MC10E416FNR2G;MC10E416FNG;MC100E416FN;MC100E416FNG;MC100E416FNR2;中文规格书,Datasheet资料
MOTOROLA系列芯片解密
MOTOROLA系列芯片解密MOTOROLA单片机具有片内FLASH，具有FLASH存储器在线编程功能和保密功能(FLASH编程/查处的电压由芯片内部电荷泵产生)，编程后FLASH位将设为0，擦除后FLASH位将为1，FLASH存储器的加密特性可以阻止未经授权的用户查看FLASH存储器中的内容。
以下龙人成功实现技术突破的MOTOROLA单片机型号，目前我们可针对以下单片机型号提供高效可靠的解密服务：24小时服务热线：086-0755-********E-mail：sales@68HC711XX系列68HC711E9MFN2 68HC711E9MFNE2 68HC711E9VFNE268HC711E9VFN2 68HC705C4A 68HC705C468HC705C8 68HC711E9VFN2 68HC705C8A68HC705C9 68HC705C9A 68HC70568HC705J1A 68HC705SR3 ……MC56F8XX系列MC56F8013VFAE MC56F8014VFAE MC56F8023MFAEMC56F8023VFAE MC56F8025VLD MC56F8036MFAEMC56F8036VFAE MC56F8037VLH MC56F8122VFAMC56F8122VFAE MC56F8123VFB MC56F8123VFBEMC56F8322MFA60 MC56F8322MFAE MC56F8322VFA60MC56F8322VFAE MC56F8323MFB60 MC56F8323MFBEMC56F8323VFB60 MC56F8323VFBE ……MC68HC705XX系列MC68HC11P2(2E74J) MC68HC711P2(1E53M) MC68HC705C4MC68HC705C8 MC68HC705C4A MC68HC705C8AMC68HC705C9 MC68HC705C9A MC68HC705SR3MC68HC705 MC68HC705J1A MC68HC705B16MC68HC705X16 MC68HC705B32 MC68HC705X32MC68HC705B6 MC68HC05B8 MC68HC05B16MC68HC705X16 MC68HC05B32 MC68HC05X32MC68HC705H12(0H57A) MC68HC705B16N MC68HC705B5MC68HC705J2 MC68HC705KJ1 MC68HC705P6MC68HC705P9 MC68705R3 MC68705R5MC68705U3 MC68705U5 XC68HC705P6A(CDW)MC68HC11XX系列MC68HC11A8(AB95T) MC68HC11A8(C96N) MC68HC11E9(1B60R)MC68HC11A8(D26E) MC68HC11E20(3E22B) MC68HC11E9(D82R)MC68HC11E9(E22B) MC68HC11E9(E28B) MC68HC11EA9(2D47J)MC68HC11F1(E87J) MC68HC11F1(2F37E) MC68HC11K1(2D58N)MC68HC11K4(1E62H) MC68HC11K4(OE75J) MC68HC11KA4(1E59B)MC68HC11KS4(0E57S) MC68HC11KS2(0H95B) MC68HC11KS4(0F60M)MC68HC11A0 MC68HC11A1 MC68HC11E1MC68HC11P1 ……MC68HC711XX系列MC68HC711E20(1H19S) MC68HC711E9(4K81H) MC68HC711E9(5C47M)MC68HC711K4(K59D) MC68HC711EA9(0D46J) MC68HC711PH8(0H30R)MC68S711E9(5C47M) MC68HC711KS8(1H96P) MC68HC711D3MC68HC711E20 MC68HC711E9 MC68HC711E9CFN2MC68HC711E9CFN(4.5V) MC68HC711E9CFN3 MC68HC711K4MC68HC711E9CFNE2 MC68HC711E9CFNE3 MC68HC711E9-FNMC68HC711KA2 MC68HC711KA4 MC68HC711KS2MC68HC711L6 XC68HC711D3 ……MC68HC81XX系列MC68HC811E2MP2 MC68HC811E2CP2 MC68HC811E2MC68HC811E2P2 MC68HC811E2VP2 MC68HC812A4CPVMC68HC812A4CPVE MC68HC812A4MPV ……MC68HC908XX系列MC68HC908AS60(3J74Y) MC68HC908AZ60(4J74Y) MC68HC908AZ60(2J74Y) MC68HC908AS60A(1L87J) MC68HC908AZ60A(3K85K) MC68HC908AS20(0H94K) MC68HC908AZ60(1J35D) MC68HC908AZ32(0J66D) MC68HC908AZ32(1H56A) MC68H908AZ32A(1L52H) MC68HC908AB32(3K56G) MC68HC908QT3MC68HC908QT1 MC68HC908QT2 MC68HC908QT4MC68HC908QY1 MC68HC908QY2 MC68HC908QY3MC68HC908QY4 MC68HC908JK1 MC68HC908JK3MC68HC908AP16CB MC68HC908AB32MFU MC68HC908LK24MC68HC908AB32CFU MC68HC908AP16CFA MC68HC908JK8MC68HC908AP16CFB MC68HC908AP32CB MC68HC908LK24MC68HC908AP32CFA MC68HC908AP32CFB MC68HC908AP64CBMC68HC908AP64CFA MC68HC908AP64CFB MC68HC908AP8CBMC68HC908AP8CFA MC68HC908AP8CFB MC68HC908AS32AMC68HC908BD48IB MC68HC908BD48IFB MC68HC908EY16CFAMC68HC908EY16MFA MC68HC908EY16VFA MC68HC908EY8CFAMC68HC908EY8MFA MC68HC908EY8VFA MC68HC908GP32MC68HC908GR16CFA MC68HC908GR16CFJ MC68HC908GR16MFAMC68HC908GR16MFJ MC68HC908GR16VFA MC68HC908GR4CDWMC68HC908GR16VFJ MC68HC908GR4CFA MC68HC908GR4CPMC68HC908GR4MDW MC68HC908GR4MFA MC68HC908GR4MPMC68HC908GR4VDW MC68HC908GR4VFA MC68HC908GR4VPMC68HC908GR8CDW MC68HC908GR8CFA MC68HC908GR8CPMC68HC908GR8MDW MC68HC908GR8MFA MC68HC908GR8MPMC68HC908GR8VDW MC68HC908GR8VFA MC68HC908GR8VPMC68HC908GT16 MC68HC908GT8CB MC68HC908GT8CFBMC68HC908GZ16 MC68HC908GZ32 MC68HC908GZ48MC68HC908GZ60 MC68HC908GZ8 MC68HC908JB12MC68HC908JB16 MC68HC908JK1ECDW MC68HC908JB8MC68HC908JK1CDW MC68HC908JK1CP MC68HC908JB8MC68HC908JK1ECP MC68HC908JK1EMDW MC68HC908JK1EMPMC68HC908JK1MDW MC68HC908JK1MP MC68HC908JK3CDWMC68HC908JK3CP MC68HC908JK3ECDW MC68HC908JK3ECPMC68HC908JK3EMDW MC68HC908JK3EMP MC68HC908JK3MDW MC68HC908JK3MP MC68HC908JK8 MC68HC908JK8MC68HC908JL3CDW MC68HC908JL3CFA MC68HC908JL3CPMC68HC908JL3ECDW MC68HC908JL3ECFA MC68HC908JL3ECPMC68HC908JL3EMDW MC68HC908JL3EMFA MC68HC908JL3EMP MC68HC908JL3MDW MC68HC908JL3MFA MC68HC908JL3MPMC68HC908LB8CDWE MC68HC908LB8MDWE MC68HC908LB8CPE MC68HC908LB8MPE MC68HC908LB8VDWE MC68HC908JL8MC68HC908LB8VPE MC68HC908LD60IFU MC68HC908KX8MC68HC908LD64IFU MC68HC908LJ12CFB MC68HC908KX2MC68HC908LJ12CFBE MC68HC908LJ12CFU MC68HC908LJ12CFU MC68HC908LJ12CFUE MC68HC908LJ12CPB MC68HC908LJ12CPBE MC68HC908LJ24CFQ MC68HC908LJ24CFQE MC68HC908LJ24CFU MC68HC908LJ24CFUE MC68HC908LJ24CPB MC68HC908LJ24CPBE MC68HC908LJ24CPK MC68HC908LJ24CPKE MC68HC908LK24CFQ MC68HC908LK24CFQE MC68HC908LK24CFU MC68HC908LK24CFUE MC68HC908LK24CPB MC68HC908LK24CPBE MC68HC908QB4MC68HC908LK24CPK MC68HC908LK24CPKE MC68HC908QB8MC68HC908LV8CPBE MC68HC908MR16 MC68HC908MR32MC68HC908QC16 MC68HC908QC4 MC68HC908QC8MC68HC908QT1ACFQE MC68HC908QT1AMFQE MC68HC908QF4 MC68HC908QT1AVFQE MC68HC908QT1CDW MC68HC908QL2MC68HC908QT1CFQ MC68HC908QT1CP MC68HC908QL3MC68HC908QT1MDW MC68HC908QT1MFQ MC68HC908QL4MC68HC908QT1MP MC68HC908QT1VDW MC68HC908QT1VFQMC68HC908QT1VP MC68HC908QT2ACFQE MC68HC908QT2AMFQE MC68HC908QT2AVFQE MC68HC908QT2CFQ MC68HC908QT2CDW MC68HC908QT2CP MC68HC908QT2MDW MC68HC908QT2MFQMC68HC908QT2MP MC68HC908QT2VDW MC68HC908QT2VFQMC68HC908QT4ACFQE MC68HC908QT4AMFQE MC68HC908QT2VP MC68HC908QT4AVFQE MC68HC908QT4CDW MC68HC908QT4CFQ MC68HC908QT4MDW MC68HC908QT4MFQ MC68HC908QT4CPMC68HC908QT4VDW MC68HC908QT4VFQ MC68HC908QT4MPMC68HC908QT4VP MC68HC908QY1CDT MC68HC908QY1CDWMC68HC908QY1CP MC68HC908QY1MDT MC68HC908QY1MDWMC68HC908QY1MP MC68HC908QY1VDT MC68HC908QY1VDWMC68HC908QY2CDT MC68HC908QY2CDW MC68HC908QY2CPMC68HC908QY2MDT MC68HC908QY2MDW MC68HC908QY2MPMC68HC908QY2VDT MC68HC908QY2VDW MC68HC908QY2VPMC68HC908QY4CDT MC68HC908QY4CDW MC68HC908QY4CPMC68HC908QY4MDT MC68HC908QY4MDW MC68HC908QY4MPMC68HC908QY4VDT MC68HC908QY4VDW MC68HC908QY4VPMC68HC908QY8 MC68HC908SR12 MC68HC908RF2XC68HC908MR32 ……MC68HC912XX系列MC68HC912DC128A(3K91D) MC68HC912DC128(0K50E) MC68HC912D60(0K13J) MC68HC912DG128(0K50E) MC68HC912DG128(5H55W) MC68HC912B32(9H91F) MC68HC912D60(0K75F) MC68HC912D60A(2K38K) MC68HC912D60(4F73K)MC68HC912DG128A(3K91D) MC9S12DG128B(0L85D) MC68HC912B32(4J54E) MC68HC912BC32 ……MC68HC9S12XX系列MC9S12DT128B(0L85D) MC9S12DB128B(0L85D) MC9S12A128B(0L85D)MC9S12DG256C(2K79X) MC9S12DT256C(2K79X) MC9S12DT128B(1L85D)MC9S12H128(1K78X) MC9S12DP256C(2K79X) MC9S12H256(1K78X)MC9S12DP512(1L00M) MC9S12DT128B(3L40K) ……MC68HRC908XX系列MC68HRC908JK1CDW MC68HRC908JK1CP MC68HRC908JK1ECPMC68HRC908JK1ECDW MC68HRC908JK1EMDW MC68HRC908JK1EMPMC68HRC908JK1MDW MC68HRC908JK3CDW MC68HRC908JK1MPMC68HRC908JK3CP MC68HRC908JK3ECDW MC68HRC908JK3ECPMC68HRC908JK3EMDW MC68HRC908JK3EMP MC68HRC908JK3MDWMC68HRC908JK3MP MC68HRC908JK8 MC68HRC908JL3CPMC68HRC908JL3CDW MC68HRC908JL3CFA MC68HRC908JL3ECPMC68HRC908JL3ECDW MC68HRC908JL3ECFA MC68HRC908JL3EMDWMC68HRC908JL3EMFA MC68HRC908JL3EMP MC68HRC908JL3MDWMC68HRC908JL3MFA MC68HRC908JL3MP MC68HRC908JL8MC68HSC705XX系列MC68HSC705C8A XC68HSC705C9A ……MC68S711E9XX系列MC68S711E9 ……MC908AXX系列MC908AB32CFUE MC908AP16CBE MC908AP32CBEMC908AP32CFAE MC908AP32CFBE MC908AP64CBEMC908AP64CFAE MC908AP64CFBE MC908AP8CBEMC908AP8CFAE MC908AP8CFBE ……MC908BXX系列MC908BD48IBE MC908BD48IFBE MC908EY16ACFJEMC908EY16ACFJE MC908EY16AKFJE MC908EY16AMFJE MC908EY16AVFJE MC908EY8ACFJE MC908EY8AKFJEMC908EY8AVFJE MC908EY8AMFJE ……MC908JL16XX系列MC908JL16CDWE MC908JL16CFJE MC908JL16CPEMC908JL16CSPE ……MC908QTXX系列MC908QT1ACDWE MC908QT1ACPE MC908QT1AMDWE MC908QT1AMPE MC908QT1AVDWE MC908QT1AVPEMC908QT2ACDWE MC908QT2ACPE MC908QT2AMDWE MC908QT2AMPE MC908QT2AVDWE MC908QT2AVPEMC908QT4ACDWE MC908QT4ACPE MC908QT4AMDWE MC908QT4AMPE MC908QT4AVDWE MC908QT4AVPEMC908QYXX系列MC908QY1ACDTE MC908QY1ACDWE MC908QY1ACPEMC908QY1AMDTE MC908QY1AMDWE MC908QY1AMPE MC908QY1AVDTE MC908QY1AVDWE MC908QY1AVPEMC908QY2ACDTE MC908QY2ACDWE MC908QY2ACPEMC908QY2AMDTE MC908QY2AMDWE MC908QY2AMPE MC908QY2AVDTE MC908QY2AVDWE MC908QY2AVPEMC908QY4ACDT MC908QY4ACDWE MC908QY4ACPEMC908QY4AMDTE MC908QY4AMDWE MC908QY4AMPE MC908QY4AVDTE MC908QY4AVDWE MC908QY4AVPEMC912D60XX系列MC912D60ACFU8 MC912D60ACPV8 MC912D60AMFU8MC912D60AMPV8 MC912D60AVFU8 MC912D60AVPV8MC912D60CCFU8 MC912D60CCPV8 MC912D60CMFU8MC912D60CMPV8 MC912D60CVFU8 MC912D60CVPV8MC912D60PCFU8 MC912D60PCPV8 MC912D60PMFU8MC912D60PMPV8 MC912D60PVFU8 MC912D60PVPV8MC912DG128XX系列MC912DG128ACPV MC912DG128AMPV MC912DG128AVPV MC912DG128CCPV MC912DG128CMPV MC912DG128CVPV MC912DG128PCPV MC912DG128PMPV MC912DG128PVPV MC912DT128XX系列MC912DT128ACPV MC912DT128AMPV MC912DT128AVPV MC912DT128CCPV MC912DT128CMPV MC912DT128CVPV MC912DT128PCPV MC912DT128PMPV MC912DT128PVPVMC9RS08KA1CPC MC9RS08KA1CSC MC9RS08KA2CPCMC9RS08KA2CSC ……MC9S08ACXX系列MC9S08AC16CFD MC9S08AC16CFDE MC9S08AC16CFG MC9S08AC16CFGE MC9S08AC16MFD MC9S08AC16MFDE MC9S08AC16MFG MC9S08AC16MFGE MC9S08AC16VFD MC9S08AC16VFDE MC9S08AC16VFG MC9S08AC16VFGE MC9S08AC32CFD MC9S08AC32CFDE MC9S08AC32CFG MC9S08AC32CFGE MC9S08AC32CFU MC9S08AC32CFUE MC9S08AC32CPU MC9S08AC32CPUE MC9S08AC32MFD MC9S08AC32MFDE MC9S08AC32MFG MC9S08AC32MFGE MC9S08AC32MFU MC9S08AC32MFUE MC9S08AC32MPU MC9S08AC32MPUE MC9S08AC32VFD MC9S08AC32VFDE MC9S08AC32VFG MC9S08AC32VFGE MC9S08AC32VFU MC9S08AC32VFUE MC9S08AC32VPU MC9S08AC32VPUE MC9S08AC48CFD MC9S08AC48CFDE MC9S08AC48CFG MC9S08AC48CFGE MC9S08AC48CFU MC9S08AC48CFUE MC9S08AC48CPU MC9S08AC48CPUE MC9S08AC48MFD MC9S08AC48MFDE MC9S08AC48MFG MC9S08AC48MFGE MC9S08AC48MFU MC9S08AC48MFUE MC9S08AC48MPU MC9S08AC48MPUE MC9S08AC48VFD MC9S08AC48VFDE MC9S08AC48VFG MC9S08AC48VFGE MC9S08AC48VFU MC9S08AC48VFUE MC9S08AC48VPU MC9S08AC48VPUE MC9S08AC60CFD MC9S08AC60CFDE MC9S08AC60CFG MC9S08AC60CFGE MC9S08AC60CFU MC9S08AC60CFUE MC9S08AC60CPU MC9S08AC60CPUE MC9S08AC60MFD MC9S08AC60MFDE MC9S08AC60MFG MC9S08AC60MFGE MC9S08AC60MFU MC9S08AC60MFUE MC9S08AC60MPU MC9S08AC60MPUE MC9S08AC60VFD MC9S08AC60VFDE MC9S08AC60VFG MC9S08AC60VFGE MC9S08AC60VFU MC9S08AC60VFUE MC9S08AC60VPU MC9S08AC60VPUE MC9S08AC8CFD MC9S08AC8CFDE MC9S08AC8CFGMC9S08AC8CFGE MC9S08AC8MFD MC9S08AC8MFDEMC9S08AC8MFG MC9S08AC8MFGE MC9S08AC8VFDMC9S08AC8VFDE MC9S08AC8VFG MC9S08AC8VFGEMC9S08AWXX系列MC9S08AW16CFD MC9S08AW16CFDE MC9S08AW16CFG MC9S08AW16CFGE MC9S08AW16CFU MC9S08AW16CFUE MC9S08AW16CPU MC9S08AW16CPUE MC9S08AW16MFD MC9S08AW16MFDE MC9S08AW16MFG MC9S08AW16MFGE MC9S08AW16MFU MC9S08AW16MFUE MC9S08AW16MPUMC9S08AW16VFUE MC9S08AW16VPU MC9S08AW16VPUE MC9S08AW32CFD MC9S08AW32CFDE MC9S08AW32CFG MC9S08AW32CFGE MC9S08AW32CFU MC9S08AW32CFUE MC9S08AW32CPU MC9S08AW32CPUE MC9S08AW32MFD MC9S08AW32MFDE MC9S08AW32MFG MC9S08AW32MFGE MC9S08AW32MFU MC9S08AW32MFUE MC9S08AW32MPU MC9S08AW32MPUE MC9S08AW32VFD MC9S08AW32VFDE MC9S08AW32VFG MC9S08AW32VFGE MC9S08AW32VFU MC9S08AW32VFUE MC9S08AW32VPU MC9S08AW32VPUE MC9S08AW48CFD MC9S08AW48CFDE MC9S08AW48CFG MC9S08AW48CFGE MC9S08AW48CFU MC9S08AW48CFUE MC9S08AW48CPU MC9S08AW48CPUE MC9S08AW48MFD MC9S08AW48MFDE MC9S08AW48MFG MC9S08AW48MFGE MC9S08AW48MFU MC9S08AW48MFUE MC9S08AW48MPU MC9S08AW48MPUE MC9S08AW48VFD MC9S08AW48VFDE