5082-2815中文资料
5082-7613-0C000中文资料
Features• Industry Standard Size • Industry Standard Pinout7.62 mm (0.300 inch) DIP Leads on 2.54 mm (0.100 inch) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red,Yellow, Green• Excellent Appearance Evenly Lighted Segments ±50° Viewing AngleOptimum Contrast Given byGray Top Surface for AlGaAs Red and Green DevicesRed Top Surface for HER Devices Yellow Top Surface for Yellow Devices• Design Flexibility Common Anode or Common Cathode Single DigitsLeft or Right Hand Decimal Point ±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing• Intensity and Color Selection AvailableSee Intensity and Color Selected Displays Data Sheet• Sunlight Viewable AlGaAsAlGaAs [1]HER [1]Yellow Green Package Red HDSP-5082-5082-HDSP-DescriptionDrawing7610762036007.6 mm Common Anode Left Hand Decimal A 7611762136017.6 mm Common Anode Right Hand Decimal B 7613762336037.6 mm Common Cathode Right Hand Decimal C 7616762636067.6 mm Universal ±1. Overflow Right Hand Decimal [2]D E15076507660460010.9 mm Common Anode Left Hand Decimal E E15176517661460110.9 mm Common Anode Right Hand Decimal F E15376537663460310.9 mm Common Cathode Right Hand Decimal G E15676567666460610.9 mm Universal ±1. Overflow Right Hand Decimal [2]HNotes:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-E10X AlGaAs and HDSP-335X HER data sheet for low current operation.2. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagram D.3. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagram H.Devices5082-761x Series 5082-762x Series 5082-765x Series 5082-766x Series HDSP-360x Series HDSP-460x Series HDSP-E15x Series7.6 mm (0.3 inch)/10.9 mm (0.43 inch) Seven Segment Displays Technical DataDescriptionThe 7.6 mm (0.3 inch) and 10.9mm (0.43 inch) LED sevensegment displays are designed for viewing distances up to 3 metres (10 feet) and 5 metres (16 feet).These devices use an industry standard size package andpinouts. All devices are available as either common anode or common cathode.Part Numbering System5082 -X X X X-X X X X XHDSP-X X X X-X X X X XMechanical Options[1]00: No Mechanical OptionColor Bin Options[1,2]0: No Color Bin Limitation4: Color Bin 4 Only (applicable for Green devices only)B: Color Bins 2 and 3 (applicable for Yellow devices only)Maximum Intensity Bin[1,2]0: No Maximum Intensity Bin LimitationMinimum Intensity Bin[1,2]0: No Minimum Intensity Bin LimitationDevice Configuration/Color[1]0: Common Anode1: Common Anode3: Common CathodeDevice Specific Configuration[1]Refer to Respective DatasheetPackage[1]E: 10.9 mm (0.43 inch) Single Digit Seven Segment Display Notes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearestAgilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.displays are ideal for portable applications. The high light ambient displays are ideal for high light ambients or long string lengths. For additional informa-tion see the Low Current Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.NOTES;1. DIMENSIONS IN MILLIMETRES AND (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. REDUNDANT ANODES.4. UNUSED DP POSITION.5. SEE INTERNALCIRCUIT DIAGRAM.6. REDUNDANT CATHODE.7. SEE PART NUMBER TABLE FOR L.H.D.P.AND R.H.D.P.DESIGNATION.8. FOR YELLOW AND GREEN DEVICES ONLY.Package DimensionsThese displays are ideal for most applications. Pin for pin equiva-lent displays are also available in a low current or high lightambient design. The low currentInternal Circuit DiagramAbsolute Maximum RatingsAlGaAs Red HER Yellow GreenHDSP-E1505082-7610/5082-7620/HDSP-3600/ Description Series7650 Series7660 Series4600 Series Units Average Power per Segment or DP9610580105mW Peak Forward Current per160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per40[2]30[4]20[6]30[8]mA Segment or DPOperating Temperature Range-20 to +100[9]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per 3.0V Segment or DPWave Soldering Temperature for3 Seconds (1.59 mm [0.063 in.] 250°Cbelow Body)Notes:1.See Figure 1 to establish pulsed conditions.2. Derate above 46°C at 0.54 mA/°C.3. See Figure 6 to establish pulsed conditions.4. Derate above 53°C at 0.45 mA/°C.5. See Figure 7 to establish pulsed conditions.6. Derate above 81°C at 0.52 mA/°C.7. See Figure 8 to establish pulsed conditions.8. Derate above 39°C at 0.37 mA/°C.9. For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeries Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V8.515.0mcd I F = 20 mA(Digit Average)1.8V I F = 20 mAForward Voltage/Segment or DP V F2.03.0V I F = 100 mAHDSP-E15x Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-PIN340°C/W/Segto-PinHigh Efficiency RedDeviceSeries Parameter Symbol Min.Typ.Max.Units Test Conditions 5082-761x Luminous Intensity/Segment[1,2,6]340800µcd I F = 5 mA (Digit Average)I V5082-765x3401115µcd I F = 5 mA Forward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mAPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nm AllReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN280°C/WJunction-to-PinDevice Series ParameterSymbol Min.Typ.Max.Units Test Conditions 5082-762x Luminous Intensity/Segment [1,2]205620µcdI F = 5 mA(Digit Average)I V5082-766x290835µcd I F = 5 mA Forward Voltage/Segment or DP V F 2.2 2.5V I F = 20 mAPeak WavelengthλPEAK 583nm Dominant Wavelength [3,7]λd 581.5586592.5nm AllReverse Voltage/Segment or DP [4]V R 3.040V I R = 100 µA Temperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DP Thermal Resistance LED R θJ-PIN280°C/W/SegJunction-to-PinYellowNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-E10X series displays are recommended. They are tested at 1 mA dc/segment and are pin for pin compatible with the HDSP-E15X series.6. For low current operation, the HER HDSP-335X series displays are recommended. They are tested at 2 mA dc/segment and are pin for pin compatible with the 5082-7650 series.7. The Yellow (5082-7620/7660) and Green (HDSP-3600/4600) displays are categorized for dominant wavelength. The category is designated by a number adjacent to the luminous intensity category letter.High Performance GreenDevice Test Series ParameterSymbol Min.Typ.Max.Units Conditions HDSP-360x Luminous Intensity/Segment [1,2]8602700µcdI F = 10 mA(Digit Average)I VHDSP-460x10304000µcd I F = 10 mA Forward Voltage/Segment or DP V F 2.1 2.5V I F = 10 mAPeak WavelengthλPEAK 566nm Dominant Wavelength [3,7]λd 571577nm AllReverse Voltage/Segment or DP [4]V R 3.050V I R = 100 µA Temperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DP Thermal Resistance LED R θJ -PIN280°C/W/SegJunction-to-PinFigure 3. Forward Current vs. Forward Voltage.Figure 2. Maximum Allowable DC Current vs.Ambient Temperature.Figure 4. Relative Luminous Intensity vs. DC Forward Current.Figure 5. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.AlGaAs RedFigure 1. Maximum Allowed Peak Current vs. Pulse Duration – AlGaAs Red.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AT A – AMBIENT TEMPERATURE – °C5030102051525354045I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – V R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A )0I F – FORWARD CURRENT PER SEGMENT – mA2.001.501.250.750.2520401.751.000.5010305152535ηP E A K – N O R M A L I Z E D R E L A T I V E EF F I C I E N C Y0.5I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA50.0150.05.0HER, Yellow, GreenFigure 6. Maximum Tolerable Peak Current vs.Pulse Duration – HER Series.Figure 7. Maximum Tolerable Peak Current vs.Pulse Duration – Yellow Series.Figure 8. Allowable Peak Current vs.Pulse Duration – Green Series.Figure 9. Maximum Allowable DC Current vs.Ambient Temperature.Figure 11. Relative LuminousIntensity vs. DC Forward Current.Figure 10. Forward Current vs.Forward Voltage.Figure 12. Relative LuminousEfficiency (Luminous Intensity per Unit Current) vs. Peak Current.HDSP-E15x IV Bin Category Min.Max.L 8.6715.90M 13.0023.80N 19.5035.80O 29.3053.60P 43.9080.50Intensity Bin Limits (mcd)AlGaAs RedHER5082-761x IV Bin Category Min.Max.B 0.3690.630C 0.5160.946D 0.774 1.418E 1.160 2.127F 1.740 3.190G 2.610 4.785H 3.9157.1775082-765xIV Bin Category Min.Max.B 0.3470.593C 0.4850.890D 0.728 1.333E 1.091 2.000F 1.636 3.000G 2.454 4.500H 3.6826.751Yellow5082-762x IV Bin Category Min.Max.B 0.2290.387C 0.3170.582D 0.4760.872E 0.714 1.311F 1.073 1.967G 1.609 2.950H 2.413 4.4255082-766xIV Bin Category Min.Max.C 0.2970.543D 0.4450.817E 0.669 1.225F 1.003 1.838G 1.504 2.758H 2.2564.137HDSP-460xIV Bin Category Min.Max.G 1.03 1.88H 1.54 2.82I 2.31 4.23J 3.46 6.34K 5.189.50L 7.7814.26GreenHDSP-360x IV Bin Category Min.Max.H 0.86 1.58I 1.29 2.37J 1.94 3.55K 2.90 5.33L 4.378.01Color CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.Contrast EnhancementFor information on contrastenhancement, please seeApplication Note 1015.Soldering/CleaningFor information on solderingLEDs, please refer to ApplicationNote 1027.元器件交易网/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5963-7394EJuly 17, 20045988-3325EN。
