M29W256GL7AN6E

Parallel NOR Flash Embedded Memory M29W256GH, M29W256GLFeatures•Supply voltage–V CC = 2.7–3.6V (program, erase, read)–V CCQ = 1.65–3.6V (I/O buffers)–V PPH = 12V for fast program (optional)•Asynchronous random/page read–Page size: 8words or 16 bytes–Page access: 25, 30ns–Random access: 60ns1, 70, 80ns•Fast program commands: 32-word (64-byte) write buffer•Enhanced buffered program commands: 256-word •Program time–16µs per byte/word TYP–Chip program time: 10s with V PPH and 16s with-out V PPH•Memory organization–Uniform blocks: 256 main blocks, 128-Kbytes or 64-Kwords each•Program/erase controller–Embedded byte/word program algorithms •Program/erase suspend and resume capability–Read from any block during a PROGRAM SUS-PEND operation–Read or program another block during an ERASE SUSPEND operation•Unlock bypass, block erase, chip erase, write to buf-fer and program–Fast buffered/batch programming–Fast block/chip erase •V PP/WP# pin protection–Protects first or last block regardless of block protection settings•Software protection–Volatile protection–Nonvolatile protection–Password protection•Extended memory block–128-word (256-byte) memory block for perma-nent, secure identification–Programmed or locked at the factory or by the customer•Common flash interface–64-bit security code•Low power consumption: Standby and automatic mode•JESD47H-compliant–100,000 minimum PROGRAM/ERASE cycles per block–Data retention: 20 years (TYP)•65nm single-level cell (SLC) process technology •Fortified BGA, TBGA, and TSOP packages •Green packages available–RoHS-compliant–Halogen-free•Automotive device grade (6): temperature –40°C to +85°C (automotive grade certified)•Automotive device grade (3): temperature –40°C to +125°C (automotive grade certified)Note: 1.The 60ns device is available upon customer request.Part Numbering InformationAvailable with extended memory block prelocked by Micron. Devices are shipped from the factory with memory content bits erased to 1. For available options, such as packages or high/low protection, or for further information, contact your Micron sales representative. Part numbers can be verified at . Feature and specifica-tion comparison by device type is available at /products. Contact the factory for devices not found.Table 1: Part Number InformationNotes: 1.80ns if VCCQ = 1.65V to VCC.2.The 60ns device is available upon customer request.3.Automotive qualified, available only with option 6. Qualified and characterized according to AEC Q100 andQ003 or equivalent; advanced screening according to AEC Q001 and Q002 or equivalent.ContentsGeneral Description (7)Signal Assignments (8)Signal Descriptions (23)Memory Organization (24)Memory Configuration (24)Memory Map – 256Mb Density (24)Bus Operations (25)Read (25)Write (25)Standby and Automatic Standby (25)Output Disable (26)Reset (26)Registers (27)Status Register (27)Lock Register (32)Standard Command Definitions – Address-Data Cycles (34)READ Operations (36)READ/RESET Command (36)READ CFI Command (36)AUTO SELECT Operations (37)AUTO SELECT Command (37)Bypass Operations (40)UNLOCK BYPASS Command (40)UNLOCK BYPASS RESET Command (40)Program Operations (41)PROGRAM Command (41)UNLOCK BYPASS PROGRAM Command (41)WRITE TO BUFFER PROGRAM Command (41)UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command (44)WRITE TO BUFFER PROGRAM CONFIRM Command (44)BUFFERED PROGRAM ABORT AND RESET Command (44)PROGRAM SUSPEND Command (44)PROGRAM RESUME Command (45)ENTER and EXIT ENHANCED BUFFERED PROGRAM Command (45)ENHANCED BUFFERED PROGRAM Command (45)ENHANCED BUFFERED PROGRAM ABORT AND RESET Command (48)Erase Operations (49)CHIP ERASE Command (49)UNLOCK BYPASS CHIP ERASE Command (49)BLOCK ERASE Command (49)UNLOCK BYPASS BLOCK ERASE Command (50)ERASE SUSPEND Command (50)ERASE RESUME Command (51)Block Protection Command Definitions – Address-Data Cycles (52)Protection Operations (55)LOCK REGISTER Commands (55)PASSWORD PROTECTION Commands (55)NONVOLATILE PROTECTION Commands (55)NONVOLATILE PROTECTION BIT LOCK BIT Commands (57)VOLATILE PROTECTION Commands (57)EXTENDED MEMORY BLOCK Commands (57)EXIT PROTECTION Command (58)Device Protection (59)Hardware Protection (59)Software