M41T00AUDD1F;中文规格书,Datasheet资料

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MOV-14D201K,MOV-14D431K,MOV-14D471K,MOV-14D181K,MOV-14D391K,MOV-14D511K, 规格书,Datasheet 资料

*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Speciﬁ cations are subject to change without notice.Customers should verify actual device performance in their speciﬁ c applications.Absolute Maximum Ratings (@ T A = 25 °C Unless Otherwise Noted)ParameterSymbol Min.Typ.Max.Unit Operating Temperature T OPR -4025+85˚C Storage Temperature T STG -4025+125˚C Rated WattageP w 0.60Watt Varistor Voltage Temperature Coefﬁ cient V TC 00.10.05 % / ˚C Response TimeT r 1025ns Varistor Voltage ToleranceV tol-1010%Electrical Characteristics (@ T A = 25 °C Unless Otherwise Noted)*Ro H S C O MP L I A N TBourns Part No.Max. Continuous Voltage (V)Voltage @ 1 mA DC(V)Voltage @ Class Current Max. PeakCurrent Max.Energy Max. Cap.(8/20 μs)(8/20 μs)(J)(pF)r.m.s.d.c.Min.Nom.Max.ClassCurrent(A)Max.Clamping Voltage (V)One Time 8/20 μs 1 kHz MOV-14D180K 111416182010361000 4.011100MOV-14D220K 141820222410431000 5.09100MOV-14D270K 172224273010531000 6.07400MOV-14D330K 2026303336106510007.56100MOV-14D390K 2531353943107710008.65100MOV-14D470K 30384247521093100010.04300MOV-14D560K 354550566210110100011.03600MOV-14D680K 405661687510135100014.02900MOV-14D820K 506574829050135450022.02400MOV-14D101K 60859010011050165450028.02000MOV-14D121K 7510010812013250200450032.01700MOV-14D151K 9512513515016550250450040.01300MOV-14D181K 11515016218019850300450050.01100MOV-14D201K 13017018520022550340450057.01000MOV-14D221K 14018019822024250360450060.0900MOV-14D241K 15020021624026450395450063.0830MOV-14D271K 17522524327029750455450070.0740MOV-14D301K 19025027030033050500450077.0670MOV-14D331K 21027529733036350550450085.0610MOV-14D361K 23030032436039650595450093.0560MOV-14D391K 250320351390429506504500100.0510MOV-14D431K 275350387430473507104500115.0460MOV-14D471K 300385423470517507754500125.0430MOV-14D511K 320415459510561508454500125.0390MOV-14D561K 350460504560616509254500125.0360MOV-14D621K 3855055586206825010254500125.0320MOV-14D681K 4205606126807485011204500130.0290MOV-14D751K 4606156757508255012404500143.0270MOV-14D781K 4856407027808585012904500148.0260MOV-14D821K 5106707388209025013554500157.0240MOV-14D911K 55074581991010015015004500175.0220MOV-14D102K 625825900100011005016504500190.0200MOV-14D112K 680895990110012105018154500213.0180MOV-14D152K 7509901080150013205019804500337.0150MOV-14D182K110014651620180019805029704500337.010014D 201K5Speciﬁ cations are subject to change without notice.Customers should verify actual device performance in their speciﬁ c applications.Product DimensionsDIMENSIONS:MM(INCHES)This is an RoHS compliant molded radial package with 100 % Sn plating on the terminations.Internal ConstructionHow to OrderMOV - 14D nn (n) K (TR)Model DesignatorMOV = Metal Oxide Varistor Disc Diameter 14D = 14 mmNominal Varistor VoltageSee Electrical Characteristics TableMultiplier of Voltage Digits 0 = No multiplier 1 = nn * 101 2 = nn * 102Varistor Voltage Tolerance K = 10 %PackagingBlank = BulkTR = Tape & Reel*Examples: MOV-14D270K = 27 V, Bulk PackMOV-14D331KTR = 330 V, T ape & Reel* Models MOV-14D911K, 102K, 112K, 152K and 182K are not available in Tape & Reel packaging.Part Number Dim. H (Max.)Dim. T (Max.)MOV-14D180K20.0(.787) 3.8(.150)MOV-14D220K 20.0(.787) 3.9(.154)MOV-14D270K 20.0(.787) 4.2(.165)MOV-14D330K 20.0(.787) 3.8(.150)MOV-14D390K20.0(.787) 4.0(.157)MOV-14D470K 20.0(.787) 4.2(.165)MOV-14D560K 20.0(.787) 4.3(.169)MOV-14D680K 20.0(.787) 4.4(.173)MOV-14D820K20.0(.787) 3.8(.150)MOV-14D101K 20.0(.787) 4.0(.157)MOV-14D121K20.0(.787) 4.2(.165)MOV-14D151K 20.0(.787) 4.4(.173)MOV-14D181K20.0(.787) 3.6(.142)MOV-14D201K 20.0(.787) 3.8(.150)MOV-14D221K 20.0(.787) 3.9(.154)MOV-14D241K 20.0(.787) 4.0(.157)MOV-14D271K 20.0(.787) 4.2(.165)MOV-14D301K20.0(.787) 4.4(.173)Part Number Dim. H (Max.)Dim. T (Max.)MOV-14D331K 20.0(.787) 4.6(.181)MOV-14D361K 20.0(.787) 4.8(.189)MOV-14D391K 20.0(.787) 5.0(.197)MOV-14D431K 20.0(.787) 5.2(.205)MOV-14D471K 20.0(.787) 5.4(.213)MOV-14D511K 20.0(.787) 5.5(.217)MOV-14D561K 22.0(.866) 6.0(.236)MOV-14D621K 22.0(.866) 6.4(.252)MOV-14D681K 22.0(.866) 6.5(.256)MOV-14D751K 22.0(.866) 6.7(.264)MOV-14D781K 22.0(.866) 6.9(.272)MOV-14D821K 22.0(.866)7.3(.287)MOV-14D911K*22.0(.866)7.7(.303)MOV-14D102K*22.0(.866)8.2(.323)MOV-14D112K*22.0(.866)8.7(.343)MOV-14D152K*22.0(.866)9.7(.382)MOV-14D182K*22.0(.866)11.7(.461)* Not available in Tape & Reel packaging.Speciﬁ cations are subject to change without notice.Customers should verify actual device performance in their speciﬁ c applications.1011001000101010101010Current (A)V o l t a g e (V )680560470390330270220180100100010000101010101010Current (A)V o l t a g e (V )18215211210291182178175168162156151147110010100010000101010101010Current (A)V o l t a g e (V )431391361331301271241221201181151121101820101010101010101010101010101010Performance Graphs V-I CharacteristicsMOV-14D180K to MOV-14D680KMOV-14D820K to MOV-14D431KMOV-14D471K to MOV-14D182KBournsPart Number Bourns Part Marking MOV-14D180K 14D180K MOV-14D220K 14D220K MOV-14D270K 14D270K MOV-14D330K 14D330K MOV-14D390K 14D390K MOV-14D470K 14D470K MOV-14D560K 14D560K MOV-14D680K 14D680K MOV-14D820K 14D820K MOV-14D101K 14D101K MOV-14D121K 14D121K MOV-14D151K 14D151K MOV-14D181K 14D181K MOV-14D201K 14D201K MOV-14D221K 14D221K MOV-14D241K 14D241K MOV-14D271K 14D271K MOV-14D301K 14D301K MOV-14D331K 14D331K MOV-14D361K 14D361K MOV-14D391K 14D391K MOV-14D431K 14D431K MOV-14D471K 14D471K MOV-14D511K 14D511K MOV-14D561K 14D561K MOV-14D621K 14D621K MOV-14D681K 14D681K MOV-14D751K 14D751K MOV-14D781K 14D781K MOV-14D821K 14D821K MOV-14D911K 14D821K MOV-14D102K 14D102K MOV-14D112K 14D112K MOV-14D152K 14D152K MOV-14D182K14D182KNOTE: The “5” marking on MOV products is for traceability of production assembly for quality assurance compliance.Typical Part MarkingPackaging InformationTAPE & REELItem Symbol14 mm Disc Reel Outside Diameter RD355(13.98) Reel Inner Diameter RD130(11.81) Tape Width RW55(2.165) Reel Width RW163(2.48) Pitch of Component P25.4 ± 1.0(1.00 ± 0.04) Feed Hole Pitch P012.7 ± 1.0(0.50 ± 0.04) Feed Hole Center to Pitch P18.95 ± 0.7(0.352 ± 0.3) Feed Hole Center to ComponentCenterP212.7 ± 1.0(0.50 ± 0.04)Lead to Lead Distance F7.50 ± 0.8(0.30 ± 0.03)Component AlignmentΔh4.0max.(0.157) max.Tape Width W18.0 ± 0.5(0.71 ± 0.02)Hole Down Tape Width W012.0 ± 0.8(0.47 ± 0.03)Hole Position W19.0 ± 0.5(0.35 ± 0.02)Hole Down Tape Position W23.0max.(0.12) max.Height From Center toComponent BaseH19.0 ± 1.0(0.75 ± 0.04)Seating Plane Height H016.0 ± 0.5(0.63 ± 0.02)Component Height H140.0max.(1.57) maxCrimp Length C2.60typ.(0.10) maxFeed Hole Diameter D04.0 ± 0.2(0.16 ± 0.08)Total Tape Thickness t0.6 ± 0.3(0.02 ± 0.01)Length of Clippped Height L1.0max.(0.04) maxQuantity per ReelMOV-14D180K – 14D391KMOV-14D431K - 14D182K-100050012/11Speciﬁ cations are subject to change without notice.Customers should verify actual device performance in their speciﬁ c applications.BULK60.0(2.36)Asia-Paciﬁ c:Tel: +886-2 2562-4117Fax: +886-2 2562-4116Europe:Tel: +41-41 768 5555Fax: +41-41 768 5510The Americas:Tel: +1-951 781-5500Fax: +1-951 781-5700NOTE: Models MOV-14D911K, 102K, 112K, 152K and 182K are not availablein Tape & Reel packaging.。

