陶氏POE 8107

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IR公司_大功率MOS管选型

IR公司_大功率MOS管选型

I DContinuous Drain Current(A)70°Micro3Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPartNumberPD Max.PowerDissipation (W)N-ChannelLogic LevelIRLML2402*912570.54200.25 1.20.95230H1IRLML2803912580.54300.251.20.93230P-ChannelLogic LevelIRLML6302*912590.54-200.6-0.62-4.8230H1IRLML5103912600.54-300.6-0.61-4.8230* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°Micro6Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPartNumberPD Max.PowerDissipation (W)N-ChannelLogic LevelIRLMS1902915401.7200.10 3.2 2.675H2IRLMS1503915081.7300.103.22.675P-ChannelLogic LevelIRLMS6702*914141.7-200.20-2.3-1.975H2IRLMS5703914131.7-300.20-2.3-1.975* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°Micro8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRF7601* 912611.820 0.035 5.7 4.6 70 H3IRF7603 912621.830 0.035 5.6 4.5 70Dual N-Channel Logic LevelIRF7501* 912651.220 0.135 2.4 1.9 100 H3IRF7503 912661.2530 0.135 2.4 1.9 100P-Channel Logic LevelIRF7604* 912631.8-20 0.09 -3.6 -2.9 70 H3IRF7606 912641.8-30 0.09 -3.6 -2.9 70Dual P-Channel Logic LevelIRF7504* 912671.25-20 0.27 -1.7 -1.4 100 H3IRF7506 912681.25-30 0.27 -1.7 -1.4 100Dual N- and P-Channel Logic LevelIRF7507* 912691.2520 0.1352.4 1.9 100 H3-20 0.27 -1.7 -1.4IRF7509 912701.2530 0.135 2.4 1.9 100-30 0.27 -1.7 -1.4* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRF7413913302.5300.011139.250H4IRF7413A 916132.5300.0135128.450IRF9410915622.5300.0375.850Dual N-ChannelIRF7311914352.0200.029 6.6 5.362.5H4IRF7313914802.0300.029 6.5 5.262.5IRF7333917002.0300.10 3.5 2.862.5917002.0300.050 4.9 3.962.5IRF9956915592.0300.103.52.862.5Dual P-ChannelIRF7314914352.0-200.058-5.3-4.362.5H4IRF7316915052.0-300.058-4.9-3.962.5IRF9953915602.0-300.25-2.3-1.862.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)RΘMax.ThermalResistance(°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)Dual N- and P-ChannelIRF7317 915682.020 0.029 6.6 5.3 62.5 H42.0-20 0.058 -5.3 -4.3 62.5IRF9952 915622.030 0.103.5 2.8 62.5915622.0-30 0.25 -2.3 -1.8 62.5IRF7319 916062.030 0.029 6.5 5.2 62.52.0-30 0.058 -4.9 -3.9 62.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRF7401912442.5200.0228.77.050H4IRF7201911002.5300.0307.0 5.650IRF7403912452.5300.0228.55.450Dual N-ChannelLogic LevelIRF7101908712.0200.10 3.5 2.362.5H4IRF7301912382.0200.050 5.2 4.162.5IRF7303912392.0300.050 4.9 3.962.5IRF7103910952.0500.1303.02.362.5P-ChannelLogic LevelIRF7204911032.5-200.060-5.3-4.250H4IRF7404912462.5-200.040-6.7-5.450IRF7205911042.5-300.070-4.6-3.750IRF7406912472.5-300.045-5.8-3.750IRF7416913562.5-300.02-10-7.150* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)Dual P-ChannelLogic LevelIRF7104910962.0-200.250-2.3-1.862.5H4IRF7304912402.0-200.090-4.3-3.462.5IRF7306912412.0-300.10-3.6-2.962.5Dual N- and P-Channe Logic LevelIRF7307912421.4200.050 4.3 3.490H4-200.090-3.6-2.9IRF7105910972.0250.1093.5 2.862.52-250.25-2.3-1.862IRF7309912432.0300.050 4.9 3.962.5-300.10-3.6-2.9* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SOT-223Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFL4105913812.1550.045 3.7 3.060H6IRFL110908612.01000.54 1.50.9660IRFL4310913682.11000.20 1.6 1.360IRFL21090868 2.02001.50.960.660IRFL214908622.02502.00.790.560P-ChannelIRFL9110908642.0-1001.2-1.1-0.6960H6N-ChannelLogic LevelIRLL3303913792.1300.031 4.6 3.760H6IRLL014N 914992.1550.14 2.0 1.660IRLL2705913802.1550.043.83.060* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFR33039164257300.0313321 2.2H7IRFR024N9133638550.0751610 3.3IRFR41059130248550.0452516 2.7IRFR12059131869550.0273723 1.8IRFR11090524251000.54 4.3 2.75IRFR120N 91365391000.219.1 5.8 3.2IRFR391091364521000.11159.5 2.4IRFR2109052625200 1.5 2.6 1.75IRFR22090525422000.8 4.833IRFR21490703252502 2.2 1.45IRFR2249060042250 1.1 3.8 2.43IRFR3109059725400 3.6 1.7 1.15IRFR3209059842400 1.8 3.123IRFR42090599425003 2.4 1.53IRFRC2090637426004.421.33* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)P-ChannelIRFR55059161057-550.11-18-11 2.2H7IRFR53059140289-550.065-28-18 1.4IRFR90149065425-600.5-5.1-3.25IRFR90249065542-600.28-8.8-5.63IRFR91109051925-100 1.2-3.1-25IRFR91209052042-1000.6-5.6-3.63IRFR9120N 9150739-1000.48-6.5-4.1 3.2IRFR92109052125-2003-1.9-1.25IRFR92209052242-200 1.5-3.6-2.33IRFR92149165850-250 3.0-2.7-1.7 2.5IRFR93109166350-4007.0-1.8-1.12.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRLR27039133538300.0452214 3.3H7IRLR33039131657300.0313321 2.2IRLR31039133369300.0194629 1.8IRLR024N 9136338550.0651711 3.3IRLR27059131746550.042415 2.7IRLR29059133469550.0273623 1.8IRLR120N 91541391000.18511 6.9 3.2IRLR341091607521000.10159.52.4* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-ChannelIRFZ24NS 913554555 0.07 17 12 3.3 H10IRFZ34NS 913116855 0.04 29 20 2.2IRFZ44NS 9131511055 0.022 49 35 1.4IRFZ46NS 9130512055 0.020 53 37 1.3IRFZ48NS 9140814055 0.016 64 45 1.1IRF1010NS 913723.855 0.011 84 60 40IRF3205S 9130420055 0.008 110 80 0.75IRFZ44ES 9171411060 0.023 48 34 1.4IRF1010ES 9172017060 0.012 83 59 0.90IRF2807S 9151815075 0.013 71 50 1.0IRF520NS 9134047100 0.2 9.5 6.7 3.2IRF530NS 9135263100 0.11 15 11 2.4IRF540NS 91342110100 0.052 27 19 1.6IRF1310NS 91514120100 0.036 36 25 1.3IRF3710S 91310150100 0.028 46 33 1.0IRF3315S 9161794150 0.082 21 15 1.6IRF3415S 91509150150 0.042 37 26 1.0IRFBC20S 9.101450600 4.4 2.2 1.4 2.5IRFBC30S 9101574600 2.2 3.6 2.3 1.7IRFBC40S 91016130600 1.2 6.2 3.9 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemandNumberCase Outline KeyPart NumberP D Max.PowerDissipation (W)IRFBF20S 9166554900 8.0 1.7 1.1 2.3 H10P-ChannelIRF5305S 91386110-55 0.06 -31 -22 1.4 H10IRF4905S 914783.8-55 0.02 -74 -52 40IRF9520NS 9152247-100 0.48 -6.7 -4.8 3.2IRF9530NS 9152375-100 0.20 -14 -9.9 2.0IRF9540NS 9148394-100 0.117 -19 -13 1.6IRF5210S 91405150-100 0.06 -35 -25 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRL3302S 916925720 0.020 39 25 2.2 H10IRL3202S916756920 0.016 48 30 1.8IRL3102S 916918920 0.013 61 39 1.4IRL3402S 9169311020 0.01 85 54 1.1IRL3502S 9167614020 0.007 110 67 0.89IRL2703S 913604530 0.04 24 17 3.3IRL3303S 913236830 0.026 38 27 2.2IRL3103S 9133811030 0.014 64 45 1.4IRL2203NS 9136717030 0.007 116 82 0.90IRL3803S 9131920030 0.006 140 98 0.75IRLZ24NS 913584555 0.06 18 13 3.3IRLZ34NS 913086855 0.035 30 21 2.2IRLZ44NS 9134711055 0.022 47 33 1.4IRL3705NS 9150217055 0.01 89 63 0.90IRL2505S 9132620055 0.008 104 74 0.75IRLZ44S 9090615060 0.028 50 36 1.0IRL530NS 9134963100 0.1 15 11 2.4IRL2910S 91376150100 0.026 48 34 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°SOT-227Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous DrainCurrent 25°C(A)RΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelFully Isolated Low ChargeFA38SA50LC 916155005000.1338240.25H21FA57SA50LC916506255000.0857360.20* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°I-PakThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFU33039164257300.0313321 2.2H8IRFU024N 9133638550.0751610 3.3IRFU41059130248550.0452519 