GB50821985起重吊运指挥信号
两旗分别拢起，向前伸出，旗头由前方向下摆动（图56）。
2．2．21“停止”
单旗左右摆动，另一面旗自然放下（图57）。
图57
2．2．22“紧急停止”
双手分别持旗，同时左右摆动（图58）。
图58
2．2．23“工作结束”
两旗拢起，在额前交叉（图59）。
图59
2．3音响信号
2．3．1“预备”、“停止”
图5
2．1．1．6“吊钩水平移动”
小臂向侧上方伸直，五指并拢手心朝外，朝负载应运行的方向，向下挥动到与肩相平的位置（图6）。
图6
2．1．1．7“吊钩微微上升”
小臂伸向侧前上方，手心朝上高于肩部，以腕部为轴，重复向上摆动手掌（图7）。
2．1．1．8“吊钩微微下落”
手臂伸向侧前下方，与身体夹角约为30°，手心朝下，以腕部为轴，重复向下摆动手掌（图8）。
单手自然握拳，置于头上，轻触头顶（图2）
2．1．1．3“要副钩”
一只手握拳，小臂向上不动，另一只手伸出，手心轻触前只手的肘关节（图3）
2．1．1．4“吊钩上升”
小臂向侧上方伸直，五指自然伸开，高于肩部，以腕部为轴转动（图4）
2．1．1．5“吊钩下降”
手臂伸向侧前下方，与身体夹角约为30°，五指自然伸开，以腕部为轴转动（图5）。
两手分别拢旗，伸向一侧，其间距与负载所要移动的距离接近（图52）。
2．2．17“指示降落方位”
单手拢绿旗，指向负载应降落的位置，旗头进行转动（图53）。
2．2．18“履带起重机回转”
一只手拢旗，水平指向侧前方，另只手持旗，水平重复挥动（图54）。
图54
2．2．19“起重机前进”
两旗分别拢起，向前上方伸出，旗头由前上方向后摆动（图55）。
5082-2800中文资料
Schottky Barrier Diodes for General Purpose ApplicationsTechnical DataFeatures• Low Turn-On VoltageAs Low as 0.34 V at 1 mA• Pico Second Switching Speed • High Breakdown VoltageUp to 70 V• Matched Characteristics AvailableDescription/Applications The 1N5711, 1N5712, 5082-2800/ 10/11 are passivated Schottky barrier diodes which use a patented “guard ring” design to achieve a high breakdown voltage. Packaged in a low cost glass package, they are well suited for high level detecting, mixing, switching, gating, log or A-D converting, video detecting, frequency discriminating, sampling, and wave shaping.The 5082-2835 is a passivatedSchottky diode in a low cost glasspackage. It is optimized for lowturn-on voltage. The 5082-2835 isparticularly well suited for theUHF mixing needs of the CATVmarketplace.The 5082-2300 Series and5082-2900 devices are unpas-sivated Schottky diodes in a glasspackage. These diodes haveextremely low 1/f noise and areideal for low noise mixing, andhigh sensitivity detecting. Theyare particularly well suited for usein Doppler or narrow band videoreceivers.1N57111N57125082-2300 Series5082-2800 Series5082-2900DIMENSIONS IN MILLIMETERS AND (INCHES).Outline 15Maximum RatingsJunction Operating and Storage Temperature Range5082-2303, -2900.................................................................-60°C to +100°C 1N5711, 1N5712, 5082-2800/10/11....................................-65°C to +200°C 5082-2835............................................................................-60°C to +150°C DC Power Dissipation(Measured in an infinite heat sink at T CASE = 25°C)Derate linearly to zero at maximum rated temperature5082-2303, -2900..............................................................................100 mW 1N5711, 1N5712, 5082-2800/10/11.................................................250 mW 5082-2835.........................................................................................150 mW Peak Inverse Voltage.................................................................................V BRPackage CharacteristicsOutline 15Lead Material........................................................................................DumetLead Finish..............................................................................95-5% Tin-LeadMax. Soldering Temperature................................................260°C for 5 secMin. Lead Strength....................................................................4 pounds pullTypical Package Inductance1N5711, 1N5712:................................................................................2.0 nH2800 Series:........................................................................................2.0 nH2300 Series, 2900:..............................................................................3.0 nHTypical Package Capacitance1N5711, 1N5712:................................................................................0.2 pF2800 Series:........................................................................................0.2 pF2300 Series, 2900:............................................................................0.07 pFThe leads on the Outline 15 package should be restricted so that thebend starts at least 1/16 inch from the glass body.Outline 15 diodes are available on tape and reel. The tape and reelspecification is patterned after RS-296-D.Electrical Specifications at T= 25°CAGeneral Purpose DiodesMin.Max.V F = 1 V Max.Max.Max.Breakdown Forward at Forward Reverse Leakage Capaci-Part Package Voltage Voltage Current Current tance Number Outline V BR (V)V F (mV)I F (mA)I R (nA) at V R (V)C T (pF) 5082-280015704101520050 2.0 1N571115704101520050 2.0 5082-281015204103510015 1.2 1N571215205503515016 1.2 5082-28111515410201008 1.2 5082-2835158*34010*1001 1.0 Test I R = 10 µA I F = 1 mA*V F = 0.45 V V R = 0 V Conditions*I R = 100 µA f =1.0 MHz Note: Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA except for 5082-2835 which is measured at 20 mA.Low 1/f (Flicker) Noise DiodesMin.Max.V F = 1 V Max.Max.Max.Part Breakdown Forward at Forward Reverse Leakage Capaci-Number Package Voltage Voltage Current Current tance 5082-Outline V BR (V)V F (mV)I F (mA)I R (nA) at V R (V)C T (pF) 230315204003550015 1.0 29001510400201005 1.2 Test I R = 10 µA I F = 1 mA V R = 0 V Conditions f =1.0 MHzNote: Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 20 mA.Matched Pairs and QuadsBasic Matched MatchedPart Number Pair Quad Batch5082-Unconnected Unconnected Matched[1]Test Conditions2900∆VF at IF= 1.0, 10 mA28005082-28045082-2805∆V F at I F = 0.5, 5 mA ∆V F = 20 mV∆V F = 20 mV*I F = 10 mA∆C O at f = 1.0 MHz28115082-2826∆VF at IF= 10 mA∆V F = 10 mV∆C O at f = 1.0 MHz ∆C O = 0.1 pF28355082-2080∆VF at IF=10 mA∆V F = 10 mV∆C O at f = 1.0 MHz∆C O = 0.1 pFNote:1. Batch matched devices have a minimum batch size of 50 devices.SPICE ParametersParameter Units5082-28005082-28105082-28115082-28355082-23035082-2900B V V75251892510C J0pF 1.60.8 1.00.70.7 1.1E G eV0.690.690.690.690.690.69I BV A10E-510E-510E-510E-510E-510E-5I S A 2.2 x 10E-9 1.1 x 10E-90.3 x 10E-8 2.2 x 10E-87 x 1.0E-910E-8N 1.08 1.08 1.08 1.08 1.08 1.08 R SΩ25101051015 P B V0.60.60.60.560.640.64 PT222222 M0.50.50.50.50.50.5Typical ParametersV F – FORWARD VOLTAGE (V)Figure 1. I-V Curve Showing Typical Temperature Variation for 5082-2300 Series and 5082-2900 Schottky Diodes.1001010.10.01I F - F O R W A R D C U R R E N T (m A )V BR (V)Figure 2. 5082-2300 Series Typical Reverse Current vs. Reverse Voltage at Various Temperatures.10.0001,000100101I R (n A )051015100755025T A = 25°CI F - FORWARD CURRENT (mA)Figure 3. 5082-2300 Series and 5082-2900 Typical Dynamic Resistance (R D ) vs. Forward Current (I F ).100010010R D - D Y N A M I C R E S I S T AN C E (Ω)0.01010100V R - REVERSE VOLTAGE (V)Figure 4. 5082-2300 and 5082-2900 Typical Capacitance vs. Reverse Voltage.1.21.00.80.60.40.20C T - C A P A C I T A N C E (p F )048121620V F - FORWARD VOLTAGE (V)Figure 5. I-V Curve Showing Typical Temperature Variation for 5082-2800 or 1N5711 Schottky Diodes.5010510.50.10.050.01I F - F O R W A R D C U R R E N T (m A )00.20.40.60.8 1.0 1.2V R - REVERSE VOLTAGE (V)Figure 6. (5082-2800 OR 1N5711) Typical Variation of Reverse Current (I R ) vs. Reverse Voltage (V R ) at Various Temperatures.100,00010,0001000100101I R - R E V E R S E C U R R E N T (n A )0.20.40.60.81.01.2V R - REVERSE VOLTAGE (V)Figure 7. (5082-2800 or 1N5711)Typical Capacitance (C T ) vs. Reverse Voltage (V R ).12.01.51.00.50C T - C A P A C I T A N C E (p F )010********V F - FORWARD VOLTAGE (V)Figure 8. I-V Curve Showing Typical Temperature Variation for the 5082-2810 or 1N5712 Schottky Diode.100101.00.10.01I F - F O R W A R D C U R R E N T (m A )V R - REVERSE VOLTAGE (V)Figure 9. (5082-2810 or IN5712)Typical Variation of Reverse Current (I R ) vs. Reverse Voltage (V R ) at Various Temperatures.10,0001000100101.0I R - R E V E R S E C U R R E N T (n A )Typical Parameters, continuedV F - FORWARD VOLTAGE (V)Figure 10. I-V Curve Showing Typical Temperature Variation for the 5082-2811 Schottky Diode.100101.00.10.01I F - F O R W A R D C U R R E N T (m A )0.40.20.60.81.01.2V R - REVERSE VOLTAGE (V)Figure 11. (5082-2811) Typical Variation of Reverse Current (I R ) vs. Reverse Voltage (V R ) at Various Temperatures.100,00010,0001000100101I R - R E V E R S E C U R R E N T (n A )0510********V F - FORWARD VOLTAGE (V)Figure 12. I-V Curve Showing Typical Temperature Variations for 5082-2835 Schottky Diode.100101.00.10.01I F - F O R W A R D C U R R E N T (m A )00.20.40.60.8 1.0 1.2V R - REVERSE VOLTAGE (V)Figure 13. (5082-2835) Typical Variation of Reverse Current (I R ) vs. Reverse Voltage (V R ) at Various Temperatures.100,00010,0001000100101I R - R E V E R S E C U R R E N T (n A )0123456V R - REVERSE VOLTAGE (V)Figure 14. Typical Capacitance (C T ) vs. Reverse Voltage (V R ).C T - C A P A C I T A N C E (p F )0246810I F - FORWARD CURRENT (mA)Figure 15. Typical Dynamic Resistance (R D ) vs. Forward Current (I F ).1000100101R D - D Y N A M I C R E S I S T A N C E (Ω)Diode Package Marking1N5xxx5082-xxxxwould be marked:1Nx xxxxx xxYWW YWWwhere xxxx are the last four digits of the 1Nxxxx or the 5082-xxxx partnumber. Y is the last digit of the calendar year. WW is the work week ofmanufacture.Examples of diodes manufactured during workweek45 of 1999:1N57125082-3080would be marked:1N53071280945945Data subject to change.Copyright © 1999 Agilent TechnologiesObsoletes 5968-4304E5968-7181E (11/99)。
