAILSFor further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.DO NOT SCALE.ASSOCIATED PUBLICATIONSTitleApplication NoteNumber Calculating the junction temperature or power semiconductors AN4506Recommendations for clamping power semiconductors AN4839Thyristor and diode measurement with a multi-meter AN4853Use of V TO, r Ton-state characteristicAN5001POWER ASSEMBLY CAPABILITYThe Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors.We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers.Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).DEVICE CLAMPSDisc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.Please refer to our application note on device clamping, AN4839HEATSINKSPower Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise theperformance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory.CUSTOMER SERVICE CENTRESFrance, Benelux, Italy and Spain T el: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50North America T el: 011-800-5554-5554. Fax: 011-800-5444-5444UK, Germany, Scandinavia & Rest Of World T el: +44 (0)1522 500500. Fax: +44 (0)1522 500020SALES OFFICESFrance, Benelux, Italy and Spain T el: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50Germany T el: 07351 827723North America T el: (613) 723-7035. Fax: (613) 723-1518. T oll Free: 1.888.33.DYNEX (39639) /T el: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020These offices are supported by Representatives and Distributors in many countries world-wide.© Dynex Semiconductor 2000 Publication No. DS4212-4 Issue No. 4.0 January 2000TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOMHEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln.Lincolnshire. LN6 3LF. United Kingdom.Tel: 00-44-(0)1522-500500Fax: 00-44-(0)1522-500550DYNEX POWER INC.Unit 7 - 58 Antares Drive,Nepean, Ontario, Canada K2E 7W6.T el: 613.723.7035Fax: 613.723.1518T oll Free: 1.888.33.DYNEX (39639)This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injuryor death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.e-mail: power_solutions@Datasheet Annotations:Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.Advance Information: The product design is complete and final characterisation for volume production is well in hand.No Annotation: The product parameters are fixed and the product is available to datasheet specification.。

SC16IS752中文资料

XTAL1
XTAL2
b. SPI interface Fig 1. Block diagram of SC16IS752/SC16IS762
SC16IS752_SC16IS762_6 © NXP B.V. 2006. All rights reserved.
Product data sheet
1 kΩ (3.3 V) 1.5 kΩ (2.5 V)
SPI
IRQ RESET I2C/SPI GPIO REGISTER
GPIO7/RIA GPIO6/CDA GPIO5/DTRA GPIO4/DSRA GPIO3/RIB GPIO2/CDB GPIO1/DTRB GPIO0/DSRB
002aab598
Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
5. Block diagram
VDD VSS
SC16IS752/ SC16IS762
16C450 COMPATIBLE REGISTER SETS
TXA RXA RTSA CTSA TXB RXB RTSB CTSB
元器件交易网
NXP Semiconductors
SC16IS752/SC16IS762
Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
I I I I I I I I
I I I I I I
RS-485 driver direction control inversion Built-in IrDA encoder and decoder supporting IrDA SIR with speeds up to 115.2 kbit/s SC16IS762 supports IrDA SIR with speeds up to 1.152 Mbit/s1 Software reset Transmitter and receiver can be enabled/disabled independent of each other Receive and Transmit FIFO levels Programmable special character detection Fully programmable character formatting N 5-bit, 6-bit, 7-bit or 8-bit character N Even, odd, or no parity N 1, 11⁄2, or 2 stop bits Line break generation and detection Internal Loopback mode Sleep current less than 30 µA at 3.3 V Industrial and commercial temperature ranges 5 V tolerant inputs Available in HVQFN32 and TSSOP28 packages

XM7520 datasheet

XM7520电子烟集成电路◆应用:电子香烟◆典型应用电路图图 1: XM7520典型应用电路特征◆高集成度：集电子香烟模拟器，电池充电器和MOSFET的单芯片解决方案◆封装：DFN6-L (2x2x0.75)◆工作电压范围宽：1.6V至5.5V◆低静态电流：小于4uA◆高输出电流：2.5A概述XM7520是电子烟集成电路。

该芯片集成了电子烟功能以及电池充电功能于一体的单芯片方案。

传统5V适配器和USB端口均可用于电池充电。

独立的充电器的输入引脚增加了更高的灵活性。

引脚分配绝对最大额定值额定值极限值VDD 引脚供电电压 -0.3V 至 6.0V CAP, OUT 和 LED 引脚电压 -0.3V 至 6.0V OUT 引脚电流 2.5A工作温度范围 -40°C 至 85°C 结温 125°C 储存温度 -65°C 至150°C 焊接温度300°C电气特性(无特别说明，T A= 25°C, VDD=3.6V)参数符号条件极限值单位最小典型最大电源电压 V DD0 5.5 V电源电流I DD主动模式睡眠模式5 10 mA 2.5 4uA低电压阈值 V LVD 3.05 3.2 3.35V 充电器电压 V CHRG 4.5 5.5预设电压 V SET 4.15 4.20 4.25 充电电压 V RECHRG 4.05 4.10 4.15 涓流充电电压 V TRK 2.7 2.8 2.9充电电流 I SET 160 200 240 mA 涓流充电电流 I TRK 30 40 50 LED 电流 I LED 5 输出电流 I OUT R OUT =2Ω 1.5 1.8 2.1 A 热关断 T SD 150 °C PFET 导通电阻 R ON 0.15 Ω 短路阈值 R SC 0.5 2.0 Ω 过流阈值 I OC 3 3.5 4 A 传感电容 C SNS 2 20 pF 感应阈值 ΔC SNS 1.6 %传感间隔t SNS32ms引脚功能OUT (引脚1)：加热线圈和充电器连接引脚。