MJF44H11G;MJF45H11G;MJF44H11;MJF45H11;中文规格书,Datasheet资料

20 30 50 70 100
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 2. Maximum Rated Forward Bias Safe Operating Area
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC − VCE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
−
−
500
−
−
500
−
−
140
−
−
100
−
Unit Vdc mA mA Vdc Vdc
−
pF MHz
ns ns ns
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0 0.7 D = 0.5 0.5
0.3 0.2
0.2
0.1 0.1
0.07
0.05
0.05 0.02
MJF44H11 MJF45H11
Symbol VCEO(sus)
ICES IEBO VCE(sat) VBE(sat) hFE

调频1KW发射机技术说明书

+10dBm；
第6页
GME1F13D 调频发射机技术说明书
第三章发射机面板与接口说明第一节前面板
从发射机的前方，从上到下分别是： [1] 主控制单元（显示单元） [2] 激励器 [3] 电控单元 [4] 功放单元 [5] 开关电源
1 2 3
4
5
图 3-1
第7页
各部分前面板具体说明如下：
一、电源面板说明
北京吉兆电子有限公司
GME1F13 调频 1KW 发射机技术说明书
公司地址
售后服务热线免费咨询热线营销部电话营销部传真 E-mail Web
北京市海淀区王庄路 1 号清华同方科技大厦 A 座 26 层
(100083) 010-82916768 010-800-810-8463 010-82399620 010-82399617 gme@
五、激励器、功放均带有检测、控制接口，可以根据用户要求增加控制单元，实现微机联网控制，并实现遥控开关机、定时开关机等功能。
六、具有防雷击、交流欠压、直流过压、电源过热、功放过热、发射机超载等各种保护功能，使发射机性能稳定可靠。
七、功放具有很强的自保护功能，在出现功放过热、激励器过激励、天线超载时，功放中的控制电路可以立即作出判断，并作出相应的动作关断信号保护功放。
相对湿度：≤ 95%；海拔高度：≤2000 米； *输入特性 [1]音频输入阻抗：600Ω（平衡）或 10KΩ可选 [2]音频输入接口： XLR [3]音频输入电平：-13dBm---- +14dBm； [4]MPX 输入接口：BNC 、不平衡 [5]SCA/RDS 输入接口：BNC、不平衡
第5页
GME1F13D 调频发射机技术说明书

D1D40中文资料

Load Current Range 3 [Adc]
Max. Surge Current, [Adc] (10Msec) Max. On-State Voltage Drop @ Rated Current [Vdc] Thermal Resistance Junction to Case RqJC[°C/W] Max On-state Resistance @ Rated Current (R DS-ON ) [Ohms] Max. Off-State Leakage Current @ Rated Voltage [mA] Max. Turn-On Time [µsec]
MAX. SURGE CURRENT (Amps)
Transient Protection
All loads are inductive, even ones that are not so labeled. An inductive load will produce harmful transient voltages when it is turned off. The more perfect the switch, the larger the transient voltages; the MOSFET output is so nearly an ideal switch that the transient voltages produced by seemingly "non-inductive" loads can cause damage if not suppressed. Diodes should be fast recovery type with PIV rated greater than supply voltage.