MC9S08AW48VFG MC9S08AW48VFGE MC9S08AW48VFU MC9S08AW48VFUE MC9S08AW48VPU MC9S08AW48VPUE MC9S08AW60CFD MC9S08AW60CFDE MC9S08AW60CFG MC9S08AW60CFGE MC9S08AW60CFU MC9S08AW60CFUE MC9S08AW60CPU MC9S08AW60CPUE MC9S08AW60MFD MC9S08AW60MFDE MC9S08AW60MFG MC9S08AW60MFGE MC9S08AW60MFU MC9S08AW60MFUE MC9S08AW60MPU MC9S08AW60MPUE MC9S08AW60VFD MC9S08AW60VFDE MC9S08AW60VFG MC9S08AW60VFGE MC9S08AW60VFU MC9S08AW60VFUE MC9S08AW60VPU MC9S08AW60VPUEMC9S08GBXX系列MC9S08GB32ACFU MC9S08GB32ACFUE MC9S08GB32CFU MC9S08GB32CFUE MC9S08GB60ACFU MC9S08GB60ACFUE MC9S08GB60CFU MC9S08GB60CFUE ……MC9S08GTXX系列MC9S08GT16ACB MC9S08GT16ACFB MC9S08GT16ACFC MC9S08GT16ACFCE MC9S08GT16ACFD MC9S08GT16AMB MC9S08GT16AMFB MC9S08GT16AMFC MC9S08GT16AMFCE MC9S08GT16AMFD MC9S08GT16CB MC9S08GT16CBEMC9S08GT16CFB MC9S08GT16CFBE MC9S08GT16CFDMC9S08GT16CFDE MC9S08GT32ACFB MC9S08GT32ACFBE MC9S08GT32ACFD MC9S08GT32ACFDE MC9S08GT32CB MC9S08GT32CBE MC9S08GT32CFB MC9S08GT32CFBEMC9S08GT32CFD MC9S08GT32CFDE MC9S08GT60ACFB MC9S08GT60ACFB MC9S08GT60ACFD MC9S08GT60ACFDE MC9S08GT60CB MC9S08GT60CBE MC9S08GT60CFBMC9S08GT8ACFCE MC9S08GT8ACFD MC9S08GT8AMB MC9S08GT8AMFB MC9S08GT8AMFC MC9S08GT8AMFCE MC9S08GT8AMFD ……MC9S08JMXX系列MC9S08JM16CGT MC9S08JM16CGTE MC9S08JM16CLD MC9S08JM16CLDE MC9S08JM16MGT MC9S08JM16MGTE MC9S08JM16MLD MC9S08JM16MLDE MC9S08JM16VGT MC9S08JM16VGTE MC9S08JM16VLD MC9S08JM16VLDE MC9S08JM32CGT MC9S08JM32CGTE MC9S08JM32CLD MC9S08JM32CLDE MC9S08JM32CLH MC9S08JM32CLHE MC9S08JM32CQH MC9S08JM32CQHE MC9S08JM32MGT MC9S08JM32MGTE MC9S08JM32MLD MC9S08JM32MLDE MC9S08JM32MLH MC9S08JM32MLHE MC9S08JM32MQH MC9S08JM32MQHE MC9S08JM32VGT MC9S08JM32VGTE MC9S08JM32VLD MC9S08JM32VLDE MC9S08JM32VLH MC9S08JM32VLHE MC9S08JM32VQH MC9S08JM32VQHE MC9S08JM60CGTE MC9S08JM60CLDE MC9S08JM60CLHE MC9S08JM60CQHE MC9S08JM8CGT MC9S08JM8CGTE MC9S08JM8CLD MC9S08JM8CLDE MC9S08JM8MGTMC9S08JM8MGTE MC9S08JM8MLD MC9S08JM8MLDEMC9S08JM8VGT MC9S08JM8VGTE MC9S08JM8VLDMC9S08JM8VLDE ……MC9S08QAXX系列MC9S08QA2CDN MC9S08QA2CDNE MC9S08QA2CFQMC9S08QA2CFQE MC9S08QA2CPA MC9S08QA2CPAEMC9S08QA2MDN MC9S08QA2MDNE MC9S08QA2MFQMC9S08QA2MFQE MC9S08QA2MPA MC9S08QA2MPAE MC9S08QA2VDN MC9S08QA2VDNE MC9S08QA2VFQMC9S08QA2VFQE MC9S08QA2VPA MC9S08QA4CDNMC9S08QA4CDNE MC9S08QA4CFQ MC9S08QA4CFQE MC9S08QA4CPA MC9S08QA4CPAE MC9S08QA4MDNMC9S08QA4MDNE MC9S08QA4MFQ MC9S08QA4MFQE MC9S08QA4MPA MC9S08QA4MPAE MC9S08QA4VDNMC9S08QA4VDNE MC9S08QA4VFQ MC9S08QA4VFQEMC9S08QA4VPA MC9S08QA4VPA E ……MC9S08QDXX系列MC9S08QD2CPC MC9S08QD2CSC MC9S08QD2MPCMC9S08QD2MSC MC9S08QD2VPC MC9S08QD2VSCMC9S08QD4CPC MC9S08QD4CSC MC9S08QD4MPCMC9S08QD4MSC MC9S08QD4VPC MC9S08QD4VSCMC9S08QG4CDNE MC9S08QG4CDTE MC9S08QG4CFFE MC9S08QG4CFQE MC9S08QG4CPAE MC9S08QG8CDNE MC9S08QG8CDTE MC9S08QG8CFFE MC9S08QG8CFQE MC9S08QG8CPBE ……MC9S08RCXX系列MC9S08RC16CFG MC9S08RC16CFJ MC9S08RC16FG MC9S08RC16FJ MC9S08RC32CFG MC9S08RC32CFJMC9S08RC32FG MC9S08RC32FJ MC9S08RC60CFGMC9S08RC60CFJ MC9S08RC60FG MC9S08RC60FJMC9S08RC8CFG MC9S08RC8CFJ MC9S08RC8FGMC9S08RC8FJ ……MC9S08RDXX系列MC9S08RD16CDW MC9S08RD16CFG MC9S08RD16CFJ MC9S08RD16CP MC9S08RD16DW MC9S08RD16FGMC9S08RD16FJ MC9S08RD16P MC9S08RD32CDWMC9S08RD32CFG MC9S08RD32CFJ MC9S08RD32CP MC9S08RD32DW MC9S08RD32FG MC9S08RD32FJMC9S08RD32P MC9S08RD60CDW MC9S08RD60CFG MC9S08RD60CFJ MC9S08RD60CP MC9S08RD60DWMC9S08RD60FG MC9S08RD60FJ MC9S08RD60PMC9S08RD8CDW MC9S08RD8CFG MC9S08RD8CFJMC9S08RD8CP MC9S08RD8DW MC9S08RD8FGMC9S08RD8FJ MC9S08RD8P ……MC9S08REXX系列MC9S08RE16CFG MC9S08RE16CFJ MC9S08RE16FJMC9S08RE32CFG MC9S08RE32CFJ MC9S08RE32FG MC9S08RE32FJ MC9S08RE60CFG MC9S08RE60CFJMC9S08RE60FG MC9S08RE60FJ MC9S08RE8CFGMC9S08RE8CFJ MC9S08RE8FG MC9S08RE8FJMC9S08RGXX系列MC9S08RG32CFG MC9S08RG32CFJ MC9S08RG32FG MC9S08RG32FJ MC9S08RG60CFG MC9S08RG60CFJ MC9S08RG60FG MC9S08RG60FJ ……MC9S08SGXX系列单片机解密MC9S08SG4CSC MC9S08SG4MSC MC9S08SG4MTGMC9S08SG4VSC MC9S08SG4VTG MC9S08SG8CSCMC9S08SG8CTG MC9S08SG8MSC MC9S08SG8MTGMC9S08SG8VSC MC9S08SG8VTG ……MC9S08SH4CSC MC9S08SH4CTG MC9S08SH4MSCMC9S08SH4MTG MC9S08SH4VSC MC9S08SH4VTGMC9S08SH8CTG MC9S08SH8MSC MC9S08SH8MTGMC9S08SH8VSC MC9S08SH8VTG ……MC9S12AXX系列MC9S12A128BCFU MC9S12A128BCPV MC9S12A128BMFU MC9S12A128BMPV MC9S12A128BVFU MC9S12A128BVPV MC9S12A128CFU MC9S12A128CPV MC9S12A128MFUMC9S12A128VFU MC9S12A128MPV MC9S12A128VPVMC9S12A256BCFU MC9S12A256BCPV MC9S12A256BMFU MC9S12A256BMPV MC9S12A256BVFU MC9S12A256BVPV MC9S12A256CFU MC9S12A256CPV MC9S12A256MFUMC9S12A256MPV MC9S12A256VFU MC9S12A256VPVMC9S12A64CFU MC9S12A64CPV MC9S12A64FMC9S12A64MFU MC9S12A64MPV MC9S12A64PVMC9S12A64VFU MC9S12A64VPV ……MC9S12BXX系列MC9S12B128CFU MC9S12B128CPV MC9S12B128MFUMC9S12B128MPV MC9S12B128VFU MC9S12B128VPVMC9S12B64CFU MC9S12B64CPV MC9S12B64MFUMC9S12B64MPV MC9S12B64VFU MC9S12B64VPVMC9S12CXX系列MC9S12C128CFA MC9S12C128CFU MC9S12C128CPBMC9S12C128MFA MC9S12C128MFU MC9S12C128MPB MC9S12C128VFA MC9S12C128VFU MC9S12C128VPBMC9S12C32CFA16 MC9S12C32CFA25 MC9S12C32CFU16 MC9S12C32CFU25 MC9S12C32CPB16 MC9S12C32CPB25 MC9S12C32MFA16 MC9S12C32MFA25 MC9S12C32MFU16 MC9S12C32MFU25 MC9S12C32MPB16 MC9S12C32MPB25 MC9S12C32VFA16 MC9S12C32VFA25 MC9S12C32VFU16 MC9S12C32VFU25 MC9S12C32VPB16 MC9S12C32VPB25 MC9S12C64CFA MC9S12C64CFU MC9S12C64CPBMC9S12C64MFA MC9S12C64MFU MC9S12C64MPBMC9S12C64VFA MC9S12C64VFU MC9S12C64VPBMC9S12C96CFA MC9S12C96CFU MC9S12C96CPBMC9S12C96MFA MC9S12C96MFU MC9S12C96MPBMC9S12C96VFA MC9S12C96VFU MC9S12C96VPBMC9S12D64XX系列MC9S12D64CFU MC9S12D64CPV MC9S12D64FUMC9S12D64MFU MC9S12D64MPV MC9S12D64PVMC9S12D64VFU MC9S12D64VPV ……MC9S12DBXX系列MC9S12DB128BCPV MC9S12DB128BVPV MC9S12DB128BMPV MC9S12DB128MPV MC9S12DB128VPV ……MC9S12DBXX系列MC9S12DB128BCPV MC9S12DB128BVPV MC9S12DB128BMPV MC9S12DB128MPV MC9S12DB128VPV ……MC9S12DGXX系列MC9S12DG128BCFU MC9S12DG128BCPV MC9S12DG128BMFU MC9S12DG128BMPV C9S12DG128BVFU MC9S12DG128BVPV MC9S12DG128CFU MC9S12DG128CPV MC9S12DG128ECFUMC9S12DG128ECPV MC9S12DG128EMFU MC9S12DG128EMPV MC9S12DG128EVFU MC9S12DG128EVPV MC9S12DG128MFU MC9S12DG128MPV MC9S12DG128VFU MC9S12DG128VPVMC9S12DG256BCFU MC9S12DG256BCPV MC9S12DG256BMFU MC9S12DG256BMPV MC9S12DG256BVFU MC9S12DG256BVPV MC9S12DG256CCFU MC9S12DG256CCPV MC9S12DG256CFU MC9S12DG256CMFU MC9S12DG256CMPV MC9S12DG256CPV MC9S12DG256CVFU MC9S12DG256CVPV MC9S12DG256MFU MC9S12DG256MPV MC9S12DG256VFU MC9S12DG256VPVMC9S12DJXX系列MC9S12DJ128BCFU MC9S12DJ128BCPV MC9S12DJ128BMFU MC9S12DJ128BMPV MC9S12DJ128BVFU MC9S12DJ128BVPV MC9S12DJ128CFU MC9S12DJ128CPV MC9S12DJ128ECFUMC9S12DJ128ECPV MC9S12DJ128EMFU MC9S12DJ128EMPV MC9S12DJ128EVFU MC9S12DJ128EVPV MC9S12DJ128MFUMC9S12DJ128MPV MC9S12DJ128VFU MC9S12DJ128VPVMC9S12DJ256BCFU MC9S12DJ256BCPV MC9S12DJ256BMFU MC9S12DJ256BMPV MC9S12DJ256BVFU MC9S12DJ256BVPV MC9S12DJ256CCFU MC9S12DJ256CCPV MC9S12DJ256CFUMC9S12DJ256CMFU MC9S12DJ256CMPV MC9S12DJ256CPVMC9S12DJ256CVFU MC9S12DJ256CVPV MC9S12DJ256MFUMC9S12DJ256MPV MC9S12DJ256VFU MC9S12DJ256VPVMC9S12DJ64CFU MC9S12DJ64CPV MC9S12DJ64FUMC9S12DJ64MFU MC9S12DJ64MPV MC9S12DJ64PVMC9S12DJ64VFU MC9S12DJ64VPV ……MC9S12DPXX系列MC9S12DP256BCPV MC9S12DP256BMPV MC9S12DP256BVPV MC9S12DP256CCPV MC9S12DP256CMPV MC9S12DP256CVPVMC9S12DP256BCPV MC9S12DP256BMPV MC9S12DP256BVPV MC9S12DP256CCPV MC9S12DP256CMPV MC9S12DP256CVPVMC9S12DTXX系列MC9S12DT128BCPV MC9S12DT128BMPV MC9S12DT128BVPV MC9S12DT128CPV MC9S12DT128ECPV MC9S12DT128EMPVMC9S12DT128EVPV MC9S12DT128MPV MC9S12DT128VPVMC9S12DT256BCPV MC9S12DT256BMPV MC9S12DT256BVPV MC9S12DT256CCPV MC9S12DT256CFU MC9S12DT256CMPV MC9S12DT256CPV MC9S12DT256CVPV MC9S12DT256MFUMC9S12DT256MPV MC9S12DT256VFU MC9S12DT256VPVMC9S12EXX系列MC9S12E128CFU MC9S12E128CFUE MC9S12E128CPVMC9S12E128CPVE MC9S12E128MFU MC9S12E128MFUEMC9S12E128MPV MC9S12E128MPVE MC9S12E128VFUMC9S12E128VFUE MC9S12E128VPV MC9S12E128VPVEMC9S12E256CFU MC9S12E256CFUE MC9S12E256CPVMC9S12E256CPVE MC9S12E256MFU MC9S12E256MFUEMC9S12E256MPV MC9S12E256MPVE MC9S12E256VFUMC9S12E256VFU MC9S12E256VPV MC9S12E256VPVEMC9S12E32CFU MC9S12E32CFUE MC9S12E32MFUMC9S12E32MFUE MC9S12E32VFU MC9S12E32VFUEMC9S12E64CFU MC9S12E64CFUE MC9S12E64CPVMC9S12E64CPVE MC9S12E64MFU MC9S12E64MFUEMC9S12E64VPV MC9S12E64MPV MC9S12E64MPVEMC9S12E64VFU MC9S12E64VFUE MC9S12E64VPVEMC9S12GCXX系列MC9S12GC128CFA MC9S12GC128CPB MC9S12GC128MFAMC9S12GC128MFU MC9S12GC128MPB MC9S12GC128VFAMC9S12GC128VFU MC9S12GC128VPB MC9S12GC16CFAMC9S12GC16CFU MC9S12GC16CPB MC9S12GC16MFAMC9S12GC16MFU MC9S12GC16MPB MC9S12GC16VFAMC9S12GC16VFU MC9S12GC16VPB MC9S12GC32CFAMC9S12GC32CFU MC9S12GC32CPB MC9S12GC32MFAMC9S12GC32MFU MC9S12GC32MPB MC9S12GC32VFAMC9S12GC32VFU MC9S12GC32VPB MC9S12GC64CFAMC9S12GC64CFU MC9S12GC64CPB MC9S12GC64MFAMC9S12GC64MFU MC9S12GC64MPB MC9S12GC64VFAMC9S12GC64VFU MC9S12GC64VPB MC9S12GC96CFAMC9S12GC96CFU MC9S12GC96CPB MC9S12GC96MFAMC9S12GC96MFU MC9S12GC96MPB MC9S12GC96VFAMC9S12GC96VFU MC9S12GC96VPB ……MC9S12HN64CAA MC9S12HN64CAL MC9S12HN64CFUMC9S12HN64CPV MC9S12HN64MAA MC9S12HN64MAL MC9S12HN64MFU MC9S12HN64MPV MC9S12HN64VAA MC9S12HN64VAL MC9S12HN64VFU MC9S12HN64VPVMC9S12HZXX系列MC9S12HZ128CAA MC9S12HZ128CAL MC9S12HZ128CFU MC9S12HZ128CPV MC9S12HZ128MAA MC9S12HZ128MAL MC9S12HZ128MFU MC9S12HZ128MPV MC9S12HZ128VAA MC9S12HZ128VAL MC9S12HZ128VFU MC9S12HZ128VPV MC9S12HZ256CAA MC9S12HZ256CAL MC9S12HZ256CFU MC9S12HZ256CPV MC9S12HZ256MAA MC9S12HZ256MAL MC9S12HZ256MFU MC9S12HZ256MPV MC9S12HZ256VAA MC9S12HZ256VAL MC9S12HZ256VFU MC9S12HZ256VPV MC9S12HZ64CAA MC9S12HZ64CAL MC9S12HZ64CFUMC9S12HZ64CPV MC9S12HZ64MAA MC9S12HZ64MALMC9S12HZ64MFU MC9S12HZ64MPV MC9S12HZ64VAAMC9S12HZ64VAL MC9S12HZ64VFU MC9S12HZ64VPVMC9S12KGXX系列MC9S12KG256CFU MC9S12KG256CPV MC9S12KG256MFU MC9S12KG256MPV MC9S12KG256VFU MC9S12KG256VPVMC9S12KTXX系列MC9S12KT256CPV MC9S12KT256MPV MC9S12KT256VPVMC9S12NE64XX系列MC9S12NE64CPV MC9S12NE64CPVE MC9S12NE64VTU MC9S12NE64VTUE ……MC9S12UF32XX系列MC9S12UF32PB MC9S12UF32PBE MC9S12UF32PUMC9S12XAXX系列MC9S12XA128CAA MC9S12XA128CAL MC9S12XA128CFU MC9S12XA128CPV MC9S12XA128MAA MC9S12XA128MAL MC9S12XA128MFU MC9S12XA128MPV MC9S12XA128VAA MC9S12XA128VAL MC9S12XA128VFU MC9S12XA128VPV MC9S12XA256CAA MC9S12XA256CAG MC9S12XA256CAL MC9S12XA256CFU MC9S12XA256CFV MC9S12XA256CPV MC9S12XA256MAA MC9S12XA256MAG MC9S12XA256MAL MC9S12XA256MFU MC9S12XA256MFV MC9S12XA256MPV MC9S12XA256VAA MC9S12XA256VAG MC9S12XA256VAL MC9S12XA256VFU MC9S12XA256VFV MC9S12XA256VPVMC9S12XA512CAA MC9S12XA512CAG MC9S12XA512CALMC9S12XA512CFU MC9S12XA512CFV MC9S12XA512CPVMC9S12XA512MAA MC9S12XA512MAG MC9S12XA512MALMC9S12XA512MFU MC9S12XA512MFV MC9S12XA512MPVMC9S12XA512VAA MC9S12XA512VAG MC9S12XA512VALMC9S12XA512VFU MC9S12XA512VFV MC9S12XA512VPVMC9S12XBXX系列MC9S12XB128CAA MC9S12XB128CA MC9S12XB128CFUMC9S12XB128CPV MC9S12XB128MAA MC9S12XB128MALMC9S12XB128MFU MC9S12XB128MPV MC9S12XB128VAAMC9S12XB128VAL MC9S12XB128VFU MC9S12XB128VPVMC9S12XB256CAA MC9S12XB256CAL MC9S12XB256CFUMC9S12XB256CPV MC9S12XB256MAA MC9S12XB256MALMC9S12XB256MFU MC9S12XB256MPV MC9S12XB256VAAMC9S12XB256VAL MC9S12XB256VFU MC9S12XB256VPVMC9S12XDXX系列MC9S12XD128CAA MC9S12XD128CAL