MT3200A-UR2中文资料
德尔（Dell）EMG力源N3200-ON 规格表说明书
The N3200 switch series offers power-efficient and resilient 1GbE and 1/2.5/5/10GbE Multigigabit range of switching solution for advanced Layer 3 distribution for offices and campus networks. The series has high-performance capabilities and wire-speed performance utilizing a non-blocking architecture to easily handle unexpected traffic loads. Use dual internal hot-swappable 80PLUS Platinum certified power supplies for high availability and power efficiency. The switches offer simple management and scalability via an 400Gbps (full duplex) high-availability stacking architecture that allows management of up to 12 switches from a single IP address.Modernize campus network architectures Modernize campus network architectures with a power-efficient and resilient 1/2.5/5/10GbE switching solution with dense options of 802.3at (30W) or 802.3bt (60W/90W) PoE solutions to deliver clean power to wide range network devices such as wireless access points (APs), Voice-over-IP (VoIP) handsets, video conferencing systems, security cameras, LED luminaires and many more.Achieve high availability and full bandwidth utilizationwith Multichassis Link Aggregation (MLAG). N3200 series switches support MLAG to create active/active loop-free redundancy without spanning tree. Server roomscan deliver reliable server and storage connectivity with features to help save time and avoid configuration errors. N3200 supports VRF-lite, allowing it to be partitioned into multiple virtual routers with isolated control and data planes on the same physical switch. For greater interoperabilityin multivendor networks, N3200 switches offer the latest open-standard protocols.Leverage familiar tools and practicesAll N-Series switches include Dell EMC Networking OS6, designed for easier deployment, greater interoperability and a lower learning curve for network administrators.OS6 common command line interface (CLI) and graphic user interface (GUI) are intuitive, so skilled network administrators can get productive quickly. N3200 switches also support the Open Network Install Environment (ONIE), enabling installation of alternate network operating systems.Deploy with confidence at any scaleN3200 series switches help create performance assurance with a data rate up to 1560Gbps (full duplex) and a forwarding rate up to 2167Mpps. Scale easily with built-in rear stacking ports. Switch stacks of up to 6241/2.5/5/10GbE/25GbE ports can be managed from a single screen using the highly available stacking architecturefor high-density aggregation with seamless redundant availability. The N-series switches’ lifetime warranty covers software upgrades, hardware repair or replacement, and optics and cables purchased with the switch.¹Dell EMC PowerSwitchN3200-ON Series SwitchesHigh performance Open networking 1GbE and 10GbE Multigigabit switchesfor modern campus networks1 Select Networking products carry a Lifetime Limited Warranty with Basic Hardware Service (repair or replacement) for life. Repair or replacement does not include troubleshooting, configuration, or other advanced service provided by Dell EMC ProSupport. See details at https:///en-us/work/shop/networkingwarranty/cp/networkingwarrantyHardware, performance and efficiency• 1GbE Switches: 1RU switches with up to 48 line-rate 1GbE ports of copper or fiber, and four integrated10GbE SFP+ ports. PoE variants with up to 48 ports of 802.3at (30W) PoE.• Multigig Switches: 1RU switches with up to 48 line-rate 1G/2.5G/ 5G/10GbE copper ports with four integrated 25GbE SFP28 ports. PoE variants with up to 48 portsof 802.3bt (90W) PoE.• 400Gbps stacking bandwidth using two 100GbE QSFP28integrated rear stacking ports.• Available with dual 80PLUS Platinum certified hot swappableinternal power supplies. Optional external power supply to extend PoE budgets on specific models.• Variable speed fan operation helps decrease cooling and power costs.• Energy-Efficient Ethernet and lower power PHYs reduce power to inactive ports and idle links, providing energy savings from the power cord to the port.• Dell EMC Fresh Air compliance for operation in environments up to 113°F (45°C) reduces coolingcosts.Deploying, configuring and managing• USB auto-configuration rapidly deploys the switch without complex TFTP configurations or sendingtechnical staff to remote offices.• Management via an intuitive and familiar CLI, embedded web server (GUI), SNMP-basedmanagement console application (including Dell EMC OpenManage Network Manager), Telnet or serialconnection.• Private VLAN extensions and Private VLAN Edge support.• AAA authorization, TACACS+ accounting and RADIUS support for comprehensive secure access support.• Authentication tiering allows network administrators to tier port authentication methods such as 802.1x, MAC Authentication Bypass and Captive Portal in priorityorder so that a single port can provide flexible access and security.• Achieve high availability and full bandwidth utilization with MLAG and support firmware upgrades withouttaking the network offline.• Layer 3 Advanced IPv4 and IPv6 functionality including BGP, VRF, BFD, PIM-SM/DM/SSM, IGMP/MLD, RIPv1/ v2, OSPFv2/v3• VXLAN support in hardware only ²• MACsec support in N3248PXE-ON hardware only ²2 Can be used if enabled by ON partner network operating system.3 Planned in Roadmap4 Auto-negotiation not supported, using 1G optics require manual configuration and all 4x10G SFP+ or 4x25G SFP28 ports to be set to same speed. 100M speed not supported.5 Auto-negotiation not supported, using 10G cables or optics require manual configuration and all 4x25G SFP28 ports to be set to same speed. 