UF_SFM3050TC2_Datasheet_V1.0
THM3050 用户手册
SF-3050说明书
SF-3050
星站差分产品
用户指南
北京星火北斗科技有限公司(版权所有)
目录
北京星火北斗科技有限公司
第 1 章 入门------------------------------------------------------ 1 第 2 章 简介---------------------------------------------------- 23 第 3 章 Web 服务器-------------------------------------------33 第 4 章 接口---------------------------------------------------- 53 第 5 章 安装---------------------------------------------------- 70 第 6 章 配置---------------------------------------------------- 75
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北京星火北斗科技有限公司
“StarFire:Enabled”代表已内置了 Starfire 选件选项,但并不带表已经安装了信号服务。
对接收机软件版本进行升级: 一、 单击 Receiver Options 选项,出现 Receiver Options 界面:
,打开“Load Receiver Firmware”对话框:
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北京星火北斗科技有限公司
SFM3050 指纹识别接口板用户指南说明书
BiometricInterface BoardUser Guideelectronic stepsContents1 What You Need to Get Started2 Setting Up the System3 Enroll a Fingerprint4 How to Identify a Fingerprint5 Delete a Fingerprint6 Board Schematic electronic stepsOverviewelectronic stepsThe Biometric Interface Board is a demonstration board for evaluating SFM3050 ngerprint module. Its an expansion board compatible with Microchip Explorer 16 development board.Fingerprint modules are designed to provide biometric security solution to developersand manufacturers for integration with several application, as access control, time attendance,mobile device, safes and so on. FeaturesHigh-end standalone ngerprint module equipped with RS232 interface.EER < 0.1%Enrollment time 700 msec 1:1 Veri cation time 700 msec1:1000 Identi cation time * 830 msecTemplate size 384 Bytes (reducible to 256 bytes)Template standard ISO19794-2, ANSI-378Getting StartedTo get started, an Explorer 16 Development Board is required. The Biometric Interface Board can be attached to the Explorer 16 Development Board through the K1 connector and it was speci callydesigned to be used with PIC24FJ256GB110 PIM.Pag 1Electronicsteps Presenting...1 What You Need to Get StartedAfter power up the board, wait until the presentation ends, or wait 30 seconds for the system to initialize before pressing S4.STEP1STEP2Press S4 to switch from the apresentation to the menu.STEP3If its your rst time to run the aplication, then you have to start to Enroll a nger rst.Please go to the chapter “Enroll a Fingerprint”. If you have already done the enrollment you can start to identify the same nger, by pressing S6.We provide a simple rmware to demonstrate how to Enroll, Verify and Delete a ngerprint into the SFM 3050 module.After you program the demo rmware to PIC24F256GB110 PIM, and atached the Explorer 16 board to the Biometric Interface Board, power up the Explorer 16, and you will see a quick presentation running on the LCD. Please wait until the presentation ends because the module is also initializing during this time.2 Setting Up the system- Biometric Interface Board- Microchip Explorer 16 Development Board - PIC24FJ256GB110 PIM - Demo rmware- PIC Programer to burn the demo rmware into the PIC24F256GB110 PIMelectronic stepsS3 -> Enroll S5 -> DeleteElectronicsteps Presenting...Press S6 toIdentify FingerPag 2S3 -> Enroll S5 -> DeletePlease insert FingerEnroll Fail ErrorFinger Enrolled Success3 Enroll a FingerprintPress S4 until the LCD shows a menu with S3 and S5 options.STEP1STEP2Press S3 to Enroll a ngerprint.STEP3Insert your ngerprint by pressing the sensor module with your nger .STEP4If the LCD shows the message“Finger Enrolled Success” your ngerprint was correctly enrolled in the module.T roubleshootingIf the LCD shows a Error Message, it can be due to a timeout or to a error reading the ngerprint. Go to Step 1 and try again.electronic stepsPag 3Please insert Finger4 How to Identify a FingerprintPress S4 until the LCD shows a menu with S6 option.STEP1STEP2Press S6 to Identify nger .STEP3Insert your ngerprint by pressing the sensor module with your nger .STEP4If the LCD shows the message“Finger Match Success” your ngerprint was correctly identi ed by the module.T roubleshootingIn case you received a “No match” message,it can be due to a timeout , error reading the ngerprint or the nger is diferent from the one you previously Enrolled.Go to Step 1 and try again, or if the nger is diferent you must Enroll rst.Press S6 toIdentify FingerFinger Match SuccessNo match, finger not identifiedelectronic stepsPag 45 Delete a FingerprintPress S4 until the LCD shows a menu withS5 option.STEP1STEP2Press S5 to Delete ngerprint.STEP3If the LCD shows the message “Done Deleting” your ngerprint was correctly deleted by the module.Done Deleting Successelectronic steps S3 -> EnrollS5 -> DeletePag 56 Board Schematicelectronic steps31A 0N BIO201201Pag 6DEVELOPMENT BOARDS - INTERFACE BOARDS - ELECTRONIC KITS - STARTER KITSAll rights reserved. Name and logos are trademarks of STEPTRONIC Lda. All othertrademarks and services marks are the property of theirs owners.electronic steps。
HE3050F V1.1_CN规格书赫尔半导体HEERMICR
特点•反向充电连接保护•电池单元反向连接保护•过温保护•过充电电流保护•两步检测过充电流:过放电电流保护负载短路•充电器检测功能•0V 电池充电功能•符合RoHS 标准且不含铅(Pb )•低至40mΩ的等效开启电阻内部功率MOSFET •内部延迟发生器•高精度电压检测•低电流损耗工作状态:典型值2.5µA.掉电状态:典型值1.5µA •只需一个外接电容•采用SOT23-6封装•-40℃至+85℃温度范围应用•单节锂离子电池组•充电宝•单节锂聚合物电池组•IOT 传感器/电子玩具概述HE 3050F 针对锂离子/聚合物电池保护提供了高集成解决方案。
HE 3050F 包含内部功率MOSFET ,高精度电压检测电路和延迟电路。
HE 3050F 具有电池应用所需的所有保护功能,包括过充电、过放电、过流和负载短路保护等。
准确的过充电检测电压保证了充电的安全和充分利用。
低待机电流在存储时从电池中消耗很少的电流。
该产品不仅适用于数字蜂窝电话,而且适用任何其他需要长期电池寿命的锂离子和锂聚合电池供电的信息设备。
HE 3050F 需要最少数量的现成的外部组件,并且采用的SOT23-6封装可以节省空间。
典型应用电路Figure 1.Typical Application Circuit523/6HE 3050F单节锂离子和锂聚合物电池保护芯片引脚描述管脚设置Figure 2.Pin Configuration引脚描述引脚名称功能1NC NC2VM连接电池组的负极。
内部FET 开关将这个端口连接到GND 3/6GND 接地引脚5VDD 电源引脚4NCNC印章说明标记描述封装最小包装3代表过放电流值;50代表导通内阻;F 代表SOT-23封装;B 代表过充电压;9代表生产年份;A 代表生产周数SOT23-63000PCS订购须知型号HE 3050F-AHE 3050F-BHE3050F-CHE 3050F-D过充电压 4.250V 4.300V 4.425V 4.475V 丝印图350FA350FB350FC350FD-6HE 3050F单节锂离子和锂聚合物电池保护芯片绝对最大额定值(1)(2)VDD输入电压…………….........…...-0.3V to6V 工作温度范围……………….…...-40°C to+85°C 铅温度(钎焊,10s)…………………..+300°C θJA…….………………….…………........250°C/W θJC……….……...……………...…..........130°C/W VM输入电压…..…………………......…...-6V to10V存储温度范围.....................................-55°C to150°C 结温...........................................................+125°C ESD(Human Body Made)HMB............................2KV ESD(Machine Made)MM (200V)备注1:超过这些额定值可能会损坏器件。
Mornsun LS05-23BxxDR3 高功率 AC DC 转换器说明书
5W,DIY AC/DCconverterRoHSEN62368-1FEATURES●Ultra-wide 85-305VAC and 70-430VDC input voltage range ●Accepts AC or DC input (dual-use of same terminal)●Operating ambient temperature range:-40℃to +85℃●High I/O isolation test voltage up to 4000VAC●Multi application,compact size,flexible layout ●No-load power consumption 0.1W●Output short circuit,over-current protection ●Plastic case meets UL94V-0flammability ●Pollution level Ⅲ(meet IEC62368-1)LS05-23BxxDR3series is one of Mornsun’s miniaturized potting highly efficient green power AC-DC Converters.They feature wide input range accepting either AC or DC voltage,high reliability,low power consumption,reinforced isolation and strong applicability.All models are particularly suitable for industrial control,electric power,instrumentation and smart home applications which have high requirement for dimension and don’t have high requirement on EMC.For extremely harsh EMC environment,we recommend using the application circuit show in Design Reference of this datasheet.Input SpecificationsItemOperating Conditions Min.Typ.Max.Unit Input Voltage Range AC input 85--305V AC DC input70--430VDC Input Frequency 47--63HzInput Current 115V AC ----0.2A 230V AC ----0.1Inrush Current115V AC --20--230V AC--40--Recommended External Input Fuse 1A,slow-blow,required(The actual use needs to be selected according to the application enviroment)Hot PlugUnavailableOutput SpecificationsItemOperating Conditions Min.Typ.Max.UnitOutput Voltage Accuracy 10%-100%load --±5--%Line Regulation Rated load --±1.5--Load Regulation 10%-100%load--±3--Ripple &Noise *20MHz bandwidth (peak-to-peak value),10%-100%load--80150mV Temperature Coefficient --±0.15--%/°C Stand-by Power Consumption230V AC--0.100.15W Selection GuideCertificationPart No.Output PowerNominal Output Voltage and Current (Vo/Io)Efficiency at 230V AC(%)Typ.Capacitive Load(uF)Max.ENLS05-23B03DR3 3.3W3.3V/1000mA 682200LS05-23B05DR35W 5V/1000mA 711500LS05-23B09DR39V/560mA 74680LS05-23B12DR312V/420mA 75470LS05-23B15DR315V/340mA 77330LS05-23B24DR324V/210mA77100Note:The nominal output voltage refers to the voltage applied to the load terminal after adding external circuits.Short Circuit Protection Hiccup,continuous,self-recovery Over-current Protection≥110%Io,self-recovery Minimum Load10----%Hold-up Time 115V AC input--8--ms 230V AC input--40--Note:1.