M3062PT-80FPB中文资料
惠普 LaserJet 3050 3052 3055 3390 3392 多功能一体机 说明书
HP LaserJet 3050/3052/3055/3390/3392 all-in-one (HP LaserJet 3050/3052/3055/3390/ 3392 多功能一体机)用户指南版权与许可© 2006 版权所有 Hewlett-Packard Development Company, LP未经事先书面许可，严禁进行任何形式的复制、改编或翻译，除非版权法另有规定。
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HP 公司对此处任何技术性或编辑性的错误或遗漏概不负责。
产品号 Q6500-90939Edition 1, 4/2006商标声明Adobe Photoshop® 和 PostScript® 是Adobe Systems Incorporated 的商标。
Corel® 是 Corel Corporation 或 Corel Corporation Limited 的商标或注册商标。
Linux 是 Linus Torvalds 在美国的注册商标。
Microsoft®、Windows®、Windows NT® 和Windows® XP 是 Microsoft Corporation 在美国的注册商标。
UNIX® 是 Open Group 的注册商标。
ENERGY STAR® 和 ENERGY STAR 徽标®是美国环保署在美国的注册标记。
目录1 多功能一体机基本信息多功能一体机配置 (2)HP LaserJet 3050 all-in-one (HP LaserJet 3050 多功能一体机) (2)HP LaserJet 3052/3055 all-in-one (HP LaserJet 3052/3055 多功能一体机) (3)HP LaserJet 3390/3392 all-in-one (HP LaserJet 3390/3392 多功能一体机) (4)多功能一体机功能 (5)多功能一体机部件 (7)HP LaserJet 3050 all-in-one (HP LaserJet 3050 多功能一体机) 部件 (7)正视图 (7)后视图 (7)接口 (8)控制面板 (8)HP LaserJet 3052/3055 all-in-one (HP LaserJet 3052/3055 多功能一体机) 部件 (9)正视图 (9)后视图 (9)接口 (10)控制面板 (10)HP LaserJet 3390/3392 all-in-one (HP LaserJet 3390/3392 多功能一体机) 部件 (11)正视图 (11)后视图 (11)接口 (12)控制面板 (12)2 软件软件安装 (14)典型安装 (14)最小安装 (14)打印机驱动程序 (15)支持的打印机驱动程序 (15)附加驱动程序 (15)选择正确的打印机驱动程序 (15)打印机驱动程序帮助 (Windows) (16)访问打印机驱动程序 (17)其它还有哪些软件可用？ (17)Windows 软件 (18)用于 Windows 的软件组件 (18)HP ToolboxFX (18)嵌入式 Web 服务器 (EWS) (18)使用“添加或删除程序”卸载 (18)ZHCN iiiMacintosh 软件 (19)HP Director (HP 控制器) (19)Macintosh Configure Device (Macintosh 配置设备)（Mac OS X V10.3 与Mac OS X V10.4） (19)PDE（Mac OS X V10.3 与 Mac OS X V10.4） (20)安装 Macintosh 软件 (20)安装适用于直接连接 (USB) 的 Macintosh 打印系统软件 (20)安装用于网络的 Macintosh 打印系统软件 (20)从 Macintosh 操作系统中删除软件 (21)3 介质规格一般准则 (24)选择纸张和其它介质 (24)HP 介质 (24)避免使用的介质 (25)可能损坏多功能一体机的介质 (25)介质使用准则 (26)纸张 (26)标签 (26)标签结构 (27)投影胶片 (27)信封 (28)信封结构 (28)双面接缝信封 (28)带不干胶封条或封舌的信封 (29)信封存放 (29)卡片纸和重磅介质 (29)卡片纸结构 (29)卡片纸准则 (29)信头纸和预打印表单 (30)支持的介质重量和尺寸 (31)打印和存放环境 (34)4 使用多功能一体机将介质装入进纸盘 (36)装入要传真、复印或扫描的文档 (36)将纸张装入进纸盘，HP LaserJet 3050/3052/3055 all-in-one (HP LaserJet 3050/3052/3055 多功能一体机) (37)优先进纸槽 (37)250 张进纸盘（纸盘 1） (38)将纸张装入进纸盘，HP LaserJet 3390/3392 all-in-one (HP LaserJet 3390/3392 多功能一体机) (39)单张优先进纸槽（纸盘 1） (39)250 张进纸盘（纸盘 2 或可选纸盘 3） (39)控制打印作业 (40)打印设置优先级 (40)选择来源 (40)选择类型或尺寸 (40)使用多功能一体机控制面板 (41)iv ZHCN更改多功能一体机控制面板显示语言 (41)更改默认介质尺寸和类型 (41)更改默认介质尺寸 (41)更改默认介质类型 (42)更改默认纸盘配置 (42)使用多功能一体机音量控制键 (42)更改警报音量 (43)更改传真音量 (43)更改传真响铃音量 (44)更改多功能一体机控制面板按键音量。
HP激光打印机系列对照表
硒鼓型号
打印机型号
硒鼓型号
打印机型号
硒鼓型号
HP LaserJet 4
HP LaserJet 4L
HP LaserJet 4P
HP LaserJet 4+
HP LaserJet 4SI
HP LaserJet 4V
HP LaserJet 5
HP LaserJet 5L
HP LaserJet 5P
HP LaserJet 4250N
HP LaserJet 4300
C4127X
C8061A
C8061X
Q1338A
C5942A
C5942X
Q1339A
HP LaserJet 1150
HP LaserJet 1200
HP LaserJet 1220
Q2624A
C7115A
C7115X
HP LaserJet 6L
C9720A黑色硒鼓（K）
HP Color LaserJet 1500L HP Color LaserJet 2500
C9701A青色硒鼓（C）
C9703A品红色硒鼓（M）
C9702A黄色碳硒鼓（Y）
C9700A黑色硒鼓（K）
C9704A成像鼓
HP Color LaserJet 5500
HP Color LaserJet 5500DN
C8543X
HP LaserJet 2100
HP LaserJet 2200D
C4096A
HP LaserJet 1100
HP LaserJet 1100A
C4092A
HP LaserJet 9055
HP LaserJet 9065
DR3062规格书
©2011 Senchip Corporation
4 / 10
SENCHIP MICROELECTRONICS CO., LTD.