MC9S12XD128CFUMC9S12XD128CPV MC9S12XD128MAA MC9S12XD128MALMC9S12XD128MPV MC9S12XD128VAA MC9S12XD128VALMC9S12XD128VFU MC9S12XD128VPV MC9S12XD256VPVMC9S12XD256CAA MC9S12XD256CAG MC9S12XD256CALMC9S12XD256CFU MC9S12XD256CFV MC9S12XD256CPVMC9S12XD256MAA MC9S12XD256MAG MC9S12XD256MALMC9S12XD256MFU MC9S12XD256MFV MC9S12XD256MPVMC9S12XD256VAA MC9S12XD256VAG MC9S12XD256VALMC9S12XD256VFU MC9S12XD256VFV MC9S12XD64VFUMC9S12XD64CAA MC9S12XD64CFU MC9S12XD64MAAMC9S12XD64MFU MC9S12XD64VAA ……MC9S12XDGXX系列MC9S12XDG128CAA MC9S12XDG128CAL MC9S12XDG128CFU MC9S12XDG128CPV MC9S12XDG128MAA MC9S12XDG128MAL MC9S12XDG128MFU MC9S12XDG128MPV MC9S12XDG128VAA MC9S12XDG128VAL MC9S12XDG128VFU MC9S12XDG128VPVMC9S12XDPXX系列MC9S12XDP512CAG MC9S12XDP512CA MC9S12XDP512CFV MC9S12XDP512CPV MC9S12XDP512MAG MC9S12XDP512MAL MC9S12XDP512MFV MC9S12XDP512MPV MC9S12XDP512VAG MC9S12XDP512VAL MC9S12XDP512VFV MC9S12XDP512VPVMC9S12XDQXX系列MC9S12XDQ256CAA MC9S12XDQ256CAG MC9S12XDQ256CALMC9S12XDQ256CFU MC9S12XDQ256CFV MC9S12XDQ256CPV MC9S12XDQ256MAA MC9S12XDQ256MAG MC9S12XDQ256MAL MC9S12XDQ256MFU MC9S12XDQ256MFV MC9S12XDQ256MPV MC9S12XDQ256VAA MC9S12XDQ256VAG MC9S12XDQ256VAL MC9S12XDQ256VFU MC9S12XDQ256VFV MC9S12XDQ256VPVMC9S12XDTXX系列MC9S12XDT256CAA MC9S12XDT256CAG MC9S12XDT256CAL MC9S12XDT256CFU MC9S12XDT256CFV MC9S12XDT256CPV MC9S12XDT256MAA MC9S12XDT256MAG MC9S12XDT256MAL MC9S12XDT256MFU MC9S12XDT256MFV MC9S12XDT256MPV MC9S12XDT256VAA MC9S12XDT256VAG MC9S12XDT256VA MC9S12XDT256VFU MC9S12XDT256VFV MC9S12XDT256VPV MC9S12XDT384CAA MC9S12XDT384CAG MC9S12XDT384CAL MC9S12XDT384CFV MC9S12XDT384CPU MC9S12XDT384CPV MC9S12XDT384MAA MC9S12XDT384MAG MC9S12XDT384MAL MC9S12XDT384MFV MC9S12XDT384MPU MC9S12XDT384MPV MC9S12XDT384VAA MC9S12XDT384VAG MC9S12XDT384VAL MC9S12XDT384VFV MC9S12XDT384VPU MC9S12XDT384VPV MC9S12XDT512CAA MC9S12XDT512CAG MC9S12XDT512CAL MC9S12XDT512CFU MC9S12XDT512CFV MC9S12XDT512CPV MC9S12XDT512MAA MC9S12XDT512MAG MC9S12XDT512MAL MC9S12XDT512MFU MC9S12XDT512MFV MC9S12XDT512MPV MC9S12XDT512VAA MC9S12XDT512VAG MC9S12XDT512VAL MC9S12XDT512VFU MC9S12XDT512VFV MC9S12XDT512VPVMC9S12XHZXX系列MC9S12XHZ256CAG MC9S12XHZ256CA MC9S12XHZ256MAG MC9S12XHZ256MAL MC9S12XHZ256VAG MC9S12XHZ256VAL MC9S12XHZ384CAG MC9S12XHZ384CAL MC9S12XHZ384MAG MC9S12XHZ384MAL MC9S12XHZ384VAG MC9S12XHZ384VAL MC9S12XHZ512CAG MC9S12XHZ512CAL MC9S12XHZ512MAG MC9S12XHZ512MAL MC9S12XHZ512VAG MC9S12XHZ512VALMCHC908JWXX系列MCHC908JW32FAE MCHC908JW32FC ……DSP56F8XX系列单片机解密(龙人)DSP56F801 DSP56F802 DSP56F803DSP56F805 DSP56F807 DSP56F827DSP56F826 ……P912XDG128XX系列P912XDG128CAA P912XDG128CAA P912XDG128CALP912XDG128CFU P912XDG128CPV P912XDG128MAAP912XDG128MAL P912XDG128MFU P912XDG128MPVP912XDG128VAA P912XDG128VAL P912XDG128VFUP912XDG128VPV ……P9RS08KAXX系列P9RS08KA1CPC P9RS08KA1CSC P9RS08KA2CPCP9RS08KA2CSC ……PC56F80XX系列PC56F8011VFAE PC56F8013VFAE PC56F8014VFAEPC68HC908XX系列PC68HC908GP32 ……PC9S12UFXX系列PC9S12UF32PB PC9S12UF32PBE PC9S12UF32PUPC9S12XFXX系列PC9S12XF128 PC9S12XF256 PC9S12XF384PC9S12XF512 ……PC9S12XHZXX系列PC9S12XHZ256CAG PC9S12XHZ256CAL PC9S12XHZ256MAG PC9S12XHZ256MAL PC9S12XHZ256VAG PC9S12XHZ256VAL PC9S12XHZ384CAG PC9S12XHZ384CAL PC9S12XHZ384MAG PC9S12XHZ384MAL PC9S12XHZ384VAG PC9S12XHZ384VAL PC9S12XHZ512CAG PC9S12XHZ512CAL PC9S12XHZ512MAG PC9S12XHZ512MAL PC9S12XHZ512VAG PC9S12XHZ512VALS9S08AWXX系列S9S08AW16ACFT S9S08AW16ACLS S9S08AW16AMFTS9S08AW16AMLS S9S08AW16AVFT S9S08AW16AVLSS9S08AW8ACFT S9S08AW8ACLS S9S08AW8AMFTS9S08AW8AMLS S9S08AW8AVFT S9S08AW8AVLS11系列motorola单片机解密：MC68HC711系列MC68HC11A8 (AB95T)、MC68HC11A8 (C96N)MC68HC11A8 (D26E)、MC68HC11E20 (3E22B)MC68HC11E9 (1B60R)、MC68HC11E9 (D82R)MC68HC11E9 (E22B)、MC68HC11E9 (E28B)MC68HC11EA9 (2D47J)、MC68HC11F1 (2F37E)MC68HC11F1 (E87J)、MC68HC11K1 (2D58N)MC68HC11K4 (1E62H)、MC68HC11K4 (OE75J)MC68HC11KA4 (1E59B)、MC68HC11KS2 (0H95B)MC68HC11KS4 (0E57S)、MC68HC11KS4 (0F60M)MC68HC711E20 (1H19S)、MC68HC711E9 (4K81H)MC68HC711E9 (5C47M)、MC68HC711EA9 (0D46J)MC68HC711K4 (K59D)、MC68HC711PH8 (0H30R)MC68S711E9 (5C47M)、XC68HC711KS8 (1H96P)MC68HC11P2 (2E74J)、XC68HC711P2 (1E53M)MC68HC705系列MC68HC705C4 (68HC705C4) MC68HC705C4A (68HC705C4A) MC68HC705C8 (68HC705C8) MC68HC705C8A (68HC705C8A) MC68HC705C9 (68HC705C9) MC68HC705C9A (68HC705C9A) MC68HC705SR3 (68HC705SR3) MC68HC705J1A (68HC705J1A) MC68HC705 (68HC705) ……MC68HC705B16 MC68HC705B32MC68HC705X16 MC68HC705X32MC68HC05B6 MC68HC05B8MC68HC05B16 MC68HC05B32MC68HC05X16 MC68HC05X32MC68HC05H12(0H57A) ……MC68HC908系列MC68HC908AZ60(2J74Y) MC68HC908AZ60(4J74Y)MC68HC908AZ60A(3K85K) MC68HC908AS60(3J74Y)MC68HC908AS60A(1L87J) MC68HC908AB32(3K56G)MC68HC08AZ60(1J35D) MC68HC08AZ32(0J66D)MC68HC08AZ32(1H56A) MC68HC08AS20(0H94K)MC68HC08AZ32A(1L52H) ……MC68HC912系列MC68HC912DC128A(3K91D) MC68HC912DC128(0K50E)MC68HC912DG128(5H55W) MC68HC912DG128A(3K91D)MC68HC912DG128(0K50E) MC68HC912D60A(2K38K)MC68HC912D60(0K75F) MC68HC912D60(0K13J)MC68HC912D60(4F73K) MC68HC912B32(4J54E)MC68HC912B32(9H91F) MC9S12DG128B(0L85DMC68HC9S12系列MC9S12DT128B(0L85D) MC9S12A128B(0L85D)MC9S12DB128B(0L85D) MC9S12DT128B(1L85D)MC9S12DG256C(2K79X) MC9S12DT256C(2K79X)MC9S12H128(1K78X) MC9S12H256(1K78X)MC9S12DP256C(2K79X) MC9S12DT128B(3L40K)MC9S12DP512(1L00M) ……【责任编辑：hailee 文章来源：】。
MC100E016FNG,MC10E016FNG,MC100E016FN,MC10E016FN,MC100E016FNR2,MC10E016FNR2, 规格书,Datasheet 资料
MC10E016, MC100E0165.0 V ECL 8−Bit Synchronous BinaryUp CounterDescriptionThe MC10E/100E016 is a high−speed synchronous, presettable, cascadable 8−bit binary counter. Architecture and operation are the same as the MC10H016 in the MECL 10H™ family, extended to 8−bits, as shown in the logic symbol.The counter features internal feedback of TC, gated by the TCLD (terminal count load) pin. When TCLD is LOW (or left open, in which case it is pulled LOW by the internal pull−downs), the TC feedback is disabled, and counting proceeds continuously, with TC going LOW to indicate an all−one state. When TCLD is HIGH, the TC feedback causes the counter to automatically reload upon TC = LOW, thus functioning as a programmable counter. The Q n outputs do not need to be terminated for the count function to operate properly. To minimize noise and power, unused Q outputs should be left unterminated. The 100 series contains temperature compensation.Features•700 MHz Min. Count Frequency•1000 ps CLK to Q, TC•Internal TC Feedback (Gated)•8−Bit•Fully Synchronous Counting and TC Generation •Asynchronous Master Reset•PECL Mode Operating Range: V CC = 4.2 V to 5.7 Vwith V EE = 0 V•NECL Mode Operating Range: V CC = 0 Vwith V EE = −4.2 V to −5.7 V•Pb−Free Packages are Available**For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.MARKING DIAGRAM*xxx= 10 or 100A= Assembly LocationWL= Wafer LotYY= YearWW= Work WeekG=Pb−Free PackagePLCC−28FN SUFFIXCASE 776MCxxxE016GAWLYYWW1*For additional marking information, refer toApplication Note AND8002/D.See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet.ORDERING INFORMATION1MR CLK TCLD V EE NC P 0P 12627282342524232221201918171615141312115678910PE CE P 7P 6P 5V CCO TC Q 7Q 6V CC Q 5Q 4Q 3P 2P 3P 4V CCO Q 0Q 1Q 2V CCO Figure 1. 28−Lead Pinout Assignment (Top View)All V CC and V CCO pins are tied together on the die.Warning: All V CC , V CCO , and V EE pins must be externally connected to Power Supply to guarantee proper operation.Table 1. PIN DESCRIPTIONPIN FUNCTIONP0−P 7Q 0−Q 7CE PE MR CLK TC TCLD NCV CC , V CCO V EEECL Parallel Data (Preset) Inputs ECL Data OutputsECL Count Enable Control InputECL Parallel Load Enable Control Input ECL Master Reset ECL ClockECL Terminal Count Output ECL TC −Load Control Input No Connect Positive Supply Negative SupplyFigure 2. 8−Bit Binary Counter Logic CounterPE TCLDCEPOMRCLKTable 2. FUNCTION TABLEFUNCTIONCE PE TCLD MR CLK Load Parallel (P n to Q n )X L X L Z Continuous CountL H L L Z Count; Load Parallel on TC = LOW L H H L Z HoldH H X L Z Masters Respond, Slaves Hold X X X L ZZ Reset (Q n : = LOW, TC : = HIGH)XXXHXZ = clock pulse (low to high);ZZ = clock pulse (high to low)Table 3. EXPANDED FUNCTION TABLEFunction PE CE MR TCLD CLK P7−P4P3P2P1P0Q7−Q4Q3Q2Q1Q0TC Load L X L X Z H H H L L H H H L L H Count H L L L Z X X X X X H H H L H HH L L L Z X X X X X H H H H L HH L L L Z X X X X X H H H H H LH L L L Z X X X X X L L L L L H Load L X L X Z H H H L L H H H L L H Hold H H L X Z X X X X X H H H L L HH H L X Z X X X X X H H H L L H Load On H L L H Z H L H H L H H H L H H Terminal H L L H Z H L H H L H H H H L H Count H L L H Z H L H H L H H H H H LH L L H Z H L H H L H L H H L HH L L H Z H L H H L H L H H H HH L L H Z H L H H L H H L L L H Reset X X H X X X X X X X L L L L L HTable 4. ATTRIBUTESCharacteristics ValueInternal Input Pulldown Resistor50 k WInternal Input Pullup Resistor50 k WESD Protection Human Body ModelMachine Model > 2 kV > 200 VMoisture Sensitivity, Indefinite Time Out of Drypack (Note 1)Pb Pkg Pb−Free PkgPLCC−28Level 1Level 3 Flammability Rating Oxygen Index: 28 to 34UL 94 V−0 @ 0.125 in Transistor Count592 DevicesMeets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test1.For additional information, see Application Note AND8003/D.Table 5. MAXIMUM RATINGSSymbol Parameter Condition 1Condition 2Rating Unit V CC PECL Mode Power Supply V EE = 0 V8VV I PECL Mode Input VoltageNECL Mode Input Voltage V EE = 0 VV CC = 0 VV I V CCV I V EE6−6VI out Output Current ContinuousSurge 50100mAmAT A Operating Temperature Range0 to +85°C T stg Storage Temperature Range−65 to +150°Cq JA Thermal Resistance (Junction−to−Ambient)0 lfpm500 lfpm PLCC−28PLCC−2863.543.5°C/W°C/Wq JC Thermal Resistance (Junction−to−Case)Standard Board PLCC−2822 to 26°C/WT sol Wave Solder PbPb−Free 265265°CMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.Table 6. 10E SERIES PECL DC CHARACTERISTICS V CCx = 5.0 V; V EE = 0.0 V (Note 1)0°C25°C85°CSymbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit I EE Power Supply Current151181151181151181mA V OH Output HIGH Voltage (Note 2)398040704160402041054190409041854280mV V OL Output LOW Voltage (Note 2)305032103370305032103370305032273405mV V IH Input HIGH Voltage383039954160387040304190394041104280mV V IL Input LOW Voltage305032853520305032853520305033023555mV I IH Input HIGH Current150150150m AI IL Input LOW Current0.50.30.50.250.30.2m A NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.1.Input and output parameters vary 1:1 with V CC. V EE can vary −0.46 V / +0.06 V.2.Outputs are terminated through a 50 W resistor to V CC− 2.0 V.Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit I EE Power Supply Current151181151181151181mA V OH Output HIGH Voltage (Note 4)−1020−930−840−980−895−810−910−815−720mV V OL Output LOW Voltage (Note 4)−1950−1790−1630−1950−1790−1630−1950−1773−1595mV V IH Input HIGH Voltage−1170−1005−840−1130−970−810−1060−890−720mV V IL Input LOW Voltage−1950−1715−1480−1950−1715−1480−1950−1698−1445mV I IH Input HIGH Current150150150m A I IL Input LOW Current0.50.30.50.0650.30.2m A NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.3.Input and output parameters vary 1:1 with V CC. V EE can vary −0.46 V / +0.06 V.4.Outputs are terminated through a 50 W resistor to V CC− 2.0 V.Table 8. 