2.7IRFU12059131869550.0273723 1.8IRFU11090524251000.54 4.3 2.7 5.0IRFU120N 91365391000.219.1 5.8 3.2IRFU391091364521000.11159.5 2.4IRFU2109052625200 1.5 2.6 1.7 5.0IRFU22090525422000.80 4.8 3.0 3.0IRFU2149070325250 2.0 2.2 1.4 5.0IRFU2249060042250 1.1 3.8 2.4 3.0IRFU3109059725400 3.6 1.7 1.1 5.0IRFU3209059842400 1.8 3.1 2.0 3.0IRFU4209059942500 3.0 2.4 1.5 3.0IRFUC2090637426004.42.01.33.0I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°I-PakThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)P-ChannelIRFU55059161057-550.11-18-11 2.2H8IRFU53059140289-550.065-28-18 1.4IRFU90149065425-600.50-5.1-3.2 5.0IRFU90249065542-600.28-8.8-5.6 3.0IRFU91109051925-100 1.2-3.1-2.0 5.0IRFU91209052042-1000.60-5.6-3.6 3.0IRFU9120N 9150739-1000.48-6.5-4.1 3.2IRFU92109052125-200 3.0-1.9-1.2 5.0IRFU92209052242-200 1.5-3.6-2.3 3.0IRFU92149165850-2503.0-2.7-1.7 2.5IRFU93109166350-4007.0-1.8-1.12.5N-ChannelLogic LevelIRLU27039133538300.0452214 3.3H8IRLU33039131657300.0313321 2.2IRLU31039133369300.0194629 1.8IRLU024N 9136338550.0651711 3.3IRLU27059131746550.04241715IRLU29059133469550.0273623 1.8IRLU120N 91541391000.18511 6.9 3.2IRLU341091607521000.10159.52.4I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°HEXDIPThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFD014907001.3600.2 1.7 1.2120H9IRFD024906991.3600.1 2.5 1.8120IRFD110903281.31000.54 1.00.71120IRFD120903851.31000.27 1.30.94120IRFD210903861.3200 1.50.60.38120IRFD220904171.32000.80.80.50120IRFD214912711.3250 2.00.570.32120IRFD224912721.3250 1.10.760.43120IRFD310912251.3400 3.60.420.23120IRFD320912261.3400 1.80.600.33120IRFD420912271.3500 3.00.460.26120IRFDC20912281.36004.40.320.21120I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-220Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C (A)R ΘMax.Thermal Resistance(°C/W)1Faxon Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)N-ChannelLow ChargeIRF737LC91314743000.75 6.1** 1.7 3.9H11IRF740LC 910681254000.5510** 1.039IRF840LC 910691255000.858.0** 1.039IRFBC40LC910701256001.26.2**1.039I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFZ24N 9135445550.071712 3.3H12IRFZ34N9127656550.042618 2.7IRFZ44N 9130383550.0244129 1.8IRFZ46N 9127788550.024633 1.7IRFZ48N 9140694550.0165337 1.6IRF1010N 91278130550.0127251 1.2IRF320591279150550.0089869 1.0IRFZ34E 9167268600.0422820 2.2IRFZ44E 91671110600.0234834 1.4IRF1010E 91670170600.01281570.90IRF280791517150750.0137150 1.0IRF520N 91339471000.209.5 6.79.5IRF530N 91351601000.111511 2.4IRF540N 91341941000.0522719 1.6IRF1310N 916111201000.0363625 1.3IRF3710913091501000.0284633 1.0IRF331591623941500.0822115 1.6IRF3415914771501500.0423726 1.0IRFBC209062350600 4.4 2.2 1.4 2.5IRFBC309048274600 2.2 3.6 2.3 1.7IRFBC4090506125600 1.2 6.2 3.9 1.0IRFBE2090610548006.51.81.22.3I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)IRFBE3090613125800 3.0 4.1 2.6 2.0H12IRFBF3090616125900 3.7 3.6 2.3 1.0IRFBG209060454100011 1.40.86 2.3IRFBG309062012510005.03.12.01.0P-ChannelIRF9Z24N 9148445-550.175-12-8.53.3H12IRF9Z34N 9148556-550.10-17-12 2.7IRF530591385110-550.06-31-22 1.4IRF490591280150-550.02-64-45 1.0IRF9530N 9148275-1000.20-13-9.2 2.0IRF9540N 9143794-1000.117-19-13 1.6IRF521091434150-1000.06-35-25 1.0IRF62159147983-1500.29-11-7.81.8I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRL3302 916965720 0.020 39 25 2.2 H12IRL3202 916956920 0.016 48 30 1.8IRL3102 916948920 0.013 61 39 1.4IRL3402 9169711020 0.01 85 54 1.1IRL3502 9169814020 0.007 110 67 0.89IRL2703 913594530 0.04 24 17 3.3IRL3303 913225630 0.026 34 24 2.7IRL3103 913378330 0.014 56 40 1.8IRL2203N 9136613030 0.007 100 71 1.230 0.007 61 43 3.2IRL3803 9130115030 0.006 120 83 1.0IRLZ24N 913574555 0.06 18 13 3.3IRLZ34N 913075655 0.035 27 19 2.7IRLZ44N 913468355 0.022 41 29 1.8IRL3705N 9137013055 0.01 77 54 1.2IRL2505 9132520055 0.008 104 74 0.75IRL520N 9149447100 0.18 10 7.1 3.2IRL530N 9134863100 0.10 15 11 2.4IRL540N 9149594100 0.044 30 21 1.6IRL2910 91375150100 0.026 48 34 1.0I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-220 FullPak (Fully Isolated)Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous DrainCurrent 25°C(A)R ΘMax.Thermal Resistance (°C/W)1Fax on Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)N-ChannelLow ChargeIRFI740GLC91209404000.55 6.0** 3.139H13IRFI840GLC 91208405000.85 4.8** 3.139IRFIBC40GLC91211406001.24.0**3.139I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFIZ24N 9150126550.07139.2 5.8H14IRFIZ34N9148931550.041913 4.8IRFIZ44N 9140338550.02428200.024IRFIZ46N 9130640550.023122 3.8IRFIZ48N 9140742550.0163625 3.6IRFI1010N 9137347550.0124431 3.2IRFI32059137448550.0085640 3.1IRFIZ24E 9167329600.071149.6 5.2IRFIZ34E 9167437600.0422115 4.1IRFI510G 90829271000.54 4.5 3.2 5.5IRFI520N 91362271000.207.2 5.1 5.5IRFI530N 91353331000.11117.8 4.5IRFI540N 91361421000.0521813 3.6IRFI1310N 91611451000.0362216 3.3IRFI371091387481000.0252820 3.1IRFI620G 90832302000.8 4.1 2.6 4.1IRFI630G 90652322000.4 5.9 3.7 3.6IRFI640G 90649402000.189.8 6.2 3.1IRFI614G 9083123250 2.0 2.1 1.3 5.5IRFI624G 9083330250 1.1 3.4 2.2 4.1IRFI634G 90738322500.45 5.6 3.5 3.6IRFI644G 90739402500.287.953.1I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)IRFI720G 9083430400 1.8 2.6 1.7 4.1H14IRFI730G 9065032400 1.0 3.7 2.3 3.6IRFI740G 90651404000.55 5.4 3.4 3.1IRFI734G 9100135450 1.2 3.4 2.1 3.6IRFI744G 91002404500.63 4.9 3.1 3.1IRFI820G 9064130500 3.0 2.1 1.3 4.1IRFI830G 9064632500 1.5 3.12 3.6IRFI840G 90642405000.85 4.6 2.9 3.1IRFIBC20G 90850306004.41.71.1 4.1IRFIBC30G 90851356002.2 2.5 1.63.6IRFIBC40G 9085240600 1.2 3.5 2.2 3.1IRFIBE20G 9085330800 6.5 1.4.86 4.1IRFIBE30G 9085435800 3.0 2.1 1.4 3.6IRFIBF20G 90855309008.0 1.2.79 4.1IRFIBF30G90856359003.71.91.23.6P-ChannelIRFI9Z24N 9152929-550.175-9.5-6.7 5.2H14IRFI9Z34N 9153037-550.10-14-10 4.1IRFI49059152663-550.02-41-29 2.4IRFI9540G 9083742-1000.117-13-9.2 3.6IRFI9540N 9148742-1000.117-13-9.2 3.6IRFI52109140448-1000.06-20-14 3.1IRFI9634G 9148835-2501.0-4.1-2.63.6I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRLI2203N 9137847300.0076143 3.2H14IRLI38039132048300.0066747 3.1IRLIZ24N 9134426550.06149.9 5.8IRLIZ34N 9132931550.0352014 4.8IRLIZ44N 9149838550.0222820 4.0IRLI3705N 9136947550.014733 3.2IRLI25059132763550.00858412.4IRLI520N 91496271000.187.7 5.4 5.5IRLI530N 91350331000.10117.8 4.5IRLI540N 91497421000.04420143.6IRLI291091384481000.02627193.1P-ChannelLogic LevelIRFI9520G 9083537-1000.6-5.2-3.6 4.1H14IRFI9530G 9083638-1000.03-7.7-5.4 3.6IRFI9620G 9087430-200 1.5-3.0-1.9 4.1IRFI9630G 9083840-2000.8-4.3-2.7 3.6IRFI9640G9083940-2000.5-6.1-3.93.1I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-247Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C (A)R ΘMax.Thermal Resistance (°C/W)1Fax on Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)1N-ChannelLow ChargeIRFP350LC912291904000.3018**0.6570H16IRFP360LC 912302804000.2023**0.4598IRFP450LC 912311905000.4016**0.6570IRFP460LC 912322805000.2720**0.4598IRFPC50LC 912331906000.6013**0.6570IRFPC60LC912342806000.4016**0.4598I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not rated。

