SnAg3.0Cu0.5锡膏物性规格书

一.锡膏规格如下/SPCIFICATION
测试项目/Item
规格值/Specification 测试方法/Test method
外观/Physical state
平滑膏状/Smooth paste
焊剂成份/Flux
content (wt%)
12.0±0.5 IPC-TM-650 粘度/Viscosity（25℃，Malcon sensor, 10rpm Pa.s ） 160±30
JIS-Z-3197
粒径与形状/Grain size and shade (μm) 25-45/球形/sphericity IPC-TM-650
合金规格/Alloy type
Sn96.5Ag3.0Cu0.5 铜镜测试/Copper mirror test
PASS IPC-TM-650
绝缘阻抗值/ Surface insulation resistance ≥1011Ω
JIS-Z-3197，IPC-TM-650铜板腐蚀/ Copper corrosion tests 未腐蚀/No corrosion IPC-TM-650 坍塌试验/Slump test PASS
IPC-TM-650
贮存条件/Shelf condition 5°C-10°C
贮存寿命/Shelf line
6个月/6 months
三.特性 / CHARACTERISTCS
特制焊剂确保高可靠性能及优良润湿性。

Specially developed flux ensure high reliability and excellent wet ability. 焊剂残渣是非腐蚀及能显示良好电气性能。

Flux residue is non-corrosive and exhibits superior electrical properties
能准确控制焊粉，25-45μm 特制焊剂确保良好的连续性印刷。

Precisely controlled solder powder , 25-45μm,and specially developed flux ensure good continual printability with fine pitch pattern.
持久粘性。

Time of tacky is very long
四 保存及处理预防措施/PRECAUTIONS AGAINST STORING AND HANDLING
尽量小心使用焊膏，避免接触皮肤。

若附于衣服或身体时，应尽快用含有酒精的溶剂把焊膏抹掉。

Do not touch solder paste bare-handed. Remove with ethyl alcohol from body or clothes if contaminated by solder paste.
不要吸入回流时喷出的蒸汽。

Do not inhale the vapor during reflow.
焊接工作后要洗手
Wash hands and rinse mouth before meals and after soldering.
安装排气管于焊接区
Install exhaust pipe at soldering area.
保存焊膏于冰箱（5°C-10°C）
keep this product in refrigeration at（5°C-10°C）
焊膏从冰箱取出时，应放置4小时直至回复室温。

解冻不开封在常温下可放置时间24小时。

Leave solder paste for4 hours at room temperature before use.Unseal solder paste be stored 24 hours in room temperature .
从容器内取出所需份量的焊膏，一经使用后，不要放回原来之容器内,应抛弃，或应存于另外之容器放在冰箱内（5°C-10°C）至少24小时才能再次使用。

Once required quantity to be taken out from the container .it should not be returned to original container ，should abandon or stored in a new contained in refrigeration at （5°C-10°C）for at least24hours for next usage.
使用时搅拌容器内的焊膏。

锡膏钢网寿命为8小时
Stir solder paste in container before use.Solder paste stencil life 8 hours。

印刷后要尽快回流焊膏。

Reflow solder paste as soon as possible after printing.
使用焊膏的适当室温大约23°C -25°C，湿度60%以下。

The proper room temperature for soldering is about 23°C -25°C, humidity is below 60%.
不要将焊膏放近于风口的位置，因为这样会令焊膏中的溶剂容易蒸发，降低其粘性。

Solvent may be easily vaporized when solder paste is contacted with air-conditioned current or wind and hence reducing its tackiness.
五.保质期限 /GUARANTEE PERIOD
产品保证期限由制造日起6个月未开启存放于冰箱内（5°C-10°C）
The guarantee period should be six months from the manufacturing date if kept sealed in refrigeration at （5°C-10°C）
六.包装 / PACKAGING
焊膏（净重500克）盛于塑料容器内。

Net 500g in one plastic container.。

※本产品样本中提供的技术参数仅供参考，它们会随不同的工作条件，如设备类型、材质、工艺条件等改变。

（如有改动，以最新规格表资料为准）。