CK6150D LADDER
CAK6150D参数表(0 TD)
*
8163
1636
*
8164
4
8165
4856
8174
4000
8184
4
8185
500
*
8186
1622
*
8198
17920
*
8200
00000010
8203
00001000
8204
00000110
8206
01000100
8210
00000010
8220
8
8222
-111/111
*
111
8223
12500
12500
REF.COUNTER
4000
4000(3000)
注：
1、括号（）内的值是为1.5米机床用的。
2、标记*表示该参数值可以现场调整，调整值栏空白时为参数值。
3、标记S是调速主轴的设定参数，没有调速主轴时不检查此参数。
4、标记S*表示该主轴参数可以现场调整。
5、表中未列出的参数均未0.
00000001
0060
00000101
0070
10000000
0074
00000000
0077
00010000
0100
2
0101
2
0108
S*
0109
0
U
0111
0
0112
1
0113
0
0114
0
0120
0
0121
100
0130
1
0131
2
0132
3
0133
4
蓝牙IC芯片,CSR _BC6150资料.
Features _äìÉ`çêÉ∆=_`SNRM »=nck■Single-chip Bluetooth mono headset solution withadvanced echo and noise cancellation ■Low-power consumption: over 7 hours of talk-time from a 120mAh battery ■Built-in high-performance 5th Generation CVC(CVC v5.0) single and dual microphone echo and noise cancellation■Advanced Multipoint support: allows a headset (HFP) connection to 2 phones for voice■Packet Loss Concealment and Bit Error Concealment to improve audio quality in thepresence of air interference■Programmable Audio Prompts■Secure Simple Pairing and Proximity Pairing(headset initiated pairing)■Best-in-class Bluetooth radio with 7.5dBmtransmit power and -91dBm receive sensitivity■64MIPS Kalimba DSP coprocessor■Configurable mono headset software■HFP v1.5 and HSP v1.1 support■Integrated 1.5V and 1.8V linear regulators■Integrated switch-mode regulator■Integrated 150mA lithium battery charger■Integrated high-quality codec with 95dB SNRDAC■68-lead 8 x 8 x 0.9mm, 0.4mm pitch QFN package(pin-for-pin compatible with BlueVox DSP QFN)■Green (RoHS compliant and no antimony orhalogenated flame retardants)■ A complete BC6150 QFN mono headset solutiondevelopment kit, including example design, isavailable. Order code DK‑BC‑6150‑1ABC6150 QFN Mono Headset SolutionFully Qualified Single-chipBluetooth ® v2.1 + EDR SystemProduction InformationBC6150A08Issue 2General Description _`SNRM=nck is a low-cost fully featured ROM chip solution for mono headsets. It features advanced single-microphone and dual-microphone CVC v5.0echo and noise cancellation. BC6150 QFN includes a Bluetooth radio, baseband, Kalimba DSP, DAC /ADC, switch-mode power supply and battery charger in a compact 8 x 8 x 0.9mm QFN package for low-cost designs.Applications■Mono headset solution with advanced echo andnoise cancellationBC6150 QFN also includes state-of-the-art CVC v5.0single and dual-microphone echo and noise reductionincluding significant near end audio enhancements.Dual-microphone CVC v5.0 achieves over 30dBdynamic noise suppression, allowing the headset userto be heard more clearly.BC6150 QFN supports the latest Bluetooth v2.1 + EDRspecification which includes Secure Simple Pairing.This greatly simplifies the pairing process, making iteasier to use a Bluetooth headset.The device incorporates auto-calibration and BISTroutines to simplify development, type approval andproduction test.BC6150 QFN contains the Kalimba DSP coprocessorfor supporting enhanced audio applications.BC6150 QFN is designed to reduce the number ofexternal components required, which minimisesproduction costs._`SNRM=nck Data SheetDocument History RevisionDate Change Reason127 AUG 09Original publication of this document.213 NOV 09Production Information added.SPI interface information updated.If you have any comments about this document, email comments@ givingthe number, title and section with your feedback.Document History_`SNRM=nck Data SheetStatus InformationThe status of this Data Sheet is Production Information .CSR Product Data Sheets progress according to the following format:Advance InformationInformation for designers concerning CSR product in development. All values specified are the target values of thedesign. Minimum and maximum values specified are only given as guidance to the final specification limits and mustnot be considered as the final values.All detailed specifications including pinouts and electrical specifications may be changed by CSR without notice.Pre-production InformationPinout and mechanical dimension specifications finalised. All values specified are the target values of the design.Minimum and maximum values specified are only given as guidance to the final specification limits and must not beconsidered as the final values.All electrical specifications may be changed by CSR without notice.Production InformationFinal Data Sheet including the guaranteed minimum and maximum limits for the electrical specifications.Production Data Sheets supersede all previous document versions.Life Support Policy and Use in Safety-critical ApplicationsCSR's products are not authorised for use in life-support or safety-critical applications. Use in such applications isdone at the sole discretion of the customer. CSR will not warrant the use of its devices in such applications.CSR Green Semiconductor Products and RoHS ComplianceBC6150 QFN devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Councilon the Restriction of Hazardous Substance (RoHS).BC6150 QFN devices are also free from halogenated or antimony trioxide-based flame retardants and otherhazardous chemicals. For more information, see CSR's Environmental Compliance Statement for CSR GreenSemiconductor Products .Trademarks, Patents and LicencesUnless otherwise stated, words and logos marked with ™ or ® are trademarks registered or owned by CSR plc or itsaffiliates. Bluetooth ® and the Bluetooth ® logos are trademarks owned by Bluetooth ® SIG, Inc. and licensed toCSR. Other products, services and names used in this document may have been trademarked by their respectiveowners.The publication of this information does not imply that any license is granted under any patent or other rights ownedby CSR plc and/or its affiliates.CSR reserves the right to make technical changes to its products as part of its development programme.While every care has been taken to ensure the accuracy of the contents of this document, CSR cannot acceptresponsibility for any errors.Refer to for compliance and conformance to standards information.Status Information_`SNRM=nck Data SheetContents1Device Details (8)2Functional Block Diagram (9)3Package Information (10)3.1Pinout Diagram (10)3.2Device Terminal Functions (11)3.3Package Dimensions (15)3.4PCB Design and Assembly Considerations (16)3.5Typical Solder Reflow Profile (16)4Bluetooth Modem (17)4.1RF Ports (17)4.1.1RF_N and RF_P (17)4.2RF Receiver (17)4.2.1Low Noise Amplifier (17)4.2.2RSSI Analogue to Digital Converter (17)4.3RF Transmitter (18)4.3.1IQ Modulator (18)4.3.2Power Amplifier (18)4.4Bluetooth Radio Synthesiser (18)4.5Baseband (18)4.5.1Burst Mode Controller (18)4.5.2Physical Layer Hardware Engine (18)4.6Basic Rate Modem (18)4.7Enhanced Data Rate Modem (18)5Clock Generation (20)5.1Clock Architecture (20)5.2Input Frequencies and PS Key Settings (20)5.3External Reference Clock (20)5.3.1Input: XTAL_IN (20)5.3.2XTAL_IN Impedance in External Mode (21)5.3.3Clock Start-up Delay (21)5.3.4Clock Timing Accuracy (21)5.4Crystal Oscillator: XTAL_IN and XTAL_OUT (22)5.4.1Load Capacitance (23)5.4.2Frequency Trim (23)5.4.3Transconductance Driver Model (24)5.4.4Negative Resistance Model (24)5.4.5Crystal PS Key Settings (25)6Bluetooth Stack Microcontroller (26)6.1Programmable I/O Ports, PIO and AIO (26)7Kalimba DSP (27)8Memory Interface and Management (28)8.1Memory Management Unit (28)8.2System RAM (28)8.3Kalimba DSP RAM (28)8.4Internal ROM (28)9Serial Interfaces (29)9.1UART Interface (29)9.1.1UART Configuration While Reset is Active (31)9.2Programming and Debug Interface (31)9.2.1Instruction Cycle ..................................................................................................................... 