BA3430S中文资料

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MBRS340T3G;MBRS320T3G;MBRS330T3G;中文规格书,Datasheet资料

MBRS320T3G, SBRS8320T3G, MBRS330T3G, NRVBS330T3G, MBRS340T3G, SBRS8340T3G Surface Mount Schottky Power Rectifier
These devices employ the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system.
0.0
TJ = −65C 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 VF, INSTANTANEOUS FORWARD VOLTAGE (V)
0.1 0.0
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
TJ = 100C
1.E−05 1.E−06
TJ = 25C
1.E−05 1.E−06
0

SPS-9380BMG中文资料

Optoway SPS-9380MG**********************************************************************************************************************************************************************************************************************************************************************************************************************************************OPTOWAY TECHNOLOGY INC. No .38, Kuang Fu S. Road, Hu Kou, Hsin Chu Industrial Park, Hsin Chu, Taiwan 303Tel: 886-3-5979798 Fax: 886-3-597973712/1/2005 V2.0 1SPS-9380MG / SPS-9380BMG (RoHS Compliant)3.3V / 1550 nm / Multirate SFP LC SINGLE-MODE TRANSCEIVER**********************************************************************************************************************************************************************FEATURESl Hot-Pluggable SFP Footprint LC Optical Transceiver l Small Form-Factor Pluggable (SFP) MSA compatible l Compliant with SONET OC-48 (LR-2) / SDH STM-16 (L-16.2)l Compliant with Fibre Channel 1x/2x SM-LC-L FC-PI l Compliant with IEEE 802.3z 1000BASE-ZX l 1550 nm DFB LD Transmitter l APD High Sensitivity Receiver l 26 dB Power Budget at Leastl AC/AC Coupling according to MSA l Single +3.3 V Power Supply l RoHS Compliantl 0 to 70o C Operation: SPS-9380MG l -10 to 85o C Operation: SPS-9380BMGl Class 1 Laser International Safety Standard IEC-60825 CompliantAPPLICATIONSl SONET OC-48 / SDH STM-16 l SONET OC-12 / SDH STM-4 l SONET OC-3 / SDH STM-1l Gigabit Ethernet / 1X/2X Fibre ChannelDESCRIPTIONThe SPS-9380MG series single mode transceivers is small form factor pluggable module for bi-directional serial optical data communications such as SONET OC-48 / SDH STM-16, Gigabit Ethernet 1000BASE-LX and Fibre Channel 1x/2x SM-LC-L FC-PI. It is with the SFP 20-pin connector to allow hot plug capability. This module is designed for single mode fiber and operates at a nominal wavelength of 1550 nm. A guaranteed minimum optical link budget of 26 dB is offered which can correspond to a link distance of over 80 km (assuming worst case fiber loss of 0.25 dB/km). The transmitter section uses a multiple quantum well 1550 nm DFB laser and is a class 1 laser compliant according to International Safety Standard IEC-60825. The receiver section uses an integrated InGaAs detector preamplifier (IDP) mounted in an optical header and a limiting post-amplifier IC.LASER SAFETYThis single mode transceiver is a Class 1 laser product. It complies with IEC-60825 and FDA 21 CFR 1040.10 and 1040.11. The transceiver must be operated within the specified temperature and voltage limits. The optical ports of the module shall be terminated with an optical connector or with a dust plug.ORDER INFORMATIONP/No.Bit Rate(Mb/s)SONET /SDHDistance (km) Wavelength(nm) Package Temp. (o C) TX Power (dBm) RX Sens. (dBm) RoHS Compliant SPS-9380MG Multirate* LR-2/L-16.2 80 1550 DFB LC SFP 0 to 70 3 to -2 -28 Yes SPS-9380BMGMultirate* LR-2/L-16.2801550 DFBLC SFP-10 to 853 to -2-28YesMultirate*: 2.67 Gb/s / OC-48 / 2X FC / GbE / 1X FC / OC-12 / OC-3Absolute Maximum RatingsParameterSymbol Min Max Units NotesStorage TemperatureTstg -40 85 o COperating Case Temperature Topr 0 -10 70 85 o C SPS-9380MG SPS-9380BMG Power Supply VoltageVcc-0.53.6VRecommended Operating ConditionsParameterSymbol Min Typ Max Units / NotesPower Supply VoltageVcc 3.13 3.3 3.47 VOperating Case Temperature Topr 0 -10 70 85 oC / SPS-9380MG oC / SPS-9380BMGPower Supply Current I CC (TX+RX)230 300 mA Data Rate12524882670Mb/sTransmitter Specifications (0o C < Topr < 70o C, 3.13V < Vcc < 3.47V)Parameter Symbol Min Typ Max Units Notes OpticalOptical Transmit Power Po -2 --- 3 dBm 1Output Center Wavelength λ1500 1550 1580 nmOutput Spectrum Width ∆λ--- --- 1 nm -20 dB WidthSide Mode Suppression Ratio SMSR 30 dBExtinction Ratio E R8.2 --- --- dBOutput Eye Compliant with Telecordia GR-253-GORE and ITU-T Recommendation G.957Optical Rise Time t r150 ps 20 % to 80% Values Optical Fall Time t f150 ps 20 % to 80% Values Relative Intensity Noise RIN -120 dB/HzDispersion Penalty 2 dB 2 ElectricalData Input Current – Low I IL-350 µAData Input Current – High I IH350 µADifferential Input Voltage V IH - V IL0.5 2.4 V Peak-to-PeakTX Disable Input Voltage – Low T DIS, L0 0.5 V 3TX Disable Input Voltage – High T DIS, H 2.0 Vcc V 3TX Disable Assert Time T ASSERT10 µsTX Disable Deassert Time T DEASSERT 1 msTX Fault Output Voltage -- Low T FaultL0 0.5 V 4TX Fault Output Voltage -- High T FaultH 2.0 Vcc+0.3 V 41. Output power is power coupled into a 9/125 µm single mode fiber.2. Specified at 1600 ps/nm dispersion over G.652/G.654 fiber with center wavelength range of 1500 to 1580 nm.3. There is an internal4.7K to 10K ohm pull-up resistor to VccTX.4. Open collector compatible, 4.7K to 10K ohm pull-up to Vcc (Host Supply Voltage).Receiver Specifications(0o C < Topr < 70o C, 3.13V < Vcc < 3.47V)Parameter Symbol Min Typ Max Units NotesOpticalSensitivity @ OC-48Sens1 -9 -28 dBm 5 Sensitivity @2X Fibre Channal Sens2 -9 -28 dBm 6 Sensitivity @Gigabit Ethernet Sens3 -9 -30 dBm 6 Sensitivity @OC-12 Sens4 -9 -29 dBm 5 Sensitivity @OC-3 Sens5 -18 -30 dBm 5Signal Detect -- Asserted Pa --- -28 dBm Transition: low to high Signal Detect -- Deasserted Pd -40 --- --- dBm Transition: high to low Signal detect -- Hysteresis 1.0 --- dBWavelength of Operation 1100 --- 1600 nmElectricalDifferential Output Voltage V OH– V OL0.6 2.0 VOutput LOS Voltage -- Low V OL0 0.5 V 7Output LOS Voltage -- High V OH 2.0 Vcc+0.3 V 75. Measured at 223-1 PRBS at BER 1E-10.6. Measured at 27-1 PRBS at BER 1E-12 .7. Open collector compatible, 4.7K to 10K ohm pull-up to Vcc (Host Supply Voltage).********************************************************************************************************************************************************************** OPTOWAY TECHNOLOGY INC. No.38, Kuang Fu S. Road, Hu Kou, Hsin Chu Industrial Park, Hsin Chu, Taiwan 303**********************************************************************************************************************************************************************OPTOWAY TECHNOLOGY INC. No .38, Kuang Fu S. Road, Hu Kou, Hsin Chu Industrial Park, Hsin Chu, Taiwan 303PINSignal NameDescriptionPINSignal Name Description1 TX GND Transmitter Ground11 RX GND Receiver Ground2 TX Fault Transmitter Fault Indication12 RX DATA OUT- Inverse Receiver Data Out 3 TX Disable Transmitter Disable (Module disables on high or open)13 RX DATA OUT+ Receiver Data Out 4 MOD-DFE2 Modulation Definition 2 – Two wires serial ID Interface14 RX GND Receiver Ground5 MOD-DEF1 Modulation Definition 1 – Two wires serial ID Interface15 Vcc RX Receiver Power – 3.3V ±5% 6 MOD-DEF0 Modulation Definition 0 – Ground in Module16 Vcc TX Transmitter Power – 3.3V ±5% 7 N/C Not Connected 17 TX GNDTransmitter Ground 8 LOS Loss of Signal 18 TX DATA IN+ Transmitter Data In9 RX GND Receiver Ground 19 TX DATA IN- Inverse Transmitter Data In 10RX GNDReceiver Ground20TX GNDTransmitter GroundModule DefinitionModule DefinitionMOD-DEF2 PIN 4 MOD-DEF1 PIN 5 MOD-DEF0 PIN 6 Interpretation by Host 4SDASCLLV-TTL LowSerial module definitionprotocolModule Definition 4 specifies a serial definition protocol. For this definition, upon power up, MOD-DEF(1:2) appear as no connector (NC) and MOD-DEF(0) is TTL LOW. When the host system detects this condition, it activates the serial protocol. The protocol uses the 2-wire serial CMOS E 2PROM protocol of the ATMEL AT24C01A/02/04 family of components.********************************************************************************************************************************************************************** OPTOWAY TECHNOLOGY INC. No.38, Kuang Fu S. Road, Hu Kou, Hsin Chu Industrial Park, Hsin Chu, Taiwan 303。

HD14053B中文资料

Hitachi CodeJEDECEIAJWeight (reference value)DP-16 Conforms Conforms 1.07 gHitachi Code JEDEC EIAJWeight (reference value)FP-16DA —Conforms 0.24 g*Dimension including the plating thicknessBase material dimension° – 8°Hitachi CodeJEDECEIAJWeight (reference value)FP-16DNConformsConforms0.15 gUnit: mm*Dimension including the plating thickness Base material dimension° – 8°元器件交易网Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。

GS8180S18资料

Functional Description
Because a Sigma RAM is a synchronous device, address, data Inputs, and read/ write control inputs are captured on the rising edge of the input clock. Write cycles are internally self-timed and initiated by the rising edge of the clock input. This feature eliminates complex off-chip write pulse generation required by asynchronous SRAMs and simplifies input signal timing.7 A(8M)
8 E3 MCL NC NC VDDQ VSS VDDQ VSS VDDQ NC VDDQ VSS VDDQ VSS VDDQ NC A A TDO
9 A NC MCL VSS VDDQ VSS VDDQ VSS VDDQ NC VDDQ VSS VDDQ VSS VDDQ VSS NC A
333 MHz 1.8 V VDD 1.8 V and 1.5 V I/
Features
• Observes the Sigma RAM pinout standard • 1.8 V +150/–100 mV core power supply • 1.5 V or 1.8 V I/O supply • Pipelined read operation • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • ZQ mode pin for user-selectable output drive strength • 2 user-programmable chip enable inputs for easy depth expansion • IEEE 1149.1 JTAG-compatible Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin compatible with future 32M, 64M and 128M devices - 333 3.0 ns 1.5 ns

Sun StorEdge 3510 FC 阵列补充资料说明书

Sun StorEdge™3000 系列补充资料Sun StorEdge 3510 FC 阵列带 SATA 的 Sun StorEdge 3511 FC 阵列Sun Microsystems, Inc.部件号：817-6075-102004 年 7 月，修订版 A请将有关本文档的意见或建议提交至：/hwdocs/feedback版权所有© 2004 Dot Hill Systems Corporation, 6305 El Camino Real, Carlsbad, California 92009, USA.保留所有权利。