DR3062 LED 驱动工作原理
DR3062
DR3062是以低电流（20-40mA）的方式分段驱动高电压发光二极管串列。DR3062的输入为 全波整流未稳压电源，当输入电源电压波形上升/下降时，DR3062会按时序关闭/开启相关的 驱动输出端，而判断某个驱动端的关闭/开启的基准在于后一个驱动端的负载电流，当后一个 驱动端的负载电流超过某个预定电流值时（如10mA），DR3062就会关闭前一个驱动端。应用 电路中的DR3062 功能方框图所示，驱动高压发光LED 灯泡的IC 由下列功能组成。
高压白光LED
高压LED是由数个低压LED串联而成，如下图所示。
DR3062
阳极
阴极
高压 LED 外部示意图
低压LED
高压LED内部结构
高压LED I-V 特性曲线如下图所示（共13颗低压LED串联，低压LED以If = 20mA，Vf = 3.4V， Cut-in = 3.1V为例）。其中Vf 为正向电压，If 为正向电流。
---
4.0
Walt
平均承受功率
--- 0.4 Walt
参考电压输入（VREF）
直流电压输入
-0.3 20
Volt
封装热阻（RΘja）
SOP8-EP
35
--- ℃/W
雷击耐受度（Surge）
测试相位90度
500 --- Volt
静电耐受度（ESD）
人体模式（human body mode） 机械模式（machine mode）
Sn ToLogic Cntrl CKT
M25P80的介绍
1引言FPGA凭借其方便灵活、可重复编程等优点而日益被广泛应用；闪速存储器(Flash Memo ry)以其集成度高、成本低、使用方便等优点，在众多领域中也获得了广泛应用。
在现代数字电路设计中。
经常需要保存大量数据，而Flash存储速度快、体积小、功耗低且价格低廉，可在线电擦写，信息在掉电后不会丢失，因此成为设计人员的首选。
2 M25P80的介绍Flash是一种具有电可擦除的可编程ROM，可以分为两大类：并行Flash和串行Flash。
并行Flash存储量大，速度快；而串行Flash存储量相对较小，但体积小，连线简单，可减小电路面积，节约成本，二者各有其优缺点，可依据实际需要选取。
本文开发的系统对速度的要求不是很高，而对电路板的面积要求则较为苛刻，因此系统设计选用了串行FlashM25P80。
M25P80是意法半导体推出的一款高速8 Mbit串行Flash，共由16部分组成，每一部分有256页，每页有256个字节。
M25P80具有先进的写保护机制，读取数据的最大时钟速率为40 MHz。
M25P80的工作电压范围为2.7 V～3.6 V，具有整体擦除和扇区擦除、灵活的页编程指令和写保护功能，数据保存至少20年，每个扇区可承受100 000次擦写循环。
并行Flash封装通常需要28个以上的引脚，因此，额外支出大，而M25P80采用SO8封装，需要的引脚数较少，从而节省了电路板空间，功率、系统噪声和整体成本等都会大幅度降低，既经济又实用。
图1为M25P80的引脚排列，其中Vcc和Vss分别为电源和地，其他6个引脚均可直接与FPGA的I／O引脚相连；写保护引脚W和HOLD挂起引脚，用于数据保护和空闲模式的低功耗运行，若不用可将其置为高电平；S为片选信号，为低电平时表示器件被选中，否则工作在待机状态；Q为串行数据输出，数据在时钟的下降沿输出Flash器件；D为串行数据输入，包括传输指令、地址和输人数据，输入信号在时钟的上升沿锁存Flash器件中。
传真机耗材型号对照
国 三星 SF-5800 SF-5800P
佳能 L770
SF-5805P
SF-5905P
硒鼓
5000 页
硒鼓
硒鼓
硒鼓
2500 页
硒鼓
2500 页
硒鼓
中 佳能 FX-2 佳能 L500
佳能 FX-3 佳能 L250
L600 L380
L350
L200
L240
L280
硒鼓 硒鼓
佳能 FX-4 佳能 L900 L880
硒鼓
理光 1465 理光 FAX SL310
硒鼓
理光 EM-1 理光 FAX EL800
硒鼓
中国 OA 技术论坛 树叶收集整理发布
中国 OA 技术论坛 树叶收集整理发布
UG-3221 松下 UG-3220 松下 UG-3313 松下 KX-PEP5 三星 SF5100D3 三星 SF5800D5 佳能 FX-1
松下 UF490 590
术
松下 UF-A8710 8880 8770 1100
技 松下 KX-6500 6100 6300 A 三星 SF5100、SF5100P、Msys-5100P、SF-530 SF535e SF-531P、SF-515 O SF550 SF808
兄弟 1270T 1970T 1270 1970 770 870
技 兄弟 FAX-1010 1020 1030 FAX-1170 1270 1570MC MFC-1770
1870MC 1970MC
A 兄弟 1150 1150P 1200P 1250 1700P 1350 1550MC 1650 1750 O 1850MC 1500M 1950
国
惠普（HP）打印机技术规格与支持的纸种说明书
Pregledajte tehničke specifikacije i podržane vrste papira za štampač.●Tehničke specifikacije●Podržani tipovi papiraTehničke specifikacijePregledajte tehničke specifikacije za štampač.Za najnovije informacije posetite /support/ljM329MFP, /support/ljM428MFP, ili /support/ljM429MFP.Tabela 1 Tehničke specifikacije po modelu štampačaIme modela Broj proizvoda Ime modela Broj proizvoda Ime modela Broj proizvoda M428fdwW1A30AM429fdwW1A35AM428dwW1A28AM428dwW1A31AM429dwW1A33AM428fdnW1A29AM428fdnW1A32AM429fdnW1A34AM329dnW1A23AM329dwW1A24ARad sa papirom Ležište 1 (kapacitet 100 listova)Priloženo Priloženo Priloženo Priloženo Priloženo Rad sa papirom Ležište 2 (kapacitet 250 listova)Priloženo Priloženo Priloženo Priloženo Priloženo Rad sa papirom Opciono pomoćno ležište za 550listova Opcionalno Opcionalno Opcionalno Opcionalno Opcionalno Rad sa papirom Automatsko dupleks štampanje Priloženo Priloženo Priloženo Priloženo Priloženo Povezanost10/100/1000 Ethernet LAN vezasa IPv4 i IPv6 protokolima Priloženo Priloženo Priloženo Priloženo Priloženo Povezanost Hi-Speed USB 2.0Priloženo Priloženo Priloženo Priloženo Priloženo Povezanost Port za USB usputno štampanje Priloženo Priloženo Priloženo Priloženo Priloženo Povezanost Server za štampanje zapovezivanje na bežičnu mrežu Priloženo Priloženo Nije dostupno Nije dostupno Priloženo Povezanost Bluetooth Low Energy (BLE)Priloženo Priloženo Nije dostupno Nije dostupno Priloženo Povezanost Wi-Fi Direct za štampanje samobilnih uređaja Priloženo Priloženo Nije dostupno Nije dostupno PriloženoEkran i ulazni interfejs kontrolne table Kontrolna tabla sa ekranom u bojiosetljivim na dodir Priloženo Priloženo Priloženo Priloženo PriloženoSRWW1Tabela 1 Tehničke specifikacije po modelu štampača (nastavljeno)Ime modela Broj proizvoda Ime modela Broj proizvoda Ime modela Broj proizvoda M428fdw W1A30A M429fdw W1A35AM428dw W1A28A M428dw W1A31A M429dw W1A33A M428fdn W1A29A M428fdn W1A32A M429fdn W1A34A M329dn W1A23AM329dw W1A24AŠtampanjeŠtampa 38 stranica u minutu (ppm) na papiru veličine A4 i 40 stranica na papiru Letter formata Priloženo PriloženoPriloženoNije dostupnoNije dostupnoŠtampanjeŠtampa 35 stranica u minutu (ppm) na papiru veličine A4 i 37stranica na papiru Letter formata Nije dostupno Nije dostupno Nije dostupno Priloženo PriloženoŠtampanje Skladištenje zadataka i privatno štampanje Priloženo Priloženo Priloženo Priloženo Priloženo FaksFunkcije faksaPriloženo Nije dostupno Priloženo Nije dostupno Nije dostupno Kopiranje i skeniranje Kopira i skenira do 32 stranica u minutu (ppm)PriloženoPriloženoPriloženoPriloženoPriloženoKopiranje i skeniranjeDvoglavi ulagač dokumenata za 50 stranica sa