31_`SNRM=nck Data Sheet9.2.2Multi-slave Operation (31)9.3I 2C Interface (31)10Audio Interface (33)10.1Audio Input and Output (33)10.2Mono Audio Codec Interface (33)10.2.1Mono Audio Codec Block Diagram (34)10.2.2ADC (34)10.2.3ADC Digital Gain (34)10.2.4ADC Analogue Gain (35)10.2.5DAC (35)10.2.6DAC Digital Gain (35)10.2.7DAC Analogue Gain (36)10.2.8Microphone Input (36)10.2.9Output Stage (39)10.2.10Side Tone (40)10.2.11Integrated Digital Filter (40)11Power Control and Regulation (42)11.1Power Sequencing (42)11.2External Voltage Source (42)11.3Switch-mode Regulator (43)11.4Low-voltage Linear Regulator (43)11.5Low-voltage Audio Linear Regulator (43)11.6Voltage Regulator Enable Pins (44)11.7Battery Charger (44)11.8LED Drivers (44)11.9Reset, RST# (45)11.9.1Digital Pin States on Reset (46)11.9.2Status after Reset (46)12Example Application Schematic (47)13Electrical Characteristics (48)13.1ESD Precautions (48)13.2Absolute Maximum Ratings (48)13.3Recommended Operating Conditions (48)13.4Input/Output Terminal Characteristics (49)13.4.1Low-voltage Linear Regulator (49)13.4.2Low-voltage Linear Audio Regulator (50)13.4.3Switch-mode Regulator (51)13.4.4Battery Charger (52)13.4.5Reset (53)13.4.6Regulator Enable (53)13.4.7Digital Terminals (54)13.4.8Mono Codec: Analogue to Digital Converter (55)13.4.9Mono Codec: Digital to Analogue Converter (56)13.4.10Clocks (57)13.4.11LED Driver Pads (57)13.4.12Auxiliary ADC (58)14Power Consumption (59)15CSR Green Semiconductor Products and RoHS Compliance (61)15.1RoHS Statement (61)15.1.1List of Restricted Materials (61)16BC6150 QFN Software Stack (62)16.1BC6150 QFN Mono Headset Solution Development Kit (62)16.2BC6150 QFN Mono Headset Solution ................................................................................................. 62_`SNRM=nck Data Sheet16.3Advanced Multipoint Support (62)16.4Programmable Audio Prompts (63)16.5Proximity Pairing (63)16.5.1Proximity Pairing Configuration (63)17Ordering Information (64)17.1BC6150 QFN Mono Headset Solution Development Kit Ordering Information (64)18Tape and Reel Information (65)18.1Tape Orientation (65)18.2Tape Dimensions (65)18.3Reel Information (66)18.4Moisture Sensitivity Level (66)19Document References (67)Terms and Definitions (68)List of FiguresFigure 2.1Functional Block Diagram (9)Figure 3.1Device Pinout (10)Figure 3.2Package Dimensions (15)Figure 4.1Simplified Circuit RF_N and RF_P (17)Figure 4.2BDR and EDR Packet Structure (19)Figure 5.1Clock Architecture (20)Figure 5.2TCXO Clock Accuracy (22)Figure 5.3Crystal Driver Circuit (22)Figure 5.4Crystal Equivalent Circuit (23)Figure 7.1Kalimba DSP Interface to Internal Functions (27)Figure 9.1Universal Asynchronous Receiver (29)Figure 9.2Break Signal (30)Figure 9.3Example EEPROM Connection (32)Figure 10.1BC6150 QFN Audio Interface (33)Figure 10.2Mono Codec Audio Input and Output Stages (34)Figure 10.3ADC Analogue Amplifier Block Diagram (35)Figure 10.4Microphone Biasing (36)Figure 10.5Speaker Output (40)Figure 11.1Voltage Regulator Configuration (42)Figure 11.2LED Equivalent Circuit (45)Figure 12.1Example Application Schematic (47)Figure 16.1Programmable Audio Prompts in External I 2C EEPROM (63)Figure 18.1BC6150 QFN Tape Orientation (65)Figure 18.2Reel Dimensions (66)List of TablesTable 4.1Data Rate Schemes (19)Table 5.1External Clock Specifications (21)Table 5.2Crystal Specification (23)Table 9.1Possible UART Settings (29)Table 9.2Standard Baud Rates (30)Table 9.3Instruction Cycle for a SPI Transaction (31)Table 10.1ADC Digital Gain Rate Selection (34)Table 10.2DAC Digital Gain Rate Selection (35)Table 10.3DAC Analogue Gain Rate Selection (36)Table 10.4Voltage Output Steps ....................................................................................................................... 38_`SNRM=nck Data SheetTable 10.5Current Output Steps (39)Table 11.1BC6150 QFN Voltage Regulator Enable Pins (44)Table 11.2BC6150 QFN Digital Pin States on Reset (46)List of EquationsEquation 5.1Load Capacitance (23)Equation 5.2Trim Capacitance (23)Equation 5.3Frequency Trim (24)Equation 5.4Pullability (24)Equation 5.5Transconductance Required for Oscillation (24)Equation 5.6Equivalent Negative Resistance (25)Equation 9.1Baud Rate (30)Equation 10.1IIR Filter Transfer Function, H(z) (41)Equation 10.2IIR Filter plus DC Blocking Transfer Function, H DC(z) (41)Equation 11.1LED Current (45)Equation 11.2LED PAD Voltage (45)_`SNRM=nckData Sheet1Device DetailsRadio ■Common TX/RX terminal simplifies external matching; eliminates external antenna switch ■BIST minimises production test time ■Bluetooth v2.1 + EDR specification compliant Transmitter ■7.5dBm RF transmit power with level control from a 6-bit DAC over a typical 30dB dynamic range ■Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch Receiver ■Receiver sensitivity of -91dBm ■Integrated channel filters ■Digital demodulator for improved sensitivity and co-channel rejection ■Real-time digitised RSSI available on HCI interface ■Fast AGC for enhanced dynamic range Synthesiser ■Fully integrated synthesiser requires no external VCO, varactor diode, resonator or loop filter ■Compatible with crystals 16MHz to 26MHz or an external clock 12MHz to 52MHz Kalimba DSP ■Very low power Kalimba DSP coprocessor,64MIPS, 24-bit fixed point core ■Single-cycle MAC; 24 x 24-bit multiply and 56-bit accumulator ■32-bit instruction word, dual 24-bit data memory■6K x 32-bit program RAM, 8K x 24-bit + 8K x 24-bit data RAM ■64 x 32-bit program memory cache when executing from ROM Audio Codec ■16-bit internal codec ■ADC and DAC for stereo audio ■Integrated amplifiers for driving 16Ω speakers; no need for external components ■Support for single-ended speaker termination and line output ■Integrated low-noise microphone bias Physical Interfaces ■Synchronous serial interface for system debugging ■I²C compatible interface to external EEPROMcontaining device configuration data (PS Keys)■UART interface with data rates up to 3Mbits/s■Bidirectional serial programmable audio interfacesupporting PCM, I²S and SPDIF formats■ 2 LED drivers with fadersBaseband and Software■Internal ROM■48KB of internal RAM, allows full-speed datatransfer, mixed voice/data and full piconet support■Logic for forward error correction, header errorcontrol, access code correlation, CRC,demodulation, encryption bit stream generation,whitening and transmit pulse shaping■Transcoders for A-law, µ-law and linear voice fromhost and A-law, µ-law and CVSD voice over air■Configurable mono headset ROM software to set-up headset features and user interface■Support for HFP v1.5 (including three-way calling)and HSP v1.1■Support for Bluetooth v2.1 + EDR specificationSecure Simple Pairing■Proximity Pairing (headset initiated pairing)■Advanced Multipoint