Sun Microsystems, Inc. 和 Dot Hill Systems Corporation 可能拥有与本产品或文档中涉及的技术相关的知识产权。

具体来说（且不仅限于此），这些知识产权包括/patents所列出的美国专利中的一项或多项，以及在美国或其它国家（地区）申请的一项或多项补充专利或未决专利。

本产品或文档按照限制其使用、复制、分发和反编译的许可证进行分发。

未经 Sun 及其许可方（如果有）的事先书面授权，不得以任何形式或任何手段复制本产品或文档的任何部分。

第三方软件由 Sun 供应商提供版权及许可授权。

本产品的某些部分来源于 Berkeley BSD 系统，已获得加利福尼亚大学的许可。

UNIX 是在美国和其它国家（地区）的注册商标，已通过 X/Open Company, Ltd. 获得独家许可。

Sun、Sun Microsystems、Sun 徽标、Sun StorEdge、AnswerBook2、、Java 和 Solaris 是 Sun Microsystems, Inc. 在美国和其它国家（地区）的商标或注册商标。

所有的 SPARC 商标均按许可证使用，是 SPARC International, Inc. 在美国和其它国家（地区）的商标或注册商标。

国产电子元器件型号标识

第四部分
寸相同序号相同)
的热量 0.7MJ的倍数值表示。
7 其他 7.1 真空规管 7.2 传真管 7.3 频标管
ZJ
－
表示同类产序号的数字
品
表示变型 (I、O除外)
管
的
字
母
LX
－
表示分类的数字 PB
－
表示同类产品序号的数字
7.4 加速管
ZK
－
表示同类产品序号的数字
7.5 荧光显示管
表示玻壳直径、
第一部分
表示灯丝电压的数字 (V)，如有小数则取其整数部分
型号标识部分
第二部分
第二部分
第四部分
D
表示同类产品序号的数字
表示结构形式的字母
Z
H
G
B
C
N
F
S
6
类别
第一部分
型号标识部分
第二部分
第二部分
第四部分
锐截止五极管
锐截止束射四极管
J
遥截止五极管
K
双四极管或双五极管
T
输出五极管及输出束射四极管
第一部分
2.3 特种电子束管(包括字标管与字码管、印刷管、油膜光阀、象元管等) 直观式
表示圆形屏幕直径或矩形屏幕对角线长度的尺寸数字(cm)
非直观式
ST
型号标识部分第Leabharlann 部分第二部分第四部分
表示同类产品表示屏幕上所涂荧光
型号的数字粉的牌号
ST
(见GB/T4073)
－
－
3 微波管 3.1 磁控管
BS
BB BBM
FZ FG
BQ BQM

pda硬件使用说明

除版权法允许部分，否则未得深圳速比邻有限公司书面同意，不得影印、重制作、修改或翻译部份或全部内容。

Microsoft、ActiveSync、Pocket IE、Pocket Word、Windows、Windows 98、Windows Me、Windows NT、Windows 2000、Windows XP、Windows 标志、Windows CE标志或为注册商标，或为Microsoft Corporation 在美国及/或其它国家之注册商标。

Microsoft产品为Microsoft Licensing, Inc.授权之OEM产品，Microsoft Licensing, Inc.为Microsoft完全拥有。

本文内所提及的所有其它品牌名称及产品名称皆为各该公司合法的商标名、服务标志或注册商标。

在使用本产品之前，请认真阅读本说明书第一章包装确认 (4)第二章S3000简介 (5)第三章开始使用 (17)第四章其它选购配备的操作 (42)第五章售后服务 (81)第一章包装确认确认包装内容请于使用前先检查是否含有下列物品：˙下列硬体固件注意：单独配了三联充和多个电池的客户，设备使用一段时间后，请将设充电器和USB 线底座S3000主机电池手腕绳和触摸笔备放在底座上来给主电池充电。

因为这样主电池还可以给备用电池充电。

（如果长时间不给备用电池充电，备用电池电量为0 的情况下，机器将出现无法开机的现象。

）第二章 S3000简介S3000产品资料介绍S3000系列产品是速比邻科技自主研发、设计、生产的针对各行业特点打造的系列工业级手持终端，外型采用人体工程学设计，轻巧灵活，防震防摔，待机时间长，采用双电源模式。

BA3430FS-E2, 规格书,Datasheet 资料

(Contact address for overseas customers in Japan)
Yokohama
As of 18th. April 2005
芯天下--/
Japan / (Internal Sales)
Tokyo Yokohama Nagoya Kyoto 2-1-1, Yaesu, Chuo-ku, Tokyo 104-0082 TEL : +81(3)5203-0321 FAX : +81(3)5203-0300 2-4-8, Shin Yokohama, Kohoku-ku, Yokohama, Kanagawa 222-8575 TEL : +81(45)476-2131 FAX : +81(45)476-2128 Dainagayo Building 9F 3-28-12, Meieki, Nakamura-ku, Nagoya,Aichi 450-0002 TEL : +81(52)581-8521 FAX : +81(52)561-2173 579-32 Higashi Shiokouji-cho, Karasuma Nishi-iru, Shiokoujidori, Shimogyo-ku, Kyoto 600-8216 TEL : +81(75)311-2121 FAX : +81(75)314-6559 TEL : +81(45)476-9270 FAX : +81(045)476-9271
Please contact our sales offices for details ;
U.S.A / San Diego Atlanta Dallas Germany / Dusseldorf TEL : +1(858)625-3630 TEL : +1(770)754-5972 TEL : +1(972)312-8818 TEL : +49(2154)9210 FAX : +1(858)625-3670 FAX : +1(770)754-0691 FAX : +1(972)312-0330 FAX : +49(2154)921400 FAX : +44(1)908-282-528

BAV20WS-V中文资料

BAV19WS-V/20WS-V/21WS-VDocument Number 85726Rev. 1.4, 31-Jul-06Vishay Semiconductors120145Small Signal Switching Diodes, High VoltageFeatures•Silicon Epitaxial Planar Diodes •For general purpose•These diodes are also available in othercase styles including: the DO35 case with the type designation BAV19 - BAV21, the MiniMELF case with the type designation BAV100 - BAV103, the SOT23 case with the type designation BAS19 -BAS21 and the SOD123 case with the type desig-nation BAV19W-V - BAV21W-V •Lead (Pb)-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECMechanical DataCase: SOD323 Plastic case Weight: approx. 5.0 mgPackaging Codes/Options:GS18/10 k per 13" reel (8 mm tape), 10 k/box GS08/3 k per 7" reel (8 mm tape), 15 k/boxParts TablePartT ype differentiation Ordering codeType MarkingRemarks BAV19WS-V V R = 100 V BAV19WS-V-GS18 or BAV19WS-V-GS08A8Tape and Reel BAV20WS-V V R = 150 V BAV20WS-V-GS18 or BAV20WS-V-GS08A9Tape and Reel BAV21WS-VV R = 200 VBAV21WS-V-GS18 or BAV21WS-V-GS08AATape and Reel 2Document Number 85726Rev. 1.4, 31-Jul-06BAV19WS-V/20WS-V/21WS-VVishay Semiconductors Absolute Maximum RatingsT amb = 25°C, unless otherwise specified1) Valid provided that leads are kept at ambient temperatureThermal CharacteristicsT amb = 25°C, unless otherwise specified1) Valid provided that leads are kept at ambient temperatureElectrical CharacteristicsT amb = 25°C, unless otherwise specifiedParameterTest conditionPart Symbol Value Unit Continuous reverse voltageBAV19WS-V V R 100V BAV20WS-V V R 150V BAV21WS-VV R 200V Repetitive peak reverse voltageBAV19WS-V V RRM 120V BAV20WS-V V RRM 200V BAV21WS-VV RRM 250V Forward continuous currentT amb = 25°CI F 2501)mA Rectified current (average) half wave rectification with resist. loadT amb = 25°C I F(AV)2001)mARepetitive peak forward current f ≥ 50 Hz, θ = 180°, T amb = 25°C I FRM 6251)mA Surge forward current t < 1 s, T j = 25°C I FSM 1A Power dissipationT amb = 25°CP tot2001)mWParameterTest condition Symbol Value Unit Thermal resistance junction to ambient airR thJA 6501)K/W Junction temperature T j 1501)°C Storage temperature rangeT stg- 65 to + 1501)°CParameterTest conditionPartSymbol MinTyp.Max Unit Forward voltage I F = 100 mA V F 1.00V I F = 200 mA V F 1.25V Leakage currentV R = 100 VBAV19WS-V I R 100nA V R = 100 V , T j = 100°C BAV19WS-V I R 15µA V R = 150 VBAV20WS-V I R 100nA V R = 150 V , T j = 100°C BAV20WS-V I R 15µA V R = 200 VBAV21WS-V I R 100nA V R = 200 V , T j = 100°CBAV21WS-VI R 15µA Dynamic forward resistance I F = 10 mA r f 5ΩDiode capacitance V R = 0, f = 1 MHz C D 1.5pF Reverse recovery timeI F = 30 mA, I R = 30 mA, I rr = 3 mA, R L = 100 Ωt rr50nsBAV19WS-V/20WS-V/21WS-VDocument Number 85726Rev. 1.4, 31-Jul-06Vishay Semiconductors3Typical CharacteristicsT amb = 25°C, unless otherwise specifiedFigure 1. Forward Current vs. Forward Voltage Figure 2. Admissible Forward Current vs. Ambient Temperature Figure 3. Admissible Power Dissipation vs. Ambient Temperature 18858I - F o r w a r d C u r r e n t (m A )F V F - For w ard V oltage (V )30609012015018859T am b - Am b ient Temperat u re (°C)I ,I - A d m i s s i b l e F o r w a r d C u r r e n t (A )O F 20018864T am b - Am b ient Temperat u re (°C)250200150100502040608010012014016018000P - A d m i s s i b l e P o w e r D i s s i p a t i o n (W )t o t Figure 4. Dynamic Forward Resistance vs. Forward CurrentFigure 5. Leakage Current vs. Junction TemperatureFigure 6. Capacitance vs. Reverse Voltager -D y n a m i c F o r w a r d R e s i s t a n c e f (Ω)10100111001018861I F - For w ard C u rrent (mA)0.118862110100100020406080100120140160180200I (T )/I (25 °C ) - L e a k a g e C u r r e n tR R j T j - J u nction Temperat u re (°C)Re v erse V oltageBA V 19W S-V V = 100 V R BA V 20W S-V V =150V R BA V 21W S-V V =200VR 188631100.10.80.60.41.41.21.00.20100C -D i o d e C a p a c i t a n c e (p F )D V R - Re v erse V oltage (V )2.01.81.6=25°CT j 4Document Number 85726Rev. 1.4, 31-Jul-06BAV19WS-V/20WS-V/21WS-V Vishay SemiconductorsPackage Dimensions in mm (Inches): SOD323BAV19WS-V/20WS-V/21WS-VDocument Number 85726Rev. 1.4, 31-Jul-06Vishay Semiconductors5Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personaldamage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyDocument Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。

isis中英文元件名称对照

AD芯片-----TECHWELL TW6805A仿真软件里的AD0809有问题,用0808代替定时/计数器的使用方法：CLK：计数和测频状态时，数字波的输入端。

