HY5V58BLF-8中文资料

HY5V58B(L)F4Banks x 8M x 8bits Synchronous DRAM This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for DESCRIPTIONThe Hynix HY5V58B(L)F is a 268,435,456bit CMOS Synchronous DRAM, ideally suited for the main memory applica-tions which require large memory density and high bandwidth. HY5V58B(L)F is organized as 4banks of 8,388,608x8.HY5V58B(L)F is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output voltage levels are compatible with LVTTL.Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(sequential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)FEATURES•Single 3.3±0.3V power supply•All device Balls are compatible with LVTTL interface•54Ball FBGA With 0.8mm of ball pitch•All inputs and outputs referenced to positive edge ofsystem clock•Data mask function by DQM•Internal four banks operation•Auto refresh and self refresh•8192 refresh cycles / 64ms•Programmable Burst Length and Burst Type- 1, 2, 4, 8 or Full Page for Sequential Burst- 1, 2, 4 or 8 for Interleave Burst•Programmable CAS Latency ; 2, 3 Clocks ORDERING INFORMATIONPart No.Clock Frequency Power Organization Interface PackageHY5V58BF-H133MHzNormal4Banks x 8Mbitsx8LVTTL54ball FBGA HY5V58BF-8125MHzHY5V58BF-P100MHzHY5V58BF-S100MHzHY5V58B(L)F-H133MHzLow powerHY5V58B(L)F-8125MHzHY5V58B(L)F-P100MHzHY5V58B(L)F-S100MHzHY5V58B(L)FBALL CONFIGURATIONA B C D E F G H J54 Ball FBGA 0.8 mm Ball PitchVSS DQ7VSSQ NC DQ6VDDQ NC DQ5VSSQ NC DQ4VDDQ NC CLK VSS DQM A11CKE A12A9A8A7A6VSSA5A4NC 1 2 3 A B C D E F G H JVDDQ VDDQ VSSQ VSSQ VDD DQ0VDD VDDDQ1NC DQ2NC DQ3NC NC NC /CAS /RAS /WE A3A2A0A1A10/CS BA0BA1 7 8 9 987321< Top View >< Bottom View >HY5V58B(L)F Ball DESCRIPTIONBall Ball NAME DESCRIPTIONCLK Clock The system clock input. All other inputs are registered to the SDRAM on the rising edge of CLKCKE Clock Enable Controls internal clock signal and when deactivated, the SDRAM will be one of the states among power down, suspend or self refreshCS Chip Select Enables or disables all inputs except CLK, CKE and DQMBA0, BA1Bank Address Selects bank to be activated during RAS activity Selects bank to be read/written during CAS activityA0 ~ A12Address Row Address : RA0 ~ RA12, Column Address : CA0 ~ CA9 Auto-precharge flag : A10RAS, CAS, WE Row Address Strobe, Col-umn Address Strobe, WriteEnableRAS, CAS and WE define the operationRefer function truth table for detailsDQM Data Input/Output Mask Controls output buffers in read mode and masks input data in write mode DQ0 ~ DQ7Data Input/Output Multiplexed data input / output BallV DD/V SS Power Supply/Ground Power supply for internal circuits and input buffersV DDQ/V SSQ Data Output Power/Ground Power supply for output buffersNC No Connection No connectionFUNCTIONAL BLOCK DIAGRAM4Mbit x 