NX3008PBKS,115;中文规格书,Datasheet资料

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NXT生产线技术参数

FUJI NXT贴片机1.技术参数（指标）部分供给装置:2、NXT主要特点及功能描述2．1设备主要特点：日本FUJI公司的NXT是兼有高生产性和灵活性模组型高速多功能贴片机，真正的模组概念，单台机器可以对应大范围的生产品种，可以构筑对应必要生产量和复数电路板的生产线，对应经常变化的多品种生产环境的机器再构成。

以最小的投资得到最大的能力，新生产方式的提议LEAN MANUFACTURING的实践。

3.设备基本功能：3.1简述：3.2.1该设备具有全自动、高精度、多功能的特点，贴放速度可调，在表面安装生产过程中能完成对电子元器件的识别、拾取、对中和贴放。

3.2.2设备结构设计合理，采用先进成熟技术及系统，具有良好的动态品质，所选伺服系统执行元件精度高、可靠性好、响应速度快。

具有贴片头贴装率高，长期稳定性好。

所有零部件和仪表的计量单位采用国际单位标准。

其机械接口满足标准SMEMA接口的要求。

设备供、换料方便快速，操作简单，维修方便，安全性好，造型美观。

3.2.3设备软硬件功能齐全。

能将规定的PCB设计文件的数据自动转换成贴装程序所需格式的文本数据，具有自动和手动编程的能力。

3． 3设备主要功能：3.3.1配备有可以交换的贴装头，同一台机器同时具有高速机和异型机的功能，几乎可以装载所有种类的贴装元件。

将设备投资和增设限制在必须的最小限度。

3.3.2根据不同产品所需元件尺寸大小，增选配置适应元件范围的贴装头和供料器，主机从功能上就具有高速机或异型机不同的特点；3.3.3更换贴片头及吸嘴站也只需短短的数分钟就可完成；3.3.4元件相机，定位相机，吸嘴中心等的校正根据不同场合的需要自动进行，可使机器一直保持在高精度的贴装状态下。

无需配置复杂调校治具和掌握繁杂的测试方法，机器自动运行来保证贴片精度；3.3.5采用先进的视觉系统：3.3.5.1适应于各种元器件的高密度灯阵列；3.3.5.2标准配备的镜头，可对应从0201到大型的BGA器件和连接器，无需额外增加配置；3.3.6提供非语言的直观式操作体系:3.3.6.1操作面板采用图解式用户界面，以降低对操作者的要求和缩短教育时间；3.3.6.2对于错误信息的处理，也配合有故障代码，准确地告知故障点；3.3.7模块化设计具有超强维护性能：3.3.7.1可以将本体模组拉出进行维修保养，便于深入机器内部，进行零部件维护或机器清洁，降低了停机时间。

三垦力达电气 SC-PB PROFIBUS现场总线基板使用说明书

PROFIBUS现场总线基板SC-PB 使用说明书目录安全注意事项 ....................................................................................................................................................... - 1 - 1 概述 ............................................................................................................................................................... - 1 -1.1 现场总线基板SC-PB简介 .............................................................................................................. - 1 -1.2 包装附件一览 ................................................................................................................................... - 1 -1.3 使用注意事项 ................................................................................................................................... - 1 -1.4 产品规格 ........................................................................................................................................... - 2 -2 选购件基板的安装与设置 ........................................................................................................................... -3 -2.1 Profibus基板安装图: ........................................................................................................................ - 3 -2.1.1 SVC06-0015～0150/VM06-0022～0185 ............................................................................ - 3 -2.1.2 SVC06-0185～0750/VM06-0220～0900 .................................................. 错误!未定义书签。

施耐德 A9D93610 A9 SLIM 4.5kA 10A TypeA 数据表

Product data sheetCharacteristicsA9D93610A9 SLIM 4.5kA 10A TypeA主要信息断路器应用配电保护产品系列Acti 9产品类型剩余电流动作保护断路器产品短名iDPNa Vigi+极数1P + N 中性线位置左侧保护极数量1额定电流 [In]10 A 电网类型AC 脱扣曲线C 剩余电流灵敏度 [IΔn]30 MA 漏电流保护等级A类分断能力4500 A Icn 隔离功能适用补充信息配电系统位置下游配电出线电网频率50 Hz 额定工作电压 [Ue]230 V AC 50 Hz 磁脱扣限制5...10 x In 额定绝缘电压 [Ui]400 V 额定冲击耐受电压 [Uimp]4 KV 触点位置指示有控制类型手柄本地信号指示开/关指示安装方式DIN 导轨安装宽度（9mm的倍数）2高度96.1 Mm 宽度18 Mm 深度65.8 Mm 净重136 Kg 机械寿命20000 次电气寿命10000 次接线能力隧道式端子 (上接线) - <= 16 mm² - 单股硬线不带接线端子隧道式端子 (下接线) - <= 10 mm² - 单股硬线不带接线端子紧固扭矩电源回路: 2.5 N.m 上接线电源回路: 2 N.m 下接线环境符合标准GB/T 16917.1 GB/T 16917.22 EN/IEC 61009-1产品认证CCCIP 保护等级IP20IP40抗湿热性2相对湿度95 % 在…上 55 °C运行温度-25…55 °C贮存环境温度-30…70 °CT h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t a t i o n c o n t a i n s g e n e r a l d e s c r i p t i o n s a n d /o r t e c h n i c a l c h a r a c t e r i s t i c s o f t h e p e r f o r m a n c e o f t h e p r o d u c t s c o n t a i n e d h e r e i n .T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s .I t i s t h e d u t y o f a n y s u c h u s e r o r i n t e g r a t o r t o p e r f o r m t h e a p p r o p r i a t e a n d c o m p l e t e r i s k a n a l y s i s , e v a l u a t i o n a n d t e s t i n g o f t h e p r o d u c t s w i t h r e s p e c t t o t h e r e l e v a n t s p e c i f i c a p p l i c a t i o n o r u s e t h e r e o f .N e i t h e r S c h n e i d e r E l e c t r i c I n d u s t r i e s S A S n o r a n y o f i t s a f f i l i a t e s o r s u b s i d i a r i e s s h a l l b e r e s p o n s i b l e o r l i a b l e f o r m i s u s e o f t h e i n f o r m a t i o n c o n t a i n e d h e r e i n .包装单位Unit Type of Package 1PCENumber of Units in Package 11Package 1 Height9.61 CmPackage 1 Width 1.8 CmPackage 1 Length 6.58 CmPackage 1 Weight125 GUnit Type of Package 2BB1Number of Units in Package 212Package 2 Height7.8 CmPackage 2 Width9.5 CmPackage 2 Length21.8 CmPackage 2 Weight 1.548 KgUnit Type of Package 3CARNumber of Units in Package 372Package 3 Height20 CmPackage 3 Width27.8 CmPackage 3 Length37.6 CmPackage 3 Weight9.831 Kg可持续性产品类型Green Premium 产品REACh法规REACh 声明欧盟ROHS指令符合豁免条件Mercury free支持可持续的包装YesRoHS exemption information支持中国 ROHS 管理办法中国 ROHS 声明环境披露产品环境文件流通资料无需具体的回收操作合同保修保修单18 个月Product Life Status :Commercialised。

NXa_系列UPS配套UPS电池速查表

Watts/cell UPS型号 NXa 30kVA 电池最大后备时间放电电流 63A 30min (*注1) 106.4
电池配置电池品牌
EXIDE PANASONIC EMERSON EXIDE
电池柜(架)配置
规格*节数*组数电池柜（架）编码
电池型号
柜(架)型号
非标非标 H40-270R2 非标非标 H40-270R4*2-50 非标非标 H40-310R4*2-50 非标非标 H80-740R4*2-50 非标非标 U40-100R4*2-50 非标非标 U40-100R4*2-50 非标非标四层卧放架 (48V400Ah) 非标非标
JTT12V4800 12V/230Ah*40*3 ———— T2V1000E/A 2V1000Ah*240*1 ———— ———— T2V650E/A
8h 100kVA 203A
2V650Ah*240*2
JTT12V3300 12V/160Ah*40*1 LC-XA12100 12V/100Ah*40*2 H12V310/A LC-X1275 12V88Ah*40*2 12V/75Ah*40*4 JTT12V3300 12V/160Ah*40*2
4400*820*1276
2
JTT12V4800 12V/230Ah*40*3 LC-X06200 T2V800E/A
6h
PANASONIC EMERSON EXIDE
9280*1030*1205
1
JTT12V4800 12V/230Ah*40*4 ———— T2V1000E/A 2V1000Ah*240*1
尺寸(宽*深*高，mm) 数量
JTT12V1560 12V/65Ah*40*1 LC-X1265 H12V200/A 12V/65Ah*40*1 12V54Ah*40*1

NX1P+datasheet

RCM、 KC
4
机器自动化控制器 NX1P
数字输出单元
产品名称晶体管输出单元
点数
内部I/O公共端线处理
最大负载电流
NPN 2点
PNP
0.5A/点、 1A/单元
规格额定电压
DC24V
NPN (PUSH-IN紧固端子台、宽12mm)
4点
PNP
0.5A/点、 2A/单元
2A/点、 8A/单元
DC12～24V DC24V
额定输入电压
I/O刷新方式
ON/OFF 响应时间
DC12～24V DC24V DC12～24V
自动运行刷新或输入输出同步刷新切换
变化时刻输入方式专用*
自动运行刷新或输入输出同步刷新切换
变化时刻输入方式专用*
20µs以下/400µs以下 100ns以下/100ns以下 20µs以下/400µs以下 100ns以下/100ns以下
20µs以下/400µs以下
NX-ID5142-5 NX-ID6142-5
UC1、 CE、 RCM、
KC
(富士通连接器、宽30mm)
AC输入单元
32点
NPN/PNP 通用
DC24V
自动运行刷新或输入输出同步刷新切换
20µs以下/400µs以下
4点
AC200～240V、50/60Hz (AC170～264V、±3Hz)
新产品信息
机器自动化控制器
NX1P
一体封装紧凑型机器自动化控制器
特点
·整合时序控制与运动控制 ·通过EtherCAT可实现最多8轴控制 ·最多4轴的电子齿轮/电子凸轮的同步功能与直线/圆弧插补功能 ·标配控制用网络EtherCAT ·在EtherCAT上实现了安全子系统 ·标配EtherNet/IP通信功能端口 ·控制器本体内置输入输出 ·控制器本体上最多可扩展8台NX单元 ·最多可安装2块可添加串行通信或模拟输入输出功能的选项板 ·可进行无蓄电池运行 ·符合国际标准规格IEC 61131-3的编程语言规格