100E SERIES PECL DC CHARACTERISTICS V CCx = 5.0 V; V EE = 0.0 V(Note 5)Symbol Characteristic0°C25°C85°CUnit Min Typ Max Min Typ Max Min Typ MaxI EE Power Supply Current151181151181174208mA V OH Output HIGH Voltage (Note 6)397540504120397540504120397540504120mV V OL Output LOW Voltage (Note 6)319032953380319032553380319032603380mV V IH Input HIGH Voltage383539754120383539754120383539754120mV V IL Input LOW Voltage319033553525319033553525319033553525mV I IH Input HIGH Current150150150m A I IL Input LOW Current0.50.30.50.250.50.2m A NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.5.Input and output parameters vary 1:1 with V CC. V EE can vary −0.46 V / +0.8 V.6.Outputs are terminated through a 50 W resistor to V CC− 2.0 V.Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit I EE Power Supply Current151181151181174208mA V OH Output HIGH Voltage (Note 8)−1025−950−880−1025−950−880−1025−950−880mV V OL Output LOW Voltage (Note 8)−1810−1705−1620−1810−1745−1620−1810−1740−1620mV V IH Input HIGH Voltage−1165−1025−880−1165−1025−880−1165−1025−880mV V IL Input LOW Voltage−1810−1645−1475−1810−1645−1475−1810−1645−1475mV I IH Input HIGH Current150150150m A I IL Input LOW Current0.50.30.50.250.50.2m A NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.7.Input and output parameters vary 1:1 with V CC. V EE can vary −0.46 V / +0.8 V.8.Outputs are terminated through a 50 W resistor to V CC− 2.0 V.Table 10. AC CHARACTERISTICS V CCx= 5.0 V; V EE = 0.0 V or V CCx = 0.0 V; V EE = −5.0 V (Note 9)0°C25°C85°CSymbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit f MAX Maximum Toggle Frequency700700700MHz f COUNT Maximum Count Frequency700900700900700900MHz t PLH, t PHL Propagation Delay to Output psCLK to Q500725900500725900500725900MR to Q500775900500775900500775900CLK to TC500775900500775900500775900MR to TC500775900500775900500775900t s Setup Time (to CLK +)psPn150−30150−30150−30CE600400600400600400PE600400600400600400TCLD500300500300500300t h Hold Time (to CLK +)Pn350100350100350100CE400200400200400200PE020*********TCLD100−300100−300100−300t RR Reset Recovery Time900700900700900700ps t PW Minimum Pulse Width psCLK, MR400400400t JITTER Random Clock Jitter (RMS)< 1< 1< 1ps t r, t f Rise/Fall Times (20 − 80%)200510700200510700200510700ps NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.9.10 Series: V EE can vary −0.46 V / +0.06 V.100 Series: V EE can vary −0.46 V / +0.8 V.APPLICATIONS INFORMATIONCascading Multiple E016 DevicesFor applications which call for larger than 8−bit counters multiple E016s can be tied together to achieve very wide bit width counters. The active low terminal count (TC) output and count enable input (CE) greatly facilitate the cascading of E016 devices. Two E016s can be cascaded without the need for external gating, however for counters wider than 16bits external OR gates are necessary for cascade implementations.Figure 3 below pictorially illustrates the cascading of 4E016s to build a 32−bit high frequency counter. Note the E101 gates used to OR the terminal count outputs of the lower order E016s to control the counting operation of the higher order bits. When the terminal count of the preceding device (or devices) goes low (the counter reaches an all 1s state) the more significant E016 is set in its count mode and will count one binary digit upon the next positive clock transition. In addition, the preceding devices will also count one bit thus sending their terminal count outputs back to a high state disabling the count operation of the more significant counters and placing them back into hold modes.Therefore, for an E016 in the chain to count, all of the lower order terminal count outputs must be in the low state. The bit width of the counter can be increased or decreased by simply adding or subtracting E016 devices from Figure 3 and maintaining the logic pattern illustrated in the same figure.The maximum frequency of operation for the cascaded counter chain is set by the propagation delay of the TC output and the necessary setup time of the CE input and the propagation delay through the OR gate controlling it (for 16−bit counters the limitation is only the TC propagation delay and the CE setup time). Figure 3 shows EL01 gates used to control the count enable inputs, however, if the frequency of operation is lower a slower, ECL OR gate can be used. Using the worst case guarantees for these parameters from the ECLinPS data book, the maximum count frequency for a greater than 16−bit counter is 500 MHz and that for a 16−bit counter is 625 MHz.Note that this assumes the trace delay between the TC outputs and the CE inputs are negligible. If this is not the case estimates of these delays need to be added to the calculations.Figure 3. 32−Bit Cascaded E016 CounterCLOCKLOADProgrammable DividerThe E016 has been designed with a control pin which makes it ideal for use as an 8−bit programmable divider. The TCLD pin (load on terminal count) when asserted reloads the data present at the parallel input pin (Pn’s) upon reaching terminal count (an all 1s state on the outputs). Because this feedback is built internal to the chip, the programmable division operation will run at very nearly the same frequency as the maximum counting frequency of the device. Figure 4below illustrates the input conditions necessary for utilizing the E016 as a programmable divider set up to divide by 113.Figure 4. Mod 2 to 256 Programmable Divider To determine what value to load into the device to accomplish the desired division, the designer simply subtracts the binary equivalent of the desired divide ratio from the binary value for 256. As an example for a divide ratio of 113:Pn’s = 256 − 113 = 8F 16 = 1000 1111where:P0 = LSB and P7 = MSBForcing this input condition as per the setup in Figure 4will result in the waveforms of Figure 5. Note that the TC output is used as the divide output and the pulse duration isequal to a full clock period. For even divide ratios, twice the desired divide ratio can be loaded into the E016 and the TC output can feed the clock input of a toggle flip flop to create a signal divided as desired with a 50% duty cycle.Table 11. Preset Values for Various Divide RatiosDivide Ratio Preset Data Inputs P7P6P5P4P3P2P1P02H H H H H HH L 3H H H H H H L H 4H H H H H H L L 5H H H H H L H H w w •••••••w ••••••••112H L L H L L L L 113H L L L H H H H 114H L L L H H H L ••••••••••••••••••254L L L L L L H L 255L L L L L L L H 256LLLLLLLLA single E016 can be used to divide by any ratio from 2to 256 inclusive. If divide ratios of greater than 256 are needed multiple E016s can be cascaded in a manner similar to that already discussed. When E016s are cascaded to build larger dividers the TCLD pin will no longer provide a means for loading on terminal count. Because one does not want to reload the counters until all of the devices in the chain have reached terminal count, external gating of the TC pins must be used for multiple E016 divider chains.PEClockTCFigure 5. Divide by 113 E016 Programmable Divider WaveformsFigure 6. 32−Bit Cascaded E016 Programmable DividerFigure 6 shows a typical block diagram of a 32−bit divider chain. Once again to maximize the frequency of operation EL01 OR gates were used. For lower frequency applications a slower OR gate could replace the EL01. Note that for a 16−bit divider the OR function feeding the PE (program enable) input CANNOT be replaced by a wire OR tie as the TC output of the least significant E016 must also feed the CE input of the most significant E016. If the two TC outputs were OR tied the cascaded count operation would not operate properly. Because in the cascaded form the PE feedback is external and requires external gating, the maximum frequency of operation will be significantly less than the same operation in a single device.Maximizing E016 Count FrequencyThe E016 device produces 9 fast transitioning single−ended outputs, thus V CC noise can become significant in situations where all of the outputs switch simultaneously in the same direction. This V CC noise can negatively impact the maximum frequency of operation of the device. Since the device does not need to have the Q outputs terminated to count properly, it is recommended that if the outputs are not going to be used in the rest of the system they should be left unterminated. In addition, if only a subset of the Q outputs are used in the system only those outputs should be terminated. Not terminating the unused outputs will not only cut down the V CC noise generated but will also save in total system power dissipation. Following these guidelines will allow designers to either be more aggressive in their designs or provide them with an extra margin to the published data book specifications.Figure 7. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.)V TTV TT = V CC − 2.0 VORDERING INFORMATIONDevicePackage Type Shipping †MC10E016FN PLCC −2837 Units/Rail MC10E016FNG PLCC −28(Pb −Free)37 Units/Rail MC10E016FNR2PLCC −28500 Units/Reel MC10E016FNR2G PLCC −28(Pb −Free)500 Units/Reel MC100E016FN PLCC −2837 Units/Rail MC100E016FNG PLCC −28(Pb −Free)37 Units/Rail MC100E016FNR2PLCC −28500 Units/Reel MC100E016FNR2GPLCC −28(Pb −Free)500 Units/Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSPLCC−28FN SUFFIXPLASTIC PLCC PACKAGECASE 776−02ISSUE ESMALLER THAN 0.025 (0.635).11MECL is a trademark of Motorola, Inc.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
MC10E016中文资料
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
8 Bit Synchronous Binary Up Counter
The MC10E/100E016 is a high-speed synchronous, presettable, cascadable 8-bit binary counter. Architecture and operation are the same as the MC10H016 in the MECL 10H family, extended to 8-bits, as shown in the logic symbol. The counter features internal feedback of TC, gated by the TCLD (terminal count load) pin. When TCLD is LOW (or left open, in which case it is pulled LOW by the internal pull-downs), the TC feedback is disabled, and counting proceeds continuously, with TC going LOW to indicate an all-one state. When TCLD is HIGH, the TC feedback causes the counter to automatically reload upon TC = LOW, thus functioning as a programmable counter. The Qn outputs do not need to be terminated for the count function to operate properly. To minimize noise and power, unused Q outputs should be left unterminated.