automatskim dvostranim kopiranjem i skeniranjemPriloženo Nije dostupno Priloženo Nije dostupno Nije dostupnoKopiranje i skeniranjeUlagač dokumenata za 50 stranica sa jednostranim kopiranjem i skeniranjem Priloženo Priloženo Priloženo Priloženo PriloženoKopiranje i skeniranjeOpcije Skeniranja u e-poštu, Skeniranja na USB i Skeniranja u mrežnu fascikluPriloženo Priloženo Priloženo Priloženo PriloženoPodržani tipovi papiraUlazna ležišta i jedinica za dvostrano štampanje podržavaju nekoliko vrsta papira. Ležište 1 podržava papir u opsegu težine od 60 do 175 g/m 2. Ležište 2, ležište 3 (opcionalno) i jedinica za dvostrano štampanje podržavaju papir u opsegu težine od 60 do 120 g/m 2.NAPOMENA:Kako biste postigli najbolje rezultate, pre štampanja u upravljačkom programu štampača izaberite ispravan format i vrstu papira.2SRWWTabela 2 Tipovi papira koje podržavaju ulazna ležišta i jedinica za dvostrano štampanjeVrsta papira Tray 1 (Ležište3)Tray 2 (Ležište3)Ležište 3(opcionoležište za 550listova)Jedinica zadvostranoštampanje(modeli saautomatskomjedinicom zadvostranoštampanje)RučnodvostranoštampanjeRavno Podržano Podržano Podržano Podržano PodržanoHP EcoEfficient Podržano Podržano Podržano Podržano PodržanoLak 60-74 g Podržano Podržano Podržano Podržano PodržanoSrednji 85-95 g Podržano Podržano Podržano Podržano PodržanoSrednje težak 96–110 g Podržano Podržano Podržano Podržano PodržanoTežak 111–130 g Podržano Podržano Podržano Nije podržano PodržanoIzuzetno težak 131–175 g Podržano Nije podržano Nije podržano Nije podržano PodržanoOznake Podržano Nije podržano Nije podržano Nije podržano Nije podržanoMemorandum Podržano Podržano Podržano Podržano PodržanoKoverte Podržano Nije podržano Nije podržano Nije podržano Nije podržanoPrethodno štampano Podržano Podržano Podržano Podržano PodržanoPerforirano Podržano Podržano Podržano Podržano PodržanoU boji Podržano Podržano Podržano Podržano PodržanoČvrst papir Podržano Podržano Podržano Podržano PodržanoReciklirano Podržano Podržano Podržano Podržano PodržanoHrapavo Podržano Podržano Podržano Nije podržano Podržano SRWW Podržani tipovi papira34SRWW。
国内外常见pos打印机品牌及其特点介绍
型号特点EPSONTM-300AK 76mm宽卷筒纸/串行口/钱箱接口/自动切纸/中文字库/卷纸器TM-300BK 9针/75mm宽卷筒纸/串行口或并行口/钱箱接口/自动切纸/卷纸器TM-210AM/AMP 9针/75mm宽卷筒纸/串行口或并行口/钱箱接口/自动切纸/中文字库TM-210A/PA 9针/75mm宽卷筒纸/串行口或并行口/钱箱接口/自动切纸/卷纸器TM-210B/PB 9针/75mm宽卷筒纸/串行口或并行口/钱箱接口/自动切纸TM-210D/PD 9针/75mm宽卷筒纸/串行口或并行口/钱箱接口/撕纸器TM-295/P 梳式平推票据/七针打印/单页纸/串行口或并行口TM-375/P 9针/1.5单站/流水帐，确认和平推三种功能/串行口或并行口STARSP-2320 9针/75mm宽卷筒纸/串行口或并行口/中文字库SP-2520 9针/75mm宽卷筒纸/串行口或并行口/撕纸器SP-312FD/FC 9针/57、76、82mm宽卷筒纸/串行口或并行口/撕纸器SP-342FD/FC 9针/57、76、82mm宽卷筒纸/串行口/黑标检测可选SP-322FD/FC 9针/穿孔纸/82-89mm纸宽/串或并/撕纸器SP-298 9针平推票据/80mm宽打印范围/单页纸/串行口/钱箱接口/中文字库TSP-552 热敏式/80mm纸宽/串或并/钱箱接口/自动切纸/条码TUP-492C 热敏式/82mm纸宽/大卷纸KIOSK打印机/串口/自动切纸/条码CITIZENIDP-3540 9针/穿孔纸/82-89mm纸宽/串口或并口/撕纸器IDP-3110 梳式/卷筒纸/58mm纸宽/串或并口/撕纸器/电池供电CBM-1000 热敏式/80mm纸宽/串口或并口/ /自动切纸/条码/前边出纸CBM-810 9针平推票据/80mm宽打印范围/单页纸/串行口/钱箱接口SRP-350 热敏式/80mm纸宽/串口或并口/钱箱接口/自动切纸SEIKDDPU-414 热敏式/112mm纸宽/串口或并口/撕纸器DPU-3445 热敏式/112mm纸宽/串口或并口/撕纸器DPU-5400 热敏式/112mm纸宽/串口或并口/自动切纸中崎AB-58K 热敏式/58mm纸宽/串口或并口/撕纸器AB-80K 热敏式/76-80mm纸宽/串口或并口/撕纸器AB-80KC 热敏式/76-80mm纸宽/串口或并口/自带切刀AB-210K 9针/76-80mm纸宽/并口/钱箱接口/撕纸器AB-210KC 9针/76-80mm纸宽/并口/钱箱接口/自带切刀公达TP-POS58II 热敏式/58mm纸宽/串口或并口UP-PH 行式热敏打印UP-SFII24/40 台式打印机/八针梭式打印国内外常见微打机芯及其特点一览表型号特点M-42V机芯价格低廉,性能出众.紧凑小巧.噪音小,可电池供电M-445机芯小巧轻便,功耗低,清晰的打印效果,价格低廉M-150II机芯小巧轻便,功耗低,清晰的打印效果,价格低廉.M190G机芯紧凑的结构设计，小巧轻便，高可靠性SMP620机芯开放式进纸结构同TM88II，辊纸轴可取出，中文字库SMP610H机芯为世界上最小的热敏机芯,自带切刀SMP280A机芯含中文字库,黑标检测,自动导纸,纸尽检测,自动切纸，性价比极高SMP260(270)机芯LTP2342机芯有中文字库，条码打印，黑标检测，两种上纸方式底部进纸或前部进纸，自动检测上纸情况，开放式结构LTP2242机芯中文字库，条码打印，黑标检测，两种上纸方式：底部进纸或前部进纸，自动检测上纸情况.TUP482机芯自动切纸,中文字库,黑标检测卷纸器,送纸器MP111机芯自动切纸,中文字库,黑标检测卷纸器,送纸器DP620机芯高速,可靠性高,红黑双色打印,图型打印MD-910机芯紧凑的结构设计，小巧轻便，高可靠性,综合性能高于190G.色带寿命是190系列的四倍.节省费用ADP-400机芯设计紧凑,轻巧,价格低廉.字体漂亮ADP-200 24针打印头文章来源于中国商业信息网： 原文地址：/detail/77-7864.html。
T80G热敏打印机-用户手册
T80G热敏打印机操作手册深圳市研科数码有限公司生产商有权修改说明书的内容而不做事先声明！目录第一章概述 (1)1.1主要技术规格 (1)1.2字符说明 (1)1.3切刀 (1)1.4 打印纸 (1)1.5打印区域 (1)1.6内存 (2)1.7打印位置和切纸位置 (2)1.8工作条件 (2)1.9可靠度 (2)1.10环境条件 (3)第二章结构及安装 (1)2.1接口 (1)2.1.1 RS232 串行接口 (1)2.1.1.1规格 (1)2.1.1.2接口引脚信号定义 (1)2.1.2并行接口 (2)2.1.2.1规格 (2)2.1.2.2并行接口引脚信号定义 (2)2.2打印机安装 (3)2.2.1接口连接 (3)2.2.2电源连接 (3)2.3钱箱连接 (3)第三章功能 (1)3.1命令列表 (1)3.2存储器功能开关设置 (1)3.2.1电源开关 (1)3.2.2控制板按键 (2)3.2.2.1走纸键 (2)3.2.3Memory Switch (2)3.2.3.1 Memory Switch 1 (2)3.2.3.2 Memory Switch 2 (2)3.3 指示灯 (3)3．4 自检 (3)3．5 HexDump (3)3．6 错误处理 (4)3．6．1 错误类型 (4)3．7 状态检测 (5)3.8 满缓冲打印 (5)第四章整体描述 (1)4.1外型尺寸和质量 (1)4.2颜色 (1)- 1 -4.3外观 (1)第五章打印控制命令 (1)5.1命令概述 (1)5.2术语解释 (1)5.3命令列表 (1)5.4命令详解 (2)LF (2)DLE EOT n (2)ESC ! n (4)ESC SO (4)ESC DC4 (4)ESC % n (5)ESC p m n1 n2 (5)ESC & y c1 c2 [x1 d1...d(y× x1)]...[xk d1...d(y×xk)]. (5)ESC * m nL nH d1... dk. (7)ESC 2 (8)ESC 3 n (8)ESC @ (8)ESC J n (8)ESC c 5 n (9)GS * x y d1..d( x y 8 ) (9)GS / m (10)①GS V m ②GS V m n (10)GS h n (11)GS H n (11)①GS k m d1 . dk NUL ②GS k m n d1 . dn (11)GS r n (14)GS v 0 m xL xH yL yH d1 ... dk (15)GS w n (16)5.5 汉字控制命令 (16)FS ! n (16)FS & (17)FS (17)附录 A: 各项注意事项 (18)附录 B: 装纸 (18)附录C：从自动切纸器错误恢复正常 (18)附录 D : 打印头清洗 (19)附录 E: CODE128 条形码 (19)- 2 -T80G操作手册第一章概述1.1 主要技术规格打印方式：行式热敏打印密度：8点/mm打印方向：进纸方向打印速度：110mm/s(Max)打印宽度：64mm/72mm (可选)纸处理方式：自动切纸行宽：3.75mm1.2 字符说明支持字符集：12×24点阵字符集；汉字：支持GB18030简体中文（向下兼容GB2312-1980）注：GB18030目前仅支持双字节1、2、3、4、5区。