ABB 新式紧凑型电缆保护设备说明书

Compact and reliable switching Smaller, more efficient and simpler gas-insulated switchgearHANS-DIETER SCHlEMPER – Gas-insulated switchgear (GIS) operates invisibly – no movement, just a faint hum, betrays the flow of bulk AC power. At first sight uncomplicated-look-ing, a closer examination reveals the complexity in the variety of configurations, engineering investment and installation effort found in a typical GIS installation. Now, however, ABB’s new compact GIS switchgear makes everything much simpler. Even at 420 kV ratings, the switch-gear is assembled as a complete bay in the factory, includ-ing wiring and testing. Installation is fast and easy: Bays move on wheels to their final destination and they can be assembled in a day. The compact dimensions leave more space for access, fit in even smaller buildings and save on resources such as SF6and metals.11Compact and reliable switching12ABB review special reportThe first GIS was installed in 1965 and used sulfur hexafluoride gas (SF 6) as in-sulation. Today, GIS switchgear is avail-able from 52 to 1,200 kV rated voltage [1]. C urrent trends and needs in GIS i nclude:− Less complex, more standardized designs that inherently improve reliability and ease project engineer-ing, production, installation and maintenance. Purchase and use of GIS should become simpler, delivery times shorter and service life longer. − Smaller dimensions that save resourc-es, provide more convenient access to the equipment and enable installa-tion in smaller buildings or containers. − Digital controllers and electronicmeasuring equipment that provide comprehensive monitoring, supervi-sion and control functions. − Higher continuous current and short-circuit current ratings.− Less use of SF 6 and reduction of SF 6emissions.Much electrical switchgear is found out in the open, so the electrical breakdown prop-erties of air have to be takeninto account in its design. As a result, switchgear installations can take up substantial real estate. Where space is costly or limited, or where the environ-ment is challenging, GIS is an ideal alter-native. In GIS equipment, switching is done inside a gas-filled sealed vessel. The gas has much better insulation properties than air, so equipment can be made a lot smaller. Substations located underground in cities, inside hydropow-er dams, in high-value real-estate areas or in containers could not be realized without GIS technology.GIS is suitable for use in harsh environ-ments such as deserts, high-altitude lo-cations or offshore oil platforms. Its lownoise levels and low electromagneticemissions allow operation in residentialareas or in sensitive industrial plants.GIS also improves the grid’s efficiency as it enables power to be transmittedat higher voltages closer to the loadcenters in cities.ABB’s new GIS products for 72.5 kV, 245 kV and 420 kV, launched in 2010, 2011 and 2012 respectively, address these trends. The entire family is built on common design principles and the family members share many common components.Compact and efficientThe new products mark a significanta dvance in footprint reduction – be it in terms of dimensions or use of raw mate-rial and SF 6.The new portfolio is based on advanced circuit breakers with small dimensions and small drives. The ELK-14 compact, 245 kV GIS features an advanced dou-ble-motion Auto-Puffer TM (self-blast) cir-cuit breaker. A single pole requires less than 900 J of stored energy to interrupt a short-circuit current of 50 kA. The ELK-14 compact has 43 percent less volume and weighs 2 tons less than the prede-cessor product ➔1. The result is a com-pact bay that fits into containers that are used for shipment or even as a perma-nent housing.The ELK-3 compact, 420 kV GIS fea-tures a new, single-interrupter puffer breaker with an excellent two-cycle per-formance at 63 kA/60 Hz and plenty of reserve for short-line faults and other duties. The ELK-3 compact circuit breaker uses just one interrupter where two interrupters in series and a larger drive were needed in the past. The sav-ings in dimensions and weight are sig-nificant ➔2.Title pictureABB’s new GIS products greatly speed up and simplify installation. The GIS ELK-3 compact product is shown here.GIS is suitable for harsh environments such as deserts, high-altitude loca-tions or offshore platforms.1 Elk-14 compact, 245 kV compared with its predecessor13Compact and reliable switchingSimplicityABB’s new GIS consists of a set of high-ly-standardized building blocks that can be configured to the specific user r equirements at a very late stage of the production process. This reducesdelivery time. Even at 420 kV, the GIS is equipped with integrated local control panels mounted directly on the steel sup-port carrying the bay. Instead of wiring the bay on-site to a distantcontrol panel, all the cabling is done at the factory in a controlled environment with automated testing facilities. Any wiring mistakes are corrected before the bay leaves the factory.Installation time nearly halvedThe new GIS designs enable complete wired bays to be shipped in containers or on flat racks. A typical 420 kV substa-tion now requires only 44 shipping units and 53 coupling steps compared with the 80 shipping units and 74 coupling steps of the predecessor product.On site, 420 kV bays are wheeled from the unloading platform into the building to their final destination. After leveling, coupling adjacent bays and connecting them to the substation control systems takes only a few hours. Before leaving the factory, bays are prefilled with SF 6 at a transport pressure slightly above1bar, which significantly reduces time and effort for on-site gas handling. Low-pressure aluminum die casting and 3-D finite-element stress calculations enable the design of enclosures with complex shapes that still meet pressur-ized vessel standards at high safety margins. The result is “skinny” enclo-sures that minimize the enclosed vol-ume and, thus, the SF 6 content. A good example is the ENK GIS type for 72.5 kV rated voltage that uses a mere 27 kg SF 6 per bay (for a typical double busbar bay with cable connections) – less than half that used by traditional designs. Or the ELK-14, which uses 115 kg SF 6, 32 kg less than the predecessor prod-uct.Best of both worlds Traditional GIS often uses single-phase enclosed designs for 245 kV. Although they would reduce complexity, three-phase enclosed GIS components for 245 kV are large and difficult to design. ELK-14 compact is innovative: All com-ponents are three-phase-enclosed but, instead of three-phase partition insula-tors, as used at 145 kV, it uses single-phase insulators. Together with skinny enclosures, ELK-14 is somewhere in between traditional single-phase and three-phase design and combines the best of the two approaches.GIS improves the grid’se fficiency as it enables power to be transmitted at higher voltages closer to the load centers in cities.The entire family is built on common design principles and the family members share many common components.2 Elk-3 compact, 420 kV compared with its predecessor14ABB review special reportIn all, installation time is cut by some 40 percent.Easy access operation Although there is little maintenancer equired, all relevant parts, such as drives, view ports, gas density sensors, gas filling valves and terminal blocks are easily accessible – thus shortening maintenance or repair times.A unique feature is that the drives and position indicators for disconnectors and grounding switches are locatedu nderneath the local control panel ➔3. The user can access the drives from the operator’s aisle for emergency manual operation with a hand crank or to lock them with a padlock. Access laddersor scaffolding is no longer required.B esides, drives are plug-in units and they can be easily pulled out of the c abinet for inspection or maintenance.C onvenient access to viewports, gas valves and monitors is provided by plat-forms and catwalks. These are an inte-gral part of the GIS and no longerr equire custom designs.Digital sensors and smart switchgearToday’s practice of measuring basicp arameters using inductive current transformers (C Ts) and voltage trans-formers (VTs) has parallels with the changeover from vinyl records to C Ds: Gone was the distortion created by ana-log reproduction as C Ds and optical links ensured low-cost, interference-free audio reproduction every time.C urrent and voltage measurement in substations is undergoing a similartransformation. The old problems caused by transient performance and saturation of C Ts, over/under-burden-ing, cable length or cross section and troublesome relay input impedance are being banished by the adoption of elec-tronic precision transducers for current(ECTs) and voltage (EVTs). These comewith digital interfaces and connect as easily as a C D player to protection r elays with digital inputs. Their stability, dynamic range and precision are out-standing – a single EC T provides both class 0.2 metering data and precision current data in the kiloampere range. Consequently, most of ABB’s GIS equip-ment is now available with compact EC Ts and EVTs employing Rogowski coils and capacitive voltage transducers[2]➔4. They connect to any relay with anIEC 61850-9-2-compatible digital opti-cal interface, eg, ABB’s Relion series. Although not yet commonly used, ECTsand EVTs, together with intelligent bay controllers, such as ABB’s REC670, and protection devices, form the basis of a digital control panel. Replacing bulky hardwired controls and a sizeable bind-er of schematics, a digital control panel has a network interface based on IEC 61850 data models and communi-cation protocols. The GIS bay is deliv-ered with an electronic capability de-scription in XML – ready to be loaded,The GIS consists of a set of highly-standardized build-ing blocks that can be configured to the specific user requirements at a very late stage ofproduction.3 Frontal access to drives (Elk-14 compact) 4Combined ECT/EVT for 420kV15Compact and reliable switching grate renewable energy sources andf ocuses on providing Denmark with green energy. Energinet.dk selected GIS technology for new 420 kV substationsto reduce space consumption and visu-al impact. A project currently underway is the con-struction of a new 400kV connection between Kassø, near Aabenraa, and Tjele. A 400 kV double-circuit line, in-stalled on tubular towers designed to blend into the landscape, will reinforce and renew Jut-land’s grid. The line will replace the approximately 45-year-old sin-gle-circuit line op-erating on the section today. The project received funding from theEuropean Union’s trans-European ener-gy networks program. Part of the project is Revsing substa-tion. It forms a node with other 420 kV connections along the line. Energinet.dk selected the ELK-3 compact based on a comprehensive list of selection criteria that reflect the company’s demands.Decisive features were the low SF 6 gas content, the compactness (resulting in a small building, crane and basement) and the short installation time.browsed and integrated into the substa-tion automation system ➔5.As part of the new portfolio, ABB’s engi-neers have developed a comprehensive but simple-to-operate gas monitoring sys-tem called modular switchgear monitoring (MSM) that can be added to conventional controls or digital control panels ➔6.MSM’s main task is to detect even small leaks at rates as low as 0.5 percent per year with a set of linear prediction filters. The filters are tuned so as to distinguish leaks from natural density variations stemming from inhomogeneous temper-ature distributions in gas compart-ments. Unlike traditional gas density monitors, which would flag an alarm first when 5 to 10 percent of the SF 6 had already leaked, MSM alerts the operator when as little as 1 to 2 percent of the gas has escaped.Case study: Revsing substationEnerginet.dk owns and operates the transmission grid and the natural gassystem in Denmark. The company builds intelligent infrastructure to inte-Revsing substation will be commis-sioned in 2013. The new line is sched-uled to commence operation in 2014.Though established more than 40 years ago, GIS technology is still rapidly de-veloping. It continues to serve as a key element in growing grids. The installa-tion of GIS is becoming faster and the operation easier. C ompact designs useless raw materials and SF 6. Safeguard-ed by digital controls and monitoring functions, GIS technology is steadilyi mproving its excellent environmental compatibility.Hans-Dieter Schlemper ABB Power Products, High Voltage Products Zurich, Switzerland****************************.com References[1] Holaus, W., Stucki, F. “Breaking news:High-voltage switchgear to power China.”ABB Review Special Report: Dancing with the Dragon , pp. 33 – 37. (2008).[2] Schlemper H.-D et al., “Test and application ofnon-conventional multi-purpose voltage andcurrent transducers” Cigré, Paris, 2004, paperA3-108.6 Gas density monitoring system, MSMOn site, 420 kV bays arewheeled from the unloading platform into the building to their final destination.5 Schematic diagram of a digital control system for a GIS bay。