聚烯烃弹性体(POE)的市场分析及国内外技术现状

聚烯烃弹性体(POE)的市场分析及国内外技术现状

聚烯烃弹性体(POE)的市场分析及国内外技术现状魏浩;伊帆【摘要】分析了聚烯烃弹性体POE的市场发展潜力,综述了国内外国内外的技术现状和相关产业.全球多家石化公司已经成功实现了POE的产业化,国内还没有POE的生产能力.指出我国应加大POE生产工艺及催化剂技术的研发力度,加强政策引导和资金投入.【期刊名称】《山西化工》【年(卷),期】2019(039)001【总页数】3页(P66-67,79)【关键词】聚烯烃弹性体;市场分析;技术现状【作者】魏浩;伊帆【作者单位】阳煤集团太原化工新材料有限公司,山西太原 030400;阳煤集团太原化工新材料有限公司,山西太原 030400【正文语种】中文【中图分类】TQ334引言聚烯烃弹性体(Polyolefin elastomer),简称POE,是指乙烯与高碳α-烯烃(1-丁烯、1-己烯、1-辛烯等)的无规共聚物弹性体。

通常所说的POE主要是指辛烯质量分数大于20%的乙烯-辛烯共聚弹性体,这种弹性体具有一定的结晶度,相对分子量非常窄,密度较低。

因特殊的分子结构,POE具有良好的流变性能、力学性能、抗紫外线性能,低温韧性好,还和聚烯烃具有较好的亲和性,用途广泛。

POE能够用于PP的增韧改性,PP/PE回料性能的改善,PA尼龙等的增韧及相容剂,EVA挤出软管改性及并用发泡,色母或填充母粒,生产热熔胶、电缆护套料、膜类等。

目前,在汽车零部件、电线电缆、家居用品、玩具、机械工具、娱乐和运动用品、鞋底、热熔胶、密封件等领域被广泛应用。

POE的应用极大冲击了传统的橡胶、塑料材料形成了,因此受到了学术界与工业界的广泛关注。

1 POE的市场发展潜力当前POE在国内的售价为15 700元/t~18 800元/t之间,附加值高,国内在售的有美国陶氏化学(DOW)和埃克森美孚(ExxonMobil),日本三井化学(MITSUI)、韩国LG化学和SK集团,沙特阿拉伯沙比克公司的产品,包括17种牌号。

POE物性表(7系列产品和8系列产品)

POE物性表(7系列产品和8系列产品)

Engage ENR 7086 (门尼粘度26 , 密度0.901 g/ cm3 , MFR > 0.5g/ 10min) 是一种高熔体强度的乙烯- 丁烯共聚物, 设计用于改性PP 均聚或共聚物, 应用于吹塑、挤出和热成型; 它也能用于提高填充HDPE 挤出料的熔体强度和韧性, 当与PP 混合,可吹塑更大的部件, 如艇的护舷物, 允许采用更大的牵引和更宽的加工范围进行热成型; 它也能提高透明PP 的冲击强度, 以替代PET 和PS。

ENR 7256 ( MFR 为2 g/ 10 min , 密度0.885 g/ cm3 , 邵A 硬度79 , 乙烯- 丁烯) 和ENR 8556 ( MFR为2 g/ 10 min , 密度0.885 g/ cm3 , 邵A 硬度68 , 乙烯- 辛烯)都为管材、型材和线/ 缆的发泡和挤出进行过优化。

二者的加工性能得到改进, 挤出速率更快。

用于线/ 缆, 与填料或交联结合可提高物理性能; 用于挤出型材, 则挤出速率更快, 产量更高。

目标市场包括交联弹性体和韧性热塑性材料。

ENR7380 (门尼粘度48 , 密度0.870 g/ cm3) 是一种丁烯品级, 设计在软质TPE 中作为一种弹性添加剂。

当25 %~30 %的7380与SEBS 混合时, 可使材料保持所有的关键性能的同时成本降低5 %~10 %; 其低的结晶度和增强的熔体强度也使它可作为热成型PP 的优异改性剂。

