SST89E52RC-33-C-NJE;SST89E54RC-33-C-NJE;SST89E52RC-33-C-PIE;中文规格书,Datasheet资料

A Microchip Technology CompanyData SheetFeatures•8-bit 8051-Compatible Microcontroller (MCU)with Embedded SuperFlash Memory–Fully Software Compatible–Development Toolset Compatible –Pin-for-Pin Package Compatible•SST89E5xRC Operation–0to 33MHz at 5V•Total 512Byte Internal RAM (256Byte by default +256Byte enabled by software)•Single Block SuperFlash EEPROM–SST89E54RC:16KByte primary partition +1KByte secondary partition–SST89E52RC:8KByte primary partition +1KByte secondary partition–Primary Partition is divided into Four Pages –Secondary Partition has One Page –Individual Page Security Lock –In-System Programming (ISP)–In-Application Programming (IAP)–Small-Sector Architecture:128-Byte Sector Size•Support External Address Range up to 64KByte of Program and Data Memory•Three High-Current Port 1pins (16mA each)•Three 16-bit Timers/Counters•Full-Duplex,Enhanced UART–Framing error detection–Automatic address recognition•Eight Interrupt Sources at 4Priority Levels •Programmable Watchdog Timer (WDT)•Four 8-bit I/O Ports (32I/O Pins)•Second DPTR register •Low EMI Mode (Inhibit ALE)•Standard 12Clocks per cycle,the device has an option to double the speed to 6clocks per cycle.•TTL-and CMOS-Compatible Logic Levels •Low Power Modes–Power-down Mode with External Interrupt Wake-up –Idle Mode•Selectable Operation Clock–Divide down to 1/4,1/16,1/256,or 1/1024th•Temperature Ranges:–Commercial (0°C to +70°C)•Packages Available–40-pin PDIP –44-lead PLCC•All non-Pb (lead-free)devices are RoHS compliantFlashFlex MCUSST89E52RC /SST89E54RCThe SST89E52RC / SST89E54RC are members of the FlashFlex family of 8-bit microcontroller products designed and manufactured with SST’s patented and proprietary SuperFlash CMOS semiconductor process technology. The split-gate cell design and thick-oxide tunneling injector offer significant cost and reliability benefits for our customers.The devices use the 8051 instruction set and are pin-for-pin compatible with standard 8051 microcontroller devices.Not recommended for new designs.Contact Microchip Sales for microcontroller design options.Data Sheet Product DescriptionThe SST89E52RC/SST89E54RC are members of the FlashFlex family of8-bit microcontrollerproducts designed and manufactured with SST’s patented and proprietary SuperFlash CMOSsemiconductor process technology.The split-gate cell design and thick-oxide tunneling injectoroffer significant cost and reliability benefits for our customers.The devices use the8051instructionset and are pin-for-pin compatible with standard8051microcontroller devices.The device comes with17/9KByte of on-chip flash EEPROM program memory which is dividedinto2independent program memory partitions.The primary partition occupies16/8KByte of inter-nal program memory space and the secondary partition occupies1KByte of internal programmemory space.The flash memory can be programmed via a standard87C5x OTP EPROM programmer fitted with a spe-cial adapter and firmware for SST’s devices.During power-on reset,the devices can be configured as eithera slave to an external host for source code storage or a master to an external host for an in-system program-ming(ISP)operation.The devices are designed to be programmed in-system on the printed circuit board formaximum flexibility.An example of the bootstrap loader(BSL)in memory,demonstrating initial user programcode loading or subsequent user code updating via an ISP operation,is provided on the SST website.Thesample BSL is for the user’s reference only;SST does not guarantee its functionality.In addition to17/9KByte of SuperFlash EEPROM program memory on-chip and512x8bits of on-chipRAM,the device can address up to64KByte of external program memory and up to64KByte of externalRAM.The highly-reliable,patented SST SuperFlash technology and memory cell architecture have a number of impor-tant advantages for designing and manufacturing flash EEPROMs.These advantages translate into significant costand reliability benefits for our customers.Data Sheet Functional BlocksData Sheet Pin AssignmentsFigure2:Pin Assignments for40-pin PDIP 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21(T2)P1.0 (T2EX)P1.1P1.2P1.3P1.4P1.5P1.6P1.7RST (RXD)P3.0 (TXD)P3.1 (INT0#)P3.2 (INT1#)P3.3(T0)P3.4(T1)P3.5 (WR#)P3.6 (RD#)P3.7XTAL2XTAL1V SS 1234567891011121314151617181920V DDP0.0(AD0)P0.1(AD1)P0.2(AD2)P0.3(AD3)P0.4(AD4)P0.5(AD5)P0.6(AD6)P0.7(AD7)EA#ALE/PROG#PSEN#P2.7(A15)P2.6(A14)P2.5(A13)P2.4(A12)P2.3(A11)P2.2(A10)P2.1(A9)P2.0(A8) 40-pin PDIPTop View125940-pdip PI P1.1Data SheetFigure 3:Pin Assignments for 44-lead PLCC39383736353433323130297891011121314151617P1.5P1.6P1.7RST(RXD)P3.0NC(TXD)P3.1(INT0#)P3.2(INT1#)P3.3(T0)P3.4(T1)P3.5P0.4(AD4)P0.5(AD5)P0.6(AD6)P0.7(AD7)EA#NCALE/PROG#PSEN#P2.7(A15)P2.6(A14)P2.5(A13)65432144434241401819202122232425262728P 1.4P 1.3P 1.2P 1.1(T 2E X )P 1.0(T 2)N CV D DP 0.0(A D 0)P 0.1(A D 1)P 0.2(A D 2)P 0.3(A D 3)(W R #)P 3.6(R D #)P 3.7X T A L 