100M/1G speed not supported.Hardware specificationsPhysical2 integrated rear 100GbE QSFP28 stacking ports (except N3208PX-ON)Out-of-band management port(10/100/1000BASE-T)USB (Type A) port for configuration via USB flash driveMicroUSB (Type B) console port (MicroUSB to USB connector cable included)RJ45 console port with RS232 signaling(RJ-45 to female DB-9 connector cable included)Auto-negotiation for speed and flow control Auto-MDI/MDIX, port mirroringFlow-based port mirroring Broadcast storm controlEnergy-Efficient Ethernet per port settings Redundant variable speed fansAir flow: I/O to power supplyPower supply:Integrated 320W (N3208PX-ON),550W (N3224T-ON, N3224F-ON,N3248TE-ON, N3248X-ON),1050W (N3224P-ON, N3248P-ON),1600W (N3224PX-ON, N3248PXE-ON)Dual firmware images on-boardSwitching engine model: Store and forwardChassisSize (1RU, H x W x D):N3208PX-ON: 1.71 in x 11 in x 12.28 in;All other models: 1.71 in x 17.09 in x 15.75 in (power supply/fan tray handle adds add’l 1.18 in)Approximate weight (Switch with 1 PSU installed):8.44lbs/3.83kg (N3208PX-ON),13.75lbs/6.24kg (N3224T-ON),14.25lbs/6.46kg (N3224F-ON),15.6lbs/7.08kg(N3224P-ON),16lbs/7.26kg (N3224PX-ON,15.4lbs/6.99kg (N3248TE-ON),16.7lbs/7.57kg (N3248P-ON),16.1lbs/7.3kg (N3248X-ON),17.6lbs/7.98kg (N3248PXE-ON)2-post rack mounting kitEnvironmentalPower supply efficiency: 87% or better in all operating modesMax. thermal output (BTU/hr):2821 (N3208PX-ON), 686 (N3224T-ON), 764 (N3224F-ON), 3220 (N3224P-ON), 9344 (N3224PX-ON), 723 (N3248TE-ON), 5719 (N3248P-ON), 1637 (N3248X-ON), 18224 (N3248PXE-ON)Power consumption max (watts):900 (N3208PX-ON), 201 (N3224T-ON),224 (N3224F-ON), 944 (N3224P-ON),2740 (N3224PX-ON), 212 (N3248TE-ON), 1677 (N3248P-ON), 480 (N3248X-ON), 5344 (N3248PXE-ON)Operating temperature: 32° to 113°F (0° to 45°C)Operating relative humidity: 95%Storage temperature: –40° to 158°F(–40° to 70°C)Storage relative humidity: 95%PerformanceCPU memory: 4GBSSD: 8GB (32GB for N3248TE-ON)Packet buffer memory:8MB (4MB for N3208PX-ON and 32MB forN3248X-ON and N3248PXE-ON)Switch fabric capacity (full-duplex):88Gbps (N3208PX-ON),528Gbps (N3224T-ON, N3224F-ON,N3224P-ON),576Gbps (N3248TE-ON, N3248P-ON),1080Gbps (N3224PX-ON),1560Gbps (N3248X-ON, N3248PXE-ON)Forwarding rate:122Mpps (N3208PX-ON),733Mpps (N3224T-ON, N3224F-ON,N3224P-ON),800Mpps (N3248TE-ON, N3248P-ON),1500Mpps (N3224PX-ON),2167Mpps (N3248X-ON, N3248PXE-ON)Line-rate Layer 2 switching: All (non-blocking)Line-rate Layer 3 routing: All (non-blocking)Network Operating System specificationsSoftware specifications listed below areapplicable for OS6. For detailed specificationsof NOS, please contact your Dell Technologiesrepresentative.Scaling performanceMAC addresses: 32KLink aggregation:128 LAG groups, 144 dynamic ports perstack, 8 member ports per LAGPriority queues per port: 8Static routes: 1,024 (IPv4)/1,024 (IPv6)Dynamic routes: 8,158 (IPv4)/4,096 (IPv6)OSPF routing interfaces: 8,158RIP routing interfaces: 512ECMP next hops per route: 16ECMP groups: 1024VLAN routing interfaces: 128VLANs supported: 4,094Protocol-based VLANs: SupportedMulticast forwarding entries:1,536 (IPv4), 512 (IPv6)ARP entries: 6,144NDP entries: 2,560Access control lists (ACL): SupportedMAC and IP-based ACLs: SupportedTime-controlled ACLs: SupportedMax number of ACLs: 100Max ACL rules system-wide: 3,914Max rules per ACL: 1,023Max ACL rules per interface (IPv4):1,023 (ingress), 511 (egress)Max ACL rules per interface (IPv6):1,021 (ingress), 509 (egress)Max VLAN interfaces with ACLs applied: 24IEEE compliance802.1AB LLDPDell Voice VLANDell ISDP802.1D Bridging, Spanning Tree802.1p Ethernet Priority (User Provisioningand Mapping)Dell Adjustable WRR and Strict QueueScheduling802.1Q VLAN Tagging, Double VLANTagging, GVRP802.1S Multiple Spanning Tree (MSTP)802.1v Protocol-based VLANs802.1W Rapid Spanning Tree (RSTP)Dell RSTP-Per VLANDell Spanning tree optional features: STProot guard, BPDU guard, BPDUfiltering802.1X Network Access Control, Auto VLAN802.2 Logical Link Control802.3 10BASE-T802.3ab Gigabit Ethernet (1000BASE-T)802.3ac Frame Extensions for VLANTagging802.3ad Link Aggregation with LACP802.3at PoE (N3224P-ON, N3248P-ON,N3208PX-ON, N3224PX-ON,N3248PXE-ON)802.3bt PoE (N3208PX-ON, N3224PX-ON,N3248PXE-ON)802.3AX LAG Load BalancingDell Multi-Chassis LAG (MLAG)Dell Policy Based Forwarding802.3az Energy Efficient Ethernet (EEE)802.3u Fast Ethernet (100BASE-TX) onmanagement ports802.3x Flow Control802.3z Gigabit Ethernet (1000BASE-X)802.3bz 1G/2.5G/5G/10GANSI LLDP-MED (TIA-1057)Dell EqualLogic iSCSI Auto-configurationMTU 9,216 bytesGeneral Internet protocolsGeneral Internet protocols are supported.For a detailed list, please contact your DellTechnologies representative.General IPv4 protocolsGeneral IPv4 protocols are supported. Fora detailed list, please contact your DellTechnologies representative.General IPv6 protocolsGeneral IPv6 protocols are supported. Fora detailed list, please contact your DellTechnologies representative.Layer 3 functionality1058 RIPv11724 RIPv2 MIB Extension1765 OSPF DB overflow1850 OSPF MIB2082 RIP-2 MD5 Auth2328 OSPFv22338 VRRP2370 OpaqueDell Policy Based Routing2453 RIPv22740 OSPFv32787 VRRP MIB3101 NSSA3137 OSPF Stub Router Advert3623 Graceful Restart3768 VRRP4271 BGP5187 OSPFv3 Graceful Routing RestartMulticast1112 IGMPv12236 IGMPv22365 Admin scoped IP2710 MLDv12932 IPv4 MIB2933 IGMP MIB3810 MLDv23973 PIM-DM4541 IGMP v1/v2/v3 Snooping and Querier5060 PIM MIB5061 PIM MIB3376 IGMPv3Dell Static IP MulticastDraft-ietf-pim-sm-bsr-05Draft-ietf-idmr-dvmrp-v3-10 DVMRPDraft-ietf-magma-igmp-proxy-06.txtIGMP/MLD ProxyingDraft-ietf-magma-igmpv3-and-routing-05.txtdraft-ietf-idmr-dvmrp-mib-11draft-ietf-magma-mgmd-mib-05draft-ietf-pim-bsr-mib-06IEEE 