Protection (59)Volatile Protection Mode (60)Nonvolatile Protection Mode (60)Password Protection Mode (61)Common Flash Interface (62)Power-Up and Reset Characteristics (66)Absolute Ratings and Operating Conditions (69)DC Characteristics (71)Read AC Characteristics (73)Write AC Characteristics (76)Accelerated Program, Data Polling/Toggle AC Characteristics (83)Program/Erase Characteristics (85)Package Dimensions (86)Revision History (89)Rev. B – 05/13 (89)Rev. A – 05/12 (89)List of FiguresFigure 1: Logic Diagram (7)Figure 2: 44-Pin SO (Top View) (8)Figure 3: 44-Pin SO (Top View) (8)Figure 4: 48-Pin TSOP (Top View) (9)Figure 5: 48-Pin TSOP (Top View) (10)Figure 6: 48-Pin TSOP (Top View) (10)Figure 7: 48-Pin TSOP (Top View) (11)Figure 8: 56-Pin TSOP (Top View) (12)Figure 9: 56-Pin TSOP (Top View) (12)Figure 10: 56-Pin TSOP (Top View) (13)Figure 11: 48-Ball Fortified BGA and 48-Ball TBGA (15)Figure 12: 48-Ball Fortified BGA and 48-Ball TBGA (16)Figure 13: 48-Ball Fortified BGA and 48-Ball TBGA (17)Figure 14: 48-Ball Fortified BGA and 48-Ball TBGA (18)Figure 15: 64-Ball Fortified BGA and 64-Ball TBGA (19)Figure 16: 64-Ball Fortified BGA and 64-Ball TBGA (20)Figure 17: 64-Ball Fortified BGA and 64-Ball TBGA (21)Figure 18: 64-Ball Fortified BGA and 64-Ball TBGA (22)Figure 19: Data Polling Flowchart (29)Figure 20: Toggle Bit Flowchart (30)Figure 21: Status Register Polling Flowchart (31)Figure 22: Lock Register Program Flowchart (33)Figure 23: WRITE TO BUFFER PROGRAM Flowchart (43)Figure 24: ENHANCED BUFFERED PROGRAM Flowchart (47)Figure 25: Program/Erase Nonvolatile Protection Bit Algorithm (56)Figure 26: Software Protection Scheme (61)Figure 27: Power-Up Timing (66)Figure 28: Reset AC Timing – No PROGRAM/ERASE Operation in Progress (67)Figure 29: Reset AC Timing During PROGRAM/ERASE Operation (68)Figure 30: AC Measurement Load Circuit (70)Figure 31: AC Measurement I/O Waveform (70)Figure 32: Random Read AC Timing (8-Bit Mode) (74)Figure 33: Random Read AC Timing (16-Bit Mode) (74)Figure 34: Page Read AC Timing (16-Bit Mode) (75)Figure 35: WE#-Controlled Program AC Timing (8-Bit Mode) (77)Figure 36: WE#-Controlled Program AC Timing (16-Bit Mode) (78)Figure 37: CE#-Controlled Program AC Timing (8-Bit Mode) (80)Figure 38: CE#-Controlled Program AC Timing (16-Bit Mode) (81)Figure 39: Chip/Block Erase AC Timing (8-Bit Mode) (82)Figure 40: Accelerated Program AC Timing (83)Figure 41: Data Polling AC Timing (84)Figure 42: Toggle/Alternative Toggle Bit Polling AC Timing (8-Bit Mode) (84)Figure 43: 56-Pin TSOP – 14mm x 20mm (86)Figure 44: 64-Pin TBGA – 10mm x 13mm (87)Figure 45: 64-Ball Fortified BGA – 11mm x 13mm (88)List of TablesTable 1: Part Number Information (2)Table 2: Signal Descriptions (23)Table 3: 256Mb, Blocks[255:0] (24)Table 4: Bus Operations (25)Table 5: Status Register Bit Definitions (27)Table 6: Operations and Corresponding Bit Settings (28)Table 7: Lock Register Bit Definitions (32)Table 8: Block Protection Status (32)Table 9: Standard Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit (34)Table 10: Read Electronic Signature (37)Table 11: Block Protection (39)Table 12: Block Protection Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit (52)Table 13: Extended Memory Block Address and Data (57)Table 14: V PP/WP# Functions (59)Table 15: Query Structure Overview (62)Table 16: CFI Query Identification String (62)Table 17: CFI Query System Interface Information (63)Table 18: Device Geometry Definition (63)Table 19: Primary Algorithm-Specific Extended Query Table (64)Table 20: Security Code Area (65)Table 21: Power-Up Wait Timing Specifications (66)Table 22: Reset AC Specifications (67)Table 23: Absolute Maximum/Minimum Ratings (69)Table 24: Operating Conditions (69)Table 25: Input/Output Capacitance1 (70)Table 26: DC Current Characteristics (71)Table 27: DC Voltage Characteristics (72)Table 28: Read AC Characteristics (73)Table 29: WE#-Controlled Write AC Characteristics (76)Table 30: CE#-Controlled Write AC Characteristics (79)Table 31: Accelerated Program and Data Polling/Data Toggle AC Characteristics (83)Table 32: Program/Erase Characteristics (85)General DescriptionThe M29W is an asynchronous, uniform block, parallel