D45H11;中文规格书,Datasheet资料

D45H11 — PNP Power Amplifier© 2012 Fairchild Semiconductor Corporation D45H11 Rev. A11June 2012D45H11PNP Power Amplifier•This device is designed for power amplifier, regulator and switching circuits where speed is important.•Sourced from process 5Q.Absolute Maximum RatingsElectrical Characteristics T a = 25°C unless otherwise notedThermal Characteristics T a = 25°C unless otherwise noted* Note) Device mounted on FR-$ PCB 36mm*18mm*1.5mm: Mounting pad for the collector lead min. 6cm2.SymbolParameterValueUnitsV CEO Collector-Emitter Voltage-80V I C Collector Current - Continuous-10A T J , T STGOperating and Storage Junction Temperature Range-55 to +150°CSymbolParameter Test Condition Min.Max.UnitsOff Characteristics V (BR)CEO Collector-Emitter Breakdown Voltage I C = -100mA, I B = 0-80V I CBO Collector-Cutoff Current V CB = -80V, I E = 0-10μA I EBO Emitter-Cutoff Current V EB = -5V, I C = 0-100μAOn Characteristics *h FE DC Current GainV CE = -1V, I C = -2A V CE = -1V, I C = -4A 6040V CE (sat)Collector-Emitter Saturation Voltage I C = -8A,I B = -0.4A -1.0V V BE (sat)Base-Emitter Saturation Voltage I C = -8A,I B = -0.8A -1.5V V BE (on)Base-Emitter On Voltage V CE = -2V, I C = -10mA -0.54-0.65V Small Signal Characteristicsf TCurrent Gain Bandwidth ProductI C = -500mA, V CE = -10V40MHZSymbolParameterMax.UnitsP D Total Device DissipationDerate above 25°C60480W mW/°C R θJC Thermal Resistance, Junction to Case 2.1°C/W R θJAThermal Resistance, Junction to Ambient62.5°C/W1TO-2201. Base2. Collector3. EmitterMark: D45H11The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is notAX-CAP¥*BitSiC¥Build it Now¥CorePLUS¥CorePOWER¥CROSSVOLT¥CTL¥Current Transfer Logic¥DEUXPEED®Dual Cool™ EcoSPARK®EfficientMax¥ESBC¥®Fairchild®Fairchild Semiconductor®FACT Quiet Series¥FACT®FAST®FastvCore¥FETBench¥FlashWriter®*FPS¥Global Power ResourceGreenBridge¥Green FPS¥Green FPS¥ e-Series¥G max¥GTO¥IntelliMAX¥ISOPLANAR¥Making Small Speakers Sound Louderand Better™MegaBuck¥MICROCOUPLER¥MicroFET¥MicroPak¥MicroPak2¥MillerDrive¥MotionMax¥Motion-SPM¥mWSaver¥OptoHiT¥OPTOLOGIC®OPTOPLANAR®®Programmable Active Droop¥QFET®QS¥Quiet Series¥RapidConfigure¥¥Saving our world, 1mW/W/kW at a time™SignalWise¥SmartMax¥SMART START¥Solutions for Your Success¥SPM®STEALTH¥SuperFET®SuperSOT¥-3SuperSOT¥-6SuperSOT¥-8SupreMOS®SyncFET¥Sync-Lock™®*The Power Franchise®TinyBoost¥TinyBuck¥TinyCalc¥TinyLogic®TINYOPTO¥TinyPower¥TinyPWM¥TinyWire¥TranSiC¥TriFault Detect¥TRUECURRENT®*P SerDes¥UHC®Ultra FRFET¥UniFET¥VCX¥VisualMax¥VoltagePlus¥XS™* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a)are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, orsystem whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.ANTI-COUNTERFEITING POLICYFairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, , under Sales Support.Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.PRODUCT STATUS DEFINITIONSDefinition of TermsDatasheet Identification Product Status DefinitionAdvance Information Formative / In DesignDatasheet contains the design specifications for product development. Specifications may change分销商库存信息: FAIRCHILDD45H11。

YAMAH MODUS F11 F01 说明书

3. NOTE: This product has been tested and found to comply with the requirements listed in FCC Regulations, Part 15 for Class “B” digital devices. Compliance with these requirements provides a reasonable level of assurance that your use of this product in a residential environment will not result in harmful interference with other electronic devices. This equipment generates/ uses radio frequencies and, if not installed and used according to the instructions found in the users manual, may cause interference harmful to the operation of
Model
Serial No.
Purchase Date
FCC INFORMATION (U.S.A.)
1. IMPORTANT NOTICE: DO NOT MODIFY THIS UNIT!
This product, when installed as indicated in the instructions contained in this manual, meets FCC requirements. Modiﬁcations not expressly approved by Yamaha may void your authority, granted by the FCC, to use the product.

国产DIRIS A41说明书

仪表可直接取代常规电力变送器、测量指示仪表以及相关的辅助单元，模
块化的结构设计，用户可根据实际需求选择最为经济的功能配置，具有极高的
性能价格比。
仪表可广泛应用于能源管理系统、供配电网自动化、小区电力监控、成套
设备开关柜等场合，具有安装方便、接线简单、维护方便，工程量小、现场可
的额定输入电压，否则应考虑使用PT，在电压输入端须安装1A 保险丝；输入
电流应不高于产品的额定输入电流，否则应考虑使用外部CT 。
3
湘湖 DIRIS A41多功能网络电力仪表使用说明书
总功率有功 3 .300kW 无功0.002kv ar 视在 3 .3 0 0 kVA
总功率有功 3.300 kW 无功 0.0 02k var 视在 3.3 00k VA
4
6
湘湖 DIRIS A41多功能网络电力仪表使用说明书
湘湖 DIRIS A41多功能网络电力仪表使用说明书
“显示方式”菜单参数值/对应字符 0 循环显示
1 相电压
示例
/
相电压 UA 220.0 V UB 22 0. 1 V UC 219 . 8 V
2 线电压
线电压 UA B 38 0.0 V UB C 3 8 0.1 V UCA 37 9.8 V
仪表有多种扩展功能模块可供选择：4路模拟量( 0～2 0 mA / 4～20 mA )输出
可实现电量的变送输出功能； 4路开关量输入和4路开关量输出可实现本地或远
程的开关信号监测和控制输出功能（ “ 遥信 ” 和 “ 遥控 ” 功能）。

FPAA 芯片

Figure 1: Architectural overview of the AN120E04 device
PRODUCT FEATURES
• Fully differential architecture • Fully differential I/O buffering with options for single ended
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter
SymboComment
DC Power Supplies
AVDD(2)
BVDD
-0.5
DVDD
-
5.5 V
V
AVSS, BVSS, DVSS and SVSS all held to 0.0 V a
rights nor the rights of others. Anadigm software and associated products cannot be used except strictly in accordance with an Anadigm software license. The terms of the appropriate Anadigm software license shall prevail
arbitrary signal generation • 4:1 Input multiplexer • Typical Signal Bandwidth: DC-2MHz (Bandwidth is CAM
dependent) • Signal to Noise Ratio:
o Broadband 80dB o Narrowband (audio) 100dB • Total Harmonic Distortion (THD): 80dB • DC offset <100µV • Package: 44-pin QFP (10x10x2mm) o Lead pitch 0.8mm • Supply voltage: 5V