ENR 7270 (018 g/ 10min , 0.880 g/ cm3) , ENR 7447 (5 g/ 10min , 0.865 g/ cm3) 和ENR 7467 (112 g/10min , 0.862 g/ cm3) 是3 种丁烯品级, 设计用于汽车TPO 和非汽车塑料改性。

ENR 7467 是一种高性能品级, 具有极低的结晶度和优异的低温韧性;ENR 7270 则是一种通用品级, 提供了良好的性价比, 用于改性PP 和HDPE。

环氧树脂介绍

环氧树脂介绍

E P O X Y
陶氏化学公司陶氏创立于1897年,总部设于美国密歇根州米德兰市。

陶氏是以科学和技术见称和具领导地位的环球企业,全球雇员约50000名,年营业额达280亿美元。

陶氏业务遍布全球,在北美洲、欧洲、拉丁美洲及亚太地区的38
个国家中设有208家工厂。

陶氏生产及供应3200余种产品,包括化学品、塑胶和农用产品,
客户遍布全世界170个国家。

在环氧树脂及中间体产品的领域,陶氏是领先的供应商,开发及
制造共超过124种环氧树脂产品。

上海政星发国际贸易有限公司陶氏公司指定华东、华北区环氧树脂分销商原装进口、供货及时、价格合理、库存充足地址:上海市漕河泾开发区田州路99号新安大楼702室
(200233)
陶氏环氧树脂(DOW EPOXY)介绍双酚A液体环氧树脂
柔韧性环氧树脂
固体环氧树脂溶液
酚醛环氧树脂
固体环氧树脂
通用型固体环氧树脂
特种固体环氧树脂
固化剂
脂肪族及改性多元胺
特种固化剂
酚类固化剂—粉末涂料用固化剂
溴化环氧树脂
DERAKANE环氧乙烯基酯树脂
注:1、典型性能,不作为参考指标。

6、粘度:cPs@52℃
2、铂钴比色法APHA值。

7、粘度:cPs@71℃
3、70%固含量的二乙二醇单丁醚溶液。

8、40%固含量的二乙二醇单丁醚溶液。

4、固体树脂的数据。

9、熔融粘度:cSt@150℃
5、粘度:cSt@25℃。

不同型号POE

不同型号POE

POE8150 产地:美国杜邦POE engage8150 美国杜邦-陶氏熔指:0.5 密度:0.868主要特性:a) 粒料b) 优异的流动特性c) 添加后可提高聚丙烯和聚乙烯的抗冲击性能d) 填料加入量高e) 可采用过氧化物、硅烷和辐照进行固化f) 固化之后具有优异的热老化性能、压缩形变和耐候性能聚烯烃弹性体POE主要应用在以下几个方面:1、取代软质PVC,EVA,可直接注塑成形,生产软管,玩具,文具。

2、取代EPDM改性PP,PE的冲击度(尤其是低温状态下),生产汽车配件,保险杆,塑料家具等。

3、改善CPP,BOPP薄膜的低温热封性能,包装薄膜的柔软性和耐穿剌性能:如拉开伸缠绕膜、保鲜膜。

4、改性EVA,与EVA共混发泡提高EVA发泡产品的回弹性,硬度和撕裂强度,生产EVA 鞋底,玩具,板材。

5、直接与PP,HDPE共混注塑,改善HDPE的抗环境应力,尤适用于生产户外家具,如沙滩椅,沙滩桌等。

6、与其他材料共混改性使用时,可提高无机填料的添加量,如填充母料。

7、辛烯含量:39%POE engage7447 美国杜邦-陶氏熔指:5 密度:0.865POE engage7467(DF610) 美国杜邦-陶氏熔指:1.2 密度:0.862POE engage7256 美国杜邦-陶氏熔指:2.0 密度:0.885POE engage8003 美国杜邦-陶氏熔指:1.0 密度:0.885POE engage8200 美国杜邦-陶氏熔指:5.0 密度:0.870POE engage8150 美国杜邦-陶氏熔指:0.5 密度:0.868POE engage8180 美国杜邦-陶氏熔指:0.5 密度:0.863POE engage8100 美国杜邦-陶氏熔指:1.0 密度:0.870POE engage8402 美国杜邦-陶氏熔指:30.0 密度:0.902POE engage8401 美国杜邦-陶氏熔指:30.0 密度:0.885POE engage8137 美国杜邦-陶氏熔指:13.0 密度:0.864POE engage8842 美国杜邦-陶氏熔指:1.0 密度:0.857POE UG6001 美国杜邦-陶氏熔指:1-15 密度:0.865-0.885 POE engage8999 美国杜邦-陶氏熔指:0.5-200 密度:0.860-0.912 KN140 美国埃克森熔指:0.5-200 密度:0.860-0.885 POE px9071 美国埃克森熔指:0.5 密度:0.870POE px9061 美国埃克森熔指:0.5 密度:0.862POE px9361 美国埃克森熔指:3.5 密度:0.864POE px9371 美国埃克森熔指:4.5 密度:0.872POE LC170 LG 化学熔指:1.0 密度:0.870POE LC670 LG 化学熔指:5.0 密度:0.870。

道化学POE(Engage)

道化学POE(Engage)

