Polycrystalline diamond compact (pdc) cutter with
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专利名称：Polycrystalline diamond compact (pdc)
cutter with improved cutting capability
发明人：Johnson, David Mark,Marek, Henry
Samuel,Flood, Gary Martin
申请号：EP98309503.5
申请日：19981119
公开号：EP0918135A1
公开日：
19990526
专利内容由知识产权出版社提供
专利附图：
摘要：The present invention relates to supported polycrystalline diamond compact cutters (PDC cutters) made under high temperature, high pressure (HT/HP) processing
conditions, and more particularly to supported PDC cutters having non-planar cutting surfaces. More specifically, the present invention is for an oriented PDC cutter (10) wherein chips and debris (16) are funneled away from the cutting edge (18) by the edges (20) of a raised top surface (14) of the polycrystalline diamond layer (PCD layer). The redirection of the debris is achieved by the creation of high and low regions on the PCD layer, of which there can be a variety of different surface geometries. Thus, an object of the present invention is to provide a PDC cutter with improved performance through channeling debris away from its cutting edge.
申请人：GENERAL ELECTRIC COMPANY
地址：1 River Road Schenectady, NY 12345 US
国籍：US
代理机构：Goode, Ian Roy
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