电路板术语总整理

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pcb常用的专业术语

pcb常用的专业术语PCB常用的专业术语PCB，即印刷电路板，是电子产品中不可或缺的一部分。

在PCB制造过程中，有许多专业术语需要了解。

本文将从材料、工艺、设计等方面介绍PCB常用的专业术语。

一、材料1.基板（Substrate）基板是指印刷电路板上的主体部分，通常由玻璃纤维和树脂复合材料构成。

基板的质量直接影响着整个PCB的性能。

2.铜箔（Copper Foil）铜箔是印刷电路板上最重要的导电层材料，其厚度通常为18um至105um之间。

铜箔的质量和厚度对于PCB的导电性能和可靠性有着重要影响。

3.覆铜板（Copper Clad Board）覆铜板是指在基板表面涂覆一层铜箔而成，通常有单面、双面和多层三种形式。

不同类型的覆铜板适用于不同种类的电路设计需求。

4.阻焊（Solder Mask）阻焊是一种涂在印刷电路板上以保护未焊接区域免受污染和短路的材料。

阻焊通常为绿色、红色或蓝色，具有良好的耐高温性和化学稳定性。

5.沉金（ENIG）沉金是一种表面处理技术，可以在印刷电路板上形成一层金属保护层，提高PCB的可靠性和耐腐蚀性。

沉金通常用于高端PCB产品中。

二、工艺1.蚀刻（Etching）蚀刻是印刷电路板制造中最重要的工艺之一，其目的是去除不需要的铜箔以形成电路图案。

蚀刻过程需要使用化学溶液和光敏树脂等材料。

2.钻孔（Drilling）钻孔是指在印刷电路板上钻洞以安装元器件或连接不同层之间的导线。

钻孔需要使用高速钻头和自动化设备完成。

3.压合（Lamination）压合是指将多个覆铜板通过热压技术粘合在一起形成多层PCB结构。

压合过程需要控制温度、压力和时间等参数，确保PCB质量符合要求。

4.喷锡（Soldering）喷锡是一种表面处理技术，可以在印刷电路板上形成一层锡保护层，提高PCB的可靠性和耐腐蚀性。

喷锡通常用于中端PCB产品中。

5.贴片（SMT）贴片是指将元器件直接安装在印刷电路板上的一种技术。

PCB术语[精华]

PCB术语PCB线路设计及制前作业术语1、Annular Ring 孔环指绕接通孔壁外平贴在板面上的铜环而言。

在内层板上此孔环常以十字桥与外面大地相连，且更常当成线路的端点或过站。

在外层板上除了当成线路的过站之外，也可当成零件脚插焊用的焊垫。

与此字同义的尚有 Pad(配圈)、 Land (独立点)等。

2、Artwork 底片在电路板工业中，此字常指的是黑白底片而言。

至于棕色的“偶氮片”(Diazo Film)则另用 Phototool 以名之。

PCB 所用的底片可分为“原始底片”Master Artwork 以及翻照后的“工作底片”Working Artwork 等。

3、Basic Grid 基本方格指电路板在设计时，其导体布局定位所着落的纵横格子。

早期的格距为 100 mil，目前由于细线密线的盛行，基本格距已再缩小到 50 mil。

4、Blind Via Hole 盲导孔指复杂的多层板中，部份导通孔因只需某几层之互连，故刻意不完全钻透，若其中有一孔口是连接在外层板的孔环上，这种如杯状死胡同的特殊孔，称之为“盲孔”(Blind Hole)。

5、Block Diagram 电路系统块图将组装板及所需的各种零组件，在设计图上以正方或长方形的空框加以框出，且用各种电性符号，对其各框的关系逐一联络，使组成有系统的架构图。

6、Bomb Sight 弹标原指轰炸机投弹的瞄准幕。

PCB 在底片制作时，为对准起见也在各角落设置这种上下两层对准用的靶标，其更精确之正式名称应叫做Photographers' Target。

7、Break-away panel 可断开板指许多面积较小的电路板，为了在下游装配线上的插件、放件、焊接等作业的方便起见，在 PCB 制程中，特将之并合在一个大板上，以进行各种加工。

完工时再以跳刀方式，在各独立小板之间进行局部切外形(Routing)断开，但却保留足够强度的数枚“连片”(Tie Bar 或Break-away Tab)，且在连片与板边间再连钻几个小孔；或上下各切 V 形槽口，以利组装制程完毕后，还能将各板折断分开。