NX3008CBKV,115;中文规格书,Datasheet资料

1.Product profile1.1General descriptionComplementary N/P-channel enhancement mode Field-Effect Transistor (FET) in an ultra small and flat lead SOT666 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.1.2Features and benefits⏹Low threshold voltage ⏹Very fast switching⏹Trench MOSFET technology⏹ESD protection up to 2 kV ⏹AEC-Q101 qualified1.3Applications⏹Level shifter⏹Power supply converter⏹Load switch ⏹Switching circuits1.4Quick reference data[1]Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm 2.NX3008CBKV30 / 30 V, 400 / 220 mA N/P-channel Trench MOSFETRev. 1 — 29 July 2011Product data sheetTable 1.Quick reference data Symbol ParameterConditions Min Typ Max Unit TR2 (P-channel)V DS drain-source voltage T j =25°C---30V V GS gate-source voltage -8-8V I D drain current V GS =-4.5V; T amb =25°C [1]---220mA TR1 (N-channel)V DS drain-source voltage T j =25°C--30V V GS gate-source voltage -8-8V I D drain currentV GS =4.5V;T amb =25°C [1]--400mA TR1 (N-channel), Static characteristicsR DSondrain-source on-state resistanceV GS =4.5V;I D =350mA; T j =25°C-11.4ΩTR2 (P-channel), Static characteristics R DSondrain-source on-state resistanceV GS =-4.5V; I D =-200mA; T j =25°C- 2.8 4.1Ω2.Pinning information3.Ordering information4.Marking[1]% = placeholder for manufacturing site code.Table 2.Pinning information Pin Symbol Description Simplified outlineGraphic symbol1S1source TR1SOT666 (SOT666)2G1gate TR13D2drain TR24S2source TR25G2gate TR26D1drain TR1123456017aaa262Table 3.Ordering informationType numberPackage NameDescriptionVersion NX3008CBKVSOT666plastic surface-mounted package; 6 leadsSOT666Table 4.Marking codesType number Marking code [1]NX3008CBKVAC5.Limiting valuesTable 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit TR2 (P-channel)V DS drain-source voltage T j=25°C--30VV GS gate-source voltage-88VI D drain current V GS=-4.5V; T amb=25°C[1]--220mAV GS=-4.5V; T amb=100°C[1]--140mA I DM peak drain current T amb=25°C; single pulse; t p≤10µs--0.9AP tot total power dissipation T amb=25°C[2]-330mW[1]-390mWT sp=25°C-1090mW TR1 (N-channel)V DS drain-source voltage T j=25°C-30VV GS gate-source voltage-88VI D drain current V GS=4.5V;T amb=25°C[1]-400mAV GS=4.5V;T amb=100°C[1]-260mA I DM peak drain current T amb=25°C; single pulse; t p≤10µs- 1.6AP tot total power dissipation T amb=25°C[2]-330mW[1]-390mWT sp=25°C-1090mW Per deviceP tot total power dissipation T amb=25°C[2]-500mW T j junction temperature-55150°C T amb ambient temperature-55150°C T stg storage temperature-65150°C TR1 (N-channel), Source-drain diodeI S source current T amb=25°C[1]-400mA TR2 (P-channel), Source-drain diodeI S source current T amb=25°C[1]--220mA TR1 N-channel), ESD maximum ratingV ESD electrostatic discharge voltage HBM[3]-2000V TR2 (P-channel), ESD maximum ratingV ESD electrostatic discharge voltage HBM[3]-2000V[1]Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm2.[2]Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper; tin-plated and standard footprint.[3]Measured between all pins.6.Thermal characteristicsTable 6.Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit Per deviceR th(j-a)thermal resistance from junction to ambient in free air[1]--250K/W TR1 (N-channel)R th(j-a)thermal resistance from junction to ambient in free air[1]-330380K/W[2]-280320K/W R th(j-sp)thermal resistance from junction to solder point--115K/W TR2 (P-channel)R th(j-a)thermal resistance from junction to ambient in free air[1]-330380K/W[2]-280320K/W R th(j-sp)thermal resistance from junction to solder point--115K/W[1]Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper; tin-plated and standard footprint.[2]Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm2.7.CharacteristicsTable 7.CharacteristicsSymbol Parameter Conditions Min Typ Max Unit TR2 (P-channel), Static characteristicsV(BR)DSS drain-sourcebreakdown voltageI D=-250µA; V GS=0V; T j=25°C-30--VV GSth gate-source thresholdvoltageI D=-250µA; V DS=V GS; T j=25°C-0.6-0.9-1.1VI DSS drain leakage current V DS=-30V; V GS=0V; T j=25°C---1µAV DS=-30V; V GS=0V; T j=150°C---10µA I GSS gate leakage current V GS=8V;V DS=0V; T j=25°C--0.2-1µAV GS=-8V;V DS=0V; T j=25°C--0.2-1µAV GS=4.5V;V DS=0V; T j=25°C--10-nAV GS=-4.5V; V DS=0V;T j=25°C--10-nAV GS=2.5V;V DS=0V; T j=25°C--1-nAV GS=-2.5V; V DS=0V;T j=25°C--1-nAR DSon drain-source on-stateresistance V GS=-4.5V; I D=-200mA; T j=25°C- 2.8 4.1ΩV GS=-2.5V; I D=-10mA; T j=25°C- 5.3 6.5ΩV GS=-4.5V; I D=-200mA; T j=150°C- 5.37.8Ωg fs transfer conductance V DS=-10V; I D=-200mA; T j=25°C-160-mS TR1 (N-channel), Static characteristicsV(BR)DSS drain-sourcebreakdown voltageI D=250µA; V GS=0V; T j=25°C30--VV GSth gate-source thresholdvoltageI D=250µA; V DS=V GS; T j=25°C0.60.9 1.1V I DSS drain leakage current V DS=30V;V GS=0V; T j=25°C--1µAV DS=30V;V GS=0V; T j=150°C--10µA I GSS gate leakage current V GS=8V;V DS=0V; T j=25°C-0.21µAV GS=-8V;V DS=0V; T j=25°C-0.21µAV GS=4.5V;V DS=0V; T j=25°C-10-nAV GS=-4.5V; V DS=0V;T j=25°C-10-nAV GS=2.5V;V DS=0V; T j=25°C-1-nAV GS=-2.5V; V DS=0V;T j=25°C-1-nAR DSon drain-source on-stateresistance V GS=4.5V;I D=350mA; T j=25°C-1 1.4ΩV GS=4.5V;I D=350mA; T j=150°C- 1.8 2.5ΩV GS=2.5V;I D=200mA; T j=150°C- 1.4 2.1ΩV GS=1.8V;I D=10mA; T j=25°C-2 2.8Ωg fs transfer conductance V DS=10V;I D=350mA; T j=25°C-310-mS TR1 (N-channel), Dynamic characteristicsQ G(tot)total gate charge V DS=15V;I D=400mA; V GS=4.5V;T j=25°C -0.520.68nCQ GS gate-source charge-0.17-nC Q GD gate-drain charge-0.08-nCC iss input capacitance V DS =15V;f =1MHz;V GS =0V; T j =25°C-3450pF C oss output capacitance - 6.5-pF C rss reverse transfer capacitance - 2.2-pF t d(on)turn-on delay time V DS =20V;R L =250Ω; V GS =4.5V; R G(ext)=6Ω; T j =25°C -1530ns t r rise time-11-ns t d(off)turn-off delay time -69138ns t f fall time -19-ns TR2 (P-channel), Dynamic characteristicsQ G(tot)total gate charge V DS =-15V; I D =-200mA; V GS =-4.5V; T j =25°C-0.550.72nC Q GS gate-source charge -0.23-nC Q GD gate-drain charge -0.09-nC C iss input capacitance V DS =-15V; f =1MHz; V GS =0V; T j =25°C-3146pF C oss output capacitance - 6.5-pF C rss reverse transfer capacitance - 2.3-pF t d(on)turn-on delay time V DS =-20V; R L =250Ω; V GS =-4.5V; R G(ext)=6Ω; T j =25°C-1938ns t r rise time-30-ns t d(off)turn-off delay time -65130ns t f fall time-38-ns TR2 (P-channel), Source-drain diode characteristics V SD source-drain voltage I S =-200mA; V GS =0V; T j =25°C -0.47-0.88-1.2V TR1 (N-channel), Source-drain diode characteristicsV SDsource-drain voltageI S =350mA;V GS =0V;T j =25°C 0.470.851.2VTable 7.Characteristics …continuedSymbol Parameter ConditionsMin Typ Max Unit分销商库存信息: NXPNX3008CBKV,115。

火灾报警联动控制系统产品手册

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目录1、JTY-LZ-ZM991智能离子感烟火灾探测器2、JTY-GD-ZM992智能光电感烟火灾探测器3、JTW-BD-ZM995智能感温火灾探测器4、JTY-GD-882光电感烟火灾探测器5、JTW-BD-885感温火灾探测器6、JTYJ-GD-2630/B 独立式感烟火灾探测报警器7、JTYJ-GD-2690/B 独立式感烟火灾探测报警器8、BAEM1224S型红外光束感烟火灾探测器9、AEC2361a 可燃气体探测报警器10、AEC2371a 可燃气体探测报警器11、J-SAP-M-SB8304 编址手动火灾报警按钮12、J-SAP-M-SB8304/H 编址消火栓报警按钮13、SM8301 输入模块14、KM8302 输入/输出模块15、KM8302B 切换模块16、DB8307 总线短路保护器17、M902M 探测器接口模块18、SG8306A 编址声光警报器19、ZH8310A 现场转换盒20、SSM24-6 警铃21、SG8306 声光警报器22、CH8504 放气指示灯23、CH8505 紧急启停按钮24、CH8507 手/自动转换盒25、CH8316/20/48/72 路接线端子箱26、CH8907/6/12/20模块箱27、FS-100 火灾显示盘28、CH8605 多线联动控制盘29、CH8601 总线手动控制盘30、JB-QB-CH8000 火灾报警控制器（联动型）31、JB-QB-CH8800 火灾报警控制器（联动型）32、JB-QB-CH8000/S 火灾报警控制器33、JB-MH-CH8500 气体灭火控制器34、JB-QB-CH8800 气体灭火控制器35、CH8909 CRT火灾彩色平面图形显示系统36、GB9242 消防广播主机37、DH9251 多线火警电话主机38、DH9261 总线制火警电话主机39、CH9200 壁挂广播通讯柜1、JTY-LZ-ZM991智能离子感烟火灾探测器功能描述及技术指标◆适用于发生火灾后产生大量的烟和少量热的场所，如宾馆、饭店、办公楼、机房、医院、学校等各种室内场所。