*The“parallel cable”method is used for ripple and noise test,please refer to AC-DC Converter Application Notes for specific information;2.The product is able to work with0%-10%load and with stable output.General SpecificationsItem Operating Conditions Min.Typ.Max.UnitIsolation Input-output Electric Strength Test for1min.,leakage current<5mA4000----VACInsulation Resistance Input-output At500VDC100----MΩOperating Temperature-40--+85℃Storage Temperature-40--+105Storage Humidity----95%RHPower Derating +55℃to+85℃ 1.67----%/℃85V AC-100VAC 1.33----%/V AC 277V AC-305V AC0.72----Safety Standard Design refer to IEC/UL62368-1,IEC/EN60335-1, IEC/EN61558-1&EN62368-1(Report)Safety Class CLASS IIMTBF MIL-HDBK-217F@25°C>1,000,000h Mechanical SpecificationsCase Material Black plastic,flame-retardant and heat-resistant(UL94V-0)Dimension27.60x18.50x7.80mmWeight7.5g(Typ.)Cooling method Free air convectionElectromagnetic Compatibility(EMC)Emissions CECISPR32/EN55032CLASS A(Application circuit1,4)CISPR32/EN55032CLASS B(Application circuit2,3,5) RECISPR32/EN55032CLASS A(Application circuit1,4)CISPR32/EN55032CLASS B(Application circuit2,3,5)Immunity ESD IEC/EN61000-4-2Contact±6KV/Air±8KV Perf.Criteria B RS IEC/EN61000-4-310V/m perf.Criteria AEFTIEC/EN61000-4-4±2KV(Application circuit1,2)perf.Criteria BIEC/EN61000-4-4±4KV(Application circuit3,4,5)perf.Criteria BSurgeIEC/EN61000-4-5line to line±1KV(Application circuit1,2)perf.Criteria BIEC/EN61000-4-5line to line±2KV(Application circuit3,4)perf.Criteria BIEC/EN61000-4-5line to line±2KV/line to ground±4KV(Application circuit5)perf.Criteria BCS IEC/EN61000-4-610Vr.m.s perf.Criteria A Voltage dip,shortinterruption and voltagevariationIEC/EN61000-4-110%,70%perf.Criteria AProduct Characteristic CurveNote:①With an AC input between85-100VAC/277-305VAC and a DC input between70-120VDC/390-430VDC,the output power must be derated as per temperature derating curves;②This product is suitable for applications using natural air cooling;for applications in closed environment please consult factory oroneof our FAE. Additional Circuits Design ReferenceLS series additional circuits design referenceLS05series additional components selection guide(No EMC devices)Part No.C1(required)C2(required)L1(required)C3(required)C4CY1(required)TVSLS05-23B03DR310uF/450V(-25℃to+85℃,85-305VAC input;-40℃to+85℃,165-305VAC input)22uF/450V(-40℃to+85℃,85-305VAC input)820uF/6.3V(solid-state capacitor) 2.2uH/36mΩ/3.3A220uF/16V0.1uF/50V1.0nF/400V ACSMBJ7.0ALS05-23B05DR3470uF/16V(solid-state capacitor)LS05-23B09DR347uF/35V SMBJ12ALS05-23B12DR3270uF/16V(solid-state capacitor)4.7uH/60mΩ/2.2A SMBJ20ALS05-23B15DR3220uF/25V(solid-state capacitor)LS05-23B24DR3220uF/35V SMBJ30A Note:1.C1is used as filter capacitor with AC input(must be connected externally)and as EMC filter capacitor with DC input(must be connected),and it is recommended to use the capacitor with ripple current>200mA@100KHz.2.We recommend using an electrolytic capacitor with high frequency and low ESR(ESR of C3at low temperature of-40℃≤1.1Ω)rating for C3(refer to manufacture’s datasheet),electrolytic capacitor can be used for C2when applied in normal and high temperature bined with C2,L1,they form a pi-type filter circuit.Choose a capacitor voltage rating with at least20%margin,in other words not exceeding80%.C4is a ceramic capacitor,used for filtering high frequency noise.3.A suppressor diode(TVS)is recommended to protect the application in case of converter failure and specification should be1.2times of the output voltage.Environmental Application EMC SolutionLS series environmental application EMC solution selection tableRecommendedcircuitApplicationenvironmental Typical industryInput voltagerangeEnvironmenttemperature Emissions Immunity1Basic application None85-305V AC -40℃to+85℃CLASS A CLASSⅢ2Indoor civilenvironmentSmart home/Home appliances(2Y)-25℃to+55℃CLASS B CLASSⅢIndoor generalenvironmentIntelligent building/Intelligentagriculture3Indoor industrialenvironment Manufacturing workshop-25℃to+55℃CLASS B CLASSⅣ4Outdoor generalenvironmentITS/Video monitoring/Chargingpoint/Communication/Securityand protection-40℃to+85℃CLASS A CLASSⅣ5OutdoorindustrialenvironmentElectricity/Grid-40℃to+85℃Class B CLASSⅣElectromagnetic Compatibility Solution--Recommended Circuit1.Application circuit1——Basic applicationApplication circuit1Application environmental Ambient temperature range Immunity CLASS Emissions CLASS Basic application-40℃to+85℃CLASSⅢCLASS AFUSE1A/300V,slow-blow,requiredR124Ω/3W(wire-wound resistor,required)LDM 4.7mH/Max:15Ω/Min:0.2A Note:R1is the input plug-in resistor,this resistor needs to be a wire-wound resistor(required),please do not select chip resistor or carbon film resistor. 2.Application circuit2——Universal system recommended circuits for indoor civil/general environmentApplication circuit2Application environmental Ambient temperature range Immunity CLASS Emissions CLASS Indoor civil/general-25℃to+55℃CLASSⅢCLASS BComponent Recommended valueR124Ω/3W(wire-wound resistor,required)LDM 4.7mH/Max:15Ω/Min:0.2ACX0.1uF/310VACFUSE1A/300V,slow-blow,required Note1:In the home appliance application environment,the two Y capacitors of the primary and secondary need to be externally connected (CY1/CY2,value at2.2nF/250VAC),which can meet the EN60335certification.Note2:According to the certification requirements,the X capacitor needs to be connected in parallel with the bleeder resistance,the recommended resistance value is less than3.8MΩ,and the actual need to be selected according to the certification standard.Note3:R1is the input plug-in resistor,this resistor needs to be a wire-wound resistor(required),please do not select chip resistor or carbon film resistor. 3.Application circuit3——Universal system recommended circuits for indoor industrial environmentApplication circuit3Application environmental Ambient temperature range Immunity CLASS Emissions CLASSIndoor industrial-25℃to+55℃CLASSⅣCLASS BComponent Recommended valueMOV S14K350CX0.1uF/310V ACLDM 4.7mH/Max:15Ω/Min:0.2AR133Ω/3W(wire-wound resistor,required)FUSE2A/300V,slow-blow,required Note1:According to the certification requirements,the X capacitor needs to be connected in parallel with the bleeder resistance,the recommended resistance value is less than3.8MΩ,and the actual need to be selected according to the certification standard.Note2:R1is the input plug-in resistor,this resistor needs to be a wire-wound resistor(required),please do not select chip resistor or carbon film resistor. 4.Application circuit4——Universal system recommended circuits for outdoor general environmentApplication circuit4Application environmental Ambient temperature range Immunity CLASS Emissions CLASSOutdoor general environment-40℃to+85℃CLASSⅣCLASS AComponent Recommended valueMOV S14K350LDM 4.7mH/Max:15Ω/Min:0.2AR133Ω/3W(wire-wound resistor,required)FUSE2A/300V,slow-blow,required Note:R1is the input plug-in resistor,this resistor needs to be a wire-wound resistor(required),please do not select chip resistor or carbon film resistor.5.Application circuit5——Universal system recommended circuits for outdoor industrial environmentApplication circuit5Application environmental Ambient temperature range Immunity CLASS Emissions CLASSOutdoor industrial environment-40℃to+85℃CLASSⅣCLASS BComponent Recommended valueC122uF/450VMOV S14K350CX0.1uF/310V ACLDM330uH/960mΩMax/0.31ALCM 3.1mHR147Ω/5W(wire-wound resistor,required)CY3/CY41nF/400V ACFUSE2A/300V,slow-blow,required Note1:According to the certification requirements,the X capacitor needs to be connected in parallel with the bleeder resistance,the recommended resistance value is less than3.8MΩ,and the actual need to be selected according to the certification standard.Note2:R1is the input plug-in resistor,this resistor needs to be a wire-wound resistor(required),please do not select chip resistor or carbon film resistor.6.For additional information please refer to application notes on . Dimensions and Recommended LayoutLS05-23BxxDR3series dimensionsLS05-23BxxDR3series recommended padNote:There is a slot(non-metallic hole)between pin4/5.For details,please refer to the recommended dimensions or pad.Note:1.For additional information on Product Packaging please refer to .Packaging bag number:58220074;2.External electrolytic capacitors are required to modules,more details refer to typical applications;3.This series is a potting product,at least6.4mm creepage distance between the primary and secondary external components of themodule is needed to meet the safety requirement,refer to the recommended welding hole design in the external dimension drawing;4.Unless otherwise specified,parameters in this datasheet were measured under the conditions of Ta=25℃,humidity<75%,nominal inputvoltage(115V and230V)and rated output load;5.All index testing methods in this datasheet are based on our company corporate standards;6.We can provide product customization service,please contact our technicians directly for specific information;7.Products are related to laws and regulations:see"Features"and"EMC";8.Our products shall be classified according to ISO14001and related environmental laws and regulations,and shall be handled byqualified units.Mornsun Guangzhou Science&Technology Co.,Ltd.Address:No.5,Kehui St.1,Kehui Development Center,Science Ave.,Guangzhou Science City,Huangpu District,Guangzhou,P.R.China Tel:86-20-38601850Fax:86-20-38601272E-mail:***************。
FSP3 FSP7 FSP13 FSP30 FSP40指示书说明书
