ol303434n_si_001
美国Omega感温线型号判断
三：热偶丝线径
• 3：24awg（0.511mm）
四：SLE与非SLE
• 这个是美国Omega感温线精度的标示，通 过外观及一般的设备就很难判断了 • 但是我们提供的均是SLE(0.4%)精度的感温 线。
美国Omega感温线常用型号
• 1：玻璃纤维绝缘层（耐温482度）
• • • • • • • • • GG-K-36-SLE玻璃纤维外皮,K分度号，耐温482度,2*0.127mm ,1000英尺/305米 GG-K-30-SLE玻璃纤维外皮,K分度号，耐温482度,2*0.255mm ,1000英尺/305米 GG-K-24-SLE玻璃纤维外皮,K分度号，耐温482度,2*0.511mm ,1000英尺/305米 GG-J-36-SLE玻璃纤维外皮，J分度号，耐温482度,2*0.127mm ,1000英尺/305米 GG-J-30-SLE玻璃纤维外皮，J分度号，耐温482度,2*0.255mm ，1000英尺/305米 GG-J-24-SLE玻璃纤维外皮，J分度号，耐温482度,2*0.511mm ，1000英尺/305米 GG-T-36-SLE玻璃纤维外皮，T分度号，耐温482度,2*0.127mm ,1000英尺/305米 GG-T-30-SLE玻璃纤维外皮，T分度号，耐温482度2*0.255mm ，1000英尺/305米 GG-T-24-SLE玻璃纤维外皮，T分度号，耐温482度2*0.511mm ，1000英尺/305米
二：分度号
• 1： K型： 一红一黄色
二：分度号
• 2： T型： 一红一蓝色
二：分度号
• 3： J型： 一红一白色
三：热偶丝线径
美国Omega感温线-热偶丝线径是通用AWG线规标示，通用的有三种： 热偶丝是指:除开绝缘层之后的裸丝 1：36awg(0.127mm)
GigaSPEED XL 3071E-B ETL Verified Category 6 U UTP
GigaSPEED XL® 3071E-B ETL Verified Category 6 U/UTP Cable, lowsmoke zero halogen, white jacket, 4 pair count, 1000 ft (305 m) length,reelProduct ClassificationRegional Availability EMEAPortfolio SYSTIMAX®Product Type Twisted pair cableProduct Brand GigaSPEED XL®General SpecificationsProduct Number3071EANSI/TIA Category6Cable Component Type HorizontalCable Type U/UTP (unshielded)Conductor Type, singles SolidConductors, quantity8Jacket Color WhitePairs, quantity4Separator Type BisectorTransmission Standards ANSI/TIA-568.2-D | CENELEC EN 50288-6-1 | ISO/IEC 11801 Class E DimensionsCable Length304.8 m | 1000 ftDiameter Over Insulated Conductor 1.041 mm | 0.041 inDiameter Over Jacket, nominal 5.918 mm | 0.233 inJacket Thickness0.559 mm | 0.022 inConductor Gauge, singles23 AWG13Page ofCross Section DrawingElectrical Specificationsdc Resistance Unbalance, maximum 5 %dc Resistance, maximum7.61 ohms/100 m | 2.32 ohms/100 ftDielectric Strength, minimum2500 VdcMutual Capacitance at Frequency 5.6 nF/100 m @ 1 kHzNominal Velocity of Propagation (NVP)70 %Operating Frequency, maximum300 MHzOperating Voltage, maximum80 VRemote Powering Fully complies with the recommendations set forth by IEEE 802.3bt (Type4) for the safe delivery of power over LAN cable when installed accordingto ISO/IEC 14763-2, CENELEC EN 50174-1, CENELEC EN 50174-2 or TIATSB-184-ASegregation Class cMaterial SpecificationsConductor Material Bare copperInsulation Material PolyolefinJacket Material Low Smoke Zero Halogen (LSZH)Separator Material PolyolefinPage of23Mechanical SpecificationsPulling Tension, maximum11.34 kg | 25 lbEnvironmental SpecificationsInstallation temperature0 °C to +60 °C (+32 °F to +140 °F)Operating Temperature-20 °C to +60 °C (-4 °F to +140 °F)Acid Gas Test Method EN 50267-2-3EN50575 CPR Cable EuroClass Fire Performance B2caEN50575 CPR Cable EuroClass Smoke Rating s1aEN50575 CPR Cable EuroClass Droplets Rating d0EN50575 CPR Cable EuroClass Acidity Rating a1Environmental Space Low Smoke Zero Halogen (LSZH)Smoke Test Method IEC 61034-2Packaging and WeightsCable weight38.097 kg/km | 25.6 lb/kftPackaging Type ReelRegulatory Compliance/CertificationsAgency ClassificationCENELEC EN 50575 compliant, Declaration of Performance (DoP) availableCHINA-ROHS Below maximum concentration valueISO 9001:2015Designed, manufactured and/or distributed under this quality management system REACH-SVHC Compliant as per SVHC revision on /ProductCompliance ROHSCompliantPage of33。
ARTISAN技术组-设备说明书
ErrataTitle & Document Type:Manual Part Number:Revision Date:HP References in this ManualThis manual may contain references to HP or Hewlett-Packard. Please note that Hewlett-Packard's former test and measurement, semiconductor products an d chemical analysis businesses are now part of Agilent Technologies. We have made no changes to this manual copy. The HP XXXX referred to in this document is now the Agilent XXXX. For example, model number HP8648A is now model number Agilent 8648A.About this ManualWe’ve added this manual to the Agilent website in an effort to help you support your product. This manual provides the best information we could find. It may be incomplete or contain dated information, and the scan quality may not be ideal. If we find a better copy in the future, we will add it to the Agilent website.Support for Your ProductAgilent no longer sells or supports this product. You will find any other available product information on the Agilent Test & Measurement website:Search for the model number of this product, and the resulting product page will guide you to any available information. Our service centers may be able to perform calibration if no repair parts are needed, but no other support from Agilent is available.16500B/16501A Logic Analysis System User's Reference 16500-97010April 1994U s er’s Ref er encePubl i c a t i on num be r16500-97010Fi r s t edi t i on,Apr i l1994For Sa f e t y i nf or m a t i on,W a r r a nt i es,a nd Reg ul a t or yi nf or m a t i on,s ee t he pa ges be hi nd t he i nde x©Copyr i g ht Hewl et t-Pac ka r d Com pa ny1987,1990,1993,1994 Al l Ri ght s Re s er v edHP 16500B/16501ALogi c Anal ys i s Sys t emI n Thi s BookW el c om e t o t he He wl et t-Pac ka r d Logi c Ana l y s i s Sys t em!The HP 16500B Logi c Ana l y s i s Sys t em i s des i gned t o be t heea s i es t s ys t em t o us e,ev e r.I t s m odul a r des i gn a l l ows you t o c onf i gur e i t wi t h j us t t he m ea s ur em ent m odul es you need now, yet a dd ot he r m odul es l a t e r.Thi s r e f er enc e expl a i ns t he oper a t i on of t he s ys t em m a i nf r a m e a nd I nt er m odul em enus.Al s o i nc l ude d i s i nf or m a t i on ont he m os t c om m on s ys t em opt i ons.O r gani zat i onW hen you or der t he HP 16500B,you get t wo bi nder s(one i s ext r a f or l a t e r us e). The m a i nf r a m e r e f er enc e i nf or m a t i on i s f ound be hi nd t he f i r s t t a b "HP 16500BM a i nf r a m e."I nf or m a t i on on t he opt i ona l keyboa r d,m ous e,a nd t he HP 16501A Expa ns i onFr a m e i s f ound behi nd t he s ec ond t a b, "Sys t em Opt i ons."As you a c c um ul a t eot her s ys t em opt i ons,pl a c e t hes er ef er e nc es behi nd t hi s t a b.Behi nd t he t hi r d t a b "Com m on M odul e Oper a t i ons"i s i nf or m a t i on c om m on t om os t m odul es,l i ke i ns t a l l i ng m odul e s,us i ng s ym bol s,a nd a s s i gni ng l a bel s.As you pur c ha s e a ddi t i ona l m ea s ur em ent m odul es,pl a c e t hei r r ef er e nc es a t t heba c k of t hi s bi nde r or i n t he s e c ondbi nder.W hat i s i n t he H P 16500B Us er’s Ref er ence?•Cha pt e r1 i nt r oduc es t he HP 16500B by s um m a r i z i ng i t s f ea t ur es.•Cha pt e r2 di s c r i bes t he m a i nf r a m e’s Sys t em Conf i g ur a t i on m e nu.•Cha pt e r3 di s c r i bes t he HP-I B a nd RS-232C i nt er f a c es.They a r e us ed f or pr i nt i ng s c r eens a nd c om put e r c ont r ol l ed m ea s ur em ent s.•Cha pt e r4 expl a i ns how t o pr i nt s c r eens t o v a r i ous g r a phi c s pr i nt er s.•Cha pt e r5 di s c r i bes t he f l exi bl e di s k a nd ha r d di s k ope r a t i ons.•Cha pt e r6 des c r i bes t he Sys t em Ut i l i t i es m enu.Adj us t m ent s t o t he r ea l-t i m e c l oc k,t ouc h c a l i br a t i on,a nd s c r een c ol or s a r e m a de her e.•Cha pt e r7 expl a i ns how t o m a ke i nt er m odul e m ea s ur em ent s.•Cha pt e r8 l i s t s t he i ns t r um ent s pec i f i c a t i ons a nd c ha r a c t er i s t i c s.•Cha pt e r9 expl a i ns t he gener a l i ns t r um ent m a i nt ena nc e a nd r epa c ki ngi nf or m a t i on.Al s o i nc l uded i s a des c r i pt i on of t he s el f-t es t t ha t i sper f or m ed when t he i ns t r um e nt i s t ur ned on.•Cha pt e r10 des c r i bes a l l s y s t e m a nd di s k er r or m es s a ges.W hat i s i n t he Sys t em O pt i ons?•Cha pt e r1 expl a i ns t he key boa r d a nd m ous e opt i ons.•Cha pt e r2 des c r i bes t he HP 16501A Expa ns i on Fr a m e opt i on.Ev en t hough you m a y not ha v e pur c ha s e d t he s e opt i ons yet,keep t hi si nf or m a t i on f or pos s i bl e f ut ur e us e.W hat i s i n t he C om m on M odul e O per at i ons?•Cha pt e r1 des c r i bes a s s i gni ng l a bel s.•Cha pt e r2 des c r i bes us i ng s ym bol s.•Cha pt e r3 expl a i ns t he gener a l i ns t a l l a t i on f or i ndi v i dua l m odul es.W her e t o go nextI f you ha v en’t a l r ea dy r ea d Se t t i ng Up The HP 16500 Logi c Anal ys i sSys t e m,pl ea s e r ea d i t be f or e c ont i nui ng.M S-DOS®i s a US r egi s t er e d t r a de m a r k of M i c r os of t Cor por a t i on.Cont ent sH P 16500BM ai nf r am e1W hat I s t he H P 16500B Logi c A nal ys i s Sys t em?Ke y Fea t ur es 1–3Opt i ona l Fea t ur es 1–3Us er I nt er f a c es1–4Def a ul t Conf i gur a t i ons 1–4Ac c es s or i es Suppl i ed 1–5Ac c es s or i es Av a i l a bl e 1–52The Sys t em Conf i gur at i on M enuGe t t i ng i nt o t he Sys t em Conf i g ur a t i on M enus 2–4La yout of t he Sy s t e m Conf i gur a t i on M enus 2–5Sl ot Des i gna t or s 2–63C onf i gur i ng t he H P-I B and RS-232CConf i gur i ng t he HP-I B I nt er f a c e3–4Conf i gur i ng t he RS-232C I nt er f a c e3–5Conf i gur i ng t he I nt er f a c e f or a Cont r ol l er or Pr i nt er 3–84C onnect i ng a Pr i nt erConne c t i ng HP-I B Pr i nt e r s 4–3Conne c t i ng RS-232C Pr i nt e r s 4–6Conne c t i ng t o Ot he r Hewl et t-Pa c ka r d Pr i nt er s 4–9Pr i nt i ng t he Di s pl a y 4–11Cont ent s–1Contents5The D i s k D r i ve M enusAc c es s i ng t he Di s k M enus 5–5I ns t a l l i ng a Fl exi bl e Di s k 5–6Sel e c t i ng a Di s k Oper a t i on 5–7Loa di ng a Fi l e 5–8For m a t t i ng a Di s k 5–10St or i ng Fi l es on a Di s k 5–12Rena m i ng a Fi l e 5–15Aut ol oa di ng a Fi l e 5–17Pur gi ng a Fi l e 5–19Copy i ng a Fi l e 5–20Pac ki ng a Di s k 5–22Dupl i c a t i ng a Di s k 5–23M a ki ng a Di r e c t or y 5–24Cha ngi ng t he Di r ec t or y 5–25Cr ea t i ng a Sys t em Fl e xi bl e Di s k 5–266The Sys t em Ut i l i t i es M enuThe Touc h a nd Sound Fi el ds 6–4Touc h Ca l i br a t i on 6–4Set t i ng t he Rea l-t i m e Cl oc k 6–6Tur ni ng t he Sound On/Of f 6–7Di s pl a y Col or Se l ec t i on 6–8Sel e c t i ng t he Col or,Hue,Sa t ur a t i on,a nd Lum i nos i t y Fi e l ds 6–10 Sel e c t i ng Col or s 6–12Ret ur ni ng t o t he De f a ul t Col or s 6–14Cont ent s–2Contents7I nt er m odul e M eas ur em ent sAc c es s i ng t he I nt er m odul e M enu 7–5Conf i gur i ng a Gr oup Run 7–6Conf i gur i ng Por t I n/Out 7–8The Gr oup Run/St op Fi el d 7–10The M odul es Li s t 7–11St a t us I ndi c a t or s a nd Ti m e Cor r el a t i on Ba r s 7–12Adj us t i ng Ske w 7–13W ha t Ar e Som e Typi c a l I nt er m odul e M e a s ur em e nt s?7–14Di s pl a y i ng M ul t i pl e M odul e Da t a on One Sc r een 7–18Hel pf ul Hi nt s 7–218G ener al Char act er i s t i csCha r a c t e r i s t i c s8–29M ai nt ai ni ng t he H P 16500BCl ea ni ng Requi r e m ent s9–2Dega us s i ng 9–3Ser v i c e a nd Ca l i br a t i on 9–3The Sys t em Tes t M enu 9–4Repa c ka gi ng f or St or a g e or Shi pm e nt 9–510Er r or M es s agesDi s k Er r or M es s a ges 10–3Di s k W a r ni ng M e s s a ge s10–5Power up Sel f-Tes t Doc um ent a t i on 10–6Fai l Codes 10–7Cr i t i c a l Er r or s10–8Non-Cr i t i c a l Er r or s10–8Cont ent s–3ContentsSys t em O pt i ons1Us i ng t he O pt i onal K eyboar d and M ous eM ov i ng t he Cur s or1-3Ent er i ng Da t a i nt o a M enu 1-5Us i ng t he Keyboa r d Ov er l a ys1-7Def i ni ng Ti m e Uni t s1-9Def i ni ng Vol t a ge Uni t s1-9As s i gni ng Edge Tr i gge r s1-10Cl os i ng a M enu 1-10Conne c t i ng t he Ke yboa r d a nd M ous e1-112The O pt i on H P 16501A Expans i on Fr am eCom ponent Det a i l s2-3Sys t em Conf i g ur a t i on 2-4Sys t em Ar m i ng a nd Tr i gg er i ng 2-4Conne c t i ng t he HP 16501A Expa ns i on Fr a m e 2-7 Com m on M odul eO per at i ons1Label s As s i gnm entLa bel As s i gnm ent Fi el ds1-3Rol l i ng La bel s a nd Pods1-52Sym bol s As s i gnm entSym bol s Fi e l d 2-33I ns t al l i ng and Rem ovi ng Car dsGe ner a l I ns t a l l a t i on Pr oc e dur e 3-3HP 16532A I ns t a l l a t i on Cons i de r a t i ons3-7HP 16517A/18A I ns t a l l a t i on Cons i der a t i ons3-11Cont ent s–41W hat I s t heH P 16500B Logi c Anal ys i s Sys t em?The H P 16500BThe HP 16500B i s t he m a i nf r a m e of t he Hewl e t t-Pa c ka r d Logi cAna l y s i s Sys t em.I t of f er s a m odul a r s t r uc t ur e f or pl ug-i n c a r ds wi t h a wi de r a ng e of s t a t e,t i m i ng,os c i l l os c ope,a nd pa t t er n g ener a t orc a pa bi l i t i es.Thi s a l l ows you t o c onf i gur e t he HP 16500B us i ng onl yt he m odul es you nee d i n or der t o per f or m a des i r ed m ea s ur em ent or s e t of m ea s ur em ent s,whi l e g i v i ng y ou t he f l exi bi l i t y t o c ha nge or upda t e t he m l a t er.The Log i c Ana l ys i s Sys t em pr ov i de s bot h exper i e nc e d a nd f i r s t-t i m e us er s wi t h power f ul m ea s ur em ent c a pa bi l i t i es.The pop-up m enusa nd c ol or gr a phi c s l ea d y ou t hr ough s et ups a nd m ea s ur e m e nt s qui c kl y a nd ea s i l y,wi t hout t he need t o m em or i z e a l ot of s t e ps.By t ouc hi ngt he a ppr opr i a t e f i el ds or us i ng t he c ur s or of ei t he r t he opt i ona l m ous e or keyboa r d,you c a n per f or m f unc t i ons,c onf i gur e m enus,a nd m ov ef r om one m e nu t o a not her.W i t h t he i nt er m odul e c a pa bi l i t i es of t he Logi c Ana l y s i s Sys t em,youc a n m a ke i nt e r a c t i v e m e a s ur em ent s be t ween m odul es.Thi s a l l ows you t o c onf i gur e m odul e s t o i nt er a c t wi t h ea c h ot her,us i ng t het r i g ger i ng c a pa bi l i t i es of one m odul e a nd t he a c qui s i t i on c a pa bi l i t i es of a not her.Syst em O pt i onsThe HP 16501A i s t he a dd-on m a i nf r a m e f or expa ndi ng t he m odul ec a pa c i t y of t he HP 16500B.W he n t he HP 16501A i s c onnec t ed t o t he HP 16500B,t heyf unc t i on a s a s i ngl e t en-c a r d s y s t em whi c h i s t ur ned on a nd c ont r ol l ed by t he HP 16500B.The HP 16501A f or m s a t i ght l y c oupl ed s ys t e m wi t h t he HP 16500B,per m i t t i ng ea ch of t he t wom a i nf r a m e s t o a r m or t r i g ger a ny m odul e f r om a ny ot her m odul e.An opt i ona l LAN i nt e r f a c e i s a v a i l a bl e f or di r ec t c onnec t i on t oc om put e r s l oc a t ed on a n Et her net l oc a l a r ea net wor k (LAN).The LAN i nt erf a c e ena bl es you t o upl oa d m e a s ur em ent da t a f or t he m os t c om pr ehens i v e pos t-pr oc es s i ng nee ds a nd ea s y a c c es s t o da t a f i l e s.1–2Key Feat ur esThe key f e a t ur es of t he HP 16500B a r e:•M odul a r m a i nf r a m e wi t h f i v e c a r d s l ot s .•9-i nc h c ol or m oni t or .•Touc hs c r e en wi t h on/of f c ont r ol .•Ba t t er y ba c ked Re a l -t i m e c l oc k.•Pr ogr a m m a bl e PORT I N v ol t a ge l ev e l a nd e dge s el ec t i on.•3.5-i nc h f l exi bl e di s k dr i v e wi t h DOS a nd LI F f or m a t s uppor t .•170 M by t e ha r d di s k dr i v e wi t h DOS f or m a t s uppor t .•I nt e r m odul e t r i gge r i ng a nd 2 ns t i m e c or r el a t i on of a c qui r ed da t a .•HP-I B a nd RS-232C i nt er f a c es f or :— Ha r dc opy out put t o a pr i nt er— Cont r ol l er i nt er f a c e .O pt i onal Feat ur esThe opt i ona l f e a t ur es of t he HP 16500B:•HP16501A Expa ns i on Fr a m e. I nc r ea s e a v a i l a bl e c a r d s l ot s t o t en whe n you c onnec t t he expa ns i on f r a m e t o a n HP 16500B.•M ous e.•Ke yboa r d.•Et her net LAN i nt er f a c e .