802.1ag draft 8.1 – Connectivity FaultManagement (CFM)IEEE 802.1p GMRP Dynamic L2 MulticastRegistrationQuality of service2474 DiffServ Field2475 DiffServ Architecture2597 Assured Fwd PHBDell Port Based QoS Services (TCP/UDP) ModeDell Red/WREDDell Flow Based QoS ServicesDell Audio Video Bridging Mode (IPv4/IPv6)Dell UDLD2697 srTCM4115 trTCMNetwork Management and SecurityDell L4 Trusted Mode1155 SMIv11157 SNMPv11212 Concise MIB Definitions1213 MIB-II1215 SNMP Traps1286 Bridge MIB1442 SMIv21451 Manager-to-Manager MIB1492 TACACS+1493 Managed objects for Bridges MIB 1573 Evolution of Interfaces1612 DNS Resolver MIB Extensions1643 Ethernet-like MIB1757 RMON MIB1867 HTML/2.0 Forms with file uploadextensions1901 Community-based SNMPv21907 SNMPv2 MIB1908 Coexistence between SNMPv1/v2 2011 IP MIB2012 TCP MIB2013 UDP MIB2068 HTTP/1.12096 IP Forwarding Table MIB2233 Interfaces Group using SMIv22246 TLS v12271 SNMP Framework MIB 2295 Transport Content Negotiation2296 Remote Variant Selection2576 Coexistence between SNMPv1/v2/v32578 SMIv22579 Textual Conventions for SMIv22580 Conformance Statements for SMIv22613 RMON MIB2618 RADIUS Authentication MIB2620 RADIUS Accounting MIB2665 Ethernet-like Interfaces MIB2666 Identification of Ethernet chipsets2674 Extended Bridge MIB2737 ENTITY MIB2818 HTTP over TLS2819 RMON MIB (groups 1, 2, 3, 9)2856 Text Conv. For High Capacity DataTypes2863 Interfaces MIB2865 RADIUS2866 RADIUS Accounting2868 RADIUS Attributes for Tunnel Prot.2869 RADIUS Extensions3410 Internet Standard Mgmt. Framework3411 SNMP Management Framework3412 Message Processing and Dispatching3413 SNMP Applications3414 User-based security model3415 View-based control model3416 SNMPv23417 Transport Mappings3418 SNMP MIB3577 RMON MIB3580 802.1X with RADIUS3737 Registry of RMON MIB4086 Randomness Requirements4113 UDP MIB4251 SSHv2 Protocol4252 SSHv2 Authentication4253 SSHv2 Transport4254 SSHv2 Connection Protocol4419 SSHv2 Transport Layer Protocol4521 LDAP Extensions4716 SECSH Public Key File Format5246 TLS v1.26101 SSL6398 IP Router AlertDell Enterprise MIB supporting routingfeaturesdraft-ietfhubmib- etherifmib- v3-00.txt (ObsoletesRFC 2665)Other certificationsN-Series products have the necessary featuresto support a PCI compliant network topology.Regulatory, environment and othercomplianceSafety and emissionsAustralia/New Zealand: ACMA RCA Class ACanada: ICES Class A; cULChina: CCC Class A; NALEurope: CE Class AJapan: VCCI Class AUSA: FCC Class A; NRTL UL; FDA 21 CFR1040.10 and 1040.11Eurasia Customs Union: EAC Germany: GSmarkProduct meets EMC and safety standards inmany countries inclusive of USA, Canada,EU, Japan, China. For more country-specificregulatory information, and approvals, pleasesee your Dell Technologies representative.RoHSProduct meets RoHS compliance standards inmany countries inclusive of USA, EU, China,and India. For more country-specific RoHScompliance information, please see your DellTechnologies representative.EU WEEEEU Battery DirectiveREACHEnergyJapan: JEL© 2021 Dell Inc. or its subsidiaries. All Rights Reserved. Dell, EMC and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. IT Lifecycle Services for NetworkingExperts, insights and easeOur highly trained experts, with innovative tools and proven processes, help you transform your IT investments into strategic advantages.Plan & DesignLet us analyze your multivendor environment and deliver a comprehensive report and action plan to build upon the existing network and improve performance.Deploy & IntegrateGet new wired or wireless network technology installed and configured with ProDeploy. Reduce costs, save time, and get up and running fast.EducateEnsure your staff builds the right skills for long-term success. Get certified on Dell EMC Networking technology and learn how to increase performance and optimize infrastructure.Manage & SupportGain access to technical experts and quickly resolve multivendor networking challenges with ProSupport. Spend less time resolving network issues and more time innovating.OptimizeMaximize performance for dynamic ITenvironments with Dell EMC Optimize. Benefit from in-depth predictive analysis, remotemonitoring and a dedicated systems analyst for your network.RetireWe can help you resell or retire excess hardware while meeting local regulatory guidelines and acting in an environmentally responsible way.Learn more at/ServicesContact a Dell Technologies ExpertView more resourcesJoin the conversationwith@DellNetworkingLearn more about Dell EMC Networking solutions。
Calisto 3200 5200 电话朋克音频设备用户指南说明书
PLANTRONICS + POLYCOM.Calisto 3200/5200Altavoz con cableGuía del usuarioÍndiceDescripción general3Conexión del altavoz4Uso diario5Alimentación5Contestar o finalizar una llamada5Silenciar y activar sonido5Volumen5Botón Microsoft Teams (solo en modelos Teams)5Música5Mezcla de audio6Asistencia711Control + de volumen 6Altavoz2silenciar7Luz indicadora 3Control - de volumen 8Cable USB4Botón de llamada9Cable de 3,5 mm (solo para el modeloCalisto 5200)5Microsoft Teams (solo para modeloTeams, se requiere la aplicación)Descripción generalConecte el altavoz a la computadora con el cable USB. Conecte el altavoz a su teléfono móvil o tablet con el cable de 3,5 mm (solo para el modelo Calisto 5200). Utilice el altavoz para reproducirmúsica o realizar llamadas. Conexión del altavozConecte el cable USB en la computadora. La luz indicadora del altavoz se iluminará de color blanco y se mantendrá fija mientras se encuentre conectado a la fuente de alimentación.Conecte el cable de 3,5 mm en el dispositivo celular o en la tablet.NOTA Esta tabla solo hace referencia