HDSP-A22C中文资料
名正行车记录仪A说明书
目录➢前言 (1)➢产品保证 (2)➢产品概述 (3)➢产品特性 (4)➢产品示意图 (5)➢按键功能 (6)➢操作指南 (7)➢摄影模式 (8)➢拍照模式 (9)➢回放模式 (10)➢系统设置 (11)➢产品参数 (12)➢附件清单 (13)➢安全注意事项 (14)➢简易疑难排解 (15)一、前言感谢您购买新科行车记录仪。
本手册将详细说明如何正确使用行车记录仪，同时提供给您详细的产品信息，包括操作、注意事项及技术规格等，使用前请仔细阅读本手册。
我们希望本产品能满足您的需求并长期服务于您!二、产品保证本产品经严格测试，性能合乎规定，使用过程中有任何问题和疑问，请致电全国免费电话：400-850-0528，专业的技术指导24小时为您服务。
三、产品概述本产品是采用最新科技设计而成的数字高清行车记录仪，可以录制像素分辨率高达1920*1080PFULL HD的高解析影像。
本产品安装方便打开包装拿出产品专用支架装到机器相对应的接口处，然后直接吸在前挡风玻璃上，接上电源把车充插到点烟器上直接使用方可。
后拉镜头撕开双面胶贴在后挡风玻璃中上端位置，然后把后拉镜头一段接口对应机器处连接上方可使用。
和传统的摄影机相比较，本产品录制的FULL HD高清影像，可以记录更加完美的视频画面。
本产品支持汽车启动自动录像，可定时循环录像，移动侦测自录像，灵敏度可调碰撞感应，支持录像锁定，录像自动覆盖。
本产品安装简单，牢固可靠，不影响驾驶人视线。
高清影像使用micro SD卡存储，最大支持32G扩展。
使用本产品，享受真正的HD画质生活。
电脑操作系统：Windows 2000/XP/Vista/Windows 7，MAC OS*10.3.6以上四、产品特性⏹1920*1080P影像。
⏹200W CMOS感光芯片。
⏹140度广角全玻镜头。
⏹高保真语音播报。
⏹具有多种场景白平衡补偿功能。
⏹前置200W像素摄像头，后置可录制100W摄像头。
ASML X系列产品手册
6.0
0.06
0.8
MF-MSMF020/60
60.0
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1.5
0.15
0.8
MF-MSMF030
30.0
10 0.30 0.60 0.30 3.00
8.0
0.10
0.8
MF-MSMF050
15.0
100 0.50 1.00 0.15 1.00
8.0
0.15
0.8
x
xx
Linear AC/DC adapters
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x
Electromagnetic loads, motor
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Solenoid protection
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3 What is the ambient temperature of your circuit?
"Bourns” and "Multifuse" are registered trademarks of Bourns, Inc. in the U.S. and other countries. COPYRIGHT© 2021, BOURNS, INC. • LITHO IN U.S.A. • MIMEO • 2/21 • e/MF2105
Bourns® Multifuse® Device Application Table
Industry
Telecom
Computer
专题32《HDS存储产品及技术介绍》(V1.0)
硬盘数量
光纤硬盘 SATA
5-105
73GB 15K RPM 73/146/300 GB 10K RPM 250/400 GB 7200 RPM
5-225
73GB 15K RPM 73/146/300 GB 10K RPM 250/400 GB 7200 RPM
5-449
36/73GB 15K RPM 73/ 146/300GB 10K RPM 250/400 GB 7200 RPM
Fibre Channel
・FC 硬盘：15个 ・FC/AL 4Path/RKA ・Height：3U
控制模块 RK可以 放置5－15 块 FC硬盘
HDS 中端存储系统－AMS200
• • 单或双控制器
– – – – 高速缓存大小： 2GB 底座最多可外挂6个附加磁盘盒 每个磁盘盒15个磁盘 总共105个磁盘 – 73/146/300GB FC – 250/400GB SATA RAID级别： 6, 5, 0+1, 1 LUN最大数量： 512 4个FC端口 – 1或2GB/s 带主机存储域的512个虚拟端口 嵌入式NAS（2005年第4季度提供）
（1）公司的基本情况； （2）该公司的主要合作伙伴情况； （3）HDS在中国的市场情况； （4）HDS存储系统的发展历程。
•
HDS公司存储产品家族
（1）HDS中端存储系统－WMS/AMS/9500V； （2）HDS中端存储系统的数据服务产品； （3）HDS高端存储系统USP－通用存储平台； （4）HDS高端存储系统的数据服务产品；
1995
7700系统
2000
Lightning:crossbar交换式结构
2002
Lightning V: 第二代交换式结构（HSD)
HDSP-A2XC中文资料
Agilent HDSP-A2XC SeriesAlphanumeric Display, 0.54" (13.7 mm)2 Character As AlInGaP RedData SheetFeatures•As AlInGaP red color •Gray face paintGray package gives optimum contrast •Design flexibilityCommon anode or common cathodeApplications•Suitable for alphanumeric •Operating temperature range –40˚C to 105˚CDevices As AlInGaP Red Description HDSP-A22C Common Anode HDSP-A27CCommon CathodeDescriptionThese 0.54" (13.7 mm) AS AlInGaP displays are available in either common anode or common cathode.Package Dimensions6.75 [0.266] 5.95 [0.234]25.20 [0.992]8.17[0.322]1.20[0.047]13.80 [0.543]7.00 [0.276]21.00 [0.827]15.24 [0.600]NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS [INCHES]2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm3.70 [0.146]20.32[0.800]Internal CircuitPin Configuration A Pin Configuration B Pin Common Anode Common Cathode 11E/2E Cathode 1E/2E Anode 21M/2M Cathode 1M/2M Anode 3No Connection No Connection 41L/2L Cathode 1L/2L Anode 51K/2K Cathode 1K/2K Anode 61J/2J Cathode 1J/2J Anode 71D/2D Cathode 1D/2D Anode 8DP1 Cathode DP1 Anode 91C/2C Cathode 1C/2C Anode 101B/2B Cathode1B/2B Anode11DIGIT No. 2 Common Anode DIGIT No. 2 Common Cathode 121A/2A Cathode 1A/2A Anode 131N/2N Cathode 1N/2N Anode 141H/2H Cathode 1H/2H Anode 151G/2G Cathode1G/2G Anode16DIGIT No. 1 Common Anode DIGIT No. 1 Common Cathode 171P/2P Cathode 1P/2P Anode 181F/2F Cathode 1F/2F AnodeCOMMON ANODECOMMON CATHODECOM 1 DIG 1 COM 2COM 1 DIG 1COM 2 DIG 1DIG 2DP1DP2A B G H CDE F JK L M NPAbsolute Maximum Ratings at T A = 25˚CParameter Symbol HDSP-A22C/HDSP-A27C UnitsDC Forward Current per Segment or DP[1,2,3]I F50mAPeak Forward Current per Segment or DP[2,3]I PEAK100mA Average Forward Current[3]I AVE30mA Reverse Voltage per Segment or DP (I R = 100 µA)V R5V Operating Temperature T O–40 to +105˚C Storage Temperature T S–40 to +120˚CLead Soldering Conditions Temperature260˚CTime3sNotes:1.Derate linearly as shown in Figure 1.2.For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).3.Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.Optical/Electrical Characteristics at T A = 25˚CDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test ConditionsA22C Forward Voltage I V 1.70 1.90 2.20V I F = 20 mAA27C Reverse Voltage V R520V I F = 100 µA Peak WavelengthλPEAK635nm Peak Wavelengthof Spectral Distri-bution at I F = 20 mA Dominant Wavelength[3]λd622.5626630nmSpectral Halfwidth∆λ1/217nm Wavelength Widthat Spectral Distri-bution 1/2 PowerPoint at I F = 20 mA Speed of Responseτs20ns Exponential TimeConstant, e-tτs Capacitance C40pF V F = 0, f = 1 MHzIntensity Bin Limits[1](mcd at 10 mA)Bin Name Min.[2]Max.[2]T18.025.0U25.036.0Notes:1.Bin categories are established forclassification of products. Products maynot be available in all bin categories.2.Tolerance for each bin limit is ± 10%. Data subject to change.Copyright © 2001 Agilent Technologies, Inc.November 20, 20015988-4821ENFigure 1. Maximum forward current vs.ambient temperature. Derating based on T JMAX = 130˚C.Figure 2. Forward current vs. forwrad voltage.I F – M A X I M U M A V E R A G E C U R R E N T – m A00T A – AMBIENT TEMPERATURE – ˚C60301204010202040506080100I F – F O R W A R D C U R R E N T P E R S E G M E N T – m A00V F – FORWARD VOLTAGE – V12060 2.0 3.08020 1.0 2.540 1.5100Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningCleaning agents from ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family (methylene chloride,trichloroethylene, carbon tetrachloride, etc.) are notrecommended for cleaning LED parts. All of these varioussolvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.。
HDSP中文资料
Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。
PCS-222C-I_X_说明书_国内中文_国内标准版_X_R1.00_(ZL_ZNKZ0200.1108)
危险 ！
在一次系统带电运行时，绝对不允许将与装置连接的电流互感器二次开路。该回路开路可能会 产生极端危险的高压。
南京南瑞继保电气有限公司
i
PCS-222C-I 智能终端
警告 ！
曝露端子 在装置带电时不要触碰曝露的端子等 ，因为可能会产生危险的高电压 。
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1.1 应用 .................................................................................................................................... 1 1.2 功能 .................................................................................................................................... 1 1.3 特点 .................................................................................................................................... 2 1.4 订货选型 ............................................................................................................................. 2 第 2 章 技术参数 .............................................................................................................................. 5 2.1 电气参数 ............................................................................................................................. 5 2.2 机械结构 ............................................................................................................................. 6 2.3 环境条件参数...................................................................................................................... 6 2.4 通讯接口 ............................................................................................................................. 6 2.5 型式试验 ............................................................................................................................. 7 2.6 智能操作箱功能参数........................................................................................................... 8 2.7 认证 .................................................................................................................................... 8 第 3 章 工作原理 .............................................................................................................................. 9 3.1 GOOSE 命令....................................................................................................................... 9 3.2 合成信号 ........................................................................................................................... 10 第 4 章 硬件及结构安装 ..................................................................................................................11 4.1 概述 ...................................................................................................................................11 4.2 结构与安装 ....................................................................................................................... 12 4.3 主 DSP 模块（NR1136A/C/E） ....................................................................................... 17 4.4 智能开入模块 1（NR1504A） ......................................................................................... 17 4.5 智能开入模块 2～3（NR1504A）.................................................................................... 19 4.6 智能开出模块（NR1521A） ............................................................................................ 19 4.7 操作回路插件（NR1531A/B）......................................................................................... 19 4.8 模拟量采集插件（NR1410A/B） ..................................................................................... 21 4.9 显示面板 ........................................................................................................................... 22