佳能(CANON)打印机耗材对照表
黑色墨盒
（带头）
BJ30/BJ70/BJC50/BJC55
BCI-10B
黑
BC-10头专用
BCI-11E
彩色墨盒
（带头）
BJC80/BJC85/BJC85PW/BJC50/BJC55
BCI-11B
黑
BC-11E头专用
BCI-11C
彩
BC-12E
彩色照片墨盒
BJC-85/BJC-55
BX-2
/MPC600/MPC400/MPC730/I865/MPC700
BCI-3EPM
浅红
BCI-3EPBK
浅黑色
BCI-6EBK
黑
S800/S900/i9100/i950/830D/i905D/I9950/I990/I865/I560/IP8500
/IP6000D/IP4000/IP5000/MP780
PG50BK
黑色墨盒
CL8BK
黑
MP500/MP530/MP600/MP610/MP810/MP830/IP4000/IP4200
/IP4300/IP4500/IP5300/PRO9000/MX850
CLI-8C/M/Y
黄/品红/青分离色
MP500/MP510/MP530/MP600/810/830/MP520/610/MX700/IP3300
BCI-6EC
兰
S800/S900/i9100/i950/830D/i905D/I9950/I990/I865/I560/IP8500
/IP6000D/IP4000/IP5000/MP780/IP300
BCI-6EM
红色
BCI-6EY
黄色
BCI-6EPC
M30626FHPFP中文资料
Rev.2.10 Nov. 07, 2003 page 1 of 84
元器件交易网
M16C/62 Group (M16C/62P, M16C/62PT)
1. Overview
1.2 Performance Outline
Table 1.1 to table 1.3 list performance outline of M16C/62 group (M16C/62P, M16C/62PT). Table 1.1 Performance outline of M16C/62 group (M16C/62P) (128-pin version)
Item
CPU
Number of basic instructions Shortest instruction execution time
Operation mode Memory space
Peripheral function
Memory capacity Port Multifunction timer
memory space expansion function)
Memory capacity
See table 1.4 to 1.7 Product List
Peripheral Port
Input/Output : 87 pins, Input : 1pin
function
Multifunction timer
Serial I/O
A-D converter D-A converter DMAC CRC calculation circuit Watchdog timer Interrupt
Clock generating circuit
HP页宽打印机一些常用信息
HP页宽打印机⼀些常⽤信息推荐使⽤ColorLok?纸张ColorLok纸张的优势⾊彩更逼真艳丽⿊⾊更醒⽬，锐利速⼲ColorLok? paper Non-ColorLok paper ColorLok? paperNon-ColorLok paper墨⽔存留在ColorLok纸张表⾯，确保打印的⾊彩艳丽，⿊⾊醒⽬，覆盖更均匀，⽂字更锐利。
墨⽔打印到⾮ColoLok纸张上，进到纸张内部，导致墨⽔扩散，覆盖不均匀，⽂字不锐利，⾊彩不艳丽，⿊⾊不⿊。
HP 喷墨产品序列号解读序列号M Y78110G J0位置12345678910含义国家年⽉⽇⼯⼚内部信息第1，2位-⽣产国家。
CN-中国；SG-新加坡；TH-泰国；MY-马来西亚。
图例⽣产国为马来西亚；第3位-⽣产年份。
这位数字代表⽣产年份的最后⼀位。
图例⽣产年份为2013年；第4位-⽣产⽉份。
分别⽤1-9，A，B，C表⽰。
图例⽣产⽉份为8⽉份；第5位-⽣产⽇期。
分别⽤1-9，A-V表⽰。
图例⽣产⽇期为7号。
Service ID （服务号）⾃检页ExampleService IDService ID 格式= YYDDD通过Service ID可以算出产品第⼀次使⽤的⽇期（也即第⼀次安装驱动的⽇期）:1.年份= YY + 19902.⽉份= (DDD/30) (如果有余数，+1)3.Date = 余数(如果余数= 0, ⽇期= 30)如上图的15130，根据解读⽅法，是2005年5⽉10⽇。
什么是墨盒保护功能该功能可以设置打印机中的墨盒，只能在本打印机上使⽤。
如果在其他打印机上使⽤被保护的墨盒，打印机就会提⽰⽆法使⽤。
墨盒⼀旦被写保护，就⽆法撤销保护。
取消打印机的墨盒保护功能，只能保证以后的墨盒不被保护。
⽬前在售的喷墨打印机，都有墨盒保护功能。
启⽤和关闭墨盒保护功能启⽤和关闭墨盒保护功能，有2个途径：在驱动中设置和在EWS中设置（关于EWS的设置，后续内容会有涉及）。
2KBP08M中文资料
2KBP005M thru 2KBP10M, 3N253 thru 3N259Document Number 8853208-Jul-05Vishay Semiconductors1Glass Passivated Single-Phase Bridge RectifierMajor Ratings and CharacteristicsI F(AV) 2 A V RRM 50 V to 1000 VI FSM 60 A I R 5 µA V F 1.1 V T j max.150 °CFeatures•UL Recognition file number E54214 •Ideal for printed circuit board •High surge current capability •High case dielectric strength •Solder Dip 260 °C, 40 secondsTypical ApplicationsGeneral purpose use in ac-to-dc bridge full wave rec-tification for Switching Power Supply, Home Appli-ances, Office Equipment, and Telecommunication applicationsMechanical DataCase: KBPMEpoxy meets UL-94V-0 Flammability ratingTerminals: Silver plated (E4 Suffix) leads, solderable per J-STD-002B and JESD22-B102D Polarity: As marked on bodyMaximum RatingsRatings at 25 °C ambient temperature unless otherwise specified.ParameterSymbols 2KBP005M2KBP 01M 2KBP 02M 2KBP 04M 2KBP 06M 2KBP 08M 2KBP 10M Units3N2533N2543N2553N2563N2573N2583N259Maximum repetitive peak reverse voltage V RRM 50 100 200 400 600 8001000 V Maximum RMS voltage V RMS 35 70 140 280 420 560 700 V Maximum DC blocking voltageV DC 50 100 200 400 600 800 1000 VMax. average forward output rectified current at T A = 55 °CI F(AV) 2.0A Peak forward surge current single half sine-wave superimposed on rated load I FSM 60 A Rating for fusing (t < 8.3 ms)I 2t 15A 2sec Operating junction and storage temperature rangeT J , T STG- 55 to + 165°C2KBP005M thru 2KBP10M, 3N253 thru 3N259Vishay SemiconductorsElectrical CharacteristicsRatings at 25 °C ambient temperature unless otherwise specified.Thermal CharacteristicsRatings at 25 °C ambient temperature unless otherwise specified.ParameterT est conditionSymbols2KBP 005M 2KBP 01M 2KBP 02M 2KBP 04M 2KBP 06M 2KBP 08M 2KBP 10M Units3N2533N2543N2553N2563N2573N2583N259Maximum instantaneous forward voltage drop per legat 3.14 AV F 1.1V Maximum DC reversecurrent at rated DC blocking voltage per legT A = 25 °C T A = 125 °C I R 5.0500µATypical junction capacitance per legat 4.0 V , 1 MHz C J25pF2KBP005M thru 2KBP10M, 3N253 thru 3N259Document Number 8853208-Jul-05Vishay Semiconductors3Package outline dimensions in inches (millimeters)Figure 4. Typical Reverse Leakage Characteristics Per Leg。