FT6x06- DataSheet _V01_ -Preliminary

FT6x06Self-Capacitive TouchPanel ControllerINTRODUCTIONThe FT6x06 Series ICs are single-chip capacitive touch panel controller ICs with a built-in 8 bit enhanced Micro-controller unit (MCU).They adopt the self-capacitance technology, which supports single point and gesture touch. In conjunction with a self-capacitive touch panel, Friendly UI can be applied on many portable devices, such as cellular phones, GPS and digital camera.The FT6x06 series ICs include FT6206 /FT6306, the difference of their specifications will be listed individually in this datasheet.FEATURES ● Self-Capacitive Sensing Techniques support single pointtouch and differential sensing● Absolute X and Y Coordinates or gesture● Auto-calibration: Insensitive to Capacitance and Environ-mental Variations● Built-in Enhanced MCU● FT6206 supports up to 28 channels of sensors /drivers● FT6306 supports up to 36 channels of sensors /drivers● Report Rate: Up to 80Hz● Support Interfaces :IIC● Support single Film material TP and diamond patternwithout additional shield● Internal accuracy ADC and smooth Filter● Support 2.8V to 3.6V Operating Voltage● Supports independent IOVCC● Built-in LDO for Digital Circuits ● High efficient consumption management with 3 Operating ModesActive Mode Monitor ModeHibernation Mode● Operating Temperature Range: -20°C to +85°C● ESD:HBM ≥5000V,INTRODUCTION (I)FEATURES (I)1 OVERVIEW (1)1.1 T YPICAL A PPLICATIONS (1)2 FUNCTIONAL DESCRIPTION (1)2.1 A RCHITECTURAL O VERVIEW (1)2.2 MCU (2)2.3 O PERATION M ODES (2)2.4 S ERIAL I NTERFACE (3)2.4.1 I2C (3)3 ELECTRICAL SPECIFICATIONS (4)3.1 A BSOLUTE M AXIMUM R ATINGS (4)3.2 DC C HARACTERISTICS (5)3.3 AC C HARACTERISTICS (5)3.4 I/O P ORTS C IRCUITS (6)3.5 POWER ON/R ESET/W AKE S EQUENCE (6)4 PIN CONFIGURATIONS (8)5 PACKAGE INFORMATION (10)5.1 P ACKAGE I NFORMATION OF QFN-5X5-40L P ACKAGE (10)5.2 P ACKAGE I NFORMATION OF QFN-6X6-48L P ACKAGE (11)5.3 O RDER I NFORMATION (12)1OVERVIEW1.1Typical ApplicationsFT6x06 accommodate a wide range of applications with a set of buttons up to a 2D touch sensing device, their typical applications are listed below.●Mobile phones, smart phones●GPS●Game consoles●POS (Point of Sales) devices●Portable MP3 and MP4 media players●Digital camerasFT6x06 Series ICs support up to 7” Touch Panel, users may find out their target IC from the specs listed in the following table,Model NamePanel PackageTouch Panel Size Channel Type Pin SizeFT6206GMA 28 QFN5*5 40 0.6-P0.4 2.8"～4.3"FT6306DMB 36 QFN6*6 48 0.6-P0.4 4.3"～7"2FUNCTIONAL DESCRIPTION2.1Architectural OverviewFigure2-1 shows the overall architecture for the FT6x06.Figure 2-1 FT6x06 System Architecture DiagramThe FT6x06 is comprised of five main functional parts listed below,●Touch Panel Interface CircuitsThe main function for the AFE and AFE controller is to interface with the touch panel. It scans the panel by sending AC signals to the panel and processes the received signals from the panel. So it supports both driver and Sensor functions. Key parameters to configure this circuit can be sent via serial interfaces.● Enhanced MCUFor the Enhanced MCU, larger program and data memories are supported. Furthermore, A Flash ROM is implemented to store programs and some key parameters.Complex signal Processing algorithms are implemented by MCU to detect the touches reliably and efficiently. Communication protocol software is also implemented on this MCU to exchange data and control information with the host pro-cessor.●External InterfaceI2C: an interface for data exchange with hostINT: an interrupt signal to inform the host processor that touch data is ready for readRSTN: an external low signal reset the chip.● A watch dog timer is implemented to ensure the robustness of the chip.● A voltage regulator to generate 1.8V for digital circuits from the input VDDA supply.2.2MCUThis section describes some critical features and operations supported by the Enhanced MCU.Figure 2-2 shows the overall structure of the MCU block. In addition to the Enhanced MCU core, we have added the following circuits,●Program Memory:32KB Flash●Data Memory: 2KB SRAM●Timer: A number of timers are available to generate different clocks●Master Clock:12/24/ 48MHz from a 48MHz RC Oscillator●Clock Manager: To control various clocks under different operation conditions of the systemFigure 2-2 MCU Block Diagram2.3Operation ModesFT6x06 operates in the following three modes:●Active ModeIn this mode, FT6x06 actively scans the panel. The default scan rate is 60 frames per second. The host processor can configure FT6x06 to speed up or to slow down.●Monitor ModeIn this mode, FT6x06 scans the panel at a reduced speed. The default scan rate is 25 frames per second and the host processor can increase or decrease this rate. When in this mode, most algorithms are stopped. A simpler algorithm is being executed to determine if there is a touch or not. When a touch is detected, FT6x06 shall enter the Active mode immediately to acquire the touch information quickly. During this mode, the serial port is closed and no data shall be transferred with the host processor●Hibernation ModeIn this mode, the chip is set in a power down mode. It shall respond to the “RESET” or “Wakeup” signal from the host processor. The chip therefore consumes very little current, which help prolong the standby time for the portable devices.Host InterfaceFigure 2-3 shows the interface between a host processor and FT6x06. This interface consists of the following threesets of signals: ● Serial Interface● Interrupt from FT6x06 to the Host ● Reset Signal from the Host to FT6x06Figure 2-3 Host Interface DiagramThe serial interface of FT6x06 is I2C. The details of this interface are described in detail in Section 2.5. The interrupt signal (/INT) is used for FT6x06 to inform the host that data are ready for the host to receive. The RSTN signal is used for the host to reset FT6x06. After resetting, FT6x06 shall enter the Active mode.2.4 Serial InterfaceFT6x06 supports the I2C interfaces, which can be used by a host processor or other devices. 