DIODE
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申请人：HITACHI LTD,HITACHI MICRO COMPUT ENG LTD
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专利内容由知识产权出版社提供
专利名称：DIODE 发明人：YAMAMOTO YUKIO,KOIKE AKIHIRO,NAITO
T 申请号：JP1857385 申请日：19850204 公开号：JPS61177761A 公开日：19860809
摘要：PURPOSE:To enable the contact of both the followings by increasing the contact area by a method wherein the inner end surface of an electrode member abutting against the pellet's bump electrode is made uneven. CONSTITUTION:The diode is a leadless diode (LLD) for surface mounting and consists of a structure that a pellet 2 having an Ag bump electrode 3 is clamped between the inner end surfaces of two surfacing electrodes 1a, 1b made of e.g. Dumet and is weld-sealed with a glass sleeve 4. The inner end surface of that electrode 1a of the surfacing ones which is located on the side of contact with the bump electrode 3 of the pellet 2 is formed as an uneven surface 5 of waveform in cross section. Therefore, this uneven surface 5 intrudes to the end surface of the bump electrode 3, secures good contact, and increases the contact area more than that of a flat surface. This uneven surface 5 can be easily formed by preparing a waveform-surfaced metal mold and applying its impact in abutment of the electrode end surface against this waveform surface at the time of forming the enlarged head of the surfacing electrode 1a.
更多信息请下载全文后查看
专利内容由知识产权出版社提供
专利名称：DIODE 发明人：YAMAMOTO YUKIO,KOIKE AKIHIRO,NAITO
T 申请号：JP1857385 申请日：19850204 公开号：JPS61177761A 公开日：19860809
摘要：PURPOSE:To enable the contact of both the followings by increasing the contact area by a method wherein the inner end surface of an electrode member abutting against the pellet's bump electrode is made uneven. CONSTITUTION:The diode is a leadless diode (LLD) for surface mounting and consists of a structure that a pellet 2 having an Ag bump electrode 3 is clamped between the inner end surfaces of two surfacing electrodes 1a, 1b made of e.g. Dumet and is weld-sealed with a glass sleeve 4. The inner end surface of that electrode 1a of the surfacing ones which is located on the side of contact with the bump electrode 3 of the pellet 2 is formed as an uneven surface 5 of waveform in cross section. Therefore, this uneven surface 5 intrudes to the end surface of the bump electrode 3, secures good contact, and increases the contact area more than that of a flat surface. This uneven surface 5 can be easily formed by preparing a waveform-surfaced metal mold and applying its impact in abutment of the electrode end surface against this waveform surface at the time of forming the enlarged head of the surfacing electrode 1a.