HP 移动宽带模块技术规格（QuickSpecs）说明书
IntroductionWireless Wide Area Network (WWAN) is an optional feature sold separately or as an add-on feature on select HP notebooks, Ultrabooks and tabletsHP Mobile Broadband modules provide integrated WWAN technology such as LTE**, DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA, GSM, GPRS, EDGE, CDMA, and GNSS connectivity over several radio frequency bands. (Select modules also supports 2G / 3G roaming). HP Mobile Broadband modules use this integrated WWAN technology to connect to wireless networks operated by mobile network operators in many countries worldwide. (Separately purchased mobile operator service required.)A WWAN connection requires wireless data service contract, network operator support, and is not available in all areas. Contact a service provider (e.g. Mobile Network Operator) to determine the coverage area and availability. Connection speeds will vary due to location, environment, network conditions, and other factors.Selected HP Mobile Broadband Wireless notebooks support Wireless WAN (WWAN) as an after-market option if ordered as a Wireless WAN (WWAN) ready configuration option. This provides customers the opportunity of adding Wireless WAN (WWAN) as an after-market option providing cost-efficient solution of adding WWAN post purchase.By offering customers this WWAN ready configuration option; HP can offer customers and integrated wireless wide area network (WWAN) option by way of after-market option kit.If the notebook is ordered with a WWAN Ready Configuration the HP production process allows for the customers to order a notebook without a HP Broadband module but receive a system that has:•WWAN antennae built into assembly•Supports aftermarket WWAN option (user accessible / upgradeable)•Subscriber identity module (SIM) user-accessibleSelect HP Mobile Broadband Wireless notebooks support Wireless Wide Area Network (WWAN) only if ordered from the factory (Select systems are not WWAN upgradeable post purchase).** 4G LTE not available on all products or in all countriesHP Mobile Broadband ModulesModelsHP XMM™ 7360 LTE-Advance WWAN 3FB01AA Key Benefits•With an HP Mobile Broadband-enabled notebook and wireless carrier service, you can check e-mail, browse the Internet, and connect to corporate networks from anywhere within your mobile operators coverage area, whether you arestationary or on the go. Enjoy the freedom of connecting in more places, the speed of broadband, the coverage of 3G or 4G networks, and the security, reliability, and ease of use of HP Business Notebooks that are Mobile Broadband enabled today!•Your HP WWAN Notebook comes preinstalled with HP Connection that enables the user to use this this generic connection manager with any SIM card from any mobile operator to set up this WWAN connection.•Convenience of having mobile wireless connectivity already set up as soon as you get your notebook, less obtrusive than a USB 3G or 4G notebook stick.•Enhance security by avoiding connections at hotels, airports, and hotspots with built-in support for VPN applications •Integrated 3G and / or 4G WWAN technology from Intel, Ericsson or Qualcomm enables high-speed Internet access via HP Mobile Broadband modules.•HP Mobile Broadband Modules allow international roaming in many countries** through support for multiple LTE /UMTS/HSPA /CDMA frequency bands and five GPRS/EDGE bands commonly used worldwide. (support varies by card, see table below)•Integrated GPS can help you accurately identify your location around the world and permit personal navigation to guide you where you need to go.***** Broadband connection requires a separately purchased wireless data service contract, mobile network service and support is not available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.*** GPS access requires an unobstructed path to multiple satellites. Performance may be affected if / when used inside of buildings, bridges or heavily congested metropolitan areas. Requires separately purchased GPS navigation software available from multiple third party GPS application vendor.CompatibilityBroadband card Compatible notebook platformHP XMM™ 7360 LTE-Advance WWAN HP ZBook 17 G5, ZBook 15 G5, ZBook 15u G5, ZBook 14u G5, ZBook x360 G5HP EliteBook 850 G5, 840 G5, 840 G5 Healthcare Edition, 840r G4, 830 G5HP EliteBook 755 G5, 745 G5, 725 G5HP ProBook 650 G4, 645 G4, 640 G4Factory-configurable options for additional select HP notebooks. Please see the QuickSpecsfor your notebook for additional compatibility information.NOTE: Works with Windows 10 onlyNOTE: Not all models are available in all regions.HP Mobile Broadband Modules and After Market Options CompatibilityProduct Part Number Product