FCC声明说明书
Federal Communications Commission (FCC) Statement (011898)This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with instructions contained in this manual, may cause harmful interference to radio and television communications. However, there is no guarantee that interference will not occur in a particular installation.If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:-REORIENT OR RELOCATE THE RECEIVING ANTENNA-INCREASE THE SEPARATION BETWEEN THE EQUIPMENT AND THE RECEIVER -CONNECT THE EQUIPMENT INTO AN OUTLET ON A CIRCUIT DIFFERENT FROM THAT OF THE RECEIVER-CONSULT THE DEALER OR AN EXPERIENCED AUDIO/TELEVISION TECHNICIANNOTE:Connecting this device to peripheral devices that do not comply with Class B requirements, or using an unshielded peripheral data cable, could also result in harmful interference to radio or television reception.The user is cautioned that any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.To ensure that the use of this product does not contribute to interference, it isnecessary to use shielded I/O cables.CopyrightThis manual is copyrighted with all rights reserved. No portion of this manual may be copied or reproduced by any means.While every precaution has been taken in the preparation of this manual, no responsibility for errors or omissions is assumed. Neither is any liability assumed for damages resulting from the use of the information contained herein.TrademarksAll brand names, logos and registered trademarks mentioned are property of their respective owners.Table of ContentsHARDWARE CONFIGURATION (3)Key Features (3)Motherboard Layout (5)Jumper Settings (6)CPU Speed Selection (6)SW1, SW2 - CPU Frequency Ratio (6)SW3 - VID[0:4] Code to Voltage Definition (7)J7 - CMOS Clear (8)J2 - On Board AC97 Codec Sound (8)Pin Assignment (9)HARDWARE SETUP (10)T o Install DIMMs (10)Installing a New Processor (11)To Install a Processor to ZIF Socket (11)Connect the processor Fan Connector (11)BIOS SETUP (12)Starting Setup (12)Main Menu (13)Standard CMOS Features (14)Advanced BIOS Features (16)Advanced Chipset Features (16)Integrated Peripherals (16)Power Management Setup (16)PnP/PCI Configurations (16)PC Health Status (16)Frequency/Voltage Control (16)Set Supervisor/User Password (16)Flash Update Procedure (18)APPENDIX (19)Select the Heatsink (19)Select the Power Supply (20)HARDWARE CONFIGURATIONKey Features:Chipset•VIA® KT133/KT133A Chipset.Processor•Full support for the AMD Duron TM and Athlon TM processors using Socket A.•Supports 100MHz & 133MHz (optional) bus speed including all processors using Socket A.VRM 9.0 (Voltage Regulator Modules) on Board•Flexible motherboard design with on board VRM 9.0.System Memory• A total of three 168-pin DIMM sockets (3.3V Synchronous DRAM).•Supports Synchronous DRAM PC100/PC133.•Memory size up to 1.5G bytes.•Supports SDRAM memory types.•Supports single-density DIMMs of 1MB, 2MB, 4MB, 8MB and 16MB depth (x64).•Supports double-density DIMMs of 2MB, 4MB, 8MB, 16MB and 32MB depth (x64).•Supports single & double sided DIMMs.•Banks of different DRAM types depths can be mixed.System BIOS•2MB flash BIOS supporting PnP, APM, ATAPI and Windows® 95.•Auto detects and supports LBA hard disks with capacities up to 8.4GB.•Full support of ACPI & DMI.•Easy to upgrade BIOS by end-user.Dual BIOS•As our dual BIOS use the awdflash ver.7.83 to flash the dual BIOS, so our dual BIOS support the flash type of the awdflash ver.7.83, such as Syncmos,ATMEL etc..•The normal boot sequence is from main BIOS. If one BIOS is fail to boot, you can press the ‘Reset’ button to boot from the other BIOS (Note: no every time issuccess, you can try it several times or touch button time is enough long, forexample 2~3 second).•If the BIOS error that contained in compressed part of BIOS bin file, our dual BIOS can know to automatic flash, but the boot block error can not know to flash, that is: If the BIOS bin file is damage, it will auto flash BIOS, and if the bin file is OKeven different with the board bin file, computer will boot normal without enter the flash screen). If the user want to flash the BIOS unconditionally, you can press the ‘Alt + F2’ key to flash another BIOS.On-board I/O•On board two PCI fast IDE ports supporting up to 4 ATA and Ultra DMA33/66/ 100 (optional) IDE devices.•Supports bus master IDE, PIO mode 4 (up to 16.6M bytes/sec) and Ultra DMA33/66/100 (optional) (up to 33/66/100M (optional) bytes/sec) transfer.•One ECP/EPP parallel port.•Two 16550-compatible UART serial ports.•One floppy port, supports two FDDs of 360KB, 720KB, 1.2MB, 1.44MB and 2.88MB capacity.•Four USB ports.•PS/2 mouse port.•PS/2 keyboard port.•Infrared (IrDA) is supported.•One Line/Speaker out, one Mic in, one Line in and MIDI/Game port (optional).Plug-and-Play•Supports plug-and-play specification 1.1.•Plug-and-play for DOS, Windows® 3.X, Windows® 95 as well as Windows® 98.•Fully steerable PCI interrupts.On-board AC97 Sound•Integrated AC97 controller with standard AC97 codec.•Direct Sound and Sound Blaster compatible.•Full-Duplex 16-bit record and playback.•PnP and APM 1.2 support.On-board Creative Sound (optional)•Creative ES1373 Audio controller.•128 voice wave table synthesizer.•DOS game compatibility.•PCI bus master for fast DMA.•Fully compliant with PC97 power management specification.(Note: If Creative PCI Sound is on board, only Primary AMR Card can be used. If Creative PCI Sound is enabled, Bus Master Device on one PCI cannot be used.)Power Management•Supports SMM, APM and ACPI.•Break switch for instant suspend/resume on system operations.•Energy star “Green PC” compliant .•WOL (Wake-On-Lan) Header support.•External Modem Ring-in Wake-up support.•Support auto setting or manual setting for CPU voltage.•Supports suspend-to-RAM (STR) (optional).Expansion Slots• 5 PCI bus master slots (Rev. 2.1 compliant).• 1 Audio Modem Riser (AMR) (optional).• 1 ISA slot (1 ISA slot share with 1 PCI slot).• 1 universal AGP slot (AGP 2.0 compliant - 4X mode support).CAUTIONStatic electricity can harm delicate components of the motherboard. To prevent damage caused by static electricity, discharge the static electricity from yourbody before you touch any of the computers electronic components.Motherboard LayoutThe following diagrams show the relative positions of the jumpers, connectors, major components and memory banks on the motherboard.# The AMR slot is optional.NOTE1)Be sure to check the cable orientation in order to match the colored strip tothe pin 1 end of the connector.2)When you start up the system, please wait for 5 seconds after you poweron AC.Jumper SettingsThis chapter explains how to configure the motherboard’s hardware. Before using your computer, make sure all jumpers and DRAM modules are set correctly. Refer to this chapter whenever in doubt.CPU Speed SelectionIn this motherboard, you can set the CPU speed by manual or auto way, but over clock isn’t recommended.SW1, SW2 - CPU Frequency RatioSW2[1:5]SW1[1:4] SW2[1:5] CPU FREQ1 2 3 4 5SW3 - VID[0:4] Code to Voltage DefinitionSW1(6) Off, Auto Setting SW1(6) On, Manual Setting。
CompactPCI+a+Specification标准
P r o p e r t y o f M o t o r o l a F orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 CompactPCI® Specification October 1, 1999P r o p e r t y o f M o t o r o l aF o r I n t e r n a l U s e O n l y - E x t e r n a l D i s t r i b u t i o n P r o h i b i t e dP r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te dRelease Note for PICMG 2.0 Revision 3.0 CompactPCI ® Specification October 1, 1999P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d Purpose This Release Note records some issues raised in the course of developing and balloting PICMG 2.0 Revision 3.0, the CompactPCI core specification. 1. System Management Bus pin assignments . This specification reserves pins on J1/P1 of all slots and J2/P2 of the System Slot for definition as I 2C System Management Busses by PICMG 2.9, CompactPCI System Management Specification. These signals have been tentatively assigned by the PICMG 2.9 as indicated in Section 3.2.7.7 and in Tables 13 through 16 with their notes. The IPMB_SDA pin is an I2C data bus connecting all slots in a backplane. The IPMB_SCL pin is the clock associated with that data line, and the IPMB_PWR pin is a power pin for the IPMB node. The data and clock pins providing System Slot access to platform devices from J2/P2 were designated ICMB_SDA and ICMB_SCL in the draft specification reviewed and adopted by the Executive Membership on October 1, 1999. These signal names are misleading, implying the use of an RS-485 UART bus as specified in the Intel IPMI documents. These signals are designated SMB_SDA and SMB_SCL in the released document. A second System Management power pin, designated ICMB_PWR in the executive draft, was also reserved on J2/P2 of the System Slot. As of the approval of PICMG 2.0 Revision 3.0, the PICMG 2.9 subcommittee is in doubt as to whether this pin will actually be used for power, and is considering assigning a different function to this reserved pin. The released specification accord designates this pin as SMB_RSV. 2. System Slot Hot Swap Signals . This specification designates Pin J1/P1 D15 as a short BD_SEL# (Board Select) signal in agreement with PICMG 2.1, CompactPCI Hot Swap Specification, but only on peripheral slots. The pin is shown as a ground on System Slots. Implementers of CompactPCI boards and systems should anticipate that this signal may also be designated as BD_SEL# on System Slots in PICMG 2.13, CompactPCI Redundant System Slot Specification. J1/P1 Pin B4 is designated as the HEALTHY# signal on System and Peripheral Slots in this specification. ###P r o p e r t y o f M o t o r o l a F orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0CompactPCI® SpecificationOctober 1, 1999P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99ii ©Copyright 1995, 1996, 1997, 1998, 1999 PCI Industrial Computers Manufacturers Group (PICMG).The attention of adopters is directed to the possibility that compliance with or adoption of PICMG ® specifications may require use of an invention covered by patent rights.PICMG ® shall not be responsible for identifying patents for which a license may be required by any PICMG ® specification, or for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG ® specifications are prospective and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.NOTICE:The information contained in this document is subject to change without notice. The material in this document details a PICMG ® specification in accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this specification in any company's products.WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG ® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.In no event shall PICMG ® be liable for errors contained herein or for indirect, incidental,special, consequential, reliance or cover damages, including loss of profits, revenue, data or use, incurred by any user or any third pliance with this specification does not absolve manufacturers of CompactPCI equipment, from the requirements of safety and regulatory agencies (UL, CSA, FCC,IEC, etc.).PICMG ®, CompactPCI ®, and the PICMG ® and CompactPCI ® logos are registered trademarks of the PCI Industrial Computers Manufacturers Group.All other brand or product names may be trademarks or registered trademarks of their respective holders.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99iii Contents1OVERVIEW.........................................................................................................................................91.1C OMPACT PCI O BJECTIVES ................................................................................................................91.2B ACKGROUND AND T ERMINOLOGY ....................................................................................................91.3D ESIRED A UDIENCE ...........................................................................................................................91.4C OMPACT PCI F EATURES .................................................................................................................101.5A PPLICABLE D OCUMENTS ................................................................................................................101.6A DMINISTRATION .............................................................................................................................111.7N AME A ND L OGO U SAGE .................................................................................................................112FEATURE SET..................................................................................................................................132.1F ORM F ACTOR .................................................................................................................................132.2C ONNECTOR .....................................................................................................................................152.3M ODULARITY ...................................................................................................................................162.4H OT S WAP C APABILITY ....................................................................................................................163ELECTRICAL REQUIREMENTS..................................................................................................173.1B OARD D ESIGN R ULES .....................................................................................................................173.1.1Decoupling Requirements......................................................................................................173.1.2CompactPCI Signal Additions...............................................................................................183.1.3CompactPCI Stub Termination..............................................................................................183.1.4Peripheral Board Signal Stub Length ...................................................................................183.1.5Characteristic Impedance......................................................................................................193.1.6System Slot Board Signal Stub Length ..................................................................................193.1.7Peripheral Board PCI Clock Signal Length..........................................................................193.1.8Pull-Up Location...................................................................................................................193.1.9Board Connector Shield Requirements.................................................................................203.2B ACKPLANE D ESIGN R ULES .............................................................................................................213.2.1Characteristic Impedance......................................................................................................213.2.2Eight-Slot Backplane Termination........................................................................................213.2.3Signaling Environment..........................................................................................................223.2.4IDSEL Assignment.................................................................................................................223.2.5REQ#/GNT# Assignment.......................................................................................................233.2.6PCI Interrupt Binding............................................................................................................243.2.7CompactPCI Signal Additions...............................................................................................253.2.8Power Distribution................................................................................................................283.2.9Power Decoupling.................................................................................................................293.2.10Healthy (Healthy#)................................................................................................................303.333 MH Z PCI C LOCK D ISTRIBUTION .................................................................................................303.3.1Backplane Clock Routing Design Rules................................................................................313.3.2System Slot Board Clock Routing Design Rules....................................................................313.464-B IT D ESIGN R ULES ......................................................................................................................313.566 MH Z E LECTRICAL R EQUIREMENTS .............................................................................................333.5.166 MHz Board Design Rules.................................................................................................333.5.266 MHz System Board Design Rules.....................................................................................343.5.366MHz Backplane Design Rules...........................................................................................343.5.466MHz PCI Clock Distribution.............................................................................................343.5.566 MHz System Slot Board Clock Routing Design Rules (35)3.5.666 MHz Hot Swap (35)3.6S YSTEM AND B OARD G ROUNDING (36)3.6.1Board Front Panel Grounding Requirements (36)3.6.2Backplane Grounding Requirements (36)3.7C OMPACT PCI B UFFER M ODELS (36)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99iv 4MECHANICAL REQUIREMENTS................................................................................................374.1B OARD R EQUIREMENTS ...................................................................................................................374.1.13U Boards..............................................................................................................................374.1.26U Boards..............................................................................................................................374.1.3Rear-panel I/O Boards..........................................................................................................374.1.4ESD Discharge Strip.............................................................................................................384.1.5ESD Clip................................................................................................................................384.1.6Cross Sectional View.............................................................................................................394.1.7Component Outline and Warpage.........................................................................................394.1.8Solder Side Cover..................................................................................................................394.1.9Front Panels..........................................................................................................................484.1.10System Slot Identification......................................................................................................494.2R EAR -P ANEL I/O B OARD R EQUIREMENTS .......................................................................................524.2.1Mechanicals...........................................................................................................................524.2.2Power.....................................................................................................................................524.2.3Rear Panel Keying.................................................................................................................534.3B ACKPLANE R EQUIREMENTS ...........................................................................................................534.3.1Connector Orientation...........................................................................................................534.3.2Slot Spacing...........................................................................................................................534.3.3Slot Designation....................................................................................................................544.3.4Bus Segments.........................................................................................................................544.3.5Backplane Dimensions..........................................................................................................545CONNECTOR IMPLEMENTATION.............................................................................................585.1O VERVIEW .......................................................................................................................................585.1.1Location.................................................................................................................................585.1.2Housing Types.......................................................................................................................595.1.3Connector Tail Lengths.........................................................................................................595.1.4Backplane / Board Population Options.................................................................................595.2J1 (32-B IT PCI S IGNALS ).................................................................................................................595.3J2 C ONNECTOR ................................................................................................................................605.3.1Peripheral Slot 64-Bit PCI....................................................................................................605.3.2Peripheral Slot Rear-Panel I/O.............................................................................................605.3.3System Slot 64-bit PCI...........................................................................................................605.3.4System Slot Rear-Panel I/O...................................................................................................605.4B USSED R ESERVED P INS ..................................................................................................................605.5N ON -B USSED R ESERVED P INS .........................................................................................................605.6P OWER P INS .....................................................................................................................................605.75V/3.3V PCI K EYING ......................................................................................................................615.8P IN A SSIGNMENTS PACTPCI BUFFER MODELS...............................................................................................69B.CONNECTOR IMPLEMENTATION.............................................................................................73B.1G ENERAL .........................................................................................................................................73B.2C ONNECTORS ...................................................................................................................................73B.3A LIGNMENT .....................................................................................................................................73B.3.1Front Plug-In Board Alignment............................................................................................73B.3.2Rear Panel I/O Board Alignment..........................................................................................74B.3.3Backward Compatibility for Rear Panel I/O Boards. (74)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99v TablesT ABLE 1. C ODING K EY C OLOR A SSIGNMENTS ..............................................................................................15T ABLE 2. B OARD D ECOUPLING R EQUIREMENTS ...........................................................................................17T ABLE 3. S TUB T ERMINATION R ESISTOR ......................................................................................................18T ABLE 4. B OARD C HARACTERISTICS .............................................................................................................19T ABLE 5. P ULL -UP R ESISTOR V ALUES ...........................................................................................................20T ABLE 6. B ACKPLANE C HARACTERISTICS .....................................................................................................21T ABLE 7. S YSTEM TO L OGICAL S LOT S IGNAL A SSIGNMENTS ........................................................................23T ABLE 8. S YSTEM TO L OGICAL S LOT I NTERRUPT A SSIGNMENTS ..................................................................24T ABLE 9. P HYSICAL S LOT A DDRESSES ..........................................................................................................27T ABLE 10. P OWER S PECIFICATIONS ...............................................................................................................28T ABLE 11. B ACKPLANE D ECOUPLING R ECOMMENDATIONS ..........................................................................30T ABLE 12. C ODING K EY C OLOR A SSIGNMENTS AND P ART N UMBERS ...........................................................61T ABLE 13. C OMPACT PCI P ERIPHERAL S LOT 64-B IT C ONNECTOR P IN A SSIGNMENTS ...................................62T ABLE 14 C OMPACT PCI P ERIPHERAL S LOT R EAR -P ANEL I/O C ONNECTOR P IN A SSIGNMENTS ....................63T ABLE 15. C OMPACT PCI S YSTEM S LOT 64-BIT C ONNECTOR P IN A SSIGNMENT .............................................64T ABLE 16. C OMPACT PCI S YSTEM S LOT R EAR -P ANEL I/O C ONNECTOR P IN A SSIGNMENTS ..........................65T ABLE 17. R EVISION H ISTORY . (67)P r o p e r t y o f M o t o r o l a F o r I n t e r n a l U s e O n l y - E x t e r n a l D i s t r i b u t i o n P r o h i b i t e d PICMG 2.0 R3.0 10/1/99vi This page is left intentionally blank.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99vii IllustrationsF IGURE 1. 3U 64-B IT C OMPACT PCI F ORM F ACTOR ......................................................................................13F IGURE 2. 3U C OMPACT PCI B ACKPLANE E XAMPLE .....................................................................................14F IGURE 3. PCI S IGNAL T ERMINATION ...........................................................................................................22F IGURE 4. L OCAL 64 B IT I NITIALIZATION ......................................................................................................33F IGURE 5. ESD C LIP L OCATION ....................................................................................................................39F IGURE 6. 3U B OARD ....................................................................................................................................40F IGURE 7. 6U B OARD ....................................................................................................................................41F IGURE 8. F RONT S IDE B OARD ESD D IMENSIONS .........................................................................................42F IGURE 9. 3U R EAR -P ANEL I/O B OARD D IMENSIONS ...................................................................................43F IGURE 10. 6U R EAR P ANEL I/O B OARD D IMENSIONS ..................................................................................44F IGURE 11. R EAR P ANEL I/O ESD D IMENSIONS ...........................................................................................45F IGURE 12. C ROSS S ECTIONAL B OARD , C ONNECTOR , B ACKPLANE AND F RONT P ANEL V IEW ......................46F IGURE 13. C OMPONENT O UTLINE ................................................................................................................47F IGURE 15. C OMPACT PCI C OMPATIBILITY G LYPHS ......................................................................................48F IGURE 16. C OMPACT PCI L OGO ...................................................................................................................48F IGURE 17. 3U EMC F RONT P ANEL ..............................................................................................................50F IGURE 18. 6U EMC F RONT P ANEL ..............................................................................................................51F IGURE 19. 3U B ACKPLANE E XAMPLE - F RONT V IEW ..................................................................................53F IGURE 20. 3U B ACKPLANE D IMENSIONS .....................................................................................................56F IGURE 21. 6U B ACKPLANE D IMENSIONS .....................................................................................................57F IGURE 22. 3U C ONNECTOR I MPLEMENTATION ............................................................................................58F IGURE 23. 6U C ONNECTOR I MPLEMENTATION ............................................................................................58F IGURE 24. 5V S TRONG PCI M ODEL ............................................................................................................69F IGURE 25. 5V W EAK PCI M ODEL ...............................................................................................................70F IGURE 26. 3.3V S TRONG PCI M ODEL .........................................................................................................70F IGURE 27. 3.3V W EAK PCI M ODEL (71)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99viii This page is left intentionally blank.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d 1. Overview CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99Page 9 of 741 Overview 1.1 CompactPCI Objectives CompactPCI is an adaptation of the Peripheral Component Interconnect (PCI)Specification 2.1 or later for industrial and/or embedded applications requiring a more robust mechanical form factor than desktop PCI. CompactPCI uses industry standard mechanical components and high performance connector technologies to provide an optimized system intended for rugged applications. CompactPCI provides a system that is electrically compatible with the PCI Specification, allowing low cost PCI components to be utilized in a mechanical form factor suited for rugged pactPCI is an open specification supported by the PICMG (PCI Industrial Co m-puter Manufacturers Group), which is a consortium of companies involved in utiliz-ing PCI for embedded applications. PICMG controls this specification.1.2 Background and Terminology Eurocard - A series of mechanical board form factor sizes for rack-based systems as used in VME, Multibus II, and other applications defined by the Institute of Electri-cal and Electronics Engineers (IEEE) and International Electrotechnical Committee (IEC).ISA - Industry Standard Architecture. A specification by which Personal Com puters (PCs) add boards.PCI - Peripheral Component Interconnect. A specification for defining a common in-terconnect between logic components. Typically used for interconnecting high-speed,PC-compatible chipset components. The PCI specification is issued through the PCI Special Interest Group (PCI SIG).This specification utilizes several key words, which are defined below:may : A key word indicating flexibility of choice with no implied preference.shall : A key word indicating a mandatory requirement. Designers shall im-plement such mandatory requirements to ensure interchangeability and to claim conformance with the specification.should: A key word indicating flexibility of choice with a strongly preferred implementation.1.3 Desired AudienceCompactPCI exists to provide a standard form factor for those applications requiring the high performance of PCI as well as the small size and ruggedness of a rack mount system. CompactPCI provides a mechanism for OEM and end users to di-rectly apply PCI components and technology to a new mechanical form factor while。
MCR10EZHJL资料
ResistorsRev.A 1/4Thick film rectangular Low resistance seriesMCR10 (2012 size (0805 size) : 1 / 4W )z Features1) Power rating of 1 / 4W 2) Highly reliable chip resistorRuthenium oxide dielectric offers superior resistance to the elements. 3) Electrodes not corroded by solderingThick film makes the electrodes very strong.4) Design and specifications are subject to change without notice. Carefully check the specification sheet before using or ordering it.z Ratings0.25W (1 / 4W)−55°C to + 155°C at 70°CItemConditionsSpecificationsRated powerRated voltageOperating temperatureNominal resistance See Table 1.Limiting element voltage1.58V(10Ω)20406080100−55070100155AMBIENT TEMPERATURE (°C)P O W E R L O A D (%)Fig.1The voltage rating is calculated by the following equation. If the value obtained exceeds the limiting element voltage, the voltage rating is equal to the maximum operating voltage.E: Rated voltage (V)P: Rated power (W)R: Nominal resistance (Ω)E= P ×RPower must be derated according to the power derating curve in Figure 1 when ambient temperature exceeds 70°C .ResistorsRev.A 2/4F (±1%)J (±5%)0.15≤ R ≤ 9.1(E24)(E24)(E24)(E24)±2500.1≤ R ≤ 0.13(E24)400±2000.047 ≤ R ≤ 0.091(E24)500±3000.1 ≤ R ≤ 0.13400±2000.15 ≤ R ≤ 0.91±250500±3000.047 ≤ R ≤ 0.091Table 1Resistance tolerance Resistance range(Ω)Special specificationL L SL L SResistance temperature coefficient(ppm/°C)z Before using components in circuits where they will be exposed to transients such as pulse loads (short–duration, high– level loads), be certain to evaluate the component in the mounted state. In addition, the reliability and performance of this component cannot be guaranteed if it is used with a steady state voltage that is greater than its rated voltage.z CharacteristicsResistorsRev.A 3/4z Dimensions (Unit : mm)z PackagingResistorsRev.A 4/4z Part No. ExplanationSpecial part numberPart No.M C 1R Nominal resistanceE Z HJ LResistance tolerance ±1%±5%F J10Ω less than (class F)1Ω less than (class J)0.1Ω less thanL Sφ180) : JEITA ET-7200B: Standard productFL,FS,JSJL :: 4 digits 3 digitsResistance code, 3 or 4 digits.Resistancetolerance+Special P/NResistance codeAppendixAbout Export Control Order in JapanProducts described herein are the objects of controlled goods in Annex 1 (Item 16) of Export T rade ControlOrder in Japan.In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.Appendix1-Rev1.1。
PVS-16MH-CN PVS-18MH-CN PVS-20MH-CN PVS-24MH-CN 光伏
PVS-16_18_20_24MH-CN-UCN-Ver42-202204
PVS-16MH-CN/PVS-18MH-CN/PVS-20MH-CN/PVS-24MH-CN
6.3 输出接线..................................................................................................... 25 6.4 接地连接..................................................................................................... 26 6.5 通讯连接..................................................................................................... 28
2 安全须知 ........................................................................................................... 4 3 产品介绍 ........................................................................................................... 6
I
6 电气连接 ......................................................................................................... 19
MC10使用说明书
4
5
perfect in form and function
神形合一，完美呈现
技术参数
符合标准 测量标准 环境标准 安全标准 电磁兼容标准 IEC60687 0.5 ANSI C12.16 Class10 IEC61036 class1 IEC61268 class2 IEC 60068-2 IEC 61557-2 IEC61000－4/2-3-4-5-6-8-11 ,4 级标准
● ● ● ● ●
根植中国， 源于历史
1928年中国驻德大使蒋作宾和随从参观AEG工厂， 洽谈AEG产 品引入中国的计划 ● 1980年以技术转让的方式， 上海人民电器厂生产ME系列低压 空气断路器， 国内为RMW系列， 成为80年代和90年代初中国 市场最领先的产品 ● 1981年以技术转让的方式， 上海电器陶瓷厂生产NT有填料密 闭管式熔断器， 国内代号为RT16， 成为至今还在中国市场热销 的产品 ● 国内应用： 茂名电厂 、 秦山核电站、 上海通用汽车、 上海地铁、 洛阳玻璃集团 ......