S p e c i f i c a t i o nsSpectrum Analyzer ¸FSPSpecificationsSpecificationsSpecifications are valid under the following conditions:15 minutes warm-up time at ambient temperature, specified environmental conditions met, calibration cycle adhered to, and total calibration performed.Data without tolerances: typical values only.Data designated "nominal" applies to design parameters and is not tested.Data designated "σ = xx dB" is shown as standard deviation.¸FSP3¸FSP7¸FSP13¸FSP30¸FSP40 FrequencyFrequency range9 kHz to 3GHz9 kHz to 7GHz9 kHz to 13.6GHz9 kHz to 30GHz9 kHz to 40GHz Frequency resolution0.01 HzInternal reference frequency (nominal)Aging per year1)1)After 30 days of operation.1 × 10–6Temperature drift 1 × 10–6With option ¸FSP-B4 (OCXO)Aging per year1) 1 × 10–7Temperature drift 1 × 10–8External reference frequency10 MHzFrequency display with marker or frequency counterMarker resolution span/500Max. deviation(sweep time >3× auto sweep time)±(frequency × reference frequency + 0.5% × span + 10% × resolution bandwidth + ½ (last digit)) Frequency counter resolution0.1 Hz to 10 kHz (selectable)Count accuracy (S/N >25 dB)±(frequency × reference frequency + ½ (last digit))Frequency span0 Hz,10 Hz to 3GHz0 Hz,10 Hz to 7GHz0 Hz,10 Hz to 13.6GHz0 Hz,10 Hz to 30GHz0 Hz,10 Hz to 40GHzMax. span deviation0.1% Spectral purity (dBc (1 Hz)) SSB phase noise, f = 500 MHz, for f > 500 MHz see diagrams belowCarrier offset100 Hz<–84, typ.–90 1 kHz<−100, typ.−108 10 kHz<−106, typ. −113100 kHz2)2)Valid for span >100 kHz.<−110, typ. −1131 MHz2)<−120, typ.−125 10 MHz typ.−145 Residual FMf = 500 MHz, RBW 1 kHz,sweep time 100 mstyp. 3 Hz2 Spectrum Analyzer ¸FSPSpectrum Analyzer ¸FSP3Sweep timeSpan ≥10 Hz 2.5 ms to 16000 sMax. deviation1%Span 0 Hz 1 µs to 16000 sResolution125 nsResolution bandwidthsBandwidths10 Hz to 10 MHz (–3 dB) in 1, 3 sequenceEMI bandwidths200 Hz, 9 kHz, 120 kHz (–6 dB)Bandwidth accuracy≤100 kHz<3%300 kHz to 3 MHz<10%10 MHz+10%, –30%Shape factor –60 dB: –3 dB≤100 kHz<5:1 (Gaussian filters)300 kHz to 3 MHz<15:1 (4-pole synchronously tuned filters)10 MHz<7:1Shape factor –60 dB: –6 dBEMI bandwidths<5:1Video bandwidths 1 Hz to 10 MHz in 1, 3 sequenceFFT filterBandwidths 1 Hz to 30 kHz (–3 dB) in 1, 3 sequenceBandwidth accuracy5%, nominalShape factor –60dB:–3 dB 2.5:1 nominalChannel filterBandwidths100; 200; 300; 500 Hz;1; 1.5; 2; 2.4; 2.7; 3; 3.4; 4; 4.5; 5; 6; 8.5; 9; 10; 12.5; 14; 15; 16; 18 (RRC); 20; 21; 24.3 (RRC); 25; 30; 50; 100;150; 192; 200; 300; 500 kHz; 1;1.228; 1.5; 2; 3; 5 MHz1.28 (RRC), 3.84 (RRC), 4.096 (RRC)LevelDisplay range displayed average noise level to 30 dBmMaximum input levelDC voltage50 V0 VRF attenuation 0 dBCW RF power20 dBmPulse spectral density97 dBµV (1 MHz)RF attenuation ≥10 dBCW RF power30 dBmMax. pulse voltage150 V50 VMax. pulse energy (10 µs) 1 mWs0.5 mWs1 dB compression of input mixer0 dB RF attenuation, f > 200 MHz0 dBm nominalIntermodulation3rd-order intermodulationIntermodulation-free dynamic range, level 2 × –30 dBm, ∆f > 5 × RBW or 10 kHz, whichever is larger20 MHz to 200 MHz>70 dBc, TOI >5 dBm200 MHz to 3 GHz>74 dBc, TOI >7 dBm (typ. 10 dBm)3 GHz to 7 GHz−>80 dBc, TOI >10 dBm (typ. 15 dBm)7 GHz to 13.6 GHz−−>80 dBc, TOI >10 dBm13.6 GHz to 30 GHz−−−>76 dBc, TOI >8dBm>80 dBc, TOI >10 dBm 30 GHz to 40 GHz−−−−>80 dBc, TOI >10 dBm With optional Electronic Attenuator ¸FSP-B25 switched on20 MHz to 200 MHz>74 dBc, TOI > 7 dBm−200 MHz to 3 GHz>80 dBc, TOI > 10 dBm−3 GHz to 7 GHz>84 dBc, TOI > 12 dBm−4 Spectrum Analyzer ¸FSPSecond harmonic intercept point (SHI)<100 MHz typ. 25 dBm100 MHz to 1.5 GHz typ. 35 dBm1.5 GHz to 7 GHz−typ. 80 dBm7 GHz to 13.6 GHz−−typ. 80 dBm13.6 GHz to 30 GHz−−−typ. 80 dBm30 GHz to 40 GHz−−−−typ.80 dBm Displayed average noise level(0 dB RF attenuation, RBW 10 Hz, VBW 1 Hz, 20 averages, trace average, span 0 Hz, termination 50 Ω)Frequency9 kHz<−95 dBm100 kHz<−100 dBm1 MHz<−120 dBm, typ. −125 dBm10 MHz to 1 GHz<−142 dBm,typ.−145 dBm<−140 dBm, typ. −145 dBm1 GHz to 3 GHz<−140 dBm,typ. −145 dBm<−138 dBm, typ. −143 dBm3 GHz to 7 GHz−<−138 dBm,typ. −143 dBm<−135 dBm, typ. −140 dBm7 GHz to 13.6 GHz−−<−132 dBm, typ. −138 dBm13.6 GHz to 22 GHz−−−<−120 dBm,typ. −128 dBm−22 GHz to 30 GHz−−−<−115 dBm,typ. −123 dBm−13.6 GHz to 20 GHz−−−−<−120 dBm,typ. −128 dBm 20 GHz to 30 GHz−−−−<−120 dBm,typ. −128 dBm 30 GHz to 40 GHz−−−−<−112 dBm,typ. −120 dBm Displayed average noise level with preamplifier on (option ¸FSP-B25)10 MHz to 2 GHz<–152 dBm−2 GHz to 7 GHz<–150 dBm−Immunity to interferenceImage frequency>70 dBIntermediate frequency (f <3 GHz)>70 dBSpurious responses (f >1 MHz, withoutinput signal, 0 dB attenuation)<−103 dBmOther spurious (with input signal, mixer level <–10 dBm, ∆f >100kHz)f <7 GHz: <−70 dBc f <13.6 GHz: <−64 dBc f <30 GHz: <−56 dBcLevel displayScreen501 × 400 pixels (one diagram), max. two diagrams with independent settingsLogarithmic level scale10 dB to 200 dB, in steps of 10 dBLinear level scale10% of reference level per level division (10 divisions)Traces max. 3, with two diagrams on screen max. 3 per diagramTrace detector max peak, min peak, auto peak, sample, quasi-peak, average, RMSTrace functions clear/write, max. hold, min hold, averageNumber of test points501, selectable in steps of approx. factor 2, 125 to 8001Setting range of reference levelLogarithmic level display–130 dBm to 30 dBm, in steps of 0.1 dBLinear level display70.71 nV to 7.07 V in steps of 1%Units of level scale dBm, dBmV, dBµV, dBµA, dBpW (log level display), mV, µV, mA, µA, pW, nW (linear level display)Max. uncertainty of level measurementAt 128 MHz, −30 dBm (RF attenuation10dB, RBW 10kHz, ref. level –20 dBm)<0.2 dB (σ = 0.07 dB)Spectrum Analyzer ¸FSP5Frequency response<50 kHz <+0.5/− 1.0 dB50 kHz to 3 GHz<0.5 dB (σ = 0.17 dB)3 GHz to 7 GHz–<2 dB(σ = 0.7 dB)7 GHz to 13.6 GHz––<2.5 dB1)13.6 GHz to 30 GHz–––<3 dB1)30 GHz to 40 GHz––––<4 dB1) Frequency response with option ¸FSP-B25 switched on (preamplifier, electronic attenuator)10 MHz to 3 GHz<1 dB(σ = 0.33 dB)–3 GHz to 7 GHz–<2 dB(σ = 0.7 dB)–Attenuator<0.2 dB (σ = 0.07 dB)Reference level switching<0.2 dB (σ = 0.07 dB)Display nonlinearity LOG/LIN (S/N >16 dB)RBW ≤100 kHz0 dB to –70 dB<0.2 dB (σ = 0.07 dB)–70 dB to –90 dB<0.5 dB (σ = 0.17 dB)RBW ≥300 kHz0 dB to –50 dB<0.2 dB (σ = 0.07 dB)–50 dB to –70 dB<0.5 dB (σ = 0.17 dB)Bandwidth switching uncertainty (ref. to RBW = 10 kHz)10 Hz to 100 kHz <0.1 dB (σ = 0.03 dB)300 kHz to 10 MHz<0.2 dB (σ = 0.07 dB)1 Hz to 3 kHz, FFT<0.2 dB (σ = 0.03 dB)Total measurement uncertainty0 GHz to 3 GHz0.5 dBTrigger functionsTriggerSpan ≥10 HzTrigger source free run, video, external, IF levelTrigger offset125 ns to 100 s, resolution 125 ns min. (or 1% of offset)Span = 0 HzTrigger source free run, video, external, IF levelTrigger offset±125 ns to 100 s, min. resolution 125 ns, dependent on sweep timeMax. deviation of trigger offset±(125 ns + (0.1% × delay time))Gated sweepTrigger source external, IF level, videoGate delay 1 µs to 100 sGate length125 ns to 100 s, min. resolution 125 ns or 1% of gate lengthMax. deviation of gate length±(125 ns + (0.05% × gate length))Inputs and outputs (front panel)RF input N female, 50 Ωtest port system 50 Ω,N female,3.5 mm female2)test port system 50 Ω,N female,K female2)VSWR (RF attenuation >0 dB)f <3 GHz 1.5:1f <7 GHz− 2.0:1f <13 GHz−− 2.5:1f <30 GHz−−− 3.0:1f <40 GHz−−−− 3.0:1 Input attenuator0 dB to 70 dB in 10 dB stepsWith option ¸FSP-B250 dB to 75 dB in 5 dB steps not availableProbe power supply+15 V DC, –12.6 V DC and ground, max. 150 mAKeyboard connector PS/2 female for MF2 keyboardAF output (only with option ¸FSP-B3) 3.5 mm mini-jackOutput impedance10 ΩOpen-circuit voltage up to 1.5 V, adjustable6 Spectrum Analyzer ¸FSPInputs and outputs (rear panel)IF 20.4 MHz Z out= 50 Ω, BNC femaleLevelRBW ≤30 kHz, FFT–10 dBm at reference level, mixer level >–60 dBmRBW ≥100 kHz0 dBm at reference level, mixer level >–60 dBmReference frequencyOutput BNC femaleOutput frequency10 MHzLevel 0 dBm, nominalInput10 MHzRequired level0 dBm into 50 ΩOthersPower supply for noise source BNC female, 0 V and 28 V, switchable, max. 100mAExternal trigger/gate input BNC female, >10 kΩTrigger voltage 1.4 V (TTL)IEC/IEEE bus remote control interface to IEC 625-2 (IEEE 488.2)Command set SCPI 1997.0Connector24-pin Amphenol femaleInterface functions SH1, AH1, T6, L4, SR1, RL1, PP1, DC1, DT1, C0Serial interface RS-232-C (COM), 9-pin sub-D connectorPrinter interface parallel (Centronics-compatible)Mouse connector PS/2 femaleConnector for ext. monitor (VGA)15-pin sub-D connectorGeneral dataDisplay21 cm TFT colour display (8.4”)Resolution640 × 480 pixels (VGA resolution)Pixel failure rate<2 × 10 –5Mass memory 1.44 MByte 3½” disk drive (built-in), hard diskData storage>500 instrument settings and tracesTemperaturesOperating temperature range+5°C to +40°CPermissible temperature range+5°C to +45°CStorage temperature range–40°C to +70°CDamp heat+40°C at 95% relative humidity (EN 60068-2-30)Mechanical resistanceVibration, sinusoidal 5 Hz to 150 Hz, max. 2 g at 55 Hz; 0.5 g from 55 Hz to 150 Hz; meets EN60068-2-6, EN60068-2-30, EN61010-1,MIL-T-28800D, class 5Vibration, random10 Hz to 100 Hz, acceleration 1 g (rms)Shock test40 g shock spectrum, meets MIL-STD-810C and MIL-T-28800D, classes 3 and 5Recommended calibration interval 2 years for operation with external reference,1 year with internal referencePower supplyAC supply100 V AC to 240 V AC, 50 Hz to 400Hz, 3.1 A to 1.3 A, class of protection I to VDE411Typical power consumption70 VA 120 VA150 VASafety meets EN61010-1, UL3111-1, CSAC22.2 No. 1010-1,RFI suppression meets EMC Directive of EU (89/336/EEC) and German EMC lawTest mark VDE, GS, CSA, CSA-NRTL/CDimensions in mm (W × H × D)412 × 197 × 417Weight10.5 kg11.3 kg12 kg1)RF attenuation 10 dB, sweep time >1s/1 GHz.2)See recommended extras for alternate connectors.Spectrum Analyzer ¸FSP7Specifications of optionsTracking Generator ¸FSP-B9Unless specified otherwise, specifications not valid for frequency range from –3 × RBW to +3 × RBW; however, at least not valid from –9 kHz to +9 kHz.The specified level accuracy of the tracking generator is valid under the following conditions: RF attenuation ≥ 20 dB and sweep time ≥2000 ms.FrequencyFrequency range9 kHz to 3 GHzFrequency offsetSetting range±150 MHzResolution 1 HzSpectral purity (dBc (1 Hz)) SSB phase noise, f = 500 MHz, carrier offset 100 kHzNormal mode typ. –90With FM modulation on typ. –70LevelLevel setting range–30 dBm to 0 dBm in steps of 0.1 dBLevel setting range with AM–30 dBm to –6 dBm in steps of 0.1 dBMax. deviation of output level, 128 MHz, 0 dBm<1 dBFrequency responseOutput level 0 dBm, 100 kHz to 2 GHz<1 dBOutput level 0 dBm to −25 dBm, 9 kHz to 3 GHz<3 dBDynamic rangeAttenuation measurement range, RBW = 1 kHz, f > 10 MHz120 dBSpuriousHarmonics, output level –10 dBm typ. –30 dBcNonharmonics, output level 0 dBm typ. –30 dBcModulationModulation format (external)I/Q, AM, FM, FM-DC, PM, ASK, FSKAM, f > 10 MHzModulation depth0% to 99%Modulation frequency