al modelo Calisto 5200, pues el modelo Calisto 3200 no tienebatería.Estado Tiempo de conversación IndicadorBatería alta Más de 12 horas"Battery high" (batería alta)Batería media Menos de 12 horas, más de 2 horas "Battery medium" (batería media)Batería bajaMenos de 2 horas, más de 30 minutos"Battery low" (batería baja) cuando quedan menos de 2 horas de tiempo de conversación Batería crítica Igual o inferior a 30 minutos30 minutos, "battery low" (batería baja) se repite cada 15 minutos10 minutos, "battery low" (batería baja) se repite cada 5 minutos0 minutos, "power off" (apagado) una sola vezImportante: Si el altavoz no se enciende automáticamente cuando se conecta a la fuente de alimentación, mantenga presionados el botón de silencio y el botón de llamada durante cuatro segundos para encender el altavoz manualmente. Si repite este proceso, se apagará el dispositivo.Presione brevemente el botón de llamada para contestar o finalizar una llamada.Se activa o desactiva el silencio de los micrófonos al presionar brevemente el botón de silencio.Presiona los botones de volumen (+) o (-) para aumentarlo o disminuirlo.Presiona el botón Teams para interactuar con Microsoft Teams cuando no estés en una llamada.NOTA La aplicación Microsoft Teams debe estar instalada.Para obtener una mejor experiencia de audio con el conector de 3,5 mm (solo para el modelo Calisto 5200), mantenga presionado el botón de silencio durante cuatro segundos para poner el altavoz en modo de música. Para desactivar el modo de música antes de realizar o recibir llamadas, toque el botón de silencio.Uso diarioAlimentaciónContestar o finalizar unallamadaSilenciar y activar sonidoVolumenBotón Microsoft Teams (solo en modelos Teams)MúsicaMezcla de audioPara mezclar una llamada de USB y 3,5 mm, se debe activar una llamada de USB y 3,5 mm.Enchufe la otra conexión a otro dispositivo. El audio se mezclará y se sincronizará, similar a unallamada de tres vías.Asistencia¿NECESITAS MÁS AYUDA?/supportPlantronics, Inc.Plantronics B.V.345 Encinal Street Santa Cruz, CA 95060 United States Scorpius 171 2132 LR Hoofddorp Netherlands© 2020 Plantronics, Inc. Todos los derechos reservados. Poly, el diseño de hélice y el logotipo de Poly son marcas comerciales de Plantronics, Inc. Todas las demás marcas comerciales son propiedad de sus respectivos propietarios. Fabricado por Plantronics, Inc.212877-09 10.20。
黑梭3200系列耳机头戴式麦克风与内联麦克风麦克风与内联麦克风麦克风与内联麦克风说明书
Blackwire 3200 Series Schnurgebundenes-Headset mit Inline-AnrufsteuerungBedienungsanleitungInhaltÜberblick3Einrichtung4Download der Software4Passung6Kopfbügel anpassen6Positionieren des Mikrofonarms6Anpassen des Mikrofonarms6Nutzung der Inline-Steuerung7Anrufe tätigen/annehmen/beenden7Lautstärke7Stummschalten7Fehlerbehebung8Headset8Support10Gesprächstaste Blinkt grün Eingehender AnrufLeuchtet grün auf Laufendes GesprächT aste zum Erhöhen der Lautstärke Hörlautstärke erhöhen T aste zum Verringern der LautstärkeHörlautstärke verringern Stummschaltung Leuchtet durchgehend rotHeadset ist stummgeschaltet ÜberblickSchalten Sie Ihr Headset ein, indem Sie es mit Ihrem Computer oder mobilen Gerät verbinden.Sie können Ihr Headset auf zwei Arten anschließen:1Per USB-A/USB-C-Anschluss HINWEISDie Headset-Anrufsteuerung kann bei Mobilgeräten variieren.2Per 3,5 mm-Anschluss*HINWEISDie Anrufsteuerung am Headset ist nicht verfügbar.* 3,5 mm-Anschluss nur verfügbar für Blackwire 3215/3225.Passen Sie das Geräteverhalten mithilfe erweiterter Einstellungen und Optionen mit derPoly Lens Desktop-App an. Manche Softphones erfordern die Installation von PolySoftware, um Steuerungsfunktionen (Anruf annehmen/beenden und Stummschaltung) des Geräts zu unterstützen. Download: /lens .HINWEIS Die Geräteeinstellungen sind auch in der Plantronics Hub Desktop-App verfügbar.Aktualisieren Ihres Poly GerätsHalten Sie Ihre Firmware und Software aktuell, um die Leistung zu optimieren und Ihrem Poly Gerät neue Funktionen hinzuzufügen.Aktualisieren Sie Ihr Gerät über den Computer mit Poly Lens Desktop-App. Download unter /lensBeim Aktualisieren:•Verwenden Sie Ihr Poly Gerät nicht, bis das Update abgeschlossen ist.•Starten Sie kein zweites Update von einem zweiten Gerät.EinrichtungDownload der Software•Streamen Sie keine Medien.•Tätigen Sie keine Anrufe und nehmen Sie keine Anrufe an.Verlängern oder verkürzen Sie den Kopfbügel so, dass das Headset angenehm sitzt. DieOhrkissen sollten bequem am Ohr anliegen.Dieses Headset kann sowohl links als auch rechts getragen werden.Drehen Sie den Mikrofonarm so, dass sich das Mikrofon direkt vor Ihrem Mund befindet.VORSICHT Stellen Sie den Mikrofonarm auf bis zu 180°, damit dieser nicht beschädigt wird.Positionieren Sie den Mikrofonarm vorsichtig so, dass er in einem Abstand von 3 cm zur Ecke Ihres Mundes zeigt.PassungKopfbügel anpassenPositionieren desMikrofonarmsAnpassen desMikrofonarmsDie Gesprächskontrolle über das Headset ist eine Softwarefunktion, die ein kompatibles Softphone voraussetzt. Wenn Sie die Poly Lens Desktop-App (/lens ) nicht installiert haben oder kein kompatibles Softphone besitzen, drücken Sie Sie zunächst die Gesprächstaste am Headset und tätigen/beenden Sie dann den Anruf über die Softphone-Anwendung.Annehmen und Beenden von Anrufen Tippen Sie auf die Gesprächstaste oder nehmen Sie den Anruf über Ihr Softphone an.Anruf tätigen Wählen Sie mithilfe der Softphone-Anwendung.Wahlwiederholung Drücken Sie, solange kein Anruf aktiv ist, zweimal die Anruftaste, um die letzte Nummer erneut zu wählen.Halten Halten Sie die Gesprächstaste 2 Sekunden lang gedrückt, um einen Anruf zu halten.Hörlautstärke Drücken Sie die Taste zum Erhöhen (+) oder Verringern (-) der Lautstärke.Anpassen der Lautstärke des Headset-Mikrofons (Softphone)Führen Sie einen Testanruf mit dem Softphone durch und passen Sie die Softphone-Lautstärke und den PC-Sound an.Drücken Sie während eines Gesprächs kurz die Stummschaltungstaste, um das Mikrofonan der Inline-Steuerung stummzuschalten. Um die Stummschaltung wieder aufzuheben,drücken Sie die Taste erneut.Nutzung der Inline-SteuerungAnrufe tätigen/annehmen/beendenLautstärkeStummschaltenIch höre einen hohen Ton, wenn ich das Headset trage.