PT481E00000F;中文规格书,Datasheet资料

PT481E00000FPale Blue Transparent Resin,Narrow Angle, Darlington PhototransistorNotice The content of data sheet is subject to change without prior notice.In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP ■Features1.Side view detection package2.Molded plastic with pale blue transparent resin lens3.Peak sensitivity wavelength: 800 nm (TYP.)4.High sensitivity (I C : 10 mA @ Ee = 0.1 mW/cm 2)5.Narrow acceptance angle (±13° TYP.)6.Lead-free and RoHS directive compliant■Agency Approvals/Compliancepliant with RoHS directive (2002/95/EC)2.Content information about the six substancesspecified in “Management Methods for Control of Pollution Caused by Electronic Information Prod-ucts Regulation” (popular name: China RoHS)(Chinese: ); refer to page 7.■Applications1.Optoelectronic switches2.Automatic stroboscopes3.Mechanical Systems4.Office automation equipment5.Audio visual equipment■External Dimensions■Absolute Maximum Ratings*1 5 s (MAX.) no closer than 1.4 mm from resin edge.■Electro-optical Charactertistics*1 Ee: Irradiance by CIE standard light source A (tungsten lamp)ParameterSymbol Rating Unit Collector-emitter voltage V CEO 35V Emitter-collector voltage V ECO 6V Collector currentI C 50mA Collector power dissipation P C 75mW Operating temperature Topr -25 to +85°C Storage temperature Tstg -40 to +85°C Soldering temperature *1Tsol260°CParameterSymbol Conditions *1MIN.TYP.MAX.Unit Collector current I C Ee = 0.1 mW/cm 2, V CE = 2 V1.51025mADark currentI CEO Ee = 0, V CE = 10 V – 1.01000nA Collector-emitter saturation voltage V CE (sat)Ee = 1 mW/cm 2, Ic = 2.5 mA–0.7 1.0V Collector-emitter breakdown voltage BV CEO I C = 0.1 mA, Ee = 035––V Emitter-collector breakdown voltage BV ECO I E = 0.01 mA, Ee = 06––V Peak sensitivity wavelength λp ––800–nm Response time (Rise)tr V CE = 2 V, I C = 10 mA,R L = 100Ω–80–µs Response time (Fall)tf–70–µsFig. 1Collector Power Dissipation vs.Ambient TemperatureFig. 2Spectral Sensitivity (TYP.)(Ta = 25°C)(Ta = 25°C)Fig. 3Collector Dark Current vs.Ambient TemperatureFig. 4Collector Current vs. IrradianceFig. 5Relative Collector Current vs.Ambient TemperatureFig. 6Collector Current vs.Collector-Emitter VoltageFig. 7Response Time vs. Load Resistance Fig. 8Test Circuit for Response Time Fig. 9Collector-to-Emitter SaturationVoltage vs. IrradienceFig. 10Relative Output vs Distance Fig. 11Sensitivity vs. Axis (TYP.)Graph data is for reference only and is not guaranteed data.■Design Notes1.This product is not designed to resist electromagnetic and ionized-particle radiation.■Manufacturing Guidelines●Soldering Instructions1.Sharp does not recommend soldering this part using preheat or solder reflow methods. Leads on this part arepre-coated with lead-free solder. See Figure 12.2.If hand soldering, use temperatures ≤260° for ≤5 seconds.3.When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between thesolder, the pad, and the circuit board.4.Do not subject the package to excessive mechanical force during soldering as it may cause deformation ordefects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-age due to the PCB flexing during the soldering process.Fig. 12Soldering Area●Cleaning Instructions1.Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect theoptical characteristics.2.Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.3.Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaningtime, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-tions to confirm the harmlessness of the ultrasonic cleaning methods.4.Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.■Presence of ODCs (RoHS Compliance)This product shall not contain the following materials, and they are not used in the production process for this product:•Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).•Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (Chinese:)NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11363-2006 standard.CategoryToxic and Hazdardous SubstancesLead (Pb)mercury (Hg)Cadmium (Cd)Hexavalentchromiun (Cr 6+)Polybrominated biphenyls (PBB)Polybrominated diphenyl ethers(PBDE)Photo Transistor✓✓✓✓✓✓■Packing Specifications1.Parts are packed in a plastic zip-top bag, with a quantity of 1000 pieces per bag.2.Bags are secured in a box as shown in Figure 13.3.Product mass: 0.09 g (approximately)Fig. 13Packing Composition■Important Notices·The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP’s devices.·Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data materials, struc-ture, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.·Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions:(i) The devices in this publication are designed for use in general electronic equipment designs such as: ---Personal computers---Office automation equipment---Telecommunication equipment (terminal)---Test and measurement equipment---Industrial control---Audio visual equipment---Consumer electronics(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as:---Transportation control and safety equipment(i.e., aircraft, trains, automobiles, etc.)---Traffic signals---Gas leakage sensor breakers---Alarm equipment---Various safety devices, etc.(iii) SHARP devices shall not be used for or in connec-tion with equipment that requires an extremely high level of reliability and safety such as:---Space applications---Telecommunication equipment (trunk lines)---Nuclear power control equipment---Medical and other life support equipment (e.g.scuba)·If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.·This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be repro-duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.·Contact and consult with a SHARP representative if there are any questions about the contents of this pub-lication.分销商库存信息:SHARP-MICROELECTRONICS PT481E00000F。