range0 Hz to 1 MHzFM, f > 10 MHzFrequency deviation0 Hz to 20 MHzModulation frequency range0 Hz to 100 kHzI/Q modulation, f > 10 MHz0 Hz to 30 MHz typ. 1 dBInputs and outputs (front panel)RF output N female, 50 ΩVSWR typ. 2:1Inputs and outputs (rear panel)TG/AM IN V max(pp) = 1 V; Z in = 50 Ω, BNC femaleTG Q/FM IN V max(pp) = 1 V; Z in = 50 Ω, BNC femaleExternal Generator Control ¸FSP-B10Supported signal generators¸SME02/03/06, ¸SMG, ¸SMGL, ¸SMGU, ¸SMH, ¸SMHU,¸SMIQ02B/02E/03B/03E/04B/06B¸SML, ¸SMR20/27/30/40/60¸SMP02/22/03/04,¸SMX, ¸SMY¸SMT02/03/06LAN Interface ¸FSP-B16Connector (rear panel)RJ-45Supported protocols10Base-T (IEEE standard 10 Mbit/s 802.3)100Base-TX (IEEE standard 100 Mbit/s 802.3u)Extended Environmental Specification ¸FSP-B20Temperature range (noncondensing)Operating temperature range 0°C to +50°CPermissible temperature range0°C to +55°CMechanical resistanceVibration, random10 Hz to 300 Hz, acceleration 1.9 g (rms)8 Spectrum Analyzer ¸FSPLO/IF ports for external Mixers ¸FSP-B21 (¸FSP40 only)LO levelFrequency range 7 GHz to 13.2 GHzLevel+15.5 dBm ±3 dBIF inputIF frequency 404.4 MHzFull scale level2 port mixer, LO output/IF input (front) –20 dBmLevel deviation<1dBIF level –30 dBm, reference level –20 dBm, RBW 30 kHz,LO output/IF input (front)Full scale level3 port mixer, IF input (front) –20 dBmLevel deviationIF level –30 dBm, reference level –20 dBm, RBW 30 kHz, IF input (front)<1dBInputs and outputs (front)LO output/IF input SMA female, 50 ΩIF input SMA female, 50 ΩElectronic Attenuator ¸FSP-B25 (only for ¸FSP3 and ¸FSP7)FrequencyFrequency range10 MHz to 7 GHzInput attenuator range (mechanical)0 dB to 75 dB in 5 dB stepsElectronic attenuation range0 dB to 30 dB in 5 dB stepsPreamplifier20 dB, switchableDisplayed average noise level with preamplifier on (0 dB RF attenuation, RBW 10 Hz, VBW 1 Hz, 20 averages, trace average, span 0 Hz, termination 50 Ω) 10 MHz to 2 GHz<–152 dBm2 GHz to 7 GHz<–150 dBmIntermodulation with electronic attenuator on3rd-order intermodulation, intermodulation-free dynamic range, level 2 × –30 dBm, ∆f >5 × RBW or 10 kHz, whichever is larger20 MHz to 200 MHz>74 dBc, TOI >7 dBm200 MHz to 3 GHz>80 dBc, TOI >10 dBm3 GHz to 7 GHz>84 dBc, TOI >12 dBmMax. deviation of level measurement<0.2 dB (σ = 0.07 dB)128 MHz, –30 dBm (RF attenuation 10 dB, RBW 10 kHz,ref. level –20dBm), preamplifier onElectronic attenuator<0.2 dB (σ = 0.07 dB)Frequency response with preamplifier, electronic attenuator10 MHz to 3 GHz<1.0 dB (σ = 0.33 dB)3 GHz to 7 GHz<2 dB (σ = 0.7 dB)Trigger Port ¸FSP-B28Output voltage high ≤1.4 Vlow ≥0.7 VTrigger port connector25-pin sub-D femaleFrequency range extension 20 Hz ¸FSP-B29Frequency range 20 Hz to f maxFrequency response <9 kHz <1 dBDisplayed average noise level0 dB RF attenuation, RBW 10 Hz, VBW 1 Hz, 20 averages, trace average, span 0 Hz, termination50Ω20 Hz<–58 dBm100 Hz<–75 dBm1 kHz<–85 dBmDC Power Supply ¸FSP-B30Input voltage range10 V to 28 V DC25 A to 12.5 AOutput voltage 120 V to 360 V DC/300 WCurrent consumption (V DC = 12 V, ¸FSP without options, default settings)¸FSP3typ. 6 A¸FSP30typ. 8 AOperating temperature range 0°C to +50°CStorage temperature range–40°C to +70°CDimensions in mm (W × H × D)145 × 154 × 65Weight0.6 kgSpectrum Analyzer ¸FSP9Battery Pack ¸FSP-B31/-B32NiMH battery pack with built-in load control for all ¸FSP and ¸ESPI models with options ¸FSP-B1 and ¸FSP-B30Input voltage of battery pack10 V to 28 V DCInput voltage power supply (battery charge)24 V DC/max. 3 AOutput voltageBattery operation13.2 V DC/200 WhBypass operation10 V to 28 V DC/10 ATypical operating times (¸FSP without options)¸FSP3 2 h¸FSP30 1.5 hCharging time 5 h at 25°COperating temperature range (discharging)0°C to +50°COperating temperature range (charging)+10°C to +40°CStorage temperature range (<1 year)–20°C to +35°CStorage temperature range (<1 month)–20°C to +55°CDimensions (W × H × D)400 mm × 134 mm × 42 mmWeight 3.7 kgAC adapter (¸FSP-B31 only)Input voltage range100 V to 240 V AC ±10%Input frequency range50 Hz to 60 Hz ±5%Input power140 VAOutput voltage24 VOutput current 3 AOperating temperature range 0°C to +50°CStorage temperature range –20°C to +70°CDimensions (W × H × D)132 mm × 58 mm × 30 mmWeight0.3 kgOrdering informationOrder designation Type Order No. Spectrum Analyzer, 9 kHz to 3 GHz¸FSP31164.4391.03 Spectrum Analyzer, 9 kHz to 7 GHz¸FSP71164.4391.07 Spectrum Analyzer, 9 kHz to 13.6 GHz¸FSP131164.4391.13 Spectrum Analyzer, 9 kHz to 30 GHz¸FSP301164.4391.30 Spectrum Analyzer, 9 kHz to 40 GHz¸FSP401164.4391.40 Accessories suppliedPower cable, compact manual, CD-ROM with operating manual and service manual.¸FSP30: test port adapter with 3.5 mm female (1021.0512.00) and N female (1021.0535.00) connector.¸FSP40: test port adapter with K female (1036.4770.00) and N female (1036.4777.00) connector.OptionsOrder designation Type Order No.Retrofittable RemarksOptionsDelete Manuals¸FSP-B01129.8394.02Rugged Case, carrying handle (factory-fitted)¸FSP-B11129.7998.02noAM/FM Audio Demodulator¸FSP-B31129.6491.02yes not with ¸FSP-B15. OCXO Reference Frequency ¸FSP-B41129.6740.02yesTV Trigger/RF Power Trigger¸FSP-B61129.859.4.02yes not with ¸FSP-B21. Internal Tracking Generator 9 kHz to 3GHz, I/Q modulator, for all ¸FSP models¸FSP-B91129.6991.02yesExternal Generator Control for all ¸FSP models¸FSP-B101129.7246.02yesPulse Calibrator for ¸FSP¸FSP-B151155.1006.02yes not with ¸FSP-B3;required for ¸FS-K72/-K73 LAN Interface 100BT for all ¸FSP models with Windows XP (1164.4391.xx)¸FSP-B161129.8042.03yes10 Spectrum Analyzer ¸FSPOrder designation Type Order No.Retrofittable RemarksLAN Interface 100BT for all ¸FSP models with Windows NT (1043.4495.xx)¸FSP-B161129.8042.02yesExtended Environmental Specification ¸FSP-B201155.1606.06noLO/IF Ports for External Mixers¸FSU-B211157.1090.02yes not with ¸FSP-B6;only for ¸FSP40¸FSP-B251129.7746.02yesElectronic Attenuator, 0 dB to 30 dB, 5 dB steps, integrated preamplifier for¸FSP3 and ¸FSP7Trigger Port for ¸FSP for indication of trigger conditions¸FSP-B281162.9915.02yesFrequency Range Extension 20 Hz for ¸FSP3/7¸FSP-B291163.0663.07noFrequency Range Extension 20 Hz for ¸FSP13/30¸FSP-B291163.0663.30noFrequency Range Extension 20 Hz for ¸FSP40¸FSP-B291163.0663.40noDC Power Supply for Spectrum Analyzers ¸FSP¸FSP-B301155.1158.02yesBattery Pack for Spectrum Analyzers ¸FSP¸FSP-B311155.1258.02yes¸FSP-B1 and¸FSP-B30 required Spare Battery Pack for Spectrum Analyzers ¸FSP¸FSP-B321155.1506.02yes¸FSP-B31 required Demodulation Hardware and Memory Extension¸FSP-B701157.0559.02yes required for ¸FS-K72/-K73; ¸FSP-B15 required SoftwarePhase Noise Measurement Software¸FS-K41108.0088.02GSM/EDGE Application Firmware, Mobile¸FS-K51141.1496.02AM/FM/ϕM Measurement Demodulator¸FS-K71141.1796.02Application Firmware for Bluetooth® Measurements¸FS-K81157.2568.02Power Sensor Measurements¸FS-K91157.3006.02supports ¸NRP-Z11/-Z21with ¸NRP-Z4 USB con-nectorApplication Firmware for Noise Figure and Gain Measurements¸FS-K301300.6508.02Preamplifier ¸FSP-B25recommended3GPP BTS/Node B FDD Application Firmware¸FS-K721154.7000.02¸FSP-B15 and -B70required3GPP UE FDD Application Firmware¸FS-K731154.7252.02¸FSP-B15 required,¸FSP-B70 recommended 3GPP HSDPA BTS Application Firmware¸FS-K741300.7156.02¸FS-K72 required3GPP TD-SCDMA BTS Application Firmware¸FS-K761300.7291.023GPP TD-SCDMA UE Application Firmware¸FS-K771300.8100.02CDMA2000® (IS-95) 1xEV-DV BTS FDD Application Firmware¸FS-K821157.2316.02CDMA2000® 1xEV-DV MS Application Firmware¸FS-K831157.2416.02CDMA2000® 1xEV-DO BTS Application Firmware¸FS-K841157.2851.02CDMA2000®-1xEV-DO MS Application Firmware¸FS-K851300.6689.02WLAN 802.11a TX Measurements Application Firmware¸FSP-K901300.6650.02The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by Rohde&Schwarz is under license.CDMA2000® is a registered trademark of the Telecommunications Industry Association (TIA -USA).Spectrum Analyzer ¸FSP11Europe:Tel:+491805124242,e-mail:*********************************.com·USA:Tel.+1410-910-7988,e-mail:*********************************.comAsia:Tel.+6568463710,e-mail:***********************************.com¸i s a r e g i s t e r e d t r a d e m a r k o f R o h d e &S c h w a r z G m b H &C o . K G · T r a d e n a m e s a r e t r a d e m a r k s o f t h e o w n e r s · P r i n t e d i n G e r m a n y (B i a s )P D 0758.1206.22 · S p e c t r u m A n a l y z e r ¸F S P · V e r s i o n 05.00 · O c t o b e r 2004 · D a t a w i t h o u t t o l e r a n c e l i m i t s i s n o t b i n d i n g · S u b j e c t t o c h a n g eCertified Quality System ISO 9001Certified Environmental SystemISO 14001Product brochure see PD 0758.1206.12 and at (search term: FSP)Recommended extrasDesignationTypeOrder No.Headphones 0708.9010.00US Keyboard with Trackball ¸PSP-Z21091.4100.02PS/2 Mouse¸FSE-Z21084.7043.02DC Block,10kHz to 18GHz (type N)¸FSE-Z41084.7443.02Colour Monitor, 15", 230 V ¸PMC31082.6004.02IEC/IEEE Bus Cable, 1 m ¸PCK 0292.2013.10IEC/IEEE Bus Cable, 2 m ¸PCK 0292.2013.2019" Rack Adapter (not for ¸FSP-B1)¸ZZA4781096.3248.00Soft Carrying Case, grey¸ZZT4731109.5048.00Printed operating manual (German)–1093.4820.11Printed operating manual (English)–1093.4820.12Printed service manual (German)–1093.4820.81Printed service manual (English)–1093.4820.82Matching Pads, 75 ΩL Section¸RAM 0358.5414.02Series Resistor, 25 Ω1)1)Taken into account in device function RF INPUT 75 Ω.¸RAZ 0358.5714.02SWR Bridge, 5 MHz to 3 GHz ¸ZRB2 0373.9017.52SWR Bridge, 40 kHz to 4 GHz ¸ZRC 1039.9492.52High-Power Attenuators, 100 W 3/6/10/20/30 dB¸RBU1001073.8495.XX (XX=03/06/10/20/30)High-Power Attenuators, 50 W 3/6/10/20/30 dB ¸RBU501073.8695.XX (XX=03/06/10/20/30)For ¸FSP30Test Port Adapter, 3.5 mm male –1021.0529.00Test Port Adapter, N male–1021.0541.00Microwave Measurement Cable and Adapter Set ¸FS-Z151046.2002.02For ¸FSP40Test Port Adapter K male –1036.4802.00Test Port Adapter N male –1036.4783.00Test Port Adapter 2.4 mm female¸FSE-Z51088.1627.02Related data sheetsTitleOrder No.TV Trigger/RF Power Trigger ¸FSP-B6PD 0757.6433Noise Measurement Software ¸FS-K3 for Spectrum Analyzers ¸FSE, ¸FSIQ and ¸FSP PD 0757.2380Phase Noise Measurement Software ¸FSE-K4PD 0757.6727GSM/EDGE Application Firmware ¸FS-K5 for ¸FSP PD 0757.6185FM Measurement Demodulator ¸FS-K7 PD 0757.6685Bluetooth Application Firmware ¸FS-K8PD 0757.7730Application Firmware for Noise Figure and Amplifier Measure-ments R&S®FS-K30PD 0758.0839.32WCDMA 3GPP Application Firmware ¸FS-K72/-K73/-K74 PD 0757.7246TD-SCDMA Test Application Firmware ¸FS-K76/-K77 PD 0758.0880.32CDMA2000® Base Station Test Application Firmware 1xEV-DO Base Station Test Application Firmware ¸FS-K82/-K84PD 0758.1712.32Mobile Station Test Application Firmware ¸FS-K83/¸FS-K85PD 0758.1729.32WLAN Application Firmwar e ¸FSQ-K91/ ¸FSP-K90PD 0758.1435.12。