测量精度
参数
电压 电流 频率
精度
1%(10% ~ 120%满刻度) 1%(2% ~ 120%满刻度) ±0.02Hz 2%(|PF|>0.5) 2%(|PF|>0.5) 2%(|PF|>0.5) 2%(|PF|>0.5) 2.0% 4.0% 1% 小于100ppm/℃ 0.5‰/年
分辨率
0.1V 0.001A 0.01Hz 0.001 0.001KW 0.001KVar 0.001KVA 0.1V 0.1KWh(0.1KVarh) 0.001A
5路报警继电器 机械式触点(常开) 100mΩ/1A,初始值 250Vac/30Vdc 5A 2000Vac rms
海德汉调试手册.
NC 版本: 340 49x-04 PLC 版本:Basic 54 HEIDENHAIN简明调试手册iTNC 530目录1,调试准备 (1)1.1本手册中标识的含义 (1)1.2 各模块概述 ...................................................................................................... 2 1.2.1 主计算机,硬盘, SIK .......................................................................................... 2 1.2.2 CC 控制单元 ........................................................................................................... 3 1.2.3UV106 B电源模块 ................................................................................................. 4 1.2.4 显示单元和键盘 . .................................................................................................... 5 1.2.5手轮 . ......................................................................................................................... 7 1.2.6 PLC 模块 ................................................................................................................ 8 1.2.7驱动模块 . .. (9)2, 系统连接 ........................................................................................... 10 2.1 一般信息 ........................................................................................................ 10 2.1.1 安全措施 . .............................................................................................................. 10 2.2硬盘(HDR 和 SIK 的安装 . ....................................................................... 11 2.3使用环境 ......................................................................................................... 13 2.3.1温度和湿度 . ........................................................................................................... 13 2.3.2空调 . ....................................................................................................................... 13 2.3.3机械振动 . ............................................................................................................... 14 2.3.4污染 . ....................................................................................................................... 14 2.3 安装空间 ........................................................................................................ 15 2.3.1一般信息 . ............................................................................................................... 15 2.3.2 MC 42x(C, CC42x(B, UV, UM, UE2xxB 安装空间 ......................................... 16 2.3.3显示器 . ................................................................................................................... 16 2.3电气设计重要事项 ......................................................................................... 17 2.3.1供电 . ....................................................................................................................... 17 2.3.2电气柜设计基本要求 . ........................................................................................... 17 2.3.3接地 . ....................................................................................................................... 17 2.4 电缆连接总图 ................................................................................................ 18 2.5 iTNC530连接概览 ..................................................................................... 23 2.6 供电 .............................................................................................................. 26 2.6.1 iTNC 530供电 . ................................................................................................... 26 2.6.2 系统内置 PLC 供电 ........................................................................................... 27 2.6.3 PLC 51x 扩展模块供电 ..................................................................................... 28 2.6.4 Control-Is-Ready 信号供电 . ............................................................................... 28 2.6.5 显示单元(BF 150供电 .. (28)i2.8 手轮 (29)2.8.1 HR 4xx便携式手轮 (30)2.9 PLC 输入信号 (31)3.9.1 输入信号和地址 . .................................................................................................. 31 2.9.2 MC 42x(C内置 PLC 输入信号 ......................................................................... 32 2.9.3 扩展模块 PL 510的输入点 ................................................................................. 33 2.10 PLC 输出信号 ........................................................................................... 34 2.11 PLC输入输出模块 ...................................................................................... 37 2.11.1 PLB511/PLB512 ................................................................................................. 38 2.12机床操作面板 ............................................................................................... 40 2.13 键盘单元 ...................................................................................................... 41 2.14 显示单元 ...................................................................................................... 42 2.15 驱动和电机的连接 ...................................................................................... 43 2.15.1 UV(R 1x0(D 电源模块 ................................................................................. 43 2.15.2 UM1xx(B(D驱动模块 ................................................................................... 47 2.15.3 电机 . .................................................................................................................. 49 2.16基本回路 MC_CC422_UV1xx_CMx .......................................................... 51 2.17 系统通电 (52)2.17.1 第一次通电 . (52)3, PLC 调试 (53)3.1 PLC软件的安装 (53)3.2海德汉 PLC 介绍 ........................................................................................... 54 3.2.1 PLCdesignNT软件 . ............................................................................................... 54 3.2.2 PLC基本程序简介 ............................................................................................... 56 3.3 PLC命令 ........................................................................................................ 57 3.3.1操作符类型 . ........................................................................................................... 57 3.3.2操作数 . ................................................................................................................... 58 3.4用户 PLC 程序的调试 ................................................................................... 60 3.4.1iTNC530编程站 PLC 程序编制 .......................................................................... 60 3.4.2 PLC举例 ............................................................................................................... 65 3.4.3 机床 PLC 程序编制 ............................................................................................. 68 3.5 PLC报警文本 ................................................................................................ 71 3.5.1 PLC 报警信息表结构 ........................................................................................... 71 3.5.2 举例PLC 报警信息 ............................................................................................. 72 3.6 PLC状态诊断 (78)4,驱动器和 NC 调试 . (81)4.2 基本参数的设定 (84)4.2.1编码器和机床 . (85)4.2.2 定位和控制 . (85)4.2.3主轴参数 . (86)4.2.4显示和硬件 . (87)4.3 NC的调试 ...................................................................................................... 87 4.3.1坐标轴及其速度和加速度 . ................................................................................... 87 4.3.2光栅尺和传动比的设定 . ....................................................................................... 88 4.3.3零点的设置 . ........................................................................................................... 89 4.3.4软限位 . ................................................................................................................... 93 4.3.5反向间隙补偿 . ....................................................................................................... 93 4.3.6丝杠螺距非线性误差补偿 . ................................................................................... 93 4.3.7 主轴的调试 . .......................................................................................................... 99 4.4 伺服优化准备 .............................................................................................. 100 4.4.1 TNCopt软件 . ....................................................................................................... 100 4.4.2 控制环原理介绍 . ................................................................................................ 102 4.5电流环优化 ................................................................................................... 102 4.5.1电流环优化准备 . ................................................................................................. 103 4.5.2手动优化电流环步骤:. ..................................................................................... 103 4.6速度环优化 ................................................................................................... 105 4.6.1速度环的脉冲响应 . ............................................................................................. 106 4.6.2速度环的阶跃响应 . ............................................................................................. 107 4.7前馈控制系数的优化 ................................................................................... 108 4.8 Kv系数优化 . ................................................................................................ 109 4.9圆周测试 (110)5,网络连接 (113)5.1设置 iTNC530数控系统的 IP 地址 . (113)5.2 个人电脑固定 IP 的设置步骤 (114)6,数据备份和恢复 (117)6.1数据备份 (117)6.2数据恢复 (121)7,机床参数表 (125)7.1“机床参数编辑”操作模式 ........................................................................ 125 7.2输入和输出机床参数 ................................................................................... 127 7.2.1输入格式 . ............................................................................................................. 127 7.2.2 激活机床参数列表 . .. (128)iii7.2.3 修改输入值 . .................................................................................................. 129 7.3 机床参数列表 . (130)7.3.1 编码器和机床 . (130)7.3.2 定位 . (134)7.3.3 使用速度前馈控制 . (139)7.3.4 使用跟随误差 . (140)7.3.5 速度和电流综合控制 . (141)7.3.6 主轴 . (148)7.3.7 内置 PLC (151)7.3.8 配置数据接口 . (154)7.3.9 3-D测头 (156)7.3.10 用 TT 测量刀具 . (158)7.3.11 攻丝 . (161)7.3.12 显示器和其操作 . (162)7.3.13 颜色 . (168)7.3.14 加工和程序运行 . (170)7.3.15 硬件 . (175)7.3.16 第二主轴 . (181)8, NC-PLC 接口 (183)8.1 Marker . (183)8.2 字和双字 (188)9,安装尺寸 (191)11,调试准备iTNC530是适用于镗、铣、加工中心类数控系统。
鸣志M2DC驱动器用户手册
2.3 电机型号介绍 ........................................................................................................................ 13 2.3.1 电机铭牌说明.............................................................................................................................. 13 2.3.2 电机型号说明.............................................................................................................................. 13 2.3.3 电机规格及尺寸 .......................................................................................................................... 14
MC100E163中文资料
LOGIC DIAGRAM
A2 A3 A4 A5 A6 A7 * All VCC and VCCO pins are tied together on the die.
FUNCTION TABLE
SEL2 L L L L H H H H SEL1 L L H H L L H H SEL0 L H L H L H L H
T L –M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L –M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L –M T L –M
S
N N
S
H
S
0.007 (0.180)
M
T L –M
S
N
S
M
S
C
E G G1 0.010 (0.250)
tSKEW
tr tf
1. Within-device skew is defined as identical transitions on similar paths through a device; n = 0-7, m n, m = 0-7.
MOTOROLA
2–2
ECLinPS and ECLinPS Lite DL140 — Rev 4
B2 25 B1 B0 SEL0 VEE SEL1 SEL2 A0 26 27 28 1 2 3 4 5 A1 6 7 8 9 10 11 A0 A1 A2 A/B Data 0 1 2 3 4 5 6 7 A3 A4 A5 A6 A7 SEL0 SEL1 SEL2 Function A Data Inputs B Data Inputs Select Inputs True Outputs Inverting Outputs To Side B QA QA B3 24 B4 23 B5 22 B6 21 B7 20 VCCO 19 18 17 16 15 14 13 12 QB QB VCC NC VCCO QA QA FN SUFFIX PLASTIC PACKAGE CASE 776-02
mcr16可控硅中文参数
mcr16可控硅中文参数
MCR16是一种可控硅，以下是它的中文参数：
1. 公称电压（Vdrm）：根据具体型号不同，可选的公称电压
范围为400V至1200V。
2. 阻断电压（Vrrm）：通常情况下，阻断电压等于公称电压。
3. 公称电流（Itm）：根据具体型号不同，可选的公称电流范
围为16A至100A。
4. 门极触发电流（Igt）：通常情况下，门极触发电流约为
10mA至45mA。
5. 保持电流（IH）：在触发电流条件下，保持电流通常小于
或等于50mA。
6. 关断电流（IH）：在正向电流条件下，关断电流通常小于
或等于65mA。
7. 触发电压范围（Vgt）：通常情况下，触发电压范围为0.8V
至1.5V。
8. 反向封装电压（VBR）：通常情况下，反向封装电压小于
或等于10V。
这些参数是根据一般情况下的典型数值给出的，实际型号和厂
商可能会有所不同。
在选择使用MCR16可控硅时，最好参考具体型号的数据手册以获取详细的参数信息。
MC100系列说明书(DOC)
MC100系列智能多媒体控制系统Intelligent Multimedia Control System（适用于MC100系列机型）用户安装手册User’s Manual* *请在安装使用前认真阅读本说明书**尊敬的用户：感谢您选购我们生产的这个系列多媒体中央控制器。
该产品具有外观设计小巧高档大方；使用简单方便；功能强大；可直接外接其他厂家的设备；二个可编程232口最多可同时控制两个不同厂家的投影机或其他设备；可对各接口重新定义和单独控制；投影机一键切换；投影幕自动升降；开机即是电脑画面等等多种实用功能。
为了您能安全地使用本设备，发挥其最大的功能，强烈建议在安装使用前先仔细阅读本说明书。
若有任何技术问题或对产品的意见和建议，请与本公司技术服务部联系。
联系方法如下：电话：（020）33534881 61087188传真：（020）61087188-8002地址：广州市天河软件园建工路9号4楼南区A1邮编：510665E-mail：laitong@http：//特别提醒：1. 在使用本系统的时候，严禁在开机时对各个部件进行插拔（特别是通讯口及VGA接口，这可能会人为损坏设备）。
2. 本控制器为智能开关设计，在雷雨天气或长时间不使用时，请关闭电源总闸。
3. 本控制器内有强电模块，严禁带电自行维修。
4．因中控本身已做好接地处理，为有效保护中控及设备，请在强电输入部分做好接地措施！目录一．系统说明1，中控简介 (5)2，简单使用说明 (5)二，硬件连接1，连线说明 (6)三，系统设置1，系统通讯协议 (8)2，开机状态设置 (10)3，开关机流程设置 (11)4，开关延时设置 (12)5，投影机设置 (12)6，红外学习 (14)7，按键面板设置 (15)8，其它设置 (16)四，常见故障处理1，按控制面板“系统开”无法开机 (18)2，红外学习不成功或显示成功却不能遥控 (18)3，有些设备红外遥控不灵 (19)4，投影机打不开 (19)5，中控与电脑连接失败 (19)一、系统说明1. 中控简介智能多媒体控制器为简单电化教室、会议室及家居提供了很好的解决方案。
MITSUBISHI 图形操作终端GOT1000 主机 说明书
● GOT主机、电缆的故障，会导致输出一直保持ON或者OFF状态。 对于与重大事故有关的输出信号，请在外部设计监视回路。 否则误输出、误动作有可能导致事故发生。
● 如果GOT执行监控时发生通信异常(包括电缆脱落)，GOT和PLC CPU的通信中断，则GOT 无法动作。 使用GOT构建系统时，请考虑如果GOT通信异常在系统中执行重要动作的开关，要使用 GOT以外的装置来执行。 否则误输出、误动作有可能导致事故发生。
A-4
【运输注意事项】 注意
● GOT是精密设备，因此在运输过程中，请避免受到的冲击超过本手册中记载的能承受 值。 否则可能会造成GOT故障。在运输后，请确认模块的动作。
A-5
印刷日期 2006年12月
※手册编号 JY997D24701
版本 A
修改内容 第一版
本书并不对工业知识产权或其它任何种类权利的实施予以保证，也不承诺实施权。 此外，对于因使用本书中记载的内容而造成的工业知识产权方面的各种问题，本公司不 承担任何责任。
2.2.1 GO T(GT10)....................................................................................................................2-3 2.2.2 选件设备(GT10中可以使用的选件设备).........................................................................2-3
第5章 安装........................................................5-1~5-6
西门子 S7-1200 功能安全手册 - 设备手册说明书
SIMATICS7S7-1200 功能安全手册设备手册Siemens AGDigital IndustriesⓅ 10/2022 本公司保留更改的权利 Copyright © Siemens AG 2022. 保留所有权利法律资讯警告提示系统为了您的人身安全以及避免财产损失，必须注意本手册中的提示。
人身安全的提示用一个警告三角表示，仅与财产损失有关的提示不带警告三角。
警告提示根据危险等级由高到低如下表示。
危险表示如果不采取相应的小心措施，将会导致死亡或者严重的人身伤害。
警告表示如果不采取相应的小心措施，可能导致死亡或者严重的人身伤害。
小心表示如果不采取相应的小心措施，可能导致轻微的人身伤害。
注意表示如果不采取相应的小心措施，可能导致财产损失。
当出现多个危险等级的情况下，每次总是使用最高等级的警告提示。
如果在某个警告提示中带有警告可能导致人身伤害的警告三角，则可能在该警告提示中另外还附带有可能导致财产损失的警告。
合格的专业人员本文件所属的产品/系统只允许由符合各项工作要求的合格人员进行操作。
其操作必须遵照各自附带的文件说明，特别是其中的安全及警告提示。
由于具备相关培训及经验，合格人员可以察觉本产品/系统的风险，并避免可能的危险。
按规定使用 Siemens 产品请注意下列说明：警告Siemens 产品只允许用于目录和相关技术文件中规定的使用情况。
如果要使用其他公司的产品和组件，必须得到 Siemens 推荐和允许。
正确的运输、储存、组装、装配、安装、调试、操作和维护是产品安全、正常运行的前提。
必须保证允许的环境条件。
必须注意相关文件中的提示。
商标所有带有标记符号 ® 的都是 Siemens AG 的注册商标。
本印刷品中的其他符号可能是一些其他商标。
若第三方出于自身目的使用这些商标，将侵害其所有者的权利。
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然而不排除存在偏差的可能性，因此我们不保证印刷品中所述内容与硬件和软件完全一致。
NVIDIA nForce 220 420平台下安装nForce核心驱动程序（Windows 98）
