SMT回焊炉DOE实验
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Pareto of factor’s contribution to output
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3. Process Parameter-Setting by DOE- Reflow Process Step6. Analyse DOE Data by ANOVA (3)
Factor’s level response to output
Step1. Define the type of problem
Problem Type Problem cause Factor level settings Solution Tool T type clear clear QC tools A type clear unclear DOE X type unclear unclear DOE
Step2. Define the goal expected by DOE
Output Index Dppm of Reflow Dppm of Wave Measurements no failure joints by visual with 10X Magnifier no failure joints by visual with 10X Magnifier Goal 150 1500
Q'ty per run 30 30 30 30 30 30 30 30
run order
e
e
Void
Bridge
sum
(DPPM) (DPPM) (DPPM)
1 5 6 2 3 7 8 4
1 2 1 2 2 1 2 1
1 2 2 1 2 1 1 2
218 2832 4139 218 327 3595 2832 0
OSP finish
Confidential
Reflow Soldering DOE Implementation
Confidential
3. Process Parameter-Setting by DOE- Reflow Process
Step4. Select Factor and Level for DOE
Confidential
3. Process Parameter-Setting by DOE- overview (2)
Photo1: L1704 Interface B For Typical Reflow Soldering Immersion Tin finish
Photo2: L1704 Power B For Typical Wave Soldering
Step8. Reproducibility Verification on Selected Combination
Run 100pcs under selected combination, No defect is found, so DOE is decided to be successful compared to the defined goal.
A: pre-heat time A1=60s A2=40s 1 1 1 1 2 2 2 2 B: active temp B1=150C B2=170C 1 1 2 2 1 1 2 2 C: reflow interaction of temp A*B C1=230C C2=245C 1 1 2 2 2 2 1 1 1 2 1 2 1 2 1 2 D:Solder Model D1=SAC305 OM338 D2=TLF-207-93 1 2 2 1 1 2 2 1
Step3. Select PCBA Type for DOE implementation
Basing on the complexity of L1704 interface board PCBA-see photo1, its reflow process can be thought typical. Basing on the complexity of L1704 power board PCBA-see photo2 , its wave soldering process can be thought typica60cm/min.
Confidential
3. Process Parameter-Setting by DOE- Reflow Process
Step5. Select orthogonal table for combination L827 and Run DOE
Select Factor and Level for DOE Select orthogonal table for Level combination and Run DOE Analyse DOE Data by ANOVA
Step 5 Step 6
Step 7
Decide what level of selected factors will be used
Level 1
Level 2
Confidential
3. Process Parameter-Setting by DOE- Reflow Process Step6. Analyse DOE Data by ANOVA (4)
Interaction response to output
Confidential
Step 8 Step 9
Reproducibility Verification on selected combination Standardize DOE result into SOP
Confidential
3. Process Parameter-Setting by DOE- overview (1)
note:
Contribution % Order Contribution % Accumulation %
0.0 0.2 5.4 6.4 #DIV/0! 36.3 F(1,2,0.05)=18.51, F(1,2,0.01)=98.50 Fk >18.51 significant factor * , Fk >98.5 very signifact factor** 3.98% 0.01% 0.43% 10.69% 12.67% #DIV/0! effor (e) 3.98% 100.00% 72.23%
● ● ● Y Y Y
A:preheating time B: active temp C:reflow peak temp D: solder type
Note: ● ●
● ● ●
●
●
Y
A1=60S A2=40S B1=150C B2=170C C1=230C C2=245 D1=Alpha SAC305 OM325 D2=TLF-207-93
DOE Factors Anlysis factors effect on output complexity Used as if no used by DOE, If used, select level of Level DOE factor how about the fixed settings change (Y/N) settings?
980 0 1634 0 1852 654 654 0
1198 2832 5773 218 2179 4248 3486 0
Confidential
3. Process Parameter-Setting DOE- Reflow Process
Step6. Analyse DOE Data by ANOVA (1)
#DIV/0!