2.4.1I2CThe I2C is always configured in the Slave mode. The data transfer format is shown in Figure 2-4.Figure 2-4 I2C Serial Data Transfer FormatFigure 2-5 I2C master write, slave readFigure 2-6 I2C master read, slave writeTable 2-1 lists the meanings of the mnemonics used in the above figures.Table 2-1 Mnemonics DescriptionMnemonicsDescriptionSI2C Start or I2C RestartA[6:0] Slave address R/WREAD/WRITE bit, ‘1’ for read, ‘0’for writeA(N) ACK(NACK) PSTOP: the indication of the end of a packet (if this bit is missing, S will indicate the endof the current packet and the beginning of the next packet)I2C Interface Timing Characteristics is shown in Table 2-2.Table 2-2 I2C Timing Characteristics ParameterMin Max Unit SCL frequency10 400 KHz Bus free time between a STOP and START condition 4.7 \ us Hold time (repeated) START condition 4.0 \ us Data setup time250 \ ns Setup time for a repeated START condition 4.7 \ us Setup Time for STOP condition4.0\us3ELECTRICAL SPECIFICATIONS3.1Absolute Maximum RatingsTable 3-1 Absolute Maximum RatingsItemSymbol Value Unit Note Power Supply Voltage VDDA - VSSA-0.3 ~ +3.6V1, 2I/O Digital Voltage IOVCC 1.8~3.6 V 1 Operating Temperature Topr -20 ~ +85 ℃ 1 Storage TemperatureTstg-55 ~ +150℃ 1Notes1. If used beyond the absolute maximum ratings, FT6x06 may be permanently damaged. It is strongly recommended that the device be used within the electrical characteristics in normal operations. If exposed to the condition not within the electrical characteristics, it may affect the reliability of the device.2. Make sure VDDA (high) ≥VSSA (low).3.2DC CharacteristicsTable 3-2 DC Characteristics (VDDA=2.8~3.3V, Ta=-20~85℃)Item Symbol Test Condition Min. Typ. Max. Unit Note Input high-level voltage VIH 0.7 x IOVCC-- IOVCC VInput low -level voltage VIL -0.3 -- 0.3 x IOVCC VOutput high -level voltage VOH IOH=-0.1mA 0.7 x IOVCC-- -- VOutput low -level voltage VOL IOH=0.1mA -- -- 0.3 x IOVCC VI/O leakage current ILI Vin=0~VDDA -1 -- 1 μACurrent consumption （Normal operation mode）IoprVDDA = 3.3VTa=25℃ MCLK=24MHz--2.1-- mACurrent consumption （Monitor mode）ImonVDDA = 3.3VTa=25℃ MCLK=24MHz--TBD -- mACurrent consumption （Sleep mode）IslpVDDA = 3.3VTa=25℃ MCLK=24MHz--0.03-- mAStep-up output voltage VDD5 VDDA = 3.3V 3.35TBD VPower Supply voltage VDDA 2.8- 3.6V3.3AC CharacteristicsTable 3-3 AC Characteristics of OscillatorsItem Symbol Test Condition Min. Typ. Max. Unit NoteOSC clock 1 fosc1 VDDA= 3.3VTa=25℃47 48 49 MHzTable 3-4 AC Characteristics of #SItem Symbol Test Condition Min Typ. Max Unit Note #S acceptable clock F#s - 160 - KHz#S rise time T#s r - 1.5 - nS#S fall time T#s f - 250 - nS3.4I/O Ports CircuitsFigure 3-1 Digital In/Out Port CircuitFigure 3-2 Reset Input Port Circuits3.5POWER ON/Reset/Wake SequenceThe GPIO such as INT and I2C are advised to be low before powering on. Reset should be pulled down to be low before powering on. INT signal will be sent to the host after initializing all parameters and then start to report points to the host.P o w e rFigure 3-7 Power on timeFigure 3-8 Power on SequenceReset time must be enough to guarantee reliable reset, the time of starting to report point after resetting approach to the time of starting to report point after powering on.Figure 3-8 Reset SequenceTable 3-5 Power on/Reset/Wake Sequence ParametersParameter DescriptionMin Max Units Tris Rise time from 0.1VDD to 0.9VDD-- 3 ms Tpon Time of starting to report point after powering on 300 -- ms Tprt Time of being low after powering on 1 -- ms Trsi Time of starting to report point after resetting 300 -- ms TrstReset time5--ms4 PIN CONFIGURATIONSPin List of FT6x06Table 4-1 Pin Definition of FT6x06NamePin No.Type DescriptionFT6206GMA FT6306DMBVREF 1 47 PWRGenerated internal reference voltage. A 1μF ceramic capacitor toground is required. S1 2 48 I/O Capacitance sensor /driver channel S2 3 1 I/O Capacitance sensor /driver channel S3 4 2 I/O Capacitance sensor /driver channel S4 5 3 I/O Capacitance sensor /driver channel S5 6 4 I/O Capacitance sensor /driver channel S6 7 5 I/O Capacitance sensor /driver channel S7 8 6 I/O Capacitance sensor /driver channel S8 9 7 I/O Capacitance sensor /driver channel S9 10 8 I/O Capacitance sensor /driver channel S10 11 9 I/O Capacitance sensor /driver channel S11 12 10 I/O Capacitance sensor /driver channel S12 13 11 I/O Capacitance sensor /driver channel S13 14 12 I/O Capacitance sensor /driver channel S14 15 13 I/O Capacitance sensor /driver channel S15 16 14 I/O Capacitance sensor /driver channel S16 17 15 I/O Capacitance sensor /driver channel S17 18 16 I/O Capacitance sensor /driver channel S18 19 17 I/O Capacitance sensor /driver channel S19 20 18 I/O Capacitance sensor /driver channel S20 21 19 I/O Capacitance sensor /driver channel S21 22 20 I/O Capacitance sensor /driver channel S22 23 21 I/O Capacitance sensor /driver channel S23 24 22 I/O Capacitance sensor /driver channel S24 25 23 I/O Capacitance sensor /driver channel S25 26 24 I/O Capacitance sensor /driver channel S26 27 25 I/O Capacitance sensor /driver channel S27 28 26 I/O Capacitance sensor /driver channel S28 29 27 I/O Capacitance sensor /driver channel S29 28 I/O Capacitance sensor /driver channel S30 29 I/O Capacitance sensor /driver channel S31 30 I/O Capacitance sensor /driver channel S32 31 I/O Capacitance sensor /driver channel S33 32 I/O Capacitance sensor /driver channel S34 33 I/O Capacitance sensor /driver channel S35 34 I/O Capacitance sensor /driver channel S3635I/OCapacitance sensor /driver channelVDD5 30 36 PWR High voltage power supply from the charge pump LDO generatedinternally. A 1μF ceramic to ground is required. VSSA 31 37 GND Analog ground VDDA 32 38 PWR Analog power supply, A 1μF ceramic capacitor to ground is required.VSS 33 39 GND Analog groundVDDD 34 40 PWR Digital power supply. A 1μF ceramic capacitor to ground is required.VSSD 35 41 GNDAnalog ground RSTN 36 42 I External Reset, Low is active IOVCC 37 43 PWR I/O power supply SCL 38 44 I/O I2C clock inputSDA 39 45 I/O I2C data input and output INT 4046I/OExternal interrupt to the hostFT6206GMA Package DiagramFT6306DMB Package Diagram5PACKAGE INFORMATION5.1Package Information of QFN-5x5-40L PackageItemSymbolMillimeter Min Type MaxTotal Thickness A 0.5 0.55 0.6 Stand OffA1 0 0.035 0.05 Mold Thickness A2 ---- 0.4 0.425 L/F Thickness A3 0.152 REF Lead Width b 0.150.20 0.25 Body Size D 5 BSC E 5 BSC Lead Pitch e 0.4 BSC EP SizeJ 3.3 3.4 3.5 K 3.3 3.4 3.5 Lead LengthL 0.350.4 0.45Package Edge Tolerance aaa 0.1 Mold Flatness bbb 0.1Co Planarity ccc0.08 Lead Offset ddd 0.1Exposed Pad Offseteee0.15.2Package Information of QFN-6x6-48L PackageItemSymbolMillimeterMin Type Max Total Thickness A 0.50.55 0.6 Stand OffA1 0 0.035 0.05 Mold Thickness A2 ----0.4 0.425L/F Thickness A3 0.152 REF Lead Width b 0.150.20 0.25 Body Size D 6 BSC E 6 BSC Lead Pitch e 0.4 BSC EP SizeJ 4.52 4.62 4.72 K 4.52 4.62 4.72 Lead LengthL 0.350.4 0.45 Package Edge Tolerance aaa 0.1 Mold Flatness bbb 0.1 Co Planarity ccc 0.08 Lead Offsetddd 0.1 Exposed Pad Offseteee 0.15.3Order InformationEND OF DATASHEETProduct Name Package Type #S Pins FT6206GMA FT6306DMBQFN-40L QFN-48L28 36。