WK28515-T-50电源模块详细规范
WKI2815D-15M电源模块规范1 范围本规范规定了WKI2815D-15M电源模块 (以下简称模块)的技术要求、试验方法、质量评定规则、标志、包装、运输和贮存等。
2 规范性引用文件下列文件中的条款通过本标准的引用而成为本标准的条款。
凡是注日期的引用文件，其随后所有的修改单（不包括勘误的内容）或修订版均不适用于本标准，然而，鼓励根据本标准达成协议的各方研究是否可使用这些文件的最新版本。
凡是不注日期的引用文件，其最新版本适用于本标准。
GB191-2000 包装储运图示标志GJB150—86 军用设备环境试验方法GJB360A-96 电子及电气元件试验方法GJB548A—96 微电子器件试验方法和程序SJ20646-97 混合集成电路DC/DC变换器测试方法SJ20668-1998 微电路模块总规范3 要求3.1 总则每个模块的要求应符合本规范和相应标准，当本规范与标准要求不一致时，应以本规范为准。
3.2 设计、结构和外形3.2.1 绝对最大额定值绝对最大额定值见表1：表1 绝对最大额定值3.2.2 外壳外形外壳外形见图1，规格尺寸见表2的规定。
图1 外壳外形图3.2.3 管脚排列管脚排列见图2，管脚定义见表3。
图 2 正视图表3 管脚定义3.3 电特性注：1 交叉调整率测试条件：+P OUT =50%额定负载，-P OUT =10%～50%额定负载变化； -P OUT =50%额定负载，+P OUT =10%～50%额定负载变化；2 模块正常工作时，输出双路电压不允许空载工作；最小负载10% P OUT 。
3 输出纹波电压测试条件： 20MHz 带宽限制，方法：靠测法测量表 6 动态电特性-------------------------。
HSMS-2803中文资料
Technical Data
HSMS-28XX Series
Features
• Surface Mount SOT-23/SOT143 Package
• Low Turn-On Voltage (As Low as 0.34 V at 1 mA)
HSMS-286X
7.0 0.18 0.69 10E-5 5.0 x 10E -8 1.08 5.0 0.65
2 0.5
4
IF - FORWARD CURRENT (mA)
∆VF - FORWARD VOLTAGE DIFFERENCE (mV)
IF - FORWARD CURRENT (mA)
Typical Parameters at TA = 25°C (unless otherwise noted), Single Diode
HSMS-2820 series of diodes is the best all-around choice for most applications, featuring low series resistance, low forward voltage at all current levels and good RF characteristics. The HSMS-2860 series is a high performance diode offering superior Vf and ultra-low capacitance.
CDIAGONAL = _C_1_x__C_2_ + _C_3__x_C__4 C1 + C2 C3 + C4
DV250501;中文规格书,Datasheet资料
MMCP250XXDevelopment KitUser’s Guide 2004 Microchip Technology Inc.DS51266CDS51266C-page ii2004 Microchip Technology rmation contained in this publication regarding deviceapplications and the like is intended through suggestion onlyand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.No representation or warranty is given and no liability isassumed by Microchip T echnology Incorporated with respectto the accuracy or use of such information, or infringement ofpatents or other intellectual property rights arising from suchuse or otherwise. Use of Microchip’s products as criticalcomponents in life support systems is not authorized exceptwith express written approval by Microchip. No licenses areconveyed, implicitly or otherwise, under any intellectual property rights.Note the following details of the code protection feature on Microchip devices:•Microchip products meet the specification contained in their particular Microchip Data Sheet.•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to ourknowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.•Microchip is willing to work with the customer who is concerned about the integrity of their code.•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities inChandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro ® 8-bit MCUs, K EE L OQ ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analogproducts. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K EE L OQ , MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.AmpLab, FilterLab, micro ID , MXDEV , MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.Application Maestro, dsPICDEM, ,dsPICworks, ECAN, ECONOMONITOR, FanSense,FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP ,ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK,MPSIM, PICkit, PICDEM, , PICtail, PowerCal,PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, SelectMode, SmartSensor, SmartTel and T otal Endurance aretrademarks of Microchip Technology Incorporated in theU.S.A. and other countries.Serialized Quick Turn Programming (SQTP) is a service markof Microchip Technology Incorporated in the U.S.A.All other trademarks mentioned herein are property of theirrespective companies.© 2004, Microchip T echnology Incorporated, Printed in theU.S.A., All Rights Reserved.Printed on recycled paper.M MCP250XX USER’S GUIDE 2004 Microchip Technology Inc.DS51266C-page iii Table of Contents Preface............................................................................................................................1Chapter 1. Product Overview and Installation 1.1Introduction and Highlights........................................................................51.2What is the MCP250XX Development Kit?...............................................51.3System Requirements ..............................................................................51.4MCP250XX Development Kit Components ..............................................61.5MCP2515 Components ............................................................................71.6Hardware Installation ..............................................................................101.7Software Installation . (11)Chapter 2. MCP250XX Basic View Tutorial2.1 Introduction (13)2.2 Highlights (13)2.3 Setting up the Basic Template Evaluation Mode (13)2.4 Establishing Communications (20)2.5 Explaining the CAN Messages (22)Chapter 3. MCP250XX Register View Tutorial3.1 Introduction (23)3.2 Highlights (23)3.3 Setting up the Register Template Evaluation Mode (23)3.4 Establishing Communication (27)3.5 Explaining the Register Template Windows (27)Chapter 4. Programming the MCP250XX User Defaults4.1 Introduction (29)4.2 Highlights (29)4.3 Device Programmer (29)4.4 Programming via the ICSP™ Connector (34)Chapter 5. Other Capabilities of the Development Board5.1 Introduction (35)5.2 Highlights (35)5.3 Oscillator Configurations (35)5.4 Node A Prototyping Area and Header Pinout (36)5.5 External Bus Connections (37)MCP250XX User’s GuideDS51266C-page iv 2004 Microchip Technology Inc.Appendix A. Schematics and LayoutsA.1 Introduction (39)A.2 V PP Step-up Regulator (40)A.3 Clock and Data for Programming (41)A.4 PC Node (42)A.5 CAN Physical Layer (43)A.6 Node A and Node B (44)A.7 Caps Page (45)Index (47)Worldwide Sales and Service (48)M MCP250XX USER’S GUIDEPrefaceINTRODUCTION AND HIGHLIGHTSThis section provides general information that will be useful to know before using theMCP250XX Development Kit and touches on the following topics:•About This Guide•Recommended Reading•Troubleshooting•The Microchip Internet Web Site•Customer SupportABOUT THIS GUIDEDocument LayoutThe User’s Guide layout is as follows:•Chapter 1: Product Overview and Installation – details the hardware andsoftware components and discusses installation procedures.•Chapter 2: MCP250XX Basic View Tutorial – covers some of the key elementsof the MCP250XX by going through the steps for setting up and running thedemonstration program.•Chapter 3: MCP250XX Register View Tutorial – details the demonstrationsoftware and the CAN system, as well as discussing the steps required tosuccessfully communicate with the MCP250XX while in the Register template.•Chapter 4: Programming the MCP250XX Using the Development Board –describes the procedure for programming the MCP250XX using the programmingcircuitry and special software.•Chapter 5: Other Capabilities of the MCP250XX Development Kit - details theother capabilities of the MCP250XX Development Kit, including configuring theboard for multiple oscillators, connecting the board to the MCP2515 developmentboard and connecting the board to external CAN busses.Appendices•Appendix A: Schematics and Layouts – lists the schematics and layoutdiagrams for the MCP250XX Development Kit.•Index – cross-reference listing of terms, features and sections of this document.•Worldwide Sales and Service – provides the address, telephone and faxnumbers for Microchip T echnology Inc. sales and service locations throughout theworld.UpdatesSince Microchip tools are constantly evolving to meet customer needs, some softwaredialogs and/or tool descriptions may differ from this document. Please refer to theMicrochip web site to obtain the latest documentation available (). 