NUD4301MNT1G;中文规格书,Datasheet资料

NUD4301Dual Channel LEDDriver/Current SourceThis device is designed to replace switching regulators for driving LEDs in low voltage DC applications (up to 6 V). Its unique integrated circuit design provides the ability to drive external FETs to achieve higher voltage and current capabilities for different application needs (see Figure 8). An external resistor allows the circuit designer to set the LED current for different applications needs. The device is packaged in a small surface mount leadless package (DFN8), which results in a significant reduction of both system cost and board space.Features•ăLow Dropout V oltage < 300 mV•ăProgrammable Output Current from 1 mA to 30 mA •ăDual Output with Independent Current Limit Set •ăDC Current in LED•ăAnalog/Digital PWM Capability •ăThis is a Pb-Free DeviceTypical Applications•ăPortables: PDAs, Cell phones •ăLCD Backlighting ApplicationsFigure 1. Block Diagram94GND12Dim 5Source16Drain17Drain28Source23NCDevicePackage Shipping †ORDERING INFORMATIONNUD4301MNT1GDFN8(Pb-Free)3000/Tape & ReelPIN CONFIGURATION†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging SpecificationBrochure, BRD8011/D.123456789(Bottom View)FUNCTIONAL PIN DESCRIPTIONSPin Function Description1Enable The device is enabled with a positive voltage signal at this pin. The enable controls both channels.2Dim This pin is used for analog or PWM dimming control. An analog signal of 0 – 3.3 volts is required, or a PWM signal with an amplitude greater than 3.3 volts. The dim controls both channels.3NC No connection.4GND Ground Reference to the device.5Source1Source terminal of the FET 16Drain1Drain terminal of the FET 1, which is also the switching node of the load 1.7Drain2Drain terminal of the FET 2, which is also the switching node of the load 2.8Source2Source terminal of the FET 29VCC Input voltage to the LED driver. This voltage is compatible with any battery based systems of up to 6 V.MAXIMUM RATINGSRating Symbol Value UnitInput Voltage, Operating Steady State (V CC to GND)Transient (1 ms)V CC-0.3 to 6-0.3 to 7VDrain Voltage, Operating Steady State (Drain-to-Source)Transient (1 ms)V DS-0.3 to 6-0.3 to 7VEnable Voltage, Operating Steady State V EN-0.3 to 6V Dim Voltage, Operating Steady State V dim-0.3 to 3.6V Drain Current, Peak I Dpk100mA Drain Current, Continuous I D(avg)30mA Thermal Resistance, Junction-to-Air (Note 1)Q JA365°C/WPower Dissipation @ T A = 25°C (Note 1) Derating above 25°C P max3402.7mWmW/°CHuman Body Model (HBM)Machine Model (MM)According to EIA/JESD22/A114, A115 Specifications ESD2000200VOperating Temperature Range T J-40 to 150°C Non-Operating Temperature Range T J-55 to 175°C Maximum Lead Temperature for Soldering Purposes (1.8” from case for 10 s)T L260°C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.Mounted onto minimum pad board.ELECTRICAL CHARACTERISTICS (Unless otherwise noted: V CC = 3.6 V, R sense = 4.7 W , 1%, T A = 25°C for typical values,For min/max values T J is the applicable junction temperature)CharacteristicsSymbolMinTypMaxUnitPower FET (Each Channel)ON Resistance (V CC = 3.6 V, I D = 10 mA, R sense = 4.7 W , V dim = 3.3 V)R DSon - 5.0 5.6W Zero Enable Voltage Drain Current (V DS = 6 V, V Enable = 0 V)I DSS -10100nA Drain-to-Source Sustaining Voltage (I D = 100 m A)V BRDSS7.0--V Output Capacitance (V DS = 6 V, V Enable = 0 V, f = 1 kHz)-100-pF Voltage Drop (Note 2)(V CC = 3.6 V, V LED = 3.3 V, I D = 20 mA, R sense = 4.7 W , V dim = 3.3 V)V drop --300mVCurrent Regulation Circuit (Each Channel)Output Current Regulation(V CC = 3.6 V, V LED = 3.3 V, R sense = 4.7 W , V dim = 3.3 V)I out192021mAEnableLogic Level High (Unit Operational)V ENhigh 1.7--V Logic Level Low (Unit Shutdown)V ENlow--0.7VDimOff Voltage (Zero Output Current), I D = 20 m A, R sense = 4.7 W V zero --50mV On Voltage (Max Output Current), I D = I out , R sense = 4.7 W V max 3.1 3.3 3.6V Max PWM Frequencyf max-10-kHzBias Supply (Complete Device)Bias Current (V CC = 3.6 V, Device Non-Operational, V Enable = 0 V)I BIAS1-10100nA Bias Current (V CC = 3.6 V, Device Operational, V Enable = V CC )I BIAS2-150250m A2.V drop = V DS + V RsenseRsense1Figure 2. Typical Low Voltage Application CircuitTYPICAL PERFORMANCE CURVES(T A = 255C, unless otherwise noted)Figure 5. Typical Current Regulation vs. V drop(V drop = V DS + V Rsense )V drop (V)0.300.150.100.0505.0101520I L E D (m A )I L E D (m A )0.200.25Figure 6. Typical Current Regulation vs. V dim(V LED = 3.4 V, R sense = 4.7 W )V dim (V)3.61.81.51.20.90.60.302.13.0 3.32.4 2.7Figure 7. Dimming Operation Curves (Graph obtained from SPICE simulations)AnalogDigital timeV DIM3.3 VI Limit I LEDI avgTheory of OperationThis device contains two LED current sources. Each channel is comprised of a lateral N-channel FET controlled by a current limit circuit that senses the voltage drop across the R sense resistor and compares it with an internal voltage reference to provide the current regulation. For dimming applications, the current limit circuit operates in combination with the PWM signal applied to the dim pin of the device for control purposes.Current Limit CircuitWith a DC voltage of 3.3 V applied to the Dim pin of the device, the internal reference voltage of the current limit circuit is set to 94 mV . The R sense resistor is then selected through a very simple formula: R sense = 94 mV / I LED . This allows the user to set different LED currents (between 1 mA and 30 mA). If different V dim voltage is used, then the I LED current will change according to the following formula:I LED +(V dim ń35)R senseDim CircuitFor dimming control, a PWM signal may be applied to the dim pin of the device. This PWM signal can be used to perform digital dimming.For digital dimming, the amplitude of the PWM signal must be 3.3 V or higher. The LED current will be proportional to the duty cycle of the PWM signal.For analog dimming, the input signal to the Dim pin must be between 0 V and 3.3 V . The resulting output current will be given by the previous I LED formula. It is important to mention that variations on the turn on point from part-to-part are expected due to the offset of the internal amplifiers. That is, some devices may turn on right after V dim = 50 mV and others until V dim is around 0.3 V .If a PWM signal is beyond the input frequency range for the Dim pin, a RC filter may be used to convert it to an analog signal.The RC filter generates an analog voltage signal, which is proportional to the duty cycle of the PWM signal applied.This analog signal is then used as the new reference voltage for the current limit circuit, which compares it with the voltage signal generated across R sense to provide the current regulation.EnableThe enable circuit turns the device on when a positive signal is applied to the enable pin. The circuit is designed to allow low current consumption (0.1 m A typical) when the device is disabled.LCD Backlighting ApplicationsThe voltage and current capability of the NUD4301device can be increased by using external FETs so that the circuit can be used in high voltage backlighting applications such as TV . Figure 8 shows the schematic diagram of this concept.Figure 8. Typical LCD Backlighting Application CircuitS2_TP D2_TP D1_TP S1_TPTable 1. PROPOSED BOM FOR THE CIRCUIT OF FIGURE 8Designator DescriptionCharacteristics Part Number Manufacturer R1, R2Leaded Resistor10 K, 1/2 W, 5%User Selectable User Selectable C1Ceramic SMT 1206 Capacitor 10 m F, 10 V User Selectable User Selectable Z1Zener Diode SOT-23 5.1 V, 300 mW BZX84C5V1LT1, G ON Semiconductor R3, R4SMT 0805 Resistor 4.7 W , 1%User Selectable User Selectable R5, R6SMT 0805 Resistor 560 K, 5%User Selectable User Selectable C2, C3Tantalum Leaded Capacitor 1 m F, 10 V User Selectable User Selectable Q1, Q2N-Channel FET SOT-2360 V, 115 mA 2N7002LT1G ON Semiconductor NUD4301Dual LED Driver, DFN 2x25 V, 30 mANUD4301ON SemiconductorFor more details about this application circuit concept, please refer to the application notes posted at the ON Semiconductor Web site in the NUD4301 page.PACKAGE DIMENSIONSDFN8CASE 506AQ-01ISSUE ABOTTOM VIEW8 Xǒmm inchesǓON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息: ONSEMINUD4301MNT1G。

LT4351CMS#PBF;LT4351IMS#PBF;LT4351CMS;LT4351CMS#TR;LT4351CMS#TRPBF;中文规格书,Datasheet资料

SYMBOL IOV VF(ON) IF(OFF) Boost Supply VBR tOFF ISWLIM Gate Drive VIOR ∆VGL ∆VG(MAX) VG(OFF) IGSO IGSK VDD IVDD Input-to-Output Regulated Voltage Gate Voltage Limit Maximum Gate Voltage Gate Off-Voltage Gate Source Current Gate Sink Current Operating Range VDD Supply Current VIN = 1.2V, VOUT = 1.1V, VDD = 12.3V, GATE Open VIN = 18V, VOUT = 17.9V, VDD = 29.1V, GATE Open VIN = 5V, VOUT = 4.9V, VDD = 13V Measured with Respect to VDD VIN = 5V, VOUT = 4.9V, VDD = 16.1V Measured with Respect to VOUT VOUT = 5.1V VOUT = 4.9V, VGATE = 9V VOUT = 5.1V, VGATE = 9V
TYPICAL APPLICATION
Dual 5V Redundant Supply
Si4862DY POWER SUPPLY 1 4.7µH 5V 10µF 1µF VIN MBR0530 MBR0530 24.9k 1% 232Ω 1% 1.47k 1% SW UV OV GND VDD LT4351 STATUS FAULT STATUS FAULT GND LT4351 1× 5V COMMON CLOAD LOAD 1× Si4862DY 5V 10µF 4.7µH POWER SUPPLY 2