2X T A L 1V S SN C(A 8)P 2.0(A 9)P 2.1(A 10)P 2.2(A 11)P 2.3(A 12)P 2.444-lead PLCC T op View125944-plcc NJ P3.1Data Sheet Pin DescriptionsTable1:Pin Descriptions(1of2)Data Sheet Table1:Pin Descriptions(Continued)(2of2)1.I=Input;O=Output2.It is not necessary to receive a12V programming supply voltage during flash programming.3.ALE loading issue:When ALE pin experiences higher loading(>30pf)during the reset,the MCU may accidentally enterinto modes other than normal working mode.The solution is to add a pull-up resistor of3-50K to V DD,e.g.for ALE pin.4.For6clock mode,ALE is emitted at1/3of crystal frequency.Data Sheet Memory OrganizationThe device has separate address spaces for program and data memory.Program Flash MemoryThere are two internal flash memory partitions in the device.The primary flash memory partition(Par-tition0)has16/8KByte.The secondary flash memory partition(Partition1)has1KByte.The totalflash memory space of both partitions can be used as a contiguous code storage.The16K/8K x8primary flash partition is organized as128/64sectors,each sector consists of128Bytes.The primary partition is divided into four logical pages as shown in Figure5The1K x8secondary flash partition is organized as8sectors,each sector consists also of128Bytes.For both partitions,the7least significant program address bits select the byte within the sector.Theremainder of the program address bits select the sector within the partition.Data RAM MemoryThe data RAM has512Bytes of internal memory.The first256Bytes are available by default.The sec-ond256Bytes are enabled by clearing the EXTRAM bit in the AUXR register.The RAM can beaddressed up to64KByte for external data memory.Expanded Data RAM AddressingThe SST89E5xRC have the capability of512Bytes of RAM.See Figure4.The device has four sections of internal data memory:1.The lower128Bytes of RAM(00H to7FH)are directly and indirectly addressable.2.The higher128Bytes of RAM(80H to FFH)are indirectly addressable.3.The special function registers(80H to FFH)are directly addressable only.4.The expanded RAM of256Bytes(00H to FFH)is indirectly addressable by the moveexternal instruction(MOVX)and clearing the EXTRAM bit.(See“Auxiliary Register(AUXR)”in Section,“Special Function Registers”)Since the upper128bytes occupy the same addresses as the SFRs,the RAM must be accessed indi-rectly.The RAM and SFRs space are physically separate even though they have the same addresses.When instructions access addresses in the upper128bytes(above7FH),the MCU determineswhether to access the SFRs or RAM by the type of instruction given.If it is indirect,then RAM isaccessed.If it is direct,then an SFR is accessed.See the examples below.Indirect Access:MOV@R0,#data;R0contains90HRegister R0points to90H which is located in the upper address range.Data in“#data”is written toRAM location90H rather than port1.Direct Access:MOV90H,#data;write data to P1Data in“#data”is written to port1.Instructions that write directly to the address write to the SFRs.Data Sheet To access the expanded RAM,the EXTRAM bit must be cleared and MOVX instructions must be used. The extra256Bytes of memory is physically located on the chip and logically occupies the first256 bytes of external memory(addresses000H to FFH).When EXTRAM=0,the expanded RAM is indirectly addressed using the MOVX instruction in combina-tion with any of the registers R0,R1of the selected bank or DPTR.Accessing the expanded RAM does not affect ports P0,P3.6(WR#),P3.7(RD#),or P2.With EXTRAM=0,the expanded RAM can be accessed as in the following example.Expanded RAM Access(Indirect Addressing only):MOVX@DPTR,A;DPTR contains0A0HDPTR points to0A0H and data in“A”is written to address0A0H of the expanded RAM rather than external memory.Access to external memory higher than FFH using the MOVX instruction will access external memory(0100H to FFFFH)and will perform in the same way as the standard8051,with P0 and P2as data/address bus,and P3.6and P3.7as write and read timing signals.When EXTRAM=1,MOVX@Ri and MOVX@DPTR will be similar to the ing MOVX@Ri provides an8-bit address with multiplexed data on Port0.Other output port pins can be used to output higher order address bits.This provides external paging ing MOVX @DPTR generates a16-bit address.This allows external addressing up the64K.Port2provides the high-order eight address bits(DPH),and Port0multiplexes the low order eight address bits(DPL)with data.Both MOVX@Ri and MOVX@DPTR generates the necessary read and write signals(P3.6-WR#and P3.7-RD#)for external memory use.Table2shows external data memory RD#,WR#oper-ation with EXTRAM bit.The stack pointer(SP)can be located anywhere within the256bytes of internal RAM(lower128bytes and upper128bytes).The stack pointer may not be located in any part of the expanded RAM.Table2:External Data Memory RD#,WR#with EXTRAM bit1.Access limited to ERAM address within0to0FFH.Data Sheet分销商库存信息:MICROCHIPSST89E52RC-33-C-NJE SST89E54RC-33-C-NJE SST89E52RC-33-C-PIE SST89E54RC-33-C-PIE。