NOR Flash memory device man-ufactured on 65nm single-level cell (SLC) technology. READ, ERASE, and PROGRAM op-erations are performed using a single low-voltage supply. Upon power-up, the device defaults to read array mode.The main memory array is divided into uniform blocks that can be erased independent-ly so that valid data can be preserved while old data is purged. PROGRAM and ERASE commands are written to the command interface of the memory. An on-chip program/erase controller simplifies the process of programming or erasing the memory by taking care of all special operations required to update the memory contents. The end of a PROGRAM or ERASE operation can be detected and any error condition can be identi-fied. The command set required to control the device is consistent with JEDEC stand-ards.CE#, OE#, and WE# control the bus operation of the device and enable a simple con-nection to most microprocessors, often without additional logic.The M29W supports asynchronous random read and page read from all blocks of the array. It features a write to buffer program capability that improves throughput by pro-gramming a buffer of 32 words in one command sequence. Also, in x16 mode, the en-hanced buffered program capability improves throughput by programming 256 words in one command sequence. The device V PP /WP# signal enables faster programming.The device contains a 128-word (x16) and 256-byte (x8) extended memory block. The user can program this additional space and then protect it to permanently secure the contents. The device also features different levels of hardware and software protection to secure blocks from unwanted modification.Figure 1: Logic DiagramVV A[23:0]V /WP#DQ[14:0]SSSignal Assignments Figure 2: 44-Pin SO (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 2244 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23RFU RY/BY#A17A7A6A5A4A3A2A1A0CE#V SSOE#D0D8D1D9D2D10D3D11RST#WE#A8A9A10A11A12A13A14A15A16BYTE#V SSDQ15/A-1DQ7DQ14DQ6DQ13DQ5DQ12DQ4V CC Notes: 1.A17 = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 3: 44-Pin SO (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 2244 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23RST# A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE# V SS OE# D0 D8 D1 D9 D2 D10 D3 D11WE#RFUA8A9A10A11A12A13A14A15A16BYTE#V SSDQ15/A-1DQ7DQ14DQ6DQ13DQ5DQ12DQ4V CC Notes: 1.A18 = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 4: 48-Pin TSOP (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 2448 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25A15A14A13A12A11A10A9A8RFURFUWE# RST#RFURFU RY/BY#RFUA17A7A6A5A4A3A2A1A16BYTE#V SSDQ15/A-1DQ7DQ14DQ6DQ13DQ5DQ12DQ4V CCDQ11DQ3DQ10DQ2DQ9DQ1DQ8DQ0OE#V SSCE#A0 Notes: 1.A17 = A[MAX].2.A-1 is the least significant address bit in x8 mode. Figure 5: 48-Pin TSOP (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 2448 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25A15A14A13A12A11A10A9A8RFURFUWE# RST#RFURFU RY/BY#A18A17A7A6A5A4A3A2A1A16BYTE#V SSDQ15/A-1DQ7DQ14DQ6DQ13DQ5DQ12DQ4V CCDQ11DQ3DQ10DQ2DQ9DQ1DQ8DQ0OE#V SSCE#A0 Notes: 1.A18 = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 6: 48-Pin TSOP (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 2448 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25A15A14A13A12A11A10A9A8A19A20WE#RST#RFU V PP/WP# RY/BY#A18A17A7A6A5A4A3A2A1A16BYTE#V SSDQ15/A-1DQ7DQ14DQ6DQ13DQ5DQ12DQ4V CCDQ11DQ3DQ10DQ2DQ9DQ1DQ8DQ0OE#V SSCE#A0 Notes: 1.A20 = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 7: 48-Pin TSOP (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 2448 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25A15A14A13A12A11A10A9A8A19A20WE#RST#A21 V PP/WP# RY/BY#A18A17A7A6A5A4A3A2A1A16 BYTE#V SSDQ15/A-1 DQ7DQ14 DQ6DQ13 DQ5DQ12 DQ4V CCDQ11 DQ3DQ10 DQ2DQ9DQ1DQ8DQ0OE#V SSCE#A0Notes: 1.A21 = A[MAX].2.A-1 is the least significant address bit in x8 mode. Figure 8: 56-Pin TSOP (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 2856 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29RFURFUA15A14A13A12A11A10A9A8A19A20WE#RST#A21 V PP/WP# RY/BY#A18A17A7A6A5A4A3A2A1RFURFURFURFUA16BYTE#V SSDQ15/A-1DQ7DQ14DQ6DQ13DQ5DQ12DQ4V CCDQ11DQ3DQ10DQ2DQ9DQ1DQ8DQ0OE#VSSCE#A0RFUV