电路板术语总整理。

電路板術語總整理----A----A-Stage A 階段Abietic Acid 松脂酸Abrasion Resistance 耐磨性ABS 樹脂Absorption 吸收，吸入Accelerated Test (Aging) 加速老化Acceleration 速化反應Accelerator 加速劑，速化劑Acceptability，Acceptance 允收性，允收Access Hole 露出孔(穿露孔, 露底孔) Accuracy 準確度Acid Number(Acid Value) 酸值Acrylic 壓克力Actinic Light(or Intensity, or Radiation) 有效光Activation 活化Activator 活化劑Active parts(Devices) 主動零件Acutance 解像稅利度Addition Agent 添加劑Additive Process 加成法Adhesion 附著力Adhesion Promotor 附著力促進劑Adhesive 膠類或接著劑Admittavce 導納Aging 老化Air Inclusion 氣泡夾雜Air Knife 風刀Algorithm 演算法Aliphatic Solvevt 脂肪族溶劑Ambient Tamp. 環境溫度Amp-Hour 安培小時Amchoring Spurs 著力爪Ａngle of Attack 攻角Angle of Contact 接觸角Anion 陽向游子（陰離子）Anneal 韌化Annular Ring 孔環Anode 陽极Anode Sludge 陽极泥Anodizing 陽极化ANSI美國標準協會Anti-Pit Agent 抗凹劑AOI 自動光學檢驗AQL品質允收水準Arc Resistance 耐電弧性Array 排列，陣列Artwork底片ASIC 特定用途的積體電路器Aspect Ratio 縱橫比Assembly裝配、組裝、構裝A TE自動電測設備Autoclave 壓力鍋Axial-lead軸心引腳Azetrope 共沸混合液BB-Stage B階段Back Light(Back Lighting ) 背光法Back Taper 反錐斜角Back-up 墊板Backpanels, Backplanes支持板Bandability彎曲性，彎曲能力Banking Agent護岸劑Bare Chip Assembly 裸體晶片組裝Barrel 孔壁，滾鍍Base Material 基材Basic Grid基本方格Batch 批Baume波美度Beam Lead 光芒式的平行密集引腳Bed-of-Nail Testing 針訂測試Bellows Contact彈片式接觸Beta Ray Backscatter 貝他射線反彈散射Bevelling 切斜邊Bias斜張綱布,斜織法Binder 粘結劑Bits頭Black Oxide 黑氧化層Blanking 衝空斷開Bleach漂洗Bleeding溢流Blind Via Hole盲導孔Blister局部性分層或起泡Block Diagram電路系統塊圖Blockout封網Blotting 乾印Blotting Paper 吸水紙Blue Plaque 藍紋Blow Hole吹孔Bomb Sight彈標Bond Strength結合強度Bondability結合性Bonding Layer 結合層, 接著層Bonding Sheet(layer)結合線Bonding Wire結合線Bow, Bowing板彎Braid 編線Brazing硬焊Break-away panel可斷開板Break Point出像點,顯像點Breakdown V oltage崩潰電壓Break-Out破出Bridging搭橋、橋接Bright-Dip光澤浸漬處理Brightener光澤劑Brush Plating刷鍍Build-up 增厚,堆積Bulge 鼓起, 凸出Bump 突塊Buoyancy浮力Buried Via Hole埋導孔Burn-in 高溫加速老化試驗Burning 燒焦Burr毛頭Bus Bar匯電桿Butter Coat 外表樹脂層CCable 電纜CAD 電腦輔助設計Calendered Fabric軋平式網布Cap Lamination 帽式壓合法Capacitance 電容Capacitive Coupling電容耦合Capillary Action毛細作用Carbide 碳化物Carbon Arc Lamp 碳弧燈Carbon Treatment, Active 活性碳處理Card卡板Card Cages/Card Racks電路板構裝箱Carlson Pin卡氏定位梢Carrier 載體Cartridge濾芯Castallation堡型積體電路器Catalyzed Board, Catalyzed Substrate(or Material) 催化板材Catalyzing 催化Cathode 陰极Caul Plate 隔板Cavitation空泡化, 半真空Center-to-Center Spacing 中心間距Ceramics 陶瓷Cermet 陶金粉Certificate證明書CFC 氟氯碳化物Chamfer 倒角Characteristic Impedance特性阻抗Chase綱框Check List檢查清單Chelate螯合Chemical Milling化學研磨Chemical Resistance 抗化性Chemisorption化學吸附Chip晶粒、晶片、片狀Chip on Board 晶片粘著板Circumferential Separation環狀斷孔Clad/Cladding披覆Clean Room 無塵室、潔凈室Clinched Lead Terminal緊箱式引腳Clinched-wire Through Connection 通孔彎線連接法Clip Terminal繞線端接Co-Firing共燒Coat, Coating皮膜,表層Coaxial Cable同軸纜線Coefficient of Thermal Expansion 熱膨脹係數Cold Flow冷流Cold Solder Joint冷焊點Collimated Light平行光Colloid膠體Columnar Structure 柱狀組織Comb Pattern梳型電路Complex ion 錯離子Component Hole零件孔Component Orientation 零件方向Component Side組件面Composite, (CEM-1, CEM-3)復合板材Conditioning整孔Conductance 導電Conductive Salt導電鹽Conductivity導電度Conductor Spacing 導體間距Conformal Coating貼護層、護形Conformity吻合性，服貼性Connector 連接器Contact Angle接觸角Contact Area接觸區Contact Resistance 接觸電阻Continuity連通性Contract Service協力廠，分包商Conversion Coating轉化皮膜Coplanarity共面性Copolymer共聚物Copper Foil銅箔、銅皮Copper Mirror Test 銅鏡試驗Copper Paste 銅膏Corner Crack通孔斷角Corner Mark板角標記Counterboring 方型擴孔,埋頭孔Countersinking 錐型擴孔,喇叭孔Coupling Agent偶合劑Coupon, Test Coupon板邊試樣Coverlay / Covercoat表護層、保護層Crack 裂痕Crazing白斑Crease皺褶Creep潛變Crossection Area截面積Crosshatching十字交叉區Crosslinking ,Crosslinkage交聯，架橋Crosstalk雜訊、熟化Cure硬化、熱化Current Density電流密度Curtain Coating濂塗法Current-Carrying Capability載流能力DD-glass D玻璃Datum Reference基準參考Daughter Board子板Deburring去毛頭Declination Angle斜射角Definition邊緣逼真度Degradation劣化Degrasing 脫脂Deionized Water去離子水Delamination分層Dendritic Growth枝狀生長Denier丹尼爾Densitomer透光度計Dent凹陷Deposition皮膜處理Desiccator 乾燥器Desmearing除膠渣Desoldering解焊Developer顯像液，顯像機Developing顯像Deviation偏差Device電子元件Device縮錫Diazo Film偶氮棕片Dichromate重鉻酸鹽Dicyandiamide(Dicy)雙氰胺Die沖模,鑄模Die Bonding晶粒接著Die Stamping 沖壓Dielectric介質Dielectric Breakdown V oltage介質崩潰電壓Dielectric Constant,ε介質常數Dielectric Strength 介質強度Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法Diffusion Layer擴散層Digitizing數位化Dihedral Angle變反斜角Dimensional Stability呎度安定性Diode二极體DIP(Dual Inline Package)雙排腳封裝體Dip Coating 浸塗法Dip Soldering浸焊法Dipole偶极，雙极Direct Emulsion直接乳膠Direct/Indirect Stencil直間版膜Direct Plating直接電鍍，直接鍍板Discrete Compenent散裝零件Dish Down碟型下陷Dispersant分散劑Disspation Factor散逸因子Dog Ear狗耳Doping摻雜Double Layer電變層Double Treated Foil雙面處理銅箔Drag in /Drag out帶進／帶出Drag Soldering拖焊Drawbridging吊橋效應Drilled Blank已鑽孔的裸板Drill Facet鑽尖切削面Drill Pointer鑽針重磨機Dross 浮渣Drum Side銅箔光面Dry Film乾膜Dual Wave Soldering雙波焊接Ductillty展性Dummy ,Dummying假鍍片，假鍍Dummy Land假焊墊Durometer 橡膠硬度計EE-glass 電子級玻璃Eddy Current過電流Edge-Board Connector板邊（金手指）承接器Edge-Board Contact板邊金手指Edge-Dip Solderability Test板邊焊錫性測試Edge Spacing 板邊空地EDTA乙二胺四乙酸Effluent排放物Elastomer彈性體Electric Strength (耐)電性強度Electro-deposition電鍍Electro-Deposited Photo-resist電著光阻,電泳光阻Electro-migration電遷移Electro-phoresis電泳動，電滲Electro-tinning鍍錫Electro-winning電解冶煉Electroless-deposition無電鍍Electrolytic Cleaning電解清洗Electrolytic Tough Pitch電解銅Elongation延伸性，延伸率Embossing凸出性壓花EMF電動勢EMI電磁幹擾Emulsion乳化Encapsulating囊封、膠囊End Cap封頭Entrapment夾雜物Entry Material蓋板Epoxy Resin環氧樹脂Etchant蝕刻劑，蝕刻液Etchback回蝕Etch Factor蝕刻因子、蝕刻函數Etching Indicator蝕刻指標Etching Resist抗蝕阻劑Eutetic Composition共融組成Exposure曝光Eyelet鉚眼FFabric網布Face Bonding 反面朝下之結合Failure故障，損壞Farad法拉Farady 法拉第Fatigue Strength抗疲勞強度Fault缺陷，瑕疵Fault Plane斷層面Feed Through Hole導通孔Feeder進料器、送料器Fiber Exposure玻纖顯露Fiducial Mark基準記號Filament纖絲Filament緯向Filler填充料Fillet內圓填角Film底片Filter過濾器Fine Line細線Fineness純度、成色、粒度Finger 手指(板邊連續排列接點) Finishing終飾、終修First Article首產品First Pass-Yield初檢良品率Fixture夾具Flair第一面外緣變形，刃角變形Flame Resistant耐燃性Flammability Rate燃性等級Flare扇形崩口Flash Plating閃鍍Flashover閃絡Flat Cable扁平排線Flat Pack扁平封裝（之零件）Flexible Printed Circuit, FPC軟板Flexural Failure撓曲損壞Flexural Strength抗撓強度Flocculation絮凝，凝聚Flood Stroke Print覆墨衝程印刷Flow Soldering流焊Fluorescence螢光Flurocarbon Resin 碳氟樹脂Flush Conductor嵌入式線路，貼平式導體Flute退屑槽Flux助焊劑Foil Burr銅箔毛邊Foil Lamination銅箔壓板法Foot殘足Foot Print(Land Pattern)腳墊Foreign Material外來物，異物Form-to-List布線說明清單Free Radical自由基Frequency頻率Fully-Additive Process全加成法Fungus Resistance抗霉性Fused Coating熔錫層Fusing熔合GG-10Gage, Gauge量規Galvanic Series賈凡尼次序Galvanizing鍍鋅GAP第一面分離，是刃斷開Gel Time膠化時間Gelation Particle（膠凝點）Gerber Date，Gerber File格博檔案Ghost Image陰影Gilding鍍金Glass Fiber玻纖Glass Fiber Protrusion/Gouging ,Groove玻纖突出／挖破Glass Transition Temperature, Tg玻璃態轉化溫度Glouble Test球狀測試法Golden Board測試用標準板Grain Size結晶粒度Grid標準格Ground Plane(or Earth Plane)接地層Ground Plane Clearance接地空環Gull Wing Lead鷗翼引腳Grass Leak大漏Guide Pin導針HHalf Angle半角Halide鹵化物Haloing白圈、白邊Halon海龍Hard Anodizing硬陽极化Hard Chrome Plating鍍硬鉻Hard Soldering硬焊Hardener硬化劑（或Curing Agent）Hardness硬度Haring-Blum Cell海因槽Harness電纜組合Hay Wire跳線Heat Cleaning燒潔Heat Sink Plane散熱層Heatsink Tool散熱工具Hertz(HZ)赫Hi-Rel高可靠度Hipot Test高壓電測Holding Time停置時間Hole breakout孔位破出Hole Couter數孔機Hole Density孔數密度Hole Location孔位Hole Preparation通孔準備Hole V oid破洞Hook切削刃緣外凸Hot Air Levelling噴錫Hot Bar(Reflow)Soldering熱把焊接Hot gas Soldering熱風手焊HTE(High Temperature Elongation)高溫延伸必性Hull Cell哈氏槽Hybrid Integrated Circuit混成電路Hydraulic Bulge Test 液壓鼓起試驗Hydrogen Embrittlement氫脆Hydrogen Overvoltage氫超電壓，氫過電壓Hydrolysis水解Hydrophilic親水性Hygroscopic吸濕性Hypersorption超吸性－L－I．C．Socket積體電路器插座Icicle錫尖Illuminance照度Image Transfer影像轉移，圖像轉移Immersion Plating浸鍍Impedance阻抗，特性阻抗Impedance Match阻抗匹配In-Circuit Testing組裝板電測Inclusion異物、夾雜物Indexing Hole基準孔、參考Inductance(L)電感Infrared (IR)紅外線Input/Output輸入／輸出Insert 、Insertion插接、插裝Inspection Overlay套檢底片Insulation Resistance絕緣電阻Integrated Circuit(IC)積體電路器Interconnection互連Interface介面Intermatallic Compound(IMC)介面合金共化物Internal Stress 內應力Interstitial Via-Hole(IVH)局部層間導通孔Invar殷鋼Ion Exchange Resins 離子交換樹脂Ion Cleanliness離子清潔度Ionizable(Ionic) Contaimination離子性污染Ionization游離，電離Ionization Voltage(Corona Level)電離化電壓(電暈水準) IPC美國印刷電路板協會－J－J-LeadJ型接腳JEDEC聯合電子元件工程委員會Job Shop專業工廠，職業工廠Joule焦耳Jumper Wire跳線Just-In-Time(JIT)適時供應，及時出現－K－Kapton聚亞醯胺軟材Karat克拉，開Kerf切形，裁截Kevlar聚醯胺纖維Key鑰槽，電鍵Key Board鍵盤Kiss Pressure吻壓、低壓Knoop Hardness努普硬度Kovar科伐合金Kraft Paper牛皮紙－L－Laminar Flow 平流Laminar Structure片狀結構Laminate V oid 板材空洞Lamination V oid壓合空洞Laminate(s)基板、積層板Laminator壓膜機Land 孔環焊墊、表面(方型)焊墊Landless Hole無環通孔Laser Direct Imaging ,LDI雷射直接成像Laser Maching雷射加工法Laser Photogenerator(LPG)，Laser Photoplotter雷射曝光機Lay Back刃角磨損Lay Out佈線、佈局Lay Up疊合Layer to Layer Spacing層間距離Leaching焊散、漂出、溶出Lead Frame腳架Lead引腳，接腳Legend 文字標記、符號Leveling整平Lifted Land孔環(焊墊)浮起Ligand 錯離子附屬體Light Integrator光能累積器、光能積分器Light Emitting Diodes ,LED 發光二極體Light Intensity 光強度Limiting Current Density極限電流密度Liquid Crystal Display ,LCD 液晶顯示器Liquid Dielectrics液態介質Liquid Photoimagible Solder Mask,LPSM液態感光防焊綠漆Logic Circuit 邏輯電路Lot Size批量Luminance發光強度，耀度Lyophilic親水性膠體─M─Macro-Throwing Power巨觀分佈力Major Defect 嚴重缺點，主要缺點Margin刃帶、脈筋Marking標記Mask阻劑Mass Finishing大量整面、大量拋光Mass Lamination大型壓板(層板)Mass Transport質量輸送Master Drawing主圖Mat蓆Matte Side毛面Measling泡點Mechanical Stretcher機械式張網機Mechamical Warp機械性纏繞Mechanism機理Membrane Switch薄膜開關Meniscograph Test弧面狀沾錫試驗Meniscus彎月面，上凹面Mercury Vaper Lamp汞氯燈Mesh Count網目數Metal Halide Lamp金屬鹵素燈Metallized Fabric金屬化綱布Metallization金屬化Micro-electronics微電子Micro-etching 微蝕Microsectioning微切片法Microstrip微條Microthrowing Power 微分佈力Migration遷移Migration Rate遷移率Mil英絲Minimum Annular Ring孔環下限Minimum Electrical Spacing電性間距下限，最窄電性間距Misregistration對不準，對不準度Mixed Componmt Mounting Technology混合零件之組裝技術Mldem 調變及解調器，數據機Modification修改、改質Module模組Modulus of Elasticity 彈性係數Moisture and Insulation Resistance Test濕氣與絕緣電阻試驗Monofilament 單絲Mother Board 主機板、母板、主構板Mounting Hole安裝孔Mouse Bite鼠齧Multi-Chip-Module(MCM)多晶片(蕊片)模組Multi-wiring Board(or Discrete Wiring Board)復線板－N－Nail Head釘頭N.C.數值控制Near IR近紅外線Negative負片，鑽尖第一面外緣變窄Negative-Acting Resist負性作用之阻劑，負型阻劑Negative etch-back反回蝕Negative Stencil負性感光膜Network網狀元件Newton(N)牛頓Newton Ring牛頓環Newtonian Liquid牛頓流體Nick缺口Noble Metal Paste貴金屬印膏Node節點Nodule瘤Nomencleature 標示文字符號Nominal Cured Thickness標示厚度Non-circular Land非圓形孔環焊墊Non-flammable非燃性Non-wetting不沾錫Normal Distribution常態分配，常態分布Novolac 酯醛樹脂Nucleation，Nucleating核化Numerical Control數值控制，數控Nylon耐龍－O－O cclusion 吸藏Off-Contact架空Offset 第一面大小不均OFHC無氧高導電銅Ohm 歐姆OLB(Outer Lead Bond)外引腳結合Oligomer 寡聚物Omega Meter 離子污染檢測儀Omega Wave 振盪波Opaquer不透明劑，遮光劑Open Circuits 斷線Optical Comparater光學對比器(光學放大器) Optical Density光密度Optical Inspection光學檢驗Optical Instrument光學儀器Osmosis滲透Outgassing出氣，吹氣Outgrowth懸出，橫出，側出Output產生，輸出Overflow溢流Overhang總浮空Overlap鑽尖點分離Overlapotantial (Overvoltage)過電位，過電壓Oxidation氧化Oxygen Inhibitor氧氣抑制現象Ozone Depletion臭氣層耗損Packaging對裝，構裝Pad焊墊，圓墊Pad Master圓墊底片Palladium鈀Panel 製程板Panel plating全板鍍銅Panel Process全板電鍍法Paper Phenolic紙質酚醛樹脂（板材）Parting Agent 脫膜劑Passivation鈍化，鈍化處理Passive Device (component) 被動元素（零件）Paste膏，糊Pattern板面圖形Pattern Plating線路電鍍Pattern Process線路電鍍法Peak voltage 峰值電壓ｐeel Strength抗撕強度Periodic Reverse(PR)Current周期性反電流Peripheral過邊附屬設備Permeability透氣性，導磁率Permittivity誘電率，透電率Phenolic酚醛樹脂Photofugitive感光褪色Photographic Film感光成像之底片Photoinitiator 感光啟劑Photomask光罩Photoplotter，Plotter光學繪圖Photoresist光阻Photoresist Chemical Machinning(Milling)光阻式化學歷（銑刻）加工Phototool底片pick and place拾取與放置Piezoelectric 壓電性Pin Grid Array(PGA) 矩陣式針腳封裝Pinhole針孔Pin接腳，插梢，插針Pink Ring粉紅圈Plain Weave平織Plasma電將Plasticizers可塑劑．增塑劑Plated Through Hole ,PTH鍍通孔Platen 熱盤Plating 鍍Plotting標繪Plug插腳，塞柱Play層，股Pneumatic Stretcher氣動拉伸器Point Angle鑽尖角Point Source Light點狀光源Point鑽尖Poise泊Polar Solvent 极性溶劑Polarity電极性Polarization分极，极化Polarizing slot 偏槽Polyester Films聚酯類薄片Polyimide(PI) 聚亞醯胺Porosity Test疏孔度試驗Positive Acting Resist正性光阻劑Post Cure後續硬化，後烤Pot Life適用期，鍋中壽命Potting鑄封，模封Power Supply電源供應器Pre-tinning預先沾錫Preform預製品Preheat預熱Prepreg膠片，樹脂Press Plate鋼板Press-Fit Contact擠入式接觸Primary Image線路成像Probe探針Process Camera製程用照像機Profile輪廓、部面圖、升溫曲線圖稜線Propagation傳播Puddle Effect水坑效應Pull Away拉離Pulse Plating脈衝電鍍法Pumice powder浮石粉Punch衝切Purge ,Purging凈洗Purple Plague紫疫Post Separation後期分離．事後分離－Q －Quad Flat Pack(QFP) 方扁形封裝體Qualification Agency 資格認證機構Qualification Inspection資格檢驗Qualified Products list 合格產品嘗（供應者）名單Qualitative Analysis 定性分析Quality Conformance Test Circuitry(coupon) 品質符合之試驗線路（樣板）Quantitative Analysis 定量分析Quench 淬火，驟冷Quick Disconnect 快速接頭Quick 緯紗繞軸－R－Rack 掛架Radial lead 放射狀引腳Radiometer 輻射計，光度計Rake Angle 摳角，耙角Rated Temperature ,V oltage額定溫度，額定電壓Reactance 電抗Real Estate 底材面，基板面Reclaiming 再生，再製Reel to Reel 捲輪(盤)式操作Reference Dimension 參考呎度，參考尺寸Reference Edge 參考邊緣Reflow Soldering 重熔焊接，熔焊Refraction 折射Refractive Index 折射率Register Mark 對準用標記Registration 對準度Reinforcement 補強物Relaxation 剔退，拒收Relaxation 鬆馳，緩和Relay 繼電器Release Agent Release Sheets 脫模劑，離型膜Reliability 可靠度，信賴度Relief Angle 浮角Repair 修理Resin Content 膠含量，樹脂含量Resin Flow 膠流量，樹脂流量Resin Recession 樹脂下陷Resin Rich Area 樹脂豐富區，多膠區Resin Smear 膠糊渣，膠渣Resin Starved Area 樹脂缺乏區，缺膠區Resist 阻劑，阻膜Resistivity 電阻系數，電阻率Resistor電阻器，電阻Resistor Drift 電阻漂移Resolution 解像,解像度,解析度Resolving Power 解析力,解像力(分辯力)Reverse Current Cleaning 反電流(電解)精洗Reverse Etchback 反回蝕Reverse Image 負片影像(阻劑) Reversion 反轉、還原Revision 修正版,改訂版Rework(ing) 重工,再加工Rhology 流變學,流變性質Ribbon Cable 圓線纜帶Rigid-Flex Printed Board 硬軟合板Rinsing 水洗,沖洗Ripple 紋波Roadmap 線路與零件之佈局圖Robber 輔助陰极Roller Coating 輥輪塗佈Roller Cutter 輥切機(業界俗稱鋸板機) Roller Tinning 輥錫法,滾錫法Rosin 鬆香Rotary Dip Test 擺動沾錫試驗Routing 切外型Runout 偏轉,累積距差Rupture 迸裂Sacrificial Protection 犧牲性保護層Salt Spray 監霧試驗Sand Blast 噴砂Saponification 皂化作用Satin Finish緞面處理Scaled Flow Test比例流量試驗Schemetic Diagram電路概略圖Scratch 刮痕Screen Printing網版印刷Screenability 網印能力Scrubber磨刷機、磨刷器Scum透明殘膜Sealing封孔Secondary Side第二面Seeding下种Selective Plating選擇性電鍍Self-Extinguishing 自熄性Selvage布邊Semi-Additive Process半加成制程Semi-Conductor半導體Sensitizing敏化Separable Component Part可分離式零件Sequestering Lamination 接續性壓合法Sequestering Agent螯合劑Shadowing陰影，回蝕死角Shank鑽針柄部Shear Strength抗剪（力）強度Shelf Life 儲齡Shield 遮蔽，屏遮Shore Hardness蕭氏硬度Short短路Shoulder Angle肩斜角Shunt分路Side Wall側壁Siemens電阻值Sigma(Standard Deviation) 標準差Signal訊號Silane矽烷Silicon矽Silicone 矽酮Silk Screen 綱版，絲綱印刷Single-In-line Package(SIP) 單邊插腳封裝體Sizing 上膠，上Skin Effect 集膚效應Skip Printing ,Skip Plating 漏印，漏鍍Slashing 漿經Sleeve Jint 套接Sliver 邊絲,邊條Slot Slotting 槽口,開槽Sludge 沉澱物,淤泥Slump 塌散Slurry 稠漿,懸浮狀漿Small Hole 小孔Smear 膠糊渣,膠渣Snap-off 彈回高度Socket 插座Soler 銲錫Solderability 焊錫性,可焊性Solder Ball銲錫球，錫球Solder Bridging錫橋Solder Bump銲錫凸塊Solder Connection 焊接Solder Cost銲錫著層Solder Dam錫堤Solder Fillet填錫Solder Levelling噴錫、熱風整平Solder Mask(S/M)綠漆，防焊膜Solder Paste錫膏Solder Plug錫塞，錫柱Solder Preforms預銲料Solder Projection銲錫突點Solder Sag銲錫垂流物Solder Side 焊錫面Solder Spatter 濺錫Solder Spread Test 散錫試驗Solder Webbing錫網Solder Wicking銲錫之燈芯效應，滲錫Soldering軟焊，焊接Solder Fluid, Soldering Oil 助焊液，護焊油Solid Content 固體含量，固形份，固形物Solidus Line固相線Spacing間距Span 跨距Spark Over閃絡Specification (Spec.) 規範、規格Specimen樣品，試樣Spectrophotometry分光光度計檢測法Spindle 鑽軸，主軸Splay 斜鑽孔Spray Coating濆著涂裝，噴射涂裝Spur底片圖形邊緣突出Sputtering濺射Squeege刮刀Stalagometer滴管式表面張力計Stand-Off Terminals直立型端子Starvation缺膠Static Eliminator靜電消除器Steel Rule Die（鋼）刀模Stencil版膜Step and Repeat逐次重覆曝光Step Plating 梯階式鍍層Step Tablet 階段式(光密度)曝光表Stiffener 補強條，補強板Stop off 阻劑，防鍍膜Strain 變形，應變Strand 絞Stray Current 迷走電流，散雜電流Stress Corrosion 應力腐蝕Stress Relief 消除應力Strike 預鍍；打底Stringing 拖尾；牽絲Stripline 條線Stripper 剝除液，剝除器Substractive Process 減成法Substrate 底材Supported Hole （金屬）支助通孔Surface Energy 表面能Surface Insulation Resistance(SIR) 表面絕緣電阻Surface Mounting Technology 表面粘裝技術Surface Tension 表面張力Surface-Mount Device 表面粘裝零件Surfactant 表面潤濕劑Surge 突流；突壓Swaged Lead 壓扁式引腳Swelling Agents；Sweller 膨鬆劑Swimming 線路滑離Synthetic Resin 合成樹脂TTab接點；金手指Taber Abraser泰伯磨試器Tape Automatic Bonding(TAB) 捲帶自動結合Tape Test 撕膠帶試驗Tape Up Master 原始手貼片Tape Components 捲帶式連載零件Taper Pin Gauge 錐狀孔規Tarnish 污化Teflon 鐵氟龍Telegraphing 浮印，隱印Temperature Profile 溫度曲線Template 模板Tensile Strength 抗拉強度Tensiomenter 張力計Tenting 蓋孔法Terminal 端子Terminal Clearance 端子空環，端子讓環Tetrafunctional Resin 四功能樹脂Thermal Coefficient of Expansion(TCE) 熱膨脹系數Thermal Conductivity 導熱率Thermal Cycling 熱循環，熱震盪Thermal Mismstch 感熱失諧Thermal Relief 散熱式鏤空Thermal Zone 感熱區Thermocompression Bonding 熱壓結合Thermocouple熱電偶Thermode 發熱體Thermoplastic 熱塑性Thermosetting 熱固性Thermosonic Bonding 熱超音波結合Thermo-Via 導熱孔Thick Film Circuit 厚膜電路Thief 輔助陰极，藕流陰极Thin Copper Foil 薄銅箔Thin Core 薄基板Thin Film Technology 薄膜技術Thinner 調薄劑Thixotropy 抗垂流性，搖變性，搖溶性，靜凝性Three-Layer Carrier三層式載體Threshold Limit Value(TLV) 極限值Through Hole Mounting 通孔插裝Through Put 物流量，物料通過量Throwing Power 分布力Tie Bar 分流條Tin Drift 錫量飄失Tin Immersion 浸鍍錫Tin Pest 錫疫Tin Whishers 錫鬚Tinning 熱沾銲錫Tolerance 公差Tombstoning 墓碑效應Tooling Feature 工具標的物Torsion Strength 抗扭強度Touch Up 觸修、簡修Trace 線路、導線Traceability 追溯性，可溯性Transducer轉能器Transfer Bump 移用式突塊，轉移式突塊Transfer Laminatied Circuit 轉壓式線路Transfer Soldering 移焊法Transistor電晶體Transmission Line傳輸線Transmittance透光率Treament ,Treating 含浸處理Treeing 枝狀鍍物，鍍鬚Trim Line 裁切線Trimming 修整、修邊True Position真位Tungsten鎢Tungsten Carbide 碳化鎢Turnkey System包辦式系統Turret Solder Terminal塔立式焊接端子Twill Weave斜織法，菱織法Twist 板翹、板扭Two Layer Carrier 兩層式載體UUL Symbol “保險業試驗所”標誌Ultimate Tensile Strength(UTS) 極限抗拉強度Ultra High Freqrency(UHF) 特高頻率Ultra Violet Curing(UV Curing)紫外線硬化Ultrasonic Bonding超音波結合Ultrasonic Cleaning超音波清洗Undercut, Undercutting側蝕Underplate底鍍層Universal Tester 泛用型電測機Unsupported Hole 非鍍通孔Urea 尿素Urethane 胺基甲酸乙脂V-Cut V 型切槽Vacuum Evaporation(or Deposition) 真空蒸法Vacuum Lamination 真空壓合Van Der Waals Force 凡得瓦力Vapor Blasting 蒸氣噴砂Vapor Degreasing 蒸氣除油法Vapor Phase Soldering 氣相焊接Varnish 清潔、凡力水Very Large-Scale Integration (VLSI) 极大積體電路器Via Hole 導通孔Vickers Hardness 維氏硬度Viscosity 粘度,粘度Vision Systems視覺系統Visual Examination(Inspection) 目視檢查V oid 破洞，空洞V olatile Content 揮發份含量V oltage 電壓V oltage Breakdown （崩）潰電壓V oltage Drop 電壓降落V oltage Efficiency電壓效率V oltage Plane 電壓層V oltage plane clearance 電壓層的空環V olume resistivity 體積電阻率V olumetric Analysis 容量分析法Vulcanization 硫化，交聯－W－Wafer 晶圓Waive 不檢驗Warp ；Warpage 板彎Warp Size 漿經處理Washer 墊圈Waste Treatment 廢棄處理Water Absorption 吸水性Water Break 水膜破散．水破Water mark 水印Watt 瓦特Watts Bath瓦玆鍍鎳液Wave Guide導波管Wave Soldering 波焊Waviness 波紋，波度Wear Resistance耐磨度，耐磨性Weatherability耐候性Weave Exposure 織紋顯露；Weave Texture織紋隱見Web 蹼部Weft Yarn緯紗Welding熔接Wet Blasting 濕噴砂Wet Lamination濕壓膜法Wet Process濕式制程Wetting Agent潤濕劑Wetting Balance沾錫天平Wetting 沾濕，沾錫Whirl Brush旋渦式磨刷法Whirl Coating 旋渦涂布法Whisker 晶鬚White residue 白色殘渣White Spot 白點Wicking 燈芯效應Window 操作範圍, 傳動齒孔Wire Bonding 打線結合Wire Gauge 線規Wire Lead 金屬線腳Wire warp 繞線互連Wiring pattern 佈線圖形Working master 工作母片Working time(life) 堪用時間Workmanship 工藝水準.製作水準Woven Cable 扁平編線Wrought Foil 鍛碾金屬箔－X－X -axis X軸X-Ray Fluorescence X 射線瑩光, X 瑩光X-Ray X光－Y-Y-axis Y軸Yarn紗．線Yield 良品率,良率,產率－Z－Z-Axis Z軸Zig-zag In-line Package(zip) 鏈齒狀雙排腳對裝件Abrasives 磨料,刷材Acceptable Quality Level(AQL) 允收品質水準AC Impedance 交流阻抗Reactance;X l )Acoustic Microscope(AM) 感音成像顯微鏡Active Carbon活性炭Aerosol 噴霧劑，氣溶膠，氣懸體Aluminium Nitride(AIN)氮化鋁Amorpho 無定形，非晶形Analog Circuit /Analog Signal類比電路／類比訊號Anisotropic異向的，單向的Anti-Foaming Agent消泡劑Apertures開口，鋼版開口Aramid Fiber聚醯胺纖維Attenuation訊號衰減Balanced Transmission Lines 平衡式傳輸線Ball Grid Array球腳陣列（封裝）Bi-level Stencil 雙階式鋼板Blur Edge(Circle) 模糊邊模糊邊圈Brown oxide 棕氧化Build Up Process 增層法製程Bumping凸塊制程C4 Chip Joint C4晶片焊接C-Stage C階段Cation陰向游子Chip On Glass晶玻接裝(COG)(晶對對玻璃電路板的直接安裝)Chlorinated Solvent含氯溶劑,氯化溶劑Condensation Soldering凝熱焊接,液化放熱焊接Controlled Depth Drilling定深鑽孔Copper-Invar-Copper(CIC)綜合夾心板Core Material內層板材,核材CrossoveMounting Hole 組裝孔，機裝孔──是用螺絲或其他金屬扣件，將組裝板鎖牢固定在機器底座或外殼的工具孔，為直徑160mil左右的大孔．此種組裝孔早期均采兩面大型孔環與孔銅壁之PTH，后為防止孔壁在波焊中沾錫而影響螺絲穿過起見，新式設計特殊將大孔改成“非鍍通孔”（在PTH之間予以遮蓋或鍍銅之後再鑽二次孔），而於周圍環寬上另做數個小型通孔以強化孔環在板面的固著強度．由於NPTH十分麻煩，近來SMT板上也有將大孔只改回PTH者，其兩面孔環多半不相同，常將焊接面的大環取消而改成幾個獨立的小環，或改成馬蹄形不完整的大環，或擴充面積成異形大銅面，兼做為接地之用．Organic Solderability Preservatives(OSP)有機保焊劑──早期半間單面板節省滾錫之可焊處理層，改在裸銅待焊面上涂布一層油性的保護皮膜，稱為“預焊劑Preflux”，以別於下游焊接所用到的助焊劑Preflux．由於油性皮膜的粘手與妨礙電性測試，此種Preflux從未在雙面板與多面板業界使用過．Pits凹點──指在金屬表層上所呈現小面積下陷的凹點，當鍍光涌鎳制程管理不善（有機污染）時，在高電流區常出現密集的凹點，其原因是眾多氫氣聚集附著所致．一般業者常將此詞與“針孔PinHole”混為一談，事實上Pits是不見底的小孔，與見底的針孔並不相同．Pitch跨距，腳距，墊距，線距──Pitch純粹是指板面兩“單元”中心間之遠近距離，PCB業美式表達常用mil-pitch，即指兩焊墊中心線間的跨距mil而言．Pitch與Spacing不同，後者通常是指兩導體間的“隔離板面”，是面積而非長度．Pogo Pin伸縮探針──電測機以針床進行電測時（Bed of Nail Testing），其探針前段分為外套與內針兩部份．內部裝有彈簧，在設定壓力之針盤對準待測板面測點接觸時，可使上千支針尖同時保持其導通所需的彈力．此種伸縮性探針謂之Pogo Pin．此種探針又稱為Spring Probe，當QFP在256腳以上，腳跑密集到15mil時，必須采交錯式觸壓在測墊上，以避免探針本身搭靠短路十分不易．Popcorn Effect爆米花效應──原指以塑膠外體所封裝的IC，因其晶片安裝所用的銀膏會吸水，一旦未加範而逕行麉牢塑體后，在下游組裝焊接遭遇高溫時，其水分將因汽化壓力而造成封體的爆裂，同時還會發出有如爆米花般的聲響，故而得名．近來十分盛行PBGA的封裝元件，不但其中銀膠會吸水，且連載板之BT其材也會吸水，管理不良時也常出現爆米花現象．Print Through壓透，過度擠壓──多層板壓合時所采用之壓力強度(PSI)太大，使得許多樹脂被擠出板外，造成銅皮被直接壓在玻璃布上，甚至將玻璃布也壓扁變形，以致板厚不足，呎寸安定性不良，以及內層線路板被壓走樣等缺失．嚴重者線路根基常與玻纖布直接接觸，埋下“陽极性玻纖絲”漏電的隱憂(Conductive Anodic Filament；CAF)．根本解決方法是按比例流量（Scaled Flow）的原理，大面積壓合則使大的壓力強度，小板面使用小壓力強度，即以1.16PSI/in2或1.16LB/in4為基準，去計算現場操作的壓力強度(Pressure )與總壓力(Force)．Production Master生產底片──指1：1可直接用以生產電路板的原寸底片而言，至於各項諸元的呎寸與公差，則須另列於主圖上(Master Drawing亦即藍圖)．Roller Coating滾動涂布法──是一種采用滾筒，將液態涂料對水平輸送電路板的全面涂布法，此法有希望取代成本較貴的乾膜，而成為內層板直接蝕刻的而蝕光阻主流．為使雙面兩道涂布後才一次預熱固化起見，已涂之濕板只好采用V型輸送帶運送，這對大面薄板會有彎曲變形之可能．涂布用的上下滾筒(Roller，有金屬或橡皮等不同材質)可采精確“間距控制法”，或“筒面刻槽法”，以持續補充料，完成連續自動涂布作業．此法之涂料與機械目前均正在積极開發中．Scoring V型刻槽──數片小型板以藕斷絲連式薄材互接在一起，成為面積爓大的集合板，可方便下游焊接作業及提高其效率．於完成組裝後，再自原來薄材之V型刻槽界分處予以折斷分開．這種從兩面故意削薄以便於折斷之刻痕稱為Score或V-Cut．此項機械工作要恰到好處並不容易，必須保持上下刀口之適當間距與精確對準，使中心餘厚既可支持組裝作業還要方便折斷．其加工成效經常成為下游客戶挑剔之處，主要關鍵在加工機器的精密與性能．Separator Plate隔板，鋼板，鏡板──基材板或多層板進行壓合時，壓機每個開口(Opening ,Daylight)中用以分隔各板冊(Books)的硬質不銹鋼板(如410, 412等)即是．為防止沾膠起見，特將其表面處理至非常平坦光亮，故又稱為鏡板(Mirror Plate)．Silver Paste銀膏──指由重量比達70%之細小銀片與樹脂所調制的聚合物印膏，並加入少量高沸點溶劑做為調薄劑，以方便網版印刷之施工．一般板面追加的跳線(Jumper)或貫孔導通，均可采用銀膏以代替正統PTH，後者特稱為STH(Silver Through Hole)．本法有設備簡單、施工迅速、無廢水麻煩、導通品質不錯等優點，其電阻僅40mΩ/sq．一般STH成本不到PTH的三分之二，是低功率簡單功能電路板的寵兒，常用於各種遙控器或桌上電話機等電子機器．全球STH板類之生產多半集中在東南亞及韓國等地，所用銀膏則以日貨為主，如Fujikura、北陸等品牌．近年來板面跳線多已改成碳膠，而銀膏則專用於貫孔式雙面板之頌域．“銀貫孔”技術要做到客戶允收並不簡單，常會出現斷裂、鬆動、及“遷移”(Migration)等問題．可供參考的文獻不多，現場只有自求多福，以經驗為主去克服困難．Skip Solder缺錫，漏銲──指波焊中之待焊板面，由於出現氣泡或零件的阻礙或其他原因，造成應沾錫表面並未完全蓋滿，稱為Skip Solder，亦稱為Solder Shading．此種缺錫或漏焊情形，在徒手操作之烙鐵補焊中也常發生．Supper Solder超級焊錫──系日商古河電工與Harima化成兩家公司共同開發一種特殊錫膏之商品名稱．其配方中含金屬錫粒與有機酸鉛(RCOO-Pb)，及某些活性的化學品．當此錫膏被印著在裸銅焊墊上又經高溫熔銲時，則三者之間會迅速產生一連串復雜的“置換反應”．部份生成的金屬鉛會滲入錫粒中形成合金．，並焊接在銅面上，效果如同水平“噴錫層”一般，不但厚度十分均勻，而且只在銅面上生長．介於銅墊之間的底材表面將不會出現“牽拖”的焊錫．因此本法可做為QFP 极密墊距的焊料．目前國內已量產的P5筆記型電腦，用以承載CPU高難度小型8層板的Daughter Card，其320腳9.8mil密距及5mil窄墊者，系采SMT烙焊法，此種Supper Solder 錫膏法已成為良率高的少數制程．銅墊上L-type的Super Solder印膏內，於攝氏210度的重熔高溫中，在特殊活性化學品的促進下，其“有機酸鉛”與金屬鋼鐵粒兩者之間會產生一種轉置換反應，而令金屬錫氧化成“有機酸錫”(RCOO-Sn)，隨即也有金屬鉛被還原而附著在錫粒及銅面上，並同時滲入錫粒中形成銲錫．在此同時印膏中的活化劑也會在高溫中使金屬銅溶解成為鉛鹽，且參加上述的置換反應，而讓新生的銲錫成長於銅墊上．Tackiness粘著性，粘手性──在板面涂布液態感光綠漆(LPSM)後（如空網印刷、垂流、噴涂、垂直刮涂、與滾涂等方法），還要預烤以待曝光．這種預烤漆面在強光照射下仍會沾底片的性質稱為Tackiness．又下游各SMD焊墊上印著錫膏與放置零件后，在等待紅外線與熱風熔焊前，錫膏必須暫時呈現粘貼定位的功能，也稱為Tackiness．Tarnish污化，污著──指某些新加工金屬的光澤表面在空氣中放置一段時間后，由於氧化、硫化或外來雜物的附著，以致失去金屬光澤與變色(Discoloration)稱為Tarnish．此詞最常用於鍍銀表面的“污化”，為了確保鍍銀表面的美觀與實用功能起見，其Anti-Tarnish技術也成為鍍銀的重要課題．Thermal Via導熱孔，散熱孔──是分布在高功率（如5W以上）大型零件（如CPU或其他驅動IC）腹底板面上的通孔，此等通孔不具導電互連功能只做散熱用途．有時還會與較大的銅面連接，以增加直接散熱效果．此等散熱孔對Z方向熱應力具有舒緩的作用．精密Daught Card的8層小板，或在某些BGA 雙面板上，就常有這種格點排列的散熱孔，與兩面鍍金的“散熱座”等設計．Three Point Bending三點壓彎試驗──系將組裝板自下板面外側兩杆予以支持，再自上面中心第三點向下施力壓成板彎，然後觀察各貼焊點強度的一種試驗法．Trim 修整，修改數值，精修──碳膠質網印式電阻器(Resistor)，當硬化後之厚度與寬度固定時，則仍可用砂法或雷射法精確。