ISC技术规格参数
ISC技术参数55寸智能平板规格参数显示屏参数屏类型TFT LCD屏标准A规显示区域1209.6(H) x 680.4 (V)分辨率1209.6(H) x 680.4 (V)亮度500 cd/㎡对比度5000：1响应时间< 5.5ms色彩总数1073.7M（10-bit 4通道低压差分信号）刷新频率100Hz/120Hz(FRC技术)可视角度> 178°寿命> 50000小时触摸书写系统识别原理红外光学识别响应时间< 8ms触摸有效时间> 5 mm扫描频率100Hz扫描精度4096×4096通信方式全速USB书写方式任意不透明直径大于5mm的物体书写屏表面物理钢化莫氏7级防爆，防反光、防眩、防散射（可选）触摸框前维护触摸框模块化前置，方便维护电视系统彩色制式PAL/SECAM频道数199输入阻抗75 Ohm射频连接类型IEC模拟SCALER MTK8222高频头TDQ-6F6梳状滤波器3D COMB filter高频接口 1AV输入（黄、白、 1红）AV输出（黄、白、1红）1色差 (4pinDIN)YPBPR（绿蓝红） 21VGA输入(15针D-Sub)PC-AUDIO输入 1高清多媒体接2口（HDMI）同轴输出（橙） 1耳机输出 1声音输出功率2*10W扬声器数 4体感游戏（特定内置家庭、办公娱乐体感游戏型号）不需要打开电脑，即可播放音频、视频和图片USB多媒体播放功能PC系统主芯片AMD Athlon II X2 240 双核心处理器，主频2.8G 主板YESTON A785显卡ATI HD4200声卡集成声卡网卡集成10/100/1000M自适应网卡内存2G DDRIII硬盘320G SATA操作系统Windows XP/Windows 7USB（A口） 4USB（B口） 1网际接口RJ45 1VGA输出 1耳机 1电源参数输入电源220V AC 50/60Hz整机功耗﹤300W待机功耗﹤3W工作环境工作温度0℃-40℃工作湿度10% - 95%贮存温度-10℃-60℃贮存湿度10% - 95%外观尺寸底架（选配）壁挂架、移动支架屏幕钢化NG玻璃整机尺寸1350x820x135mm整机包装尺寸1600x990x320mm重量59kg±3kg外观无锐角安全设计，边角部位采用平滑圆弧过渡，细缝接合均匀65寸智能平板规格参数显示屏参数屏类型TFT LCD屏标准A规显示区域1428.48 (H) x 803.52 (V)分辨率1920 x1080亮度500 cd/㎡对比度5000：1响应时间< 5.5ms色彩总数1073.7M（10-bit 4通道低压差分信号）刷新频率100Hz/120Hz(FRC技术)可视角度> 178°寿命> 50000小时触摸书写系统识别原理红外光学识别响应时间< 8ms触摸有效时间> 5 mm扫描频率100Hz扫描精度4096×4096通信方式全速USB书写方式任意不透明直径大于5mm的物体书写屏表面物理钢化莫氏7级防爆，防反光、防眩、防散射（可选）触摸框前维护触摸框模块化前置，方便维护电视系统彩色制式PAL/SECAM频道数199输入阻抗75 Ohm射频连接类型IEC模拟SCALER MTK8222高频头TDQ-6F6梳状滤波器3D COMB filter高频接口 1AV输入（黄、白、1红）1AV输出（黄、白、红）1色差 (4pinDIN)YPBPR（绿蓝红） 2VGA输入(15针1D-Sub)PC-AUDIO输入 12高清多媒体接口（HDMI）同轴输出（橙） 1耳机输出 1声音输出功率2*10W扬声器数 4体感游戏（特定内置家庭、办公娱乐体感游戏型号）不需要打开电脑，即可播放音频、视频和图片USB多媒体播放功能PC系统主芯片AMD Athlon II X2 240 双核心处理器，主频2.8G 主板YESTON A785显卡ATI HD4200声卡集成声卡网卡集成10/100/1000M自适应网卡内存2G DDRIII硬盘320G SATA操作系统Windows XP/Windows 7USB（A口） 4USB（B口） 1网际接口RJ45 1VGA输出 1耳机 1电源参数输入电源220V AC 50/60Hz整机功耗﹤400W待机功耗﹤3W工作环境工作温度0℃-40℃工作湿度10% - 95%贮存温度-10℃-60℃贮存湿度10% - 95%外观尺寸底架（选配）壁挂架、移动支架屏幕钢化NG玻璃整机尺寸1600×960×150mm整机包装尺寸1820×1120×320mm重量74kg±3kg外观无锐角安全设计，边角部位采用平滑圆弧过渡，细缝接合均匀VGA矩阵VGA特性增益0dB带宽350MHz（-3dB）满载微分相位0.05º@4.43 MHz微分增益0.05% @4.43 MHz最大传播延时5nS(±1nS)切换速度≤150nSVGA输入信号类型VGA信号接口VGA D型15针最小电平0.5Vp-p最大电平 1.0Vp-p阻抗75Ω回波损耗-30dB@5MHzVGA输出信号类型VGA信号接口VGA D型15针输出电平0.75Vp-p阻抗75Ω回波损耗-30dB@5MHz直流补偿最大5mV同步信号特性输入/输出信号TTL类型输入电平0V-5Vp-p输出电平TTL: 5Vp-p输出阻抗75Ω极性正或负（与输入一致）音频特性增率0dB频率响应20 Hz ~ 20 kHz0.05% @ 1 kHz （额定电压下）总谐波失真+噪声（CMRR） >75dB @: 20 Hz ~ 20 kHz共态抑制比（CMRR）音频输入信号类型立体声，平衡接口5PIN接口阻抗>10KΩ最大电平+21dBu音频输出信号类型立体声，平衡接口5PIN接口阻抗>470Ω最大电平+21dBu控制类型串行控制接口RS-232，9-针母D型接口波特率9600数据位8位停止位无奇偶校验位2=TX，3=RX，5=GND串行控制口结构规格电源100VAC ~ 240VAC, 50/60 Hz, 国际自适应电源功率≤30W存储环境温度-20°C ~ +150°C工作环境温度-10°C ~ +55°C相对湿度20% ~ 95%50，000小时平均无故障时间会议专用音箱灵敏度87dB（1W/1M）频率响应50Hz-17KHz单元构成Low 5.5”*1 ,Hi 1”*1同轴输入功率50W-100W储存温度-20℃-60℃阻抗8Ω尺寸（H×W×D）220×155×133mm重量 2.5Kg双通道无线麦克风频率响应50-22,000 Hz，可选择成50-12,000 Hz 模式通道双通道/系统无线频率 1.92 to 1.93 GHz (UPCS 北美) ，1.88 to 1.90 GHz (DECT 欧洲)覆盖范围100’ (30米) 大约值. (无遮挡)Executive HD 基100-240V AC, 50-60 Hz, 15W (通用输入)站电源需求HD 充电基座电20W源需求电池锂电池，8小时连续发言时间充电时间2小时加密128-bit 专利技术(每一个麦克风通道)环境需求工作温度40° to 100° F (5° to 40° C)，湿度20% to 85%RAV600和900尺寸RAV43.2厘米 X 19.1厘米 X 5.1厘米RF控制器10.5”X 4.5”X 2.75”麦克半径17.8厘米，高度3.8厘米重量RAV 2.04公斤RF控制器0.91公斤麦克0.5公斤运行环境温度华氏32º to 122º湿度15% to 80%电源电压100 — 240VAC 50–60 Hz 自适应麦克范围360º链接5类线RJ-45，Link In/Out端口最大距离15米（RAV 900），23米（RAV 600）频响范围60Hz — 14 KHz (+/-1dB)总谐波失真>0.08% （-45dBu 输入@ 1 KHz）灵敏度-45dBu输入电平-6dBu（1 KHz 94dBSPL）动态范围65dB线路输入链接非平衡式RCA插头增益-10dBu(正常)，调节范围：-14dBu to +18dBu 正常电平-10 dBu最大电平+9 dBu阻抗>10Kohm线路输出链接非平衡式RCA插头正常电平-10dBu，调节范围：-14dBu to +18dBu最大电平+9 dBu频响范围40Hz — 15 KHz(+/-1dB)动态范围80dB总谐波失真<0.02% （+6dBu 输入@ 1 KHz）阻抗>10Kohm重放/录音输入链接非平衡式RCA插头增益-10dBu，调节范围：-14dBu to +18dBu正常电平-10 dBu最大电平+9 dBu阻抗>10Kohm重放/录音输出链接非平衡式RCA插头正常电平-10dBu，调节范围：-14dBu to +18dBu 最大电平+9 dBu频响范围40Hz — 15 KHz(+/-1dB)动态范围>80dB总谐波失真<0.02% （+6dBu 输入@ 1 KHz）阻抗>10Kohm音箱链接左、右按压式端子功率8Ohm负载10W阻抗8 Ohm频响范围60 Hz — 15 kHz(+/-1dB)动态范围>80dB总谐波失真<0.5% （+5dBu 线路输入@ 1 KHz）输出电平90dBSPL 输出 @ 1米混音器回声消除尾音时间128 ms自适应噪音消除6—18dB门控自适应环境电平、第一麦克优先、NOM衰减电话接口条件所有测量都是在ALC禁止的情况下完成的连接RJ-11接口尾音时间30 ms频响范围 250 Hz — 3.3 kHz(+/-1dB) 总谐波失真<0.2%（+7dBu 线路输入@ 1 KHz）动态范围>60dB通讯输入/输出端口10/100M以太网控制端口带LED指示器的RJ-45接口RS-232控制接口DB9，波特率57600（缺省），8位数据位，1位停止位，无奇偶校验，硬件流控on（缺省）/offVISCA摄像头端口DIN，波特率9600，无流控USB 1.1配置端口附加端口AMX NXD-700ViNXD-700Vi 特性显示类型7" 彩色有源液晶显示分辨率16 x 9 (800 x 480 )亮度350 +cd/m对比度200 :1可视范围 6.00" x 3.60"可视角100° (任意角度)显示颜色256K (18 位色深)内存模块扩展内存模块64MB闪存128MB 闪存，已预载演示页面 (可升级至 1GB) 电源电源类型1.4 A @ 12.0 伏直流电压（有线连接）2.8 A @ 12.0 伏直流电压（带电池底座及充电时）机械特性尺寸15.04 cm x 20.21 cm x 8.45 cm重量0.839 公斤IPAD屏基本参数操作系统IOS处理器A4，1GHz存贮容量16GB显示屏屏幕尺寸9.7英寸屏幕分辨率1024×768屏幕描述多点触摸IPS屏，防指纹涂层，LED指取设备触摸屏网络连接WiFi功能支持802.11a/b/g/n无线协议蓝牙功能支持音频视频声音系统内置音效芯片外置接口音频接口 3.5mm耳机接口，3.5mm麦克风接口其他接口苹果Dock接口电源参数电池类型锂电池续航类型使用时间：10小时左右待机时间：超过1个月外观参数产品尺寸242.8×189.7×13.4mm产品重量692g机壳材质镁合金材质机壳颜色银色平板电脑附件包装清单平板电脑主机x1 连接线x1说明书x1 充电器x1可选配件iPad Keyboard Dock（键盘底座）iPad Case（原装皮套）iPad Camera Connection Kit（相机连接套件）iPad Dock（充电底座）iPad 10W USB Power Adapter（充电器）iPad Dock Connector to VGA Adapter（转换线）Apple Wireless Keyboard（蓝牙键盘）Apple In-Ear Headphones with Remote and Mic（耳机）Apple Earphones with Remote and Mic（线控耳机）Apple Composite A V Cable（视频连接线）双飞燕无线键鼠套装键盘参数键盘类型无线键盘性能净重:650g（加电池后672g）标准104键盘按键寿命:2000万次鼠标参数鼠标类型无线光电鼠标性能分辨率为3200dpi，五档切换精确自定义48K记忆体，存储绝招编程30G加速度单重:83g（加电池后130g）7个功能快捷键。
TASCAM CC-222SL产品说明书
1CC-222SL above all the rest. Further solidifying this source-device’s reputation for flexibility is its ability to be operated as two individual recorders; or, record one source to both recorders consecutively.Digital I/O (coaxial and optical), RCA (unbalanced) analog I/O, Auto Track Increment, MP3 playback, Power on Play, Fade In and Out, Manual Track Increment, and a variety of playback modes are just a few of the features included on the CC-222SL that you’ve come to expect for TASCAM. TASCAM’s most popular combination CD/Cassette recorder, the CC222SL, now supports a more robust slot loading CD transport and comes equipped with “selectable” independent outputs for CD and Cassette. The CC-222SL includes a RIAA phono input which allows direct recording from a turntable; a feature which sets the CD-RW Recorder Slot loading transport Acceptable discs: CD-R, CD-RW, CD-R-DA, CD-RW-DAHigh Speed Recording Media is applicable MP3 playback 24 bit AD/DA converter Digital input volume control Sampling rate converter (32kHz/ 44.1kHz / 48kHz) Unbalanced analog I/O (RCA)COAXIAL and Optical digital I/O (CD) Fade in and out Auto Track Increment (via SPDIF or Audio Level)Erase or Un-finalize of CD-RW discs Multiple playback modes Cassette ± 10% Pitch Control Return to Zero Function Dolby B Noise ReductionAuto Reverse General RIAA Phono Input for recording onto CD-R/RW discs or cassette tape Independent Output for CD and Cassette (selectable) Continuous Play between Cassette & CDCassette to CD-R/RW dubbing and vice versa Headphone Output w/Level Control RC-222 Wireless Remote IncludedDedicated analog input level controls Power-on play TASCAM 7733 Telegraph Road Montebello, CA 90640 (323) 726-0303 All features, pricing, and specifications are subject to change without notice. Contact your local TASCAM representative for the latest information.TASCAM CC-222SL2TASCAM 7733 Telegraph Road Montebello, CA 90640 (323) 726-0303 All features, pricing, and specifications are subject to change without notice. Contact your local TASCAM representative for the latest information.TASCAM CC-222SL3CD recorder sectionRecordable discs CD-R, CD-R-DA, CD-RW, CD-RW-DA (High speed CD-RW is supported)Quantization bit depth 16 bit linearSampling frequency 44.1 kHzFrequency response20 Hz~20 KHz±0.8 dB (playback)±1.0 dB (recording)S/N ratio 92 dB (playback) 88 dB (recording)Dynamic range 92 dB (playback)88 dB (recording)Total harmonic distortion 0.006% (playback)0.01% (recording)Channel separation 80 dB (playback:1kHz)75 dB (recording:1kHz)Wow and flutter Unmeasurable (< 0.001 %)Digital input Fs 32 kHz to 48 kHz (SRC ON)44.1 kHz (SRC OFF)Digital input Coaxial RCA pin jack (IEC60958 Consumer use)Optical TOSLINK (IEC60958 Consumer use)Digital output Coaxial RCA pin jack (IEC60958 Consumer use)Optical TOSLINK (IEC60958 Consumer use)Line inputs 1 Unbalanced input RCA pin Level -10 dBV (Full Scale -16 dB)Maximum input level +6 dBVInput impedance 50 k Ø ±10 % (unbalanced)Line outputs 1 Unbalanced output RCA pinLevel -10 dBV (Full Scale -16 