•Stellen Sie sicher, dass der 3,5 mm-Anschluss korrekt mit der Headset-Steuerung verbunden ist.Ich kann den Anrufer nicht hören.•Die Hörlautstärke ist zu niedrig. Drücken Sie auf demHeadset auf die Lautstärketaste, um die Lautstärke zuerhöhen. Stellen Sie zudem sicher, dass dieLautstärkeeinstellung auf Ihrem Computer korrekt ist.•Ihr Headset ist nicht als Standard-Audiogerät eingerichtet.Verwenden Sie die Audioeinstellungen IhresBetriebssystems, um das Headset von Plantronics alsStandard-Audiogerät einzustellen.•Stellen Sie sicher, dass der 3,5 mm-Anschluss korrekt mit derHeadset-Steuerung verbunden ist.Anrufer können mich nicht hören.•Das Headset ist stummgeschaltet. Tippen Sie auf die Stummschalttaste, um die Stummschaltung des Mikrofons aufzuheben.•Der Headset-Mikrofonarm befindet sich in der falschen Position. Richten Sie den Headset-Mikrofonarm zu Ihrem Mund hin aus.•Ihr Headset ist nicht als Standard-Sprachgerät eingerichtet. Verwenden Sie die Audioeinstellungen Ihres Betriebssystems, um das Aufnahmegerät zu ändern.•Stellen Sie sicher, dass der 3,5 mm-Anschluss korrekt mit der Headset-Steuerung verbunden ist.Die Audiowiedergabe über das Headset ist verzerrt.Ich kann im Headset ein Echo hören.•Reduzieren Sie die Hörlautstärke an Ihrem Softphone, bis die Verzerrung nicht mehr zu hören ist.•Passen Sie die Lautstärke am Headset an.•Stellen Sie sicher, dass der 3,5 mm-Anschluss korrekt mit der Headset-Steuerung verbunden ist.Wenn ich mein Headset mit einem Softphone verwende, funktionieren die Anrufsteuerung und die Stummschaltungstasten nicht.•Schauen Sie unter / softphonecompatibility nach, ob Ihr Softphone unterstützt wird.•Falls Sie die Headset-Steuerung (Annahme/Beenden und Stummschalten) aktivieren müssen, stellen Sie sicher, dass Poly Lens Desktop-App installiert ist. Siehe Download der Software.•Eventuell unterstützt Ihr mobiles Gerät die Anrufsteuerung nicht. Wenden Sie sich an den Hersteller des Geräts.Das andere Headset, mit dem ich Musik gehört habe, funktioniert nicht mehr.•Ihr Headset richtet sich selbsttätig als Standard-Audiogerät in Windows ein. Verwenden Sie die Audioeinstellungen Ihres Betriebssystems, um das Audiogerät zu ändern.Mein Telefon findet mein Headset während eines Anrufs oder beim Musikhören nicht.•Stellen Sie während eines Anrufs oder beim Musikhören sicher, dass das Audiosignal an das gewünschte HeadsetFehlerbehebungHeadsetweitergeleitet wird, indem Sie es in den Einstellungen als Standard festlegen.SupportBENÖTIGEN SIE WEITERE HILFE?/supportPlantronics, Inc.Plantronics B.V.345 Encinal Street Santa Cruz, CA 95060 United States Scorpius 171 2132 LR Hoofddorp Netherlands© 2022 Plantronics, Inc. Alle Rechte vorbehalten. Poly, das Propeller-Design und das Poly Logo sind Marken von Plantronics, Inc. Alle anderen Marken sind Eigentum ihrer jeweiligen Rechteinhaber. Hergestellt von Plantronics, Inc.211088-04 02.22。
MEMORY存储芯片MT29F32G08CBADAWP中文规格书
Electrical Specifications – AC Characteristics and Operating Conditions AC Characteristics: Command, Data, and Address Input (3.3V)Notes: 1.Operating mode timings meet ONFI timing mode 5 parameters.2.Timing for t ADL begins in the address cycle, on the final rising edge of WE#, and endswith the first rising edge of WE# for data input.AC Characteristics: Command, Data, and Address Input (1.8V) Note 1Notes: 1.Operating mode timings meet ONFI timing mode 4 parameters.2.Timing for t ADL begins in the address cycle on the final rising edge of WE#, and endswith the first rising edge of WE# for data input.4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Electrical Specifications – AC Characteristics and Operating ConditionsElectrical Specifications – DC Characteristics and Operating Conditions DC Characteristics and Operating Conditions (3.3V)Notes: 1.Measurement is taken with 1ms averaging intervals and begins after V CC reachesV CC(MIN).2.I OL (R/B#) may need to be relaxed if R/B pull-down strength is not set to full.3.V OH and V OL may need to be relaxed if I/O drive strength is not set to full.DC Characteristics and Operating Conditions (1.8V)Notes: 1.Typical and maximum values are for single-plane operation only. If device supports dual-plane operation, values are 20mA (TYP) and 40mA (MAX).2.Values are for single-die operations. Values could be higher for interleaved-die opera-tions.3.Measurement is taken with 1ms averaging intervals and begins after V CC reachesV CC(MIN).4.Test conditions for V OH and V OL.5.DC characteristics may need to be relaxed if R/B# pull-down strength is not set to full.。
TLMK3200资料