4banks x 8 I/O Synchronous DRAMABSOLUTE MAXIMUM RATINGSNote : Operation at above absolute maximum rating can adversely affect device reliability.DC OPERATING CONDITION (T A =0 to 70°C )Note :1.All voltages are referenced to V SS = 0V2.V IH (max) is acceptable 5.6V AC pulse width with <=3ns of duration.3.V IL (min) is acceptable -2.0V AC pulse width with <=3ns of duration.AC OPERATING TEST CONDITION (T A =0 to 70°C , V DD =3.3±0.3V, V SS =0V)Note :1.Output load to measure access times is equivalent to two TTL gates and one capacitor (50pF). For details, refer to AC/DC output load circuitParameterSymbolRatingUnitAmbient Temperature T A 0 ~ 70°C Storage TemperatureT STG -55 ~ 125°C Voltage on Any Ball relative to V SS V IN , V OUT -1.0 ~ 4.6V Voltage on V DD relative to V SS V DD, V DDQ -1.0 ~ 4.6V Short Circuit Output Current I OS 50mA Power DissipationP D 1W Soldering Temperature ⋅ TimeT SOLDER260 ⋅ 10°C ⋅ SecParameterSymbol Min Typ Max Unit Note Power Supply Voltage V DD , V DDQ 3.0 3.3 3.6V 1Input High voltage V IH 2.0 3.0V DDQ + 0.3V 1,2Input Low voltageV IL-0.30.8V1,3ParameterSymbol Value Unit NoteAC Input High / Low Level VoltageV IH / V IL 2.4/0.4V Input Timing Measurement Reference Level Voltage Vtrip 1.4V Input Rise / Fall TimetR / tF 1ns Output Timing Measurement Reference Level Voltage Voutref 1.4V Output Load Capacitance for Access Time MeasurementC L50pF1CAPACITANCE (T A =25°C , f=1MHz)DC CHARACTERISTICS I (T A =0 to 70°C , V DD =3.3±0.3V)Note :1.V IN = 0 to 3.6V, All other Balls are not under test = 0V2.D OUT is disabled, V OUT =0 to3.6VParameterBallSymbol-H-8/P/SUnitMin.Max.Min.Max.Input CapacitanceCLKC I1 2.5 3.5 2.5 3.5pF A0 ~ A11, BA0, BA1, CKE, CS, RAS, CAS, WE, DQMCI 2 2.5 3.8 2.5 3.8pF Data Input / Output CapacitanceDQ0 ~ DQ7C I/O4.06.54.06.5pFParameterSymbolMin.Max Unit Note Input Leakage Current I LI -11uA 1Output Leakage Current I LO -11uA 2Output High Voltage V OH 2.4-V I OH = -2mA Output Low VoltageV OL-0.4VI OL =+2mADC CHARACTERISTICS II (T A =0 to 70°C , V DD =3.3±0.3V, V SS =0V)Note :1.I DD1 and I DD4 depend on output loading and cycle rates. Specified values are measured with the output open.2.Min. of tRRC (Refresh RAS cycle time) is applied to HY5V58B(L)F-H/8/P/S which are listed on AC characteristic II.3.HY5V58BF-H/8/P/S4.HY5V58BLF-H/8/P/SParameterSymbolTest ConditionSpeedUnitNote-H-8-P -S Operating CurrentI DD1Burst length=1, One bank active t RC ≥ t RC (min), I OL =0mA 120120110110mA1Precharge Standby Current in Power Down ModeI DD2P CKE ≤ V IL (max), t CK = 15ns 2mAI DD2PSCKE ≤ V IL (max), t CK = ∞1Precharge Standby Current in Non Power Down ModeI DD2NCKE ≥ V IH (min), CS ≥ V IH (min), t CK = 15ns Input signals are changed one time during 30ns. All other balls ≥ V DD -0.2V