dB)Maximum output level +6 dBV ±2 dBOutput impedance 600 Ø ±10% (unbalanced)Cassette recorder sectionNumber of channels 4-track, 2-channel stereoHeads Record/playbackx 1 (rotary reverse), erase x 1 Type of tapes Compact Cassette C-60, C-90 Type I (normal)), Type II (high-position)-recording and playback; Type IV(metal)-playback onlyTape speed 4.76 cm/s (1 7/8 ips)Motor DC servo motor x 1Wow and flutter <0.19% (W.RMS)Frequency response (overall) 50 Hz — 12.5 kHz ±3 dB (high position)50 Hz — 10 kHz ±3 dB (normal)Signal-to-noise ratio (overall) 46 dB (Dolby NR off)52 dB (Dolby NR on)Fast winding time About 120 seconds (C-60) Line inputs 2 Unbalanced RCA Normal input level 0.28 V (-11 dBV) Input impedance 50 k Ø Line outputs 2 Unbalanced RCA Normal output level 0.46 V (-6.7 dBV) Output impedance 1k Ø General specificationsPower U.S.A./Canada 120 VAC, 60 HzU.K./Erope 230 VAC, 50 HzAustralia 240 VAC, 50 HzPower consumption 33 WDimensions (d x w x h) 295 x 435 x 138 (mm)11.6 x 17.13 x 5.4 (in)Weight 7.4 kg (16.3 lb)Phono input and headphonesRIAA PHONO INPUT Unbalanced RCA (with grnd) Cartridge type MM (moving magnet) Input signal level 5.6 mV Input impedance 50 k Ø S/N ratio 60 dB (6.3 Ø) PHONES (headphone output) 6 mm (1/4”) stereo Output level 10 mW + 10 mW (into 32 Ø) TASCAM 7733 Telegraph Road Montebello, CA 90640 (323) 726-0303 All features, pricing, and specifications are subject to change without notice. Contact your local TASCAM representative for the latest information. TASCAM CC-222SL。
HDS系列存储产品技术资料
HDS系列存储产品技术资料HDS存储目录第1章 HDS系列产品手册资料 (4)1.1 HDS VSP G1000（高端存储－1及高端存储扩容－1/2）产品介绍 (4)14.1.1概述 (4)14.1.2 VSP G1000产品亮点 (4)14.1.3 VSP G1000产品技术优势 (5)14.1.4 VSP G1000软件包 (14)14.1.5 VSP G1000产品技术指标 (25)1.2 HDS HUS-VM（高端存储－2/3及高端存储扩容－3/4）产品介绍 (30)14.2.1概述 (30)14.2.2 HUS VM技术的技术优势 (33)14.2.3HUS VM软件包 (40)14.2.4 HUS VM产品技术指标 (43)1.3 HDS VSP G200（中端存储1/2/3）产品介绍 (46)14.3.1概述 (46)14.3.2VSP Gx00系列产品亮点 (47)14.3.3 VSP Gx00技术优势 (48)14.3.4 VSP Gx00软件包 (49)14.3.5 VSP Gx00产品技术指标 (49)1.4 存储虚拟化兼容列表（VSP G1000/G200/HUS-VM通用） (54)1.5 HDS HCP（归档存储网关）产品介绍 (58)14.5.1什么是归档及其影响 (58)14.5.2归档平台与SAN和NAS的区别 (60)14.5.3HCP 概述 (61)14.5.4HCP优势 (62)14.5.5HCP功能介绍 (63)1.6 HDS Brocade 6510（光纤交换机－1/2及光纤交换机扩容）产品介绍 (69)14.6.1 亮点 (69)14.6.2 概述 (70)14.6.3 超高的性价比，支持不断增长的 SAN 工作负载 (70)14.6.4行业领先的技术，灵活、简单而且简便易用 (71)14.6.5拟化私有云存储的有机组成部分 (71)14.6.6 Brocade Access Gateway（接入网关）模式错误！未定义书签。
HDSP0960资料
Hexadecimal and Numeric Displays for Industrial ApplicationsTechnical DataFeatures• Three ColorsHigh-Efficiency RedYellowHigh Performance Green• Two High-Efficiency Red OptionsLow PowerHigh Brightness• Three Character OptionsNumericHexadecimalOver Range• Performance Guaranteed over Temperature • Memory Latch/Decoder/ DriverTTL Compatible• 4 x 7 Dot Matrix Character • Categorized for Luminous Intensity• Yellow and Green Categorized for Color Typical Applications• Industrial Equipment• Computer Peripherals• Instrumentation• Telecommunication EquipmentDevice Selection GuidePart Number Front HDSP-Color Description View 0760High-Efficiency Numeric, Right Hand DP A0761Red Numeric, Left Hand DP B0762Low Power Hexadecimal C0763Over Range ±1D0770High-EfficiencyNumeric, Right Hand DP A 0771Red Numeric, Left Hand DP B 0772High Brightness Hexadecimal C 0763Over Range ±1D 0860Yellow Numeric, Right Hand DP A 0861Numeric, Left Hand DP B 0862Hexadecimal C 0863Over Range ±1D 0960Green Numeric, Right Hand DP A 0961Numeric, Left Hand DP B 0962Hexadecimal C 0963Over Range ±1D DescriptionThese solid state display devices are designed and tested for use in adverse industrial environments. The character height is 7.4mm (0.29 inch). The numeric and hexadecimal devices incorporate an on-board IC that contains the data memory, decoder and display driver functions.The numeric devices decode positive BCD logic into characters “0-9”, a “–” sign, decimal point, and a test pattern. The hexadeci-mal devices decode positive BCD logic into 16 characters, “0-9, A-F.”An input is provided on the hexa-decimal devices to blank the display (all LEDs off) without losing the contents of the memory. The over range device displays “±1” and right hand decimal point and is typically driven via external switching transistors.HDSP-076X SeriesHDSP-077X SeriesHDSP-086X SeriesHDSP-096X SeriesPackage DimensionsZAbsolute Maximum RatingsDescription Symbol Min.Max.Unit Storage Temperature, Ambient T S-65+100°C Operating Temperature, Ambient[1]T A-55+85°C Supply Voltage[2]V CC-0.5+7.0V Voltage Applied to Input Logic, dp and Enable Pins V I, V DP, V E-0.5V CC V Voltage Applied to Blanking Input[2]V B-0.5V CC V Maximum Solder Temperature at 1.59 mm (0.062 inch)260°C Below Seating Plane, t ≤ 5 secondsRecommended Operating ConditionsDescription Symbol Min.Nom.Max.Unit Supply Voltage[2]V CC 4.5 5.0 5.5V Operating Temperature, Ambient[1]T A-55+85°C Enable Pulse Width t W100nsec Time Data Must Be Held Before Positive t SETUP50nsec Transition of Enable LineTime Data Must Be Held After Positive t HOLD50nsec Transition of Enable LineEnable Pulse Rise Time t TLH 1.0msec Optical Characteristics at T A = 25°C, V CC = 5.0 VNotes:1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board is RθJA = 50°C/W/device. The device package thermal resistance is RθJ-PIN = 15°C/W/device. The thermal resistance device pin-to-ambient through the PC board should not exceed 35°C/W/device for operation at T A = +85°C.2. Voltage values are with respect to device ground, pin 6.3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back ofthe display package. Case temperature of the device immediately prior to the light measurement is equal to 25°C.Electrical Characteristics; T A = -55°C to +85°CNotes:4. The luminous intensity at a specific operating ambient temperature, I V (T A ) may be approximated from the following exponential equation: I (T = I (25°C) e [k (T - 25°C)].d device.6. The HDSP-0860 and HDSP-0960 series devices are categorized as to dominant wavelength with the category designated by a number on the back of the display package.7. All typical values at V CC = 5.0 V and T A = 25°C.AOperational ConsiderationsElectricalThese devices use a modified4x7 dot matrix light emitting diode to display decimal/hexa-decimal numeric information. The high efficiency red and yellow LEDs are GaAsP epitaxial layer on a GaP transparent substrate. The green LEDs are GaP epitaxial layer on a GaP transparent substrate. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enable line is at logic low and the data is latched when the enable is at logic high. Using the enable pulse width and data setup and hold times listed in the Recommended Operating Conditions allows data to be clocked into an array of displays at a 6.7 MHz rate.The decimal point input is activelow true and this data is latchedinto the display memory in thesame fashion as the BCD data.The decimal point LED is drivenby the on-board IC.The blanking control input on thehexadecimal displays blanks (turnsoff) the displayed informationwithout disturbing the contents ofdisplay memory. The display isblanked at a minimum thresholdlevel of 2.0 volts. When blanked,the display standby power isnominally 250 mW at T A = 25°C.MechanicalThe primary thermal path forpower dissipation is through thedevice leads. Therefore, to insurereliable operation up to anambient temperature of +85°C, itis important to maintain a case-to-ambient thermal resistance ofless than 35°C watt/device asmeasured on top of display pin 3.For information on soldering andpost solder cleaning see Applica-tion Note 1027, Soldering LEDComponents.Contrast EnhancementThese display devices aredesigned to provide an optimumON/OFF contrast when placedbehind an appropriate contrastenhancement filter. For furtherinformation, please refer toApplication Note 1015, ContrastEnhancement Techniques forLED Displays.Over Range DisplayThe over range devices display“±1” and decimal point. Thecharacter height and packageconfiguration are the same as thenumeric and hexadecimaldevices. Character selection isobtained via external switchingtransistors and current limitingresistors.Package DimensionsNotes:0: Line switching transistor in Figure 7 cutoff.1: Line switching transistor in Figure 7 saturated.X: 'don't care'Absolute Maximum RatingsDescriptionSymbol Min.Max.Unit Storage Temperature, Ambient T S-65+100°C Operating Temperature, Ambient T A -55+85°C Forward Current, Each LED I F 10mA Reverse Voltage, Each LEDV R5VLuminous Intensity per LED[3,4]Figure 3. Typical Driving Circuit.Electrical Characteristics: T = -55°C to +85°CData subject to change.Copyright © 1999 Agilent Technologies, Inc. Obsoletes 5953-9395 (1/84)5963-7395E (11/99)。
PD15-22C中文资料