Power SMD LED PLCC-4DESCRIPTIONThe TLM.32.. series is an advanced development in terms of heat dissipation.The leadframe profile of this PLCC-3 SMD package is optimized to reduce the thermal resistance.This allows higher drive current and doubles the light output compared to Vishay’s high intensity SMD LED in PLCC-2 package.PRODUCT GROUP AND PACKAGE DATA •Product group: LED•Package: SMD PLCC-4•Product series: power•Angle of half intensity: ± 60°FEATURES•Utilizing AlInGaP technology•Available in 8 mm tape•Luminous intensity, color and forwardvoltage categorized per packing unit •Luminous intensity ratio per packing unitI Vmax/I Vmin≤ 1.6•ESD class 2•Suitable for all soldering methodsaccording to CECC•Lead (Pb)-free deviceAPPLICATIONS•Traffic Signals and Signs•Interior and exterior lighting•Dashboard illumination•Indicator and backlighting purposes for audio, video, LCDs switches, symbols, illuminated advertising etc.19210PARTS TABLEPART COLOR, LUMINOUS INTENSITY DOMINANT WAVELENGTH TLMK3200Red, I V > 200 mcd (typ. 500 mcd)611 nm to 622 nm TLMK3201Red, I V = (250 to 800) mcd611 nm to 622 nm TLMK3202Red, I V = (320 to 800) mcd611 nm to 622 nm TLMK3203Red, I V = (400 to 1250) mcd611 nm to 622 nm TLMS3200Red, I V > 160 mcd (typ. 300 mcd)626 nm to 638 nm TLMS3201Red, I V = (160 to 400) mcd626 nm to 638 nm TLMS3202Red, I V = (250 to 800) mcd626 nm to 638 nm TLMO3200Soft orange, I V > 200 mcd (typ. 500 mcd)600 nm to 611 nm TLMO3201Soft orange, I V = (250 to 800) mcd600 nm to 611 nm TLMO3202Soft orange, I V = (320 to 800) mcd600 nm to 611 nm TLMO3203Soft orange, I V = (400 to 1250) mcd600 nm to 611 nm TLMY3200Y ellow, I V > 200 mcd (typ. 450 mcd)583 nm to 594 nm TLMY3201Y ellow, I V = (250 to 800) mcd583 nm to 594 nm TLMY3202Y ellow, I V = (320 to 800) mcd583 nm to 594 nm TLMY3203Y ellow, I V = (400 to 1250) mcd583 nm to 594 nmNote:1)T amb = 25°C, unless otherwise specifiedNote:1) Tamb = 25°C, unless otherwise specifiedNote:1)T amb = 25°C, unless otherwise specified ABSOLUTE MAXIMUM RATINGS 1) TLMK32.., TLMS32.., TLMO32.., TLMY32..PARAMETER TEST CONDITIONSYMBOLVALUE UNIT Reverse voltage V R 5V Forward current I F 70mA Power dissipation T amb ≤ 65°C (290 K/W), T amb ≤ 70°C (270 K/W)P tot 180mW Junction temperature T j 125°C Operating temperature range T amb - 40 to + 100°C Storage temperature range T stg - 40 to + 100°C Thermal resistance junction/ambientmounted on PC board FR4optional paddesign (see page 11)R thJA 290K/W mounted on PC board FR4recommended paddesign (see page 10)R thJA270K/WOPTICAL AND ELECTRICAL CHARACTERISTICS 1) TLMK32.., REDPARAMETERTEST CONDITIONPART SYMBOLMIN TYP.MAXUNIT Luminous intensityI F = 50 mATLMK3200I V 200500mcd TLMK3201I V 250800mcd TLMK3202I V 320800mcd TLMK3203I V 4001250mcd Luminous flux/Luminous intensityφV /I V 3mlm/mcd Dominant wavelength I F = 50 mA λd 611617622nm Peak wavelength I F = 50 mA λp 624nm Spectral bandwidth at 50 % I rel max I F = 50 mA Δλ18nm Angle of half intensity I F = 50 mA ϕ± 60deg Forward voltage I F = 50 mA V F 1.85 2.1 2.55V Reverse currentV R = 5 VV R0.0110µAOPTICAL AND ELECTRICAL CHARACTERISTICS 1) TLMS32.., REDPARAMETER TEST CONDITIONPART SYMBOLMIN TYP.MAXUNIT Luminous intensity I F = 50 mATLMS3200I V 160300mcd TLMS3201I V 160400mcd TLMS3202I V 250800mcd Luminous flux/Luminous intensityφV /I V 3mlm/mcd Dominant wavelength I F = 50 mA λd 626630638nm Peak wavelength I F = 50 mA λp 641nm Spectral bandwidth at 50 % I rel max I F = 50 mA Δλ17nm Angle of half intensity I F = 50 mA ϕ± 60deg Forward voltage I F = 50 mA V F 1.85 2.1 2.55V Reverse currentV R = 5 V V R0.0110µANote:1)T amb = 25°C, unless otherwise specifiedNote:1)T amb = 25°C, unless otherwise specifiedOPTICAL AND ELECTRICAL CHARACTERISTICS 1) TLMO32.., SOFT ORANGEPARAMETERTEST CONDITIONPART SYMBOLMIN TYP.MAXUNIT Luminous intensityI F = 50 mATLMO3200I V 200500mcd TLMO3201I V 250800mcd TLMO3202I V 320800mcd TLMO3203I V 4001250mcd Luminous flux/Luminous intensityφV /I V 3mlm/mcd Dominant wavelength I F = 50 mA λd 600605611nm Peak wavelength I F = 50 mA λp 611nm Spectral bandwidth at 50 % I rel max I F = 50 mA Δλ17nm Angle of half intensity I F = 50 mA ϕ± 60deg Forward voltage I F = 50 mA V F 1.85 2.1 2.55V Reverse currentV R = 5 VV R0.0110µAOPTICAL AND ELECTRICAL CHARACTERISTICS 1) TLMY32.., YELLOWPARAMETERTEST CONDITIONPART SYMBOLMIN TYP.MAX UNIT Luminous intensityI F = 50 mATLMY3200I V 200450mcd TLMY3201I V 250800mcd TLMY3202I V 320800mcd TLMY3203I V 4001250mcd Luminous flux/Luminous intensityφV /I V3mlm/mcdDominant wavelength I F = 50 mA λd 583588594nm Peak wavelength I F = 50 mA λp 590nm Spectral bandwidth at 50 % I rel max I F = 50 mA Δλ18nm Angle of half intensity I F = 50 mA ϕ± 60deg Forward voltage I F = 50 mA V F 1.852.1 2.55V Reverse currentV R = 5 VV R0.0110µAFORWARD VOLTAGE CLASSIFICATIONGROUPFORWARD VOLTAGE (V)MIN MAX 1 1.85 2.2522.152.55One packing unit/tape contains only one classification group of luminous intensity, color and forward voltage.Only one single classification groups is not available.The given groups are not order codes, customer specific group combinations require marketing agreement.No color subgrouping for Super Red.TYPICAL CHARACTERISTICS T amb = 25°C, unless otherwise specifiedCOLOR CLASSIFICATIONGROUPDOMINANT WAVELENGTH (NM)REDSOFT ORANGE YELLOWMINMIN MAXMIN MAX MAX 161161859860158158426146226006035835863602605585588460460758759056066095895926608611591594LUMINOUS INTENSITY CLASSIFICATIONGROUP LUMINOUS INTENSITY (MCD)MIN MAX Xa 160250Xb 200320Y a 250400Yb 320500Za 400630Zb 5008000a 63010000b8001250GROUP NAME ON LABELLUMINOUS INTENSITY GROUPHALFGROUPWAVELENGTHFORWARD VOLTAGEZb21Figure 1. Power Dissipation vs. Ambient Temperature 020406080100120140160180200025507510012518567V P -P o w e r D i s s i p a t i o n (m W )T am b -Am b ient Temperat u re (°C)Figure 2. Forward Current vs. Ambient Temperature10203040506070809010025507510012518568I F - F o r w a r d C u r r e n t (m A )T am b - Am b ient Temperat u re (°C)Figure 3. Rel. Luminous Intensity vs. Angular Displacement Figure 4. Relative Intensity vs. WavelengthFigure 5. Change of Forward Voltage vs. Ambient Temperature 0.40.20.20.40.695 103190.60.90.80°30°10°20°40°50°60°70°80°0.71.0I V r e l - R e l a t i v e L u m i n o u s I n t e n s i t y0.00.2 0.4 0.6 0.8 1.0 1.2570 590 610 630 650 670λ - W a v elength (nm)16007I