DescriptionOperator Compatibility Operating System SupportVerizon Sprint AT&T T-MobileGeneric GSM(SIM)W7supportW8.XsupportW10Support3FB01AA HP XMM™ 7360 LTE-Advance WWAN X X X * Win 8 Support only, no Win 8.1 supportService and SupportEach HP Mobile Broadband Module has a one-year limited warranty or the warranty remaining for the HP product in which it is installed. Technical support is available seven days a week, 24 hours a day, as well as in online support forums. Certain restrictions and exclusions apply.HP XMM™ 7360 LTE-Advance WWANTechnology/Operating bands LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8),700 (Band 12 lower), 700 (Band 13 upper), 700 (Band 17 lower),800 (Band 20), 700 (Band 28).HSPA+: 2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4),850 (Band 5), 900 (Band 8) MHzWireless protocol standards 3GPP Release 10 LTE Specification CAT.4, 20MHz BWWCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification1xEVDO Release 0, A and B.E-GPRS: Class B, Multi-slot class 12, coding schemes CS1 - CS4 and MSC1 - MSC9GPS Standalone, A-GPS (MS-A, MS-B and XTRA)GPS bands 1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHzMaximum data rates LTE: 150 Mbps (Download), 50 Mbps (Upload)DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)CDMA 1xRTT: 153.6 kbps (Download), 153.6 kbps (Upload)EVDO Rel.A: 3.1 Mbps (Download), 1.8 Mbps (Upload)EVDO Rel.B: 14.7 Mbps (Download), 5.4Mbps (Upload)EDGE: 236.8 kbps (Download), 236.8 kbps (Upload)GPRS: 85.6 kbps(Download), 85.6 kbps (Upload)Maximum output power LTE: 23 dBmHSPA+: 23.5 dBm1xRTT/EVDO: 24dBmE-GPRS 1900/1800: 26 dBmE-GPRS 900/850: 27 dBmGPRS 1900/1800: 29.5 dBmGPRS 900/850: 32.5 dBmMaximum power consumption LTE: 1,200 mA (peak); 900 mA (average)HSPA+: 1,100 mA (peak); 800 mA (average)1xRTT/EVDO: 1,000 mA (peak); 700 mA (average)E-GPRS: 2,800 mA (peak); 500 mA (average)Form Factor M.2, 3042-S3 Key BWeight 6.2 gDimensions (LxWxD) 1.65 x 1.18 x .09 in (42 x 30 x 2.3 mm)* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.Change Log© Copyright 2022 HP Development Company, L.P. The information contained herein is subject to change without notice.The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. All other trademarks are the property of their respective owners.Date of change: VersionDescription of change:History:V1 to V2 Added to be able to use the convert toolJuly 4, 2014 V20 to V21 Added three new WWAN ModulesJuly 8, 2014 V21 to V22 Changed WWAN part numbers, descriptionsMay 24, 2015 V22 to V23 Added HP lt4111b LTE/EV-DO/HSPA+ WWAN M0U02AAJune 10, 2015 V23 to V24 Added HP lt4120 LTE/EV-DO/HSPA+ WWANJuly 27, 2015 V24 to V25 Updated Removed 600 Series from HP lt4120 LTE/EV-DO/HSPA+ WWAN page 4Added Windows 10 page 5August 25, 2015 V25 to V26 Added HP lt4112 LTE/HSPA+W10 WWAN T0E33AAHP hs3110 HSPA+W10 WWAN T0E35AAHP lt4211 LTE/EV-DO/HSPA+W10 WWAN T0E34UTSeptember 3, 2015 V26 to V27 Updated HP lt4211 LTE/EV-DO/HSPA+W10 WWANFrom T0E34UT to TOE34AARemoved Removing already Discontinued productsQC431AA, WD301AA, H6F23AA, H4J87AASeptember 17, 2015 V27 to V28 Updated Updated compatibility for the HP lt4120 LTE/EV-DO/HSPA+ WWAN November 19, 2015 V28 to V29 Added Only compatible with HP EliteBook 850 G3 with HD and FHD panels. NotetoHP lt4120 LTE/EV-DO/HSPA+ WWANFebruary 29, 2016 V29 to V30 Updated Updated compatibility forHP lt4120 LTE/EV-DO/HSPA+ WWANHP hs3110 HSPA+W10 WWANHP lt4211 LTE/EV-DO/HSPA+W10 WWANDecember 16, 2016 V30 to V31 Added HP lt4132 LTE/HSPA+ 4G WWAN, 1HC91AA & HP hs3210 HSPA+ MobileModule, 1HC90AA were added their tech specs and compatibilities as well June 21, 2017 V31 to V32 Updated N8T16AA Sprint compatibility removedNovember 1, 2017 V32 to V33 Updated Added HP XMM™ 7360 LTE WWAN; removed HP HS2350 HSPA+(H4X00AA), HP hs3110 HSPA+ W8.1 WWAN (J8F05AA), HP lt4211 LTE/EV-DO/HSPA+ WWAN (J8F06AA), HP lt4112 LTE/HSPA+ W8.1 WWAN(J8F07AA), HP lt4111b LTE/EV-DO/HSPA+ WWAN (M0U02AA) November 16, 2017 V33 to V34 Update Product names updatedJanuary 24, 2019 V34 to V35 Update HP lt4132 LTE/HSPA+ 4G WWAN G2 addedJanuary 19, 2021 V35 to V36 Update All modules removed but HP XMM™ 7360 LTE-Advance WWAN。
MC-306规格书 爱普生32.768kHz晶振
产品名称 (标准显示)
MC-306 ① ①型号
32.768000kHz 12.5 +20.0-20.0 ② ③ ④ -6 ②频率 ③负载电容(pF) ④频率稳定度(× 10 ,+25 C) （单位：mm）
MC-405 / 406
外部尺寸规格
.
MC-306
8.0 #4 Max. #3 内部连接 (TOP VIEW) #4 #3 #1
本材料中记载的品牌名称或产品名称是其所有人的商标或注册商标。
Seiko Epson Corporation
追求高品质
Seiko Epson 为了向顾客提供高品质、卓越信赖性的产品、服务，迅 速着手通过 ISO 9000 系列资格认证的工作，其日本和海外工厂也在通 过 ISO 9001 认证。 同时， 也在通过大型汽车制造厂商要求规格的 ISO/TS 16949 认证。 ISO/TS16949 是一项国际标准,是在 ISO9001 的基础上增 加了对汽车工业的特殊要求部分。
条件
请联系我们以获取其它可用频率的相关信息 裸存
+25 C, DL=0.1 W
可指定 MC-306 MC-405 / 406 MC-306 MC-405 / 406 +25 C, 第一年
串联电阻（ESR）
频率 串联电阻 20 kHzf_nom< 31.2 kHz 55 k Max. 31.2 kHzf_nom< 40 kHz 35 k Max. 40 kHzf_nom< 90 kHz 20 k Max. 90 kHzf_nom 120 kHz 12 k Max.
