CS4952中文资料

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AD9520-0_cn

AD9520-0_cn

图1.
应用
低抖动、低相位噪声时钟分配 SONET、10Ge、10GFC、同步以太网、 OTU2/3/4的时钟产生 和转换 前向纠错(G.710) 为高速ADC、DAC、DDS、DDC、DUC、MxFE提供时钟 高性能无线收发器 自动测试设备(ATE)和高性能仪器仪表 宽带基础设施
ADI中文版数据手册是英文版数据手册的译文,敬请谅解翻译中可能存在的语言组织或翻译错误,ADI不对翻译中存在的差异或由此产生的错误负责。如需确认任何词语的准确性,请参考ADI提供 的最新英文版数据手册。
07213-001
SPI/I2C CONTROL PORT AND DIGITAL LOGIC
EEPROM
功能框图
CP LF
REFIN
SWITCHOVER AND MONITOR
OPTIONAL
REF1
STATUS MONITOR
PLL
VCO
REFIN
REF2
CLK
DIVIDER AND MUXES
ZERO DELAY
LVPECL/ CMOS DIV/Φ
OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 OUT9 OUT10 OUT11
12路LVPECL/24路CMOS输出时钟 发生器,集成2.8 GHz VCO
AD9520-0
特性
低相位噪声锁相环(PLL) 片内VCO调谐范围:2.53 GHz至2.95 GHz 可选外部3.3 V/5 V VCO/VCXO至2.4 GHz 1路差分或2路单端参考输入 支持最高250 MHz的CMOS、LVDS或LVPECL参考 参考输入接受16.62 MHz至33.3 MHz晶振 可选参考时钟倍频器 参考监控功能 自动/手动参考保持和参考切换模式,恢复式切换 参考间无 毛刺切换 从保持模式自动恢复 可选数字或模拟锁定检测 可选零延迟工作 12路1.6 GHz LVPECL输出分为4组 每组3路输出,共享一个带相位延迟的1至32分频器 加性输出抖动低至225 fs rms 分组输出的通道间偏斜:<16 ps 可以将每路LVPECL输出配置为2路CMOS输出(fOUT ≤ 250 MHz) 上电时所有输出自动同步 提供手动输出同步 SPI和I²C兼容型串行控制端口 64引脚LFCSP封装 非易失性EEPROM存储配置设置

SN74AC245PWLE中文资料

SN74AC245PWLE中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-87758012A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8775801RA ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type 5962-8775801SA ACTIVE CFP W201TBD A42N/A for Pkg Type 5962-8775801VRA ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type5962-8775801VSA ACTIVE CFP W201TBD A42N/A for Pkg Type SN74AC245DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74AC245DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74AC245NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74AC245NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC245PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74AC245PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AC245PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54AC245FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54AC245J ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SNJ54AC245W ACTIVE CFP W201TBD A42N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.6-Dec-2006TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Dec-2006TAPE AND REELINFORMATION24-Apr-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AC245DBR DB 20MLA 330168.27.5 2.51216Q1SN74AC245DWR DW 20MLA 3302410.813.0 2.71224Q1SN74AC245NSRNS 20MLA 330248.213.0 2.51224Q1SN74AC245PWRPW20MLA330166.957.11.6816Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length (mm)Width (mm)Height (mm)SN74AC245DBR DB 20MLA 333.2333.228.58SN74AC245DWR DW 20MLA 333.2333.231.75SN74AC245NSR NS 20MLA 333.2333.231.75SN74AC245PWRPW20MLA333.2333.228.5824-Apr-200724-Apr-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

CS4922-CL资料

CS4922-CL资料

Preliminary Product InformationThis document contains information for a new product.Cirrus Logic reserves the right to modify this product without notice.1Copyright © Cirrus Logic, Inc. 1999(All Rights Reserved)P.O. Box 17847, Austin, Texas 78760(512) 445 7222 FAX: (512) 445 7581CS4922MPEG/G.729A Audio Decoder SystemFeaturesl DSP Optimized for Audio Decode, 24-bitFixed Point w/48-bit Accumulator l On-Chip Functional Blocks Include:-DSP with RAM and ROM Memories-CD Quality Stereo DAC with Output Filtering -Mono Output & Digital Volume Control-S/PDIF Transmitter, Bidirectional PCM Audio Port-Internal Phase Locked Loop for Clocking -Dedicated Compressed Serial Input Interfacel MPEG-1 & MPEG-2 Layers 1 & 2 With AllSample/Bit Rates and Ancillary Data Support.l MPEG-1 & MPEG-2 Packetized Audio Stream and Elementary Stream Input l G.729A Audio Decodel PCM Synthesis for Auxiliary Audiol Pin Compatibility with CS4920A and Primary Feature/Firmware Compatiblel +5 Volt Only CMOS, 44 pin PLCCDescriptionThe CS4922 is a complete audio decompression sub-system implemented in a single high integration mixed signal CMOS chip. The CS4922 has been widely used in direct broadcast system set-top boxes and proprietary embedded systems which pull compressed audio from local system memory.The CS4922 is tailored to include the necessary hard-ware and firmware to ensure proper audio/video synchronization for MPEG-2 audio decompression. In addition to audio decoding this programmable DSP solu-tion provides robust error concealment and feature implementations like ancillary data support and PCM synthesis.The CS4922 can also support the decode of other com-pression standards such as G.729A with a separate download image. The flexible architecture of the CS4922provides the ability to mix compressed audio with data from the auxiliary PCM port.ORDERING INFORMATIONCS4922-CL 44-pin PLCC CDB4922Evaluation BoardVD1VD4SCK/SCL SDA/CDOUT CDIN CS REQVA+Serial Control Port (SPI or I 2C)AUXLR AUXIN AUXOUT AUXCLK FSYNC SCLK SDATA Auxiliary Serial Audio Port Serial Audio PortRESET 90_CLK BOOT33 bit CounterDGND1DGND4DSPFLT CLKIN EXTCK ALTCLK CLKOUT PLL +Clock ManagerStereo DACAOUTM AOUTL AOUTR AES/EBU - S/PDIF TX TransmitterProgrammable IO/ PinsPIO XF1XF2XF3XF4AGND1AGND2JUL ‘99DS227PP2TABLE OF CONTENTS1CHARACTERISTICS AND SPECIFICATIONS (4)ANALOG CHARACTERISTICS (4)D/A INTERPOLATION FILTER CHARACTERISTICS (4)ABSOLUTE MAXIMUM RATINGS (5)RECOMMENDED OPERATING CONDITIONS (5)DIGITAL CHARACTERISTICS (5)SWITCHING CHARACTERISTICS - CLOCKS (6)SWITCHING CHARACTERISTICS - EXTERNAL FLAGS (6)SWITCHING CHARACTERISTICS - PROGRAMMABLE INPUT/OUTPUT (6)SWITCHING CHARACTERISTICS - BOOT INITIALIZATION (7)SWITCHING CHARACTERISTICS - CONTROL PORT (SPI MODE) (8)SWITCHING CHARACTERISTICS - CONTROL PORT (I2C MODE) (10)SWITCHING CHARACTERISTICS - SERIAL AUDIO PORT (12)SWITCHING CHARACTERISTICS - AUXILIARY DIGITAL AUDIO PORT (13)2TYPICAL CONNECTION DIAGRAM (14)3THEORY OF OPERATION (15)3.1Introduction (15)4PERIPHERALS (15)4.1Clock Manager (15)4.233-bit Counter (16)4.3Digital to Analog Converter (16)4.4Digital Audio Transmitter (17)4.5Audio Serial Input Port (17)4.6Auxiliary Digital Audio Port (17)4.7Serial Control Port (17)4.7.1I2C Mode (18)4.7.2Rise Time on SCL/SCK (20)4.7.3SPI mode (20)4.8External Flag Pins (22)5BOOT PROCEDURE (23)6POWER SUPPLY AND GROUNDING (24)7DAC FILTER RESPONSE PLOTS (26)8PIN DESCRIPTIONS (27)Power Supplies (27)Digital-to-Analog Converter (28)Serial Audio Port (28)Digital Audio Transmitter (28)Clock Manager (28)Control (29)Serial Control Port (30)Auxiliary Digital Audio Port (30)9PARAMETER DEFINITIONS (31)10PACKAGE DIMENSIONS (32)Contacting Cirrus Logic SupportFor a complete listing of Direct Sales, Distributor, and Sales Representative contacts, visit the Cirrus Logic web site at: /corporate/contacts/I2C is a registered trademark of Philips Semiconductor.Preliminary product information describes products which are in production, but for which full characterization data is not yet available. Advance product infor-mation describes products which are in development and subject to development changes. Cirrus Logic, Inc. has made best efforts to ensure that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provid ed “AS IS” without warranty of any kind (express or implied). No responsibility is assumed by Cirrus Logic, Inc. for the use of this information, nor for infringements of patents or other rights of third parties. This document is the property of Cirrus Logic, Inc. and implies no license under patents, copyrights, trademarks, or trade secrets. No part of this publication may be copied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photographic, or otherwise) without the prior written consent of Cirrus Logic, Inc. Items from any Cirrus Logic website or disk may be printed for use by the user. However, no part of the printout or electronic files may be copied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means (electronic, mechanical, photographic, or otherwise) without the prior written consent of Cirrus Logic, Inc.Furthermore, no part of this publication may be used as a basis for manufacture or sale of any items without the prior written consent of Cirrus Logic, Inc. The names of products of Cirrus Logic, Inc. or other vendors and suppliers appearing in this document may be trademarks or service marks of their respective owners which may be registered in some jurisdictions. A list of Cirrus Logic, Inc. trade-marks and service marks can be found at .2LIST OF FIGURESFigure 1.Boot Timing (7)Figure 2.SPI Control Port Timing (9)Figure 3.I2C® Control Port Timing (11)Figure 4.Serial Audio Port Timing (12)Figure 5.Auxiliary Audio Port Timing (13)Figure 6.Typical Connection Diagram (14)Figure 7.CLKOUT Generation Circuit (16)Figure 8.DAC (16)Figure 9.Auxiliary Data Input Formats (17)Figure 10.Auxiliary Data Output Formats (17)Figure 11.Multi-channel Auxiliary Data Formats (18)Figure 12.Control Port Timing, I2C® Write (19)Figure 13.Serial Control Port (19)Figure 14.Control Port Timing, I2C® Read (20)Figure 15.I2C® Connection Diagram (21)Figure 16.Control Port Timing, SPI Write (21)Figure 17.Control Port Timing, SPI Read (22)Figure 18.CS4922 Suggested Layout (24)Figure 19.CS4922 Surface Mount Decoupling Layout (25)Figure 20.DAC Frequency Response (26)Figure 21.DAC Phase Response (26)Figure 22.DAC Transition Band (26)Figure 23.DAC Passband Ripple (26)341CHARACTERISTICS AND SPECIFICATIONSANALOG CHARACTERISTICS (T A = 25 °C; VA+, VD+ = 5V; CLKIN = 27 MHz; Full-Scale OutputSinewave, 1.125 kHz; Word Clock = 48 kHz (PLL in use); Logic 0 = GND, Logic 1 = VD+; Measurement Bandwidth is 20 Hz to 20 kHz; Local components as shown in "Typical Connection Diagram"; SPI mode, I 2S audio data; unless otherwise specified.)Notes: 1.10 k Ω, 100pF load for each analog signal (Left, Right).30 k Ω, 100pF load for analog Mono signal.D/A INTERPOLATION FILTER CHARACTERISTICS (See Figures 20 through 23)* Refer to Parameter Definitions on page 31 of this data sheet.Specifications are subject to change without notice.Parameter*SymbolMin Typ Max Units Dynamic PerformanceDAC Resolution16--Bits DAC Differential Nonlinearity DNL--±0.9LSB Total Harmonic Distortion AOUTL, AOUTR (Note 1)AOUTM THD -0.010.020.0150.03%Instantaneous Dynamic Range AOUTL, AOUTR (Note 1)(DAC not muted, A weighted)AOUTMIDR85809085-dB Interchannel Isolation (Note 1)-85-dB Interchannel Gain Mismatch --0.2dB Frequency Response -3.0-+0.2dB Full Scale output Voltage AOUTL, AOUTR (Note 1)AOUTM2.662.7 2.883.0 3.23.3Vpp Gain Drift-100-ppm/°C Deviation from Linear Phase --5Deg Out of Band Energy (Fs/2 to 2Fs)--60-dB Analog Output Load Resistance:Capacitance:8----100k ΩpF Power SupplyPower Supply Rejection (1 kHz)-40-dB Power Supply ConsumptionVA+VD+--2010040140mA mAParameterSymbolMin Typ Max Units Passband (to -3 dB corner)(Fs is conversion freq.).0-0.476Fs Hz Passband Ripple. --±0.1dB Transition Band. 0.442Fs -0.567FsHz Stop Band.≥0.567Fs--Hz Stop Band Rejection.50--dB Stop Band Rejection with Ext. 2Fs RC filter.57--dB Group Delay. -12/Fs-s5ABSOLUTE MAXIMUM RATINGS (AGND, DGND = 0V, all voltages with respect to ground.)WARNING:Operation at or beyond these limits may result in permanent damage to the device. Normal operation is not guaranteed at these extremes.RECOMMENDED OPERATING CONDITIONS (AGND, DGND = 0V; all voltages with respectto ground.)DIGITAL CHARACTERISTICS (T A = 25 °C; VA+, VD+ = 5V ±10%; measurements performed understatic conditions.)Notes: 2.Not Valid for pin numbers 9, 12, 13, and 30 which are configured with on-chip pull-down resistors. Notvalid for pin number 29 which is a static input signal and should be tied to either VD+ or DGND.ParameterSymbol Min Max Units DC Power Supplies:Positive Digital Positive Analog | | VA+ | - | VD+ | |VD+VA+-0.3-0.3- 6.06.00.4V V V Input Current, Any Pin Except Supplies I in -±10mA Digital Input VoltageV IND -0.3(VD+) + 0.4V Ambient Operating Temperature (power applied)T Amax -55125°C Storage TemperatureT stg-65150°CParameterSymbol Min Typ Max Units DC Power Supplies:Positive Digital Positive Analog | | VA+ | - | VD+ | |VD+VA+ 4.504.50- 5.05.0- 5.505.500.4V V V Ambient Operating TemperatureT A-70°CParameterSymbol Min Typ Max Units High-Level Input Voltage V IH TBD 2.25-V Low-Level Input VoltageV IL --0.8V High-Level Output Voltage at I o = -2.0 mA V OH VD x 0.9--V Low-Level Output Voltage at I o = 2.0 mA V OL --VD x 0.1V Input Leakage Current(Note 2)I in-- 1.0µA6SWITCHING CHARACTERISTICS - CLOCKS (T A = 25 °C; VA+, VD+ = 5V; Inputs: Logic 0 =DGND, Logic 1 = VD+, C L = 20pF)SWITCHING CHARACTERISTICS - EXTERNAL FLAGS (T A = 25 °C; VA+, VD+ = 5V;Inputs: Logic 0 = DGND, Logic 1 = VD+, C L = 20pF)Notes: 3.Assumes 2k Ω pull-up to 5V supply on XF1-XF4 pins.SWITCHING CHARACTERISTICS - PROGRAMMABLE INPUT/OUTPUT (T A = 25°C;VA+, VD+ = 5V; Inputs: Logic 0 = DGND, Logic 1 = VD+, C L = 20pF)ParameterSymbol MinTyp MaxUnits Master Clock Frequency CLKIN 27MHz Master Clock Duty Cycle CYCK 405060%Clock OutputCLKOUT--256 Fs MHzParameterSymbol MinTypMax Units Rise time of XF1-XF4(Note 3)t rxf 200ns Fall time of XF1-XF4t fxf100nsParameterSymbol MinTypMax Units I_O = 0Input Frequency f pio 350kHz Risetime of PIO t rpio 200ns Fall time of PIOt fpio 200ns I_O = 1Rise time of PIO t rpo 200ns Fall time of PIOt fpo200ns7SWITCHING CHARACTERISTICS - BOOT INITIALIZATION (T A = 25 °C; VA+, VD+ =5V; Inputs: Logic 0 = DGND, Logic 1 = VD+, C L = 20pF)Notes: 4.The mode of the Serial Control Port is selected by CS. CS = 1 is I 2C ® . CS = 0 is SPI mode.5.This delay is necessary after any rising edge of RESET to allow time for the part to initialize and forthe on-board PLL to stabilize.ParameterSymbol Min Max Units BOOT Setup Time to RESET Rising t bsu 350-ns RESET Rising to Boot Hold Time t bh 450-ns CS Setup Time to RESET Rising (Note 4)t cssu 200-ns RESET Rising to CS Hold Time t csh 400-ns RESET Low Timet rlow 50-µs SCK/SCL Delay Time from RESET Rising(Note 5)t rsc 2-ms SCK/SCL falling to CS rising on last byte of downloadt sfcr3-µsFigure 1. Boot Timing8SWITCHING CHARACTERISTICS - CONTROL PORT (SPI MODE) (T A = 25 °C;VA+, VD+ = 5V; Inputs: Logic 0 = DGND, Logic 1 = VD+, C L = 20pF)Notes: 6.Data must be held for sufficient time to bridge 300(50) ns transition time of SCK/SCL.7.CDOUT should NOT be sampled during this time period.8.REQ will only go HIGH if there is no data in SCPOUT at the rising edge of SCL/SCK during a READoperation as shown. DSP frequency is 20 MHz. Pull-up resistor is 2 k Ω. C L = 20 pF.9.If REQ went HIGH as indicated in note 7, then REQ will hold high at least until the next rising edge ofSCK/SCL. If data is in SCPOUT at this time REQ will go active LOW again. This condition should be treated as a new READ process. Address and R/W bit should be sent again.ParameterSymbolMin Max Units SPI Mode (CS = 0)SCK/SCL Clock Frequency (slow mode)(fast mode)f sck f sck --3502000kHz CS Falling to SCK/SCL Rising(slow mode)t css 20-ns Rise Time of Both CDIN and SCK/SCL Lines (slow mode)t r -50ns Fall Time of Both CDIN and SCK/SCL Lines (slow mode)(fast mode)t f t f --30050ns ns SCK/SCL Low Time (slow mode)(fast mode)t scl t scl 1100150--ns ns SCK/SCL High Time(slow mode)(fast mode)t sch t sch 1100150--ns ns Setup Time CDIN to SCK/SCL Rising (slow mode)(fast mode)t cdisu 25050--ns ns Hold Time SCK/SCL Rising to CDIN(Note 6)t cdih 50-ns Transition Time from SCK/SCL to CDOUT Valid (Note 7)t scdov -40ns Time from SCK/SCL Rising to REQ Rising (Note 7)t scrh -200ns Rise Time for REQ (Note 8)t rr -50ns Fall Time for REQ(Note 9)t rf -20ns Hold Time for REQ from SCK/SCL Rising (Note 9)t scrl 0-ns Time from SCK/SCL Falling to CS Rising t sccsh 20-ns High Time Between Active CSt csht200-nsFigure 2. SPI Control Port Timing910SWITCHING CHARACTERISTICS - CONTROL PORT (I 2C MODE) (T A = 25 °C;VA+, VD+ = 5V; Inputs: Logic 0 = DGND, Logic 1 = VD+, C L = 20pF)Notes:e of I 2C ® bus compatible interface requires a license from Philips.11.Data must be held for sufficient time to bridge the 300ns transition time of SCK/SCL.12.This rise time is shorter than the I 2C specifications recommend, please refer to the section on SCPcommunications for more information.13.REQ will only go HIGH if there is no data in the SCPOUT register at the rising edge of SCL/SCK duringa READ operation as shown. DSP frequency is 20 MHz. Pull-up resistor is 2 k Ω C L = 20pF.14.if REQ went HIGH as indicated in Note 13 then REQ will hold HIGH at least until the next rising edge ofSCK/SCL. If data is in the SCPOUT register at this time REQ will go active LOW again. This condition should be treated as a new READ process. The address and R/W should be sent again following a new START condition.ParameterSymbolMinMax Units I 2C ® Mode (CS=1)(Note 10)SCK/SCL Clock Frequency(slow mode)(fast mode)f scl 100400kHz Bus Free Time Between Transmissionst buf 4.7µs Start Condition Hold Time (prior to first clock pulse)t hdst 4.0µs Clock Low Time slow fast t low 4.71.2µs Clock High Timeslow fast t high 4.01.0µs SDA Setup Time to SCK/SCL Rising t sud250ns SDA Hold Time from SCK/SCL Falling (Note 11)t hdd 0µs Rise Time of Both SDA and SCK/SCL (Note 12)t r 50ns Fall Time of Both SDA and SCK/SCL t f 300ns Time from SCK/SCL Falling to CS4920 ACK t sca 40ns Time from SCK/SCL Falling to SDA Valid During READ Operationt scsdv40ns Time from SCK/SCL Rising to REQ Rising (Note 13)t scrh 200ns Hold Time for REQ from SCK/SCL Rising (Note 14)t scrl 0ns Rise Time for REQ (Note 13)t rr 50ns Fall Time for REQ(Note 14)t rf 20ns Setup Time for Stop Conditiont susp4.7µsFigure 3. I2C® Control Port TimingSWITCHING CHARACTERISTICS - SERIAL AUDIO PORT (T A = 25 °C; VA+, VD+ =5V; Inputs: Logic 0 = GND, Logic 1 = VD+; C L = 20 pF)Notes:15.The table above assumes data is output on the falling edge and latched on the rising edge. The SCLKedge is selectable in setting the EDG bit in the ASICN register. The diagram is for EDG = 1.ParameterSymbolMin Typ Max Units SCLK Frequency --12.5MHz SCLK Pulse Width Low t sckl 25--ns SCLK Pulse Width Hight sckh 25--ns SCLK rising to FSYNC edge delay (Note 15)t sfds 20--ns SCLK rising to FSYNC edge setup (Note 15)t sfs 20--ns SDATA valid to SCLK rising setup (Note 15)t sss 20--ns SCLK rising to SDATA hold time (Note 15)t ssh 20--nsRise time of SCLKt sclr --20nsFigure 4. Serial Audio Port TimingSWITCHING CHARACTERISTICS - AUXILIARY DIGITAL AUDIO PORTNotes:16.Fs determined by clock input rate and configuration of on-chip PLL.17.AUXCLK frequency selectable @ 32, 64, or 128 Fs via AUXCN register bits 1:0.ParameterSymbol Min Typ Max Units Input Sample Rate (Note 16)Fs 16-48kHz AUXCLK Period(Note 17)tsclk-1/(32Fs)1/(64Fs)1/(128Fs)-nsAUXCLK to AUXLR valid tlrun 0-25ns AUXCLK to AUXOUT data valid tdoun 0-25AUXIN data setup time to AUXCLK tdisu 50--ns AUXIN data hold time from AUXCLKtdiho3--nsFigure 5. Auxiliary Audio Port Timing2TYPICAL CONNECTION DIAGRAMFigure 6. Typical Connection Diagram3THEORY OF OPERATION3.1IntroductionThe CS4922 is a complete audio subsystem on a chip. It consists of a general-purpose Digital Signal Processor (DSP), and a number of supplementary analog and digital blocks. These supplementary blocks include a PLL clock multiplier, a serial au-dio input port, an auxiliary serial audio port, a CD quality stereo Digital-to-Analog Converter (DAC), an AES/EBU - S/PDIF compatible digital audio transmitter, and a serial control port. Figure 6 shows a typical connection diagram for the CS4922 in which a micro controller is used for loading the program code.The CS4922 is RAM based audio decoder that can be used to process compressed digital audio sig-nals. Serial audio data broadcast on networks such as cable TV, direct broadcast satellite TV, or the telephone system can be decompressed and con-verted to standard analog and digital signals. A wide variety of standard and proprietary decom-pression algorithms can be supported.CS4922 application code is available which per-forms industry standard MPEG 1 and 2, layers I and II. Application code is also available for G.729A decode.The DSP has a 24-bit fixed point data path, 5K words of program RAM, and 3K words of data RAM. The execution unit includes a 48-bit accu-mulator. The DSP can provide up to 12 MIPS. Either compressed digital audio data or PCM data can be delivered.For analog reproduction of the digital input, a ste-reo DAC using delta-sigma architecture is built-in. Switched-capacitor filters perform most of the re-construction process. Only a simple external pas-sive filter is needed to complete reconstruction.In addition to the analog output, an AES/EBU -S/PDIF compatible output is provided. This allows the designer the flexibility of transmitting the audio data in a standard digital format to an external sys-tem.To facilitate the downloading of DSP code to the CS4922, a serial control port, communicating in ei-ther I2C® or SPI format, is used. This port may also be used during run time to issue control commands to the DSP.4PERIPHERALSSix on-chip peripherals make the audio decoder ideal for decoding broadcast digital audio signals. It has a PLL clock manager, a CD quality DAC, a digital audio transmitter, a three pin serial port for audio data input, a serial bi-directional auxiliary port for digital audio data, and an SPI/I2C port for serial control information. Each peripheral has I/O mapped data, control, and status registers. Many peripherals can also generate interrupts.4.1Clock ManagerThe clock manager is primarily a clock multiplier circuit that takes a reference frequency of 27 MHz on CLKIN which is used for deriving internal clocking. At the heart of the clock manager circuit is a PLL (Phase-Locked Loop) circuit. The PLL is configured by software to produce the appropriate DSP Clock for the desired sample rate. All other in-ternal clocks required for the DAC and other pe-ripherals are derived from this root clock.The PLL’s internal VCO requires a capacitor to be connected to the FLT pin (pin 31). The typical val-ue of the FLT capacitor is 0.47 µf, which is suffi-cient for all allowable CLKIN input frequencies. It must be stressed that the best analog performance can only be achieved by placing the capacitor as close as possible to the FLT pin and that the proper layout precautions be taken to avoid noise coupling onto the FLT pin.The CLKOUT pin is a divided version of the DSP clock. A diagram of the CLKOUT generation cir-cuit is shown in Figure 7.The DSP clock is divided by a programmable di-vider and an additional divide by 2 before being output. The divider output is determined by the val-ue of the Q value which can be accessed through the application software. The divide by 2 guaran-tees a 50% duty cycle output. The Q value provides effective divides ranging from 1 to 1024, which means the frequency of CLKOUT can vary from the DSP clock frequency divided by 2 to the DSP clock frequency divided by 2048. CLKOUT can be used to synchronize external devices or generate most compressed bit rate clocks.4.233-bit CounterThe 33-bit-counter can be used to support MPEG synchronization of audio and video. This loadable counter is targeted to operate at 90 kHz. The 90kHz clock may be derived from a 27 MHz mas-ter clock provided at CLKIN (if available) or from a 90 kHz clock provided at Pin 19 90_CLK. The se-lection of the counter clock is made via the register bit DIV which is accessible through the application code. When set, the DIV bit divides the clock at CLKIN by 300 and provides the divided clock to 33-bit-counter.4.3Digital to Analog ConverterThe digital to analog converter (DAC) is a dual channel CD quality DAC. It is designed with delta sigma architecture. The baseband audio is interpo-lated to 128Fs (192Fs) before going into the modu-lator. The modulator is third order and is followed by a 1 bit DAC/switch capacitor filter stage. An ex-ternal passive filter completes the reconstruction process. The output is single ended with a drive ca-pability down to 8 kΩ. Figure 8 is a block diagram of the DAC.The interpolation filter produces images which are attenuated by at least 56 dB from .584Fs to 128Fs (192Fs). At a 48 kHz sample rate, a full scale signal at 20 kHz will produce an image at 28 kHz which is attenuated by more than 60 dB.The out-of-band quantization noise from the delta sigma modulator extends from .417Fs to 128Fs (192Fs). This noise is attenuated by the switch ca-pacitor filter and the continuous time filters. The total quantization noise and thermal noise from the analog filters integrated over the .417Fs to 128Fs (192Fs) is more than 50 dB below full scale power.Figure 7. CLKOUT Generation CircuitFigure 8. DAC4.4Digital Audio TransmitterThe transmitter encodes digital audio data accord-ing to the Sony®/Philips® Digital Interface Format (S/PDIF) or the AES/EBU interface format. The encoded data is output on the TX pin. More infor-mation on the S/PDIF and AES/EBU standards are available from Crystal’s application note library.4.5Audio Serial Input PortThe audio serial input port has a three pin interface consisting of FSYNC, SCLK, and SDATA. FSYNC is only used to frame data when the audio data is in a PCM format. Systems, such as MPEG decoders, which use the audio serial input port for compressed audio data should tie FSYNC to +5V. SCLK used to clock SDATA (serial data input) into an internal FIFO. The active edge of SCLK is de-termined by the application code running on the CS4922. Consult the documentation for each ap-plication download to determine your system re-quirements.4.6Auxiliary Digital Audio PortThe CS4922 auxiliary port provides a path for the internal DSP core to directly read and write framed PCM digital audio data. The auxiliary port is de-signed to operate in a full duplex mode that can support simultaneous PCM input and output. It is important to note that the CS4922 always masters the audio clocks on the Auxiliary Digital Audio Port.The port has the capability to support two digital audio formats. The formats are illustrated in Fig-ures 9, 10, and 11. The input and output formats are always configured to operate in the same mode. The input and output sampling rates are the same as the sample rate for the on-chip DAC. The AUX port can support 18 bit samples at 64Fs (I2S For-mat) or 20 bit samples at 128Fs (Left Justified For-mat).The CS4922 Auxiliary digital audio port physically is implemented with four device pins: AUXCLK pin 11, AUXLR pin 10, AUXIN pin 9, and AUX-OUT pin 8. AUXCLK is utilized as the primary synchronous clock. AUXOUT is the serial audio data output pin and AUXIN is the serial audio data input pin. AUXLR is an output pin used for fram-ing the auxiliary digital audio port. AUXLR cycles at the same Fs as the on-chip stereo DAC. Fs is programmed by the DSP. AUXLR and AUXOUT transition with the falling edge of AUXCLK. The rising edge of AUXCLK samples AUXIN.4.7Serial Control PortThe serial control port (SCP) can operate in I2C or SPI compatible modes. In either mode, the control port performs eight bit transfers and is always con-figured as a slave. As a slave, it cannot drive the clock signal nor initiate data transfers. The port can request to be serviced by activating the REQ pin. The port is an asynchronous interface which pro-vides interrupts and handshaking signals to allowFigure 9. Auxiliary Data Input FormatsFigure 10. Auxiliary Data Output Formatscommunication between the on-chip DSP and an off-chip device such as a micro controller. Figure 13 shows a block diagram of the port.4.7.1I2C ModeThe status of CS sets the mode of the SCP during a hardware and software reset. If CS is high during a reset the mode is I2C. Note that in most systems where I2C is the preferred control mode, CS is con-nected to the digital supply.For normal I2C operation SCL/SCK, SDA, and REQ are used. CS and CDIN are typically connect-ed to the digital supply. SCL/SCK is the serial clock input which is always driven by an external device. SDA is the serial data Input/Output signal. REQ is the active low request signal, which is driv-en low when there is valid data in the serial control port output SCPOUT register.As an I2C compatible port, data is communicated on the SDA pin and is clocked by the rising edge of SCL/SCK. The Philips I2C bus specification pro-vides details of this interface. Note the CS4922 does not meet the rise time specification of the SCL/SCK signal. For more details please refer to the section on Rise Time of SCL/SCK.Figure 12 shows the relative timing necessary for an I2C write operation for a single byte. A ‘write’is defined as the transfer of data from an I2C bus master to the CS4922 serial control port. A transfer is initiated with a start condition followed by a 7 bit address and a read/write bit (set low for a write).This address is the address assigned to the device being written to during the transfer. In the case of the CS4922, this address is stored in the SCPCN register. Immediately following power up, the CS4922's Address checking Enable (AEN) bit is set to zero. The AEN bit must be set high for the CS4922 to compare the address of the intended I2C device on the bus to its internal address. This means the CS4922 will respond to any address on the I2C bus until its address is initialized and address checking is enabled. To avoid bus conflicts the CS4922 should be held in reset (RESET active low) until the master is ready to communicate with the CS4922 and sets the address in the SCPCN. The address can only be set using the I2C bus interface, so the master should use the intended I2C address when downloading microcode to the CS4922 to avoid conflict with other devices on the bus. Once the microcode is loaded into the CS4922 the micro-code should either initialize the I2C address or pro-vide a means for the master to program the I2C address. If the CS4922 is the only device on the I2C bus, address checking is optional. However, I2C bus protocol is still required. In other words, the ad-dress bits and read/write bit are still required.If a write to the CS4922 is specified, 8 bits of data on SDA will be shifted into the input shift register as shown in Figure 13. When the shift register is full, the 8 bit data is transferred to the Serial Control Port Input (SCPIN) register on the falling edge of the 8th data bit and an acknowledge (ACK) is sent back to the master..Figure 11. Multi-channel Auxiliary Data Formats。