V r e l - R e l a t i v e L u m i n o u s I n t e n s i ty- 50- 25255075100T am b - Am b ient Temperat u re (°C)17034V - C h a n g e o f F o r w a r d V o l t a g e (m V )F Figure 6. Relative Luminous Intensity vs. Amb. TemperatureFigure 7. Change of Dominant Wavelength vs.Ambient TemperatureFigure8. Relative Luminous Intensity vs. Forward Current- 50- 250255075100T am b - Am b ient Temperat u re (°C)17035I V r e l - R e l a t i v e L u m i n o u s I n t e n s i t y0 2 4 6- 50- 250255075100T am b - Am b ient Temperat u re (°C)17036- C h a n g e o f D o m . W a v e l e n g th (n m )d 0.010.1110110100I F - For w ard C u rrent (mA)17037I V r e l - R e l a t i v e L u m i n o u s I n t e n s i t yFigure 9. Change of Dominant Wavelength vs. Forward Current Figure 10. Relative Intensity vs. Wavelength Figure 11. Forward Current vs. Forward Voltage10 20 30 40 50 60 70 80 90 100 17038 - C h a n g e o f D o m . W a v e l e n g t h (n m )d I F - For w ard C u rrent (mA)0.00.10.20.30.40.50.60.70.80.91.01.11.260061062063064065066067068069070017045I -R e l a t i v e L u m i n o u s I n t e n s i t yV r e l λ-W a v elength (nm)1020304050607080901001.41.51.61.71.81.92.02.12.22.32.4V F - For w ard V oltage (V )17047F I -F o r w a r d C u r r e n t (m A )Figure 12. Change of Forward Voltage vs. Ambient TemperatureFigure 13. Relative Luminous Intensity vs. Amb. TemperatureFigure 14. Change of Dominant Wavelength vs.Ambient TemperatureT am b - Am b ient Temperat u re (°C)V F - C h a n g e o f F o r w a r d V o l t a g e (m V )17039- 200- 150- 100- 50050100150200250- 50- 252550751000.00.51.01.52.02.5- 50- 250255075100T am b -Am b ient Temperat u re (°C)17040I -R e l a t i v e L u m i n o u s I n t e n s i t yV r e l - 5- 4- 3- 2- 10123- 50- 25255075100T am b -Am b ient Temperat u re (°C)17041-C h a n g e o f D o m .W a v e l e n g t h (n m )ΔλdFigure 15. Relative Luminous Intensity vs. Forward Current Figure 16. Change of Dominant Wavelength vs. Forward Current Figure 17. Relative Intensity vs. Wavelength1 10 100I F - For w ard C u rrent (mA)17042I V r e l - R e l a t i v e L u m i n o u s I n t e n si t y- 1.5- 1.0- 0.50.00.51.01.510203040506070809010017043I F -For w ard C u rrent (mA)-C h a n g e o f D o m .W a v e l e n g t h (n m )Δλd 0.8560 580 600 620 640 66016314I V r e l - R e l a t i v e L u m i n o u s I t e n s i t yλ - W a v elength (nm)Figure 18. Change of Forward Voltage vs. Ambient TemperatureFigure 19. Relative Luminous Intensity vs. Amb. TemperatureFigure 20. Change of Dominant Wavelength vs.Ambient Temperature- 50- 25 0255075100T am b - Am b ient Temperat u re (°C)17020V - C h a n g e o f F o r w a r d V o l t a g e (m V )F- 50- 250255075100T am b - Am b ient Temperat u re (°C)17021I V r e l - R e l a t i v e L u m i n o u s I n t e n s i t y- 50- 250255075100T am b - Am b ient Temperat u re (°C)17022- C h a n g e o f D o m . W a v e l e n g t h (n m )dFigure 21. Relative Luminous Intensity vs. Forward Current Figure 22. Change of Dominant Wavelength vs. Forward Current Figure 23. Relative Intensity vs. Wavelength0.010.1110110100I F - For w ard C u rrent (mA)17023I V r e l - R e l a t i v e L u m i n o u s I n t e n s i ty10 20 30 40 50 60 70 80 90 10017024- C h a n g e o f D o m . W a v e l e n g t h (n m )d I F - For w ard C u rrent (mA)0.00.20.40.6 0.8 1.0 1.2 540 560 580 600 620 640λ - W a v elength (nm)16008I V r e l - R e l a t i v e L u m i n o u s I n t e n s i t yFigure 24. Change of Forward Voltage vs. Ambient TemperatureFigure 25. Relative Luminous Intensity vs. Amb. TemperatureFigure 26. Change of Dominant Wavelength vs.Ambient Temperature- 50- 25 0 25 50 75 100T am b - Am b ient Temperat u re (°C)17015Δ V F - C h a n g e o f F o r w a r d V o l t a g e (m V )- 50- 250255075100T am b - Am b ient Temperat u re (°C)17016I V r e l - R e l a t i v e L u m i n o u s I n t e n s i t y- 6 - 4 - 2 0 2 4 6- 50- 250255075100T am b - Am b ient Temperat u re (°C)17017- C h a n g e o f D o m . W a v e l e n g t h (n m )dTAPING in millimetersFigure 27. Relative Luminous Intensity vs. Forward Current Figure 28. Change of Dominant Wavelength vs. Forward Current 0.010.1110110100I F - For w ard C u rrent (mA)17018I V r e l - R e l a t i v e L u m i n o u s I n t e n s i ty- 1.5- 1.0- 0.510 20 30 40 50 60 70 80 90 10017019- C h a n g e o f D o m . W a v e l e n g t h (n m )dI F - For w ard C u rrent (mA)Figure 29. Forward Current vs. Forward VoltageFigure 30. Forward Current vs. Pulse Length1.51.61.71.81.92.02.12.22.32.42.5V F - For w ard V oltage (V )170460.000.020.040.060.080.100.12t P - P u lse Length (s)I F - F o r w a r d C u r r e n t (A )10-510-410-310-210-110010110217044RECOMMENDED PAD DESIGN in millimeters (Wave-Soldering), R thJA = 270 K/WRECOMMENDED PAD DESIGN in millimeters (Reflow-Soldering), R thJA = 270 K/WTLMK/O/S/Y320.Vishay SemiconductorsOPTIONAL PAD DESIGN in millimeters(Wave-Soldering), R thJA = 290 K/W(Reflow-Soldering), R thJA = 290 K/WTLMK/O/S/Y320.Vishay Semiconductors PACKAGE DIMENSIONS in millimetersTLMK/O/S/Y320.Vishay Semiconductors Ozone Depletin g Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with suchunintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。
纽瑞斯NRH-3200系列交流电压 电流表使用说明书
使用说明书NHR-3200系列交流电压/电流表可外接电压、电流互感器的标准信号或直接接入电流5A、电压500V的交流信号，输出功能可选模拟量输出、通讯输出功能，配备RS232/485通讯接口，支持标准MODBUS RTU通讯协议，可组网实现数据的集中管理；可带欠压和过载事件报警功能。
本产品采用工业级元器件，所有与外界的连接都做了电气隔离，内置抗雷击保护电路和电源滤波器。
可靠的端子输入，接线端子采用国外进口插拔式端子，具备高耐压和过流等级的特点。
专业的EMC设计，对装置输入电源、模拟和数字电源进行实时的监测，保证了其运行的可靠性。
科学的自诊断功能，可通过显示代码表明产品的故障。
适用于成套智能高、低压配电柜、智能箱变、小家电性能检测系统的数据采集。