规格（特征）
项目
额定频率范围 储存温度 工作温度 激励功率 频率公差（标准） 拐点温度 频率温度系数 负载电容 串联电阻（ESR） 串联电容 分路电容 频率老化
LNK302-306中文资料
D Package (SO-8C)
S1 S2 BP 3 FB 4
8S 7S
5D
3a
BP 1 FB 2
D4
8S 7S 6S 5S
3b
图 3. 引脚布局
PI-5422-041509
LinkSwitch-TN 功能描述
LinkSwitch-TN在一个器件上结合了一个高压功率MOSFET 开关及一个电源控制器。与传统的PWM(脉宽调制)控制器 不同，LinkSwitch-TN采用简单的开/关控制器来调节输出 电压。LinkSwitch-TN的控制器包括一个振荡器、反馈电 路(检测及逻辑电路)、5.8 V稳压电路、旁路引脚欠压电 路、过温保护、频率调制、限流电路、前沿消隐电路及 一个700 V的功率MOSFET。LinkSwitch-TN还另外集成了 用于自动重启动的保护电路。
降低系统成本 • 具有精确的限流点且工作在66 kHz — 可使用普通的
1 mH 电感达到120 mA的输出电流 • 严格的参数公差与微小的可以忽略不计的温度漂移 • 高达700 V的击穿电压提供了良好的抵抗输入浪涌的
能力 • 频率调制技术极大地降低了EMI(~10 dB) — 降低了
EMI滤波器的成本 • 很高的过温关断保护点(最小+135 °C)
图 5. 采用LinkSwitch-TN器件、宽电压输入12 V、120 mA恒压输出的电源
4
版本J 04/09
LNK302/304-306
AC INPUT
RF1
D3
L2
C4
C5
D4
LinkSwitch-TN
D
FB
R1 BP
S
S
C1 R3
C3
柯尼卡美能达耗材型号对照表
EP3000
MT TONER302B
Di350/Di350f
MT TONER104C
EP1053/EP1084/EP2030
ＭＴ603Ｂ
Di520/Di521/Di620/Di621
MT TONER801C
EP8010
MT TONER601B
EP5070/EP5071/EP6000/EP6000II
（PHOTOCONDUCTOR）DR114
bizhub 210/bizhub 180/bizhub 162/bizhub 162f
bizhub 220/bizhub 211/bizhub 181/bizhub 163
（PHOTOCONDUCTOR）
bizhub C450/bizhub C450P/bizhub C351
7020/7025/7030
7020/7025/7030
7035
7035
7033/7133/7040/
7140/7045
7033/7133/7040/
7140/7045
7050/7050M
7050/7050M
7060/7150
7060/7150
7065/7055/7170
7065/7055/7170
TN710
bizhub 750/bizhub 600
TN511
bizhu b 500/bizhub 420/bizhub 360
TN311
bizhub 350
TN211
bizhub 250/bizhub 200
TN114
bizhub 210/bizhub 180/bizhub 162/bizhub 162f
MAX306中文资料
_______________General DescriptionThe MAX306/MAX307 precision, monolithic, CMOS analog multiplexers (muxes) offer low on-resistance (less than 100Ω), which is matched to within 5Ωbetween channels and remains flat over the specified analog signal range (7Ωmax). They also offer low leak-age over temperature (I NO(OFF)less than 2.5nA at +85°C) and fast switching speeds (t TRANS less than 250ns). The MAX306 is a single-ended 1-of-16 device,and the MAX307 is a differential 2-of-8 device.The MAX306/MAX307 are fabricated with Maxim’s improved 44V silicon-gate process. Design improve-ments yield extremely low charge injection (less than 10pC) and guarantee electrostatic discharge (ESD)protection greater than 2000V.These muxes operate with a single +4.5V to +30V sup-ply, or bipolar ±4.5V to ±20V supplies, while retaining TTL/CMOS-logic input compatibility and fast switching.CMOS inputs provide reduced input loading. These improved parts are plug-in upgrades for the industry-standard DG406, DG407, DG506A, and DG507A.________________________ApplicationsSample-and-Hold Circuits Test Equipment Heads-Up DisplaysGuidance and Control Systems Military RadiosCommunications Systems Battery-Operated Systems PBX, PABXAudio Signal Routing____________________________Featureso Guaranteed On-Resistance Match Between Channels, <5ΩMaxo Low On-Resistance, <100ΩMaxo Guaranteed Flat On-Resistance over Specified Signal Range, 7ΩMaxo Guaranteed Charge Injection, <10pC o I NO(OFF)Leakage <2.5nA at +85°C o I COM(OFF)Leakage <20nA at +85°C o ESD Protection >2000Vo Plug-In Upgrade for Industry-Standard DG406/DG407/DG506A/DG507Ao Single-Supply Operation (+4.5V to +30V)Bipolar-Supply Operation (±4.5V to ±20V)o Low Power Consumption, <1.25mW o Rail-to-Rail Signal Handling o TTL/CMOS-Logic CompatibleMAX306/MAX307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers________________________________________________________________Maxim Integrated Products 1_____________________Pin Configurations/Functional Diagrams/Truth TablesCall toll free 1-800-998-8800 for free samples or literature.19-0270; Rev 0; 8/94Ordering Information continued at end of data sheet.* Contact factory for dice specifications.M A X 306/M A X 307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS—Dual Supplies(V+ = +15V, V- = -15V, GND = 0V, V AH = +2.4V, V AL = +0.8V, T A = T MIN to T MAX , unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Referenced to V-V+............................................................................-0.3V, 44V GND.........................................................................-0.3V, 25V Digital Inputs, NO, COM (Note 1)...........(V- - 2V) to (V+ + 2V) or30mA (whichever occurs first)Continuous Current (any terminal)......................................30mA Peak Current, NO or COM(pulsed at 1ms, 10% duty cycle max)..........................100mA Continuous Power Dissipation (T A = +70°C)Plastic DIP (derate 9.09mW/°C above +70°C)............727mW Wide SO (derate 12.50mW/°C above +70°C)............1000mW PLCC (derate 10.53mW/°C above +70°C)..................842mW CERDIP (derate 16.67mW/°C above +70°C).............1333mW Operating Temperature RangesMAX30_C_ _.......................................................0°C to +70°C MAX30_E_ _.....................................................-40°C to +85°C MAX30_MJI....................................................-55°C to +125°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10sec).............................+300°CNote 1:Signals on NO, COM, A0, A1, A2, A3, or EN exceeding V+ or V- are clamped by internal diodes. Limit forward current to maximum current ratings.MAX306/MAX307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS—Dual Supplies (continued)(V+ = +15V, V- = -15V, GND = 0V, V= +2.4V, V = +0.8V, T = T to T , unless otherwise noted.)M A X 306/M A X 307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—Single Supply(V+ = +12V, V- = 0V, GND = 0V, V AH = +2.4V, V AL = +0.8V, T A = T MIN to T MAX , unless otherwise noted.)Note 2:The algebraic convention where the most negative value is a minimum and the most positive value a maximum is used inthis data sheet.Note 3:Guaranteed by design.Note 4:∆R ON = R ON(MAX)- R ON(MIN).On-resistance match between channels and flatness are guaranteed only with specifiedvoltages. Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured at the extremes of the specified analog signal range.Note 5:Leakage parameters are 100% tested at the maximum rated hot temperature and guaranteed by correlation at +25°C.Note 6:Off isolation = 20log V COM /V NO , where V COM = output and V NO = input to off switch.MAX306/MAX307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers_______________________________________________________________________________________5120140160ON-RESISTANCE vs. V COM(DUAL SUPPLIES)1000204060-2020-1515-1010-5580V COM (V)R O N (Ω)120ON-RESISTANCE vs. V COM AND TEMPERATURE (DUAL SUPPLIES)1000204060-1515-1010-55080V COM (V)R O N (Ω)280320360400ON-RESISTANCE vs. V COM (SINGLE SUPPLY)24040801201601520105200V COM (V)R O N (Ω)120140160ON-RESISTANCE vs. V COM AND TEMPERATURE (SINGLE SUPPLY)10002040601510580V COM (V)R O N (Ω)30CHARGE INJECTION vs. V COM20-30-20-100-1515-1010-55010V COM (V)Q j (p C )100.0001-55125OFF LEAKAGE vs. TEMPERATURE1TEMPERATURE (°C)O F F L E A K A G E (n A )250.010.001-35-15650.1100100045851055100.0001-55125ON LEAKAGE vs. TEMPERATURE1TEMPERATURE (°C)O N L E A K A G E (n A )250.010.001-35-15650.11001000458510551000.001-55125SUPPLY CURRENT vs. TEMPERATURE10TEMPERATURE (°C)I +, I - (µA )250.10.01-35-1565145851055__________________________________________Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)__________Applications InformationOperation with Supply VoltagesOther than ±15VUsing supply