Application Note nForce 220/420 Platform Installing nForce Core Drivers Under Windows 98Installing Core DriversUnder Windows 98 This application note provides instructions to install the NVIDIA nForce coredrivers (GART, Ethernet, Audio, Audio Utilities, SMBUS and Memory Controller)under Windows 98. Currently, the NVIDIA installer supports Windows XP,Windows 2000 and Windows ME. Use the following procedure to install allNVIDIA devices under Windows 98 until the release of Windows 98 installersupport.To install the nForce integrated video driver, use the standard Windows installationsteps for ‘Updating a Video Driver.’Driver Package ContentsIt is recommended to have the following nForce drivers before proceeding:q GART Driverq Audio Drivers with Audio Utilitiesq Ethernet Driverq SMBUS Driver (System Management Bus)q Memory Controller DriverInstalling GART DriversWhen a Windows 98 operating system is installed, there are a series of unknowndevices in Windows 98 Device Manager. To install the nForce GART drivers, usethe following procedure:1. Extract the GART driver package to a temporary location.GART Manager is present in Device Manager under: PCI Standard Host CPUBridge. Microsoft Generic Drivers are used until you upgrade with the properGART drivers.2. Go to the Device Manager (STARTØCONTROL PANELØSYSTEMØDEVICE MANAGER).3. Look for the following devices:- NVIDIA nForce GART Manager- PCI Standard Host CPU Bridge- PCI standard PCI-to-PCI bridge device4. Update the drivers using the ones saved into the temporary location instep 1.5. Restart your system.Installing the Audio DriversUse the following procedure to install nForce Audio drivers:1. Extract the Audio driver package to a temporary location.Use the drivers from Audio Driver package to enumerate all unknown mediaclass devices.2. Go to the Device Manager (STARTØCONTROL PANELØSYSTEMØDEVICE MANAGER).3. Look for the following devices:Unknown Drivers- NVIDIA Audio Codec Interface- NVIDIA Media Controller ProcessorSound, Video, and Game Controllers- NVIDIA nForce Audio Codec Interface- NVIDIA nForce MCP Audio Processing UnitNote: Various nForce Audio items Under Sound, Video and GameControllers will be replaced when the System Devices are updated.4. Update the drivers using the ones saved into the temporary location instep 1.5. Restart your system.Installing Ethernet DriversUse the following procedure to install Ethernet drivers:1. Extract the Ethernet driver package to a temporary location.Use the drivers from the Ethernet Driver package to enumerate the unknownEthernet Device.2. Go to the Device Manager (STARTØCONTROL PANELØSYSTEMØDEVICE MANAGER).3. Look for the following devices:Unknown Drivers- NVIDIA Ethernet DeviceNetwork Adapters- NVIDIA nForce MCP Networking Adapter4. Update the drivers using the ones saved into the temporary location instep 1.5. Restart your system.Installing SMBus DriversUse the following procedure to install Ethernet drivers:1. Extract the SMBus driver package to a temporary location.SMBus needs to be enabled for DDC to function correctly and systemmanagement functions to be enabled.2. Go to the Device Manager (STARTØCONTROL PANELØSYSTEMØDEVICE MANAGER).3. Go to Unknown Devices / PCI System Management Bus4. Update the drivers using the ones saved into the temporary location instep 1.5. Restart your system.Updating MemoryController Drivers1. Extract the files from the (os)\memory directory of the driver package to atemporary location.Microsoft Generic Drivers will be used. To replace the Microsoft drivers withNVIDIA drivers, continue with Step 2.Note: Several instances of Memory Controller may be present in DeviceManager under:- Windows 9x/ME or Windows 2000/XP- PCI Standard RAM Controller2. Go to the Device Manager (STARTØCONTROL PANELØSYSTEMØDEVICE MANAGER).3. Look for the following devices:System Devices- PCI Standard RAM Controller- NVIDIA nForce 420 Memory Controller- NVIDIA nForce 220/420 Memory Controller4. Update all instances of these drivers using the ones saved into the temporarylocation in step 1.5. Restart your system.Note: It is important to restart your computer after all drivers are installed.Information furnished is believed to be accurate and reliable. However, NVIDIA Corporation assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of NVIDIA Corporation. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. NVIDIA Corporation products are not authorized for use as critical components in life support devices or systems without express written approval of NVIDIA Corporation.TrademarksNVIDIA, the NVIDIA logo, and nForce are trademarks of NVIDIA Corporation.Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation Other company and product names may be trademarks of the respective c ompanies with which they are associated.CopyrightCopyright NVIDIA Corporation 2001NVIDIA Corporation2701 San Tomas ExpresswaySanta Clara, CA 95050。
M1000e 刀片服务器详细介绍 图解
戴尔PowerEdge M1000e刀片机框拆解纪实戴尔PowerEdge M1000e刀片服务器机框是一款面向数据中心、大型企业等高端客户而推出的一款产品，具有高密度、模块化、灵活的I/O扩展以及方便简单的管理等诸多优点，这使得其可以轻松胜任各种行业应用、虚拟化整合以及大规模集群计算节点等对计算性能有较高要求的工作。
今天，我们带来的这篇拆解报告就是要为大家详细解析一下这款产品的结构，让大家对其有一个更加清晰的了解。
在介绍戴尔PowerEdge M1000e的拆解之前，我们有必要对其特点了解一下。
戴尔PowerEdge M1000e最为戴尔第十代刀片服务器，无论是在服务器模块的配置灵活性、计算密度还是再能耗等诸多方面都有了较大的提升。
戴尔PowerEdge M1000e可以在10U机箱内放置最多16个半高刀片服务器，这比起以往7U机箱中放置10个刀片服务器的戴尔PE 1955刀片系统要高出不少，而在计算模块的配置上，戴尔PowerEdge M1000e不但支持半高的Dell PowerEdge M600和M605，还能够支持全高的Dell PowerEdge M905、M805刀片服务器，并可以实现半高与全高刀片的混插，虽然现在再戴尔中文官方网站上刀片产品列表只有M600和M605半高刀片，但在产品手册中已经介绍了M905、M805，相信不久就会大规模投入市场。
而在功耗上，由于采用了超低功耗电源、动态电源高效风扇等技术，使得其整体效能比起戴尔上一代的戴尔PE 1955刀片系统更高。
戴尔PowerEdge M1000e刀片系统配置左为全部使用半高刀片，右为全部使用全高刀片半高全高刀片混插除了上述几点之外，戴尔PowerEdge M1000e再I/O系统和管理的人性化方面也非常注意，其再背后提供了多达6个I/O插槽，可以支持以太网交换模块、直连模块以及光纤交换机，而在管理方面，戴尔PowerEdge M1000e提供了两个CMC(机箱管控)模块，和两个个ikvm模块，通过与CMC模块，用户可以再远程实现对机箱的管控，而CMC与服务器上IDRAC芯片相连，用户可进一步实现服务器远程管理，更重要的是改管理界面采用的是WEB页面的图形化形式，使用起来非常方便，而分别位于机箱前后的两个KVM模块也使得管理方便不少。
PCIe2 2端口10GbE Base-T, PCIe2 4端口(10GbE SFP+和1GbE R
®PCIe2 2-Port 10GbE Base-T, PCIe2 4-Port (10GbESFP+ & 1GbE RJ45) Adapter Families for IBM Power SystemsIBM Redbooks Product GuideThis IBM® Redbooks® Product Guide describes the PCIe2 2-Port 10GbE Base-T Adapter and PCIe24-Port (10GbE SFP+ & 1GbE RJ45) Adapter products. These are PCI Express Generation 2 (PCIe2) x8, short form-factor, low-profile capable, regular height network interface card (NIC) adapters. The 2-port adapters enable affordable 10-Gigabit Ethernet (10GbE) network performance with cost-effective RJ45 connections for distances up to 100 meters. The 4-port adapter enables affordable 10-Gigabit Ethernet (10GbE) network performance over SFP+ Multimode Fiber SR optical modules and also supports SFP+ Active Copper cables, depending on the Ethernet switch used. They are compatible with the installed base of GbE switching and cabling infrastructure commonly deployed today.Figure 1. PCIe2 2-Port 10GbE Base-T AdapterDid you know?These network adapters offer an ideal solution for IBM Power System servers that require high-speed data transfer in LAN connectivity for mission-critical applications using existing, affordable cabling and switching IT infrastructure. The adapters provide support for 10Gb networking with CAT 6 copper cable connectivity with the two built-in RJ45 ports. The four-port adapter provides support for 10Gb SFP+ SR fiber or SFP+CU active Copper cable connectivity and 1Gb RJ45 CAT 5/5e cable connectivity.Figure 2 shows the PCIe2 4-Port (10GbE SFP+ & 1GbE RJ45) Adapter.Figure 2. PCIe2 4-Port (10GbE SFP+ & 1GbE RJ45) AdapterPart number informationTable 1 contains the part numbers and feature codes for ordering these adapters.Table 1. Ordering part numbers, CCINs, and feature codesDescription Part number CCIN Feature code PCIe2 2-port 10 GbE BaseT RJ45 Adapter00E27182CC4EN0WPCIe2 LP 2-port 10 GbE BaseT RJ45 Adapter00E27182CC4EN0XPCIe2 4-Port (10Gb+1GbE) SR+RJ45 Adapter00E27192CC3EN0SPCIe2 LP 4-Port (10Gb+1GbE) SR+RJ45 Adapter00E27192CC3EN0TPCIe2 4-port (10Gb+1GbE) Copper SFP+RJ45 Adapter00E27192CC3EN0UPCIe2 LP 4-port (10Gb+1GbE) Copper SFP+RJ45 Adapter00E27192CC3EN0VPCIe2 4-Port (10Gb+1GbE) SR+RJ45 Adapters and PCIe2 4-port (10Gb+1GbE) Copper SFP+RJ45 Adapters specifications (CCIN: 2CC3 FC: EN0S, EN0T, EN0U, and EN0V):Adapter field-replaceable unit (FRU) number: 00E2715 (complies with RoHS requirement)●Low-profile tailstock part number: 00E2720●Wrap plug FRU numbers:●o12R9314 (SFP+ SR wrap plug)o74Y7010 (Twinax wrap plug)o10N7405 (1 Gb unshielded twisted pair (UTP) wrap plug)I/O bus architecture: PCIe2 x8●PCIe2 2-port 10 GbE BaseT RJ45 Adapters (CCIN: 2CC4 FC: EN0W EN0X) specifications:Adapter FRU number: 00E2714 (complies with RoHS requirement)●Regular-height tailstock part number: 00E2862●Low-profile tailstock part number: 00E2721●Wrap plug FRU number: 10N7405 (RJ45 wrap plug)●I/O bus architecture: PCIe2 x8●Cables: PCIe2 4-Port (10Gb+1GBE) SR+RJ45 AdaptersThese adapters (CCIN: 2CC3 FC: EN0S and EN0T) use multimode fiber optic cables with shortwave lasers. Table 2 lists cable details.Table 2. Supported distances for multimode fiber optic cablesCable type OM1*OM2**OM3Specification Multimode 62.5/125 micronfiberMultimode 50/125 micron fiber Multimode 50/125 micron fiber Bandwidth200 MHz x km 500 MHz x km 2000 MHz x kmSupported distances 0.5 meters to 33 meters (1.64feet to 108.26 feet)0.5 meters to 82 meters (1.64feet to 269.02 feet)0.5 meters to 300 meters (1.64feet to 984.25 feet)* Because core sizes differ, OM1 cables can be connected only to other OM1 cables.** For best results, OM2 cables must not be connected to OM3 or OM4 cables. However, if an OM2 cable is connected to an OM3 or OM4 cable, the OM2 cable characteristics apply to the entire length of the cables.Cables: PCIe2 4-Port (10Gb+1GBE) Copper SFP+RJ45 AdaptersThese adapters (CCIN: 2CC3 FC: EN0U and EN0V) use 10 Gb copper twinax Ethernet cables listed in Table 3.Table 3. Feature code and part number for varying lengths of the cableCharacteristics Cable, by lengthLength 1 m (3.28 ft) 3 m (9.84 ft) 5 m (16.4 ft)Feature code EN01EN02EN03CCIN EF01EF02EF03Part number46K618246K618346K6184Cables: PCIe2 2-Port 10 GbE GBaseT AdaptersThese adapters (CCIN: 2CC4 FC:EN0W and EN0X) use the (4-pair) CAT 6A cables.Features and specificationsThe adapters provide the following features:Are PCIe2 NIC network convergence adapters.●Can be used as the host local area network (LAN) adapter.●Support interrupt moderation to deliver increased performance while significantly reducing processor ●utilizationSupport dual port operation in any PCIe3 or PCIe2 slot.●Support auto-negotiation, full-duplex only.●Support multiple media-access control (MAC) per interface.●Support integrated media-access control (MAC) and physical layer (PHY).●Provide message signal interrupts (MSI), MSI-X, and support of legacy pin interrupts.●Support jumbo frames up to 9.6 KB.●Support gigabit Ether Channel (GEC) with the existing software.●Support TCP checksum offload transmission control protocol (TCP), user datagram protocol (UDP), ●TCP segmentation Offload (TSO) for IPv4 and IPv6.Support TCP segmentation or large send offload●Support EEPROM-SPI and single EEPROM●Comply with the following protocols:●oIEEE 802.3ae in the 10 GbE portsoIEEE 802.3ab in the 1 GbE portsoEther II and IEEE 802.3 for encapsulated framesoIEEE 802.1p for setting up priority levels in tagged VLAN framesoIEEE 802.1Q for VLAN taggingoIEEE 802.3x for flow controloIEEE 802.3ad for load-balancing and failoveroIEEE 802.3ad and 802.3 for link aggregationSupported serversTable 4 identifies the IBM Power System servers that are supported by these adapters.Table 4. Servers supported by the adaptersSupported operating systems and device driversThe adapters support the following IBM AIX®, Linux, and IBM i operating systems and device drivers: AIX (all adapter feature codes support these AIX versions):AIX 7.1, Technology Level 3, Service Pack 2, or later●AIX 7.1, Technology Level 2, Service Pack 2, or later●AIX 7.1, Technology Level 1, Service Pack 3, or later●AIX 6.1, Technology Level 9, Service Pack 2, or later●AIX 6.1, Technology Level 8, Service Pack 3, or later●AIX 6.1, Technology Level 7, Service Pack 2, or later●Linux (all adapters feature codes support these versions of Linux):Red Hat Enterprise Linux Version 6.5 or later; current maintenance updates are available from Red ●Hat.SUSE Linux Enterprise Server 11, Service Pack 3, or later; current maintenance updates are●available from SUSE.For support and important notices, see the Linux on IBM web page:/webapp/set2/sas/f/lopdiags/info/LinuxAlerts.htmlIBM i (Table 5 lists IBM I versions that are applicable to the adapter feature codes).Table 5. IBM i version applicable to adapter feature codesDevice driversTable 6 lists the device drivers that are needed for the adapters.Table 6. Device driversTo download the current version of the device driver or Power RAID adapter utilities (iprutils), go to the IBM Service and productivity tools website:/webapp/set2/sas/f/lopdiags/home.htmlPopular configurationFigure 3 shows a common configuration using these adapters with two IBM Power Systems® that are connected via an Ethernet network.Figure 3. Power Systems using EthernetWarrantyWhen these adapters are installed in a supported IBM server, they assume your system's base warranty.Physical specificationTable 7 lists the physical specifications for these adapters.Table 7. Physical specificationsPart numbers (CCINs)Dimension00E2719 (2CC3)00E2718 (2CC4) Width0.7"0.7"Length 6.6" 6.6"Height 2.731" 2.731"Height with bracket 4.725" 4.725"Weight450 g (0.99 lb.)450 g (0.99 lb.) Operating environmentThe adapters are supported in the following environment:Temperature:●oOperating: 0° to 55°C (32° to 131 °F) at 0 - 914 m (0 - 3000 ft) oStorage: -40° to 65°C (-40° to 149°F) at 0 - 914 m (0 - 3000 ft) Relative humidity: 5% - 95% (non-condensing)●Agency approvalsThe adapters are compliant with European Union Directive 2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment.Table 8 lists FCC Classifications that are available for these adapters. Date format is mm/dd/yy.Table 8: FCC ClassificationsPart numbers (CCINs)00E2719 (2CC3)00E2718 (2CC4) Classification Class Date Class Date FCC Rules, Part 15 B01/13/13A08/09/13 Industry Canada, ICES-003 B01/13/13A08/09/13 EN55022 (emissions portion of the CE Mark)B03/11/13A08/19/13 EN55024 (immunity portion of the CE Mark)N/A03/11/13N/A08/19/13 CISPR22--Australia/New Zealand (C-Tick Mark)B01/13/13A08/19/13 Japan VCCI B01/25/13A08/19/13 Taiwan BSMI B01/30/13A10/18/13 Korea B02/20/13A09/10/13Related informationSee these resources for more information about the adapters:IBM Power Systems S812L and S822L Technical Overview and Introduction, REDP-5098●/abstracts/redp5098.html?OpenIBM Power Systems S814 and S824 Technical Overview and Introduction, REDP-5097●/abstracts/redp5097.html?OpenIBM Power System S824L Technical Overview and Introduction, REDP-5139●/redpieces/abstracts/redp5139.html?OpenIBM Power Systems E870 and E880 Technical Overview and Introductio n, REDP-5137●/redpieces/abstracts/redp5137.html?OpenIBM Power System S822 Technical Overview and Introduction, REDP-5102●/abstracts/redp5102.html?OpenIBM