35RAPC4BHN2中文资料

35RAPC4BHN2中文资料

Previous Page | Return to Index | Next Page3.5 mm SINGLE MONO AND STEREO JACKS1. 35RAPC4BV42. 35RAPC2AV3. 35RAPC2BHN24. 35RAPC4BH35. 35RAPC2BV46. 35RAPC2BH3click here to download a schematic drawing(you will need to have Adobe Acrobat installed on your system to do this)click here to download a schematic drawing(you will need to have Adobe Acrobat installed on your system to do this)click here to download a schematic drawing(you will need to have Adobe Acrobat installed on your system to do this)click here to download a schematic drawing(you will need to have Adobe Acrobat installed on your system to do this)APPLICATIONS* Multi-media workstations* Headphones/microphone sets* Interactive TV* Audio* Telecommunications* Medical* Computer* InstrumentationSWITCHCRAFT 3.5 mm JACK PART NUMBERING SYSTEMSeries MountingTypeCircuitryHousingOrientationBushingFootprintDesignation35 3.5 mm RAPCRight-Angle2A SingleClosedH (Horizontal)Board SpaceRequiredGreater ThanAboveBoard Height(RAPC)BlankThreadedBushingBlank See Note1PM PanelMount2B DoubleOpenV (Vertical)Board SpaceRequiredGreater ThanAboveBoard Height(RAPC)NNon-threadedBushing2 See Note 13B SingleOpen +SingleClosedV (Vertical)SolderTerminals ExitHousingOpposite FromBushing (PM)3 See Note 14B DoubleClosedBlank OpenFrame Jack4 See Note 15 See Note 1Notes:1. Footprints are assigned sequentially within a family of jacks.For example, all 35RAPCXXV2 jacks can use the 35RAPC4BV2 footprint independent of whether the bushing is threaded.Not all holes would be used by jacks with 2A, 2B, and 3B circuitry.35RAPCXXV3 jacks require an entirely different PC board layout than 35RAPCXXV2 jacks.Each number designates a different footprint.ORDERING INFORMATIONPart Number Description Height vs.WidthBushing35RAPC2AV mono vertical threaded3 35RAPC2AHN2mono horizontal non-threaded 35RAPC2AHN3mono horizontal non-threaded35RAPC2BHN2stereo horizontal non-threaded 35RAPC2BHN3stereo horizontal non-threaded 35RAPC3BHN2stereo horizontal non-threaded 35RAPC3BHN3stereo horizontal non-threaded 35RAPC4BHN2stereo horizontal non-threaded 35RAPC4BHN3stereo horizontal non-threaded 35RAPC2AH3mono horizontal threaded3 35RAPC2BH3stereo horizontal threaded3 35RAPC3BH3stereo horizontal threaded3 35RAPC4BH3stereo horizontal threaded3 35RAPC2AV4mono vertical threaded3 35RAPC2BV4mono vertical threaded3 35RAPC3BV4stereo vertical threaded3 35RAPC4BV4stereo vertical threaded3 35RAPC2AVN4mono vertical non-threaded 35RAPC2BVN4stereo vertical non-threaded 35RAPC3BVN4stereo vertical non-threaded 35RAPC4BVN4stereo vertical non-threaded Part numbers which include the letter "N" designate non-threaded bushings. Part numbers without the letter "N" designate threaded bushing.1. Order by part number2. Contact Switchcraft for special ordering information3. Mounting hardware included.35RAPC2AV - MONO, VERTICAL, THREADEDMATERIALSCoil Spring: Steel wire.Bushing: Nickel-plated copper alloy.Terminal: Silver-plated copper alloy.Tip Spring: Silver-plated copper alloy.Shunt Terminal: Plated copper alloy.Cover: Thermoplastic, transparent UL 94V-2.Body: Thermoplastic, UL 94V-1 black color.PERFORMANCE SPECIFICATIONSContact Resistance: 20 milliohms maximum.Insulation Resistance: 100 milliohms minimum at 250V DC.Dielectric Withstanding Voltage: 250V AC.Life: 5000 cycles, minimum.Insertion Force: 0.88 pounds - 3.5 pounds.Withdrawal Force: 0.88 pounds - 2.64 pounds.35RAPC4BHN2 - STEREO, HORIZONTAL, NON-THREADED MATERIALSCover: Thermoplastic, UL 94V-1 black color.Shunt Terminals: Silver-plated copper alloy.Ring Spring: Copper alloy.Tip Spring: Special silver plating.Ground Terminal: Plated copper alloy.Metal: Nickel-plated copper alloy.Body: Thermoplastic, UL 94V-0 black color.PERFORMANCE SPECIFICATIONSContact Resistance: 30 milliohms maximum, initial 100 milliohms maximum., after life.Insulation Resistance: 100 megohms mininimum at 500V DC.Dielectric Withstanding Voltage: 500V AC.Life: 5000 cycles, minimum.Insertion Force: 0.88 pounds - 6.6 pounds.Withdrawal Force: 0.88 pounds - 6.6 pounds.35RAPC2BHN2 - STEREO, HORIZONTAL, NON-THREADED MATERIALSCover: Thermoplastic, UL 94V-1 black color.Ring Spring: Copper alloy.Tip Spring: Silver-plated copper alloy.Ground Terminal: Silver-plated copper alloy.Metal: Copper alloy, nickel plating.Body: Thermoplastic, UL 94V-0 black color.PERFORMANCE SPECIFICATIONSContact Resistance: 30 milliohms maximum, initial 100 milliohms maximum, after life.Insulation Resistance: 100 megohms minimum at 500V DC.Dielectric Withstanding Voltage: 500V AC.Life: 5000 cycles, minimum.Insertion Force: 0.88 pounds - 6.6 pounds.Withdrawal Force: 0.88 pounds - 6.6 pounds.35RAPC2BH3 - STEREO, HORIZONTAL, THREADED MATERIALSCoil Springs: Steel wire.Tip Spring: Silver-plated copper alloy.Switchcraft元器件交易网Ring Spring: Silver-plated copper alloy.Ground Terminal: Silver-plated copper alloy.Bushing: Nickel-plated copper alloy.Cover: Thermoplastic, transparent UL 94V-2.Body: Thermoplastic, UL 94V-1 black color.PERFORMANCE SPECIFICATIONSContact Resistance: 20 milliohms maximum, initial 100 milliohms maximum, after life.Insulation Resistance: 100 megohms minimum.Dielectric Withstanding Voltage: 250V AC.Life: 5000 cycles, minimum.Insertion Force: 0.88 lbs. - 3.50 lbs.Withdrawal Force: 0.88 lbs. - 3.10 lbs.35RAPC4BH3 - STEREO, HORIZONTAL, THREADED MATERIALSCoil Springs: Steel wire.Tip Spring: Silver-plated copper alloy.Ring Spring: Silver-plated copper alloy.Contactors: Silver-plated copper alloy.Ground Terminal: Silver-plated copper alloy.Bushing: Nickel-plated copper alloy.Cover: Thermoplastic, transparent UL 94V-2.Body: Thermoplastic, UL 94V-1 black color.PERFORMANCE SPECIFICATIONSContact Resistance: 20 milliohms maximum, initial 100 milliohms maximum, after life.Insulation Resistance: 100 megohms minimum.Dielectric Withstanding Voltage: 250V AC.Life: 5000 cycles, minimum.Insertion Force: 0.88 - 3.5 pounds.Withdrawal Force: 0.88 - 3.1 pounds.35RAPC2BV4 - STEREO, VERTICAL, THREADED MATERIALSCoil Springs: Steel Wire.Ring Spring: Copper alloy strip, tin alloy plating.Ground Terminal: Copper alloy strip, tin alloy plating.Bushing: Nickel-plated copper alloy.Cover: Thermoplastic, UL 94V-0 black color.Body: Thermoplastic, UL 94V-0 black color.PERFORMANCE SPECIFICATIONS Contact Resistance: 20 milliohms maximum,Switchcraft元器件交易网initial 50 milliohms maximum, after life.Insulation Resistance: 50 megohms minimum at 500V DC.Dielectric Withstanding Voltage: 250V AC.Life: 5,000 cycles, minimum.Insertion Force: 0.88 lbs. to 3.50 lbs.Withdrawal Force: 0.88 lbs. to 3.10 lbs.35RAPC4BV4 - STEREO, VERTICAL, THREADED MATERIALSCoil Springs: Steel wire.Shunt Terminals: Copper alloy strip,tin alloy plated.Ring Spring: Copper alloy strip,tin alloy plated.Ground Terminal: Copper alloy strip,tin alloy plated.Bushing: Plated copper alloy.Cover: Thermoplastic, UL 94V-0 black color.Body: Thermoplastic, UL 94V-0 black color.PERFORMANCE SPECIFICATIONSContact Resistance: 20 milliohms maximum, initial 50 milliohms maximum, after life.Insulation Resistance: 50 milliohms minimum at 500V DC.Dielectric Withstanding Voltage: 250V AC.Life: 5000 cycles, minimum.Insertion Force: 0.88 - 3.5 pounds.Withdrawal Force: 0.88 - 3.5 pounds.Previous Page | Return to Index | Next PageTo search a category please click on the corresponding icon:| Connectors | Jacks and Plugs || Patch Panels, Patch Kits & Jackfields | Cable Assemblies and Patch Cords | Switches |Switchcraft元器件交易网All products shown are covered by Switchcraft's limited lifetime warranty.| Switchcraft home |About Us | Products | What's New | Search | Contact UsSwitchcraft元器件交易网。

CS44210资料

CS44210资料
6.1 Grounding and Power Supply Decoupling ...................................................................... 29 6.2 Clock Modes ................................................................................................................... 29 6.3 De-Emphasis .................................................................................................................. 29 6.4 PWM PopGuard Transient Control ................................................................................. 29 6.5 Recommended Power-up Sequence .............................................................................. 30
The CS44210 architecture uses a direct-to-digital approach that maintains digital signal integrity to the final output filter. This minimizes analog interference effects that can negatively affect system performance.

CS42324中文资料

CS42324中文资料

10-In, 6-Out, 2Vrms Audio CODECD/A FeaturesDual 24-bit Stereo DACs Multi-bit Delta-Sigma Modulator 100dB Dynamic Range (A-Wtd) -90dB THD+N Integrated Line Driver– 2 Vrms Output–Single-Ended OutputsUp to 96kHz Sampling Rates Stereo 7:1 Output Multiplexer Volume Control with Soft Ramp–0.5dB Step Size–Zero Crossing Click-Free Transitions Selectable Serial Audio Interface Formats –Left- or Right-Justified, Up to 24-bit –I²S Up to 24-bitSelectable 50/15 μs De-Emphasis Internal Analog MuteControl Output for External Muting Popguard ® TechnologyA/D FeaturesMulti-bit Delta-Sigma Modulator 24-bit ConversionUp to 96kHz Sampling Rates 95dB Dynamic Range (A-Wtd) -88dB THD+NStereo 5:1 Input MultiplexerDigital Volume Control with Soft Ramp–0.5dB Step SizeSelectable Serial Audio Interface Formats–Left-Justified –I²SHigh-Pass Filter or DC Offset Calibration See System Features , General Description , and Order-ing information on page 2.CS42324System FeaturesDirect Interface with 1.8 V to 3.3 V Logic LevelsSupports Asynchronous Serial Port Operation –Two Independent Clock Domains–ADC, DAC1, and DAC2 can beIndependently Assigned to the Two ClockDomains–Each Serial Port Supports Master or Slave OperationInternal Digital Loopback+3.3V Analog Power Supply+3.3V Digital Power Supply+9 V to +12 V High-Voltage Power SupplyHardware or Software Mode Configuration –Supports I²C® and SPI™ Software Interface General DescriptionThe CS42324 is a highly integrated stereo audio CODEC. The CS42324 performs stereo analog-to-digital (A/D) and up to four channels of digital-to-analog (D/A) conversion of up to 24-bit serial values at sample rates up to 96kHz.A 5:1 stereo input multiplexer is included for selecting between line-level inputs. The output of the input multi-plexer is followed by an advanced 3rd-order, multi-bit delta-sigma modulator and digital filtering/decimation. Sampled data is transmitted by the serial audio inter-face at rates from 4kHz to 96kHz, in either Slave or Master Mode.The D/A converter is based on a 5th-order multi-bit del-ta-sigma modulator with an ultra-linear low-pass filter and offers a volume control that operates with a 0.5dB step size. It incorporates selectable soft ramp and zero crossing transition functions to eliminate clicks and pops.An integrated 7:1 stereo output multiplexer on each of the three stereo 2 Vrms line-level outputs is used to se-lect any of the 5 stereo analog inputs, for analog bypass support, or the outputs of the 2 internal DACs. Each 2Vrms output can be muted with the selectable analog mute function.Standard 50/15μs de-emphasis is available for a 44.1kHz sample rate for compatibility with digital audio programs mastered using the 50/15μs pre-emphasis technique.Integrated digital level translators allow easy interfacing between the CS42324 and other devices operating over a wide range of logic levels.The CS42324 is available in a 48-pin LQFP package in Commercial (-40°C to +85°C) and Automotive (-40°C to +105°C) grades. The CDB42324 Customer Demonstra-tion board is also available for device evaluation and implementation suggestions. Please refer to “Ordering information” on page71 for complete details.TABLE OF CONTENTS1. PIN DESCRIPTIONS (8)1.1 Software Mode (8)1.2 Hardware Mode (10)1.3 Digital I/O Pin Characteristics (12)2. CHARACTERISTICS AND SPECIFICATIONS (13)RECOMMENDED OPERATING CONDITIONS (13)ABSOLUTE MAXIMUM RATINGS (13)DAC ANALOG CHARACTERISTICS - COMMERCIAL (-CQZ) (14)DAC ANALOG CHARACTERISTICS - AUTOMOTIVE (-DQZ) (15)DAC COMBINED INTERPOLATION & ON-CHIP ANALOG FILTER RESPONSE (16)ADC ANALOG CHARACTERISTICS - COMMERCIAL (-CQZ) (17)ADC ANALOG CHARACTERISTICS - AUTOMOTIVE (-DQZ) (18)ADC DIGITAL FILTER CHARACTERISTICS (19)ANALOG PASS-THRU CHARACTERISTICS (20)DC ELECTRICAL CHARACTERISTICS (21)DIGITAL INTERFACE CHARACTERISTICS (21)SWITCHING CHARACTERISTICS - SERIAL AUDIO (22)SWITCHING CHARACTERISTICS - SERIAL AUDIO (CONT.) (23)SWITCHING CHARACTERISTICS - SOFTWARE MODE - I²C FORMAT (24)SWITCHING CHARACTERISTICS - SOFTWARE MODE - SPI FORMAT (25)3. TYPICAL CONNECTION DIAGRAMS (26)4. APPLICATIONS (28)4.1 System Clocking (28)4.1.1 Master Clock (28)4.1.2 Synchronous / Asynchronous Mode (29)4.2 Serial Port Operation (29)4.2.1 Master Mode (30)4.2.2 Slave Mode (30)4.2.3 ADC, DAC1, and DAC2 clock selection (31)4.2.4 High-Impedance Digital Output (31)4.2.5 Digital Interface Formats (32)4.2.6 Synchronization of Multiple Devices (32)4.3 Analog-to-Digital Data Path (33)4.3.1 ADC Analog Input Multiplexer (33)4.3.2 ADC Description (33)4.3.3 High-Pass Filter and DC Offset Calibration (34)4.3.4 Digital Attenuation Control (34)4.4 Digital-to-Analog Data Path (34)4.4.1 Digital Volume Control (34)4.4.2 Mono Channel Mixer (34)4.4.3 De-Emphasis Filter (35)4.4.4 Internal Digital Loopback (35)4.4.5 DAC Description (35)4.4.6 Analog Output Multiplexer (36)4.4.7 Output Transient Control (36)4.4.8 Mute Control (37)4.5 Initialization (37)4.5.1 Determining Hardware or Software Mode (37)4.5.2 Hardware Mode Start-Up (37)4.5.3 Software Mode Start-Up (38)4.5.4 Initialization Flow Chart (39)4.6 Device Control (40)4.6.2 Software Mode - I²C Control Port (41)4.6.3 Software Mode - SPI Control Port (42)4.6.4 Memory Address Pointer (MAP) (43)4.7 Interrupts and Overflow (43)5. REGISTER QUICK REFERENCE (44)6. REGISTER DESCRIPTION (46)6.1 Device I.D. and Revision Register (Address 00h) (Read Only) (46)6.1.1 Device I.D. (Read Only) (46)6.1.2 Chip Revision (Read Only) (46)6.2 Mute Control (Address 01h) (46)6.2.1 System MCLK Source (46)6.2.2 Mute DAC2 Left-Channel (46)6.2.3 Mute DAC2 Right-Channel (47)6.2.4 Mute DAC1 Left-Channel (47)6.2.5 Mute DAC1 Right-Channel (47)6.2.6 Mute ADC Left-Channel (47)6.2.7 Mute ADC Right-Channel (47)6.3 Operational Control (Address 02h) (47)6.3.1 Global Power-Down (47)6.3.2 INT Pin High/Low Active (INT_H/L) (48)6.3.3 Freeze (48)6.3.4 Tri-State SDOUT (48)6.3.5 Tri-State Serial Port 1 (48)6.3.6 Tri-State Serial Port 2 (49)6.4 Serial Port 1 Control (Address 03h) (49)6.4.1 Serial Port 1 Master/Slave Select (49)6.4.2 Serial Port 1 Speed Mode (49)6.4.3 MCLK1 Divider (49)6.4.4 Serial Port 1 MCLK source (49)6.5 Serial Port 2 Control (Address 04h) (50)6.5.1 Serial Port 2 Master/Slave Select (50)6.5.2 Serial Port 2 Speed Mode (50)6.5.3 MCLK2 Divider (50)6.5.4 Serial Port 2 MCLK Source (50)6.6 ADC Clocking (Address 06h) (50)6.6.1 ADC MCLK Source (50)6.6.2 ADC Serial Port Source (51)6.6.3 ADC Digital Interface Format (ADC_DIF) (51)6.7 DAC1 Clocking (Address 07h) (51)6.7.1 DAC1 MCLK Source (51)6.7.2 DAC1 Serial Port Source (51)6.7.3 DAC1 Digital Interface Format (DAC1_DIF) (51)6.8 DAC2 Clocking (Address 08h) (52)6.8.1 DAC2 MCLK Source (52)6.8.2 DAC2 Serial Port Source (52)6.8.3 DAC2 Digital Interface Format (DAC2_DIF) (52)6.9 ADC Control (Address 0Ah) (52)6.9.1 ADC High-Pass Filter Freeze (52)6.9.2 ADC Soft Ramp Control (52)6.9.3 Analog Input Selection (53)6.10 DAC1 Control (Address 0Bh) (53)6.10.1 DAC1 De-Emphasis Control (53)6.10.2 DAC1 Single Volume Control (53)6.10.4 DAC1 Zero Cross Control (54)6.10.5 DAC1 Loop-Back (54)6.10.6 DAC1 Invert Signal Polarity (54)6.10.7 DAC1 Channel Mixer (54)6.11 DAC2 Control (Address 0Ch) (55)6.11.1 DAC2 De-Emphasis Control (55)6.11.2 DAC2 Single Volume Control (55)6.11.3 DAC2 Soft Ramp Control (55)6.11.4 DAC2 Zero Cross Control (55)6.11.5 DAC2 Loop-Back (56)6.11.6 DAC2 Invert Signal Polarity (56)6.11.7 DAC2 Channel Mixer (56)6.12 AOUT1 Control (Address 0Dh) (56)6.12.1 External Mute Control Pin (56)6.12.2 AOUT1 Select (56)6.13 AOUT2 Control (Address 0Eh) (57)6.13.1 External Mute Control Pin (57)6.13.2 AOUT2 Select (57)6.14 AOUT3 Control (Address 0Fh) (57)6.14.1 External Mute Control Pin (57)6.14.2 AOUT3 Select (58)6.15 ADCx Volume Control: ADCA (Address 10h) & ADCB (Address 11h) (58)6.16 DAC1x Volume Control: DAC1A (Address 12h) & DAC1B (Address 13h) (58)6.17 DAC2x Volume Control: DAC1A (Address 14h) & DAC1B (Address 15h) (59)6.18 Interrupt Mode (Address 16h) (59)6.19 Interrupt Mask (Address 17h) (59)6.19.1 DAC2 Auto Mute Left Mask (DAC2_AMUTELM) (60)6.19.2 DAC2 Auto Mute Right Mask (DAC2_AMUTERM) (60)6.19.3 DAC1 Auto Mute Left Mask (DAC1_AMUTELM) (60)6.19.4 DAC1 Auto Mute Right Mask (DAC1_AMUTELM) (60)6.19.5 Serial Port 2 Clock Error Mask (SP2_CLKERRM) (60)6.19.6 Serial Port 1 Clock Error Mask (SP1_CLKERRM) (60)6.19.7 ADC Positive Overflow Mask (ADC_OVFLPM) (61)6.19.8 ADC Negative Overflow Mask (ADC_OVFLNM) (61)6.20 Interrupt Status (Address 18h) (Read Only) (61)6.20.1 DAC2 Auto Mute Left Interrupt Status (DAC2_AMUTEL) (61)6.20.2 DAC2 Auto Mute Right Interrupt Status (DAC2_AMUTER) (61)6.20.3 DAC1 Auto Mute Left Interrupt Status (DAC1_AMUTEL) (62)6.20.4 DAC1 Auto Mute Right Interrupt Status (DAC1_AMUTEL) (62)6.20.5 Serial Port 2 Clock Error Interrupt Status (SP2_CLKERR) (62)6.20.6 Serial Port 1 Clock Error Interrupt Status (SP1_CLKERR) (62)6.20.7 ADC Positive Overflow Interrupt Bit (ADC_OVFLP) (62)6.20.8 ADC Negative Overflow Interrupt Bit (ADC_OVFLN) (63)7. GROUNDING AND POWER SUPPLY DECOUPLING (64)8. ADC FILTER PLOTS (65)9. DAC DIGITAL FILTER RESPONSE PLOTS (67)10. PARAMETER DEFINITIONS (69)11. PACKAGE DIMENSIONS (70)THERMAL CHARACTERISTICS AND SPECIFICATIONS (70)12. ORDERING INFORMATION (71)13. REVISION HISTORY (71)LIST OF FIGURESFigure 1.Equivalent Analog Output Load (16)Figure 2.Maximum Analog Output Loading (16)Figure 3.Serial Input Timing (22)Figure 4.Serial Output Timing (23)Figure 5.Software Mode Timing - I²C Format (24)Figure 6.Software Mode Timing - SPI Mode (25)Figure 7.Typical Connection Diagram - Software Mode (26)Figure 8.Typical Connection Diagram - Hardware Mode (27)Figure 9.Serial Port Topology (29)Figure 10.Master Mode Clock Generation (30)Figure 11.Converter Clocking (31)Figure 12.Tri-State Serial Port (31)Figure 13.Left-Justified up to 24-Bit Data (32)Figure 14.I²S up to 24-Bit Data (32)Figure 15.Right-Justified 16-Bit Data, Right-Justified 24-Bit Data (32)Figure 16.Analog Input Architecture (33)Figure 17.De-Emphasis Curve (35)Figure 18.Analog Output Architecture (36)Figure 19.Initialization Flow Chart (39)Figure 20.Software Mode Timing, I²C Write (41)Figure 21.Software Mode Timing, I²C Read (41)Figure 22.Software Mode Timing, SPI Mode (43)Figure 23.Single-Speed Mode Stopband Rejection (65)Figure 24.Single-Speed Mode Transition Band (65)Figure 25.Single-Speed Mode Transition Band (Detail) (65)Figure 26.Single-Speed Mode Passband Ripple (65)Figure 27.Double-Speed Mode Stopband Rejection (65)Figure 28.Double-Speed Mode Transition Band (65)Figure 29.Double-Speed Mode Transition Band (Detail) (66)Figure 30.Double-Speed Mode Passband Ripple (66)Figure 31.Single-Speed Stopband Rejection (67)Figure 32.Single-Speed Transition Band (67)Figure 33.Single-Speed Transition Band (detail) (67)Figure 34.Single-Speed Passband Ripple (67)Figure 35.Double-Speed Stopband Rejection (67)Figure 36.Double-Speed Transition Band (67)Figure 37.Double-Speed Transition Band (detail) (68)Figure 38.Double-Speed Passband Ripple (68)Figure 39.Quad-Speed Stopband Rejection (68)Figure 40.Quad-Speed Transition Band (68)Figure 41.Quad-Speed Transition Band (detail) (68)Figure 42.Quad-Speed Passband Ripple (68)LIST OF TABLESTable 1. I/O Power Rails (12)Table 2. Speed Modes (28)Table 3. Single-Speed Mode Common Clock Frequencies (28)Table 4. Double-Speed Mode Common Clock Frequencies (28)Table 5. M1 and M0 Mode Pins in Hardware Mode (29)Table 6. Slave Mode SCLK/LRCK Ratios (30)Table 7. MCLKx to LRCKx Ratios (30)Table 8. Hardware Mode Interface Format Control (32)Table 9. Hardware Mode Feature Summary (40)Table 10. Freeze-able Bits (48)1.PIN DESCRIPTIONS1.1Software ModePin Name #Pin DescriptionSDA/CDOUT1I²C Format SDA (Input/Output ) - Acts as an input/output data pin. An external pull-up resistor is required for I²C control port operation.SPI Format CDOUT (Output ) - Acts as an output only data pin.SCL/CCLK 2I²C Format, SCL (Input ) – Serial clock for the serial control port. An external pull-up resistor is required for I²C control port operation.SPI Format, CCLK (Input ) – Serial clock for the serial control port.AD0/CS 3I²C Format, AD0 (Input ) - Forms the device address input AD[0].SPI Format, CS (Input ) - Acts as the active low chip select input.AD1/CDIN 4I²C Format, AD1 (Input ) - Forms the device address input AD[1].SPI Format, CDIN (Input ) - Becomes the input data pin.INT 5Interrupt (Output ) - Indicates an interrupt condition has occurred.FILT+6FILT+ (Output ) - Full-scale reference voltage for ADC.VCMADC 7ADC Common-Mode Voltage (Output ) - Filter connections for the ADC internal quiescent refer-ence voltage.GND 8Analog Ground (Input ) - Analog ground reference.VA 9Analog Power (Input) - Positive power for the internal analog section.VBIAS 10Bias Voltage (Output ) - Positive reference voltage for the internal DAC.MUTEC111Mute Control 1 (Output ) - Active-low mute output can drive external circuitry to eliminate the clicks and pops associated with any single-rail output. This pin will become a high-impedance out-put during power-down mode or when an invalid MCLK to LRCK ratio is detected.SCL/CCLK G N D HS C L K 1AD0/CS AD1/CDININT SDA/CDOUT FILT+VCMADCGND VA VBIAS MUTEC1MUTEC2V A _HA O U T 1BA O U T 2AA O U T 2BA O U T 3AA O U T 3BM U T E C 3V C M B U FV C M D A CV A _HA O U T 1AS D I N 2M C L K 1L R C K 1V DG N DV LS D O U TC L K 2L R C K 2M C L K 2D I N 1MUTEC212Mute Control 2 (Output) - Active-low mute output can drive external circuitry to eliminate the clicks and pops associated with any single-rail output. This pin will become a high-impedance out-put during power-down mode or when an invalid MCLK to LRCK ratio is detected.MUTEC313Mute Control 3 (Output) - Active-low mute output can drive external circuitry to eliminate the clicks and pops associated with any single-rail output. This pin will become a high-impedance out-put during power-down mode or when an invalid MCLK to LRCK ratio is detected.VCMBUF14VCMBUF (Output) -Internally buffered VCMDACVCMDAC15DAC Common-Mode Voltage (Output)-Filter connections for the DAC internal quiescent refer-ence voltage.VA_H 1618Analog High Voltage Power (Input)-Positive power for the internal output buffer section.GNDH17Analog Ground (Input) - Ground reference for high-voltage section.AOUT1A, AOUT1B AOUT2A, AOUT2B AOUT3A, AOUT3B 19, 2021, 2223, 24DAC Analog Audio Outputs (Output) - The full-scale output level is specified in the DAC Analog Characteristics specification table.AIN5B, AIN5A AIN4B, AIN4A AIN3B, AIN3A AIN2B, AIN2A AIN1B, AIN1A 25, 2627, 2829, 3031, 3233, 34Stereo Analog Inputs 1-5 (Input)-The full-scale input level is specified in the ADC Analog Char-acteristics specification table.RST35Reset (Input) - The device enters a low-power mode when this pin is driven low. OVFL36ADC Overflow (Output) -Indicates an ADC overflow condition is present.SDIN2 SDIN13738Serial Audio Data Input (Input) - Input for two’s complement serial audio data.MCLK239Master Clock 2 (Input) - Optional asynchronous clock source for the DAC’s delta-sigma modula-tors.LRCK240Serial Port 2 Left/Right Clock(Input/Output) - Determines which channel, Left or Right, is cur-rently active on the serial audio input data line.SCLK241Serial Port 2 Serial Bit Clock (Input/Output)-Serial bit clock for serial audio interface 2. VD42Digital Power (Input) -Positive power for the internal digital section.GND43Digital Ground (Input) - Ground reference for the internal digital section.VL44Digital Interface Power (Input) -Determines the required signal level for the control and serial port interfaces as shown in “I/O Power Rails” on page12. Refer to the“Recommended Operating Conditions” on page13 for appropriate voltages.SDOUT45Serial Audio Data Output (Output) -Output for two’s complement serial audio data. SCLK146Serial Port 1 Serial Bit Clock (Input/Output)-Serial bit clock for serial audio interface 1.LRCK147Serial Port 1 Left/Right Clock(Input/Output) - Determines which channel, Left or Right, is cur-rently active on the serial audio output data line.MCLK148Master Clock 1 (Input) - Clock source for the ADC’s delta-sigma modulators. By default, this sig-nal also clocks the DAC’s delta-sigma modulators.1.2Hardware ModePin Name#Pin DescriptionM0, M11, 2Mode Selection (Input) - Determines the operational mode of the device.MDIV3MCLK Divider (Input) - Setting this pin high places a divide-by-2 circuit in the MCLK path to the core device circuitry.MUTE4MUTE (Input) -Engages the internal digital mute and activates the MUTECx pinsDIF5DIF (Input) -Sets the serial audio interface format. Setting DIF high selects I²S audio format and low selects LJ audio format.FILT+6FILT+ (Output) -Full-scale reference voltage for ADC.VCMADC7ADC Common-Mode Voltage (Output)-Filter connections for the ADC internal quiescent refer-ence voltage.GND8Analog Ground (Input)-Analog ground reference.VA9Analog Power (Input)-Positive power for the internal analog section. VBIAS10Bias Voltage (Output)-Positive reference voltage for the internal DAC.MUTEC111Mute Control 1 (Output) - Active-low mute output can drive external circuitry to eliminate the clicks and pops associated with any single-rail output. This pin will become a high-impedance out-put during power-down mode or when an invalid MCLK to LRCK ratio is detected.MUTEC212Mute Control 2 (Output) - Active-low mute output can drive external circuitry to eliminate the clicks and pops associated with any single-rail output. This pin will become a high-impedance out-put during power-down mode or when an invalid MCLK to LRCK ratio is detected.OVFLRSTAIN1AAIN1BAIN2AAIN2BAIN3AAIN3BAIN4AAIN4BAIN5AAIN5BM1MDIVMUTEDIFM0FILT+VCMADCGNDVAVBIAS MUTEC1 MUTEC2SCLK1SDIN2 MCLK1LRCK1VDGNDVLSDOUTSCLK2LRCK2MCLK2SDIN1GNDHVA_HAOUT1BAOUT2AAOUT2BAOUT3AAOUT3B MUTEC3VCMBUFVCMDACVA_HAOUT1AMUTEC313Mute Control 3 (Output) - Active-low mute output can drive external circuitry to eliminate the clicks and pops associated with any single-rail output. This pin will become a high-impedance out-put during power-down mode or when an invalid MCLK to LRCK ratio is detected.VCMBUF14VCMBUF (Output) -Internally buffered VCMDACVCMDAC15DAC Common-Mode Voltage (Output)- Filter connections for the DAC internal quiescent refer-ence voltage.VA_H16, 18Analog High Voltage Power (Input)-Positive power for the internal output buffer section. GNDH17Analog Ground (Input) - Ground reference for high-voltage section.AOUT1A, AOUT1B AOUT2A, AOUT2B AOUT3A, AOUT3B 19, 2021, 2223, 24DAC Analog Audio Outputs (Output) - The full-scale output level is specified in the DAC Analog Characteristics specification table.AIN5B, AIN5A AIN4B, AIN4A AIN3B, AIN3A AIN2B, AIN2A AIN1B, AIN1A 25, 2627, 2829, 3031, 3233, 34Stereo Analog Inputs 1-5 (Input)-The full-scale input level is specified in the ADC Analog Char-acteristics specification table.RST35Reset (Input) - The device enters a low-power mode when this pin is driven low. OVFL36ADC Overflow (Output) -Indicates an ADC overflow condition is present.SDIN2 SDIN13738Serial Audio Data Input (Input) - Input for two’s complement serial audio data.MCLK239Master Clock 2 (Input) - Optional asynchronous clock source for the DAC’s delta-sigma modula-tors.LRCK240Serial Port 2 Left/Right Clock(Input/Output) - Determines which channel, Left or Right, is cur-rently active on the serial audio input data line.SCLK241Serial Port 2 Serial Bit Clock (Input/Output)-Serial bit clock for serial audio interface 2. VD42Digital Power (Input) -Positive power for the internal digital section.GND43Digital Ground (Input) - Ground reference for the internal digital section.VL44Digital Interface Power (Input) -Determines the required signal level for the control and serial port interfaces as shown in “I/O Power Rails” on page12. Refer to the“Recommended Operating Conditions” on page13 for appropriate voltagesSDOUT45Serial Audio Data Output (Output) -Output for two’s complement serial audio data. SCLK146Serial Port 1 Serial Bit Clock (Input/Output)-Serial bit clock for serial audio interface 1.LRCK147Serial Port 1 Left Right/Clock(Input/Output) - Determines which channel, Left or Right, is cur-rently active on the serial audio output data line.MCLK148Master Clock 1 (Input) - Clock source for the ADC’s delta-sigma modulators. By default, this sig-nal also clocks the DAC’s delta-sigma modulators.1.3Digital I/O Pin CharacteristicsThe logic level for each input should adhere to the corresponding power rail and should not exceed the max-imum ratings.Power SupplyPinNumberPin Name I/O Driver ReceiverSoftware ModeVL 1SDACDOUTInput/OutputHi-Z/Output1.8 V - 3.3 V, Open Drain1.8 V - 3.3 V, CMOS1.8 V - 3.3 V, with Hysteresis 2SCLCCLKInput- 1.8 V - 3.3 V, with Hysteresis 3AD0CSInput- 1.8 V - 3.3 V, with Hysteresis 4AD1CDINInput- 1.8 V - 3.3 V, with Hysteresis 5INT Output 1.8 V - 3.3 V, Open Drain 1.8 V - 3.3 V, with HysteresisHardware ModeVL 1M0Input- 1.8 V - 3.3 V, with Hysteresis 2M1Input- 1.8 V - 3.3 V, with Hysteresis 3MDIV Input- 1.8 V - 3.3 V, with Hysteresis 4MUTE Input- 1.8 V - 3.3 V, with Hysteresis 5DIF Input- 1.8 V - 3.3 V, with HysteresisAll ModesVL 35RST Input- 1.8 V - 3.3 V 4740LRCK1LRCK2Input/Output 1.8 V - 3.3 V, CMOS 1.8 V - 3.3 V 4641SCLK1SCLK2Input/Output 1.8 V - 3.3 V, CMOS 1.8 V - 3.3 V 4839MCLK1MCLK2Input- 1.8 V - 3.3 V 3837SDIN1SDIN2Input- 1.8 V - 3.3 V 45SDOUT Output 1.8 V - 3.3 V, CMOS-36OVFL Output 1.8 V - 3.3 V, Open Drain-VA_H 111213MUTEC1MUTEC2MUTEC3Output9.0 V - 12.0 V-Table 1. I/O Power Rails2.CHARACTERISTICS AND SPECIFICATIONS RECOMMENDED OPERATING CONDITIONSGND =GNDH =0V; All voltages with respect to ground.ABSOLUTE MAXIMUM RATINGSGND =GNDH =0 V; All voltages with respect to ground. (Note 1)Notes:1.Operation beyond these limits may result in permanent damage to the device.Normal operation is not guaranteed at these extremes.2.Any pin except supplies. Transient currents of up to ±100mA on the analog input pins will not causeSCR latch-up.ParametersSymbol Min Nom Max Units DC Power Supplies:Analog Digital LogicHigh Voltage AnalogVA VD VL VA_H 3.133.131.718.55 3.33.33.39.0 3.473.473.4712.60V V V V Ambient Operating Temperature (Power Applied)Commercial(-CQZ)Automotive(-DQZ)T A-40-40--+85+105°C °CParameterSymbol Min Max Units DC Power Supplies:Analog Digital LogicHigh Voltage AnalogVA VD VL VA_H -0.3-0.3-0.3-0.3+4.50+4.50+4.50+17.0V V V V Input Current (Note 2)I in -10+10mA Analog Input Voltage V INA GND - 0.3VA_H + 0.3V Digital Input VoltageLogicV IND -0.3VL + 0.4V Ambient Operating Temperature (Power Applied)T A -55+125°C Storage TemperatureT stg-65+150°CTest Conditions (unless otherwise specified): VA = VD = VL = 3.3V, VA_H = 9V, GND =GNDH =0V; T A = 25°C; 997Hz Full-Scale Output Sine Wave. Decoupling capacitors, Filter capacitors, and Recommended output filter as shown in Figure 7 on page 26 and Figure 8 on page 27; Fs =48 kHz or 96kHz; Synchronous Mode; Measurement Bandwidth 10 Hz to 20kHz,Notes:3.One-half LSB of triangular PDF dither added to data.4.See Figures 1 and 2 on page 16. R L and C L reflect the minimum resistance and maximum capacitanceallowed in order to maintain stability in the internal op-amp. C L affects the dominant pole of the internal output amp; increasing C L beyond 100pF can cause the internal op-amp to become unstable.ParameterSymbolMin Typ Max Unit Dynamic Range(Note 3)18 to 24-Bit A-weighted unweighted 16-BitA-weighted unweighted94918885100979390----dB dB dB dB Total Harmonic Distortion + Noise(Note 3)18 to 24-Bit0 dB -20 dB-60 dB 16-Bit0 dB -20 dB -60 dB THD+N -------90-77-37-87-77-37-84-73-33-82-62-22dB dB dB dB dB dB Interchannel Isolation (1kHz)--100-dB DC AccuracyInterchannel Gain Mismatch -0.10.25dB Gain Drift -100-ppm/°C Analog OutputFull-Scale Output Voltage1.92.0 2.1V rms Max current draw from an AOUT pin I OUT-575-μA AC-Load Resistance (Note 4)R L 5--k ΩLoad Capacitance (Note 4)C L --100pF Output ImpedanceZ OUT-50-ΩTest Conditions (unless otherwise specified): VA =3.13V to 3.47V, VD =3.13V to 3.47V, VL =1.71V to 3.47V, VA_H = 8.55V to 12.60V, GND=GNDH=0V; T A = -40° C to +85° C; 997Hz Full-Scale Output Sine Wave. Decoupling capacitors, filter capacitors, and recommended output filter as shown in Figure 7 on page 26 and Fig-ure 8 on page 27; Fs=48 kHz or 96kHz; Synchronous Mode; Measurement Bandwidth 10 Hz to 20kHz,Parameter Symbol Min Typ Max Unit Dynamic Range(Note 3)18 to 24-Bit A-weightedunweighted 16-Bit A-weightedunweighted 90878380100979390----dBdBdBdBTotal Harmonic Distortion + Noise(Note 3)18 to 24-Bit0 dB-20 dB-60 dB 16-Bit0 dB-20 dB-60 dB THD+N-------90-77-37-87-77-37-80-67-27-77-67-27dBdBdBdBdBdBInterchannel Isolation(1kHz)--100-dB DC AccuracyInterchannel Gain Mismatch-0.10.25dB Gain Drift-100-ppm/°C Analog OutputFull-Scale Output Voltage 1.9 2.0 2.1V rms Max current draw from an AOUT pin I OUT-575-μA AC-Load Resistance(Note 4)R L5--kΩLoad Capacitance(Note 4)C L--100pF Output Impedance Z OUT-50-ΩDAC COMBINED INTERPOLATION & ON-CHIP ANALOG FILTER RESPONSENotes:5.Response is clock-dependent and will scale with Fs. Note that the amplitude vs. frequency plots of thisdata (Figures 31 to 42) have been normalized to Fs and can be de-normalized by multiplying the X-axis scale by Fs.6.For Single-Speed Mode, the measurement bandwidth is from StopBand to 3 Fs.For Double-Speed Mode, the measurement bandwidth is from StopBand to 3 Fs.7.De-emphasis is available only in Single-Speed Mode.Parameter (Note 5)SymbolMinTypMaxUnitSingle-Speed Mode Passband (Note 6)to -0.01dB corner to -3dB corner00--.454.499Fs FsFrequency Response (10Hz to 20kHz)-0.01-+0.01dB StopBand0.547--Fs StopBand Attenuation (Note 6)102--dB Group Delaytgd-9.4/Fs -s De-emphasis Error (Note 7) Fs = 44.1 kHz--+/-0.14dBDouble-Speed Mode Passband (Note 6)to -0.01dB corner to -3dB corner00--.43.499Fs Fs Frequency Response (10Hz to 20kHz)-0.01-+0.01dB StopBand.583--Fs StopBand Attenuation (Note 6)80--dB Group Delaytgd- 4.6/Fs-sFigure 1. Equivalent Analog Output Load Figure 2. Maximum Analog Output Loading。