voltages other than ±15V will reduce the analog signal range. The MAX306/MAX307 switches operate with ±4.5V to ±20V bipolar supplies or with a +4.5V to +30V single supply; connect V- to GND when operating with a single supply. Also, both device types can operate with unbalanced supplies such as +24V and -5V. The Typical Operating Characteristics graphs show typical on-resistance with 20V, 15V, 10V, and 5V supplies. (Switching times increase by a factor of two or more for operation at 5V.)Overvoltage ProtectionProper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maxi-mum ratings because stresses beyond the listed rat-ings may cause permanent damage to the devices.Always sequence V+ on first, then V-, followed by either the logic inputs, NO, or COM. If power-supply sequencing is not possible, add two small signal diodes in series with supply pins for overvoltage pro-tection (Figure 1). Adding diodes reduces the analogsignal range to 1V above V+ and 1V below V-, but low switch resistance and low leakage characteristics are unaffected. Device operation is unchanged, and the difference between V+ and V- should not exceed +44V.M A X 306/M A X 307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers 6_______________________________________________________________________________________Output–bidirectionalCOM28Address Inputs A3–A014–17Enable InputsEN 18Analog Inputs–bidirectional NO1–NO819–26Negative Supply Voltage Input V-27Ground GND 12Analog Inputs–bidirectional NO16–NO94–11MAX306PINNo Internal Connections N.C.2, 3, 13Positive Supply Voltage Input V+1FUNCTIONNAME_____________________________________________________________Pin DescriptionsDiodesMAX306/MAX307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers_______________________________________________________________________________________7______________________________________________Test Circuits/Timing DiagramsM A X 306/M A X 307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers 8________________________________________________________________________________________________________________________Test Circuits/Timing Diagrams (continued)Figure 5. Charge InjectionMAX306/MAX307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers_______________________________________________________________________________________9_________________________________Test Circuits/Timing Diagrams (continued)Figure 8. NO/COM CapacitanceM A X 306/M A X 307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers 10______________________________________________________________________________________________Pin Configurations/Functional Diagrams/Truth Tables (continued)A2A1A0EN ON Switch X 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1X 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 10 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1None 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16MAX306LOGIC “0” V AL ≤ 0.8V, LOGIC “1” = V AH ≥ 2.4VA3X 0 0 0 0 0 0 0 0 1 1 1 1 1 1 11A2A1A0EN ON Switch X 0 0 0 0 1 1 1 1X 0 0 1 1 0 0 1 1X 0 1 0 1 0 1 0 10 1 1 1 1 1 1 1 1None 1 2 3 4 5 6 7 8MAX307LOGIC “0” V AL ≤ 0.8V, LOGIC “1” = V AH ≥ 2.4VMAX306/MAX307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers______________________________________________________________________________________11________Pin Configurations/Functional Diagrams/Truth Tables (continued)_Ordering Information (continued)* Contact factory for dice specifications.Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600©1994 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.M A X 306/M A X 307Precision, 16-Channel/Dual 8-Channel,High-Performance, CMOS Analog Multiplexers __________________________________________________________Chip TopographiesGNDNO1 NO2 NO3 N04 NO5 NO6 NO7 NO80.184" (4.67mm)0.078" (1.98mm)NO9NO10NO11NO12N013NO14NO15NO16N.C.V-COM V+GND NO1A NO2A NO3A N04A NO5A NO6A NO7A NO8A0.184" (4.67mm)0.078" (1.98mm)NO1B NO2B NO3B NO4B N05B NO6B NO7B NO8B COMBV-COMA V+TRANSISTOR COUNT: 269SUBSTRATE IS INTERNALLY CONNECTED TO V+TRANSISTOR COUNT: 269SUBSTRATE IS INTERNALLY CONNECTED TO V+MAX306MAX307N.C. = NO INTERNAL CONNECTION。
西门子西伯乐斯BC80操作说明
第五章 LCD 操作·········································································································9 １． 用户级别 ························································································································9 ２． 界面分布 ·······················································································································10 ３． 键盘和指示灯的分布 ····································································································11 ４．用户界面 ························································································································13
地址：北京市海淀区上地信息产业基地信息路 18 号 版本日期：0211 文件号：8601
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M3062PT-80FPB User's Manual
of the M3062PT-80FPB. (5) Connect the YQPACK080SB and M3062PT-80FPB together
for use. During board-mounted evaluation On top of NQPACK080SB that is mounted on the target system, attach the MCU with on-chip flash memory or one-time PROM and the HQPACK080SB (option) in that order.
Recommended Foot Pattern (Unit: mm)
[Ordering Information] See Appendix H "Ordering Information". *All brand names and product names are trademarks or registered trademarks of their respective companies.
Attaching Procedure
When debugging (1) Mount the NQPACK080SB on the foot pattern of the target
system. (2) Attach the YQPACK080SB on top of (1). (3) Screw down the YQPACK080SB with YQ-GUIDE's. (4) Connect the probe of top of emulator to the upper connector
*Required components to connect to the target system are included with this product package. Each component made by Tokyo Eletech Co., Ltd. is optionally available alone from Tokyo Eletech Co., Ltd. See Appendix G "Contact Addresses for Partner Products".
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Package Components
• M3062PT-80FPB converter • YQPACK080SB (made by Tokyo Eletech Co., Ltd.) • NQPACK080SB (made by Tokyo Eletech Co., Ltd.) • YQ-GUIDE (× 4) • User's manual
The M3062PT-80FPB is a converter for connecting the FLX160 160-core flexible board to a foot pattern of a 80-pin 0.65mm-pitch QFP (80P6S-A) for M16C/60 Series. This converter can be used during debugging and board-mounted evaluatd Dimensions
Attaching Procedure
When debugging (1) Mount the NQPACK080SB on the foot pattern of the target system. (2) Attach the YQPACK080SB on top of (1). (3) Screw down the YQPACK080SB with YQ-GUIDE's. (4) Connect the probe of top of emulator to the upper connector of the M3062PT-80FPB. (5) Connect the YQPACK080SB and M3062PT-80FPB together for use. During board-mounted evaluation On top of NQPACK080SB that is mounted on the target system, attach the MCU with on-chip flash memory or one-time PROM and the HQPACK080SB (option) in that order.
Recommended Foot Pattern (Unit: mm)
[Ordering Information] See Appendix H "Ordering Information".
*All brand names and product names are trademarks or registered trademarks of their respective companies.
元器件交易网
M3062PT-80FPB
Converter Board for Connecting 160-core Flexible Board FLX160 to 80-pin 0.65mm-pitch QFP (for M16C/60 Series)
Function