2004 Microchip Technology Inc.DS51266C-page 1MCP250XX User’s GuideRECOMMENDED READINGFor more information regarding the MCP250XX devices and other CAN related topics,the following are recommended reading. The following data sheets may bedownloaded from our internet web site at .MCP2502X/2505X Data Sheet (DS21664)This data sheet provides detailed information regarding the MCP250XX CAN I/OExpanders.MCP2515 Data Sheet (DS21291)This data sheet provides detailed information regarding the MCP2515 Stand-AloneCAN Controller, which is the master node on the board.PRO MATE® II User’s Guide (DS30082)This manual contains a section explaining how to program the MCP250XX devicesusing the specified socket module.MCP250XX Programming Specification (DS20072)This specification explains the requirements for programming the MCP250XXusing the ICSP™ protocol.AN815 – Understanding the MCP250XX Devices (DS00815).AN816 – A CAN System Using Multiple MCP250XX I/O Expanders (DS00816).AN713 – An Introduction to the CAN Protocol Application Note (DS00713)This application note provides “the basics” for those not familiar with the CANprotocol.AN754 – Understanding Microchip’s CAN Module Bit Timing Application Note(DS00754)This application note is an in-depth discussion of bit timing using Microchip’s CANmodule.A CAN Kingdom by Lars-Berno Fredriksson (Kvaser AB)This document covers the CAN Kingdom Specification and should help give someinsight into the main software and some of the menu items that refer to CANKingdom-specific functions. For more information, please visit CAN Kingdom website at CANKing Help FilesThe help files are a good resource for answering some common questions aboutthe MCP250XX Development Kit, including the CAN Kingdom-specific menuitems.README FilesContains the latest information on the MCP250XX evaluation system.Microsoft® Windows® ManualsThese manuals assume that users are familiar with the Microsoft Windowsoperating system. Many excellent references exist for this software program andshould be consulted for general operation of the Windows® operating system. TROUBLESHOOTINGSee the README files for information regarding common problems not addressed in thisuser’s guide.DS51266C-page 2 2004 Microchip Technology Inc.PrefaceTHE MICROCHIP INTERNET WEB SITEMicrochip provides easy access to our documentation and on-line support through ourWorld Wide Web Site at . You can download files from the web siteor from our FTP site at ftp://.CUSTOMER SUPPORTUsers of Microchip products can receive assistance through several channels:•Distributor or Representative•Local Sales Office•Field Application Engineer (FAE)•Corporate Applications Engineer (CAE)•Hot LineCustomers should call their distributor, representative or field application engineer(FAE) for support. Local sales offices are also available to help customers. See theback cover for a listing of sales offices and locations.Corporate applications engineers (CAEs) may be contacted at:(480) 792-7627.In addition, there is a Systems Information and Upgrade Line. This line provides systemusers a listing of the latest versions of all of Microchip’s development systems softwareproducts. Plus, this line provides information on how customers can receive anycurrently available upgrade kits.The Hot Line numbers are:1-800-755-2345 for U.S. and most of Canada, and1-480-792-7302 for the rest of the world.2004 Microchip Technology Inc.DS51266C-page 3MCP250XX User’s GuideNOTES:DS51266C-page 4 2004 Microchip Technology Inc.M MCP250XX USER’S GUIDE Chapter 1. Product Overview and Installation1.1INTRODUCTION AND HIGHLIGHTSThis chapter provides an overview of the MCP250XX Development Kit and covers thefollowing topics:•What is the MCP250XX Development Kit?•System Requirements•MCP250XX Development Kit Components•MCP2515 Components•Hardware Installation•Software Installation1.2WHAT IS THE MCP250XX DEVELOPMENT KIT?The MCP250XX Development Kit is an evaluation, demonstration and developmenttool for Microchip Technology’s 14-pin CAN I/O Expanders. The MCP250XX can beevaluated easily by installing the provided software and running the demonstrationprogram. Furthermore, development can be accomplished by utilizing the bare CANnode with the prototyping area, as well as with the on-board device programmer.The development board has the ability to program the user-defined defaults by usingthe device programmer module and the supplied software. Alternatively, the In-CircuitSerial Programming™ (ICSP™) protocol can be used to program the MCP250XXusing the 5-pin header, which is connected to a 14-pin socket on the board. See theMCP250XX Programming Specification (DS20072) for details on programming viaICSP.Some of the key features of the MCP250XX Development Kit include:•Evaluation of Microchip’s CAN I/O Expanders•Programming the MCP2505X devices using supplied software•Programming the MCP2505X devices via the ICSP protocol•Connectable to external CAN networks1.3SYSTEM REQUIREMENTSTo take full advantage of the MCP250XX features, you must install the supplieddemonstration/evaluation software on a host computer. The MCP250XX requires:•Microsoft Windows 95/98/ME/NT/2000 operating system•One free parallel port•CD-ROM drive2004 Microchip Technology Inc.DS51266C-page 5MCP250XX User’s Guide1.4MCP250XX DEVELOPMENT KIT COMPONENTSThe MCP250XX Development Kit contains:•MCP250XX Development Board•MCP250XX Development Kit User’s Guide•MCP250XX Development Kit CD-ROM with demo and programming software•Parallel port cable•9V DC power supply adapter•Warranty/Registration card•Three MCP25020 CAN I/O Expanders•Three MCP25050 CAN I/O ExpandersFIGURE 1-1:MCP250XX DEVELOPMENT KITDS51266C-page 6 2004 Microchip Technology Inc.分销商库存信息: MICROCHIPDV250501。
45750-0212中文资料
FEATURES AND SPECIFICATIONSSPECIFICATIONS4.20mm (.165") Pitch Mini-Fit Plus HCS ™Terminal 45750Crimp, FemaleThe new, improved and patented Mini-Fit Plus HCS terminals are designed to be used with all existing Mini-Fit ®crimp receptacle housings. The Mini-Fit Plus HCS terminals will allow for current loads up to 12.0A in 2 to 10 circuit configurations and 11.0A in 12 to 24circuit configurations.The unique, elliptical contact dimple design increases durability, doubling to tripling the number of mating cycles versus standard Mini-Fit terminals. Terminals are available in post-plated versions only, enhancing the long-term electrical performance and of the mating interface. The gold-plated terminals are suitable for “hot-pluggable” applications.Reference Information Packaging: Reel or bagUse With: 5557, 30067, 42474, and 44516 housings Designed In: MillimetersElectrical Voltage: 600VCurrent: 12.0A max.Current Interruption: 8.0A max. at 24V Contact Resistance: 10 milliohms max.Dielectric Withstanding Voltage: 2200V Insulation Resistance: 1000 Megohms min.MechanicalContact Insertion Force: 1.54kg (3.40 lb) max.Contact Retention to Housing: 3.0kg (6.61 lb) min.Wire Pull-out Force: 6.0kg (13.23 lb) min.Mating Force: 1.14kg (2.51 lb) max.Unmating Force: 0.10kg (0.22 lb) min.Normal Force: 200g min.Durability: Tin (Sn) – 75 cyclesGold (Au) – 100 cyclesPhysicalContact: Copper (Cu) Alloy Plating:Contact Area – 100µ” Tin (Sn) or 30µ” Gold (Au)Underplating – 50µ” Nickel (Ni)Wire Range: 16, 18, 20 AWGInsulation Range: 3.10mm (.122”) max.Strip Length: 3.00 to 3.50mm (.118” to .138”)Operating Temperature: -40 to +105°CFeatures and BenefitsI High-current terminal design enables customers toupgrade existing crimp receptacle housings to carry an additional 3.0A to 5.0A per circuitI Gold plated terminals are hot pluggable making them suitable for current interruption applications where hot mating and unmating is requiredI High force, low-pressure contact dimple designincreases durability (cycling) while minimizing contact resistanceI Two-point contact design assures high reliabilityI Compatible with existing Mini-Fit application toolingallowing customers to process these terminals with existing equipmentHot-pluggable, high-current Mini-Fit Plus HCS Terminals handle up to 12 amperes of current load and increase mating cycle durabilityAPPLICATIONSI Power Supplies I Fan Trays I Lottery Systems I HVAC Systems I Personal Computers I Lighting Systems I Gaming Equipment I Office Equipment I Disk Drives I Network servers I Telecommunications -Base stations -Hubs and routers I AppliancesI Business Equipment I Printers I PC IndustryI AutomotiveI Industrial EquipmentI MedicalAmericas Headquarters Lisle, Illinois 60532 U.S.A.1-800-78MOLEX amerinfo@ Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324feninfo@ Far East South Headquarters Jurong, Singapore 65-6-268-6868fesinfo@ European Headquarters Munich, Germany 49-89-413092-0eurinfo@Corporate Headquarters 2222 Wellington Ct.Lisle, IL 60532 U.S.A.630-969-4550Fax:630-969-1352Visit our Web site at /product/power/mf.htmlOrder No. USA-318Printed in USA/JI/2005.07©2005 MolexORDERING INFORMATIONApplication ToolingCurrent Rating Chart4.20mm (.165") Pitch Mini-Fit Plus HCS ™Terminal45750Crimp, Female。