元器件交易网Technical Data Sheet Silicon PIN PhotodiodePD15-22CFeatures․Fast response time ․High photo sensitivity ․Small junction capacitance ․Pb free ․The product itself will remain within RoHS compliant version.Descriptions․PD15-22C is a high speed and high sensitive PIN photodiode in miniature flat top view lens SMD package and it is molded in a water clear plastic. The device is Spectrally matched to visible and infrared emitting diode.Applications․High speed photo detector ․Copier ․Game machineDevice Selection Guide LED Part No.PDChip MaterialSiliconLens ColorWater clearEverlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-2005Rev 3Page: 1 of 9Prepared by：David Huang元器件交易网PD15-22CPackage Dimensions2.12.3 0.45 0.90.92.03.3 2.3 1.65 1.15 2.8 1.4 4-R0.25Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.1mmAbsolute Maximum Ratings (Ta=25℃)Parameter Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature Power Dissipation at(or below) 25℃Free Air Temperature Symbol VR Topr Tstg Tsol Pc Rating 32 -25 ~ +85 -40 ~ +85 260 150 Units mA ℃ ℃ ℃ mWNotes: *1:Soldering time≦5 seconds.Everlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-20051.1Rev 3Page: 2 of 9Prepared by：David Huang元器件交易网PD15-22CElectro-Optical Characteristics (Ta=25℃)Parameter Rang Of Spectral Bandwidth Wavelength Of Peak Sensitivity Open-Circuit Voltage Symbol λ0.5 λP VOC ISC Condition ----Ee=5mW /cm2 λP=940nm Ee=1mW /cm2 λP=875nm Ee=1mW /cm2 λP=875nm VR=5V Ee=0mW /cm2 VR=10V Ee=0mW /cm2 IR=100μA Ee=0mW /cm2 f=1MHz VR=5V VR=5V RL=1000Ω Min 400 ----Typ --940 0.41 Max 1100 ----Unit nm nm V μAShort-Circuit Current---6.5---Reverse Light CurrentIL ID BVR4.26.5---μADark Reverse Current Reverse Breakdown Voltage--32--17010 ---nA VTotal Capacitance Rise Time Fall TimeCt tr tf-------6 10 10-----pFnS ---Everlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-2005Rev 3Page: 3 of 9Prepared by：David Huang元器件交易网PD15-22CTypical Electro-Optical Characteristics CurvesFig.1 Power Dissipation vs. Ambient Temperature Fig.2 Spectral Sensitivity2001.0 Ta=25 C 0.8 0.61501000.4500.20 -25 0 25 50 75 85 1000 100 300 500 700 900 1100 1300Fig.3 Dark Current vs. Ambient Temperature 1000Fig.4 Reverse Light Current vs. Ee201001510 VR=10V 1 20 40 60 80 10010 5 VR=5V 0 0.5 1.0 1.523.0Everlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-2005Rev 3Page: 4 of 9Prepared by：David Huang元器件交易网PD15-22CTypical Electro-Optical Characteristics CurvesFig.5 Terminal Capacitance vs. Reverse Voltage Fig.6 Response Time vs. Load Resistance10 8f=1MHZ VR=5V1021VR=10VTa=25°C100t610-1410 10-2-32 0.1 1 10 100101102103104105Everlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-2005Rev 3Page: 5 of 9Prepared by：David Huang元器件交易网PD15-22CPrecautions For Use1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.Everlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-2005Rev 3Page: 6 of 9Prepared by：David Huang元器件交易网PD15-22C4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 280℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.Everlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-2005Rev 3Page: 7 of 9Prepared by：David Huang元器件交易网PD15-22CReliability Test Item And Condition The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% NO. Item Test Conditions Test Hours/ Sample Cycles Sizes 22pcs IL≦L×0.8 22pcs L：Lower 22pcs Specification Limit 0/1 0/1 Failure Judgement Criteria Ac/Re1 REFLOW Soldering TEMP.：260℃±5℃ 6Mins 5secs 15mins 50Cycles 2 Temperature Cycle H : +100℃ 5mins L : -40℃ 15mins 3 Thermal Shock H :+100℃ L :-10℃ 4 High Temperature Storage 5 Low Temperature Storage 5mins 50Cycles 10secs 5mins 1000hrs 1000hrs 1000hrs 1000hrs0/1TEMP.：+100℃ TEMP.：-40℃22pcs 22pcs 22pcs 22pcs0/1 0/1 0/1 0/16 DC Operating Life VR=5V 7 High Temperature/ 85℃ / 85% R.H High HumidityEverlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-2005Rev 3Page: 8 of 9Prepared by：David Huang元器件交易网PD15-22CPacking Quantity Specification1.1000PCS/1Bag，20Bags/1Box 2.10Boxes/1CartonLabel Form SpecificationCPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production PlaceRoHSPD15-22CNotes1. Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http:\\Everlight Electronics Co., Ltd. Device No：DPD-152-013http:\\ Prepared date：07-20-2005Rev 3Page: 9 of 9Prepared by：David Huang。
AVS-P2012T 2MP STARVIS PTZ HD-AVS摄像头产品说明书
AVS-P2012T2MP 12x Starlight PTZ HD-AVS Camera●1/2.8” 2 Megapixel STARVIS™ CMOS ●Powerful 12x optical zoom ●Starlight technology●Max. 25/30fps@1080P, 25/30/50/60fps@720P ●120dB true WDR, 3D DNR ●IP66, IK10SimplicityHD-AVS technology inherits the born feature of simplicity from traditional analog surveillance system, making itself a best choice for investment protection. HD-AVS system can seamlessly upgrade the traditional analog system without replacing existing coaxial cabling. The plug and play approach enables full HD video surveillance without the hassle of configuring a network.Starlight TechnologyFor challenging low-light applications, Starlight Ultra-low Light Technology offers best-in-class light sensitivity, capturing color details in low light. The camera uses a set of optical features to balance light throughout the scene, resulting in clear images in dark environments.A new release to the AVS line-up, the AVS-P2012T. This camera is a flush mount, indoor / outdoor PTZ equipped with the latest in STARVIS imaging sensors allowing strong color reproduction with the least light requirements.The camera itself is a true WDR camera with 120dB of WDR. The optics on the camera are a powered 12X zoom module allowing a focal length of 5.3mm ~ 64mm.Ideal applications for this PTZ include retrofit applications with Coaxial cable, Residences, Gas Stations, Businesses and more.System OverviewFunctionsWide Dynamic RangeThe camera achieves vivid images, even in the mostintense contrast lighting conditions, using industry-leading wide dynamic range (WDR) technology. For applications with both bright and low lighting conditions that change quickly, true WDR (120 dB) optimizes both the bright and dark areas of a scene at the same time to provide usable video.EnvironmentalWith a temperature range of -30 °C to +60 °C (-22 °F to +140°F), the camera is designed for extreme temperature environments. Subjected and certified to rigorous dust and water immersion tests, the IP66 rating makes it suitable for demanding applications.ProtectionThis camera suits even the harsh conditions forapplications. Its 2KV lightning rating provides protection against the camera and its structure from the effects of lightning.The camera complies with an IK10 vandal resistance rating making it capable of withstanding the equivalent of 5 kg (11.02 lbs) of force dropped from a height of 40 cm (15.75 in).Technical SpecificationImage Sensor 1/2.8” STARVIS™ CMOS Effective Pixels 1920(H) x 1080(V), 2 Megapixels Scanning System ProgressiveElectronic Shutter SpeedPAL: 1/3s~1/30,000s NTSC: 1/4s~1/30,000sMinimum Illumination Color:*************;B/W:**************S/N Ratio More than 50dB IR Distance N/A IR On/Off Control N/A IR LEDsN/ALens Type 5.3mm~64mm Max. Aperture F1.6 ~ F3.0Angle of View H: 58.2° ~ 4.8°Optical Zoom 12xFocus Control Auto / Manual Close Focus Distance100mm~ 1000mm DORI Distance DetectObserve Recognize Identify 883m 353m 177m 88m 2897ft1158ft581ft289ftLensCameraPan/Tilt Range Pan: 0° ~ 360° endlessTilt: -2° ~ 90°, auto flip 180°Manual Control Speed Pan: 0.1° ~300° /s; Tilt: 0.1° ~120° /s Preset Speed Pan: 300° /s; Tilt: 200° /s Presets 300PTZ Mode 5 Pattern, 8 Tour, Auto Pan, Auto ScanSpeed Setup Human-oriented focal Length/ speed adaptationPower up Action Auto restore to previous PTZ and lens status after power failureIdle Motion Activate Preset/ Scan/Tour/ Pattern if there is no command in the specified periodProtocolICR-SD, Pelco-P/D (Auto recognition)Pan/Tilt/RotationResolution 1080P(1920×1080)/720P(1280×720)Frame Rate 25/30fps@1080P, 25/30/50/60fps@720P Video Output 1-channel BNC high definition video output/ CVBS standard definition video output (switchable)Day/Night Auto(ICR) / Color / B/W OSD Menu SupportBLC Mode BLC / HLC / WDR(120dB)White Balance Auto, ATW, Indoor, Outdoor, Manual Gain Control Auto / Manual Noise Reduction Ultra DNR (2D/3D)Digital Zoom 16x Flip180°Privacy MaskingUp to 24 areasVideoCertificationsCE: EN55032/EN55024/EN50130-4FCC: Part15 subpartB,ANSI C63.4- 2014UL: UL60950-1+CAN/CSA C22.2,No.60950-1CertificationsVideo Interface 1-channel BNC Audio Interface 1 channel in RS4851Alarm I/O2/1InterfacePower Supply AC24V/1.5A(±10%)Power Consumption10WElectricalOperating Conditions -30°C ~ 60°C (-22°F ~ +140°F) / Less than 95% RH Ingress Protection IP66Vandal ResistanceIK10EnvironmentalCasing MetalDimensions Φ170(mm)×155(mm)Net Weight 1.8kg(3.97lb)Gross Weight3.3kg(7.28lb)ConstructionMounting Dimensions (mm/in)。
RME HDSP and HDSPe Series Windows Driver 4.x and T