•Expa nda bl e s ys t em m em or y up t o 64 M byt e s .See Also "Sys t em Opt i ons " f or m or e i nf or m a t i on on a v a i l a bl e s ys t em s of t wa r e a ndha r dwa r e opt i ons .What is the HP 16500B Logic Analysis System Key Features1–3What is the HP 16500B Logic Analysis SystemUser InterfacesU s er I nt er f acesThe HP 16500B ha s f our us er i nt e r f a c e dev i c es:t he knob on t he f r ont pa nel,t he t ouc hs c r ee n,t he opt i ona l m ous e,a nd t he opt i ona l key boa r d.The knob on t he f r ont pa nel i s us ed t o m ov e t he c ur s or on c er t a i n m enus,i nc r em ent or de c r em ent num e r i c f i e l ds,a nd t o r ol l t he di s pl a y.The t ouc hs c r e en f i e l ds c a n be s el ec t e d by t ouc h or wi t h t he opt i ona l m ous eor key boa r d.To a c t i v a t e a f i e l d by t ouc h,pr es s t he da r k bl ue f i e l d on t hedi s pl a y wi t h your f i ng er unt i l t he f i el d c ha ng es c ol or.Then m ov e your f i nge ra wa y f r om t he s c r een t o a c t i v a t e y our s el ec t i on.You ha v e t he opt i on ofdi s a bl i ng t he t ouc hs c r e en wi t h t he f r ont-pa ne l Touc h On/Of f but t on.See Also The "Sy s t e m Opt i ons"pa r t f or m or e i nf or m a t i on on us i ng t he opt i ona lke yboa r d a nd m ous e.Scr een C ont r as t and Br i ght nes sSc r een c ont r a s t a nd br i ght nes s a r e a dj us t ed by t ur ni ng t he t wo s m a l l knobsl oc a t ed be nea t h t he Touc h Sc r ee n but t on.The l e f t knob i s f or br i ght nes s a ndt he r i ght knob i s f or c ont r a s t.D ef aul t Conf i gur at i onsW hen t he i ns t r um e nt i s power ed up,pr edet er m i ned v a l ue s a r e a ut om a t i c a l l ya s s i gned t o t he di f f er ent f i e l ds of t he m e nus t o c onf i gur e t he i ns t r um ent f orba s i c m ea s ur em ent s.Thi s a l l ows y ou t o m a ke a ba s i c m ea s ur e m ent byt ur ni ng on t he i ns t r um ent,c onnec t i ng t he pr obes,a nd t ouc hi ng t he Runf i el d.Of t en,onl y m i nor c ha nges a r e ne eded f or m or e c om pl e x m ea s ur e m ent s.St or i ng D ef aul t C onf i gur at i onsThe def a ul t c onf i gur a t i ons m a y be s t or e d on a di s k f or l a t er us e or r es et byc yc l i ng t he power.St or i ng de f a ul t c onf i g ur a t i ons on a di s k i s a c onv eni entwa y t o r et ur n t o t he def a ul t v a l ue s wi t hout c yc l i ng t he power.Def a ul t v a l uesf or ea c h m odul e c a n be s t or e d s epa r a t el y or t oget her i n one f i l e.See Also The "Us i ng t he Di s k Dr i v e M e nus"c ha pt er f or m or e i nf or m a t i on on t he St or e ope r a t i on.1–4What is the HP 16500B Logic Analysis SystemAccessories SuppliedAcces s or i es Suppl i edThe f ol l owi ng l i s t of a c c es s or i es i s s uppl i e d wi t h t he HP 16500B Logi cAna l y s i s Sys t em.I f a ny a c c es s or y i s m i s s i ng,c ont a c t your l oc a l s a l es of f i c e. Accessories Supplied QtyTraining Kit1User’s Reference Guide1Programming Reference Guide1Service Guide1Setting Up the System Guide1RS-232C Loopback Connector1Power Cord1Disk pouch containing composite software1Feeling Comfortable With Logic Analyzers guide1Feeling Comfortable with Digitizing Oscilloscopes guide1Filler Panels**Quant i t y depends on how m any m odul es ar e or der ed w i t h t he HP 16500B/16501AAcces s or i es Avai l abl eOt her a c c es s or i es a v a i l a bl e f or t he HP 16500B/16501A Logi c Ana l y s i s Sys t em a r e l i s t ed i n t he Ac c e s s or i e s f or HP Logi c Anal yze r s br oc hur e.1–51–62The Sys t em Conf i gur at i on M enuThe Sys t em Conf i gur at i on M enuThe Sys t em Conf i gur a t i on m enu i s t he f i r s t m enu you s ee a f t er t hei ni t i a l power-up of t he i ns t r um ent.Thi s m enu l i s t s t he m odul es a nds of t wa r e opt i ons t ha t your s y s t em i s c onf i g ur ed wi t h a nd s howswhet her t her e a r e f i v e c a r d s l ot s(t he HP 16500B a l one)or t en c a r ds l ot s(t he HP 16500B wi t h t he opt i ona l HP 16501A a t t a c hed)a v a i l a bl e.I t a l s o s hows i f ei t her t he opt i ona l m ous e or keyboa r d i sc onnec t ed.I f a m ous e i s c onnec t e d,t he s ys t e m c onf i gur a t i on m enui ndi c a t es whet her t he m ous e i s c onnec t e d di r ec t l y t o t he HP 16500Bor t o a keyboa r d c onnec t ed t o t he m a i nf r a m e.Fi na l l y,t he s ys t e mc onf i gur a t i on m e nu g i v es you a c c e s s t o t he c onf i gur a t i on of t he HP-I B, RS-232C,a nd opt i ona l LAN i nte rf a c es.2–2The System Configuration Menu M enu M apThe f ol l owi ng m e nu m a p i l l us t r a t e s a l l f i el ds a nd a v a i l a bl e opt i ons i nt he Sys t em Conf i g ur a t i on m enu.The m enu m a p wi l l hel p you ge t a nov er v i ew a s wel l a s pr ov i de you wi t h a qui c k r ef er e nc e of wha t t heSys t e m Conf i gur a t i on m enu c ont a i ns.System Configuration Menu Map2–3G et t i ng i nt o t he Sys t em Conf i gur at i on M enusI n t he upper -l ef t c or ne r of t he m enu a r e t wo f i e l ds t ha t i ndi c a t e t he c ur r ent m enu a nd m odul e. The f i e l d t o t he e xt r em e l ef t (Sys t em ) s hows you whi c h m odul e y ou’r e i n a nd t he one t o t he r i g ht of t he m odul e f i el d (Conf i gur a t i on)s hows you wha t m enu wi t hi n t he m odul e y ou’v e a c c es s ed.To a c c e s s t he Sy s t e m Conf i gur a t i on m enu, f ol l ow t hes e s t eps :1I f t he m odul e f i el d i n t he upper -l ef t cor ner of t he s c r een doe s notdi s pl ay "Sys t em ," s el ect t hi s f i e l d and w he n t he pop-up appe ar s , s el ect System. Thi s w i l l g et y ou i nt o one of t he Sy s t em m enus .2I f t he m odul e f i el d i n t he upper -l ef t cor ner of t he s c r een di s pl ay s "Sy s t em ," but t he m enu f i el d t o t he r i ght of Sys t em doe s n’t di s pl ay "Conf i gur at i on," s el ect t hi s f i el d. W hen t he pop-up appear s , s e l ec t Configuration t o di s pl ay t he Sys t e m Conf i gur at i on m enu.Module and Menu FieldsThe System Configuration Menu Getting into the System Configuration Menus2–4The System Configuration MenuLayout of the System Configuration MenusLayout of t he Sys t em Conf i gur at i on M enusThe f i g ur e bel ow s hows t he l a yout of t he Sys t em Conf i g ur a t i on m e nu f or t he HP 16500B.The f i g ur e i s l a bel l ed wi t h t he m a j or f e a t ur es a nd f unc t i ons oft he m enu.ModuleModuleModuleModuleModuleSystem Configuration Menu2–5The System Configuration MenuSlot DesignatorsSl ot D es i gnat or sThe s l ot des i gna t or s a r e l i s t ed a s A t hr ough E f or t he HP 16500B a l one,or A t hr ough J f or t he HP 16500B wi t h t he HP 16501A a t t a c hed.The s l otdes i gna t or s a r e di s pl a yed t o t he l ef t of t he l i s t of c a r ds f or t he s y s t e m a nd i ndi c a t e t he l oc a t i ons or s l ot s f or e a c h c a r d.W he n you s el ec t t he M odul ef i el d,a pop-up a ppe a r s.The l et t e r s a f t er t he na m e of ea c h m odul e i ndi c a t e t he l oc a t i on of ea c h “m a s t e r”c a r d f or t ha t m odul e.Slot Designators in Master Frame2–63Conf i gur i ng t heH P-I B and RS-232CThe H P-I B and RS-232C I nt er f acesThi s c ha pt e r des c r i bes t he c ont r ol l er a nd pr i nt e r i nt er f a c e s a nd t hei r c onf i gur a t i ons.I t de f i ne s t he HP-I B i nt er f a c e a nd des c r i bes how t os e l ec t a ny one of t he 31 di f f er e nt HP-I B a ddr e s s es a v a i l a bl e.I t a l s o def i nes t he RS-232C i nt e r f a c e a nd t el l s y ou how t o s el ec t a ba ud r a t e, how t o c ha nge t he s t op bi t s,how t o s et t he pa r i t y a nd da t a bi t s,a nd how t o c ha nge t he pr ot oc ol.Controller and Printer Configuration3–2Configuring the HP-IB and RS-232C The C ont r ol l er I nt er f aceThe HP 16500B i s e qui pped wi t h a s t a nda r d RS-232C i nt er f a c e a nd a n HP-I B i nt er f a c e t ha t a l l ow you t o c onne c t t o a c ont r ol l er.Thi s gi v e s you r em ot e a c c e s s f or r unni ng m ea s ur em ent s,f or upl oa di ng a nd downl oa di ng c onf i g ur a t i ons a nd da t a,f or pr i nt i ng,a nd m or e.Thec ont r ol l er i nt er f a c e i s e xpl a i ned i n m ore det a i l i n t heHP 16500B/16501A Pr ogr am m er’s Gui de.The Pr i nt er I nt er f aceThe HP 16500B c a n out put i t s s c r een di s pl a y t o v a r i ous HP-I B a ndRS-232C g r a phi c s pr i nt e r s.Conf i gur ed m enus,wa v ef or m s,a nd ot her da t a c a n be pr i nt ed f or c om pl et e m ea s ur em ent doc um ent a t i on.Thepr i nt er i nt er f a c e i s e xpl a i ned i n m or e det a i l i n c ha pt er"Connec t i ng a Pr i nt er."3–3Conf i gur i ng t he H P-I B I nt er f aceThe Hewl e t t -Pac ka r d I nt er f a c e Bus (HP-I B) i s Hewl et t -Pa c ka r d’si m pl em ent a t i on of I EEE St a nda r d 488-1978, “St a nda r d Di gi t a l I nt er f a c e f orPr ogr a m m a bl e I ns t r um e nt a t i on.” The HP-I B i s a c a r ef ul l y de f i ned i nt er f a c et ha t s i m pl i f i es t he i nt eg r a t i on of v a r i ous i ns t r um e nt s a nd c om put er s i nt os ys t em s . I t us es a n a ddr es s i ng t ec hni que t o ens ur e t ha t ea c h de v i c e on t hebus (i nt e r c onnec t ed by HP-I B c a bl es ) r ec ei v es onl y t he da t a i nt ende d f or i t .To a c c om pl i s h t hi s , ea c h dev i c e i s s et t o a di f f er ent a ddr es s a nd t hi s a ddr es si s us ed t o c om m uni c a t e wi t h ot her de v i c es on t he bus .Sel ect i ng an H P-I B A ddr es sThe HP-I B a ddr es s c a n be s et t o 31 di f f er ent HP-I B a ddr es s es , f r om 0 t o 30.Si m pl y c hoos e a n a ddr es s t ha t i s c om pa t i bl e wi t h your dev i c e or s of t wa r e.The def a ul t i s 7.1Sel e ct t he Communications f i el d.2Us i ng t he knob or keypad, e nt er a n HP-I B addr es s i n t he f i el d di r ect l yunder "HP-I B Addr es s ."To us e t he keypa d, s el e c t t he HP-IB Address f i el d a nd a pop-up keypa d wi l la ppea r . Then, e nt er t he a ddr es s a nd s el ec t Done .3W hen you a r e f i ni s hed conf i gur i ng t he HP-I B Addr e s s , s e l ec t Done .Communications Configuration pop-up MenuConfiguring the HP-IB and RS-232CConfiguring the HP-IB Interface3–4Conf i gur i ng t he RS-232C I nt er f aceThe RS-232C i nt er f a c e on t hi s i ns t r um ent i s He wl et t -Pac ka r d’si m pl em ent a t i on of EI A Rec om m ende d St a nda r d RS-232C, “I nt e r f a c e Bet weenDa t a Ter m i na l Equi pm ent a nd Da t a Com m uni c a t i ons Equi pm ent Em pl oy i ngSer i a l Bi na r y Da t a I nt er c ha nge.” Thi s i nt er f a c e s ends da t a one bi t a t a t i m e ,a nd c ha r a c t er s a r e not s y nc hr oni z ed wi t h pr e c edi ng or s ubs equent da t ac ha r a c t e r s . Ea c h c ha r a c t er i s s ent a s a c om pl et e ent i t y wi t hout r el a t i ons hi pt o ot her ev ent s .Baud Rat eThe ba ud r a t e i s t he r a t e a t whi c h bi t s a r e t r a ns f e r r ed bet ween t he i nt er f a c ea nd t he per i pher a l . The ba ud r a t e m us t be s et t o t r a ns m i t a nd r e c ei v e a t t hes a m e r a t e a s t he pe r i pher a l , or da t a c a nnot be s uc c es s f ul l y t r a ns f er r ed.1Sel e ct t he Communications f i el d.2Sel e ct t he RS-232C f i el d l oca t e d di r ect l y under t he HP-I B Addr es s f i el d.3W hen t he pop-up m e nu appear s , s e l ec t t he f i el d di r ect l y t o t he r i ght of“Baud Rat e.”RS-232C ConfigurationConfiguring the HP-IB and RS-232C Configuring the RS-232C Interface3–54W hen t he s e c ond pop-up a ppe a r s , s el ec t t he ba ud r a t e you wa nt f r om t he l i s tdi s pl a yed i n t he pop-up (110 t o 19.2k) a nd t he pop-up wi l l di s a ppea r .St op Bi t sSt op bi t s a r e us ed t o i dent i f y t he e nd of a c ha r a c t e r . The num ber of s t op bi t sm us t be t he s a m e f or t he c ont r ol l er a s f or t he Logi c Ana l ys i s Sys t em.1Sel e ct t he Communications f i el d.2Sel e ct t he RS-232C f i el d l oca t e d di r ect l y under t he HP-I B Addr es s f i el d.3Sel e ct t he f i el d di r ect l y t o t he r i ght of “St op Bi t s ” i n t he RS-232CConf i gur a t i on pop-up m enu.4W hen t he new pop-up appe ar s , s el ect 1, 1.5, or 2 s t op bi t s t o i dent i f yt he e nd of t he char ac t e r . The pop-up di s appear s , pl aci ng yours el e ct i on i n t he appr opr i at e f i e l d.Par i t yThe pa r i t y bi t det ec t s er r or s a s i nc om i ng c ha r a c t er s a r e r e c ei v ed. I f t hepa r i t y bi t doe s not m a t c h t he e xpe c t ed v a l ue, t he c ha r a c t er i s a s s um ed t o bei nc or r ec t l y r ec e i v ed. The a c t i on t a ken when a n er r or i s det e c t ed depends onhow t he i nt e r f a c e a nd t he de v i c e pr ogr a m a r e c onf i gur ed.Par i t y i s det e r m i ned by t he r equi r em ent s of t he s ys t em. The pa r i t y bi t m a ybe i nc l uded or om i t t ed f r om e a c h c ha r a c t e r by ena bl i ng or di s a bl i ng t hepa r i t y f unc t i on.1Sel e ct t he Communications f i el d.2Sel e ct t he RS-232C f i el d l oca t e d di r ect l y under t he HP-I B Addr es s f i el d.3Sel e ct t he f i el d di r ect l y t o t he r i ght of “Par i t y” i n t he RS-232CConf i gur a t i on m enu.4W hen t he pop-up a ppea r s , s el ect None, Odd , or Even t o m at ch t hepar i t y of t he ext er nal de vi c e. Af t er y ou m ake your s e l ec t i on, t hepop-up di s appear s .Configuring the HP-IB and RS-232C Configuring the RS-232C Interface3–6Pr ot ocolPr ot oc ol gov er ns t he f l ow of da t a bet ween t he i ns t r um ent a nd t he ext e r na ldev i c e .1Sel e ct t he Communications f i el d.2Sel e ct t he RS-232C f i el d l oca t e d di r ect l y under t he HP-I B Addr es s f i el d.3Sel e ct t he f i el d di r ect l y t o t he r i ght of “Pr ot ocol ” i n t he RS-232CConf i gur a t i on pop-up m enu.4W hen t he pop-up a ppea r s , s el ect None or Xon/Xoff .None•W it h l es s t ha n a 5-wi r e i nt er f a c e , s e l ec t i ng None does not a l l ow t he s e ndi ng or r ec e i v i ng dev i c e t o c ont r ol how f a s t t he da t a i s bei ng s ent . Noc ont r ol ov er t he da t a f l ow i nc r ea s es t he pos s i bi l i t y of m i s s i ng da t a ort r a ns f er r i ng i nc om pl et e da t a .•W it h a f ul l 5-wi r e i nt er f a c e, s el ec t i ng None a l l ows a ha r dwa r e ha nds ha ke t o oc c ur . W i t h a ha r dwa r e ha nds ha ke, ha r dwa r e s i gna l s c ont r ol da t a f l ow.The HP 13242G c a bl e a l l ows t he HP 16500B t o s uppor t ha r dwa r eha nds ha ke.Xon/Xoff•Xon/Xof f s t a nds f or Tr a ns m i t On/Tr a ns m i t Of f . W i t h t hi s m ode, t he r ec e i v er c ont r ol s t he da t a f l ow a nd c a n r eques t t ha t t he pr i nt er s t op da t af l ow a t a ny t i m e .5Sel e ct Done .D at a Bi t sDa t a bi t s a r e t he num ber of bi t s s e nt a nd r ec ei v e d per c ha r a c t er t ha tr epr es ent t he bi na r y c ode of t ha t c ha r a c t er . The HP 16500B s uppor t s t he8-bi t bi na r y c ode .Configuring the HP-IB and RS-232C Configuring the RS-232C Interface3–7。
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STAND RVN4057 3.532 X 8 CODEPLUG NO3080385B23 & 5880385B30 MDVN4965 3.59100-WS/T CONFIG KITRVN4053 3.5ASTRO DIGITAL INTERFACE NO3080385B23RVN41842-CD RKN4046A (Portable) 2-3.5ASTRO PORTABLE /MOBILE YES3080369B73 or0180300B10 (Mobile) RVN41831-CD3080369B732-3.5ASTRO SPECTRA MOBILE YES(Low / Mid Power)0180300B10 (High Power) RVN4185CD ASTRO SPECTRA PLUS MOBILE NO MANY OPTIONS; SEESERVICE BRIEF#SB-MO-0101RVN4186CD ASTRO SPECTRA PLUS MANY OPTIONS;MOBILE/PORTABLE COMB SEE SERVICE BRIEF#SB-MO-0101RVN4154 3.5ASTROTAC 3000 COMPAR.3080385B23RVN5003 3.5ASTROTAC COMPARATORS NO3080399E31 Adpt.5880385B34RVN4083 3.5BSC II NO FKN5836ARVN4171 3.5C200RVN4029 3.5CENTRACOM SERIES II NO VARIOUS-SEE MANUAL6881121E49RVN4112 3.5COMMAND PLUS NORVN4149 3.5COMTEGRA YES3082056X02HVN6053CD CT250, 450, 450LS YES AAPMKN4004RVN4079 3.5DESKTRAC CONVENTIONAL YES3080070N01RVN4093 3.5DESKTRAC TRUNKED YES3080070N01RVN4091 3.5DGT 9000 DESKSET YES0180358A22RVN4114 3.5GLOBAL POSITIONING SYS.NO RKN4021AHVN8177 3.5GM/GR300/GR500/GR400M10/M120/130YES3080070N01RVN4159 3.5GP60 SERIES YES PMLN4074AHVN9128 3.5GP300 & GP350RVN4152 3.5GP350 AVSRVN4150 3.5GTX YES HKN9857 (Portable)3080070N01(Mobile) HVN9025CD HT CDM/MTX/EX SERIES YES AARKN4083/AARKN4081RiblessAARKN4075RIBLESS NON-USA RKN4074RVN4098H 3.5HT1000/JT1000-VISAR YES3080371E46(VISAR CONV)RVN4151 3.5HT1000 AVSRVN4098 3.5HT1000/ VISAR CONV’L.YES RKN4035B (HT1000) HVN9084 3.5i750YES HLN-9102ARVN4156 3.5LCS/LTS 2000YES HKN9857(Portable)3080070N01(Mobile) RVN4087 3.5LORAN C LOC. RECV’R.NO RKN4021ARVN4135 3.5M100/M200,M110,M400,R100 includesHVN9173,9177,9646,9774YES3080070N01RVN4023 3.5MARATRAC YES3080070N01RVN4019 3.5MAXTRAC CONVENTIONAL YES3080070N01RVN4139 3.5MAXTRAC LS YES3080070N01RVN4043 3.5MAXTRAC TRK DUPLEX YES3080070N01RVN4178CD MC SERIES, MC2000/2500DDN6124AW/DB25 CONNECTORDDN6367AW/DB9 CONNECTOR RVN41751-CD Rib to MIC connector 1-3.5MCS2000 RKN4062BRVN41131-3.5MCS2000RVN4011 3.5MCX1000YES3000056M01RVN4063 3.5MCX1000 MARINE YES3000056M01RVN4117 3.5MDC/RDLAP DEVICESRVN4105 3.5MOBILE PROG. TOOLRVN4119 3.5MOBITEX DEVICESRVN4128 3.5MPT1327-1200 SERIES YES SEE MANUALRVN4025 3.5MSF5000/PURC/ANALOG YES0180355A30RVN4077 3.5MSF5000/10000FLD YES0180355A30RVN4017K 3.5MT 1000YES RTK4205CRVN4148 3.5MTR 2000YES3082056X02RVN4140 3.5MTRI 2000NORVN41761-CD MTS2000, MT2000*, MTX8000, MTX90001-3.5*programmed by DOS which is included in the RVN4176RVN4131 3.5MTVA CODE PLUG FIXRVN4142 3.5MTVA DOCTOR YES3080070N01RVN4131 3.5MTVA3.EXERVN4013 3.5MTX800 & MTX800S YES RTK4205CRVN4097 1-CD MTX8000/MTX9000,MTS2000,MT2000*,* programmed by DOS which is included in the RVN4176HVN9067CD MTX850/MTX8250MTX950,MTX925RVN4138 3.5MTX-LS YES RKN4035DRVN4035 3.5MX 1000YES RTK4203CRVN4073 3.5MX 800YES RKN4006BHVN9395 P100, P200 LB, P50+, P210, P500, PR3000RVN4134 3.5P100 (HVN9175)P200 LB (HVN9794)P50+ (HVN9395)P210 (HVN9763)P500 (HVN9941)PR3000 (HVN9586)YES RTK4205HVN9852 3.5P110YES HKN9755A/REX1143 HVN9262 3.5P200 UHF/VHF YES RTK4205RVN4129 3.5PDT220YVN4051 3.5PORTABLE REPEATER Portable rptr.P1820/P1821AXRVN4061C 3.5PP 1000/500NO3080385B23 & 5880385B30 RVN5002 3.5QUANTAR/QUANTRO NO3O80369E31RVN4135 3.5R100 (HVN9177)M100/M200/M110/M400YES0180358A52RVN4146 3.5RPM500/660RVN4002 3.5SABER YES RTK4203CRVN4131 3.5SETTLET.EXEHVN9007 3.5SM50 & SM120YESRVN4039 3.5SMART STATUS YES FKN5825AHVN9054 3.5SOFTWARE R03.2 P1225YES3080070N01HVN9001 3.5SOFTWARE R05.00.00 1225LS YES HLN9359AHVN9012 3.5SP50RVN4001N 3.5SPECTRA YES3080369B73 (STANDARD)0180300B10 (HIGH POWER) RVN4099 3.5SPECTRA RAILROAD YES3080369B73RVN4110 