1-281523-0中文资料
Product Details for 1-281523-0Languages: English | Deutsch | Español | Português (do Brasil) | ??????? | Italiano | ????(??) | ?? (??) | ???Country Sites : China | JapanHome | Customer Support | Supplier | Site Map | Privacy Policy| Browser Support© 2006 Tyco Electronics Corporation All Rights ReservedHome > Products > By Type > Ribbon and Flat Flex Wire Connectors -Ribbon Cable > Product Feature Selector> Product Details1-281523-0ActivePin and Pinless Headers (AMP-LATCH)RoHS Compliant(Statement of Compliance)Product Highlights:?Connector Type = Pin Headers ?Standard Profile?Number of Positions = 10? 2.54 x 2.54 mm Centerline, Matrix ?PCB Mount Angle = Right Angle View all FeaturesCheck Pricing &AvailabilitySearch for Tooling Product Feature SelectorContact Us About This ProductQuick LinksDocumentation & Additional InformationProduct Drawings:?AMP latch pin header, MIL type, with stamped rounde...(PDF,English)Catalog Pages/Data Sheets:?None Available Product Specifications:?None Available Application Specifications:?None Available Instruction Sheets:?None Available CAD Files:?None AvailableList all DocumentsAdditional Information:?Product Line Information Related Products:?ToolingProduct Features(Please use the Product Drawing for all design activity)Product Type Features:?Connector Type = Pin Headers ?Profile = Standard ?Number of Positions = 10?PCB Mount Angle = Right Angle ?PCB Retention Feature = Without ?Mating Connector Lock = With ?Housing Style = 4-Sided ?Ejection Latches = With ?Shrouded = Yes?Mating Polarization = Without?Mating Connector Lock Type = Ejection Latch Termination Related Features:?Termination Post Length (mm [in]) = 3.10[0.122] Body Related Features:?Centerline, Matrix (mm [in]) = 2.54 x 2.54[.100 x .100]Contact Related Features:?Contact Mating Area Plating = Gold (8) over Nickel?Contact Material = Phosphor Bronze ?Contact Termination Area Plating = TinHousing Related Features:?Housing Material = Glass -Filled Polyester ?Housing Flammability Rating = UL 94V -0 ?Housing Color = Black Industry Standards:?RoHS/ELV Compliance = RoHS compliant, ELV compliant?Lead Free Solder Processes = Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C?RoHS/ELV Compliance History = Always was RoHS compliant Conditions for Usage:?Temperature Rating= StandardPackaging Related Features:?Packaging Quantity = 120 Other:?Brand = AMPSearch By:Part Number Text Tips n m l k j i n ml k j Enter a complete or partial part number...GoSign InProducts Documentation Resources My Account Customer Support About Us元器件交易网。
USCAR-2(中文第5版)-2009[1].03.17
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Lock overtravel
Forward stop contacted
向前止动接触
Decreasing
Recognizable travel
distance
如果有适用的设备，强烈建议绘制所施加的啮合力与插入距离之间的连续对照图。
个结构合理的连接器(和密封系统，如适用的话) 应当能够绘制出一张图，其中显示
力平稳上升至一个峰值，然后下降直至连接器完全啮合。
如果图中显示一个以上的力
的峰值，锁止机构就可能存在错误。
第五修订版修订日期：
汽车电器连接器系统的性能标准
+/-10毫米/分的速率增加啮合力，直至完全啮合为止。
试验所有样品．记录将每一套连接器的一半完全插入另外一半，直至锁定位置所需要使用的力并且用这些数值来验证每一对连接器是否符合5.4.2.4 章节的验收标准。
5082-2830中文资料
Schottky Barrier Diode Quads for Double Balanced MixersTechnical DataFeatures• Small SizeEases Broad Band Designs• Tight MatchImproves Mixer Balance• Improved Balance overTemperature• Rugged DesignDescription/Applications This matched diode quad uses a monolithic array of Schottky diodes interconnected in ring configuration. The relative proximity of the diode junction on the wafer assures uniform electrical characteristics and temperature tracking.These diodes are designed for use in double balanced mixers, phase detectors, AM modulators, and pulse modulators requiring wideband operation and small size. the low barrier diodes allow for optimum mixer noise figure at lower than conventional local oscillator levels. the wider dynamic range of the medium barrier diodes allows for better distortion performance.Note: For new designs, theHSMS-820X series of surface mount microwave diodes are recommended.5082-2830Outline E4C P = 0.07 pF diagonal C P = 0.09 pF adjacentDIMENSIONS IN MILLIMETERS AND (INCHES).Maximum RatingsOperating and Storage Temperature RangeE4........................................................................................-65°C to +125°C DC Power Dissipation.....................................................75 mW per Juction Derated linearly to zero at maximum rated temperatures(measured in infinite heat sink at T CASE = 25°C).Soldering TemperatureE4.......................................................................................220°C for 10 sec These diodes are ESD sensitive. Handle with care to avoid static discharge through the diode.Electrical Specifications at TA = 25°CMaximum Measured MaximumMaximum Part Maximum Capacitance V FDynamic Forward Number Capacitance Difference Difference Resistance Voltage 5082-Package Barrier C M (pF)∆C M (pF)∆V F (mV)R D (Ω)V F (V)2830E4Medium0.5 Typ.0.2020120.40Test V R = 0I F = 5 mAI F = 1 mA Conditionsf = 1 MHzbetween Adjacent LeadsMeasured between Adjacent LeadsTypical Parameterswhere I B is the bias current in milliamperes. The series resistance is independent of current.The dynamic resistance is more easily measured. If seriesresistance is specified, it is usually obtained by subtracting the calculated junction resistance from the measured dynamic resistance.Quad CapacitanceCapacitance of Schottky diode quads is measured using an HP4271 LCR meter. Thisinstrument effectively isolates individual diode branches from the others, allowing accuratecapacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S.voltage at 1 MHz. Agilent defines this measurement as “CM”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then bePackage CharacteristicsThe Agilent outline E4 package is designed for MIC, Microstrip, and Stripline use from dc through C-Band. The leads provide a good continuity of transmission line impedance to the monolithic diode array. The leads are tin plated copper.Dynamic and Series ResistanceSchottky diode resistance may be expressed as series resistance, R S ,or as dynamic ressitance, R D .These two terms are related by the equationR D = R S = R jwhere R j is the resistance of the junction. Junction resistance of a diode with DC bias is quite accurately calculated byR j = 26/I Bcalculated by the formulas given CThe equivalent adjacentcapacitance is the capacitance between points A and C in figure below. This capacitance is calculated using the following formula1C ADJACENT = C 1 + ____________1 1 1–– + –– + –– C2 C 3C 4SPICE ParametersParameterUnits 5082-2830B V V 10C J0pF 4E G eV 0.69I BV A 10E -5I S A 2 x 10E -10N 1.08R S Ω6P B V0.65P T 2M0.5 Data subject to change.Copyright © 1999 Agilent Technologies 5965-8848E (11/99)。
J508中文资料
IF Zk VL VR IF
rDS VR
POV VF
IR
PACKAGING DETAILS
TБайду номын сангаас-92
0.175 0.195 0.130 0.155 0.045 0.060 0.170 0.195
LS XXX YYWW
0.016 0.022 0.500 0.610
0.014 0.020
1
2
0.095 0.105
PART
Linear Integrated Systems
• 4042 Clipper Court • Fremont, CA 94538 • Tel: 510 490-9160 • Fax: 510 353-0261
元器件交易网
V-I CHARACTERISTICS CURRENT REGULTING DIODE
1
CURRENT REGULATING DIODES
0.192 to 5.6mA VGS = 0V
TO-92 BOTTOM VIEW A 1 K 2
K
K
A
A
SPECIFIC ELECTRICAL CHARACTERISTICS @ 25 °C (unless otherwise stated) Forward Current3 IF VF = 25V MIN J500 J501 J502 J503 J504 J505 J506 J507 J508 J509 J510 J511 0.192 0.264 0.344 0.448 0.600 0.800 1.120 1.440 1.900 2.400 2.900 3.800 NOM 0.24 0.33 0.43 0.56 0.75 1.00 1.40 1.80 2.40 3.00 3.60 4.70 MAX 0.288 0.396 0.516 0.672 0.900 1.200 1.680 2.160 2.900 3.600 4.300 5.600 MIN 4.00 2.20 1.50 1.20 0.80 0.50 0.33 0.20 0.20 0.15 0.15 0.12 Dynamic Impedance4 Zd VF = 25V TYP 15 10 7 5 3.5 2. 1.5 1 0.7 0.5 0.4 0.3 Knee Impedance Zk VF = 6V TYP 2.50 1.60 1.10 0.80 0.55 0.40 0.25 0.19 0.13 0.09 0.07 0.05 Limiting Voltage5 VL IF = 0.8IF(min) TYP 1.2 1.3 1.5 1.7 1.9 2.1 2.5 2.8 3.1 3.5 3.9 4.2 MAX 0.4 0.5 0.6 0.7 0.8 0.9 1.1 1.3 1.5 1.7 1.9 2.1
SH35012002 石油化工有毒可燃介质管道工程施工及验收规范双语版
备案号：J249－2003 SH中华人民共和国石油化工行业标准Standard for Petrochemical Industry of PRCSH 3501－2002代替SH 3501－2001SH 3501-2002A substitute version of SH 3501-2001石油化工有毒、可燃介质管道工程施工及验收规范Specification for construction and acceptance of hypertoxic and combustible medium piping engineering in petrochemical industryChinese language is the "original" language and if inconsistencies exist between English and Chinese versions, the Chinese version takes precedence and the Chinese version is the legally binding version.原本以中文书就，如果英文和中文版本之间存在不一致，以中文版本为准，中文版本具有法律约束力。