（counter enable)CE：计数使能端；通过属性设置高还是低有效。

无效暂停计数RST:复位端（RESET),可设上升沿（Low-High)或者下降沿（High-Low）有效。

4种工作方式：通过属性Operating Mode 来选择。

Default : 缺省方式，计数器方式。

Time(secs):100S定时方式，由CE和RST 控制暂停和重新开始。

Time(hms)：10小时定时方式，同上。

Frequency: 测频方式，CE和RST有效时，显示CLK端数字波频率Count:计数方式。

+++++++++++++++++++++++++++++++++ ++++++++++++++++++++++++++++常用元件列表：POT-HG 可调电位器7SEG-MPX8-CC-BLUE 8位数码管COMPIM 串口SW- 开关7SEG-BCD 含译码驱动的数显Speaker 扬声器2N5771和2N5772，15V对管300MARES , CAP,BUTTON 按钮开关KEYPAD-PHONE 3*4电话键盘KEYPAD-SMALLCALC 4*4计算器键盘KEYPAD-CALCULATOR 4*6计算器键盘PG160128A 128*128液晶++++++++元件库详细分类1.analog ics 模拟集成器件8个子类：amplifier 放大器comparators 比较器display drivers 显示驱动器filters 滤波器miscellaneous 混杂器件regulators 三端稳压器timers 555定时器voltage references 参考电压2，capacitors CAP电容，23个分类别animated 可显示充放电电荷电容audio grade axial 音响专用电容axial lead polypropene 径向轴引线聚丙烯电容axial lead polystyrene 径向轴引线聚苯乙烯电容ceramic disc 陶瓷圆片电容decoupling disc 解耦圆片电容high temp radial 高温径向电容high temp axial electrolytic高温径向电解电容metallised polyester film 金属聚酯膜电容metallised polypropene 金属聚丙烯电容metallised polypropene film 金属聚丙烯膜电容miniture electrolytic 微型电解电容multilayer metallised polyester film 多层金属聚酯膜电容mylar film 聚酯薄膜电容nickel barrier 镍栅电容non polarised 无极性电容polyester layer 聚酯层电容radial electrolytic 径向电解电容resin dipped 树脂蚀刻电容tantalum bead 钽珠电容variable 可变电容vx a xial electrolytic VX 轴电解电容3，CMOS 4000 series 4000系列数字电路adders 加法器buffers & drivers 缓冲和驱动器comparators 比较器counters 计数器decoders 译码器encoders 编码器flip-flops & latches 触发器和锁存器frequency dividers & tiner 分频和定时器gates & inverters 门电路和反相器memory 存储器misc.logic 混杂逻辑电路mutiplexers 数据选择器multivibrators 多谐振荡器phase-locked loops(PLL) 锁相环registers 寄存器signal switcher 信号开关4，connectors 接头；8个分类：audio 音频接头D-type D型接头DIL 双排插座header blocks 插头miscellaneous 各种接头PCB transfer PCB 传输接头SIL 单盘插座ribbon cable 蛇皮电缆terminal blocks 接线端子台5，data converters 数据转换器：4个分类：A/D converters 模数转换器D/A converters 数模转换器sample & hold 采样保持器temperature sensors 温度传感器6，debugging tools 调试工具数据：3个类别：breakpoint triggers 断点触发器logic probes 逻辑输出探针logic timuli 逻辑状态输入7，diodes 二极管；8个分类：bridge rectifiers 整流桥generic 普通二极管rectifiers 整流二极管schottky 肖特基二极管switching 开关二极管tunnel 隧道二极管varicap 稳压二极管8，inductors 电感：3个类别：generic 普通电感SMT inductors 表面安装技术电感transformers 变压器9,laplace primitives 拉普拉斯模型：7个类别：1st order 一阶模型2nd order 二阶模型controllers 控制器non-linear 非线性模型operators 算子poles/zeros 极点/零点symbols 符号10，memory ICs 存储器芯片：7个分类：dynamic RAM 动态数据存储器EEPROM 电可擦出程序存储器EPROM 可擦出程序存储器I2C memories I2C 总线存储器memory cards 存储卡SPI Memories SPI 总线存储器static RAM 静态数据存储器11，microprocessor ICs 微处理器：13个分类：12，modelling primitivvves 建模源：9个分类：13，operational amplifiers 运算放大器：7个分类：dual 双运放ideal 理想运放macromodel 大量使用的运放octal 8运放quad 4运放single 单运放triple 三运放14，optoelectronics 光电器件：11个分类：7-segment displays 7段显示alphanumeric LCDs 液晶数码显示bargraph displays 条形显示dot matrix displays 点阵显示graphical LCDs 液晶图形显示lamps 灯LCD controllers 液晶控制器LCD controllers 液晶面板显示LEDs 发光二极管optocouplers 光电耦合serial LCDs 串行液晶显示15，resistors 电阻：11个分类：0.6w metal film 0.6w金属膜电阻10 watt wirewound 10w绕线电阻2w metal film 2w 金属膜电阻3 watt wirewound 3w 绕线电阻7 watt wirewound 7w 绕线电阻generix 普通电阻high voltage 高压电阻NTC 负温度系数热敏电阻resistor packs 排阻variable 滑动变阻器varisitors可变电阻参考试验中采用的可变电阻是：POT-HG16，simulator primitives 仿真源：3个类别：flip-flops 触发器gates 门电路sources 电源17，switches and relays 开关和继电器：4个类别：key pads 键盘relays 普通继电器relays(specific) 专用继电器switches 开关18,switching devices 开关器件：4个分类：DIACs 两端交流开关generic 普通开关元件SCRs 可控硅TRIACs 三端双向可控硅19，真空管：20，传感器：2个分类：pressure 压力传感器temperature 温度传感器21，晶体管：8个分类：bipolar 双极型晶体管generic 普通晶体管(错误）IGBT 绝缘栅双极晶体管JFET 结型场效应管MOSFET 金属氧化物场效应管RF power LDMOS 射频功率LDMOS管RF power VDMOS 射频功率VDMOS管unijunction 单结晶体管Electromechanical 电机MOTOR AC 交流电机MOTOR SERVO 伺服电机双相步进电机motor-bistepper（Bipolar Stepper Motor），四相步进电机motor-stepper（unipolar stepper motor）驱动电路，用ULN2003可以，proteus中推荐的L298和L6201(电子元件-步进电机中有L298资料）+++++++++++++++++++++++++++++++++ +++++++++++++++++++++++++++++++++ +++步进电机,可以用MTD2003,UN2916等专用芯片Proteus中图形液晶模块驱动芯片一览表LM3228 LM3229 LM3267 LM3283LM3287 LM4228 LM4265 LM4267LM4283 LM4287 PG12864F PG24064FPG128128A PG160128AAGM1232G EW12A03GL Y HDM32GS12-B HDM32GS12Y-B HDG12864F-1 HDS12864F-3 HDG12864L-4 HDG12864L-6NOKIA7110 TG126410GFSB TG13650FEYAMPIRE128x64 LGM12641BS1R PROTEUS原理图元器件库详细说明Device.lib 单双向可控硅、包括电阻、电容、二极管、三极管和PCB的连接器符号、ACTIVE.LIB 包括虚拟仪器和有源器件、拨动开关、键盘、可调电位器和开关、DIODE.LIB 包括二极管和整流桥、稳压管、变容二极管、大功率二极管、高速二极管、可控硅、DISPLAY.LIB 包括LCD、LED、LED 阵列BIPOLAR.LIB 包括三极管FET.LIB 包括场效应管ASIMMDLS.LIB 包括模拟元器件AS 稳压二极管、全桥、74系列、及其他。

MAX3430中文资料

Lighting Systems
Industrofibus Applications
Multimaster RS-485 Networks
Features
o ±80V Fault Protection o ±12kV ESD Protection o +3.3V Operation o Internal Slew-Rate Limiting o 250kbps Data Rate o Allows Up to 128 Transceivers on the Bus o -7V to +12V Common-Mode Input Voltage Range o True Fail-Safe Inputs o Hot-Swap Input Structure on DE o Available in 8-Pin SO and PDIP Packages
MIN TYP MAX
2.0
VCC
1.5
VCC
0.2
Driver Common-Mode Output Voltage
VOC Figure 1, RL = 100Ω or 54Ω
VCC / 2 3
Change in Magnitude of Common-Mode Voltage
∆VOC Figure 1, RL = 100Ω or 54Ω (Note 2)
Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C