PCB电子线路板专业术语

PCB电子线路板专业术语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glasscloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan更多的详细资料来源：。

线路板常用术语

一、线路板常用术语1． Warp与Fill：经向(Warp),指大料(或Prepreg)的短方向，纬向(Fill)指大料(或Prepreg)的长方向。

2．横料与直料：多层板开料时将Panel长方向与大料长方向一致的称为直料；将Panel长方向与大料短方向一致的称为横料；3． Material Thickness(Board Thickness)：客户图纸或Spec无特别说明的均指成品厚度(Finished Thickness)，Material Thickn ess无Tolerance要求时, 选用厚度最接近的板料；4． Copper Thickness：客户图纸或Spec无特别说明情况下，均指成品线路铜厚度；5． Pitch：节距，相邻导体中心之间的距离；6． Solder Mask Clearance：绿油开窗的直径；7．LPI 阻焊油： Liquid Photo-Imaging 液态感光成像阻焊油,俗称湿绿油；8．SMOBC： Solder Mask On Bare Copper绿油丝印在光铜面上，一般有 SMOBC+HAL/Entek/ENIG等工艺；9．BGA： Ball Grid Array (BGA球栅列阵)：集成电路的封装形式，其输入输出点是在元件底面上按栅格样式排列的锡球；10． Blind via(盲孔)：PCB的外层与内层之间的导电连接，不继续通到板的另一面；Buried via(埋孔)：PCB的两个或多个内层之间的导电连接(即从外层看不见的)；11． Positive Pattern：正像图形、正片、照相原版、生产底版上的导电图形为不透明时的图形；12． Negative Pattern：负像图形，负片，照相原版、生产底版上的导电图形是透明时的图形。

我们一般称直蚀线路菲林、绿油挡墨菲林、干/UV绿油菲林为负片菲林；需要电镀线路菲林、湿绿油菲林、字符菲林、碳油菲林、兰胶菲林称为正片菲林；13． FPT： Fine-Pitch Technology 精细节距技术, 表面贴片元件包装的引角中心间隔距离为0.025”(0.0635mm)或更少；14． Lead Free：无铅；15． Halogen Free：无卤素，指环保型材料；16． RoHS：Restriction of Use of Hazardous Substances 危险物质的限制使用，禁铅、禁汞、禁镉（Cadmium）、禁六价铬（Hexava lent Chromium）与禁溴耐燃剂（Flame Retardents）；17． OSP： Organic Solderability Protector 防氧化；18． CTI： Comparative Tracking Index 相对漏电起痕指数，即材料表面能经受住50滴电解液而没有形成漏电痕迹的最高电压值；19． PTI： Proof Tracking Index 耐漏电起痕指数，即材料表面能经受住50滴电解液而没有形成漏电痕迹的耐电压值用V表示；20． Tg： Glass Transition temperature 玻璃态转化温度; 21．试孔纸：将各测试点、管位、以1：1打印出来的图纸; 22．测试点：一般指独立的PTH孔、SMT PAD、金手指、Bonding手指、IC手指、BGA焊接点、以及客户于插件后测试的测试点; 23．测试端点：线路网络中不能再向前延伸的测试点。