support, allowing the headsetto connect to 2 mobile phones or 1 mobile phoneand a VoIP dongle■Programmable audio prompts■Packet Loss Concealment and Bit ErrorConcealment to improve audio quality in thepresence of air interference■DSP based single-microphone CVC v5.0 echo andnoise cancellation is included in the BC6150 QFNfor effective noise cancellation under all conditions■ A high-performance dual-microphone noisecancellation is available using CVC v5.0 is availablein BC6150 QFN providing over 30dB of dynamicnoise suppressionAuxiliary Features■Crystal oscillator with built-in digital trimming■Power management includes digital shutdown andwake-up commands with an integrated low-poweroscillator for ultra-low power Park/Sniff/Hold mode■Clock request output to control external clock■On-chip regulators: 1.5V output from 1.7V to 1.95Vinput■On-chip high-efficiency switched-mode regulator:1.8V output from2.5V to 4.4V input■Power-on-reset cell detects low-supply voltage■10-bit ADC available to applications■On-chip 150mA charger for lithium ion/polymerbatteriesPackage Option■QFN 68-lead, 8 x 8 x 0.9mm, 0.4mm pitch Device Details_`SNRM=nck Data Sheet2Functional Block DiagramG-TW-0115.3.2VREGIN_AUDIO VDD_AUDIO VREGENABLE_L VREGIN_L VREGENABLE_H VSS BAT_PVDD_CHG RF_P XTAL_OUT XTAL_IN LO_REF VDD_LO LED[0]VDD_PADSVDD_MEM RST#TEST_ENVDD_SMP_CORE VDD_CORE VDD_ANA LX VDD_RADIO LED[1]AIO[0]AIO[1]PIO[5:0]VSS_PIO VDD_PIO PIO[14:11, 9]RF_N SPKR_A_PSPKR_A_NMIC_BIASMIC_A_PMIC_A_NMIC_B_NMIC_B_PAU_REF_DCPLUART_TXUART_RXUART_CTS UART_RTS VDD_UARTPIO[7]PIO[8]PIO[6]SPI_CS#SPI_MISO SPI_MOSISPI_CLKFigure 2.1: Functional Block DiagramFunctional Block Diagram_`SNRM=nck Data Sheet3Package Information 3.1Pinout DiagramG-TW-091.4.21234567891018192011121314151617212223242526272829303132333435363738394041424344454647484950515268535455565758596061626364656667Orientation from Top of DeviceFigure 3.1: Device Pinout Package Information_`SNRM=nck Data Sheet3.2Device Terminal FunctionsBluetooth Radio Lead Pad Type Supply Domain DescriptionRF_N65RFVDD_RADIO Transmitter output/switched receiverRF_P64RF Complement of RF_N Synthesiser andOscillatorLead Pad Type Supply Domain DescriptionXTAL_IN3Analogue VDD_ANA For crystal or external clock inputXTAL_OUT4Drive for crystalLO_REF5Reference voltage to decouple the synthesiserSPI Interface Lead Pad Type Supply Domain DescriptionSPI_MOSI28Input, with weak internal pull-downVDD_PADSSPI data inputSPI_CS#30Bidirectional with weakinternal pull-downChip select for SPI, active lowSPI_CLK29Bidirectional with weakinternal pull-downSPI clockSPI_MISO31Bidirectional with weakinternal pull-downSPI data outputUART Interface Lead Pad Type Supply Domain DescriptionUART_TX9Output, tri-state, with weakinternal pull-downVDD_UARTUART data output, active highUART_RX10Bidirectional with weakinternal pull-downUART data input, active highUART_RTS12Bidirectional CMOS output,tri-state, with weak internalpull-upUART request to send active lowUART_CTS11CMOS input with weakinternal pull-downUART clear to send active low_`SNRM=nckData SheetPIO Port Lead Pad Type Supply Domain Description PIO[14]20Bidirectional withprogrammable strength internal pull-up/down VDD_PADS Programmable input/output linePIO[13]19PIO[12]18PIO[11]15PIO[9]14PIO[8]21PIO[7]22PIO[6]23PIO[5]24PIO[4]25PIO[3]58Bidirectional withprogrammable strength internal pull-up/down VDD_PIO Programmable input/output linePIO[2]59PIO[1]60PIO[0]61AIO[1]6Bidirectional VDD_ANA Programmable input/output line AIO[0]7_`SNRM=nck Data SheetAudio Lead Pad Type Supply Domain DescriptionSPKR_A_N56Analogue VDD_AUDIO Speaker output, negative, channel ASPKR_A_P57Analogue VDD_AUDIO Speaker output, positive, channel AMIC_A_N52Analogue VDD_AUDIO Microphone input, negative, channel AMIC_A_P51Analogue VDD_AUDIO Microphone input, positive, channel AMIC_B_N50Analogue VDD_AUDIO Microphone input, negative, channel BMIC_B_P48Analogue VDD_AUDIO Microphone input, positive, channel BMIC_BIAS45Analogue VDD_AUDIO,BAT_PMicrophone biasAU_REF_DCPL55Analogue VDD_AUDIO Decoupling of audio reference, for high-quality audioLED Drivers Lead Pad Type Supply Domain Description LED[1]33Open drain output Open drainLED driver LED[0]32LED driver Test and Debug Lead Pad Type Supply Domain DescriptionRST#26Input with weak internal pull-upVDD_PADSReset if low. Input debounced somust be low for >5ms to cause aresetTEST_EN27Input with strong internal pull-downFor test purposes only, leaveunconnected_`SNRM=nckData SheetPower SuppliesControl Lead DescriptionVREGENABLE_L68Low-voltage linear regulator and low-voltage audiolinear regulator enable, active highVREGIN_L 1Input to internal low-voltage regulatorVREGENABLE_H 35Switch-mode regulator enable, active highVREGIN_AUDIO 46Input to internal audio low-voltage linear regulator VDD_AUDIO 47Positive supply for audioLX 37Switch-mode regulator outputVDD_ANA 2Positive supply output for analogue circuitry and1.5V regulated output, from internal low-voltageregulatorVDD_PIO 62Positive supply for digital input/output ports PIO[3:0]VDD_PADS 16Positive supply for all other digital Input/Output portsincluding PIO[14:11,9:4]VDD_CORE 17, 34Positive supply for internal digital circuitryVDD_RADIO 63, 66Positive supply for RF circuitryVDD_UART 13Positive supply for UART portsVDD_LO 67Positive supply for local oscillator circuitryBAT_P 38Lithium ion/polymer battery positive terminal. Batterycharger output and input to switch-mode regulatorVDD_CHG 39Lithium ion/polymer battery charger inputVDD_SMP_CORE 36Positive supply for switch-mode control circuitry VSS Exposed Pad Ground connectionsUnconnected Leads (N/Cs)Description8, 40, 41, 42, 43, 44, 49, 53, 54Leave unconnected_`SNRM=nck Data Sheet3.3Package DimensionsG-T W-0939.4.3Orientation from TopSeating PlaneOrientation from BottomFigure 3.2: Package Dimensions_`SNRM=nck Data Sheet3.4PCB Design and Assembly ConsiderationsThis section lists recommendations to achieve maximum board-level reliability of the 8 x 8 x 0.9mm QFN 68-leadpackage:■NSMD lands (lands smaller than the solder mask aperture) are preferred, because of the greater accuracy of the metal definition process compared to the solder mask process. With solder mask defined pads, theoverlap of the solder mask on the land creates a step in the solder at the land interface, which can causestress concentration and act as a point for crack initiation.■CSR recommends that the PCB land pattern to be in accordance with IPC standard IPC-7351.