3.5STATION ACCESS MODULE NO3080369E31RVN4089A 3.5STX TRANSIT YES0180357A54RVN4051 3.5SYSTEMS SABER YES RTK4203BRVN4075 3.5T5600/T5620 SERIES NO3080385B23HVN9060CD TC3000, TS3000, TR3000RVN4123 3.5VISAR PRIVACY PLUS YES3080371E46FVN4333 3.5VRM 100 TOOLBOX FKN4486A CABLE &ADAPTORRVN4133 3.5VRM 500/600/650/850NORVN4181CD XTS 2500/5000 PORTABLES RKN4105A/RKN4106A RVN41002- 3.5XTS3000 ASTRO PORTABLE/MOBILERVN4170 3.5XTS3500YES RKN4035DRIB SET UPRLN4008E RADIO INTERFACE BOX (RIB)0180357A57RIB AC POWER PACK 120V0180358A56RIB AC POWER PACK 220V3080369B71IBM TO RIB CABLE (25 PIN) (USE WITH XT & PS2)3080369B72IBM TO RIB CABLE (9 PIN)RLN443825 PIN (F) TO 9 PIN (M) ADAPTOR (USE W/3080369B72 FOR AT APPLICATION) 5880385B308 PIN MODULAR TO 25 PIN ”D” ADAPTOR (FOR T5600 ONLY)0180359A29DUPLEX ADAPTOR (MOSTAR/TRAXAR TRNK’D ONLY)Item Disk Radio RIB Cable Number Size Product Required Number Item Disk Radio RIB Cable Number Size Product Required NumberUtilizing your personal computer, Radio Service Software (RSS)/Customer Programming Software (CPS)/CustomerConfiguration Software (CCS) enables you to add or reprogram features/parameters as your requirements change. RSS/CPS/CCS is compatible with IBM XT, AT, PS/2 models 30, 50, 60 and 80.Requires 640K RAM. DOS 3.1 or later. Consult the RSS users guide for the computer configuration and DOS requirements. (ForHT1000, MT/MTS2000, MTX838/8000/9000, Visar and some newer products —IBM model 386, 4 MEG RAM and DOS 5.0 or higher are recommended.) A Radio Interface Box (RIB) may be required as well as the appropriate cables. The RIB and cables must be ordered separately.Licensing:A license is required before a software (RVN) order is placed. The software license is site specific (customer number and ultimate destination tag). All sites/locations must purchase their own software.Be sure to place subsequent orders using the original customer number and ship-to-tag or other licensed sites; ordering software without a licensed customer number and ultimate tag may result in unnecessary delays. To obtain a no charge license agreement kit, order RPX4719. To place an order in the U.S. call 1-800-422-4210. Outside the U.S., FAX 847-576-3023.Subscription Program:The purchase of Radio ServiceSoftware/Customer Programming/Customer ConfigurationSoftware (RVN & HVN kits) entitles the buyer/subscriber to three years of free upgrades. At the end of these three years, the sub-scriber must purchase the same Radio Service Software kit to receive an additional three years of free upgrades. If the sub-scriber does not elect to purchase the same Radio Service Software kit, no upgrades will be sent. Annually a subscription status report is mailed to inform subscribers of the RSS/CPS/CCS items on our database and their expiration dates.Notes:1)A subscription service is offered on “RVN”-Radio Service Software/Customer Programming/Customer Configuration Software kits only.2)“RVN” software must only be procured through Radio Products and Services Division (RPSD). Software not procured through the RPSD will not be recorded on the subscription database; upgrades will not be mailed.3)Upgrades are mailed to the original buyer (customer number & ultimate tag).4)SP software is available through the radio product groups.The Motorola General Radio Service Software Agreement is now available on Motorola Online. If you need assistance please feel free to submit a “Contact Us” or call 800-422-4210.SMART RIB SET UPRLN1015D SMART RIB0180302E27 AC POWER PACK 120V 2580373E86 AC POWER PACK 220V3080390B49SMARTRIB CABLE (9 PIN (F) TO 9 PIN (M) (USE WITH AT)3080390B48SMARTRIB CABLE (25 PIN (F) TO 9 PIN (M) (USE WITH XT)RLN4488ASMART RIB BATTERY PACKWIRELESS DATA GROUP PRODUTS SOFTWARERVN4126 3.59100-386/9100T DEVICES MDVN4965 3.59100-WS/T CONFIG’TN RVN41173.5MDC/RDLAP DEVICESPAGING PRODUCTS MANUALS6881011B54 3.5ADVISOR6881029B90 3.5ADVISOR ELITE 6881023B20 3.5ADVISOR GOLD 6881020B35 3.5ADVISOR PRO FLX 6881032B30 3.5BR8506881032B30 3.5LS3506881032B30 3.5LS5506881032B30 3.5LS7506881033B10 3.5LS9506881035B20 3.5MINITOR III8262947A15 3.5PAGEWRITER 20008262947A15 3.5PAGEWRITER 2000X 6881028B10 3.5TALKABOUT T3406881029B35 3.5TIMEPORT P7308262947A15 3.5TIMEPORT P930NLN3548BUNIVERSAL INTERFACE KITItem Disk Radio NumberSize Product。
Omega LVCN4300级别开关产品说明书
LVCN401
252 24 Vdc relay electronics for LVCN4300 Series, 83 H x 44 W x 111 D mm (3.25 x 1.75 x 4.37")
LVCN402
264 115 Vac relay electronics for LVCN4300 Series, 83 H x 44 W x 111 D mm (3.25 x 1.75 x 4.37")
“-HT” Units: 177°C (350°F) Max Pressure: 290 psi (20 bar) Level Indication: LED Status on/off Protection Class for LVCN400: IP40 LVCN4300:
PTFE: 177°C (350°F) Weight: Sensor 1 kg (2.2 lb) for 24" L
LVCN403
264 230 Vac relay electronics for LVCN4300 Series, 83 H x 44 W x 111 D mm (3.25 x 1.75 x 4.37")
Accessories Model No. TX4-100 PSU-93
Price $35 40
LVCN400: Approx. 227 g (0.5 lb)
K-43
LVCN4321-24-PTFE, $846, shown smaller than actual size.
Recommended Reference Book: Water Wells and Septic Systems Handbook, FW-300, $100
AU680报警列表_翻译
ARIES ARIES-P -Ver.04- 8 0 2 7 9 0 8 1 1 3 7 4 0 产
ISTRUZIONI D'USO E DI INSTALLAZIONE INSTALLATION AND USER'S MANUALINSTRUCTIONS D'UTILISATION ET D'INSTALLATION INSTALLATIONS-UND GEBRAUCHSANLEITUNG INSTRUCCIONES DE USO Y DE INSTALACION INSTRUÇÕES DE USO E DE INSTALAÇÃOCENTRALINA DI COMANDO D811184A ver. 04 08-02-02I CONTROL UNIT GB UNITÉ DE COMMANDE F STEUERZENTRALE D CENTRAL DE MANDO E CENTRAL DO MANDOP ARIES - ARIES P8027908113740a“WARNINGS” leaflet and an “INSTRUCTION MANUAL”.These should both be read carefully as they provide important information about safety, installation, operation and maintenance. This product complies with the recognised technical standards and safety regulations. We declare that this product is in conformity with the following European Directives: 89/336/EEC and 73/23/EEC (and subsequent amendments).1) GENERAL OUTLINEThe ARIES control unit has been designed for swing gates. It can be used for one or two gate controllers.The control unit mod. ARIES P can also be used to perform opening of a single actuator while keeping the other one closed (pedestrian access).2) FUNCTIONSSTOP: In all cases: it stops the gate until a new start command is given.PHOT:Functions can be set with Dip-Switch.Activated during closing.Activated during opening and closing.Rapid closingON: When the position of the gate photocells is exceeded, during both opening and closing, the gate automatically starts to close even if TCA is activated. We recommend setting DIP3 to ON (photocells only activated during closing).Blocks impulsesON: During opening, START commands are not accepted.OFF: During opening, START commands are accepted.PhotocellsON: Photocells only activated during closing.OFF: Photocells activated during opening and closing.Automatic closing time (TCA)ON: Automatic closing activated (can be adjusted from 0 to 90s)Preallarm (mod. ARIES P only)ON: The flashing light turns on abt 3 seconds before the motors start.FOR THE INSTALLER: check the boxes you are interested in.START:four-step logic Gate closedGate openDuring openingDuring closingAfter stop START: two-step logic SCA: Gate open indicating lightit opens it opensit stops and activates TCAit closesit stops and does not activate TCAit starts opening it stops and activats TCA (if activated)it closesit opensit opensoffononflashingATTENTION:Dip non used in mod. ARIES (always in OFF set).3) MAINTENANCE AND DEMOLITIONThe maintenance of the system should only be carried out by qualified personnel regularly. The materials making up the set and its packing must be disposed of according to the regulations in force.Batteries must be properly disposed of.WARNINGSCorrect controller operation is only ensured when the data contained in the present manual are observed. The company is not to be held responsible for any damage resulting from failure to observe the installation standards and the instructions contained in the present manual.The descriptions and illustrations contained in the present manual are not binding. The Company reserves the right to make any alterations deemed appropriate for the technical, manufacturing and commercial improvement of the product, while leaving the essential product features unchanged, at any time and without undertaking to update the present publication.D 811184A _04Thank you for buying this product, our company is sure that you will be more than satisfied with the product ’s performance. The product is supplied with a “WARNINGS ” leaflet and an “INSTRUCTION MANUAL ”.These should both be read carefully as they provide important information about safety, installation, operation and maintenance.This product complies with the recognised technical standards and safety regulations. We declare that this product is in conformity with the following European Directives: 89/336/EEC and 73/23/EEC (and subsequent amendments).1) GENERAL OUTLINEThe ARIES control unit has been designed for swing gates. It can be used for one or two gate controllers.The control unit mod. ARIES P can also be used to perform opening of a single actuator while keeping the other one closed (pedestrian access).2) GENERAL SAFETYWARNING! An incorrect installation or improper use of the product can cause damage to persons, animals or things.•The “Warnings ” leaflet and “Instruction booklet ” supplied with this product should be read carefully as they provide important information about safety, installation, use and maintenance.•Scrap packing materials (plastic, cardboard, polystyrene etc) according to the provisions set out by current standards. Keep nylon or polystyrene bags out of children ’s reach.•Keep the instructions together with the technical brochure for future reference.•This product was exclusively designed and manufactured for the use specified in the present documentation. Any other use not specified in this documentation could damage the product and be dangerous.•The Company declines all responsibility for any consequences resulting from improper use of the product, or use which is different from that expected and specified in the present documentation.•Do not install the product in explosive atmosphere.•The Company declines all responsibility for any consequences resulting from failure to observe Good Technical Practice when constructing closing structures (door, gates etc.), as well as from any deformation which might occur during use.•The installation must comply with the provisions set out by the following European Directives: 89/336/EEC, 73/23/EEC, 98/37/ECC and subsequent amendments.•Disconnect the electrical power supply before carrying out any work on the installation. Also disconnect any buffer batteries, if fitted.•Fit an omnipolar or magnetothermal switch on the mains power supply,having a contact opening distance equal to or greater than 3mm.•Check that a differential switch with a 0.03A threshold is fitted just before the power supply mains.•Check that earthing is carried out correctly: connect all metal parts for closure (doors, gates etc.) and all system components provided with an earth terminal.•The Company declines all responsibility with respect to the automation safety and correct operation when other manufacturers ’ components are used.•Only use original parts for any maintenance or repair operation.•Do not modify the automation components, unless explicitly authorised by the company.•Instruct the product user about the control systems provided and the manual opening operation in case of emergency.•Do not allow persons or children to remain in the automation operation area.•Keep radio control or other control devices out of children ’s reach, in order to avoid unintentional automation activation.•The user must avoid any attempt to carry out work or repair on the automation system, and always request the assistance of qualified personnel.•Anything which is not expressly provided for in the present instructions,is not allowed.3) TECHNICAL SPECIFICATIONSPower supply:...............................................................230V ±10% 50Hz Absorption on empty:.................................................................0.5A max Output power for accessories:..........................................24V~ 6VA max Max relay current:................................................................................8A Max power of motors:...............................................................300 W x 2Torque limiter:.................................................Self-transformer with 4 pos Limit switch:................................................................Adjustable run timePanel dimensions:.........................................................................See fig.1Cabinet protection:............................................................................IP55Working temperature:...............................................................-20 +55°C 4) TERMINAL BOARD CONNECTIONS(Fig.2)CAUTION: Keep the low voltage connections completely separated from the power supply connections.Fig.3 shows the fixing and connection method of the drive condensers whenever they are not fitted to the motor.JP51-2 Single-phase power supply 230V ±10%, 50 Hz (1=L/2=N).For connection to the mains use a multiple-pole cable with a minimum cross section of 3x1.5mm 2 of the type indicated in the above-mentioned standard (by way of example, if the cable is not shielded it must be at least equivalent to H07 RN-F while, if shielded, it must be at least equivalent to H05 VV-F with a cross section of 3x1.5mm 2).JP33-4 (mod.ARIES-P) 230V 40W max. blinker connection.5-6 (mod.ARIES) 230V 40W max. blinker connection.7-8-9 Motor M1 connection - 8 common, 7-9 start.10-11-12 Motor M2(r) connection - 11 common, 10-12 start.JP413-14 Open-close button and key switch (N.O.).13-15 Stop button (N.C.). If unused, leave bridged.13-16 Photocell or pneumatic edge input (N.C.). If unused, leave bridged.17-18 24V 3W max. gate open warning light.18-19 24V~ 0.25A max. (6VA) output (for supplying photocell or other device).20-21 Antenna input for radio-receiver board (20 signal - 21 braid).22 Common terminal (equivalent to terminal 13).23 Terminal for pedestrian control. It moves the leaf of motor M2 connected to terminal 10-11-12. This terminal is available only in ARIES-P control unit.JP225-26 2nd radio channel output of the double-channel receiver board (terminals not fitted on ARIES but fitted on ARIES-P) contact N.O.JP1 Radio-receiver board connector 1-2 channels.5) FUNCTIONSDL1:Power-on LedIt is switched on when the board is electrically powered.START: four-step logic: (DIP5 OFF)gate closed:..................................................................................it opens during opening:............................................... it stops and activates TCA gate open:................................................................................... it closes during closing:.................................... it stops and does not activate TCA after stop:.........................................................................it starts opening START: two-step logic: (DIP5 ON)gate closed:..................................................................................it opens during opening:................................it stops and activats TCA (if activated)gate open:....................................................................................it closes during closing:..............................................................................it opens after stop:.....................................................................................it opens STOP: In all cases: it stops the gate until a new start command is given.PHOT:Functions can be set with DIP-SWITCH.Activated during closing if DIP3-ON.Activated during opening and closing if DIP3-OFF.SCA: Gate open indicating light.with gate closed:...................................................................................off when gate is opening:...........................................................................on with gate open:.......................................................................................on when gate is closing:.....................................................................flashing 6) DIP-SWITCH SELECTION DIP1 Rapid closingON: When the position of the gate photocells is exceeded, during both opening and closing, the gate automatically starts to close even if TCA is activated. We recommend setting DIP3 to ON (photocells only activated during closing).OFF: Function not activated.DIP2 Blocks impulsesON: During opening, START commands are not accepted.OFF: During opening, START commands are accepted.DIP3 PhotocellsON: Photocells only activated during closing.OFF: Photocells activated during opening and closing.D 811184A _04DIP4 Automatic closing time (TCA)ON: Automatic closing activated (can be adjusted from 0 to 90s).OFF: Automatic closing not activated.DIP5 Control logicON: 2-step logic is activated (see start paragraph).OFF: 4-step logic is activated (see start paragraph).DIP6: Preallarm (mod.ARIES P only)ON: The flashing light turns on abt 3 seconds before the motors start.OFF The flashing light turns on simultaneously with the start of the motors.ATTENTION:Dip non used in mod. ARIES (always in OFF set).7) TRIMMER ADJUSTMENTTCA This adjusts the automatic closing time, after which time the gate automatically closes (can be adjusted from 0 to 90s).TW This adjusts the motor working time, after which time the motor stops (can be adjusted from 0 to 40s).TDELAY This adjusts the closing delay time of the second motor (M2).8) MOTOR TORQUE ADJUSTMENTThe ARIES control unit has electric torque adjustment which allows the motor force to be adjusted.The adjustment should be set for the minimum force required to carry out the opening and closing strokes completely.Adjustment is carried out by moving the connection 55 (fig.3) on the tran-sformer sockets as described below:Pos.T1 1st TORQUE (MINIMUM TORQUE)Pos.T2 2nd TORQUE Pos.T3 3rd TORQUEPos.T4 4th TORQUE (MAXIMUM TORQUE)4 motor torque values can be obtained.To gain access to the torque adjustment sockets, disconnect the mains supply and remove the protective case “P ” of the transfomer.CAUTION: Excessive torque adjustment may jeopardise the anti-squash safety function. On the other hand insufficient torque adjustment may not guarantee correct opening or closing strokes.9) MAINTENANCE AND DEMOLITIONThe maintenance of the system should only be carried out by qualified personnel regularly. The materials making up the set and its packing must be disposed of according to the regulations in force.Batteries must be properly disposed of.WARNINGSCorrect controller operation is only ensured when the data contained in the present manual are observed. The company is not to be held responsible for any damage resulting from failure to observe the installation standards and the instructions contained in the present manual.The descriptions and illustrations contained in the present manual are not binding. The Company reserves the right to make any alterations deemed appropriate for the technical, manufacturing and commercial improvement of the product, while leaving the essential product features unchanged, at any time and without undertaking to update the present publication.D811184A_04ARIES/ARIES-P - Ver. 04 -23。