Schneider Electric XTPB和XTPR系列手动电机保护器说明书

1D r i v e s a n d M o t o r sManual Motor Protectorsl Visible Trip Indicationl Class 10 Overload Protectionl M anual Motor Protectors up to 25A l U L 508 Group Motor and Type E Compliant XTPB and XTPR SeriesManual Motor Protectors (MMPs) features a pushbutton or rotary ON/OFF manual disconnect, Class 10 adjustable bimetallic overload relay and fixed magnetic short circuit trip capability in one compact unit. The Frame B size (45 mm) for motors has FLA ratings up to 32A. The XTPB and XTPR MMPs are UL Listed under UL 508 as Manual Motor Protectors. They provide an economical solution for applications requiring simple manual starting and stopping of motors. When used as an MMP , they are typically installed in an enclosure. Many enclosures are offered as accessories for the MMPs. Separate short-circuit protective devices, such as circuit breakers or fuses, are wired ahead of the MMPs. The short-circuit protective device should be sized per the NEC code and should not exceed 400% of the maximumFLA dial setting of the MMP . A Group Motor Installation can be defined as more than one motor circuit protected by a single set of fuses or circuit breaker on a motor branch circuit. This eliminates the need for individual fuses or circuit breakers for each motor circuit. Substantial component cost savings,panel space savings and reduced wiringinstallation time can be achieved in GroupMotor Installations. The MMPs are tested and listed for group installation. If remoteoperation is required, a magnetic contactorcan be wired in series with the MMP . Manual Motor Protectors are selected based on theoverload current range required for a given motor. This current range is determined from the motor Full Load Ampere rating and Motor Service Factor usually found on the motor nameplate. For motors with service factors less than 1.15, multiply the motor FLA by 0.90 to select appropriate MMP . Example: For motor having FLA of 6.4 A and service factor of 1.0 (6.4 A x 0.90 = 5.76 A), select Model Number: XTPB6P3BC1SPECIFICATIONS (XTPB, XTPR)GENERALStandards: IEC/EN 60947, VDE 0660, UL 508, CSA C 22.2 No. 14All models shown smaller than actual size.XTPR6P3BC1XTPB2P5BC1XTPBXENAS65IEC EN 60947cccClimatic Proofing: Damp heat, constant,to IEC 60068-2-78; damp heat, cyclic, to IEC 60068-2-30Ambient Temperature °C (°F):Storage: -25 to 80 (-13 to 176) Open: -25 to 55 (-13 to 131) Enclosed: -25 to 40 (-13 to 104)Direction of Incoming Supply: As requiredDegree of Protection Device: IP20 Terminals: IP00Protection Against Direct Contact: Finger- and back-of-hand proof Shock Resistance Half-Sinusoidal Shock 10 mS to IEC 60068-2-27 (g): 25 Altitude (m), Maximum: 2000Terminal Capacity:Solid (mm 2): 1 x (1 to 6) 2 x (1 to 6) Flexible with Ferrule to DIN 46228 (mm 2): 1 x (1 to 6) 2 x (1 to 6) S olid or Stranded: 18 to 10 (AWG)TERMINAL SCREw TIGHTENING TORqUEMain Cable, Nm: 1.7 Main Cable, lb-in: 15.0Control Circuit Cable, Nm: 1 Control Circuit Cable, lb-in: 8.9MAIN CONTACTSRated Impulse withstand Voltage (Uimp), Vac: 6000Overvoltage Category/Pollution Degree: III/32XTPB PUSHBUTTON MANUAL MOTOR PROTECTORMAXIMUM MOTOR RATINGSMAXiMuM hP RATiNg P (hP) MAXiMuM kW RATiNg AC-3 P (kW) uL 508/CSA C 22.2 No. 14 3-PhASE 3-PhASE 220 To 380 To 660 ToModEL No. 240V 415V 440V 500V 690V 200V 240V 480V 600VXTPB001BC1 1 0.63 to 1 14 0.12 0.25 0.25 0.37 0.55 * * 1⁄2 1⁄2 XTPB1P6BC1 1.6 1 to 1.6 22 0.25 0.55 0.55 0.75 1.1 * * 3⁄4 1 XTPB2P5BC1 2.5 1.6 to 2.5 35 0.37 0.75 1.1 1.1 1.5 1⁄2 1⁄2 1 11⁄2 XTPB004BC1 4 2.5 to 4 56 0.75 1.5 1.5 2.2 3 1 1 2 3 XTPB6P3BC1 6.3 4 to 6.3 88 1.1 2.2 3 3 4 11⁄2 11⁄2 3 5XTPB010BC1 10 6.3 to 10 140 2.2 4 4 4 7.5 3 3 71⁄2 10 XTPB016BC1 16 10 to 16 224 4 7.5 9 9 12.5 3 5 10 10XTPR ROTARy MANUAL MOTOR PROTECTORS wITH SCREw TERMINALSXTPR001BC1 1 0.63 to 1 14 0.12 0.25 0.25 0.37 0.55 * * 1⁄2 1⁄2 XTPR1P6BC1 1.6 1 to 1.6 22 0.25 0.55 0.55 0.75 1.1 * * 3⁄4 1 XTPR2P5BC1 2.5 1.6 to 2.5 35 0.37 0.75 1.1 1.1 1.5 1⁄2 1⁄2 1 11⁄2 XTPR004BC1 4 2.5 to 4 56 0.75 1.5 1.5 2.2 3 1 1 2 3 XTPR6P3BC1 6.3 4 to 6.3 88 1.1 2.2 3 3 4 11⁄2 11⁄2 3 5 XTPR010BC1 10 6.3 to 10 140 2.2 4 4 4 7.5 3 3 71⁄2 10 XTPR016BC1 16 10 to 16 224 4 7.5 9 9 12.5 3 5 10 10 XTPR020BC1 20 16 to 20 280 5.5 9 11 12.5 15 5 5 10 15 XTPR025BC125 20 to 25 350 5.512.512.515 22 5 71⁄2 15 20RATEduNiNTERRuPTEd CuRRENT: iu = iE (AMPS) FLA AdjuST. RANgE / oVERLoAd RELEASE iR (AMPS)ShoRT CiRCuiT RELEASE iRM * In this range, calculate motor rating according to rated current. Specified values to NEC Table 430.250Notes: Single-phasing sensitivity to IEC/EN 60947-4-1, VDE 0660 Part 102. Can be snap-fit to IEC/EN 60715 top-hat (DIN) with 7.5 or 15 mm height.Service Factor (SF) — Setting Ir of current scale in dependence of load factor: SF = 1.15 -> Ir = 1 x In mot SF = 1 -> Ir = 0.9 x In motRated Operational Voltage (Ue), Vac: 690Rated Uninterrupted Current = Rated Operational Current (Iu = Ie) in Amperes:X TPB: 25 or current setting of the overcurrent releaseXTPR: 32 or current setting of the overcurrent releaseRated Frequency, Hz: 40 to 60Current Heat Loss (3-Pole at Operating Temperature), w: 6Lifespan, Mechanical (ops): XTPB: 50,000 XTPR: 100,000 Lifespan, Electrical (AC-3 at 400V) (ops): XTPB: 50,000 XTPR: 100,000Maximum Operating Frequency, Operations/hr: XTPB: 25 XTPR: 40Short-Circuit Rating, DC (kA): 60 MOTOR SwITCHING CAPACITy AC-3 (up to 690V) in Amperes: XTPB: 25 XTPR: 32DC-5 (up to 250V) in Amperes: XTPB: 25XTPR: 25 (3 contacts in series)RELEASESOverload Release SettingRange (x Iu): 0.6 to 1.0Fixed Short-Circuit Release (x Iu): 14 Short-Circuit Release Tolerance: ± 20% Phase-Failure Sensitivity:IEC/EN 60947-1-1, VDE 0660Part 102 TEMPERATURE COMPENSATIONIEC/EN 60947, VDE 0660, °C (°F):-5 to 40 (23 to 104)Operating Range °C (°F): -25 to 55 (-13 to 131) Temperature Compensation Residual Error for T > 20°C, %/K: < =0.25SPECIFICATIONS FOR (AUXILIARy CONTACTS)XTPAXSA Rated Impulse withstand Voltage, Uimp (Vac): 6000Overvoltage Category/Pollution Degree: III/3Rated Operational VoltageUe (Vac): 500Ue (Vdc): 250Safe Isolation to Vde 0106 Part 101 and Part 101/A1 Between Auxiliary Contacts and Main Contacts (Vac): 690RATED OPERATIONAL CURRENT AC-15 220 to 240V, Ie (A): 3.5 380 to 415V, Ie (A): 2440 to 500V, Ie (A): 1 DC-13 L/R < 100 ms 24V, Ie (A): 260V, Ie (A): 1.5 110V, Ie (A): 1 220V, Ie (A): 0.25LIFE SPAN Mechanical, Operations (x 106): 0.1 Electrical, Operations (x 106): 0.05 Contact Reliability (@ Ue = 24 Vdc, Umin – 17V, Imin = 5.4 mA, FaultProbability: < 10-8 < 1 fault at 1 x 108 operations Positively Driven Contacts to ZH 1/457: Yes SHORT-CIRCUIT RATING wITHOUTwELDING Fuseless: FAZ-B4/1-HIFuse (A gG/gL): 10TERMINAL CAPACITy Solid or Flexible Conductor with Ferrule (mm 2): 0.75–2.5Solid or Stranded: 18 – 14 (AWG)3D r i v e sa n dM o t o r sTo OrderiEC MANuAL MoToR PRoTECToR PuShBuTToN ModEL No. dESCRiPTioN XTPB001BC1 MMP PB frame B class 10, 0.63 to 1 A XTPB1P6BC1 MMP PB frame B class 10, 1 to 1.6 A XTPB2P5BC1 MMP PB frame B class 10, 1.6 to 2.5 A XTPB004BC1 MMP PB frame B class 10, 2.5 to 4 A XTPB6P3BC1 MMP PB frame B class 10, 4 to 6.3 A XTPB010BC1 MMP PB frame B class 10, 6.3 to 10 A XTPB016BC1 MMP PB frame B class 10, 10 to 16 A RoTARy XTPR001BC1 MMP rotary frame B class 10, 0.63 to 1 A XTPR1P6BC1 MMP rotary frame B class 10, 1 to 1.6 A XTPR2P5BC1 MMP rotary frame B class 10, 1.6 to 2.5 A XTPR004BC1 MMP rotary frame B class 10, 2.5 to 4 A XTPR6P3BC1 MMP rotary frame B class 10, 4 to 6.3 A XTPR010BC1 MMP rotary frame B class 10, 6.3 to 10 A XTPR016BC1 MMP rotary frame B class 10, 6.3 to 10 A XTPR020BC1 MMP rotary frame B class 10, 16 to 20 A XTPR025BC1 MMP rotary frame B class 10, 20 to 25 A MANuAL MoToR PRoTECToR ACCESSoRiES ModEL No. dESCRiPTioN XTPAXCLkA2 3-Ph commoning link A, 2 devices frame B XTPAXCLkA3 3-Ph commoning link A, 3 devices frame B XTPAXiT Incoming terminal XTPAXSA11 Side auxiliary contact 1NO 1NC XTPAXSA12 Side auxiliary contact 1NO 2NC XTPBXENAS41 MMP PB accessory enclosure-N.A. surface IP41 XTPBXENAS65 MMP PB accessory enclosure-N.A. surface IP65Comes complete with operator’s manual.Ordering Example: XTPB6P3BC1, manual motor protector 4 to 6.3 A, XTPAXSA11, side auxiliary contact.XTPBXENAXTPAXiTXTPAXSA11All models shownlarger than actual size.。

GXU硬件用户手册 - 中文

未经 Schneider Electric 明确书面许可，不得以任何形式、通过任何电子或机械手段（包括影印）复制本文档的任何部分。
在安装和使用本产品时，必须遵守国家、地区和当地的所有相关的安全法规。出于安全方面的考虑和为了帮助确保符合归档的系统数据，只有制造商才能对各个组件进行维修。
当设备用于具有技术安全要求的应用场合时，必须遵守有关的使用说明。
警告
失控请谨慎考虑机器控制系统设计中控制路径的可能故障模式，例如：
可能的背景灯故障，无法预料的链路传输延迟或故障，操作人员无法控制机器，操作人员在控制机器时操作错误。为诸如紧急停止和超行程停止等关键控制功能发生路径故障期间或之后提供一个能达到安全状态的方法。为关键控制功能提供单独或冗余的控制路径。开始使用前，逐个彻底测试面板的每个实施以确认其能正常运行。不遵循上述说明可能导致人员伤亡或设备损坏。
编辑模式外设eio000000207401201519运行模式外设usb接口20eio0000002074012015运行模式外设串行通讯eio000000207401201521附件串口项usb接口部件软件产品编号产品名称说明xbtz9008电缆hmigxurs485连接到modiconm221m241m251m218m238m258m340hmigxurs485连接到atv驱动器xbtz9018hmigxurs485连接到microtwidoplcxbtzg9722电缆hmigxurs422连接到rs422设备端子块产品编号产品名称说明供应商xbtzg9772电缆hmigxurs232连接到plc系列的链路单元mitsubishixbtzg9774hmigxurs232连接到plc系列的cpuxbtzg9775hmigxurs422连接到plcfx系列的cpuxbtzg9740xbtzg9731hmigxurs232连接到plcsysmac链路系列omron产品名称产品编号说明usb面板安装加长电缆xbtzgusb用于扩展防水机柜上的usb1主机接口usb转换电缆hmizursusb1主机接口转换到rs232miniusb面板安装加长电缆hmizsusbb用于扩展防水机柜上的usb2主机接口usb数据传输电缆bmxxcausbh018将面板连接到pcusb终端口产品名称说明vijeodesignerbasic用于创建hmi设备工程数据的软件