Product InformationRev. 2, July 20027.531.610.50.25518301015203550810203040500.910.900.8850.870.8630.857Comonomer Content, wt %More ElastomericDensity, g/cm 3Mooney Viscosity, ML 1 + 4, 121ºCM e l t I n d e x , (190ºC , 2.16 k g ) d g /m i n6Engage ®polyolefin elastomers (POEs) are ethylene octene copolymers produced using INSITE ™catalyst and process technology. These novel elastomers are compatible with most olefinic materials,are an excellent impact modifier,and offer uniqueperformance capabilities for compounded ed extensively in TPO,polymer modification,wireand cable,and flexible goods,Engage ®successfully bridges the gap between plastics and rubber. Offered in a broad range of grades,Engage ®provides design flexibility and a unique balance of properties. The pellet form of Engage ®allows it to be easily integrated into a wide range of manufacturing processes.Engage ®Product ChartComonomer Mooney Durometer Content Melt Index, dg/min Viscosity Hardness,Engage ®wt%Density, g/cm 3ASTM D-1238ASTM D-1646Shore A Grade 13C NMR/FTIRASTM D-792190ºC, 2.16 kgML 1 + 4 at 121°C ASTM D-224088421450.857 1.026508180420.8630.535668130420.86413< 5608400/84071, 2400.87030< 5728150/81571, 3390.8680.535758100/81071, 3380.870 1.023758200/82071, 3380.870 5.0875*******.875 3.011778411330.88018< 5818401310.88530< 5858003300.885 1.022*********.897 1.616928402220.90230< 5948490210.9027.5< 5918480200.902 1.018948450200.902 3.010*********.902 4.37948540170.908 1.018968445160.910 3.58968403160.91330< 5961This grade is talc dusted; properties are measured before the addition of talc.2Engage ®8400 is available in the European region. Engage ®8407 is available in the Americas and Asia Pacific.3Engage ®8157 was formerly 8840. Engage ®8107 was formerly 8843. Engage ®8207 was formerly 8846.Typical Properties of Engage®Listing with Comonomer Content in Decreasing OrderFlexural Ultimate Tensile Ultimate DSC Melting Glass Transition Modulus, MPa Strength, MPa Elongation, %Engage ®Peak, °C Temperature, ºC ASTM D-790,ASTM D-638,ASTM D-638,Grade Rate 10°C/minDSC Inflection Point2% Secant508 mm/min508 mm/min8842133-61 3.5 2.1975818049-588.38.8860813050-59 6.9 2.07608400/84071, 260-5712.1 3.3>10008150/81571, 355-5611.810.97808100/81071, 360-5513.610.38208200/82071, 360-5612.1 6.9>1000845267-5316.69.8920841172-5221.9 6.5900840178-5125.8 6.4950800378-4935.121.8670844094-4459.224.5760840298-4469.912.9790849098-4271.616.28708480100-4178.125.8630845098-4272.624.8730855098-4265.423.16908540103-39104.028.97108445103-38110.121.08008403107-39113.412.37601This grade is talc dusted; properties are measured before the addition of talc.2Engage ®8400 is available in the European region. Engage ®8407 is available in the Americas and Asia Pacific.3Engage ®8157 was formerly 8840. Engage ®8107 was formerly 8843. Engage ®8207 was formerly 8846.Typical Properties of Engage®Listing with Comonomer Content in Decreasing OrderUses of Engage®Used as a Neat ResinEngage®polyolefin elastomers are widely used as stand-alone resins in flexible extruded and molded goods. Engage®grades range from slightly opaque to clear. All grades have excellent colorability for use in commercial applications including tubing, toys,foamed articles,and many other molded goods and extruded profiles.Used as a Modifier in Thermoplastic Blends and CompoundsEngage®has excellent low temperature ductility, making it the resin of choice as an impact modifier. When added at low levels (typically 5–20 wt%) to other olefins such as HDPE and PP,it provides enhanced impact properties. At intermediate levels (typically 20–35 wt%),Engage®is a leading impact and process modifier in hard TPO compounds for automotive exteriors and interiors and other applications requiring superior low temperature performance. Engage®can also be used as a cost-effective modifier for other olefin-containing TPE compounds,including highly filled systems. Used as the Primary Component inSoft Thermoplastic CompoundsAt the other end of the spectrum are softer compounds where Engage®is used as the majority component. Designed to provide a cost-effective balance of desirable end-use and processing characteristics,Engage®is used as a primary resinin conjunction with PP or HDPE. Compoundswith high contents of Engage®also provide good adhesion to a broad range of olefins for soft-touch overmolded goods.Used in Thermoset CompoundsEngage®is readily crosslinked by peroxide,irradiation or moisture (if silane grafted) and performs well in crosslinked foam,extrusion,and injection molding applications. These systems have better colorability and toughness than EV A compounds in crosslinked foams and also have higher service temperatures than peroxide cured EPDM-based compounds.Figure 1.Engage®Current Product/General Application MatrixNotes:The chart above illustrates grades generally used for various applications and processes. Other grades may be suitable in specific applications or processes. Visit our website or talk to a representative to learn more about Engage®and for assistance in proper grade selection.Attributes of Engage ®Comonomer Content is KeyComonomer content and type are key determining factors of the elastomeric characteristics of thepolymer. For reference,Figure 2 shows the correlation between comonomer content and density for Engage ®polyolefin elastomers. Engage ®polyolefin elastomers are produced with a wide range of comonomer levels,offering many choices for the end user.The Versatility and Performance You Need Engage ®polyolefin elastomers are ethylene octene copolymers which:•are suited for both traditional thermoplastic and thermoset applications,either as the main polymer or a value enhancing ingredient in compound formulations,•are in pellet form,which means they can be processed by current plastic or rubber handling,mixing,and forming processes,•are specifically designed to optimize processing and end-use application performance,•provide excellent thermal stability,UV resistance,and recyclability,•offer excellent optics and electrical properties due to extremely low levels of contamination,•exhibit excellent physical properties including elasticity,toughness,and low temperature ductility,•offer enhanced physical properties whencombined with the use of fillers,compounding techniques and/or crosslinking,and•deliver superior heat resistance when crosslinked.Selection of the best Engage ®product for your application will likely depend on the balance of properties and processing performance desired. To further assist in grade selection,correlations of typical mechanical properties vs. comonomer content are shown in Figures 3–6.120100806040200101520302540354550F l e x u r a l M o d u l u s (2% s e c a n t ), M P a1600014000120001000080006000400020000psiComonomer Content, wt%120100806040200101520302540354550S h o r e A D u r o m e t e r H a r d n e s sComonomer Content, wt%35302520151050101520302540354550T e n s i l e S t r e n g t h , M P a500040003000200010000psiComonomer Content, wt%1 MI30 MI0.920.910.900.890.880.870.860.85101520302540354550D e n s i t y , g /c cComonomer Content, wt%Figure 3.Flexural Modulus Trend Figure onomer vs. Density TrendFigure 4.Durometer Hardness TrendFigure 5.Tensile Strength Trends Figure 6.Service Temperature Range TrendsUSA – Global HeadquartersDuPont Dow Elastomers L.L.C.300 Bellevue Parkway Suite 300Wilmington,DE 19809 USA Tel +1 800 853 5515+1 302 792 4000Fax +1 302 792 4450European HeadquartersDuPont Dow Elastomers S.A.2,chemin du PavillonCH-1218 Le Grand-Saconnex Geneva,Switzerland Tel +41 22 717 4000Fax +41 22 717 4001Asia Pacific HeadquartersDuPont Dow Elastomers Pte Ltd.1 Maritime Square #10-54World Trade Center Singapore 099253Tel +65 6275 9383Fax +65 6275 9395South & CentralAmerica HeadquartersDuPont Dow Elastomers Ltda.Altameda Itapecuru,506 - Sala 12Alphaville - Barueri - SP CEP 06454-080BrasilTel +55 11 4166 8978Fax +55 11 4166 8989GermanyDuPont Dow Elastomers GmbH DuPont Strasse 1,D-61343 Bad Homburg Tel +49 6172 87 13 55Fax +49 6172 87 13 51ItalyDuPont Dow Elastomers S.r.l.16,via A. V olta1-20093 Cologno Monzese Tel +39 02 25 302 900Fax +39 02 25 302 905The information set forth herein is furnished free of charge and is based on technical data that DuPont Dow Elastomers believes to be reliable. It is intended for use by persons having technical skill,at their own discretion and risk. Handling precaution information is given with the understanding that those using it will satisfy themselves that their partic-ular conditions of use present no health or safety hazards. Since conditions of product use and disposal are outside of our control,we make no warranties,express or implied,and assume no liability in connection with any use of this information. As with any material,evaluation of any compound under end-use conditions prior to specification is essential.Nothing herein is to be taken as a license to operate or a recommendation to infringe on any patents.Caution:Do not use in medical applications involving permanent implantation in the human body. For other medical applications,discuss with your DuPont Dow Elastomers customer service representative and read Medical Caution Statement H-69237.Engage ®is a registered trademark of DuPont Dow Elastomers.INSITE ™is a trademark of The Dow Chemical Company.Copyright ©2001,2002 DuPont Dow Elastomers. All rights reserved.(07/02) Printed in U.S.A.Reorder No.: ENS-H69272-00-F0702For further information on Engage ®or other elastomers please contact one of the addresses below, or visit us at our website at Engage ®Products Standard Packaging Availability800381008107*813081508157*818082008207*8401840284038407*84008411844084458450845284808490854085508842US 20 kg Bags ✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘US 1000 lb Boxes ✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘✘US Railcars (180,000 lb)✘✘✘✘Europe †20 kg Bags✘✘✘✘✘✘✘✘✘Europe†500 kg Boxes✘✘✘✘✘✘✘✘✘*Talc dusted†Alternative packages are available subject to business interest.。

陶氏POE牌号物性

陶氏POE牌号物性
Dow Elastomers
Technical Information
Product Selection Guide
ENGAGE™ Polyolefin Elastomers (POE) are designed to offer customers improved impact performance, melt strength, and processability over a broad spectrum of markets and applications. They can offer exceptional performance and a unique balance of properties when used alone or in blends and compounds. The grade breadth includes ethylene butene and ethylene octene copolymers over a wide range of densities and melt flow rates.
Innovative Solutions for Your Processes and Applications
Designed to improve impact performance, melt strength, or overall processability, ENGAGE™ Polyolefin Elastomers are available in a wide range of grades to meet the most demanding processing and performance needs. They are compatible with most olefinic materials and offer unique capabilities that can enhance your product. Applications include: automotive thermoplastic olefins (TPO); plastics modification; thermoplastic elastomers (TPE); wire and cable coatings; consumer goods; foams; footwear; noise vibration harshness (NVH) applications; and extrusion or injection molded goods. Some of the features and benefits relative to these applications follow.