用户手册更新智能音频解决方案HDSP和HDSPe系列Windows驱动4.x及TotalMix FX新特性，新功能Multiface Digiface RPMHDSP 9632 HDSP 9652 HDSP AES-32 HDSP MADI HDSPe AIO HDSPe RayDAT HDSPe AES HDSPe MADIHDSPe MADIface通用1. 概述 (5)2. 系统要求 (5)驱动安装和操作3. 驱动安装和升级 (7)4. 4.0版本的主要变化 (7)5. HDSP或HDSPe音频接口配置 (8)5.1 设置对话框 (8)5.1.1 主选项卡 (9)5.1.2 全局选项卡 (10)5.1.3 设置对话框 –Pitch (11)5.2 时钟模式– 同步 (12)6. WDM配置 (13)6.1 背景 (13)6.2 WDM设备选项 (14)TotalMix FX7. TotalMix：路由和监听 (17)7.1 概述 (17)7.2 用户界面 (19)7.3 通道 (20)7.4 控制室栏 (23)7.5 控制条 (24)7.5.1 视图选项 (25)7.5.2 快照‐组 (26)7.5.3 通道布局‐布局预设 (26)7.5.4 滚动位置标记 (28)7.6 首选项 (29)7.6.1 为当前所有用户保存 (30)7.7 设置 (30)7.7.1 混音器页面 (30)7.7.2 MIDI页面 (31)7.7.3 OSC页面 (32)7.7.4 辅助设备 (33)7.8 热键与使用 (34)7.9 菜单选项 (35)8. 矩阵 (36)8.1 概述 (36)8.2 矩阵视图元素 (36)8.3 操作 (36)9. 操作技巧 (37)9.1 ASIO直接监听 (37)9.2 复制子混音 (37)9.3 删除子混音 (37)9.4 双重输出信号 (37)9.5 录制子混音 –回路 (37)9.6 MS处理 (39)10. MIDI远程控制 (40)10.1 概述 (40)10.2 规划 (40)10.3 设置 (41)10.4 操作 (41)10.5 MIDI控制 (41)10.6 回路检测 (43)10.7 OSC (43)附录关于RME的新闻、驱动升级以及更多的产品信息请点击RME官方网站经销商：Audio AG，Am Pfanderling 60, D-85778 Haimhausen, 电话: (49) 08133 / 91810制造商：IMM Elektronik GmbH, Leipziger Strasse 32, D-09648 Mittweida商标所有商标（无论注册与否）均归其各自所有者所有。
HDSP-2111-HI000资料
HDSP-210x Series, HDSP-211x Series, HDSP-250x SeriesFeatures• X stackable (HDSP-21xx)• XY stackable (HDSP-250x)• 128 sharacter ASCII decoder • Programmable functions • 16 user definable characters• Multi-level dimming and blanking • TTL compatible CMOS IC • Wave solderableApplications• Computer peripherals • Industrial instrumentation • Medical equipment• Portable data entry devices • Cellular phones• Telecommunications equipment • Test equipmentDescriptionThe HDSP-210x/-211x/-250x series of products is ideal for applications where displaying eight or more characters of dot matrix information in an aes-thetically pleasing manner is required. These devices are 8-digit, 5 x 7 dot matrix, alphanumeric displays and are all packaged in a standard 15.24 mm (0.6 inch) 28 pin DIP . The on-board CMOS IC has the ability to decode 128 ASCII characters which are permanently stored in ROM. In addition, 16 programmable symbols may be stored in on- board ROM, allowing considerable flexibility for dis-playing additional symbols and icons. Seven brightness levels provide versatility in adjusting the display intensity and power consumption. The HDSP-210x/-211x/-250x products are designed for standard microprocessor interface techniques. The display and special features are accessed through a bidirectional 8-bit data bus.Device Selection Guide AlGaAs High EfficiencyFont Height RedRedOrangeYellowGreen0.2 inches HDSP-2107 HDSP-2112 HDSP-2110 HDSP-2111 HDSP-21130.27 inchesHDSP-2504HDSP-2502HDSP-2500HDSP-2501HDSP-2503HDSP-210x SeriesEight Character 5 mm and 7 mm Smart Alphanumeric DisplaysData SheetESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED TO AVOID STATIC DISCHARGE.Absolute Maximum RatingsSupply Voltage, V DD to Ground [1] -0.3 to 7.0 V Operating Voltage, V DD to Ground [2] 5.5 VInput Voltage, Any Pin to Ground-0.3 to V DD +0.3 V Free Air Operating Temperature Range, T A [3] -45°C to +85°C Storage Temperature Range, T S -55°C to +100°C Relative Humidity (non-condensing) 85%Soldering Temperature[1.59 mm (0.063 in.) Below Body] Solder Dipping 260°C for 5 secs Wave Soldering250°C for 3 secs ESD Protection @ 1.5 kΩ, 100 pFV Z = 4 kV (each pin)Notes:1. Maximum Voltage is with no LEDs illuminated.2. 20 dots ON in all locations at full brightness.3. Maximum supply voltage is 5.25 V for operation above 70°C.PIN FUNCTION ASSIGNMENT TABLENOTES:1. DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON ALL DIMENSIONS IS ± 0.25 mm (0.010 INCH).3. FOR YELLOW AND GREEN DEVICES ONLY.NOTES:1. DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON ALL DIMENSIONS IS ± 0.25 mm (0.010 INCH).3. FOR YELLOW AND GREEN DEVICES ONLY.ASCII Character Set HDSP-210X, HDSP-211X, HDSP-250X SeriesRecommended Operating ConditionsParameter Symbol Minimum Nominal Maximum Units Supply Voltage V DD 4.5 5.0 5.5 VElectrical Characteristics Over Operating Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedT A = 25°C -45°C < T A < + 85°CV DD = 5.0 4.5 V < V DD < 5.5 VParameter Symbol Typ. Max. Min. Max. Units Test Conditions Input Leakage I IH 1.0 µA V IN = 0 to V DD, (Input without pullup) I IL-1.0 pins CLK, D0-DA0-A4Input Current I IPL-11 -18 -30 µA V IN = 0 to V DD, (Input with pullup) pins CLS, RST,WR, RD, CE, FL I DD Blank I DD (BLK) 0.5 3.0 4.0 mA V IN = V DDI DD 8 digits I DD(V) 200 255 330 mA “V” on in all 812 dots/character[1,2]locationsI DD 8 digits I DD(#) 300 370 430 mA “#” on in al20 dots/character[1,2,3,4] locations Input Voltage High V IH 2.0 V DD V+0.3Input Voltage Low V IL GND 0.8 V-0.3 VOutput Voltage High V OH 2.4 V V DD = 4.5 V,I OH = -40 µA Output Voltage Low V OL0.4 V V DD = 4.5 V, D0-D7 I OL = 1.6 mA Output Voltage Low V OL0.4 V V DD = 4.5 V, CLK I OL = 40 µA High Level Output I OH-60 mA V DD = 5.0 V CurrentLow Level Output I OL50 mA V DD = 5.0 V CurrentThermal Resistance R q J-C15 °C/WIC Junction-to-CaseNotes:1. Average I DD measured at full brightness. See Table 2 in Control Word Section for I DD at lower brightness levels. Peak I DD = 28/15 x I DD (#).2. Maximum I DD occurs at -55°C.3. Maximum I DD(#) = 355 mA at V DD = 5.25 V and IC T J = 150°C.4. Maximum I DD(#) = 375 mA at V DD =5.5 V and IC T J = 150°C.Optical Characteristics at 25°C[1]V DD = 5.0 V at Full BrightnessLuminous Intensity Peak DominantCharacter Average (#) Wavelength Wavelength Part Iv (mcd) l Peak l d Description Number Min. Typ. (nm) (nm) AlGaAs HDSP-2107 8.0 15.0 645 637-2504HER HDSP-2112 2.5 7.5 635 626-2502Orange HDSP-2110 2.5 7.5 600 602-2500Yellow HDSP-2111 2.5 7.5 583 585-2501High Performance HDSP-2113 2.5 7.5 568 574 Green -2503Note:1. Refers to the initial case temperature of the device immediately prior to measurement.AC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedReferenceNumber Symbol Description Min.[1]Units1 t ACC Display Access TimeWrite 210Read 230 ns2 t ACS Address Setup Time to Chip Enable 10 ns3 t CE Chip Enable Active TimeWrite 140Read 160 ns4 t ACH Address Hold Time to Chip Enable 20 ns5 t CER Chip Enable Recovery Time 60 ns6 t CES Chip Enable Active Prior to Rising Edge ofWrite 140Read 160 ns7 t CEH Chip Enable Hold Time to Rising Edge ofRead/Write Signal[2,3]0 ns8 t W Write Active Time 100 ns9 t WSU Data Write Setup Time 50 ns10 t WH Data Write Hold Time 20 ns11 t R Chip Enable Active Prior to Valid Data 160 ns12 t RD Read Active Prior to Valid Data 75 ns13 t DF Read Data Float Delay 10 nst RC Reset Active Time300 ns Notes:1. Worst case values occur at an IC junction temperature of 150°C.2. For designers who do not need to read from the display, the Read line can be tied to V DD and the Write and Chip Enable lines can be tied to-gether.3. Changing the logic levels of the Address lines when CE = “0” may cause erroneous data to be entered into the Character RAM, regardless of the logic levels of the WR and RD lines.4. The display must not be accessed until after 3 clock pulses (110 µs min. using the internal refresh clock) after the rising edge of the reset line.Write Cycle Timing DiagramAC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD < 5.5 V, unless otherwise specified Symbol Description 25°C Typ. Min.[1]UnitsF OSC Oscillator Frequency 57 28 kHz F RF [2] Display Refresh Rate 256 128 Hz F FL [3] Character Flash Rate 2 1 Hz t ST [4]Self Test Cycle Time4.69.2secNotes:1. Worst case values occur at an IC junction temperature of 150°C.2. F RF = F OSC /224.3. F FL = F OSC /28,672.4. t ST = 262,144/F OSC .INPUT PULSE LEVELS: 0.6 V to 2.4 VRead Cycle Timing DiagramRelative Luminous Intensity vs. TemperatureINPUT PULSE LEVELS: 0.6 V to 2.4 VOUTPUT REFERENCE LEVELS: 0.6 V to 2.2 V OUTPUT LOADING = 1 TTL LOAD AND 100 pFR E L A T I V E L U M I N O U S I N T E NS I T Y (N O R M A L I Z E D T O 1 A T 25°C )T A – AMBIENT TEMPERATURE – °C3.53.02.51.51.00.52.0Electrical DescriptionPin Function DescriptionRESET (RST, pin 1) Initializes the display.FLASH (FL, pin 2) FL low indicates an access to the Flash RAM and is unaffected by thestate of address lines A3-A4.ADDRESS INPUTS Each location in memory has a distinct address. Address inputs (A0-A2) (A0-A4, pins 3-6, 10) select a specific location in the Character RAM, the Flash RAM or aparticular row in the UDC (User-Defined Character) RAM. A3-A4are usedto select which section of memory is accessed. Table 1 shows thelogic levels needed to access each section of memory.Table 1. Logic Levels to Access MemorySection of Memory FL A4 A3A2 A1 A0Flash RAM 0 X X Char. AddressUDC Address Register 1 0 0 Don’t CareUDC RAM 1 0 1 Row AddressControl Word Register 1 1 0 Don’t CareCharacter RAM 1 1 1 Character AddressCLOCK SELECT Used to select either an internal (CLS = 1) or external (CLS = 0) clock source. (CLS, pin 11)CLOCK INPUT/OUTPUT Outputs the master clock (CLS = 1) or inputs a clock (CLS = 0) for slave displays. (CLK, pin 12)WRITE (WR, pin 13) Data is written into the display when the WR input is low and the CE input is low. CHIP ENABLE (CE, pin 17) Must be at a logic low to read or write data to the display and must go high betweeneach read and write cycle.READ (RD, pin 18) Data is read from the display when the RD input is low and the CE input is low. DATA Bus (D0-D7, Used to read from or write to the display.pins 19, 20, 23-28)GND (SUPPLY) (pin 15) Analog ground for the LED drivers.GND (LOGIC) (pin 16) Digital ground for internal logic.V DD (POWER) (pin 14) Positive power supply input.F i g u r e 1. H D S P -210X /-211X /-212X /-250X i n t e r n a l b l o c k d i a g r a m .Character RAM This RAM stores either ASCII character data or a UDC RAM address.Flash RAMThis is a 1 x 8 RAM which stores Flash data.User-Defined Character RAM This RAM stores the dot pattern for custom characters.