2STR2215;中文规格书,Datasheet资料

density) technology. The resulting transistor
c shows exceptional high gain performances du coupled with very low saturation voltage. Obsolete Pro The complementary NPN is the 2STR1215.
Date
Revision
Changes
09-Feb-2006
1
Initial release.
20-Jul-2006
2
New template.
08-Sep-2008
3
Updated the SOT-23 mechanical data.
Updated Figure 1: Internal schematic diagram
Produc hFE (1) DC current gain
IC = -50 mA VCE = -2 V 200
IC = -500 mA VCE = -2 V 200 280 560
IC = -1 A IC = -2 A
VCE = -2 V 130 VCE = -2 V 80
leteCCBO
Collector-base capacitance (IE = 0)
IEBO
(IC =0)
VEB = -4 V
-0.1 µA
) Collector-base
t(s V(BR)CBO breakdown voltage
IC = -100 µA
-15
V
c (IE = 0)
rodu V(BR)CEO (1)
Collector-emitter breakdown voltage

744227;中文规格书,Datasheet资料

8.1 8.0 7.02012-07-172012-07-172004-10-11SStSStMSTSStSBaWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]F Typical Impedance Characteristics:H1: Classification Reflow Profile for SMT components:H2: Classification Reflow ProfilesProfile FeaturePreheat- Temperature Min (T smin ) - Temperature Max (T smax ) - Time (t s ) from (T smin to T smax )Ramp-up rate (T L to T P )Liquidous temperature (T L )Time (t L ) maintained above T L Peak package body temperature (T p )Time within 5°C of actual peak temperature (t p )Ramp-down rate (T P to T L )Time 25°C to peak temperature Pb-Free Assembly 150°C 200°C60-180 seconds 3°C/ second max.217°C60-150 seconds See Table H320-30 seconds 6°C/ second max.8 minutes max.refer to IPC/JEDEC J-STD-020DH3: Package Classification Reflow TemperaturePB-Free Assembly PB-Free Assembly PB-Free Assembly Package Thickness< 1.6 mm 1.6 - 2.5 mm ≥ 2.5 mmVolume mm³<350260°C 260°C 250°CVolume mm³350 - 2000260°C 250°C 245°CVolume mm³>2000260°C 245°C 245°Crefer to IPC/JEDEC J-STD-020DH Soldering Specifications:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-SL2of Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the wire isolation has to be avoided.If the product is potted in customer applications, the potting material might shrink during and after hardening. Accordingly to this the product is exposed to the pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the electrical as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the core, wire and termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Cleaning solvents which are used to clean the application might damage or change the characteristics of the component.Direct mechanical impact to the product shall be prevented as the ferrite material of the core could flake or in the worst case it could break. Product specific:Follow all instructions mentioned in the datasheet, especially:•The soldering profile has to be complied with according to the technical reflow soldering specification, otherwise no warranty will be su-stained.•All products are supposed to be used before the end of the period of 12 months based on the transfer of title, if not a 100% solderability can´t be warranted.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 744227。

