Integrated Electrical and Thermal Solution for Inv
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专利名称：Integrated Electrical and Thermal Solution
for Inverter DC-Link Capacitor Packaging
发明人：Lihua Chen,Chingchi Chen,Shahram Zarei
申请号：US13891167
申请日：20130509
公开号：US20140334105A1
公开日：
20141113
专利内容由知识产权出版社提供
专利附图：
摘要：An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements
electrically coupled to a bus bar, and a thermally enhanced isolation layer between the
bus bar and a case. The isolation layer can be provided adjacent a case base and sidewall portions. The bus bar can be disposed adjacent the isolation layer and be configured to extend along the package side and along the package length below the capacitor elements to provide an extended path for heat dissipation from the bus bar prior to its contact with capacitor elements. The enhanced isolation layer is configured to conduct heat away from the bus bar to the case to avoid the hotspot temperature of the capacitor. Reduced capacitor temperature allows use of smaller, cheaper capacitors, reducing inverter costs without compromising performance.
申请人：FORD GLOBAL TECHNOLOGIES, LLC
地址：Dearborn MI US
国籍：US
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