Opone收发器
第一部分光纤收发器FT-100A 快速以太网光纤收发器系列FT-101A快速以太网光纤收发器系列FT-200A千兆以太网光纤收发器系列FT-200千兆以太网光纤收发器系列FT-120A双电口光纤收发器系列FT-150A四电口光纤收发器系列FTC-8光纤收发器机箱FTC-14光纤收发器机架FTC-16光纤收发器机架FT-100A 快速以太网光纤收发器系列概述:OpOne FT-100A为10/100Mbps自适应快速以太网光纤收发器(亦称光电介质转换器),可将10Base-T和100Base-TX双绞线电信号同100Base-FX光信号进行相互转换。
使网络的传输距离从铜线100m的极限扩展到120Km(单模全双工方式)。
支持两种不同的网络连接媒体类型:10/100Base-TX和100Base-FX,通过使用交换技术和存储转发技术来实现两种网络连接媒体之间的数据传输。
支持双纤多模、双纤单模和单纤单模多种光纤传输。
特点:自动适应10Mbps和100Mbps环境,便于网络的升级内置高效交换核心,实现流量控制,减少广播包支持全双工和半双工传输模式,能自动协商支持双绞线口自动交叉,方便系统调试安装支持最长1552byte超长数据包传输支持VLAN标签超长数据包传输支持QoS,保证VOIP数据包传输支持STP生成树,构成冗余网络低功耗,低发热,能长时间稳定工作;支持双纤多模、双纤单模和单纤单模多种光纤口选择,扩展了用户的需求。
产品图片:FT-100A(双纤单/多模外置电源) FT-100APS(单纤单模内置电源) FT-100AC(双纤单纤单模块卡)参数规格接入方式10/100Mbps标准IEEE802.3 10Base-T Ethernet,IEEE802.3u,100Base-TX/FX Fast Ethernet, IEEE802.3x Flow control,IEEE802.1q VLAN,IEEE802.1p QoS,IEEE802.1d Spanning Tree波长850nm/1310nm/1550nm传输距离双纤多模:2Km,双纤单模:25/40/60/80/100/120Km,单纤单模:25/40/60/80/100Km五类双绞线:100m端口1个RJ45口:连接STP/UTP五类双绞线1个光纤口:多模—SC或ST(光纤尺寸50、62.5/125μm)订购信息:FT-101A快速以太网光纤收发器系列概述:OpOne FT-101A为10/100M自适应快速以太网光纤收发器(亦称光电介质转换器),可将10Base-T和100Base-TX双绞线电信号同100Base-FX光信号进行相互转换。
Micro800 非隔离型热电偶功能性插件模块 产品目录号 2080-TC2 说明书
接线图Micro800™ 非隔离型热电偶功能性插件模块产品目录号2080-TC2/idc/groups/literature/documents/wd/208 0-wd006_-mu-p.pdfFR Cette publication est disponible en français sous forme électronique (fichier PDF).Pour la télécharger, rendez-vous sur la page Internet indiquée ci-dessus.IT Questa pubblicazione è disponibile in Italiano in formato PDF. Per scaricarla collegarsi al sito Web indicato sopra.DE Diese Publikation ist als PDF auf Deutsch verfügbar. Gehen Sie auf die oben genannte Web-Adresse, um nach der Publikation zu suchen und sie herunterzuladen.ES Esta publicación está disponible en español como PDF. Diríjase a la dirección web indicada arriba para buscar y descarga esta publicación.PT Esta publicação está disponível em portugués como PDF. Vá ao endereço web que aparece acima para encontrar e fazer download da publicação.ZHZC2 Micro800™ 非隔离型热电偶功能性插件模块出版物 2080-WD006A-ZH-P - 2010年9 月环境和机柜防止静电放电本设备适用于在污染等级 2 工业环境、过电压 II 类应用中使用 (如 IEC 60664-1 所定义),在海拔高达 2000 米 (6562 英尺) 时不降额。
Sun 外部 I O 扩展单元 产品说明书
Sun适用于 SPARC Enterprise T5120/T5140/T5220/T5240/T5440服务器的 Sun 外部 I/O 扩展单元产品说明文件号码 821-1944-102010 年 3 月,修订版 A请回收版权所有 2010 Sun Microsystems, Inc., 4150 Network Circle, Santa Clara, California 95054, U.S.A. 保留所有权利。
FUJITSU LIMITED 对本文档的某些部分提供了技术支持并进行了审校。
对于本文档中介绍的产品和技术,Sun Microsystems, Inc. 和 Fujitsu Limited 分别拥有相关的知识产权,此类产品、技术及本文档受版权法、专利法与其他知识产权法和国际公约的保护。
Sun Microsystems, Inc. 和 Fujitsu Limited 在此类产品、技术及本文档中拥有的知识产权包括(但不限于)在 /patents 中列出的一项或多项美国专利,以及在美国或其他国家/地区申请的一项或多项其他专利或待批专利。
本文档及其相关产品和技术的使用、复制、分发和反编译均受许可证限制。
未经 Fujitsu Limited 和 Sun Microsystems, Inc. 及其适用许可方(如果有)的事先书面许可,不得以任何形式、任何手段复制此类产品或技术或本文档的任何部分。
提供本文档并不意味着赋予您对相关产品或技术的任何明示或默示的权利或许可,而且本文档不包含也不表示 Fujitsu Limited 或 Sun Microsystems, Inc. 或各自分支机构作出的任何种类的任何承诺。
本文档以及其中介绍的产品和技术可能包含已从 Fujitsu Limited 和/或 Sun Microsystems, Inc. 供应商处获得版权和/或使用许可的第三方知识产权,包括软件和字体技术。
SF1530规格书
Value
35 10 20 -0.3 to 7 250 90 150 150 -40 to 85
Unit
V mA V V o C/W o C/W o C/W o C o C
SF1530
Storage Temperature Range Lead Temperature (Soldering, 10sec.) ESD Capability, HBM (Human Body Model) ESD Capability, MM (Machine Model) -65 to 150 260 3 250 C C kV V
Absolute Maximum Ratings (Note 1)
Parameter
VDD DC Supply Voltage VCC DC Clamp Current GATE pin FB, RT, CS voltage range Package Thermal Resistance (SOT-26) Package Thermal Resistance (DIP-8) Package Thermal Resistance (SOP-8) Maximum Junction Temperature Operating Temperature Range
Test Conditions
Min
13.5 8
Typ
14.5 9 5 2.5 28.5 35 3 5.5
Ordering Information
P30DP
Top Mark
.30YWW SF1530DP SOT26 DIP8
Package
Green RoHS
Tape & Reel
Yes
Marking Information
Broadcom ALMD-xx3F LED系列产品说明书
DescriptionThe new Broadcom® ALMD-xx3F LED series has the same or just slightly less luminous intensity than conventional high brightness, through-hole LEDs.The new LED lamps can be assembled using common SMT assembly processes and are compatible with industrial reflow soldering processes.The LEDs are made with an advanced optical grade epoxy for superior performance in outdoor sign applicationsFor easy pick and place assembly, the LEDs are shipped in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity.Features⏹Compact form factor ⏹High brightness material⏹Available in green and blue colors —Green InGaN 525 nm —Blue InGaN 470 nm ⏹JEDEC MSL 2A⏹Compatible with the reflow soldering process ⏹Tinted lens⏹Typical viewing angle: 30°ApplicationsMono color signsCAUTION: InGaN devices are Class 1C HBM ESD sensitive, AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.CAUTION: Customers should always keep the LED in the moisture barrier bag (MBB) with < 5% RH when not in use because prolonged exposure to the environment might cause the silver-plated leads to tarnish or rust, which might cause difficulties in soldering.ALMD-CM3F, ALMD-CB3FHigh-Brightness SMT Round Green and Blue LED Lamps Data SheetFigure 1 Package DimensionsNOTE1.All dimensions in millimeters (mm).2.Tolerance is ± 0.20 mm, unless other specified.3.Midsteel lead frame.Device Selection GuidePart NumberColorDominant Wavelength, λd(nm)a a.Dominant wavelength, λd , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.Luminous Intensity, Iv (mcd)b,c,d b.The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.c.The optical axis is closely aligned with the package mechanical axis.d.Tolerance for each bin limit is ± 15%.Viewing Angle, 2θ½(°)e e.θ½ is the off-axis angle where the luminous intensity is half of the peak intensity.Typ.Min.Max.Typ.ALMD-CM3F-Y1002Green 52593002100030ALMD-CB3F -TV002Blue 4702500550030Absolute Maximum Rating, T J = 25 °CElectrical/Optical Characteristics, T J = 25 °CParameterGreen Blue Unit DC Forward Current a a.Derate linearly as shown in Figure 5.3020mA Peak Forward Current b b.Duty Factor = 30%, frequency = 1 kHz.100100mA Power Dissipation 11470mW LED Junction Temperature 110105°C Operating Temperature Range –40 to +85°C Storage Temperature Range–40 to +100°CParameter Symbol Min.Typ.Max.Units Test ConditionsForward VoltageGreen Blue V F2.52.52.82.83.83.5VI F = 20 mAReverse Voltage aGreen Blue a.Indicates product final testing condition. Long-term reverse bias is not recommended.V R55————VI R = 10 μADominant Wavelength bGreen Blue b.The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.λd519460525470539480nmI F = 20 mAPeak WavelengthGreen Blue λPEAK——522464——nmPeak of Wavelength of Spectral Distribution at I F = 20 mA Thermal ResistanceGreen Blue R θJ-PIN——270480——°C/WLED Junction-to-PinLuminous Efficacy cGreen Blue c.The radiant intensity, I e in watts per steradian, may be found from the equation I e = I V /ηV where I V is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/watt.ηV——50085——lm/WEmitted Luminous Power/Emitted Radiant PowerThermal coefficient of λdGreen Blue——0.0330.033——nm/°C I F = 20 mA; +25°C ≤ T J ≤ +100°CPart Numbering SystemA L M D-x1x2x3x4-x5x6x7x8x9Code Description Optionx1Package type C Round InGaNx2Color B BlueM Greenx3Viewing angle330°x4Product specific designation Fx5Minimum intensity bin Refer to the Intensity Bin Limit Tablex6Maximum intensity binx7Color bin selection0Full distributionx8x9Packaging option 02Tested 20 mA, 13-in. carrier tape Bin InformationIntensity Bin Limit Table (1.3:1 lv Bin Ratio)Luminous Intensity, l v (mcd) at 20 mABinMin.Max.T25003200U32004200V42005500W55007200X72009300Y930012000Z120001600011600021000Tolerance for each bin limit is ± 15%.Blue Color RangeTolerance for each bin limit is ± 0.5 nm.Green Color RangeTolerance for each bin limit is ± 0.5 nm.Bin Min.Dom.Max.Dom.X Min.Y Min.X Max.Y Max.1460.0464.00.14400.02970.17660.0966 0.18180.09040.13740.03742464.0468.00.13740.03740.16990.1062 0.17660.09660.12910.04953468.0472.00.12910.04950.16160.1209 0.16990.10620.11870.06714472.0476.00.11870.06710.15170.1423 0.16160.12090.10630.09455476.0480.00.10630.09450.13970.17280.15170.14230.09130.1327BinMin.Dom.Max.Dom.X Min.Y Min.X Max.Y Max.1519.0523.00.06670.83230.14500.73190.12000.73750.09790.83162523.0527.00.09790.83160.17110.72180.14500.73190.13050.81893527.0531.00.13050.81890.19670.70770.17110.72180.16250.80124531.0535.00.16250.80120.22100.69200.19670.70770.19290.78165535.0539.00.19290.78160.24450.67470.22100.69200.22330.7600Figure6 Dominant Wavelength Shift vs. Forward CurrentFigure7 Radiation Pattern for X Axis Figure8 Component Axis for Radiation PatternFigure9 Relative Intensity Shift vs. Junction Temperature Figure10 Forward Voltage Shift vs. Junction TemperatureFigure11 Recommended Soldering Land PatternFigure12 Carrier Tape DimensionNOTE All dimensions are in millimeters. Figure13 Reel DimensionNOTE All dimensions are in millimeters.Figure14 Unit Orientation from ReelPacking Label(i) Mother Label (Available on the MBB Bag)(ii) Baby Label (Available on the Plastic Reel)For acronyms and definitions, see the next page.Acronyms and DefinitionsBIN:(i) Color bin only or V F bin only(Applicable for part numbers with color bins but without a V F bin or part numbers with V F bins and no color bin) (ii) Color bin incorporated with V F binApplicable for part numbers that have both the color bin and the V F bin Example:a.Color bin only or V F bin onlyBIN: 4 (represent color bin 4 only)BIN: VA (represent V F bin “VA” only)b.Color bin incorporates with the V F binPrecautionary NotesSoldering⏹Reflow soldering must not be done more than two times.Take the necessary precautions for handling amoisture-sensitive device, as stated in HandlingPrecautions.