PCB专业术语大汇集

PCBJargon(PCB专业术语) AAbsorption 吸收、吸入Accelerated Test（Aging）加速实验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（AQL）允收品质水准Accuracy 准确度ACF：Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为ActivatorActive parts（Devices）主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国规范协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArray 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit 特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light（Back Lighting）背光法Back-UP 垫板Backpanels/Backplanes 背板、支持板，厚度较厚，Ball Grid Array（BGA）球脚车列（封装）Barrel 孔壁Base Material 基材Batch 批（同时间发料某一数量的板子）Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化（Brown Oxide）Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞（void）所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指PPBonding Wire 结合线，IC之晶片与PCB之引线Bow 板弯Break-away Panel 可断开板或者说Break Away TabBreak Point 出像点、影像点Break-Out 破出（钻孔破出开成断环情形）Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump 突块Buried Via Hole 埋导孔Burn-in 高温加速老化实验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: Computer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物 Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Characteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室 (Class 100)Cleanliness 清洁度Clearance 余隙、余环COB（Chip on Board）晶片在板上直接组装COC（Certificate of Compliance）出货合格书COF（Chip on Flexible PCB）COG（Chip glass）Coefficient of Thermal Expansion 热膨胀系数（CTE）Cold Solder Joint 冷焊点Component Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性实验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑（基板外观上的缺点）Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density （C.D.）电流密度（1 ASD=9.1 ASF）Curtain Coating 液涂法Datum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡DFM: Design for Manufacturing/Dirty foreign Materials 异物、杂质Die 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP（Dual Inline Package）双排脚封装体Direct Plating 直接电镀DI Water 纯水 (De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM（Defect Parts Per Million）Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummy 假镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰 Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉 RivetFAAR（First Article Approval Report）Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具 (Rig and Fixture)Flame Resistant 耐燃性（分HB、VO、V1及V2等四级）Flux 助焊剂Foil Burr 铜箔毛边Foot Pint（Land Pattern）脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用规范板Grid 规范格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener 硬化剂Hardness 硬度Heat Dissipation 散热Hertz（Hz）赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测 High Potential TestHit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength 孔壁强度Hole Void 破洞Hot Air Levelling 喷锡 HASL/HALTHE(High Temperature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection互连Intermatallic Compound(IMC) 介面合金共化物Internal Stress 内应力Ion Cleanliness 离子清洁度Ionic Contamination 离子污染IPC: The Institute for Interconnecting and Packaging Electronic Circuits 美国印刷电路板协会ISO: International Organization for Standardization 国际规范组织Isolation 隔离性JJPCA/Japan Print Circuit Association 日本印刷电路工业会Just-In-Time(JIT) 适时供应KKeyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land 孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局 (configuration, general arrangement) Lay Up 叠合Lead Frame 脚架Lead 引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate)MMajor Defect 严重缺点、主要缺点Marking 标记Mask 阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch 薄膜开关Microctching 微蚀Microsectioning 微切片法Migration迁移Mil 英丝0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem 调变及解调器、数据机Modification 修改、改变Module 模组Mother Board 主机板NNail Head 钉头N.C.数值控制（Numerical Control）Negative 负片Negative etch-back 反回蚀Nick 缺口Node 节点Nodule 瘤Non-Conformance 不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution 常态分配NPI：New project introduction)NRE Charge-Non-Recurring Engineering Charge 不会重收的工程费用OOhm 欧姆Omega Meter 离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection 光学检验Organic Solderability Preservatives(OSP) 有机保焊剂Outgassing 出气、吹气Output 产出、输出Overflow 溢流Oxidation氧化Ozone Depletion 臭氧层耗损PPackaging 封装、购装Packing 包装Pad 配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏（锡膏Solder Paste）Pattern Plating 线路电镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral 周边附属设备Phototool 底片（一般指偶氮棕片 Diazo Film）Pin Grid Array(PGA) 矩阵式针脚封装Pinhole 针孔Pin 接脚、插梢、插针Pink Ring 粉红圈Pits 凹点（小面积下陷）Pitch 脚距、垫距、线距Plasma 电浆Plated through Hole/PTH 镀通孔Plug 插脚、塞孔Polarization 分极、极化Polyimide(PI) 聚亚酸胺Popcorn Effect 爆M花效应Post Cure 疏孔度实验Power Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million 百万分之几Preheat 预热Prepreg 胶片、树脂片Press Plate 压合钢板Press-Fit Contact 挤入式接触Printing 印刷Probe 探针Profile 轮廓、部面图、升温曲线图积线Punch 横切、冲床QQIT(Quality improvement Team) 品质改善小组Qualified Products List 合格产品（供应者）名单RRadiometer 辐射计、光度计Radius 尺角、半径Reference Dimension 参考尺度、参考尺寸Reflow Soldering 重熔焊接、熔焊Registration 对准度Reject 剔退、拒收Reliability 可靠度、信赖度Repair 修理Resin Content 胶含量、树脂含量Resin Flow 胶流量、树脂流量Resist 阻剂、阻膜Resistor 电阻器、电阻Resolution 解像、解像度、解读度Resolving Power 解读力、解像力（分辨力）Rework(ing) 重工、再加工Ring 套环Roller Cutter 混切机（俗称锯板机）Roller Coating 滚动涂布法Routing 切外型、捞外型RRM: Revolutions per Minute 转速（每分钟）Run-out 偏转、绕转、累积距差SSCAR(Supplier CA Request) 供应商改善报告SCM: Supply chain Management 供应商经管系统Scratch 刮痕Screen Printing 网版印刷Scrubber 磨刷机、磨刷器Selective Plating 选择性电镀SEM/Scanning Electron Microscope 扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short 短路SIR(Surface Insulation Resistance) 表面绝缘电阻Side Wall 侧壁Sigma(Standard Deviation) 规范差Signal 讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect 集肤效应Skip Printing 漏印Slot 槽孔Smear 胶渣SMT/Surface Mount Technology 表面黏装技术Solder 焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤（IC脚间的防焊）Solder Levelling 喷锡、热风整平Solder Mask(S/M) 绿漆、防焊膜Solder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 规范作业程序Spacing 间距SPC/Statistical Process Control 统计制程管制Specific Gravity SG比重Specification(Spec) 规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil 版膜、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR) 表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device 表面黏装零件Swelling Agents/Sweller 膨胀剂SWR(Special Working Request) 试产前之“特殊工作要求”TTab 接点、金手指Tape 撕胶带实验Teflon 铁氟龙Temperature Profile 温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology 薄膜技术Throwing Power 分布力Tolerance 公差Touch Up 检修（简单的工具在手操作下即可进行的小规范的检修，称之Touch Up或Rewok 有些类似）Trace 线路、导线Traceability 追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist 板翘、板扭UUL 保险业实验 Underwriters Laboratories/INCUltra Violet Curing(UV Curing) 紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity 黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer 晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer 垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure 织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting Balance 沾锡、沾湿White Spot 白点Wicking effect 灯芯效应Wire Bonding 打线结合WIP(Working Piece in Process) 在制品XX Axis X轴X-Ray X光YY-Axis Y轴Yield 良品率、良率、产率ZZ-Axis X轴OtherHDI-High Density inter-connect 高密度内连接SWOT Strengths Weaknesses Opportunities ThreatsCD: Compact DiscCPU: Central Process UnitLaser, YAG Laser)DLD: Direct Laser Drilling (CO2DVD: Digital Versatile DiscEEPROM: Electrically Erasable Programmable Read Only Memory EMS: Electronics Manufacturing ServiceGPS: Global Positioning ServiceHDD: Hard Disk DriveHDTV: High Density TVLCD: Liquid Crystal DisplayLED: Light Emitting DiodeVCD: Video Compact DiskQuality System Requirements QS-9000(質量體系要求)Advanced Product Quality Planning and Control Plan APQP(產品質量先期策劃和控制計劃)Measurement Systems Analysis MSA(測量系統分析)Potential Failure Mode and Effects Analysis FMEA(潜在失效模式與後果分析) Production Part Approval Process PPAP (生產件批准程序)Statistical Process Control SPC (統計過程控制)IPC-A-600Classification 分级Acceptance Criteria 允收规格Applicable Documents 参考资料Dimensions And Tolerances 尺度与公差Terms And Definitions 术语及定义Workmanship 工艺水准Externally Observable Characteristics 外观特性Board Edges 板边Burrs 看头、毛刺Nonmetallic Burrs 非金属性毛头Metallic Burrs 金属毛头Nicks 缺口Haloing 白边Base Material 基材Weave Exposure 织纹显露Weave Texture 织纹隐现Exposed/Disrupted Fibers 玻织曝露/扰乱Pits and Voids 凹点与凹坑Base Material Subsurface 基材次表面Measling白点Crazing白斑Delamination/Blister分层/起泡Foreign Inclusions外来夹杂物Solder Coatings and Fused Tin Lead喷锡板或熔锡板Nonwetting拒锡（不沾锡）Dewetting缩锡Holes-Plated-Through-General镀通孔概要Nodules/Burrs镀瘤/毛头Pink Ring粉红圈Voids-Copper Plating镀铜层破洞Voids-Finished Coating完工皮膜之镀层破洞Lifted Lands-(Visual)孔环浮离（目检）Holes-Unsupported未镀孔Haloing白圈Printed Contacts板边接触金手指Surface Plating-General表面镀层通则Surface Plating-Wire Bond Pads打线承垫之表面Burrs on Edge-Board Contacts板边接点之毛头Adhesion of Overplate表面镀层之附着力Marking标记Etched Marking蚀刻标记Screened or Ink Stamped Marking纲印或盖印之标记Solder Resist(Solder Mask)防焊绿漆Coverage Over Conductors (Skip Coverage)边线表面之覆盖性（覆盖不全、跳印）Registration to Holes (All Finishes)对孔之套准度（各种表处理层）Registration to Other Conductive Patterns其他防焊的对准性Ball Grid Array (Solder Resist-Defined Lands)球脚格列体之焊垫（绿漆设限之焊垫）Ball Grid Array (Copper-Defined Lands)球脚格列体（铜面设限之焊垫）Ball Grid Array (Solder Dam)球脚格列体（防焊堤）Blisters/Delamination起泡/分层Adhesion(Flaking or Peeling)附著力（破片或剥落）Waves/Wrinkles/Ripples起浪/起皱/纹路Tenting(Via Holes)盖孔（导通孔、过孔）Pattern Definition-Dimensional圆形尺度特性Conductor Width and Spacing线宽与间距Conductor Width线宽Conductor Spacing导线间距External Annular Ring-Measurement孔环测量External Annular Ring-Supported Holes有孔壁支援的外孔环External Annular Ring-Unsupported Holes无孔壁支援的外孔环Flatness平坦度Internally Observable Characteristics可观察到的内在特性Dielectric Materials介质材料Laminate Voids(Outside Thermal Zone)压板空洞（或热区之外）Registration/Conductors to Holes导体与通孔之间的对准度Clearance Hole/Unsupported/to Power/Ground Planes针对电源层或接地层具隔环之非镀通孔Delamination/Blister分层/起泡Etchback回蚀Negative Etchback反回蚀Smear Removal除胶渣Dielectric Material/Clearance/Metal Plane for Supported Holes 金属层与通孔壁之介质隔距Layer-to-Layer Spacing层与层之间距Resin Recession树脂缩陷Conductive Patterns-General导线概论Etching Characteristics蚀刻特性Print and Etch印后即蚀刻（指正片法）Surface Conductor Thickness(Foil Plus Plating)表导体厚度（铜箔加电镀铜）Foil Thickness-Internal Layers内层箔厚Plated-Through Holes-General镀通孔概论Annular Ring-Internal Layers各内层之孔环Lifted Lands-(Cross-Sections)焊环浮起（切片上所见）Foil Crack-(Internal Foil)“C”Crack内层铜箔之裂纹Foil Crack-(External Foil)镀层破裂Plating Crack-(Barrel)“E”Crack孔壁镀层破裂Plating Crack-(Corner)“F”Crack孔角镀层破裂Plating Nodules镀层长瘤Copper Plating Thickness-Hole Wall孔壁镀铜厚度Plating Voids镀层破洞Solder Coating Thickness (Only When Specified)焊锡皮膜厚度（当已规定检查者）Solder Resist Thickness绿漆厚度Wicking灯芯效应（指玻织束渗入化学铜）Wicking/Clearance Holes隔离孔之渗铜Innerlayer Separation-Vertical (Axial) Microsection内层（环）分离-垂直（纵断面）微切片Innerlayer Separation-Horizontal (Transverse) Microsection内层（环）分离-水平（横断面）微切片Material Fill of Blind and Buried Vias盲孔与埋孔之填充材料钻孔式镀通孔Plated-Through Holes-Drilled钻孔式镀通孔Burrs毛头Nailheading钉头Plated-Through Holes-Punched冲孔式镀通孔Roughness and Nodules粗糙与镀瘤Flare喇叭口Miscellaneous其他离顶Flexible And Rigid-Flex Printed Wiring软性及软硬合板Metal Core Printed Boards金属平心电路板Type Classifications型式分类Spacing Laminated Type间距压合板Insulation Thickness/Insulated Metal Substrate已绝缘金属底材之绝缘厚度Insulation Material Fill/Laminated Type Metal Core压合型金属平心之绝缘填料Cracks in Insulation Material Fill/Laminated Type压合型绝缘填充料之裂纹Core Bond to Plated-Through Hole Wall平心层与镀通孔之间的固著Flush Printed Boards表面全平板Flushness of Surface Conductor表面导线之平坦性Cleanliness Testing清洁度实验Solderability Testing焊锡性实验Plated-Through Holes镀通孔Electrical Integrity电性之完整。

电路板术语集锦

电路板术语集锦时间:2006-07-24 来源: 作者: 点击：…… 字体大小:【大中小】*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验).Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光.Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr) 凡液体比重比水轻则 Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射.Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 .Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈). Bomb Sight弹标.Bond Strength结合强度. Bondability结合性.Bonding Layer结合层接着层. Bonding Sheet(Layer)接合片. Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条). 在425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理. Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程.Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程. Buoyancy浮力.Buried Via Hole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距. Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性. Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 . Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻. Continuity连通性.Contract Service协力厂,分包厂. Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记. Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积. Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D*****Daisy Chained Design菊瓣设计.Datum Reference基准参考.Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位, 定义9000米纱束所具有的重量(以克米计)). Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压. Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器. Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度. Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法. First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 , 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金 (现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.Glass Transition Temperature, Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机. Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作).Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性. Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路.Hydraulic Bulge Test液压鼓起试验. Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压. Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻.Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物. Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构.Laminate Void板材空洞.Laminate(s)基板.Lamination Void压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机. Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管.Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆. Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面). Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术. Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验. Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).Multi-Chip-Module(MCM)多芯片芯片模块.Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄.Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂.Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯. Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜. Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.) Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phenolic纸质酚醛树脂(板材). Parting Agent脱膜剂.Passivation钝化 ,钝化外理.Passive Device (Component)被动组件(零件) Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.Periodic Reverse (PR) Current周期性反电流. Peripheral周边附属设备.Permeability透气性,导磁率.Permittivity诱电率,透电率.pH Value酸碱值.Phase相.Phase Diagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光启始剂.Photomask光罩.Photoplotter, Plotter光学绘图机.Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工. Phototool底片.Pick and Place拾取与放置.Piezoelectric压电性.Pin 插脚,插梢,插针.Pin Grid Array (PGA)矩阵式针脚对装.Pinhole针孔.Pink Ring粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.Plain Weave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.Pneumatic Stretcher气动拉伸器.Pogo Pin伸缩探针.Point 钻尖.Point Angle钻尖面.Point Source Light点状光源.Poise泊."粘滞度"单位=1dyne*sec/cm2.Polar Solvent极性溶剂.Polarity电极性.Polarization分极,极化.Polarizing Slot偏槽.Polyester Films聚酯类薄片.Polymer Thick Film (PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亚醯胺.Popcorn Effect爆米花效应.Porcelain瓷材,瓷面.Porosity Test疏孔度试验.Positive Acting Resist正性光阻剂. Post Cure后续硬化,后烤.Post Separation后期分离,事后公离. Pot Life运用期,锅中寿命.Potting铸封,模封.Power Supply电源供应器.Preform 预制品.Preheat预热.Prepreg胶片,树脂片.Press Plate钢板.Press-Fit Contact挤入式接触. Pressure Foot 压力脚.Pre-tinning预先沾锡.Primary Image线路成像.Print Through压透,过度挤压..Probe探针.Process Camera制程用照像机. Process Window操作范围. Production Master生产底片.Profile轮廓,部面图,升温曲线图棱线. Propagation传播.Propagation Delay传播延迟.Puddle Effect水坑效应.Pull Away拉离.Pulse Plating脉冲电镀法.Pumice Powder 浮石粉.Punch冲切.Purge, Purging净空,净洗.Purple Plague紫疫(金与铝的共化物层). Pyrolysis热裂解,高温分解.*****Q*****Quad Flat Pack (QFP)方扁形封装体. Qualification Agency资格认证机构.Qualification Inspection资格检验.Qualified Products List合格产品(供应者)名单.Qualitative Analysis定性分析.Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板). Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*****R*****Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference (RFI)射频干扰.Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压.Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮(盘)式操作.Reference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合.Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂.Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶(糊)渣.Resin Starve Area缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反电流(电解)清洗. Reverse Etchback反回蚀.Reverse Image负片影像(阻剂).Reverse Osmosis (RO)反(逆渗透).Reversion反转,还原.Revision修正版.改订版.Rework(ing)重工,再加工.Rhology流变学,流变性质.Ribbon Cable圆线缆带.Rigid-Flex Printed Board硬软合板.Ring 套环.Rinsing水洗,冲洗.Ripple纹波(指整流器所输出电流中不稳定成分). Rise Time上升时间.Roadmap 线路与零件之布局图.Robber辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*****S*****Sacrificial Protection牺牲性保护层.Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验. Schemetic Diagram电路概略图. ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷. Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程. Semi-Conductor半导体.Sensitizing敏化.Separable Component Part可分离式零件. Separator Plate隔板, 钢板.Sequential Lamination接续性压合法. Sequestering Agent螯合剂. Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma (Standard Deviation)标准差.Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.Silver Migration银迁移.Silver Paste 银膏.Single-In-Line Package(SIP)单边插脚封装体.Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应 (高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀.Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃(铅玻璃).Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法. Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking(S/M)防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞(柱).Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应. Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油. Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样. Spectrophotometry分光光度计检测法. Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术. Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂.*****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合. Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数. Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合.Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法.Thermogravimetric Analysis, (TGA)热重分析法. Thermomechanical Analysis (TMA)热机分析法. Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器. Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value (TLV)极限值.Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫". Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路.Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体.*****U*****UL Symbol(UL.为Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度.Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化. Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式传输线. Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机.Unsupported Hole非镀通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法. Vacuum Lamination真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器. Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.Void 破洞,空洞.Volatile Content挥发份含量.Voltage电压.Voltage Breakdown崩溃电压.Voltage Drop 电压降落.Voltage Efficiency电压效率.Voltage Plane电压层.Voltage Plane Clearance电压层的空环.Volume Resistivity体绩电阻率.Volume Resistivity体绩电阻率.Volumetric Analysis容量分析法.Vulcanization交联,硫化.*****W*****Wafer晶圆.Waive暂准过关,暂不检查.Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理. Water Absorption吸水性. Water Break水膜破散,水破. Water Mark水印.Watt瓦特.Watts Bath瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊. Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure织纹显露. Weave Texture织纹隐现.Web蹼部.Wedge Bond 楔形结合点. Wedge Void楔形缺口(破口). Weft Yarn纬纱.Welding熔接.Wet Blasting湿喷砂.Wet Lamination湿压膜法.Wet Process湿式制程. Wetting Agent润湿剂. Wetting Balance沾锡天平. Wetting Balance沾锡,沾湿. Whirl Brush旋涡式磨刷法. Whirl Coating旋涡涂布法. Whisker晶须.White Residue白色残渣. White Spot白点.Wicking灯蕊效应.Window操作范围,传动齿孔. Wiping Action 滑动接触(导电). Wire Bonding打线结合.Wire Gauge线规.Wire Lead金属线脚.Wire Pattern布线图形.Wire Wrap绕线互连.Working Master工作母片.Working Time (Life)堪用时间.Workmanship 手艺,工艺水平,制作水准.Woven Cable扁平编线.Wrinkle皱折, 皱纹.Wrought Foil锻碾金属箔.*****X*****X AxisX轴.X-Ray X光.X-Ray FluorescenceX萤光.*****Y*****Yarn纱线.Y-AxisY轴.Yield良品率,良率,产率.Yield Point屈服点.*****Z*****Z-AxisZ轴.Zero Centering中心不变(叠合法).Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.===================================================== [分享]PCB专业英译术语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制组件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board。

PCB之综合词汇

综合词汇：1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated multilayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark1、Access Hole 露出孔(穿露孔，露底孔) （FPC、软板相关术语）常指软板外表的保护层Coverlay(须先冲切出的穿露孔)，用以贴合在软板线路表面做为防焊膜的用途。

电路板术语

电路板术语整理5Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应.Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油.Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样.Spectrophotometry分光光度计检测法.Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术.Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂. *****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合.Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数.Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合.Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法.Thermogravimetric Analysis, (TGA)热重分析法.Thermomechanical Analysis (TMA)热机分析法.Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器.Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value (TLV)极限值.Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路.Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体. *****U*****UL Symbol(UL.为Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度.Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化.Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式传输线.Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机.Unsupported Hole非镀通孔.Urea尿素.Urethane 胺基甲酸乙脂. *****V*****V acuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法.Vacuum Lamination 真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器.Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.V oid 破洞,空洞.V olatile Content 挥发份含量.V oltage电压.V oltage Breakdown崩溃电压.V oltage Drop 电压降落.V oltage Efficiency电压效率.V oltage Plane电压层.V oltage Plane Clearance电压层的空环.V olume Resistivity体绩电阻率.V olume Resistivity体绩电阻率.V olumetric Analysis容量分析法.Vulcanization 交联,硫化. *****W*****Wafer晶圆.Waive暂准过关,暂不检查.Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理.Water Absorption吸水性.Water Break水膜破散,水破.Water Mark水印. Watt瓦特.Watts Bath 瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊.Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度.Weatherability耐候性.WeaveEposure织纹显露.Weave Texture织纹隐现.Web蹼部.。

PCB设计常用术语

1、印制电路（Printed Cirtuit）：在绝缘基材上，按设计生成的印制原件或印制电路以及两者结合的信号传输电路。

2、PCB（Printed Circuit Board）：印制电路板是由导电材料和绝缘基材一起组成的印制板，实现了所设计电路的信号连接，并且装配电路所需的所有元件。