(UDC RAM)User-Defined Character This register is used to provide the address to the UDC RAM when the user is Address Registerwriting or reading a custom character.(UDC Address Register)Control Word Register This register allows the user to adjust the display brightness, flash individualcharacters, blink, self test, or clear the display.Display Internal Block DiagramFigure 1 shows the internal block diagram of the HDSP-210X/-211X/-250X displays. The CMOS IC consists of an 8 byte Character RAM, an 8 bit Flash RAM, a 128 character ASCII decoder, a 16 character UDC RAM, a UDC AddressRegister, a Control Word Register, and refresh circuitry necessary to synchronize the decoding and driving of eight 5 x 7 dot matrix characters. The major user-acces-sible portions of the display are listed below:Character RAMFigure 2 shows the logic levels needed to access the HDSP-210X/-211X/-250X Character RAM. During a normal access, the CE = “0” and either RD = “0” or WR = “0.” However, erroneous data may be written into the Character RAM if the address lines are unstable when CE = “0” regardless of the logic levels of the RD or WR lines. Address lines A 0-A 2 are used to select the location in the Character RAM. Two types of data can be stored in each Character RAM location: an ASCII code or a UDC RAM address. Data bit D 7 is used to differentiate between the ASCII character and a UDC RAM address. D 7 = 0 enables the ASCII decoder and D 7 = 1 enables the UDC RAM. D 0-D 6 are used to input ASCII data and D 0-D 3 are used to input a UDC address.Figure 2. Logic levels to access the character RAM.CE FL A 4A 3A 2A 1A 0RST WR RD CHARACTER ADDRESSSYMBOL IS ACCESSED IN LOCATIONSPECIFIED BY THE CHARACTER ADDRESS ABOVE 0100011111011UNDEFINEDCONTROL SIGNALSCHARACTER RAM ADDRESSCHARACTER RAM DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = LEFT MOST 111 = RIGHT MOSTD 7D 6D 5D 4D 3D 2D 1D 00128 ASCII CODEXXXUDC CODE1DISPLAY0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREDIG 0DIG 1DIG 2DIG 3DIG 4DIG 5DIG 6DIG 7001010011100101110111000UDC RAM and UDC Address RegisterFigure 3 shows the logic levels needed to access the UDC RAM and the UDC Address Register. The UDC Address Register is eight bits wide. The lower four bits (D 0-D 3) are used to select one of the 16 UDC locations. The upper four bits (D 4-D 7) are not used. Once the UDC address has been stored in the UDC Address Register, the UDC RAM can be accessed.To completely specify a 5 x 7 character, eight write cycles are required. One cycle is used to store the UDC RAM address in the UDC Address Register and seven cycles are used to store dot data in the UDC RAM. Data is entered by rows and one cycle is needed to access each row. Figure 4 shows the organization of a UDC character assuming the symbol to be stored is an “F.” A 0-A 2 are used to select the row to be accessed and D 0-D 4 are used to transmit the row dot data. The upper three bits (D 5-D 7) are ignored. D 0 (least significant bit) corresponds to the right most column of the 5 x 7 matrix and D 4 (most significant bit) corresponds to the left most column of the 5 x 7 matrix.Flash RAMFigure 5 shows the logic levels needed to access the Flash RAM. The Flash RAM has one bit associated with each location of the Character RAM. The Flash input is used to select the Flash RAM while address lines A 3-A 4 are ignored. Address lines A 0-A 2 are used to select the location in the Flash RAM to store the attribute. D 0 is used to store or remove the flash attribute. D 0 = “1” stores the attribute and D 0 = “0” removes the attribute.When the attribute is enabled through bit 3 of the Control Word and a “1” is stored in the Flash RAM, the corresponding character will flash at approximately 2 Hz. The actual rate is dependent on the clock frequency. For an external clock the flash rate can be calculated by dividing the clock frequency by 28,672.Figure 4. Data to load “”F’’ into the UDC RAM.Figure 3. Logic levels to access a UDC character.CE FL A 4A 3A 2A 1A 0RST WR RD 010001101XXX011UNDEFINEDCONTROL SIGNALSUDC ADDRESS REGISTER ADDRESSUDC ADDRESS REGISTER DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = ROW 1110 = ROW 7D 7D 6D 5D 4D 3D 2D 1D 0XUDC CODEXXXFL A 4A 3A 2A 1A 011ROW SELECTUDC RAM ADDRESSUDC RAM C C DATA FORMATO O L L 150 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARED 7D 6D 5D 4D 3D 2D 1D 0XDOT DATAXXCE RST WR RD 0100011011UNDEFINEDCONTROL SIGNALSWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDC C C C C O O O O O L L L L L 1 2 3 4 5D 4D 3D 2D 1D 0UDC CHARACTER HEX CODE 1 1 1 1 1 ROW 1 • • • • • 1F 1 0 0 0 0 ROW 2 • 101 0 0 0 0 ROW 3 •101 1 1 1 0 ROW 4 • • • • 1D 1 0 0 0 0 ROW 5 • 101 0 0 0 0 ROW 6 • 101 0 0 0 0 ROW 7• 10IGNORED0 = LOGIC 0; 1 = LOGIC 1; * = ILLUMINATED LEDFigure 5. Logic levels to access the flash RAM.Table 2. Current Requirements at Different Brightness Levels V DD = 5.0 V % Current at 25°C Symbol D 2 D 1 D 0 Brightness Typ.UnitsI DD (V) 0 0 0 100 200 mA 0 0 1 80 160 mA 0 1 0 53 106 mA 0 1 1 40 80 mA 1 0 0 27 54 mA 1 0 1 20 40 mA111326mAFigure 6. Logic levels to access the control word registerControl Word RegisterFigure 6 shows how to access the Control Word Register. This 8-bit register performs five functions: Brightness control, Flash RAM control, Blinking, Self Test, and Clear. Each function is independent of the others; however, all bits are updated during each Control Word write cycle.Brightness (Bits 0-2)Bits 0-2 of the Control Word adjust the brightness of the display. Bits 0-2 are interpreted as a three bit binary code with code (000) corresponding to maximum brightness and code (111) corresponding to a blanked display. In addition to varying the display brightness, bits 0-2 also vary the average value of I DD . I DD can be calculated at any brightness level by multiplying the percent brightness level by the value of I DD at the 100% brightness level. These values of I DD are shown in Table 2.Flash Function (Bit 3)Bit 3 determines whether the flashing character attribute is on or off. When bit 3 is a“1,” the output of the Flash RAM is checked. If the content of a location in the Flash RAM is a “1,” the associated digit will flash at approximately 2 Hz. For an external clock, the blink rate can be calculated by driving the clock frequency by 28,672. If the flash enable bit of the Control Word is a “0,” the content of the Flash RAM is ignored. To use this function with multiple display systems, see the Display Reset section.Blink Function (Bit 4)Bit 4 of the Control Word is used to synchronize blinking of all eight digits of the display. When this bit is a “1” all eight digits of the display will blink at approximately 2 Hz. The actual rate is dependent on the clock frequency. For an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672. This function will override the Flash function when it is active. To use this function with multiple display systems, see the Display Reset section.CE FL A 4A 3A 2A 1A 0RST WR RD 0100011XX011UNDEFINEDREMOVE FLASH ATSPECIFIED DIGIT LOCATION STORE FLASH ATSPECIFIED DIGIT LOCATIONCONTROL SIGNALS FLASH RAM ADDRESS FLASH RAM DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0XXXXXXX01CHARACTER ADDRESS000 = LEFT MOST 111 = RIGHT MOSTCE FL A 4A 3A 2A 1A 0RST WR RD 01000111XXX1011UNDEFINEDCONTROL SIGNALSCONTROL WORD ADDRESSCONTROL WORD DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE0 DISABLE FLASH 1 ENABLE FLASHBRIGHTNESS CONTROL LEVELS 0 DISABLE BLINKING 1 ENABLE BLINKING0 NORMAL OPERATION1 CLEAR FLASH AND CHARACTER RAMS 0 X NORMAL OPERATION; X IS IGNORED 1 X START SELF TEST; RESULT GIVEN IN X X = 0 FAILED X = 1 PASSED WRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0CSSBLFB000100%00180%01053%01140%10027%10120%11013%1110%BBFigure 7. Logic levels to reset the display.CE RST WR RD 0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE NOTE:IF RST, CE, AND WR ARE LOW, UNKNOWN DATA MAY BE WRITTEN INTO THE DISPLAY.FL 01XXXXXA 4 -A 0D 7 -D 0Self Test Function (Bits 5, 6)Bit 6 of the Control Word Register is used to initiate the self test function. Results of the internal self test are stored in bit 5 of the Control Word. Bit 5 is a read only bit where bit 5 = “1” indicates a passed self test and bit 5 = “0” indicates a failed self test.Setting bit 6 to a logic 1 will start the