⏹Do not apply any pressure or force on the LED duringreflow and after reflow when the LED is still hot.⏹Use reflow soldering to solder the LED. Use hand solderingonly for rework if unavoidable, but hand soldering must be strictly controlled to the following conditions:—Soldering iron tip temperature = 320°C maximum.—Soldering duration = 3s maximum.—Number of cycles = 1 only—Power of soldering iron = 50W maximum.⏹Do not touch the LED body with a hot soldering ironexcept the soldering terminals because this might damage the LED.⏹For de-soldering, use a double head soldering iron.⏹Confirm beforehand whether the functionality andperformance of the LED is affected by hand soldering.Figure15 Leaded Reflow Soldering Figure16 Lead-Free Reflow SolderingFigure17 Recommended Board Reflow DirectionHandling PrecautionsFor automated pick and place, Broadcom has tested the following nozzle size made with urethane material to work well with this LED. However, due to the possibility of variations in other parameters, such as pick and place, machinemaker/model, and other settings of the machine, verify the selected nozzle.NOTE⏹The nozzle tip should touch the LED flange duringpick and place.⏹The outer dimensions of the nozzle should fit intothe carrier tape pocket.Handling of Moisture-Sensitive DevicesThis product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures.⏹Before use:—An unopened moisture barrier bag (MBB) can be stored at < 40°C / 90% RH for 12 months. If the actualshelf life has exceeded 12 months and the humidityindicator card (HIC) indicates that baking is notrequired, then it is safe to reflow the LEDs per theoriginal MSL rating.—Do not open the MBB prior to assembly (for example, for IQC).⏹Control after opening the MBB:—Read the HIC immediately upon opening of the MBB.—Keep the LEDs < 30°C / 60% RH at all times; allhigh-temperature-related processes, includingsoldering, curing, or rework, must be completedwithin 672 hours.⏹Control for unfinished reel:Store unused LEDs in a sealed MBB with desiccant ordesiccator at < 5% RH.⏹Control of assembled boards:If the PCB soldered with the LEDs is to be subjected toother high-temperature processes, store the PCB in asealed MBB with desiccant or desiccator at < 5% RH toensure that all LEDs have not exceeded their floor life of672hours.⏹Baking is required if:—The HIC indicator is not BROWN at 10% and is AZURE at 5%.—The LEDs are exposed to conditions of >30°C / 60% RH at any time.—The LED floor life exceeded 672 hours.The recommended baking condition is: 60°C ±5°C for20hours. Baking should only be done once.⏹StorageThe soldering terminals of these Broadcom LEDs are silver plated. If the LEDs are exposed for too long in an ambient environment, the silver plating might become oxidized,thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or indesiccator at < 5% RH.Application Precautions⏹The drive current of the LED must not exceed themaximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance.⏹LEDs exhibit slightly different characteristics at differentdrive currents, which might result in larger performancevariations (that is, intensity, wavelength, and forwardvoltage). Set the application current as close as possible to the test current to minimize these variations.⏹The LED is not intended for reverse bias. Use otherappropriate components for such purposes. When driving the LED in matrix form, make sure that the reverse biasvoltage does not exceed the allowable limit of the LED.⏹Avoid rapid changes in ambient temperature, especially inhigh-humidity environments, because this will causecondensation on the LED.⏹If the LED is intended to be used in outdoor or harshenvironments, protect the LED leads with suitable potting material against damages caused by rain water, oil,corrosive gases, and so on. Use a louver or shade to reduce direct sunlight on the LEDs.Eye Safety PrecautionsLEDs might pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment.For product information and a complete list of distributors, please go to our web site: .Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries and/or the EU. Copyright © 2015–2017 by Broadcom. All Rights Reserved.The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For more information, please visit .Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design.Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.AV02-4618EN – May 5, 2017DISCLAIMER : Broadcom’s products and software are not specifically designed, manufactured or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. Customers are solely responsible, and waive all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use.。
施耐德PL7软件手册
0
TSX 37-05/08/10/21/22 PLCs
用于简单 I/O 连接个数 Preventa 安全模块 远程 I/O Telefast 2 实时时钟 模拟量 I/O
过程控制 计数、定位
通讯
软件结构 内存结构 供电电压 标准 I/O
PLC 类型 页数 1/2
本体单元 扩展接口 每个 HE 10 连接器 每个端子块
b TSX 37 21/22PLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1/7
b 功能、内存结构 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1/8
–
60
88
124
紧急停机,以及对极限开关进行监控
96 个远程 I/O (4 个 Nano PLC) c 24 V 输入, a 115 V 输入
8、 12 或 16 通道,带或不带 LED,每个通道带 1 个或 2 个端子
8 或 16 通道,c 5 V TTL, c 24 V, c 48 V, a 115 或 230 V,每通道带 2 个端子 集成 ( 分、秒 )
@ 请参考相关产品样本
Schneider Electric
1
1
1/0
Schneider Electric
目录
1 - Modicon TSX Micro
0
自动化平台
1 - Modicon TSX Micro PLC
3050使用说明书分解
DCAP-3050(V3.0)变压器后备保护测控装置使用说明书北京紫光测控有限公司BEIJING UNISPLENDOUR M&C CO. , LTD目录1 概述 (3)2装置主要功能配置 (3)3装置硬件资源配置 (4)4主要技术指标 (4)4.1 额定参数 (4)4.2 环境条件 (4)4.3 功率消耗 (5)4.4 热稳定性 (5)4.5 测控技术指标 (5)4.6 保护技术指标 (6)4.7 触点容量 (8)4.8 绝缘性能 (8)4.9 抗干扰能力 (9)5装置原理 (10)5.1 装置的构成 (10)5.2 保护原理说明 (10)6菜单及数据表格说明 (19)6.1 实时数据表 (19)6.2保护参数表 (21)6.3 通信数据表格 (26)6.4系统参数表 (30)6.5模拟量校准表 (34)7操作方法 (35)8装置结构及尺寸 (35)9装置典型接线图 (36)10箱后端子接线图 (37)1 概述DCAP3050变压器后备保护测控装置适用于变压器后备保护及测控。
2 装置主要功能配置3 装置硬件资源配置4 主要技术指标4.1 额定参数交流电压额定值(Un):线电压:100V;相电压:57.7V 交流电流额定值(In):5A,1A电源频率额定值:50Hz直流电源额定值:220V,110V4.2 环境条件环境温度:工作:温度范围 -25~+55℃。
贮存:温度范围 -40~+70℃,在极限值下不施加激励量,装置不出现不可逆变化,温度恢复后,装置能正常工作。
大气压力:80~110KPa(相对海拔高度2Km及以下)相对湿度:最湿月的月平均最大相对湿度为90%,同时该月的月平均最低温度为25℃,且表面无凝露。
最高温度为40℃时,平均最大相对湿度不大于50%。
4.3 功率消耗交流电压回路:不大于0.5VA/相(额定电压下)交流电流回路:不大于0.5VA/相(额定电流下)直流回路:每个保护箱不大于15W(静态)或30W(动作)4.4 热稳定性长期运行2In,1.5Un短时过载20In,1s瞬时过载峰值50In,10ms4.5 测控技术指标(1)交流工频输入量a) 标称值电压:100V;电流:1A,5A;频率:50 Hz。
广州爱普电子技术有限公司产品说明书
Typical Features◆Wide input voltage range:85-265VAC/120-380VDC◆No-load power consumption≤≤0.5W◆Transfer efficiency(typ.87%)◆Switching frequency:65KHz◆Protection:Short Circuit,Over Current◆Isolation voltage:2500Vac◆Plastic case,conform to UL94V-0Class◆PCB mountingApplication FieldFA24-220SXXG3N3Series-----a compact size,high efficient power converter offered by Aipu.It features universal input voltage,DC and AC dual-use,low ripple,low temperature rise,low power consumption, high efficiency,high reliability,safer isolation,with good EMC performance.EMC and Safety standard meet international EN55032,IEC/EN61000.It widely used in power,industrial,instrument,smart home applications.For harsh EMC environment,the application circuit in the datasheet is strongly recommended.Typical Product ListPart No.Output SpecificationMax.Capacitive LoadRipple&Noise20MHz(Max)Efficiency@Full Load220Vac(Typical) Power Voltage1Current1Voltage2Current2(W)Vo1(V)Io1(m A)Vo2(V)Io2(m A)u F mVp-p%FA24-220S12G3N32412.02000--200015085 FA24-220S15G3N32415.01600--20008086 FA24-220S24G3N324241000--80010087 Note1:Ripple&Noise of FA24-220S15G3N3,FA24-220S24G3N3should be tested with EMC solution recommended circuit,please see photo1at back.Note2:Due to space limitations,above is only a part of our product list,please contact our sales team for more items.Note3:.”