巨辉康SSD卡 官网所有产品及参数
性能级SDD推荐
性能级SDD推荐作者：来源：《微型计算机》2020年第04期普及大容量NVMe SSD 金士顿A2000 M.2NVMe固态硬盘500GB这款NVMe SSD采用慧荣的SM2263EN 4通道PCle 3.0 x4主控，每通道支持4CE片选信号。
同时该主控支持NVMe l.3规范，并配备了512MB缓存。
这款SSD板载了来自美光、FPGA编号为“NW951”的96层堆叠3DNAND TLC闪存，500GB容量产品的质保可写容量为350TB。
性能上，这款SSD配有一个接近75G B容量的超大SLC CACHE缓存空间，在ASSSD BENCHMARK中的总分逼近3000分。
在实际的游戏载入体验中，金士顿KC2000则能在20秒以内快速地启动各类游戏大作，比如《坦克世界》的启动时间只有不到13秒。
值得一提的是，目前金士顿A2000 M.2 NVMe固态硬盘正以豪华套装的形式销售，附送由散热器厂商Tt 专门为金士顿M.2NVMe SSD定制的铝合金散热器，颇具性价比。
兼得容量与性能西数蓝盘SN550 1TB这款SSD采用了来自闪迪的主控，是一款DRAM-Iess无缓存主控，支持HMB技术，可以使用少量电脑内存作缓存。
同时西数为其采用了96层堆叠的3DNAND TLC闪存颗粒，单颗闪存容量就达到了1TB。
质保方面，西部数据为SN550 SSD提供了5年质保加可写容量的质保政策（以先到为准），其1TB容量产品的质保可写容量达到600TB。
在测试中，西数蓝盘SN550 1TB的AS SSD BENCHMARK测试成绩达到了3689分，在PCle 3.O SSD中还是达到了中上水平。
它的连续读取速度为2233M B/s，高队列深度随机4KB 写入性能达到23.6万IOPS，全盘平均写入速度也能达到850.3M B/s。
其表现远远优于掉速后写入速度不到300M B/s的主流TLC SSD，以及实际写入速度不到100M B/s的QLC SSD。
MTA18ASF2G72PZ-2G6D1
Important Notes and WarningsMicron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions. This document supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-ment if you obtain the product described herein from any unauthorized distributor or other source not authorized by Micron.Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi-cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting from any use of non-automotive-grade products in automotive applications.Critical Applications. Products are not authorized for use in applications in which failure of the Micron compo-nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-mental damage by incorporating safety design measures into customer's applications to ensure that failure of the Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron component for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi-cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron product.Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems, applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL-URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en-vironmental damages will result from failure of any semiconductor component.Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly authorized representative.质量等级领域:宇航级IC、特军级IC、超军级IC、普军级IC、禁运IC、工业级IC，军级二三极管，功率管等;应用领域:航空航天、船舶、汽车电子、军用计算机、铁路、医疗电子、通信网络、电力工业以及大型工业设备祝您:工作顺利，生活愉快!以深圳市美光存储技术有限公司提供的参数为例，以下为MTA18ASF2G72PZ-2G6D1的详细参数，仅供参考I DD SpecificationsTable 5: DDR4 I DD Specifications and Conditions (0° ≤ T C≤ 85°) – 16GB (Die Revision B)Values are for the MT40A2G4 DDR4 SDRAM only and are computed from values specified in the 8Gb (2 Gig x 4) compo-nent data sheetTable 6: DDR4 I DD Specifications and Conditions (0° ≤ T C≤ 85°) – 16GB (Die Revision D)Values are for the MT40A2G4 DDR4 SDRAM only and are computed from values specified in the 8Gb (2 Gig x 4) compo-nent data sheetTable 7: DDR4 I DD Specifications and Conditions (0° ≤ T C≤ 85°) – 16GB (Die Revision E)Values are for the MT40A2G4 DDR4 SDRAM only and are computed from values specified in the 8Gb (2 Gig x 4) compo-Note: 1.When T C > 85°C, the I DD and I PP values must be derated. Refer to the base device datasheet I DD and I PP specification tables for derating values for the applicable die-revision.Table 8: DDR4 I DD Specifications and Conditions (0° ≤ T C≤ 85°) – 16GB (Die Revision J)Values are for the MT40A2G4 DDR4 SDRAM only and are computed from values specified in the 8Gb (2 Gig x 4) compo-Note: 1.When T C > 85°C, the I DD and I PP values must be derated. Refer to the base device datasheet I DD and I PP specification tables for derating values for the applicable die-revision.。
E7 v2.2 新版本发布说明
要点： 推荐应用环境 安装前准备工作 新增功能 更新内容 使用注意事项 附录一：E7 软件安装说明
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索贝数码科技股份有限公司 中国事业本部 桌面产品事业部
一，推荐应用环境：
部件 整机 CPU 内存 型号 HP z800 专业图形工作站 Intel(R) Xeon(R) E5520 2.26GHz/1333MHz/8MB L2 Cache x 2 4GB DDR3 1333MHz ECC 160GB 7200RPM SATA DVD+/-RW 刻录光驱 板载双千兆以太网卡 板载 Realtek ALC262 High Definition Audio Controller 板载 1394 接口/PCI 1394 卡（VIA 芯片） Nvidia Geforce GTS250 1GB Sobey MG1500E 专业视音频接口卡(PCI-E) Sobey MG3500E 专业视音频接口卡(PCI-E) Declink Sudio 视音频接口卡 数据硬盘 显示器 音箱 附件 名称 Windows7 中文版 WindowsXP 中文版 显卡驱动 500GB 7200RPM SATAII x 4 22“ LCD x 2 专业监听音箱 LightBoxII For E7 索贝专业视音频素材库 版本 专业版/旗舰版 32 位 专业版 SP2 32 位 Nvidia Display Driver 195.62_WHQL_win7 MG1500E Sobey_MG_Series_10.0209(0209 版) MG3500E Sobey_MG3500E_Series_23.9.26.3500(0301 版) Matrox DSX LE 500 Matrox 5.0 sp1 E7 2.2 安装程序 支持老用户使 用 Windows XP 系统直接升级安装 E7 2.2 IO 板卡驱动 备注 E7-180 E7-500S 备注 本部分配置由 HP 公司提供 CPU 可用选配配置提升性能 (请见选配件明细) HP 公司可能在不告知的情况 下更改设备配置， 未免除出现 配置选择错误， 请提前向桌面 产品事业部咨询
AX101470 72端口巨集以太网终端套件商品说明书
Product:AX10147072 Port GigaBIX Termination Kit, 72 PortProduct Description72 Port GigaBIX Termination Kit, 72 PortTechnical SpecificationsProduct OverviewPhysical Characteristics (Overall)ConnectorsMaterialsConstruction and DimensionsStrandingElectrical CharacteristicsInductanceMated ConnectionTemperature RangeOperating Temp Range:-10°C To +60°CMechanical CharacteristicsFootprint/Type:GigaBIXTool Compatibility:BIX Connecting Tool (A0270165)Termination InterfaceTermination Connection DurabilitiesFront IDC Connection200 insertionsRear IDC Connection200 InsertionsDimensions (WxHxD)Width Height Depth7.63915.281 4.527StandardsIEC Compliance:ISO/IEC 11801:2002Data Category:Category 6TIA/EIA Compliance:ANSI/TIA/EIA 568 C.2 Category 6Third Party Performance Verification:ETL - Verified Category 6Applicable Environmental and Other ProgramsEnvironmental Space:IndoorEU Directive Compliance:EU Directive 2002/95/EC (RoHS)EU RoHS Compliance Date2008-01-30(yyyy-mm-dd):SuitabilitySuitability - Indoor:YesFlammability, LS0H, Toxicity TestingSafety Listing:ACA,UL 1863 and CSA-C22.2Part NumberRelated Parts:GIGABIX CONNECTORS, MANAGEMENT RING, MANAGEMENT MODULE, PATCH COORD ORGANIZER, HORIZONTAL CHANEL PLATE, GIGABIX PATCH CORD, GIGABIX/MEDIAFLEX ADAPTORVariantsItem #Color UPCAX101470Black611589002813Product NotesIncluded Parts: 2 Wood Screws; 6 Designation strips; 12 Wire Guards; French and English Installation Guide; 2 Velcro Ties; 1 Termination Bar PackNotes:For proper installation refer to Installation Guide PX101813 (French) or PX101814 (English) included with the product or visit our web site at HistoryUpdate and Revision:Revision Number: 0.103 Revision Date: 07-28-2020© 2020 Belden, IncAll Rights Reserved.Although Belden makes every reasonable effort to ensure their accuracy at the time of this publication, information and specifications described here in are subject to error or omission and to change without notice, and the listing of such information and specifications does not ensure product availability.Belden provides the information and specifications herein on an "ASIS" basis, with no representations or warranties, whether express, statutory or implied. In no event will Belden be liable for any damages (including consequential, indirect, incidental, special, punitive, or exemplary damages) whatsoever, even if Belden has been advised of the possibility of such damages, whether in an action under contract, negligence or any other theory, arising out of or in connection with the use, or inability to use, the information or specifications described herein.All sales of Belden products are subject to Belden's standard terms and conditions of sale.Belden believes this product to be in compliance with all applicable environmental programs as listed in the data sheet. The information provided is correct to the best of Belden's knowledge, information and belief at the date of its publication. This information is designed only as a general guide for the safe handling, storage, and any other operation of the product itself or the one that it becomes a part of. The Product Disclosure is not to be considered a warranty or quality specification. Regulatory information is for guidance purposes only. Product users are responsible for determining the applicability of legislation and regulations based on their individual usage of the product.。
固态硬盘参数
性能参数 理论传输速度 最大连续读速 最大连续写速 IOPS读@4kb IOPS写@4kb 电学参数 额定电压 额定功率 空转功率 待机功率 休眠功率 可靠性参数 S.M.A.R.T MTBF 环境参数 运行状态环境温度 存贮状态环境温度 运行状态抗冲击力 存贮状态抗冲击力 抗振动受力 环境湿度要求 物理参数 长 宽 高 重量
3Gbps(300MB/s) 250MB/s 180 MB/s 7000 2000
5V ±5% Max 2W Max 0.5W Max 0.3W Max 0.3W
支持 2,000,000 Hours
0°C to 70°C -55°C to 95°C 1500G, ( @ 0.5msec half sine wave ) 1500G, ( @ 0.5msec half sine wave ) 20G Peak, 10 ~ 2000Hz, (15mins/ Axis) x3 Axis 0°C to 55°C / 90~95% RH
K5,K6固态硬盘参数
K5 2.5英寸 SATAII(3.0Gbps) SLC 8GB 16GB 32GB 64GB 128GB
K6
MLC 16GB 32GB 64GB 128GB 256GB
1.5Gbps (150MB/s) 250MB/s (8GB,16GB) 200MB/s 8000 6000
ห้องสมุดไป่ตู้
100mm 70mm 9.5mm 72～82g
附加信息: 1 megabyte (MB) = 1 million bytes; 1 gigabyte (GB) = 1 billion bytes 更多支持:info@ support@
HITACHI Ultrastar 服务器硬盘 A7K2000 3.5 英寸企业级硬盘 说明书
容量密度翻倍全球的数据中心专家在致力于满足日益增长的企业存储需求时面临一个两难的境地，那就是既要在同样大小的硬盘中存储更多的数据，同时又要减少用电和 HVAC 能耗。
新款 Ultrastar™ 服务器硬盘 A7K2000 的数据存储容量是上代 Ultrastar 服务器硬盘 A7K1000 的两倍，且用电量更少。
现在，将 2TB A7K2000 硬盘部署在由 10 个 4U 、60 位硬盘盒组成的硬盘组里，就可以在标准的 19 英寸企业级存储机架中实现 1.2 PB 的超大存储容量。
7200 RPM 性能与精细的电源控制完美结合日立 Ultrastar 服务器硬盘 A7K2000 以 7200 RPM 转速运行，功耗率极低，与低转速、侧重容量的硬盘相比整体性能更好。
与上代 Ultrastar 服务器硬盘 A7K1000 相比，A7K2000 的持续数据传输率提高了 155% 之多，每 GB 用电减少了 120%。
利用五种高级电源管理模式，在低转速闲置模式下可减少用电 36%，待机/休眠模式下用电不到 1W ，有助于数据中心达到更低 AC 电源和 HVAC 能耗要求，为满足日益增长的企业级存储需求腾出了宝贵的空间。
提升数据安全为确保最大程度的数据安全，Ultrastar 服务器硬盘 A7K2000 设有批量数据加密 (BDE) 选项。
启用后，实施的日立 BDE 会在数据写入硬盘时使用专有的安全密钥对硬盘上的所有数据进行加密，然后在检索数据时再用该密钥解密，给用户的数据高度保护。
与基于软件的加密解决方案不同，日立 BDE 的实施基于硬件，因此不会减慢系统的运行速度。
该技术也加速和简化了硬盘的再布署和更换过程。
通过删除加密密钥，数据可变成不可读取，从而无需进行费时的多模式数据覆写。
提供业界领先的可靠性Ultrastar 服务器硬盘 A7K2000 采用坚实的第四代机械设计，专门针对企业存储应用打造和测试。
Blackmagic官方SSD固态硬盘推荐型号