Systems●/systems/infrastructure/us/en/it-infrastructure/mobile-app.htmlPower Systems Technical Guide●/systems/power/hardware/reports/factsfeatures.htmlIBM PartnerWorld® - Techline●/partnerworld/wps/servlet/ContentHandler/LLIE-6LLS4TIBM PartnerWorld - IBM Techline Repository●https:///partnerworld/wps/servlet/ContentHandler/stg_com_sys-techline-repositoryNoticesThis information was developed for products and services offered in the U.S.A.IBM may not offer the products, services, or features discussed in this document in other countries. Consult your local IBM representative for information on the products and services currently available in your area. Any reference to an IBM product, program, or service is not intended to state or imply that only that IBM product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any IBM intellectual property right may be used instead. However, it is the user's responsibility to evaluate and verify the operation of any non-IBM product, program, or service. IBM may have patents or pending patent applications covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries, in writing, to:IBM Director of Licensing, IBM Corporation, North Castle Drive, Armonk, NY 10504-1785 U.S.A.The following paragraph does not apply to the United Kingdom or any other country where such provisions are inconsistent with local law: INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you. This information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice.Any references in this information to non-IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this IBM product and use of those Web sites is at your own risk.IBM may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you. Information concerning non-IBM products was obtained from the suppliers of those products, their published announcements or other publicly available sources. IBM has not tested those products and cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. This information contains examples of data and reports used in daily business operations. To illustrate them as completely as possible, the examples include the names of individuals, companies, brands, and products. All of these names are fictitious and any similarity to the names and addresses used by an actual business enterprise is entirely coincidental.Any performance data contained herein was determined in a controlled environment. Therefore, the results obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurement may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment.COPYRIGHT LICENSE:This information contains sample application programs in source language, which illustrate programming techniques on various operating platforms. You may copy, modify, and distribute these sample programs in any form without payment to IBM, for the purposes of developing, using, marketing or distributing application programs conforming to the application programming interface for the operating platform for which the sample programs are written. These examples have not been thoroughly tested under all conditions. IBM, therefore, cannot guarantee or imply reliability, serviceability, or function of these programs.© Copyright International Business Machines Corporation 2014-2015. All rights reserved.Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted byGSA ADP Schedule Contract with IBM Corp.This document was created or updated on January 20, 2015.Send us your comments in one of the following ways:Use the online Contact us review form found at:●/redbooksSend your comments in an e-mail to:●***************.comMail your comments to:●IBM Corporation, International Technical Support OrganizationDept. HYTD Mail Station P0992455 South RoadPoughkeepsie, NY 12601-5400 U.S.A.This document is available online at /redbooks/abstracts/tips1225.html . TrademarksIBM, the IBM logo, and are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. 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minecraft硬件标准
硬件要求（全文来自wiki百科，本人仅仅做了一点点修改）需要确认的信息▪请确认你的电脑以下信息，可以使用鲁大师、AIDA64、Speccy、CPU-Z或GPU-Z等类似软件。
▪操作系统（Windows、Mac OS、GNU/Linux）的发行版本和适用的硬件架构（32位或64位）。
▪CPU品牌（AMD或Intel），型号，时钟频率（GHz）。
▪RAM容量（GB），类型（DDR、DDR2、DDR3）、时钟频率（MHz）。
▪显卡品牌（AMD/ATI、Nvidia或英特尔），型号、核心/显存频率（MHz）、显存大小。
▪显卡驱动，请确认你的显卡驱动是否最新的，过时的驱动可能是无法进行游戏的原因。
▪屏幕分辨率和颜色深度(位数)，例如：1280*768*32。
▪游戏运行帧率（FPS），可以在游戏中使用F3键调出调试页面来获得。
▪安装Java的计算机，请确认你正在使用的Java版本（OpenJDK或Sun/Oracle）。
▪此外，在1.5版本中渲染引擎被重写，所以对应的游戏要求也被提高，不再支援过时的Java。
而在未来的1.7版本将会再完善渲染引擎，需求更高级版本的OpenGL并且不支持旧显卡驱动。
届时帧率会上升，游戏更流畅，渲染更高效。
由于Minecraft使用Java架构编写，因此硬件需求较高▪任何拥有下列硬件及软件的电脑都能够运行游戏，然而，要体验更好的游戏体验，我们建议使用推荐配置或更好的电脑。
▪在1.7版本后要求会更高，所以已改善所需的硬件要求。
▪最低配置：▪CPU（中央处理器）：Intel Pentium/Celeron/Core（奔腾/赛扬/酷睿）系列单核/双核处理器或更好、AMD Sempron/Athlon 64/Phenom（闪龙/速龙64/羿龙）系列单核/双核处理器或更好。
▪CPU频率（MHz/GHz）：由于现时处理器构架繁多，而不同的构架在同频率下的性能也不同，这里取自Intel与AMD构架的平均。
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MC10E416, MC100E4165V ECL Quint Differential Line ReceiverDescriptionThe MC10E416/100E416 is a 5-bit differential line receiving device. The 2.0 GHz of bandwidth provided by the high frequency outputs makes the device ideal for buffering of very high speed oscillators.The design incorporates two stages of gain, internal to the device, making it an excellent choice for use in high bandwidth amplifier applications.The differential inputs have internal clamp structures which will force the Q output of a gate in an open input condition to go to a LOW state. Thus, inputs of unused gates can be left open and will not affect the operation of the rest of the device. Note that the input clamp will take affect only if both inputs fall 2.5 V below V CC.The V BB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to V BB as a switching reference voltage. V BB may also rebias AC coupled inputs. When used, decouple V BB and V CC via a 0.01 m F capacitor and limit current sourcing or sinking to 0.5 mA. When not used, V BB should be left open.The 100 Series contains temperature compensation.Features•Differential D and Q; V BB available•600 ps Max. Propagation Delay•High Frequency Outputs•2 Stages of Gain•PECL Mode Operating Range: V CC = 4.2 V to 5.7 Vwith V EE = 0 V•NECL Mode Operating Range: V CC = 0 Vwith V EE = −4.2 V to −5.7 V•Internal Input 50 k W Pulldown Resistors•ESD Protection:Human Body Model; > 2 kV,Machine Model; > 200 V•Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test •Moisture Sensitivity Level:Pb = 1;Pb−Free = 3For Additional Information, see Application Note AND8003/D •Flammability Rating: UL 94 V−0 @ 0.125 in,Oxygen Index: 28 to 34•Transistor Count = 201 devices•Pb−Free Packages are Available**For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.MARKING DIAGRAM*xxx = 10 or 100A = Assembly LocationWL = Wafer LotYY = YearWW = Work WeekG = Pb−Free PackagePLCC−28FN SUFFIXCASE 776*For additional marking information, refer toApplication Note AND8002/D.See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet.ORDERING INFORMATIONMCxxxE416FNGAWLYYWW128D3 D2 D2 V EE V BB D0 D02627282342524232221201918171615141312115678910D3D4D4V CCO Q4Q4V CCOQ3Q3V CCQ2Q2V CCOQ1D1D1V CCO Q0Q0V CCO Q11Pinout: 28-Lead PLCC(Top View)* All V CC and V CCO pins are tied together on the die.Figure 1. 28−Lean Pinout AssignmentWarning: All V CC, V CCO, and V EE pins must be externallyconnected to Power Supply to guarantee proper operation.Figure 2. Logic DiagramD0D0D1D1D2D2D3D3D4D4Q0Q0Q1Q1Q2Q2Q3Q3Q4Q4V BBTable 1. PIN DESCRIPTIONPIN FUNCTIOND[0:4], D[0:4]ECL Differential Data InputsQ[0:4], Q[0:4]ECL Differential Data OutputsV BB Reference Voltage OutputV CC, V CCO Positive SupplyV EE Negative SupplyTable 2. MAXIMUM RATINGSSymbol Parameter Condition 1Condition 2Rating Unit V CC PECL Mode Power Supply V EE = 0 V8VV I PECL Mode Input VoltageNECL Mode Input Voltage V EE = 0 VV CC = 0 VV I v V CCV I w V EE6−6VVI out Output Current ContinuousSurge 50100mAmAI BB V BB Sink/Source± 0.5mA T A Operating Temperature Range0 to +85°C T stg Storage Temperature Range−65 to +150°Cq JA Thermal Resistance (Junction−to−Ambient)0 lfpm500 lfpm PLCC−28PLCC−2863.543.5°C/W°C/Wq JC Thermal Resistance (Junction−to−Case)Standard Board PLCC−2822 to 26°C/WT sol Wave Solder PbPb−Free 265265°CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.Symbol Characteristic UnitMin Typ Max Min Typ Max Min Typ MaxI EE Power Supply Current135162135162135162mA V OH Output HIGH Voltage (Note 2)398040704160402041054190409041854280mV V OL Output LOW Voltage (Note 2)305032103370305032103370305032273405mV V IH Input HIGH Voltage (Single−Ended)383039954160387040304190394041104280mV V IL Input LOW Voltage (Single−Ended)305032853520305032853520305033023555mV V BB Output Voltage Reference 3.62 3.73 3.65 3.75 3.69 3.81VV IHCMR Input HIGH Voltage Common ModeRange (Differential Configuration) (Note 3)2.7 5.0 2.7 5.0 2.7 5.0VI IH Input HIGH Current150150150m A I IL Input LOW Current0.50.30.50.250.30.2m A NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.1.Input and output parameters vary 1:1 with V CC. V EE can vary −0.46 V / +0.06 V.2.Outputs are terminated through a 50 W resistor to V CC− 2.0 V.3.V IHCMR min varies 1:1 with V EE, max varies 1:1 with V CC.Table 4. 10E SERIES NECL DC CHARACTERISTICS V CCx = 0.0 V; V EE = −5.0 V (Note 4)Symbol Characteristic0°C25°C85°CUnit Min Typ Max Min Typ Max Min Typ MaxI EE Power Supply Current135162135162135162mA V OH Output HIGH Voltage (Note 5)−1020−930−840−980−895−810−910−815−720mV V OL Output LOW Voltage (Note 5)−1950−1790−1630−1950−1790−1630−1950−1773−1595mV V IH Input HIGH Voltage (Single−Ended)−1170−1005−840−1130−970−810−1060−890−720mV V IL Input LOW Voltage (Single−Ended)−1950−1715−1480−1950−1715−1480−1950−1698−1445mV V BB Output Voltage Reference−1.38−1.27−1.35−1.25−1.31−1.19VV IHCMR Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 6)−2.30.0−2.30.0−2.30.0VI IH Input HIGH Current150150150m AI IL Input LOW Current0.50.30.50.0650.30.2m A NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.4.Input and output parameters vary 1:1 with V CC. V EE can vary −0.46 V / +0.06 V.5.Outputs are terminated through a 50 W resistor to V CC− 2.0 V.6.V IHCMR min varies 1:1 with V EE, max varies 1:1 with V CC.Symbol Characteristic UnitMin Typ Max Min Typ Max Min Typ MaxI EE Power Supply Current135162135162155186mA V OH Output HIGH Voltage (Note 8)397540504120397540504120397540504120mV V OL Output LOW Voltage (Note 8)319032953380319032553380319032603380mV V IH Input HIGH Voltage (Single−Ended)383539754120383539754120383539754120mV V IL Input LOW Voltage (Single−Ended)319033553525319033553525319033553525mV V BB Output Voltage Reference 3.62 3.74 3.62 3.74 3.62 3.74VV IHCMR Input HIGH Voltage Common ModeRange (Differential Configuration) (Note 9)2.7 5.0 2.7 5.0 2.7 5.0VI IH Input HIGH Current150150150m A I IL Input LOW Current0.50.30.50.250.50.2m A NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.7.Input and output parameters vary 1:1 with V CC. V EE can vary −0.46 V / +0.8 V.8.Outputs are terminated through a 50 W resistor to V CC− 2.0 V.9.V IHCMR min varies 1:1 with V EE, max varies 1:1 with V CC.Table 6. 100E SERIES NECL DC CHARACTERISTICS V CCx = 0 V; V EE = −5.0 V (Note 10)Symbol Characteristic0°C25°C85°CUnit Min Typ Max Min Typ Max Min Typ MaxI EE Power Supply Current135162135162155186mA V OH Output HIGH Voltage (Note 11)−1025−950−880−1025−950−880−1025−950−880mV V OL Output LOW Voltage (Note 11)−1810−1705−1620−1810−1745−1620−1810−1740−1620mV V IH Input HIGH Voltage (Single−Ended)−1165−1025−880−1165−1025−880−1165−1025−880mV V IL Input LOW Voltage (Single−Ended)−1810−1645−1475−1810−1645−1475−1810−1645−1475mV V BB Output Voltage Reference−1.38−1.26−1.38−1.26−1.38−1.26VV IHCMR Input HIGH Voltage Common ModeRange (Differential Configuration)(Note 12)−2.30.0−2.30.0−2.30.0VI IH Input HIGH Current150150150m A I IL Input LOW Current0.50.30.50.250.50.2m A NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.10.Input and output parameters vary 1:1 with V CC. V EE can vary −0.46 V / +0.8 V.11.Outputs are terminated through a 50 W resistor to V CC− 2.0 V.12.V IHCMR min varies 1:1 with V EE, max varies 1:1 with V CC.Table 7. AC CHARACTERISTICS V CCx = 5.0 V; V EE = 0.0 V or V CCx = 0.0 V; V EE = −5.0 V (Note 13)Symbol Characteristic0°C25°C85°CUnit Min Typ Max Min Typ Max Min Typ Maxf MAX Maximum Toggle Frequency> 2.0GHzt PLH t PHL Propagation Delay to Output psd(Diff)250350500250350500250350500D(SE)200350550200350550200350550t SKEW Within-Device Skew (Note 14)505050ps t SKEW Duty Cycle Skew (Note 15)t PLH-t PHL±10±10±10ps t JITTER Random Clock Jitter (RMS)< 1< 1< 1ps V PP(AC)Input Voltage Swing(Differential Configuration)150100015010001501000mVt r t f Rise/Fall Time ps (20-80%)100200350100200350100200350NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.13.10 Series: V EE can vary −0.46 V / +0.06 V.100 Series: V EE can vary −0.46 V / +0.8 V.14.Within-device skew is defined as identical transitions on similar paths through a device.15.Duty cycle skew defined only for differential operation when the delays are measured from the cross point of the inputs to the cross pointof the outputs.Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.)V TTV TT = V CC − 2.0 VORDERING INFORMATIONDevicePackage Shipping †MC10E416FN PLCC −2837 Units / Rail MC10E416FNG PLCC −28(Pb −Free)37 Units / Rail MC10E416FNR2PLCC −28500 / Tape & Reel MC10E416FNR2G PLCC −28(Pb −Free)500 / Tape & Reel MC100E416FN PLCC −2837 Units / Rail MC100E416FNG PLCC −28(Pb −Free)37 Units / Rail MC100E416FNR2PLCC −28500 / Tape & Reel MC100E416FNR2GPLCC −28(Pb −Free)500 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.Resource Reference of Application NotesAN1405/D −ECL Clock Distribution Techniques AN1406/D −Designing with PECL (ECL at +5.0 V)AN1503/D −ECLinPS t I/O SPiCE Modeling Kit AN1504/D −Metastability and the ECLinPS Family AN1568/D −Interfacing Between LVDS and ECL AN1672/D −The ECL Translator Guide AND8001/D −Odd Number Counters Design AND8002/D −Marking and Date CodesAND8020/D −Termination of ECL Logic Devices AND8066/D −Interfacing with ECLinPSAND8090/D−AC Characteristics of ECL DevicesPACKAGE DIMENSIONSPLCC −28FN SUFFIXPLASTIC PLCC PACKAGECASE 776−02ISSUE ESL−M S 0.010 (0.250) NST VIEW SNOTES:1.DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.2.DIMENSION G1, TRUE POSITION TO BEMEASURED AT DATUM −T−, SEATING PLANE.3.DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.4.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.5.CONTROLLING DIMENSION: INCH.6.THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012(0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.7.DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037(0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.4850.49512.3212.57B 0.4850.49512.3212.57C 0.1650.180 4.20 4.57E 0.0900.110 2.29 2.79F 0.0130.0190.330.48G 0.050 BSC 1.27 BSC H 0.0260.0320.660.81J 0.020−−−0.51−−−K 0.025−−−0.64−−−R 0.4500.45611.4311.58U 0.4500.45611.4311.58V 0.0420.048 1.07 1.21W 0.0420.048 1.07 1.21X 0.0420.056 1.07 1.42Y −−−0.020−−−0.50Z 2 10 2 10 G10.4100.43010.4210.92K10.040−−− 1.02−−−____ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息:ONSEMIMC10E416FNR2G MC10E416FNG MC100E416FN MC100E416FNG MC100E416FNR2MC100E416FNR2G MC10E416FN MC10E416FNR2。