■Solder paste must be used during the assembly process.3.5Typical Solder Reflow ProfileSee Typical Solder Reflow Profile for Lead-free Devices for information._`SNRM=nckData Sheet4Bluetooth Modem4.1RF Ports4.1.1RF_N and RF_PRF_N and RF_P form a complementary balanced pair and are available for both transmit and receive. On transmit their outputs are combined using an external balun into the single-ended output required for the antenna. Similarly,on receive their input signals are combined internally.Both terminals present similar complex impedances that may require matching networks between them and the balun. Viewed from the chip, the outputs can each be modelled as an ideal current source in parallel with a lossy capacitor. An equivalent series inductance can represent the package parasitics.G-T W-03349.2.2RF_NRF_PFigure 4.1: Simplified Circuit RF_N and RF_PRF_N and RF_P require an external DC bias. The DC level must be set at VDD_RADIO.4.2RF ReceiverThe receiver features a near-zero IF architecture that allows the channel filters to be integrated onto the die. Sufficient out-of-band blocking specification at the LNA input allows the receiver to be used in close proximity to GSM and W‑CDMA cellular phone transmitters without being desensitised. The use of a digital FSK discriminator means that no discriminator tank is needed and its excellent performance in the presence of noise allows BC6150 QFN to exceed the Bluetooth requirements for co-channel and adjacent channel rejection.For EDR, the demodulator contains an ADC which digitises the IF received signal. This information is then passed to the EDR modem.4.2.1Low Noise AmplifierThe LNA operates in differential mode and takes its input from the shared RF port.4.2.2RSSI Analogue to Digital ConverterThe ADC implements fast AGC. The ADC samples the RSSI voltage on a slot-by-slot basis. The front-end LNA gain is changed according to the measured RSSI value, keeping the first mixer input signal within a limited range. This improves the dynamic range of the receiver, improving performance in interference limited environments._`SNRM=nck Data Sheet4.3RF Transmitter4.3.1IQ ModulatorThe transmitter features a direct IQ modulator to minimise frequency drift during a transmit timeslot, which results in a controlled modulation index. Digital baseband transmit circuitry provides the required spectral shaping.4.3.2Power AmplifierThe internal PA has a maximum output power that allows BC6150 QFN to be used in Class 2 and Class 3 radios without an external RF PA.4.4Bluetooth Radio SynthesiserThe Bluetooth radio synthesiser is fully integrated onto the die with no requirement for an external VCO screening can, varactor tuning diodes, LC resonators or loop filter. The synthesiser is guaranteed to lock in sufficient time across the guaranteed temperature range to meet the Bluetooth v2.1 + EDR specification.4.5Baseband4.5.1Burst Mode ControllerDuring transmission the BMC constructs a packet from header information previously loaded into memory-mapped registers by the software and payload data/voice taken from the appropriate ring buffer in the RAM. During reception, the BMC stores the packet header in memory-mapped registers and the payload data in the appropriate ring buffer in RAM. This architecture minimises the intervention required by the processor during transmission and reception.4.5.2Physical Layer Hardware EngineDedicated logic performs the following:■Forward error correction■Header error control■Cyclic redundancy check■Encryption■Data whitening■Access code correlation■Audio transcodingFirmware performs the following voice data translations and operations:■A-law/µ-law/linear voice data (from host)■A-law/µ-law/CVSD (over the air)■Voice interpolation for lost packets■Rate mismatch correctionThe hardware supports all optional and mandatory features of Bluetooth v2.1 + EDR specification including AFH and eSCO.4.6Basic Rate ModemThe basic rate modem satisfies the basic data rate requirements of the Bluetooth v2.1 + EDR specification. The basic rate was the standard data rate available on the Bluetooth v1.2 specification and below, it is based on GFSK modulation scheme.Including the basic rate modem allows BC6150 QFN compatibility with earlier Bluetooth products.The basic rate modem uses the RF ports, receiver, transmitter and synthesiser, alongside the baseband components described in Section 4.5.4.7Enhanced Data Rate ModemThe EDR modem satisfies the requirements of the Bluetooth v2.1 + EDR specification. EDR has been introduced to provide 2x and 3x data rates with minimal disruption to higher layers of the Bluetooth stack. BC6150 QFN supportsboth the basic and enhanced data rates and is compliant with the Bluetooth v2.1 + EDR specification._`SNRM=nck Data SheetAt the baseband level, EDR uses the same 1.6kHz slot rate and the 1MHz symbol rate defined for the basic data rate. EDR differs in that each symbol in the payload portion of a packet represents 2 or 3 bits. This is achieved using 2 new distinct modulation schemes. Table 4.1 and Figure 4.2 summarise these. Link Establishment and Management are unchanged and still use GFSK for both the header and payload portions of these packets.The enhanced data rate modem uses the RF ports, receiver, transmitter and synthesiser, with the baseband components described in Section 4.5.Data Rate Scheme Bits Per Symbol ModulationBasic Rate 1GFSKEDR 2π/4 DQPSKEDR 38DPSK (optional)Table 4.1: Data Rate SchemesG-TW-0244.2.3Enhanced Data Rate Figure 4.2: BDR and EDR Packet Structure_`SNRM=nck Data Sheet。
CK6150数控车床上的应用
西安航空学院毕业设计题目：FAGOR 8025/8030数控系统及其在CK6150数控车床上的应用院系：电气学院专业：电气自动化技术班级：电气1550学生学号：1230301155045学生姓名：田旺上指导教师：邓利红完成日期：2015.5.10FAGOR 8025/8030数控系统及其在CK6150数控车床上的应用设计摘要本设计是数控机床的PLC控制，用国内广泛使用的德国西门子S7-200系列PLC来控制CK6150数控机床。
本设计主要包括CK6150机床的简单介绍、PLC类型选择、输入/输出分配表、梯形图、指令语句等内容。
本文分析了数控中的PLC，以CK6150数控车床的PLC控制来分析PLC在工业中的应用。
通过CK6150数控车床的PLC控制这个实例，可以清楚地看出独立型PLC与CNC装置之间、PLC与机床侧的开关量之间的I/O连接关系：并通过PLC程序设计，使CNC装置、PLC和数控机床三者紧密结合在一起，形成一个有机整体，从而控制数控机床有条不紊地工作。
关键词：可编程控制器（PLC）,控制,数控机床ABSTRACTThis design is the PLC’s conformity of CNC machine tools. Germany's Siemens S7-200 series PLC what is widely used at home to control the CK6150 CNC machine tools. The design includes a brief introduction of the CK6150 machine, PLC type, input / output allocation table, ladder, instructions, etc. statements. This paper analyzes the PLC of the numerical control and applications of PLC control in industry by the PLC’s conformity of the CK6150 CNC machine tools. You can clearly see that the I / O connections between independent PLC and CNC equipment and that PLC and the machine side of the switch by this example of the PLC’s conformity of the CK6150 CNC machine tools. The close connection with the three together forms an organic whole by the designing of PLC program, and thus conformity of CNC machine tools work in an orderly manner.KEY WORDS:Programmable controller (PLC)，control，engine bed numerical control目录摘要 (I)ABSTRACT (II)前言 (1)一.FAGOR 8025/8030 数控简介1 . 1 外形结构 (2)1 . 2 I/O连接器配置 (3)二． K6150数控车床PLC控制2 . 1 概述 (7)2．2 CK6150数控车床 (7)2．2．1 CK6150型数控车床控制电路工作原理 (8)2．3 PLC类型的选择 (11)2．4 输入/输出分配表 (12)2．5 PLC的I/O接线图 (13)2．6 PLC主程序梯形图 (15)2．7 主要子程序梯形图 (17)2．7．1 液压卡盘和液压尾座控制子程序 (17)2．7．2 冷却和润滑控制子程序 (19)2．7．3 换刀控制子程序 (21)2．7．4 主轴控制子程序 (23)2．7．5 急停、进给保持控制子程序 (26)结语 (29)参考文献 (30)谢辞 (31)前言大学生活即将结束，而毕业设计却是我们大学学习生活的很重要的一部分，是我们在校学习的最后一个环节，是评价我们是否是一个合格大学生的一个很重要标准，因此在做毕业设计时，我都怀着很重视的态度去做的。
6150AD操作手册
相关型号 6150AD1~6150AD6， 6150AD1/H~6150AD6/H 6150AD1/E~6150AD6/E
济南中威仪器有限公司
目
录
1． 应用 ........................................................................................................................... 4 2．6150AD 型号 .................................................................................................................. 5 3．结构 3.1 外层结构 ................................................................................................................ 8 3.2 探头位置 ................................................................................................................ 8 3.3 显示 ......................................................................................................................... 9 3.4 扬声器 ............................................