CCQ Notes: 1.A21 = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 9: 56-Pin TSOP (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 2856 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29RFUA22A15A14A13A12A11A10A9A8A19A20WE#RST#A21 V PP/WP# RY/BY#A18A17A7A6A5A4A3A2A1RFURFURFURFUA16BYTE#V SSDQ15/A-1DQ7DQ14DQ6DQ13DQ5DQ12DQ4V CCDQ11DQ3DQ10DQ2DQ9DQ1DQ8DQ0OE#VSSCE#A0RFUV CCQ Notes: 1.A22 = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 10: 56-Pin TSOP (Top View)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 2856 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29A23A22A15A14A13A12A11A10A9A8A19A20WE#RST#A21 V PP/WP# RY/BY#A18A17A7A6A5A4A3A2A1RFURFURFURFUA16BYTE#V SSDQ15/A-1DQ7DQ14DQ6DQ13DQ5DQ12DQ4V CCDQ11DQ3DQ10DQ2DQ9DQ1DQ8DQ0OE#VSSCE#A0RFUV CCQ Notes: 1.A23 = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 11: 48-Ball Fortified BGA and 48-Ball TBGANotes: 1.A[17] = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 12: 48-Ball Fortified BGA and 48-Ball TBGANotes: 1.A[18] = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 13: 48-Ball Fortified BGA and 48-Ball TBGANotes: 1.A[20] = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 14: 48-Ball Fortified BGA and 48-Ball TBGANotes: 1.A[21] = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 15: 64-Ball Fortified BGA and 64-Ball TBGANotes: 1.A[20] = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 16: 64-Ball Fortified BGA and 64-Ball TBGANotes: 1.A[21] = A[MAX].2.A-1 is the least significant address bit in x8 mode.3.Pads D8 and F1 are not connected (NC) on the M29W640GT and M29W640GB devices.Figure 17: 64-Ball Fortified BGA and 64-Ball TBGANotes: 1.A[22] = A[MAX].2.A-1 is the least significant address bit in x8 mode.Figure 18: 64-Ball Fortified BGA and 64-Ball TBGANotes: 1.A[23] = A[MAX].2.A-1 is the least significant address bit in x8 mode.Signal DescriptionsThe signal description table below is a comprehensive list of signals for this device fami-ly. All signals listed may not be supported on this device. See Signal Assignments for in-formation specific to this device.Table 2: Signal DescriptionsTable 2: Signal Descriptions (Continued)Memory OrganizationMemory ConfigurationThe main memory array is divided into 128KB or 64KW uniform blocks. Memory Map – 256Mb DensityTable 3: 256Mb, Blocks[255:0]Bus OperationsTable 4: Bus OperationsNotes: 1.Typical glitches of less than 5ns on CE#, WE#, and RST# are ignored by the device and donot affect bus operations.2.H = Logic level HIGH (V IH); L = Logic level LOW (V IL); X = HIGH or LOW.3.If WP# is LOW, then the highest or the lowest block remains protected, depending online item.4.Data input is required when issuing a command sequence or when performing datapolling or block protection.ReadBus READ operations read from the memory cells, registers, or CFI space. To acceleratethe READ operation, the memory array can be read in page mode where data is inter-nally read and stored in a page buffer.Page size is 8 words (16 bytes) and is addressed by address inputs A[2:0] in x16 busmode and A[2:0] plus DQ15/A-1 in x8 bus mode. The extended memory blocks and CFIarea do not support page read mode.A valid READ operation requires setting the appropriate address on the address inputs,taking CE# and OE# LOW, and holding WE# HIGH. Data I/O signals output the value. WriteBus WRITE operations write to the command interface. A valid WRITE operation re-quires setting the appropriate address on the address inputs. These are latched by thecommand interface on the falling edge of CE# or WE#, whichever occurs last. Values ondata I/O signals are latched by the command interface on the rising edge of CE# orWE#, whichever occurs first. OE# must remain HIGH during the entire operation. Standby and Automatic StandbyWhen the device is in read mode, driving CE# HIGH places the device in standby modeand drives data I/Os to High-Z. Supply current is reduced to standby (I CC2), by holdingCE# within V CC ±0.3V.During PROGRAM or ERASE operations the device continues to use the program/erasesupply current (I CC3) until the operation completes.Automatic standby enables low power consumption during read mode. When