BMD官方SSD固态硬盘推荐型号如下：同时支持无压缩及压缩视频格式∙英特尔Intel 335 Series 240GB SSD (SSDSC2CT240A4K5)∙英特尔Intel 520 Series 240GB SSD (SSDSC2CW240A310)∙英特尔Intel 520 Series 480GB SSD (SSDSC2CW480A310)∙英特尔Intel 530 Series 180GB SSD (SSDSC2BW180A401)∙英特尔Intel 530 Series 240GB SSD (SSDSC2BW240A401)∙金士顿Kingston 240 GB HyperX 3K (SH103S3/240G)∙金士顿Kingston 480 GB HyperX 3K (SH103S3/480G)∙金士顿Kingston 240 GB SSDNow KC300 (SKC300S37A/240G)∙金士顿Kingston 480 GB SSDNow KC300 (SKC300S37A/480G)∙闪迪Sandisk Extreme 240GB (SDSSDX-240G-G25)∙闪迪Sandisk Extreme 480GB (SDSSDX-480G-G25)∙PNY 240GB Prevail SSD (firmware 5.0.2) (SSD9SC240GCDA-PVL)∙OWC 120GB Mercury Extreme Pro 6G (Firmware Rev 5.0.7) (OWCSSDMX6G120T)∙OWC 240GB Mercury Extreme Pro 6G (Firmware Rev 5.0.6) (OWCSSDMX6G240T)∙OWC 480GB Mercury Extreme Pro 6G (Firmware Rev 5.0.6) (OWCSSDMX6G480)∙Digistor 128GB SSD Professional Video Extreme (DIG-PVD128E, pre-formatted ExFat) ∙Digistor 240GB SSD Professional Video Series (DIG-PVD240S, pre-formatted ExFat)∙Digistor 480GB SSD Professional Video Series (DIG-PVD480S, pre-formatted ExFat) ∙Angelbird 240GB AV Pro (Firmware 2.54)∙ADATA XPG SX900 256GB (ASX900S3-256GM-C)只支持压缩视频格式∙镁光 Crucial 256GB M4 (firmware 000F) (CT256M4SSD2)∙饥饿鲨 OCZ Agility 3 240GB (AGT3-25SAT3-240G)∙闪迪Sandisk Extreme 120GB (SDSSDX-120G-G25)厂商已停止支持或停产∙Crucial 256GB C300 (CTFDDAC256MAG-1G1)∙Kingston 64GB SSDNow V+100 (SVP100S2/64G)∙Kingston 128GB SSDNow V+100 (SVP100S2/128G)∙Kingston 512GB SSDNow V+100 (SVP100S2/512G)∙Kingston 120GB SSDNow V+200 (SVP200S3/120G)∙Kingston 240GB SSDNow V+200 (SVP200S3/240G)∙Kingston HyperX 240GB (SH100S3/240G)∙OCZ 240GB Vertex 3 (VTX3-25SAT3-240G)∙OCZ 480GB Vertex 3 (VTX3-25SAT3-480G)∙OCZ 240GB Deneva 2 (firmware 2.22) (D2CSTK251M21-0240)∙OWC Mercury Extreme Pro 6G SSD (firmware 5.0.2) (OWCSSDMX6G240T)。
工业CFast卡F-50系列SATA III-6.0 Gbit s标准和工业温度等级数据表说明书
SFCA032GH1AD4TOIGS 216STD SFCA064GH1AD4TOIGS216STDSFCA128GH1AD4TOILT216STDSFCA256GH1AD4TOIHT216STDContents1.PRODUCT SUMMARY (3)2.PRODUCT FEATURES (4)3.ORDERING INFORMATION (5)4.PRODUCT DESCRIPTION (6)4.1P ERFORMANCE S PECIFICATIONS (7)4.2C URRENT C ONSUMPTION (7)4.3E NVIRONMENTAL S PECIFICATIONS (8)4.4R EGULATORY C OMPLIANCE (9)4.5M ECHANICAL S PECIFICATIONS (9)4.6R ELIABILITY AND E NDURANCE (10)4.7D RIVE G EOMETRY S PECIFICATION (10)5.ELECTRICAL INTERFACE (11)6.PACKAGE MECHANICAL (12)7.ATA COMMANDS (13)8.IDENTIFY DEVICE DATA (15)9.S.M.A.R.T. FUNCTIONALITY (16)9.1S.M.A.R.T.S UBCOMMANDS (16)9.2S.M.A.R.T.R EAD D ATA (17)9.3S.M.A.R.T.A TTRIBUTES (17)9.4S.M.A.R.T.A TTRIBUTE E NTRY S TRUCTURE (18)10.PART NUMBER DECODER (19)10.1M ANUFACTURER (19)10.2M EMORY T YPE (19)10.3P RODUCT T YPE (19)10.4D ENSITY (19)10.5P LATFORM (19)10.6P RODUCT G ENERATION (19)10.7M EMORY O RGANIZATION (19)10.8T ECHNOLOGY (19)10.9N UMBER OF F LASH C HIPS (19)10.10F LASH C ODE (20)10.11T EMPERATURE O PTION (20)10.12D IE C LASSIFICATION (20)10.13P IN M ODE (20)10.14D RIVE C ONFIGURATION XYZ (20)10.15O PTION (20)11.SWISSBIT CFAST SSD MARKING SPECIFICATION (21)11.1T OP V IEW (21)11.2B OTTOM V IEW (21)11.3L ABEL C ONTENT (21)12.REVISION HISTORY (22)F-50 Series – Industrial CFast™Solid State Drive8 GBytes Up to 256 GBytes1.Product Summary∙Capacities: 8 GBytes, 16 GBytes, 32 GBytes, 64 GBytes, 128 GBytes, 256 GBytes∙Form Factor: CFast-Sized Solid State Drive (36.4 mm x 42.8 mm x 3.6 mm)∙Compliance: SATA Rev 3.1 - 6 Gbit/s (3 Gbit/s and 1.5 Gbit/s backward compatible)∙CFast 2.0 Compatible1∙Command Sets: Supports ATA/ATAPI-8 and ACS-2∙Performance:o Burst Transfer Rate: Up to 600 MBytes/s in SATA III - 6.0 Gbit/so Read Performance: Sequential Read up to 500 MBytes/s, Random Read IOPs up to 53Ko Write Performance: Sequential Write up to 330 MBytes/s, Random Write IOPs up to 74K ∙Operating Temperature Range2:o Commercial: 0 °C to 70 °Co Industrial: -40 °C to 85 °C∙Storage Temperature Range: -40 °C to 85 °C∙Operating Voltage: 3.3 V ± 5%∙Power (Max Capacity):o Read (Active): 1.2 Wo Write (Active): 2.0 Wo Idle: 248 mWo Slumber: 17 mW∙Data Retention: 10Years @ Life Begin; 1 Year @ Life End∙Endurance: TeraBytes Written (TBW) @ Max Capacity3o Client > 155o Enterprise > 5∙Shock/Vibration: 500 g/20 g (MIL-STD810)∙High-Performance 32-Bit Processor with Integrated, Parallel Flash Interface Engines: o Multi-Level Cell (MLC) NAND Flasho Hardware BCH Code ECC (up to 66 bit correction per 1 KByte page)∙High Reliability:o Mean Time Between Failure (MTBF): > 2,000,000 hourso Data Reliability: < 1 non-recoverable error per 1016 bits read1Devices are CFast 2.0 compatible when in removable mode. Devices in removable mode are available upon request.2Adequate airflow is required to ensure the drive temperature, as reported in the S.M.A.R.T. data, does not exceed the specified maximum operating temperature.3According to JEDEC, the time to write the full TBW is a minimum of 18 months. Higher average daily data volume reduces the specified TBW.2.Product Features∙Dynamic and Static Wear Leveling∙Page Mode Flash Translation Layer (FTL)∙Data Care Managemento Active: Adaptive Read Refresho Passive: Background Media Scan∙Lifetime Enhancementso Dynamic Bad Block Remappingo Write Amplification Reduction∙On-Board Power Fail Protection∙AHCI, TRIM, and NCQ Support∙ATA Security Feature Set Support∙DEVSLP Compatible∙In-Field Firmware Update∙Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.)∙Life Cycle Management∙Controlled “Locked” BOM∙RoHS-6 Compliant∙30 µinch Gold-Plated Connector (on request)∙Conformal coating (on request)∙Swissbit Life Time Monitoring (SBLTM) Tool and SDK for SBLTM (on request)3.Ordering Information4.Product DescriptionThe Swissbit® F-50 Solid State Drive (SSD) leverages the CFast 2.0 compatible, industry-standard form factor and connectivity. Combined with a SATA Gen III controller and Multi-Level Cell (MLC) NAND flash technology, the F-50 realizes a robust non-volatile storage solution for today’s embedded storage applications. A functional block diagram of the F-50 SSD is provided below in Figure 1.Figure 1: F-50 CFast Functional Block DiagramThe F-50 SSD incorporates two existing industry standards into a single product: the CompactFlash™ (CF) card form factor and the Serial ATA (SATA) interface commonly used with hard disk drives (HDDs) and SSDs. The interface consists of a female 7-pin SATA data connector and a female 17-pin power connector. Because standard SATA hard drives use male connectors, an adaptor is required to replace drives with CFast cards. CFast cards can be used to replace HDDs, SSDs, and Compact Flash™ cards in applications requiring smaller form factors, high endurance, and the ability to withstand shock, vibration, extreme temperatures (-40°C to 85°C), high altitude, and rough environmental conditions. The Swissbit CFast™ cards provide rugged storage for embedded and industrial systems where data and system reliability, power fail protection, and flexibility are important design considerations.The on-board SATA III controller manages the interface between the host and the non-volatile NAND flash memory array. The controller supports SATA Gen III (6 Gbit/s) interface speeds and is fully backward compatible with SATA Gen II (3 Gbit/s) and SATA Gen I (1.5 Gbit/s) to enable the broadest possible range of platform compatibility. The controller utilizes an ARC 700 processing core, providing an optimum balance between read/write performance, Data Care Management, and power fail protection.The F-50 achieves sequential read/write performance of up to 500/330 MBytes/s (MBPS) and random read/write input/output operations (IOPs) of up to 53K/74K. In addition, the F-50 series feature Swissbit’s proven power fail safety and support for the ATA security feature set, enhanced secure erase tools, NCQ, TRIM, advanced wear leveling and bad block management, and in-field firmware updates.An on-controller BCH Error Correction Code (ECC) engine provides the F-50 hardware ECC, which is capable of correcting up to 66 bits per 1 KByte page. This, combined with Swissbit’s Data Care Management firmware, provides both passive and active data management strategies to insure data integrity and extract the maximum possible endurance and reliability from the NAND flash array. These strategies include, but are not limited to, Global Wear Leveling, Adaptive Read Refresh, Background Media Scan, and Dynamic Block Remapping.The risk of data loss as a result of an unexpected power fail event is mitigated using a robust sequence of voltage regulators and detectors designed to insure a graceful shutdown of the controller and NAND flash array. A combination of both hardware and firmware power fail features prevent the possibility of resident data being corrupted during an unexpected power failure.Related Documentation∙ CFast Specification 2.0 ( )∙ Serial ATA International Organization Serial ATA Revision 3.0 ( ) ∙ Serial Transport Protocols and Physical Interconnect (ATA/ATAPI-8) ( ) ∙Electronic Industries Alliance ( )4.1 Performance SpecificationsThe F-50 read/write sequential and random I/O performance benchmarks are detailed below in Table 3.44.2 Current ConsumptionThe drive-level current consumption as a function of operating mode is shown below in Table 4.5 4The values are measured using Crystal Disk Mark (CDM) across the full drive density. Performance depends on flash type and number, file/cluster size, and burst speed. 5All values are typical at 25 °C, with nominal supply voltage, and SATA III performance test with IOMeter (512 byte-1 MByte transfer sizes).4.3 Environmental Specifications4.3.1 Recommended Operating ConditionsThe recommended operating conditions for the F-50 SSDs are provided in Table 5 below.64.3.2 Recommended Storage ConditionsThe recommended storage conditions are listed below in Table 6.4.3.3 Shock, Vibration, and HumidityThe maximum shock, vibration, and humidity conditions are listed below in Table 7.6Adequate airflow is required to ensure the drive temperature, as reported in the S.M.A.R.T. data, does not exceed the specified maximum operating temperature.4.4 Regulatory ComplianceThe F-50 devices comply with the standards listed in the following table.4.5 Mechanical SpecificationsThe F-50 SSD consists of a flash controller and NAND flash memory devices. The controller interfaces with a host system allowing data to be written to and read from the flash memory array. The SSD has a female 7-pin SATA data connector and a female 17-pin power connector. Because standard SATA hard drives use male connectors, an adaptor is required to replace drives with CFast cards. Physical dimensions are detailed in Table 9 below. Figure 3 on page 12 illustrates the F-50 dimensions and connector location.4.6 Reliability and EnduranceThe Mean Time Between Failure (MTBF) is specified to exceed the value listed below. Data reliability with effective error tolerance and data retention at the beginning and end of life is also provided.Endurance represented as both TeraBytes Written (TBW) and full Drive Writes Per Day (DWPD) for two different application scenarios is provided in the following table.7NOTE:Because NAND flash has a limited life, replace the drive once it has reached the number of program/erase (P/E) cycles rated for the device as data loss can occur at any time beyond