Agilent SPME Fiber or Arrow Manual Injection Kit U
12345SPME Fiber or Arrow Manual Injection KitSPME manual samplingThe Agilent manual injection kit will allow the end user to extract samples using SPME fibers or Arrows. They can then inject the samples into a GC inlet.Manual SPME SamplingSPME fibers and Arrowsp/n 5191-58772PAL3 alignment ring (gray) for split/splitless (S/SL) inletManual injectionManual injection guidePAL3 alignment ring (Gray) for S/SL inlet (G7371-67001)The manual injection guide sits on thealignment ring for manual sample injection.3Methodology—manual samplingInstalling a PDMS SPME (100 μm) Arrow into the manual syringeLoosen the cap at the base of the syringe and remove it.Depress the black plunger completely.Screw the hub of an SPME fiber/Arrow into the bottom of the plunger at the end of thesyringe bodyRetract the black plunger and slide the cap over the SPME fiber/Arrow and tighten itonto the syringe.4The extraction guide has two positions where the syringe can be installed.The upper position is used for headspace extraction.The lower position is used for immersion extraction.Incorrect and correct position of the lower locking screw.Do not tighten the screw against the black plunger or you will not be able to move the SPME fiber/Arrow intoposition for sampling.Setting the locking screwsLarge inner diameter (id) locking screwSmall inner diameter (id) locking screwSlide the locking screws onto the syringe from the plunger side (the right side as shown above).• Install the large id locking screw onto the silver body of the syringe.• Install the small id locking screw onto the wider portion of the black plunger.•Tighten the locking screws until finger-tight. Do not overtighten, as they will be adjusted in later steps.5• Raise the syringe plunger to the fully extended position and insert the syringe and lower locking screw into the upper position of the extraction guide.•Lock the syringe into place by rotating it until the locking screw is positioned in the notch.• Adjust the syringe so that the SPME fiber/Arrow is protruding ~1 cm beyond the inner base of the extraction guide (A).• Tighten the lower locking screw securely.•The tip of the SPME fiber/Arrow will be recessed at least 1 mm in from the end ofthe extraction guide (B).A BSetting the locking screws for septum penetration depthPlace the extraction guide (with syringe in place) on a headspace sampling vial and loosen the upper locking screw.Adjust the SPME fiber/Arrow to the desired exposure depth by moving the black plunger.Choose a depth that ensures that the SPME fiber/Arrow will be in the gas phase.Once the SPME fiber/Arrow is at the proper depth, hold the plunger in place and slide the upper locking screw until it is flush against the top of the silver syringe body. Then tighten the upper locking screw securely.Setting the exposure depth for headspace extraction6Fine depth adjustment for direct immersion extractionAdjusting the injector penetration depthInsert the syringe into the lower position of the extraction guide.1. Manual SPME injection guide2. PAL3 alignment ring (gray) forS/SL inlet (G7371-67001)• Carefully insert the syringe into the injection guide.• Use caution to avoid damaging the SPME fiber/Arrow when threading it through the hole in the base of the injection guide.•Lock the syringe into place by rotating it until the locking screw is positioned in the notch.Penetrate a vial and fully expose the SPME fiber/Arrow within the vial.Adjust the lower locking screw and upper locking screw to obtain the desired exposure depth (to ensureimmersion in the sample liquid).127Setting injector penetration depthWith the appropriate GC-specific adaptor cup on the end of the injection guide, measure the distance from the tip of the SPME fiber/Arrow to the groove inside the adaptor cup.Adjust the desorption depth by screwing the body of the injection guide up or down (maximum depth = 67 mm).Twist the locking ring down until it locks on the body of the injection guide./chemDE.3985648148This information is subject to change without notice.© Agilent Technologies, Inc. 2020 Printed in the USA, March 6, 2020 5994-1732ENInjection onto the GC inletRemove the adapter cup from the injection guide.The adapter cup is placed onto the GC inlet to guide the manual injection.Push the plunger down until the top locking screw is resting on the body of the syringe.The sample is then injected.。
3100Y30I17999CJ产品有限公司3100型号确定目的接线人员，3桡，24VAC电压额定值，
3100Y30I17999CJProducts Unlimited 3100, Definite Purpose Contactors, Pole Configuration 3, 24VACCoil Voltage Rating, 60A Contact Current Rating, PanelRelays, Contactors & Switches>Contactors>Definite Purpose Contactors>DP CONTACTORS, 3 POLE, 20-40FLAContact Arrangement: 3 Form X, 3PST-NO-DMMounting Type:PanelContact Current Rating:60 ACoil Voltage Rating:24 VACPole Configuration:3All DP CONTACTORS, 3 POLE, 20-40FLA (43)FeaturesProduct Type FeaturesMolded YesProduct Category Electromechanical RelaysProduct Type ContactorArc Cover WithProduct Classification Relays - ContactorsModel93Contactor Type Definite PurposeTerminal Configuration Box Lug, Quick ConnectConfiguration FeaturesAuxiliary Switch Contact Arrangement WithoutElectrical CharacteristicsActuating System ACCoil Voltage (Max)24 VACCoil Voltage Rating24 VACCoil Resistance 1.77 ΩContact Switching Voltage (Max)600 VACContact Features3100Y30I17999CJ ACTIVEProducts UnlimitedTE Internal #:8-1611019-5Products Unlimited 3100, Definite Purpose Contactors, PoleConfiguration 3, 24VAC Coil Voltage Rating, 60A Contact CurrentRating, PanelView on >Products Unlimited 3100|Contact FeaturesContact Base Material Silver Cadmium OxidePole Configuration3Contact Current Rating60 AContact Arrangement 3 Form X, 3PST-NO-DMTermination FeaturesCoil Termination6-32 Screw, Quick ConnectMechanical AttachmentMounting Plate WithMounting Type PanelDimensionsWire Size 2.08 – 33.6 mm²Industry StandardsUL Flammability Rating UL 94V-0Agency Approval CSA Certified, SEMKO Certified, ULRecognizedPackaging FeaturesPackaging Method IndividualOtherTorque50 in-lbsProduct ComplianceFor compliance documentation, visit the product page on >EU RoHS Directive 2011/65/EU Compliant with ExemptionsEU ELV Directive 2000/53/EC Not CompliantChina RoHS 2 Directive MIIT Order No 32, 2016Restricted Materials Above ThresholdEU REACH Regulation (EC) No. 1907/2006Current ECHA Candidate List: JUN 2020(209)Candidate List Declared Against: JUN 2018(191)Cadmium oxide (.12%)Article Safe Usage Statements:Use personal protective equipment as required. Do not eat, drink or smoke whenusing this product. Recycle if possible and dispose of the article by following allapplicable governmental regulations relevant to your geographic location. Halogen Content Not Yet Reviewed for halogen content Solder Process Capability Not applicable for solder process capabilityProduct Compliance DisclaimerThis information is provided based on reasonable inquiry of our suppliers and represents our current actual knowledge based on the information they provided. This information is subject to change. The part numbers that TE has identified as EU RoHS compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, mercury, PBB, PBDE, DBP, BBP, DEHP, DIBP, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2011/65/EU (RoHS2). Finished electrical and electronic equipment products will be CE marked as required by Directive 2011/65/EU. Components may not be CE marked.Additionally, the part numbers that TE has identified as EU ELV compliant have a maximum concentration of 0.1% by weight in homogenous materials for lead, hexavalent chromium, and mercury, and 0.01% for cadmium, or qualify for an exemption to these limits as defined in the Annexes of Directive 2000/53/EC (ELV). Regarding the REACH Regulations, TE’s information on SVHC in articles for this part number is still based on the European Chemical Agency (ECHA) ‘Guidance on requirements forsubstances in articles’(Version: 2, April 2011), applying the 0.1% weight on weight concentration threshold at the finished product level. TE is aware of the European Court of Justice ruling of September 10th, 2015 also known as O5A (Once An Article Always An Article) stating that, in case of ‘complex object’, the threshold for a SVHC must be applied to both the product as a whole and simultaneously to each of the articles forming part of its composition. TE has evaluated this ruling based on the new ECHA “Guidance on requirements for substances in articles” (June 2017, version 4.0) and will be updating its statements accordingly.TE Model / Part #ZPF000000000036945983-6SE 14-04 SN-LTE Model / Part #1058120-13284 3201 10TE Model / Part #822283-000204K012-3-0TE Model / Part #2-2176370-1RQ 0603 698R 0.1% 10PPM 5K RLDefinite Purpose Contactors(80)TE Model / Part #1611349-134300-332=AUXILIARY SWITCH 1N.TE Model / Part #175022-1PL EX MKII 250 REC 18-14AWG PTBRCompatible PartsAlso in the Series Products Unlimited 3100Customers Also BoughtTE Model / Part #3-1879669-7H4 2K74 0.1% 25PPMTE Model / Part #1-1879336-4CPF 0603 316R 1% 50PPM 1K RLTE Model / Part #YACT20MJ19SNC00100SQUARE FLANGE RECEPTACLETE Model / Part #YACT20MJ19SAC00100SQUARE FLANGE RECEPTACLETE Model / Part #ZPF000000000001199097-0014-16TE Model / Part #ZPF000000000001233097-0165-12DocumentsCAD Files3D PDF3DCustomer View ModelENG_CVM_CVM_8-1611019-5_O.2d_dxf.zipEnglishCustomer View ModelENG_CVM_CVM_8-1611019-5_O.3d_igs.zipEnglishCustomer View ModelENG_CVM_CVM_8-1611019-5_O.3d_stp.zipEnglishBy downloading the CAD file I accept and agree to the of use.Terms and Conditions Datasheets & Catalog PagesIndustrial Relays Quick Reference GuideEnglishModel 93 - 3100 Definite Purpose Contactor 3-pole, 50-60 FLA AC CoilEnglish。
Owon TAO3074、TAO3104、TAO3074A、TAO3104A 四通道数字波形测试仪参
Automatic Measurement
Waveform Math
Waveform Storage Communication Interface
Frequency Counter BAT
Dimension (W x H x D)
TAO3074
TAO3104
全国免费服务热线：4006-909-365 .……..….….……..…..……..…..……..…..……..…..……..…..……..…....…..…..…..…..………………………………………
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TAO3000 Series Four-channel Handheld Digital Storage Oscilloscope
1MΩ ± 2%, in parallel with 15pF ± 5pF
1MΩ ≤ 300Vrms;
0.001X - 1000X, step by 1 - 2 - 5
±10ppm
DC, AC, GND
1mV/div - 10V/div (at input) Edge, Video, Pulse, Slope, Runt, Windows, Timeout, Nth Edge, Logic, I2C, SPI, RS232,
TAO3074A
TAO3104A
70MHz
100MHz
70MHz
100MHz
1GS/s
8 bits
8bits/12bits/14 bits
40M
45,000 wfms/s
2ns/div - 1000s/div, step by 1 - 2 - 5
JBL MRX525 音频系统说明书
JBL Incorporated, 8500 Balboa Boulevard, P .O.Box 2200, Northridge, California 91329 U.S.A.J B L M R X 525 R E V HPACKAGE WIRING DIAGRAM03-12T echnical ManualJBL MRX525SPECIFICATIONSACOUSTIC & ELECTRICAL SPECIFICATIONS:•Nominal Impedance: 4 Ohms •Power Capacity:800W / 1600W / 3200W, 2 hrs.(Cont/ Prog/Peak):700W / 1400W / 2800W, 100 hrs • Frequency Range:40 Hz - 20 kHz (-10 dB)•Frequency Response:57 Hz – 20 kHz (±3 dB) •Maximum SPL:129 dB SPL continuous (135 dB SPL peak)•System Sensitivity:100 dB SPL (1 watt @ 1 meter)•Crossover Frequency:1.8 kHzSYSTEM COMPONENTS:•Cabinet:Enclosure (Not for Sale)•Grille:362524-001•Low Frequency 265H-1, 380 mm (15 in) Differential Transducer:Drive woofer •DC Resistance: 5.0 ohm ±10%•High Frequency 2408H, 37.5 mm (1.5 in) annularTransducer:polymer diaphragm, neodymium compression driver•DC Resistance:4.8 ohm +/- 0.2 ohmSYSTEM COMPONENTS:(CONT’D) • Crossover Network:364969-001AURAL SWEEP TEST SPECIFICATIONS:A.System Aural Sweep T est:7.0V Input, 50 Hz to 20 kHzB.L.F .Aural Sweep Test:7.0V Input, 10 Hz to 300 HzC.H.F .Aural Sweep Test:0.75V Input, 200 Hz to 1.5 kHz PHYSICAL SPECIFICATIONS:•Enclosure Dimensions:1240 x 535 x 460 mm D (H x W x D)(48.75 x 21.0 x 18.0 in D)•Net Weight (ea):84.0 lb (38.2 kg)WARRANTY INFORMATION:•Refer to Warranty Statement packed with each product.Warranty 59660Manual362053-001Carton362293-001Fillers (2)362294-002Pkg, Microfoam (8) 49790PPop Sticker 362896-001NETWORK SCHEMATIC - (364969-001)Driver, High Freq 2408H(361549-001X) Driver Repl D8R2408Driver,Low Freq (2)265H(362048-001X)Cone Repl C8R265 265H-1 (2)(363837-003X)Cone Repl C8R265-1Network Assembly 364969-001YEL YEL/BLKGRN GRN/BLKWH/BLK WH NOTE:INDIVIDUAL PARTS FOR THE ABOVE CROSSOVER ARE NOT AVAILABLE.A COMPLETE REPLACEMENT ASSEMBL Y SHOULD BE ORDERED.JBL MRX525804-11110-1610-32 x 1, FLT, PH,BLK OXIDE, LCSNetwork, Input364969-001Screw (6)882-41110-106 x 5/8, PAN, PH,BLK ZINC, LCSNameplate 362051-001Grille Assembly w/ Screen362524-001 Screw (26)882-51110-12Foot (4)353445-001Screw (4)884-41110-1210 x 3/4, PAN, PH,PB, BLK ZINC, LCSDriver, Low Freq (2)265H(362048-001X)Cone ReplC8R265265H-1(363837-003X)Cone ReplC8R265-1Network, Input362292-001Screw (2)882-41110-106 x 5/8, PAN, PH,BLK ZINC, LCS。
Engineered O-Rings Catalog ORD 5710 美国Parker O-Rin