CMOSlevels (VCC ± 0.3 V) drive the bus and following a READ operation and a period of inac-tivity specified in DC Characteristics, the memory enters automatic standby as internalsupply current is reduced to ICC2. Data I/O signals still output data if a READ operationis in progress. Depending on load circuits connected with data bus, VCCQ, can have anull consumption when the memory enters automatic standby.Output DisableData I/Os are High-Z when OE# is HIGH.ResetDuring reset mode the device is deselected and outputs are High-Z. The device is in re-set mode when RST# is LOW. Power consumption is reduced to standby level independ-ently from CE#, OE#, or WE# inputs.RegistersStatus RegisterTable 5: Status Register Bit DefinitionsNotes: 1.The status register can be read during PROGRAM, ERASE, or ERASE SUSPEND operations;the READ operation outputs data on DQ[7:0].2.For a PROGRAM operation in progress, DQ7 outputs the complement of the bit beingprogrammed. For a READ operation from the address previously programmed success-fully, DQ7 outputs existing DQ7 data. For a READ operation from addresses with blocksto be erased while an ERASE SUSPEND operation is in progress, DQ7 outputs 0; uponsuccessful completion of the ERASE SUSPEND operation, DQ7 outputs 1. For an ERASEoperation in progress, DQ7 outputs 0; upon either operation's successful completion,DQ7 outputs 1.3.After successful completion of a PROGRAM or ERASE operation, the device returns toread mode.4.During erase suspend mode, READ operations to addresses within blocks not beingerased output memory array data as if in read mode. A protected block is treated thesame as a block not being erased. See the Toggle Flowchart for more information.5.During erase suspend mode, DQ6 toggles when addressing a cell within a block beingerased. The toggling stops when the program/erase controller has suspended the ERASEoperation. See the Toggle Flowchart for more information.6.When DQ5 is set to 1, a READ/RESET command must be issued before any subsequentcommand.Table 6: Operations and Corresponding Bit SettingsNotes: 1.Unspecified data bits should be ignored.2.DQ7# for buffer program is related to the last address location loaded.Figure 19: Data Polling FlowchartNotes: 1.Valid address is the address being programmed or an address within the block beingerased.2.Failure results: DQ5 = 1 indicates an operation error; DQ1 = 1 indicates a WRITE TO BUF-FER PROGRAM ABORT operation.Figure 20: Toggle Bit FlowchartNote: 1.Failure results: DQ5 = 1 indicates an operation error; DQ1 = 1 indicates a WRITE TO BUF-FER PROGRAM ABORT operation.Figure 21: Status Register Polling FlowchartLock RegisterTable 7: Lock Register Bit DefinitionsNotes: 1.The lock register is a 16-bit, one-time programmable register. DQ[15:3] are reserved andare set to a default value of 1.2.The password protection mode lock bit and nonvolatile protection mode lock bit cannotboth be programmed to 0. Any attempt to program one while the other is programmedcauses the operation to abort, and the device returns to read mode. The device is ship-ped from the factory with the default setting.Table 8: Block Protection StatusNotes: 1.Nonvolatile protection bit lock bit: when cleared to 1, all nonvolatile protection bits areunlocked; when set to 0, all nonvolatile protection bits are locked.2.Block nonvolatile protection bit: when cleared to 1, the block is unprotected; when setto 0, the block is protected.3.Block volatile protection bit: when cleared to 1, the block is unprotected; when set to 0,the block is protected.Figure 22: Lock Register Program FlowchartNotes: 1.Each lock register bit can be programmed only once.2.See the Block Protection Command Definitions table for address-data cycle details.Standard Command Definitions – Address-Data Cycles Table 9: Standard Command Definitions – Address-Data Cycles, 8-Bit and 16-BitTable 9: Standard Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit (Continued)Notes: 1. A = Address; D = Data; X = "Don't Care;" BAd = Any address in the block; N = Number ofbytes to be programmed; PA = Program address; PD = Program data; Gray shading = Notapplicable. All values in the table are hexadecimal. Some