伯恩索马特电气焊接金属，银含量矿核无铅焊线说明书

SAFETY DATA SHEET1. IdentificationProduct identifierBernzOmatic Electrical Solder, Silver bearing rosin core lead-free solder Other means of identificationSDS number WC037Recommended use Soldering electrical connections Recommended restrictions None known.Manufacturer/Importer/Supplier/Distributor informationManufacturer/SupplierWorthington Cylinder Corporation Address 300 E. Breed St., Chilton, WI 53014United States Contact personKurt GoomeyE-mail address Telephone number 1-920-849-1740Emergency telephone number1-703-527-3887 International / CHEMTREC 1-800-424-9300 Domestic2. Hazard(s) identificationNot classified.Physical hazards Not classified.Health hazards Category 1Hazardous to the aquatic environment, acute hazard Environmental hazards Not classified.OSHA defined hazards Label elementsNone.Hazard symbol Signal word None.Hazard statement Very toxic to aquatic life.Precautionary statementPreventionAvoid release to the environment.Response Collect spillage.Storage Store away from incompatible materials.DisposalDispose of contents/container in accordance with local/regional/national/international regulations.Hazard(s) not otherwise classified (HNOC)None known.3. Composition/information on ingredientsMixtures7440-31-590 - 100Tin CAS number %Chemical name 7440-50-8 1 - 10Copper 65997-06-0< 1Rosin 7440-22-4< 1SilverComposition commentsAll concentrations are in percent by weight unless ingredient is a gas. Gas concentrations are in percent by volume.84711534. First-aid measuresInhalation Immediately remove from further exposure. Get immediate medical assistance. For thoseproviding assistance, avoid exposure to yourself or others. Use adequate respiratory protection.Give supplemental oxygen, if available. If breathing has stopped, assist ventilation with amechanical device or use mouth-to-mouth resuscitation.Skin contact Remove contaminated clothes and rinse skin thoroughly with water for at least 15 minutes. If skinrash or an allergic skin reaction develops, get medical attention.Eye contact Rinse immediately with plenty of water for at least 15 minutes. Remove any contact lenses. Getmedical attention if irritation develops or persists.Ingestion Immediately rinse mouth and drink a cupful of water. Never give anything by mouth to a victim whois unconscious or is having convulsions. Only induce vomiting at the instruction of medicalpersonnel. Get medical attention immediately.Most importantsymptoms/effects, acute and delayed Elevated temperatures or mechanical action may form dust and fumes which may be irritating to the eye, mucous membranes and respiratory tract. Symptoms may include stinging, tearing, redness, swelling, and blurred vision. Symptoms may include redness, edema, drying, defatting and cracking of the skin. Symptoms may include coughing, difficulty breathing and shortness of breath. Overexposure to copper fumes may cause fever, chills, congestion and headaches.Indication of immediate medical attention and special treatment needed Treat symptomatically. Exposure may aggravate pre-existing respiratory disorders. Symptoms may be delayed.General information Show this safety data sheet to the doctor in attendance.5. Fire-fighting measuresSuitable extinguishing media Extinguish with foam, carbon dioxide or dry powder. Unsuitable extinguishingmediaDo not use water or halogenated extinguishing media.Specific hazards arising fromthe chemicalFire or high temperatures create: Metal oxides.Special protective equipmentand precautions for firefightersUse protective equipment appropriate for surrounding materials.Fire-fighting equipment/instructions Self-contained breathing apparatus and full protective clothing must be worn in case of fire. Move containers from fire area if you can do it without risk.Specific methods Use standard firefighting procedures and consider the hazards of other involved materials. General fire hazards Solid metal is not flammable; however, finely divided metallic dust or powder may form anexplosive mixture with air.6. Accidental release measuresPersonal precautions, protective equipment and emergency procedures Keep unnecessary personnel away. Avoid inhalation of dust from the spilled material. Do not touch damaged containers or spilled material unless wearing appropriate protective clothing. Wear protective clothing as described in Section 8 of this SDS.Methods and materials for containment and cleaning up Stop leak if you can do so without risk. For a dry material spill, use a HEPA (high efficiency particle air) vacuum to collect material and place in a sealable container for disposal. Avoid dust formation. Recover and recycle, if practical. Keep out of water supply. Local authorities should be advised if significant spillages cannot be contained.Environmental precautions Prevent further leakage or spillage if safe to do so. Do not contaminate water.If release occurs in the U.S. and is reportable under CERCLA Section 103, notify the NationalResponse Center at (800)424-8802 (USA) or (202)426-2675 (USA).7. Handling and storagePrecautions for safe handling Wear appropriate personal protective equipment (See Section 8). Keep formation of airborne duststo a minimum. Provide appropriate exhaust ventilation at places where dust is formed. Avoidinhalation of dust and fumes. Avoid contact with skin and eyes. Do not get this material onclothing. Do not eat, drink or smoke when using the product. Wash thoroughly after handling.Avoid release to the environment.Any surface that comes in contact with molten metal must be preheated or specially coated andrust free. Inadvertent contaminants to product such as moisture, ice, snow, grease, or oil cancause an explosion when charged to a molten metal bath or metal furnace (preheating metal willremove moisture from product).Conditions for safe storage, including any incompatibilities Store in tightly closed original container in a dry, cool and well-ventilated place. Store in a closed container away from incompatible materials. Keep out of reach of children. Keep away from food, drink and animal feedingstuffs.8. Exposure controls/personal protectionOccupational exposure limitsUS. OSHA Table Z-1 Limits for Air Contaminants (29 CFR 1910.1000)Value Type Form ComponentsPEL 1 mg/m3Dust and mist.Copper (CAS 7440-50-8)0.1 mg/m3Fume.PEL 0.01 mg/m3Silver (CAS 7440-22-4)PEL2 mg/m3Tin (CAS 7440-31-5)US. ACGIH Threshold Limit Values Value Type FormComponentsTWA 1 mg/m3Dust and mist.Copper (CAS 7440-50-8)0.2 mg/m3Fume.TWA 0.1 mg/m3Dust and fume.Silver (CAS 7440-22-4)TWA2 mg/m3Tin (CAS 7440-31-5)US. NIOSH: Pocket Guide to Chemical Hazards Value Type Form ComponentsTWA 1 mg/m3Dust and mist.Copper (CAS 7440-50-8)TWA 0.01 mg/m3Dust.Silver (CAS 7440-22-4)TWA2 mg/m3Tin (CAS 7440-31-5)Biological limit values No biological exposure limits noted for the ingredient(s).Exposure guidelines No exposure standards allocated.Appropriate engineering controlsProvide adequate ventilation. Observe Occupational Exposure Limits and minimize the risk of inhalation of dust. Keep melting/soldering temperatures as low as possible to minimize the generation of fume. Shower, hand and eye washing facilities near the workplace are recommended.Individual protection measures, such as personal protective equipmentEye/face protectionWear safety glasses with side shields (or goggles). Wear a face shield when working with molten material.Skin protectionHand protectionWhen handling hot material, use heat resistant gloves.OtherChemical resistant clothing is recommended. Heat resistant/insulated gloves and clothing are recommended when working with molten material.Respiratory protectionUse a respirator when local exhaust or ventilation is not adequate to keep exposures below the OEL. In a confined space a supplied respirator may be required. Selection and use of respiratory protective equipment should be in accordance with OSHA General Industry Standard 29 CFR 1910.134; or in Canada with CSA Standard Z94.4. Use a NIOSH/MSHA approved respirator if there is a risk of exposure to dust/fume at levels exceeding the exposure limits.Thermal hazards Wear appropriate thermal protective clothing, when necessary.General hygiene considerationsAlways observe good personal hygiene measures, such as washing after handling the material and before eating, drinking, and/or smoking. Routinely wash work clothing and protective equipment to remove contaminants.9. Physical and chemical propertiesAppearanceSilver to silver-gray metallic metal.Physical state Solid.Form Solid.Color Silver to gray.OdorOdorless.Odor threshold Not available.pHNot applicable Melting point/freezing point Not available.Initial boiling point and boiling range 440.96 - 482 °F (227.2 - 250 °C)Flash pointNot available.Evaporation rate Not available.Flammability (solid, gas)Not available.Upper/lower flammability or explosive limitsFlammability limit - lower(%)Not available.Flammability limit - upper(%)Not available.Vapor pressure Not applicableVapor density Not available.Relative density7.38Solubility(ies)Solubility (water)Not solublePartition coefficient(n-octanol/water)Not available.Auto-ignition temperature Not available.Decomposition temperature Not available.Viscosity Not applicable10. Stability and reactivityReactivity The product is stable and non-reactive under normal conditions of use, storage and transport. Chemical stability Material is stable under normal conditions.Possibility of hazardousreactionsHazardous polymerization does not occur.Conditions to avoid Contact with incompatible materials. Avoid molten metal contact with water.Incompatible materials Chlorine. Turpentine. Magnesium. Acetylene Gas.Hazardous decompositionproductsToxic metal oxides are emitted when heated above the melting point.11. Toxicological informationInformation on likely routes of exposureIngestion Ingestion of dusts generated during working operations may cause nausea and vomiting. Copperpoisoning can result in hemolytic anemia and kidney, liver and spleen damage.Inhalation May cause respiratory tract irritation. Lung damage and possible pulmonary edema can resultfrom dust exposure. Inhalation of powder or fumes may cause metal fume fever.Skin contact May cause skin irritation. Hot or molten material may produce thermal burns.Eye contact Elevated temperatures or mechanical action may form dust and fumes which may be irritating tothe eyes.Symptoms related to the physical, chemical and toxicological characteristics Elevated temperatures or mechanical action may form dust and fumes which may be irritating to the eye, mucous membranes and respiratory tract. Contact with molten material may cause thermal burns. Symptoms may include stinging, tearing, redness, swelling, and blurred vision. Symptoms may include redness, edema, drying, defatting and cracking of the skin. Symptoms may include coughing, difficulty breathing and shortness of breath. Overexposure to copper fumes may cause fever, chills, congestion and headaches.Information on toxicological effectsAcute toxicity High concentrations of freshly formed fumes/dusts of metal oxides can produce symptoms ofmetal fume fever. When heated, the vapors/fumes given off may cause respiratory tract irritation.Overexposure of Tin can cause irritation of the eyes, skin, mucous membranes, and respiratorysystem. Acute overexposure to Copper dust/fume can cause irritation of the eyes, nose, throat,and skin and under severe fume overexposure can cause metal fume fever with flu-like symptomssuch as sweet metal taste, dry throat, coughing, fever and chills, tight chest, dyspnea, headache,blurred vision, back pain, nausea, vomiting, fatigue. Symptoms usually disappear within 24 hours.Copper may cause skin and hair discoloration. Inhalation of copper dusts may change the gumsand mucous lining of the mouth which is generally attributable to localized tissue effect rather thangeneral toxicity.Test ResultsComponentsSpecies Silver (CAS 7440-22-4)LD50Rat Oral Acute > 5000 mg/kgSkin corrosion/irritation Not classified.Serious eye damage/eye irritationElevated temperatures or mechanical action may form dust and fumes which may be irritating to the eye.Respiratory or skin sensitizationRespiratory sensitizationNot classified.Skin sensitization No sensitizing effects known.Germ cell mutagenicity Not classified.CarcinogenicityNot classifiable as to carcinogenicity to humans.OSHA Specifically Regulated Substances (29 CFR 1910.1001-1050)Not listed.Reproductive toxicityNot classified.Specific target organ toxicity -single exposureNot classified.Specific target organ toxicity -repeated exposure Not classified.Aspiration hazard Due to the physical form of the product it is not an aspiration hazard.Chronic effectsProlonged and repeated overexposure to dust and fumes can lead to benign pneumoconiosis (stannosis). Overexposure to Tin can result in benign pneumoconiosis (stannous). This form of pneumoconiosis produces progressive x-ray changes of the lungs as long as exposure exists, but there is no distinctive fibrosis, no evidence of disability and no special complicating factors.Ingestion of silver may cause a permanently benign bluish gray discoloration to the skin (argyria).12. Ecological informationEcotoxicityAlloys in massive forms present a limited hazard for the environment. Very toxic to aquatic life.ComponentsTest ResultsSpeciesCopper (CAS 7440-50-8)Aquatic EC50Crustacea 0.0076 - 0.026 mg/l, 48 hours Water flea (Daphnia obtusa)LC50Fish0.0051 - 0.015 mg/l, 96 hoursBony fish superclass (Osteichthyes)Silver (CAS 7440-22-4)Aquatic EC50Crustacea 0.0002 mg/l, 48 hoursWater flea (Daphnia magna)LC50Fish0.0019 - 0.003 mg/l, 96 hoursFathead minnow (Pimephales promelas)Persistence and degradability The product is not biodegradable.Bioaccumulative potential No data available.Mobility in soil Alloys in massive forms are not mobile in the environment.Other adverse effectsNone known.13. Disposal considerationsDisposal instructions Dispose in accordance with all applicable regulations.Local disposal regulations Dispose of in accordance with local regulations.Hazardous waste code Product contains silver a hazardous waste constituent regulated under 40 CFR 261.24.Waste from residues / unused productsDispose of in accordance with local regulations. Scrapped material should be sent for refining to recover precious metal content. Solid metal and alloys in the form of particles may be reactive. Its hazardous characteristics, including fire and explosion, should be determined prior to disposal.Contaminated packagingDispose of in accordance with local regulations.14. Transport informationDOTNot regulated as dangerous goods.IATANot regulated as dangerous goods.IMDGNot regulated as dangerous goods.Not applicable.Transport in bulk according toAnnex II of MARPOL 73/78 andthe IBC Code15. Regulatory informationUS federal regulations This product is a "Hazardous Chemical" as defined by the OSHA Hazard CommunicationStandard, 29 CFR 1910.1200.All components are on the U.S. EPA TSCA Inventory List.TSCA Section 12(b) Export Notification (40 CFR 707, Subpt. D)Not regulated.OSHA Specifically Regulated Substances (29 CFR 1910.1001-1050)Not listed.CERCLA Hazardous Substance List (40 CFR 302.4)Copper (CAS 7440-50-8)LISTEDSilver (CAS 7440-22-4)LISTEDSuperfund Amendments and Reauthorization Act of 1986 (SARA)Hazard categories Immediate Hazard - YesDelayed Hazard - NoFire Hazard - NoPressure Hazard - NoReactivity Hazard - NoSARA 302 Extremely hazardous substanceNot listed.YesSARA 311/312 HazardouschemicalSARA 313 (TRI reporting)Chemical name CAS number% by wt.Copper7440-50-8 1 - 10Other federal regulationsClean Air Act (CAA) Section 112 Hazardous Air Pollutants (HAPs) ListNot regulated.Clean Air Act (CAA) Section 112(r) Accidental Release Prevention (40 CFR 68.130)Not regulated.Not regulated.Safe Drinking Water Act(SDWA)US state regulationsUS. Massachusetts RTK - Substance ListCopper (CAS 7440-50-8)Silver (CAS 7440-22-4)Tin (CAS 7440-31-5)US. New Jersey Worker and Community Right-to-Know ActCopper (CAS 7440-50-8)Silver (CAS 7440-22-4)Tin (CAS 7440-31-5)US. Pennsylvania Worker and Community Right-to-Know LawCopper (CAS 7440-50-8)Silver (CAS 7440-22-4)Tin (CAS 7440-31-5)US. Rhode Island RTKCopper (CAS 7440-50-8)Silver (CAS 7440-22-4)US. California Proposition 65California Safe Drinking Water and Toxic Enforcement Act of 1986 (Proposition 65): This material is not known to contain any chemicals currently listed as carcinogens or reproductive toxins.US - California Proposition 65 - Carcinogens & Reproductive Toxicity (CRT): Listed substanceNot listed.International InventoriesCountry(s) or region Inventory nameOn inventory (yes/no)*Australian Inventory of Chemical Substances (AICS)YesAustralia Domestic Substances List (DSL)Yes Canada Non-Domestic Substances List (NDSL)No Canada Inventory of Existing Chemical Substances in China (IECSC)Yes China European Inventory of Existing Commercial Chemical Substances (EINECS)Yes Europe European List of Notified Chemical Substances (ELINCS)No Europe Inventory of Existing and New Chemical Substances (ENCS)No Japan Existing Chemicals List (ECL)Yes Korea New Zealand InventoryYes New Zealand Philippine Inventory of Chemicals and Chemical Substances (PICCS)Yes Philippines*A "Yes" indicates this product complies with the inventory requirements administered by the governing country(s).A "No" indicates that one or more components of the product are not listed or exempt from listing on the inventory administered by the governing country(s).Toxic Substances Control Act (TSCA) InventoryYesUnited States & Puerto Rico16. Other information, including date of preparation or last revisionIssue date 07-August-2014Revision date -Version #01HMIS® ratingsHealth: 1Flammability: 0Physical hazard: 0DisclaimerAll information in this Material Safety Data Sheet is believed to be accurate and reliable. However,no guarantee or warranty of any kind is made with regard to the accuracy of information or the suitability of the recommendations contained herein. It is the user’s responsibility to assess the safety and toxicity of this product under their own conditions of use and to comply with all applicable laws and regulations.。