新机构CK6150数控车床使用说明书(通用)
CK6150数控车床使用说明书中国·山东山东普鲁特机床有限公司目录1概述 (1)1.1 产品的主要用途 (1)1.2 机床的精度 (1)1.3 机床的使用环境 (1)1.4 机床对环境的影响 (1)2安全防护须知 (2)2.1 对上机操作、维修人员的要求 (2)2.2 基本操作要求 (2)2.3 接通电源之前的要求 (2)2.4 接通电源之后的要求 (3)2.5 常规检查 (3)2.6 温升 (3)2.7 开机前的准备工作 (4)2.8 工作中注意事项 (4)2.9 中断加工 (5)2.10 完成加工之后 (5)2.11 安全保护装置 (5)2.12 维修前的准备工作 (5)2.13 维修操作 (5)2.14 维修后的处理 (6)3 吊运与安装 (7)3.1 机床的运输与存放 (7)3.2 安装前的准备工作 (7)3.3 机床吊运 (7)3.4 机床安装 (7)3.5 内部装置连接的检查 (8)3.6 操作前的检查 (8)3.7 床身水平的最终调整 (9)3.8 安装后的维护和内部装置连接的检查 (9)5 机床结构 (11)5.1 机床布局 (11)5.2 机床部件简介 (11)6 机床的使用和安全防护 (13)6.1 机床的使用 (13)6.2 安全防护 (13)6.3 设置必要的安全警告标牌 (13)7 检查与维修 (14)7.1 常规检查 (14)7.2 定期检查 (15)7.3 润滑、冷却 (15)7.4 机床的调整和维修 (16)7.5 常见故障排除 (18)8 机床电气概述 (20)8.1 电气设备配置图 (20)8.2 机床电气主要参数 (21)8.3 机床电气的检查 (21)8.4机床送电 (22)8.5 机床电气维护和调整 (22)8.6 电气原理图（附图1） (23)8.7 控制面板接线图（附图2） (24)8.8线路板接线、布局图（附图3） (25)使用须知➢在使用本机床之前，请仔细阅读本《使用说明书》及《车床数控系统产品说明书》，并完全理解说明书全部内容，才能使本机床安全地运转。
CK6150计算资料
1． CK6160数控车床设计要求主要技术参数：1、 床身上最大回转直径：600mm ；2、 最大车削直径：600mm ；3、 最大车削长度：1000mm （最大行程：1050mm ）；4、 横向最大行程：350mm ；5、 主电机功率：11kw ；；6、 主轴最高转速：2500rpm ；7、 X 向/Z 向参数：快速进给速度16m/8m/min ，最小移动单位0.001mm ，最小输入单位0.001mm 。
8、 其余：床身为矩形导轨，与其接触的工作台面贴塑2 滚珠丝杠副的计算及选型为了满足数控机床高进给速度、高定位精度、高平稳性和快速响应的要求，必须合理选择滚珠丝杠副，并进行必要的校核计算。
计算参数：纵向工作台总重量 W=2000N 工作台Z 向最大行程 1050mm 纵向快速进给速度 Vxmax=8m/min 定位精度 ±0.01mm 重复定位精度 ±0.005mm 下表1给出了工作台的切削状况，以此为前提进行传动部件的设计。
表1 轴向受力状况切削方式 轴向力(N) 进给速度(r/min)工作时间百分比％强力切削 6900 50 20 一般切削 3900 100 50 精切削1400500302.1 确定滚珠丝杠的导程t根据机床传动要求、负载大小和传动效率等因素综合考虑确定导程t 。
先按机床传动要求确定，其公式为:max max x x in V t式中：V xmax ——Z 向快速进给速度，mm/min ；i ——传动比，因电机与滚珠丝杠副直接联接，i 取1；n xmax ——驱动电机最高转速，r/min 。
由式t=16000/2000=8mm ，取导程t=8mm 。
2.2 滚珠丝杠副的载荷及转速计算 2.2.1 工作载荷F工作载荷F 是指数控机床工作时，实际作用在滚珠丝杠上的轴向作用力，其数值可用下列进给作用力的实验公式计算： 对于滑动导轨机床：F=F zi +F f 式中： F zi ——Z 方向上的切削分力，N ；F f ——导轨摩擦阻力，N 。
6150说明书
第一章机床特点及性能参数1.1概述6150数控车床是我公司设计制造的高性能数控产品，整机配置本着一切为用户设想的原则，具备功能齐全，加工效率高，精度稳定性好，可靠性高且自动化程度高等特点，是高效生产的理想设备。
本系列数控车床可据用户要求选配不同的数控系统、伺服驱动系统、液压系统、动力卡盘及动力刀架等。
1.2主要技术参数*床身上最大回转直径………………………ø 500mm*过拖板最大加工直径………………………ø 210mm*顶间距………………………………………1500mm-5*主轴端部……………………………………A2*主轴头锥孔…………………………………1∶20*主轴通孔直径………………………………ø82mm*主轴最高转速………………………………2000r/min*刀架…………………………………………四工位*刀具截面尺寸………………………………25mm×25mm*最大行程……………………………………X轴:250mmZ轴:1500mm*尾座套筒直径………………………………ø75mm*尾座套筒锥孔………………………………莫氏5#*尾座套筒行程………………………………150mm*主轴电机功率………………………………4KW/伺服5.5KW*X轴电机……………………………………1KW*Z轴电机……………………………………1.5KW*最大轮廓尺寸………………………………1760mm×1190mm×1470mm*重量…………………………………………2200kg以上参数为6150标准型数控机床参数。
由于用户的特殊性，您订购的机床参数可能会有部分改变，请用户在加工操作时认真核对，若有不清，请迅速与我公司联系。
第二章机床的吊运与安装2.1开箱用户在收到机床后应尽快打开包装箱检查，检查过程中应特别注意以下项目：a.检查整机包装是否完整？b.机床在运输过程中是否受潮？c.检查机床外观及各部件是否在运输过程中受损？d.按《发货清单》进行清查，是否有与《发货清单》不符合的地方。
DIN导轨 导轨 线槽
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环保线槽 - 产品目录 - 线槽 扎带 接头 软管 端子 线束 上海日成电子有限公司RCCN
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电缆接头 护线套 夹线套
金属接头 固定座
环保白锌冷轧钢
T S-35/7.5/1.0/2M/W-525
环保白锌冷轧钢
T S-35/7.5/1.0/1M-N
彩锌冷轧钢-无底孔
T S-35/7.5/1.0/1M/W-N
环保白锌冷轧钢-无底孔
T S-35/7.5/1.0/2M-N
彩锌冷轧钢-无底孔
T S-35/7.5/1.0/2M/W-N
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日成液压导轨切断钳T S - 5 1特点:快速省力
导轨钳 1 特点:手动式
DI N 导轨 钢质导轨 TS-357.51.0/TS-35151.5
导轨钳 导轨钳
日成液压导轨切断钳T S - 5 日成液压导轨切断钳TS-5
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数控车床CK 6150 产品参数及特点 PDF资料
冉升机械数控车床主营产品:CK 6150 机床特点： 机床控制采用各种CNC 数控系统供客户选购 进给运动采用滚珠丝杆，滑动导轨 主轴电机变速采用交流变频器
主轴卡盘夹紧装置有手动、液压各种控制形式供客户选购。
进给轴采用步进电机或伺服电机控制供客户选购。
在托板上安装不同角度的电主轴，可以实现各种螺旋槽、直槽、钻孔等。
进给轴采用步进电机或伺服电机控制供客户选购。
导轨采用超音频淬火
产品产品：：CK 6150
具体参数 床身上最大回转直径 Φ520mm 床身上加工最大直径 Φ520mm 加工棒料最大直径
Φ48-82mm 在刀架上加工最大直径（电动刀架/排
刀架） Φ220/160mm 最大加工长度 1600mm 公制螺纹 0.25-12mm 英制螺纹
28-3 1/2'' 主轴中心高（床身平轨至主轴中心线） 260mm 主轴转速范围 2-2000r/min 刀架X 轴最大行程 230mm 刀架Z 轴最大行程 1600mm X 轴进给速度（无级） 5-1000mm/min Z 轴进给速度（无级） 10-2000mm/min X 轴快进速度 4000mm/min Z 轴快进速度 6000mm/min 刀杆截面尺寸
25*25mm 主轴中心线到刀具支撑底面距离 25mm 尾座顶尖套筒绦内孔锥度 No4 尾座套筒最大移动量 150mm 主电机功率
7.5kw
机床外形尺寸（长*宽*高） 2850*1200*1620mm
机床净重
2500kgs。
新机构CK6150数控车床使用说明书(通用)
CK6150数控车床使用说明书中国·山东山东普鲁特机床有限公司目录1概述 (1)1.1 产品的主要用途 (1)1.2 机床的精度 (1)1.3 机床的使用环境 (1)1.4 机床对环境的影响 (1)2安全防护须知 (2)2.1 对上机操作、维修人员的要求 (2)2.2 基本操作要求 (2)2.3 接通电源之前的要求 (2)2.4 接通电源之后的要求 (3)2.5 常规检查 (3)2.6 温升 (3)2.7 开机前的准备工作 (4)2.8 工作中注意事项 (4)2.9 中断加工 (5)2.10 完成加工之后 (5)2.11 安全保护装置 (5)2.12 维修前的准备工作 (5)2.13 维修操作 (5)2.14 维修后的处理 (6)3 吊运与安装 (7)3.1 机床的运输与存放 (7)3.2 安装前的准备工作 (7)3.3 机床吊运 (7)3.4 机床安装 (7)3.5 内部装置连接的检查 (8)3.6 操作前的检查 (8)3.7 床身水平的最终调整 (9)3.8 安装后的维护和内部装置连接的检查 (9)5 机床结构 (11)5.1 机床布局 (11)5.2 机床部件简介 (11)6 机床的使用和安全防护 (13)6.1 机床的使用 (13)6.2 安全防护 (13)6.3 设置必要的安全警告标牌 (13)7 检查与维修 (14)7.1 常规检查 (14)7.2 定期检查 (15)7.3 润滑、冷却 (15)7.4 机床的调整和维修 (16)7.5 常见故障排除 (18)8 机床电气概述 (20)8.1 电气设备配置图 (20)8.2 机床电气主要参数 (21)8.3 机床电气的检查 (21)8.4机床送电 (22)8.5 机床电气维护和调整 (22)8.6 电气原理图（附图1） (23)8.7 控制面板接线图（附图2） (24)8.8线路板接线、布局图（附图3） (25)使用须知➢在使用本机床之前，请仔细阅读本《使用说明书》及《车床数控系统产品说明书》，并完全理解说明书全部内容，才能使本机床安全地运转。
纳德拉滚轮导轨(新)
|9
产品一览
重载系列导轨 GU,GP
承受中-重型负载/适应恶劣环境 GU ... M, GU ... MT 型导轨 RKU 滚轮 FKU 滚轮 RKUL 滚轮 LUBU 润滑块 SAG 导向安装柱 承受中-重型负载/恶劣环境 GP ... MC 系列导轨 GP ... M 系列导轨 PK 滚轮 FK 滚轮 GC 滚轮 FG / FGU 滚轮 LUBP 润滑块
型号
尺寸 (mm)
H
h
S
D
G
g
b
c
sm
l
l1
± 0.05
± 0.05
± 0.05
+ 0.1
+ 0.05
± 0.05
GU 28 MT
19
11
28.8 5.5
10
5.7 10
2.5
0.7 x 45° 90
30
GU 35 MT
23.9 15.7 35.5 6.6
11
6.8 10
3.8
1 x 45° 90
30
2.5
页码 84 85 86 87 88 89 90 91 92 93 94 96
| 13
产品一览
B系列导轨FWS,FWH,DC,C
针对于中性负载及腐蚀环境 DC型导轨 C 型导轨 PFV 滚轮 RKO 滚轮 T4 PFV 滑块 NAID 刮板 LUBC 润滑块 针对于轻型负载 FWS 型导轨 FWH 型导轨 FR ... EU 滚轮 FR ... EU AS, FR ... EU AZ 滚轮 FRL ... EU 滚轮 T4 FR 滑块
• SAG 安装导向柱
024
3.2 GP 产品
针对于中-重型负载及恶劣环境
CAK6150 使用说明书(机械与液压)
CAK6140CAK6150系列数控车床CAK6161使用说明书(机械与液压)沈阳第一机床厂Ver.2.0 /1998.8操作须知在使用本机床之前，请仔细阅读本使用说明书，并完全理解说明书的全部内容，这样才能使本机床安全地运转。
尽管本说明书的内容是经过仔细核对的，但如果出现什么疑点，不正确的解释，或是有遗漏，请与我厂取得联系。
为了说明本机床的具体内容，说明书里有些图解没有表示出盖门、防护设施及罩等。
因此要在机床操作之前按说明书内容所示将罩门关好，如果忽略了这点，便会产生一系列危险，引起机床主件及其它附件的损坏。
本机床为了运输的安全性，对防护门等进行了固定，如图1所示。
用户在操作机床前，须将上述装置拆掉，否则将造成机床损坏。
安装须知为了确保机床的安全运行，在安装时应注意以下各项：1 接线1.1 所使用的电气接线一定要等于或超过本说明书规定的性能值。
1.2 不要与能够产生噪声的设备，如电焊机、高频淬火机等共用一个电源配电盒。
1.3 应由熟练的电气人员来连接动力线。
2 接地所使用的接地线，必须是铜导线，其横截面积应超过10mm2,电阻低于10Ω。
一般来讲，每台数控机床的地线应接到单独的接地棒上。
如果机床没有提供单独的接地，应按下述连接地线。
规定的独立的接地条件：数控机床地线电阻：10Ω共用地线地线电阻=10Ω/（被接到一个地线上的设备数量）绝对不可以如下图所示的那样去对几个设备连接地线。
3 环境条件机床应适合在下述规定的实际环境和运行条件中使用。
NC 机床 NC 机床●电源电压：额定的电源电压的±10%●电源频率： 50Hz±0.5Hz●环境温度：5℃～40℃范围内，且24h平均温度应不超过35℃●相对湿度：低于75%●湿度变化的原则是不应引起冷凝●大气：没有过分的灰尘、酸气、腐蚀气体和盐分。
●应当避免阳光直射机床，或热辐射机床而引起环境温度的变化。
●防止机床受到外来不正常的振动。
CDE系列普通车床产品介绍
CDE 普通车床产品介绍1.概述CDE 系列普通车床是大连机床集团结合世界知名企业英国600集团产品新研制开发的具有宜人性的新型普通车床，外观采用流行的直角平面造型，前后腿宽大。
床身经过了表面高频淬火、磨削加工，淬火硬度G50。
床头箱齿轮经过了齿部高频淬火、精密磨齿加工，齿轮精度可达7级。
本系列有CDE6140A、CDE6240A、CDE6150A、CDE6250A、CDE6166A和CDE6266A等型号的普通车床。
根据用户不同需要配置。
左右手轮溜板箱，有公制、英制、公英对照等型式。
●机床主轴箱内采用机械摩擦片离合器，不用改变电机的转速和停止电机便可实现主轴的变速、停止，换向。
●机床的溜板箱设有快速移动装置、设有过载安全保护装置；纵横向十字操纵手柄、开合螺母手柄。
●机床的进给箱；不用变换挂轮，便可车削公制、英制、模数、径节螺纹。
●可提供公制机床、英制机床、左手轮溜板箱等多种组合；●本系列机床主轴孔径的主轴孔径为为52mm。
机床的主轴头形式为C6；本系列机床的主电机的功率为7.5kW/50Hz（为5.5Kw/60Hz）；特殊定货5.5kW/50Hz●机床的床头箱、进给箱采用油泵强制润滑；机床的噪声声压级不大于83（A）1.1 机床外观图2 机床的功用和加工范围2.1机床的功用在本机床上可以车削零件的外圆、内孔和端面、可以钻孔、铰孔和拉油槽，可以加工各种公制、英制、模数、径节螺纹，用户提出特殊定货还可以加工周节螺纹，本机床特别适合于小批量生产的加工车间和机械修理车间使用。
本机床可加工钢、铸铁及有色金属、非金属等材料。
在本机床上加工的零件尺寸精度可达到IT7级，表面粗糙度可达到1.6级。
2.2 加工范围机床加工范围应根据机床规格及其技术参数确定。
禁止超过机床的参数范围加工。
否则，会损坏机床甚至发生人身伤亡事故。