CS42435_07中文资料

CS42435_07中文资料

FEATURESFour 24-bit A/D, Eight 24-bit D/A Converters ADC Dynamic Range–105 dB Differential –102 dB Single-Ended DAC Dynamic Range–108 dB Differential –105 dB Single-Ended ADC/DAC THD+N–-98 dB Differential –-95 dB Single-EndedCompatible with Industry-Standard TimeDivision Multiplexed (TDM) Serial InterfaceDAC Sampling Rates up to 192 kHz ADC Sampling Rates up to 96 kHzProgrammable ADC High-Pass Filter for DCOffset CalibrationLogarithmic Digital Volume Control Hardware Mode or Software I²C ® & SPI ™ Supports Logic Levels Between 5V and 1.8VGENERAL DESCRIPTIONThe CS42435 CODEC provides four multi-bit analog-to-digital and eight multi-bit digital-to-analog delta-sigma converters. The CODEC is capable of operation with ei-ther differential or single-ended inputs and outputs, in a 52-pin MQFP package.Four fully differential, or single-ended, inputs are avail-able on stereo ADC1 and ADC2. Digital volume control is provided for each ADC channel, with selectable over-flow detection. An auxiliary serial input is available for an additional two channels of PCM data.All eight DAC channels provide digital volume control and can operate with differential or single-ended outputs.The CS42435 is available in a 52-pin MQFP package in Commercial (-40°C to +85°C) and Automotive (-40°C to +105°C) grades. The CDB42438 Customer Demonstra-tion board is also available for device evaluation and implementation suggestions. Please refer to “Ordering Information” on page 57 for complete ordering information.The CS42435 is ideal for audio systems requiring wide dynamic range, negligible distortion and low noise, such as A/V receivers, DVD receivers, and automotive audio systems.CS42435TABLE OF CONTENTS1. PIN DESCRIPTIONS - SOFTWARE MODE (6)1.1 Digital I/O Pin Characteristics (8)2. PIN DESCRIPTIONS - HARDWARE MODE (9)3. TYPICAL CONNECTION DIAGRAMS (11)4. CHARACTERISTICS AND SPECIFICATIONS (13)RECOMMENDED OPERATING CONDITIONS (13)ABSOLUTE MAXIMUM RATINGS (13)ANALOG INPUT CHARACTERISTICS (COMMERCIAL) (14)ANALOG INPUT CHARACTERISTICS (AUTOMOTIVE) (15)ADC DIGITAL FILTER CHARACTERISTICS (16)ANALOG OUTPUT CHARACTERISTICS (COMMERCIAL) (17)ANALOG OUTPUT CHARACTERISTICS (AUTOMOTIVE) (18)COMBINED DAC INTERPOLATION & ON-CHIP ANALOG FILTER RESPONSE (20)SWITCHING SPECIFICATIONS - ADC/DAC PORT (21)SWITCHING CHARACTERISTICS - AUX PORT (22)SWITCHING SPECIFICATIONS - CONTROL PORT - I²C MODE (23)SWITCHING SPECIFICATIONS - CONTROL PORT - SPI FORMAT (24)DC ELECTRICAL CHARACTERISTICS (25)DIGITAL INTERFACE SPECIFICATIONS & CHARACTERISTICS (25)5. APPLICATIONS (26)5.1 Overview (26)5.2 Analog Inputs (27)5.2.1 Line-Level Inputs (27)5.2.1.1 Hardware Mode (27)5.2.1.2 Software Mode (27)5.2.2 High-Pass Filter and DC Offset Calibration (27)5.2.2.1 Hardware Mode (28)5.3 Analog Outputs (28)5.3.1 Initialization (28)5.3.2 Line-Level Outputs and Filtering (28)5.3.3 Digital Volume Control (30)5.3.3.1 Hardware Mode (30)5.3.3.2 Software Mode (30)5.3.4 De-Emphasis Filter (30)5.4 System Clocking (31)5.4.1 Hardware Mode (31)5.4.2 Software Mode (31)5.5 CODEC Digital Interface (31)5.5.1 TDM (31)5.5.2 I/O Channel Allocation (32)5.6 AUX Port Digital Interface Formats (32)5.6.1 Hardware Mode (32)5.6.2 Software Mode (32)5.6.3 I²S (32)5.6.4 Left-Justified (33)5.7 Control Port Description and Timing (33)5.7.1 SPI Mode (33)5.7.2 I²C Mode (34)5.8 Recommended Power-Up Sequence (35)5.8.1 Hardware Mode (35)5.8.2 Software Mode (36)5.9 Reset and Power-Up (36)5.10 Power Supply, Grounding, and PCB Layout (36)6. REGISTER QUICK REFERENCE (37)7. REGISTER DESCRIPTION (39)7.1 Memory Address Pointer (MAP) (39)7.1.1 Increment (INCR) (39)7.1.2 Memory Address Pointer (MAP[6:0]) (39)7.2 Chip I.D. and Revision Register (Address 01h) (Read Only) (39)7.2.1 Chip I.D. (CHIP_ID[3:0]) (39)7.2.2 Chip Revision (REV_ID[3:0]) (39)7.3 Power Control (Address 02h) (40)7.3.1 Power Down ADC Pairs (PDN_ADCX) (40)7.3.2 Power Down DAC Pairs (PDN_DACX) (40)7.3.3 Power Down (PDN) (40)7.4 Functional Mode (Address 03h) (41)7.4.1 MCLK Frequency (MFREQ[2:0]) (41)7.5 Miscellaneous Control (Address 04h) (41)7.5.1 Freeze Controls (FREEZE) (41)7.5.2 Auxiliary Digital Interface Format (AUX_DIF) (41)7.6 ADC Control & DAC De-Emphasis (Address 05h) (42)7.6.1 ADC1-2 High-Pass Filter Freeze (ADC1-2_HPF FREEZE) (42)7.6.2 DAC De-Emphasis Control (DAC_DEM) (42)7.6.3 ADC1 Single-Ended Mode (ADC1 SINGLE) (42)7.6.4 ADC2 Single-Ended Mode (ADC2 SINGLE) (43)7.7 Transition Control (Address 06h) (43)7.7.1 Single Volume Control (DAC_SNGVOL, ADC_SNGVOL) (43)7.7.2 Soft Ramp and Zero Cross Control (ADC_SZC[1:0], DAC_SZC[1:0]) (43)7.7.3 Auto-Mute (AMUTE) (44)7.7.4 Mute ADC Serial Port (MUTE ADC_SP) (44)7.8 DAC Channel Mute (Address 07h) (44)7.8.1 Independent Channel Mute (AOUTX_MUTE) (44)7.9 AOUTX Volume Control (Addresses 08h- 0Fh) (45)7.9.1 Volume Control (AOUTX_VOL[7:0]) (45)7.10 DAC Channel Invert (Address 10h) (45)7.10.1 Invert Signal Polarity (INV_AOUTX) (45)7.11 AINX Volume Control (Address 11h-14h) (45)7.11.1 AINX Volume Control (AINX_VOL[7:0]) (45)7.12 ADC Channel Invert (Address 17h) (46)7.12.1 Invert Signal Polarity (INV_AINX) (46)7.13 Status (Address 19h) (Read Only) (46)7.13.1 Clock Error (CLK ERROR) (46)7.13.2 ADC Overflow (ADCX_OVFL) (46)7.14 Status Mask (Address 1Ah) (47)8. EXTERNAL FILTERS (48)8.1 ADC Input Filter (48)8.1.1 Passive Input Filter (49)8.1.2 Passive Input Filter w/Attenuation (49)8.2 DAC Output Filter (50)9. ADC FILTER PLOTS (51)10. DAC FILTER PLOTS (53)11. PARAMETER DEFINITIONS (55)12. REFERENCES (55)13. PACKAGE INFORMATION (56)13.1 Thermal Characteristics (56)14. ORDERING INFORMATION (57)15. REVISION HISTORY (57)LIST OF FIGURESFigure 1.Typical Connection Diagram (Software Mode) (11)Figure 2.Typical Connection Diagram (Hardware Mode) (12)Figure 3.Output Test Circuit for Maximum Load (19)Figure 4.Maximum Loading (19)Figure 5.TDM Serial Audio Interface Timing (21)Figure 6.Serial Audio Interface Slave Mode Timing (22)Figure 7.Control Port Timing - I²C Format (23)Figure 8.Control Port Timing - SPI Format (24)Figure 9.Full-Scale Input (27)Figure 10.Audio Output Initialization Flow Chart (29)Figure 11.Full-Scale Output (30)Figure 12.De-Emphasis Curve (31)Figure 13.TDM Serial Audio Format (32)Figure 14.AUX I²S Format (32)Figure 15.AUX Left-Justified Format (33)Figure 16.Control Port Timing in SPI Mode (34)Figure 17.Control Port Timing, I²C Write (34)Figure 18.Control Port Timing, I²C Read (35)Figure 19.Single-to-Differential Active Input Filter (48)Figure 20.Single-Ended Active Input Filter (48)Figure 21.Passive Input Filter (49)Figure 22.Passive Input Filter w/Attenuation (49)Figure 23.Active Analog Output Filter (50)Figure 24.Passive Analog Output Filter (50)Figure 25.SSM Stopband Rejection (51)Figure 26.SSM Transition Band (51)Figure 27.SSM Transition Band (Detail) (51)Figure 28.SSM Passband Ripple (51)Figure 29.DSM Stopband Rejection (51)Figure 30.DSM Transition Band (51)Figure 31.DSM Transition Band (Detail) (52)Figure 32.DSM Passband Ripple (52)Figure 33.SSM Stopband Rejection (53)Figure 34.SSM Transition Band (53)Figure 35.SSM Transition Band (detail) (53)Figure 36.SSM Passband Ripple (53)Figure 37.DSM Stopband Rejection (53)Figure 38.DSM Transition Band (53)Figure 39.DSM Transition Band (detail) (54)Figure 40.DSM Passband Ripple (54)Figure 41.QSM Stopband Rejection (54)Figure 42.QSM Transition Band (54)Figure 43.QSM Transition Band (detail) (54)Figure 44.QSM Passband Ripple (54)LIST OF TABLESTable 1. I/O Power Rails (8)Table 2. Hardware Configurable Settings (26)Table 3. MCLK Frequency Settings (31)Table 4. Serial Audio Interface Channel Allocations (32)Table 5. MCLK Frequency Settings (41)Table 6. Example AOUT Volume Settings (45)Table 7. Example AIN Volume Settings (46)1.PIN DESCRIPTIONS - SOFTWARE MODEPin Name#Pin DescriptionSCL/CCLK1Serial Control Port Clock (Input) - Serial clock for the control port interface.SDA/CDOUT2Serial Control Data I/O (Input/Output) - Input/Output for I²C data. Output for SPI data.AD0/CS3Address Bit [0]/ Chip Select (Input) - Chip address bit in I²C Mode. Control signal used to select the chip in SPI Mode.AD1/CDIN4Address Bit [1]/ SPI Data Input (Input) - Chip address bit in I²C Mode. Input for SPI data.RST5Reset (Input) - The device enters a low-power mode and all internal registers are reset to their default settings when low.VLC6Control Port Power (Input) - Determines the required signal level for the control port interface. See “Digital I/O Pin Characteristics” on page8.FS7Frame Sync (Input) - Signals the start of a new TDM frame in the TDM digital interface format. VD8Digital Power (Input) - Positive power supply for the digital section.DGND9,18Digital Ground (Input) - Ground reference for the digital section.VLS10Serial Port Interface Power (Input) - Determines the required signal level for the serial port inter-faces. See “Digital I/O Pin Characteristics” on page8.SCLK11Serial Clock(Input) - Serial clock for the serial audio interface. Input frequency must be 256 x Fs. MCLK12Master Clock (Input) - Clock source for the delta-sigma modulators and digital filters.ADC_SDOUT13Serial Audio Data Output (Output) - TDM output for two’s complement serial audio data.DAC_SDIN14DAC Serial Audio Data Input (Input) - TDM Input for two’s complement serial audio data.AUX_LRCK15Auxiliary Left/Right Clock (Output) - Determines which channel, Left or Right, is currently active on the Auxiliary serial audio data line.AUX_SCLK16Auxiliary Serial Clock(Output) - Serial clock for the Auxiliary serial audio interface.AUX_SDIN17Auxiliary Serial Input (Input) - The CS42435 provides an additional serial input for two’s comple-ment serial audio data.AOUT1 +,-AOUT2 +,-AOUT3 +,-AOUT4 +,-AOUT5 +,-AOUT6 +,-AOUT7 +,-AOUT8 +,-20,1921,2224,2325,2628,2729,3032,3133,34Differential Analog Output (Output) - The full-scale differential analog output level is specified in the Analog Characteristics specification table. Each positive leg of the differential outputs may also be used single-ended.TSTN 49,5051,52Test In - These pins are inputs used for test purposes only. They must be tied to ground for nor-mal operation.AGND35,48Analog Ground (Input) - Ground reference for the analog section.VQ36Quiescent Voltage (Output) - Filter connection for internal quiescent reference voltage. VA37,46Analog Power (Input) - Positive power supply for the analog section.AIN1 +,-AIN2 +,-AIN3 +,-AIN4 +,-39,3841,4043,4245,44Differential Analog Input (Input) - Signals are presented differentially to the delta-sigma modula-tors. The full-scale input level is specified in the Analog Characteristics specification table.FILT+47Positive Voltage Reference (Output) - Positive reference voltage for the internal sampling cir-cuits.1.1Digital I/O Pin CharacteristicsVarious pins on the CS42435 are powered from separate power supply rails. The logic level for each input should adhere to the corresponding power rail and should not exceed the maximum ratings.Power Rail Pin NameSW/(HW)I/O Driver ReceiverVLC RST Input- 1.8 V - 5.0 V, CMOS SCL/CCLK(TEST)Input- 1.8 V - 5.0 V, CMOS, with HysteresisSDA/CDOUT (TEST)Input/Output1.8 V - 5.0 V, CMOS/Open Drain 1.8 V - 5.0 V, CMOS, with HysteresisAD0/CS(MFREQ)Input- 1.8 V - 5.0 V, CMOS AD1/CDIN(TEST)Input- 1.8 V - 5.0 V, CMOS VLS MCLK Input- 1.8 V - 5.0 V, CMOS LRCK Input- 1.8 V - 5.0 V, CMOSSCLK Input- 1.8 V - 5.0 V, CMOSADC_SDOUT Input/Output1.8 V - 5.0 V, CMOS-DAC_SDIN Input- 1.8 V - 5.0 V, CMOS AUX_LRCK Output 1.8 V - 5.0 V, CMOS-AUX_SCLK Output 1.8 V - 5.0 V, CMOS-AUX_SDIN Input- 1.8 V - 5.0 V, CMOSTable 1. I/O Power Rails2.PIN DESCRIPTIONS - HARDWARE MODEPin Name#Pin DescriptionTEST1,2,4Test - These pins are inputs used for test purposes only. They must be tied high or low. MFREQ3MCLK Frequency (Input) - Sets the required frequency range of the input master clock.RST5Reset (Input) - The device enters a low-power mode and all internal registers are reset to their default settings when low.VLC6Control Port Power (Input) - Determines the required signal level for the control port interface. See “Digital I/O Pin Characteristics” on page8.FS7Frame Sync (Input) - Signals the start of a new TDM frame in the TDM digital interface format. VD8Digital Power (Input) - Positive power supply for the digital section.DGND9,18Digital Ground (Input) - Ground reference for the digital section.VLS10Serial Port Interface Power (Input) - Determines the required signal level for the serial port inter-faces. See “Digital I/O Pin Characteristics” on page8.SCLK11Serial Clock(Input) - Serial clock for the serial audio interface. Input frequency must be 256 x Fs. MCLK12Master Clock (Input) - Clock source for the delta-sigma modulators and digital filters.ADC_SDOUT13Serial Audio Data Output (Output) - TDM output for two’s complement serial audio data.DAC_SDIN14DAC Serial Audio Data Input (Input) - TDM Input for two’s complement serial audio data.AUX_LRCK15Auxiliary Left/Right Clock (Output) - Determines which channel, Left or Right, is currently active on the Auxiliary serial audio data line.AUX_SCLK16Auxiliary Serial Clock(Output) - Serial clock for the Auxiliary serial audio interface.AUX_SDIN17Auxiliary Serial Input (Input) - The CS42435 provides an additional serial input for two’s comple-ment serial audio data.AOUT1 +,-AOUT2 +,-AOUT3 +,-AOUT4 +,-AOUT5 +,-AOUT6 +,-AOUT7 +,-AOUT8 +,-20,1921,2224,2325,2628,2729,3032,3133,34Differential Analog Output (Output) - The full-scale differential analog output level is specified in the Analog Characteristics specification table. Each positive leg of the differential outputs may also be used single-ended.AGND35,48Analog Ground (Input) - Ground reference for the analog section.VQ36Quiescent Voltage (Output) - Filter connection for internal quiescent reference voltage. VA37,46Analog Power (Input) - Positive power supply for the analog section.AIN1 +,-AIN2 +,-AIN3 +,-AIN4 +,-39,3841,4043,4245,44Differential Analog Input (Input) - Signals are presented differentially to the delta-sigma modula-tors. The full-scale input level is specified in the Analog Characteristics specification table.FILT+47Positive Voltage Reference (Output) - Positive reference voltage for the internal sampling cir-cuits.TSTN 49,5051,52Test In - These pins are inputs used for test purposes only. They must be tied to ground for nor-mal operation.3.TYPICAL CONNECTION DIAGRAMSFigure 1. Typical Connection Diagram (Software Mode)Figure 2. Typical Connection Diagram (Hardware Mode)4.CHARACTERISTICS AND SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS(AGND=DGND=0 V, all voltages with respect to ground.)ABSOLUTE MAXIMUM RATINGS(AGND = DGND = 0 V; all voltages with respect to ground.)WARNING:Operation at or beyond these limits may result in permanent damage to the device. Normal operationis not guaranteed at these extremes.Notes:1.Typical Analog input/output performance will slightly degrade at VA = 3.3 V.2.The ADC_SDOUT may not meet timing requirements in Double-Speed Mode.3.Any pin except supplies. Transient currents of up to ±100 mA on the analog input pins will not causeSCR latch-up.4.The maximum over/under voltage is limited by the input current.ParametersSymbol MinMax Units DC Power Supply Analog (Note 1)VA 3.14 5.25V Digital VD 3.14 3.47V Serial Audio Interface (Note 2)VLS 1.71 5.25V Control Port Interface VLC 1.71 5.25V Ambient TemperatureCommercial -CMZAutomotive -DMZT A-40-40+85+105°C °CParametersSymbol Min Max Units DC Power SupplyAnalogDigitalSerial Port Interface Control Port InterfaceVA VD VLS VLC -0.3-0.3-0.3-0.3 6.06.06.06.0V V V V Input Current(Note 3)I in -±10mA Analog Input Voltage (Note 4)V IN AGND-0.7VA+0.7V Digital Input Voltage Serial Port Interface (Note 4)Control Port InterfaceV IND-S V IND-C -0.3-0.3VLS+ 0.4VLC+ 0.4V V Ambient Operating Temperature (power applied)T A -50+125°C Storage TemperatureT stg-65+150°C(Test Conditions (unless otherwise specified): VA = 5V, VD = VLS = VLC = 3.3V, and TA = 25°C. Full-scale input sine wave: 1 kHz through the active input filter in Figure 20 on page 48 and Figure 20 on page 48; Measurement Bandwidth is 10Hz to 20kHz.)Differential Single-EndedParameter Min Typ Max Min Typ Max Unit Fs=48 kHz, 96 kHzDynamic Range A-weightedunweighted40 kHz bandwidth unweighted 9996-10510299---96931029996---dBdBdBTotal Harmonic Distortion + Noise -1dB (Note 5) -20dB-60dB40 kHz bandwidth -1 dB -----98-82-42-90-92--------95-79-39-90-89---dBdBdBdBADC1-2 Interchannel Isolation-90--90-dB DC AccuracyInterchannel Gain Mismatch-0.1--0.1-dB Gain Drift-±100--±100-ppm/°C Analog InputFull-Scale Input Voltage 1.06*VA 1.12*VA 1.18*VA0.53*VA0.56*VA0.59*VA Vpp Differential Input Impedance (Note 6)232932---kΩSingle-Ended Input Impedance (Note 7)---232932kΩCommon Mode Rejection Ratio (CMRR)-82----dB(Test Conditions (unless otherwise specified): VA = 5V±5%, VD = VLS = VLC = 3.3V±5% and TA=-40°to +85°C. Full-scale input sine wave: 1 kHz through the active input filter in Figure 20 on page 48 and Figure 19 on page 48; Measurement Bandwidth is 10Hz to 20kHz.)Notes:5.Referred to the typical full-scale voltage.6.Measured between AINx+ and AINx-.7.Measured between AINxx and AGND.Differential Single-EndedParameter Min Typ Max Min Typ Max Unit Fs=48 kHz, 96 kHzDynamic Range A-weightedunweighted40 kHz bandwidth unweighted 9794-10510299---9491-1029996---dBdBdBTotal Harmonic Distortion + Noise -1dB (Note 5) -20dB-60dB40 kHz bandwidth -1 dB -----98-82-42-87-90--------95-79-39-87-87---dBdBdBdBADC1-2 Interchannel Isolation-90--90-dB DC AccuracyInterchannel Gain Mismatch-0.1--0.1-dB Gain Drift-±100--±100-ppm/°C Analog InputFull-Scale Input Voltage 1.04*VA 1.12*VA 1.20*VA0.52*VA0.56*VA0.60*VA Vpp Differential Input Impedance(Note 6)232932---kΩSingle-Ended Input Impedance(Note 7)---232932kΩCommon Mode Rejection Ratio (CMRR)-82----dBADC DIGITAL FILTER CHARACTERISTICSNotes:8.Filter response is guaranteed by design.9.Response is clock-dependent and will scale with Fs. Note that the response plots (Figures 25to 32) havebeen normalized to Fs and can be de-normalized by multiplying the X-axis scale by Fs.Parameter (Notes 8, 9)MinTypMaxUnitSingle-Speed Mode (Note 9)Passband (Frequency Response) to -0.1 dB corner0-0.4896Fs Passband Ripple --0.08dB Stopband0.5688--Fs Stopband Attenuation 70--dB Total Group Delay-12/Fs-sDouble-Speed Mode (Note 9)Passband (Frequency Response) to -0.1 dB corner0-0.4896Fs Passband Ripple --0.16dB Stopband0.5604--Fs Stopband Attenuation 69--dB Total Group Delay-9/Fs-sHigh-Pass Filter Characteristics Frequency Response -3.0 dB -0.13 dB -120--Hz Hz Phase Deviation @ 20Hz-10-Deg Passband Ripple --0dB Filter Settling Time -105/Fss(Test Conditions (unless otherwise specified): VA = 5V, VD = VLS = VLC = 3.3V, and TA = 25° C. Full-scale 997 Hz output sine wave (see Note 11) into passive filter in Figure 25 on page 51 and active filter in Figure 25 on page 51; Measurement Bandwidth is 10Hz to 20kHz.)ParameterDifferentialMin Typ MaxSingle-EndedMin Typ Max UnitFs = 48 kHz, 96 kHz, 192 kHz Dynamic Range18 to 24-Bit A-weightedunweighted 16-Bit A-weightedunweighted 10299--1081059996----9996--1051029693----dBdBdBdBTotal Harmonic Distortion + Noise18 to 24-Bit0 dB-20 dB-60 dB 16-Bit0 dB-20 dB-60 dB -------98-85-45-93-76-36-92-----------95-82-42-90-73-33-89-----dBdBdBdBdBdBInterchannel Isolation (1 kHz)-100--100-dB Analog OutputFull-Scale Output 1.235•VA 1.300•VA 1.365•VA0.618•VA0.650•VA0.683•VA Vpp Interchannel Gain Mismatch-0.10.25-0.10.25dB Gain Drift-±100--±100-ppm/°C Output Impedance-100--100-ΩDC Current draw from an AOUT pin(Note 10)--10--10μA AC-Load Resistance (R L)(Note 12)3--3--kΩLoad Capacitance (C L)(Note 12)--100--100pF(Test Conditions (unless otherwise specified): VA = 5V±5%, VD = VLS = VLC = 3.3V±5% and TA =-40 to +85×C. Full-scale 997 Hz output sine wave (see Note 11) in Figure 25 on page 51 and Figure 25 on page 51; Measure-ment Bandwidth is 10Hz to 20kHz.)Notes:10.Guaranteed by design. The DC current draw represents the allowed current draw from the AOUT pindue to typical leakage through the electrolytic DC-blocking capacitors.11.One-half LSB of triangular PDF dither is added to data.12.Guaranteed by design. See Figure 3. R L and C L reflect the recommended minimum resistance andmaximum capacitance required for the internal op-amp's stability and signal integrity. In this circuit to-pology, C L will effectively move the dominant pole of the two-pole amp in the output stage. Increasing this value beyond the recommended 100 pF can cause the internal op-amp to become unstable. See “External Filters” on page 48 for a recommended output filter.ParameterDifferentialMin Typ MaxSingle-EndedMin Typ MaxUnitFs = 48 kHz, 96 kHz, 192 kHz Dynamic Range18 to 24-Bit A-weightedunweighted16-Bit A-weightedunweighted10097--1081059996----9794--1051029693----dB dB dB dB Total Harmonic Distortion + Noise18 to 24-Bit 0 dB-20 dB-60 dB16-Bit 0 dB-20 dB-60 dB-------98-85-45-93-76-36-90------------95-82-42-90-73-33-87-----dB dB dB dB dB dB Interchannel Isolation (1 kHz)-100--100-dBAnalog Output Full-Scale Output 1.210•VA 1.300•VA 1.392•VA 0.605•VA 0.650•VA 0.696•VA Vpp Interchannel Gain Mismatch -0.10.25-0.10.25dB Gain Drift -±100--±100-ppm/°C Output Impedance -100--100-ΩDC Current draw from an AOUT pin (Note 10)--10--10μAAC-Load Resistance (R L ) (Note 12)3--3--k ΩLoad Capacitance (C L )(Note 12)--100--100pFFigure 3. Output Test Circuit for Maximum Load Figure 4. Maximum LoadingCOMBINED DAC INTERPOLATION & ON-CHIP ANALOG FILTER RESPONSENotes:13.Response is clock-dependent and will scale with Fs. Note that the response plots (Figures 33to 44) havebeen normalized to Fs and can be de-normalized by multiplying the X-axis scale by Fs.14.Single- and Double-Speed Mode Measurement Bandwidth is from Stopband to 3 Fs.Quad-Speed Mode Measurement Bandwidth is from Stopband to 1.34 Fs.15.De-emphasis is only available in Single-Speed Mode.Parameter (Notes 8, 13)MinTypMaxUnitSingle-Speed ModePassband (Frequency Response)to -0.05dB corner to -3dB corner00--0.47800.4996Fs Fs Frequency Response 10Hz to 20kHz -0.2-+0.08dB StopBand0.5465--Fs StopBand Attenuation (Note 14)50--dB Group Delay-10/Fs -sDe-emphasis Error (Note 15)Fs = 32kHz Fs = 44.1 kHz Fs = 48 kHz ------+1.5/+0+0.05/-0.25-0.2/-0.4dB dB dB Double-Speed ModePassband (Frequency Response)to -0.1dB corner to -3dB corner00--0.46500.4982Fs Fs Frequency Response 10Hz to 20kHz -0.2-+0.7dB StopBand0.5770--Fs StopBand Attenuation (Note 14)55--dB Group Delay -5/Fs -s Quad-Speed ModePassband (Frequency Response)to -0.1dB corner to -3dB corner00--0.3970.476Fs Fs Frequency Response 10Hz to 20kHz -0.2-+0.05dB StopBand0.7--Fs StopBand Attenuation (Note 14)51--dB Group Delay - 2.5/Fs-sSWITCHING SPECIFICATIONS - ADC/DAC PORT(Inputs: Logic 0 = DGND, Logic 1 = VLS, ADC_SDOUT C LOAD = 15 pF.)Notes:16.After powering up the CS42435, RST should be held low after the power supplies and clocks are settled.17.See Table 5 on page 41 for suggested MCLK frequencies.18.VLS is limited to nominal 2.5 V to 5.0V operation only.19.ADC does not meet timing specification for Quad-Speed Mode.Parameters Symbol Min Max UnitsSlave ModeRST pin Low Pulse Width(Note 16)1-ms MCLK Frequency 0.51250MHz MCLK Duty Cycle(Note 17)4555%Input Sample Rate (FS pin)Single-Speed ModeDouble-Speed Mode (Note 18)Quad-Speed Mode (Note 19)F s F s F s 45010050100200kHz kHz kHz SCLK Duty Cycle 4555%SCLK High Time t sckh 8-ns SCLK Low Timet sckl 8-ns FS Rising Edge to SCLK Rising Edge t fss 5-ns SCLK Rising Edge to FS Falling Edget fsh 16-ns DAC_SDIN Setup Time Before SCLK Rising Edge t ds 3-ns DAC_SDIN Hold Time After SCLK Rising Edge t dh 5-ns DAC_SDIN Hold Time After SCLK Rising Edge t dh15-ns ADC_SDOUT Hold Time After SCLK Rising Edge t dh210-ns ADC_SDOUT Valid Before SCLK Rising Edget dval15-nsFigure 5. TDM Serial Audio Interface TimingSWITCHING CHARACTERISTICS - AUX PORT(Inputs: Logic 0 = DGND, Logic 1 = VLS.)Parameters Symbol Min Max Units Master ModeOutput Sample Rate (AUX_LRCK) All Speed Modes F s-FS kHz AUX_SCLK Frequency-64·FS kHz AUX_SCLK Duty Cycle4555% AUX_LRCK Edge to SCLK Rising Edge t lcks-5ns AUX_SDIN Setup Time Before SCLK Rising Edge t ds3-nsnsAUX_SDIN Hold Time After SCLK Rising Edge t dh5-SWITCHING SPECIFICATIONS - CONTROL PORT - I²C MODE(VLC = 1.8V - 5.0V, VLS = VD = 3.3 V, VA = 5.0 V; Inputs: Logic 0=DGND, Logic 1=VLC, SDA C L =30pF)Notes:20.Data must be held for sufficient time to bridge the transition time, t fc , of SCL.21.Guaranteed by design.Parameter SymbolMin Max Unit SCL Clock Frequency f scl -100kHz RST Rising Edge to Startt irs 500-ns Bus Free Time Between Transmissionst buf 4.7-µs Start Condition Hold Time (prior to first clock pulse)t hdst 4.0-µs Clock Low time t low 4.7-µs Clock High Timet high 4.0-µs Setup Time for Repeated Start Condition t sust 4.7-µs SDA Hold Time from SCL Falling (Note 20)t hdd 0-µs SDA Setup time to SCL Rising t sud 250-ns Rise Time of SCL and SDA (Note 21)t rc -1µs Fall Time SCL and SDA (Note 21)t fc -300ns Setup Time for Stop Condition t susp 4.7-µs Acknowledge Delay from SCL Falling t ack3001000nsFigure 7. Control Port Timing - I²C FormatSWITCHING SPECIFICATIONS - CONTROL PORT - SPI FORMAT(VLC = 1.8V - 5.0V, VLS = VD = 3.3 V, VA = 5.0 V; Inputs: Logic 0=DGND, Logic 1=VLC, CDOUT C L =30pF)Notes:22.Data must be held for sufficient time to bridge the transition time of CCLK.23.For f sck <1MHz.ParameterSymbol Min Max Units CCLK Clock Frequency f sck 0 6.0MHz RST Rising Edge to CS Falling t srs 20-ns CS Falling to CCLK Edget css 20-ns CS High Time Between Transmissions t csh 1.0-μs CCLK Low Time t scl 66-ns CCLK High Timet sch 66-ns CDIN to CCLK Rising Setup Time t dsu40-ns CCLK Rising to DATA Hold Time (Note 22)t dh 15-ns CCLK Falling to CDOUT Stable t pd -50ns Rise Time of CDOUT t r1-25ns Fall Time of CDOUTt f1-25ns Rise Time of CCLK and CDIN (Note 23)t r2-100ns Fall Time of CCLK and CDIN (Note 23)t f2-100nsFigure 8. Control Port Timing - SPI Format。