3、层（Layer）：PCB上由铜箔组成的导电层，包括传输信号层和电源或地层。

4、内电层（Inner Layer）：内电层是PCB的一种负片层，主要作用是电源或地的层。

5、信号层（Signal Layer）：信号层是PCB的一种正片层，主要用作信号的传输和走线。

6、单层PCB：只有一面上进行信号走线的PCB。

7、双面PCB：两面都进行信号走线的PCB。

8、多层PCB：有许多导电走线层和绝缘材料层一起粘接，层间的信号走线可以实现互连PCB。

9、母板（Mother Board）：可以安装一块或多块PCB组件的主PCB。

10、背板（Backplane）：一面提供了多个连接器插座，用于点间电气互连PCB。

点间电气互连可以是印制电路。

11、元件：实现电路功能的基本单元，比如电容、电感、电阻、集成电路芯片等。

12、元件封装（Footprint）：元件封装是指元件焊接到电路板时所指的外观和焊盘位置。

既然原件封装只是元件的外观和焊盘位置，那么纯粹的元件封装只是空间的概念，因此，不同的元件可以共用同一个元件封装。

13、焊盘（Pad）：用于连接元件引脚和PCB上走线的电气焊接点，通常由铜层、镀铜和焊锡流组成，其周围还会有阻焊层。

14、过孔（Via）：为连通各层之间的线路，在各层需要连通的导线的交汇处钻上一个公共孔。

15、盲孔（Blind Via）：从中间层延伸到PCB一个表面层的过孔。

16、埋孔（Buried Via）：从一个中间到另一个中间之间的过孔，不会延伸到PCB表面层。

17、安全距离（Clearance）：防止信号之间出现短路的最小距离，是PCB走线的重要设置参数。

大陆电路板术语总整理

大陸電路板術語總整理(1)一般術語printed circuit 印制電路printed wiring 印制線路printed board 印制板single sided printed board 單面印制板double sided printed board 雙面印制板multiplayer printed board 多層印制板rigid printed board 剛性印制板rigid single-sided printed board剛性單面印制板rigid double-sided printed board 剛性雙面印制板rigid multiplayer printed board剛性多層印制板flexible printed board 撓性印制板flexible single-sided printed board 撓性單面印制板flexible double-sided printed board撓性雙面印制板flexible multiplayer printed board 撓性多層印制板flex-rigid printed board 剛撓印制板flex-rigid double-sided printed board剛撓雙面印制板flex-rigid multiplayer printed board 剛撓多層印制板flush printed board 齊平印制板metal core printed board 金屬芯印制板mother board 母板conductor 導線multi-wire printed board 多重布線印制板ceramic substrate printed board 陶瓷印制板printed component 印制元件grid 綱路component side 元件面solder side 焊接面1printing 印制板conductor side導線面flush conductor 齊平導線legend 字符pattern 圖形marking 標志conductive pattern 導電圖形non-conductive pattern 非導電圖形(2)基材種類的結構——metal-clad base material 覆金屬箔基材base material 基材copper-clad laminate 覆銅箔層壓板laminate, laminated sheet 層壓板single-sided copper-clad laminate單面覆銅箔層壓板double-sided copper-clad laminate雙面覆銅箔層壓板composite laminate 復合層壓板thin laminate 薄層壓板metal core copper-clad laminate金屬芯覆銅箔層壓板pre-preg，prelim-pregnated material 預浸材料bonding sheet 黏結片flexible copper-clad dielectric film撓性覆銅箔絕緣膜adhesive coated dielectric film 塗膠黏劑絕緣膜unsupported adhesive film 無支撐膠黏劑膜laminate for additive process 加成法用層壓板mass lamination panel，semi-manufactured mutilayerprinted board panel 預制內層覆箔板copper-clad surface 銅箔面foil removal surface 去銅箔面unclad laminate surface 層壓板面base film face 基膜面lengthwise direction （層壓板）縱向crosswise direction （層壓板）橫向cut-to-size panel 切割板cold punching 冷沖原材料——conductive foil 導電箔shiny side 光面electrodeposited copper foil 電解銅箔rolled copper foil 壓延銅箔annealed copper foil 退火銅箔matte side 粗糙面treated side 處理面stain proofing 防锈處理thin copper foil 薄銅箔adhesive coated foil 塗膠銅箔reinforcing material 增強材料e-glass fiber 玻璃纖維glass cloth 玻璃布warp-wise 經向non-woven fabric 非織布weft-wise，filling-wise 緯向thread count 織物經緯密度weave structure 織物組織plain weave 平紋組織size 浸潤劑coupling agent 偶聯劑impregnating insulation paper 浸漬絕缘紙aromatic polyamide paper 塗醯胺纖維紙non-woren polyester fabric 塗酯纖維非織布machine direction 縱向cross direction 橫向breaking length斷裂長height of capillary rise 吸水高度wet strength retention 濕強度保留率whiteness，brightness 白度poly-functional epoxy resin 多功能環氧樹脂brominated epoxy resin 溴化環氧樹脂a-stage resin a階樹脂b-stage resin b階樹脂c-stage resin c階樹脂polyimide resin 聚醯亞胺樹脂bismaleimied-triazine resin，BT雙馬來醯亞胺三泰樹脂perfluorinated ethylene-propylenecopolymer film，(fep film) 聚全氟乙烯丙烯薄膜weight per epoxy equivalent wpe 環氧當量epoxy value 環氧值dicyandiamide 雙氰胺binder 黏結劑flame retardant 阻燃劑abhesive 膠黏劑curing agent 固化劑bond enhancement treatment 黏結增強處理composite metallic material 複合金屬箔carrier foil 載體箔opaquer 遮光劑cure time 固化時間foil profile 箔輪廓finished fabric 處理織物bow 弓緯miss-picks 缺緯waviness 云緯fish eye 魚眼feather length 毛圈長mark厚薄段size content 浸潤劑含量twist 捻度size residue 浸潤劑殘留量split 裂縫d-glass fiber d 玻璃纖維grey fabric 壞布woven serin 稀松織物制造——impregnation 浸漬kiss pressure 接觸壓力impregnator；treater 浸漬機gel 凝膠體doctor knife 調節刮刀pot life 適用期clad 覆箔daylight 壓板間距laminating 層壓laminating 層合；復合multi-opening press 多層壓機high-pressure moulding 高壓壓制layup 疊層low-pressure moulding 低壓壓制release agent，parting agent 脫模劑release film 防黏膜press platen 壓板pressure pad 壓墊材料degassing 放氣laminate moulding plate 層壓模板moulding cycle 壓制周期post cure 后固化plate finish 原始光潔面matt finish 失光光潔面internal identification mark 內部識別標志(3) 設計schematic diagram 原理圖logic diagram 編輯圖printed wiring layout 印制總圖master drawing 布設總圖artwork master 照相底圖engineering drawing 工程圖printed wiring assembly drawing 印制線路組裝圖component density 元件密度hole density 孔密度blind via 盲孔packaging density 組裝密度via 導通孔interlayer connection 表面間連接plated through hole 鍍覆孔buried via 埋孔access hole 餘隙孔landless hole無連接盤孔component hole 元件孔mounting hole 安裝孔hole pattern 孔圖supported hole 支撐孔land pad 連接盤unsupported hole 非支撐孔clearance hole 隔離孔hole location 孔位dimensioned hole 注尺寸孔offset land 偏置連接盤nonfunctional land 非功能連接盤land pattern 連接盤圖形anchoring spur 盤趾annular ring 孔環conductor layer 導線層conductor layer no.1 第一導線層internal layer 內層external layer 外層layer -to-layer spacing 層間距signal plane 信號層span 跨距ground 接地ground plane 接地層ground plane clearance 接地層隔離voltage plane 電源層pitch 節距voltage plane clearance 電源層隔離heat-sink plane 散熱層heat shield 熱隔離edge spacing 邊距primary side 主面secondary side 輔面supporting plane 支撐面basic dimension 基準尺寸center to center spacing 中心距design spacing of conductors 導線設計間距design width of conductors 導線設計寬度conductor spacing 導線間距edge-board connector 板邊連接器right-angle edge connector 直角板邊連接器connector area 連接器區edge board contact 板邊接觸件printed contact 印制接觸件contact area 接觸面積component lead 元件引線component pin 元件引腳nonfunctional interfacial connection 非功能表面間連接jumper wire 跨度線reference edge 基準邊haywire 附加連線bus bar 匯流條crosshatching 開窗口routing 表線board thickness 印制板厚度datum reference 參考基準net list 綱表reference dimension 參考尺寸corner mark 角標trim line 外形線probe point 探測點keying slot 鍵槽polarizing slot 偏置定位槽register mark 對準標記micro-strip 微帶線transmission line 傳輸線layer 層characteristic impedance 特性阻抗strip-line 帶狀線crosstalk 串擾capacitive coupling 電容耦合continuity連通性digitizing 數字化current-carrying capacity 載流量minimum electrical spacing 最小電氣間距electromagnetic shielding 電磁屏蔽from-to-list 接線表placement 布局printed board cad 印制板計算機輔助設計design rule checking 設計規則檢查(4) 制造通用術語——manufacturing drawing 加工圖subtractive process 減成法additive process 加成法semi-additive process 半加成法tenting 掩蔽法solder mask on bare copper （SMOBC）裸銅覆阻劑工藝blank 壞料panel 在制板multiple printed panel 拼板multiple pattern 拼圖metallization 金屬化reworking 返工tuching up 修整repairing修復照相底版制作——original production master 照相原版production master 生產底版photo-tool，artwork 照相底版single-image production master 單板底版multiple –image production master 拼板底版photographic reduction dimension照相縮小尺寸photographic film照相底片silver film 銀藍底片diazo film重氮底片positive 正像positive pattern正像圖形negative 負像negative pattern 負像圖形photo plotting 光繪圖step-and-repeat步進重復emulsion side 乳膠面right reading正向definition清晰度resolution 分辨率density 密度（光密度）印制導線制作技術——photo resist 光致抗蝕劑dry film photo-resist，photopolymer film resist 干膜抗蝕劑liquid photo-resist 液體抗蝕劑positive-acting resist正性抗蝕劑negative-acting resist負性抗蝕劑plating resist耐電鍍抗蝕劑plated resist抗蝕鍍層permanent resist永久性保護層solder resist 阻焊劑solder masking 阻焊印料dry film solder mask 阻焊干膜liquid photosensitive solder mask液體光致阻焊劑step scale，gary scale 光梯尺，光密度尺exposure 曝光imaging 成像screen printing 綱印stencil 綱版thixotropic 熱變性outgroth 鍍層增寬etching 蝕刻etchant 蝕刻劑etching indicator 蝕刻指示圖bright dip 浸亮undercut 側蝕undercut in process 加工中側蝕etch factor 蝕刻系數overhang 鍍層突沿conductor width 導線寬度sliver 鍍層conductor base wise 導線底寬conductor base spacing 導線底距differential etching 差分蝕刻法鍍覆及其前后處理——hole cleaning 洗孔desmear 去鑽污etchback 凹蝕etchback shadowing 凹蝕死角negative etchback 負凹蝕pink ring 粉紅環wicking 芯吸作用electrolytic cleaning 電解清洗micro etch 微蝕刻activating 活化plating 鍍覆plating bath 鍍浴brightener 光亮劑wetting agent 潤濕劑leveling agent 整平劑strike 閃鍍throwing power 分散能力fusing 熱浴pattern plating 圖形電鍍bleeding 滲出panel plating 整板電鍍whiskers 晶鬚plating up 電鍍加厚overplating 外鍍層aspect ratio 板厚／孔徑比plating bar 工藝導線fusing fluid 熱熔液plating thief 分流陰極burned plating 燒焦鍍層solder levelling 焊料整平hot air levelling 熱風整平多層板壓制﹐機械加工——multiplayer lay up 多層疊層multiplayer laminating 多層壓制bonding layer 黏結層foil burr 毛刺adhesing promoting 黏合力增處理black oxidation 黑化deburr 去毛刺punching 沖切drilling 鑽孔chip load 切削量feed rate 進給速度feed rotation rate 進給轉給比peck drilling 啄鑽step drilling 分步鑽inspection overlay 覆蓋檢驗版resin smear 樹脂鑽污tooling hole 定位孔polarization 偏置定位chamfer 倒角tooling feature 定位特徵location mark 定位標記location notch 定位缺口location slot 定位槽location edge 定位邊(5)檢測通用術語——acceptance inspection 驗收檢驗production board 成品板test board 測試板test pattern 測試圖形composite test pattern 綜合測試圖形quality conformance test circuit質量一致性檢驗電路test coupon 附連測試板visual examination 目檢外觀和尺寸——blister 起泡﹑氣泡blow hole氣孔bulge 凸起delamination 分層circumferential separation 環形斷裂cracking 裂縫crack of foil 金屬箔裂縫crack of plating 鍍層裂縫crazing 微裂紋crazing conformal coating 敷形塗層微裂紋dent 凹痕﹔壓痕fiber exposure 露纖維extraneous copper 殘餘銅wrinkle 皺褶weave exposure 露織物haloing 暈圈weave texture 顯布紋hole breakout 破壞hole void 孔壁空洞inclusion 夾雜物lifted land 連接盤起翹measling 白斑nail heading 釘頭nick 缺口nodule 結瘤pin hole 針孔pit 麻點resin recession 樹脂凹縮scratch 劃痕void 空洞bump 凸瘤flare 錐口孔splay 斜孔conductor thickness 導線厚度minimum annular ring 最小環寬registration 重合度base material thickness 基材厚度metal-clad laminate thickness 覆箔板厚度resin-starved area 缺膠區resin-rich area 富膠區gelation particle 膠化顆粒treatment transter 處理物轉移total board thickness 印制板總厚度rectangularity 垂直度電性能——contact resistance 接觸電阻surface resistance 表面電阻surface resistivity 表面電阻率volume resistance 體積電阻volume resistivity 體積電阻率dielectric constant 介電常數dielectric dissipation factor 損耗因數dielectric strength 介電強度dielectric breakdown 介電擊穿comparative tracking index 相比起痕指數arc resistance 耐電弧度dielectric withstanding voltage 耐電壓非電性能——bond strength 黏合強度camber 彎度pull of strength 拉脫強度twist 扭曲pull-out strength 拉出強度bow 弓曲pael strength 剝離強度coefficient of thermal expansion（CTE）熱膨脹系數dimensional stability 尺寸穩定性solderability 可焊性nonwetring 不潤濕wetting 焊料潤濕dewetting 半潤濕ionizable（ionic）contaminat 離子污染microsectiong 顯微剖切plated-through hole structure test 覆孔結構試驗solder float test 浮焊試驗machinability 機械加工性heat resistance 耐熱性elongation伸長率flexural strength彎曲強度tensile strength 拉伸強度tensile modules of elasticity 拉伸彈性模量shear strengh 剪切強度tear stangth 撕列強度flexural fatgue 彎曲疲勞cold flow 冷流flammability可燃性flaming combustion 有焰燃烷glowing combustion 灼熱燃燒self extinguishing 自熄性oxygen index（OI）氧指數glass transition temperature 玻璃化溫度fungus resistance 防霉性chemical resistance耐化學性預浸材料系塗膠薄膜——volatile content 揮發物含量resin content樹脂含量gel time 膠化時間tack time 黏性時間cured thickness 預浸材料固化厚度differential scanning calorimeter 差示掃描量熱法resin flow 樹脂流動度thermal mechanical analysis 熱機分析(6) 裝聯printed board assembly 印制板組裝件packaging and interconnection assmbly 裝聯件through-hole mounting 通孔安裝packaging and interconnection structure 裝聯構件flat package 扁平封裝dual-in-line package（DIP）雙列直插式封裝surface-mount technology（SMT）表面安裝技術chip-on-board（COB）芯片直裝tape automated bonding（TAB）帶載自動安裝automatic placement systems (machine) 貼片機，捨放機contact angle 接觸角mixed component mounting technology 混合安裝技術solder wicking 芯帶吸焊taped components 帶載式元件surface-mount component 表面安裝元件chip carrier 芯片載體keying 定位鍵key 鍵bellows contact 扁簧式接觸件bifurcated contact 開槽接觸件press-fit contact 壓配合接觸件keying（V）鍵控定位axial lead 軸向引線swaged lead 擠壓引線dip soldering 浸焊lead extension 引線露出端lead projection引線伸出長度stress relief 消除應力clinched-wire through connection 穿線彎連mechanical warp 機械纏繞solderless warp繞接drag soldering 拖焊step soldering 分步焊接reflow soldering 重熔焊,再流焊infrared reflow soldering（IRS）紅外線熔焊vapor phase reflow soldering（VPS）汽相重熔焊solder 焊料solder fillet 焊縫dross 焊渣solder connection 焊點solder paste 焊膏outgassing 排氣pulse vacuum tin removal 真空吸錫法heat sink tool散熱工具flux 焊劑cold solder connection 冷焊點（虛焊點）disturbed solder connection 移位焊點Writed By Owen.W And Drgon.ZH （End）。