*”is model under developing.Note4:The typical output efficiency is based on that product is full loaded and burned-in after half an hour.Note5:The fluctuation range of full load efficiency(%,TYP)is±2%,full load output efficiency=total output power/module’s input power.Input SpecificationItem Operating Condition Min.Typ.Max.UnitInput Voltage Range AC Input85220265VAC DC Input120310380VDCInput Frequency Range-475063HzInput Current 115VAC//250mA 220VAC//150Surge Current 115VAC//10 220VAC//20Leakage Current-0.5mA TYP/230VAC/50HzExternal fuserecommended value-2A-5A/250VAC slow-fusing Hot plug-UnavailableRemote control terminal-UnavailableOutput SpecificationItem Operating Condition Min.Typ.Max.UnitVoltage Accuracy Full input voltagerangeAny loadVo1--±2.0%Vo2---%Line Regulation Nominal Load Vo1--±2.0% Vo2---%Load RegulationNominal inputVoltage20%~100%loadVo1--±2.0%Vo2---%No load power consumption Input115VAC--0.5W Input220VAC--Minimum loadSingle Output0--% Positive Negative Dualoutput commongrounded---% Positive Negative Dualoutput isolated---Turn-on Delay Time Nominal input voltage,fullload-300-mSPower-off Holding Time Input115VAC(full load)-65-mS Input220VAC(full load)--Output Overshooting Full input voltage range(full load)--10%Dynamic Response 25%~50%~25%50%~75%~50%Overshoot range(%):≤±5%%Recovery time(mS):≤5.0mS mSShort Circuit Protection Input full voltage range Continuous,Self-recovery Hiccup Drift Coefficient--±0.03%-%/℃Over Current Protection Input220VAC≥120%Io,Self-recovery HiccupRipple&Noise Vo=12.0V≤150mV Vo=15.0V≤80mVVo=24.0V≤100Note:Ripple&Noise is tested by Twisted Pair Method,details please see Ripple&Noise Test at back. General SpecificationsItem Operating Condition Min.Typ.Max.Unit Switching Frequency-606570KHz Operating Temperature--40-+75℃Storage Temperature--40-+85Relative Humidity-10-90%RHIsolation Voltage Input-Output,Test1min,leakage current≤5mA2500--VACInsulation Resistance Input-Output@DC500V100--MΩMTBF-≥300,000H@25℃Vibration-10-55Hz,10G,30Min,alongX,Y,ZClass of Case Material-UL94V-0EMC CharacteristicsTotal Item Sub Item Test Standard ClassEMC EMICE CISPR22/EN55032CLASS B(see recommended circuit Photo2)RE CISPR22/EN55032CLASS B(see recommended circuit Photo2)EMSRS IEC/EN61000-4-310V/m Perf.Criteria BCS IEC/EN61000-4-63Vr.m.s Perf.Criteria BESD IEC/EN61000-4-2Contact±4KV/Air±8KV Perf.Criteria BSurge IEC/EN61000-4-5±1KV Perf.Criteria B(see recommendedcircuit Photo2)EFT IEC/EN61000-4-4±2KV Perf.Criteria BVoltage dips,shortinterruptions and voltagevariations immunityIEC/EN61000-4-110%~70%Perf.Criteria BPacking DimensionPacking Code L x W x HG339.0x25.0x22.0mmPin DefinitionPin-out12345Single(S)AC(N)AC(L)GND NP+VoNote:If the definition of pin is not in accordance with the model selection manual,please refer to the label on actual item. Ripple&Noise Test:(Twisted Pair Method20MHZ bandwidth)Test Method:(1)12#twisted pair to connect,Oscilloscope bandwidth set as20MHz,100M bandwidth probe,terminated with0.1uFpolypropylene capacitor and10uF high frequency lowresistance electrolytic capacitor in parallel,oscilloscope set asSample pattern.(2)Input terminal connect to power supply,output terminalconnect to electronic load through jig plate,Use30cm±2cmsampling line.Power line selected from correspondingdiameter wire with insulation according to the flow of outputcurrent.Product Characteristic CurveNote1:Input Voltage should be derated base on Input Voltage Derating Curve when it is85~100VAC/240~265VAC/120~140VDC/340~380VDC.2:Our product is suitable to use under natural air cooling environment,if use it under closed condition,please contact with us. Typical EMC Circuit and Recommended Spec1.Typical Application CircuitPart No.CE1L1CE2TVS1FA24-220S12G3N3NC2uH470uF/16V SMBJ14.0AFA24-220S15G3N3220uF/25V5uH220uF/25V SMBJ17.0A*FA24-220S24G3N3220uF/35V5uH220uF/35V SMBJ26.0ANote:Output filter capacitor C2is electrolytic capacitor,recommend high frequency low resistor electrolytic capacitor,for capacity and current low,please refer to the technical specifications provided by each manufacturer.C2capacitor withstand voltage should derate to80%,capacitor C1is ceramic capacitor,to filter high frequency noise,recommended0.1uF/50V/1206.TVS1tube is a recommend component to protect post-circuit if converter fails.Recommend to external FUSE,Model:3.15A/250V, slow fusing.2.EMC solution recommended circuitPhoto2,EMC for higher requirement circuitComponent Products Module ValueFUSE 3.15A/250Vac 3.15A/250Vac,slow-fusing,necessaryNTC5D-95D-9MOV10D561K10D561KCX10.47uF/275Vac0.47uF/275VacL1 6.8uH/3.0A 6.8uH/3.0A H inductorLF2UU9.830mH min30mH/3.0ANote:1.The product should be used under the specification range,otherwise it will cause permanent damage to it.2.Product’s input terminal should connect to fuse;3.If the product is not worked under the load range(below the minimum load or beyond the load range),we cannot ensure that the performance of product is in accordance with all the indexes in this manual;4.Unless otherwise specified,data in this datasheet are tested under conditions of Ta=25℃,humidity<75%when inputting nominal voltage and outputting rated load(pure resistance load);5.All index testing methods in this datasheet are based on our Company’s corporate standards6.The performance indexes of the product models listed in this manual are as above,but some indexes of non-standard model products will exceed the above-mentioned requirements,please directly contact our technician for specific information;7.We can provide customized product service;8.The product specification may be changed at any time without prior notice.。
综合楼智能化弱电系统工程报价清单_secret
综合楼智能化弱电系统工程报价清单综合大楼有12层,有一个地下停车场,弱电系统:网络设备系统、综合布线、电话交换机、有线电视、机房装修建设、网络闭路监控系统、门禁管理系统、室议室会议系统、多功能厅多媒体系统、防盗报警系统、停车场自动收费系统、人行通道管理系统(挡闸)、LED大屏幕系统、办证大厅排队系统、公共广播系统、电子巡更系统、楼宇自动化控制系统。
网络设备系统:综合楼二层机房为核心层交换机、总共13个接入层:地下层、首层、三层到十二为接入层,两层为核心层、地下室平行层设备部分(总共74个网络信息点)、首层平行层设备部分(总共125个网络信息点)、二层平行层设备部分(总共68个网络信息点)、三层平行层设备部分(总共104个网络信息点)、四层-七层平行层设备部分(总共576个网络信息点)、八层平行层设备部分(总共124个网络信息点)、九层-十层平行层设备部分(总共384个网络信息点)、十一层平行层设备部分(总共123个网络信息点)、十二层平行层设备部分(总共79个网络信息点)、网络保密设备部分(政俯网以及外网)。
综合布线:网络综合布线部分(1657个网络信息点)、电话综合布线部分(1657个电话语音点)电话交换机:电话交换机部分(64外线/440个分机)有线电视:总共74个TV、D1层有线电视系统设备部分(8个TV)、首层有线电视系统设备部分(5个TV)、二层有线电视系统设备部分(3个TV)、三层有线电视系统设备部分(8个TV)、五层—六层有线电视系统设备部分(12个TV)、七层有线电视系统设备部分(6个TV)、八层有线电视系统设备部分(6个TV)、九层有线电视系统设备部分(6个TV)、十层有线电视系统设备部分(6个TV)、十一层有线电视系统设备部分(4个TV)、十二层有线电视系统设备部分(4个TV) 机房装修建设:106平方米机房,要静电地板以及吊天花。
网络闭路监控系统:101个摄像机,其中20个带云台,D1层闭路监控前端部分(总共12个,其中11个固定摄像机,其中1个带云台)、室外闭路监控前端部分(总共11个,其中3个固定摄像机,其中8个带云台)、首层闭路监控前端部分(总共6个,其中5个固定摄像机,1个带云台摄像机)、二层闭路监控前端部分(总共7个,其中6个固定摄像机,1个带云台摄像机)、三层闭路监控前端部分(总共6个,其中5个固定摄像机,1个带云台摄像机)、四层闭路监控前端部分(总共9个,其中8个固定摄像机,1个带云台摄像机)、五层-七层闭路监控前端部分(总共27个,其中24个固定摄像机,3个带云台摄像机)、八层闭路监控前端部分(总共4个,其中3个固定摄像机,1个带云台摄像机)、九层-十二层闭路监控前端部分(总共16个,其中12个固定摄像机,4个带云台摄像机)、电梯桥箱闭路监控前端部分(总共3半球摄像机)。
爱普特微电子 APT32S003F8PT 数据手册说明书
APT32S003F8PT数据手册V1.2APT32S003F8PT数据手册相关文档APT32S003F8PT使用手册版权所有©深圳市爱普特微电子有限公司本资料内容为深圳市爱普特微电子有限公司在现有数据资料基础上慎重且力求准确无误编制而成,本资料中所记载的实例以正确的使用方法和标准操作为前提,使用方在应用该等实例时请充分考虑外部诸条件,深圳市爱普特微电子有限公司不担保或确认该等实例在使用方的适用性、适当性或完整性,深圳市爱普特微电子有限公司亦不对使用方因使用本资料所有内容而可能或已经带来的风险或后果承担任何法律责任。
基于使本资料的内容更加完善等原因,公司保留未经预告的修改权。
APT32S003F8PT数据手册V1.2 历史版本说明历史版本说明1 概述1.1 APT32S003F8PT介绍APT32S003F8PT是由爱普特微电子推出的基于平头哥半导体(T-HEAD Semiconductor) CPU内核开发的32位高性能低成本单片机。
APT32S003F8PT单片机面向的应用为工业控制,触控家电,消费电子设备,可穿戴设备等应用。
∙C-Sky 32位CPU内核(0.7DMIPS),支持单周期乘法和SWD调试∙片载64K(32Kbytes可选)程序闪存,独立2Kbytes数据闪存∙内含4Kbytes SRAM,可用于堆栈,数据存储,代码存储∙工作温度:- 40 to 85︒C∙工作电压范围:1.8 to 5.5V∙最高工作频率:48MHz∙中断控制器:支持动态配置的可嵌套中断(NVIC)∙增强的时钟和功耗控制器(SYSCON)∙独立看门狗定时器(IWDT)∙1x16位增强型定时器/计数器(EPT),每个TIMER支持4路PWM输出功能,支持互补带死区模式∙1x 16位通用定时器/计数器,支持2路PWM输出功能(GPT)∙1x 16位计数器(COUNTERA),支持自动重载功能以及单次或者循环计数功能(载波发生器)∙1x 16位基本计时TIMER (Basic Timer)∙1x 16位低功耗TIMER(LPT)∙1x 8位WWDT∙串行通信接口:1x I2C,3x UART,1 x SPI∙多达15路的12位ADC,支持内部/外部VREF输入∙支持96bit UID功能∙最多支持18个GPIO,所有GPIO均可配置为外部中断∙支持三种工作模式:RUN,SLEEP,和DEEP-SLEEP模式∙ 4 个大电流驱动管脚(每个管脚支持灌入最大电流为120mA)∙多达14路的触摸按键控制器1.2 主要特性1.2.1 处理器(CPU)∙32-bit RISC CPU核,指令长度16位∙16个32位通用寄存器∙高效的2级执行流水线∙单周期32位x32位的硬件整形乘法阵列(结果只支持32位)∙SWD (Serial Wire Debug)调试接口1.2.2 存储(Memory)∙多达64K/32Kbytes的内部程序闪存,支持ISP保护,保护区域的大小可配置,支持硬件CRC校验∙2Kbytes的独立数据闪存,数据闪存编程不影响程序运行∙User Option配置- 外部复位管脚使能配置- 看门狗缺省使能状态配置- 代码安全性配置∙专用烧写接口,支持快速的量产烧录(需配合专用烧写器)∙多达4Kbytes的内部SRAM,支持硬件CRC校验∙小端(little-endian)存储方式1.2.3 可嵌套中断控制器(NVIC)∙多达32个中断源,支持中断向量表重定向∙32个可编程优先级,每个中断都有独立的优先级∙每个中断都有独立的使能或者禁止控制∙每个中断源都有固定的向量地址∙支持陷阱功能∙支持软件复位∙全局中断使能控制∙可单独配置唤醒事件的使能/禁止(可配置唤醒后不入中断)1.2.4 系统控制器(SYSCON)∙外部晶振400KHz 到24MHz (EMCLK: External Main Clock,外部主时钟),支持独立的32.768K配置项∙内部主振131.072KHz / 2.097MHz / 4.194MHz / 5.556MHz (default) 四个option选择(1%偏差@典型值,IMCLK: Internal Main Clock,内部主时钟)∙内部高速振荡器24MHz/48MHz (1%偏差@典型值,HFCLK: High Frequency Clock,内部高速时钟) ∙内部辅振27KHz (5%偏差@典型值,ISCLK: Internal Sub Clock,内部辅时钟)∙内部振荡器均支持软件微调∙支持低功耗模式(SLEEP/DEEP-SLEEP)∙低功耗模式下支持可编程的功耗优化∙可编程的时钟分频器∙外部晶振失效监测(外部晶振失效时,支持自动切换到内部主振)∙外部晶振抖动滤波处理∙外部中断输入数字滤波控制,支持中断触发的异步计数∙FLASH和SRAM校验错误管理,可配置重试或者系统复位∙复位源检测和管理(RSTID)1.2.5 独立看门狗定时器(IWDT:Independent Watchdog Timer)∙复位时间可配置:缺省8秒∙可配置复位前报警中断∙独立工作在内部辅晶振下的可编程18位递减计数器(27KHz时钟)1.2.6 16位增强型定时器/计数器(EPT:Enhance Purpose Timer)∙三种计数模式:递增、递减、递增递减∙每个TIMER有4路独立PWM输出,支持4个比较值∙支持互补输出,死区控制,斩波输出,紧急模式输出∙支持紧急模式输出:软锁止和硬锁止模式- 外部输入EPIx- 系统错误,LVD中断触发∙支持特殊寄存器保护∙支持单次触发模式和外部脉冲计数模式∙4个数字比较器可触发多种同步和波形输出∙可以工作在捕捉模式,最多支持4个比较值捕获∙支持ETCB事件联动∙PCLK工作时钟1.2.7 16位通用定时器/计数器(GPT:General Purpose Timer)∙三种计数模式:递增、递减、递增递减∙每个TIMER支持两个输出通道,每个通道可配置为PWM波形输出控制∙支持捕获模式,最多4个捕获值∙支持ETCB事件联动∙PCLK工作时钟1.2.8 载波频率发生器(CNTA:Counter A)∙1个16位的计数器,支持自动重载功能以及单次或者循环计数功能∙软件/硬件可选择的载波频率输出使能/禁止控制∙在一个周期波形内,输出高/低电平脉冲宽度可配置∙输出极性可配置∙可以用于驱动扬声器或者远程IR数据传输1.2.9 基础计时器(BT:Basic Timer)∙1个16位的递增计数器,支持自动重载功能∙一个比较值寄存器,支持PWM波形输出∙支持单次触发模式∙支持比较值Match中断、周期中断和溢出中断∙支持ETCB事件联动∙PCLK工作时钟1.2.10 内核计时器(CORET:Core Timer)∙1个24位的递减计数器,支持自动重载功能∙计数时钟源可选(CPU时钟或者系统时钟的8分频)∙支持周期中断和溢出中断1.2.11 低功耗定时器/计数器(LPT:Low Power Timer)∙16位的递增计数器,支持自动重载功能∙一个16位比较值寄存器,支持PWM输出∙3位预分频选择,可支持1、2、4、8、16、32、64、128分频∙支持多种计数时钟源:ISCLK、IMCLK、EMCLK、PCLK或者外部CLK ∙支持Toggle或者PWM输出功能∙支持单次触发模式∙支持周期中断和MATCH中断∙支持ETCB事件联动1.2.12 窗口看门狗(WWDT:Window Watchdog)∙基于PCLK工作∙支持复位前报警中断∙可通过软件触发复位操作∙计数器刷新窗口限制功能1.2.13 通用异步收发器(UART)∙2个通道∙8位数据长度,支持校验位(奇偶校验,0/1校验)∙单独的8x8位收发FIFO∙可编程的分数波特率发生器1.2.14 异步串行总线(I2C)∙1个通道∙支持多主机I2C总线,支持主机或者从机工作模式。
Microsemi USB50403C - USB50424C Transient Voltage
Available
Bidirectional TVS Array
DESCRIPTION
This USB50403C – USB50424C Transient Voltage Suppressor (TVS) family is packaged in a SOT-143 configuration giving protection to 1 bidirectional data or interface line. It is designed for use in applications where protection is required at the board level from voltage transients caused by electrostatic discharge (ESD) as defined in IEC 61000–4-2, electrical fast transients (EFT) per IEC 61000-4-4 and secondary effects of lightning. It is also available in RoHS compliant versions. These TVS arrays have a peak power rating of 500 watts for an 8/20 sec pulse. This array is suitable for protection of sensitive circuitry consisting of TTL, CMOS, DRAM’s, SRAM’s, HCMOS, HSIC microprocessors, and Universal Serial Bus (USB) and I/O transceivers.