M41000002P资料

Amendment +1 Issue Date September 5, 2002
元器件交易网
PRELIMINARY
Am41DL32x8G
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM DISTINCTIVE CHARACTERISTICS MCP Features
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any changes that have been made are the result of normal datasheet improvement and are noted in the document revision summary, where supported. Future routine revisions will occur when appropriate, and changes will be noted in a revision summary.
s WP#/ACC input pin
— Write protect (WP#) function allows protection of two outermost boot sectors, regardless of sector protect status — Acceleration (ACC) function accelerates program timing

41系列梅索尼兰调节阀中文说明书

5
注意：在进行填料函维修之前，必须将阀门从管线中隔离出来，并将压力排空。 A. 松开并取下填料法兰螺母（3）。 B. 沿阀杆向上提起填料法兰（4）和填料压紧环（23）。注：在进行下一步之前，提起了的填料法兰和填料压紧环可用胶带粘住以便它们不致掉落下来。 C. 使用填料钩除去填料（6）。注：只有在填料分隔环上面部分的旧填料可以用从阀盖上部拉出的方法卸除。 D. 更换填料（6）。请参照图 2 将规定数量的填料放置在填料分隔环（5）上面。注：相邻的两填料中的斜切口必须成 180°放置。 E. 重新装上填料压紧环（23）和填料法兰（4）。 F. 重新装上填料函螺拴上的螺母（3），并均匀地拧紧。注意：螺母不能拧得过紧 G. 将阀门再投入使用，并且只需把填料拧紧到防止漏的程度。注：在紧急情况下，串式填料仅可作为临时性的修理而使用，随后，应尽快地用正确的填料来取代串式填料。 7.2 埴料函—任选件润滑型（图 7）
7.1 密封函（标准型）… … … … … … … … … … … … … … … … … … … … … … … … … … … 5 7.2 密封函（任选件润滑型）… … … … … … … … … … … … … … … … … … … … … … … … 5 7.3 阀芯杆的销钉连接… … … … … … … … … … … … … … … … … … … … … … … … … … … 5 7.4 阀芯与阀座环… … … … … … … … … … … … … … … … … … … … … … … … … … … … … 5 7.5 阀芯套组装件… … … … … … … … … … … … … … … … … … … … … … … … … … … … … 5 8. 阀体重新装配… … … … … … … … … … … … … … … … … … … … … … … … … … … … … … 5,6 所有的图… … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … … 6-10

I ST D01说明书

本手册专为易检车服产品的使用而设计，对于将之用于指导其它设备操作而导致的各种后果，本公司不承担任何责任。

本手册及其包含的所有范例若有更改，恕不另行通知。

因使用者个人或第三方的意外事故，滥用、误用该设备，擅自更改、修理该设备，或未按易检车服公司的操作与保养要求而致使设备损坏、遗失所产生的费用及开支等，易检车服公司及其分支机构不承担任何责任。

对于使用其它选用配件或损耗品而非易检车服公司原装产品或易检车服公司认可之产品而导致该设备损坏或出现问题，易检车服公司不承担任何责任。

正式声明：本说明书所提及之其它产品名称，目的在于说明本设备如何使用，其注册商标所有权仍属原公司。

本设备供专业技术人员或维修人员使用。

注册商标易检车服公司已在中国及海外若干国家进行了商标注册，其标志为。

在易检车服公司之商标、服务标志、域名、图标和公司名称还未注册之国家，易检车服公司声明其对未注册商标、服务标志、域名、图标和公司名称仍享有其所有权。

本手册所提及之其它产品及公司名称的商标仍属于原注册公司所有。

在未得到拥有人的书面同意之前，任何人不得使用易检车服公司或所提及的其它公司之商标，服务标志，域名，图标，公司名称。

您可以访问网址：了解易检车服公司产品信息；或写信至：深圳市龙岗区坂田街道天安云谷产业园11栋3310客服服务中心，与易检车服公司进行联系，征得其手册使用权之书面同意。

III为了避免造成人身伤害、财产损失或对产品造成意外损坏，在使用产品前请阅读本章中的全部信息。

注意事项1．始终保持在安全的环境中进行车辆检测。

2．切勿在驾驶车辆的同时操作检测设备，以免分心造成车祸。

3．起动发动机前，应拉好手刹，特别应挡好前轮，并将变速杆置于空档（手动变速器）或[P]档位（自动变速器）以免起动发动机而使车辆冲出伤人。

F07A-0102,F10A-0102,F04B-0101, 规格书,Datasheet 资料

Integrated LCD
Each Fusion touch display includes an integrated LCD mechanically bonded to the touch sensor to create a single, easy-to-integrate module with high cosmetic quality. The Fusion touch firmware has been tuned to the LCD to ensure easy integration as a drop-in component.
1 mm center, 2 mm within 5 mm of edges 80–100 interrupts/sec. (single touch) Integrated on FPC (CoF) I2C (USB 2.0 Optional) Reference Driver for Linux, Android 6 pin ZIF
Benefits of Projected Capacitive Touch Technology
Touch Revolution’s Fusion displays offer a host of benefits over traditional touch sensor designs. In addition to improved optical transmittance, durable design, and integrated touch controllers; projective capacitive Fusion displays allow designers an out-of-the box experience with intuitive gesture capability, improved industrial design and a touch interface that is instantly recognizable by consumers.

DW-FP1说明书

智能管理系统指纹识别仪DW-FP1使用说明书深圳丽泽智能科技有限公司DW-FP1指纹仪有完善的用户权限管理。

但为了避免拥有管理权限的用户不在场，而客户又急需设置本系统，本系统特设了一个复位密码。

拥有复位密码的人可以进入系统将设备恢复到出厂时的设置。

特别注意事项：1、出厂时所有的DW-FP1 的复位密码均为888888888，客户在成功安装后，正式使用前，需自行修改此复位密码。

复位密码的长度为6～9位。

2、复位密码是在客户不得已的情况下才使用的。

若使用复位密码恢复出厂设置，则该系统中原有的用户数据将全部丢失，参数设置也将恢复成出厂时的设置。

需重新登记用户才可使用。

3、若遗忘了复位密码则只能回厂重新更新为缺省密码，但所有的数据将全部丢失。

主要技术参数指标：*注：这里所说的脱机使用是指通电后在指纹处理器上即可完成用户数据的登记与存储、系统信息的查询与设置、指纹数据的验证、日志信息的记录与存储、提示信息的显示等，这些工作不需要与PC联网就能完成.处理器输出维根信号，配合维根控制器可控制门锁的开合。