this point. The current and rated erase counts for the device are reported in the S.M.A.R.T. data. Swissbit also offers lifetime monitoring software and a software development kit (SDK) to monitor drive health.4.7 Drive Geometry SpecificationThe F-50 drive geometry is set to report industry standard LBA settings per the IDEMA standard (LBA1-03). The values for each capacity are shown below in Table 12.7Client and Enterprise workloads follow the JEDEC JESD219 standard. Enterprise workload values are measured based on 168 hours of runtime.8Because the JEDEC master trace file for the Client workload is designed for capacities ≥ 64 GBytes, the values for the 8, 16, and 32 GByte capacities are estimates.91 GByte = 109 bytes5.Electrical InterfaceThe CFast card is connected with a standard 7-pin SATA connector and a standard 17-pin power connector (see below Figure 2: F-50 CFast Connector). The signal/pin assignments and descriptions are listed inTable 13.Figure 2: F-50 CFast ConnectorBottom sideTop side10 CDI and CDO are physically shorted together in the device. The CDO logic state shall follow the CDI logic state whether the device is powered up or not.6.Package MechanicalNOTE: The dimensions in the following figure are the maximum values based on the CFast specification. For the product dimensions, see the Mechanical Specifications section on page 9.Figure 3: CFast SSD Dimensions in mm [in]7.ATA CommandsThis section provides information on the ATA commands supported by the SSD. The commands are issued to the ATA by loading the required registers in the command block with the supplied parameter, and then writing the command code to the register. For backward compatibility, some commands are implemented as a "no operation". See Table 14 for a list of ATA commands the device supports. For details about setting up the command registers, see the latest ATA Specification.8.Identify Device DataThe following table describes the 512 bytes of data the drive returns for the Identify Device command (ECh).9.S.M.A.R.T. FunctionalityThe F-50 SSD fully supports the ATA Specification for Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.). For details about the S.M.A.R.T. subcommands and attributes, see the S.M.A.R.T. Attribute Technical Reference Guide.9.1 S.M.A.R.T. SubcommandsThe following table lists the supported S.M.A.R.T. subcommands and the Features register values.The device aborts any S.M.A.R.T. subcommands with Features register values not listed in the above table.9.2 S.M.A.R.T. Read DataWhen the drive receives the S.M.A.R.T. Read Data subcommand, it returns one sector (512 bytes) of data. See the following table for the data structure of this sector.9.3 S.M.A.R.T. AttributesThe F-50 drives support the S.M.A.R.T. attributes listed in the following table.9.4 S.M.A.R.T. Attribute Entry StructureEach attribute entry consists of 12 bytes. See the following table for the data structure of each entry.10.Part Number DecoderS F CA 032G H 1 A D 4 TO - I - G S - 216 - STD10.1 Manufacturer10.2 Memory Type10.3 Product Type10.4 Density10.5 Platform10.6 Product Generation10.7 Memory Organization10.8 Technology10.9 Number of Flash Chips10.10 Flash Code10.11 Temperature Option10.12 Die Classification10.13 Pin Mode10.14 Drive Configuration XYZ10.15 Option11.S wissbit CFast SSD Marking Specification 11.1 Top View11.2 Bottom View11.3 Label Contento Swissbit Logoo CFast Logoo Part Numbero Lot Code information with Bar Codeo CE Logoo RoHS Logoo WEEE Logoo Manufacturing Dateo Country of Origin12.Revision HistoryDisclaimer:No part of this document may be copied or reproduced in any form or by any means, or transferred to any third party, without the prior written consent of an authorized representative of Swissbit AG (“SWISSBIT”). The information in this document is subject to change without notice. SWISSBIT assumes no responsibility for any errors or omissions that may appear in this document, and disclaims responsibility for any consequences resulting from the use of the information set forth herein. SWISSBIT makes no commitments to update or to keep current information contained in this document. The products listed in this document are not suitable for use in applications such as, but not limited to, aircraft control systems, aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. Moreover, SWISSBIT does not recommend or approve the use of any of its products in life support devices or systems or in any application where failure could result in injury or death. If a customer wishes to use SWISSBIT products in applications not intended by SWISSBIT, said customer must contact an authorized SWISSBIT representative to determine SWISSBIT willingness to support a given application. The information set forth in this document does not convey any license under the copyrights, patent rights, trademarks or other intellectual property rights claimed and owned by SWISSBIT. The information set forth in this document is considered to be “Proprietary” and “Confidential” property owned by SWISSBIT.ALL PRODUCTS SOLD BY SWISSBIT ARE COVERED BY THE PROVISIONS APPEARING IN SWISSBIT’S TERMS AND CONDITIONS OF SALE ONLY, INCLUDING THE LIMITATIONS OF LIABILITY, WARRANTY AND INFRINGEMENT PROVISIONS. SWISSBIT MAKES NO WARRANTIES OF ANY KIND, EXPRESS, STATUTORY, IMPLIED OR OTHERWISE, REGARDING INFORMATION SET FORTH HEREIN OR REGARDING THE FREEDOM OF THE DESCRIBED PRODUCTS FROM INTELLECTUAL PROPERTY INFRINGEMENT, AND EXPRESSLY DISCLAIMS ANY SUCH WARRANTIES INCLUDING WITHOUT LIMITATION ANY EXPRESS, STATUTORY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.©2016 SWISSBIT AG All rights reserved.SFCA032GH1AD4TOIGS 216STD SFCA064GH1AD4TOIGS216STDSFCA128GH1AD4TOILT216STDSFCA256GH1AD4TOIHT216STD。
Invitrogen EnterokinaseMax 用户手册说明书
EnterokinaseMax™ (EKMax™)iiTable of ContentsTable of Contents (iii)Important Information (iv)Methods (1)Overview (1)EKMax™ Digestion (2)Appendix (6)Recipes (6)Technical Service (7)References (8)iiiImportant InformationShipping/Storage EnterokinaseMax™ and the 10X EKMax™ reaction buffer are shipped on blue iceand should be stored at -20°C.Contents EKMax™ in 50 mM potassium phosphate, pH 8.0, 500 mM NaCl and 50%glycerol, is supplied as follows:Catalog no. E180-01:Item AmountVolume EKMax™250 units, 1 unit/µl 250µl10X EKMax™ Reaction Buffer 500 mM Tris-HCl, pH 8.0 (22°C), 10 mM CaCl2, 1% Tween-20 1.5 mlCatalog no. E180-02:Item AmountVolume EKMax™1000 units, 1 unit/µl 1.0 ml10X EKMax™ Reaction Buffer 500 mM Tris-HCl, pH 8.0 (22°C), 10 mM CaCl2, 1% Tween-20 3 x 1.5 mlAdditional Materials Needed You will need to have the following materials:• 37°C water bath or heat block• Deionized water• 1.5 ml microcentrifuge tubes• SDS-PAGE apparatus and buffers (see page 4 for guidelines) • EK-Away™ Resin and buffers (Invitrogen, Catalog no. R180-01) • 15 ml polypropylene tubes (optional)• Chromatography columns (optional, Catalog no. R640-50) • Rocker or rotatorUnit Definition 1 unit is defined as the amount of EKMax™ that will digest 20 µg of BioEase™Mog1 (multicopy suppressor of GSP1, 1)fusion protein to 90% completionin 20 minutes at 37°C in 50 mM Tris-HCl, pH 8.0, 1 mM CaCl2, and0.1% Tween-20 (1X EKMax™ Buffer).For comparison purposes, 1 Invitrogen unit of EKMax™ = ~190 trypsinogenactivation units. Use this conversion only as a rough estimate of how muchEKMax™ to use. It is important to empirically determine the optimal amount ofEKMax™ to digest your fusion protein (see page 2).Limited Label License No. 62: EKMax™Enterokinase This product is sold under patent license from Genetics Institute, Inc. for Research Use Only. Licenses for commercial manufacture or use may be obtained from Genetics Institute, Inc.ivMethodsOverviewIntroduction Enterokinase is a highly specific serine protease that can be used to digest fusion proteins to release the fusion partner or tag from the desired protein. Theenzyme recognizes the sequence -(Asp)4 Lys and cleaves after the lysine residue.This cleavage sequence is present in many expression vectors available fromInvitrogen (contact Technical Service for more information). Genes cloned intothe multiple cloning site of these vectors express recombinant N-terminal fusionproteins. The native proteins can be released from the N-terminal fusion peptideor protein by digesting with enterokinase.EnterokinaseMax™ (EKMax™) is a specially prepared recombinant enzyme,consisting of the catalytic subunit of the holoenzyme. This subunit is expressedand purified from the yeast, Pichia pastoris, yielding an enzyme with higherspecific activity. This results in more efficient cleavage using less enzyme.Description of Enterokinase Enterokinase (enteropeptidase EC 3.4.21.9) is the physiological activator of trypsinogen and a serine protease that exhibits specificity for the sequence (Asp)4 Lys (Anderson et al., 1977). The bovine holoenzyme is a heterodimer consisting of a 115 kDa structural subunit and a 35 kDa catalytic subunit. The larger subunit acts as a membrane anchor and positions the catalytic subunit on the luminal side of the brush border membrane. The catalytic subunit is homologous to other serine proteases and is inhibited by chemical modification of the serine and histidine active site residues (Grant and Hermon-Taylor, 1977; Light and Liepnieks, 1979; Maroux et al., 1971).Specificity of Enterokinase It has been proposed that the active center of enterokinase possesses a distinctive cationic subsite that binds -(Asp)4. Enterokinase is highly specific and tolerates very few changes to its recognition site. If the ionic charge of the recognition site is preserved, enterokinase will recognize the site, but the rate of hydrolysis of the peptide bond will be reduced (Light and Janska, 1989). The four aspartyl residues act as a signal for enterokinase cleavage. It has been reported that with only three aspartyl residues the rate of hydrolysis is reduced. Two aspartyl residues preceding the lysyl residue are the minimum number of acidic residues needed to maintain specificity (Maroux et al., 1971). Non-specific cleavage by enterokinase may occur in the cases described above, but this is usually alleviated by reducing the amount of enzyme used.Expression of the Recombinant Catalytic Subunit EKMax™ is a clone of the catalytic subunit of enterokinase (LaVallie et al., 1993) expressed in the yeast Pichia pastoris. EKMax™ is secreted