2003－02－09 发布2003－05－01 实施国家经济贸易委员会发布SH 3501－2002Issued on Feb. 9, 2003 Implemented on May 1, 2003 Issued by State Economy & Trade CommissionSH 3501－2002目次List of Contents前言……………………………………………………………………………………………Foreword1 范围……………………………………………………………………………………Scope2 规范性引用文件………………………………………………………………………Normative documents quoted3 总则……………………………………………………………………………………General4 管道分级………………………………………………………………………………Pipeline grading5 管道组成件检验………………………………………………………………………Inspection of constituent elements of pipeline5.1 一般规定………………………………………………………………………………General specifications5.2 管子检验………………………………………………………………………………Inspection of pipe5.3 阀门检验………………………………………………………………………………Inspection of valve5.4 其他管道组成件检验…………………………………………………………………Inspection of constituent elements of other pipes6 管道预制及安装………………………………………………………………………Prefabrication and installation of pipeline6.1 管道预制………………………………………………………………………………Prefabrication of pipeline6.2 管道安装………………………………………………………………………………Installation of pipeline7 管道焊接………………………………………………………………………………Welding of pipeline7.1 一般规定………………………………………………………………………………General specifications7.2 焊前准备与接头组对…………………………………………………………………Preparation and assembly of joints7.3 焊接工艺要求…………………………………………………………………………Requirement for welding procedureSH 3501－20027.4 预热与热处理…………………………………………………………………………Preheating and heat treatment7.5 质量检验………………………………………………………………………………Quality inspection8 管道系统试验…………………………………………………………………………Test for piping system8.1 管道系统压力试验……………………………………………………………………Pressure test for piping system8.2 管道系统吹扫…………………………………………………………………………Sweeping for piping system8.3 气体泄漏性试验及真空度试验………………………………………………………Gas leakage test and test of vacuum degree9 交工文件………………………………………………………………………………Handover document附录A（资料性附录）常用有毒介质、可燃介质………………………………………Appendix A (Data Appendix) Common Hypertoxic and Combustible Medium附录B（资料性附录）焊接接头坡口形式及组对要求……………………………………Appendix B(Data Appendix)Type of Groove of Weld Joint and Requirements for Assembly 附：条文说明…………………………………………………………………………………Explanation to ClausesSH 3501－2002前言Foreword本规范是根据国经贸厅行业[2002]36号文的通知，由中国石化集团第五建设公司对《石油化工剧毒、可燃介质管道工程施工及验收规范》SH 3501－2001进行修订而成。
HSMS-2812中文资料
Quad Capacitance
Capacitance of Schottky diode quads is measured using an HP4271 LCR meter. This instrument effectively isolates individual diode branches from the others, allowing accurate capacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S. voltage at 1 MHz. HP defines this measurement as “CM”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then be calculated by the formulas given below.
元器件交易网
Surface Mount RF Schottky Barrier Diodes
Technical Data
HSMS-28XX Series
Features
• Surface Mount SOT-23/SOT143 Package
• Low Turn-On Voltage (As Low as 0.34 V at 1 mA)
HSMS-2820 series of diodes is the best all-around choice for most applications, featuring low series resistance, low forward voltage at all current levels and good RF characteristics. The HSMS-2860 series is a high performance diode offering superior Vf and ultra-low capacitance.
5082-H511-GG500中文资料
DevicesAlGaAs Orange Red HER Green Package HDSP-HDSP-HDSP-HDSP- DescriptionDrawingA411A111A211A5117.6 mm Common Anode Right Hand Decimal A A413A113A213A5137.6 mm Common Cathode Right Hand Decimal B F411F111F211F51110 mm Common Anode Right Hand Decimal C F413F113F213F51310 mm Common Cathode Right Hand Decimal D G411G111G211G51110 mm Two Digit Common Anode Right Hand Decimal E G413G113G213G51310 mm Two Digit Common Cathode Right Hand Decimal F H411H111H211H51114.2 mm Common Anode Right Hand Decimal G H413H113H213H51314.2 mm Common Cathode Right Hand Decimal H K411K111K211K51114.2 mm Two Digit Common Anode Right Hand Decimal I K413K113K213K51314.2 mm Two Digit Common Cathode Right Hand DecimalJBlack Surface Seven Segment Displays Technical DataFeatures• Black Surface and Color Tinted Epoxy• Industry Standard Size • Industry Standard Pinout • Choice of Character Size 7.6 mm (0.30 in.), 10 mm (0.40in.), 14.2 mm (0.56 in.)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Green, Orange • Excellent Appearance Evenly Lighted Segments ±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Two Digit• Categorized for Luminous IntensityCategorized for Color: Green Use of Like Categories Yields a Uniform Display• Excellent for Long Digit String MultiplexingDescriptionThese devices use industrystandard size package and pinout.Available with black surfaceHDSP-AX11/-AX13 Series HDSP-FX11/-FX13 Series HDSP-GX11/-GX13 Series HDSP-HX11/-HX13 Series HDSP-KX11/-KX13 Seriesfinish. All devices are available as either common anode or common cathode.Typical applications includeappliances, channel indicators of TV, CATV converters, game machines, and point of sale terminals.Part Numbering System5082 -X X X X-X X X X XHDSP-X X X X-X X X X XMechanical Options[1]00: No Mechanical OptionColor Bin Options[1,2]0: No Color Bin LimitationMaximum Intensity Bin[1,2]0: No Maximum Intensity Bin LimitationMinimum Intensity Bin[1,2]0: No Minimum Intensity Bin LimitationDevice Configuration/Color[1]1: Common Anode3: Common CathodeDevice Specific Configuration[1]Refer to Respective DatasheetPackage[1]A: 7.6 mm (0.3 inch) Single Digit Seven Segment DisplayF: 10 mm (0.4 inch) Single Digit Seven Segment DisplayG: 10 mm (0.4 inch) Dual Digit Seven Segment DisplayH: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayK: 14.2 mm (0.56 inch) Dual Digit Seven Segment Display Notes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearestAgilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.Package Dimensions (7.6 mm Series)Internal Circuit DiagramPackage Dimensions (10 mm Series: Single)Internal Circuit DiagramPackage Dimensions (10 mm Series: Two Digit)Internal Circuit DiagramPackage Dimensions (14.2 mm Series: Single)Internal Circuit DiagramPackage Dimensions (14.2 mm Series: Two Digit)Internal Circuit Diagram2DIGIT NO. 1 CATHODE1Absolute Maximum RatingsAlGaAs Red HER/Orange GreenHDSP-X11X HDSP-X21X/X41X HDSP-X51X Description Series Series Series Units Average Power per Segment37105105mW or DPPeak Forward Current per4590[1]90[3]mA Segment or DPDC Forward Current per15[5]30[2]30[4]mA Segment or DPOperating Temperature Range–20 to +100 –40 to +100°C Storage Temperature Range–55 to +100°C Reverse Voltage per 3.0V Segment or DPWave Soldering Temperature for250°C 3 Seconds (1.60 mm [0.063 in.]below Body)Notes:1. See Figure 5 to establish pulsed conditions.2. Derate above 53°C at 0.45 mA/°C (see Figure 7).3. See Figure 6 to establish pulsed conditions.4. Derate above 39°C at 0.37 mA/°C (see Figure 7).5. Derate above 91°C at 0.53 mA/°C (see Figure 1).Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDevice SeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions A11X Luminous Intensity/Segment[1,2]I V315600µcd I F = 1 mA (Digit Average)3600I F = 5 mAF11X, G11X330650I F = 1 mA3900I F = 5 mAH11X, K11X400700I F = 1 mA4200I F = 5 mAAll Devices Forward Voltage/Segment or DP V F 1.6 2.0V I F = 1 mA1.7I F = 5 mA1.822I F = 20 mA PeakPeak WavelengthλP EAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPA11X Thermal Resistance LED RθJ-PIN255°C/W/Junction-to-Pin Seg.F11X, G11X320H11X, K12X400OrangeDevice SeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions A41X Luminous Intensity/Segment I V0.70mcd I F = 5 mA (Segment Average)[1,2]F41X, G41X 1.0I F = 5 mAH41X, K41X 2.37I F = 10 mAAll Forward Voltage/Segment or DP V F 2.0 2.5V I F = 20 mA DevicesPeak WavelengthλPEAK600nmDominant Wavelength[3]λd603nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C–2mV/°CV F/Segment or DPA41X Thermal Resistance LED RθJ-PIN200°C/W/Junction-to-Pin Seg.F41X, G41X320H41X, K41X345High Efficiency RedDevice SeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions A21X Luminous Intensity/Segment[1,2]I V360980µcd I F = 5 mA (Digit Average)5390I F = 20 mAF21X, G21X4201200I F = 5 mAH21X, K21X9002800I F = 10 mA3700I F = 60 mA Peak:1/6 Duty Factor All Forward Voltage/Segment or DP V F 2.0 2.5V I F = 20 mA DevicesPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPA21X Thermal Resistance LED RθJ-PIN200°C/W/Junction-to-Pin Seg.F21X, G21X320H21X, K21X345High Performance GreenDevice SeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test ConditionsA51X Luminous Intensity/Segment[1,2]I V8603000µcd I F = 10 mA (Digit Average)6800I F = 20 mAF51X, G51X10303500I F = 10 mAH51X, K51X9002500I F = 10 mA3100I F = 60 mA Peak:1/6 Duty FactorAll Forward Voltage/Segment or DP V F 2.1 2.5V I F = 10 mADevicesPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.050V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPA51X Thermal Resistance LED RθJ-PIN200°C/W/Junction-to-Pin Seg.F51X, G51X320H51X, G51X345Notes:1. Case temperature of device immediately prior to the intensity measurement is 25°C.