WT7522 v030

偉詮電子股份有限公司Weltrend Semiconductor, Inc.新竹市科學工業園區工業東九路24號2樓WT7522POWER SUPPLY PWM SUPERVISORData SheetVersion 0.3February 11, 2009The information in this document is subject to change without notice. ©Weltrend Semiconductor, Inc. All Rights Reserved.GENERAL DESCRIPTIONThe WT7522 is a pulse–width modulation (PWM) control circuit with complete protection circuits for used in the SMPS (Switched Mode Power Supply). It contains various functions, which are Over Voltage Protection, Under Voltage Protection, Power Good Output (PG), Remote On/Off control, Opamp and etc. It can minimize external components of switching power supply systems in personal computer.Over Voltage Protection (OVP) monitors 3.3V, 5V, 12V and PT input voltage level. Under Voltage Protection (UVP) monitors 3.3V, 5V, 12V and one negative voltage input voltage level. Power Good Output monitors the voltage level of power supply.FEATURES• Complete PWM Control and Protection Circuitry • Over Voltage Protection for 3.3V / 5V / V12 / PT• 3.3V / 5V / 12V Under Voltage Warning for PG Low • Under Voltage Protection for 3.3V / 5V / V12 • Two Opamp loop function • 300ms PG Time Delay• Power Good Output is Open Drain Output • Push-pull PWM Output• Remote ON/OFF function De–bounce Time • Soft-Start function built-in • 20–Pin Dual In–line PackagePIN CONFIGURATIONOrdering Number Package Type WT7522-NG200WT DIP 20PSON V33 V5 PT DET NVP V12 C2 C1 PGVCC RT SS VADJ COMP GND OP1 IN1 IN2OP2PIN DESCRIPTIONPin No. Pin Name TYPE FUNCTION1 PSON I Remote on/off input.PSON=”low” that means the main SMPS is turned-on.PSON=”high”, the main SMPS is turned-off.2 V33 I OVP/UVP sense input FOR 3.3V.3 V5 I OVP/UVP sense input for 5V.4 PT I Over-power sense input.5 DET I Power good detection input.6 NVP I UVP sense input for negative voltage.7 V12 I OVP/UVP sense input for 12V.8 C2 O PWM totem-pole output.9 C1 O PWM totem-pole output.10 PG O Power good signal.PG= ”high” means “power good”.11 OP2 O Output for second Opamp loop.12 IN2I Input for second Opamp loop.13 IN1 I Input for first Opamp loop.14 OP1O Output for first Opamp loop.15 GND P Ground16 COMP O Error amplifier output.17 VADJ I Input of error amplifier.18 SS I The soft-start function set through an external capacitor.19 RT I Reference setting by an external resistor.voltage.20 VCC P SupplyELECTRICALCHARACTERISTICS,TA=25℃, V CC =5V,CHARACTERISTICS SYMBOLTEST CONDITIONMin.Typ. Max. UnitTOTAL DEVICESTANDBY SUPPLY CURRENT I VCC PG=High 5 10 mAERROR AMP SECTIONOPEN LOOP VOLTAGE GAIN 90 dB UNIT GAIN BANDWIDTH 1 MHz REFERENCE VOLTAGE 2.46 2.5 2.54 VPROTECTION SECTIONV33 3.9 4.1 4.3 V V5 5.8 6.1 6.5 VOVER VOLTAGE PROTECTION （OVP ） V12 13.9 14.5 14.9 VV33 2.5 2.8 3.0 V V5 4.0 4.3 4.5 VUNDER VOLTAGE SENSE for PG Low (UVS) V12 9.4 10.1 10.4 VV33 2.0 2.6 2.8 V V5 3.0 3.6 3.9 VUNDER VOLTAGE PROTECTION （UVP ） V12 6.0 7.2 8.0 VPT Protection with Delay Time V PT 2.02 2.4 2.66 V Negative Voltage Protection (NVP) V NVP Note 1 2.0 2.1 2.2 V NVP Source current I NVP RT =75K Ω 63 67 71 μA OVP Debounce Time T OVP RT =75K Ω 0.37 0.7 1.35 ms UVP Debounce Time T UVP RT =75K Ω 0.8 2.4 3.75 ms UVS Debounce Time T UVS RT =75K Ω 0.37 1.2 1.88 ms Debounce Timing of NVP T NVP RT =75K Ω 1.65 3.5 5.1 ms PT Debounce Time T PT RT =75K Ω 1.65 3.5 5.1 ms Note 1 : V NVP > 2.1 (TYP) => ProtectionREMOTE ON/OFF SECTIONPSON HIGH INPUT VOLTAGE V PSONH2.0 V PSON LOW INPUT VOLTAGE V PSONL 0.8 V PSON to ON Debounce TIME T PSON_ON RT =75K Ω 30 40 50 ms PSON to OFF Debounce TIME T PSON_OFF RT =75K Ω 7 14 21 ms PSON to OFF DELAY TIME T OFF RT =75K Ω 1.5 2 6.3 msPOWER GOOD SECTIONDET SENSE VOLTAGE V DET0.68 0.7 0.72 V PG DELAY TIME T PG RT =75 K Ω 200 300 400 ms OUTPUT LOW VOLTAGE V PGL I PG =5mA 0.5 V SINK CURRENT OF PG I PG 30 mA V DET > 0.7V 50 75 100 ms Internal UVP Delay Time (RT=75K Ω) (Power On Mode) (Note 3) V DET < 0.7V 200 300 400 ms UVP disable Voltage (Normal Mode) V DET V DET < 0.7V 0.68 0.7 0.72 V Note 3 : When SS go High will enter Power On Mode at first and then jump to Normal Mode when PG are rightUnitMax.CHARACTERISTICS SYMBOL TESTCONDITION Min.Typ.SOFT START SECTIONCHARGE CURRENT OF SS I SS RT =75 KΩ7 8 9 μAOSCILLATION SECTION=75KΩ65 KHZ OSCILLATION FREQUENCY F OSC RTOPAMP SECTIONReference Voltage VREF 2.475 2.5 2.525 VSINK CURRENT OF OP I OP 30 mAPWM OUTPUT SECTIONSINK CURRENT OF C1, C2 I C1, I C2 20 mA=20mA 0.8 V Output Voltage Low V OL I O=12V 4 V Output Voltage High V OH V12TIMING DIAGRAM1. PSON ON/OFF ：VCC PSON NVPSS PGVCC PSONDET PT SS PG PGAPPLICATION :MECHANICAL INFORMATIONPLASTIC DUAL–IN–LINE PACKAGENOTE 1：All linear dimensions are in inches（millimeters）.NOTE 2：This drawing is subject to change without notice.NOTE 3：Falls within JEDEC MS–001。

BSP752T中文资料

Function Logic ground Input, activates the power switch in case of logic high signal Output to the load not connected Positive power supply voltage Positive power supply voltage Positive power supply voltage Positive power supply voltage
1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain connection. PCB is vertical without blown air. (see page 16) 2higher current due temperature sensor
• Overvoltage protection (including load dump)
Application
• All types of resistive, inductive and capacitive loads • µC compatible power switch for 12 V, 24 V and 42 V DC applications • Replaces electromechanical relays and discrete circuits
Pin configuration
Top view
GND IN OUT NC 1• 2 3 4 8 7 6 5 Vbb Vbb Vbb Vbb
Page 2

M57962L;中文规格书,Datasheet资料

151Gate DriverM57962LPowerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272Hybrid Integrated Circuit For Driving IGBT ModulesDescription:M57962L is a hybrid integrated circuit designed for driving n-channel IGBT modules in any gate amplifier application. This device operates as an isolation amplifier for these modules and provides the required electrical isolation between the in-put and output with an opto-coupler.Short circuit protection is provided by a built in desaturation detector.A fault signal is provided if theshort circuit protection is activated.Features:□Built in high CMRR opto-coupler (V CMR : Typical 30kV/␮s, Min. 15kV/␮s)□Electrical Isolation betweeninput and output with opto-couplers (V iso = 2500,V RMS for 1 min.)□TTL compatible input interface □Two supply drive topology□Built in short circuit protectioncircuit with a pin for fault output Application:To drive IGBT modules for inverter,AC Servo systems, UPS, CVCF inverter, and welding applications.Recommended Modules:V CES = 600V Series(up to 400A Class)V CES = 1200V Series(up to 200A Class)V CES = 1400V Series(up to 200A Class)/Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272M57962LHybrid IC for IGBT Gate DriverAbsolute Maximum Ratings, T a ~ 20°C to 70°C unless otherwise specifiedItem Symbol Test Conditions Limit UnitsCCEEInput Voltage V I-1 ~ 7Volts Output Voltage V O Output Voltage “H”V CC Volts Output Current I OHP Pulse Width 2µs, f = 20kHz -5AmperesI OLP Pulse Width 2µs, f = 20kHz5AmperesOutput Current I OH f = 20kHz, 50% Duty Cycle0.5Amperes Isolation Voltage V RMS Sinewave Voltage 60kHz, 1 min.2500Volts Junction Temperature T j85°C Operating Temperature T opg(Differs from H/C Condition)-20 ~ 60°C Storage Temperature t stg-25 ~ 100°C Fault Output Current I FO20mA Input Voltage V R150Volts *20 Volts ≤ V CC + V EE≤ 28 VoltsElectrical Characteristics, T a = 25°C, V CC = 15V, -V EE = 10V unless otherwise specifiedCharacteristics Symbol Test Conditions Min.Typ.Max.Units Supply Voltage V CC Recommended Range14 15—VoltsEEPull-up Voltage on Input Side V IN Recommended Range 4.75 5.00 5.25Volts “H” Input Current I IH V IN = 5V, R = 185Ω—16—mA “H” Output Voltage V OH1314—Volts “L” Output Voltage V OL-8-9—Volts Internal Power Dissipation P D f = 20kHz,— 2.38—WattsModule 400A, 1200V IGBT“L-H” Propagation Time t PLH V I = 0 to 4V, T j± 85°C— 1.0 1.5µs “L-H” Rise Time t r V I = 0 to 4V, T j± 85°C—0.6 1.0µs “H-L” Propagation Time t PHL V I = 0 to 4V, T j± 85°C— 1.0 1.5µs “H-L” Rise Time t r V I = 0 to 4V, T j± 85°C—0.4 1.0µs Reset Time of Protection t RESET1—2ms Fault Output Current I FO—5—mA SC Voltage V SC15——Volts152/分销商库存信息: POWEREXM57962L。