D 72.23% 72.23%
C 12.67% 84.90%
AxB 10.69% 95.59%
B 0.43% 96.02%
A 0.01% 96.02%
Confidential
3. Process Parameter-Setting DOE- Reflow Process
Step6. Analyse DOE Data by ANOVA (2)
Contents
2. DOE----Execution Step 3. Reflow Soldering DOE Implementation
Confidential
2. DOE----Execution Step
Step 1 Step 2 Step 3 Step 4 Define the type of problem Define the goal expected by DOE implementation Select typical product for DOE running
FB310 profile is selected since its max temperature is higher than others
significant effect; very easy to change Medium effect; easier to change
DOE Running background: Reflow Soldering Machine Model: FOLUNG NW-850N
3. Process Parameter-Setting by DOE- Reflow Process
Step7. Decide what level of selected factors will be used
1. From the chart of “Factor’s level response to output ”, we can see that factor “D” namely “solder paste model” is a significant factor to output. 2. The optimum combination for defined parameters is A2B2C2, which output can be far lower than goal-setting. Pre-heat time: 40 seconds Active temp: 170。C Reflow temp: 245。C Solder Paste Type: SAC305 OM325
avg= Level 1 response Level 2 response 2491.83 A 2505.4 2478.2 B 2614.4 2369.3 A1B1 A1B2 A2B1 A2B2 Si Factors Si total of e =effor sum 28109737.0 26991340.0 1118397.0 error (e) df=Φ i Vi=Si/Φ i Fk=Vk/Ve 2 559198.5 A 1 1483.3 B 1 120146.1 AxB 1 3003652.4 C 1 3561367.7 #DIV/0! e D 1 20304690.5 #DIV/0! #DIV/0! e 1483.3 1483.3 120146.1 120146.1 AxB 1879.1 3104.6 2015.3 2995.6 3213.5 1742.9 3003652.4 3003652.4 3561367.7 3561367.7 784657.8 20304690.5 20304690.5 333739.2 C 3159.0 1824.6 e 2805.0 2178.6 D 898.7 4085.0 e 2287.6 2696.1
As far as Pb-free soldering process is concerned, problem causes such as bridge, void are same as Pb soldering process, so basing on long-term experience in soldering industry, “A” type problem for Pb-free process optimization is selected.
Confidential
3. Process Parameter-Setting by DOE- Reflow Process Step6. Analyse DOE Data by ANOVA (3)
Factor’s level response to output
Step1. Define the type of problem
Problem Type Problem cause Factor level settings Solution Tool T type clear clear QC tools A type clear unclear DOE X type unclear unclear DOE
Step2. Define the goal expected by DOE
Output Index Dppm of Reflow Dppm of Wave Measurements no failure joints by visual with 10X Magnifier no failure joints by visual with 10X Magnifier Goal 150 1500
Q'ty per run 30 30 30 30 30 30 30 30
run order
e
e
Void
Bridge
sum
(DPPM) (DPPM) (DPPM)
1 5 6 2 3 7 8 4
1 2 1 2 2 1 2 1
1 2 2 1 2 1 1 2
218 2832 4139 218 327 3595 2832 0
OSP finish
Confidential
Reflow Soldering DOE Implementation
Confidential
3. Process Parameter-Setting by DOE- Reflow Process
Step4. Select Factor and Level for DOE
Confidential
3. Process Parameter-Setting by DOE- overview (2)
Photo1: L1704 Interface B For Typical Reflow Soldering Immersion Tin finish
Photo2: L1704 Power B For Typical Wave Soldering
Step8. Reproducibility Verification on Selected Combination
Run 100pcs under selected combination, No defect is found, so DOE is decided to be successful compared to the defined goal.
A: pre-heat time A1=60s A2=40s 1 1 1 1 2 2 2 2 B: active temp B1=150C B2=170C 1 1 2 2 1 1 2 2 C: reflow interaction of temp A*B C1=230C C2=245C 1 1 2 2 2 2 1 1 1 2 1 2 1 2 1 2 D:Solder Model D1=SAC305 OM338 D2=TLF-207-93 1 2 2 1 1 2 2 1
Step3. Select PCBA Type for DOE implementation
Basing on the complexity of L1704 interface board PCBA-see photo1, its reflow process can be thought typical. Basing on the complexity of L1704 power board PCBA-see photo2 , its wave soldering process can be thought typica60cm/min.