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is that single wavelength which defines the color ofthe device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. Green (HDSP-A51X/F51X/G51X/H512X/K51X) series displays are categorized for dominant wavelength. The category is designated bya number adjacent to the luminous intensity category letter.Figure 3. Relative Luminous Intensity vs. DC Forward Current.Figure 4. Relative Efficiency (LuminousIntensity per Unit Current) vs. Peak Current.Figure 1. Maximum Allowable Average orDC Current vs. Ambient Temperature.Figure 2. Forward Current vs. Forward Voltage.16024681012142010090807060504030T – AMBIENT TEMPERATURE – °C AI A V E . M A X – M A X I M U M A V E R A G E F O R W A R D C U R R E N T P E R S E G M E N T – m AF 1201102018F 50.020.010.05.02.01.00.50.10.51.01.52.02.5V – FORWARD VOLTAGE – VF I – F O R W A R D C U R R E N TP E R S E G M E N T – m A20105210.50.20.10.10.20.51251020R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 1 m A )I – FORWARD CURRENT PER SEGMENT – mAF I – PEAK FORWARD CURRENTPER SEGMENT – mAPEAK η –R E L A T I V E E F F I C I E N C Y – N O R M A L I Z E D T O 1 A T 1 m AP E A K 1.31.21.11.00.90.80.7AlGaAs RedHER, Green, OrangeFigure 7. Maximum Allowable DCCurrent vs. Ambient Temperature.Figure 8. Forward Current vs.Forward Voltage Characteristics.Figure 9. Relative Luminous Intensity vs. DC Forward Current.Figure 10. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.40051015202530352010090807060504030T – AMBIENT TEMPERATURE – °CA I M A X – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AD C 1201105045010080604020I – F O R W A R D C U R R E N T P E R S E G M E N T – m AF 2.04.03.01.0V –FORWARD VOLTAGE – VF 05.0ηP E A K – R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 5 m A F O R H E R ,A N D T O 1 A T 10 m A F O R G R E E N )150108642205301025I – FORWARD CURRENT PER SEGMENT – mAF 0I – PEAK FORWARD CURRENTPER SEGMENT – mAPEAK ηP E A K – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 5 m A F O R H E R ,A N D 10 m A F O R G R E E N )Figure 5. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.Figure 6. Maximum Tolerable Peak Current vs. Pulse Duration – Green.R A T I O O F M A X I M U M O P E R A T I N G P E A K C U R R E N T T O T E M P E R A T U R E D E R A T E D D C C U R R E N TI P E A K F I M A X D C t – PULSE DURATION – µsP 101100DC R A T I O O F M A X I M U M O P E R A T I N G P E A K C U R R E N T T O T E M P E R A T U R E D E R A T E D D C C U R R E N TI P E A K FI M A X D C t – PULSE DURATION – µs P 101100DCHDSP-A1xx IV Bin Category Min.Max.E 0.3150.520F 0.4280.759G 0.621 1.16H 0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55Intensity Bin Limits (mcd)AlGaAs RedHDSP-F1xx/G1xx IV Bin Category Min.Max.D 0.3910.650E 0.5320.923F 0.755 1.39G 1.13 2.08H 1.703.14HDSP-H1xx/K1xx IV Bin Category Min.Max.C 0.4150.690D 0.5650.990E 0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50OrangeHDSP-A41XIV Bin Category MinMaxA 0.2840.433B 0.3540.541C 0.4430.677D 0.5540.846E 0.692 1.057F 0.856 1.322G 1.082 1.652H 1.352 2.066I 1.692 2.581J 2.114 3.227K 2.641 4.034L 3.300 5.042M 4.127 6.303N 5.1577.878HDSP-F41X/G41XIV Bin Category MinMaxC 0.4850.890D 0.728 1.333E 1.091 2.000F 1.636 3.000G 2.454 4.500H 3.6826.751HDSP-H41X/K41XIV Bin Category MinMaxB 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Intensity Bin Limits (mcd), continued HERMin.Max.B0.3420.630C0.5160.946D0.774 1.418E 1.160 2.127F 1.740 3.190G 2.610 4.785H 3.9157.177Min.Max.C0.4850.890D0.728 1.333E 1.091 2.000F 1.636 3.000G 2.454 4.500H 3.682 6.751Min.Max.E0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K10.3919.04Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningFor information on soldering LEDs, please refer to Application Note 1029.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Color CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.HDSP-A5xx IV Bin Category Min.Max.H 0.86 1.58I 1.29 2.37J 1.94 3.55K 2.90 5.33L 4.378.01Intensity Bin Limits (mcd), continued GreenHDSP-F5xx/G5xx IV Bin Category Min.Max.H 1.54 2.82I 2.31 4.23J 3.46 6.34K 5.189.50L 7.7814.26HDSP-H5xx/K5xx IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46/semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-1742ENJuly 17, 20045988-4433EN。
5082-A907-O0000中文资料
Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。
5082-H158-O0000资料
14.2 mm (0.56 inch)Seven Segment Displays Technical DataFeatures• Industry Standard Size • Industry Standard Pinout 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red, Yellow, Green, Orange • Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum Contrast±50° Viewing Angle • Design FlexibilityCommon Anode or Common CathodeSingle and Dual Digits Right Hand Decimal Point ±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing • Intensity and Color Selection OptionSee Intensity and ColorSelected Displays Data Sheet • Sunlight Viewable AlGaAsDescriptionThe 14.2 mm (0.56 inch) LED seven segment displays aredesigned for viewing distances upto 7 metres (23 feet). Thesedevices use an industry standard size package and pinout. Both the numeric and ±1 overflow devices feature a right hand decimalpoint. All devices are available as either common anode or common cathode.Orange AlGaAs Red HERYellowGreen Package HDSP-HDSP-[1]HDSP-[1]HDSP-HDSP- DescriptionDrawingH401H151550157015601Common Anode Right Hand Decimal A H403H153550357035603Common Cathode Right Hand Decimal B H157550757075607Common Anode ±1. Overflow C H158550857085608Common Cathode ±1. OverflowD K401552157215621Two Digit Common Anode Right Hand DecimalE K403552357235623Two Digit Common Cathode Right Hand DecimalFDevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-H10X/K12X AlGaAs and HDSP-555X HER data sheet for low current operation.HDSP-K40x Series HDSP-550x Series HDSP-552x Series HDSP-560x Series HDSP-562x Series HDSP-570x Series HDSP-572x Series HDSP-H15x Series HDSP-H40x SeriesThese displays are ideal for most applications. Pin for pin equivalent displays are alsoavailable in a low current design.The low current displays are idealfor portable applications. For additional information see the Low Current Seven Segment Displays data sheet.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]1: Common Anode 3: Common CathodeDevice Specific Configuration [1]Refer to Respective DatasheetPackage [1]H: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayFUNCTIONPIN AB CDEF1CATHODE e ANODE e CATHODE c ANODE cE CATHODE NO. 1 E ANODE NO. 12CATHODE d ANODE d ANODE c, d CATHODE c, d D CATHODE NO. 1 D ANODE NO. 13ANODE [3]CATHODE [4]CATHODE b ANODE bC CATHODE NO. 1 C ANODE NO. 14CATHODE c ANODE c ANODE a, b, DP CATHODE a, b, DP DP CATHODE NO. 1DP ANODE NO. 15CATHODE DP ANODE DP CATHOPDE DP ANODE DE E CATHODE NO. 1 E ANODE NO. 26CATHODE b ANODE b CATHODE a ANODE aD CATHODE NO. 2 D ANODE NO. 27CATHODE a ANODE a ANODE a, b, DP CATHODE a, b, DP G CATHODE NO. 2G ANODE NO. 28ANODE [3]CATHODE [4]ANODE c, d CATHODE c, d C CATHODE NO. 2 C ANODE NO. 29CATHODE f ANODE f CATHODE d ANODE d DP CATHODE NO. 2DP ANODE NO. 210CATHODE g ANODE g NO PINNO PINB CATHODE NO. 2 B ANODE NO. 211 A CATHODE NO. 2 A ANODE NO. 212 F CATHODE NO. 2 F ANODE NO. 213DIGIT NO. 2 ANODE DIGIT NO. 2 CATHODE 14DIGIT NO. 1 ANODE DIGIT NO. 1 CATHODE 15 B CATHODE NO. 1 B ANODE NO. 116 A CATHODE NO. 1 A ANODE NO. 117G CATHODE NO. 1G ANODE NO. 118F CATHODE NO. 1 F ANODE NO. 1NOTES:1. ALL DIMENSIONS IN MILLIMETRES (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. REDUNDANT ANODES.4. REDUNDANT CATHODES.5. FOR HDSP-5600/-5700 SERIES PRODUCT ONLY.Package DimensionsInternal Circuit DiagramNotes:1. See Figure 2 to establish pulsed conditions.2. Derate above 46°C at 0.54 mA/°C.3. See Figure 7 to establish pulsed conditions.4. Derate above 53°C at 0.45 mA/°C.5. See Figure 8 to establish pulsed conditions.HER/Orange HDSP-5500AlGaAs Red HDSP-H40x Yellow Green HDSP-H150HDSP-K40x HDSP-5700HDSP-5600 Description SeriesSeriesSeriesSeriesUnits Average Power per Segment or DP 9610580105mW Peak Forward Current per 160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per Segment or DP 40[2]30[4]20[6]3018]mA Operating Temperature Range -20 to +100[9]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment or DP 3.0V Lead Solder Temperature for 3 