self test function. The built-in self test function of the IC consists of two internal routines which exercise major portions of the IC and illuminate all of the LEDs. The first routine cycles the ASCII decoder ROM through all states and performs a checksum on the output. If the checksum agrees with the correct value, bit 5 is set to “1.” The second routine provides a visual test of the LEDs using the drive circuitry. This is accomplished by writing checkered and inverse checkered patterns to the display. Each pattern is displayed for approximately 2 seconds.During the self test function the display must not be accessed. The time needed to execute the self test function is calculated by multiplying the clock period by 262,144. For example, assume a clock frequency of 58 KHz, then the time to execute the self test function frequency is equal to (262,144/58,000) = 4.5 second duration.At the end of the self test function, the Character RAM is loaded with blanks, the Control Word Register is set to zeros except for bit 5, the Flash RAM is cleared, and the UDC Address Register is set to all ones.Clear Function (Bit 7)Bit 7 of the Control Word will clear the Character RAM and the Flash RAM. Setting bit 7 to a “1” will start the clear function. Three clock cycles (110 ms minimum using the internal refresh clock) are required to complete the clear function. The display must not be accessed while the display is being cleared. When the clear function has been completed, bit 7 will be reset to a “0.” The ASCII character code for a space (20H) will be loaded into the Character RAM to blank the display and the Flash RAM will be loaded with “0”s. The UDC RAM, UDC Address Register, and the remainder of the Control Word are unaffected.Display ResetFigure 7 shows the logic levels needed to Reset the display. The display should be Reset on Power-up. The external Reset clears the Character RAM, Flash RAM, Control Word and resets the internal counters. After the rising edge of the Reset signal, three clock cycles (110 µs minimum using the internal refresh clock) are required to complete the reset sequence. The display must not be accessed while the display is being reset. The ASCII Character code for a space (20H) will be loaded into the Character RAM to blank the display. The Flash RAM and Control Word Register are loaded with all “0”s. The UDC RAM and UDC Address Register are unaffected. All displays which operate with the same clock source must be simultaneously reset to synchronize the Flashing and Blinking functions.Mechanical and Electrical ConsiderationsThe HDSP-210X/-211X/-250X are 28 pin dual-in-line packages with 26 external pins. The devices can be stacked horizontally and vertically to create arrays of any size. The HDSP-210X/-211X/-250X are designed to operate continuously from -45°C to +85°C with a maximum of 20 dots on per character at 5.25 V. Illuminating all thirty-five dots at full brightness is not recommended.The HDSP-210X/-211X/-250X are assembled by die attaching and wire bonding 280 LED chips and a CMOS IC to a thermally conductive printed circuit board. A poly-carbonate lens is placed over the PC board creating an air gap over the LED wire bonds. A protective cap creates an air gap over the CMOS IC. Backfill epoxy environmentally seals the display package. This package construction makes the display highly tolerant to temperature cycling and allows wave soldering.The inputs to the IC are protected against static discharge and input current latchup. However, for best results standard CMOS handling precautions should be used. Prior to use, the HDSP-210X/-211X/-250X should be stored in antistatic tubes or in conductive material. During assembly, a grounded conductive work area should be used, and assembly personnel should wear conductive wrist straps. Lab coats made of synthetic material should be avoided since they are prone to static buildup. Input current latchup is caused when the CMOS inputs are subjected to either a voltage below ground (V IN < ground) or to a voltage higher than V DD (V IN > V DD ) and when a high current is forced into the input. To prevent input current latchup and ESD damage, unused inputs should be connected either to ground or to V DD . Voltages should not be applied to the inputs until V DD has been applied to the display.Thermal ConsiderationsThe HDSP-210X/-211X/-212X/250X have been designed to provide a low thermal resistance path for the CMOS IC to the 26 package pins. Heat is typically conducted through the traces of the printed circuit board to free air. For most applications no additional heatsinking is required.Measurements were made on a 32 character display string to determine the thermal resistance of the display assembly. Several display boards were constructed using 0.062 in. thick printed circuit material, and one ounce copper 0.020 in. traces. Some of the device pins were connected to a heatsink formed by etching a copper area on the printed circuit board surrounding the display. A maximally metallized printed circuit board was also evaluated. The junction temperature was measured for displays soldered directly to these PC boards, displays installed in sockets, and finally displays installed in sockets with a filter over the display to restrict airflow. The results of these thermal resistance measurements, Rq J-A are shown in Table 3 and include the effects of Rq J-C .Ground ConnectionsTwo ground pins are provided to keep the internal IC logic ground clean. The designer can, when necessary, route the analog ground for the LED drivers separately from the logic ground until an appropriate ground plane is available. On long interconnections between the display and the host system, the designer can keep voltage drops on the analog ground from affecting the display logic levels by isolating the two grounds.The logic ground should be connected to the same ground potential as the logic interface circuitry. The analog ground and the logic ground should be connected at a common ground which can withstand the current introduced by the switching LED drivers. When separate ground connections are used, the analog ground can vary from -0.3 V to +0.3 V with respect to the logic ground. Voltage below -0.3 V can cause all dots to be on. Voltage above +0.3 V can cause dimming and dot mismatch.Table 3. Thermal Resistance, q JA , Using Various Amounts of Heatsinking Material Heatsinking Metal W/Sockets W/O Sockets W/Sockets per Device W/O Filter W/O Filter W/Filter sq. in. (Avg.) (Avg.)(Avg.)Units0 31 30 35 °C/W 1 31 28 33 °C/W 330 26 33 °C/W Max. Metal 29 25 32 °C/W 4 Board Avg302733°C/WSoldering and Post SolderCleaning Instructions for the HDSP-210X/-211X/-250XThe HDSP-210X/-211X/-250X may be hand soldered or wave soldered with SN63 solder. When hand soldering, it is recommended that an electronically temperature controlled and securely grounded soldering iron be used. For best results, the iron tip temperature should be set at 315°C (600°F). For wave soldering, a rosin-based RMA flux can be used. The solder wave temperature should be set at 245°C ± 5°C (473°F ± 9°F), and the dwell in the wave should be set between 11 /2 to 3 seconds for optimum soldering. The preheat temperature should not exceed 105°C (221°F) as measured on the solder side of the PC board.For additional information on soldering and post solder cleaning, see Application Note 1027, Soldering LED Com-ponents .Contrast EnhancementThe objective of contrast enhancement is to provide good readability in a variety of ambient lighting condi-tions. For information on contrast enhancement see Application Note 1015, Contrast Enhancement Techniques for LED Displays .Color Bin LimitsColor Range (nm)Color BinMin. Max.Yellow 3 581.5 585.0 4 584.0 587.5 5 586.5 590.0 6 589.0 592.5 7 591.5 595.0Green 1 576.0 580.0 2 573.0 577.0 3 570.0 574.04567.0571.5Note:Test conditions as specified in Optical Char-acteristic table.Intensity Bin Limits for HDSP-2107 Intensity Range (mcd)Bin Min. Max.I 5.12 9.01J 7.68 13.52K 11.52 20.28L 17.27 30.42M25.3945.63Note:Test conditions as specified in Optical Char-acteristic table.Intensity Bin Limits for HDSP-211x and HDSP-250x (Except HDSP-2504) Intensity Range (mcd)Bin Min. Max.G 2.50 4.00H 3.41 6.01I 5.12 9.01J 7.68 13.52K11.5220.28Note:Test conditions as specified in Optical Char-acteristic table.For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3183EN AV02-0629EN - May 9, 2008Intensity Bin Limit for HDSP-2504BinIntensity Range (mcd)Min.MaxJ 7.6813.52K 11.5220.28L 17.2730.42M 25.9145.63Note:Test conditions as specified in Optical Charac-teristic table.。
HD2-WD20 2 Megapixel Starlight HD-AVS 杭钢凸顶相机说明书