NX3008NBKS

1.Product profile1.1General descriptionDual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.1.2Features and benefits⏹Very fast switching ⏹Low threshold voltage ⏹Trench MOSFET technology⏹ESD protection up to 2 kV ⏹AEC-Q101 qualified1.3Applications⏹Relay driver⏹High-speed line driver⏹Low-side loadswitch ⏹Switching circuits1.4Quick reference data[1]Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 1 cm 2.NX3008NBKS30 V, 350 mA dual N-channel Trench MOSFETRev. 1 — 1 August 2011Product data sheetTable 1.Quick reference data Symbol ParameterConditions Min Typ Max Unit Per transistorV DS drain-source voltage T j =25°C--30V V GS gate-source voltage -8-8V I D drain currentV GS =4.5V; T amb =25°C [1]--350mA Static characteristics (per transistor)R DSondrain-source on-state resistanceV GS =4.5V; I D =350mA; T j =25°C-11.4Ω2.Pinning information3.Ordering information4.Marking[1]% = placeholder for manufacturing site code.Table 2.Pinning information Pin Symbol Description Simplified outlineGraphic symbol1S1source TR1SOT363 (SC-88)2G1gate TR13D2drain TR24S2source TR25G2gate TR26D1drain TR1132456017aaa256Table 3.Ordering informationType numberPackage NameDescriptionVersion NX3008NBKSSC-88plastic surface-mounted package; 6 leadsSOT363Table 4.Marking codesType number Marking code [1]NX3008NBKSLB%5.Limiting valuesTable 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit Per transistorV DS drain-source voltage T j=25°C-30VV GS gate-source voltage-88VI D drain current V GS=4.5V;T amb=25°C[1]-350mAV GS=4.5V;T amb=100°C[1]-230mA I DM peak drain current T amb=25°C; single pulse; t p≤10µs- 1.4AP tot total power dissipation T amb=25°C[2]-280mW[1]-320mWT sp=25°C-990mW Per deviceP tot total power dissipation T amb=25°C[2]-445mW T j junction temperature-55150°C T amb ambient temperature-55150°C T stg storage temperature-65150°C Source-drain diodeI S source current T amb=25°C-300mA ESD maximum ratingV ESD electrostatic discharge voltage HBM[3]-2000V[1]Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 1 cm2.[2]Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.[3]Measured between all pins.6.Thermal characteristicsTable 6.Thermal characteristicsSymbol Parameter Conditions Min Typ Max Unit Per transistorR th(j-a)thermal resistance from junction to ambient in free air[1]-390445K/W[2]-340390K/W R th(j-sp)thermal resistance from junction to solder point--130K/W Per deviceR th(j-a)thermal resistance from junction to ambient in free air[1]--300K/W[1]Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.[2]Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm2.7.CharacteristicsTable 7.CharacteristicsSymbol Parameter Conditions Min Typ Max Unit Static characteristics (per transistor)V(BR)DSS drain-sourcebreakdown voltageI D=250µA; V GS=0V; T j=25°C30--VV GSth gate-source thresholdvoltageI D=250µA; V DS=V GS; T j=25°C0.60.9 1.1VI DSS drain leakage current V DS=30V;V GS=0V; T j=25°C--1µAV DS=30V;V GS=0V; T j=150°C--10µA I GSS gate leakage current V GS=8V;V DS=0V; T j=25°C-0.21µAV GS=-8V;V DS=0V; T j=25°C-0.21µAV GS=4.5V;V DS=0V; T j=25°C-10-nAV GS=-4.5V; V DS=0V;T j=25°C-10-nAV GS=2.5V;V DS=0V; T j=25°C-1-nAV GS=-2.5V; V DS=0V;T j=25°C-1-nAR DSon drain-source on-stateresistance V GS=4.5V;I D=350mA; T j=25°C-1 1.4ΩV GS=4.5V;I D=350mA; T j=150°C- 1.8 2.5ΩV GS=2.5V;I D=200mA; T j=25°C- 1.4 2.1ΩV GS=1.8V;I D=10mA; T j=25°C-2 2.8Ωg fs forwardtransconductanceV DS=10V;I D=350mA; T j=25°C-310-mS Dynamic characteristics (per transistor)Q G(tot)total gate charge V DS=15V;I D=350mA; V GS=4.5V;T j=25°C -0.520.68nCQ GS gate-source charge-0.17-nC Q GD gate-drain charge-0.08-nCC iss input capacitance V DS=15V;f=1MHz;V GS=0V;T j=25°C -3450pFC oss output capacitance- 6.5-pF C rss reverse transfercapacitance- 2.2-pFt d(on)turn-on delay time V DS=20V;R L=250Ω; V GS=4.5V;R G(ext)=6Ω; T j=25°C -1530nst r rise time-11-ns t d(off)turn-off delay time-69138ns t f fall time-19-ns Source-drain diode (per transistor)V SD source-drain voltage I S=350mA;V GS=0V;T j=25°C0.470.85 1.2V8.Test information8.1Quality informationThis product has been qualified in accordance with the Automotive Electronics Council(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and issuitable for use in automotive applications.9.Package outlinePlastic surface-mounted package; 6 leads SOT363Fig 18.Package outline SOT363 (SC-88)10.Soldering11.Revision historyTable 8.Revision historyDocument ID Release date Data sheet status Change notice Supersedes NX3008NBKS v.120110801Product data sheet--12.Legal information12.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term 'short data sheet' is explained in section "Definitions".[3]The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest productstatus information is available on the Internet at URL .12.2DefinitionsPreview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.12.3DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third partycustomer(s). NXP does not accept any liability in this respect.Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.Document status [1][2] Product status [3] DefinitionObjective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.Product [short] data sheet Production This document contains the product specification.Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at /profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.12.4TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation.13.Contact informationFor more information, please visit: For sales office addresses, please send an email to: salesaddresses@14.Contents1Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .11.1General description . . . . . . . . . . . . . . . . . . . . . .11.2Features and benefits. . . . . . . . . . . . . . . . . . . . .11.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .11.4Quick reference data . . . . . . . . . . . . . . . . . . . . .12Pinning information. . . . . . . . . . . . . . . . . . . . . . .23Ordering information. . . . . . . . . . . . . . . . . . . . . .24Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .36Thermal characteristics . . . . . . . . . . . . . . . . . . .57Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .78Test information. . . . . . . . . . . . . . . . . . . . . . . . .118.1Quality information . . . . . . . . . . . . . . . . . . . . . .119Package outline. . . . . . . . . . . . . . . . . . . . . . . . .1210Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1311Revision history. . . . . . . . . . . . . . . . . . . . . . . . .1412Legal information. . . . . . . . . . . . . . . . . . . . . . . .1512.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . .1512.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1512.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .1512.4Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .1613Contact information. . . . . . . . . . . . . . . . . . . . . .16Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© NXP B.V.2011.All rights reserved.For more information, please visit: For sales office addresses, please send an email to: salesaddresses@。

摩克斯 SDS-3008 系列产品名称和型号说明书

SDS-3008SeriesIndustrial 8-port smart EthernetswitchesFeatures and Benefits•Compact and flexible housing design to fit into confined spaces •Web-based GUI for easy device configuration and management•EtherNet/IP,PROFINET,and Modbus TCP industrial protocols supported foreasy integration and monitoring in automation HMI/SCADA systems•Multi-language web GUI:English,Traditional Chinese,Simplified Chinese,Japanese,German,and French•Supports RSTP/STP for network redundancy •Security features based on IEC 62443CertificationsIntroductionThe SDS-3008smart Ethernet switch is the ideal product for IA engineers and automation machine builders to make their networks compatible with the vision of Industry 4.0.By breathing life into machines and control cabinets,the smart switch simplifies daily tasks with its easy configuration and easy installation.In addition,it is monitorable and is easy to maintain throughout the entire product life cycle.The most frequently used automation protocols—including EtherNet/IP,PROFINET,and Modbus TCP—are embedded in the SDS-3008switch to provide enhanced operational performance and flexibility by making it controllable and visible from automation HMIs.It also supports a range of useful management functions,including IEEE 802.1Q VLAN,port mirroring,SNMP,warning by relay,and a multi-language Web GUI.Additional Features and Benefits•Supports IEEE 802.1D-2004and IEEE 802.1w STP/RSTP for rapid network redundancy•IEEE 802.1Q VLAN to ease network planning•Supports the ABC-02-USB automatic backup configurator for quick event log and configuration backup.Can also enable quick device switch over and firmware upgrade•Automatic warning by exception through relay output•Unused port lock,SNMPv3and HTTPS to enhance network security •Role-based account management for self-defined administration and/or user accounts•Local log and the ability to export inventory files ease inventory managementSpecificationsInput/Output InterfaceAlarm Contact Channels 1,Relay output with current carrying capacity of 1A @24VDC ButtonsReset button Digital Input Channels 1Digital Inputs+13to +30V for state 1-30to +3V for state 0Max.input current:8mAEthernet Interface10/100BaseT(X)Ports(RJ45connector)8Auto negotiation speedFull/Half duplex modeAuto MDI/MDI-X connectionStandards IEEE802.3for10BaseTIEEE802.3u for100BaseT(X)IEEE802.3x for flow controlIEEE802.1D-2004for Spanning Tree ProtocolIEEE802.1w for Rapid Spanning Tree ProtocolIEEE802.1Q for VLAN TaggingEthernet Software FeaturesIndustrial Protocols EtherNet/IP,Modbus TCP,PROFINET IO Device(Slave)Management Back Pressure Flow Control,DHCP Client,Flow control,IPv4/IPv6,LLDP,Port Mirror,SNMP Inform,SNMPv1/v2c/v3,SyslogMIB RFC1213,Ethernet-like MIB,IF MIB,LLDP MIB,Bridge MIB,Q-BRIDGE MIB Redundancy Protocols RSTP,STPSecurity Broadcast storm protection,HTTPS/SSL,SNMPv3,Port LockTime Management NTP Server/Client,SNTPFilter802.1Q VLANSwitch PropertiesMAC Table Size8KMax.No.of VLANs8VLAN ID Range VID1to4094Packet Buffer Size3MbitsUSB InterfaceStorage Port USB Type ALED InterfaceLED Indicators PWR1,PWR2,STATE,FAULT,10/100M(TP Port)Power ParametersConnection2removable4-contact terminal block(s)Input Voltage12/24/48/-48VDC,Redundant dual inputsOperating Voltage9.6to60VDCInput Current0.55A@24VDCOverload Current Protection SupportedReverse Polarity Protection SupportedPhysical CharacteristicsHousing MetalIP Rating IP40Dimensions20x135x111mm(0.79x5.32x4.37in)Weight438g(0.97lb)Installation DIN-rail mountingEnvironmental LimitsOperating Temperature SDS-3008:-10to60°C(14to140°F)SDS-3008-T:-40to75°C(-40to167°F)Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN61000-6-2/-6-4EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:20V/mIEC61000-4-4EFT:Power:2kV;Signal:2kVIEC61000-4-5Surge:Power:2kV;Signal:2kVIEC61000-4-6CS:10VIEC61000-4-8PFMFSafety EN60950-1(LVD),UL61010-2-201,UL508Shock IEC60068-2-27Freefall IEC60068-2-32Vibration IEC60068-2-6MTBFTime1,391,620hrsStandards Telcordia(Bellcore),GBWarrantyWarranty Period5yearsDetails See /warrantyPackage ContentsDevice1x SDS-3008Series switchInstallation Kit4x cap,plastic,for RJ45portDocumentation1x product certificates of quality inspection,Simplified Chinese1x product notice,Simplified Chinese1x quick installation guide1x warranty cardDimensionsOrdering InformationModel Name Layer Total No.of Ports 10/100BaseT(X)PortsRJ45ConnectorOperating Temp.SDS-3008288-10to60°CSDS-3008-T288-40to75°C Accessories(sold separately)Storage KitsABC-02-USB Configuration backup and restoration tool,firmware upgrade,and log file storage tool for managedEthernet switches and routers,0to60°C operating temperatureABC-02-USB-T Configuration backup and restoration tool,firmware upgrade,and log file storage tool for managedEthernet switches and routers,-40to75°C operating temperaturePower SuppliesDR-120-24120W/2.5A DIN-rail24VDC power supply with universal88to132VAC or176to264VAC input byswitch,or248to370VDC input,-10to60°C operating temperatureDR-452445W/2A DIN-rail24VDC power supply with universal85to264VAC or120to370VDC input,-10to50°C operating temperatureDR-75-2475W/3.2A DIN-rail24VDC power supply with universal85to264VAC or120to370VDC input,-10to60°C operating temperatureMDR-40-24DIN-rail24VDC power supply with40W/1.7A,85to264VAC,or120to370VDC input,-20to70°Coperating temperatureMDR-60-24DIN-rail24VDC power supply with60W/2.5A,85to264VAC,or120to370VDC input,-20to70°Coperating temperatureRack-Mounting KitsRK-4U19-inch rack-mounting kit©Moxa Inc.All rights reserved.Updated Nov12,2018.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