网络设备产品参数

网络设备产品参数

安全产品技术规范杭州华三通信技术有限公司目录1.防火墙系列.......................................................................................................................................................1.1.M9000防火墙核心引导指标说明:...............................................................................................1.2.M9006..................................................................................................................................................1.3.M9010..................................................................................................................................................1.4.M9014..................................................................................................................................................1.5.新一代防火墙F50X0核心引导指标说明:..................................................................................1.6.F5040防火墙招标参数 .....................................................................................................................1.7.F5020防火墙招标参数 .....................................................................................................................1.8.F5000-S防火墙招标参数 .................................................................................................................1.9.F5000-C防火墙招标参数.................................................................................................................1.10.新一代F10X0防火墙核心引导指标说明:...............................................................................1.11.H3C SecPath F1020防火墙招标参数..............................................................................................1.12.H3C SecPath F1030防火墙招标参数..........................................................................................1.13.H3C SecPath F1050防火墙招标参数..........................................................................................1.14.H3C SecPath F1060防火墙招标参数..........................................................................................1.15.H3C SecPath F1070防火墙招标参数..........................................................................................1.16.H3C SecPath F1080防火墙招标参数..........................................................................................1.17.三款新千兆防火墙核心引导指标说明:...................................................................................1.18.F1000-E ...........................................................................................................................................1.19.F1000-E-SI ......................................................................................................................................1.20.F1000-A-EI .....................................................................................................................................1.21.F1000-S-AI......................................................................................................................................1.22.SecBlade FW Enhanced招标参数................................................................................................1.23.SecBlade FW招标参数 .................................................................................................................1.24.SecBlade FW Lite防火墙招标参数.............................................................................................1.25.新一代F1000-C-SI、F100-A/M-SI防火墙核心引导指标说明: ..........................................1.26.F1000-C-SI防火墙招标参数........................................................................................................1.27.F100-A-SI防火墙招标参数 .........................................................................................................1.28.F100-M-SI防火墙招标参数.........................................................................................................2.VPN系列.........................................................................................................................................................2.1.3.3.3.L1000-A...............................................................................................................................................4.流量分析NetStream (S75E、S95E、S105、S125配套)..........................................................................5.应用控制与审计网关ACG ...........................................................................................................................5.1.ACG 1000E(1G) .................................................................................................................................5.2.ACG 1000A(500M) ......................................................................................................................5.3.ACG 1000M(200M)......................................................................................................................5.4.ACG 1000S(30M) .........................................................................................................................5.5.ACG 1000C(10M).........................................................................................................................5.6.ACG 2000............................................................................................................................................5.7.ACG 8800............................................................................................................................................5.8.ACG 插卡(S75E、S95E、S105、S125配套) .........................................................................6.入侵防御IPS系列 .........................................................................................................................................6.1.IPS核心引导指标说明......................................................................................................................6.2.IPS T5000-S3 ......................................................................................................................................6.3.IPS T1000-A........................................................................................................................................6.4.IPS T1000-S ........................................................................................................................................6.5.IPS T1000-C........................................................................................................................................6.6.IPS T200-A..........................................................................................................................................6.7.IPS T200-M.........................................................................................................................................6.8.IPS T200-S ..........................................................................................................................................6.9.IPS 插卡(S125、S95E、S75E、S58、SR88、SR66配套) ...................................................7.UTM .................................................................................................................................................................7.1.UTM核心引导指标说明 ..................................................................................................................7.2.U200-A ................................................................................................................................................7.3.U200-M................................................................................................................................................7.4.U200-S.................................................................................................................................................7.5.UTM200-CA .......................................................................................................................................7.6.UTM200-CM.......................................................................................................................................7.7.UTM200-CS........................................................................................................................................1.防火墙系列防火墙整体引导策略:1、要求采用指定架构(M9000的分布式架构、中低端的多核非X86架构等),屏蔽和抬高友商。

TRACOPOWER全系列产品手册

TRACOPOWER全系列产品手册

3W
4.5-9, 9-18,
9-18,18-36, 36-75
18-36, 36-75
3.3, 5, 12, 15,
3.3, 5, 12,
±5, ±12, ±15
±12, ±15
±0.5 %
±0.3 %
±0.75 %
±1.0 %
50 mVpp
50 mVpp
1500
1500
-25 to+75°C
-40 to +71°C
DC/DC 电源模块
TMA、TME、TMR 系列
TSM、TES 系列
DC/DC模块 1到2W,SIP和SMD封装
• 单路和双路输出
• 满载时效率为 81%
• 工业标准脚位
Series Output Power Input Voltages (VDC) Output Voltages (VDC)
Regulation: -Line -Load max.
MHV 2W 12 (±10 %) 180, 350, 500, 1000, 1500, 2000 ± 0.03 % ± 0.08 % 0.05 %/8 h 30 mVpp -10 to +75 °C 80/110 x 12 x 19.8
PHV 5W 12 (±10 %) 350, 500, 1000, 2000 ±0.01 % ±0.1 % 0.05 %/8 h 100 mVpp -10 to +75 °C 60 x 40 x 15/20
DC /DC 大功率模块, 60W 到 22kW
• 工业专用
• 输入电压可达800VDC
• 多标准可用选项
• 标准输出电压可达800VDC
Series Output Power Input Voltage Ranges (VDC) Output Voltages (VDC) Output Currents up to Regulation: -Line max.

陶氏化学环氧树脂产品介绍

陶氏化学环氧树脂产品介绍
性能概述
D.E.R. 337 樹脂的二甲苯溶液 半固態環氧樹脂的二甲苯溶液,有良好的附著力和耐化性,可快速 固化。用于高固體分的船舶及重防腐塗料。 低分子量固體環氧樹脂的二甲苯溶液。 超高分子量環氧樹脂的甲乙酮(MEK)溶液,用於熱塑型或熱固性的 高柔韌性塗料或粘結劑的底塗應用。
性能概述
極低粘度液體酚醛環氧樹脂,常作添加劑以增加耐化學品性、改善 高溫性能。廣泛用於結構增強領域。 高粘度的酚醛環氧樹脂,極佳的耐高溫性能和抗化學品性。適用於 電子和結構增強的應用領域。 D.E.N. 438 樹脂的丙酮溶液。 D.E.N. 438 樹脂的甲乙酮溶液。 D.E.N. 438 樹脂的甲基異丁酮(MIBK)溶液。 D.E.N. 438 樹脂的二甲苯溶液。 半固態環氧酚醛樹脂,可制備粘性的半固化片,幾乎沒有 B 態。 亦用於各種電子和結構增強的場合。 D.E.N. 439 樹脂的甲乙酮(MEK)溶液。 D.E.N. 438 樹脂的二甲苯溶液。
≤3
D.E.R. 324
195 - 204
600 - 800
≤1
D.E.R. 325
185 - 206
850 - 2,800
≤1252
固體環氧樹脂溶液1
產品
環氧當量
粘度
顏色
(g/eq.) (mPa • s@25˚C) (加氏法)
D.E.R. 337-X80
230 - 260
500 - 1,200
低粘度液體環氧樹脂,提供相對較長的適用期。推薦用于塗料、 電子封裝及纖維纏繞等應用場合。
超高純度的雙酚 A 二縮水甘油醚,粘度極低,透明無色。可用於對 顏色有嚴苛要求的場合,並能改善耐高溫性能。
中等環氧當量的雙酚A型半固態環氧樹脂。常用於船舶及修補 塗料、膠粘劑,以及含煤焦油的配方。