into the medium, purified, and migrates at 43 kDa on an SDS-PAGE gel. The calculated molecular weight of the protein is 26.3 kDa, but it contains three sites for asparagine-linked glycosylation. The apparent molecular weight of 43 kDa is consistent with previous observations (LaVallie et al., 1993) and is assumed to be because ofN-linked glycosylation.1EKMax™ DigestionIntroduction You will need to have pure or partially pure fusion protein. This sectiondescribes how to digest the fusion protein with EKMax™ to cleave your proteinfrom the fusion partner. This requires setting up a series of pilot reactions todetermine empirically the best conditions for digestion. The efficiency ofcleavage of EKMax™ will differ with each fusion protein. Also, if you areaccustomed to using EK3 (Biozyme), it is still necessary to test differentconcentrations of EKMax™ to determine the right amount for complete digestion.The table below outlines the steps needed to digest your fusion protein andobtain pure protein.Stage Description1 Obtain purified fusion protein at a concentration of > 0.1 mg/ml2 Dialyze (if necessary) into 1X EKMax™ Buffer3 Set up pilot reactions using different amounts of EKMax™ and digestovernight4 Assay reactions on an SDS-PAGE gel and analyze5 Optimize digestion conditions by adjusting amount of enzyme or thetemperature as needed6 Scale-up digestions to produce more of your native protein7 Purify your native protein away from the fusion partner andEKMax™Additional Materials Needed You will need to have the following materials:• 37°C water bath or heat block• Deionized water• 1.5 ml microcentrifuge tubes• SDS-PAGE apparatus and buffers (see page 4 for guidelines) • EK-Away™ Resin and buffers (Invitrogen, Catalog no. R180-01) • 15 ml snap-cap polypropylene tubes (optional)•Chromatography columns (optional, Catalog no. R640-50)• Rocker or rotatorImportantWe have found that EKMax™ will digest fusion proteins bound to theirrespective affinity columns, releasing the desired protein and leaving the fusionpartner bound to the column. For methods to digest Xpress™ fusions bound toProBond™ and thioredoxin fusion proteins in situ on ThioBond™, contactTechnical Service (see page 7).continued on next page2Obtain Purified Fusion Protein Purify at least 120 µg of your fusion protein using your system of choice following the manufacturer's instructions.• To purify thioredoxin fusion proteins, refer to the ThioBond™ manual included with the ThioBond™ resin or contact Invitrogen for information. • To purify Xpress™ fusion proteins, refer to the ProBond™ Purification System manual or contact Invitrogen for informationNote: Both manuals may be downloaded from .EKMax™ will digest fusion proteins in crude cell lysates. Note however, that you will lose your fusion tag and will have to develop a separate protocol for purification of your protein.Dialysis of the Fusion Protein It may be necessary to dialyze your fusion protein against 1X EKMax™ buffer (see Recipes, page 6) before digesting it with EKMax™. EKMax™ is inhibited by high ionic strength. 250 mM NaCl reduces EKMax™ activity to 75% of normal and 2 M NaCl almost completely inhibits enzyme activity (Barratti et al., 1973). Also, EKMax™ is known to be inhibited by > 2 M urea, > 20 mMβ-mercaptoethanol (β-ME), >0.1% SDS, > 50 mM imidazole, and pH values below 6 and above 9.Use the table below to determine if you need to dialyze your fusion protein prior to digestion with EKMax™.If your purified protein ....Then ......contains > 2 M urea, > 250 mM NaCl,> 20 mM -ME, 0.1% SDS, or > 50 mMimidazoledialyze to remove the inhibitorsis in a buffer where the pH is lowerthan 6 or higher than 9dialyze to adjust the pH to between 6and 9.is free from inhibitors and the pH isbetween 6 and 9do not dialyze. Proceed straight toPreparation of Pilot Reactions, below.Recommendation If you are not sure whether you should dialyze your protein or not, dialyze asmall volume of your protein solution and test both dialyzed and undialyzedsamples in a pilot EKMax™ digestion.continued on next page3Preparation of Pilot Reactions You will need at least 120 µg of your fusion protein for the pilot reactions. The ratio of enzyme to fusion protein to achieve complete digestion may vary depending on the protein expressed. It is very important to use only the minimal amount of EKMax™ necessary to completely digest the fusion protein. Excess EKMax™ may cause non-specific cleavage of your fusion protein in some cases.1. To determine the optimal units of EKMax™ needed for complete digestion,use five different amounts of EKMax™ (4 units, 1 unit, 0.1 unit, 0.01 unit,and 0.001 unit). For 4 units of EKMax™, use 4 µl of undiluted EKMax™. Use 1X EKMax™ buffer to make serial 10-fold dilutions of the enzyme.2. Set up 6 reactions, including a reaction without EKMax™ to control forproteases in your protein solution:Fusion Protein 20 µg10X EKMax™ Buffer 3 µlEKMax™1-4 µlDeionized Water to 29 µl(use 30 µl for the no EKMax™ control)Final Volume 30 µl3. Mix well and incubate at 37°C overnight (~16 hours). If your protein isunstable and degrades at 37°C, try incubation at 22°C, 16°C, or +4°C. It is not necessary to increase the time of digestion to compensate for the decrease in temperature.4. Prepare and load 1-20 µl on an SDS-PAGE gel (see next section). For westernblotting, load ~1 µg of your fusion protein, and for Coomassie-stained gels, load ~10 µg.If you wish to digest your fusion protein in a crude lysate, be sure to dialyze toremove any inhibitors of EKMax™. Set up your pilot reactions as described aboveto determine the amount of EKMax™ needed to digest your fusion protein.SDS-PAGEAnalysisUse an SDS-PAGE gel that will allow you to differentiate between undigested anddigested fusion protein. The type of gel and concentration of acrylamide dependson the size of your fusion protein and the fusion partner. Some fusion partners willbe too small to resolve conveniently (i.e. the Xpress™ tag). You should be able todistinguish the removal of the fusion partner from your protein, either byCoomassie-staining or by using antibody detection methods. Choose the dilutionof EKMax™ that gives you complete digestion of your recombinant fusion protein.Recommendationfor ThioredoxinFusion ProteinsA Tricine gradient gel may be necessary to visualize the 14.6 kDa thioredoxinfusion partner (Schagger and von Jagow, 1987). Alternatively, a western blot usingthe Anti-Thio™ Antibody (Catalog no. R920-25) may be used to detect theaccumulation of the thioredoxin fusion partner and/or subsequent loss of signalfrom the native protein.continued on next page4Recommendation for Xpress™Fusion Proteins Since the Xpress™ peptide is less than 4 kDa, a shift in the size of your protein may be undetectable. A western blot using the Anti-Xpress™ Antibody (Catalog no.R910-25) or the Anti-Xpress™-HRP Antibody (Catalog no. R911-25) may be necessary to visualize the cleavage and removal of the Xpress™ fusion peptide from fusion proteins. Perform a western blot and look for the loss of the signal from your protein. The Xpress™ peptide is so small, it may not transfer well to nitrocellulose or nylon, making it difficult to detect.Optimizing EKMax™ Cleavage In some cases, increasing the calcium chloride concentration to 10 mM or the amount of Tween-20 to 1% in the digestion reaction increases the activity of EKMax™. There is a possibility that EKMax™ may recognize sites that are similar to its recognition site; however, the rate of hydrolysis will be reduced. This is usually alleviated by decreasing the amount of EKMax™.Scale-Up of EKMax™ Reaction After you have optimized the EKMax™ reaction, you may scale up your digestion reaction in a linear manner. You may need a concentrated solution of fusion protein in order to scale up your digestion. Use standard ultrafiltration methods to concentrate your protein solution.Removal of EKMax™After digestion, EKMax™ may be removed by affinity chromatography on soybean trypsin inhibitor (STI) resin. For easy removal of EKMax™, EK-Away™Resin (Catalog no. R180-01) is available from Invitrogen. EK-Away™ Resin consists of soybean trypsin inhibitor immobilized on 4% beaded agarose. For a protocol to use EK-Away™ Resin, refer to the EK-Away™ manual. The manual is available at or contacting Technical Service (see page 7).Removal of Fusion Partners Fusion partners may be removed by the same affinity resin as was used to purify the fusion protein. For protocols to remove the Xpress™ tag or the thioredoxin fusion partner after EKMax™ digestion, contact Technical Service (see page 7). For other fusion proteins, consult the manufacturer of your particular system.5Appendix Recipes10X EKMax™Reaction Buffer 500 mM Tris-HCl, pH 8.010 mM CaCl21% Tween-20 (v/v)1. For 1 liter, dissolve 60.5 g Tris base in 950 ml deionized water.2. Adjust pH to 8.0 with concentrated HCl.3. Add 1.47 g CaCl2-2H2O and 10 ml Tween-20 and mix.4. Adjust the volume to 1 liter. Store at room temperature.6Technical ServiceVisit the Invitrogen website at for:• Technical resources, including manuals, vector maps and sequences,application notes, MSDSs, FAQs, formulations, citations, handbooks, etc.