HGM9520N中文说明书

HGM9520N中文说明书

HGM9520N发电机组与市电并联控制器用户手册目次前言 (5)1 概述 (7)2 性能特点 (8)3 规格 (9)4 操作 (11)4.1 指示灯 (11)4.2 按键功能描述 (12)4.3 显示 (13)4.3.1 主显示 (13)4.3.2 用户菜单及参数设置 (14)4.4 自动开机停机操作 (14)4.5 手动开机停机操作 (15)4.6 发电机组控制器开关控制过程 (16)4.6.1 手动控制过程 (16)4.6.2 自动控制过程 (16)5 保护 (16)5.1 警告 (17)5.2 闭锁 (21)5.3 安全跳闸 (25)5.4 安全跳闸停机 (29)5.5 跳闸 (32)5.6 跳闸停机 (37)5.7 报警停机 (41)6 接线 (46)7 编程参数范围及定义 (49)7.1 参数设置内容及范围 (49)7.2 开关量输出口可定义内容 (65)7.2.1 自定义时间段输出 (71)7.2.2 自定义组合输出 (71)7.3 开关量输入口可定义内容 (72)7.4 传感器选择 (75)7.5 起动成功条件选择 (76)8 参数设置 (77)9 传感器设置 (78)10 试运行 (79)10.1 步骤1-单台机组调试 (79)10.2 步骤2-空载手动并联 (79)10.3 步骤3-带载手动并联 (79)10.4 步骤4-自动并联 (79)11 市电并联模式说明 (79)11.1 发电控制模式 (80)11.2 市电控制模式 (80)11.3 负载接收模式 (81)11.4 AMF控制模式 (82)11.5 孤岛开机模式 (83)12 典型应用 (85)13 功率管理模式说明 (87)14 非重要负载(NEL)跳闸说明 (88)15 虚假负载(DL)连接说明 (89)16 安装 (90)17 控制器与发动机的J1939连接 (91)17.1 CUMMINS ISB/ISBE(康明斯) (91)17.2 CUMMINS QSL9 (91)17.3 CUMMINS QSM11(进口) (92)17.4 CUMMINS QSX15-CM570 (92)17.5 CUMMINS GCS-MODBUS (92)17.6 CUMMINS QSM11(西安康明斯) (93)17.7 CUMMINS QSZ13(东风康明斯) (93)17.8 DETROIT DIESEL DDEC III / IV(底特律) (93)17.9 DEUTZ EMR2(道依茨) (94)17.10 JOHN DEERE(强鹿) (94)17.11 MTU ADEC(SMART模块) (94)17.12 MTU ADEC(SAM模块) (95)17.13 PERKINS(珀金斯) (95)17.14 SCANIA (95)17.15 VOLVO EDC3(沃尔沃) (96)17.16 VOLVO EDC4 (96)17.17 VOLVO EMS2 (97)17.18 玉柴 (97)17.19 潍柴 (98)18 故障排除 (98)前言表1版本发展历史本文档适用于HGM9520N发电机组与市电并联控制器。

CS9LTVH中文资料

CS9LTVH中文资料

Page 1 of 3CS9L/CSPL SERIES: ULTRA HF CLOCK OSCILLATOR, PECL, +3.3 VDC or +2.5VDCDESCRIPTION: A crystal controlled, high frequency, highly stable oscillator, adhering to Positive EmitterCoupled Logic (PECL) Standards and fundamental crystal or analog multiplication technologies. The output can be Tri-stated to facilitate testing or combined multiple clocks. The device is contained in a sub-miniature, very low profile, leadless ceramic SMD package with 6 gold contact pads. This miniature oscillator is ideal for today's automated assembly environments. APPLICATIONS AND FEATURES:" Infiniband; Fiber Channel; SATA; 10GbE; Network Processors; SOHO Routing; Switches;" Common Frequencies: 150 MHz; 156.25 MHz; 155.52 MHz; 161.1328 MHz; 212.5MHz; 312.5MHz " +3.3 VDC or +2.5VDC PECL" Frequency Range from 150.000 to 700 MHz " Analog multiplication" Miniature Ceramic SMD Package Available on Tape and Reel " Lead Free and ROHS Compliant$ ABSOLUTE MAXIMUM RATINGS:PARAMETERSYMBOLVALUE UNIT Operating temperature range Ta -40…+85 °C Storage temperature range T(stg) -55…+90 °C Supply voltage Vcc +4.6VDC Maximum Input Voltage Vi Vss-0.5…Vcc+0.5 VDC Maximum Output VoltageVo Vss-0.5…Vcc+0.5VDC$ ELECTRICAL PARAMETERS:PARAMETERSYMBOL TEST CONDITIONS *1VALUEUNIT Nominal Frequency fo 150.000 ~ 700.00** MHz Supply Voltage Vcc +3.3 or +2.5 ±5% VDC Supply Current Is 80.0 MAX mA Output Logic TypePECLLoadConnected between each output and Vcc – 2.0 VDC 50Ω Output Voltage Levels Voh Vol min maxVcc-1.025 Vcc-1.620VDC VDC Duty Cycle DC Measured at 50% of Vcc40/60 to 60/40 or 45/55 to 55/45%Rise / Fall Timetr / tfMeasured at 20/80% and 80/20% Vcc Levels 0.7 TYP 1.0 MAX *2 ns Integrated Phase tji RMS, Fj = 12 kHz…20 MHz 5 0.3 TYP** ps Integrated Phase RMS tii offset frequency 50KHz to80MHz 50.5 TYP** psFo<320MHz. 1 TYP **Deterministic period Jitter Dj using wavecrest analyzer 4 Fo>320MHz. 8 TYP **psFo<320MHz. 2.5 TYP ** Random period Jitter Rj usingwavecrest analyzer 4Fo>320MHz. 2.5 TYP**ps Fo<320MHz. 25 TYP** JitterJAcumm. Peak to Peak Jitter Tp-pusing wavecrest analyzer *4 Fo>320MHz. 27 TYP**psPhase Noise £(∆f)typ. @212.5MHz 6∆f=10 Hz ∆f=100 Hz ∆f=1 KHz ∆f=10 KHz∆f =100 KHz∆f>1M Hz -65 -95 -125 -140 -145 -148 dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Fo<320MHz. -50Sub Harmonicsf_sub Load, nom, Supply nomFo>320MHz. -35dBc Overall Frequency Stability ∆f/fc Op. Temp., Aging, Load, Supply and Cal. Variations ±20, ±25, ±50, or ±100 MAX *3 ppm Pin 1 Output EnabledOutput DisabledEn DisHigh Voltage or No Connect Ground 0.7•Vcc MIN 0.3•Vcc MAXVDC VDCPage 2 of 3*1 Test Conditions Unless Stated Otherwise: Nominal Vcc, Nominal Load, +25 ±3°C *2 Frequency Dependent*3 Not All Stabilities Available With All Temperature Ranges—Please Consult Factory For Availability *4 Measured with Wavecrest SIA-3000A 1,000,000 Hits no filtering *5 Calculated from Agilent 5500 phase noise measurements *6 Measured with Agilent 5500$ PART NUMBERING SYSTEM:SERIESSYMMETRYTEMPERATURE RANGE (°C) FREQUENCYSTABILITY(Overall)FREQUENCY(MHz)CS9L: UHF +3.3Vdc Clock with PECL Comp. Output CSPL: UHF +2.5Vdc Clock with PECL Comp. Output A: 40/60 to 60/40% T: 45/55 to 55/45%R: 0…+50 S: 0…+70 U: -20…+70 V: -40…+85**K: ±20 ppm** I: ±25 ppm**H: ±50 ppmJ: ±100 ppm150.000…700.000EXAMPLE: CS9LASH-155.520Clock Oscillator, 7x5mm Package, +3.3 VDC Supply Voltage, PECL Output, Standard Symmetry, 0…+70°C Operating Temperature Range, ±50 ppm Total Frequency Stability, 155.520 MHz**Above 300MHz extended temp range and ±25ppm stability may not be available, jitter may vary upon spec requirements. Please consult the factory for any custom requirements.Page 3 of 3 ! REFLOW PROFILE:**ROHS COMPLIANT**。

CS9LTSH中文资料

CS9LTSH中文资料

Page 1 of 3CS9L/CSPL SERIES: ULTRA HF CLOCK OSCILLATOR, PECL, +3.3 VDC or +2.5VDCDESCRIPTION: A crystal controlled, high frequency, highly stable oscillator, adhering to Positive EmitterCoupled Logic (PECL) Standards and fundamental crystal or analog multiplication technologies. The output can be Tri-stated to facilitate testing or combined multiple clocks. The device is contained in a sub-miniature, very low profile, leadless ceramic SMD package with 6 gold contact pads. This miniature oscillator is ideal for today's automated assembly environments. APPLICATIONS AND FEATURES:" Infiniband; Fiber Channel; SATA; 10GbE; Network Processors; SOHO Routing; Switches;" Common Frequencies: 150 MHz; 156.25 MHz; 155.52 MHz; 161.1328 MHz; 212.5MHz; 312.5MHz " +3.3 VDC or +2.5VDC PECL" Frequency Range from 150.000 to 700 MHz " Analog multiplication" Miniature Ceramic SMD Package Available on Tape and Reel " Lead Free and ROHS Compliant$ ABSOLUTE MAXIMUM RATINGS:PARAMETERSYMBOLVALUE UNIT Operating temperature range Ta -40…+85 °C Storage temperature range T(stg) -55…+90 °C Supply voltage Vcc +4.6VDC Maximum Input Voltage Vi Vss-0.5…Vcc+0.5 VDC Maximum Output VoltageVo Vss-0.5…Vcc+0.5VDC$ ELECTRICAL PARAMETERS:PARAMETERSYMBOL TEST CONDITIONS *1VALUEUNIT Nominal Frequency fo 150.000 ~ 700.00** MHz Supply Voltage Vcc +3.3 or +2.5 ±5% VDC Supply Current Is 80.0 MAX mA Output Logic TypePECLLoadConnected between each output and Vcc – 2.0 VDC 50Ω Output Voltage Levels Voh Vol min maxVcc-1.025 Vcc-1.620VDC VDC Duty Cycle DC Measured at 50% of Vcc40/60 to 60/40 or 45/55 to 55/45%Rise / Fall Timetr / tfMeasured at 20/80% and 80/20% Vcc Levels 0.7 TYP 1.0 MAX *2 ns Integrated Phase tji RMS, Fj = 12 kHz…20 MHz 5 0.3 TYP** ps Integrated Phase RMS tii offset frequency 50KHz to80MHz 50.5 TYP** psFo<320MHz. 1 TYP **Deterministic period Jitter Dj using wavecrest analyzer 4 Fo>320MHz. 8 TYP **psFo<320MHz. 2.5 TYP ** Random period Jitter Rj usingwavecrest analyzer 4Fo>320MHz. 2.5 TYP**ps Fo<320MHz. 25 TYP** JitterJAcumm. Peak to Peak Jitter Tp-pusing wavecrest analyzer *4 Fo>320MHz. 27 TYP**psPhase Noise £(∆f)typ. @212.5MHz 6∆f=10 Hz ∆f=100 Hz ∆f=1 KHz ∆f=10 KHz∆f =100 KHz∆f>1M Hz -65 -95 -125 -140 -145 -148 dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Fo<320MHz. -50Sub Harmonicsf_sub Load, nom, Supply nomFo>320MHz. -35dBc Overall Frequency Stability ∆f/fc Op. Temp., Aging, Load, Supply and Cal. Variations ±20, ±25, ±50, or ±100 MAX *3 ppm Pin 1 Output EnabledOutput DisabledEn DisHigh Voltage or No Connect Ground 0.7•Vcc MIN 0.3•Vcc MAXVDC VDCPage 2 of 3*1 Test Conditions Unless Stated Otherwise: Nominal Vcc, Nominal Load, +25 ±3°C *2 Frequency Dependent*3 Not All Stabilities Available With All Temperature Ranges—Please Consult Factory For Availability *4 Measured with Wavecrest SIA-3000A 1,000,000 Hits no filtering *5 Calculated from Agilent 5500 phase noise measurements *6 Measured with Agilent 5500$ PART NUMBERING SYSTEM:SERIESSYMMETRYTEMPERATURE RANGE (°C) FREQUENCYSTABILITY(Overall)FREQUENCY(MHz)CS9L: UHF +3.3Vdc Clock with PECL Comp. Output CSPL: UHF +2.5Vdc Clock with PECL Comp. Output A: 40/60 to 60/40% T: 45/55 to 55/45%R: 0…+50 S: 0…+70 U: -20…+70 V: -40…+85**K: ±20 ppm** I: ±25 ppm**H: ±50 ppmJ: ±100 ppm150.000…700.000EXAMPLE: CS9LASH-155.520Clock Oscillator, 7x5mm Package, +3.3 VDC Supply Voltage, PECL Output, Standard Symmetry, 0…+70°C Operating Temperature Range, ±50 ppm Total Frequency Stability, 155.520 MHz**Above 300MHz extended temp range and ±25ppm stability may not be available, jitter may vary upon spec requirements. Please consult the factory for any custom requirements.Page 3 of 3 ! REFLOW PROFILE:**ROHS COMPLIANT**。