CSD75205W1015;中文规格书,Datasheet资料

VGS = 0V, VDS = –10V, f = 1MHz
VDS = –10V, IDS = –1A
VDS = –10.25V, VGS = 0V
VDS = –10V, VGS = –4.5V, IDS = –1A, RG = 10Ω
IDS = –1A, VGS = 0V Vdd = –10.25V, IF = –1A, di/dt = 200A/μs Vdd = –10.25V, IF = –1A, di/dt = 200A/μs
td(on)
Turn On Delay Time
tr
Rise Time
td(off)
Turn Off Delay Time
tf
Fall Time
Diode Characteristics
VSD
Diode Forward Voltage
Qrr
Reverse Recovery Charge
trr
Reverse Recovery Time
TJ = 25°C
TJ = 125°C
1
2
3
4
5
-VGS − Gate to Source Voltage − V
6
G006
500 450 400 350 300 250 200 150 100
50 0 0
RD1D2(on) vs VGS
ID1D2 = -1A
TJ = 25°C
TJ = 125°C
1
RDS(on) Drain to Source On Resistance
RD1D2(on) Source to Drain On Resistance
gfs
Transconductance

Fujitsu IW652 Pro IW752 Pro IW862 Pro 产品说明书

86”75”65”Natural Writing ExperienceSupport both pen and finger touch input to provide a smooth and natural writing experience.Eye CaringEye health protection with an eye-care display that is glare-free, flicker-free and low in blue light emission.Centralized ManagementManage remotely and centrally through an internet portal, saving you time, money, and manpower.One Cable SolutionJust plug and play. No extra setup is required when you use. USB Type-C™ connector is added for connecting to notebook computer.Better Touch to More Collaboration20-point touch screens powered by infrared technology provide unparalleled reliability.Lower Total Cost of OwnershipNo need of extra computer and audio equipment, creating a tidier workplace for teachers and minimized complicated technical support.E�ficient Learning EnvironmentDrive operational e�ficiency with Bring Your Own Device (BYOD) connectivity that enables e�fective lessons with the Panel.Blended and Hybrid Learning ReadyWith built-in video conferencing app, teachers can conduct online lessons to students who can either participate in classroom or from home.12345678Seamless T eaching Practices in Modern ClassroomA simple and intuitive design optimized for classroom collaboration and interaction.Whiteboard UseSimply tap the whiteboard tool to turn the Panel into a full-size whiteboard for illustrating ideas, recording notes, brainstorming, and more.Pen Tip Detection TechnologyAutomatically detect pen diameter and write simultaneously with di�ferent colours and thickness, making it ideal for lively classroom activities. Video AnnotationT eachers can auto-pause and resume of video playback during and after annotation. They can then export the content for further discussion and annotation.Multi-Window Content Sharing4-way split screen allows teachers easily access and copy contents fromdi�ferent applications and windows for content sharing and collaboration. Instant SharingSave annotations in the Panel local storage, share with QR code or even share to the cloud drive.Panel Design Essentials to Safeguard Y our EyesThe Panel is designed to prevent eyestrain and eye fatigue caused by spending too much time in front of a visual display.4K Ultra HD ResolutionThe Panel features a true 4K Ultra High Definition (UHD) display resolution to deliver the finest visual details to the fullest. Each pixel in the Panel features vivid, true-to-life images and colours,all without distortionFlicker-Free Display TechnologyFlicker-free technology removes the LED backlight flickering thatis commonly found in traditional LCD displays – this helps to prevent eye strain from screen time.Anti-Glare DisplayAn anti-glare filter e�fectively reduces reflection fromambient lighting, givingstudents the best viewing experience in classroom.Optional Low-Blue Light ModeLow Blue Light technology protects your eyes without compromising 4K image quality,e�fectively lowering harm caused by blue spectrum light.Multi-Device Capability and Wireless Mirroring The Panel serves as a hub for content sharing across multipledevices wirelessly. It can simultaneously display screens of up to 32 di�ferent devices #. Full classroom collaboration isencouraged via students sharing their work with fellow classmates in real time.Multiple Operating SystemsThe real-time mirroring feature supports di�ferent devices running various operating systems, including Windows, macOS, iOS and Android. In addition, the Panel and your device can control or interact on Windows and macOS platform.Multi-Panel Multi-Device SynchronisationMultiple panels can be grouped together and synchronise their displays through wireless networking. Students can also mirror the panel’s content onto their own mobile devices.Remote LearningWith the Panel, teachers can host the lesson in an ordinary way within the classroom and share the live status and teaching contents to remote students, which enhances the e�ficiency for both onsite and remote lesson. Built-in Cross Platforms and Cross Applications Pop-quiz ToolQuickly gauge levels of understanding and give explanations by posing questions to students and having them respond on their BYOD device.Maximize Flexibility in T eaching through OpenSharing Wirelessly manage digital content sharing from any mobile devices, from every corner of the classroom, or even from di�ferent places.#Default configuration supports simultaneous display of 9 devices. Windows environment supportsprojection of up to 32 devices. Performance may be a�fected by network bandwidth.HONG KONG Tel: (852) 3910-8228Email:***********************.com /pcCHINA Fujitsu (China) Holdings Co., Ltd-PC China Division Tel: 86 (21) 58871000-8721Email:*************************.com /pc SINGAPORE Fujitsu Asia Pte Ltd.Fujitsu Businsess Technologies Asia Pacific Ltd.Tel: (60) 3-7801-0505Email:***********************.com /pc INDONESIA PT Fujitsu Indonesia Tel: (62) 21-570-9330Email:********************.com /pcPHILIPPINES Fujitsu Philippines, Inc.Tel: (63) 2-841-8488Email:***************.com /pc MALAYSIA Fujitsu (Malaysia) Sdn. Bhd Tel: (60) 3-8230-4188Email:*************************/pc TAIWAN Fujitsu Taiwan Ltd.Tel: (886) 2-2311-2255Email:************************/pcTHAILAND Fujitsu (Thailand) Co., Ltd.Tel: (66) 0-2302-1500Email:***************.com /pc VIETNAM Fujitsu Vietnam Limited Tel: (84-24) 2220-3113Email:********************/pc Authorized Dealer or Reseller© Copyright 2021 Fujitsu Business Technologies Asia Pacific Ltd.Fujitsu, the Fujitsu logo and Fujitsu brand names are trademarks or registered trademarks ofFujitsu Limited in Japan and other countries. Other company, product and service names maybe trademarks or registered trademarks of their respective owners, the use of which by thirdparties for their own purposes may infringe the rights of such owners. T echnical data aresubject to modification and delivery subject to availability. Any liability that the data andillustrations are complete, actual or correct is excluded. Designations may be trademarksand/or copyrights of the respective manufacturer, the use of which by third parties for their own purposes may infringe the rights of such owner. All rights reserved. (Nov 2021)IW652 Pro IW752 Pro IW862 Pro Picture performance Panel and backlitDLED Screen surface treatmentAG tempered glass Mohs level 7 Contrast - typical1200:1 Viewing angle (h/v) - typical178° / 178° Colour performance1.07 billion colors Brightness - typical350 cd/m² (Typ) Size and resolutionAspect ratio16:9 Resolution (native)3840(H) x 2160(V) Picture size (H x V)1,428.48 x 803.52 mm 1,649.664 x 927.936 mm 1,895.04 x 1,065.96 mm Response time8 ms (Typ) Refreshing frequency60 Hz ConnectivityVGA/D-SUB IN1 x D-SUB HDMI1 x HDMI OUT (4K), 3 x HDMI IN (HDMI 2.0) USB1 x USB 2.04 x USB 3.0 (including 2 USB ports in front) USB Type-C™1 x USB Type-C™ Audio in1 x 3.5 mm stereo phone jack Audio output1 x Audio out Built-in speakerYes, 2 x 16 W LAN IN1 x GIGABIT LAN (RJ45) LAN OUT1 x GIGABIT LAN (RJ45) TOUCH OUT2 x TOUCH OUT (USB 3.0) Touch systemSensing typeInfrared recognition T ouch point20 points touches, 10 points writing T ouch toolFinger / Passive infrared pen / Active infrared pen Accuracy±1 mm (over 90% area) Communication modeFull-speed USB (driver free) Power consumption (typical)Soft switch o�f≤0.5 W Overall power (nominal power)450 W 550 W 650 W Dimensions / Weight / EnvironmentalDimension L x H x D1,488.4 x 896.6 x 86.4 mm 1,709.1 x 1,019.5 x 85.7 mm 1,957 x 1,159 x 86 mm Net weight / Gross weight38 kg / 48.5 kg 49.5 kg / 63.4 kg 64.6 kg / 82.28 kg Thickness of machine and wall mount116.4 mm (9,060G) 115.7 mm (9,060G) 116 mm (9,060G)VESA600 x 400 mm 800 x 400 mm 800 x 600 mm WarrantyStandard warranty 3 years (depending on country)。