• Complete technical service contact information• Access to the Invitrogen Online Catalog• Additional product information and special offersContact Us For more information or technical assistance, call, write, fax, or email. Additional international offices are listed on our website (). Corporate Headquarters:Invitrogen Corporation1600 Faraday AvenueCarlsbad, CA 92008 USATel:176****7200Tel(TollFree):180****6288Fax:176****6500E-mail: ***************************Japanese Headquarters:Invitrogen JapanLOOP-X Bldg. 6F3-9-15, KaiganMinato-ku, Tokyo 108-0022Tel: 81 3 5730 6509Fax: 81 3 5730 6519E-mail: *********************European Headquarters:Invitrogen LtdInchinnan Business Park3 Fountain DrivePaisley PA4 9RF, UKTel: +44 (0) 141 814 6100Tech Fax: +44 (0) 141 814 6117E-mail: ***********************MSDS MSDSs (Material Safety Data Sheets) are available on our website at/msds.Limited Warranty Invitrogen is committed to providing our customers with high-quality goods and services. Our goal is to ensure that every customer is 100% satisfied with ourproducts and our service. If you should have any questions or concerns about anInvitrogen product or service, contact our Technical Service Representatives.Invitrogen warrants that all of its products will perform according tospecifications stated on the certificate of analysis. The company will replace, freeof charge, any product that does not meet those specifications. This warrantylimits Invitrogen Corporation’s liability only to the cost of the product. Nowarranty is granted for products beyond their listed expiration date. No warrantyis applicable unless all product components are stored in accordance withinstructions. Invitrogen reserves the right to select the method(s) used to analyze aproduct unless Invitrogen agrees to a specified method in writing prior toacceptance of the order.Invitrogen makes every effort to ensure the accuracy of its publications, butrealizes that the occasional typographical or other error is inevitable. ThereforeInvitrogen makes no warranty of any kind regarding the contents of anypublications or documentation. If you discover an error in any of our publications,please report it to our Technical Service Representatives.Invitrogen assumes no responsibility or liability for any special, incidental,indirect or consequential loss or damage whatsoever. The above limitedwarranty is sole and exclusive. No other warranty is made, whether expressedor implied, including any warranty of merchantability or fitness for a particularpurpose.continued on next pageReferencesAnderson, L. E., Walsh, K. A., and Neurath, H. (1977). Bovine Enterokinase. Purification, Specificity, and Some Molecular Properties. Biochemistry 16, 3354-3360.Barratti, J., Maroux, S., and Louvard, D. (1973). Effect of Ionic Strength and Calcium Ions on the Activation of Trypsinogen by Enterokinase. A Modified Test for the Quantitative Evaluation of the Enzyme. Biochem. Biophys. ACTA 321, 632-638.Grant, D. A. W., and Hermon-Taylor, J. (1977). Hydrolysis of Artificial Substrates by Enterokinase and Trypsin and the Development of a Sensitive Specific Assay for Enterokinase in Serum. Biochem J. 155, 243-254.LaVallie, E. R., Rehemtulla, A., Racie, L. A., Diblasio, E. A., Ferenz, C., Grant, K. L., Light, A., and McCoy, J. M. (1993). Cloning and Functional Expression of a cDNA Encoding the Catalytic Subunit of Bovine Enterokinase. J. Biol. Chem. 268, 23311-23317.Light, A., and Janska, H. (1989). Enterokinase (enteropeptidase): Comparative Aspects. TIBS 14, 110-112. Light, A., and Liepnieks, J. J. (1979). The Preparation and Purification of Bovine Enterokinase. J. Biol.Chem. 254, 1677-1683.Maroux, S., Baratti, J., and Desnuelle, P. (1971). Purification and Specificity of Porcine Enterokinase. J.Biol. Chem. 246, 5031-5039.Schagger, H., and von Jagow, G. (1987). Tricine-Sodium dodecyl sulfate-Polyacrylamide Gel Electrophoresis for the Separation of Proteins in the Range from 1 to 100 kDa. Anal. Biochem. 166, 368-379.©1998-2006 Invitrogen Corporation. All rights reserved.For research use only. Not intended for any animal or human therapeutic or diagnostic use.。
Kingston NV2 PCIe 4.0 NVMe SSD产品规格说明书
更多內容 >>›Gen 4x4 NVMe PCIe 效能 ›是筆記型電腦和小尺寸 電腦 (SFF) 的理想選擇 ›儲存容量高達 4TB 2高容量的效能升級方案Kingston NV2 PCIe 4.0 NVMe SSD 是一款具備 Gen 4x4 NVMe 控制器的新一代儲存解決方案。
NV2 提供高達 3,500/2,800MB/s 的讀取/寫入速度1、低耗電及低熱能，有助於最佳化系統效能，在不犧牲效能的情況下提供最佳表現。
精實的單面 M.2 2280 (22x80mm) 設計不僅能節省空間，儲存容量最高更達 4TB 2，讓 NV2 成為超薄筆記型電腦、小尺寸電腦 (SFF) 系統和 DIY 主機板的理想選擇。
提供的儲存容量從 250GB 到 4TB 2，可提供您儲存應用程式、文件、照片、影片等檔案所需的所有空間。
NV2 PCIe 4.0 NVMe SSDk i ngs to /ssd產品規格產品特色/優點Gen 4x4 NVMe PCIe 效能 — 提供高達 3,500/2,800MB/s 的讀取/寫入速度1，打造整體速度更快的系統。
適合空間有限的系統 — 輕鬆整合至 M.2 接頭。
是薄型筆記型電腦以及小尺寸電腦的理想之選。
擴充儲存容量 — 有高達 4TB 2 的多種大儲存容量 可供選擇，滿足不同的資料儲存需求。
此款 SSD 固態硬碟適用於桌上型及筆記型電腦，不適用於伺服器環境。
1. 以「out-of-box performance 」拆封時效能為基準，採用 PCIe 4.0 主機板。
實際速度可能因主機 軟硬體及用途而有所不同。
2. 快閃儲存裝置的標示容量中，有部分是留給格式化和其他功能而無法用於資料儲存。
因此，實際可用來儲存資料的儲存容量會略低於產品所標示之容量。
如需更多詳細資訊， 請參閱 Kingston 《快閃記憶體指南》，網址：/flashguide 。
3. 資料寫入總位元數 (TBW) 來自於 JEDEC 客戶工作承載(JESD219A)。
IMAGE TANK G2 OTG 操作说明书
IMAGE TANK G2 OTG操作使用說明書Grand-Level Technology corp.August 2004Grand-Level Technology Corp./快速使用指南感謝您選擇使用G2 OTG! 以下，為您提供一些使用G2 OTG的快速操作。
其他更詳細的說明，請參閱本使用手冊。
快速鍵 快速鍵 (ESC) (ESC) (ESC) 選擇複製選擇複製選擇複製：：Step 1 – 按下電源鍵開機。
Step 2 – 插入CF 卡或先插入5合1轉接卡至卡槽，再於轉接卡後端接上所要複製的記憶卡。
Step 3 – 按下ESC 鍵(ESC 旁橘色短線)選擇複製- 從卡到硬碟(CF to HDD) 或 USB 裝置到硬碟(USB to HDD)。
Step 4 – 選好裝置 並按”Enter”確認. 隨後 “Waiting”顯示於 “訊息列”Step 5 – 按 ”←” 或 “→” 鍵選擇 Disk Copy 或 File CopyStep 6 – 按 “Enter” 鍵確認選定Disk Copy (或是 File Copy)Step 7 – 按 ”Enter” 確認所選的File (或Directory). 訊息列出現 “Continue?”. 不要繼續 請按 “ESC” 鍵.Step 8 – 按 “Enter” 開始複製 訊息列顯示 “Copy N%” (N=從1到100) 當複製完成 “Copy OK” 顯示在 訊息列 若出現 “Copy Error” 表示複製不完成 清除記憶卡全部資料清除記憶卡全部資料：：Step 1 –插入CF 卡或先插入5合1轉接卡至卡槽，再於轉接卡後端接上所要複製的記憶卡。
Step 2 –按下 ← 或 → 鍵請選擇如(圖a)所示。
Step 3 –按下2次ENTER 鍵後，系統會詢問是否確定。
Step 4 –為了慎重系統會在詢問2次，所以請再按ENTER 鍵2次。
DS4800介绍
DS4800 产品介绍1.1 DS4800 摘要n 支持多种平台，是IBM TotalStorage SAN 解决方案的一部分，为用户提供了存储集中整合的解决方案n 双热插拔RAID控制器提供8个4Gb的光纤通道主机端口，8个4Gb的磁盘扩展接口，支持直接连接基于UNIX和Intel处理器的集群服务器，以经济的方式实现多路径故障切换n RAID控制器拥有4G、8G的Cachen 推动存储区域网络（SAN）、网络连接存储（NAS）和直接连接环境中的存储整合n 最多可支持224个光纤（FC）磁盘驱动器，存储容量可扩展到67.2T B以上n 最多可支持224个串行（SATA）磁盘驱动器，存储容量可扩展到56TB以上n 最多64个存储分区n 支持RAID 0，1，3，5和10n 提供1600MB/s的高性能的磁盘读取带宽n 提供高性能的FAStT存储管理软件，可对所有的FAStT存储子系统进行集中管理n 支持FlashCopy、VolumeCopy高级存储管理软件n 支持Remote Mirror同步/异步容灾软件n 支持FC/SATA磁盘扩展柜混合连接n 包括基于Microsoft Windows 2000/Windows 2003的故障切换驱动器，以及对基于AIX、Sun Solaris、HP-UX和其它基于Intel处理器平台的支持—包括Novell NetWare和Linux操作系统n 通过可选的FAStT服务报警（FAStT Service Alert）功能提供的自动报警，可缩短服务的响应时间1.2 IBM TotalStorage SAN解决方案的一部分IBM TotalStorage DS4800存储服务器是一种为存储整合和集群应用而设计的价格合理、可扩展的存储服务器。
DS4800是IBM TotalStorage SAN 解决方案的一部分。
DS4800结合IBM SAN交换机，使用户可以建立SAN架构，实现存储集中管理，并可以通过相应的软硬件进一步实现存储共享、高可用性集群、自动备份容灾等高级功能。
DS-SDWI4827-050-xxx8x
3 装配尺寸
智能显示终端
SDWI4827-050-xxx8x
模块尺寸图
T
T-带电阻触摸屏，C-带电容触摸屏，N-不带触摸屏
N
S-塑料外壳，J-金属外壳，N-无外壳
2
接口方式 0：TTL/CMOS，2：RS-2本，不同硬件版本所选用液晶屏品牌型号不同以满足不同应用需求。
W 供电电压 L：低压，W：宽压，S：超宽压，F：固定电压，具体电压以规格书为准。
实物图片
接口描述 序号 位号
1
J1
R61/R62/R63 2
J21/J22/J23
3
J2
4
J4
5
J3
6
J8
名称
串口
串口电平 选择
USB-mini SD 卡座 键盘及 GPIO
串口
功能说明
采用标准 7 脚 2.0mm 间距插座，插座型号：Molex 5023520700； 用户接口类型（TTL/RS-232/RS-485），需要在订货时指明。 RS2-32 电平：断开 J21/J22/J23，R61/R62/R63 都焊接 33 欧电阻； TTL 电平：用焊锡短接 J21/J22/J23，去掉 R61/R62/R63。 用于在线下载图片、各种配置文件、以及参数设置。 用于脱机批量下载图片、各种配置文件、以及参数设置。。 选配，总共 16 个 IO 口，提供 4 种键盘与 GPIO 口组合方式。 选配，10Pin_1.0mm FPC 下接插座。
最小值
3V 6V 6V
典型值
5V 12V 24V
最大值
6V 20V 42V
智能显示终端
SDWI4827-050-xxx8x
电气特性
D系列说明书
温馨提示:在进行产品安装时，可以将控制箱前盖取下来。取下前盖
的方法是：先将前盖打开至与底壳垂直的位置，然后再将前盖轻轻向前推 6mm，最后将前盖向左侧平移出来。
1.4 产品的搬运
本产品属于精密电子设备，在搬运过程中要做好防静电工作；搬运时勿 摔、勿压，以免造成零部件脱落或是外观变形！
1.5 产品的保存
-6-
深圳市中翔恒威科技有限公司
控制箱左侧一个,便于从控制箱左边布线使用； 控制箱右侧一个,便于从控制箱右边布线使用； 控制箱底部两个,便于从控制箱底部布线使用。
kang® King ingk
温馨提示 :
1)所有布线口出厂时为封闭状态,施工人员可以根据现场具体情况,以及客户 要求打开相应的进出线口。不需要用到的不要打开！ 2)控制箱底部两个布线口是为了在布线时可以走暗线，其余的布明线。 3)布线口一经开启以后不能复原！ ②→为我们公司的品牌标志。 ③→控制箱的锁孔,可以将控制箱锁起来。 ④→控制箱前盖。 ⑤→百叶窗,控制箱内通风散热用,在控制箱左右两侧都有。 ⑦→控制箱底壳。
-2-
深圳市中翔恒威科技有限公司
kang® King ingk
提示
在任何情况下，所有门禁系统中的设备在安装过程中都不得违反当地的有关 消防条例。应该在安装之前和当地的消防部门联系，协商。对设备进行试验， 并在安装之前取得消防部门书面认可。
提示
本文件中的信息可能修改，恕不另行通知。
温馨提示
在拆包装前先检查运输途中有没有出现损坏。 所有外包装请小心打开，使里面的设备不要受损。 以下是打开设备包装，准备安装的步骤： 1. 打开外包装，去除所有包裹材料，保留这些包装。 2. 检查货物是否齐全，若有缺少物品，请立即联系订购部门。 3. 检查货物是否完好， 若有损坏， 请按下面执行： 如果损坏为运输过程所为 ， 在申诉单上一定要填写商业承运人。如果是其他故障，请要求返回认可。
EC3000-R32SSD 产品说明书
Tech Date Box 1 - EC3000-R32SSD Wt: 40 lbs. Dim: 18" x 21" x 12"Part No.Description QuantityYes Remarks 1EC3000Processor Unit 12001-188-260-00Cbl Assy DB9-DB9 5m 13000-176-423-11AC Power Cbl 5m 14000-174-113-10LAN Cable 0.5M 15000-157-47010A Fuse FGMB 250V 10A PBF 3SP24-006016100-366-821-10Dust Proof Sponge 1FP24-006037001-285-750-00FAR-3000 Installation Software DVD 1"8100-366-811-10Wiring Plate 11CP24-021019100-367-720-10Chassis Base 11"10100-372-170-10Chassis Base 21"11001-186-200-00Wiring Plate 2 Assy 1"12000-162-167Cable Tie CV-100N 100mm 10"13000-162-186-10Cable Tie CV-150N 150mm 30"14000-166-666-10Crimp-on Lug FV1.25-4 Red 9"15000-162-664-10Binding Head Screw M3X6 SUS3045"16000-162-669-10Binding Head Screw M4X8 SUS30410"17E32-013-05Z Instruction Manual 118OSE-361-60Z Operator's Guide 119IME-361-80Z Installation Manual 120OME-361-60Z Operator's Manual CD 121Dongle Information Sheet 122MDC-361-80Z Environmental Data Sheet 1Box 2 - RCU025Wt: 10 lbs. Dim: 19" x 11" x 9"Part No.Description Quantity Yes Remarks 1RCU025Radar Control Unit 12000-176-700-11Cable Assy TS-20-071-1 5m 13100-367-460-10Desk Fixing Plate 1FP24-007014100-372-000-10USB Sheet 1"5000-163-192-10Washer Head Screw M4X124"6000-162-608-10Self-Tapping Screw 5X20 SUS3042CP24-022017000-172-164-10Cable Tie CV-125N 125mm 2"8001-188-3005M USB Cable 1PACKING LIST FOR FAR3230SSSDBB/12EC3000-R32SSD RCU025Tech Date Box 3 - RSB133-111N Wt: 220 lbs. Dim: 29" x 29" x 26"Part No.Description Quantity Yes Remarks 1RSB133-111N Gearbox 30kW S Band 12300-130-020-10Seal Washer 8CP03-354023000-167-397-10Spring Washer M128"4000-167-491-10Hex Nut M1216"5000-167-446-10Flat Washer M128"6000-162-814-10Hex Head Screw M12X708"7000-158-856-10Hex Nut M61"8000-158-855-10Spring Washer M61"9000-158-854-10Flat Washer M63"10000-162-871-10Hex Head Bolt M6X251"11000-566-000Ground Wire Assy 30cm 1"12C32-013-03Z Installation Notice S Band 1Box 4 - PSU016Part No.Description Quantity Yes Remarks 1PSU016Power Supply Unit 12000-166-666-10Crimp-on Lug FV1.25-41CP03-353013000-157-247-10Crimp-on Lug FV2-43"4000-157-250-10Crimp-on Lug FV2-M31"5000-166-044-10Connector MPS588-C 3"6000-155-840-10Fuse 5A 250V 2SP03-17661Box 5 - 001-259-860-00Wt: 51 lbs. Dim: 19" x 19" x 7"Part No.Description Quantity Yes Remarks 1001-259-860-00Cable Assy RW-00135-L30M 1Box 6 - SN36CF/ANT12Wt: 163 lbs. Dim: 16" x 23" x 158"Part No.Description Quantity Yes Remarks 1SN36CF/ANT12S-Band Array 12000-167-446-10Flat Washer M1212CP03-352023000-167-397-10Spring Washer M1212"4000-162-810-10Hex Head Bolt M12X404"5000-164-116-10Hex Head Bolt M12X508"6000-158-483-11 3 Bond Sealant S-8400W 1"Rev 7/15Wt: 22 lbs. Dim: 21" x 20" x 11"PSU016SN36CF/ANT12PACKING LIST FOR FAR3230SSSDBB/12RSB133-111N 001-259-860-00。
Synology DiskStation DS1618+ 6-Bay NAS商品说明书