XIDie中文用户手册

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Sensata 电源接线板说明书

SERIES 1 | 120 VACPANEL MOUNTFeatures• SCR output for heavy industrial loads• Zero voltage or instantaneous turn-on outputs• UL/CSA/TUV Approved, CE Compliant to EN60950-1• Improved SEMS screw and washer• Redesigned housing with anti-rotation barriers• AC or DC control• Direct bond copper substrate• EMC compliant to Level 3• Direct power lead frame• Epoxy free designRequired for valid part numberBlank: Zero Voltage Turn-OnOUTPUT SPECIFICATIONS (5)INPUT SPECIFICATIONS (5)GENERAL SPECIFICATIONS(5)WIRING DIAGRAMInput Current vs Input Voltage Standard Regulated DC InputI n p u t C u r r e n t (m A )DC Input VoltageEQUIVALENT CIRCUIT BLOCK DIAGRAMSDiagram: Series 1 AC control+DC -DCLimiterDiagram: Series 1 DC controlMECHANICAL SPECIFICATIONS (5)Tolerances: ±0.02 in / 0.5 mmAll dimensions are in: inches [millimeters]Screw TerminationHex Standoff Termination (“K” Option)(2)Quick Connect Termination (“F” Option ) - Up to 25 Amp (1)Quick Connect Termination (“F” Option ) - Up to 50 Amp (1)SURGE CURRENT INFORMATION20406080100120S u r g e C u r r e n t (A m p )Surge Duration (Secs)10 A050100150200250S u r g e C u r r e n t (A m p )Surge Duration (Secs)25 A100200300400500600S u r g e C u r r e n t (A m p )Surge Duration (Secs)40 ANon repetitive peak surge current at Tj initial 40ºC.THERMAL DERATE INFORMATIONAmbient Temperature (ºC)10 A3ºC/W5ºC/WNo HeatsinkAmbient Temperature (ºC)25 A1.5ºC/W2ºC/W3ºC/WAmbient Temperature (ºC)40 A1ºC/W 1.5ºC/W2ºC/W3.5ºC/WAGENCY APPROVALS AND CERTIFICATIONSEN60950 : Meets the requirements of sections1.5: 1,7: 2.9: 2.10.5.3: 4.2: 4.5: 4.7:Designed in accordance with the requirements of IEC 62314IEC 61000-4-2 : Electrostatic Discharge – Level 3IEC 61000-4-4 : Electrically Fast Transients – Level 3IEC 61000-4-5 : Electrical Surges – Level 3IEC 60068-2-6 : Vibration 0.33mm and 0.75 mm Amplitude over 10-55 Hz IEC 60068-2-27 : Shock Resistance 15g/11msE116949 LR81689ACCESORIESPart number: KS101Clear plastic cover compatible with all new S1 designs. Safety covers provide added protection from electric shock when installing or checking equipment.Protective CoverHardware KitPart number: HK4Bag with 2 square brass accessories and 2 screw 8-32 x 5/8 for output. Used to mount TMR1 lug terminals.New Accessories!Protective Cover & Hardware KitsGENERAL NOTES(1) Single pair (up to 25A) Double pair* (up to 50A). *Caution: User must connect both pairs.(2) Option “K” is designed and tested for use with printed circuit boards or ring/fork terminals having a thickness between 0.031 and 0.093 inches (0.79 to 2.36 mm), and loads rated up to 50 Amps. For higher load currents, the “K” standoff temperature must not exceed 105°C. For additional application assistance please contact Crydom Technical Support. (3) Output will self trigger between 450-600Vpk, Min. power factor 0.7 or higher, not suitable for capacitive loads. (4) Instantaneous turn-on version is not recomended for capacitive loads. Use zero turn-on only.(5) All parameters at 25°C unless otherwise speciﬁed.(6) For “S” option, operating voltage frequency is 47-63Hz.(7) For parts with option “S” maximum leakage current is 10mA.(8) Heat sinking required, see derating curves.(9) Increase minimum voltage by 1V for operations from -20 to -40°C.(10) Turn-on time for instantaneous turn-on versions is 0.02 msec (DC control Models).(11) All parameters at 50% power rating and 100% duty cycle (contact Crydom tech support for detailed report). (12) Load can be wired to either SSR output terminal 1 or 2.(13) Elective Input Status LED, “G” option(14) Elective Overvoltage Protection, “P” option.(15) Elective Internal Snubber, “S” option.(16) Mechanical dimensions vary from G3 models.For additional information or speciﬁc questions, contact Crydom Technical Support.CONTACT USSensata Technologies, Inc. (“Sensata”) data sheets are solely intended to assist designers (“Buyers”) who are developing systems that incorporate Sensata products (also referred to herein as “components”). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyer’s systems and products. Sensata data sheets have been created using standard laboratory conditions and engineering practices. Sensata has not conducted any testing other than that speciﬁcally described in the published documentation for a particular data sheet. Sensata may make corrections, enhancements, improvements and other changes to its data sheets or components without notice.Buyers are authorized to use Sensata data sheets with the Sensata component(s) identiﬁed in each particular data sheet. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER SENSATA INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN. SENSATA DATA SHEETS ARE PROVIDED “AS IS”. SENSATA MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE DATA SHEETS OR USE OF THE DATA SHEETS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ACCURACY OR COMPLETENESS. SENSATA DISCLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS WITH REGARD TO SENSATA DATA SHEETS OR USE THEREOF.All products are sold subject to Sensata’s terms and conditions of sale supplied at SENSATA ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR THE DESIGN OF BUYERS’ PRODUCTS. BUYER ACKNOWLEDGES AND AGREES THAT IT IS SOLELY RESPONSIBLE FOR COMPLIANCE WITH ALL LEGAL, REGULATORY AND SAFETY-RELATED REQUIREMENTS CONCERNING ITS PRODUCTS, Americas+1 (877) 502 5500 – Option 2 ************************Europe, Middle East & Africa +44 (1202) 416170***********************Asia Paciﬁc*************************.com China +86 (21) 2306 1500Japan +81 (45) 277 7117Korea +82 (31) 601 2004India +91 (80) 67920890Rest of Asia +886 (2) 27602006ext 2808Page 6WARNINGSRISK OF MATERIAL DAMAGE AND HOT ENCLOSURE• The product’s side panels may be hot, allow the product to cool before touching.• Follow proper mounting instructions including torque values.• Do not allow liquids or foreign objects to enter this product.Failure to follow these instructions can result in serious injury, or equipment damage.HAZARD OF ELECTRIC SHOCK, EXPLOSION OR ARC FLASH• Disconnect all power before installing or working with this equipment.• Verify all connections and replace all covers before turning on power.Failure to follow these instructions will result in death or serious injury.。