POE 塑胶原料

POE 塑胶原料

POE 塑胶原料美国杜邦7256、7270、7340、7467、8150、8200、8401、8402、8480、8999 美国陶氏8999, 8150,5501,7467,8003,8100,8180,8402,8407,8450,3000美国埃克森5061,0201,0203,5101,5171,5371,8201,6100,5371,5062POE 0201通用级埃克森美孚POE 0203通用级埃克森美孚POE 5061挤出级埃克森美孚POE 5171注塑级埃克森美孚POE 5371通用级埃克森美孚POE 7256注塑级美国杜邦POE 7467注塑级美国杜邦POE 8100注塑级美国杜邦POE 8150注塑级美国杜邦POE 8180注塑级美国杜邦POE 8200注塑级美国杜邦POE 8201通用级埃克森美孚POE 8203通用级埃克森美孚POE 8210注塑级埃克森美孚POE塑料POE分两种,一种是乙烯和丁烯的高聚物,另一种是乙烯和辛烯的高聚物。

POE塑料是采用茂金属催化剂的乙烯和辛烯实现原位聚合的热塑性弹性体,其特点是:(1)辛烯的柔软链卷曲结构和结晶的乙烯链作为物理交联点,使它既有优异的韧性又有良好的加工性。

(2)POE塑料分子结构中没有不饱和双键,具有优良的耐老化性能。

(3)POE塑料分子量分布窄,具有较好的流动性,与聚烯烃相容性好。

(4)良好的流动性可改善填料的分散效果,同时也可提高制品的熔接痕强度。

随着POE塑料含量的增加,体系的冲击强度和断裂伸长率有很大的提高。

可见,POE塑料对PP有优良的增韧作用,与PP、活性碳酸钙有较好的相容性。

这是因为POE塑料的分子量分布窄,分子结构中侧辛基长于侧乙基,在分子结构中可形成联结点,在各成分之间起到联结、缓冲作用,使体系在受到冲击时起分散、缓冲冲击能的作用,减少银纹因受力发展成裂纹的机会,从而提高了体系的冲击强度。

当体系受到张力时,由于这些联结点所形成的网络状结构可以发生较大的形变,所以,体系的断裂伸长率有显著的增加,当POE塑料的含量增加时,体系的拉伸强度、弯曲强度和弯曲模量均有所下降,这是由POE塑料本身的性能决定的,故POE塑料的含量应控制在20%以下。

POE牌号大全 及拉伸强度、熔指、伸长率---原料技术数据大全

POE牌号大全 及拉伸强度、熔指、伸长率---原料技术数据大全

韩国LG POE(SEETEC)LC170 主要性能:抗冲击,良好的韧性。

重要参数:熔融指数1.1、比重0.87、硬度71、抗张强度9.5、断裂伸长率900%、弯曲模量14、撕裂强度40、熔融温度58℃。

LC175 主要性能:抗冲击,良好的韧性。

重要参数:熔融指数1.1、比重0.7、门尼粘度18、硬度63、抗张强度4.4、断裂伸长率900%、撕裂强度34、熔融温度36℃。

LC565 主要性能:抗冲击,高韧性。

重要参数:熔融指数5.0、比重0.87、门尼粘度8、硬度54、抗张强度1.8、断裂伸长v领550%、撕裂强度20、熔融温度36℃。

LC670 主要性能:高韧性,高抗冲。

重要参数:熔融指数5.0、比重0.87、门尼粘度9、硬度70、抗张强度5.5、断裂伸长率1000%、弯曲模量13、撕裂强度38、熔融温度58℃。

埃克森美孚POE(Exact)POE 9061 主要性能:高韧性,高抗冲。

重要参数:熔融指数0.5、比重0.86、硬度59、弯曲模量6.5、拉伸应力1.7、抗张强度2.4、断裂伸长率1200%、维卡软化点47℃。

POE 6102 主要性能:薄膜,包装。

重要参数:比重0.86、乙烯成分16%、硬度66、弯曲模量12、拉伸应力1.9、撕裂强度34、维卡软化点52℃。

POE 0201 主要性能:通用级,共混,发泡。

重要参数:硬度90、比重0.90、熔融指数2.5、弯曲模量68、拉伸应力12、断裂伸长率1144%、拉伸强度30、门尼粘度4.0、维卡软化点83℃、熔融温度97℃。

POE 0203 主要性能:通用级,共混,发泡。

重要参数:比重0.90、熔融指数3.0、硬度87、弯曲模量76、熔融温度94℃、维卡软化点93℃、拉伸应力6.5、抗张强度75、门尼粘度9.1。

POE 5101 重要参数:熔融指数2.0、比重0.90、硬度90、门尼粘度18、抗张强度86、拉伸强度21、弯曲模量88、维卡软化点89℃、熔融温度98℃。

POE牌号大全 及拉伸强度、熔指、伸长率---原料技术数据大全

POE牌号大全 及拉伸强度、熔指、伸长率---原料技术数据大全

韩国LG POE(SEETEC)LC170 主要性能:抗冲击,良好的韧性。

重要参数:熔融指数1.1、比重0.87、硬度71、抗张强度9.5、断裂伸长率900%、弯曲模量14、撕裂强度40、熔融温度58℃。

LC175 主要性能:抗冲击,良好的韧性。

重要参数:熔融指数1.1、比重0.7、门尼粘度18、硬度63、抗张强度4.4、断裂伸长率900%、撕裂强度34、熔融温度36℃。

LC565 主要性能:抗冲击,高韧性。

重要参数:熔融指数5.0、比重0.87、门尼粘度8、硬度54、抗张强度1.8、断裂伸长v领550%、撕裂强度20、熔融温度36℃。

LC670 主要性能:高韧性,高抗冲。

重要参数:熔融指数5.0、比重0.87、门尼粘度9、硬度70、抗张强度5.5、断裂伸长率1000%、弯曲模量13、撕裂强度38、熔融温度58℃。

埃克森美孚POE(Exact)POE 9061 主要性能:高韧性,高抗冲。

重要参数:熔融指数0.5、比重0.86、硬度59、弯曲模量6.5、拉伸应力1.7、抗张强度2.4、断裂伸长率1200%、维卡软化点47℃。

POE 6102 主要性能:薄膜,包装。

重要参数:比重0.86、乙烯成分16%、硬度66、弯曲模量12、拉伸应力1.9、撕裂强度34、维卡软化点52℃。

POE 0201 主要性能:通用级,共混,发泡。

重要参数:硬度90、比重0.90、熔融指数2.5、弯曲模量68、拉伸应力12、断裂伸长率1144%、拉伸强度30、门尼粘度4.0、维卡软化点83℃、熔融温度97℃。