MAX3430EPA+中文资料

General DescriptionThe MAX3430 fault-protected RS-485 transceiver features ±80V protection from overvoltage signal faults on commu-nication bus lines. Each device contains one driver and one receiver, and the output pins can withstand faults,with respect to ground, of up to ±80V. Even if the faults occur when the transceiver is active, shut down, or pow-ered off, the device will not be damaged. The MAX3430operates from a 3.3V supply and features a slew-rate-lim-ited driver that minimizes EMI and reduces reflections caused by improperly terminated cables, allowing error-free data transmission at data rates up to 250kbps. The MAX3430 has a 1/4-unit-load receiver input impedance allowing up to 128 transceivers on a single bus and fea-tures fail-safe circuitry, which guarantees a logic-high receiver output when the receiver inputs are open.Hot-swap circuitry eliminates false transitions on the data cable during circuit initialization or connection to a live backplane. Short-circuit current limiting and ther-mal-shutdown circuitry protect the driver against exces-sive power dissipation.The MAX3430 is available in 8-pin SO and 8-pin PDI P packages, and is specified over commercial and indus-trial temperature ranges.ApplicationsRS-422/RS-485 Communications Lighting SystemsIndustrial-Control Local Area Networks Profibus Applications Multimaster RS-485 NetworksFeatureso ±80V Fault Protection o ±12kV ESD Protection o +3.3V Operationo Internal Slew-Rate Limiting o 250kbps Data Rateo Allows Up to 128 Transceivers on the Bus o -7V to +12V Common-Mode Input Voltage Range o True Fail-Safe Inputso Hot-Swap Input Structure on DEo Available in 8-Pin SO and PDIP PackagesMAX3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver________________________________________________________________Maxim Integrated Products 1Pin Configuration and Typical Operating CircuitOrdering Information19-2756; Rev 1; 4/03For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +3.3V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.3V and T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All voltages are referenced to GND.)V CC ........................................................................................+5V RE , DE, DI...................................................-0.3V to (V CC + 0.3V)Driver Output Voltage (A, B) (Note 1)..................................±80V Receiver Input Voltage (A, B) (Note 1)................................±80V RO..............................................................-0.3V to (V CC + 0.3V)Continuous Power Dissipation (T A = +70°C)8-Pin SO (derate 5.88mW/°C above +70°C)................471mW 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C)...727mWOperating Temperature RangesMAX3430C_ _.....................................................0°C to +70°C MAX3430E_ _..................................................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CNote 1:A, B must be terminated with 54Ωor 100Ωto guarantee ±80V fault protection.MAX3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +3.3V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.3V and T A = +25°C.)(V CC = +3.3V ±10%, T A = T MIN to T MAX ,unless otherwise noted. Typical values are at V CC = +3.3V and T A = +25°C.)M A X 3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver 4_______________________________________________________________________________________DRIVER SWITCHING CHARACTERISTICS(V CC = +3.3V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.3V and T A = +25°C.)RECEIVER SWITCHING CHARACTERISTICS(V CC = +3.3V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.3V and T A = +25°C.)OD OC OD OC Note 3:The short-circuit output current applies to peak current just prior to foldback current limiting; the short-circuit foldback outputcurrent applies during current limiting to allow a recovery from bus contention.MAX3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver_______________________________________________________________________________________5013245-40-2020406080SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (m A )0755025150125100175200-40-2020406080SHUTDOWN CURRENT vs. TEMPERATURETEMPERATURE (°C)S H U T D O W N C U R R E N T (µA )0412816201.00.51.52.02.53.03.5OUTPUT CURRENTvs. RECEIVER OUTPUT LOW VOLTAGEOUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )0312*******1.00.51.52.02.53.03.5OUTPUT CURRENTvs. RECEIVER OUTPUT HIGH VOLTAGEOUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A)3.003.103.053.203.153.253.30-40-2020406080RECEIVER OUTPUT HIGH VOLTAGEvs. TEMPERATURETEMPERATURE (°C)O U T P U T H I G H V O L T A G E (V )00.10.30.20.40.5-40-2020406080RECEIVER OUTPUT LOW VOLTAGEvs. TEMPERATURETEMPERATURE (°C)O U T P U T L O W V O L T A G E (V )02080604010012001.00.51.52.02.53.03.5DRIVER OUTPUT CURRENTvs. DIFFERENTIAL OUTPUT VOLTAGEDIFFERENTIAL OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A)1.51.00.52.52.03.03.5-400-2020406080DRIVER DIFFERENTIAL OUTPUT VOLTAGEvs. TEMPERATURETEMPERATURE (°C)D I F F E R E N T I A L OU T P U T V O L T A G E (V )-3-2-10123-80-40-60-20020406080A, B CURRENTvs. A, B VOLTAGE (TO GROUND)A, B VOLTAGE (V)A ,BC U R R E N T (m A )Typical Operating Characteristics(V CC = +3.3V, T A = +25°C, unless otherwise noted.)M A X 3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver 6_______________________________________________________________________________________Figure 1. Driver DC Test LoadFigure 2. Driver Timing Test CircuitFigure 3. Driver Propagation DelaysDZL DLZt DLZ(SHDN))Figure 5. Driver Enable and Disable Times (t DHZ , t DZH , t DZH(SHDN))Test Circuits/Timing DiagramsMAX3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver_______________________________________________________________________________________7Figure 6. Receiver Propagation DelaysFigure 7. Receiver Enable and Disable TimesTest Circuits/Timing Diagrams (continued)M A X 3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver 8_______________________________________________________________________________________MAX3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver_______________________________________________________________________________________9Detailed DescriptionDriverThe driver accepts a single-ended, logic-level input (DI) and transfers it to a differential, RS-485 level output (A and B). Driving DE high enables the driver, while pulling DE low places the driver outputs (A and B) into a high-impedance state.ReceiverThe receiver accepts a differential, RS-485 level input (A and B), and transfers it to a single-ended, logic-level output (RO). Pulling RE low enables the receiver, while driving RE high and DE low places the receiver inputs (A and B) into a high-impedance state.Low-Power ShutdownForce DE low and RE high to shut down the MAX3430. A time delay of 1µs prevents the device from accidentally entering shutdown due to logic skews when switching between transmit and receive modes. Holding DE low and RE high for at least 1ms guarantees that the MAX3430 enters shutdown. I n shutdown, the device consumes 100µA supply current.±80V Fault ProtectionThe driver outputs/receiver inputs of RS-485 devices in industrial network applications often experience voltage faults resulting from transients that exceed the -7V to +12V range specified in the EI A/TI A-485 standard. I n these applications, ordinary RS-485 devices (typical absolute maximum ratings -8V to +12.5V) require costly external protection devices. To reduce system com-plexity and the need for external protection, the driver outputs/receiver inputs of the MAX3430 withstand volt-age faults of up to ±80V with respect to ground without damage (see the Absolute Maximum R atings section,Note 1). Protection is guaranteed regardless of whether the device is active, shut down, or without power.True Fail-SafeThe MAX3430 uses a -50mV to -200mV differential input threshold to ensure true fail-safe receiver inputs.This threshold guarantees the receiver outputs a logic high for shorted, open, or idle data lines. The -50mV to -200mV threshold complies with the ±200mV threshold EIA/TIA-485 standard.±12kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against ESD encountered during handling and assembly. The MAX3430 receiver inputs/driver outputs (A, B) have extra protection against static electricity found in nor-mal operation. Maxim ’s engineers have developed state-of-the-art structures to protect these pins against ±12kV ESD without damage. After an ESD event, the MAX3430 continues working without latchup.ESD protection can be tested in several ways. The receiver inputs are characterized for protection up to ±12kV using the Human Body Model.ESD Test ConditionsESD performance depends on a number of conditions.Contact Maxim for a reliability report that documents test setup, methodology, and results.Human Body ModelFigure 8a shows the Human Body Model, and Figure 8b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the device through a 1.5k Ωresistor.Driver Output ProtectionTwo mechanisms prevent excessive output current and power dissipation caused by faults or bus contention.The first, a foldback current limit on the driver outputFigure 8a. Human Body ESD Test ModelM A X 3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiverstage, provides immediate protection against short cir-cuits over the whole common-mode voltage range. The second, a thermal shutdown circuit, forces the driver outputs into a high-impedance state if the die tempera-ture exceeds +160°C. Normal operation resumes when the die temperature cools by +140°C, resulting in a pulsed output during continuous short-circuit conditions.Hot-Swap CapabilityHot-Swap InputsInserting circuit boards into a hot, or powered backplane may cause voltage transients on DE, RE , and receiver inputs A and B that can lead to data errors. For example,upon initial circuit board insertion, the processor under-goes a power-up sequence. During this period, the high-impedance state of the output drivers makes them unable to drive the MAX3430 enable inputs to a defined logic level. Meanwhile, leakage currents of up to 10µA from the high-impedance output, or capacitively coupled noise from V CC or GND, could cause an input to drift to an incorrect logic state. To prevent such a condition from occurring, the MAX3430 features hot-swap input circuitry on DE to safeguard against unwanted driver activation during hot-swap situations. When V CC rises, an internal pulldown circuit holds DE low for at least 10µs, and until the current into DE exceeds 200µA. After the initial power-up sequence, the pulldown circuit becomes transparent, resetting the hot-swap tolerable input.Hot-Swap Input CircuitryAt the driver enable input (DE), there are two NMOS devices, M1 and M2 (Figure 9). When V CC ramps from 0, an internal 15µs timer turns on M2 and sets the SR latch, which also turns on M1. Transistors M2, a 2mA current sink, and M1, a 100µA current sink, pull DE to GND through a 5.6k Ωresistor. M2 pulls DE to the dis-abled state against an external parasitic capacitance up to 100pF that may drive DE high. After 15µs, the timer deactivates M2 while M1 remains on, holding DE low against three-state leakage currents that may drive DE high. M1 remains on until an external current source overcomes the required input current. At this time, the SR latch resets M1 and turns off. When M1 turns off, DE reverts to a standard, high-impedance CMOS input.Whenever V CC drops below 1V, the input is reset.MAX3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 Transceiver______________________________________________________________________________________11Applications Information128 Transceivers on the BusThe standard RS-485 receiver input impedance is 12k Ω(one-unit load), and a standard driver can drive up to 32-unit loads. The MAX3430 transceiver 1/4-unit-load receiver input impedance (48k Ω) allows up to 128transceivers connected in parallel on one communica-tion line. Connect any combination of these devices,and/or other RS-485 devices, for a maximum of 32 unit loads to the line.RS-485 ApplicationsThe MAX3430 transceiver provides bidirectional data communications on multipoint bus transmission lines.Figure 10shows a typical network applications circuit.The RS-485 standard covers line lengths up to 4000ft.The signal line must be terminated at both ends in its characteristic impedance, and stub lengths off the main line kept as short as possible.Chip InformationTRANSISTOR COUNT:300PROCESS:BiCMOSM A X 3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 TransceiverPackage Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)MAX3430±80V Fault-Protected, Fail-Safe,1/4-Unit Load, +3.3V RS-485 TransceiverMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________13©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。