0449140201;中文规格书,Datasheet资料

0449140201;中文规格书,Datasheet资料

This document was generated on 08/20/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:44914-0201Status:ActiveOverview:Micro-Fit 3.0™ ConnectorsDescription:3.00mm Pitch Micro-Fit 3.0 CPI™ Header, Compliant Pin Interface, Dual Row, Vertical,2 Circuits, Tin (Sn) Plating, Glow Wire CompatibleDocuments:3D ModelRoHS Certificate of Compliance (PDF)Drawing (PDF)Product Literature (PDF)Product Specification PS-43045 (PDF)Agency CertificationCSA LR19980TUV R72081037ULE29179GeneralProduct Family PCB Headers Series44914ApplicationPower, Wire-to-Board Application Tooling Part Link 622008400Application Tooling Part Link 622030455Comments"High Temperature|Square Pin<P><P>This Molex product is manufactured from material that has the following ratings, tested by independent agencies:.a) A Glow Wire Ignition Temperature (GWIT) of at least 775 deg C per IEC 60695-2-13.. b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 60695-2-12.and hence complies with therequirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire. <P><P> The customers using this product must determine its suitability for use in their particular application through testing or other acceptable means as described in end-product glow-wire flammability test standard IEC 60695-2-11 and any applicable product end-use standard(s). <P> If it is determined during the customer’s evaluation of suitability, that higher performance is required, please contact Molex for possible product options."OverviewMicro-Fit 3.0™ Connectors Product Literature Order No 987650-5984Product Name Micro-Fit 3.0 CPI™UPC756054637630PhysicalBreakawayNo Circuits (Loaded)2Circuits (maximum)2Color - ResinBlack Durability (mating cycles max)30Flammability94V-0Glow-Wire Compliant YesMaterial - MetalHigh Performance Alloy (HPA)Material - Plating MatingTinSeriesimage - Reference onlyEU RoHSChina RoHSELV and RoHS Compliant REACH SVHCContains SVHC: No Low-Halogen Status Low-HalogenNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 44914Series Mates With 430250200Application Tooling | FAQTooling specifications and manuals are found by selecting the products below.Crimp Height Specifications are then contained in the Application Tooling Specification document.GlobalDescription Product #Compliant Pin Insertion Flat Rock Tool0622008400Removal Tool 0622030455Material - Plating Termination TinMaterial - Resin High Temperature ThermoplasticNet Weight0.480/gNumber of Rows2Orientation VerticalPCB Locator YesPCB Retention YesPackaging Type TrayPitch - Mating Interface 3.00mmPlating min - Mating 5.080µmPlating min - Termination 5.080µmPolarized to PCB YesShrouded FullyStackable NoSurface Mount Compatible (SMC)NoTemperature Range - Operating-40°C to +105°CTermination Interface: Style Through Hole - Compliant PinElectricalCurrent - Maximum per Contact5AVoltage - Maximum250VMaterial InfoReference - Drawing NumbersProduct Specification PS-43045, RPS-43045-003, RPS-43045-004Sales Drawing SD-44914-001This document was generated on 08/20/2012PLEASE CHECK FOR LATEST PART INFORMATION分销商库存信息: MOLEX 0449140201。

VJ9522Y102中文资料

VJ9522Y102中文资料

Surface Mount Multilayer Ceramic Chip Capacitorsfor Low Profile ApplicationsVJ X7R VTOPVishay VitramonDocument Number: 45024For technical questions, contact: mlcc.specials@Not for New Designs Product DiscontinuationFEATURES••VTOP product available in 0.022" [0.56 mm] and 0.026" [0.66 mm] maximum thickness.•Surface mount, precious metal technology,wet build processELECTRICAL SPECIFICATIONSNote: Electrical characteristics at + 25 °C unless otherwise specified .Capacitance Range: 470 pF to 0.33 µF Voltage Range: 25 Vdc to 50 VdcTemperature Coefficient of Capacitance (TCC): ± 15 % from - 55 °C to + 125 °CDissipation Factor (DF):25 V ratings: 3.5 % maximum at 1.0 V rms and 1 kHz 50 V ratings: 2.5 % maximum at 1.0 V rms and 1 kHzInsulation Resistance (IR):At + 25 °C and rated voltage 100 000 M Ω minimum or 1000 ΩF, whichever is lessAt + 125 °C and rated voltage 10 000 M Ω minimum or 100 ΩF, whichever is lessDielectric Withstanding Voltage (DWV):This is the maximum voltage the capacitors are tested for a 1 to 5 second period and the charge/discharge current does not exceed 50 mA≤ 50 Vdc: DWV at 250 % of rated voltage Aging Rate: 1 % maximum per decadeORDERING INFORMATIONVJ9626Y102K XAA TCASE CODEDIELECTRIC CAPACIT ANCE NOMINAL CODE CAPACIT ANCE TOLERANCETERMINATION DC VOLTAGE RATING (1)MARKING PACKAGING95229526962296269722972699229926Y = X7RExpressed inpicofarads (pF). The first two digits aresignificant, the thirdis a multiplier. Example:102 = 1000 pFJ = ± 5 % K = ± 10 %M = ± 20 % X = Ni barrier 100 % tin plated X = 25 V A = 50 VA = UnmarkedT = 7" reel/plastic tape C = 7" reel/paper tape R = 11 1/4" reel/plastic tape P = 11 1/4" reel/paper tape元器件交易网 For technical questions, contact: mlcc.specials@Document Number: 45024VJ X7R VTOPNot for New Designs Product DiscontinuationVishay Vitramon Surface Mount Multilayer Ceramic Chip Capacitorsfor Low Profile ApplicationsSELECTION CHARTSTYLE VJ9522VJ9526VJ9622VJ9626VJ9722VJ9726VJ9922VJ9926EIA TYPE 0603080512061210VOLTAGE (Vdc)25502550255025502550255025502550CAP. CODE CAP.471470 pF ••••••••561560 pF ••••••••681680 pF ••••••••821820 pF ••••••••1021000 pF ••••••••••••1221200 pF ••••••••••••1521500 pF ••••••••••••1821800 pF ••••••••••••2222200 pF ••••••••••••2722700 pF ••••••••••••3323300 pF ••••••••••••3923900 pF ••••••••••••4724700 pF ••••••••••••5625600 pF ••••••••••••6826800 pF ••••••••••••8228200 pF ••••••••••••1030.010 µF ••••••••••••••••1230.012 µF •••••••••••••••1530.015 µF ••••••••••••••1830.018 µF ••••••••••••••2030.020 µF ••••••••••••••2230.022 µF ••••••••••••••2730.027 µF •••••••••••••3330.033 µF •••••••••••3930.039 µF ••••••••••4730.047 µF ••••••••••5630.056 µF ••••••••••6830.068 µF •••••••••8230.082 µF ••••••••1040.10 µF •••••••1240.12 µF ••••••1540.15 µF •••••1840.18 µF •••2240.22 µF ••2740.27 µF ••3340.33 µFNot for New DesignsProduct Discontinuation VJ X7R VTOP Surface Mount Multilayer Ceramic Chip Capacitorsfor Low Profile ApplicationsVishay Vitramon Document Number: 45024For technical questions, contact: mlcc.specials@ Disclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。

CS42L52中文资料

CS42L52中文资料

Low Power, Stereo CODEC w/Headphone & Speaker AmpsStereo CODECHigh Performance Stereo ADC & DAC–98dB Dynamic Range (A-wtd) –-88dB THD+N Flexible Stereo Analog Input Architecture–4:1 Analog Input MUX –Analog Input Mixing–Analog Passthru with Volume Control–Analog Programmable Gain Amplifier (PGA) Programmable Automatic Level Control (ALC)–Noise Gate for Noise Suppression–Programmable Threshold & Attack/ReleaseRates Dual MIC Inputs–Differential or Single-Ended–+16dB to +32dB w/1dB step MIC Pre-Amplifiers–Programmable, Low Noise MIC Bias Levels Digital Signal Processing Engine–Bass & Treble Tone Control, De-Emphasis–Master Vol. and Independent PCM SDIN + ADC SDOUT Mix Volume Control–Soft-Ramp & Zero-Cross Transitions –Programmable Peak-Detect and Limiter –Beep Generator w/Full Tone ControlClass D Stereo/Mono Speaker AmplifierNo External Filter RequiredHigh Stereo Output Power at 10% THD+N– 2 x 1.00 W into 8Ω @ 5.0V – 2 x 550mW into 8Ω @ 3.7V – 2 x 230mW into 8Ω @ 2.5V High Mono Output Power at 10% THD+N– 1 x 1.90W into 4Ω @ 5.0V – 1 x 1.00W into 4Ω @ 3.7V – 1 x 350mW into 4Ω @ 2.5V Direct Battery Powered Operation–Battery Level Monitoring & Compensation 82% Efficiency at 800 mWPhase-Aligned PWM Output Reduces IdleChannel CurrentSpread Spectrum Modulation Low Quiescent CurrentStereo Headphone AmplifierGround Centered Outputs–No DC-Blocking Capacitors Required –Integrated Negative Voltage Regulator High Power Output at -75dB THD+N– 2 x 23mW Into 16Ω @ 1.8V – 2 x 44mW Into 16Ω @ 2.5V (Features continued on page 2)CS42L52CS42L52System Features12, 24, and 27MHz Master Clock Support inAddition to Typical Audio Clock Rates High Performance 24-bit Converters–Multi-bit Delta Sigma Architecture–Very Low 64Fs Oversampling Clock Reduces Power ConsumptionLow Power Operation–Stereo Analog Passthru: 10 mW @ 1.8 V –Stereo Playback: 14 mW @ 1.8 V–Stereo Rec. and Playback: 23 mW @ 1.8V Variable Power Supplies– 1.8 V to 2.5 V Digital & Analog – 1.6V to 5V Class D Amplifier– 1.8V to 2.5V Headphone Amplifier – 1.8 V to 3.3V Interface LogicPower Down Management–ADC, DAC, CODEC, MIC Pre-Amplifier, PGA,Headphone Amplifier, Speaker Amplifier Analog & Digital Routing/Mixes:–Line/Headphone Out =Analog In (ADCBypassed)–Line/Headphone/SpeakerOut =ADC +Digital In–Digital Out =ADC +Digital In –Internal Digital Loopback –Mono Mixes Flexible Clocking Options–Master or Slave Operation–High Impedance Digital Output Option (for easyMUXing between CODEC & other data sources)–Quarter-Speed Mode - (i.e. allows 8 kHz Fswhile maintaining a flat noise floor up to 16kHz)– 4 kHz to 96 kHz Sample Rates I²C ® Control Port OperationTemp. Monitor w/Thermal Foldback &ShutdownHeadphone/Speaker Detection Input Pop and Click SuppressionApplicationsDigital Voice Recorders, Digital Cameras &Camcorders PDA’sPersonal Media Players Portable Game ConsolesGeneral DescriptionThe CS42L52 is a highly integrated, low power stereo CODEC with headphone and Class D speaker amplifiers. The CS42L52 offers many features suitable for low power, porta-ble system applications.The ADC input path allows independent channel control of a number of features. Input summing amplifiers mix and select line-level and/or microphone level inputs for each channel.The microphone input path includes a selectable programma-ble-gain pre-amplifier stage and a low noise MIC bias voltage supply. A PGA is available for line or microphone inputs and provides analog gain with soft ramp and zero cross transi-tions. The ADC also features a digital volume control with soft ramp transitions. A programmable ALC and Noise Gate mon-itor the input signals and adjust the volume levels appropriately. To conserve power, the ADC may be bypassed while still allowing full analog volume control.The DAC output path includes a digital signal processing en-gine with various fixed function controls.Tone Control provides bass and treble adjustment of four selectable corner frequen-cies. The Digital Mixer provides independent volume control for both the ADC output and PCM input signal paths, as well as a master volume control. Digital Volume controls may be configured to change on soft ramp transitions while the analog controls can be configured to occur on every zero crossing.The DAC also includes de-emphasis, limiting functions and a BEEP generator delivering tones selectable across a range of two full octaves.The stereo headphone amplifier is powered from a separate positive supply and the integrated charge pump provides a negative supply. This allows a ground-centered analog output with a wide signal swing and eliminates external DC-blocking capacitors.The Class D stereo speaker amplifier does not require an external filter and provides the high efficiency amplification re-quired by power sensitive portable applications. The speaker amplifier may be powered directly from a battery while the in-ternal DC supply monitoring and compensation provides a constant gain level as the battery’s voltage decays. An internal temperature monitor alerts the user and automatically atten-uates and/or shuts down the PWM speaker output when an overload condition causes temperatures to exceed safe oper-ating levels.In addition to its many features, the CS42L52 operates from a low voltage analog and digital core making it ideal for portable systems that require extremely low power consumption in a minimal amount of space.The CS42L52 is available in a 40-pin QFN package in both Commercial (-40 to +85 °C) and Automotive (-40 to +105 °C)grades. The CS42L52 Customer Demonstration board is also available for device evaluation and implementation sugges-tions. Please refer to “Ordering Information” on page 82 for complete ordering information.CS42L52 TABLE OF CONTENTS1. PIN DESCRIPTIONS (8)1.1 I/O Pin Characteristics (9)2. TYPICAL CONNECTION DIAGRAM (10)3. CHARACTERISTIC AND SPECIFICATIONS (11)RECOMMENDED OPERATING CONDITIONS (11)ABSOLUTE MAXIMUM RATINGS (11)ANALOG INPUT CHARACTERISTICS (COMMERCIAL - CNZ) (12)ANALOG INPUT CHARACTERISTICS (AUTOMOTIVE - DNZ) (13)ADC DIGITAL FILTER CHARACTERISTICS (14)ANALOG OUTPUT CHARACTERISTICS (COMMERCIAL - CNZ) (15)ANALOG OUTPUT CHARACTERISTICS (AUTOMOTIVE - DNZ) (16)ANALOG PASSTHRU CHARACTERISTICS (17)PWM OUTPUT CHARACTERISTICS (Note 9) (17)LINE OUTPUT VOLTAGE LEVEL CHARACTERISTICS (18)HEADPHONE OUTPUT POWER CHARACTERISTICS (19)COMBINED DAC INTERPOLATION & ON-CHIP ANALOG FILTER RESPONSE (20)SWITCHING SPECIFICATIONS - SERIAL PORT (21)SWITCHING SPECIFICATIONS - I²C CONTROL PORT (22)DC ELECTRICAL CHARACTERISTICS (23)DIGITAL INTERFACE SPECIFICATIONS & CHARACTERISTICS (23)POWER CONSUMPTION (24)4. APPLICATIONS (25)4.1 Overview (25)4.1.1 Basic Architecture (25)4.1.2 Line & MIC Inputs (25)4.1.3 Line & Headphone Outputs (25)4.1.4 Speaker Driver Outputs (25)4.1.5 Fixed Function DSP Engine (25)4.1.6 Beep Generator (25)4.1.7 Power Management (25)4.2 Analog Inputs (26)4.2.1 MIC Inputs (27)4.2.2 Automatic Level Control (ALC) (27)4.2.3 Noise Gate (28)4.3 Analog Outputs (29)4.3.1 Beep Generator (30)4.3.2 Limiter (31)4.4 Analog In to Analog Out Passthru (32)4.4.1 Overriding the ADC Power Down (32)4.4.2 Overriding the PGA Power Down (33)4.5 PWM Outputs (33)4.5.1 Mono Speaker Output Configuration (33)4.5.2 VP Battery Compensation (33)4.5.2.1 Maintaining a Desired Output Level (34)4.6 Serial Port Clocking (34)4.7 Digital Interface Formats (36)4.7.1 DSP Mode (36)4.8 Initialization (36)4.9 Recommended Power-Up Sequence (37)4.10 Recommended Power-Down Sequence (37)4.11 Control Port Operation (38)4.11.1 I²C Control (38)CS42L524.11.2 Memory Address Pointer (MAP) (39)4.11.2.1 Map Increment (INCR) (39)5. REGISTER QUICK REFERENCE (40)6. REGISTER DESCRIPTION (42)6.1 Chip I.D. and Revision Register (Address 01h) (Read Only) (42)6.1.1 Chip I.D. (Read Only) (42)6.1.2 Chip Revision (Read Only) (42)6.2 Power Control 1 (Address 02h) (42)6.2.1 Power Down ADC Charge Pump (42)6.2.2 Power Down PGAx (42)6.2.3 Power Down ADCx (43)6.2.4 Power Down (43)6.3 Power Control 2 (Address 03h) (43)6.3.1 Power Down ADC Override (43)6.3.2 Power Down MICx (43)6.3.3 Power Down MIC Bias (43)6.4 Power Control 3 (Address 04h) (44)6.4.1 Headphone Power Control (44)6.4.2 Speaker Power Control (44)6.5 Clocking Control (Address 05h) (44)6.5.1 Auto-Detect (44)6.5.2 Speed Mode (45)6.5.3 32kHz Sample Rate Group (45)6.5.4 27 MHz Video Clock (45)6.5.5 Internal MCLK/LRCK Ratio (45)6.5.6 MCLK Divide By 2 (46)6.6 Interface Control 1 (Address 06h) (46)6.6.1 Master/Slave Mode (46)6.6.2 SCLK Polarity (46)6.6.3 ADC Interface Format (46)6.6.4 DSP Mode (46)6.6.5 DAC Interface Format (47)6.6.6 Audio Word Length (47)6.7 Interface Control 2 (Address 07h) (47)6.7.1 SCLK equals MCLK (47)6.7.2 SDOUT to SDIN Digital Loopback (47)6.7.3 Tri-State Serial Port Interface (48)6.7.4 Speaker/Headphone Switch Invert (48)6.7.5 MIC Bias Level (48)6.8 Input x Select: ADCA and PGAA (Address 08h), ADCB and PGAB (Address 09h) (48)6.8.1 ADC Input Select (48)6.8.2 PGA Input Mapping (49)6.9 Analog & HPF Control (Address 0Ah) (49)6.9.1 ADCx High-Pass Filter (49)6.9.2 ADCx High-Pass Filter Freeze (49)6.9.3 Ch. x Analog Soft Ramp (49)6.9.4 Ch. x Analog Zero Cross (49)6.10 ADC HPF Corner Frequency (Address 0Bh) (50)6.10.1 HPF x Corner Frequency (50)6.11 Misc. ADC Control (Address 0Ch) (50)6.11.1 ADC Channel B=A (50)6.11.2 Digital MUX (50)6.11.3 Digital Sum (50)6.11.4 Invert ADC Signal Polarity (50)CS42L526.11.5 ADC Mute (51)6.12 Playback Control 1 (Address 0Dh) (51)6.12.1 Headphone Analog Gain (51)6.12.2 Playback Volume Setting B=A (51)6.12.3 Invert PCM Signal Polarity (51)6.12.4 Master Playback Mute (51)6.13 Miscellaneous Controls (Address 0Eh) (52)6.13.1 Passthru Analog (52)6.13.2 Passthru Mute (52)6.13.3 Freeze Registers (52)6.13.4 HP/Speaker De-Emphasis (52)6.13.5 Digital Soft Ramp (53)6.13.6 Digital Zero Cross (53)6.14 Playback Control 2 (Address 0Fh) (53)6.14.1 Headphone Mute (53)6.14.2 Speaker Mute (53)6.14.3 Speaker Volume Setting B=A (54)6.14.4 Speaker Channel Swap (54)6.14.5 Speaker MONO Control (54)6.14.6 Speaker Mute 50/50 Control (54)6.15 MICx Amp Control:MIC A (Address 10h) & MIC B (Address 11h) (54)6.15.1 MIC x Select (54)6.15.2 MICx Configuration (55)6.15.3 MICx Gain (55)6.16 PGAx Vol. & ALCx Transition Ctl.:ALC, PGA A (Address 12h) & ALC, PGA B (Address 13h) (55)6.16.1 ALCx Soft Ramp Disable (55)6.16.2 ALCx Zero Cross Disable (55)6.16.3 PGAx Volume (56)6.17 Passthru x Volume: PASSAVOL (Address 14h) & PASSBVOL (Address 15h) (56)6.17.1 Passthru x Volume (56)6.18 ADCx Volume Control: ADCAVOL (Address 16h) & ADCBVOL (Address 17h) (57)6.18.1 ADCx Volume (57)6.19 ADCx Mixer Volume: ADCA (Address 18h) & ADCB (Address 19h) (58)6.19.1 ADC Mixer Channel x Mute (58)6.19.2 ADC Mixer Channel x Volume (58)6.20 PCMx Mixer Volume: PCMA (Address 1Ah) & PCMB (Address 1Bh) (58)6.20.1 PCM Mixer Channel x Mute (58)6.20.2 PCM Mixer Channel x Volume (58)6.21 Beep Frequency & On Time (Address 1Ch) (59)6.21.1 Beep Frequency (59)6.21.2 Beep On Time (60)6.22 Beep Volume & Off Time (Address 1Dh) (60)6.22.1 Beep Off Time (60)6.22.2 Beep Volume (61)6.23 Beep & Tone Configuration (Address 1Eh) (61)6.23.1 Beep Configuration (61)6.23.2 Beep Mix Disable (61)6.23.3 Treble Corner Frequency (62)6.23.4 Bass Corner Frequency (62)6.23.5 Tone Control Enable (62)6.24 Tone Control (Address 1Fh) (62)6.24.1 Treble Gain (62)CS42L526.24.2 Bass Gain (63)6.25 Master Volume Control: MSTA (Address 20h) & MSTB (Address 21h) (63)6.25.1 Master Volume Control (63)6.26 Headphone Volume Control: HPA (Address 22h) & HPB (Address 23h) (63)6.26.1 Headphone Volume Control (63)6.27 Speaker Volume Control: SPKA (Address 24h) & SPKB (Address 25h) (64)6.27.1 Speaker Volume Control (64)6.28 ADC & PCM Channel Mixer (Address 26h) (64)6.28.1 PCM Mix Channel Swap (64)6.28.2 ADC Mix Channel Swap (64)6.29 Limiter Control 1, Min/Max Thresholds (Address 27h) (65)6.29.1 Limiter Maximum Threshold (65)6.29.2 Limiter Cushion Threshold (65)6.29.3 Limiter Soft Ramp Disable (65)6.29.4 Limiter Zero Cross Disable (66)6.30 Limiter Control 2, Release Rate (Address 28h) (66)6.30.1 Peak Detect and Limiter (66)6.30.2 Peak Signal Limit All Channels (66)6.30.3 Limiter Release Rate (66)6.31 Limiter Attack Rate (Address 29h) (67)6.31.1 Limiter Attack Rate (67)6.32 ALC Enable & Attack Rate (Address 2Ah) (67)6.32.1 ALCx Enable (67)6.32.2 ALC Attack Rate (67)6.33 ALC Release Rate (Address 2Bh) (68)6.33.1 ALC Release Rate (68)6.34 ALC Threshold (Address 2Ch) (68)6.34.1 ALC Maximum Threshold (68)6.34.2 ALC Minimum Threshold (69)6.35 Noise Gate Control (Address 2Dh) (69)6.35.1 Noise Gate All Channels (69)6.35.2 Noise Gate Enable (69)6.35.3 Noise Gate Threshold and Boost (70)6.35.4 Noise Gate Delay Timing (70)6.36 Status (Address 2Eh) (Read Only) (70)6.36.1 Serial Port Clock Error (Read Only) (70)6.36.2 DSP Engine Overflow (Read Only) (71)6.36.3 PCMx Overflow (Read Only) (71)6.36.4 ADCx Overflow (Read Only) (71)6.37 Battery Compensation (Address 2Fh) (71)6.37.1 Battery Compensation (71)6.37.2 VP Monitor (71)6.37.3 VP Reference (72)6.38 VP Battery Level (Address 30h) (Read Only) (72)6.38.1 VP Voltage Level (Read Only) (72)6.39 Speaker Status (Address 31h) (Read Only) (72)6.39.1 Speaker Current Load Status (Read Only) (72)6.39.2 SPKR/HP Pin Status (Read Only) (73)6.39.3 Thermal Warning Status (Read Only) (73)6.39.4 Thermal Error Status (Read Only) (73)6.40 Temperature Monitor Control (Address 32h) (73)6.40.1 Temperature Acknowledge & Release (73)6.40.2 Thermal Foldback (Address 33h) (73)6.40.3 Thermal Foldback (73)CS42L526.40.4 Speaker Attenuation (74)6.41 Charge Pump Frequency (Address 34h) (74)6.41.1 Charge Pump Frequency (74)7. ANALOG PERFORMANCE PLOTS (75)7.1 Headphone THD+N versus Output Power Plots (75)8. EXAMPLE SYSTEM CLOCK FREQUENCIES (77)8.1 Auto Detect Enabled (77)8.2 Auto Detect Disabled (77)9. PCB LAYOUT CONSIDERATIONS (78)9.1 Power Supply, Grounding (78)9.2 QFN Thermal Pad (78)10. ADC & DAC DIGITAL FILTERS (79)11. PARAMETER DEFINITIONS (80)12. PACKAGE DIMENSIONS (81)THERMAL CHARACTERISTICS (81)13. ORDERING INFORMATION (82)14. REFERENCES (82)15. REVISION HISTORY (82)LIST OF FIGURESFigure 1. Typical Connection Diagram (10)Figure 2. Headphone Output Test Load (19)Figure 3. Serial Audio Interface Timing (21)Figure 4. Control Port Timing - I²C (22)Figure 5. Analog Input Signal Flow (26)Figure 6. Single-Ended MIC Configuration (27)Figure 7. Differential MIC Configuration (27)Figure 8. ALC (28)Figure 9. Noise Gate Attenuation (28)Figure 10. DSP Engine Signal Flow (29)Figure 11. PWM Output Stage (30)Figure 12. Analog Output Stage (30)Figure 13. Beep Configuration Options (31)Figure 14. Peak Detect & Limiter (32)Figure 15. Battery Compensation (34)Figure 16. I²S Format (36)Figure 17. Left-Justified Format (36)Figure 18. Right-Justified Format (DAC only) (36)Figure 19. DSP Mode Format) (36)Figure 20. Control Port Timing, I²C Write (38)Figure 21. Control Port Timing, I²C Read (38)Figure 22. THD+N vs. Output Power per Channel at 1.8V (16 Ω load) (75)Figure 23. THD+N vs. Output Power per Channel at 2.5V (16 Ω load) (75)Figure 24. THD+N vs. Output Power per Channel at 1.8V (32 Ω load) (76)Figure 25. THD+N vs. Output Power per Channel at 2.5V (32 Ω load) (76)Figure 26. ADC Passband Ripple (79)Figure 27. ADC Stopband Rejection (79)Figure 28. ADC Transition Band (79)Figure 29. ADC Transition Band Detail (79)Figure 30. DAC Passband Ripple (79)Figure 31. DAC Stopband (79)Figure 32. DAC Transition Band (79)Figure 33. DAC Transition Band (Detail) (79)CS42L52 1.PIN DESCRIPTIONSPin Name#Pin DescriptionSDA1Serial Control Data (Input/Output) - SDA is a data I/O in I²C Mode.SCL2Serial Control Port Clock (Input) - Serial clock for the serial control port.TSTN 3Test In - This pin is an input used for test purposes only. It must be tied to ground for normal oper-ation.SPKR_OUTA-SPKR_OUTB+ SPKR_OUTB-679PWM Speaker Output (Output) - Full-bridge amplified PWM speaker outputs.VP 58Power for PWM Drivers (Input)-Power supply for the PWM output driver stages.-VHPFILTpump that provides the negative rail for the headphone/line amplifiers.FLYN 11Charge Pump Cap Negative Node (Output)- Negative node for the inverting charge pump’s fly-ing capacitor.FLYPcapacitor.+VHP13Positive Analog Power for Headphone (Input)-Positive voltage rail and power for the internal headphone amplifiers and inverting charge pump.SDOUTMCLKSCLKSDINSDALRCKFLYN+VHPHP/LINE_OUTBHP/LINE_OUTAVQMICBIASAIN4A/MIC1+/MIC2AAIN2ATSTNSPKR_OUTA+VPVPVDSPKR_OUTB--VHPFILTAIN4B/MIC2+/MIC2BAIN1BAIN2BAFILTBAIN3B/MIC2-/MIC1BAFILTAAIN1AAIN3A/MIC1-/MIC1ASPKR_OUTB+SCLDGNDSPKR_OUTA-FLYPVAAGNDFILT+RESETVLSPKR/HPCS42L521.1I/O Pin CharacteristicsInput and output levels and associated power supply voltage are shown in the table below. Logic levels should not exceed the corresponding power supply voltage.FILT+cuits.VQ 19Quiescent Voltage (Output ) - Filter connection for the internal quiescent voltage.MICBIAS 20Microphone Bias (Output ) - Low noise bias supply for an external microphone. Electrical charac-teristics are specified in the DC Electrical Characteristics table.AIN3A,B 23,24Line-Level Analog Inputs (Input ) - Single-ended stereo line-level analog inputs. MIC1+,-MIC2+,-21,2322,24Differential Microphone Inputs (Input ) - Differential stereo microphone inputs. MIC1A,B 23,24Single-Ended Microphone Inputs (Input ) - Single-ended stereo microphone inputs.AIN2A,B AIN1A,B 25,2629,30Line-Level Analog Inputs (Input ) - Single-ended stereo line-level analog inputs.SPKR/HP and/or headphone outputs.RESET 32Reset (Input ) - The device enters a low power mode when this pin is driven low.VL face and host control port.VD 34Digital Power (Input ) - Positive power for the internal digital section. DGND 35Digital Ground (Input ) - Ground reference for the internal digital section.SDOUT 36Serial Audio Data Output (Output ) - Output for two’s complement serial audio data.MCLK 37Master Clock (Input ) - Clock source for the delta-sigma modulators.SCLK 38Serial Clock (Input/Output ) - Serial clock for the serial audio interface.SDIN 39Serial Audio Data Input (Input ) - Input for two’s complement serial audio data.LRCK40Left Right Clock (Input/Output ) - Determines which channel, Left or Right, is currently active on the serial audio data line.GND/Thermal Paddissipation.Power SupplyPin Name I/O DriverReceiverVLRESET Input - 1.65 V - 3.47 V, with Hysteresis SCL Input - 1.65 V - 3.47 V, with Hysteresis SDA Input/Output 1.65 V - 3.47 V, CMOS/Open Drain1.65 V - 3.47 V, with HysteresisMCLK Input - 1.65 V - 3.47 V LRCK Input/Output 1.65 V - 3.47 V, CMOS 1.65 V - 3.47 V SCLK Input/Output 1.65 V - 3.47 V, CMOS 1.65 V - 3.47 VSDOUT Output 1.65 V - 3.47 V V, CMOSSDIN Input - 1.65 V - 3.47 V VA SPKR/HP Input - 1.65 V - 2.63 VVPSPKR_OUTA+Output 1.6V - 5.25V Power MOSFET -SPKR_OUTA-Output1.6V - 5.25V Power MOSFET -SPKR_OUTB+Output 1.6V - 5.25V Power MOSFET -SPKR_OUTB-Output1.6V - 5.25V Power MOSFET-CS42L52 2.TYPICAL CONNECTION DIAGRAMFigure 1. Typical Connection DiagramCS42L523.CHARACTERISTIC AND SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS(AGND=DGND=0 V, all voltages with respect to ground.)ABSOLUTE MAXIMUM RATINGS(AGND = DGND = 0 V; all voltages with respect to ground.)WARNING:Operation at or beyond these limits may result in permanent damage to the device. Normal operationis not guaranteed at these extremes.Notes:1.Any pin except supplies. Transient currents of up to ±100 mA on the analog input pins will not causeSCR latch-up.2.The maximum over/under voltage is limited by the input current.ParametersSymbol Min MaxUnitsDC Power Supply AnalogVA 1.65 2.63V Headphone Amplifier +VHP 1.65 2.63V Speaker Amplifier VP 1.60 5.25V DigitalVD 1.65 2.63V Serial/Control Port Interface VL1.65 3.47V Ambient TemperatureCommercial - CNZ Automotive - DNZT A-40-40+85+105°C °CParametersSymbolMinMaxUnitsDC Power SupplyAnalog Speaker DigitalSerial/Control Port InterfaceVA, VHP VP VD VL -0.3-0.3-0.3-0.3 3.05.53.04.0V V V V Input Current(Note 1)I in-±10mAAnalog Input Voltage(Note 2)V INAGND-0.7VA+0.7VDigital Input Voltage(Note 2)V IND -0.3VL+ 0.4V Ambient Operating Temperature (power applied)T A -50+115°C Storage TemperatureT stg-65+150°CCS42L52ANALOG INPUT CHARACTERISTICS (COMMERCIAL - CNZ)(Test Conditions (unless otherwise specified): Input sine wave (relative to digital full-scale): 1kHz through passive input filter; VL = VD = VHP = 1.8 V; T A = +25°C; Measurement Bandwidth is 10Hz to 20kHz unless otherwise specified. Sample Fre-quency = 48kHz)3.Measured with DAC delivering full-scale output into specified load.4.Measured between analog input and AGND.VA = 2.5V VA = 1.8V Parameters MinTypMaxMinTypMaxUnitAnalog In to ADC (PGA bypassed)Dynamic RangeA-weighted unweighted 93909996--90879693--dB dB Total Harmonic Distortion + Noise-1dBFS -20dBFS -60dBFS ----86-76-36-80--30----84-73-33-78--27dB dB dB Analog In to PGA to ADC Dynamic Range PGA Setting: 0 dB A-weighted unweighted 92899895--89869592--dB dB PGA Setting: +12 dBA-weighted unweighted85829188--82798885--dB dB Total Harmonic Distortion + Noise PGA Setting: 0 dB -1dBFS -60dBFS ---88-35-82-29---86-32-80-26dB dB PGA Setting: +12 dB -1dBFS --85-79--83-77dB Analog In to MIC Pre-Amp (+16 dB) to PGA to ADC Dynamic Range PGA Setting: 0 dB A-weighted unweighted --8683----8380--dB dB Total Harmonic Distortion + Noise PGA Setting: 0 dB -1dBFS --76---74-dB Analog In to MIC Pre-Amp (+32 dB) to PGA to ADC Dynamic Range PGA Setting: 0 dB A-weighted unweighted --7874----7571--dB dB Total Harmonic Distortion + Noise PGA Setting: 0 dB -2dBFS --74---71-dB Other Characteristics DC AccuracyInterchannel Gain Mismatch -0.2--0.2-dB Gain Drift -±100--±100-ppm/°C Offset Error SDOUT Code with HPF On -352--352-LSB InputInterchannel Isolation -90--90-dB HP Amp to Analog Input Isolation R L = 10 k Ω(Note 3)R L = 16 Ω--10070----10070--dB dB Speaker Amp to Analog Input Isolation -60--60-dB Full-scale Input Voltage ADC PGA (0 dB)PGA (+12 dB)MIC (+16 dB)MIC (+32 dB)0.73•VA0.73•VA 0.769•VA 0.770•VA 0.194•VA 0.115•VA 0.019•VA0.83•VA0.83•VA 0.73•VA 0.73•VA0.769•VA 0.770•VA 0.194•VA 0.115•VA 0.019•VA 0.83•VA 0.83•VAVpp Vpp Vpp Vpp Input Impedance (Note 4)ADC PGA MIC ---203950------203950---k Ωk Ωk ΩCS42L52 ANALOG INPUT CHARACTERISTICS (AUTOMOTIVE - DNZ)(Test Conditions (unless otherwise specified): Input sine wave (relative to full-scale): 1 kHz through passive input filter;VL = VD = VHP = 1.8 V; T A = -40 to +85°C; Measurement Bandwidth is 10Hz to 20kHz unless otherwise specified. Sample Frequency = 48kHz)VA = 2.37 - 2.63 V VA = 1.65 - 1.89 VParameters Min Typ Max Min Typ Max Unit Analog In to ADCDynamic Range A-weightedunweighted 91889996--88859693--dBdBTotal Harmonic Distortion + Noise -1dBFS -20dBFS-60dBFS ----86-76-36-78--28----84-73-33-76--25dBdBdBAnalog In to PGA to ADC Dynamic RangePGA Setting: 0 dB A-weightedunweighted 90879895--87849592--dBdBPGA Setting: +12 dB A-weightedunweighted 83809188--80778885--dBdBTotal Harmonic Distortion + NoisePGA Setting: 0 dB -1dBFS -60dBFS ---88-35-80-27---86-32-78-24dBdBPGA Setting: +12 dB -1dBFS--85-77--83-75dB Analog In to MIC Pre-Amp (+16 dB) to PGA to ADCDynamic RangePGA Setting: 0 dB A-weightedunweighted --8683----8380--dBdBTotal Harmonic Distortion + NoisePGA Setting: 0 dB -1dBFS--76---74-dB Analog In to MIC Pre-Amp (+32 dB) to PGA to ADCDynamic RangePGA Setting: 0 dB A-weightedunweighted --7874----7571--dBdBTotal Harmonic Distortion + NoisePGA Setting: 0 dB -2dBFS--74---71-dB Other CharacteristicsDC AccuracyInterchannel Gain Mismatch-0.1--0.1-dB Gain Drift-±100--±100-ppm/°C Offset Error SDOUT Code with HPF On-352--352-LSB InputInterchannel Isolation-90--90-dBHP Amp to Analog Input Isolation R L = 10 kΩ(Note 3)R L = 16 Ω--10070----10070--dBdBSpeaker Amp to Analog Input Isolation-60--60-dBFull-scale Input Voltage ADCPGA (0 dB)PGA (+12 dB)MIC (+16 dB)MIC (+32 dB)0.73•VA0.73•VA0.769•VA0.770•VA0.194•VA0.115•VA0.019•VA0.83•VA0.83•VA0.73•VA0.73•VA0.769•VA0.770•VA0.194•VA0.115•VA0.019•VA0.83•VA0.83•VAVppVppVppVppInput Impedance (Note 4)ADCPGAMIC 184050------184050------kΩkΩkΩCS42L52ADC DIGITAL FILTER CHARACTERISTICS5.Response is clock-dependent and will scale with Fs. Note that the response plots (Figures 26to 29 onpage 79) have been normalized to Fs and can be de-normalized by multiplying the X-axis scale by Fs.HPF parameters are for Fs = 48 kHz.Parameters (Note 5)MinTypMaxUnitPassband (Frequency Response) to -0.1 dB corner0-0.4948Fs Passband Ripple -0.09-0.17dB Stopband0.6--Fs Stopband Attenuation 33--dB Total Group Delay-7.6/Fs -s High-Pass Filter Characteristics (48 kHz Fs)Frequency Response -3.0 dB -0.13 dB-- 3.624.2--Hz Hz Phase Deviation @ 20Hz-10-Deg Passband Ripple --0.17dB Filter Settling Time-105/Fss。