PCB术语总整理

ＰＣＢ朮语总整理Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验). Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr) 凡液体比重比水轻则 Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 .Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈).Bomb Sight弹标.Bond Strength结合强度.Bondability结合性.Bonding Layer结合层接着层. Bonding Sheet(Layer)接合片. Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条). 在425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理.Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程.Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程.Buoyancy浮力.Buried Via Hole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C***** C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法. Capacitance电容.Capacitive Coupling电容耦合. Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理. Card卡板.Card Cages/Card Racks电路板构装箱.Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性.Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 . Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂. Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记.Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积.Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点. C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D***** Daisy Chained Design菊瓣设计.Datum Reference基准参考.Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位, 定义9000米纱束所具有的重量(以克米计)). Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法.Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素. Disspation Factor散逸因子. Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔. Drag In / Drag Out带[进/带出. Drag Soldering拖焊. Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接. Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器.Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试.EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度.Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距. Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法. First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 , 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀). Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金 (现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破. Glass Transition Temperature, Tg玻璃态转化温度. Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent). Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作). Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性. Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路. Hydraulic Bulge Test液压鼓起试验. Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压. Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I***** I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测. Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片. Insulation Resistance绝缘电阻. Integrated Circuit(IC)绩体电路器. Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染. Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会. Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值). Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构.Laminate Void板材空洞.Laminate(s)基板.Lamination Void压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管.Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面). Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术. Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验.Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).Multi-Chip-Module(MCM)多芯片芯片模块.Multiwiring Board (or Discrete Wiring Board)复线板. *****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄.Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂.Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜.Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.)Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压.Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P***** Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phenolic纸质酚醛树脂(板材). Parting Agent脱膜剂.Passivation钝化 ,钝化外理.Passive Device (Component)被动组件(零件) Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.Periodic Reverse (PR) Current周期性反电流. Peripheral周边附属设备.Permeability透气性,导磁率.Permittivity诱电率,透电率.pH Value酸碱值.Phase相.Phase Diagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光启始剂.Photomask光罩.Photoplotter, Plotter光学绘图机.Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工.Phototool底片.Pick and Place拾取与放置.Piezoelectric压电性.Pin 插脚,插梢,插针.Pin Grid Array (PGA)矩阵式针脚对装.Pinhole针孔.Pink Ring粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.Plain Weave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.Pneumatic Stretcher气动拉伸器. Pogo Pin伸缩探针.Point 钻尖.Point Angle钻尖面.Point Source Light点状光源.Poise泊."粘滞度"单位=1dyne*sec/cm2. Polar Solvent极性溶剂.Polarity电极性.Polarization分极,极化.Polarizing Slot偏槽.Polyester Films聚酯类薄片. Polymer Thick Film (PTF)厚膜糊. Polymerization聚合.Polymide(PI)聚亚醯胺.Popcorn Effect爆米花效应. Porcelain瓷材,瓷面.Porosity Test疏孔度试验.Positive Acting Resist正性光阻剂. Post Cure后续硬化,后烤.Post Separation后期分离,事后公离. Pot Life运用期,锅中寿命.Potting铸封,模封.Power Supply电源供应器.Preform 预制品.Preheat预热.Prepreg胶片,树脂片.Press Plate钢板.Press-Fit Contact挤入式接触. Pressure Foot 压力脚.Pre-tinning预先沾锡.Primary Image线路成像.Print Through压透,过度挤压..Probe探针.Process Camera制程用照像机.Process Window操作范围.Production Master生产底片.Profile轮廓,部面图,升温曲线图棱线. Propagation传播.Propagation Delay传播延迟.Puddle Effect水坑效应.Pull Away拉离.Pulse Plating脉冲电镀法.Pumice Powder 浮石粉.Punch冲切.Purge, Purging净空,净洗.Purple Plague紫疫(金与铝的共化物层). Pyrolysis热裂解,高温分解.*****Q*****Quad Flat Pack (QFP)方扁形封装体. Qualification Agency资格认证机构. Qualification Inspection资格检验.Qualified Products List合格产品(供应者)名单. Qualitative Analysis定性分析.Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板).Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*****R*****Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference (RFI)射频干扰.Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压. Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮(盘)式操作.Reference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合.Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂. Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶(糊)渣.Resin Starve Area缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反电流(电解)清洗. Reverse Etchback反回蚀.Reverse Image负片影像(阻剂).Reverse Osmosis (RO)反(逆渗透).Reversion反转,还原.Revision修正版.改订版.Rework(ing)重工,再加工.Rhology流变学,流变性质.Ribbon Cable圆线缆带.Rigid-Flex Printed Board硬软合板.Ring 套环.Rinsing水洗,冲洗.Ripple纹波(指整流器所输出电流中不稳定成分). Rise Time上升时间.Roadmap 线路与零件之布局图.Robber辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验. Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*****S***** Sacrificial Protection牺牲性保护层. Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验. Schemetic Diagram电路概略图. ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷. Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程. Semi-Conductor半导体.Sensitizing敏化.Separable Component Part可分离式零件. Separator Plate隔板, 钢板.Sequential Lamination接续性压合法. Sequestering Agent螯合剂.Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma (Standard Deviation)标准差.Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.Silver Migration银迁移.Silver Paste 银膏.Single-In-Line Package(SIP)单边插脚封装体. Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应 (高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀.Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃(铅玻璃). Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法. Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking(S/M)防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞(柱).Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应. Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油. Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格. Specimen样品,试样. Spectrophotometry分光光度计检测法. Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点. Stalagometer滴管式表面张力计. Stand-off Terminals直立型端子. Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术. Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂.*****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合. Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.。

PCB专业词汇

PCB专业词汇PCB，即印刷电路板（Printed Circuit Board），是现代电子设备中不可缺少的一部分。

PCB由电气连接、信号传输、导线分布、电源供应等多个重要元件组成，为电子产品提供了可靠的基础支持。

在PCB工程设计和生产过程中，涉及到众多的专业词汇和术语，下面是一些常见的PCB专业词汇。

1. 线路(Trace) ：在电路板上绘制的导线，是电路板中最基本的元件。

2. 焊盘(Pad) ：电子元件连接至电路板上的部分，用于与焊料连接，以确保良好连接和固定。

3. 电路板层(PCB Layer) ：电路板的不同层，用于提供电路连接的支持和连接4. 焊接(Soldering) ：把焊料涂于焊盘上，使焊盘与电子元件连接，从而实现电路连接和固定。

5. 接地(Ground) ：电路板上用来消除干扰和防止静电等问题的虚接线，是一条“安全阀”。

6. 电源(Power) ：为PCB提供能量，使电子元件能够正常运行的部分。

7. 线路宽度(Trace Width) ：绘制线路的宽度，它是电路板设计和制造中的一个重要参数。

8. 间距(Spacing) ：PCB上电子元件之间的距离，影响电路板的紧凑程度和稳定性。

9. 材料(Materials) ：作为电路板构建和制造的基础材料，包括玻璃纤维、铜等常用材料。

10. 涂覆(Solder Mask) ：在PCB表面施加涂料，以保护电子元件和追踪线免受外部环境的影响以及缩短信号传输时间。

11. 丝印(Silk Screen) ：以文字或图形形式在PCB表面打印标记和标识的一种方法。

12. 经孔(Via) ：在电路板层之间进行电气联通的洞孔。

13. 环形电缆(Annular Ring) ：表示设备，尤其在PCB外围情况下元件的焊盘和电气测量的间距。

14. 层压板（Lamination) ：PCB层被压合为一个完整的电路板。

15. SMT (Surface mount technology)：一种电子元件表面焊接技术，大大提高了电子产品的制造效率和质量。

pcb术语

电路板(PCB)字汇整理PCB字典流程图PCB Mfg. FLOW CHART UPDATED:1999,09,01多层板内层流程(INNER LAYER PRODUCT)多次埋孔Multiple Buried ViaJOHNNY HSU顾客(CUSTOMER)工程制前(FRONT-END DEP.)裁板(LAMINATE SHEAR)内层干膜(INNERLAYER IMAGE)预叠板及叠板(LAY- UP )通孔电镀(P . T . H .)液态防焊(LIQUID S/M )外观检查(VISUAL INSPECTION ) 成型(FINAL SHAPING)业务(SALES DEPARTMENT)生产管理(P&M CONTROL)蚀铜(I/L ETCHING)钻孔(PTH DRILLING)压合(LAMINATION)外层干膜(OUTERLAYERIMAGE)二次铜及锡铅电镀(PATTERN PLATING) 蚀铜(O/L ETCHING)检查(INSPECTION )喷锡(HOT AIR LEVELING)电测(ELECTRICAL TEST)出货前检查(O. Q. C. )包装出货(PACKING&SHIPPING)曝光(EXPOSURE)压膜(LAMINATION)前处理(PRELIMINARY TREATMENT ) 显影(DEVELOPIG)蚀铜(ETCHING)去膜(STRIPPING)黑化处理(BLACK OXIDE)烘烤(BAKING)预叠板及叠板(LAY- UP )压合(LAMINATION)后处理(POSTTREATMENT)曝光(EXPOSURE)压膜(LAMINATION)二次铜电镀(PATTERNPLATING)锡铅电镀(T/L PLATING)去膜(STRIPPING)蚀铜(ETCHING)剥锡铅(T/L STRIPPING)涂布印刷(S/M COATING)预干燥(PRE-CURE)曝光(EXPOSURE)显影(DEVELOPING)后烘烤(POST CURE)MLB全板电镀(PANEL PLATING)铜面防氧化处理O.S.P (Entek Cu 106A) 外层制作(OUTER-LAYER)TENTING PROCESS镀金手指(G/F PLATING)镀化学镍金(E-less Ni/Au)For O. S. P.选择性镀镍镀金(SELECTIVE GOLD)印文字(SCREEN LEGEND)网版制作(STENCIL)图面(DRAWING)工作底片(WORKING A/W )制作规范(RUN CARD)程序带(PROGRAM )钻孔, 成型机(D. N. C.)底片(MASTER A/W)磁盘, 磁带(DISK , M/T)蓝图(DRAWING)资料传送(MODEM , FTP)A O I 检查(AOI INSPECTION )除胶渣(DESMER)通孔电镀(E-LESS CU)DOUBLE SIDE前处理(PRELIMINARY TREATMENT ) 全面镀镍金(S/G PLATING)雷射钻孔(LASER ABLATION)Blinded Via埋孔钻孔(I.V.H. DRILLING)埋孔钻孔(I.V.H. DRILLING)埋孔电镀(I.V.H. PLATING)埋孔电镀(I.V.H. PLATING)埋孔(Buried via)P1/136* Process Module 说明:A. 下料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling) C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)Developing , Etching & Stripping ( DES )d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask) I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 短断路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙) identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块) mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落)performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压Chamfer 斜边。

PCB专业术语

电路板术语总整理----A----A-Stage A 阶段----指胶片(Prepreg)制造过程中，其补强材料的玻纤布或棉纸，在通过胶水槽进行含浸工程时，该树脂之胶水(Varnish，也译为清漆水)，尚处于单体且被溶剂稀释的状态，称为A-Stage。

相对的当玻纤布或棉纸吸入胶水，又经热风及红外线干燥,将便树脂分子量增大为复体或寡聚物(Oligomer)，再集附于补强材上形成胶片。

此时的树脂状态称为B-Stage。

当再继续加热软化，并进一步聚合成为最后高分子树脂时，则称为C-Stage。

Abietic Acid 松脂酸----是天然松香(Rosin)的主要成份，占其重量比的34%。

在焊接的高温下，此酸能将铜面的轻微氧化物或钝化物予以清除，使得清洁铜面可与熔锡产生“接口合金共化物”(IMC)而完成焊接。

此松脂酸在常温很安定，不会腐蚀金属。

Abrasion Resistance 耐磨性----在电路板工程中，常指防焊绿漆的耐磨性。

其试验方法是以1kg重的软性砂轮，在完成绿漆的IPC-B-25样板上旋转磨刷50次，其梳型电路区不许磨破见铜(详见电路板信息杂志第54 期P.70)，即为绿漆的耐磨性。

某些规范也对金手指的耐磨性有所要求。

又，Abrasive是指磨料而言，如浮石粉即是。

ABS 树脂----是由Acrylonitrile-Butadine-Styrane(丙烯腈-丁二烯-苯乙烯)所组成的三元混合树脂，其中丁二烯之橡皮部份能被铬酸所腐蚀而出现疏孔，可做为化学铜或化学镍的着落点，因而得以继续进行电镀。

电路板上许多装配的零件，即为采购ABS镀件。

Absorption 吸收，吸入----指被吸收物会进入主体的内部，是一种化学式的吸入动作。

如光化反应中的光能吸收，或板材与绿漆对溶剂的吸入等。

另有一近似词Adsorption则是指吸附而言，只附着在主体的表面，是一种物理式的亲和吸附。

Accelerated Test (Aging) 加速老化----也就是加速老化试验(Aging)。

电路板设术语

电路板设术语1.信号完整性（Signal Integrity）：就是指电路系统中信号的质量,如果在要求的时间内,信号能不失真地从源端传送到接收端,我们就称该信号是完整的。

传输线（Transmission Line）：由两个具有一定长度的导体组成回路的连接线,我们称之为传输线,有时也被称为延迟线。

集总电路（Lumped circuit）：在一般的电路分析中,电路的所有参数,如阻抗、容抗、感抗都集中于空间的各个点上,各个元件上,各点之间的信号是瞬间传递的,这种理想化的电路模型称为集总电路。

分布式系统(Distributed System)：实际的电路情况是各种参数分布于电路所在空间的各处,当这种分散性造成的信号延迟时间与信号本身的变化时间相比已不能忽略的时侯,整个信号通道是带有电阻、电容、电感的复杂网络,这就是一个典型的分布参数系统。

上升/下降时间（Rise/Fall Time）：信号从低电平跳变为高电平所需要的时间,通常是量度上升/下降沿在10%-90%电压幅值之间的持续时间,记为Tr。

截止频率（Knee Frequency）：这是表征数字电路中集中了大部分能量的频率范围（0.5/Tr）,记为Fknee,一般认为超过这个频率的能量对数字信号的传输没有任何影响。

特征阻抗（Characteristic Impedance）：交流信号在传输线上传播中的每一步遇到不变的瞬间阻抗就被称为特征阻抗,也称为浪涌阻抗,记为Z0。

可以通过传输线上输入电压对输入电流的比率值(V/I)来表示。

传输延迟（Propagation delay）：指信号在传输线上的传播延时,与线长和信号传播速度有关,记为tPD。

微带线（Micro-Strip）：指只有一边存在参考平面的传输线。

带状线（Strip-Line）：指两边都有参考平面的传输线。

趋肤效应（Skin effect）：指当信号频率提高时,流动电荷会渐渐向传输线的边缘靠近,甚至中间将没有电流通过。

电路板术语总整理

*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验). Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收. Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜. Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光.Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号.Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火). Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线. Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr)凡液体比重比水轻则 Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值).Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射.Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板. Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 . 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Curtain Coating濂涂法.*****D***** Daisy Chained Design菊瓣设计.Datum Reference基准参考.Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位,定义9000米纱束所具有的重量(以克米计)). Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压. Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法.Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体. Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜. Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板. Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应. Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器. Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度. Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻.Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜.. Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F***** Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线.Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距. Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法. First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级. Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 , 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).Galvanic Series贾凡尼次序(电动次序). Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案). Ghost Image阴影.Gilding镀金 (现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.Glass Transition Temperature, Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H***** Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名. Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度). Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫. High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作). Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路. Hydraulic Bulge Test液压鼓起试验. Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压. Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻.Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物. Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔. Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J***** JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K***** Kapton聚亚醯胺软板.Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L***** Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构. Laminate Void板材空洞.Laminate(s)基板.Lamination Void压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像. Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管. Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度. Liquid Crystal Display (LCD)液晶显示器. Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面). Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数.Measling白点.Mechanical Stretcher机械式张网机. Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验. Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线. Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限. Minor Weave Direction次要织向. Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术.Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验. Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).Multi-Chip-Module(MCM)多芯片芯片模块. Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄. Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂. Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯. Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度.Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O***** Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜.Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.) Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂.Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P***** Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phenolic纸质酚醛树脂(板材).Parting Agent脱膜剂.Passivation钝化 ,钝化外理.Passive Device (Component)被动组件(零件) Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.Periodic Reverse (PR) Current周期性反电流. Peripheral周边附属设备. Permeability透气性,导磁率.Permittivity诱电率,透电率.pH Value酸碱值.Phase相.Phase Diagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographic film感光成像之底片. Photoinitiator感光启始剂.Photomask光罩.Photoplotter, Plotter光学绘图机. Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工.Phototool底片.Pick and Place拾取与放置.Piezoelectric压电性.Pin 插脚,插梢,插针.Pin Grid Array (PGA)矩阵式针脚对装. Pinhole针孔.Pink Ring粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.Plain Weave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.Pneumatic Stretcher气动拉伸器.Pogo Pin伸缩探针.Point 钻尖.Point Angle钻尖面.Point Source Light点状光源.Poise泊."粘滞度"单位=1dyne*sec/cm2. Polar Solvent极性溶剂.Polarity电极性.Polarization分极,极化.Polarizing Slot偏槽.Polyester Films聚酯类薄片.Polymer Thick Film (PTF)厚膜糊. Polymerization聚合.Polymide(PI)聚亚醯胺.Popcorn Effect爆米花效应.Porcelain瓷材,瓷面.Porosity Test疏孔度试验.Positive Acting Resist正性光阻剂.Post Cure后续硬化,后烤.Post Separation后期分离,事后公离.Pot Life运用期,锅中寿命.Potting铸封,模封.Power Supply电源供应器.Preform 预制品.Preheat预热.Prepreg胶片,树脂片.Press Plate钢板.Press-Fit Contact挤入式接触.Pressure Foot 压力脚.Pre-tinning预先沾锡.Primary Image线路成像.Print Through压透,过度挤压..Probe探针.Process Camera制程用照像机.Process Window操作范围.Production Master生产底片.Profile轮廓,部面图,升温曲线图棱线. Propagation传播.Propagation Delay传播延迟.Puddle Effect水坑效应.Pull Away拉离.Pulse Plating脉冲电镀法.Pumice Powder 浮石粉.Punch冲切.Purge, Purging净空,净洗.Purple Plague紫疫(金与铝的共化物层). Pyrolysis热裂解,高温分解.*****Q***** Quad Flat Pack (QFP)方扁形封装体. Qualification Agency资格认证机构. Qualification Inspection资格检验. Qualified Products List合格产品(供应者)名单.Qualitative Analysis定性分析.Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板).Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*****R***** Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference (RFI)射频干扰. Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压.Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮(盘)式操作.Reference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合. Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂.Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶(糊)渣.Resin Starve Area缺胶区,树脂缺乏区. Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析(像)力,分辨力. Reverse Current Cleaning反电流(电解)清洗. Reverse Etchback反回蚀.Reverse Image负片影像(阻剂).Reverse Osmosis (RO)反(逆渗透). Reversion反转,还原.Revision修正版.改订版.Rework(ing)重工,再加工.Rhology流变学,流变性质.Ribbon Cable圆线缆带.Rigid-Flex Printed Board硬软合板.Ring 套环.Rinsing水洗,冲洗.Ripple纹波(指整流器所输出电流中不稳定成分).Rise Time上升时间.Roadmap 线路与零件之布局图.Robber辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*****S***** Sacrificial Protection牺牲性保护层. Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验. Schemetic Diagram电路概略图.ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷.Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程.Semi-Conductor半导体.Sensitizing敏化. Separable Component Part可分离式零件. Separator Plate隔板, 钢板.Sequential Lamination接续性压合法. Sequestering Agent螯合剂.Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma (Standard Deviation)标准差.Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.Silver Migration银迁移.Silver Paste 银膏.Single-In-Line Package(SIP)单边插脚封装体. Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应 (高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀. Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃(铅玻璃).Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法. Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking(S/M)防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞(柱).Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应. Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油.Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样.Spectrophotometry分光光度计检测法. Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计. Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻. Surface Mount Device 表面粘装组件. Surface Mounting Technology (SMT)表面粘装技术.Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂. Swimming 线路滑离.Synthetic Resin合成树脂.*****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合. Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数.Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合. Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法. Thermogravimetric Analysis, (TGA)热重分析法.Thermomechanical Analysis (TMA)热机分析法. Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合. Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器. Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体. Threshold Limit Value (TLV)极限值. Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路. Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子. Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体.*****U*****UL Symbol(UL.为Under-Writers 保俭业试验所标志.Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度.Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化. Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接. Unbalanced Transmission Line非平衡式传输线.Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机. Unsupported Hole非镀通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V***** Vacuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法.Vacuum Lamination真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器.Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.Void 破洞,空洞.Volatile Content挥发份含量.Voltage电压.Voltage Breakdown崩溃电压.Voltage Drop 电压降落.Voltage Efficiency电压效率.Voltage Plane电压层.Voltage Plane Clearance电压层的空环. Volume Resistivity体绩电阻率.Volume Resistivity体绩电阻率.Volumetric Analysis容量分析法. Vulcanization交联,硫化.*****W***** Wafer晶圆.Waive暂准过关,暂不检查.Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理.Water Absorption吸水性.Water Break水膜破散,水破.Water Mark水印.Watt瓦特.Watts Bath瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊.Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure织纹显露.Weave Texture织纹隐现.Web蹼部.Wedge Bond 楔形结合点.Wedge Void楔形缺口(破口).Weft Yarn纬纱.Welding熔接.Wet Blasting湿喷砂.Wet Lamination湿压膜法.Wet Process湿式制程.Wetting Agent润湿剂.Wetting Balance沾锡天平.Wetting Balance沾锡,沾湿.Whirl Brush旋涡式磨刷法.Whirl Coating旋涡涂布法.Whisker晶须.White Residue白色残渣.White Spot白点.Wicking灯蕊效应.Window操作范围,传动齿孔.Wiping Action 滑动接触(导电).Wire Bonding打线结合.Wire Gauge线规.Wire Lead金属线脚.Wire Pattern布线图形.Wire Wrap绕线互连.Working Master工作母片.Working Time (Life)堪用时间. Workmanship 手艺,工艺水平,制作水准.Woven Cable扁平编线.Wrinkle皱折, 皱纹.Wrought Foil锻碾金属箔.*****X*****X AxisX轴.X-Ray X光.X-Ray FluorescenceX萤光.*****Y*****Yarn纱线.Y-AxisY轴.Yield良品率,良率,产率.Yield Point屈服点.*****Z*****Z-AxisZ轴.Zero Centering中心不变(叠合法).Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.=====================================================[分享]PCB专业英译术语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制组件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printedboard(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board。