S3050中文资料
Lock Detect
The S3050 contains a lock detect circuit which monitors the integrity of the serial data inputs. If the received serial data fails the frequency test, the PLL will be forced to lock to the local reference clock. This will maintain the correct frequency of the recovered clock output under loss of signal or loss of lock conditions. If the recovered clock frequency deviates from the local reference clock frequency by more than the value stated in Table 4, the PLL will be declared out of lock. The lock detect circuit will poll the input data stream in an attempt to reacquire lock to data. If the recovered clock frequency is determined to be within the specification as in Table 4, the PLL will be declared in lock and the lock detect output will go active.
PIO系列贴片功率电感规格书
0.030 0.040 0.070 0.080 0.093 0.115 0.170 0.330 0.400 0.540 0.690 1.180 1.800 2.750 3.200
100 150 220
Isat:
PIO52 Series
Part Number
L(
1.1 1.5 2.2 3.3 4.7 5.6 10 15 22 33 47 68
H)
Tolerance
20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 20% 10% 10% 10%
Test Freq.
100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 100kHz 1kHz 1kHz 1kHz
DIMENSIONS
(Unit) Part A B C D E F G PIO31 3.5 3.0 1.6 1.0 1.3 0.9 3.0 0.3 0.3 0.3 0.1 0.3 0.1 0.3 PIO32 3.5 3.0 2.1 1.0 1.3 0.9 3.0 0.3 0.3 0.3 0.1 0.3 0.1 0.3 PIO42 4.5 4 .0 2.15 1.5 2.1 1.0 4.0 0.3 0.3 0.3 0.1 0.3 0.1 0.3 PIO43 4.5 4.0 3.2 1.5 2.1 1.0 4.0 0.3 0.3 0.3 0.1 0.3 0.1 0.3 PIO52 5.8 5.2 2.1 1.5 2 .5 1.0 3.0 0.3 0.3 0.35 0.1 0.3 0.1 0.3 PIO53 5.8 5.2 3.0 1.7 2 .5 1.2 5.8 0.3 0.3 0.3 0.1 0.3 0.1 0.3 PIO54 5.8 5.2 4.5 1.7 2.5 1.2 5.8 0.3 0.3 0.3 0.1 0.3 PIO73 7.8 7.0 3.5 2.2 3.3 1.4 8.0 0.3 0.3 0.4 0.1 0.3 0.2 0.3 PIO75 7.8 7.0 5.0 2.2 3.3 1.4 8.0 0.3 0.3 0.4 0.1 0.3 0.2 0.3 PIO104 10.0 9.0 4.0 2.8 4.4 1.8 10.0 0.3 0.4 0.1 0.3 0.2
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UniFinger SFM3050-TC2DatasheetVer. 1.0UniFinger SFM3050-TC2 2Revision HistoryRev No. Issued date Description1.0 Dec 27, 2004 Initial ReleaseImportant NoticeInformation in this document is provided in connection with Suprema products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Suprema’s Terms and Conditions of Sale for such products, Suprema assumes no liability whatsoever, and Suprema disclaims any express or implied warranty, relating to sale and/or use of Suprema products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Suprema products are not intended for use in medical, life saving, life sustaining applications,or other applications in which the failure of the Suprema product could create a situation where personal injury or death may occur. Should Buyer purchase or use Suprema products for any such unintended or unauthorized application, Buyer shall indemnify and hold Suprema and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Suprema was negligent regarding the design or manufacture of the part.Suprema reserves the right to make changes to specifications and product descriptions at any time without notice to improve reliability, function, or design.Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Suprema reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Contact your local Suprema sales office or your distributor to obtain the latest specifications and before placing your product order.Copyright © by Suprema Inc., 2004*Third-party brands and names are the property of their respective owners.UniFinger SFM3050-TC2 3Contents1.Overview (4)2.UniFinger SFM3000 Series (5)Table 1 UniFinger SFM3000 Series combinations (5)3.Features (5)4.Fingerprint Authentication Specifications (6)4.1.Fingerprint Authentication Performance (6)4.2.Fingerprint Sensor Specifications (6)5.Hardware Specifications (6)5.1.Operating range (6)5.2.Absolute Maximum Ratings (6)5.3.Electrical DC characteristics(V DD = 3.3Vdc, T OP = 25°C) (6)5.4.Interface (7)5.5.Connector Specifications (7)5.5.1.J1 pin assignment (7)5.5.2.J2 pin assignment (8)5.6.Physical Dimensions (8)Figure 1Main module dimensions (8)Figure 2Sensor dimensions (9)munication Protocol Summary (10)6.1.Packet Structure (10)mand Summary (11)UniFinger SFM3050-TC2 41. OverviewThe UniFinger modules are stand-alone fingerprint systems ideal forembedded system applications where biometric security is needed. Themodules are designed for manufacturers searching for an inexpensive,reliable and easy-to-integrate biometric system. The UniFinger modulesprovide complete fingerprint solutions by incorporating fingerprint sensorinterface and embedded fingerprint recognition algorithm into a halfbusiness card sized module.The UniFinger SFM3000 series is the latest UniFinger module equipped withworld’s leading fingerprint authentication algorithm (ranked No. 1 inFVC2004) and powerful DSP technology. Also, it supports wide range offingerprint sensor interoperability giving you a freedom to select suitablesensor that most fits to your application. Furthermore, the fingerprint datafor enrollment and verification are compatible among different sensors,even if they are based on different technologies. This feature of unificationpresents application manufacturers and system integrators with muchmore flexibility than ever before.In addition to these features, the miniature sized UniFinger module has astate-of-the-art low power design making it a perfect match in a widerange of applications from battery operated mobile equipments to networkbased security systems. The UniFinger stands ready to meet yourrequirements and adapt to your applications.UniFinger SFM3050-TC2 52. UniFinger SFM3000 SeriesThe UniFinger SFM3000 series is the latest UniFinger module equipped withworld’s leading fingerprint authentication algorithm, which ranked No. 1 inFVC2004. The SFM3000 series is based on powerful DSP technology,optimized for performance while minimizing power consumptions.Table 1 summarizes available combinations of modules and sensors.Table 1 UniFinger SFM3000 Series combinationsModel name Supported sensors Base moduleAF-S2SFM3000-FL AuthentecSFM3000SFM3000-PR BMFBLP-100Fingerchip SFM3010 SFM3010-FC AtmelSFM3020-OP Optical sensor I SFM3020SFM3040-OC Optical sensor IISFM3040SFM3040-OL Optical sensor IIISFM3050SFM3050-TC UPEK TouchChip TCS1CDSFM3050-TC2 UPEK TouchChip TCS2CF3. FeaturesWorld best authentication performance (ranked No. 1 in FVC2004) High speed fingerprint verificationCompact sizeLow power consumptionFast power on timeSupports various communication interfacesSupports fingerprint data encryptionSupports various fingerprint sensorsHighly configurable I/O signalsOperates with a single 3.3v dc supplyUniFinger SFM3050-TC2 64. Fingerprint Authentication Specifications4.1. Fingerprint Authentication PerformanceEER* <0.1% Enrollment time <1 secVerification time <1 sec*EER is dependent on databases4.2. Fingerprint Sensor SpecificationsDevice Name UPEK TouchChip TCS2CFSensor technology CapacitiveSensing area 10.4mm x 14.4mmImage size(pixels) 208 x 288Image resolution 508 dpi5. Hardware Specifications5.1. Operating rangeMaxTypUnitsMinParameter SymbolSupply voltage V DD 3.0 3.3 3.6 VOperating temperature T OP 0 70 °C5.2. Absolute Maximum RatingsUnits Parameter SymbolMax.Min.Power supply voltage V DD -0.3 3.6 VInput voltage on signal pins V IN -0.3 3.6 V5.3. Electrical DC characteristics(V DD = 3.3Vdc, T OP = 25°C)Max.Typ.UnitsMin.Parameter SymbolSupply current (idle) I DD1 60 mASupply current (scanning) I DD2 130 mAmA150Supply current (identifying) I DD3135UniFinger SFM3050-TC2 7Parameter SymbolMin.Typ.Max.Units High level input voltage V IH 2.0 3.6 VLow level input voltage V IL -0.3 0.6 V5.4. InterfaceType DescriptionUART 3.3V CMOS levelBaud rates up to 921.6kbps (factory default is 115.2kbps)RS232/422/485 supported via additional level converterDigital I/O 3.3V CMOS level8 ports separately configurable26bit Wiegand I/O supported via additional level converter5.5. Connector SpecificationsConnector UsageJ1 Host interface port IJ2 Host interface port II (Molex 53261-8090 compatible)J3 Debug port for factory use onlyJ4 Sensor interface port, 20 pin FPC/FFC5.5.1. J1 pin assignmentName PinnumberFunctionsVSS 4,14PowerGroundVDD 9 Power pin. 3.3VdcGPIO_0 ~ GPIO_7 5,6,7,8,1,2,3,153.3V CMOS, bidirectional portH_RXD 10 Receive Data, 5V tolerant 3.3V CMOS,input onlyH_TXD 11 Transmit Data, 3.3V CMOS, output only Reserved 12, 13 Reserved for future useUniFinger SFM3050-TC2 85.5.2. J2 pin assignmentFunctionsName PinnumberVDD 1, Power pin. Must be connected to 3.3vdcReserved 2, 3 Reserved for future useGroundPowerVSS 4,7H_RXD 5 Receive Data, 5V tolerant 3.3V CMOS,input onlyH_TXD 6 Transmit Data, 3.3V CMOS, output onlySHIELD 8ShieldGround5.6. Physical DimensionsParameter ValuesMain board 55mm x 40mm x 8mm (WxLxH)Sensor 20.4mm x 27mm x 3.5mm (WxLxH)Figure 1 Main module dimensionsDimensions in millimeters* Connect 'Earth GND' hole with system chassis or earth ground foroptimum ESD characteristics.UniFinger SFM3050-TC2 9 Figure 2 Sensor dimensionsDimensions in millimeters. Image from UPEKUniFinger SFM3050-TC2 10 6. Communication Protocol SummaryThe UniFinger provides a proprietary communication protocol for easyinterface with most host systems. The protocol based on fixed sizedpackets. Only fingerprint image, template data, and user lists aretransmitted as appended to the packet. Checksum functionality issupported to ensure consistency of transmitted data.Please refer to UniFinger Protocol Manual for detailed information.6.1. Packet StructureEndcode Start code Command Param Size Flag Checksum1byte 1byte 1byte4bytes4bytes1byte 1byteUniFinger SFM3050-TC2 11 6.2. Command SummaryCommand Code DescriptionSW 0x01 System parameter writeSF 0x02 System parameter saveSR 0x03 System parameter readSS 0x04 System status checkES 0x05 Enroll by scanEI 0x06 Enroll by imageET 0x07 Enroll by templateVS 0x08 Verify by scanVI 0x09 Verify by imageVT 0x10 Verify by templateVH 0x22 Verify host template by scanIS 0x11 Identify by scanII 0x12 Identify by imageIT 0x13 Identify by templateRI 0x20 Read imagetemplateReadRT 0x14SI 0x15 Scan imageScantemplateST 0x21templateDeleteDT 0x16DA 0x17 Delete all templatesLT 0x18 List user IDCT 0x19 Check user IDFP 0x23 Fix all provisional templatesDP 0x24 Delete all provisional templatesKW 0x34 Encryption key writeKS 0x35 Scan template with challenge dataGR 0x36 Read GPIO configurationGW 0x37 Write GPIO configurationGC 0x38 Clear GPIO configurationGD 0x39 Set default GPIO configurationUniFinger SFM3050-TC2 12Contact InfoHeadquartersSuprema, Inc. ()Dongcheon Bldg, 13-21 Yangjae-dong, Seocho-gu, Seoul 137-130 KoreaTel: +82-2-571-9305Fax:+82-2-571-9306Email: sales@, support@。