注意！当使用马鞍车床加工超过床身上最大回转直径的扁平盘类工件时，拆下马鞍导轨后应避免加工时床鞍左端面超出床身导轨端面，在这种情况下可通过调整刀架滑板或加长刀杆使之满足切削长度要求。
Chemlok 6150一种用于粘合各种弹簧到金属的表面处理剂说明书
Chemlok® 6150 Technical Data SheetChemlok® 6150 is a one-coat surface treatment usedto affix a variety of elastomers to various metals. It is composed of a mixture of polymers, organic compounds and mineral fillers dissolved or dispersed in an organic solvent system.Chemlok 6150 provides high strength systems with environmental resistance to harsh environments. It is a non-chlorinated solvent surface treatment that can applied as a one- or two-coat system.Features and Benefits:Versatile – affixes a wide variety of elastomers to metals, plastics and fabrics; suitable for existing production lines; tolerates a wide variety of stock formulations. Convenient – requires only a single coat for most applications, reducing labor, solvent usage, inventory and shipping costs.Durable – provides high tear and cohesive strength; demonstrates superior performance with plated metals, lowering scrap rates.Elastomers:• Natural Rubber (NR) • Nitrile (NBR)• Polyisoprene (IR) • Butyl (IIR)• Styrene-butadiene (SBR) • EPDM Polymers• Polybutadiene (BR) • Polyepichlorohydrin (ECO)• Polychloroprene (CR)Application:Surface Preparation – Thoroughly clean metal surfaces prior to application. Remove protective oils, cutting oils and greases by solvent degreasing or alkaline cleaning. Remove rust, scale or oxide coatings by suitable chemical or mechanical cleaning methods.Apply Chemlok 6150 to stainless steel, aluminum, brass and other nonferrous substrates within one-half hour after cleaning. For ferrous substrates such as steel, a longer layover can be tolerated if no rust is formed.For further detailed information on surface preparation of specific substrates, refer to Chemlok application guide. Mixing – Thoroughly stir Chemlok 6150 before use,and agitate sufficiently during use to keep dispersed solids uniformly suspended. If needed, proper dilutionfor the various application methods is best achieved by experience. Give careful attention to agitation since dilution will accelerate settling.Applying – Apply Chemlok 6150 by brush, dip, roll coat, spray or any other method that gives a uniform coating and avoids excessive runs and tears.When using Chemlok 6150 as a one-coat surface treatment, the dry film thickness should be 17.8-30.5 micron (0.7-1.2 mil). When used as a covercoat over a primer, the dry film thickness of Chemlok 6150 should be15.2-20.3 micron (0.6-0.8 mil).Chemlok 6150 — Technical Data SheetParker LORDEngineered Materials Group 111 LORD DriveCary, NC 27511-7923USAValues stated in this document represent typical values as not all tests are run on each lot of material produced. For formalized product specifications for specific product end uses, contact the Customer Support Center.Information provided herein is based upon tests believed to be reliable. In as much as Parker LORD has no control over the manner in which others may use this information, it does not guarantee the results to be obtained. In addition, Parker LORD does not guarantee the performance of the product or the results obtained from the use of the product or this information where the product has been repackaged by any third party, including but not limited to any product end-user. Nor does the company make any express or implied warranty of merchantability or fitness for a particular purpose concerning the effects or results of such use.WARNING — USER RESPONSIBILITY . FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE.This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise.The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of the application are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors.To the extent that Parker or its subsidiaries or authorized distributors provide component or system options based upon data or specifications provided by the user, the user is responsible for determining that such data and specifications are suitable and sufficient for all applications and reasonably foreseeable uses of the components or systems.©2021 Parker Hannifin - All Rights ReservedInformation and specifications subject to change without notice and without liability therefor. Trademarks used herein are the property of their respective owners.OD DS6002CE 07/21 Rev.2Drying/Curing – Allow Chemlok 6150 to dry until visual examination of the film has shown that all solvent has evaporated. This will take approximately 20-40 minutes at room temperature. Drying time can be shortened by either preheating the metal inserts or oven drying after application. Metal parts may be preheated to a maximum of 65°C (150°F) prior to application of Chemlok 6150. For coated parts, moderate drying temperatures should be used, but temperatures as high as 149°C (300°F) may be used for very short periods of time. Maximum air flow at minimum temperatures will give the best results.Cleanup – Use solvents such as xylene and MEK toremove Chemlok 6150 before heat is applied. Once cured, removal by solvent is not possible.Shelf Life/Storage:Shelf life is one year from date of manufacture whenstored by the recipient in a well ventilated area at 21-27°C (70-80°F) in original, unopened container. Do not store or use near heat, sparks or open flame. Keep container tightly closed when not in use.Chemlok 6150 is moisture sensitive. Minimize exposure to moisture during application and storage. Avoid excessive exposure to high humidity.Cautionary Information:Before using this or any Parker LORD product, refer to the Safety Data Sheet (SDS) and label for safe use and handling instructions.For industrial/commercial use only. Required to use under organized emissions. Must be applied by trained personnel only. Not to be used in household applications. Not for consumer use.Chemlok® 6150是一种单涂表面处理剂，可以帮助和促进各式各样的弹性体附着至各种金属。
CIRCALOK 6150产品说明书
USA SAFETY DATA SHEET3000000042181. CHEMICAL PRODUCT AND COMPANY IDENTIFICATIONProduct name: CIRCALOK 6150Product Use/Class:Thermally Conductive AdhesiveLORD Corporation 111 LORD DriveCary, NC 27511-7923 USATelephone: 814 868-3180Non-Transportation Emergency: 814 763-2345 Chemtrec 24 Hr Transportation Emergency No.800 424-9300 (Outside Continental U.S. 703 527-3887)EFFECTIVE DATE: 06/24/20162. HAZARDS IDENTIFICATIONGHS CLASSIFICATION:Skin corrosion/irritation Category 2Serious eye damage/eye irritation Category 2A Skin sensitization Category 1Specific target organ systemic toxicity (single exposure) Category 3Specific target organ systemic toxicity (repeated exposure) Category 1 Lungs, Respiratory system Hazardous to the aquatic environment - acute hazard Category 1 Hazardous to the aquatic environment - chronic hazard Category 2GHS LABEL ELEMENTS: Symbol(s)Signal WordD ANGERHazard StatementsCauses skin irritation.Causes serious eye irritation.May cause an allergic skin reaction. May cause respiratory irritation.Causes damage to organs through prolonged or repeated exposure.