Seconds 260°C(1.60 mm [0.063 in.] below seating plane)Absolute Maximum Ratings6. Derate above 81°C at 0.52 mA/°C.7. See Figure 9 to establish pulsed conditions.8. Derate above 39°C at 0.37 mA/°C.9. For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V9.116.0mcd I F = 20 mA(Digit Average)1.8I F = 20 mAForward Voltage/Segment or DP V F V2.03.0I F = 100 mAH15XPeak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin400°C/W/to-Pin SegHigh Efficiency RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions9002800I F = 10 mA Luminous Intensity/Segment[1,2,6]I Vµcd(Digit Average)3700I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 55XXPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegYellowDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions6001800I F = 10 mA Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)2750I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 57XXPeak WavelengthλPEAK583nmDominant Wavelength[3,7]λd581.5586592.5nmReverse Voltage/Segment or DP[4]V R 3.040V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegOrangeDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 2.37mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mAPeak WavelengthλPEAK600nm H40x Dominant Wavelength[3]λd603nm I F = 10 mA K40x Reverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µA Temperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegDeviceSeriesHDSP-ParameterSymbol Min.Typ.Max.UnitsTest Conditions 9002500I F = 10 mALuminous Intensity/Segment [1,2]I Vµcd(Digit Average)`3100I F = 60 mA Peak:1 of 6 df Forward Voltage/Segment or DPV F 2.1 2.5V I F = 10 mA56XXPeak Wavelength λPEAK 566nm Dominant Wavelength [3,7]λd 571577nm Reverse Voltage/Segment or DP [4]V R 3.050V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DPThermal Resistance LED Junction-R θJ-Pin345°C/W/to-PinSegHigh Performance GreenNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-H10X series displays are recommended. They are tested at 1 mA dc/segment and are pin for pin compatible with the HDSP-H15X series.6. For low current operation, the HER HDSP-555X series displays are recommended. They are tested at 2 mA dc/segment and are pin for pin compatible with the HDSP-550X series.7. The Yellow (HDSP-5700) and Green (HDSP-5600) displays are categorized for dominant wavelength. The category is designated by a number adjacent to the luminous intensity category letter.AlGaAs RedFigure 3. Maximum Allowable DC Current vs.Ambient Temperature.Figure 4. Forward Current vs.Forward Voltage.HER, Yellow, Green, OrangeFigure 7. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AT A – AMBIENT TEMPERATURE – °C 5030102051525354045I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A)I F – FORWARD CURRENT PER SEGMENT – mA204010305152535ηP E A K – N O R M A L IZ E D R E L A T I V E E F F I C I E N C YI PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA4550110120Figure 11. Forward Current vs.Forward Voltage.Figure 9. Maximum Tolerable PeakCurrent vs. Pulse Duration – Green.Figure 10. Maximum Allowable DC Current vs.Ambient Temperature.Figure 12. Relative LuminousIntensity vs. DC Forward Current.Figure 13. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Contrast EnhancementFor information on contrastenhancement please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro–ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )I F – DC FORWARD CURRENT – mAηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A P E R S E G ME N T )0.6I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA902070801001.61.41.31.10.90.860504030100.71.01.21.5HDSP-H15x IV Bin Category Min.Max.K 9.2016.90L 13.8025.30M 20.7038.00N 31.1056.90O 46.6085.40Intensity Bin Limits (mcd)AlGaAs RedHDSP-550x/552x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04HERHDSP-570x/572xIV Bin Category Min.Max.D 0.61 1.11E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04YellowHDSP-560x/562x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46GreenColor CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.10HDSP-H40x/K40x IV Bin Category Min.Max.B 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Orange元器件交易网元器件交易网/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 271 2451India, Australia, New Zealand: (+65) 271 2394Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only)Korea: (+65) 271 2194Malaysia, Singapore: (+65) 271 2054Taiwan: (+65) 271 2654Data subject to change.Copyright © 2002 Agilent Technologies, Inc.Obsoletes 5988-0383ENJanuary 17, 20025988-4273EN。
HSMS-2805中文资料
HSMS-2820 series of diodes is the best all-around choice for most applications, featuring low series resistance, low forward voltage at all current levels and good RF characteristics. The HSMS-2860 series is a high performance diode offering superior Vf and ultra-low capacitance.
pF
EG
eV
IBV
A
IS
A
N
RS
Ω
PB
V
PT
M
HSMS-280X
75 1.6 0.69 10E-5 3 x 10E - 8 1.08 30 0.65 2 0.5
HSMS-281X
25 1.1 0.69 10E-5 4.8 x 10E - 9 1.08 10 0.65 2 0.5
HSMS-282X
15 0.7 0.69 10E-4 2.2 x 10E -8 1.08 6.0 0.65 2 0.5
Note that HP’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.
2864
T4
4 Common
Cathode
2865
T5
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Passivated General Purpose Schottky Diodes Reliability Data
The following cumulative test results have been obtained from testing performed at Hewlett-Packard Communications Com-ponents Division in accordance with the latest revision of
MIL-STD-750. Data was gathered
from the product qualification,reliability monitor, and engineering evaluation.
For the purpose of this reliability data sheet, a failure is any part which fails to meet the electrical
and/or mechanical specification listed in the Hewlett-Packard Communications Components Designer’s Catalog.
Point [1]
90% Confidence Level [2]
Junction Temp.MTTF MTTF
T J (°C)(Hours) FIT [3](Hours) FIT [3]200 2.7 x 1053704.0 1.2 x 1058333.0175 1.4 x 106714.0 6.1 x 1051639.01508.9 x 106112.0 4.0 x 106250.01257.1 x 10714.0 3.1 x 10732.01007.4 x 108 1.3 3.2 x 108 3.1 75
1.0 x 1010
0.10
4.3 x 109
2.3
B. Failure Rate Prediction
The failure rate will depend on the junction temperature of the device. The estimated life at different temperatures is calcu-lated, using the Arrhenius plot with activation energy of 1.2eV,and listed in the following table.
1. Life Test
A. Demonstrated Performance
Units Total Total
Failure Rate Test Test Conditions Tested Device Hrs.Failed 1%/1K Hrs.
High Temp. Rev.V R = 80% V BR , T A = 200°C 676598,00000Bias (HTRB)Room Temp.P fm = 250 mW, T A = 25°C 364
364,000
Operating Life V R = 80% V BR , 60 Hz (RTOL)High Temp.T A = 200°C
367271,00000
Storage (HTS)
1N5711/12
5082-2800/04/055082-2810/115082-2815/17/185082-28265082-28355082-2080
Notes:
1. The point MTTF is simply the total device hours divided by the number of failures.
2. The MTTF and failure rate represent the performance level for which there is a 90% probability of the device doing
400J U N C T I O N T E M P E R A T U R E , T j (°C )
MEAN TIME TO FAILURE, MTTF (HRS)
350300250200
150
100
50
25A C T I V A T I O N E N E R G Y (e V )
0.7
0.8
0.91.01.5
2.0
3.04.00.6
0.5
102
103104105106107108109
better than the stated value. The confidence level is based on the statistics of failure distribution. The assumed distribution is exponential.This particular distribution is commonly used in describing useful life failures.
3. FIT is defined as Failure in Time, or specifically, failures per billion hours.The relationship between MTTF and FIT is as follows: FIT = 109/(MTTF).
C. Example of Failure Rate Calculation
At 75°C with a device operating 8 hours a day, 5 days a week, the percent utilization is:
% Utilization = (8 hrs/day x 5 days/wk) ÷ 168 hrs/wk = 25%Then the point failure rate per year is:
(1.0 x 10-10/hr.) x (25%) x (8760 hrs/yr) = 2.2 x 10-5% per year Likewise, the 90% confidence level failure rate per year is:
(2.3 x 10-10/hrs.) x (25%) x (8760 hrs/yr) = 5.1 x 10-5% per year
2. Environmental and Mechanical Tests
MIL-STD-750Units Total Test Reference Test Conditions Tested Failed Solderability2026260°C, 5 seconds1980 Solder Heat2031260°C, 10 seconds440 Resistance to Solvent1022 4 solvent groups1260 Thermal Shock1056-65/200°C, 5 min dwell,1160
200 cycles
Temperature Cycle1051-55/100°C, 10 min dwell,4160
200 cycles
Mechanical Shock20161500 g’s, 0.5 msec pulse2720
5 blows each X1, Y1, Y2
Acceleration200620,000 g’s, 1 min, X1, Y, Y21160 Vibration Variable Freq.205620–2000 Hz, 20 g, 4 min all axis1160 Hermeticity1017Fine And Gross4160 Lead Integrity 4 lbs Minimum1760 Salt Atmosphere104110–50 gr/m2 @ 35°C, 24 hrs.450
3. DOD-HDBK-1686 ESD Classification:
5082-28XX Class I。