Engineered O-Rings Catalog ORD 5710 USASimple solutionsfor complex sealing problemsIn the O-Ring Division’s monitoring each step of the process Finite element analysisElement Analysistion process and ensures theselection of the right materialand geometry for a customer’sapplication. As an addedbenefit, FEAused to predict service life.a simple interfacespecific glands and seals. Itversions of these books, availableas ORD 5703 (US) and 5705(Europe), provide engineersfor static and dynamic seals,with world productionamounting tobillions per year.In 1937,Niels A. Christensen, aDanish emigrant to the USA,was awarded a patent for thisring with the perfectgeometricalshape.In 1949,Parker O-ring materialsled to the aeronautical specifica-tion MIL-P-5515 B and to the dimensionalstandards MS 29512 and 513, which werebased on Parker O-rings. Since then, theO-ring has become a vital sealingelement in all kinds of fluidpower equipment.advice from Parker sealing experts isnever far away.Parker O-Ring division’s manufacturing facilities span 4 continents and 9countries. Some of these The division’s North American headquarters, located in Lexington KY , isApplicationsTransportation•Brakes/ABS•Cooling/air conditioning •Fuel and diesel injection, spark plugs•Quick connects, couplings, gear units•Shock absorbers •Steering systems•Transmissions and radiator sealsAerospace•Aircraft engines, wheels and brakes•Control and actuation systems•Fuel systems•Space shuttle launch vehiclesMedical•Dyalizers•Syringes, infusions•USP Class VI and FDA “White Listed” formulations are availableSemiconductor Processing•For wet, dry and thermal processes•Parker UHP Processing:Parker uses totally enclosed and dedicated manufacturing areas for compounding,preparation, molding, cleaning and final packaging of o-rings in critical compounds for semiconductor processing applicationsFluid Power•Accumulators •Cylinders, valves •Filters •Fittings •Pumps•Rotary actuatorsConsumer Products•Appliances•Compounds meeting the requirements/recommen-dations: FDA, NSF, WRC,DVGW, BGA, KTW •Heating/plumbing •Sanitary equipmentChemical Processing Industry (CPI)•Equipment and components requiring extremely high chemical inertness attemperatures up to +320°CEnergy/Oil Field•Drilling•Exploration •Production •TransportationParker O-rings are used in many applications and industries, including:1-800-C-Parker Parker O-Ring Division Worldwide LocationsNorth AmericaUSAParker Hannifin CorporationO-Ring Division2360 Palumbo Drive Lexington, KY 40509 Phone: (859) 269-2351Fax: (859) 335-5128 Parker Hannifin CorporationO-Ring Division104 Hartmann Drive Lebanon, TN 37087Phone: (615) 444-0191Fax: (615) 449-7312 Parker Hannifin CorporationO-Ring Division109 Industrial Park Drive Livingston, TN 38570 CanadaParker Hannifin CorporationO-Ring Division255 Hughes RoadOrillia, Ontario L3V 2M3 Phone: (705) 325-2391Fax: (705) 325-5721 MexicoParker Hannifin CorporationO-Ring DivisionPSDM Business Unit Diagonal Lorenzo de la Garza #13 Ciudad IndustrialH. Matamoros, Tam. 87490 Parker Hannifin CorporationO-Ring DivisionBRCO Business UnitCalle Sexta Y Vizcaya #95 Col. EuzkadiH. Matamoros, Tam. 87370 EuropeAustriaSee GermanyBelgiumParker Hannifin SA NVParc Industriel Sud, Zone II 15, Rue du Bosquet1400 NivellesPhone:+(32) 67-28 09 00 Fax:+(32) 67-28 09 99 Czech RepublicParker Hannifin s.r.o. Podebradská 100528912 SadskáPhone: +(420) 325-55 5111 Fax: +(420) 325-55 5112 DenmarkPolar Seals A/S Bjergvangen 23060 EspergærdePhone: +(45) 49 12 17 00 Fax: +(45) 49 12 17 01FinlandParker Hannifin OyYlastontie 16FIN-01510 VantaaPhone: +(358) 9-47 67 31Fax: +(358) 9-47 67 32 00FranceParker Hannifin RakZ.l. du Mont-BlancB.P. 482, Ville-la-Grand74108 Annemasse-CédexPhone: +(33) 4-50 87 80 80Fax: +(33) 4-50 87 80 76GermanyParker Hannifin GmbHO-Ring DivisionStuifenstr. 55D-74385 PleidelsheimPhone:+(49) 71 44-206-0Fax: +(49) 71 44-2 37 49HungaryParker Hannifin CorporationBudapest Representation OfficeVezer u. 156-1581148 BudapestPhone: +(36) 1-2 52 81 37Fax: +(36) 1-2 52 81 29IrelandSee United KingdomItalyParker Seals S.p.A.Via Marzaghette 2I-25030, Adro (BS)Phone: +(39) 030 754 811Fax: +(39) 030 745 8210Parker Hannifin S.p.A.Via Priv. Archimede, 120094 Corsico (Mi)Phone: +(39) 02-4 51 92-1Fax: +(39) 02-4 47 93 40NetherlandsParker Hannifin B.V.Edisonstraat 1P.O. Box 3407570 AH OldenzaalPhone: +(31) 541-58 50 00Fax: +(31) 541-58 54 59NorwayParker Hannifin A/SBerghagenP.O. Box 3008N-1402 SkiPhone: +(47) 64 91 10 00Fax: +(47) 64 91 10 90PolandParker Hannifin Sp. z.o.o.ul. Parowcowa 8B02-445 WarsawPhone: +(48) 22-8 63 49 42/43Fax: +(48) 22-8 63 49 44RussiaParker Hannifin CorporationKomsomolsky Prospect 42Office 407119827 GSP Moscow G-48Phone: +(7) 095-234 0054Fax: +(7) 095-242 0907Slovakiasee Czech RepublicSwedenParker Hannifin Sweden ABBox 831416308 SpangaPhone: +(46) 8-7 60 29 60Fax: +(46) 8-7 61 81 70SwitzerlandSee GermanySpainParker Hannifin Espana S.A.Paseo Cordellas, 5708290 Cerdanyola-del-Valles(Barcelona)Phone: +(34) 93-6 91 50 62Fax: +(34) 93-6 91 46 19United KingdomParker Hannifin plcSeal GroupParkway, Globe ParkMarlow, Bucks SL7 1YBPhone: +(44) 16 28-40 40 88Fax: +(44) 16 28-40 40 89Asia PacificAustraliaParker Hannifin Australia Pty. Ltd.9 Carrington Road2154 (NSW) Castle HillPhone: +(61) 2-96 34 77 77Fax: +(61) 2-98 42 51 11ChinaParker HannifinFluid Power Systems(Shanghai) Co., Ltd.280 Yun Qiao RoadJian Qiao Export Processing ZoneShanghai 201206Phone: +(86) 21-5031 2525Fax: +(86) 21-5834 3714Parker Asun Sealing CompanyNo. 26 Tian Bao RoadTian Bao Industrial ZoneDong Guan CityGuang Dong, P.R.O.C.Hong KongParker Hannifin Hong Kong Ltd.8/F Kin Yip Plaza9 Cheung Y ee StreetCheung Sha Wan, KowloonPhone: +(852) 24 28 80 08Fax: +(852) 24 80 42 56JapanParker Hannifin Japan Ltd.Osaka Sales OfficeNo. 2 Tani Bldg.1-4-25, Nishi-Miyahara,Yodogawa-KuPhone: +(81) 6-48 07-32 88Fax: +(81) 6-48 07-32 99KoreaParker Hannifin Korea Ltd.902 Dae Heung Bldg.648-23 Yeaksam-dongKangnam-Ku, Seoul 135-080Phone: +(82) 2-5 61 04 14Fax: +(82) 2-5 56 81 87SingaporeParker Hannifin Singapore Pte., Ltd.No. 11 Fourth Chin Bee RoadJurong Town 61 9702Phone: +(65) 261 5233Fax: +(65) 265 5125TaiwanParker Hannifin Taiwan, Ltd.8F-1, No 102 Sung Lung RoadTaipeiPhone: +(886) 2 8787 3780Fax: +(886) 2 8787 3782AfricaParker Hannifin Africa Pty. Ltd.Parker Place10 Berne AvenueAeroportKempton Park, South AfricaPhone: +(27) 11-3 92 72 80Fax: +(27) 11-3 92 72 13Latin AmericaArgentinaParker Hannifin Argentina SAICStephenson 27111667 Tortuguitas - Malvinas Arg.Buenos AiresPhone: +(54) 1-1 47 52-41 29Fax: +(54) 1-1 47 52-37 04BrazilParker Hannifin do BrasilIndustria e Comercia Ltda.Via Anhanguera, Km 25,305275 Sao Paulo / SPPhone: +(55) 11-39 17-10 99Fax: +(55) 11-39 17-08 17Continental HeadquartersManufacturing plants1/2-2.5M-CE。
MMSZ4xxxT1G系列和SZMMSZ4xxxT1G系列零点电阻电源器件的商品说明书
MMSZ4686T1G MMSZ4686T1G.MMSZ4xxxT1G Series, SZMMSZ4xxxT1G Series Zener Voltage Regulators 500 mW, Low I ZT SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 1.8 V to 43 V•Low Reverse Current (I ZT) − 50 m A•Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications•ESD Rating of Class 3 (>16 kV) per Human Body Model•SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These Devices are Pb−Free and are RoHS Compliant*Mechanical Characteristics:CASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSRating Symbol Max Units Total Power Dissipation on FR−5 Board,(Note 1) @ T L = 75°CDerated above 75°C P D5006.7mWmW/°CThermal Resistance, (Note 2) Junction−to−Ambient R q JA340°C/WThermal Resistance, (Note 2) Junction−to−Lead R q JL150°C/WJunction and Storage Temperature Range T J, T stg−55 to+150°CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.Cathode AnodeSee specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONSOD−123CASE 425STYLE 1Device Package Shipping†ORDERING INFORMATIONMARKING DIAGRAM†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.MMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & Reel xx= Device Code (Refer to page 3)M= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)1SZMMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelSZMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & ReelELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Symbol ParameterV Z Reverse Zener Voltage @ I ZTI ZT Reverse CurrentI R Reverse Leakage Current @ V RVR Reverse VoltageI F Forward CurrentV F Forward Voltage @ I FProduct parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Device*DeviceMarkingZener Voltage (Note 3)Leakage CurrentV Z (Volts)@ I ZT I R @ V RMin Nom Max m A m A VoltsMMSZ4678T1G CC 1.71 1.8 1.89507.51 MMSZ4679T1G CD 1.90 2.0 2.105051 MMSZ4680T1G CE 2.09 2.2 2.315041 MMSZ4681T1G CF 2.28 2.4 2.525021 MMSZ4682T1G CH 2.565 2.7 2.8355011 MMSZ4683T1G CJ 2.85 3.0 3.15500.81 MMSZ4684T1G CK 3.13 3.3 3.47507.5 1.5 MMSZ4685T1G CM 3.42 3.6 3.78507.52 MMSZ4686T1G CN 3.70 3.9 4.105052 MMSZ4687T1G CP 4.09 4.3 4.525042 SZMMSZ4687T1G CG6 4.09 4.3 4.525042 MMSZ4688T1G CT 4.47 4.7 4.9450103 MMSZ4689T1G CU 4.85 5.1 5.3650103 MMSZ4690T1G/T3G CV 5.32 5.6 5.8850104 MMSZ4691T1G CA 5.89 6.2 6.5150105 MMSZ4692T1G CX 6.46 6.87.145010 5.1 MMSZ4693T1G CY7.137.57.885010 5.7 MMSZ4694T1G CZ7.798.28.61501 6.2 MMSZ4695T1G DC8.278.79.14501 6.6 MMSZ4696T1G DD8.659.19.56501 6.9 MMSZ4697T1G DE9.501010.505017.6 MMSZ4698T1G DF10.451111.55500.058.4 MMSZ4699T1G DH11.401212.60500.059.1 MMSZ4700T1G DJ12.351313.65500.059.8 MMSZ4701T1G DK13.301414.70500.0510.6 MMSZ4702T1G DM14.251515.75500.0511.4 MMSZ4703T1G†DN15.201616.80500.0512.1 MMSZ4704T1G DP16.151717.85500.0512.9 MMSZ4705T1G DT17.101818.90500.0513.6 MMSZ4706T1G DU18.051919.95500.0514.4 MMSZ4707T1G DV19.002021.00500.0115.2 MMSZ4708T1G DA20.902223.10500.0116.7 MMSZ4709T1G DX22.802425.20500.0118.2 MMSZ4710T1G DY23.752526.25500.0119.0 MMSZ4711T1G†EA25.652728.35500.0120.4 MMSZ4712T1G EC26.602829.40500.0121.2 MMSZ4713T1G ED28.503031.50500.0122.8 MMSZ4714T1G EE31.353334.65500.0125.0 MMSZ4715T1G EF34.203637.80500.0127.3 MMSZ4716T1G EH37.053940.95500.0129.6 MMSZ4717T1G EJ40.854345.15500.0132.6 3.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C ±1°C.*Include SZ-prefix devices where applicable.†MMSZ4703 and MMSZ4711 Not Available in 10,000/Tape & ReelTYPICAL CHARACTERISTICSV Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θV Z , NOMINAL ZENER VOLTAGE (V)Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θ100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (5C)Figure 3. Steady State Power Derating P p k, P E A K S U R G E P O W E R (W A T T S )PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge PowerP D , P O W E R D I S S I P A T I O N (W A T T S )V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener ImpedanceZ Z T , D Y N A M I C I M P E D A N C E ()ΩTYPICAL CHARACTERISTICSC , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 6. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01I Z , Z EN E R C U R R E N T (m A )V Z , ZENER VOLTAGE (V)1001010.10.01I R , L E A K A G E C U R R E N T (A )μV Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Leakage Current10001001010.10.010.0010.00010.00001I Z , Z E N E R C U R R E N T (m A )Figure 8. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 9. Zener Voltage versus Zener Current(12 V to 91 V)SOD−123CASE 425−04ISSUE GDATE 07 OCT 2009SCALE 5:1NOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.DIM MIN NOM MAXMILLIMETERSINCHESA0.94 1.17 1.350.037A10.000.050.100.000b0.510.610.710.020c1.600.150.055D 1.40 1.80E 2.54 2.69 2.840.100---3.680.140L0.253.860.0100.0460.0020.0240.0630.1060.1450.0530.0040.0280.0710.1120.152MIN NOM MAX3.56H E---------0.006------------GENERICMARKING DIAGRAM**For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT**This information is generic. Please refer to device datasheet for actual part marking. Pb−Free indicator, “G” ormicrodot “ G”, may or may not be present.XXX= Specific Device CodeM= Date CodeG= Pb−Free Package1STYLE 1:PIN 1. CATHODE2. ANODE0.910.036ǒmminchesǓSCALE 10:1------q001010°°°°(Note: Microdot may be in either location) MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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bq24630 datasheet
SRNSRPISET2ACSETGNDREGNS V Ibq24630 SLUS894–JANUARY2010 Stand-Alone Synchronous Switch-Mode Lithium Phosphate Battery Charger with SystemPower Selector and Low I qCheck for Samples:bq24630FEATURES•24-Pin4×4-mm2QFN Package•300kHz NMOS-NMOS Synchronous Buck•Energy Star Low Quiescent Current I q Converter–<15m A Off-State Battery Discharge current •Stand-alone Charger Specifically for Lithium–<1.5mA Off-State Input Quiescent Current Phosphate•5V–28V VCC Input Operating Range,Support APPLICATIONS1-7Battery Cells•Power Tool and Portable Equipment•High-Accuracy Voltage and Current Regulation•Personal Digital Assistants•Handheld Terminals–±0.5%Charge Voltage Accuracy•Industrial and Medical Equipment –±3%Charge Current Accuracy•Netbook,Mobile Internet Device and –±3%Adapter Current AccuracyUltra-Mobile PC•Integration–Automatic System Power Selection from DESCRIPTIONAdapter or BatteryThe bq24630is highly integrated switch-mode battery –Internal Loop Compensation charge controller designed specifically for Lithium–Internal Soft Start Phosphate battery.It offers a constant-frequencysynchronous PWM controller with high accuracy –Dynamic Power Management(DPM)current and voltage regulation,charge •Safety Protectionpreconditioning,termination,adapter current –Input Over-Voltage Protection regulation,and charge status monitoring.–Battery Thermistor Sense Suspend Charge The bq24630charges the battery in three phases: at Hot/Cold and Automatically I CHARGE/8at preconditioning,constant current,and constant Hot/Cold or Warm/Cool voltage.Charge is terminated when the currentreaches a minimum user-selectable level.A –Battery Detectionprogrammable charge timer provides a safety –Reverse Protection Input FETbackup.The bq24630automatically restarts the –Programmable Safety Timer charge cycle if the battery voltage falls below an–Charge Over-Current Protection internal threshold,and enters a low-quiescent currentsleep mode when the input voltage falls below the –Battery Short Protectionbattery voltage.–Battery Over-Voltage Protection–Thermal Shutdown•Status Outputs–Adapter Present–Charger Operation Status•Charge Enable Pin•6V Gate Drive for Synchronous BuckConverter•30ns Driver Dead-time and99.95%MaxEffective Duty CyclePlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright©2010,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.PACK+PACK-SYSTEMADAPTER+ADAPTER-Cff 22pFbq24630SLUS894–JANUARY 2010This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated circuits be handled with appropriate precautions.Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.DESCRIPTION (CONTINUED)The bq24630controls external switches to prevent battery discharge back to the input,connect the adapter to the system,and to connect the battery to the system using 6-V gate drives for better system efficiency.The bq24630features Dynamic Power Management (DPM).These features reduce battery charge current when the input power limit is reached to avoid overloading the AC adapter when supplying the load and the battery charger simultaneously.A highly-accurate current-sense amplifier enables precise measurement of input current from the AC adapter to monitor the overall system power.NOTE:VIN=19V,BAT=3-cell LiFePO 4,I adapter_limit =4A,I charge =3A,I pre-charge =0.125A,I term =0.3A,2.5hr safety timerFigure 1.Typical System Schematic2Submit Documentation FeedbackCopyright ©2010,Texas Instruments IncorporatedProduct Folder Link(s):bq24630bq24630 SLUS894–JANUARY2010ORDERING INFORMATIONODERING NUMBERPART NUMBER IC MARING PACKAGE QUANTITY(Tape and Reel)bq24630RGER3000 bq24630OAT24-Pin4×4mm2QFNbq24630RGET250PACKAGE THERMAL DATA(1)T A=25°C DERATING FACTOR PACKAGE q JP q JAPOWER RATING ABOVE T A=25°C QFN–RGE(2)4°C/W43°C/W 2.3W0.023W/°C(1)This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board.This isconnected to the ground plane by a2×2via matrix.q JA has5%improvement by3x3via matrix.(2)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TIWeb site at .ABSOLUTE MAXIMUM RATINGS(1)(2)(3)over operating free-air temperature range(unless otherwise noted)VALUE UNIT Voltage range VCC,ACP,ACN,SRP,SRN,BATDRV,ACDRV,CE,STAT1,–0.3to33VSTAT2,PGPH–2to36VVFB–0.3to16VREGN,LODRV,ACSET,TS,TTC–0.3to7VBTST,HIDRV with respect to GND–0.3to39VVREF,ISET1,ISET2–0.3to3.6V Maximum difference voltage ACP–ACN,SRP–SRN–0.5to0.5V Junction temperature range,T J–40to155°C Storage temperature range,T stg–55to155°C (1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltages are with respect to GND if not specified.Currents are positive into,negative out of the specified terminal.Consult PackagingSection of the data book for thermal limitations and considerations of packages.