SC16IS752IPW-F资料

SC16IS752IPW-F资料

2. Features
2.1 General features
I I I I I I I I I I I I I Dual full-duplex UART I2C-bus or SPI interface selectable 3.3 V or 2.5 V operation Industrial temperature range: −40 °C to +95 °C 64 bytes FIFO (transmitter and receiver) Fully compatible with industrial standard 16C450 and equivalent Baud rates up to 5 Mbit/s in 16× clock mode Auto hardware flow control using RTS/CTS Auto software flow control with programmable Xon/Xoff characters Single or double Xon/Xoff characters Automatic RS-485 support (automatic slave address detection) Up to eight programmable I/O pins RS-485 driver direction control via RTS signal
SC16IS752_SC16IS762_7
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 07 — 19 May 2008
3 of 59
NXP Semiconductors

SUSSEX-AST-952-1

SUSSEX-AST-952-1

Abstract
CERN{TH/95-15
On leave of absence from Departamento de F sica, Instituto Superior Tecnico, Av. Rovisco Pais, 1096 Lisboa Codex, Portugal; also at Theory Division, CERN; E-mail: Orfeu@vxcern.cern.ch 2 PPARC postdoctoral research fellow. E-mail: j.bellido@
Astrophysical and cosmological constraints on a scale-dependent gravitational coupling
Orfeu Bertolami1
INFN - Sezione Torino, Via Pietro Giuria 1, I-10125 Torino, Italy
CERN-TH/95-15 DFTT 5/95 yy/95 SUSSEX-AST-95/2-1 IEM-FT-101/95 hep-th/9502010 January 1995
PostScript® processed by the SLAC/DESY Libraries on 3 Feb 1995.
1
1 Introduction
The atness of the rotation curves of galaxies and the large structure of the Universe indicate that either the Universe is predominantly made up of dark matter of exotic n

AD9852ASVZ资料

AD9852ASVZ资料

CMOS 300 MSPS Complete DDSAD9852 Rev. EInformation furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, M A 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 ©2002–2007 Analog Devices, Inc. All rights reserved.FEATURES300 MHz internal clock rateFSK, BPSK, PSK, chirp, AM operationDual integrated 12-bit D/A convertersUltrahigh speed comparator, 3 ps rms jitterExcellent dynamic performance80 dB SFDR at 100 MHz (±1 MHz) A OUT4× to 20× programmable reference clock multiplier Dual 48-bit programmable frequency registersDual 14-bit programmable phase offset registers12-bit programmable amplitude modulation and on/off output shaped keying functionSingle-pin FSK and BPSK data interfacesPSK capability via I/O interfaceLinear or nonlinear FM chirp functions with single pin frequency hold function Frequency ramped FSK<25 ps rms total jitter in clock generator mode Automatic bidirectional frequency sweepingSin(x)/x correctionSimplified control interface10 MHz serial 2-wire or 3-wire SPI-compatible100 MHz parallel 8-bit programming3.3 V single supplyMultiple power-down functionsSingle-ended or differential input reference clock Small, 80-lead LQFP or TQFP with exposed pad APPLICATIONSAgile LO frequency synthesisProgrammable clock generatorFM chirp source for radar and scanning systems Test and measurement equipmentCommercial and amateur RF exciterFUNCTIONAL BLOCK DIAGRAMSETPARALLEL SELECTOR SERIALPROGRAMMINGLINESPARALLELLOADRESETS634-1Figure 1.AD9852Rev. E | Page 2 of 52TABLE OF CONTENTSFeatures..............................................................................................1 Applications.......................................................................................1 Functional Block Diagram..............................................................1 Revision History...............................................................................3 General Description.........................................................................4 Overview........................................................................................4 Specifications.....................................................................................5 Absolute Maximum Ratings............................................................8 Thermal Resistance......................................................................8 Explanation of Test Levels...........................................................8 ESD Caution..................................................................................8 Pin Configuration and Function Descriptions.............................9 Typical Performance Characteristics...........................................12 Typical Applications.......................................................................16 Modes of Operation.......................................................................18 Single Tone (Mode 000).............................................................18 Unramped FSK (Mode 001)......................................................19 Ramped FSK (Mode 010)..........................................................19 Chirp (Mode 011).......................................................................22 BPSK (Mode 100).......................................................................26 Using the AD9852..........................................................................27 Internal and External Update Clock........................................27 On/Off Output Shaped Keying (OSK)....................................27 Cosine DAC................................................................................29 Control DAC. (29)Inverse Sinc Function................................................................29 REFCLK Multiplier....................................................................29 High Speed Comparator............................................................30 Power-Down...............................................................................30 Programming the AD9852............................................................31 MASTER RESET........................................................................31 Parallel I/O Operation...............................................................31 Serial Port I/O Operation..........................................................31 General Operation of the Serial Interface...................................34 Instruction Byte..........................................................................34 Serial Interface Port Pin Descriptions.....................................35 MSB/LSB Transfers....................................................................35 Control Register Descriptions..................................................36 Power Dissipation and Thermal Considerations.......................38 Thermal Impedance...................................................................38 Junction Temperature Considerations....................................38 Evaluation of Operating Conditions............................................40 Thermally Enhanced Package Mounting Guidelines............40 Evaluation Board............................................................................41 Evaluation Board Instructions..................................................41 General Operating Instructions...............................................41 Using the Provided Software....................................................43 Support........................................................................................43 Outline Dimensions.......................................................................51 Ordering Guide.. (52)AD9852Rev. E | Page 3 of 52REVISION HISTORY5/07—Rev. D to Rev. EChanged AD9852ASQ to AD9852ASVZ.......................Universal Changed AD9852AST to AD9852ASTZ.........................Universal Change to Features............................................................................1 Changes to Endnote 10 of Table 1...................................................7 Changes to Absolute Maximum Ratings........................................8 Added Thermal Resistance Section................................................8 Change to Ramped FSK (Mode 010) Section..............................19 Change to Internal and External Update Clock Section............27 Change to Thermal Impedance Section.......................................38 Changes to Junction Temperature Considerations Section.......38 Changes to Thermally Enhanced Package MountingGuidelines Section......................................................................40 Deleted Figure 61 to Figure 64......................................................41 Changes to Table 14........................................................................44 Updated Outline Dimensions........................................................51 Changes to Ordering Guide...........................................................52 12/05—Rev. C to Rev. DUpdated Format..................................................................Universal Changes to General Description.....................................................4 Changes to Explanation of Test Levels Section.............................9 Change to Pin Configuration........................................................10 Changes to Figure 65......................................................................47 Changes to Outline Dimensions...................................................52 Changes to Ordering Guide...........................................................52 4/04—Rev. B to Rev. CUpdated Format..................................................................Universal Changes to Figure 1...........................................................................1 Changes to General Description.....................................................3 Changes to Table 1............................................................................4 Changes to Footnote 2......................................................................6 Changes to Figure 2...........................................................................8 Changes to Table 5..........................................................................17 Changes to Equation in Ramped FSK (Mode 010).....................19 Changes to Evaluation Board Instructions..................................39 Changes to General Operating Instructions Section..................39 Changes to Using the Provided Software Section.......................42 Changes to Figure 65......................................................................43 Changes to Figure 66......................................................................44 Changes to Figure 72 and Figure 73.............................................48 Changes to Ordering Guide.. (48)3/02—Rev. A to Rev. BChanges to General Description.....................................................1 Changes to Functional Block Diagram..........................................1 Changes to Specifications................................................................3 Changes to Absolute Maximum Ratings........................................5 Changes to Pin Function Descriptions..........................................6 Changes to Figure 3..........................................................................8 Deleted Two TPCs..........................................................................11 Changes to Figure 18 and Figure 19.............................................11 Changes to BPDK Mode Section..................................................21 Changes to Differential Refclk Enable Section...........................24 Changes to Master Reset Section..................................................24 Changes to Parallel I/O Operation Section.................................24 Changes to General Operation of the SerialInterface Section..............................................................................27 Changes to Figure 50......................................................................27 Changes to Figure 65. (36)AD9852Rev. E | Page 4 of 52GENERAL DESCRIPTIONThe AD9852 digital synthesizer is a highly integrated device that uses advanced DDS technology, coupled with an internal high speed, high performance D/A converter to form a digitally programmable, agile synthesizer function. When referenced to an accurate clock source, the AD9852 generates a highly stable frequency-, phase-, and amplitude-programmable cosine output that can be used as an agile LO in communications, radar, and many other applications. The innovative high speed DDS core of the AD9852 provides 48-bit frequency resolution (1 μHz tuning resolution with 300 MHz SYSCLK). Maintaining 17 bits ensures excellent SFDR.The circuit architecture of the AD9852 allows the generation of output signals at frequencies up to 150 MHz, which can be digitally tuned at a rate of up to 100 million new frequencies per second. The (externally filtered) cosine wave output can be converted to a square wave by the internal comparator for agile clock generator applications. The device provides two 14-bit phase registers and a single pin for BPSK operation.For higher-order PSK operation, the I/O interface can be used for phase changes. The 12-bit cosine DAC, coupled with the innovative DDS architecture, provides excellent wideband and narrow-band output SFDR. When configured with thecomparator, the 12-bit control DAC facilitates static duty cycle control in the high speed clock generator applications. The 12-bit digital multiplier permits programmable amplitude modulation, on/off output shaped keying, and precise amplitude control of the cosine DAC output. Chirp functionality is also included for wide bandwidth frequency sweeping applications. The AD9852 programmable 4× to 20× REFCLK multiplier cir-cuit internally generates the 300 MHz system clock from a lower frequency external reference clock. This saves the user the expense and difficulty of implementing a 300 MHz system clock source. Direct 300 MHz clocking is also accommodated with either single-ended or differential inputs. Single-pin, conventional FSK and the enhanced spectral qualities of ramped FSK are supported. The AD9852 uses advanced 0.35 μ CMOS technology to provide this high level of functionality on a single 3.3 V supply.The AD9852 is pin-for-pin compatible with the AD9854 single-tone synthesizer. The AD9852 is specified to operate over the extended industrial temperature range of −40°C to +85°C.OVERVIEWThe AD9852 digital synthesizer is a highly flexible device that addresses a wide range of applications. The device consists of an NCO with a 48-bit phase accumulator, a programmable reference clock multiplier, an inverse sinc filter, a digital multiplier, two 12-bit/300 MHz DACs, a high speed analog comparator, and an interface logic. This highly integrated device can be configured to serve as a synthesized LO agile clock generator and FSK/BPSK modulator. The theory ofoperation for the functional blocks of the device and a technical description of the signal flow through a DDS device is provided by Analog Devices, Inc., in the tutorial A Technical Tutorial on Digital Signal Synthesis . The tutorial also provides basic applications information for a variety of digital synthesis implementations.AD9852Rev. E | Page 5 of 52SPECIFICATIONSV S = 3.3 V ± 5%, R SET = 3.9 kΩ, external reference clock frequency = 30 MHz with REFCLK multiplier enabled at 10× for AD9852ASVZ, external reference clock frequency = 20 MHz with REFCLK multiplier enabled at 10× for AD9852ASTZ, unless otherwise noted. Table 1.Test AD9852ASVZ AD9852ASTZ Parameter Temp Level M in Typ M ax M in Typ Max UnitREFERENCE CLOCK INPUT CHARACTERISTICS 1Internal System Clock Frequency Range REFCLK Multiplier Enabled Full VI 20 300 20 200 MHz REFCLK Multiplier Disabled Full VI DC 300 DC 200 MHz External Reference Clock Frequency Range REFCLK Multiplier Enabled Full VI 5 75 5 50 MHz REFCLK Multiplier Disabled Full VI DC 300 DC 200 MHz Duty Cycle 25°C IV 45 50 55 45 50 55 % Input Capacitance 25°C IV 3 3 pF Input Impedance 25°C IV 100 100 kΩ Differential Common-Mode Voltage RangeMinimum Signal Amplitude 225°C IV 400 400 mV p-p Common-Mode Range 25°C IV 1.6 1.75 1.9 1.6 1.75 1.9 V V IH (Single-Ended Mode) 25°C IV 2.3 2.3 V V IL (Single-Ended Mode) 25°C IV 1 1 V DAC STATIC OUTPUT CHARACTERISTICS Output Update Speed Full I 300 200 MSPS Resolution 25°C IV 12 12 Bits Cosine and Control DAC Full-Scale Output Current 25°C IV 5 10 20 5 10 20 mAGain Error 25°C I −6 +2.25 −6 +2.25% FS Output Offset 25°C I 2 2 μA Differential Nonlinearity 25°C I 0.3 1.25 0.3 1.25 LSB Integral Nonlinearity 25°C I 0.6 1.66 0.6 1.66 LSB Output Impedance 25°C IV 100 100 kΩ Voltage Compliance Range 25°C I −0.5 +1.0 −0.5 +1.0 V DAC DYNAMIC OUTPUT CHARACTERISTICS DAC Wideband SFDR 1 MHz to 20 MHz A OUT 25°C V 58 58 dBc 20 MHz to 40 MHz A OUT 25°C V 56 56 dBc 40 MHz to 60 MHz A OUT 25°C V 52 52 dBc 60 MHz to 80 MHz A OUT 25°C V 48 48 dBc 80 MHz to 100 MHz A OUT 25°C V 48 48 dBc 100 MHz to 120 MHz A OUT 25°C V 48 dBc DAC Narrow-Band SFDR 10 MHz A OUT (±1 MHz) 25°C V 83 83 dBc 10 MHz A OUT (±250 kHz) 25°C V 83 83 dBc 10 MHz A OUT (±50 kHz) 25°C V 91 91 dBc 41 MHz A OUT (±1 MHz) 25°C V 82 82 dBc 41 MHz A OUT (±250 kHz) 25°C V 84 84 dBc 41 MHz A OUT (±50 kHz) 25°C V 89 89 dBc 119 MHz A OUT (±1 MHz) 25°C V 71 dBc 119 MHz A OUT (±250 kHz) 25°C V 77 dBc 119 MHz A OUT (±50 kHz) 25°C V 83 dBcAD9852Rev. E | Page 6 of 52Test AD9852ASVZ AD9852ASTZ Parameter Temp Level M in Typ M ax M in Typ M ax Unit Residual Phase Noise(A OUT = 5 MHz, External Clock = 30 MHz,REFCLK Multiplier Engaged at 10×) 1 kHz Offset 25°C V 140 140 dBc/Hz 10 kHz Offset 25°C V 138 138 dBc/Hz 100 kHz Offset 25°C V 142 142 dBc/Hz(A OUT = 5 MHz, External Clock = 300 MHz,REFCLK Multiplier Bypassed) 1 kHz Offset 25°C V 142 142 dBc/Hz 0 kHz Offset 25°C V 148 148 dBc/Hz 100 kHz Offset 25°C V 152 152 dBc/HzPIPELINE DELAYS 3, 4, 5DDS Core (Phase Accumulator andPhase-to-Amp Converter) 25°C IV 33 33 SYSCLK cycles Frequency Accumulator 25°C IV 26 26 SYSCLK cycles Inverse Sinc Filter 25°C IV 16 16 SYSCLK cycles Digital Multiplier 25°C IV 9 9 SYSCLK cycles DAC 25°C IV 1 1 SYSCLK cycles I/O Update Clock (Internal Mode) 25°C IV 2 2 SYSCLK cycles I/O Update Clock (External Mode) 25°C IV 3 3 SYSCLK cycles MASTER RESET DURATION 25°C IV 10 10 SYSCLK cycles COMPARATOR INPUT CHARACTERISTICS Input Capacitance 25°C V 3 3 pF Input Resistance 25°C IV 500 500 kΩ Input Current 25°C I ± 1 ± 5 ± 1 ± 5 μA Hysteresis 25°C IV 10 20 10 20 mV p-p COMPARATOR OUTPUT CHARACTERISTICS Logic 1 Voltage, High-Z Load Full VI 3.1 3.1 V Logic 0 Voltage, High-Z Load Full VI 0.16 0.16 VOutput Power, 50 Ω Load, 120 MHz Toggle Rate 25°C I 9 11 9 11 dBmPropagation Delay 25°C IV 3 3 nsOutput Duty Cycle Error 625°C I −10 ± 1 +10 −10 ± 1 +10 % Rise/Fall Time, 5 pF Load 25°C V 2 2 ns Toggle Rate, High-Z Load 25°C IV 300 350 300 350 MHz Toggle Rate, 50 Ω Load 25°C IV 375 400 375 400 MHzOutput Cycle-to-Cycle Jitter 725°C IV 4.0 4.0 ps rms COMPARATOR NARROW-BAND SFDR 8 10 MHz (±1 MHz) 25°C V 84 84 dBc 10 MHz (±250 MHz) 25°C V 84 84 dBc 10 MHz (±50 kHz) 25°C V 92 92 dBc 41 MHz (±1 MHz) 25°C V 76 76 dBc 41 MHz (±250 kHz) 25°C V 82 82 dBc 41 MHz (±50 kHz) 25°C V 89 89 dBc 119 MHz (±1 MHz) 25°C V 73 dBc 119 MHz (±250 kHz) 25°C V 73 dBc 119 MHz (±50 kHz) 25°C V 83 dBc CLOCK GENERATOR OUTPUT JITTER 8 5 MHz A OUT 25°C V 23 23 ps rms 40 MHz A OUT 25°C V 12 12 ps rms 100 MHz A OUT 25°C V 7 7 ps rmsAD98521 The reference clock inputs are configured to accept a 1 V p-p (typical) dc offset square or sine waves centered at one-half the applied V DD or a 3 V TTL-level pulse input.2 An internal 400 mV p-p differential voltage swing equates to 200 mV p-p applied to both REFCLK input pins.3 Pipeline delays of each individual block are fixed; however, if the first eight MSBs of a tuning word are all 0s, the delay appears longer. This is due to insufficient phase accumulation per a system clock period to produce enough LSB amplitude to the D/A converter.4 If a feature such as inverse sinc, which has 16 pipeline delays, can be bypassed, the total delay is reduced by that amount.5 The I/O UD CLK transfers data from the I/O port buffers to the programming registers. This transfer is measured in system clocks.6 A change in duty cycle from 1 MHz to 100 MHz with 1 V p-p sine wave input and 0.5 V threshold.7 Represents the comparator’s inherent cycle-to-cycle jitter contribution. The input signal is a 1 V, 40 MHz square wave, and the measurement device is a Wavecrest DTS-2075.8 Comparator input originates from analog output section via external 7-pole elliptic low-pass filter. Single-ended input, 0.5 V p-p. Comparator output terminated in 50 Ω.9 Avoid overdriving digital inputs. (Refer to equivalent circuits in Figure 3.)10 If all device functions are enabled, it is not recommended to simultaneously operate the device at the maximum ambient temperature of 85°C and at the maximum internal clock frequency. This configuration may result in violating the maximum die junction temperature of 150°C. Refer to the Power Dissipation and Thermal Considerations section for derating and thermal management information.11 All functions engaged.12 All functions except inverse sinc engaged.13 All functions except inverse sinc and digital multipliers engaged.Rev. E | Page 7 of 52AD9852Rev. E | Page 8 of 52ABSOLUTE MAXIMUM RATINGSTable 2.Parameter RatingMaximum Junction Temperature 150°CV S 4 VDigital Inputs −0.7 V to +V SDigital Output Current 5 mAStorage Temperature −65°C to +150°COperating Temperature −40°C to +85°CLead Temperature (Soldering, 10 sec) 300°CMaximum Clock Frequency (ASVZ) 300 MHzMaximum Clock Frequency (ASTZ) 200 MHzStresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operationalsection of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.THERMAL RESISTANCEThe heat sink of the AD9852ASVZ 80-lead TQFP package must be soldered to the PCB. Table 3.Thermal Characteristic TQFP LQFPθJA (0 m/sec airflow)1, 2, 316.2°C/W 38°C/W θJMA (1.0 m/sec airflow)2, 3, 4, 513.7°C/W θJMA (2.5 m/sec airflow)2, 3, 4, 512.8°C/W ΨJT 1, 20.3°C/W θJC 6, 72.0°C/W1 Per JEDEC JESD51-2 (heat sink soldered to PCB). 22S2P JEDEC test board. 3Values of θJA are provided for package comparison and PCB design considerations. 4Per JEDEC JESD51-6 (heat sink soldered to PCB). 5Airflow increases heat dissipation, effectively reducing θJA . Furthermore, the more metal that is directly in contact with the package leads from metal traces through holes, ground, and power planes, the more θJA is reduced. 6Per MIL-Std 883, Method 1012.1. 7Values of θJC are provided for package comparison and PCB design considerations when an external heat sink is required.To determine the junction temperature on the application PCB use the following equation:T J = T case + (ΨJT × PD ) where: T J is the junction temperature expressed in degrees Celsius. T case is the case temperature expressed in degrees Celsius, as measured by the user at the top center of the package.ΨJT = 0.3°C/W . PD is the power dissipation (PD); see the Power Dissipation and Thermal Considerations section for the method to calculate PD. EXPLANATION OF TEST LEVELSTable 4.Test Level DescriptionI 100% production tested. III Sample tested only.IV Parameter is guaranteed by design and characterization testing.V Parameter is a typical value only.VIDevices are 100% production tested at 25°C and guaranteed by design and characterization testing for industrial operating temperature range.ESD CAUTIONAD9852Rev. E | Page 9 of 52PIN CONFIGURATION AND FUNCTION DESCRIPTIONSD6D5D4D1D2D3D7D0DVDD DVDD DGND NC A5A4A3A2/IO RESET A1/SDO A0/SDIO I/O UD CLK DGND AGND NC NC AVDD DACBP DAC R SET AVDD AGND IOUT2IOUT2IOUT1IOUT1AGND AGND AGND AVDD VINN VINP AGNDAVDD W R /S C L KR D /C SD V D DD V D DD V D DD G N DD G N DD G N DF S K /B P S K /H O L DO S KA V D DA V D DA G N DA G N DN CV O U TA V D DA V D DA G N DA G N DD V D DD V D DD G N DD G N DD G N DD G N DD V D DD V D DD G N DM A S T E R R E S E TS /P S E L E C TR E F C L KR E F C L KA G N DA G N DA V D DD I F F C L KE N A B L EN CA G N DP L L F I L T E R00634-002Figure 2. Pin ConfigurationTable 5. Pin Function DescriptionsPin Number Mnemonic Description1 to 8D7 to D0 8-Bit Bidirectional Parallel Programming Data Inputs. Used only in parallel programming mode. 9, 10, 23, 24, 25, 73, 74, 79, 80 DVDD Connections for the Digital Circuitry Supply Voltage. Nominally 3.3 V more positive than AGND and DGND.11, 12, 26, 27, 28, 72, 75 to 78DGND Connections for Digital Circuitry Ground Return. Same potential as AGND.13, 35, 57, 58, 63 NCNo Internal Connection.14 to 16A5 to A3Parallel Address Inputs for Program Registers (Part of 6-Bit Parallel Address Inputs for Program Register, A5:A0). Used only in parallel programming mode.17 A2/IO RESET Parallel Address Input for Program Registers (Part of 6-Bit Parallel Address Inputs for ProgramRegister, A5:A0)/IO Reset. A2 is used only in parallel programming mode. IO RESET is used when the serial programming mode is selected, allowing an IO RESET of the serial communication bus that is unresponsive due to improper programming protocol. Resetting the serial bus in this manner does not affect previous programming, nor does it invoke the default programming values seen in Table 9. Active high.18 A1/SDO Parallel Address Input for Program Registers (Part of 6-Bit Parallel Address Inputs for ProgramRegister, A5:A0)/Unidirectional Serial Data Output. A1 is used only in parallel programming mode. SDO is used in 3-wire serial communication mode when the serial programming mode is selected.AD9852Rev. E | Page 10 of 52OUT OUTBMUST TERMINATE OUTPUTS FOR CURRENT FLOW. DO NOT EXCEED THE OUTPUTVOLTAGE COMPLIANCE RATING.DIGITAL INPUTS. FORWARD BIASING ESD DIODES MAY COUPLE DIGITAL NOISE ONTO POWER PINS.A. DAC OutputsB. Comparator OutputC. Comparator InputD. Digital Inputs00634-003Figure 3. Equivalent Input and Output CircuitsTYPICAL PERFORMANCE CHARACTERISTICSFigure 4 to Figure 9 indicate the wideband harmonic distortion performance of the AD9852 from 19.1 MHz to 119.1 MHz fundamental output, reference clock = 30 MHz, REFCLK multiplier = 10×. Each graph is plotted from 0 MHz to 150 MHz (Nyquist).START 0Hz15MHz/STOP 150MHz006Figure 4. Wideband SFDR, 19.1 MHz START 0Hz15MHz/STOP 150MHz006 Figure 5. Wideband SFDR, 39.1 MHzSTART 0Hz15MHz/STOP 150MHz006Figure 6. Wideband SFDR, 59.1 MHz0START 0Hz –10–20–30–40–50–60–70–80–90–10015MHz/STOP 150MHz00634-007Figure 7. Wideband SFDR, 79.1 MHz0START 0Hz–10–20–30–40–50–60–70–80–90–10015MHz/STOP 150MHz00634-008Figure 8. Wideband SFDR, 99.1 MHz0START 0Hz –10–20–30–40–50–60–70–80–90–10015MHz/STOP 150MHz00634-009Figure 9. Wideband SFDR, 119.1 MHzFigure 10 to Figure 15 show the trade-off in elevated noise floor, increased phase noise (PN), and discrete spurious energy when theinternal REFCLK multiplier circuit is engaged. Plots with wide (1 MHz) and narrow (50 kHz) spans are shown. Compare the noise floor of Figure 11 and Figure 12 with that of Figure 14 and Figure 15. The improvement seen in Figure 11 and Figure 12 is a direct result of sampling the fundamental at a higher rate. Sampling at a higher rate spreads the quantization noise of the DAC over a wider bandwidth, which effectively lowers the noise floor.CENTER 39.1MHz100kHz/SPAN 1MHz006Figure 10. Narrow-Band SFDR, 39.1 MHz, 1 MHz BW,300 MHz REFCLK with REFCLK Multiplier BypassedCENTER 39.1MHz5kHz/SPAN 50kHz006Figure 11. Narrow-Band SFDR, 39.1 MHz, 50 kHz BW,300 MHz REFCLK with REFCLK Multiplier BypassedCENTER 39.1MHz5kHz/SPAN 50kHz006Figure 12. Narrow-Band SFDR, 39.1 MHz, 50 kHz BW,100 MHz REFCLK with REFCLK Multiplier Bypassed0CENTER 39.1MHz –10–20–30–40–50–60–70–80–90–100100kHz/SPAN 1MHz00634-013Figure 13. Narrow-Band SFDR, 39.1 MHz, 1 MHz BW,30 MHz REFCLK with REFCLK Multiplier = 10×0CENTER 39.1MHz–10–20–30–40–50–60–70–80–90–1005kHz/SPAN 50kHz00634-014Figure 14. Narrow-Band SFDR, 39.1 MHz, 50 kHz BW,30 MHz REFCLK with REFCLK Multiplier = 10×0CENTER 39.1MHz–10–20–30–40–50–60–70–80–90–1005kHz/SPAN 50kHz00634-015Figure 15. Narrow-Band SFDR, 39.1 MHz, 50 kHz BW, 10 MHz REFCLK with REFCLK Multiplier = 10×。