or ≤ 0.2V 15mAI DD2NSCKE ≥ V IH (min), t CK = ∞Input signals are stable.15Active Standby Current in Power Down ModeI DD3P CKE ≤ V IL (max), t CK = 15ns 5mAI DD3PSCKE ≤ V IL (max), t CK = ∞5Active Standby Current in Non Power Down ModeI DD3NCKE ≥ V IH (min), CS ≥ V IH (min), t CK = 15ns Input signals are changed one time during 30ns. All other balls ≥ V DD -0.2V or ≤ 0.2V 30mAI DD3NSCKE ≥ V IH (min), t CK = ∞Input signals are stable.20Burst Mode Operating CurrentI DD4t CK ≥ t CK (min), I OL =0mA All banks activeCL=3130130110110mA1CL=2140140120120Auto Refresh Current I DD5t RRC ≥ t RRC (min), All banks active220200200200mA 2Self Refresh CurrentI DD6CKE ≤ 0.2VNormal3mA 3Low Power1.5mA4AC CHARACTERISTICS I (AC operating conditions unless otherwise noted)Note :1.Assume tR / tF (input rise and fall time ) is 1nsIf tR & tF > 1ns, then [(tR+tF)/2-1]ns should be added to the parameter2.Access times to be measured with input signals of 1v/ns edge rate, from 0.8v to 2.0v If tR > 1ns, then (tR/2-0.5)ns should be added to the parameterParameterSymbol-H-8-P-SUnitNoteMinMaxMin MaxMin MaxMin MaxSystem Clock Cycle TimeCAS Latency = 3tCK37.5100081000101000101000nsCAS Latency = 2tCK210101012ns Clock High Pulse Width tCHW 2.5-3-3-3-ns 1Clock Low Pulse Width tCLW 2.5-3-3-3-ns 1Access Time From ClockCAS Latency = 3tAC3- 5.4-6-6-6ns2CAS Latency = 2tAC2-6-6-6-6ns Data-Out Hold Time tOH 2.7-3-3-3-ns Data-Input Setup Time tDS 1.5-2-2-2-ns 1Data-Input Hold Time tDH 0.8-1-1-1-ns 1Address Setup Time tAS 1.5-2-2-2-ns 1Address Hold Time tAH 0.8-1-1-1-ns 1CKE Setup Time tCKS 1.5-2-2-2-ns 1CKE Hold TimetCKH 0.8-1-1-1-ns 1Command Setup Time tCS 1.5-2-2-2-ns 1Command Hold TimetCH 0.8-1-1-1-ns 1CLK to Data Output in Low-Z Time tOLZ 1-1-1-1-ns CLK to DataOutput in High-Z TimeCAS Latency = 3tOHZ32.7 5.4363636ns CAS Latency =2tOHZ236363636nsAC CHARACTERISTICS IINote :1. A new command can be given tRRC after self refresh exit.ParameterSymbol-H-8-P-SUnitNoteMinMax Min Max Min Max Min Max RAS Cycle TimeOperationtRC65-68-70-70-nsAuto RefreshtRRC 65-68-70-70-ns RAS to CAS Delay tRCD 20-20-20-20-ns RAS Active Time tRAS 45100K 48100K 50100K 50100K ns RAS Precharge TimetRP 20-20-20-20-ns RAS to RAS Bank Active Delay tRRD 15-16-20-20-ns CAS to CAS DelaytCCD 1-1-1-1-CLK Write Command to Data-In Delay tWTL 0-0-0-0-CLK Data-In to Precharge Command tDPL 2-2-2-2-CLK Data-In to ActiveCommand tDAL 5-5-5-5-CLK DQM to Data-Out Hi-ZtDQZ 2-2-2-2-CLK DQM to Data-In Mask tDQM 0-0-0-0-CLK MRS to New Command tMRD 2-2-2-2-CLK Precharge to Data Output Hi-ZCAS Latency = 3tPROZ33-3-3-3-CLK CAS Latency = 2tPROZ22-2-2-2-CLK Power Down Exit Time tPDE 1-1-1-1-CLK Self Refresh Exit Time tSRE 1-1-1-1-CLK 1Refresh TimetREF-64-64-64-64msIBIS SPECIFICATIONI OH Characteristics (Pull-up) 66MHz and 100MHz Pull-upVoltage 100MHzMin100MHzMax66MHzMin(V)I (mA)I (mA)I (mA)3.45-2.43.3-27.33.00.0-74.1-0.72.6-21.1-129.2-7.52.4-34.1-153.3-13.32.0-58.7-197.0-27.51.8-67.3-226.2-35.51.65-73.0-248.0-41.11.5-77.9-269.7-47.91.4-80.8-284.3-52.41.0-88.6-344.5-72.50.0-93.0-502.4-93.0I OL Characteristics (Pull-down)66MHz and 100MHz Pull-downVoltage 100MHzMin100MHzMax66MHzMin(V)I (mA)I (mA)I (mA) 0.00.00.00.0 0.427.570.217.7 0.6541.8107.526.90.8551.6133.833.31.058.0151.237.6 1.470.7187.746.6 1.572.9194.448.0 1.6575.4202.549.5 1.877.0208.650.7 1.9577.6212.051.53.080.3219.654.2 3.4581.4222.654.9V DD Clamp @ CLK, CKE, CS, DQM & DQ V DD (V)I(mA)0.00.00.20.00.40.00.60.00.70.00.80.00.90.01.00.231.2 1.341.4 3.021.6 5.061.87.352.09.832.212.482.415.302.618.31V SS Clamp @ CLK, CKE, CS, DQM & DQ V SS (V)I (mA)-2.6-57.23-2.4-45.77-2.2-38.26-2.0-31.22-1.8-24.58-1.6-18.37-1.4-12.56-1.2-7.57-1.0-3.37-0.9-1.75-0.8-0.58-0.7-0.05-0.60.0-0.40.0-0.20.0 0.00.0 Minimum V DD clamp current (Referenced to V DD)Minimum V SS clamp currentDEVICE OPERATING OPTION TABLE HY5V58B(L)F-HHY5V58B(L)F-8 HY5V58B(L)F-P HY5V58B(L)F-S CAS Latency tRCD tRAS tRC tRP tAC tOH133MHz(7.5ns)3CLKs3CLKs6CLKs9CLKs3CLKs 5.4ns 2.7ns 125MHz(8ns)3CLKs3CLKs6CLKs9CLKs3CLKs6ns3ns 100MHz(10ns)2CLKs2CLKs5CLKs7CLKs2CLKs6ns3nsCAS Latency tRCD tRAS tRC tRP tAC tOH 125MHz(8ns)3CLKs3CLKs6CLKs9CLKs3CLKs6ns3ns 100MHz(10ns)2CLKs2CLKs5CLKs7CLKs2CLKs6ns3ns 83MHz(12ns)2CLKs2CLKs4CLKs6CLKs2CLKs6ns3nsCAS Latency tRCD tRAS tRC tRP tAC tOH 100MHz(10ns)2CLKs2CLKs5CLKs7CLKs2CLKs6ns3ns 83MHz(12ns)2CLKs2CLKs5CLKs7CLKs2CLKs6ns3ns 66MHz(15ns)2CLKs2CLKs4CLKs6CLKs2CLKs6ns3nsCAS Latency tRCD tRAS tRC tRP tAC tOH 100MHz(10ns)3CLKs2CLKs5CLKs7CLKs2CLKs6ns3ns 83MHz(12ns)2CLKs2CLKs5CLKs7CLKs2CLKs6ns3ns 66MHz(15ns)2CLKs2CLKs4CLKs6CLKs2CLKs6ns3nsCOMMAND TRUTH TABLENote :1. OP Code : Operand Code2. V = Valid, X = Dont care, H = Logic High, L= Logic Low, RA = Row Address, CA = Column Address.3. The burst read sigle write mode is entered by programming the write burst mode bit (A9) in the mode register to a logic 1.CommandCKEn-1CKEn CS RAS CAS WE DQM ADDRA10/AP BA Note Mode Register Set H X L L L L X OP code1No Operation H XH X X XXX LH H H Bank Active HX L L H H X RAV ReadHXLHLHXCALVRead with Autoprecharge H WriteHX L H L L X CALV Write with Autoprecharge H Precharge All BanksHXLLHLXXHX Precharge selected Bank L VBurst Stop H XLH HLX X DQM H X V X Auto Refresh H H L L L H X XBurst-Read-Single-WRITEH X L L L L X A9 Ball High(Other Balls OP code)MRSModeSelf RefreshEntryHLL L L H XXExitLHHXXXXL H H H Precharge power downEntryHLHXXXXXL H H HExitLHHXXXXL H H H Clock SuspendEntry H LHXXXXXLVVVExitLHXXPACKAGE INFORMATION54 Ball 0.8mm pitch 8.0mm x 13.5mm FBGA13.50 6.400.808.000.806.401.0700.3400.450。