(Lungs, Respiratory system) Very toxic to aquatic life.Toxic to aquatic life with long lasting effects.Precautionary Statements PreventionWear protective gloves/eye protection/face protection. Do not breathe dust/fume/gas/mist/vapors/spray. Wash thoroughly after handling.Do not eat, drink or smoke when using this product. Use only outdoors or in a well-ventilated area.Contaminated work clothing should not be allowed out of the workplace. Avoid release to the environment.ResponseCall a POISON CENTER or doctor/physician if you feel unwell.Specific treatment (see supplemental first aid instructions on this label).IF INHALED: Remove to fresh air and keep at rest in a position comfortable for breathing.IF ON SKIN: Wash with plenty of soap and water.If skin irritation or rash occurs: Get medical advice/attention.IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do.Continue rinsing.Take off contaminated clothing and wash before reuse.Collect spillage.StorageStore in a well-ventilated place. Keep container tightly closed.Store locked up.Disposal:Dispose of contents/container in accordance with waste/disposal laws and regulations of your country or particular locality.Other Hazards:This product contains component(s) which have the following warnings; however based on the GHS classification criteria of your country or locale, the product mixture may be outside the respective category(s).Acute: Harmful if swallowed. Ingestion is not an expected route of entry in industrial or commercial uses.Chronic: Prolonged or repeated contact may result in dermatitis. IARC has designated titanium dioxide (TiO2) as Group 2B – possibly carcinogenic to humans in dust form. However, a number of long term animal studies andhuman epidemiology studies evaluating TiO2 and workplace exposure show insufficient evidence for carcinogenic effects. EPA, NTP and OSHA do not designate TiO2 as a carcinogen and ACGIH designates TiO2 as A4 - notclassifiable as a human carcinogen. Mortaility from other chronic diseases, including other respiratory diseases, was not associated with exposure to TiO2 dust. TiO2 is not present in this product as a dust and no airborne exposure is expected during application.3. COMPOSITION/INFORMATION ON INGREDIENTSChemical Name CAS Number RangeEpoxy resin PROPRIETARY45 - 50%Titanium dioxide13463-67-70.1 - 0.9%Any "PROPRIETARY" component(s) in the above table is considered trade secret, thus the specific chemical and its exact concentration is being withheld.4. FIRST AID MEASURESFIRST AID - EYE CONTACT: Flush eyes immediately with large amount of water for at least 15 minutes holding eyelids open while flushing. Get prompt medical attention.FIRST AID - SKIN CONTACT: Flush contaminated skin with large amounts of water while removing contaminated clothing. Wash affected skin areas with soap and water. Get medical attention if symptoms occur.FIRST AID - INHALATION: Move person to fresh air. Restore and support continued breathing. If breathing is difficult, give oxygen. Get immediate medical attention.FIRST AID - INGESTION: If swallowed, do not induce vomiting. Call a physician or poison control center immediately for further instructions. Never give anything by mouth if victim is rapidly losing consciousness, unconscious or convulsing.5. FIRE-FIGHTING MEASURESSUITABLE EXTINGUISHING MEDIA: Carbon Dioxide, Dry Chemical, Foam, Water FogUNSUITABLE EXTINGUISHING MEDIA: Not determined for this product.SPECIFIC HAZARDS POSSIBLY ARISING FROM THE CHEMICAL: Keep containers tightly closed. Closed containers may rupture when exposed to extreme heat. Use water spray to keep fire exposed containers cool. During a fire, irritating and/or toxic gases and particulate may be generated by thermal decomposition or combustion.SPECIAL PROTECTIVE EQUIPMENT AND PRECAUTIONS FOR FIRE-FIGHTERS: Wear full firefighting protective clothing, including self-contained breathing apparatus (SCBA). If water is used, fog nozzles are preferable.6. ACCIDENTAL RELEASE MEASURESPERSONAL PRECAUTIONS, PROTECTIVE EQUIPMENT, AND EMERGENCY PROCEDURES: Avoid breathing vapors. Avoid contact. Use appropriate respiratory protection for large spills or spills in confined area.ENVIRONMENTAL PRECAUTIONS: Do not contaminate bodies of water, waterways, or ditches, with chemical or used container.METHODS AND MATERIALS FOR CONTAINMENT AND CLEANUP: Notify appropriate authorities if necessary. Avoid contact. Keep non-essential personnel away from spill area. Scoop spilled material into an appropriate container for proper disposal. (If necessary, use inert absorbent material to aid in containing the spill).7. HANDLING AND STORAGEHANDLING: Keep closure tight and container upright to prevent leakage. Avoid skin and eye contact. Wash thoroughly after handling. Do not handle until all safety precautions have been read and understood. Empty containers should not be re-used. Use with adequate ventilation.STORAGE: Avoid excessive heat. Avoid moisture contamination. Product should be stored frozen for best shelf life. Store only in well-ventilated areas. Keep container closed when not in use.INCOMPATIBILITY: Strong acids and bases.8. EXPOSURE CONTROLS/PERSONAL PROTECTIONCOMPONENT EXPOSURE LIMITChemical Name ACGIH TLV-TWA ACGIH TLV-STELOSHA PEL-TWAOSHA PEL-CEILINGSkinEpoxy resin N.E.N.E.N.E. N.E.N.A.Titanium dioxide10 mg/m3N.E.15 mg/m3 N.E.N.A.N.A. - Not Applicable, N.E. - Not Established, S - Skin DesignationEngineering controls: Sufficient ventilation in pattern and volume should be provided in order to maintain air contaminant levels below recommended exposure limits.PERSONAL PROTECTION MEASURES/EQUIPMENT:RESPIRATORY PROTECTION: Use a NIOSH approved air-purifying organic vapor respirator if occupational limits are exceeded. For emergency situations, confined space use, or other conditions where exposure limits may be greatly exceeded, use an approved air-supplied respirator. Observe OSHA regulations (29CFR 1910.134) forrespirator use. Note: If the exposure limit for formaldehyde is exceeded, a formaldehyde-specific,formaldehyde/organic vapor combination, or airline respirator may be required.SKIN PROTECTION: Use neoprene, nitrile, or rubber gloves to prevent skin contact.EYE PROTECTION: Use safety eyewear including safety glasses with side shields and chemical goggles where splashing may occur.OTHER PROTECTIVE EQUIPMENT: Use disposable or impervious clothing if work clothing contamination is likely. Remove and wash contaminated clothing before reuse.HYGIENIC PRACTICES: Wash hands before eating, smoking, or using toilet facility. Food or beverages should not be consumed anywhere this product is handled or stored. Wash thoroughly after handling.9. PHYSICAL AND CHEMICAL PROPERTIESTypical values, not to be used for specification purposes.ODOR: Ammonia VAPOR PRESSURE: N.D.APPEARANCE: White VAPOR DENSITY: Heavier than Air PHYSICAL STATE: Paste LOWER EXPLOSIVE LIMIT: Not ApplicableFLASH POINT: ≥ 201 °F, 93 °CUPPER EXPLOSIVE LIMIT: Not ApplicableSetaflash Closed CupBOILING RANGE: N.A.EVAPORATION RATE: Not Applicable AUTOIGNITION TEMPERATURE:N.D.DENSITY: 1.74 g/cm3 - 14.45 lb/gal DECOMPOSITION TEMPERATURE:N.D. VISCOSITY, DYNAMIC: N.D.ODOR THRESHOLD: N.D.VISCOSITY, KINEMATIC: N.D.SOLUBILITY IN H2O: Insoluble VOLATILE BY WEIGHT: 0.02 %pH: N.A.VOLATILE BY VOLUME: 0.04 %FREEZE POINT: N.D. VOC CALCULATED: 0 lb/gal, 0 g/l COEFFICIENT OF WATER/OILN.D.DISTRIBUTION:LEGEND: N.A. - Not Applicable, N.E. - Not Established, N.D. - Not Determined10. STABILITY AND REACTIVITYHAZARDOUS POLYMERIZATION: Hazardous polymerization will not occur under normal conditions. STABILITY: Product is stable under normal storage conditions.CONDITIONS TO AVOID: Moisture.; Storage temperatures above 80F shorten the shelf life of this mixture. Stable at normal room temperatures. If large masses are heated, violent autopolymerization may occur.; Product mixtures with low molecular weight ketones, alcohols, or ethers in the presence of acids or bases may cause polymerization. Mixtures involving greater than one pound of product may generate considerable heat and fumes from exothermic reaction.; High temperatures.INCOMPATIBILITY: Strong acids and bases.HAZARDOUS DECOMPOSITION PRODUCTS: Ammonia, Aldehydes, Acids, Carbon monoxide, carbon dioxide, oxides of nitrogen, Metal oxides11. TOXICOLOGICAL INFORMATIONEXPOSURE PATH: Refer to section 2 of this SDS.SYMPTOMS:Refer to section 2 of this SDS.TOXICITY MEASURES:Chemical Name LD50/LC50Epoxy resin Oral LD50: Rat11,400 mg/kgTitanium dioxide Oral LD50: Rat> 10,000 mg/kgDermal LD50: rabbit> 5,000 mg/kgGHS LC50 (vapour): Acute toxicity point estimate55 mg/lGerm cell mutagenicity: No classification proposedCarcinogenicity: No classification proposedReproductive toxicity: No classification proposed12. ECOLOGICAL INFORMATIONECOTOXICITY:Chemical Name EcotoxicityEpoxy resin N.D.Titanium dioxide N.D.PERSISTENCE AND DEGRADABILITY:Not determined for this product.BIOACCUMULATIVE: Not determined for this product.MOBILITY IN SOIL: Not determined for this product.OTHER ADVERSE EFFECTS: Not determined for this product.13. DISPOSAL CONSIDERATIONSDISPOSAL METHOD: Disposal should be done in accordance with Federal (40CFR Part 261), state and local environmental control regulations. If waste is determined to be hazardous, use licensed hazardous waste transporter and disposal facility.14. TRANSPORT INFORMATIONUS DOT RoadDOT Proper Shipping Name: Environmentally hazardous substances, liquid, n.o.s.DOT Hazard Class: 9SECONDARY HAZARD: NoneDOT UN/NA Number: 3082Packing Group: IIIEmergency Response Guide Number: 171For US DOT non-bulk road shipments this material may be classified as NOT REGULATED. For the mostaccurate shipping information, refer to your transportation/compliance department regarding changes inpackage size, mode of shipment or other regulatory descriptors.IATA CargoPROPER SHIPPING NAME: Environmentally hazardous substance, liquid, n.o.s.DOT Hazard Class: 9HAZARD CLASS: NoneUN-NUMBER: 3082PACKING GROUP: IIIEMS: 9LIMDGPROPER SHIPPING NAME: Environmentally hazardous substance, liquid, n.o.s.DOT Hazard Class: 9HAZARD CLASS: NoneUN-NUMBER: 3082PACKING GROUP: IIIEMS: F-AThe listed transportation classification applies to IATA Cargo and IMDG non-bulk shipments. It does not address regulatory variations due to changes in package size, mode of shipment or other regulatory descriptors for your country or particular locality. For the most accurate shipping information, refer to your transportation/compliance department.15. REGULATORY INFORMATIONU.S. FEDERAL REGULATIONS: AS FOLLOWS:SARA SECTION 313This product contains the following substances subject to the reporting requirements of Section 313 of Title III of the Superfund Amendment and Reauthorization Act of 1986 and 40 CFR part 372.:NONETOXIC SUBSTANCES CONTROL ACT:INVENTORY STATUSThe chemical substances in this product are on the TSCA Section 8 Inventory.EXPORT NOTIFICATIONThis product contains the following chemical substances subject to the reporting requirements of TSCA 12(B) if exported from the United States:NONE16. OTHER INFORMATIONUnder HazCom 2012 it is optional to continue using the HMIS rating system. It is important to ensure employees have been trained to recognize the different numeric ratings associated with the HazCom 2012 and HMIS schemes.HMIS RATINGS - HEALTH: 2 FLAMMABILITY: 1 PHYSICAL HAZARD: 1* - Indicates a chronic hazard; see Section 2Revision: Section 2, Section 11Effective Date: 06/24/2016DISCLAIMERThe information contained herein is, to the best of our knowledge and belief, accurate. However, since the conditions of handling and use are beyond our control, we make no guarantee of results, and assume no liability for damages incurred by use of this material. It is the responsibility of the user to comply with all applicable federal, state and local laws and regulations.。
大连机床数控车床CKD6150维保内容
大连机床数控车床CKD6150维保内容
1日常保养
1.1定期时间：每班班前、班后。
1.2作业时间：各15分钟内。
1.3班前
对机床各重要部位进行检查（液压系统、导轨润滑系统、中央闭式
循环系统、切削水系统是否足够）。
擦净机床外露导轨面及滑动面的尘土。
空车试运转。
1.4班后
抹净操作屏上的油渍。
清扫、擦拭机床。
清扫铁屑。
各部归位。
2一级保养
2.1定期时间：每季度一次。
2.2作业时间：4小时内。
2.3外表
擦拭机床的外表及罩、盖、附件，达到内外清洁、无锈蚀、无黄袍。
检查补齐螺钉、螺母，油杯有无松动。
2.4传动系统、工作台及导轨
检查主轴系统及各定位螺钉有无松动。
检查工作台及导轨面，去除毛刺。
检查各传动机构动作是否正常。
检查丝杆、螺母及调整间隙。
检查刀架、主轴头及刀库运动是否准确可靠。
检查刀眼是否准确
可靠。
2.5液压、润滑、冷却、气动
检查过滤器、冷却泵、冷却箱，要求管路、阀门畅通无泄漏。
检查油质、油量、油位是否符合要求。
检查液压、气动及润滑、冷却系统，调整工作压力。
2.6电器
擦拭电动机及电器箱，达到内外清洁。
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R0833.0D1286SUB30033M40GR4TMR00219N00216R0080.0X0001.5X0001.4ACT R0833.1E1292SUB30034M41GR3TMR00219N00217R0080.1X0001.5X0001.2ACT R0833.2F1298SUB30035M42GR5TMR00219N00218R0080.2X0001.6X0001.2ACT R0833.3G1304SUB30036M43GR5TMR00219N00219R0833.0R0478.6R0463.5H1310MGEAR-F MERR0021900220 0021500212R0833.1I00216R0833.2J00217R0833.3K00218R0463.5F0001.1LMERR RST00219N00220R0463.5ACT R0463.2M1319SUB30026MERR TMR00198002070023100237 00219NOPN00221R0080.0X0001.5R0478.6R0466.2A1323YC1 M41GEAR-F YC1-ON002210022200212R0080.1BM42R0075.7CM40R0080.2X0001.6DM43R0466.2F0001.1EYC1-ON RST00221N00222R0466.2ACT R0466.3F1335SUB30032YC1-ON TMR001980019800232 00221N00223R0080.2X0001.2R0478.6R0463.4G1339YC2 M43GR5GEAR-F YC2-ON002230022400212R0080.1HM42R0075.7X0001.3IM40GR4R0080.0X0001.4JM41GR3R0463.4F0001.1KYC2-ON RST00223N00224R0463.4ACT R0464.7L1353SUB30028YC2-ON TMR00207 00223MNOPN00225R0030.0X0006.3R0415.6R0415.7R0415.0R0478.61A1357J+H SCCW SPCW SSTP.1GEAR-F0006600229002280024800212R0025.3R0050.3R0050.4BM03M0400014X0006.4R0280.3CSTART SP.CW00092R0415.3DSPCCW002251R0485.5R0391.0K0011.1F0001.1R0005.5R0415.3EERR02CKH-L RST R-SP2SPCCW00225002280023200242 00211*003450008800245N00226X0005.7R0415.5R0415.4F1377SJOG002260022700227R0415.4G00226N00227X0005.7R0415.4ACT R0415.5H1381SUB30013SJOG TMR002260024800226N00228R0030.0X0006.1R0391.0R0415.6R0415.3R0415.01I1386J+H SCW CKH-L SPCCW SSTP.100066*00345002290022500248X0005.7JSJOGR0415.7X0005.7KSPCW SJOG00228X0006.4R0280.2LSTART W00093R0025.3R0050.4R0050.3MM04M03000141R0485.5R0478.6K0011.1F0001.1R0005.5R0415.7NERR02GEAR-F RST R-SP2SPCW00225002280023000242 00211002120008800245OPN00229R0050.3R0391.0R0485.5R0415.6A1410M03CKH-L ERR02002250022800229*0034500211R0050.4BM04R0415.6F0001.1CRST00229N00230R0464.2R0466.1F0001.1G0008.4R0465.4R0461.31D1418SP-CCW RST G*ESP0023100210000040023900194R0466.1X0001.5R0535.2R0600.7E002100019800208R0415.7R0416.0FSPCW00228002401R0544.4K0011.1R0544.5G00210002320023500241 0023200252R0544.6H00234N00231R0462.5R0463.2F0001.1R0463.3G0008.4R0464.2I1437RST ERR03G*ESP SP-CCW0023000231 00197002200021400004R0462.1J00202R0462.2K00203R0463.6L00200R0464.2MSP-CCW00231N00232R0464.1R0466.1F0001.1G0008.4R0465.4R0461.3R0544.5R0544.4N1447SP-CW RST G*ESP00210002300023300240 00237002100000400239001940023000252R0466.1R0466.3R0600.7R0544.7O00236002100022200208R0415.3R0416.1PSPCCW0022500241。