TLV2464AQPW资料

TLV2464AQPW资料

† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR). ‡ Chip forms are tested at TA = 25°C only. TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25°C 2000 µV −40°C to 125°C 1500 µV 2000 µV −55°C to 125°C 1500 µV SMALL OUTLINE† (D) TLV2460QD TLV2461QD TLV2460AQD TLV2461AQD — — — — SMALL OUTLINE† (PW) TLV2460QPW TLV2461QPW TLV2460AQPW TLV2461AQPW — — — — CERAMIC DIP (JG) — — — — TLV2460MJG TLV2461MJG TLV2460AMJG TLV2461AMJG CE2460MU TLV2461MU TLV2460AMU TLV2461AMU CHIP CARRIER (FK) — — — — TLV2460MFK TLV2461MFK TLV2460AMFK TLV2461AMFK

1
元器件交易网
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA FAMILY OF LOWĆPOWER RAILĆTOĆRAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

X9521资料

X9521资料

X9521Fiber Channel / Gigabit Ethernet Laser Diode Control for Fiber Optic ModulesBLOCK DIAGRAMSDA SCLR H1R W1R L1R H2R W2R L2WP©2000 Xicor Inc., Patents Pending Hot PluggableDual DCP , EEPROM MemoryDESCRIPTIONThe X9521 combines two Digitally Controlled Potentiome-ters (D CP’s), and integrated EEPROM with Block Lock TM protection. All functions of the X9521 are accessed by an industry standard 2-Wire serial interface.The DCP’s of the X9521 may be utilized to control the bias and modulation currents of the laser diode in a Fiber Optic module. The 2 kbit integrated EEPROM may be used to store module definition data.The features of the X9521 are ideally suited to simplifying the design of fiber optic modules which comply to the Giga-bit Interface Converter (GBIC) specification. The integration of these functions into one package significantly reduces board area, cost and increases reliability of laser diode modules.FEATURES•T wo Digitally Controlled Potentiometers (DCP’s) —100 T ap - 10k Ω —256 T ap - 100k Ω —Non-Volatile—Write Protect Function• 2 kbit EEPROM Memory with Write Protect & Block Lock TM•2-Wire industry standard Serial Interface—Complies to the Gigabit Interface Converter (GBIC) specification•Single Supply Operation —2.7V to 5.5V •Hot Pluggable •Packages—CSP (Chip Scale Package)—20 Pin TSSOPPreliminary Information元器件交易网X9521 – Preliminary InformationPIN ASSIGNMENTPin CSP Name Function1B3R H2Connection to end of resistor array for (the 256 T ap) DCP 2.2A3R w2Connection to terminal equivalent to the “Wiper” of a mechanical potentiometer for DCP 2.3A4R L2Connection to other end of resistor array for (the 256 T ap) DCP2.7C4WP Write Protect Control Pin. WP pin is a TTL level compatible input. When held HIGH, Write Protection is enabled. In the enabled state, this pin prevents all nonvolatile “write” opera-tions. Also, when the Write Protection is enabled, and the device Block Lock feature is active (i.e. the Block Lock bits are NOT [0,0]), then no “write” (volatile or nonvolatile) operations can be performed in the device (including the wiper position of any of the integrated Digitally Controlled Potentiometers (DCPs). The WP pin uses an internal “pull-down” resistor, thus if left floating the write protection feature is disabled.8D4SCL Serial Clock. This is a TTL level compatible input pin used to control the serial bus timing fordata input and output.9E4SDA Serial Data. SDA is a bidirectional TTL level compatible pin used to transfer data into and out of the device. The SDA pin input buffer is always active (not gated). This pin requires an external pull up resistor.10E1Vss Ground.11E3R L1Connection to other end of resistor for (the 100 T ap) DCP 1.12E2R w1Connection to terminal equivalent to the “Wiper” of a mechanical potentiometer for DCP 1 13D1R H1Connection to end of resistor array for (the 100 T ap) DCP 1.20A2Vcc Supply Voltage.4, 5, 6, 14, 15, 16, 17, 18, 19A1, B1,B2, B4,C1, C2,C3, D2,D3NC No Connect元器件交易网元器件交易网X9521 – Preliminary InformationX9521 – Preliminary Informationnate further data transmissions if an ACKNOWLEDGE is not detected. The master must then issue a STOP condi-tion to place the device into a known state. DEVICE INTERNAL ADDRESSING Addressing Protocol OverviewThe user addressable internal components of the X9521can be split up into three main parts:—T wo Digitally Controlled Potentiometers (DCPs)—EEPROM array—Control and Status (CONST A T) RegisterDepending upon the operation to be performed on each of these individual parts, a 1, 2 or 3 Byte protocol is used.All operations however must begin with the Slave Address Byte being issued on the SD A pin. The Slave address selects the part of the X9521 to be addressed, and speci-fies if a Read or Write operation is to be performed.It should be noted that in order to perform a write opera-tion to either a D CP or the EEPROM array , the Write Enable Latch (WEL) bit must first be set (See “BL1, BL0:Block Lock protection bits - (Nonvolatile)” on page 12.) Slave Address ByteFollowing a ST ART condition, the master must output a Slave Address Byte (Refer to Figure 4.). This byte con-sists of three parts:—The Device T ype Identifier which consists of the most significant four bits of the Slave Address (SA7 - SA4).The Device T ype Identifier must always be set to 1010in order to select the X9521.—The next three bits (SA3 - SA1) are the Internal Device Address bits. Setting these bits to 000 internally selects the EEPROM array , while setting these bits to 111selects the D CP structures in the X9521. The CON-ST A T Register may be selected using the Internal Device Address 010.—The Least Significant Bit of the Slave Address (SA0)Byte is the R/W bit. This bit defines the operation to be performed on the device being addressed (as defined in the bits SA3 - SA1). When the R/W bit is “1”, then a READ operation is selected. A “0” selects a WRITE operation (Refer to Figure 4.)SA6SA7SA5SA3SA2SA1SA0DEVICE TYPE IDENTIFIERREAD / SA4 Internal Address(SA3 - SA1)Internally AddressedDevice 000EEPROM Array 010CONST A T Register111DCPBit SA0Operation 0WRITE 1READR/WFigure 4.Slave Address Format101WRITEADDRESSINTERNAL DEVICE 元器件交易网X9521 – Preliminary InformationNonvolatile Write Acknowledge PollingAfter a nonvolatile write command sequence (for either the EEPROM array , the Non Volatile Memory of a DCP (NVM), or the CONST A T Register) has been correctly issued (including the final STOP condition), the X9521 ini-tiates an internal high voltage write cycle. This cycle typi-cally requires 5 ms. During this time, no further Read or Write commands can be issued to the device. Write Acknowledge Polling is used to determine when this high voltage write cycle has been completed.T o perform acknowledge polling, the master issues a ST ART condition followed by a Slave Address Byte. The Slave Address issued must contain a valid Internal Device Address. The LSB of the Slave Address (R/W) can be set to either 1 or 0 in this case. If the device is still busy with the high voltage cycle then no ACKNOWLEDGE will be returned. If the device has completed the write operation,an ACKNOWLED GE will be returned and the host can then proceed with a read or write operation. (Refer to Fig-ure 5.).DIGITALLY CONTROLLED POTENTIOMETERSDCP FunctionalityThe X9521 includes two independent resistor arrays.These arrays respectively contain 99 and 255 discrete resistive segments that are connected in series. The physical ends of each array are equivalent to the fixed terminals of a mechanical potentiometer (R Hx and R Lx inputs - where x = 1,2).At both ends of each array and between each resistor segment there is a CMOS switch connected to the wiper (R w x) output. Within each individual array , only one switch may be turned on at any one time. These switches are controlled by the Wiper Counter Register (WCR) (See Figure 6). The WCR is a volatile register.On power up of the X9521, wiper position data is auto-matically loaded into the WCR from its associated Non Volatile Memory (NVM) Register. The T able below shows the Initial Values of the DCP WCR’s before the contents of the NVM is loaded into the WCR.The data in the WCR is then decoded to select and enable one of the respective FET switches. A “makeDCP Initial Values Before RecallR 1 / 100 T AP V L / T AP = 0R 2 / 256 T APV H / T AP = 255元器件交易网X9521 – Preliminary Informationbefore break” sequence is used internally for the FET switches when the wiper is moved from one tap position to another.Hot PluggabilityFigure 7 shows a typical waveform that the X9521 might experience in a Hot Pluggable situation. On power up, Vcc applied to the X9521 may exhibit some amount of ringing, before it settles to the required value.The device is designed such that the wiper terminal (R Wx) is recalled to the correct position (as per the last stored in the DCP NVM), when the voltage applied to Vcc exceeds V TRIP for a time exceeding t pu.Therefore, if t trans is defined as the time taken for Vcc to settle above V TRIP(Figure 7): then the desired wiper ter-minal position is recalled by (a maximum) time: t trans+ t pu. It should be noted that t trans is determined by systemhot plug conditions.DCP OperationsIn total there are three operations that can be performed on any internal DCP structure:—DCP Nonvolatile Write—DCP Volatile Write—DCP ReadA nonvolatile write to a D CP will change the “wiper position” by simultaneously writing new data to the associated WCR and NVM. Therefore, the new “wiper position” setting is recalled into the WCR after Vcc of the X9521 is powered down and then powered back up.A volatile write operation to a DCP however, changes the “wiper position” by writing new data to the associated WCR only. The contents of the associated NVM register remains unchanged. Therefore, when Vcc to the device is powered down then back up, the “wiper position” reverts to that last position written to the DCP using a nonvolatile write operation.Both volatile and nonvolatile write operations are executed using a three byte command sequence: (DCP) Slave Address Byte, Instruction Byte, followed by a Data Byte (See Figure 9)A DCP Read operation allows the user to “read out” the current “wiper position” of the D CP, as stored in the associated WCR. This operation is executed using the Random Address Read command sequence, consisting of the (D CP) Slave Address Byte followed by an Instruction Byte and the Slave Address Byte again (Refer to Figure 10.).Instruction ByteWhile the Slave Address Byte is used to select the DCP devices, an Instruction Byte is used to determine which DCP is being addressed.The Instruction Byte (Figure 8) is valid only when the D evice T ype Identifier and the Internal D evice Address bits of the Slave Address are set to 1010111. In this case, the two Least Significant Bit’s (I1 - I0) of the Instruction Byte are used to select the particular DCP (0 - 2). In the case of a Write to any of the DCPs (i.e. the LSB of the Slave Address is 0), the Most Significant Bit of the Instruction Byte (I7), determines the Write T ype (WT) per-formed.If WT is “1”, then a Nonvolatile Write to the DCP occurs. In this case, the “wiper position” of the DCP is changed by simultaneously writing new data to the associated WCR元器件交易网and NVM. Therefore, the new “wiper position” setting is recalled into the WCR after Vcc of the X9521 has been powered down then powered back upIf WT is “0” then a DCP Volatile Write is performed. This operation changes the D CP “wiper position” by writing new data to the associated WCR only. The contents of the associated NVM register remains unchanged. Therefore, when Vcc to the device is powered down then back up, the “wiper position” reverts to that last written to the DCP using a nonvolatile write operation.DCP Write OperationA write to DCPx (x=1,2) can be performed using the three byte command sequence shown in Figure 9.In order to perform a write operation on a particular DCP, the Write Enable Latch (WEL) bit of the CONST A T Regis-ter must first be set (See “BL1, BL0: Block Lock protection bits - (Nonvolatile)” on page 12.)The Slave Address Byte 10101110 specifies that a Write to a D CP is to be conducted. An ACKNOWLED GE is returned by the X9521 after the Slave Address, if it has been received correctly.Next, an Instruction Byte is issued on SDA. Bits P1 and P0 of the Instruction Byte determine which WCR is to be written, while the WT bit determines if the Write is to be volatile or nonvolatile. If the Instruction Byte format is valid, another ACKNOWLED GE is then returned by the X9521.Following the Instruction Byte, a Data Byte is issued to the X9521 over SDA. The Data Byte contents is latched into the WCR of the DCP on the first rising edge of the clock signal, after the LSB of the D ata Byte (D0) has been issued on SDA (See Figure 25).The D ata Byte determines the “wiper position” (which FET switch of the DCP resistive array is switched ON) of the DCP. The maximum value for the Data Byte depends upon which DCP is being addressed (see T able below). Using a Data Byte larger than the values specified above results in the “wiper terminal” being set to the highest tap position. The “wiper position” does NOT roll-over to the lowest tap position.For DCP2 (256 T ap), the Data Byte maps one to one to the “wiper position” of the D CP “wiper terminal”. There-fore, the Data Byte 00001111 (1510) corresponds to set-ting the “wiper terminal” to tap position 15. Similarly, the D ata Byte 00011100 (2810) corresponds to setting theS T A R T 10101110ACKWT00000P1P0ACKSTOPACKD7D6D5D4D3D2D1D0 SLAVE ADDRESS BYTE INSTRUCTION BYTE DATA BYTEFigure 9.DCP Write Command SequenceP1- P0DCPx# Taps Max. Data Byte00Reserved01x=1100Refer to Appendix 110x=2256FFh11Reserved“wiper terminal” to tap position 28. The mapping of the Data Byte to “wiper position” data for DCP1 (100 T ap), is shown in “APPENDIX 1” . An example of a simple C lan-guage function which “translates” between the tap posi-tion (decimal) and the D ata Byte (binary) for D CP1, is given in “APPENDIX 2” .It should be noted that all writes to any DCP of the X9521are random in nature. Therefore, the Data Byte of consec-utive write operations to any DCP can differ by an arbi-trary number of bits. Also, setting the bits (P1=0, P0=0) or (P1=1, P0=1) are reserved sequences, and will result in no ACKNOWLEDGE after sending an Instruction Byte on SDA.The factory default setting of all “wiper position” settings is with 00h stored in the NVM of the D CPs. This corre-sponds to having the “wiper teminal” R WX (x=1,2) at the “lowest” tap position, Therefore, the resistance between R WX and R LX is a minimum (essentially only the Wiper Resistance, R W ).DCP Read OperationA read of DCPx (x=1,2) can be performed using the three byte random read command sequence shown in Figure 10.The master issues the ST ART condition and the Slave Address Byte 10101110 which specifies that a “dummy”write” is to be conducted. This “dummy” write operation sets which D CP is to be read (in the preceding Read operation). An ACKNOWLED GE is returned by the X9521 after the Slave Address if received correctly . Next,an Instruction Byte is issued on SDA. Bits P1-P0 of the Instruction Byte determine which DCP “wiper position” is to be read. In this case, the state of the WT bit is “don’t care”. If the Instruction Byte format is valid, then another ACKNOWLEDGE is returned by the X9521.Following this ACKNOWLEDGE, the master immediately issues another ST ART condition and a valid Slave address byte with the R/W bit set to 1. Then the X9521issues an ACKNOWLEDGE followed by Data Byte, andS t a r tS t o pSlave Address Address Byte Data ByteA C K A C K A C KSDA Bus Signals from the SlaveSignals from the MasterFigure 11.EEPROM Byte Write SequenceInternal Device Address10100000WRITE Operationfinally , the master issues a STOP condition. The D ata Byte read in this operation, corresponds to the “wiper position” (value of the WCR) of the DCP pointed to by bits P1 and P0.It should be noted that when reading out the data byte for D CP1 (100 T ap), the upper most significant bit is an “unknown”. For D CP2 (256 T ap) however, all bits of the data byte are relevant (See Figure 10).2 kbit EEPROM ARRAYOperations on the 2 kbit EEPROM Array , consist of either 1, 2 or 3 byte command sequences. All operations on the EEPROM must begin with the D evice T ype Identifier of the Slave Address set to 1010000. A Read or Write to the EEPROM is selected by setting the LSB of the Slave Address to the appropriate value R/W (Read = “1”,Write=”0”).In some cases when performing a Read or Write to the EEPROM, an Address Byte may also need to be speci-fied. This Address Byte can contain the values 00h to FFh.EEPROM Byte WriteIn order to perform an EEPROM Byte Write operation to the EEPROM array , the Write Enable Latch (WEL) bit of the CONST A T Register must first be set (See “BL1, BL0: Block Lock protection bits - (Nonvolatile)” on page 12.)For a write operation, the X9521 requires the Slave Address Byte and an Address Byte. This gives the master access to any one of the words in the array . After receipt of the Address Byte, the X9521 responds with an ACKNOWLEDGE, and awaits the next eight bits of data.After receiving the 8 bits of the D ata Byte, it againresponds with an ACKNOWLED GE. The master then terminates the transfer by generating a STOP condition,at which time the X9521 begins the internal write cycle to the nonvolatile memory (See Figure 11). D uring this internal write cycle, the X9521 inputs are disabled, so it does not respond to any requests from the master. The SDA output is at high impedance. A write to a region of EEPROM memory which has been protected with the Block-Lock feature (See “BL1, BL0: Block Lock protection bits - (Nonvolatile)” on page 12.), suppresses the ACKNOWLEDGE bit after the Address Byte.EEPROM Page WriteIn order to perform an EEPROM Page Write operation to the EEPROM array , the Write Enable Latch (WEL) bit of the CONST A T Register must first be set (See “BL1, BL0: Block Lock protection bits - (Nonvolatile)” on page 12.)The X9521 is capable of a page write operation. It is initi-ated in the same manner as the byte write operation; but instead of terminating the write cycle after the first data byte is transferred, the master can transmit an unlimited number of 8-bit bytes. After the receipt of each byte, the X9521 responds with an ACKNOWLED GE, and the address is internally incremented by one. The page address remains constant. When the counter reaches the end of the page, it “rolls over” and goes back to ‘0’ on the same page.For example, if the master writes 12 bytes to the page starting at location 11 (decimal), the first 5 bytes are writ-ten to locations 11 through 15, while the last 7 bytes are written to locations 0 through 6. Afterwards, the address counter would point to location 7. If the master supplies more than 16 bytes of data, then new data overwrites the previous data, one byte at a time (See Figure 13).S t a r tS t o pSlave AddressAddress ByteData (n)A C KA C KA C KSDA Bus Signals from the SlaveSignals from the MasterData (1)A C K(2 < n < 16)Figure 12.EEPROM Page Write Operation10100000The master terminates the Data Byte loading by issuing a STOP condition, which causes the X9521 to begin the nonvolatile write cycle. As with the byte write operation, all inputs are disabled until completion of the internal write cycle. See Figure 12 for the address, ACKNOWLEDGE,and data transfer sequence.Stops and EEPROM Write ModesStop conditions that terminate write operations must be sent by the master after sending at least 1 full data byte and receiving the subsequent ACKNOWLEDGE signal. If the master issues a STOP within a Data Byte, or before the X9521 issues a corresponding ACKNOWLEDGE, the X9521 cancels the write operation. Therefore, the con-tents of the EEPROM array does not change.EEPROM Array Read OperationsRead operations are initiated in the same manner as write operations with the exception that the R/W bit of the Slave Address Byte is set to one. There are three basic read operations: Current EEPROM Address Read, Random EEPROM Read, and Sequential EEPROM Read.Current EEPROM Address ReadInternally the device contains an address counter that maintains the address of the last word read incremented by one. Therefore, if the last read was to address n, the next read operation would access data from address n+1.On power up, the address of the address counter is unde-fined, requiring a read or write operation for initialization. Upon receipt of the Slave Address Byte with the R/W bit set to one, the device issues an ACKNOWLED GE and then transmits the eight bits of the Data Byte. The master terminates the read operation when it does not respond with an ACKNOWLEDGE during the ninth clock and then issues a STOP condition (See Figure 14 for the address,ACKNOWLEDGE, and data transfer sequence).It should be noted that the ninth clock cycle of the read operation is not a “don’t care.” T o terminate a read opera-tion, the master must either issue a STOP condition dur-ing the ninth cycle or hold SDA HIGH during the ninth clock cycle and then issue a STOP condition.Another important point to note regarding the “Current EEPROM Address Read” , is that this operation is not available if the last executed operation was an access to a DCP or the CONST A T Register (i.e.: an operation usingS t a r tS t o pSlave Address DataA C KSDA Bus Signals from the SlaveSignals from the Master1Figure 14.Current EEPROM Address Read Sequence101 00 0 0the Device T ype Identifier 1010111 or 1010010). Immedi-ately after an operation to a DCP or CONST A T Register is performed, only a “Random EEPROM Read” is available.Immediately following a “Random EEPROM Read” , a “Current EEPROM Address Read” or “Sequential EEPROM Read” is once again available (assuming that no access to a DCP or CONST A T Register occur in the interim).Random EEPROM ReadRandom read operation allows the master to access any memory location in the array . Prior to issuing the Slave Address Byte with the R/W bit set to one, the master must first perform a “dummy” write operation. The master issues the ST ART condition and the Slave Address Byte,receives an ACKNOWLED GE, then issues an Address Byte. This “dummy” Write operation sets the address pointer to the address from which to begin the random EEPROM read operation.After the X9521 acknowledges the receipt of the Address Byte, the master immediately issues another ST ART con-dition and the Slave Address Byte with the R/W bit set to one. This is followed by an ACKNOWLED GE from the X9521 and then by the eight bit word. The master termi-nates the read operation by not responding with an ACKNOWLEDGE and instead issuing a STOP condition (Refer to Figure 15.).A similar operation called “Set Current Address” also exists. This operation is performed if a STOP is issued instead of the second ST ART shown in Figure 15. In this case, the device sets the address pointer to that of the Address Byte, and then goes into standby mode after the STOP bit. All bus activity will be ignored until another ST ART is detected.Sequential EEPROM ReadSequential reads can be initiated as either a current address read or random address read. The first Data Byte is transmitted as with the other modes; however, the mas-0Slave AddressAddress ByteA C KA C K S tar tS t o pSlave Address DataA C K1S t a r tSDA Bus Signals from the SlaveSignals from the Master Figure 15.Random EEPROM Address Read Sequence0 1 0 0 0 01 1 0 1 0 0 0 0READ OperationWRITE Operation“Dummy” WriteData (2)S t o pSlave Address Data (n)A C KA C K SDA Bus Signals from the SlaveSignals from the Master 1Data (n-1)A C KA C K (n is any integer greater than 1)Data (1)Figure 16.Sequential EEPROM Read Sequence0 0 0ter now responds with an ACKNOWLEDGE, indicating it requires additional data. The X9521 continues to output a Data Byte for each ACKNOWLEDGE received. The mas-ter terminates the read operation by not responding with an ACKNOWLEDGE and instead issuing a STOP condi-tion.The data output is sequential, with the data from address n followed by the data from address n + 1. The address counter for read operations increments through the entire memory contents to be serially read during one operation.At the end of the address space the counter “rolls over” to address 00h and the device continues to output data for each ACKNOWLEDGE received (Refer to Figure 16.).CONTROL AND STATUS REGISTERThe Control and Status (CONST A T) Register provides the user with a mechanism for changing and reading the sta-tus of various parameters of the X9521 (See Figure 17). The CONST A T register is a combination of both volatile and nonvolatile bits. The nonvolatile bits of the CONST A T register retain their stored values even when Vcc is pow-ered down, then powered back up. The volatile bits how-ever, will always power up to a known logic state “0”(irrespective of their value at power down).A detailed description of the function of each of the CON-ST A T register bits follows:WEL: Write Enable Latch (Volatile)The WEL bit controls the Write Enable status of the entire X9521 device. This bit must first be enabled before ANY write operation (to DCPs, EEPROM memory array , or the CONST A T register). If the WEL bit is not first enabled,then ANY proceeding (volatile or nonvolatile) write opera-tion to DCPs, EEPROM array , as well as the CONST A T register, is aborted and no ACKNOWLED GE is issued after a Data Byte.The WEL bit is a volatile latch that powers up in the dis-abled, LOW (0) state. The WEL bit is enabled / set by writ-ing 00000010 to the CONST A T register. Once enabled,the WEL bit remains set to “1” until either it is reset to “0”(by writing 00000000 to the CONST A T register) or until the X9521 powers down, and then up again.Writes to the WEL bit do not cause an internal high volt-age write cycle. Therefore, the device is ready for another operation immediately after a STOP condition is executed in the CONST A T Write command sequence (See Figure 18).RWEL: Register Write Enable Latch (Volatile)The RWEL bit controls the (CONST A T) Register Write Enable status of the X9521. Therefore, in order to write to any of the bits of the CONST A T Register (except WEL),the RWEL bit must first be set to “1”. The RWEL bit is a volatile bit that powers up in the disabled, LOW (“0”) state.It must be noted that the RWEL bit can only be set, once the WEL bit has first been enabled (See "CONST A T Reg-ister Write Operation").The RWEL bit will reset itself to the default “0” state, in one of three cases:—After a successful write operation to any bits of the CONST A T register has been completed (See Figure 18).—When the X9521 is powered down.—When attempting to write to a Block Lock protected region of the EEPROM memory (See "BL1, BL0: Block Lock protection bits - (Nonvolatile)", below).BL1, BL0: Block Lock protection bits - (Nonvolatile)The Block Lock protection bits (BL1 and BL0) are used to:—Inhibit a write operation from being performed to certain addresses of the EEPROM memory array—Inhibit a DCP write operation (changing the “wiper posi-tion”).Bit(s)DescriptionCS7 - CS5 Always “0”(RESERVED)BL1 - BL0 Sets the Block Lock partition RWEL Register Write Enable Latch bit WEL Write Enable Latch bit CS0Always “0” (RESERVED)WELCS5CS6CS7CS4CS3CS2CS1CS0BL0BL1RWELFigure 17.CONSTAT Register Format NVNVNOTE: Bits labelled NV are nonvolatile (See “CONTROL AND ST A TUS REGISTER”).The region of EEPROM memory which is protected /locked is determined by the combination of the BL1 and BL0 bits written to the CONST A T register. It is possible to lock the regions of EEPROM memory shown in the table below:If the user attempts to perform a write operation on a pro-tected region of EEPROM memory , the operation is aborted without changing any data in the array .When the Block Lock bits of the CONST A T register are set to something other than BL1=0 and BL0=0, then the “wiper position” of the D CPs cannot be changed - i.e.DCP write operations cannot be conducted:The factory default setting for these bits are BL1 = 0, BL0= 0.IMPORT ANT NOTE: If the Write Protect (WP) pin of the X9521 is active (HIGH), then all nonvolatile write opera-tions to both the EEPROM memory and DCPs are inhib-ited, irrespective of the Block Lock bit settings (See "WP:Write Protection Pin").CONSTAT Register Write OperationThe CONST A T register is accessed using the Slave Address set to 1010010 (Refer to Figure 4.). Following theSlave Address Byte, access to the CONST A T register requires an Address Byte which must be set to FFh. Only one data byte is allowed to be written for each CONST A T register Write operation. The user must issue a STOP ,after sending this byte to the register, to initiate the nonvol-atile cycle that stores the BP1and BP0 bits. The X9521will not ACKNOWLEDGE any data bytes written after the first byte is entered (Refer to Figure 18.).When writing to the CONST A T register, the bits CS7-CS5and CS0 must all be set to “0”. Writing any other bit sequence to bits CS7-CS5 and CS0 of the CONST A T register is reserved.Prior to writing to the CONST A T register, the WEL and RWEL bits must be set using a two step process, with the whole sequence requiring 3 steps—Write a 02H to the CONST A T Register to set the Write Enable Latch (WEL). This is a volatile operation, so there is no delay after the write. (Operation preceded by a ST ART and ended with a STOP).—Write a 06H to the CONST A T Register to set the Regis-ter Write Enable Latch (RWEL) AND the WEL bit. This is also a volatile cycle. The zeros in the data byte are required. (Operation preceded by a ST ART and ended with a STOP).—Write a one byte value to the CONST A T Register that has all the bits set to the desired state. The CONST A T register can be represented as 000st010 in binary ,where st are the Block Lock Protection (BL1 and BL0)bits. This operation is proceeded by a ST ART and ended with a STOP bit. Since this is a nonvolatile write cycle, it will typically take 5ms to complete. The RWEL bit is reset by this cycle and the sequence must be repeated to change the nonvolatile bits again. If bit 2 is set to ‘1’ in this third step (000s t110) then the RWEL bit is set, but the BL1 and BL0 bits remain unchanged.Writing a second byte to the control register is not allowed. D oing so aborts the write operation and the X9521 does not return an ACKNOWLEDGE.BL1BL0Protected Addresses(Size)Partition of arraylocked 00None (Default)None (Default)01C0h - FFh (64 bytes )Upper 1/4 1080h - FFh (128 bytes )Upper 1/21100h - FFh (256 bytes)AllBL1BL0DCP Write Operation Permissible00YES (Default)01NO 10NO 11NOS T A R T111R/W AC K11111111A C KSCLSDAS T O PA C KCS7CS6CS5CS4CS3CS2CS1CS0SLAVE ADDRESS BYTE ADDRESS BYTE CONSTAT REGISTER DATA INFigure 18.CONSTAT Register Write Command Sequence。

