SURFACE ACOUSTIC WAVE DEVICE
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专利名称：SURFACE ACOUSTIC WAVE DEVICE 发明人：MURASE TAKAMICHI,KENMOCHI
KATSUE,FUNAKOSHI YASUTOMO 申请号：JP33073689
申请日：19891219
公开号：JPH03190312A
公开日：
19910820
专利内容由知识产权出版社提供
摘要：PURPOSE:To attain high performance at low cost by using an insulating resin for an inner package member and employing a resin even for an outer package member. CONSTITUTION:The entire piezoelectric substance is coated by a 1st resin (thermoplastic resin such as polyphenilene sulfide) 8 and the curing condition of the 1st resin 8 is adjusted to use resin contract at forming thereby forming a gap of several microns or over between the piezoelectric body 1 and the 1st resin 8 and avoiding the excitation, propagation and reception of a surface acoustic wave. Then the surrounding of a lead terminal 7 is adhered to a lead frame 6 by an adhesives 9. Then the 1st resin 8 is covered with a metal-made film 10 to provide a shield effect and covered by a 2nd resin 11 (epoxy group resin) with high air-tightness. Thus, the surface acoustic wave device with low cost and excellent reliability is obtained.
申请人：MATSUSHITA ELECTRIC IND CO LTD
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