电路板术语总整理1

電路東術語總整理----A----A-Stage A 階段----指膠片(Prepreg)製造過程中，其補強材料的玻纖布或棉紙，在通過膠水槽進行含浸工程時，該樹脂之膠水(Varnish，也譯為清漆水)，尚處於單體且被溶劑稀釋的狀態，稱為A-Stage。

相對的當玻纖布或棉紙吸入膠水，又經熱風及紅外線乾燥,將便樹脂分子量增大為複體或寡聚物(Oligomer)，再集附於補強材上形成膠片。

此時的樹脂狀態稱為B-Stage。

當再繼續函熱軟化，並進一步聚合成為最後高分子樹脂時，則稱為C-Stage。

Abietic Acid 松脂酸----是天然松香(Rosin)的主要成份，占其重量比的34%。

在焊接的高溫下，此酸能將銅面的輕微氧化物或鈍化物予以清除，使得清潔銅面可與熔錫產生“介面合金共化物”(IMC)而完成焊接。

此松脂酸在常溫很安定，不會腐蝕金屬。

Abrasion Resistance 耐磨性----在電路東工程中，常指防焊綠漆的耐磨性。

其詴驗方法是以1kg重的軟性砂輪，在完成綠漆的IPC-B-25樣東上旋轉磨刷50次，其梳型電路區不許磨破見銅(詳見電路東資訊雜誌第54期P.70)，即為綠漆的耐磨性。

某些規範也對金手指的耐磨性有所要求。

又，Abrasive是指磨料而言，如浮石粉即是。

ABS 樹脂----是由Acrylonitrile-Butadine-Styrane(丙烯腈-丁二烯-苯乙烯)所組成的三元混合樹脂，其中丁二烯之橡皮部份能被鉻酸所腐蝕而出現疏孔，可做為化學銅或化學鎳的著落點，因而得以繼續進行電鍍。