TC7525-16D使用说明书(中文标准版)[1]

TC7525-16D A版QTZ250(TC7525-16D)塔式起重机使用说明书CHANGSHA ZOOMLION HEAVY INDUSTRY SCIENCE AND TECHNOLOGY DEVELOPMENT CO.,LTD.致用户感谢您选购和使用本公司的塔式起重机！为了使您正确使用与维护该设备，操作前敬请仔细阅读本使用说明书，并妥善保管，以备查询。

本使用说明书中标有“注意：”的语句，涉及到施工的安全，敬请注意。

本公司致力于产品的不断完善，产品的某些局部结构或个别参数更改时，恕不另行通知。

如有疑问，请与本公司联系。

出厂日期：目录第一篇塔机的安装第一章概述........................1.1-1～1.1-10 第二章基础、平衡重及压重..........1.2-1～1.2-12 第三章立塔........................1.3-1～1.1-51 第四章拆塔........................1.4-1～1.4-6 第二篇塔机的使用与维护第一章塔机安全操作规程.............2.1-1～2.1-3 第二章机构及电气操作...............2.2-1～2.2-7 第三章安全保护装置................ 2.3-1～2.3-6 第四章保养与维修.................. 2.4-1～2.4-5 编制: 毛快校对: 郑昌明审核: 钱建军第一篇第一章概述TC7525-16D塔机为水平起重臂，小车变幅，上回转自升多用途塔机。

该机的特色有：1.1. 性能参数及技术指标国内领先，达到当今国际先进水平，最大工作幅度75m，最大起升高度240.3m。

1.2. 整机外型为国际流行式，非常美观，深受国内外用户的喜爱。

1.3. 工作方式多，适用范围广。

该机有基础固定、底架固定、外墙附着等工作方式，适用各种不同的施工对象。

支腿固定独立式起升高度为51.3m，附着式是在独立式的基础上，增加塔身标准节和附着装置即可实现，起升高度可达240.3m。

CSD75211W1723;中文规格书,Datasheet资料

QOSS
Output Charge
td(on)
Turn On Delay Time
tr
Rise Time
td(off)
Turn Off Delay Time
tf
Fall Time
Diode Characteristics
VSD
Diode Forward Voltage
Qrr
Reverse Recovery Charge
CSD75211W1723

SLPS250A – MAY 2010 – REVISED AUGUST 2011
Dual P-Channel NexFET™ Power MOSFET
Check for Samples: CSD75211W1723
RDS(on) - Drain-Source On-State Resistance - mΩ RD1D2(on) - Drain-Drain On-State Resistance - mΩ
APPLICATIONS
• Battery Management • Battery Protection • DC-DC Converters
DESCRIPTION
The device has been designed to deliver the lowest on resistance and gate charge in the smallest outline possible with thermal characteristics in an ultra low profile. Low on resistance and gate charge coupled with the small footprint and low profile make the device ideal for battery operated space constrained application in load management as well as DC-DC converter applications