commands require both a com-mand code and subcode.2.These cells represent READ cycles (versus WRITE cycles for the others).3.AUTO SELECT enables the device to read the manufacturer code, device code, block pro-tection status, and extended memory block protection indicator.4.AUTO SELECT addresses and data are specified in the Electronic Signature table and theExtended Memory Block Protection table.5.For any UNLOCK BYPASS ERASE/PROGRAM command, the first two UNLOCK cycles areunnecessary.6.BAd must be the same as the address loaded during the WRITE TO BUFFER PROGRAM3rd and 4th cycles.7.WRITE TO BUFFER PROGRAM operation: maximum cycles = 68(x8) and 36 (x16). UNLOCKBYPASS WRITE TO BUFFER PROGRAM operation: maximum cycles = 66 (x8), 34 (x16).WRITE TO BUFFER PROGRAM operation: N + 1 = bytes to be programmed; maximumbuffer size = 64 bytes (x8) and 32 words (x16).8.For x8, A[MAX:5] address pins should remain unchanged while A[4:0] and A-1 pins areused to select a byte within the N + 1 byte page. For x16, A[MAX:5] address pins shouldremain unchanged while A[4:0] pins are used to select a word within the N + 1 wordpage.9.The following is content for address-data cycles 256 through 258: BAd (FE) - Data; BAd(FF) - Data; BAd (00) - 29.10.BLOCK ERASE address cycles can extend beyond six address-data cycles, depending onthe number of blocks to erase.READ OperationsREAD/RESET CommandThe READ/RESET (F0h) command returns the device to read mode and resets the errorsin the status register. One or three bus WRITE operations can be used to issue theREAD/RESET command.To return the device to read mode, this command can be issued between bus WRITEcycles before the start of a PROGRAM or ERASE operation. If the READ/RESET com-mand is issued during the timeout of a BLOCK ERASE operation, the device requires upto 10μs to abort, during which time no valid data can be read.This command will not abort an ERASE operation while in erase suspend.READ CFI CommandThe READ CFI (98h) command puts the device in read CFI mode and is only valid whenthe device is in read array or auto select mode. One bus WRITE cycle is required to issuethe command.Once in read CFI mode, bus READ operations will output data from the CFI memoryarea (Refer to the Common Flash Interface for details). A READ/RESET command mustbe issued to return the device to the previous mode (read array or auto select ). A sec-ond READ/RESET command is required to put the device in read array mode from autoselect mode.AUTO SELECT OperationsAUTO SELECT CommandAt power-up or after a hardware reset, the device is in read mode. It can then be put inauto select mode by issuing an AUTO SELECT (90h) command or by applying V ID to A9.Auto select mode enables the following device information to be read:•Electronic signature, which includes manufacturer and device code information asshown in the Electronic Signature table.•Block protection, which includes the block protection status and extended memoryblock protection indicator, as shown in the Block Protection table.Electronic signature or block protection information is read by executing a READ opera-tion with control signals and addresses set, as shown in the Read Electronic Signaturetable or the Block Protection table, respectively.Auto select mode can be used by the programming equipment to automatically match adevice with the application code to be programmed.Three consecutive bus WRITE operations are required to issue an AUTO SELECT com-mand. The device remains in auto select mode until a READ/RESET or READ CFI com-mand is issued.The device cannot enter auto select mode when a PROGRAM or ERASE operation is inprogress (RY/BY# LOW). However, auto select mode can be entered if the PROGRAM orERASE operation has been suspended by issuing a PROGRAM SUSPEND or ERASE SUS-PEND command.To enter auto select mode by appling VID to A9, see the Read Electronic Signature tableand the Block Protection table.Auto select mode is exited by performing a reset. The device returns to read mode un-less it entered auto select mode after an ERASE SUSPEND or PROGRAM SUSPENDcommand, in which case it returns to erase or program suspend mode.Table 10: Read Electronic Signature。