電路東上許多裝配的零伔，即為採購ABS鍍伔。

Absorption 吸收，吸入----指被吸收物會進入主體的內部，是一種化學式的吸入動作。

如光化反應中的光能吸收，或東材與綠漆對溶劑的吸入等。

另有一近似詞Adsorption則是指吸附而言，只附著在主體的表面，是一種物理式的親和吸附。

A ccelerated Test (Aging) 函速老化----也就是函速老化詴驗(Aging)。

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電路板術語總整理*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(試驗). Acceleration速化反應.Accelerator 加速劑,速化劑.Acceptability,Acceptance 允收性,允收. Access Hole露出孔,穿露孔.Accuracy準確度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像顯微鏡. Acrylic壓克力(聚丙烯酸樹脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進劑.Adhesive膠類或接著劑.Admittance導納(阻抗的倒數).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.Air Inclusion氣泡夾雜.Air Knife風刀.Algorithm演算法.Aliphatic Solvent脂肪族溶劑.Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環境溫度.Amorphous無定形,非晶形.Amp-Hour安培小時.Analog Circuit/Analog Signal類比電路/類比訊號. Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal 韌化(退火).Annular Ring孔環.Anode陽極.Anode Sludge陽極泥.Anodizing陽極化.ANSI美國標準協會.Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動光學檢驗.Apertures開口,鋼版開口.AQL品質允收水準.AQL(Acceptable Quality Level)允收品質水準. Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途績體電路器.Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動電測設備.Attenuation訊號衰減.Autoclave壓力鍋.Axial-lead軸心引腳.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反錐斜角.Backpanels, Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳陣列(封裝).Bandability彎曲性.Banking Agent護岸劑.Bare Chip Assembly裸體晶片組裝.Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液體比重比水重則Be=145-(145÷Sp.Gr) 凡液體比重比水輕則Be=140÷(Sp.Gr-130)*Sp.Gr 為比重即同體績物質對"純水"1g/cm的比值). Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil]雙階式鋼板.Binder粘結劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分層或起泡.Block Diagram電路系統塊圖.Blockout封綱.Blotting幹印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight彈標.Bond Strength結合強度.Bondability結合性.Bonding Layer結合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結合線.Bow, Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425℃~870℃下進行熔接的方式). Break Point顯像點.Break-away Panel可斷開板. Breakdown V oltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stageB階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process击塊制程.Buoyancy浮力.Buried Via Hole埋導孔.Burn-in高溫加速老化試驗.Burning燒焦.Burr毛頭.Bus Bar匯電杆.Butter Coat 外表樹脂層.*****C***** C4 Chip JointC4晶片焊接.Cable電纜.CAD電腦輔助設計.Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法. Capacitance電容.Capacitive Coupling電容耦合.Capillary Action毛細作??.Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment, Active活化炭處理.Card卡板.Card Cages/Card Racks電路板構裝箱. Carlson Pin卡氏定位稍.Carrier載體.Cartridge濾心.Castallation堡型績體電路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode陰極.Cation陰向離子, 陽離子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心間距. Ceramics陶瓷.Cermet陶金粉.Certificate證明書.CFC氟氫碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學研磨.Chemical Resistance抗化性.Chemisorption化學吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG).Chisel鑽針的尖部.Chlorinated Solvent含氯溶劑,氯化溶劑. Circumferential Separation環狀斷孔.Clad/Cladding披覆.Clean Room無塵室.Cleanliness清潔度.Clearance餘地,餘環.Clinched Lead Terminal緊箝式引腳.Clinched-wire Through Connection通孔彎線連接法. Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線.Coefficient of Thermal Expansion熱膨脹係數.Co-Firing共繞.Cold Flow冷流.Cold Solder Joint冷焊點.Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Composites,(CEM-1,CEM-3)複合板材. Condensation Soldering凝熱焊接,液化放熱焊接. Conditioning整孔.Conductance導電.Conductive Salt導電鹽.Conductivity導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity吻合性, 服貼性.Connector連接器.Contact Angle接觸角.Contact Area接觸區.Contact Resistance接觸電阻.Continuity連通性.Contract Service協力廠,分包廠.Controlled Depth Drilling定深鑽孔.Conversion Coating 轉化皮膜.Coplanarity共面性.Copolymer共聚物.Copper Foil銅皮.Copper Mirror Test銅鏡試驗.Copper Paste銅膏.Copper-Invar-Copper (CIC)綜合夾心板. Core Material內層板材,核材.Corner Crack 通孔斷角.Corner Mark板角標記.Counterboring方型擴孔. Countersinking錐型擴孔.Coupling Agent 偶合劑.Coupon, Test Coupon板邊試樣. Coverlay/Covercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.Crossection Area截面積.Crosshatch Testing十字割痕試驗. Crosshatching十字交叉區. Crosslinking, Crosslinkage交聯,架橋. Crossover越交,搭交.Crosstalk雜訊, 串訊.Crystalline Melting Point晶體熔點.C-Stage C階段.Cure硬化,熟化.Current Density電流密度.Current-Carrying Capability載流能力. Curtain Coating濂塗法.*****D***** Daisy Chained Design菊瓣設計.Datum Reference基準參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水. Delamination分離.Dendritic Growth 枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單位,定義9000米紗束所具有的重量(以克米計)).Densitomer透光度計.Dent凹陷.Deposition 皮膜處理.Desiccator乾燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像.Deviation偏差.Device電子元件.Dewetting縮錫.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重鉻酸鹽.Dicing晶片分割.Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping衝壓.Dielectric 介質.Dielectric Breakdown V oltage介質崩潰電壓.Dielectric Constant介質常數.Dielectric Strength介質強度.Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法. Diffusion Layer擴散層.Digitizing數位化.Dihedral Angle雙反斜角.Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體.Dipole偶極,雙極.Direct / Indirect Stencil直接/間接版膜.Direct Emulsion直接乳膠.Direct Plating直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,複綫板. Dish Down碟型下陷.Dispersant分散劑.Dissipation Factor散失因素.Disspation Factor散逸因數.Disturbed Joint受擾焊點.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔.Drag In / Drag Out帶[進/帶出.Drag Soldering拖焊.Drawbridging吊橋效應.Drift漂移.Drill Facet鑽尖切削麵.Drill Pointer鑽針重磨機.Drilled Blank已鑽孔的裸板.Dross浮渣.Drum Side銅箔光面.Dry Film幹膜.Dual Wave Soldering 雙波焊接.Ductility展性.Dummy Land假焊墊.Dummy, Dummying假鍍(片).Durometer橡膠硬度計.DYCOstrate電漿蝕孔增層法.Dynamic Flex(FPC)動態軟板.*****E*****E-Beam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Connector板邊(金手指)承接器. Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測試.EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級玻璃.Elastomer彈性體.Electric Strength(耐)電性強度. Electrodeposition電鍍.Electro-deposition Photoresist電著光阻, 電泳光阻. Electroforming電鑄.Electroless-Deposition無電鍍.Electrolytic Tough Pitch電解銅..Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動, 電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation 延伸性, 延伸率.Embossing击出性壓花.EMF(Electromotive Force)電動勢.EMI(Electromagnetic Interference)電磁干擾. Emulsion乳化.Emulsion Side藥膜面.Encapsulating膠囊.Encroachment沾汙,侵犯.End Tap封頭.Entek有機護銅處理.Entrapment夾雜物.Entry Material蓋板.Epoxy Resin環氧樹脂.Etch Factor蝕刻因數.Etchant蝕刻劑(液).Etchback回蝕.Etching Indicator蝕刻指針.Etching Resist蝕刻阻劑.Eutetic Composition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.*****F*****Fabric綱布.Face Bonding反面朝下結合.Failure故障.Fan Out Wiring/Fan In Wiring扇出佈線/扇入佈線. Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強度.Fault缺陷.Fault Plane斷層面.Feed Through Hole導通孔.Feeder 進料器.Fiber Exposure玻纖顯露.Fiducial Mark基準記號.Filament纖絲.Fill緯向.Filler填充料.Fillet內圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter篩檢程式.Fine Line細線.Fine Pitch密腳距,密線距,密墊距.Fineness粒度, 純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法.First Article首產品.First Pass-Yield初檢良品率.Fixture夾具.Flair刃角變形.Flame Point自燃點.Flame Resistant耐燃性.Flammability Rate燃性等級.Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡.Flat Cable扁平排線.Flat Pack扁平封裝(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)軟板.Flexural Failure撓曲損壞.Flexural Module彎曲模數, 抗撓性模數. Flexural Strength抗撓強度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨衝程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence螢光.Flurocarbon Resin碳氟樹脂.Flush Conductor嵌入式線路, 貼平式導體. Flush Point閃火點.Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(幹膜殘餘物).Foot Print (Land Pattern)腳墊.Foreign Material 外來物,異物.Form-to-List佈線說明清單.Four Point Twisting四點扭曲法.Free Radical自由基.Freeboard幹舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗黴性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由連續玻纖所織成的玻纖布與環氧樹脂粘結劑所複合成的材料.Gage, Gauge量規.Gallium Arsenide (GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕). Galvanic Series賈凡尼次序(電動次序).Galvanizing鍍鋅.GAP第一面分離,長刃斷開.Gate Array閘列,閘極陣列.Gel Time膠化時間.Gelation Particle膠凝點.Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線路圖形與孔位元,所發展一系列完整的軟體檔案).Ghost Image陰影.Gilding鍍金(現為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging, Groove玻纖突出/挖破.Glass Transition Temperature, Tg玻璃態轉化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測試法.Glycol (Ethylene Glycol)乙二醇.Golden Board測試用標準板.Grain Size結晶粒度.Grass Leak 大漏.Grid標準格.Ground Plane /Earth Plane接地層.Ground Plane Clearance接地空環.Guide Pin導針.Gull /Wing Lead鷗翼引腳.*****H*****Halation環暈.Half Angle半形.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名.Hard Anodizing硬陽極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Hardener (Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空氣塵粒過瀘機. Hipot Test 高壓電測.Hi-Rel高度靠度.Hit 擊(鑽孔時鑽針每一次"刺下"的動作).Holding Time停置時間.Hole Breakout孔位破出.Hole Counter數孔機.Hole Density孔數密度.Hole Preparation通孔準備.Hole Pull Strength孔壁強度.Hole V oid破洞.Hook 切削刀緣外击.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風手焊.HTE(High Temperature Elongation)高溫延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗.Hydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸濕性.Hypersorption超吸咐.*****I*****I.C. Socket績體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉移.Immersion Plating浸鍍.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing組裝板電測.Inclusion異物,夾雜物.Indexing Hole基準孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert, Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)績體電路器.Inter Face介面.Interconnection互連.Intermetallic Compound (IMC)介面共化物.Internal Stress內應力.Interposer互邊導電物.Interstitial Via-Hole(IVH)局部層間導通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization游離,電離.Ionization V oltage (Corona Level)電離化電壓(電纜內部狹縫空氣中,引起其電離所施加之最小電壓).IPC美國印刷電路板協會.Isolation隔離性,隔絕性.*****J*****JEDEC(Joint Electronic Device 聯合電子元件工程委員會. Engineering Council)J-LeadJ型接腳.Job Shop專業工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時供應,及時出現.*****K*****Kapton聚亞醯胺軟板.Karat克拉(1克拉(鑽石)=0.2g 純金則24k金為100%的鈍金.Kauri-Butanol Value考立丁醇值(簡稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤.Kiss Pressure吻壓, 低壓.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結構.Laminate V oid板材空洞.Laminate(s)基板.Lamination V oid壓合空洞.Laminator壓膜機.Land孔環焊墊,表面焊墊.Landless Hole無環通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光機. Laser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out佈線,佈局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出.Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標記.Leveling整平.Lifted Land孔環(焊墊)浮起.Ligand錯離子附屬體.Light Emitting Diodes (LED)發光二極體.Light Integrator光能累積器.Light Intensity光強度.Limiting Current Density極限電流密度.Liquid Crystal Display (LCD)液晶顯示器.Liquid Dielectrics液態介質.Liquid Photoimagible Solder Mask, (LPSM)液態感光防焊綠漆. Local Area Network區域性網路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent (TanδDK)損失正切.Lot Size批量.Luminance發光強度.Lyophilic親水性膠體.*****M*****Macro-Throwing Power巨觀分佈力.Major Defect主要(嚴重)缺點.Major Weave Direction主要織向.Margin刃帶(鑽頭尖部).Marking標記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport品質輸送.Master Drawing主圖.Mat席(用於CEM-3(Composite Epoxy Material)的複合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).Mealing泡點.Mean Time To Failure (MTTF)故障前可用之平均時數. Measling白點.Mechanical Stretcher機械式張網機.Mechanical Warp機械式纏繞.Mechanism機理.Membrane Switch薄膜開關.Meniscograph Test弧面狀沾錫試驗.Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數.Metal Halide Lamp 金屬鹵素燈.Metallization金屬化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-electronios微電子.Microetching微蝕.Microsectioning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線.Microthrowing Power微分布力.Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向.Misregistration 對不准度.Mixed Componmt Mounting Technology混合零件之組裝技術. Modem調變及解調器.Modification修改.Module模組.Modulus of Elasticity彈性係數.Moisture and Insulation Resistance Test濕氣與絕緣電阻試驗. Mold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機板,母板.Moulded Circuit模造立體電路機.Mounting Hole安裝孔.Mounting Hole組裝孔,機裝孔.Mouse Bite鼠齒(蝕刻後線路邊緣出現不規則缺口). Multi-Chip-Module(MCM)多晶片晶片模組. Multiwiring Board (or Discrete Wiring Board)複綫板.*****N*****N.C.數值控制.Nail Head釘頭.Near IR近紅外線.Negative負片,鑽尖的第一面外緣變窄.Negative Etch-back反回蝕.Negative Stencil負性感光膜.Negative-Acting Resist負性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環.Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.Noble Metal Paste貴金屬印膏.Node節點.Nodule節瘤.Nomencleature標示文字符號.Nominal Cured Thickness標示厚度.Non-Circular Land非圓形孔環焊墊.Non-flammable非燃性.Non-wetting不沾錫.Normal Concentration (Strength)標準濃度,當量濃度. Normal Distribution常態分佈.Novolac酯醛樹脂.Nucleation , Nucleating核化.Numerical Control數值控制.Nylon尼龍.*****O***** Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)無氧高導電銅. Ohm歐姆.Oilcanning蓋板彈動.OLB(Outer Lead Bond)外引腳結合.Oligomer寡聚物.Omega Meter離子污染檢測儀.Omega Wave振盪波.On-Contact Printing密貼式印刷.Opaquer不透明劑,遮光劑.Open Circuits斷線.Optical Comparater光學對比器(光學放大器.) Optical Density光密度.Optical Inspection光學檢驗.Optical Instrument光學儀器.Organic Solderability Preservatives (OSP)有機保焊劑. Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側出.Output產出,輸出.Overflow溢流.Overhang總懸空.Overlap 鑽尖點分離.Overpotantial(Over voltage)過電位,過電壓. Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*****P***** Packaging封裝,構裝.Pad焊墊,圓墊.Pad Master圓墊底片.Pads Only Board唯墊板.Palladium鈀.Panel制程板.Panel Plating全板鍍銅.Panel Process全板電鍍法.Paper Phenolic紙質酚醛樹脂(板材).Parting Agent脫膜劑.Passivation鈍化,鈍化外理.Passive Device (Component)被動元件(零件)Paste膏,糊.Pattern板面圖形.Pattern Plating線路電鍍.Pattern Process線路電鍍法.Peak V oltage峰值電壓.Peel Strength抗撕強度.Periodic Reverse (PR) Current週期性反電流.Peripheral周邊附屬設備.Permeability透氣性,導磁率.Permittivity誘電率,透電率.pH Value酸堿值.Phase相.Phase Diagram相圖.Phenolic酚醛樹脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光啟始劑.Photomask光罩.Photoplotter, Plotter光學繪圖機.Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化學(銑刻)加工. Phototool底片.Pick and Place拾取與放置.Piezoelectric壓電性.Pin 插腳,插梢,插針.Pin Grid Array (PGA)矩陣式針腳對裝.Pinhole針孔.Pink Ring粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點.Plain Weave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.Plated Through Hole鍍通孔.Platen熱盤.Plating鍍.Plotting標繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.Pneumatic Stretcher氣動拉伸器.Pogo Pin伸縮探針.Point 鑽尖.Point Angle鑽尖面.Point Source Light點狀光源.Poise泊."粘滯度"單位=1dyne*sec/cm2. Polar Solvent極性溶劑.Polarity電極性.Polarization分極,極化.Polarizing Slot偏槽.Polyester Films聚酯類薄片.Polymer Thick Film (PTF)厚膜糊. Polymerization聚合.Polymide(PI)聚亞醯胺.Popcorn Effect爆米花效應. Porcelain瓷材,瓷面.Porosity Test疏孔度試驗.Positive Acting Resist正性光阻劑. Post Cure後續硬化,後烤.Post Separation後期分離,事後公離. Pot Life運用期,鍋中壽命.Potting鑄封,模封.Power Supply電源供應器.Preform 預製品.Preheat預熱.Prepreg膠片,樹脂片.Press Plate鋼板.Press-Fit Contact擠入式接觸. Pressure Foot 壓力腳.Pre-tinning預先沾錫.Primary Image線路成像.Print Through壓透,過度擠壓..Probe探針.Process Camera制程用照像機. Process Window操作範圍. Production Master生產底片.Profile輪廓,部面圖,升溫曲線圖棱線. Propagation傳播.Propagation Delay傳播延遲.Puddle Effect水坑效應.Pull Away拉離.Pulse Plating脈衝電鍍法.Pumice Powder 浮石粉.Punch沖切.Purge, Purging淨空,淨洗.Purple Plague紫疫(金與鋁的共化物層).Pyrolysis熱裂解,高溫分解.*****Q*****Quad Flat Pack (QFP)方扁形封裝體.Qualification Agency資格認證機構.Qualification Inspection資格檢驗.Qualified Products List合格產品(供應者)名單.Qualitative Analysis定性分析.Quality Conformance Test Circuitry (Coupon)品質符合之試驗線路(樣板). Quantitative Analysis定量分析.Quench 淬火,驟冷.Quick Disconnect快速接頭.Quill緯紗繞軸.*****R*****Rack 掛架.Radial Lead放射狀引腳.Radio Frequency Interference (RFI)射頻干擾.Rake Angle摳角,耙角.Rated Temperature, V oltage額定溫度,額定電壓.Reactance電抗.Real Estate底材面,基板面.Real Time System 即時系統.Reclaiming再生,再制.Rediometer輻射計,光度計.Reel to Reel卷輪(盤)式操作.Reference Dimension參考尺度.Reference Edge參考邊緣.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark對準用標記.Registration對準度.Reinforcement補強物.Rejection剔退,拒收.Relamination(Re-Lam)多層板壓合.Relaxation鬆弛.緩和.Relay繼電器.Release Agent, Release Sheets脫模劑,離模劑. Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背膠銅箔.Resin Content膠含量,樹脂含量.Resin Flow膠流量,樹脂流量.Resin Recession樹脂下陷.Resin Rich Area 多膠區,樹脂豐富區.Resin Smear膠(糊)渣.Resin Starve Area缺膠區,樹脂缺乏區.Resist阻膜,阻劑.Resistivity電阻係數,電阻率.Resistor電阻器,電阻.Resistor Drift電阻漂移.Resistor Paste電阻印膏.Resolution解像,解像度,解析度.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反電流(電解)清洗. Reverse Etchback反回蝕.Reverse Image負片影像(阻劑).Reverse Osmosis (RO)反(逆滲透).Reversion反轉,還原.Revision修正版.改訂版.Rework(ing)重工,再加工.Rhology流變學,流變性質.Ribbon Cable圓線纜帶.Rigid-Flex Printed Board硬軟合板.Ring 套環.Rinsing水洗,沖洗.Ripple紋波(指整流器所輸出電流中不穩定成分).Rise Time上升時間.Roadmap 線路與零件之佈局圖.Robber輔助陰極.Roller Coating輥輪塗布.Roller Coating滾動塗布法.Roller Cutter輥切機.Roller Tinning輥錫法,滾錫法.Rosin松香.Rotary Dip Test擺動沾錫試驗.Routing切外型.Runout偏轉,累績距差.Rupture迸裂.*****S***** Sacrificial Protection犧牲性保護層.Salt Spray Test鹽霧試驗.Sand Blast噴砂.Saponification皂化作用.Saponifier皂化劑.Satin Finish緞面處理.Scaled Flow Test比例流量實驗. Schemetic Diagram電路概略圖. ScoringV型刻槽.Scratch刮痕.Screen Printing綱版印刷.Screenability綱印能力.Scrubber磨刷機,磨刷器.Scum透明殘膜.Sealing封孔.Secondary Side第二面.Seeding下種.Selective Plating選擇性電鍍.Self-Extinguishing自熄性.Selvage布邊.Semi-Additive Process半加成制程.Semi-Conductor半導體.Sensitizing敏化.Separable Component Part可分離式零件. Separator Plate隔板, 鋼板.Sequential Lamination接續性壓合法.Sequestering Agent螯合劑.Shadowing陰影,回蝕死角.Shank鑽針柄部.Shear Strength 抗剪強度.Shelf Life儲齡.Shield遮蔽.Shore Hardness蕭氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall側壁.Siemens電阻值.Sigma (Standard Deviation)標準差.Signal訊號.Silane矽烷.Silica Gel矽膠砂.Silicon矽.Silicone矽銅.Silk Screen綱版印刷,絲綱印刷.Silver Migration銀遷移.Silver Paste 銀膏.Single-In-Line Package(SIP)單邊插腳封裝體.Sintering燒結.Sizing上膠,上漿.Sizing上漿處理.Skin Effect集膚效應(高頻下,電流在傳遞時多集中在導體表面,使得道線內部通過電流甚少, 造成內部導體浪費,並也使得表面導體部分電阻升高.Skip Printing, Skip Plating漏印,漏鍍.Skip Solder 缺錫, 漏焊.Slashing漿經.Sleeve Jint套接.Sliver邊絲,邊餘.Slot, Slotting槽口.Sludge於泥.Slump塌散.Slurry稠漿,懸浮漿.Small Hole小孔.Smear膠渣.Smudging錫點沾汙.Snap-off彈回高度.Socket插座.Soft Contact輕觸.Soft Glass 軟質玻璃(鉛玻璃).Solder焊錫.Solder Ball錫球.Solder Bridging錫橋.Solder Bump 焊錫击塊.Solder Column Package錫柱腳封裝法. Solder Connection焊接.Solder Cost焊錫著層.Solder Dam錫堤.Solder Fillet填錫.Solder Levelling噴錫,熱風整平.Solder Masking(S/M)防焊膜綠漆.Solder Paste錫膏.Solder Plug錫塞(柱).Solder Preforms預焊料.Solder Projection焊錫突點.Solder Sag 焊錫垂流物.Solder Side焊錫面.Solder Spatter濺錫.Solder Splash賤錫.Solder Spread Test散錫試驗.Solder Webbing錫綱.Solder Webbing錫綱.Solder Wicking滲錫,焊錫之燈芯效應. Solderability可焊性.Soldering軟焊,焊接.Soldering Fluid, Soldering Oil助焊液,護焊油. Solid Content固體含量,固形分.Solidus Line固相線.Spacing間距.Span跨距.Spark Over閃絡.Specific Heat 比熱.Specification (Spec)規範,規格.Specimen樣品,試樣.Spectrophotometry分光光度計檢測法.Spindle主軸,鑽軸.Spinning Coating自轉塗布.Splay斜鑽孔.Spray Coating噴著塗裝.Spur底片圖形邊緣突出.Sputtering濺射.Squeege刮刀.Stagger Grid蹣跚格點.Stalagometer滴管式表面張力計.Stand-off Terminals直立型端子.Starvation缺膠.Static Eliminator靜電消除器.Steel Rule Die(鋼)刀模.Stencil版膜.Step and Repeat逐次重複曝光.Step Plating梯階式鍍層.Step Tablet階段式曝光表.Stiffener補強條(板).Stop Off防鍍膜, 阻劑.Strain變形,應變.Strand絞(指由許多股單絲集束並旋扭而成的絲束).Stray Current迷走電流, 散雜電流(在電鍍槽系統中,其直流電由整流器所提供,應在陽極板與被鍍件之間的匯電杆與槽體液體中流通,但有時少部分電流也可能會從槽體本身或加熱器上迷走,漏失).Stress Corrosion應力腐蝕.Stress Relief消除應力.Strike預鍍.Stringing拖尾.Stripline條線.Stripper剝除液(器).Substractive Process減成法.Substrate底材.Supper Solder超級焊錫.Supported Hole(金屬)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面絕緣電阻. Surface Mount Device 表面粘裝元件.Surface Mounting Technology (SMT)表面粘裝技術. Surface Resistivity表面電阻率.Surface Speed鑽針表面速度.Surface Tension表面張力.Surfactant表面潤濕劑.Surge突流,突壓.Swaged Lead壓扁式引腳.Swelling Agents, Sweller膨松劑.Swimming 線路滑離.Synthetic Resin合成樹脂.*****T*****Tab接點,金手指.Taber Abraser泰伯磨試器.Tackiness粘著性, 粘手性.Tape Automatic Bonding (TAB)卷帶自動結合. Tape Casting 帶狀鑄材.Tape Test撕膠帶試驗.Tape Up Master原始手貼片.Taped Components卷帶式連載組件.Taper Pin Gauge錐狀孔規.Tarnish汙化.Tarnish 汙化, 汙著.Teflon鐵氟龍(聚4氟乙烯).Telegraphing浮印,隱印.Temperature Profile溫度曲線.Template範本.Tensile Strength抗拉強度.Tensiomenter張力計.Tenting蓋孔法.Terminal端子.Terminal Clearance端子空環.Tetra-Etch氟樹脂蝕粗劑.Tetrafunctional Resin四功能樹脂.Thermal Coefficient of Expansion (TCE)熱膨脹係數.Thermal Conductivity導熱率.Thermal Cycling熱迴圈,熱震盪.Thermal Mismstch感熱失諧.Thermal Relief散熱式鏤空.Thermal Via導熱孔.Thermal Zone感熱區.Thermocompression Bonding熱壓結合.Thermocouple熱電偶.Thermode發熱體.Thermode Soldering熱模焊接法.Thermogravimetric Analysis, (TGA)熱重分析法. Thermomechanical Analysis (TMA)熱機分析法. Thermoplastic熱塑性.Thermosetting熱固性.Thermosonic Bonding熱超音波結合.Thermount聚醯胺短纖席材.Thermo-Via導熱孔.Thick Film Circuit厚膜電路.Thief輔助陽極.Thin Copper Foil薄銅箔.Thin Core薄基板.Thin Film Technology薄膜技術.Thin Small Outline Package(TSOP)薄小型績體電路器. Thinner調薄劑.Thixotropy抗垂流性,搖變性.Three Point Bending三點壓彎試驗.Three-Layer Carrier三層式載體.Threshold Limit Value (TLV)極限值.Through Hole Mounting通孔插裝.Through Put物流量,物料通過量.Throwing Power分佈力.Tie Bar分流條.Tin Drift錫量漂飄失.Tin Immersion浸鍍錫.Tin Pest錫疫(常見白色金屬錫為"β錫",當溫度低於13.2℃時則β錫將逐漸轉變成粉末狀灰色"α錫"稱為"錫疫". Tin Whishers錫須.Tinning熱沾焊錫.Tolerance公差.Tombstoning墓碑效應.Tooling Feature工具標示物.Topography表面地形.Torsion Strength抗扭強度.Touch Up觸修,簡修.Trace 線路,導線.Traceability追溯性,可溯性.Transducer轉能器.Transfer Bump移用式突塊.Transfer Laminatied Circuit轉壓式線路.Transfer Soldering移焊法.Transistor電晶體.Translucency半透性.Transmission Line傳輸線.Transmittance透光率.Treament, Treating含浸處理.Treeing枝狀鍍物,鍍須.Trim修整, 精修.Trim Line裁切線.Trimming修整,修邊.True Position真位.Tungsten鎢Tungsten Carbide碳化鎢.Turnkey System包辦式系統.Turret Solder Terminal塔立式焊接端子.Twill Weave斜織法.Twist板扭.Two Layer Carrier兩層式載體.*****U*****UL Symbol(UL.為Under-Writers 保儉業試驗所標誌.Laboratories,INC)Ultimate Tensile Strength (UTS)極限抗拉強度.Ultra High Frequency (UHF)超高頻率.Ultra Violet Curing (UV Curing)紫外線硬化. Ultrasonic Bonding超音波結合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式傳輸線. Undercut, Undercutting側蝕.Underplate底鍍層.Universal Tester汛用型電測機.Unsupported Hole非鍍通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V***** Vacuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸鍍法. Vacuum Lamination真空壓合.Van Der Waals Force凡得華力.Vapor Blasting蒸汽噴砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering氣相焊接.Varnish凡力水,清漆(樹脂之液態單體).V-cutV型切槽.Very Large-Scale Integration(VLSI)極大績體電路器. Via Hole 導通孔.Vickers Hardness維氏硬度.Viscosity粘滯度,粘度.Vision Systems視覺系統.Visual Examination目視檢驗.V oid 破洞,空洞.V olatile Content揮發份含量.V oltage電壓.V oltage Breakdown崩潰電壓.V oltage Drop 電壓降落.V oltage Efficiency電壓效率.V oltage Plane電壓層.V oltage Plane Clearance電壓層的空環.V olume Resistivity體績電阻率.V olume Resistivity體績電阻率.V olumetric Analysis容量分析法.Vulcanization交聯,硫化.*****W*****Wafer晶圓.Waive暫准過關,暫不檢查.Warp Size 漿經處理.Warp, Warpage板彎.Washer墊圈.Waste Treatment廢棄處理. Water Absorption吸水性. Water Break水膜破散,水破. Water Mark浮水印.Watt瓦特.Watts Bath瓦茲鍍鎳液.Wave Guide導波管.Wave Soldering波焊. Waviness 波紋,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure織紋顯露. Weave Texture織紋隱現.Web蹼部.Wedge Bond 楔形結合點. Wedge V oid楔形缺口(破口). Weft Yarn緯紗.Welding熔接.Wet Blasting濕噴砂.Wet Lamination濕壓膜法.Wet Process濕式制程. Wetting Agent潤濕劑. Wetting Balance沾錫天平. Wetting Balance沾錫,沾濕. Whirl Brush旋渦式磨刷法. Whirl Coating旋渦塗布法. Whisker晶須.White Residue白色殘渣. White Spot白點.Wicking燈蕊效應.Window操作範圍,傳動齒孔. Wiping Action 滑動接觸(導電). Wire Bonding打線結合.Wire Gauge線規.Wire Lead金屬線腳.Wire Pattern佈線圖形.Wire Wrap繞線互連.Working Master工作母片.Working Time (Life)堪用時間.Workmanship 手藝,工藝水準,製作水準.Woven Cable扁平編線.Wrinkle皺折, 皺紋.Wrought Foil鍛碾金屬箔.*****X*****X AxisX軸.X-Ray X光.X-Ray FluorescenceX螢光.*****Y*****Yarn紗線.Y-AxisY軸.Yield良品率,良率,產率.Yield Point屈服點.*****Z*****Z-AxisZ軸.Zero Centering中心不變(疊合法).Zig-Zag In-Line Package (ZIP)煉齒狀雙排腳封裝件.===================================================== [分享]PCB專業英譯術語一、綜合辭彙1、印製電路：printed circuit2、印製線路：printed wiring3、印製板：printed board4、印製板電路：printed circuit board (PCB)5、印製線路板：printed wiring board(PWB)6、印製元件：printed component7、印製接點：printed contact8、印製板裝配：printed board assembly9、板：board10、單面印製板：single-sided printed board(SSB)11、雙面印製板：double-sided printed board(DSB)12、多層印製板：mulitlayer printed board(MLB)13、多層印製電路板：mulitlayer printed circuit board。