(3)Must have a series resistor between battery pack to VFB if Battery Pack voltage is expected to be greater ually the resistordivider top resistor will take care of this.RECOMMENDED OPERATING CONDITIONSVALUE UNIT Voltage range VCC,ACP,ACN,SRP,SRN,BATDRV,ACDRV,CE,STAT1,STAT2,PG–0.3to28VPH–2to30VVFB–0.3to14VREGN,LODRV,ACSET,TS,TTC–0.3to6.5VBTST,HIDRV with respect to GND–0.3to34VISET1,ISET2–0.3to3.3VVREF 3.3V Maximum difference voltage ACP–ACN,SRP–SRN–0.2to0.2VT J Junction temperature range0to125°CT stg Storage temperature range–55to155°CCopyright©2010,Texas Instruments Incorporated Submit Documentation Feedback3Product Folder Link(s):bq24630bq24630SLUS894–ELECTRICAL CHARACTERISTICS5.0V≤V(VCC)≤28V,0°C<T J<+125°C,typical values are at T A=25°C,with respect to GND unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNIT OPERATING CONDITIONSV VCC_OP VCC Input voltage operating range 5.028.0V QUIESCENT CURRENTSTotal battery discharge current(sum ofcurrents into VCC,BTST,PH,ACP,ACN,V VCC<V SRN,V VCC>V UVLO(SLEEP)15m A SRP,SRN,VFB),VFB≤2.1VI BATBattery discharge current(sum of currents V VCC>V SRN,V VCC>V UVLO CE=LOW5into BTST,PH,SRP,SRN,VFB),VFB≤V VCC>V SRN,V VCC>V VCCLOW CE=HIGH,Charge done5µA2.1VV VCC>V SRN,V VCC>V UVLO CE=LOW1 1.5Adapter supply current(current into V VCC>V SRN,V VCC>V VCCLOW,CE=HIGH,charge done25I AC mAVCC,ACP,ACN pin)V VCC>V SRN,V VCC>V VCCLOW,CE=HIGH,Charging,12Qg_total=20nC,V VCC=20VV FB Feedback regulation voltage 1.8VT J=0°C to125°C–0.5%0.5% Charge voltage regulation accuracyT J=–40°C to125°C–0.7%0.7%Input leakage current into VFB pin VFB=1.8V100nACURRENT REGULATION–FAST CHARGEV ISET1ISET1voltage range2VV IREG_CHG SRP–SRN current sense voltage range V IREG_CHG=V SRP–V SRN100mVCharger current set factor amps of chargeK(ISET1)R SENSE=10mΩ5A/V current per volt on ISET1pin)V IREG_CHG=40mV–3%3%V IREG_CHG=20mV–4%4% Charge current regulation accuracyV IREG_CHG=5mV–25%25%V IREG_CHG=1.5mV(V SRN>3.1V)–40%40%I ISET1Leakage current in to ISET1Pin V ISET1=2V100nACURRENT REGULATION–PRECHARGEPrecharge current R SENSE=10mΩ,VFB<V LOWV50125200mACHARGE TERMINATIONV ISET2ISET2voltage range2VTermination current range R SENSE=10mΩ2ATermination current set factor(amps ofK TERM1A/V termination current per volt on ISET2pin)V ITERM=20mV–4%4%Termination current accuracy V ITERM=5mV–25%25%V ITERM=<1.5mV–45%45%Deglitch time for termination(both edge)100mst QUAL Termination qualification time V BAT>V RECH and I CHARGE<I TERM250msI QUAL Termination qualification time Discharge current once termination is detected2mAI ISET2Leakage current into ISET2pin V ISET2=2V100nAINPUT CURRENT REGULATIONV ACSET ACSET voltage range02VV IREG_DPM ACP-ACN current sense voltage range V IREG_DPM=V ACP–V ACN0100mVInput current set factor(amps of inputK(ACSET)R SENSE=10mΩ5A/V current per volt on ACSET pin)V IREG_DPM=40mV–3%3%Input current regulation accuracy V IREG_DPM=20mV–4%4%V IREG_DPM=5mV–25%25%I ACSET Leakage current into ACSET pin V ACSET=2V100nAINPUT UNDER-VOLTAGE LOCK-OUT COMPARATOR(UVLO)V UVLO AC under-voltage rising threshold Measure on VCC 3.65 3.854VV UVLO_HYS AC under-voltage hysteresis,falling350mV4Submit Documentation Feedback Copyright©2010,Texas Instruments IncorporatedProduct Folder Link(s):bq24630bq24630 SLUS894–JANUARY2010ELECTRICAL CHARACTERISTICS(continued)5.0V≤V(VCC)≤28V,0°C<T J<+125°C,typical values are at T A=25°C,with respect to GND unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNIT VCC LOWV COMPARATORFalling threshold,disable charge Measure on VCC 4.1VRising threshold,resume charge 4.35 4.5V SLEEP COMPARATOR(REVERSE DISCHARGING PROTECTION)V SLEEP_FALL SLEEP falling threshold V VCC–V SRN to enter SLEEP40100150mVV SLEEP_HYS SLEEP hysteresis500mV SLEEP rising delay VCC falling below SRN,Delay to turn off ACFET1m sSLEEP falling delay VCC rising above SRN,Delay to turn on ACFET30m sSLEEP rising shutdown deglitch VCC falling below SRN,Delay to enter SLEEP mode100msSLEEP falling powerup deglitch VCC rising above SRN,Delay to exit out of SLEEP mode30ms ACN/SRN COMPARATORV ACN-SRN_FALL ACN to SRN falling threshold V ACN–V SRN to turn on BATFET100200310mVV ACN-SRN_HYS ACN to SRN rising hysteresis100mV ACN to SRN rising deglitch V ACN–V SRN>V ACN-SRN_RISE2msACN to SRN falling deglitch V ACN–V SRN<V ACN-SRN_FALL50m s BAT LOWV COMPARATORPrecharge to fastcharge transition(LOWVV LOWV Measured on VFB pin,rising0.3330.350.367V threshold)V LOWV_HYS LOWV hysteresis100mV LOWV rising deglitch VFB falling below VLOWV25msLOWV falling deglitch VFB rising above VLOWV25ms RECHARGE COMPARATORRecharge threshold(with respect toV RECHG Measured on VFB pin,rising110125140mV VREG)Recharge rising deglitch VFB decreasing below V RECHG10msRecharge falling deglitch VFB increasing above V RECHG10ms BAT OVER-VOLTAGE COMPARATORV OV_RISE Over-voltage rising threshold As percentage of V FB108%V OV_FALL Over-voltage falling threshold As percentage of V FB105%INPUT OVER-VOLTAGE COMPARATOR(ACOV)V ACOV AC over-voltage rising threshold on VCC31.043232.96VV ACOV_HYS AC over-voltage falling hysteresis1V AC over-voltage deglitch(both edge)Delay to changing the STAT pins1msAC over-voltage rising deglitch Delay to disable charge1msAC over-voltage falling deglitch Delay to resume charge20ms THERMAL SHUTDOWN COMPARATORT SHUT Thermal shutdown rising temperature Temperature increasing145°CT SHUT_HYS Thermal shutdown hysteresis15°C Thermal shutdown rising deglitch Temperature increasing100m sThermal shutdown falling deglitch Temperature decreasing10ms THERMISTOR COMPARATORV LTF Cold temperature rising threshold Charger suspended below this temperature72.5%73.5%74.5%V LTF_HYS Cold temperature hysteresis0.2%0.4%0.6%Charger enabled,cuts back to I CHARGE/8below thisV COOL Cool Temperature rising threshold70.2%70.7%71.2%temperatureV COOL_HYS Cool temperature hysteresis0.2%0.6% 1.0%V WARM Warm temperature rising threshold Charger cuts back to I CHARGE/8above this temperature47.5%48%48.5%V WARM_HYS Warm temperature hysteresis 1.0% 1.2% 1.4%Charger suspended above this temperature beforeV HTF Hot temperature rising threshold36.2%37%37.8%initiating chargeCharger suspended above this temperature duringV TCO Cut-off temperature rising threshold33.7%34.4%35.1%initiating chargeCopyright©2010,Texas Instruments Incorporated Submit Documentation Feedback5Product Folder Link(s):bq24630bq24630SLUS894–ELECTRICAL CHARACTERISTICS(continued)5.0V≤V(VCC)≤28V,0°C<T J<+125°C,typical values are at T A=25°C,with respect to GND unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNIT Deglitch time for Temperature Out ofV TS>V LTF,or V TS<V TCO,or V TS<V HTF400ms Range DetectionDeglitch time for Temperature in ValidV TS<V LTF–V LTF_HYS or V TS>V TCO,or V TS>V HTF20ms Range DetectionDeglitch time for current reduction toV TS>V COOL,or V TS<V WARM25msI CHARGE/8due to warm or cool temperatureDeglitch time to charge at I CHARGE fromI CHARGE/8when resuming from warm or V TS<V COOL-V COOL_HYS,or V TS>V WARM-V WARM_HYS25mscool temperaturesCharge current due to warm or cool V COOL<V TS<V LTF,or V WARM<V TS<V HTF,or V WARM<I CHARGEtemperatures V TS<V TCO/8CHARGE OVER-CURRENT COMPARATOR(CYCLE-BY-CYCLE)Current rising,in non-synchronous mode,mesure on45.5mVV(SRP-SRN),V SRP<2VCharge over-current falling thresholdCurrent rising,as percentage of V(IREG_CHG),in160%synchronous mode,V SRP>2.2VV OCMinimum OCP threshold in synchronous mode,measureCharge over-current threshold floor50mVon V(SRP-SRN),V SRP>2.2VMaximum OCP threshold in synchronous mode,measureCharge over-current threshold ceiling180mVon V(SRP-SRN),V SRP>2.2VCHARGE UNDER-CURRENT COMPARATOR(CYCLE-BY-CYCLE)V ISYNSET Charge under-current falling threshold Switch from SYNCH to NON-SYNCH,V SRP>2.2V159mV BATTERY SHORTED COMPARATOR(BATSHORT)BAT Short falling threshold,forcedV BATSHT V SRP falling2V non-synchronous modeV BATSHT_HYS BAT short rising hysteresis200mVV BATSHT_DEG Deglitch on both edge1m s LOW CHARGE CURRENT COMPARATORAverage low charge current falling Measure on V(SRP-SRN),forced into non-synchronousV LC 1.25mV threshold modeV LC_HYS Low charge current rising hysteresis 1.25mVV LC_DEG Deglitch on both edge1m s VREF REGULATORV VREF_REG VREF regulator voltage V VCC>V UVLO,(0–35mA load) 3.267 3.3 3.333VI VREF_LIM VREF current limit V VREF=0V,V VCC>V UVLO35mA REGN REGULATORV REGN_REG REGN regulator voltage V VCC>10V,CE=HIGH(0–40mA load) 5.7 6.0 6.3VI REGN_LIM REGN current limit V REGN=0V,V VCC>V UVLO40mA TTC INPUTT PRECHG Precharge time before fault occurs144018002160sec Precharge safety timer range(1)Fast charge saftey timer range,with+/-T CHARGE Tchg=C TTC×K TTC110Hr 10%accuracy(1)Fast charge timer accuracy(1)0.047m F≤C TTC≤0.47m F–10%10%K TTC Timer multiplier 1.4min/nFV TTC below this threshold disables the safety timer andTTC low threshold0.4VterminationTTC comparator high threshold 1.5VTTC comparator low threshold1VTTC source/sink current455055m A BATTERY SWITCH(BATFET)DRIVERR DS_BAT_OFF BATFET turn-off resistance V ACN>5V150ΩR DS_BAT_ON BATFET turn-on resistance V ACN>5V20kΩV BATDRV_REG=V ACN–V BATDRV when V ACN>5V andV BATDRV_REG BATFET drive voltage 4.27VBATFET is on(1)Verified by design6Submit Documentation Feedback Copyright©2010,Texas Instruments IncorporatedProduct Folder Link(s):bq24630bq24630 SLUS894–JANUARY2010ELECTRICAL CHARACTERISTICS(continued)5.0V≤V(VCC)≤28V,0°C<T J<+125°C,typical values are at T A=25°C,with respect to GND unless otherwise notedPARAMETER TEST CONDITIONS MIN TYP MAX UNIT AC SWITCH(ACFET)DRIVERR DS_AC_OFF ACFET turn-off resistance V VCC>5V30ΏR DS_AC_ON ACFET turn-on resistance V VCC>5V20kΏV ACDRV_REG=V VCC–V ACDRV when V VCC>5V andV ACDRV_REG ACFET drive voltage 4.27VACFET is onAC/BAT MOSFET DRIVERS TIMINGDriver dead time Dead time when switching between AC and BAT10m s BATTERY DETECTIONt WAKE Wake timer Max time charge is enabled500msI WAKE Wake Current R SENSE=10mΩ50125200mAt DISCHARGE Discharge timer Max time discharge current is applied1secI DISCHARGE Discharge current8mAI FAULT Fault current after a timeout fault2mAV WAKE Wake threshold(with-respect-to V REG)Voltage on VFB to detect battery absent during Wake125mVV DISCH Discharge threshold Voltage on VFB to detect battery absent during Discharge0.35V PWM HIGH SIDE DRIVER(HIDRV)R DS_HI_ON High Side driver(HSD)turn-on resistance V BTST–V PH=5.5V 3.36ΩR DS_HI_OFF High Side driver turn-off resistance V BTST–V PH=5.5V1 1.3ΩBootstrap refresh comparator thresholdV BTST_REFRESH V BTST–V PH when low side refresh pulse is requested 4.0 4.2V voltagePWM LOW SIDE DRIVER(LODRV)R DS_LO_ON Low side driver(LSD)turn-on resistance 4.17ΩR DS_LO_OFF Low side driver turn-off resistance1 1.4ΩPWM DRIVERS TIMINGDead time when switching between LSD and HSD,no30 Driver dead time nsload at LSD and HSDPWM OSCILLATORV RAMP_HEIGHT PWM ramp height As percentage of VCC7% PWM switching frequency(2)255300345kHz INTERNAL SOFT START(8steps to regulation current ICHG)Soft start steps8stepSoft start step time 1.6ms CHARGER SECTION POWER-UP SEQUENCINGDelay from when adapter is detected to when the chargerCharge-enable delay after power-up 1.5sis allowed to turn onLOGIC IO PIN CHARACTERISTICSV IN_LO CE input low threshold voltage0.8VV IN_HI CE input high threshold voltage 2.1VV BIAS_CE CE input bias current V=3.3V(CE has internal1MΩpulldown resistor)6m ASTAT1,STAT2,PG output low saturationV OUT_LO Sink current=5mA0.5V voltageI OUT_HI Leakage current V=32V 1.2µA(2)Verified by designCopyright©2010,Texas Instruments Incorporated Submit Documentation Feedback7Product Folder Link(s):bq24630VCC/PGVREF REGNt −Time = 4 ms/div5 V /d i v2 V /d i v10 V /d i v2 V /d i vt −Time = 200 ms/divPHLODRVIBATCE5 V /d i v5 V /d i v 10 V /d i v2A /d i v PHLDRVILCE10 V /d i v5 V /d i v 2 V /d i v2A /d i v t −Time = 4s/divμt −Time = 4 ms/divCEPHLODRVIBAT5 V /d i v5 V /d i v10 V /d i v2A /d i vbq24630SLUS894–JANUARY 2010TYPICAL CHARACTERISTICSTable 1.Table of GraphsFigureREF REGN and PG Power Up (CE=1)Figure 2Charge EnableFigure 3Current Soft-Start (CE=1)Figure 4Charge DisableFigure 5Continuous Conduction Mode Switching Waveforms Figure 6Cycle-by-Cycle Synchronous to Nonsynchronous Figure 7100%Duty and Refresh Pulse Figure 8Transient System Load (DPM)Figure 9Battery InsertionFigure 10Battery to Ground Short Protection Figure 11Battery to ground Short Transition Figure 12Efficiency vs Output Current Figure 13Input ACOV TransitionFigure 14Input ACOV Resume Normal TransitionFigure 15Figure 2.REF REGN and PG Power Up (CE=1)Figure 3.Charge EnableFigure 4.Current Soft-Start (CE=1)Figure 5.Charge Disable8Submit Documentation FeedbackCopyright ©2010,Texas Instruments IncorporatedProduct Folder Link(s):bq246305 V /d i v5 V /d i v2A /d i vPHLODRVILt Time = 200 ns/div–20 V /d i v20 V /d i v5 V /d i v2A /d i vPHLODRVILHIDRVt −Time = 200 ns/div t −Time = 400 ns/divPHLODRV IL0.5A /d i v 10 V /d i v5 V /d i vt −Time = 200s/divμIINISYSIBAT2A /d i v2A /d i v2A /d i v20 V /d i v10 V /d i v2A /d i v PHVBATILLDRV5 V /d i v t Time = 4 ms/div–10 V /d i v10 V /d i v2A /d i vPHVBAT ILt Time = 200 ms/div –bq24630SLUS894–JANUARY 2010Figure 6.Continuous Conduction Mode Switching Waveform Figure 7.Cycle-by-Cycle Synchronous to NonsynchronousFigure 8.100%Duty and Refresh Pulse Figure 9.Transient System Load (DPM)Figure 10.Battery Insertion Figure 11.Battery to GND Short ProtectionCopyright ©2010,Texas Instruments Incorporated Submit Documentation Feedback9Product Folder Link(s):bq2463020 V /d i v10 V /d i v2A /d i v5 V /d i vPHVBATILLDRVt Time = 8s/div–μIBAT - Output Current -AE f f i c i e n c y - %20 V /d i v 2 V /d i v20 V /d i v20 V /d i v/PG /BATDRV VCC/ACDRV t Time = 10 ms/div–20 V /d i v2 V /d i v20 V /d i v 20 V /d i v /PG/BATDRVVCC/ACDRVt Time = 20 ms/div–bq24630SLUS894–JANUARY 2010Figure 12.Battery to GND Short Transition Figure 13.Efficiency vs Output CurrentFigure 14.Input ACOV Transition Figure 15.Input ACOV Resume Normal Transition10Submit Documentation FeedbackCopyright ©2010,Texas Instruments IncorporatedProduct Folder Link(s):bq24630Pin Functions–24-Pin QFNPINFUNCTION DESCRIPTION1ACN Adapter current sense resistor,negative input.A0.1-m F ceramic capacitor is placed from ACN to ACP to provide differential-mode filtering.An optional0.1-m F ceramic capacitor is placed from ACN pin to GND for common-mode filtering.2ACP Adapter current sense resistor,positive input.A0.1-m F ceramic capacitor is placed from ACN to ACP to provide differential-mode filtering.A0.1-m F ceramic capacitor is placed from ACP pin to GND for common-mode filtering.3ACDRV AC adapter to system MOSFET driver output.Connect through a1-kΩresistor to the gate of the ACFET P-channel power MOSFET and the reverse conduction blocking P-channel power MOSFET.The internal gate drive is asymmetrical,allowing a quick turn-off andslow turn-on,in addition to the internal break-before-make logic with respect to BATDRV.If needed,an optional capacitor from gate tosource of the ACFET is used to slow down the ON and OFF times.4CE Charge-enable active-HIGH logic input.HI enables charge.LO disables charge.It has an internal1MΩpull-down resistor.5STAT1Open-drain charge status pin to indicate various charger operation.6TS Temperature qualification voltage input for battery pack negative temperature coefficient thermistor.Program the hot and cold temperature window with a resistor divider from VREF to TS to GND.7TTC SafetyTimer and termination control.Connect a capacitor from this node to GND to set the timer.When this input is LOW,the timer and termination are disabled.When this input is HIGH,the timer is disabled but termination is allowed.8PG Open-drain power-good status output.Active LOW when IC has a valid VCC(not in UVLO or ACOV or SLEEP mode).Active HIGH when IC has an invalid VCC.PGcan be used to drive a LED or communicate with a host processor.9STAT2Open-drain charge status pin to indicate various charger operation.10VREF 3.3V regulated voltage output.Place a1-m F ceramic capacitor from VREF to GND pin close to the IC.This voltage could be used for programming of voltage and current regulation and for programming the TS threshold.11ISET1Fast Charge current set input.The voltage of ISET1pin programs the fast charge current regulation set-point.12VFB Output voltage analog feedback adjustment.Connect the output of a resistive voltage divider from the battery terminals to this node to adjust the output battery regulation voltage.13SRN Charge current sense resistor,negative input.A0.1-m F ceramic capacitor is placed from SRN to SRP to provide differential-mode filtering.An optional0.1-m F ceramic capacitor is placed from SRN pin to GND for common-mode filtering.14SRP Charge current sense resistor,positive input.A0.1-m F ceramic capacitor is placed from SRN to SRP to provide differential-mode filtering.A0.1-m F ceramic capacitor is placed from SRP pin to GND for common-mode filtering.15ISET2Termination current set input.The voltage of ISET2pin programs termination current trigger point.16ACSET Adapter current set input.The voltage of ACSET pin programs the input current regulation set-point during Dynamic Power Management(DPM)17GND Low-current sensitive analog/digital ground.On PCB layout,connect with PowerPad underneath the IC.18REGN PWM low side driver positive6V supply output.Connect a1-m F ceramic capacitor from REGN to GND pin,close to the e for low side driver and high-side driver bootstrap voltage by connecting a small signal Schottky diode from REGN to BTST.19LODRV PWM low side driver output.Connect to the gate of the low-side power MOSFET with a short trace.20PH PWM high side driver negative supply.Connect to the Phase switching node(junction of the low-side power MOSFET drain,high-side power MOSFET source,and output inductor).Connect the0.1-m F bootstrap capacitor from PH to BTST.21HIDRV PWM high side driver output.Connect to the gate of the high-side power MOSFET with a short trace.22BTST PWM high side driver positive supply.Connect to the Phase switching node(junction of the low-side power MOSFET drain,high-side power MOSFET source,and output inductor).Connect the0.1-m F bootstrap capacitor from SW to BTST.23BATDRV Battery to system MOSFET driver output.Gate drive for the battery to system load BAT PMOS power FET to isolate the system from the battery to prevent current flow from the system to the battery,while allowing a low impedance path from battery to system.Connect this pin through a1-kΩresistor to the gate of the input BAT P-channel MOSFET.Connect the source of the FET to thesystem load voltage node.Connect the drain of the FET to the battery pack positive terminal.The internal gate drive is asymmetricalto allow a quick turn-off and slow turn-on,in addition to the internal break-before-make logic with respect to ACDRV.If needed,anoptional capacitor from gate to source of the BATFET is used to slow down the ON and OFF times.24VCC IC power positive supply.Connect through a10-Ωto the common-source(diode-OR)point:source of high-side P-channel MOSFET and source of reverse-blocking power P-channel MOSFET.Place a1-m F ceramic capacitor from VCC to GND pin close to the IC.PowerPAD Exposed pad beneath the IC.Always solder PowerPAD to the board,and have vias on the PowerPAD plane star-connecting to GND and ground plane for high-current power converter.It also serves as a thermal pad to dissipate the heat.BLOCK DIAGRAMSee OPERATIONAL FLOWCHARTV V I & I PRECH BAT R1V =1.8V 1R2éù´+êúëûISET1CHARGE SR V I =20R ´DETAILED DESCRIPTIONFigure 17.Typical Charging ProfileBATTERY VOLTAGE REGULATIONThe bq24630uses a high accuracy voltage bandgap and regulator for the high accuracy charging voltage.The charge voltage is programmed via a resistor divider from the battery to ground,with the midpoint tied to the VFB pin.The voltage at the VFB pin is regulated to 1.8V,giving Equation 1for the regulation voltage:(1)where R2is connected from VFB to the battery and R1is connected from VFB to GNDBATTERY CURRENT REGULATIONThe ISET1input sets the maximum fast charging current.Battery charge current is sensed by resistor R SRconnected between SRP and SRN.The full-scale differential voltage between SRP and SRN is 100mV.Thus,for a 10m Ωsense resistor,the maximum charging current is 10A.Equation 2is for charge current(2)V ISET1,the input voltage range of ISET1is between 0and 2V.The SRP and SRN pins are used to sense voltageacross R SR with default value of 10m Ω.However,resistors of other values can also be used.A larger sense resistor will give a larger sense voltage,a higher regulation accuracy;but,at the expense of higher conduction loss.。