Confidential
3. Process Parameter-Setting by DOE- Reflow Process
Step5. Select orthogonal table for combination L827 and Run DOE
Select Factor and Level for DOE Select orthogonal table for Level combination and Run DOE Analyse DOE Data by ANOVA
Step 5 Step 6
Step 7
Decide what level of selected factors will be used
Level 1
Level 2
Confidential
3. Process Parameter-Setting by DOE- Reflow Process Step6. Analyse DOE Data by ANOVA (4)
Interaction response to output
Confidential
Step 8 Step 9
Reproducibility Verification on selected combination Standardize DOE result into SOP
Confidential
3. Process Parameter-Setting by DOE- overview (1)
note:
Contribution % Order Contribution % Accumulation %
0.0 0.2 5.4 6.4 #DIV/0! 36.3 F(1,2,0.05)=18.51, F(1,2,0.01)=98.50 Fk >18.51 significant factor * , Fk >98.5 very signifact factor** 3.98% 0.01% 0.43% 10.69% 12.67% #DIV/0! effor (e) 3.98% 100.00% 72.23%
● ● ● Y Y Y
A:preheating time B: active temp C:reflow peak temp D: solder type
Note: ● ●
● ● ●
●
●
Y
A1=60S A2=40S B1=150C B2=170C C1=230C C2=245 D1=Alpha SAC305 OM325 D2=TLF-207-93
DOE Factors Anlysis factors effect on output complexity Used as if no used by DOE, If used, select level of Level DOE factor how about the fixed settings change (Y/N) settings?
980 0 1634 0 1852 654 654 0
1198 2832 5773 218 2179 4248 3486 0
Confidential
3. Process Parameter-Setting DOE- Reflow Process
Step6. Analyse DOE Data by ANOVA (1)
#DIV/0!
D 72.23% 72.23%
C 12.67% 84.90%
AxB 10.69% 95.59%
B 0.43% 96.02%
A 0.01% 96.02%
Confidential
3. Process Parameter-Setting DOE- Reflow Process
Step6. Analyse DOE Data by ANOVA (2)
Contents
2. DOE----Execution Step 3. Reflow Soldering DOE Implementation
Confidential
2. DOE----Execution Step
Step 1 Step 2 Step 3 Step 4 Define the type of problem Define the goal expected by DOE implementation Select typical product for DOE running
FB310 profile is selected since its max temperature is higher than others
significant effect; very easy to change Medium effect; easier to change
DOE Running background: Reflow Soldering Machine Model: FOLUNG NW-850N
3. Process Parameter-Setting by DOE- Reflow Process
Step7. Decide what level of selected factors will be used
1. From the chart of “Factor’s level response to output ”, we can see that factor “D” namely “solder paste model” is a significant factor to output. 2. The optimum combination for defined parameters is A2B2C2, which output can be far lower than goal-setting. Pre-heat time: 40 seconds Active temp: 170。C Reflow temp: 245。C Solder Paste Type: SAC305 OM325
avg= Level 1 response Level 2 response 2491.83 A 2505.4 2478.2 B 2614.4 2369.3 A1B1 A1B2 A2B1 A2B2 Si Factors Si total of e =effor sum 28109737.0 26991340.0 1118397.0 error (e) df=Φ i Vi=Si/Φ i Fk=Vk/Ve 2 559198.5 A 1 1483.3 B 1 120146.1 AxB 1 3003652.4 C 1 3561367.7 #DIV/0! e D 1 20304690.5 #DIV/0! #DIV/0! e 1483.3 1483.3 120146.1 120146.1 AxB 1879.1 3104.6 2015.3 2995.6 3213.5 1742.9 3003652.4 3003652.4 3561367.7 3561367.7 784657.8 20304690.5 20304690.5 333739.2 C 3159.0 1824.6 e 2805.0 2178.6 D 898.7 4085.0 e 2287.6 2696.1
As far as Pb-free soldering process is concerned, problem causes such as bridge, void are same as Pb soldering process, so basing on long-term experience in soldering industry, “A” type problem for Pb-free process optimization is selected.