S-81240中文资料

元器件交易网ContentsFeatures (1)Applications (1)Pin Assignment (1)Block Diagram (1)Selection Guide (2)Absolute Maximum Ratings (2)Electrical Characteristics (3)Test Circuits (11)Technical Terms (12)Operation (13)Transient Response (14)Standard Circuit (17)Application Circuits (17)Notes on Design (19)Dimensions (20)Markings (20)Package Power Dissipation (21)Taping Dimensions (22)Characteristics (25)Measuring Circuits (31)Frequently Asked Question s (32)Seiko Instruments Inc.1The S-812XXSG Series is a three-terminal positive voltage regulator made using the CMOS process. Since the S-812XXSG Series has higher precision output voltage and consumes less current than existing three-terminal voltage regulators, battery-powered portable equipment can have a higher performance and a longer service life.ApplicationsConstant voltage power supply of battery-powered equipment, communications equipment, video equipmentand othersPin AssignmentHIGH-PRECISIONVOLTAGE REGULATORS-812XXSG SeriesFeaturesLow power consumption (2.5 A max.) High accuracy of output voltage±2% : V OUT 2.7 V ±2.4% : V OUT 2.6 VSmall input/output voltage difference(S-81250SG: 160 mV typ. I OUT =10 mA) Low temperature coefficient of output voltage(S-81250SG: ±0.625 mV/ C typ.) Wide operating voltage range(S-81250SG: 16 V max.) Good line regulation(S-81250SG: 40 mV typ. I OUT =1 A to 40 mA) T O-92, SOT-89-3 and SOT-23-5 packageBlock DiagramFigure 1R LGNDV INV OUT2+-*Ref.vol.31* Parasitic diodeBottom view123(1)TO-921GND 2V IN 3V OUTTop view1231GND 2V IN 3V OUT(2)SOT-89-3GNDV IN V OUTNC NCTop View (3)SOT-23-5Figure 2HIGH PRECISION VOLTAGE REGULATOR S-812XXSG Series2Seiko Instruments Inc.Selection GuideTable 1Output voltage TO-92 *1SOT-89-3 *2SOT-23-5 *21.1 2.4%S-81211SGY-X S-81211SGUP-DQA-X S-81211SG-QA-X 1.5 2.4%S-81215SGY-XS-81215SGUP-DQK-XS-81215SG-QK-X 1.7 2.4%S-81217SG-QQ-X 1.8 2.4%S-81218SG-QR-X 2.0 2.4%S-81220SGY-X S-81220SGUP-DQS-X S-81220SG-QS-X 2.1 2.4%S-81221SGUP-DQU-X 2.3 2.4%S-81223SGY-X S-81223SG-QW-X 2.4 2.4%S-81224SGY-X S-81224SGUP-DQX-X S-81224SG-QX-X 2.5 2.4%S-81225SGY-X S-81225SGUP-DQH-X S-81225SG-QH-X 2.7 2.0%S-81227SGUP-DQZ-X 3.0 2.0%S-81230SGY-X S-81230SGUP-DQB-X S-81230SG-QB-X 3.3 2.0%S-81233SGY-X S-81233SGUP-DQF-X S-81233SG-QF-X 3.5 2.0%S-81235SGY-X S-81235SGUP-DQI-X S-81235SG-QI-X 3.6 2.0%S-81236SGUP-DQ7-X 3.7 2.0%S-81237SGY-X S-81237SGUP-DQE-X S-81237SG-QE-X 4.0 2.0%S-81240SGY-X S-81240SGUP-DQJ-X S-81240SG-QJ-X 4.2 2.0%S-81242SG-IB-X 4.5 2.0%S-81245SGY-X S-81245SGUP-DQ5-X S-81245SG-Q5-X 4.6 2.0%S-81246SGY-X S-81246SGUP-DQM-X S-81246SG-QM-X 4.7 2.0%S-81247SG-IE-X 5.0 2.0%S-81250SGY-X S-81250SGUP-DQD-X S-81250SG-QD-X 5.2 2.0%S-81252SGY-XS-81252SGUP-DQL-X S-81252SG-QL-X5.3 2.0%S-81253SGUP-DIJ-X 5.4 2.0%S-81254SGUP-DIK-X 5.5 2.0%S-81255SGUP-DIL-X 5.6 2.0%S-81256SGUP-DIM-X*1In the TO-92 package, “x” differs depending upon the packaging form:B : Loose T, Z : Tape*2In the SOT package, “x” differs depending upon the packaging form (in the SOT-23-5 package, on-tape packed products only):S : StickT : Tape (T1 and T2 are available depending upon the direction of the IC)Absolute Maximum RatingsTable 2(Unless otherwise specified: Ta=25 C)ParameterSymbol Conditions Ratings Unit V OUT 2.6 V 12V Input voltage V IN V OUT 2.7 V18Output voltage V OUT V IN +0.3 to V SS -0.3V Output current I OUT 100mA TO-92400Power dissipation P D SOT-89-3500mW SOT-23-5150Operating temperature T opr -40 to +85 C Storage temperatureT stg-40 to +125CCaution: Keep static electricity to a minimum.HIGH-PRECISION VOLTAGE REGULATORS-812XXSG SeriesSeiko Instruments Inc.3Electrical Characteristics1.S-81211SGY-X, S-81211SGUP-DQA-X, S-81211SG-QA-X (1.1-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =1.5 V, I OUT =0.5 mA 1.073 1.100 1.127V 1I/O voltage difference V dif I OUT =0.5 mA 0.050.2V 1Line regulation 1 V OUT 1V IN =1.5 to 10 V I OUT =0.5 mA 1050mV 1Line regulation 2 V OUT 2V IN =1.5 to 10 V I OUT =10 A1077mV 1Load regulation V OUT 3V IN =1.5 VI OUT =10 A to 0.5 mA 10100mV 1Current consumption I SS V IN =1.5 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =1.5 V, I OUT = 0.5 mA Ta=-40 C to 85 C±0.138mV/ C2. S-81215SGY-X, S-81215SGUP-DQK-X, S-81215SG-QK-X (1.5-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =3.5 V, I OUT =0.5 mA 1.464 1.500 1.536V 1I/O voltage difference V dif I OUT =0.5 mA 0.030.18V 1Line regulation 1 V OUT 1V IN =2.5 to 10 V I OUT =0.5 mA 739mV 1Line regulation 2 V OUT 2V IN =2.5 to 10 V I OUT =1 A7105mV 1Load regulation V OUT 3V IN =3.5 VI OUT =1 A to10 mA 80120mV 1Current consumption I SS V IN =3.5 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =3.5 V, I OUT = 0.5 mA Ta=-40 C to 85 C±0.188mV/ C3. S-81217SG-QQ-X (1.7-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =3.7 V, I OUT =10 mA 1.659 1.700 1.741V 1I/O voltage difference V dif I OUT =10 mA 0.77 1.63V 1Line regulation 1 V OUT 1V IN =2.7 to 10 V I OUT =1 mA 843mV 1Line regulation 2 V OUT 2V IN =2.7 to 10 V I OUT =1 A8119mV 1Load regulation V OUT 3V IN =3.7 VI OUT =1 A to 10 mA 80120mV 1Current consumption I SS V IN =3.7 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =3.7 V, I OUT = 10 mA Ta=-40 C to 85 C±0.213mV/ CTable 3(Unless otherwise specified: Ta=25 C)Table 4(Unless otherwise specified: Ta=25 C)Table 5(Unless otherwise specified: Ta=25 C)HIGH PRECISION VOLTAGE REGULATOR S-812XXSG Series4Seiko Instruments Inc.4.S-81218SG-QR-X (1.8-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =3.8 V, I OUT =10 mA 1.756 1.800 1.843V 1I/O voltage difference V dif I OUT =10 mA 0.72 1.55V 1Line regulation 1 V OUT 1V IN =2.8 to 10 V I OUT =1 mA 845mV 1Line regulation 2 V OUT 2V IN =2.8 to 10 V I OUT =1 A8126mV 1Load regulation V OUT 3V IN =3.8 VI OUT =1 A to 10 mA 80120mV 1Current consumption I SS V IN =3.8 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =3.8 V, I OUT = 10 mA Ta=-40 C to 85 C±0.225mV/ C5.S-81220SGY-X, S-81220SGUP-DQS-X, S-81220SG-QS-X (2.0-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =4.0 V, I OUT =10 mA 1.592 2.000 2.048V 1I/O voltage difference V dif I OUT =10 mA 0.63 1.39V 1Line regulation 1 V OUT 1V IN =3.0 to 10 V I OUT =1 mA 848mV 1Line regulation 2 V OUT 2V IN =3.0 to 10 V I OUT =1 A8140mV 1Load regulation V OUT 3V IN =4.0 VI OUT =1 A to 10 mA 80120mV 1Current consumption I SS V IN =4.0 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =4.0 V, I OUT = 10 mA Ta=-40 C to 85 C±0.250mV/ C6.S-81221SGUP-DQU-X (2.1-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =4.1 V, I OUT =10 mA 2.049 2.100 2.151V 1I/O voltage difference V dif I OUT =10 mA 0.59 1.32V 1Line regulation 1 V OUT 1V IN =3.1 to 10 V I OUT =1 mA 950mV 1Line regulation 2 V OUT 2V IN =3.1 to 10 V I OUT =1 A9147mV 1Load regulation V OUT 3V IN =4.1 VI OUT =1 A to 10 mA 80120mV 1Current consumption I SS V IN =4.1 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =4.1 V, I OU T = 10 mA Ta=-40 C to 85 C±0.263mV/ CTable 6(Unless otherwise specified : Ta=25 C)Table 7(Unless otherwise specified : Ta=25 C)Table 8(Unless otherwise specified : Ta=25 C)HIGH-PRECISION VOLTAGE REGULATORS-812XXSG SeriesSeiko Instruments Inc.57.S-81223SGY-X, S-81223SG-QW-X (2.3-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =4.3 V, I OUT =10 mA2.244 2.300 2.356V 1I/O voltage difference V dif IOUT =10 mA0.53 1.20V 1Line regulation 1 V OUT 1V IN =3.3 to 10 V I OUT =1 mA 954mV 1Line regulation 2 V OUT 2V IN =3.3 to 10 V I OUT =1 A9161mV 1Load regulation V OUT 3V IN =4.3 VI OUT =1 A to 10 mA 80120mV 1Current consumption I SS V IN =4.3 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =4.3 V, I OUT = 10 mA Ta=-40 C to 85 C±0.288mV/ C8.S-81224SGY-X, S-81224SGUP-DQX-X, S-81224SG-QX-X (2.4-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =4.4 V, I OUT =10 mA 2.342 2.400 2.458V 1I/O voltage difference V dif I OUT =10 mA 0.49 1.15V 1Line regulation 1 V OUT 1V IN =3.4 to 10 V I OUT =1 mA 1055mV 1Line regulation 2 V OUT 2V IN =3.4 to 10 V I OUT =1 A10168mV 1Load regulation V OUT 3V IN =4.4 VI OUT =1 A to 10 mA 80120mV 1Current consumption I SS V IN =4.4 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =4.4 V, I OUT = 10 mA Ta=-40 C to 85 C±0.300mV/ C9.S-81225SGY-X, S-81225SGUP-DQH-X, S-81225SG-QH-X (2.5-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =4.5 V, I OUT =10 mA 2.440 2.500 2.560V 1I/O voltage difference V dif I OUT =10 mA 0.59 1.32V 1Line regulation 1 V OUT 1V IN =3.5 to 10 V I OUT =1 mA 1057mV 1Line regulation 2 V OUT 2V IN =3.5 to 10 V I OUT =1 A10175mV 1Load regulation V OUT 3V IN =4.5 VI OUT =1 A to 10 mA 80120mV 1Current consumption I SS V IN =4.5 V, Unloaded1.22.5 A 2Input voltage V IN 10V Temperature charac-teristic of V OUTV OUT TaV IN =4.5 V, I OUT = 10 mA Ta=-40 C to 85 C±0.313mV/ CTable 9(Unless otherwise specified : Ta=25 C)Table 10(Unless otherwise specified : Ta=25 C)Table 11(Unless otherwise specified : Ta=25 C)HIGH-PRECISION VOLTAGE REGULATOR S-812XXSG Series6Seiko Instruments Inc.10.S-81227SGUP-DQZ-X (2.7-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =4.7 V, I OUT =10 mA 2.646 2.700 2.754V 1I/O voltage difference V dif I OUT =10 mA 0.52 1.20V 1Line regulation 1 V OUT 1V IN =3.7 to 16 V I OUT =1 mA 3672mV 1Line regulation 2 V OUT 2V IN =3.7 to 16 V I OUT =1 A36189mV 1Load regulation V OUT 3V IN =4.7 VI OUT =1 A to 20 mA 80120mV 1Current consumption I SS V IN =4.7 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =4.7 V, I OUT = 10 mA Ta=-40 C to 85 C±0.338mV/ C11.S-81230SGY-X, S-81230SGUP-DQB-X, S-81230SG-QB-X (3.0-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =5.0 V, I OUT =10 mA 2.940 3.000 3.060V 1I/O voltage difference V dif I OUT =10 mA 0.44 1.04V 1Line regulation 1 V OUT 1V IN =4.0 to 16 V I OUT =1 mA 3978mV 1Line regulation 2 V OUT 2V IN =4.0 to 16 V I OUT =1 A39210mV 1Load regulation V OUT 3V IN =5 VI OUT =1 A to 20 mA 60100mV 1Current consumption I SS V IN =5.0 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =5.0 V, I OUT = 10 mA Ta=-40 C to 85 C±0.375mV/ C12.S-81233SGY-X, S-81233SGUP-DQF-X, S-81233SG-QF-X (3.3-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =5.3 V, I OUT =10 mA 3.234 3.300 3.366V 1I/O voltage difference V dif I OUT =10 mA 0.370.91V 1Line regulation 1 V OUT 1V IN =4.3 to 16 V I OUT =1 mA 4284mV 1Line regulation 2 V OUT 2V IN =4.3 to 16 V I OUT =1 A42231mV 1Load regulation V OUT 3V IN =5.3 VI OUT =1 A to 20 mA 60100mV 1Current consumption I SS V IN =5.3 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =5.3 V, I OUT = 10 mA Ta=-40 C to 85 C±0.413mV/ CTable 12(Unless otherwise specified : Ta=25 C)Table 13(Unless otherwise specified : Ta=25 C)Table 14(Unless otherwise specified : Ta=25 C)HIGH-PRECISION VOLTAGE REGULATORS-812XXSG SeriesSeiko Instruments Inc.713.S-81235SGY-X, S-81235SGUP-DQI-X, S-81235SG-QI-X (3.5-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =5.5 V, I OUT =10 mA 3.430 3.500 3.570V 1I/O voltage difference V dif I OUT =10 mA 0.340.84V 1Line regulation 1 V OUT 1V IN =4.5 to 16 V I OUT =1 mA 4488mV 1Line regulation 2 V OUT 2V IN =4.5 to 16 V I OUT =1 A44245mV 1Load regulation V OUT 3V IN =5.5 VI OUT =1 A to 30 mA 60100mV 1Current consumption I SS V IN =5.5 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =5.5 V, I OUT = 10 mA Ta=-40 C to 85 C±0.438mV/ C14. S-81236SGUP-DQ7-X (3.6-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =5.6 V, I OUT =10 mA 3.528 3.600 3.672V 1I/O voltage difference V dif I OUT =16 mA 0.320.81V 1Line regulation 1 V OUT 1V IN =4.6 to 16 V I OUT =1 mA 4590mV 1Line regulation 2 V OUT 2V IN =4.6 to 16 V I OUT =1 A45252mV 1Load regulation V OUT 3V IN =5.6 VI OUT =1 A to 30 mA 60100mV 1Current consumption I SS V IN =5.6 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =5.6 V, I OUT = 10 mA Ta=-40 C to 85 C±0.450mV/ C15.S-81237SGY-X, S-81237SGUP-DQE-X, S-81237SG-QE-X (3.7-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =5.7 V, I OUT =10 mA 3.626 3.700 3.774V 1I/O voltage difference V dif I OUT =10 mA 0.310.78V 1Line regulation 1 V OUT 1V IN =4.7 to 16 V I OUT =1 mA 4692mV 1Line regulation 2 V OUT 2V IN =4.7 to 16 V I OUT =1 A46259mV 1Load regulation V OUT 3V IN =5.7 VI OUT =1 A to 30 mA 60100mV 1Current consumption I SS V IN =5.7 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =5.7 V, I OUT = 10 mA Ta=-40 C to 85 C±0.463mV/ CTable 15(Unless otherwise specified : Ta=25 C)Table 17(Unless otherwise specified : Ta=25 C)Table 16(Unless otherwise specified : Ta=25 C)HIGH-PRECISION VOLTAGE REGULATOR