atc中文手册

AT24C256中文资料2009-11-15 09:43特性???? 与1MHz I2C 总线兼容???? 1.8 到6.0 伏工作电压范围???? 低功耗CMOS 技术???? 写保护功能当WP 为高电平时进入写保护状态???? 64 字节页写缓冲器???? 自定时擦写周期???? 100,000 编程/擦写周期???? 可保存数据100 年???? 8 脚DIP SOIC 封装???? 温度范围商业级工业级和汽车级概述CAT24WC256 是一个256K 位串行CMOS E2PROM 内部含有32768 个字节每字节为8 位CATALYST 公司的先进CMOS 技术实质上减少了器件的功耗CAT24WC256 有一个64 字节页写缓冲器该器件通过I2C 总线接口进行操作管脚描述管脚名称功能A0 A1 地址输入SDA 串行数据/地址SCL 串行时钟WP 写保护Vcc +1.8V 6.0V 电源Vss 地NC 未连接极限参数工作温度工业级-55 +125商业级0 +75贮存温度-65 +150各管脚承受电压-2.0V Vcc+2.0VVcc 管脚承受电压-2.0V +7.0V封装功率损耗Ta=25 1.0W焊接温度(10 秒) 300口输出短路电流100mA功能描述CAT24WC256 支持I2C 总线数据传送协议I2C 总线协议规定任何将数据传送到总线的器件作为发送器任何从总线接收数据的器件为接收器数据传送是由产生串行时钟和所有起始停止信号的主器件控制的CAT24WC256 是作为从器件被操作的主器件和从器件都可以作为发送器或接收器但由主器件控制传送数据发送或接收的模式管脚描述SCL 串行时钟CAT24WC256 串行时钟输入管脚用于产生器件所有数据发送或接收的时钟这是一个输入管脚SDA 串行数据/地址双向串行数据/地址管脚用于器件所有数据的发送或接收SDA 是一个开漏输出管脚可与其它开漏输出或集电极开路输出进行线或wire-ORWP 写保护当WP 脚连接到Vcc 所有内存变成写保护只能读当WP 引脚连接到Vss 或悬空允许器件进行读/写操作A0 A1 器件地址输入这些管脚为硬连线或者不连接对于单总线系统最多可寻址4 个CAT24WC256 器件参阅器件寻址当这些引脚没有连接时其默认值为0I2C 总线协议I2C 总线协议定义如下1 只有在总线空闲时才允许启动数据传送2 在数据传送过程中当时钟线为高电平时数据线必须保持稳定状态不允许有跳变时钟线为高电平时数据线的任何电平变化将被看作总线的起始或停止信号起始信号时钟线保持高电平期间数据线电平从高到低的跳变作为I2C 总线的起始信号停止信号时钟线保持高电平期间数据线电平从低到高的跳变作为I2C 总线的停止信号器件寻址主器件通过发送一个起始信号启动发送过程然后发送它所要寻址的从器件的地址8 位从器件地址的高5 位固定为10100 见图5 接下来的2 位A1 A0 为器件的地址位最多可以连接4 个器件到同一总线上这些位必须与硬连线输入脚A1 A0 相对应从器件地址的最低位作为读写控制位1表示对从器件进行读操作0 表示对从器件进行写操作在主器件发送起始信号和从器件地址字节后CAT24WC256 监视总线并当其地址与发送的从地址相符时响应一个应答信号通过SDA 线CAT24WC256 再根据读写控制位R/W 的状态进行读或写操作应答信号I2C 总线数据传送时每成功地传送一个字节数据后接收器都必须产生一个应答信号应答的器件在第9 个时钟周期时将SDA 线拉低表示其已收到一个8 位数据CAT24WC256 在接收到起始信号和从器件地址之后响应一个应答信号如果器件已选择了写操作则在每接收一个8 位字节之后响应一个应答信号当CAT24WC256 工作于读模式时在发送一个8 位数据后释放SDA 线并监视一个应答信号一旦接收到应答信号CAT24WC256 继续发送数据如主器件没有发送应答信号器件停止传送数据并等待一个停止信号写操作字节写在字节写模式下主器件发送起始信号和从器件地址信息R/W 位置0 给从器件在从器件送回应答信号后主器件发送两个8 位地址字写入CAT24WC256 的地址指针主器件在收到从器件的应答信号后再发送数据到被寻址的存储单元CAT24WC256 再次应答并在主器件产生停止信号后开始内部数据的擦写在内部擦写过程中CAT24WC256 不再应答主器件的任何请求页写在页写模式下单个写周期内CAT24WC256 最多可以写入64 个字节数据页写操作的启动和字节写一样不同在于传送了一字节数据后主器件允许继续发送63 个字节每发送一个字节后CAT24WC256 将响应一个应答位且内部低6 位地址加1 高位地址保持不变如果主器件在发送停止信号之前发送大于64 个字节地址计数器将自动翻转先前写入的数据被覆盖当所有64 字节接收完毕主器件发送停止信号内部编程周期开始此时所有接收到的数据在单个写周期内写入CAT24WC256应答查询可以利用内部写周期时禁止数据输入这一特性一旦主器件发送停止位指示主器件操作结束时CAT24WC256 启动内部写周期应答查询立即启动包括发送一个起始信号和进行写操作的从器件地址如果CAT24WC256 正在进行内部写操作将不会发送应答信号如果CAT24WC256 已经完成了内部写操作将发送一个应答信号主器件可以继续对CAT24WC256 进行下一次读写操作写保护写保护操作特性可使用户避免由于不当操作而造成对存储区域内部数据的改写当WP 管脚接高时整个寄存器区全部被保护起来而变为只可读取CAT24WC256 可以接收从器件地址和字节地址但是装置在接收到第一个数据字节后不发送应答信号从而避免寄存器区域被编程改写读操作CAT24WC256 读操作的初始化方式和写操作时一样仅把R/W 位置为1 有三种不同的读操作方式立即/当前地址读选择/随机读和连续读立即/当前地址读的地址计数器内容为最后操作字节的地址加1 也就是说如果上次读/写的操作地址为N 则立即读的地址从地址N+1 开始如果N=E 此处E=32767 则计数器将翻转到0 且继续输出数据CAT24WC256接收到从器件地址信号后R/W 位置1 它首先发送一个应答信号然后发送一个8 位字节数据主器件不需发送一个应答信号但要产生一个停止信号选择/随机读选择/随机读操作允许主器件对寄存器的任意字节进行读操作主器件首先通过发送起始信号从器件地址和它想读取的字节数据的地址执行一个伪写操作在CAT24WC256 应答之后主器件重新发送起始信号和从器件地址此时R/W 位置1 CAT24WC256 响应并发送应答信号然后输出所要求的一个8 位字节数据主器件不发送应答信号但产生一个停止信号连续读连续读操作可通过立即读或选择性读操作启动在CAT24WC256 发送完一个8 位字节数据后主器件产生一个应答信号来响应告知CAT24WC256 主器件要求更多的数据对应每个主机产生的应答信号CAT24WC256 将发送一个8 位数据字节当主器件不发送应答信号而发送停止位时结束此操作从CAT24WC256 输出的数据按顺序由N 到N+1 输出读操作时地址计数器在CAT24WC256 整个地址内增加这样整个寄存器区域在可在一个读操作内全部读出当读取的字节超过E 此处E=32767计数器将翻转到零并继续输出数据字节。

sc16is752中文资料

广州周立功单片机发展有限公司 Tel: (020)38730976 38730977 Fax: 38730925
带I2C总线/SPI接口，64 字节发送和接收FIFO，支持内置
IrDA(版本 1.0 和 1.1)的双UART－SC16IS752/SC16IS762
2.特性 ...................................................................................................................................................... 3
2.1 通用特性 .......................................................................................................................................3 2.2 I2C总线特性...................................................................................................................................4 2.3 SPI特性 ..........................................................................................................................................4
7.功能描述 ....................................................................................................... 9