HD2-WD202 Megapixel Starlight HD-AVS Wedge Dome Camera●1/2.8" CMOS●Max 30fps@1080P●HD and CVBS switchable ●Starlight, 120dB WDR, 3DNR ●Audio in interface, built-in mic●Max. IR LEDs length 20m, Smart IR ●IP67, IK10, DC12VSimplicityHD-AVS technology inherits the born feature of simplicity from traditional analog surveillance system, making itself a best choice for investment protection. HD-AVS system can seamlessly upgrade the traditional analog system without replacing existing coaxial cabling. The plug and play approach enables full HD video surveillance without the hassle of configuring a network.Multiple-formatsThe camera supports multiple video formats including HD-AVS, CVBS. The two formats can be switched over through OSD menu. This feature makes the camera to be compatible with not only AVRs but also most end users’ existing Standard Definition DVRs.The HD2-WD20 from Clearview features a 1/2.8" CMOS capable of 30fps in 1080P resolution and a 3.6mm fixed lens in a compact wedge form factor. The camera is also switchable to CVBS standard definition mode and also includes a built-in Microphone.This camera also features Starlight technology for enhanced low light support and long distance Smart IR support with a distance of up to 66 feet. These features including an IP67 and IK10 protection rating make this camera a great choice for most residential and business applications.System OverviewFunctionsStarlightWith the adoption of high performance sensor, the camera is able to provide incomparable performance even under extreme low light environment. The starlight feature allows more details to be captured and accurate color to be recognized at night or in scenes with limited illumination.Smart IR TechnologyWith IR illumination, detailed images can be captured in low light or total darkness. The camera's Smart IR technologyadjusts the intensity of camera's infrared LEDs to compensate the distance of an object. Smart IR technology prevents IR LEDs from whitening out images as they come closer to the camera. The camera's integrated infrared illumination provides high performance in extreme low-light environments up to 20m (66ft).Protection(IP67, IK10, wide voltage)The camera allows for ±30% input voltage tolerance,suitable for the most unstable conditions for outdoor applications. Its 6KV lightning rating provides effective protection for both the camera and its structure against lightning. Subjected and certified to rigorous dust andimmersion tests (IP67) and impact tests (IK10), the camera is the choice for installation in even the most unforgiving environments.EnvironmentalCameras operate in extreme temperature environments, rated for use in temperatures from -30° C to +60° C (-22° F to +140° F) with 95% humidity. Device has metal casting construction.Technical SpecificationImage Sensor 1/2.8" CMOSEffective Pixels 1920(H)×1080(V), 2MP Scanning System ProgressiveElectronic Shutter SpeedPAL: 1/4s~1/100000s NTSC: 1/3s~1/100000sMinimum Illumination 0.004Lux/F1.6, 30IRE, 0Lux IR on S/N Ratio More than 65dB IR Distance Up to 20m (66feet)IR On/Off Control Auto / Manual IR LEDs8CameraPan/Tilt/Rotation RangePan: 0° ~ 60°Tilt: 0° ~ 80°Rotation: 0° ~ 360°Pan/Tilt/RotationResolution 1080P (1920×1080)Frame Rate 25/30fps@1080P, 25/30/50/60fps@720PVideo Output 1-channel BNC high definition video output / CVBS video output (DIP switch)Day/Night Auto (ICR) / Manual OSD Menu Multi-language BLC Mode BLC / HLC / WDR WDR 120dB Gain Control AGC Noise Reduction 2D/ 3D White Balance Auto / Manual Smart IRAuto / ManualVideoAudio Interface 1ch in & Built-in Mic RS485N/A AlarmN/AInterfacePower Supply 12V DC ±30%Power ConsumptionMax 4.3W (12V DC, IR on)ElectricalOperating Conditions -40°C ~ +60°C (-40°F ~ +140°F) / Less than 95% RH * Start up should be done at above -40°C (-40°F)Storage Conditions -40°C ~ +60°C (-40°F ~ +140°F) / Less than 95% RH Ingress Protection IP67Vandal ResistanceIK10EnvironmentalCasing AluminumDimensions 106mm×50.3mm (4.17"×1.98")Weight 0.31kg (0.68lb)Gross Weight0.45kg (0.99lb)ConstructionLensLens Type Fixed lens / Fixed iris Mount Type Board-in Focal Length 3.6mm Max. Aperture F1.6Angle of View H: 86.9° (110°)Focus Control Auto / Manual Close Focus Distance1200mm (500mm)47.2'' (19.7'')DORI DistanceLens Detect Observe Recognize Identify 3.6mm180 ft72 ft36 ft20 ftAccessories Dimensions (mm/in)。
22硬件需求规格说明书
项目名称硬件需求规格说明书版本号：拟制人：日期：审核人：日期：批准人：日期：宇龙计算机通信科技有限公司（限于公司员工内部使用）修订记录*A －增加 M －修改 D －删除目录1 引言 .................................................................................................................................... 错误!未定义书签。
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SmartAVI HDS-2P 4K 2K HDMI 2端口分辨率分裂器说明书
WHAT’S IN THE BOX
PART NO.
QTY DESCRIPTION
HDS-2PS
1 HDMI 2 Port Splitter
Power Supply
1 PSVDC2A
Quick Start Guide 1
NOTICE
The information contained in this document is subject to change without notice. SmartAVI makes no warranty of any kind with regard to this material, including but not limited to, implied warranties of merchantability and fitness for particular purpose.
FEATURES
Ultra HD | 4K (4096x2160) Resolution and Full 3D
One HDMI 1.4a input signal split to two HDMI Outputs
HDCP 1.3 protocol compliant Supports CEC Supports deep color 30bit, 36bit Supports Blu-ray players Digital audio format, with DTS-HD/
REAR
TECHNICAL SPECIFICATIONS
VIDEO
HDMI Version
HDMI 1.4a
HDMI Resolution
Full HD 1080p (1920x1080 at 60Hz), 3D and 4Kx2K resolution
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Agilent HDSP-A2XC SeriesAlphanumeric Display, 0.54" (13.7 mm)2 Character As AlInGaP RedData SheetFeatures•As AlInGaP red color •Gray face paintGray package gives optimum contrast •Design flexibilityCommon anode or common cathodeApplications•Suitable for alphanumeric •Operating temperature range –40˚C to 105˚CDevices As AlInGaP Red Description HDSP-A22C Common Anode HDSP-A27CCommon CathodeDescriptionThese 0.54" (13.7 mm) AS AlInGaP displays are available in either common anode or common cathode.Package Dimensions6.75 [0.266] 5.95 [0.234]25.20 [0.992]8.17[0.322]1.20[0.047]13.80 [0.543]7.00 [0.276]21.00 [0.827]15.24 [0.600]NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS [INCHES]2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm3.70 [0.146]20.32[0.800]Internal CircuitPin Configuration A Pin Configuration B Pin Common Anode Common Cathode 11E/2E Cathode 1E/2E Anode 21M/2M Cathode 1M/2M Anode 3No Connection No Connection 41L/2L Cathode 1L/2L Anode 51K/2K Cathode 1K/2K Anode 61J/2J Cathode 1J/2J Anode 71D/2D Cathode 1D/2D Anode 8DP1 Cathode DP1 Anode 91C/2C Cathode 1C/2C Anode 101B/2B Cathode1B/2B Anode11DIGIT No. 2 Common Anode DIGIT No. 2 Common Cathode 121A/2A Cathode 1A/2A Anode 131N/2N Cathode 1N/2N Anode 141H/2H Cathode 1H/2H Anode 151G/2G Cathode1G/2G Anode16DIGIT No. 1 Common Anode DIGIT No. 1 Common Cathode 171P/2P Cathode 1P/2P Anode 181F/2F Cathode 1F/2F AnodeCOMMON ANODECOMMON CATHODECOM 1 DIG 1 COM 2COM 1 DIG 1COM 2 DIG 1DIG 2DP1DP2A B G H CDE F JK L M NPAbsolute Maximum Ratings at T A = 25˚CParameter Symbol HDSP-A22C/HDSP-A27C UnitsDC Forward Current per Segment or DP[1,2,3]I F50mAPeak Forward Current per Segment or DP[2,3]I PEAK100mA Average Forward Current[3]I AVE30mA Reverse Voltage per Segment or DP (I R = 100 µA)V R5V Operating Temperature T O–40 to +105˚C Storage Temperature T S–40 to +120˚CLead Soldering Conditions Temperature260˚CTime3sNotes:1.Derate linearly as shown in Figure 1.2.For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).3.Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.Optical/Electrical Characteristics at T A = 25˚CDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test ConditionsA22C Forward Voltage I V 1.70 1.90 2.20V I F = 20 mAA27C Reverse Voltage V R520V I F = 100 µA Peak WavelengthλPEAK635nm Peak Wavelengthof Spectral Distri-bution at I F = 20 mA Dominant Wavelength[3]λd622.5626630nmSpectral Halfwidth∆λ1/217nm Wavelength Widthat Spectral Distri-bution 1/2 PowerPoint at I F = 20 mA Speed of Responseτs20ns Exponential TimeConstant, e-tτs Capacitance C40pF V F = 0, f = 1 MHzIntensity Bin Limits[1](mcd at 10 mA)Bin Name Min.[2]Max.[2]T18.025.0U25.036.0Notes:1.Bin categories are established forclassification of products. Products maynot be available in all bin categories.2.Tolerance for each bin limit is ± 10%. Data subject to change.Copyright © 2001 Agilent Technologies, Inc.November 20, 20015988-4821ENFigure 1. Maximum forward current vs.ambient temperature. Derating based on T JMAX = 130˚C.Figure 2. Forward current vs. forwrad voltage.I F – M A X I M U M A V E R A G E C U R R E N T – m A00T A – AMBIENT TEMPERATURE – ˚C60301204010202040506080100I F – F O R W A R D C U R R E N T P E R S E G M E N T – m A00V F – FORWARD VOLTAGE – V12060 2.0 3.08020 1.0 2.540 1.5100Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningCleaning agents from ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family (methylene chloride,trichloroethylene, carbon tetrachloride, etc.) are notrecommended for cleaning LED parts. All of these varioussolvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.。