S-812XXSG Series8Seiko Instruments Inc.16.S-81240SGY-X, S-81240SGUP-DQJ-X, S-81240SG-QJ-X (4.0-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =6.0 V, I OUT =10 mA 3.920 4.000 4.080V 1I/O voltage difference V dif I OUT =10 mA 0.270.70V 1Line regulation 1 V OUT 1V IN =5.0 to 16 V I OUT =1 mA 4896mV 1Line regulation 2 V OUT 2V IN =5.0 to 16 V I OUT =1 A48280mV 1Load regulation V OUT 3V IN =6.0 VI OUT =1 A to 30 mA 5090mV 1Current consumption I SS V IN =6.0 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =6.0 V, I OUT = 10 mA Ta=-40 C to 85 C±0.500mV/ C17. S-81242SG-IB-X (4.2-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =6.2V, I OUT =10 mA 4.116 4.200 4.284V 1I/O voltage difference V dif I OUT =10 mA 0.240.65V 1Line regulation 1 V OUT 1V IN =5.2 to 16 V I OUT =1 mA 50100mV 1Line regulation 2 V OUT 2V IN =5.2 to 16 V I OUT =1 A50294mV 1Load regulation V OUT 3V IN =6.2 VI OUT =1 A to 30 mA 5090mV 1Current consumption I SS V IN =6.2 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =6.2 V, I OUT = 10 mA Ta=-40 C to 85 C±0.525mV/ C18.S-81245SGY-X, S-81245SGUP-DQ5-X, S-81245SG-Q5-X (4.5-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =6.5 V, I OUT =10 mA 4.410 4.500 4.590V 1I/O voltage difference V dif I OUT =10 mA 0.210.58V 1Line regulation 1 V OUT 1V IN =5.5 to 16 V I OUT =1 mA 52104mV 1Line regulation 2 V OUT 2V IN =5.5 to 16 V I OUT =1 A52315mV 1Load regulation V OUT 3V IN =6.5 VI OUT =1 A to 30 mA 5090mV 1Current consumption I SS V IN =6.5 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =6.5 V, I OUT = 10 mA Ta=-40 C to 85 C±0.563mV/ CTable 18(Unless otherwise specified : Ta=25 C)Table 20(Unless otherwise specified : Ta=25 C)Table 19(Unless otherwise specified : Ta=25 C)HIGH-PRECISION VOLTAGE REGULATORS-812XXSG SeriesSeiko Instruments Inc.919.S-81246SGY-X, S-81246SGUP-DQM-X, S-81246SG-QM-X (4.6-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =6.6 V, I OUT =10 mA 4.508 4.600 4.692V 1I/O voltage difference V dif I OUT =10 mA 0.200.57V 1Line regulation 1 V OUT 1V IN =5.6 to 16 V I OUT =1 mA 53105mV 1Line regulation 2 V OUT 2V IN =5.6 to 16 V I OUT =1 A53322mV 1Load regulation V OUT 3V IN =6.6 VI OUT =1 A to 30 mA 5090mV 1Current consumption I SS V IN =6.6 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =6.6 V, I OUT = 10 mA Ta=-40 C to 85 C±0.575mV/ C20.S-81247SG-IE-X (4.7-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =6.7 V, I OUT =10 mA 4.606 4.700 4.794V 1I/O voltage difference V dif I OUT =10 mA 0.190.55V 1Line regulation 1 V OUT 1V IN =5.7 to 16 V I OUT =1 mA 54107mV 1Line regulation 2 V OUT 2V IN =5.7 to 16 V I OUT =1 A54329mV 1Load regulation V OUT 3V IN =6.7 VI OUT =1 A to 30 mA 5090mV 1Current consumption I SS V IN =6.7 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =6.7 V, I OUT = 10 mA Ta=-40 C to 85 C±0.588mV/ C21.S-81250SGY-X, S-81250SGUP-DQD-X, S-81250SG-QD-X (5.0-V output type)Parameter Symbol ConditionsMin.Typ.Max.Unit Test cir.Output voltage V OUT V IN =7.0 V, I OUT =10 mA 4.900 5.000 5.100V 1I/O voltage difference V dif I OUT =10 mA 0.160.50V 1Line regulation 1 V OUT 1V IN =6.0 to 16 V I OUT =1 mA 55110mV 1Line regulation 2 V OUT 2V IN =6.0 to 16 V I OUT =1 A55350mV 1Load regulation V OUT 3V IN =7.0 VI OUT =1 A to 40 mA 4080mV 1Current consumption I SS V IN =7.0 V, Unloaded1.22.5 A 2Input voltage V IN 16V Temperature charac-teristic of V OUTV OUT TaV IN =7.0 V, I OUT = 10 mA Ta=-40 C to 85 C±0.625mV/ CTable 21(Unless otherwise specified : Ta=25 C)Table 22(Unless otherwise specified : Ta=25 C)Table 23(Unless otherwise specified : Ta=25 C)22.S-81252SGY-X, S-81252SGUP-DQL-X, S-81252SG-QL-X (5.2-V output type)Parameter Symbol Conditions Min.Typ.Max.Unit Testcir.Output voltage V OUT V IN =7.2 V, I OUT =10 mA 5.096 5.200 5.304V1 I/O voltage difference V dif I OUT=10 mA 0.150.47V1 Line regulation 1 V OUT1V IN =6.2 to 16 VI OUT=1 mA57113mV1Line regulation 2 V OUT2V IN =6.2 to 16 VI OUT=1 A57364mV1Load regulation V OUT3V IN =7.2 VI OUT=1 A to 40 mA4080mV1 Current consumption I SS V IN =7.2 V, Unloaded 1.2 2.5 A2 Input voltage V IN 16VTemperature charac-teristic of V OUT V OUTTaV IN=7.2 V, I OUT = 10 mATa=-40 C to 85 C±0.650 mV/ C23.S-81253SGUP-DIJ-X (5.3-V output type)Parameter Symbol Conditions Min.Typ.Max.Unit Testcir.Output voltage V OUT V IN =7.3 V, I OUT =10 mA 5.194 5.300 5.406V1 I/O voltage difference V dif I OUT=10 mA 0.140.45V1 Line regulation 1 V OUT1V IN =6.3 to 16 VI OUT=1 mA57114mV1Line regulation 2 V OUT2V IN =6.3 to 16 VI OUT=1 A57371mV1Load regulation V OUT3V IN =7.3 VI OUT=1 A to 40 mA4080mV1 Current consumption I SS V IN =7.3 V, Unloaded 1.2 2.5 A2 Input voltage V IN 16VTemperature charac-teristic of V OUT V OUTTaV IN=7.3 V, I OUT = 10 mATa=-40 C to 85 C±0.663 mV/ C24.S-81254SGUP-DIK-X (5.4-V output type)Parameter Symbol Conditions Min.Typ.Max.Unit Testcir.Output voltage V OUT V IN =7.4 V, I OUT =10 mA 5.292 5.400 5.508V1 I/O voltage difference V dif I OUT=10 mA 0.130.44V1 Line regulation 1 V OUT1V IN =6.4 to 16 VI OUT=1 mA58115mV1Line regulation 2 V OUT2V IN =6.4 to 16 VI OUT=1 A58378mV1Load regulation V OUT3V IN =7.4 VI OUT=1 A to 40 mA4080mV1 Current consumption I SS V IN =7.4 V, Unloaded 1.2 2.5 A2 Input voltage V IN 16VTemperature charac-teristic of V OUT V OUTTaV IN=7.4 V, I OUT = 10 mATa=-40 C to 85 C±0.675 mV/ CTable 24(Unless otherwise specified: Ta=25 C)Table 25(Unless otherwise specified: Ta=25 C)Table 26(Unless otherwise specified: Ta=25 C)25.S-81255SGUP-DIL-X (5.5-V output type)Parameter Symbol Conditions Min.Typ.Max.Unit Testcir.Output voltage V OUT V IN =7.5 V, I OUT =10 mA 5.390 5.500 5.610V 1 I/O voltage difference V dif I OUT=10 mA 0.130.43V1 Line regulation 1 V OUT1V IN =6.5 to 16 VI OUT=1 mA58116mV1Line regulation 2 V OUT2V IN =6.5 to 16 VI OUT=1 A58385mV1Load regulation V OUT3V IN =7.5 VI OUT=1 A to 40 mA4080mV1 Current consumption I SS V IN =7.5 V, Unloaded 1.2 2.5 A2 Input voltage V IN 16VTemperature charac-teristic of V OUT V OUTTaV IN=7.5 V, I OUT = 10 mATa=-40 C to 85 C±0.688 mV/ C26.S-81256SGUP-DIM-X (5.6-V output type)Parameter Symbol Conditions Min.Typ.Max.Unit Testcir.Output voltage V OUT V IN =7.6 V, I OUT =10 mA 5.488 5.600 5.712V1 I/O voltage difference V dif I OUT=10 mA 0.120.42V1 Line regulation 1 V OUT1V IN =6.6 to 16 VI OUT=1 mA59117mV1Line regulation 2 V OUT2V IN =6.6 to 16 VI OUT=1 A59392mV1Load regulation V OUT3V IN =7.6 VI OUT=1 A to 40 mA4080mV1 Current consumption I SS V IN =7.6 V, Unloaded 1.2 2.5 A2 Input voltage V IN 16VTemperature charac-teristic of V OUT V OUTTaV IN=7.6 V, I OUT = 10 mATa=-40 C to 85 C±0.7 mV/ CTest CircuitsTable 27(Unless otherwise specified: Ta=25 C)Table 28(Unless otherwise specified: Ta=25 C)Figure 3GND GNDV IN V OUTV IN V OUT12S-812XXSGSeriesV V AVA S-812XXSGSeriesTechnical Terms1Output voltage (V OUT)The precision of output voltage is guaranteed at ±2.0% or ±2.4% under the prescribed conditions of input voltage, output voltage, and temperature, which differ with items. If these conditions are varied, output voltage value may change into beyond the scope of precision of output voltage. See electrical characteristics and characteristicsdata for detail.2Line regulations 1 and 2 ( V OUT1, V OUT2)Indicates the input voltage dependencies of output voltage. That is, the values express how the output voltage changes, when input voltage is changed under the condition that output current is fixed.3Load regulation ( V OUT3)Indicates the output current dependencies of output voltage. That is, the values express how the output voltage changes, when output current is changed under the condition that input voltage is fixed.4I/O voltage defference (V dif)98% of V OUT is output when the voltage of V OUT+V dif is applied. When V dif is small, output keeps a constantvoltage in the small side of input voltage and large output current can be obtained.NOTE : V dif is highly dependent on I OUT.Operation1Basic operationFigure 4 shows the block diagram of the S-812XXSG Series.The error amplifier compares a reference voltage V REF with a part of the output voltage fed back by the feedback resistors R A and R B . It supplies the control transistor with the gate current, necessary to keep a stable output voltage range not influenced by input voltage or temperature fluctuation.V INError amplifierR BR ACurrent source-+V OUTGND*Reference voltage circuit* Parasitic diodeFigure 4 Reference block diagram2Internal circuit2.1Reference voltage circuitIn a voltage regulator, the reference voltage circuit plays a very important role because any change will show up directly at an output.The S-812XXSG Series has 0.8 V typical stable voltage circuit as a highly stable reference voltage source.Features:Low power consumptionGood temperature characteristic2.2Error amplifierThe error amplifier consumes very low current because it is a differential amplifier in a stable current circuit.Features:Good matching characteristics Wide operating voltage range Low offset voltage2.3Control transistorThe S-812XXSG Series has a Pch MOS transistor as a current control transistor shown in Figure 6. Therefore an output current I OUT is expressed by the following formula where is only a small difference between input and output voltages:I OUT =KP{2(V GS -V TP ) (V IN -V OUT )-(V IN -V OUT )2}*KP :Conductive coefficiencyV TP :Threshold voltage of a control transistor Setting KP to the large value results in a voltage regulator with 160 mV typical I/O voltage difference.V IN -V IN +GNDV INV OUTFigure 5 Error amplifierBiasV INV OUTGNDV GSV REF -+** Parasitic diodeFigure 6 Control transistorNOTE :A parasitic diode is generated between V IN and V OUT .If the electric potential of V IN is higher than that of V OUT , IC may break because of a reverse current.Keep V OUT less than V IN +0.3 V.3Temperature characteristic of output voltageThe temperature characteristic of the output voltage is expressed by the following formula in the range of -40 C to 85 C.*V REF is 0.7 V min., 0.8 V typ., 0.9 V max.Transient Response1.Line transient responseThe overshoot and undershoot are caused in the output voltage if the input voltage fluctuates while the output current is constant. Figure 7 shows the output voltage fluctuation due to input voltage change between 6.0 V and 10 V in square wave. Table 19 shows the parameter dependency when input voltage fluctuates. For reference,Figure 8 describes the measurement circuit.Table 29 Parameter dependency due to input voltage fluctuationParameterMethod to decreaseovershootMethod to decreaseundershootOutput currentI OUTDecrease Decrease Load capacitance C L Increase Increase Input voltage fluctuation V IN *DecreaseDecrease TemperatureTaHigh temperature*V IN : High voltage value - low voltage valueFor reference, the next page describes the results of measuring the ringing amounts at the V OUT pin using theoutput current (I OUT ), load capacitance (C L ), input voltage fluctuation width ( V IN ), and temperature as parameters.V REFV OUT x (±0.1) mV/ C typ.Figure 7 Output voltage fluctuation due to input voltage fluctuationInput voltage6.010 VUndershootOvershootOutput voltageFigure 8 Measuring circuitFast amplifierP.G.S-812XXSGOscilloscopeC LV OUTV SSV IN+-- 2.Load transient responseThe overshoot and undershoot are caused in the output voltage if the output current fluctuates while the inputvoltage is costant. Figure 9 shows the output voltage fluctuation due to output current change between 10mA and 1 A in square wave. Table 20 shows the parameter dependency when output current fluctuates. For reference,Figure 10 describes the measuring circuit.Line transient response of S-81250SGReference data1.I OUT dependencyC L =10 F Ta=25 C1.21.00.80.60.40.20.0051015202530Ringing amount(V)I OUT (mA)2.C L dependencyUndershoot OvershootI OUT =10mA Ta=25 C1.21.00.80.60.40.20.00Ringing amount(V)1020304050C L ( F)4.Temperature dependencyUndershoot OvershootI OUT =10mA C L =10 F1.21.00.80.60.40.20.0Ringing amount(V)80400-40Ta ( C)3. V IN dependencyV IN shows the difference between the low voltage fixed to 6 V and the high voltage.For example, V IN = 2 V means the difference between 6 V and 8 V. 1.21.00.80.60.40.20.0Ringing amount(V)1245V IN (V)3C L =10 F Ta=25 CI OUT =10mAFigure 9 Output voltage fluctuation due to output current fluctuationOutput current10mA1 AOutput voltageOvershootUndershootFigure 10 Measuring circuitS-812XXSGOscilloscopeC LV OUT V SSV IN。