Synology DiskStation DS1618+ is a versatile, compact, yet powerful 6-bay NAS equipped with quad-core processor, designed for small- and medium-sized businesses. It comes with advanced computing applications to meet businesses' demands and supercharges your storage with the optional M.2 SSDadapter card for dual SSD cache drives. DS1618+ is ideal to serve as a centralized file server for simplifying data management and protecting critical assets. Synology DS1618+ is backed with Synology’s 3-year limited warranty.DiskStationDS1618+Highlights• Powerful and scalable 6-bay NAS optimized for data-intensive work environment• Quad-core, 2.1 GHz CPU with AES-NI support and 4GB DDR4 memory, expandable up to 32GB • Outstanding performance at over 2,030 MB/s reading and 620 MB/s writing 1• Boost IOPS system performance with M.2 SSD cache by using optional M2D17 adapter card 2• PCIe 3.0 slot for optional 10GbE add-on card• Four built-in 1GbE (RJ-45) ports with failover and Link Aggregation support • Advanced Btrfs file system offering 65,000 system-wide snapshots and 1,024 snapshots per shared folderHigh-performance Scalable Storage ServerSynology DS1618+ is a 6-bay network attached storage solution with great performance and scalability. DS1618+ supports up to 16 drives with two Synology DX5173 expansion units, allowing you to start small and easily scale up on demand. In addition to 10GbE add-on card , which can upgrade the network capacity of DS1618+, the PCle slot also supports the optional SATA M.2 SSD adapter card to function as SSD cache for greatly enhancing storage performance without using the 3.5" drive bays.DS1618+ is equipped with a quad-core processor and 4GB DDR4 memory (expandable up to 32GB). With Link Aggregation enabled, DS1618+ deliversoutstanding sequential throughput performance at over 2,030 MB/s reading and 620 MB/s writing 1.Btrfs: Next Generation Storage EfficiencyDS1618+ introduces the Btrfs file system , bringing the most advanced storage technologies to meet the management needs of modern businesses:• Built-in data integrity check detects data and file system corruption with data and meta-data checksums and improves the overall stability.• Flexible Shared Folder/User Quota System provides comprehensive quota control over all user accounts and shared folders.• Advanced snapshot technology with customizable backup schedule allows up to 1,024 copies of shared folder backups in a minimum 5-minute interval without occupying huge storage capacity and system resources.• File or folder level data restoration brings huge conveniences and saves time for users who wish to restore only a specific file or folder.• File self-healing : Btrfs file system can auto-detect corrupted files with mirroredmetadata, and recover broken data using the supported RAID volumes, which include RAID1, 5, 6, and 10.Cross-platform File SharingDSM, the operating system running on all Synology NAS, provides fast and secure ways to share your critical digital assets. Synology Drive unifies multiple file portals on Synology NAS and greatly simplifies data management. You can share files to anyone, and customize access permissions for optimal security. Synology Drive makes it easy to share files across multiple platforms — whether it's Windows®, Mac®, and Linux® computers or mobile devices.Ultimate Backup SolutionDS1618+ integrates various backup applications to safeguard your important data on any device with an intuitive user interface and durable storage technologies.• Desktop Backup: Cloud Station Backup safeguards your PC, Mac, or other desktop devices. DS1618+ is also compatible with Time Machine, allowing you to effortlessly backup your Mac to Synology NAS.• NAS Backup: Hyper Backup comprehensively backs up your data to a local sharedfolder, an external device, another Synology NAS, an rsync server, a public cloud service, or C2 Backup to ensure data safety.• Server Backup: Active Backup for Server provides an agentless backup solution. It centralizes data from Windows and Linux servers through SMB and rsync to effectively minimize deployment and management costs.• SaaS Backup: Active Backup for Office 365/G Suite is an on-premise backup solution for public clouds with a centralized dashboard. Optimize storage efficiency with singleinstancing and block-level deduplication technology.Effortless Virtualization EnvironmentSynology’s Virtual Machine Manager adds unlimited capabilities to your NAS. Set up and run various virtual machines, including Windows, Linux, and Virtual DSM so that you can test new software versions in a sandbox environment, isolate your customers' machines, and increase the flexibility of your DS1618+ with reduced hardware deployment and maintenance costs.Synology iSCSI storage fully supports most virtualization solutions to enhance work efficiency with a simple management interface. VMware vSphere™ 6.5 and VAAI integration helps offload storage operations and optimizes computation efficiency. Windows Offloaded Data Transfer (ODX) speeds up data transfer and migration rates, while OpenStack Cinder support turns your Synology NAS into a block-based storage component.Reliability, Availability & Disaster RecoverySystem reliability is of paramount importance to businesses which depend upon their commercial servers every day. DS1618+ responds to these concerns with wide-ranging availability and redundancy features:• Synology High Availability Manager ensures seamless transitioning between clustered servers with minimal impact to applications, preventing unexpected interruptions and costly downtime.• Redundant system fans and network ports with failover support ensure maximum continuous service uptime.• High reliability system design including fan-less CPU heat-sink and passive cooling technology, preventing single points of failure.• Optional 5-year warranty4 is available in select regions.Virtual Machine ManagerVirtual Machine Manager implements various virtualization solutions, allowing you to manage multiple virtual machines on your DS1618+, including Windows, Linux, and Virtual DSM.Next-Generation File SystemA modern file system designed to address obstacles often encountered in enterprise storage systems. Safeguarding data integrity through metadata mirroring, self-healing and snapshot replication.Hardware OverviewTechnical SpecificationsHardwareCPUIntel Atom C3538 quad-core 2.1GHzHardware encryption engine Yes (AES-NI)Memory4 GB DDR4 Non-ECC SO-DIMM (expandable up to 32 GB with 16 GB ECC SO-DIMM x 2)Compatible drive type • 6 x 3.5" or 2.5" SATA SSD/HDD (drives not included)• 2 x M.2 2280/2260/2242 SSD 2 (drives not included)External port • 3 x USB 3.0 port • 2 x Expansion portSize (HxWxD)• 166 x 282 x 236 mm• 166 x 282 x 243 mm (with server ears)Weight 5.05 kg LAN4 x 1GbE (RJ-45)Wake on LAN/WAN YesPCIe 3.0 slot• x8 slot x 1 (4-lane)• 10GbE network interface cards support • M.2 SSD adapter card support Scheduled power on/off YesSystem fan2 (92 x 92 x 32 mm)AC input power voltage 100V to 240V AC Power frequency 50/60Hz, single phase Operating temperature 0°C to 40°C (32°F to 104°F)Storage temperature -20°C to 60°C (-5°F to 140°F)Relative humidity5% to 95% RH Maximum operating altitude3,048 m (10,400 ft)1Status indicator 2Alert indicator 3Power button 4LAN indicator 5Drive status indicator 6Drive tray 7USB 3.0 port 8Power port 9Kensington Security Slot 10eSATA port 11Fan 121GbE RJ-45 port 13RESET button14USB 3.0 port15eSATA port16PCIe expansion slot7891216General DSM SpecificationNetworking protocol SMB, AFP, NFS, FTP, WebDAV, CalDAV, iSCSI, Telnet, SSH, SNMP, VPN (PPTP, OpenVPN ™, L2TP)File system • Internal: Btrfs, ext4• External: Btrfs, ext4, ext3, FAT, NTFS, HFS+, exFAT5Supported RAID type Synology Hybrid RAID (SHR), Basic, JBOD, RAID 0, RAID 1, RAID 5, RAID 6, RAID 10Storage management • Maximum single volume size: 108 TB • Maximum of system snapshots: 65,5366• Maximum internal volumes: 512• Maximum iSCSI targets: 32• Maximum iSCSI LUNs: 256• iSCSI LUN clone/snapshot supportSSD cache • Read-write cache support • M.2 SSD supportFile sharing capability • Maximum local user accounts: 2,048• Maximum local groups: 256• Maximum shared folders: 512• Maximum concurrent SMB/NFS/AFP/FTP connections: 1,000Privilege Windows Access Control List (ACL), application privilegeDirectory service Windows® AD integration: Domain users login via SMB/NFS/AFP/FTP/File Station, LDAP integration Virtualization VMware vSphere® 6.5, Microsoft Hyper-V®, Citrix®, OpenStack®Security Firewall, encrypted shared folder, SMB encryption, FTP over SSL/TLS, SFTP, rsync over SSH, login auto block, Let's Encrypt support, HTTPS (Customizable cipher suite)Supported client Windows 7 and 10, Mac OS X® 10.11 onwardsSupported browser Chrome®, Firefox®, Internet Explorer® 10 onwards, Safari® 10 onwards; Safari (iOS 10 onwards), Chrome (Android™ 6.0 onwards)Interface Language English, Deutsch, Français, Italiano, Español, Dansk, Norsk, Svensk, Nederlands, Русский, Polski, Magyar, Português do Brasil, Português Europeu, Türkçe, Český,Packages and ApplicationsFile Station Virtual drive, remote folder, Windows ACL editor, compressing/extracting archived files, bandwidth control for specific users or groups, creating sharing links, transfer logsFTP Server Bandwidth control for TCP connections, custom FTP passive port range, anonymous FTP, FTP SSL/TLS and SFTP protocol, boot over the network with TFTP and PXE support, transfer logsUniversal Search Offer global search into applications and filesHyper Backup Support local backup, network backup, and backup data to public clouds Active Backup for Server Centralize data backup for Windows and Linux servers without client installationBackup tools DSM configuration backup, macOS Time Machine support, Cloud Station Backup Shared folder sync - maximum tasks: 8Cloud Station Suite Sync data between multiple platforms by installing the client utilities on Windows, Mac, Linux, Android and iOS devices, while retaining up to 32 historical versions of filesMaximum concurrent file transfers: 1,000Drive • Maximum Number of Synced Files: 1,000,000 / single file reaction time 437 ms • Maximum Number of Concurrent Connections for PC Clients: 550Cloud Sync One or two-way synchronization with public cloud storage providers including Amazon Drive, Amazon S3-compatible storage, Baidu cloud, Box, Dropbox, Google Cloud Storage, Google Drive, hubiC, MegaDisk, Microsoft OneDrive, OpenStack Swift-compatible storage, WebDAV servers, Yandex DiskSurveillance Station Maximum IP cameras: 40 (total of 1,200 FPS at 720p, H.264) (includes two free camera licenses; additional cameras require the purchasing of additional licenses)Virtual Machine Manager Deploy and run various virtual machines on Synology NAS, including Windows, Linux, or Virtual DSM High Availability Manager Reduce service downtime by setting up two identical NAS into one high-availability clusterSnapshot