二、技术参数NHR-3200系列交流电压/电流表Hong Run Precision Instruments Co., LtD.测量参数电 压电 流测量范围0.0～500.0V/AC 0.03～5A/AC分辨力0.1V 0.001A过载持续120%；瞬时2倍/30S 持续120%；瞬时2倍/30S电压输入电流输入输出信号使用环境工作电源功耗结构交流0～500V输入，500V以上由电压互感器转换为100V电压输入输入阻抗：500KΩ交流0～5A输入，5A以上由电流互感器转换为5A电流输入输入阻抗：＜0.1Ω模拟量输出：4～20mA（负载电阻≤500Ω）、0～20mA（负载电阻≤500Ω） 0～10mA（负载电阻≤1KΩ）、1～5V（负载电阻≥250KΩ） 0～5V(负载电阻≥250KΩ)报警输出：继电器控制输出—AC220V/2A、DC24V/2A（阻性负载）通讯输出：RS485/RS232通讯接口，波特率1200～9600bps可设置，采用标MODBUS RTU通讯 协议，RS485通讯距离可达1公里；RS232通讯距离可达：15米。
环境温度：-10～60℃；相对湿度：≤85%RH； 避免强腐蚀气体。
MEMORY存储芯片MT29F32G08QAA-WP中文规格书
Table 12: Parameter Page Data Structure (Continued)Table 12: Parameter Page Data Structure (Continued)READ UNIQUE ID (EDh)The READ UNIQUE ID (EDh) command is used to read a unique identifier programmedinto the target. This command is accepted by the target only when all die (LUNs) on thetarget are idle.Writing EDh to the command register puts the target in read unique ID mode. The tar-get stays in this mode until another valid command is issued.When the EDh command is followed by an 00h address cycle, the target goes busy fort R. If the READ STATUS (70h) command is used to monitor for command completion,the READ MODE (00h) command must be used to re-enable data output mode.After t R completes, the host enables data output mode to read the unique ID. When theasynchronous interface is active, one data byte is output per RE# toggle.Sixteen copies of the unique ID data are stored in the device. Each copy is 32 bytes. Thefirst 16 bytes of a 32-byte copy are unique data, and the second 16 bytes are the comple-ment of the first 16 bytes. The host should XOR the first 16 bytes with the second 16bytes. If the result is 16 bytes of FFh, then that copy of the unique ID data is correct. Inthe event that a non-FFh result is returned, the host can repeat the XOR operation on asubsequent copy of the unique ID data. If desired, the RANDOM DATA READ (05h-E0h)command can be used to change the data output location.The upper eight I/Os on a x16 device are not used and are a “Don’t Care” for x16 devi-ces.Figure 29: READ UNIQUE ID (EDh) OperationCycle typeI/O[7:0]R/B#4Gb, 8Gb, 16Gb: x8, x16 NAND Flash MemoryREAD UNIQUE ID (EDh)。
武汉特试特 TE3200高精度回路电阻测试仪 说明书
TE 3200高精度回路电阻测试仪说 明 书武汉特试特科技有限公司地址: 武汉市东湖高新技术开发区关山二路特1号国际企业中心Ⅱ－2免费服务热线:800－880 0780电话: (027)6784 5315、6784 5317传真: (027)6784 5319网址: E－MAIL:****************一、衷心感谢您使用本公司的产品，您因此将获得本公司全面的技术支持和服务保障。
二、本使用说明书适用于T E3200 高精度回路电阻测试仪。
三、当您在使用本产品前，请仔细阅读本使用说明书，并妥善保存以备查考。
四、请严格按说明书要求步骤操作，使用不当可能危及人身安全。
五、在阅读本说明书或仪器使用过程中如有疑惑，可向我公司咨询。
咨询电话：800－880 0780前言目录1、概述1.1 用途-----------------------------------11.2 性能特点--------------------------------12、特别提示2.1 电源方面--------------------------------22.2 安全方面--------------------------------22.3 操作方面--------------------------------23、技术特征3.1 名称和分类------------------------------33.2 主机结构型式与尺寸 -----------------------33.3 使用电源--------------------------------33.4 使用环境要求-----------------------------33.5 仪器功率--------------------------------33.6 测量范围------ -------------------------33.7 测量精度--------------------------------33.8 最高分辨率------------------------------33.9 测试电流--------------------------------43.10 测试时间-------------------------------44、工作原理4.1 原理框图--------------------------------55、面板布置5.1 面板示意图------------------------------65.2 各部件说明------------------------------65.3 按键说明--------------------------------6目录6、页面说明6.1 开机页面--------------------------------76.2 主菜单---------------------------------76.3 测试菜单--------------------------------86.4 数据菜单--------------------------------86.5 数据打印页面----------------------------96.6 数据存储页面-----------------------------96.7 输入法页面------------------------------106.8 数据读取页面-----------------------------116.9 时钟设置页面-----------------------------126.10 帮助页面----------－－------------------127、基本操作7.1 如何更换打印纸---------------------------137.2 如何更换保险丝---------------------------138、测试8.1 接线准备--------------------------------148.2 测试步骤--------------------------------148.3 试验结束后现场清理------------------------149、运输与保养 -------------------------------1510、随机附件 ----------------------------- 1611、售后服务 ----------------------------- 171.1 用途T E 3200 高精度回路电阻测试仪适用于高压开关接触电阻（回路电阻）的高精度测量，同样适用于其它需要大电流、微电阻测量的场合。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
660 643 25 30.00 30.00 −.50 −1.50 20
Web: | Email: info@
元器件交易网
Visible Emitter
MT3200A−UR2 Graphs
Company Headquarters 3 Northway Lane North Latham, New York 12110 Toll Free: 800.984.5337 Fax: 518.785.4725
元器件交易网
Visible Emitter
MT3200A−UR2
Features Hity Narrow Beam Angle
Applications Optical Sensors Bar Code Reader Edge Sensing
Web: | Email: info@
West Coast Sales Office 950 South Coast Drive, Suite 265 Costa Mesa, California 92626 Toll Free: 800.984.5337 Fax: 714.850.9314
Maximum Ratings (Ta=25 C)
Characteristic Forward Current Pulsed Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Junction Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tj Tsol Max. 50 .50 5 120.00 −20 ~ +80 −30 ~+100 100 260 Test Condition Unit − tw=10µ S, T=10mS − − − − − for 5 sec. max mA A V mW
o
o
C C C C
o
o o
Opto−Electrical Characteristics (Ta=25 C)
Characteristic Forward Voltage Reverse Current Power Output Half Intensity Beam Angle Peak Wavelength Dominant Wavelength Spectral Line Half Width Rise Time Fall Time Temp Coefficient of PO Temp Coefficient of VF Junction Capacitance Company Headquarters 3 Northway Lane North Latham, New York 12110 Toll Free: 800.984.5337 Fax: 518.785.4725 Symbol VF IR PO θ λp λd ∆λ Tr Tf P/T V/T Cj Test Condition IF=20mA VR=5V IF=20mA − IF=20mA IF=20mA IF=20mA IFP=20mA IFP=20mA IF=10mA IF=10mA 1MHz, V=0V Min − − 5.00 − − − − − − − − − Typ 1.80 − 6.50 ±7
o
o
Max 2.20 100 − − − − − − − − − −
Unit V µA mW deg. nm nm nm ns ns %/°C mV/°C pF West Coast Sales Office 950 South Coast Drive, Suite 265 Costa Mesa, California 92626 Toll Free: 800.984.5337 Fax: 714.850.9314