1 概述...................................................................................................................... - 1 -1.1 指纹门禁系统构成 ................................................................................... - 1 -1.2 指纹仪接线说明....................................................................................... - 1 -1.3 名词解释................................................................................................... - 1 -2 功能概述.............................................................................................................. -3 -2.1 界面语言选择........................................................................................... - 3 -2.2 系统复位功能........................................................................................... - 3 -2.3 设备管理功能........................................................................................... - 4 -2.3.1 用户管理........................................................................................ - 4 -2.3.1.1 增加用户 ............................................................................. - 4 -2.3.1.2 修改用户 ............................................................................. - 4 -2.3.1.3 删除用户 ............................................................................. - 4 -2.3.1.4 查看用户容量 ..................................................................... - 4 -2.3.2 日志查询........................................................................................ - 4 -2.3.3 系统管理........................................................................................ - 5 -2.3.3.1 设置时间和日期 ................................................................. - 5 -2.3.3.2 设置时段 ............................................................................. - 5 -2.3.3.3 设置验证模式 ..................................................................... - 5 -2.3.3.4 设置安全等级 ..................................................................... - 5 -2.3.3.5 设置通信参数 ..................................................................... - 5 -2.4 开门验证功能........................................................................................... - 6 -2.4.1 开门方式........................................................................................ - 6 -2.4.1.1 指纹开门 ............................................................................. - 6 -2.4.1.2 密码开门 ............................................................................. - 6 -2.4.1.3 指纹与密码开门 ................................................................. - 6 -2.4.1.4 手指关联开门 ..................................................................... - 6 -2.4.2 指纹验证的比对方式 .................................................................... - 6 -2.4.2.1 完整用户编号+ 指纹（1：1验证） ............................ - 7 -2.4.2.2 部分用户编号+ 指纹（1：X验证） ........................... - 7 -2.4.2.3 直接指纹验证（1：N验证） ......................................... - 7 -2.5 日志功能................................................................................................... - 7 -2.5.1 验证日志（最多16383条） ........................................................ - 7 -3 操作说明.............................................................................................................. - 7 -3.1 传感器的使用........................................................................................... - 7 -3.2 待机状态................................................................................................... - 8 -3.3 界面语言的选择....................................................................................... - 8 -3.4 系统复位功能........................................................................................... - 8 -3.4.1 修改复位密码 ................................................................................ - 9 -3.4.2 恢复出厂状态 ................................................................................ - 9 -3.5 空机状态下的超管登记 ......................................................................... - 10 -3.6 管理员进入管理菜单 ............................................................................. - 11 -3.6.1 用户管理菜单 .............................................................................. - 12 -3.6.1.1 增加用户 ........................................................................... - 12 -3.6.1.2 修改用户信息 ................................................................... - 14 -3.6.1.3 删除用户 ........................................................................... - 14 -3.6.1.4 查询用户容量 ................................................................... - 15 -3.6.2 日志查询菜单 .............................................................................. - 15 -3.6.3 系统管理菜单 .............................................................................. - 16 -3.6.3.1 安全设置 ........................................................................... - 16 -3.6.3.1.1 验证模式 ................................................................ - 16 -3.6.3.1.2 安全等级 ................................................................ - 17 -3.6.3.1.3 报警韦根 ................................................................ - 17 -3.6.3.1.4 离线报警 ................................................................ - 17 -3.6.3.2 通信设置 ........................................................................... - 17 -3.6.3.2.1 节点号 .................................................................... - 17 -3.6.3.2.2 通信密码 ................................................................ - 17 -3.6.3.2.3 波特率 .................................................................... - 18 -3.6.3.3 时钟与时段 ....................................................................... - 18 -3.6.3.3.1 设置日期 ................................................................ - 18 -3.6.3.3.2 设置时间 ................................................................ - 19 -3.6.3.3.3 设置时段 ................................................................ - 19 -3.7 普通用户查看日志 ................................................................................. - 20 -3.8 使用指纹进行开门验证 ......................................................................... - 20 -3.9 使用密码进行开门验证 ......................................................................... - 21 -3.10 系统版本信息查询 ............................................................................... - 22 -1概述DW-FP1 指纹仪最多可存储1000个用户数据，每个用户最多可登记3枚指纹，即本系统最多可存储3000枚指纹；1.1指纹门禁系统构成处理器：它实现了用户数据的登记与存储、系统信息的查询与设置、指纹数据的验证、日志信息的记录与存储、提示信息的显示等。