Eaton 237001 品牌 Moeller 系列 xPole - PKN4 RCBO 型号产品说
Eaton 237001Eaton Moeller series xPole - PKN4 RCBO - residual-current circuit breaker with overcurrent protection. PKN4, 1 pole+N, C, In: 13 A, 4.5 kA, I ΔN: 0.03 AGeneral specificationsEaton Moeller series xPole - PKN4 RCBO - residual-current circuit breaker with overcurrent protection237001PKN4-13/1N/C/003-A-MW401508237001580 mm 73 mm 35 mm 0.203 kgCE Marked RoHS conformCEProduct NameCatalog Number Model CodeEANProduct Length/Depth Product Height Product Width Product Weight Compliances Certifications13 AIs the panel builder's responsibility. The specifications for the switchgear must be observed.4.5 kAMeets the product standard's requirements.Is the panel builder's responsibility. The specifications for the switchgear must be observed.313 ADoes not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.0 kA50 HzIs the panel builder's responsibility.20.03 AType A, pulse-current sensitive40 °C eaton-xpole-pkn4-rcbo-catalog-ca019044en-en-us.pdfeaton-xpole-protective-devices-catalog-ca019014en-en-us.pdfDA-DC-03_N4DA-DC-03_PKNeaton-xpole-pkn4-characteristic-curve-002.jpgeaton-xpole-pkn6-m-dimensions.jpgeaton-xpole-pkn6-m-3d-drawing.jpgIL019140ZUeaton-xpole-combined-mcb-rcd-device-rcbo-packaging-manual-multilingual.pdfeaton-xeffect-frbm6/m-wiring-diagram.jpgRated operational current for specified heat dissipation (In) 10.11 Short-circuit ratingRated switching capacity (IEC/EN 61009)10.4 Clearances and creepage distances10.12 Electromagnetic compatibilityCurrent limiting classAmperage Rating10.2.5 Lifting10.2.3.1 Verification of thermal stability of enclosures Rated short-circuit breaking capacity (EN 60947-2) Frequency rating10.8 Connections for external conductorsNumber of poles (total)Fault current ratingSensitivity typeAmbient operating temperature - maxHeat dissipation per pole, current-dependent Catalogs Certification reports Characteristic curve DrawingsInstallation instructions Wiring diagrams0 WBuilt-in depth69.5 mmFeaturesConcurrently switching N-neutralConnectable conductor cross section (solid-core) - min1 mm²10.9.3 Impulse withstand voltageIs the panel builder's responsibility.Number of polesSingle-pole + NAmbient operating temperature - min-25 °C10.6 Incorporation of switching devices and componentsDoes not apply, since the entire switchgear needs to be evaluated.10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Rated switching capacity4.5 kAEquipment heat dissipation, current-dependent3.1 WTripping characteristicC10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.Static heat dissipation, non-current-dependent0 WApplicationSwitchgear for residential and commercial applications10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Voltage typeACNumber of poles (protected)1Leakage current typeARated short-circuit breaking capacity (EN 61009-1)4.5 kATrippingNon-delayedOperating ambient temperature - min-25 °CHeat dissipation capacity0 WRelease characteristicCImpulse withstand currentPartly surge-proof, 250 AProduct rangePKN4Width in number of modular spacings210.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Rated short-circuit breaking capacity (EN 61009)4.5 kAOperating ambient temperature - max40 °CVoltage rating230 V10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Connectable conductor cross section (solid-core) - max25 mm²Degree of protectionIP20Overvoltage categoryIIIPollution degree210.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Connectable conductor cross section (multi-wired) - min1 mm²Rated impulse withstand voltage (Uimp)4 kV10.10 Temperature riseThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Basic functionCombined RCD/MCB devicesRated current13 AConnectable conductor cross section (multi-wired) - max 25 mm²TypeRCBO10.2.2 Corrosion resistanceMeets the product standard's requirements.Surge current capacity0.25 kA10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Rated short-circuit breaking capacity (IEC 60947-2)0 kADisconnection characteristicEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaUndelayed230 V440 VRated operational voltage (Ue) - max Rated insulation voltage (Ui)。
Agilent34401错误代码
n figuration memory lost; due to firmware revision change -315 Configuration memory lost; memory corruption detected-314 Save/recall memory lost; due to firmware revision change-314 Save/recall memory lost; memory corruption detected-313 Calibration memory lost-313 Calibration memory lost; due to firmware revision change-313 Cannot read file; due to corrupt data-313 Cannot read file; due to file revision change-313 Invalid number of channels for operation-310 System error; internal software error-310 System error; out of memory-310 System error; software initialization failed-292 Referenced name does not exist-257 File name error;access denieddrive name missing or not recognizedAgilent Trueform 系列操作和维修指南423SCPI 错误消息file or folder already existsfile too largefolder is default folderfolder not emptyinvalid character in namenot a folder namepath is a folder namepath name missingpath too longrelative path not allowedunknown file extension-256 File or folder name not found-254 Media full-252 Missing media-250 Mass storage error:file read/write error-241 Hardware missing-241 Hardware missing; Command not valid in one channel instrument.-240 Hardware error; GPIB interface failed-230 Data corrupt or stale-222 Data out of range;AM depthamplitudearb frequencyarb periodburst countburst count limited by length of burstburst periodburst period limited by length of burstcannot combine channel with bine disabled duty cycleduty cycle limited by frequencyFM deviationFM deviation limited by maximum frequency424 Agilent Trueform 系列操作和维修指南SCPI 错误消息FM deviation limited by minimum frequency frequencyfrequency in burst modefrequency in FMhigh level limited by high soft limithigh level limited by low levelhigh level limited by low soft limithigh limit value limited by high signal levellarge period limits minimum pulse widthlow level limited by high levellow level limited by high soft limitlow level limited by low soft limitlow limit value limited by low signal levelmarker confined to burst cyclesmarker confined to sweep spanoffsetperiodPRBS edge timePRBS edge time limited by bit ratepulse duty cycle limited by periodpulse edge at maximumpulse edge at minimumpulse edge timepulse edge time limited by duty cyclepulse edge time limited by periodpulse edge time limited by widthpulse frequencypulse periodpulse widthpulse width limited by periodPWM deviationPWM deviation limited by pulse parametersramp frequencyAgilent Trueform 系列操作和维修指南425SCPI 错误消息ramp SymmetrySample ratesample rate clipped to lower limitsample rate clipped to upper limitsquare edge timesquare edge time limited by duty cyclesquare edge time limited by periodsquare edge time limited by widthsquare periodsquare widthsum amplitude limited by channel or combine amplitudessum amplitude value clipped to lower limitsweep timeTrack exceeds limits on channel 1. Tracking disabledTrack exceeds limits on channel 2. Tracking disabledtrigger count clipped to lower limittrigger count clipped to upper limittrigger delaytrigger delay clipped to lower limittrigger delay clipped to upper limittrigger delay limited by length of bursttrigger level clipped to lower limit(仅适用于33600 系列)trigger level clipped to upper limit(仅适用于33600 系列)trigger level (仅适用于33600 系列)trigger timer clipped to lower limittrigger timer clipped to upper limittrigger timer limited by length of burstuser frequencyUSER setting only valid for channel 1value clipped to dwell time's lower limitvalue clipped to dwell time's upper limitvalue clipped to lower limitvalue clipped to sweep time's lower limit426 Agilent Trueform 系列操作和维修指南SCPI 错误消息value clipped to upper limitvalue limited due to coupling-222 List Data out of range; Arb frequency :Mode is changed to Normal(仅适用于33600 系列) -222 List Data out of range; Pulse frequency :Mode is changed to Normal-222 List Data out of range; Ramp frequency :Mode is changed to Normal-222 List Data out of range; Sine frequency :Mode is changed to Normal-222 List Data out of range; Square frequency :Mode is changed to Normal-222 List Data out of range; User frequency :Mode is changed to Normal-221 Setting the advance mode to trigger forced the trigger source to external.-221 Setting the Arb Filter OFF changed the maximum sample rate value to 6.25e7.-221 Setting the trigger source changed the arb advance mode.-221 Settings conflict;50V input range not compatible with 50 ohm input impedance; impedance set to 1 Mohm AM depth forced amplitude changeAM turned off by selection of other mode or modulationamplitude changed due to functionamplitude changed due to offsetamplitude units changed to Vpp due to high-Z loadamplitude units changed to Vpp, dBm and Vrms not applicable to arb sequences amplitude units unchanged, dBm and Vrms not applicable to arb sequencesarb advance changed to SRATE due to filter(仅适用于33600 系列)arb advance changed to SRATE due to modearb voltage reduced due to output load or limitsBalance gain limited due to amplitude.Balance offset changed due to amplitudeboth edge times decreased due to periodboth edge times decreased due to pulse duty cycleboth edge times decreased due to pulse widthBPSK turned off by selection of other mode or modulationburst count reduced to fit entire burstBurst mode has caused output phase to be set to zero degreesburst period increased to fit entire burstburst phase inapplicable for arbs larger than 1M. burst phase set to 0(仅适用于33500 系列) Agilent Trueform 系列操作和维修指南427SCPI 错误消息burst turned off by selection of other mode or modulationCannot combine DC functioncannot delete state selected and enabled for automatic power-on recallCannot modulate ARB carrier with ARB as modulation function.Modulation turned off. Cannot modulate ARB carrier with ARB modulation function.Function unchanged.Cannot modulate ARB carrier with USER as modulation function.Modulation turned off. Cannot modulate ARB carrier with USER modulation function.Function unchanged. Cannot modulate by a two-channel ArbCannot modulate Noise carrier with Noise as modulation function.Modulation turned off. Cannot modulate Noise carrier with Noise modulation function.Function unchanged. Cannot modulate PRBS carrier with PRBS as modulation function.Modulation turned off. Cannot modulate PRBS carrier with PRBS modulation function.Function unchanged. Cannot modulate USER carrier with ARB as modulation function.Modulation turned off. Cannot modulate USER carrier with ARB modulation function.Function unchanged. Cannot modulate USER carrier with USER as modulation function.Modulation turned off. Cannot modulate USER carrier with USER modulation function.Function unchanged. Cannot select channel as modulating sourceCannot use filter in advance arb trigger mode. (仅适用于33600 系列)combine amplitude exceeds bine disabledCombine turned off by selection of DC functioncoupling cannot be ON with this function, coupling turned offcoupling violates settings, coupling turned offedge time decreased due to bit rateexternal gating not compatible with gate output; gate output disabledFM deviation cannot exceed carrierFM deviation exceeds maximum frequencyFM turned off by selection of other mode or modulationfrequency changed for pulse functionfrequency changed for sine function(仅适用于33600 系列)frequency changed for square function(仅适用于33600 系列)frequency forced duty cycle changefrequency made compatible with burst mode(仅适用于33500 系列)frequency reduced for ramp function428 Agilent Trueform 系列操作和维修指南SCPI 错误消息frequency reduced for user functionFSK turned off by selection of other mode or modulationFunction or modulation source cannot be USER.Tracking disabledFunction selection limited the FSK frequency.Gated output not available for gated burst.Output mode changed to normal.high level changed due to low levelhigh limit less than low limit.Limits disabledinfinite burst changed trigger source to BUSinput threshold voltage > input range; threshold clipped to rangeleading edge time decreased due to periodleading edge time decreased due to pulse widthleading edge times decreased due to pulse duty cyclelimited frequency to 1MHz when sync mode carrier, burst ON, and function sine(仅适用于33500 系列) list turned off by selection of other mode or modulationlow level changed due to high levellow reference >= high referencemarker forced into sweep spanmarker off forced sync to normal modemarker on forced sync to marker modemarker point changed to fit arb lengthmodulation frequency made compatible with modulation shapemust stop operation to update trigger countmust stop operation to update trigger delaynot able to adjust phase for arb < 64 samples(仅适用于33600 系列)not able to adjust phase in this functionnot able to adjust phase in this modenot able to burst DC, burst turned offnot able to burst this functionnot able to change output load with limits enablednot able to list arb, list turned offnot able to list DC, list turned offnot able to list noise, list turned offnot able to list PRBS, list turned offAgilent Trueform 系列操作和维修指南429SCPI 错误消息not able to list this functionnot able to modulate arb, modulation turned offnot able to modulate DC, modulation turned offnot able to modulate noise, modulation turned offnot able to modulate PRBS, modulation turned offnot able to modulate this functionnot able to sweep arb, sweep turned offnot able to sweep DC, sweep turned offnot able to sweep noise, sweep turned offnot able to sweep PRBS, sweep turned offnot able to sweep this functionoffset changed due to amplitudeoffset changed on exit from DC functionPM turned off by selection of other mode or modulationprbs edge time increased due to amplitude(仅适用于33600 系列)pulse duty cycle and edge times increased due to amplitude(仅适用于33600 系列) pulse duty cycle decreased due to periodpulse duty cycle increased due to amplitude(仅适用于33600 系列)pulse duty cycle increased due to periodpulse edge times increased due to amplitude(仅适用于33600 系列)pulse width and edge times increased due to amplitude(仅适用于33600 系列) pulse width decreased due to periodpulse width increased due to amplitude(仅适用于33600 系列)pulse width increased due to large periodPWM deviation decreased due to pulse parametersPWM only available in pulse functionPWM turned off by selection of other mode or modulationRange hold turned off by selection of new function(仅适用于33600 系列) selected arb is missing, changing selection to defaultselecting a sequence turned off modulationsequences not supported, changing selection to defaultsignal exceeds high limit.Limits disabledsignal exceeds low limit.Limits disabled430 Agilent Trueform 系列操作和维修指南SCPI 错误消息Skew time between channels not available in Burst, Modulation, or Sweepsum amplitude exceeds limit or range.Sum disabledSUM turned off by selection of other mode or modulationSweep + Hold + Return time larger than trigger TIMER.Trig timer increased.Sweep + Hold + Return time max (8000s) limited time setting.Sweep + Hold + Return time max (8000s) limited time setting.Sweep + Hold + Return time too large for IMM or TIMER trigger.Sweep turned off.Sweep + Hold + Return time too large for IMM or TIMER trigger.Trig source unchanged.Sweep time reduced due to log sweep setting.sweep turned off by selection of other mode or modulationTracking turned off by selection of USER function or modulation sourcetrailing edge decreased due to leading edgetrailing edge time decreased due to periodtrailing edge time decreased due to pulse widthtrailing edge times decreased due to pulse duty cycletrigger delay reduced to fit entire bursttrigger output connector used by BPSKtrigger output connector used by burst gatetrigger output connector used by FSKtrigger output connector used by trigger externaltrigger output disabledtrigger output disabled by trigger externalTrigger source limited the sweep time; value clipped to upper limittriggered burst not available for noiseturned off infinite burst to allow immediate trigger sourceUse FUNC:ARB to select an ARB before selecting ARB as modulation function.Function unchanged.Use FUNC:ARB to select an ARB before selecting ARB as modulation function.Modulation disabled.Use FUNC:USER to select a user arb before selecting USER as modulation function.Function unchanged. Use FUNC:USER to select a user arb before selecting USER as modulation function.Modulation disabled. -213 INIT ignored-203 Command protected; Enter calibration password from front panel calibration menu(仅适用于33500 系列)-203 Command protected; instrument must be unsecured(仅适用于33600 系列)-203 Command protected; requires license BWD(仅适用于33600 系列)-203 Command protected; requires license SEC(仅适用于33600 系列)Agilent Trueform 系列操作和维修指南431SCPI 错误消息-203 Secure option:Instrument security is unlocked-115 Invalid parameter; Parameter not supported on one channel instrument-114 Header suffix out of range100 Network Error110 LXI mDNS Error201 Memory lost:stored state202 Memory lost:power-on state203 Memory lost:stored measurements263 Not able to execute while instrument is measuring291 Not able to recall state:it is empty292 State file size error293 State file corrupt301 Cannot reset input protection; high voltage present305 Not able to perform requested operation514 Not allowed514 Not allowed; Instrument locked by another I/O session521 Communications:input buffer overflow522 Communications:output buffer overflow532 Not able to achieve requested resolution540 Cannot use overload as math reference550 Not able to execute command in local mode560 No valid external timebase561 High voltage present on input channel570 DDS Processor is not responding580 Reference phase-locked loop is unlocked581 Waveform DAC Timing is unlocked(仅适用于33600 系列)581 Waveform DAC Timing regained lock(仅适用于33600 系列)582 The DATA controller failed to lock for WFDAC(仅适用于33600 系列)582 The MU controller failed to lock for WFDAC(仅适用于33600 系列)582 The SYNC controller failed to lock for WFDAC(仅适用于33600 系列)600 Internal licensing error601 License file corrupt or empty602 No valid licenses found for this instrument603 Some licenses could not be installed432 Agilent Trueform 系列操作和维修指南SCPI 错误消息604 License not found605 License already installed600 到699 之间绝大多数的错误代码指的是自检错误。