IRF9520NL资料

IRF9520NL资料

IRF9520NS/LHEXFET ® Power MOSFETPD -91522A5/13/98ParameterTyp.Max.UnitsR θJC Junction-to-Case––– 3.1R θJAJunction-to-Ambient ( PCB Mounted,steady-state)**–––40Thermal Resistance°C/WParameterMax.UnitsI D @ T C = 25°C Continuous Drain Current, V GS @ -10V -6.8I D @ T C = 100°C Continuous Drain Current, VGS @ -10V -4.8A I DMPulsed Drain Current -27P D @T A = 25°C Power Dissipation 3.8W P D @T C = 25°C Power Dissipation 48W Linear Derating Factor 0.32W/°C V GS Gate-to-Source Voltage± 20V E AS Single Pulse Avalanche Energy 140mJ I AR Avalanche Current-4.0A E AR Repetitive Avalanche Energy 4.8mJ dv/dt Peak Diode Recovery dv/dt -5.0V/ns T J Operating Junction and-55 to + 175T STGStorage Temperature RangeSoldering Temperature, for 10 seconds300 (1.6mm from case )°CAbsolute Maximum RatingsFifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.The D 2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D 2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.The through-hole version (IRF9520L) is available for low-profile applications.Description2 D PakT O -262lAdvanced Process Technology l Surface Mount (IRF9520S)l Low-profile through-hole (IRF9520L)l 175°C Operating Temperature l Fast Switching l P-Channell Fully Avalanche RatedIRF9520NS/LIRF9520NS/LIRF9520NS/LIRF9520NS/LIRF9520NS/LIRF9520NS/LIRF9520NS/LIRF9520NS/LIRF9520NS/L。

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Preliminary Product InformationThis document contains information for a new product.Cirrus Logic reserves the right to modify this product without notice.Copyright © Cirrus Logic, Inc. 1997Cirrus Logic, Inc.Crystal Semiconductor Products Division CS4952/53NTSC/PAL Digital Video EncoderFeaturesl Simultaneous composite and S-video output l Supports RS170A and CCIR601 compositeoutput timingl Multi-standard support for NTSC-M, PAL (B, D, G, H, I, M, N, Combination N)l Optional progressive scan @ MPEG2 field rates l CCIR656 input mode supporting EAV/SAV codes and CCIR601 Master/Slave input modes l Stable color subcarrier for MPEG2 systems l NTSC closed caption encoder with interrupt l Supports Macrovision copy protection in CS4953 versionl Host interface configurable for parallel or I 2C compatible operationl General purpose input and output pins l Individual DAC power-down capability l On-chip voltage reference generator l On-chip color bar generatorl +5 volt only, CMOS, low power modes, tri-state DACsDescriptionThe CS4952/3 provides full conversion from YCbCr or YUV digital video formats into NTSC & PAL Composite and Y/C (S-video) analog video. Input formats can be 27MHz 8-bit YUV, 8-bit YCbCr, or CCIR656 with sup-port for EAV/SAV codes. Output video can be formatted to be compatible with NTSC-M, or PAL B,D,G,H,I,M,N,and Combination N systems. Also supported is NTSC line 21 and line 284 closed captioning encoding.Four 9-bit DACs provide two channels for an S-Video out-put port and two composite video outputs. 2x oversampling reduces the output filter requirements and guarantees no DAC related modulation components within the spec-ified bandwidth of any of the supported video standards.Parallel or high speed I 2C compatible control interfaces are provided for flexibility in system design. The parallel interface doubles as a general purpose I/O port when the CS4952/3 is in I 2C mode to help conserve valuable board area.ORDERING INFORMATIONCS4952/3-CL 44 pin PLCC CS4952/3-CQ 44 pin TQFPOCT ‘97TABLE OF CONTENTSAC & DC PARAMETRIC SPECIFICATIONS (4)INTRODUCTION (11)FUNCTIONAL DESCRIPTION (11)Video Timing Generator (11)Video Input Formatter (11)Color Subcarrier Synthesizer (12)Chroma Path (12)Luma Path (12)Digital to Analog Converters (13)Voltage Reference (13)Current Reference (13)Host Interface (13)Closed Caption Services (13)Control Registers (13)OPERATIONAL DESCRIPTION (14)Reset Hierarchy (14)Video Timing (14)Slave Mode Input Interface (14)Master Mode Input Interface (14)Vertical Timing (15)Horizontal Timing (15)NTSC Interlaced (17)PAL Interlaced (17)Progressive Scan (19)PAL Progressive Scan (19)NTSC Progressive Scan (19)CCIR-656 (19)Digital Video Input Modes (22)Multi-standard Output Format Modes (22)Subcarrier Generation (22)Subcarrier Compensation (22)Closed Caption Insertion (23)Color Bar Generator (23)Interrupts (24)General Purpose I/O Port (24)ANALOG (24)Analog Timing (24)VREF (25)ISET (25)DACs (25)Luminance DAC (25)Chrominance DAC (25)CVBS75 DAC (26)CVBS37 DAC (26)PROGRAMMING (27)Host Control Interface (27)I2C Interface (27)8-bit Parallel Interface (27)Register Description (28)Control Register 0 (28)Control Register 1 (29)Control Register 2 (30)DAC Power Down Register (30)Status Register (31)Background Color Register (31)GPIO Control Register (31)GPIO Data Register (32)Chroma Filter Register (32)Luma Filter Register (32)I2C Address Register (32)Subcarrier Amplitude Register (33)Subcarrier Synthesis Register (33)Hue LSB Adjust Register (33)Hue MSB Adjust Register (33)Closed Caption Enable Register (34)Closed Caption Data Register (34)Interrupt Enable Register (34)Interrupt Clear Register (35)Device ID Register (35)BOARD DESIGN & LAYOUT CONSIDERATIONS (36)Power and Ground Planes (36)Power Supply Decoupling (36)VREF Decoupling (36)Digital Interconnect (36)Analog Interconnect (37)Analog Output Protection (37)ESD Protection (37)External DAC Output Filter (37)DEVICE PINOUT - 44 PLCC (38)PLCC Pin Description (39)DEVICE PINOUT - 44 TQFP (41)TQFP Pin Description (42)AC & DC PARAMETRIC SPECIFICATIONSABSOLUTE MAXIMUM RATINGS: (AGND, DGND = 0V, all voltages with respect to 0V.) Parameter Symbol Min Max Units Power Supply V AA-0.3 6.0V Input Current Per Pin Except Supply Pins-1010mA Output Current Per Pin Except Supply Pins-50+50mA Analog Input Voltage-0.3V AA+0.3V Digital Input Voltage-0.3V AA+0.3V Ambient Temperature Power Applied-55+125°C Storage T emperature -65+150°CWarning: Operating beyond these limits may result in permanent damage to the device.Normal operation is not guaranteed at these extremes. RECOMMENDED OPERATING CONDITIONS: (AGND, DGND = 0V, all voltages withrespect to 0V.)Parameter Symbol Min Typ Max Units Power Supplies: Digital Analog V AA 4.75 5.0 5.25V Operating Ambient T emperature T A0+25+70°CD.C. CHARACTERISTICS: (T A =25 C; V AA = 5V; GND = 0V.)Notes: 1.Output current levels with ISET = 10k Ω, VREFIN = 1.232 V.2.Times for black-to-white level and white-to-black level transitions.ParameterSymbolMinTypMaxUnitsDigital InputsHigh Level Input VoltageV [7:0], PDAT [7:0],HSYNC/VSYNC/FIELD/CLKINV IH 2.0-V AA +0.3V High Level Input Voltage I 2CV IH 0.7V AA --V Low Level Input Voltage All Inputs V IL -0.3-0.8V Input Leakage Current Digital Inputs --10-+10µA Digital OutputsHigh Level Output Voltage Io = -4mA V OH 2.4-V AA V Low Level Output Voltage Io = 4mAV OL --0.4V Low Level Output Voltage SDA pin only, Io = 6mA V OL --0.4V Output Leakage Current High-Z Digital Outputs --10-+10µA Analog OutputsFull Scale Output Current CVBS37/Y/C (Note 1)IO3732.934.736.5mA Full Scale Output Current CVBS75 (Note 1)IO7516.417.318.2mA LSB Current CVBS37/Y/C (Note 1)IB3764.56871.5µA LSB CurrentCVBS75 (Note 1)IB3532.23435.8µA DAC-to-DAC Matching MAT -2-%Output Compliance V OC 0-+1.4V Output Impedance R OUT -15-k ΩOutput Capacitance C OUT --30pF DAC Output Delay O DEL-412ns DAC Rise/Fall Time (Note 2)T RF - 2.55ns Voltage Reference Reference Voltage Output V OV 1.198 1.232 1.272V Reference Input Current I VC --10µA Power Supply Supply Voltage V AA4.7555.25V Supply CurrentAll DACs onCVBS75/CVGS37 onlyCVBS75 onlyI AA 1I AA 2I AA 3---18011075200--mA mA mAD.C. CHARACTERISTICS (Continued)Parameter Symbol Min Typ Max Units Static PerformanceDAC Resolution--9Bits Differential Non-Linearity DNL-1±0.5+1LSB Integral Non-Linearity INL-1±0.35+1LSB Dynamic PerformanceDifferential Gain DB-25% Differential Phase DP-±0.5±2°Signal to Noise Ratio SNR-70--dB Hue Accuracy H A--2°Saturation Accuracy S A--2%A.C. CHARACTERISTICS:Parameter Symbol Min Typ Max Units Pixel Input and Control PortClock Pulse High Time T ch14.8218.5222.58ns Clock Pulse Low Time T cl14.8218.5222.58ns Clock to Data Set-up Time T isu6--ns Clock to Data Hold Time T ih0--ns Clock to Data Output Delay T oa--17nsParameter Symbol Min Typ Max Units I2C Host Port TimingSCL Frequency F clk1001000KHz Clock Pulse High Time T sph0.1µs Clock Pulse Low Time T spl0.7µs Hold Time (Start Condition)T sh100ns Setup Time (Start Condition)T ssu100ns Data Setup Time T sds50ns Rise Time T sr1µs Fall Time T sf0.3µs Setup Time (Stop Condition)T ss100ns Bus Free Time T buf100ns Data Hold Time T dh0ns SCL Low to Data Out Valid T vdo600nsFigure 2. I2C Host Port TimingA.C. CHARACTERISTICS: (Continued)Parameter Symbol Min Typ Max Units 8-bit Parallel Host InterfaceRead Cycle Time T rd60--ns Read Pulse Width T rpw30--ns Address Setup Time T as3--ns Read Address Hold Time T rah10--ns Read Data Access Time T rda--40ns Read Data Hold Time T rdh10-50ns Write Recovery Time T wr60--ns Write Pulse Width T wpw40--ns Write Data Setup Time T wds8--ns Write Data Hold Time T wdh3--ns Write-Read/Read-Write Recovery Time T rec50--ns Address from Write Hold Time T wac0--ns8-bit Parallel Host Port Timing: Read Cycle8-bit Parallel Host Port Timing: Address Write CycleFigure 3.A.C. CHARACTERISTICS: (Continued)Parameter Symbol Min Typ Max Units Reset TimingReset Pulse Width T res100nsFigure 4. Reset TimingFigure 5. Typical Connection Diagram (I2C host interface)INTRODUCTIONThe CS4952/3 is a complete multi-standard digital video encoder implemented in current 5-volt only CMOS technology. CCIR601 or CCIR656 compli-ant digital video input can be converted into NTSC-M, PAL B, PAL D, PAL G, PAL H, PAL I, PAL M, PAL N, or PAL N Argentina-compatible analog video. The CS4952/3 is designed to connect to MPEG1 and MPEG2 digital video decompres-sors without glue logic.Two 9-bit DAC outputs provide high quality S-Video analog output while two other 9-bit DACs simultaneously generate composite analog video. The CS4952/3 will accept 8-bit YCbCr or 8-bit YUV input data.The CS4952/3 is completely configured and con-trolled via an 8-bit host interface port or an I2C compatible serial interface. This host port provides access and control of all CS4952/3 options and fea-tures like closed caption insertion, interrupts, etc. In order to lower the end user set-top overall sys-tem costs, the CS4952/3 provides an internal volt-age reference which eliminates the requirement for an external discrete 3-pin voltage reference. FUNCTIONAL DESCRIPTIONIn the following subsections, the functions of the CS4952/3 will be described. The descriptions refer to the block diagram on the cover page.Video Timing GeneratorAll timing generation is accomplished via a 27MHz input applied to the CLK pin. The CS4952/3 can also accept an optional color burst crystal on the ADDR & XTAL pins. See section: Color Subcarrier Synthesizer (page12), for further details.The Video Timing Generator is responsible for or-chestrating most all of the other modules in the de-vice. It works in harmony with external sync input timing or by providing external sync timing out-puts. It automatically disables color burst on appro-priate scan lines and generates serration and equalization pulses on appropriate scan lines.The CS4952/3 is designed to function as a video timing master or video timing slave. In both Master and Slave Modes, all timing is sampled and assert-ed with the rising edge of the CLK pin.In most cases the CS4952/3 will serve as the video timing master. The master timing cannot be exter-nally altered other than through the host interface by changing the video display modes: PAL or NTSC and Progressive Scan. HSYNC, VSYNC and FIELD are configured as outputs for Master Mode. HSYNC can also be defined as a composite blanking output signal in Master Mode. Exact hor-izontal and vertical display timing is addressed in section: Operational Description (page14).In Slave Mode HSYNC and VSYNC are config-ured as input pins and are used to initialize inde-pendent vertical and horizontal timing generators upon their respective falling edges. FIELD remains an output in Slave Mode.The CS4952/3 also provides a CCIR-656 Slave Mode where the video input stream contains EAV and SAV codes. In this case, proper HSYNC VSYNC timing is extracted automatically without aid from any inputs other than the V [7:0]. CCIR-656 input data is sampled with the leading edge of CLK. Slave Mode vertical and horizontal timing derived via CCIR-656 or external hardware must be equivalent to timing generated by the CS4952/3 in Master Mode.Video Input FormatterThe video input formatter translates YCbCr input data into YUV information, if necessary, and splits the luma and chroma information for filtering, scal-ing, and modulation.Color Subcarrier SynthesizerThe subcarrier synthesizer is a digital frequency synthesizer that produces the correct subcarrier fre-quency for NTSC or PAL. The CS4952/3 generates the color burst frequency based on the input CLK (27MHz). Color burst accuracy and stability are limited by the accuracy of the 27MHz input. If the frequency varies then the color burst frequency will also vary accordingly.In order to handle situations in which the CLK var-ies unacceptably, a local crystal frequency refer-ence may be used on the ADDR & XTAL device pins. In this instance the input CLK is continuously compared with the external crystal reference input and the internal timing of the CS4952/3 is automati-cally adjusted so that the color burst frequency re-mains close to the requirements.Controls are provided for phase adjustment of the burst to permit color adjustment and phase com-pensation. Chroma hue control is provided by the CS4952/3 via a 10-bit Hue Control Register (HUE_LSB and H_MSB). Burst amplitude control is also made available to the host via the 8-bit burst amplitude register (SC_AMP).Chroma PathThe Video Input Formatter at conclusion delivers 4:2:2 YUV outputs into separate chroma and luma data paths. The chroma path will be discussed here. The chroma output of the Video Input Formatter is directed to a chroma low pass 19-tap FIR filter. The filter bandwidth is selected or the filter may be by-passed via the CONTROL_1 register. The pass-band of the filter is either 650KHz or 1.3MHz and the passband ripple is less than or equal to 0.05dB. The stopband for the 1.3MHz selection begins at 3MHz with an attenuation of greater that 35dB. The stopband for the 650KHz selection begins around 1.1 MHz with an attenuation of greater than 20dB.The output of the chroma low pass filter is connect-ed to the chroma interpolation filter where upsam-pling from 4:2:2 to 4:4:4 is accomplished. The chroma digital data is fed to a quadrature modulator where they are combined with the output from the subcarrier synthesizer to produce the proper modu-lated chrominance signal.Following chroma modulation the chroma data passes through a variable gain amplifier where the chroma amplitude may be varied via the C_AMP 8-bit host addressable register. The chroma then is interpolated by a factor of 2 in order to operate the output DACs at 2 times the pixel rate. The interpo-lated filters help reduce the sinx/x roll-off for high-er frequencies and reduce the complexity of the external analog low pass filters.Luma PathAlong with the chroma output path, the CS4952/3 Video Input Formatter initiates a parallel luma data path by directing the luma data to a digital delay line. The delay line is built as a digital FIFO where the depth of the FIFO replicates the clock period delay associated with the more complex chroma path.Following the luma delay, the data is passed through a variable gain amplifier where the luma DC values are modifiable via the Y_AMP register. The output of the luma amplifier connects to the sync insertion block. Sync insertion is accom-plished by multiplexing into the luma data path the different sync DC values at the appropriate times. The digital sync generator takes horizontal sync and vertical sync timing signals and generates the appropriate composite sync timing (including ver-tical equalization and serration pulses), blanking information, and burst flag. The sync edge rates conform to RS-170A or CCIR specifications.The luma only path is concluded via output interpo-lation by a factor of two in order to operate the out-put DACs at two times the pixel rate.Digital to Analog ConvertersThe CS4952/3 provides four complete simulta-neous 27MHz DACs for analog video output: one 9-bit for S-video chrominance, one 9-bit for S-Vid-eo luminance, and two 9-bit composite outputs. Both S-Video DACs are designed for 37.5Ω over-all loads. The two composite 9-bit DACs are not identical. One DAC is designed to drive 37.5Ω de-rived from a double terminated 75Ω circuit. The second 9-bit DAC is targeted for an on-board local video connection where single point 75Ω termina-tion is sufficient i.e. Ch3/4 RF modulators, video amps, muxes.The DACs can be put into tri-state mode via host addressable control register bits. Each of the four DACs has its own separate DAC enable associated with it. In the disable mode, the 9-bit DACs source or sink zero current.For lower power standby scenarios the CS4952/3 also provides power shut-off control for the DACs. Each DAC has a separate DAC shut-off associated with it.Voltage ReferenceThe CS4952/3 is equipped with an on-board 1.235V voltage reference generator used by the Video DACs. For most requirements, the voltage reference output pin can be connected to the volt-age reference input pin along with a decoupling ca-pacitor. Otherwise the voltage reference input may be connected to an external voltage reference. Current ReferenceThe DAC output current per bit is derived in the current reference block. The current step is speci-fied by the size of resistor place between the ISET current reference pin and electrical ground. This has been optimized for 10kΩ (see “ISET” on page25 for more informmation on selecting the proper ISET value).Host InterfaceThe CS4952/3 provides a parallel 8-bit data inter-face for overall configuration and control. The host interface uses active low read and write strobes along with an active low address enable signal to provide microprocessor compatible read and write cycles. Indirect host addressing to the CS4952/3 in-ternal registers is accomplished via an internal ad-dress register which is uniquely accessible via bus write cycles with the host address enable signal as-serted.The CS4952/3 also provides an I2C compatible se-rial interface for device configuration and control. This port can operate in standard or fast (400KHz) modes. When in I2C mode, the parallel data inter-face PDAT [7:0] pins may be used as a general pur-pose I/O port controlled by the I2C interface. Closed Caption ServicesThe CS4952/3 supports the generation of NTSC Closed Caption services. Line 21 and Line 284 cap-tioning can be generated and enabled independent-ly via a set of control registers. When enabled, clock run-in, start bit, and data bytes are automati-cally inserted at the appropriate video lines. A con-venient interrupt interface simplifies the software interface between the host processor and the CS4952/3.Control RegistersThe control and configuration of the CS4952/3 is primarily accomplished through the control regis-ter block. All of the control registers are uniquely addressable via the internal address register. The control register bits are initialized during a chip re-set.See the detailed operation section of this data sheet for all of the individual register bit allocations, bit operational descriptions and initialization states.OPERATIONAL DESCRIPTIONReset HierarchyThe CS4952/3 is equipped with an active low asyn-chronous reset input pin RESET. RESET is used to initialize the internal registers and the internal state machines for subsequent default operation. See the electrical and timing specification section of this data sheet for specific CS4952/3 chip reset and power-on signaling timing requirements and re-strictions. All chip outputs are valid after a time pe-riod following RESET pin low.When the RESET pin is held low, the host interface in the CS4952/3 is disabled and will not respond to host initiated bus cycles.A reset initializes the CS4952/3 internal registers to their default values as described by Table 5. In the default state, the CS4952/53 video DACs are dis-abled and the device is configured to internally pro-vide blue field video data to the DACs (any input data present on the V [7:0] pins is ignored). Other-wise the CS4952/53 registers are configured for NTSC-M CCIR601 output operation. At a mini-mum, the DAC register (0x04) must be written (to enable the DACs) and the IN_MODE bit of the CONTROL_0 register (0x01) must be set (to en-able CCIR601 data input on V [7:0]) for the CS4952/53 to become operational after RESET.Video TimingSlave Mode Input InterfaceIn Slave Mode, the CS4952/3 takes VSYNC and HSYNC as inputs. Slave Mode is the default fol-lowing a reset and is changed to Master Mode via a contol register bit (CONTROL_0 [4]). The CS4952/3 is limited to CCIR601 horizontal and vertical input timing. All clocking in the CS4952/3 is generated from the CLK pin. In Slave Mode the Sync Generator uses externally provided horizontal and vertical sync signals to synchronize the internal timing of the CS4952/3.Video data that is sent to the CS4952/3 must be synchronized to the horizontal and vertical sync signals. Figure 6 illustrates horizontal timing for CCIR601 input in Slave Mode. Note that the CS4952/3 expects to receive the first active pixel data on clock cycle 245 (NTSC) when bit SYNC_DLY=0 in the CONTROL_2 Register (Ox02). When SYNC_DLY=1, it expects the first active pixel data on clock cycle 246 (NTSC). Master Mode Input InterfaceThe CS4952/3 defaults to Slave Mode following RESET high but may be switched into Master Mode via the MSTR bit in the CONTROL_0 Reg-ister (0x00). In Master Mode, the CS4952/3 uses the VSYNC, HSYNC and FIELD device pins asFigure 6. CCIR601 Input Slave Mode Horizontal Timingoutputs to schedule the proper external delivery of digital video into the V [7:0] pins. Figure 7 illus-trates horizontal timing for CCIR601 input in Mas-ter Mode. Note that the CS4952/3 expects to receive the first active pixel data on clock cycle 245(NTSC) when bit SYNC_DLY=0 in the CONTROL_2 Register (0x02). When SYNC_DLY=1, it expects the first active pixel data on clock cycle 246 (NTSC).Vertical TimingThe CS4952/3 can be selected through the CONTROL_0 register (0x00) to operate in four different timing modes: PAL which is 625 vertical lines 25 frames per second interlaced, NTSC which is 525 vertical lines 30 frames per second interlaced and both PAL and NTSC again but in Progressive Scan where the display is non-interlaced. The CS4952/3 conforms to standard digital decom-pression dimensions and does not process digital input data for the active analog video half lines as they are typically in the over/underscan region of televisions. For NTSC, 240 active lines total per field are processed and for PAL 288 active lines to-tal per field. Frame vertical dimensions are 480lines for NTSC and 576 lines for PAL. Table 1specifies active line numbers for both NTSC and PAL. Refer to Figure 8 for HSYNC, VSYNC and FIELD signal timing.Table 1. Vertical TimingHorizontal TimingHSYNC is used to synchronize the horizontal input to output timing in order to provide proper horizon-tal alignment. HSYNC defaults to an input pin fol-lowing RESET but switches to output in Master Mode (CONTROL_0 [4] = 1). Horizontal timing is referenced to HSYNC transitioning low. For active video lines, digital video input is to be applied to the V [7:0] inputs 244 (NTSC) or 264 (PAL), CLK periods following HSYNC going low to determine the horizontal alignment of the active video.Figure 7. CCIR601 Input Master Mode Horizontal TimingMODEFIELD ACTIVE LINES NTSC 1, 32, 422-261285-524PAL1, 3, 5, 72, 4, 6, 823-310336-623NTSC Progressive-Scan NA 22-261PAL Progressive-ScanNA23-310Figure 8. Vertical TimingNTSC InterlacedThe CS4952/3 supports NTSC-M and PAL-M modes where there are 525 total lines per frame and two fixed 262.5 line fields per frame and 30 total frames occuring per second. Please reference Fig-ure 9 for NTSC interlaced vertical timing. Each field consists of 1 line for closed caption, 240 ac-tive lines of video plus 21.5 lines of blanking. VSYNC field one transistions low at the beginning of line 4 and will remain low for 3 lines or (858x3) 2574 pixel cycles. The CS4952/3 exclusively re-serves line 21 of field one for closed caption inser-tion. Digital video input is expected to be delivered to the CS4952/3 V [7:0] pins for 240 lines begin-ning on active video lines 22 and continuing through line 261. VSYNC field two transistions low in the middle of line 266 and stays low for 3 lines times and transitions high in the middle of line 269. The CS4952/3 exclusively reserves line 284 of field two for closed caption insertion. Video input on the V [7:0] pins is expected between lines 285 through line 525.PAL InterlacedThe CS4952/3 supports PAL modes B, D, G, H, I, N, and Combination N where there are 625 total lines per frame and two fixed 312.5 line fields per frame and 25 total frames occuring per second. Please reference Figure 10 for PAL interlaced ver-tical timing. Each field consists of 288 active lines of video plus 24.5 lines of blanking.Figure 9. NTSC Video Interlaced TimmingFigure 10. PAL Video Interlaced TimingVSYNC will transition low to begin field one and will remain low for 2.5 lines or (864x2.5) 2160 pixel cycles. Digital video input is expected to be delivered to the CS4952/3 V [7:0] pins for 287 lines beginning on active video line 24 and continu-ing through line 310.Field two begins with VSYNC transitioning low after 312.5 lines from the beginning of field one. VSYNC stays low for 2.5 lines times and transi-tions high with the beginning of line 315. Video in-put on the V [7:0] pins is expected between line 336 through line 622.Progressive ScanThe CS4952/3 supports a progessive scan mode where the video output is non-interlaced. This is accomplished by displaying only the first video field for NTSC or PAL. To preserve exact MPEG-2 frame rates of 30 and 25 per second, the CS4952/3 displays the same first field repetitively but alter-nately varies the field times. Other digital video en-coders commonly support progressive scan by repetitively displaying a 262 line field (524/525 lines for NTSC). In the long run this method is flawed in that over time, the output display rate will overrun a system clock locked MPEG-2 decom-pressor and display a field twice every 8.75 sec-onds.PAL Progressive ScanVSYNC will transistion low to begin field one and will remain low for for 2.5 lines or (864x2.5) 2160 pixel times. Please reference Figure 11 for PAL non-interlaced timing. Digital video input is ex-pected to be delivered to the CS4952/3 V [7:0] pins for 288 lines beginning on active video line 23 and continuing through line 309.Field two begins with VSYNC transitioning low after 312 lines from the beginning of field one.VSYNC stays low for 2.5 line times and transitions high during the middle of line 315. Video input on the V [7:0] pins is expected between line 335 through line 622. Field two is 313 lines long while field one is 312.NTSC Progressive ScanVSYNC will transition low at line 4 to begin field one and will remain low for 3 lines or (858 x 3) 2574 pixel times. Please reference Figure 12 for NTSC interlaced timing. Digital video input is ex-pected to be delivered to the CS4952/3 V [7:0] pins for 240 lines beginning on active video line 22 and continuing through line 261.Field two begins with VSYNC transitioning low at line 266. VSYNC stays low for 2.5 line times and transitions high during the middle of line 268. Vid-eo input on the V [7:0] pins is expected between line 284 through line 524. Field two is 263 lines long while field one is 262.CCIR-656The CS4952/3 supports an additional Slave Mode feature that is selectable through the CCIR601 bit of the CONTROL_0 register. The CCIR-656 slave feature is unique because the horizontal and verti-cal timing and digital video are combined into a single 8-bit 27MHz input. With CCIR-656 there are no horizontal and vertical input or output strobes, only 8-bit 27MHz active CbYCrY data with start and end of video codes being implement-ed with reserved 00 and FF code sequences within the video feed. As with all modes, V [7:0] are sam-pled with the rising edge of CLK. The CS4952/3 expects the digital CCIR-656 stream to be error free. The FIELD output toggles as with non CCIR-656 input. CCIR-656 input timing is illus-trated in Figure 13.。

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