TDA7851F, 规格书,Datasheet 资料

This is information on a product in full production.June 2012Doc ID 17714 Rev 21/15TDA7851F4 x 48 W MOSFET quad bridge power amplifierDatasheet − production dataFeatures■Multipower BCD technology■High output power capability:–4 x 48 W/4 Ω max.–4 x 28 W/4 Ω @ 14.4 V , 1 kHz, 10 %–4 x 72 W/2 Ω max.■MOSFET output power stage ■Excellent 2 Ω driving capability ■Hi-Fi class distortion ■Low output noise ■Standby function ■Mute function■Automute at min. supply voltage detection ■Low external component count:–Internally fixed gain (26 dB)–No external compensation –No bootstrap capacitors ■Output DC offset detector■Protections:–Output short circuit to GND, to V s , across the load–Very inductive loads–Overrating chip temperature with soft thermal limiter–Load dump voltage–Reversed battery –ESDDescriptionThe TDA7851F is a breakthrough MOSFET technology class AB audio power amplifier, designed for high-power car radio.The fully complementary P-Channel/N-Channel output structure allows a rail-to-rail output voltage swing. This, combined with high output current and minimized saturation losses, sets new power references in the car-radio field, with unparalleled distortion performance.Table 1. Device summaryOrder code Package Packing TDA7851FFlexiwatt25TubeList of tables TDA7851F List of tablesTable 2.Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3.Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4.Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5.Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/15Doc ID 17714 Rev 2TDA7851F List of figures List of figuresFigure 1.Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2.Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3.Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4.Quiescent current vs. supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 5.Output power vs. supply voltage (R L = 4 Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 6.Output power vs. supply voltage (R L = 2 Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 7.Distortion vs. output power (R L = 4 Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 8.Distortion vs. output power (R L = 2 Ω) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 9.Distortion vs. frequency (R L = 4 Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 10.Distortion vs. frequency (R L = 2 Ω). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 11.Crosstalk vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 12.Supply voltage rejection vs. frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 13.Output attenuation vs. supply voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 14.Power dissipation and efficiency vs. output power (R L = 4 Ω, SINE). . . . . . . . . . . . . . . . . 10 Figure 15.Power dissipation and efficiency vs. output power (R L = 2 Ω, SINE). . . . . . . . . . . . . . . . . 10 Figure 16.Power dissipation vs. output power (R L = 4 Ω, audio program simulation) . . . . . . . . . . . . 11 Figure 17.Power dissipation vs. output power (R L = 2 Ω, audio program simulation) . . . . . . . . . . . . 11 Figure 18.ITU R-ARM frequency response, weighting filter for transient pop. . . . . . . . . . . . . . . . . . . 11 Figure 19.Flexiwatt25 mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Doc ID 17714 Rev 23/15Contents TDA7851FContents1Block diagram and application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.1Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.2Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.1Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.2Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73.2Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73.3Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124.1SVR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124.2Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124.3Standby and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124.4Heatsink definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144/15Doc ID 17714 Rev 2TDA7851F Block diagram and application circuitDoc ID 17714 Rev 25/151 Block diagram and application circuit1.1 Block diagram1.2 Application circuitPin description TDA7851F6/15Doc ID 17714 Rev 22 Pin description2.1 Pin connection2.2 Thermal dataTable 2.Thermal dataSymbol ParameterValue Unit R th j-caseThermal resistance junction-to-casemax1°C/WTDA7851F Electrical specificationsDoc ID 17714 Rev 27/153 Electrical specifications3.1Absolute maximum ratings3.2 Electrical characteristicsRefer to the test and application diagram, V S = 14.4 V; R L = 4Ω; R g = 600 Ω; f = 1 kHz;T amb = 25 °C; unless otherwise specified.Table 3.Absolute maximum ratingsSymbol ParameterValue Unit V S Operating supply voltage 18V V S (DC)DC supply voltage28V V S (pk)Peak supply voltage (for t = 50 ms)50V I O Output peak currentNon repetitive (t = 100 μs)Repetitive (duty cycle 10 % at f = 10 Hz)109A A P tot Power dissipation T case = 70 °C 85W T j Junction temperature 150°C T stgStorage temperature-55 to 150°CTable 4.Electrical characteristicsSymbol ParameterTest conditionMin. Typ.Max.Unit V S Supply voltage range -8-18V I q1Quiescent current R L = ∞100150300mA V OSOutput offset voltagePlay mode / Mute mode-60-+60mV dV OSDuring mute ON/OFF output offset voltage ITU R-ARM weightedsee Figure 18-10-+10mV During standby ON/OFF outputoffset voltage -10-+10mV G v Voltage gain-252627dB dG vChannel gain unbalance-±1dB P o Output powerV S = 14.4 V; THD = 10 %V S = 14.4 V; THD = 1 %252822-W W V S = 14.4 V; THD = 10 %, 2 ΩV S = 14.4 V; THD = 1 %, 2 Ω-4838-W WP o max.Max. output power (1)V S = 14.4 V; R L = 4 ΩV S = 14.4 V; R L = 2 Ω;Vs = 15.2V; R L = 4 Ω (square wave input (2 Vrms))-457548-WElectrical specifications TDA7851F8/15Doc ID 17714 Rev 2THDDistortionP o = 4 W-0.010.05%e No Output noise "A" WeightedBw = 20 Hz to 20 kHz -3550100μV μV SVR Supply voltage rejection f = 100 Hz; V r = 1 Vrms 5070-dB f ch High cut-off frequency P O = 0.5W 100300-kHz R i Input Impedance -70100130k ΩC T Cross talkf = 1 kHz P O = 4 W f = 10 kHz P O = 4 W 607060--dB dB I SB Standby current consumption V St-B y = 1.2 V --20μA V St-B y = 0--10μA I pin5Standby pin currentV St-By = 1.2 V to 2.6 V --±1μA V SB out Standby out threshold voltage (Amp: ON) 2.6-V V SB in Standby in threshold voltage (Amp: OFF)-- 1.2V A M Mute attenuationP Oref = 4 W 8090dB V M out Mute out threshold voltage (Amp: Play) 2.6-V V M inMute in threshold voltage(Amp: Mute)-- 1.2V V AM in V S automute threshold(Amp: Mute)Att ≥ 80 dB; P Oref = 4 W(Amp: Play)Att < 0.1 dB; P O = 0.5 W6.777.58VV Ipin23Muting pin currentV MUTE = 1.2 V (Sourced current)71218μA V MUTE = 2.6 V-5-18μAOffset detector V OFFDetected diff. output offsetV ST -BY = 5 V±1±2±3V V OFF_SAT Off detector sat voltage Vo > ±3 V , I off Det = 1 mA 0 V < V off Det < 18 V -0.20.4V V OFF_LKOff detector leakage currentVo < ±1 V-015µA1.Saturated square wave outputTable 4.Electrical characteristics (continued)Symbol ParameterTest conditionMin. Typ.Max.UnitTDA7851F Electrical specificationsDoc ID 17714 Rev 29/153.3 Electrical characteristics curvesFigure 4.Quiescent current vs. supplyFigure 5.Output power vs. supply voltage Figure 6.Output power vs. supply voltageFigure 7.Distortion vs. output power Figure 8.Distortion vs. output powerFigure 9.Distortion vs. frequencyElectrical specifications TDA7851F10/15Doc ID 17714 Rev 2Figure 10.Distortion vs. frequencyFigure 11.Crosstalk vs. frequencyFigure 12.Supply voltage rejection vs.Figure 13.Output attenuation vs. supplyFigure 14.Power dissipation and efficiencyFigure 15.Power dissipation and efficiency vs.TDA7851F Electrical specificationsDoc ID 17714 Rev 211/15Figure 16.Power dissipation vs. output powerFigure 17.Power dissipation vs. output powerFigure 18.ITU R-ARM frequency response,Application hints TDA7851F12/15Doc ID 17714 Rev 24 Application hints4.1 SVRBesides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFFtime sequence and, consequently, plays an essential role in the pop optimization during ON/OFF transients.T o conveniently serve both needs, its minimum recommended value is 10 µF .4.2 Input stageThe TDA7851's inputs are ground-compatible and can stand very high input signals(±8Vpk) without any performance degradation.If the standard value for the input capacitors (0.1 µF) is adopted, the low frequency cut-off amounts to 16 Hz.The input capacitors should be 1/4 of the capacitor connected to AC-GND pin for optimum pop performance.4.3 Standby and mutingStandby and muting facilities are both CMOS-compatible. In absence of true CMOS ports ormicroprocessors, a direct connection to Vs of these two pins is admissible but a 470k Ω equivalent resistance should be present between the power supply and muting and standby pins.R-C cells have always to be used in order to smooth down the transitions for preventing any audible transient noise.About standby, the time constant to be assigned in order to obtain a virtually pop-free transition has to be slower than 2.5 V /ms.4.4 Heatsink definitionUnder normal usage (4 Ohm speakers) the heatsink's thermal requirements have to bededuced from Figure 16, which reports the simulated power dissipation when realmusic/speech programmes are played out. Noise with gaussian-distributed amplitude was employed for this simulation. Based on that, frequent clipping occurrence (worst-case) causes P diss = 26 W. Assuming T amb = 70 °C and T CHIP = 150 °C as boundary conditions, the heatsink's thermal resistance should be approximately 2 °C/W. This would avoid any thermal shutdown occurrence even after long-term and full-volume operation.TDA7851F Package informationDoc ID 17714 Rev 213/155 Package informationIn order to meet environmental requirements, ST offers these devices in different grades ofECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: .ECOPACK ® is an ST trademark.Revision history TDA7851F14/15Doc ID 17714 Rev 26 Revision historyTable 5.Document revision historyDate RevisionChanges09-Jul-20101Initial release.13-Jun-20122Updated Features on page 1;Updated Section 3.2: Electrical characteristics on page 7.TDA7851FPlease Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2012 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of AmericaDoc ID 17714 Rev 215/15。