戴尔 Precision 3430 小型外形机箱显卡安装指南说明书

Dell Precision 3430 Small Form Factor VGA card Installation GuideNotes, cautions, and warningsNOTE: A NOTE indicates important information that helps you make better use of your product.CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem.WARNING: A WARNING indicates a potential for property damage, personal injury, or death.© 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.2018 - 07Rev. A001 Before you begin (4)Safety instructions (4)Before working inside your computer (4)Safety precautions (5)Standby power (5)Bonding (5)Electrostatic discharge—ESD protection (5)ESD field service kit (6)Components of an ESD field service kit (6)ESD protection summary (7)Transporting sensitive components (7)Lifting equipment (7)After working inside your computer (7)2 VGA card (8)Installing the VGA card (8)3 Getting help (22)Contacting Dell (22)Contents3Before you beginTopics:•Safety instructions•Before working inside your computer•Safety precautions•Electrostatic discharge—ESD protection•ESD field service kit•Transporting sensitive components•After working inside your computerSafety instructionsUse the following safety guidelines to protect your computer from potential damage and to ensure your personal safety. Unless otherwise noted, each procedure included in this document assumes that the following conditions exist:•You have read the safety information that shipped with your computer.•A component can be replaced or, if purchased separately, installed by performing the removal procedure in reverse order. WARNING: Disconnect all power sources before opening the computer cover or panels. After you finish working inside thecomputer, replace all covers, panels, and screws before connecting to the power source.WARNING: Before working inside your computer, read the safety information that shipped with your computer. For additional safety best practices information, see the Regulatory Compliance Homepage at /regulatory_complianceCAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or telephone service and support team.Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow the safety instructions that came with the product.CAUTION: T o avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching an unpainted metal surface at the same time as touching a connector on the back of the computer.CAUTION: Handle components and cards with care. Do not touch the components or contacts on a card. Hold a card by its edges or by its metal mounting bracket. Hold a component such as a processor by its edges, not by its pins.CAUTION: When you disconnect a cable, pull on its connector or on its pull-tab, not on the cable itself. Some cables have connectors with locking tabs; if you are disconnecting this type of cable, press in on the locking tabs before you disconnect the cable. As you pull connectors apart, keep them evenly aligned to avoid bending any connector pins. Also, before you connect acable, ensure that both connectors are correctly oriented and aligned.NOTE: The color of your computer and certain components may appear differently than shown in this document. Before working inside your computerT o avoid damaging your computer, perform the following steps before you begin working inside the computer.1 Ensure that you follow the Safety Instruction.2 Ensure that your work surface is flat and clean to prevent the computer cover from being scratched.3 Turn off your computer.4 Disconnect all network cables from the computer.1 4Before you beginCAUTION: To disconnect a network cable, first unplug the cable from your computer and then unplug the cable from the network device.5 Disconnect your computer and all attached devices from their electrical outlets.6 Press and hold the power button while the computer is unplugged to ground the system board.NOTE: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching anunpainted metal surface at the same time as touching a connector on the back of the computer.Safety precautionsThe safety precautions chapter details the primary steps to be taken before performing any disassembly instructions.Observe the following safety precautions before you perform any installation or break/fix procedures involving disassembly or reassembly:•Turn off the system and all attached peripherals.•Disconnect the system and all attached peripherals from AC power.•Disconnect all network cables, telephone, and telecommunications lines from the system.•Use an ESD field service kit when working inside any desktop to avoid electrostatic discharge (ESD) damage.•After removing any system component, carefully place the removed component on an anti-static mat.•Wear shoes with non-conductive rubber soles to reduce the chance of getting electrocuted.Standby powerDell products with standby power must be unplugged before you open the case. Systems that incorporate standby power are essentially powered while turned off. The internal power enables the system to be remotely turned on (wake on LAN) and suspended into a sleep mode and has other advanced power management features.Unplugging, pressing and holding the power button for 15 seconds should discharge residual power in the system board, desktops. BondingBonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through the use of a field service electrostatic discharge (ESD) kit. When connecting a bonding wire, ensure that it is connected to bare metal and never to a painted or non-metal surface. The wrist strap should be secure and in full contact with your skin, and ensure that you remove all jewelry such as watches, bracelets, or rings prior to bonding yourself and the equipment.Electrostatic discharge—ESD protectionESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards, processors, memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such as intermittent problems or a shortened product life span. As the industry pushes for lower power requirements and increased density, ESD protection is an increasing concern.Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than in previous Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.Two recognized types of ESD damage are catastrophic and intermittent failures.•Catastrophic – Catastrophic failures represent approximately 20 percent of ESD-related failures. The damage causes an immediate and complete loss of device functionality. An example of catastrophic failure is a memory DIMM that has received a static shock and immediately generates a "No POST/No Video" symptom with a beep code emitted for missing or nonfunctional memory.•Intermittent – Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of intermittent failures means that most of the time when damage occurs, it is not immediately recognizable. The DIMM receives a static shock, but the tracing is merely weakened and does not immediately produce outward symptoms related to the damage. The weakened trace may take weeks or months to melt, and in the meantime may cause degradation of memory integrity, intermittent memory errors, etc.Before you begin5The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or "walking wounded") failure. Perform the following steps to prevent ESD damage:•Use a wired ESD wrist strap that is properly grounded. The use of wireless anti-static straps is no longer allowed; they do not provide adequate protection. T ouching the chassis before handling parts does not ensure adequate ESD protection on parts with increased sensitivity to ESD damage.•Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.•When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing material until you are ready to install the component. Before unwrapping the anti-static packaging, ensure that you discharge static electricity from your body.•Before transporting a static-sensitive component, place it in an anti-static container or packaging.ESD field service kitThe unmonitored Field Service kit is the most commonly used service kit. Each Field Service kit includes three main components: anti-static mat, wrist strap, and bonding wire.Components of an ESD field service kitThe components of an ESD field service kit are:•Anti-Static Mat – The anti-static mat is dissipative and parts can be placed on it during service procedures. When using an anti-static mat, your wrist strap should be snug and the bonding wire should be connected to the mat and to any bare metal on the system being worked on. Once deployed properly, service parts can be removed from the ESD bag and placed directly on the mat. ESD-sensitive items are safe in your hand, on the ESD mat, in the system, or inside a bag.•Wrist Strap and Bonding Wire – The wrist strap and bonding wire can be either directly connected between your wrist and bare metal on the hardware if the ESD mat is not required, or connected to the anti-static mat to protect hardware that is temporarily placed on the mat. The physical connection of the wrist strap and bonding wire between your skin, the ESD mat, and the hardware is known as bonding. Use only Field Service kits with a wrist strap, mat, and bonding wire. Never use wireless wrist straps. Always be aware that the internal wires of a wrist strap are prone to damage from normal wear and tear, and must be checked regularly with a wrist strap tester in order to avoid accidental ESD hardware damage. It is recommended to test the wrist strap and bonding wire at least once per week.•ESD Wrist Strap Tester – The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is a best practice to regularly test the strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the best method for doing this test. If you do not have your own wrist strap tester, check with your regional office to find out if they have one.T o perform the test, plug the wrist-strap's bonding-wire into the tester while it is strapped to your wrist and push the button to test. A green LED is lit if the test is successful; a red LED is lit and an alarm sounds if the test fails.•Insulator Elements – It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are insulators and often highly charged.•Working Environment – Before deploying the ESD Field Service kit, assess the situation at the customer location. For example, deploying the kit for a server environment is different than for a desktop or portable environment. Servers are typically installed in a rack within a data center; desktops or portables are typically placed on office desks or cubicles. Always look for a large open flat work area that is free of clutter and large enough to deploy the ESD kit with additional space to accommodate the type of system that is being repaired. The workspace should also be free of insulators that can cause an ESD event. On the work area, insulators such as Styrofoam and other plastics should always be moved at least 12 inches or 30 centimeters away from sensitive parts before physically handling any hardware components•ESD Packaging – All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are preferred. However, you should always return the damaged part using the same ESD bag and packaging that the new part arrived in.The ESD bag should be folded over and taped shut and all the same foam packing material should be used in the original box that the new part arrived in. ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts should never be placed on top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the ESD mat, in the system, or inside an anti-static bag.•Transporting Sensitive Components – When transporting ESD sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in anti-static bags for safe transport.6Before you beginESD protection summaryIt is recommended that all field service technicians use the traditional wired ESD grounding wrist strap and protective anti-static mat at all times when servicing Dell products. In addition, it is critical that technicians keep sensitive parts separate from all insulator parts while performing service and that they use anti-static bags for transporting sensitive components.Transporting sensitive componentsWhen transporting ESD sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in anti-static bags for safe transport.Lifting equipmentAdhere to the following guidelines when lifting heavy weight equipment:CAUTION: Do not lift greater than 50 pounds. Always obtain additional resources or use a mechanical lifting device.1Get a firm balanced footing. Keep your feet apart for a stable base, and point your toes out.2Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.3Lift with your legs, not your back.4Keep the load close. The closer it is to your spine, the less force it exerts on your back.5Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load. Avoid twisting your body and back.6Follow the same techniques in reverse to set the load down.After working inside your computerAfter you complete any replacement procedure, ensure that you connect any external devices, cards, and cables before turning on your computer.1 Connect any telephone or network cables to your computer.CAUTION: To connect a network cable, first plug the cable into the network device and then plug it into thecomputer.2 Connect your computer and all attached devices to their electrical outlets.3 Turn on your computer.4 If required, verify that the computer works correctly by running ePSA diagnostics.Before you begin7VGA cardInstalling the VGA card1Follow the procedure in Before working inside your computer .2 Remove the side cover:aSlide the release latch on the back panel of your system until it gives a click sound to unlock the side cover [1].bSlide and lift the side cover from the system [2].3 Remove the front bezel:aPry the retention tabs to release the front bezel from the system [1] and pull to release the hooks on the front bezel from the front-panel slots [2].b Remove the front bezel from the system [3].28VGA card4 Release the hard drive and optical drive module:a Disconnect the hard drive data cable and power cable from the connectors on the hard drive [1, 2].b Slide the release tab to unlock the hard drive and optical module [3].c Unroute the hard drive cables [1] and optical drive cables [2] through the retention clip and HDD-ODD release tab respectively.VGA card9d Lift the hard drive and optical module [3]5 Remove the hard drive and optical drive module:a Disconnect the optical drive data cable and optical drive power cable from the connectors on the optical drive [1, 2].b Slide and lift the hard drive and optical drive module from the system [3].10VGA card6 Remove the heat sink with fan:a Disconnect the heat sink fan cable from the system board [1].b Loosen the 4 captive screws that secure the heat sink [2] and lift it away from the system [3].NOTE: Loosen the screws in a sequential order (1,2,3,4) as mentioned on the system board.a Remove the filler using a philips screwdriver .c Align and place the VGA card into the slot on the system chassis [2].d Fasten the two screws to secure the VGA card to the system chassis [1].8 To install the heat sink:a Align the heat sink onto the processor [1].b Tighten the four captive screws to secure the heat sink assembly to the system board [2].c9 To install the hard drive and optical drive module:a Insert the tabs on the hard drive and optical drive module into the slot on the system at a 30-degree angle [1].b Connect the optical drive data cable and power cable to the connectors on the optical drive [2, 3].c Lower the hard drive and optical drive module so that it is placed in its slot [4].e Route the hard drive data and power cables through the HDD-ODD release tab [2].g Connect the hard drive data cable and power cable from the connectors on the hard drive [2, 3].10 To install the front bezel:a Align the bezel, and insert the retention tabs on the bezel into the slots on the system.b Press the bezel until the tabs clicks into place.11 To install the side cover:a Place the cover on the system and slide the cover until it clicks into place.b The release latch automatically locks the side cover to the system.VGA card21Getting helpContacting DellNOTE: If you do not have an active Internet connection, you can find contact information on your purchase invoice, packing slip, bill, or Dell product catalog.Dell provides several online and telephone-based support and service options. Availability varies by country and product, and some services may not be available in your area. T o contact Dell for sales, technical support, or customer service issues:1Go to /support.2Select your support category.3Verify your country or region in the Choose a Country/Region drop-down list at the bottom of the page.4 Select the appropriate service or support link based on your need.322Getting help。