XTL571100-M118-017_32M_080605
1.Description:Quartz Crystal2.Nominal Frequency:32.000000 MHz3.Center Frequency:32.000000 MHz4.Dimension & Drawing No.:SX-3225 ; SXD-002135.Oscillation Mode:Fundamental6.Cutting Mode:AT cut7.Packing Style:TP-0948.Measurement Instrument:250B(Measured FL)[2] Frequency Stability :JdF/F25: Frequency Deviation Refer to 25 Frequency[3] Electrical Performance :X’TAL REFER TOAPPLICATIONITEMCONDITION SPECIFICATIONS STORED AT 85±2℃ FOR 720±12H.THEN 25±2℃ OVER 2H BEFORE TESTING. STORED AT –40±2℃ FOR 500±12H.THEN 25±2℃ OVER 2H BEFORE TESTING. STORED AT 60±2℃ AND HUMIDITY 90〜95% FOR 500±12 H.THEN 25±2℃ OVER 2H BEFORE TESTING.THE CRYSTAL FILTER UNIT SHALL BE SUBJECTED TO 100 SUCCESSIVE CHANGE OF TEMPERATURE CYCLES, THEN 25 ±2℃ OVER 2 H BEFORE TESTING, EACH CYCLE AS BELLOW ： TEMPERATURE DURATION1. -40+0/-6℃ 30±3 MINUTES2. 25℃±2℃ 2〜3 MINUTES3. 85+4/-0℃ 30 ±3 MINUTES4. 25℃±2℃ 2〜3 MINUTESITEMCONDITIONS SPECIFICATIONSA NEW UNIFORM COATING OF THE LEAD IS IMMERSED IN A 260±5℃ SOLDER BATH SOLDER SHALL COVER AWITHIN 2±0.6 SECONDS. MINIMUN 95% OF THE SURFACEREFLOW CHART AS ATTACH SHEET.TWICE PASS.FREE DROPPING FROM 75 cm HEIGHT 3 TIMES ON A HARD WOODEN BOARD.FREQUENCY ：10〜55Hz, AMPLITUDE (TOTAL EXCURSION)：1.5mm±15%,SWEEP TIME ：1MIN, 3 DIRECTION (X, Y, Z) EACH 2 H. □ THE CRYSTAL / FILTER UNIT SHALL BE IMMERSED INA WATER AT 90 〜 95℃ FOR 5 ±0.5 MINUTES. THEN 25±2℃ 1〜2 H BEFORE TESTING.□ MASS-SPECTROMETER-TYPE LEAK DETECTOR SHALL BE USED TO MEASURE THE LEAKAGE RATE OF GAS THROUGH ANY FAULTY SEAL. 4. TEMPERATURECYCLE ARELIABILITY SPECIFICATION SMD TYPE ENVIRONMENTAL PERFORMANCE 1. DRY HEAT(AGING)AJIS C 6701 2. COLD A3. DAMP HEAT A,B6. RESISTANCE TO SOLDERING HEAT A 5. SOLDERABILITY 9. SEALING7. SHOCK A8. VIBRATION A MECHANICAL PERFORMANCE B,CDX’TALREFER TOAPPLICATIONITEM CONDITIONSSPECIFICATIONSSHALL BE PRESSURIZED AT A SPEED OF APPROX.0.5mm/sec IN THE DIRECTION INDICATED BY THE ARROW UNTIL THE BENDING WIDTH REACHES 3mm AND HELD FOR 5 SECONDS. A R0.5 JIG SHALL BE USED TO APPLY A 10N DEAD LOAD IN THE DIRECTION INDICATED BY THE ARROW TO THE ELEMENT AND RETAIN IT FOR 10 SECONDS.A R0.5 PRESSURIZED BAR SHALL BE USED TO APPLYA 10N LOAD IN THE CENTER OF ELEMENT AND RETAIN IT FOR 10 SECONDS.JIS C 6701 12. ELEMENTASSEMBLYSTRENGTH A11. STICKINGTENDENCY AMECHANICAL PERFORMANCE A10. TERMINALSTRENGTH RELIABILITY SPECIFICATION SMD TYPEX’TAL REFER TOAPPLICATIONSYMBOLSTANDARD NOTE 1. FREQUENCY CHANGE PERMITTED. △F ≦±5ppm. 2. EQUIVALENT SERIES RESISTANCE CHANGE PERMITTED. △CI ≦±5.0Ω or ±20％ WHICHEVER IS THE LARGE. INSULATION RESISTANCE 500M Ω MIN. NO BUBBLES COMING UP FROM INTERIOR OF THE HOLDER. LEAK RATE 2.1 x 10-9 Pa ．m 3/s (2.1 x 10-8 mbar ．l /s) MAX.JIS C 6701RELIABILITY SPECIFICATION D SPECIFICATIONS A SMD TYPE B C。
NPG-170N
Glass cloth base epoxy resin flame retardant copper clad laminate
NPG-170N
FEATURES
Halogen, antimony, and red phosphorous free Flammability meets UL 94 V-0 Excellent long term reliability UV blocking type Superior CAF-Resistance (Anti-migration) Reactive type flame retardants High Tg 170℃ (DSC) and low C.T.E will provide excellent dimensional stability and through-hole reliability ANSI type : FR-4.1
Glass cloth base epoxy resin flame retardant prepreg
NPG-170NB
FEATURES
Halogen, antimony, and red phosphorous free Rheology of resin controlled to benefit the lamination of the boards. Modified phosphorous epoxy provides excellent heat and chemical resistance. Tg: 170±5℃
4.1-4.3 0.009-0.012 120 60 0.20-0.30 94V0 7-9 300 170 ± 5 0.01-0.03
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Supporting InformationDirect Access to Acylated Azobenzenes via Pd-Catalyzed C−H Functionalization and Further Transformation into Indazole BackboneHongji Li,† Pinhua Li,† and Lei Wang*†‡† Department of Chemistry, Huaibei Normal University, Huaibei, Anhui 235000, P R China.Tel: + 86-561-3802-069 Fax: + 86-561-3090-518 E-mail: leiwang@‡ State Key Laboratory of Organometallic Chemistry, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences, Shanghai 200032, P R ChinaTable of Contents for Supporting Information1.G e n e r a l c o n s i d e r a t i o n s (1)2.Typica l p roc e dur e fo r the s ynt he sis of azoben ze ne s (1)3.T y p i c a l p r o c e d u r e f o r t h e s y n t h e s i s o f i n d a z o l s (2)4.E f f e c t o f s o l v e n t o n t h e a c yl a t i o n r e a c t i o n (2)5.C ha r a c te ri z a t io n d a t a f o r th e p r o du c t s (3)6.1H a nd13C N MR s pe c tr a of t he pro duc ts (17)7.R e f e r e n c e s (64)1.General considerationsAll 1H NMR and 13C NMR spectra were recorded on a 400 MHz Bruker FT-NMR spectrometers (400 MHz or 100 MHz, respectively). All chemical shifts are given as δ value (ppm) with reference to tetramethylsilane (TMS) as an internal standard. The peak patterns are indicated as follows: s, singlet; d, doublet; t, triplet; m, multiplet; q, quartet. The coupling constants, J, are reported in Hertz (Hz). High resolution mass spectroscopy data of the product were collected on a Waters Micromass GCT instrument. Azobenzenes were prepared from arylamines, using CuBr as catalyst (Zhang, C.; Jiao N. Angew. Chem., Int. Ed.2010, 49, 6174). The chemicals and solvents were purchased from commercial suppliers either from Aldrich, USA or Shanghai Chemical Company, China. All the solvents were dried and freshly distilled prior to use. Products were purified by flash chromatography on 100–200 mesh silica gels, SiO2.2. Typical procedure for the acylation of azobenzenesA 10 mL of reaction tube was charged with azobenzene (1a, 36.4 mg, 0.20 mmol), benzaldehyde (2a,23.3 mg, 0.22 mmol), Pd(OAc)2 (2.3 mg, 0.01 mmol), TBHP (40µL, 0.40 mmol, dried over 4Å MS prior to use) and anhydrous 1, 2-dichloroethane (1.0 mL) under N2 atmosphere. The reaction vessel was placed in an oil bath. After the reaction was carried out at 80 o C for 12 h, it was cooled to room temperature, extracted with EtOAc (2×5 mL). The organic layers were combined, dried over Na2SO4, and concentrated to yield the crude product, which was further purified by flash chromatography (silica gel, ethyl acetate/petroleum ether 1:20, v/v), affording the desired product 3a as a red solid (44.6 mg, 78%).3. Typical procedure for the synthesis of indazole derivativesA 5 mL of reaction tube was charged with zinc dust (26.0 mg, 0.40 mmol), NH4Cl (32.1 mg, 0.60 mmol), 3a (57.2 mg, 0.20 mmol) and CH3OH (0.50 mL). The reaction mixture was stirred at room temperature for 5 min. After red color was completely disappeared, the resulting slurry was diluted with water and filtrated. The filter liquor was then extracted with EtOAc (3×5 mL), and dried over MgSO4. Then the solvent was evaporated under reduced pressure and the residue was purified by flash chromatography (silica gel, ethyl acetate/petroleum ether 1:5, v/v), affording the desired product 4a as a white solid (53.0 mg, 99%).4. Effect of solvent on the acylation reactionTable S1 Effect of the solvent on the acylation reaction of azobenzene (1a) withbenzaldehyde (2a)aEntry Solvent Yield [%]1 benzene 652 toluene 723 DMF 174 DMSO 255 DCE 786 dioxane 567 THF 528 diglyme 0aPd(OAc)2(5 mol%), TBHP (0.40 mmol, dried over 4Å MS prior to use), solvent (1.0 mL), 80o C , sealed tube, N, 12 h. b Isolated yields.25. Characterization data for the products3c: 1H NMR (400 MHz, CDCl3): δ 7.93 (d, J = 7.6 Hz, 1H), 7.68−7.61 (m, 3H), 7.57−7.55 (m, 2H), 7.49−7.46 (m, 2H), 7.36−7.31 (m, 3H), 7.17 (d,J = 7.6 Hz, 2H), 2.35 (s, 3H); 13C NMR (100 MHz, CDCl3): δ 196.72, 152.13, 150.28, 143.58, 137.44, 135.96, 131.23, 130.74, 130.61, 130.53, 129.64, 129.55, 129.01, 128.84, 128.61, 122.91, 119.65, 30.84. HRMS (ESI) ([M+H]+) Calcd. for C20H17N2O: 301.1341,Found: 301.1341.3e: 1H NMR (400 MHz, CDCl3): δ 7.96 (d, J= 7.6 Hz, 1H), 7.72−7.66 (m, 3H), 7.59−7.56 (m, 2H), 7.47−7.45(m, 2H), 7.38−7.33 (m, 5H); 13C NMR (100 MHz, CDCl3): δ 195.78, 151.93, 150.34, 139.14, 136.87, 136.21, 132.71, 131.54, 130.99, 130.93, 130.69, 129.40, 128.98, 128.87, 128.69, 128.67, 128.31, 122.86, 120.52. HRMS (ESI) ([M+H]+) Calcd. for C19H14ClN2O: 321.0795,Found: 321.0793.3f: 1H NMR (400 MHz, CDCl3): δ 7.82 (d, J = 8.4 Hz, 1H), 7.68 (dd, J = 8.8 Hz, J = 5.6 Hz, 2H), 7.53−7.49 (m, 1H), 7.44−7.41 (m, 2H), 7.37−7.35 (m, 2H), 7.24−7.18 (m, 3H), 6.91 (d, J = 8.4 Hz, 2H);13C NMR (100 MHz, CDCl3): δ 195.40, 165.35 (d, J C−F = 253.5 Hz), 157.77, 150.08, 136.36, 134.70 (d, J C−F = 3.0 Hz), 131.84 (d, J C−F = 9.1 Hz), 131.42, 130.82 (d, J C−F = 5.4 Hz), 128.86, 128.53, 122.72, 120.17, 115.37 (d, J C−F = 22.0 Hz). HRMS (ESI) ([M+H]+) Calcd. for C19H14FN2O: 305.1090, Found: 305.1090.3l: 1H NMR (400 MHz, CDCl3): δ 7.85 (d, J = 7.6 Hz, 1H), 7.56−7.54 (m, 2H), 7.49 (d, J = 3.2 Hz, 3H), 7.44 (d, J= 7.2 Hz,, 2H), 7.39−7.37 (m, 3H), 7.28−7.14 (m, 2H), 2.24 (s, 3H); 13C NMR (100 MHz, CDCl3): δ 197.25, 152.11, 150.41, 138.50, 138.09, 137.21, 133.49, 131.25, 130.72, 130.67, 129.74, 128.84, 128.72, 128.18, 126.88, 122.89, 119.84, 29.67. HRMS (ESI) ([M+H]+) Calcd. for C20H17N2O: 301.1341, Found: 301.1348.3p: 1H NMR (400 MHz, CDCl3): δ 8.22 (d, J = 2.0 Hz, 1H), 8.01 (dd, J = 6.0 Hz, J = 1.2 Hz, 1H), 7.83 (dd, J = 8.8 Hz, J = 2.4 Hz, 1H), 7.75−7.71 (m, 1H), 7.66−7.62 (m, 1H), 7.58 (dd, J = 7.6 Hz, J = 1.2 Hz, 1H), 7.53 (d, J = 8.4 Hz, 1H), 7.48−7.46 (m, 2H), 7.42−7.36 (m, 3H); 13C NMR (100 MHz, CDCl3): δ 193.53, 151.58, 150.48, 138.17, 133.95, 132.72, 132.01, 131.83, 131.24, 130.87, 129.14, 128.86, 125.66, 122.80, 122.05. HRMS (ESI) ([M+H]+) Calcd. for C19H13ClN3O3: 366.0645, Found: 366.0644.3s: 1H NMR (400 MHz, CDCl3): δ 7.92 (7.2 Hz, 1H), 7.67−7.61 (m, 4H), 7.59−7.53 (m, 2H), 7.42−7.39 (m, 3H), 6.99 (d, J = 2.8 Hz, 1H), 6.47−6.46 (m, 1H); 13C NMR (100 MHz, CDCl3): δ 184.17, 153.39, 152.23, 150.62, 146.73, 136.12, 131.44, 131.18, 130.65, 128.99, 128.76, 122.99, 119.54, 119.27, 112.26. HRMS (ESI) ([M+H]+) Calcd. for C17H13N2O2: 277.0977,Found: 277.0970.3u: 1H NMR (400 MHz, CDCl3): δ 7.89 (dd, J = 7.6 Hz, J = 2.0 Hz, 2H), 7.79−7.76 (m, 1H), 7.57−7.50 (m, 6H), 2.89 (t,J= 7.2 Hz, 2H), 1.76−1.57 (m, 2H), 0.94 (t, J= 7.2 Hz, 3H); 13C NMR (100 MHz, CDCl3): δ 205.75, 152.42, 150.05, 138.93, 131.61, 131.01, 130.77, 129.22, 127.95, 123.22, 118.55, 46.95, 29.69, 17.92. HRMS (ESI) ([M+H]+) Calcd. for C16H17N2O: 253.1341,Found: 253.1339.OMeNNOMeO3v: 1H NMR (400 MHz, CDCl3): δ 7.93 (d, J= 8.8 Hz, 1H), 7.79–7.76 (m, 2H), 7.46−7.44 (m, 1H), 7.38−7.34 (m, 4H), 7.14−7.11 (m, 1H), 7.03 (d, J = 6.8 Hz, 1H), 6.79 (dd, J = 6.8 Hz, J = 1.6 Hz, 2H), 3.89 (s, 3H), 3.79 (s, 3H); 13C NMR (100 MHz, CDCl3): δ 196.99, 161.79, 161.31, 146.45, 144.55, 138.44, 138.28, 132.60, 129.26, 128.24, 124.39, 121.92, 116.69, 113.96, 112.88, 55.75, 55.43. HRMS (ESI) ([M+H]+) Calcd. for C21H19N2O3: 347.1396,Found: 347.1392.4i: 1H NMR (CDCl3, 400 MHz): δ 7.88 (d, J = 8.4 Hz, 1H), 7.80 (d, J = 8.8 Hz, 1H), 7.65 (d, J = 8.0 Hz, 4H), 7.54–7.37 (m, 11H), 7.21–7.17 (m, 1H); 13C NMR (CDCl3, 100 MHz): δ 148.97, 140.77, 140.19, 139.95, 134.91, 129.87, 128.92, 128.76, 128.65, 128.17, 127.59, 127.23, 126.90, 126.86, 125.95, 122.48, 121.17, 120.42, 117.42. HRMS (ESI) ([M+H]+) Calcd. for C25H19N2: 347.1548, Found: 347.1548.4j: 1H NMR (CDCl3, 400 MHz): δ 7.96–7.90 (m, 3H), 7.69 (d, J = 8.0 Hz, 1H), 7.51–7.35 (m, 8H), 7.23–7.19 (m, 3H), 7.19–7.06 (m, 1H); 13C NMR (CDCl3, 100 MHz): δ 148.79, 140.13, 133.82, 133.59, 131.89, 129.50, 129.37, 128.67, 128.32, 127.80, 127.49, 126.93, 126.70, 126.20, 125.48, 125.18, 124.89, 123.31, 122.18, 120.73, 117.73. HRMS (ESI) ([M+H]+) Calcd. for C23H17N2: 321.1392, Found: 321.1388.4m[2]: 1H NMR (CDCl3, 400 MHz): δ 7.82 (dd, J = 9.2 Hz, J = 1.2 Hz, 1H), 7.44–7.41 (m, 3H), 7.36–7.22 (m, 8H), 7.09–7.05 (m, 1H), 1.93 (s, 3H); 13C NMR (CDCl3, 100 MHz): δ 148.76, 140.34, 137.69, 135.16, 131.05, 130.56, 129.55, 129.18, 128.79, 127.77, 126.89, 125.96, 124.68, 122.51, 122.02, 120.61, 117.62, 112.19, 19.79.NNCl4n: 1H NMR (CDCl3, 400 MHz): δ 7.83 (d, J = 8.8 Hz, 1H), 7.48–7.41 (m, 4H), 7.37–7.27 (m, 7H), 7.13–7.09 (m, 1H); 13C NMR (CDCl3, 100 MHz): δ 148.69, 140.19, 134.48, 132.60, 132.52, 130.40, 130.10, 129.34, 128.82, 128.04, 126.86, 124.94, 122.64, 122.39, 120.43, 117.77. HRMS (ESI) ([M+H]+) Calcd. for C19H14ClN2: 305.0846, Found: 305.0849.NNF4o: 1H NMR (CDCl3, 400 MHz): δ 7.86 (d, J = 8.8 Hz, 1H), 7.61 (dd, J = 8.4 Hz, J = 0.8 Hz, 1H), 7.49–7.45 (m, 2H), 7.42–7.34 (m, 6H), 7.22–7.09 (m, 3H); 13C NMR (CDCl3, 100 MHz): δ 159.49 (d, J C−F = 249.0 Hz), 148.89, 140.33, 131.79 (d, J C−F = 2.5 Hz), 130.81 (d, J C−F = 7.9 Hz), 129.46, 128.84, 128.15, 126.85, 125.03, 124.35 (d, J= 3.8 Hz), 122.58 (d, J C−F= 6.5 Hz), 120.24 (d, J C−F= 1.6 Hz), 117.78, 116.25 (d, J C−F = 21.4 Hz).HRMS (ESI) ([M+H]+) Calcd. for C19H14FN2: 289.1141, Found: 289.1140.NNNH24p: 1H NMR (CDCl3, 400 MHz): δ 7.78 (d, J = 8.4 Hz, 1H), 7.66 (d, J = 8.0 Hz, 1H), 7.44–7.33 (m, 6H), 7.25–7.23 (m, 1H), 7.13–7.10 (m, 1H), 6.74 (s, 1H), 6.59 (d, J = 8.0 Hz, 1H), 4.11 (br, 2H); 13C NMR (CDCl3, 100 MHz): δ 148.87, 143.19, 140.06, 134.57, 129.72, 129.34, 128.96, 128.26, 126.98, 125.81,122.50, 121.68, 120.37, 120.17, 119.34, 117.69, 116.42. HRMS (ESI) ([M+H]+) Calcd. for C19H15ClN3: 320.0955, Found: 320.0955.NNOMeMeO4q: 1H NMR (CDCl3, 400 MHz): δ 7.78 (d, J = 8.8 Hz, 1H), 7.71 (d, J = 8.8 Hz, 1H), 7.46–7.43 (m, 2H), 7.40–7.32 (m, 4H), 7.13–7.09 (m, 1H), 6.99 (dd, J = 8.0 Hz, J = 2.0 Hz, 1H), 6.89–6.87 (m, 1H), 6.73 (d, J= 2.0 Hz, 1H), 3.88 (s, 3H), 3.62 (s, 3H);13C NMR (CDCl3, 100 MHz): δ 148.99, 148.81, 140.23, 135.24, 128.81, 128.03, 126.78, 125.92, 122.24, 122.15, 121.31, 120.39, 117.58, 112.60, 111.20, 55.70, 55.55. HRMS (ESI) ([M+H]+) Calcd. for C21H19N2O2: 331.1447, Found: 331.1445.4u: 1H NMR (CDCl3, 400 MHz): δ 7.74 (d, J = 8.8 Hz, 1H), 7.77 (d, J = 8.4 Hz,1H), 7.56–7.48 (m, 5H), 7.36–7.31 (m, 1H), 7.10–7.06 (m, 1H), 3.02 (t, J = 8.0 Hz, 2H), 1.74–1.65 (m, 2H), 0.92–0.86 (m,3H); 13C NMR (CDCl, 100 MHz): δ 148.56, 140.09, 136.59, 129.06, 128.77, 126.53, 126.14, 121.10, 120.82,3120.17, 117.53, 114.99, 27.21, 22.69, 13.86. HRMS (ESI) ([M+H]+) Calcd. for C16H17N2: 237.1392, Found: 237.1391.4v[3]: 1H NMR (CDCl3, 400 MHz): δ 7.70 (d, J = 9.2 Hz, 1H), 7.42–7.31 (m, 7H), 7.07 (dd, J = 8.8 Hz, J = 2.4 Hz, 1H), 6.91–6.86 (m, 3H), 3.83 (s, 3H), 3.82 (s, 3H); 13C NMR (CDCl3, 100 MHz): δ 159.13, 155.76, 145.59, 134.16, 133.42, 130.35, 129.50, 128.73, 127.92, 126.97, 121.76, 121.38, 119.05, 114.03, 96.31, 55.43, 55.38.4w: 1H NMR (CDCl3, 400 MHz): δ 7.76 (d, J = 8.8 Hz, 1H), 7.49 (s, 1H), 7.41–7.33 (m, 7H), 7.23 (dd, J = 8.8 Hz, J = 1.2 Hz, 1H), 7.18 (d, J = 8.8 Hz, 2H), 2.46 (s, 3H), 2.39 (s, 3H); 13C NMR (CDCl3, 100 MHz): δ 147.77, 137.91, 137.75, 134.22, 131.69, 130.13, 129.67, 129.54, 129.39, 128.56, 127.93, 125.58, 121.83, 118.31, 117.30, 21.72, 20.99. HRMS (ESI) ([M+H]+) Calcd. for C21H19N2: 299.1548, Found: 299.1545.4x: 1H NMR (CDCl3, 400 MHz): δ 7.72 (d, J = 9.6 Hz, 1H), 7.67 (s, 1H), 7.43–7.40 (m, 3H), 7.38–7.35 (m, 4H), 7.34–7.28 (m, 3H);13C NMR (CDCl3, 100 MHz): δ 195.29, 150.23, 148.38, 138.52, 137.86, 137.66, 137.36, 133.15, 130.93, 129.35, 129.24, 128.78, 128.48, 124.13, 121.07. HRMS (ESI) ([M+H]+) Calcd. for C19H13Cl2N2: 339.0456, Found: 339.0455.6. 1H and 13C NMR spectra of the products。