Replication • Maximum shared folder snapshots: 1,024• Maximum replications: 32Synology Directory Server A flexible and cost-effective domain controller solutionVPN Server Maximum connections: 20, supported VPN protocol: PPTP, OpenVPN™, L2TP/IPSecMailPlus Server Secure, reliable, and private mail solution with high-availability, load balancing, security and filtering design (Includes 5 free email account licenses; additional accounts require the purchasing of additional licenses)SYNOLOGY INC.Synology is dedicated to taking full advantage of the latest technologies to bring businesses and home users reliable and affordable ways to centralize data storage, simplify data backup, share and sync files across different platforms, and access data on-the-go. Synology aims to deliver products with forward-thinking features and the best in class customer services.Copyright © 2019, Synology Inc. All rights reserved. Synology, the Synology logo are trademarks or registered trademarks of Synology Inc. Other product and company names mentioned herein may be trademarks of their respective companies. Synology may make changes to specification and product descriptions at anytime, without notice.DS1618+-2019-ENU-REV004Headqu artersSynology Inc. 9F., No.1, Yuandong Rd., Banqiao Dist., New Taipei City 220, Taiwan Tel: +886 2 2955 1814 Fax: +886 2 2955 1884MailPlusIntuitive webmail interface for MailPlus Server, customizable mail labels, filters, and user interface Collaboration tools • Chat maximum users: 1,500• Office maximum users: 1,800• Calendar: support CalDAV and access via mobile devicesNote Station Rich-text note organization and versioning, encryption, sharing, media embedding and attachmentsStorage Analyzer Volume and quota usage, total size of files, volume usage and trends based on past usage, size of shared folders, largest/most/least frequently modified filesAntivirus Essential Full system scan, scheduled scan, white list customization, virus definition auto update Download Station Supported download protocols: BT, HTTP , FTP , NZB, eMule, Thunder, FlashGet, QQDL Maximum concurrent download tasks: 80Web Station Virtual host (up to 30 websites), PHP/MariaDB®, 3rd-party applications supportOther packagesVideo Station, Photo Station, Audio Station, DNS Server, RADIUS Server, iTunes® Server, Log Center, additional 3rd-party packages are available in Package CenterEnvironment and PackagingEnvironment safetyRoHS compliant Package content• DS1618+ main unit x 1• Quick Installation Guide x 1• Accessory pack x 1• AC power cord x 2• RJ-45 LAN cable x 2Optional accessories• 4GB DDR4-2133 Non-ECC SO-DIMM (D4NS2133-4G)• 16GB DDR4-2133 ECC SO-DIMM (RAMEC2133DDR4SO-16G)• Synology E10G17-F2 / E10G15-F1 10Gbps Ethernet adapters • Synology M2D17 M.2 SSD adapter card • Expansion Unit DX517• VisualStation VS360HD, VS960HD • Surveillance Device License Pack • MailPlus License Pack •Virtual DSM License PackWarranty 3 years 7*Model specifications are subject to change without notice. Please refer to for the latest information.1. Performance figures may vary depending on environment, usage, and configuration.2. DS1618+ supports dual M.2 SSD through M2D17 adapter card, sold separately.3. DS1618+ supports up to two Synology DX517, sold separately.4.5 year warranty is available as an optional bundle with EW201, 2-year Extended Warranty service add-on. Visit https:///en-global/products/Extended_Warranty for more information on availability.5. exFAT Access is purchased separately in Package Center.6. System snapshot includes snapshots taken by iSCSI Manager, Snapshot Replication, and Virtual Machine Manager. Availability of these packages varies by model.7. The warranty period starts from the purchase date as stated on your purchase receipt. Visit https:///company/legal/warranty for more information.ChinaSynology Shanghai200070, Room 201, No. 511 Tianmu W. Rd., Jingan Dist. Shanghai, ChinaUnited Kingdom Synology UK Ltd.Unit 5 Danbury Court, Linford Wood,Milton Keynes, MK14 6PL, United KingdomFranceSynology France SARL102 Terrasse Boieldieu (TOUR W) 92800 Puteaux, France Tel: +33 147 176288Germany Synology GmbHGrafenberger Allee 125 40237 Düsseldorf DeutschlandTel: +49 211 9666 9666North & South America Synology America Corp.3535 Factoria Blvd SE #200 Bellevue, WA98006, USATel: +1 425 818 1587JapanSynology Japan Co., Ltd4F, 3-1-2, Higashikanda, Chiyoda-ku, Tokyo, 101-0031, Japan。
TS8000 Option Card 产品说明书
TS8000
DeviceNet Option 8000/DN/00
HA471506 Issue 1
© Copyright SSD Drives, Inc. 2006
All rights strictly reserved. No part of this document may be stored in a retrieval system, or transmitted in any form or by any means to persons not employed by an SSD Drives company without written permission from SSD Drives, Inc.
Specifications .................................................................................................. 5 Power Requirements ....................................................................................... 5 Communications ........................................................................................... 5 Environmental Conditions............................................................................... 5 Construction.................................................................................................. 5 Installation Requirements ................................................................................ 5
Bridgelux Vesta Series Dim-To-Warm 6mm Array 产品说明书
®Product Data Sheet DS149IntroductionVesta ® Series Dim-To-Warm Array products deliver adaptable light in a cost-effective, solid state lighting package. Vesta Series products tap into the powerful mediums of light and color to influence experience, well-being, and human emotion. They allow fixture manufacturers to simulate the familiar glow and dimming of incandescent lamps. This high flux density light source is designed to support a wide range of high quality, low cost directional luminaires and replacement lamps for commercial and residential applications.Lighting system designs incorporating these LED arrays deliver comparable performance to 150 Watt incandescent-based luminaires, while increasing system level efficacy and prolonging service life. Typical luminaire and lamp types appropriate for this family include replacement lamps, down lights, wall packs and accent, spot and track lights.Features • Dimming range from 2700K to 1800K and 3000K to 1800K • Efficacy of up to 111 lm/W typical • Uniform, high quality illumination • Minimum 90 CRI option• More energy efficient than incandescent, halogen and fluorescent lamps • Industry standardized dimensions • Flux packages up to 660 lumens typicalBenefits• Superior color dimming transition• Compact system design resulting from high lumen density • High quality, true color reproduction • Enhanced optical control • Uniform, consistent white light • Lower operating costs • Reduced maintenance costsContentsProduct Feature Map2 Product Nomenclature2 Product Selection Guide3 Electrical Characteristics4 Absolute Maximum Ratings5 Performance Curves 6 - 7 Typical Radiation Pattern8 Typical Color Spectrum9 Mechanical Dimensions10 Color Binning Information11 Packaging and Labeling12 Design Resources13 Precautions13 Disclaimers13 About Bridgelux14Product Feature MapBridgelux arrays are fully engineered devices that provide consistent thermal and optical performance on an engineeredmechanical platform. The arrays incorporate several features to simplify design integration and assembly. Please visit for more information on the Vesta Series family of products.Product NomenclatureThe part number designation for Bridgelux Vesta Series arrays is explained as follows:1 2 3 4 5 6 7 8 9 10 11 12131415 – 16 17 18Product FamilyCCT Bin Options 13 = 3 SDCMForm Factor Designator 0600 = 6mm LESMinimum CRIG = 90 CRIArray Configuration A = 6WNominal CCT 18 = 1,800K 27 = 2,700K 30 = 3,000KBXRV DR – 1830 G – 0600 – A – 13Fully engineered substratefor consistent thermal, mechanicaland optical propertiesYellow phosphor Light Emitting Surface (LES)clearance distancesNote: Part number and lot codes are scribed on back of arrayPolarity symbolsSolder PadsWhite ring around LESCase Temperature (T c ) Measurement PointDimming control componentDim-To-Warm ArrayProduct Selection GuideThe following product configurations are available:Table 1:Selection Guide, Measurement DataNotes for Table 1:1. Nominal CCT as defined by ANSI C78.377-2011.2. CRI Values are minimums. Minimum R9 value for 90 CRI products is 50. Bridgelux maintains a ±3 tolerance on all CRI and R9 values.3. Products tested under pulsed condition (10ms pulse width) at nominal test current where Tj (junction temperature) = Tc(case temperature) = 25°C.4. Typical performance values are provided as a reference only and are not a guarantee of performance.5. Bridgelux maintains a ±7% tolerance on flux measurements.6. Minimum flux values at the nominal test current are guaranteed by 100% test.7. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance.8. Typical performance is estimated based on operation under DC (direct current) with LED array mounted onto a heat sink with thermal interfacematerial and the case temperature maintained at 85°C. Based on Bridgelux test setup, values may vary depending on the thermal design of the luminaire and/or the exposed environment to which the product is subjected.Electrical CharacteristicsTable 2:Electrical CharacteristicsNotes for Table 2:1. Parts are tested in pulsed conditions, Tc= 25°C. Pulse width is 10ms.2. Voltage minimum and maximum are provided for reference only and are not a guarantee of performance.3. Bridgelux maintains a tester tolerance of ± 0.10V on forward voltage measurements.4. Typical coefficient of forward voltage tolerance is ± 0.1mV for nominal current.5. Thermal resistance value was calculated using total electrical input power; optical power was not subtracted from input power. The thermal interfacematerial used during testing is not included in the ther mal resistance value.6. Vf min hot and max cold values are provided as reference only and are not guaranteed by test. These values are provided to aid in driver design andselection over the operating range of the product.7. This product has been designed and manufactured per IEC 62031:2014. This product has passed dielectric withstand voltage testing at 500 V. The workingvoltage designated for the insulation is 45V d.c. The maximum allowable voltage across the array must be determined in the end product application.Absolute Maximum RatingsTable 3: Maximum RatingsNotes for Table 3:1. For IEC 62717 requirement, please contact Bridgelux Sales Support.2. See Bridgelux Application Note AN101 “Handling and Assembly of LED Arrays” for more information.3. Please refer to Figure 6 for a drive current derating curve.4. Bridgelux recommends a maximum duty cycle of 10% and pulse width of 20ms when operating LED arrays at the maximum peak pulsedcurrent specified. Maximum peak pulsed currents indicate values where the LED array can be driven without catastrophic failures.5. Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum ratingprovided for reference only.Figure 2: Relative Flux vs. Case Temperature88%90%92%94%96%98%100%102%152535455565758595105115R e l a t i v e L O PCase Temperature (°C)25°C Pulsed350mA 14mAFigure 5: Relative LOP vs. Drive Current, T c =25°C0%20%40%60%80%100%120%140%0100200300400500R e l a t i v e L O PDrive Current (mA)16001800200022002400260028000100200300400500C C T (K )Current (mA)Figure 3: CCT vs. Forward Current, T c =25°C1600180020002200240026002800300032000100200300400500C C T (K )Current (mA)Figure 4: CCT vs. Forward Current, T c =25°CBXRV-DR-1827x-0600-x-13BXRV-DR-1830x-0600-x-13Figure 1: Forward Voltage vs. Forward Current, T c =25°C05010015020025030035040045010.011.012.013.014.015.016.017.018.0F o r w a r d C u r r e n t (m A )Forward Voltage (V)Figure 6: Derating CurveFigure 7: Color shift vs. Forward Current 2700K - 1800KTypical Radiation PatternFigure 9: Typical Spatial Radiation PatternNotes for Figure 9:1. Typical viewing angle is 110⁰.2. The viewing angle is defined as the off axis angle from the centerline where Iv is ½ of the peak value. Figure 10: Typical Polar Radiation PatternTypical Color Spectrum Figure 11: Typical Color SpectrumNote for Figure 11:1. Color spectra measured at nominal current for Tj = Tc= 25°C.Mechanical DimensionsFigure 12: Drawing for Vesta Dim-To-Warm 6mm ArrayNotes for Figure 12:1. Drawings are not to scale.2. Drawing dimensions are in millimeters.3. Unless otherwise specified, tolerances are ± 0.10mm.4. Bridgelux maintains a flatness of 0.1 mm across the mounting surface of the array. Refer to Application Notes for product handling, mounting and heatsink recommendations.5. The optical center of the LED array is nominally defined by the mechanical center of the array. The light emitting surface (LES) is centered on the me-chanical center of the array to a tolerance of ± 0.2 mm.6. Solder pads are labeled “+” to denote positive polarity, and “-” to denote negative polarity.Color Binning InformationNotes for Table 4: 1. The x,y center points are the center points of the respective ANSI bins in the CIE 1931 xy Color Space 2. Products are binned at Tc=25°C3.Bridgelux maintains a tolerance of +/-0.007 on x and y color coordinates in the CIE 1931 Color SpaceFigure 13:Definition of the McAdam ellipseTable 4: McAdam ellipse CCT color bin definitions for product operating at T c = 25ºCPackaging and LabelingFigure 14: Vesta Series Dim-To-Warm 6mm Packaging and LabelingNotes for Figure 14:1. Each tray holds 35 Vesta Series Dim-To-Warm 6mm arrays.2. Eight trays are sealed in an anti-static bag. One such bag is placed in a box and shipped. Depending on quantities ordered, a bigger shipping box, con -taining more boxes will be used to ship products.3. Each bag and box is to be labeled as shown above.4. Dimensions for each tray are 200 (W) x 12(H) x 300 (L) mm. Dimensions for the anti-static bag are 440 (W) x 350mm (L) x 0.1 mm (T) and that of a shipping box are 350 x 245 x 67 mm.Figure 15: Product LabelingBridgelux arrays have laser markings on the back side of the substrate to help with product identification. In addition to the product identification markings, Bridgelux arrays also contain markings for internal Bridgelux manufacturing use only. The image below shows which markings are for customer use and which ones are for Bridgelux internal use only. The Bridgelux internal manufacturing markings are subject to change without notice, however these will not impact the form, function or performance of the array.product part number and other Bridgelux internal production information.Tray labelBXRV-DR-1830G-0600-A-1313BXRV-DR-1830G-0600-A-13BXRV-DR-1830G-0600-A-1313Design ResourcesDisclaimersPrecautionsApplication NotesBridgelux has developed a comprehensive set of application notes and design resources to assist customers in successfully designing with the VestaSeries product family of LED array products. Please see Bridgelux Application Note, AN101 for more information. For a list of resources under development visit .Optical Source ModelsOptical source models and ray set files are available for all Bridgelux products. For a list of available formats, visit .MINOR PRODUCT CHANGE POLICYThe rigorous qualification testing on products offered by Bridgelux provides performance assurance. Slight cos -metic changes that do not affect form, fit, or function may occur as Bridgelux continues product optimization.CAUTION: CHEMICAL EXPOSURE HAZARD Exposure to some chemicals commonly used in luminaire manufacturing and assembly can cause damage to the LED array. Please consult Bridgelux Application Note for additional information.CAUTION: EYE SAFETYEye safety classification for the use of Bridgelux Vesta Series is in accordance with IEC/TR62778: Application of IEC 62471 for the assessment of blue light hazard to light sources and luminaires. Vesta Series Dim-To-Warm arrays are classified as Risk Group 1 when operated at or below the maximum drive current. Please use appropriate precautions. It is important that employees working with LEDs are trained to use them safely.CAUTION: RISK OF BURNDo not touch the Vesta Series LED array during opera-tion. Allow the array to cool for a sufficient period of time before handling. The Vesta Series LED array may reach elevated temperatures such that could burn skin when touched.3D CAD ModelsThree dimensional CAD models depicting the product outline of all Bridgelux Vesta Series LED arrays are avail -able in both IGES and STEP formats. Please contact your Bridgelux sales representative for assistance.CAUTIONCONTACT WITH LIGHT EMITTING SURFACE (LES) Do not touch the LES (Light Emitting Surface, defined by the yellow phosphor resin area). Do not apply any stress to the LES or resistors to avoid damage to the LED array.Holder and secondary optics may be mounted on the top surface of the Vesta Series array as long as they do not make contact with the LES and resistors. Use the edges of the Vesta Series array to align and mount holder and secondary optics devices.STANDARD TEST CONDITIONSUnless otherwise stated, array testing is performed at the nominal drive current.LM80LM80 testing has been completed and the LM80 report is now available. Please contact your Bridgelux sales representative for LM-80 report.About Bridgelux: Bridging Light and Life™© 2020 Bridgelux, Inc. All rights reserved 2020. Product specifications are subject to change without notice. Bridgelux and the Bridgelux stylized logo design are registered trademarks of Bridgelux, Inc, and Vesta Series is a registered trademark of Bridgelux, Inc. All other trademarks are the property of their respective owners.Bridgelux Vesta Series Dim-To-Warm 6mm Array Product Data Sheet DS149 Rev. A (05/2020)46430 Fremont Blvd Fremont, CA 94538 USA Tel (925) At Bridgelux, we help companies, industries and people experience the power and possibility of light. Since 2002, we’ve designed LED solutions that are high performing, energy efficient, cost effective and easy to integrate. Our focus is on light’s impact on human behavior, delivering products that create better environments, experiences and returns—both experiential and financial. And our patented technology drives new platforms for commercial and industrial luminaires.For more information about the company, please visit /Bridgelux /Bridgelux/user/Bridgelux/company/bridgelux-inc-_2WeChat ID: BridgeluxInChina。
DSA E-Series (E2800 12-bay)说明书
u可向上擴充的網路儲存解決方案：具有 12 部內接式硬碟的控制器裝置，可透過最先進的 SAS 介面連接擴充裝置進行擴充u可設定的硬體架構 RAID/DDP 保護 (RAID‑5、RAID‑6 或DDP) 提供最高的系統效能u 可熱插拔的備援電源供應器和散熱風扇u兩個 10 Gigabit 的乙太網路連接埠，可提供最高速的iSCSI 連線u便於維修的完全模組化設計且受 NetApp 服務保護，包含3 年次營業日現場支援DSA E2800 代表新一代的 Bosch DSA E‑Series iSCSI 架構數位視訊磁碟陣列。
這些最先進的平台是專為保全產業最嚴苛的數位視訊儲存應用程式所設計，可管理持續成長的數位視訊資料。
自從 HD 以及最近的 UHD (4K) IP 攝影機和編碼器進入監控市場以來，產業面臨的主要挑戰就是使用者對於高頻寬與低複雜度之儲存基礎架構的需求不斷成長。
新一代的 DSA E2800 磁碟陣列正是因應此等挑戰的不二選擇。
系統概觀DSA E2800 以一部 2U 控制器裝置與 12 部內接式 3.5 吋7.2 K NL-SAS (序列連接 SCSI) 企業級硬碟 (近線 SAS) 為基礎。
控制器裝置提供了標準的單控制器設置和雙控制器設置以符合高可用性需求。
這套儲存系統是採用絕佳彈性設計的高效能解決方案，非常適合各種視訊監控需求。
其均衡的效能是針對支援高頻寬及I/O 密集型工作負載所設計。
DSA E2800 磁碟支架選項提供了具有 12 部 3.5 吋 7.2 K NL-SAS 企業級硬碟 (2U) 的標準 12 槽擴充裝置，可讓您針對任何標準中型至大型企業環境最佳化自訂設置。
此外，DSA E2800 完全備援的 I/O 路徑、進階保護功能及廣泛的診斷能力可提供高度可用性、完整性與安全性。
功能DSA E2800 是與 NetApp 聯名推出的 E2800 系列。
這套可向上擴充的網路儲存解決方案會提供安全性、最高的「現成」擴充性、安心的資料保護以及所有視訊資料的簡易管理功能。
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产品图片型号型号英寸
2.5英寸英寸接口SATA 接口
容量
16GB 容量连续读
120MB/S | 150MB/S 连续读连续写25MB/S | 80MB/S 连续写
4KB 连续每秒读次数32004KB 连续每秒读次数
4KB 连续每秒写次数3204KB 连续每秒写次数存储介质NAND 闪存MLC-NAND Flash 存储介质NAND 闪存
输入电压 3.3V±5%输入电压
空闲0.6W MAX 空闲
工作1W MAX
工作写寿命
每天写100GB 资料可以用8年写寿命读寿命
无限读寿命数据保存
在25度下可以存放10年数据保存工作温度
0～70C 工作温度存放温度-40～85℃存放温度
冲击
2,000G(@0.3ms half sine wave)冲击振动
20G(40-2000HZ)振动环境湿度5-95%环境湿度保修时间
保修时间尺寸尺寸可靠性与稳定性环境
3years JHKJMSXXX
概述性能功耗可靠性与稳定性环境3years
JHKJMSXXX 概述性能
功耗
型号型号
2.5英寸
英寸 2.5英寸SATA 接口SATA 32GB
容量64GB 120MB/S | 150MB/S
连续读120MB/S | 150MB/S 25MB/S | 80MB/S
连续写25MB/S | 80MB/S 3200
4KB 连续每秒读次数3200320
4KB 连续每秒写次数320MLC-NAND Flash
存储介质NAND 闪存MLC-NAND Flash 存储介质3.3V±5%
输入电压 3.3V±5%0.6W MAX
空闲0.6W MAX 1W MAX 工作1W MAX
每天写100GB 资料可以用8年写寿命每天写100GB 资料可以用8
年
无限读寿命无限
在25度下可以存放10年数据保存在25度下可以存放10年
0～70C 工作温度0～70C
-40～85℃存放温度-40～85℃
2,000G(@0.3ms half sine wave)冲击2,000G(@0.3ms half sine
wave)
20G(40-2000HZ)振动20G(40-2000HZ)
5-95%环境湿度5-95%保修时间保修时间
尺寸尺寸JHKJMSXXX 概述性能功耗可靠性与稳定性环境3years
概述性能功耗可靠性与稳定性环境
英寸 2.5
英寸
接口SATA 容量
128GB 连续读
120MB/S | 150MB/S 连续写
25MB/S | 80MB/S 4KB 连续每秒读次
数
32004KB 连续每秒写次
数
320NAND 闪存
MLC-NAND Flash 输入电压
3.3V±5%空闲
0.6W MAX 工作1W MAX
写寿命每天写100GB 资料可以用8年
读寿命无限
数据保存在25度下可以存放10年工作温度0～70C
存放温度-40～85℃
冲击2,000G(@0.3ms half sine wave)
振动20G(40-2000HZ)
环境湿度
5-95%JHKJMSXXX
3years。