BA3830S资料

BA3830S
(2) Bias circuit A bias voltage of VCC / 2 is applied to each of the circuits. Since the output stage uses a push-pull configuration, a stable bias source can be obtained.
元器件交易网 Audio ICs
Band-pass filter for spectral analyzers
BA3830S
The BA3830S is a 6)1 band band-pass filter for spectral analyzer displays with internal recording indicator output. All of the capacitors comprising the filter are internal capacitors, making it possible to significantly reduce the number of attached components. This enables configuration of compact sets with a high level of reliability. FApplications CD radio cassette players, mini-components, car stereos
(3) Precautions concerning the coupling capacitor When determining the polarity of the input electrolytic coupling capacitor, the potential relation with the other end of the coupling must be taken into consideration.

基于标识的动态口令系统

基于标识的动态口令系统刘莹;龙毅宏【摘要】As a user authentication technology, the one-time password technology is more secure than the traditional static password technology. To address the problems of one-time password system, such as the difficulty to manage one-time password seed secret of a user, high security requirements on the database of user seed secrets, and the restric-tion on the accounts in integrating with an application system, the lack of the function of updating seed secret auto-matically etc, this paper proposes an one-time password authentication scheme based on user identity, and implements the system based on challenge/response mode and time synchronization mode respectively. The proposed one-time password system updates the seed secrets for users automatically, and has the advantages such as easy management of user secrets and easy integration with application systems etc.%作为用户身份验证技术，动态口令技术比传统的静态口令技术具有更高的安全性。

新型石墨烯量子点及其在有机太阳能电池中的应用

新型石墨烯量子点及其在有机太阳能电池中的应用张淑瑶; 张哲泠; 黄有欢; 胡勇; 张坚【期刊名称】《《桂林电子科技大学学报》》【年(卷),期】2019(039)004【总页数】8页(P337-344)【关键词】石墨烯量子点; 支化的聚乙烯亚胺; 功函数; 有机太阳能电池; 阴极界面层【作者】张淑瑶; 张哲泠; 黄有欢; 胡勇; 张坚【作者单位】桂林电子科技大学材料科学与工程学院广西桂林 541004; 桂林电子科技大学广西信息材料重点实验室广西桂林 541004【正文语种】中文【中图分类】TM914.4太阳能在未来的能源市场上显示出巨大的潜力，因为它本质上是能够无限供应的、可再生的清洁能源。

近20年来，有机太阳能电池获得了研究者的广泛关注。

有机太阳能电池有诸多潜在的优点，如制作工艺简单，质量轻和可卷对卷制备大面积的柔性器件等[1]。

但是目前有机太阳能电池的能量转换效率较低是制约其应用的重要因素之一[2]。

有机太阳能电池的能量转换效率与器件结构、光伏材料，活性层形貌以及活性层与电极之间的界面接触等有很大的关系[3]。

合适的界面层可以与活性层形成欧姆接触，实现高效的光生电荷提取，阻止电荷在界面处复合。

界面材料主要分为阴极界面材料和阳极界面材料，此类材料功函数通常要与相应的电极的功函数匹配[4]，从而有助于提升界面处的载流子传输能力。

近年来阴极界面材料得到了快速发展，该类材料通常需要具备较低的功函数，典型的阴极界面材料有金属Ca[5]、Ba[6]，无机盐LiF[7]、CsCO3[8]，无机半导体氧化金属TiO2[9]、ZnO[10]，以及有机小分子或聚合物等[11]。

近年来，碳材料作为一种新型材料在有机太阳能电池的阴/阳极界面得到了广泛的运用[12]。

GQDs是一种尺寸小于10 nm的碳材料，不仅具备了石墨烯的优异特点，还可以被修饰改性为合适的界面材料。

例如，用羧酸盐在GQDs边缘进行修饰，可以得到合适的具有高功函的材料(ECGQDs)[13]；用四甲基铵或Cs离子修饰GQDs，可以降低其功函作为阴极界面材料[14]。

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Equivalent circuit schematic
274
Audio ICs
FMute detection circuit (1) Mute detection based on noise and music signals The signals of each block in the mute detection circuit are shown in the diagram below.
The electrolytic capacitor between the input pin and ground is for preventing switch noise. Although it is possible to prevent switch noise in the audio output without this capacitor by using the mute circuit, switch noise in the mute detection circuit will not be prevented and noise will be recognized as a song. Truth table
Audio ICs
Stereo pre-amplifiers with mute detection circuits for car stereos
BA3430S / BA3430F / BA3430FS
The BA3430S, BA3430F, and BA3430FS are stereo pre-amplifiers with mute detection circuits which have been designed for use in car stereos. The analog circuitry including the pre-amplifier and mute detection and the digital circuitry such as control logic circuits have been combined together on a single chip. This has made it possible to reduce the interface with the microcontroller to five parallel inputs and outputs, and enables a very compact circuit configuration around the tape head. The BA3430S, BA3430F, or BA3430FS makes it possible to easily incorporate an ultra-compact, high-precision pre-amplifier board into the mechanical components of a car stereo. FAbsolute maximum ratings (Ta = 25_C)
BA3430S / BA3430F / BA3430FS
(2) Sensitivity switch amplifier circuit The noise level and signal frequency of the tape differ during playback and fast forward. Therefore, this signal amplifier includes a circuit for switching the detection frequency and gain for playback and fast forward. (1) Sensitivity switch circuit This circuit switches the detection frequency and gain for playback and fast forward. A 10kΩ or less resistor must be connected to the input pin to limit the input current. The electrolytic capacitor between the input pin and ground is for preventing incorrect detection. Without this capacitor, sensitivity switch noise may cause incorrect detection of songs.
FRecommended operating conditions (Ta = 25_C)
269
Audio ICs
FBlock diagram
BA3430S / BA3430F / BA3430FS
270
Audio ICs
FPin descriptions
BA3430S / BA3430F / BA3430FS
271
Audio ICs
BA3430S / BA3430F / BA3430FS
FElectrical characteristics (unless otherwise noted, Ta = 25_C and VCC = 9V, f = 1kHz, Rg = 680Ω, VO = *10dBV)
BA3430S / BA3430F / BA3430FS

to the input pin to limit the input current. The capacitor between the input pin and ground is for preventing switch noise. It can be omitted without causing incorrect song detection. Input switch truth table
(3) Mute circuit This circuit mutes the output of the equalizer amplifier. A 22kΩ or less resistor must be connected to the input pin to limit the input current. The electrolytic capacitor between the input pin and ground is for preventing switch noise. It can be omitted without causing incorrect song detection, however, it is best to use it to ensure proper operation of the mute circuit. Input switch truth table
The low cutoff frequency fL of the amplifier is fL = 1 2 π C (R1 ) R2) (Hz)
(4) Comparator circuit This circuit detects the presence or not of the signal and outputs a detection signal. The circuit consists of two comparators. The first comparator detects the level of the signal and the second comparator detects the duration of the signal. When a signal above VCC / 30 (VO-P) is input, the first comparator turns on and draws a constant current I from the time constant pin. This causes the voltage of the time constant pin to fall, and when it drops below VCC - 2.7(V) the next comparator turns on, changing the mute detection output pin to low. If the signal level drops below VCC / 30 (VO-P), the first comparator turns off and the voltage of the time constant pin rises due to the external discharge resistor. When this voltage rises above VCC - 2.0(V), the next comparator turns off, changing the mute detection output pin to high. The time ι1 from the arrival of the signal to the changeover of the mute detection output pin to low is given as follows: 5.4 C τ1= (S) I
272
Audio ICs
FMeasurement circuit
BA3430S / BA3430F / BA3430FS
FAudio signal amplification circuit (1) Input switch circuit This circuit switches between head A and head B as needed for the auto reverse function. A 10kΩ or less resistor must be connected to the input pin to limit the input current. Equivalent circuit schematic