Siemens 电缆接线产品及系列介绍说明书

ContentsOur MissionAs energy, communications and continuous inno-vation are all inextricably linked with our lives today, modern communication and utility networks will play a vital and increasingly important role in the creation of our future society.Filoform’s mission is to assist you in planning for this opportunity now and to provide you with the best solutions, applications and products to protect your investment in the future.This future includes:· The development of highly efficient and smart energy grids with which the end user has a relationship both as a buyer and seller of energy.· The creation of decentralized energy production systems to meet local demand for electric mobility.· The utilization of new, safer and sustainable energy sources like wind and solar power.· Changing the way in which we work by planning and developing high data capacity fibre optic networks and different types of mobile communications networks.Our ExpertiseFor over 50 years, we have developed major expertise in manufacturing and supplying quality products and solu-tions to connect, seal and protect the underground cable networks of our international and domestic customers.Filoform UK LtdUnit K Lambs Farm Business Park Basingstoke Road, Swallowfield Reading RG7 1PQ T.: +44 (0) 1189 886873F.: +44 (0) 1189 886576E.: ****************.uk W.:Filoform BVDe Panoven 174191 GW Geldermalsen-NL NetherlandsT: +31 (0) 345 58 82 20F.: +31 (0) 345 52 82 21E.:*****************W.: www.filoform.nlHead OfficeDistributed by:At Filoform, we focus on you - our customers. From the moment you contact us, you are assured of a friendly reception and a prompt response to your queries. We promise you our undivided attention and we will carry out your instructions to the letter.Our dedicated, close knit and professional team will engage with you, to find out exaFiloformy what you want in order to supply you with the best solutions you need, in your specialized market sector. We also aim to continuously improve on our service to you, however we can, wherever we can.We will act with openness, honesty and complete transparency in all of our dealings with you - in sales, production, research, administration and management.Simply put, we want you to enjoy the best experience possible as a customer of Filoform.7Joint Shell DimensionsABCABC1C1C2BC1C2Straight Joint DimensionsProduct NameShell styleLength (mm)Diameter (mm)Cable entry (mm)Resin Con-tentCM0 / Straight 6 / 80163Injection Moulded - Snaplock 20035 5 - 20mm 200ml CM1 / Straight 16 / 80164Injection Moulded - Snaplock 250458 - 30mm 350ml CM2 / Straight 25 / 80164B Injection Moulded - Snaplock 3206010 - 34mm 750ml CM2.5 / Straight 35/70 / 80165Injection Moulded - Snaplock 3557226 - 53mm 1.2 Litres CM3 / Straight 95 / 8.000907Injection Moulded - Snaplock 4507530 - 48mm 1.65 Litres CM4 / Straight 120 / 8.000908Injection Moulded - Snaplock54710837 - 67mm 3.3 Litres CM5 / Straight 185 / 8.0009085Vacuum Formed 70014062 - 68mm 8.5 Litres CM6 / Straight 300 / 8.000909Vacuum Formed 80016048 - 88mm 12.0 Litres CM7 / Straight 400Vacuum Formed134515570 - 105mm15.0 LitresBranch Joint Dimensions Joint Type Shell style(A) Length (mm)(B) Width (mm)(C) Cable entry (mm)Resin ContentCB0 / 80169Injection Moulded - Snaplock 1906010 - 20mm 270ml MB6 / CB0.5Injection Moulded - Snaplock 2207610 - 22mm 450 ml MB16 / CB1Injection Moulded - Snaplock 33511010 - 30mm 1,85MB35 / CB2Injection Moulded - Snaplock42012015 - 30mm 2,65MB70 / CB3Vacuum Formed 49012515 - 40mm 4 Litres MB120 / CB4Vacuum Formed 57016015 - 50mm 9.5 Litres MB300 / CB6Vacuum Formed74025045 - 75mm 23.5 LitresBranch Joint Dimensions Joint Type Shell style (A) Length (mm)(B) Width (mm)(C) Cable entry (mm)Resin ContentCPJ120Injection Moulded - Snaplock 1609210 - 25mm 450 ml CPJ95Injection Moulded - Snaplock 1427310 - 20mm 200ml CB0Injection Moulded - Snaplock 1906010 - 20mm 270mlCM0 - CM7CU0 - CU5A BC1C1C2CB0 - CB6CPJType A B C1C2min max min max CU0 range 175********CU1 range 2206513221321CU2 range 3008019291822CU3 range 4009523352125CU4 range 50011026502530CU5 range50016038653950CPJ CBOLV Resin Cable Joints - Low Smoke Zero Halogensuitable for PVC or XLPE cable, 1kVSpecifications - Filoform Low Smoke Zero Halogen cable jointsProperties of shell Rating Relevant standardFlammabilityFlame retardantFlame class rating: 3mm V-0UL94Flame class rating: 1mm V-2UL94Glow wire test, 1 mm, 850 ºC Pass IEC 695-2-1Low SmokeSmoke density 4 min Dm < 200AIRBUS Standard ABD 0031 Halogens Free DIN VDE 472 part 815 MechanicalTensile strength at yield (speed 50mm/min)63 Mpa ISO 527, DIN 53455ImpactCharpy Impact, notched30 kJ/m2ISO 179/2CThermalThermal conductivity0.20 W/m ºC DIN 52612ElectricalDielectric strength17kV/mm IEC 243, ASTMD 149Volume resistivity1015 Ohm.m IEC 93, DIN53482Surface resistivity1015 Ohm IEC 93, DIN53482 Properties of resin type CR171HFlammability - Flame class rating: 6mm V-0UL94Physical propertiesOperating temperature-40º C to +105º CThermal conductivity0.75 W/mKShrinkage LowCoefficient of linear expansion LowElectrical propertiesVolume resistivity11 - 13 log OhmSurface resistivity12 - 14 log OhmElectric strength> 16 MV/mPermittivity 3.2 @ 1 KHzMain Cable 2, 3 & 4 core (mm2)Branch Cable2,3 & 4 core (mm2)Part NoStraight Joints4 x 6mm N/A CM0/ST6LSHF4 x 10mm N/A CM1/ST16LSHF4 x 16, 25mm N/A CM2/ST25/LSHF4 x 35, 50mm N/A CM2.5/ST35/70LSHF4 x 70, 95mm N/A CM3/ST95/LSHF4 x 95, 120, 150, 185mm N/A CU5LSHF4 x 240, 300, 400mm N/A CM56LSHF Branch Joints4 x 6mm 4 x 6mm CU1LSHF4 x 10, 16, 25mm 4 x 10, 16, 25mm CU2LSHF4 x 35mm 4 x 35mm CU3LSHF4 x 35mm 4 x 35mm CU4LSHF4 x 35mm 4 x 35mm CU5LSHF4 x 95, 120mm 4 x 95, 120mm CBM1LSHF4 x 120, 150 , 185mm 4 x 120, 150 , 185mm CBM2LSHFIllustration of a parallel installation. (extension bolts can be provided.)FiloSeal+ Re-enterable Duct Sealing System One of the reasons why ducts are sealed is to prevent running water getting into abuilding or enclosure. Often when faced with sealing a duct, this running water isstill evident.Our Filoseal Running Water Block system provides the user with a method ofpreventing the water from ruining any permanent sealing system whilst that systemis installed. The kit provides a method of damming the water flow, controlling it andstopping it.Small kit· Non-hardening plastic waterproofing sealant.(Damming Putty)· 200mm length 15mm pipe· 15mm Emergency tap· Pipe insert to strengthen pipe when tap is fittedLarge kit· Non-hardening plastic waterproofing sealant.(Damming Putty) x 2· 200mm length 15mm pipe· 15mm Emergency tap· Pipe insert to strengthen pipe when tap is fittedFiretest at Warrington FireMDI FttH Duct sealing systemThe Filoform MD1-FttH is designed for gas and watertight sealing of FttH home entries with micro ducts and cables up toØ10mm. The diameter of the drilled hole needs to be at least Ø16mm wide and max. Ø 20mm.The sealing cap can be applied to the wall by using the special anchoring pin. This way it is not necessary to drill additional holes and to secure the cap with screws.A gas and watertight seal is created with use of Filoform expanding PU resin type 2234. The resin package contains the right amount of resin to secure an optimal sealing. After mixing the resin and filling the cap it will start expanding. Within 30 min-utes the resin will fully cure intro a stong and durable seal. Any irregularities or damage to wall will be restored with the resin. To seal the duct opening on the inside of the house, we recommend the use of Filoform Fill & Seal sealing paste.• Universal, suitable for micro ducts and cables up to Ø10mm• Expansion along the borehole and on the outer wall guarantees an excellent seal• Tested 1.0 bar Gas & Watertight• Quick installation in minutes, no special tools required• No extensive core drilling necessary• Also suitable for angled penetrations• Suitable for sealing of drilled holes in the most common wall types with waterproofing according to DIN 18195 T4• Complies with DIN 18332 underground cable laying works: cable and conduit entries into buildings are to be made wa-tertight and gastight• High mechanical strength, resists ground movement, shocks and vibrations• Supplied as one complete kit for sealing of one house connection• Over 30 years of practical experience, installed in many Telecom / FO network。

specifications

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一、注意事项二、产品规格一、注意事项1、禁止在秒杀温度T≥80℃时使用本产品！高温工作将导致产品变形和加速金属氧化, 严重情况会造成电路烧毁。

2、禁在密闭的空间使用本产品！密闭环境不利于产品的通风和散热，直接导致工作温度超出安全范围。

3、禁止在含酸、碱的环境中使用本产品！禁止用含酸、碱的溶液擦拭产品。

酸碱将造成产品材质的直接损坏，导致外观受损和电路烧毁。

4、禁止用水擦洗GT-106V\ HT-78V面板, 面板使用大量环保水溶性吸光材料,定期用软毛巾轻拭产品表面，汽油、煤油等都将不同程度造成产品外观损伤。

5、本产品电子线路均工作在低压及弱电环境中，不会对安装者造成人身损害，为能更好发挥产品性能，建议由专业人员来执行产品的安装，调试。

6、本产品不使用时，请及时做好产品的防尘保养，灰尘沉积在表面，极易造成产品的外观出现损坏。

7、产品已经通过氧化处理，具备一定的抗氧化特性，请在产品安装，调试后，检查表面和内部是否有刮伤，并及时处理。

8、产品的安装、调试、使用请参照说明书步骤。

二、产品规格1 、GT 系列GTPC-- game & theatre PC专为游戏和家庭影院爱好者打造的新一代、全新概念的PC 机箱。

产品设计在满足PC 技术要求的基础上，融入防辐射，空气力学技术。

机箱采用加厚铝合金材质制成，有效减小电磁辐射强度，散热采用负风压多风道设计，在有效降低噪音的同时提高散热性能。

产品外观美观高贵，扩展性能强劲，真正集PC 、游戏机、高清播放机，电视播放机于一体。

GT-135V号GT-135V (标 ) GT-135V (LCD ) GT-135V (简 ) 颜& 银 & 银 & 银 m m)435¡L 135¡H 450¡435¡L 135¡H 450¡435¡L 135¡H 450¡材质　铝（aluminum) 铝（aluminum) 铝（aluminum) 电ATX ATX ATX AT / M ATXATX ATX ATX ATX 显卡＊　标准　显卡＊　标准　显卡＊　标准　显卡＊　硬盘〖 4* 3.5″4* 3.5″ 4* 3.5″ 驱 1* 5.25″1* 5.25″ 1* 5.25″ 热 1*8CM风扇　（Ｎｉｄｅｃ） 1*8CM 风扇　（Ｎｉｄｅｃ） 1*8CM 风扇　（Ｎｉｄｅｃ） m2*U B 2.0 / 1*I 1394 / 1*M C / 1*He 2*U B 2.0 / 1*I 1394 / 1*M C / 1*He 2*U B 2.0 / 1*I 1394 / 1*M C / 1*He标配　标配　标配　￣ン1*驱动盘用户手册／　１＊保修卡 1*驱动盘用户手册／　１＊保修卡 1*驱动盘用户手册／　１＊保修卡套件标配无无液晶屏　无CN T 液晶　无　净6.9 6.7 6.5 A¡B * 显卡：支持显卡总长度L ≤396mm 总高度 H ≤123mm ，B¡B 显卡总高度H 包含显卡散热器高度和显卡供电接头高度，C¡B *净：产品实际重量视附件而定。

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Table 3. Ordering information
Type number
Package
Name
NX3008PBKS
SC-88
4. Marking
Description plastic surface-mounted package; 6 leads
Table 4. Marking codes Type number NX3008PBKS
103
Zth(j-a) (K/W)
102
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
0.1 0.05
0
0.02
10
0.01
017aaa034
1
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 4. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2011
© NXP B.V. 2011. All rights reserved.
4 of 17
NXP Semiconductors
-125 mA
-0.8 A
280 mW
320 mW
990 mW
[2] -55 -55 -65
445 mW 150 °C 150 °C 150 °C
[1] -
-200 mA
[3] -
2000 V
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 1 cm2. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Measured between all pins.
Conditions
Min Typ Max Unit
Per transistor
VDS
drain-source voltage
VGS
gate-source voltage
ID
drain current
Static characteristics (per transistor)
RDSon
drain-source on-state resistance
Ptot
total power dissipation
Tamb = 25 °C
Per device
Ptot
total power dissipation
Tj
junction temperature
Tamb
ambient temperature
Tstg
storage temperature
Source-drain diode
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Per transistor
VDS
drain-source voltage
3 of 17
NXP Semiconductors
NX3008PBKS
30 V, 200 mA dual P-channel Trench MOSFET
120
Pder (%)
80
001aao121
120
Ider (%)
80
001aao122
40
40
0
-75
-25
25
75
125
175
Tj (°C)
0
NX3008PBKS
Product data sheet
/
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2011
© NXP B.V. 2011. All rights reserved.
NX3008PBKS
30 V, 200 mA dual P-channel Trench MOSFET
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Per device
Rth(j-a)
thermal resistance from junction to ambient
Per transistor
Rth(j-a)
thermal resistance from junction to ambient
Rth(j-sp)
thermal resistance from junction to solder point
Conditions in free air in free air
001aao253
(1)
-10-1
(2)
-10-2
-10-1
-1
(3)
(4) (5)
-10
-102
VDS (V)
Fig 3.
IDM is a single pulse (1) tp = 1 ms (2) tp = 10 ms (3) DC; Tsp = 25 °C (4) tp = 100 ms (5) DC; Tamb = 25 °C; 1 cm2 drain mounting pad
/
NXP Semiconductors
NX3008PBKS
30 V, 200 mA dual P-channel Trench MOSFET
2. Pinning information
Table 2. Pin 1 2 3 4 5 6
Pinning information
Symbol Description
S1
source TR1
G1
gate TR1
D2
drain TR2
S2
source TR2
G2
gate TR2
D1
drain TR1
Simplified outline
654
123
SOT363 (SC-88)
Graphic symbol
D1 G1
S1
3. Ordering information
NX3008PBKS
30 V, 200 mA dual P-channel Trench MOSFET
Rev. 1 — 1 August 2011
Product data sheet
1. Product profile
1.1 General description
Dual P-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
[1] % = placeholder for manufacturing site code.
Marking code[1] LC%
D2 G2
S2 017aaa260
Version SOT363
NX3008PBKS
Product data sheet
/
All information provided in this document is subject to legal disclaimers.
Min Typ Max Unit
[1] -
-
300 K/W
[1] -
390 44 K/W
-
-
130 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm2.
5 of 17
NXP Semiconductors
103
Zth(j-a) (K/W)
102
duty cycle = 1
0.75
NX3008PBKS
Product data sheet
/
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 August 2011
© NXP B.V. 2011. All rights reserved.