POE 0203 主要性能:通用级,共混,发泡。

重要参数:比重0.90、熔融指数3.0、硬度87、弯曲模量76、熔融温度94℃、维卡软化点93℃、拉伸应力6.5、抗张强度75、门尼粘度9.1。

POE 5101 重要参数:熔融指数2.0、比重0.90、硬度90、门尼粘度18、抗张强度86、拉伸强度21、弯曲模量88、维卡软化点89℃、熔融温度98℃。

双活或多活_数据中心网络建设方案

双活或多活_数据中心网络建设方案

数据中心网络建设方案目录第一章数据中心现状分析 (3)第二章数据中心网络技术分析 (3)2。

1 路由与交换 (3)2.2 EOR 与TOR (4)2。

3网络虚拟化 (4)2.3。

1 网络多虚一技术 (4)2.3.2网络一虚多技术 (6)2。

4 VM互访技术(VEPA) (6)2。

5 虚拟机迁移网络技术 (10)第三章方案设计 (12)3.1网络总体规划 (12)3.2省级数据中心网络设计 (14)3.3市级数据中心网络设计 (15)3。

4区县级数据中心网络设计 (15)3.5省、市、区/县数据中心互联设计 (15)3.5.1省、市数据中心互联 (15)3.5.2市、区/县数据中心互联 (16)3.5。

3数据中心安全解决方案 (16)第四章方案的新技术特点 (17)4。

1量身定制的数据中心网络平台 (17)4。

1.1最先进的万兆以太网技术 (17)4。

1.2硬件全线速处理技术 (17)4.1。

3 Extreme Direct Attach技术 (19)4。

1。

5 帮助虚机无缝迁移的XNV技术 (24)4。

1.5环保节能的网络建设 (27)4.2 最稳定可靠的网络平台 (28)4。

2.1 独有的模块化操作系统设计 (28)4。

2.2超强的QOS服务质量保证 (29)4。

3先进的网络安全设计 (31)4.3。

1设备安全特性 (31)4。

3。

2用户的安全接入 (32)4。

3。

3智能化的安全防御措施 (33)4。

3。

4常用安全策略建议 (34)附录方案产品资料 (38)1。

核心交换机BD 8800 (38)2。

SummitX670系列产品 (42)3。

三层千兆交换机Summit X460 (52)4.核心路由器MP7500 (59)5。

汇聚路由器MP7200 (65)6。

接入路由器MP3840 (70)7.接入路由器MP2824 (75)8。

MSG4000综合安全网关 (79)第一章数据中心现状分析云计算数据中心相比较传统数据中心对网络的要求有以下变化:1、Server-Server流量成为主流,而且要求二层流量为主。

RG-S7800系列交换机安装手册

RG-S7800系列交换机安装手册
安装手册 RG-S7800 系列 多业务 IPv6 核心路由交换机
版权声明
福建星网锐捷网络有限公司©2000-2010 锐捷网络有限公司版权所有,并保留对本手册及本声明的一切权利。 未得到锐捷网络有限公司的书面许可,任何人不得以任何方式或形式对本手册内的任何部分进行复制、 摘录、备份、修改、传播、翻译成其他语言、将其全部或部分用于商业用途。
2.1 可选模块简介 ................................................................................................................................................................. 23 2.2 M7800-CM模块 ............................................................................................................................................................. 23
1.1 产品简介 ........................................................................................................................................................................... 8 1.2 RG-S7800 产品主要技术特性........................................................................................................................................ 9 1.3 RG-S7806-ISeries交换机交换机系统........................................................................................................................... 9

【2017年整理】国内外乙烯基酯树脂牌号及各树脂性能

【2017年整理】国内外乙烯基酯树脂牌号及各树脂性能

【2017年整理】国内外乙烯基酯树脂牌号及各树脂性能国内外乙烯基树脂性能一、国内外乙烯基酯树脂牌号一览表亚什兰昭和聚DSM 公司陶氏化学上纬企业上海富晨上海天和 Reichhold 化学合物公司国度美国美国日本荷兰台湾上海挪威上海Norpol 品牌 Derakane Hetron Ripoxy Atlac Swancor Fuchem TH Dion 854、879 标准型双酚A环氧乙烯基酯 411 922 806 430 901 9100 110 880 阻燃型环氧乙烯基酯 510 992 550 750 905 892 9300 310210、220、酚醛环氧乙烯基酯 470 980 630 590 907 890 9400 230—高交联密度型环氧乙烯基酯— 970 600 — 977 898 9700—柔性环氧乙烯基酯 8084 ——— 980 810 ——PU改性型环氧乙烯基酯——— 580 — 820 9800 二、产品种类由于树脂合成的工艺和方法的不同,各家乙烯基树脂的结构、性能及应用也会略有差别。

2.1、标准型双酚A环氧乙烯基酯树脂(陶氏411-亚什兰922-昭和806-430-上纬901-富晨854、879、880-挪威9100-天和110)标准型双酚A环氧乙烯基树脂是由甲基丙烯酸与双酚A环氧树脂通过反应合成的乙烯基树脂,已溶于苯乙烯溶液,该类型树脂具有以下特点: 在分子链两端的双键极其活泼,使乙烯基树脂能迅速固化,很快得到使用强度,得到具有高度耐腐蚀性聚合物;采用甲基丙烯酸合成,酯键边的甲基可起保护作用,提高耐水解性;树脂含酯键量少,每摩尔比耐化学聚酯(双酚A-富马酸UPR)少35-50%,使其耐碱性能提高;较多的仲羟基可以改善对玻璃纤维的湿润性与粘结性,提高了层合制品的力学强度;由于仅在分子两端交联,因此分子链在应力作用下可以伸长,以吸收外力或热冲击,表现出耐微裂或开裂。

美国陶氏POE 8150

美国陶氏POE 8150
美---
外观颜色:
---
用途概述:
主要用于改性PP和PA在汽车工业方面制作保险杠,挡泥板,方向盘,垫板等等。电线电缆工业上耐热性的耐环境性要求高的绝缘层和护套。也用于工业用制品如胶管,输送带,胶布和模压制品。医疗器械以及家用电器,文体用品,玩具等,以及改性PE的低温性、韧性生产薄膜等。
备注说明:
基本特性:1、POE具有热塑性弹性体的一般特性2、价格低并且相对密度小,因而体积价格低廉3、耐热性,耐寒性优异,使用温度范围宽广4、耐候性,耐老化性良好5、耐油性,耐压缩永久变形和耐磨耗等不太好
②原料技术数据
性能项目
试验条件[状态]
测试方法
测试数据
数据单位
基本性能
密度
---
ASTM D-792
35

0.868
g/cm3
熔体流动速率
---
ASTM D-1238
0.5
dg/min
最高熔体速率
---
---
55
---
机械性能
拉伸强度
---
ASTM D-638
10.1
MPa
伸长率
50mm/min
ASTM D-638
750
%
肖氏硬度
---
ASTM D-2240
75
---
其它性能
门尼粘度
---
ASTM D-1646

85719-0001中文资料

85719-0001中文资料

Molex leads the market with the first PoE+ Integrated Connector Module Power over Ethernet (PoE) is a technology that defines the transmission of both data and power to networked devices over a standard ethernet cable, eliminating the need for separate power supplies. PoE+ is the new IEEE 802.3at Power over Ethernet standard. It provides the opportunity for switchmakers to increase port-power output to 30 watts and will supersede the existing 15 watt 802.3af standard. The specification of this new 802.3at standard is backward compatible, supporting legacy 802.3af devices.Molex has developed the HyperJack PoE+ Integrated Connector Module (ICM) in a 2x6 configuration. Based on the RJ-45 jack, the ICM has integrated PoE+ controller silicon to manage and deliver 30 watt Power over Ethernet. This is coupled with Gigabit PoE+ magnetics, thermal management and a high level of protection against electro static discharge (ESD), electrical fast transient (EFT) and electro magnetic interference (EMI). PoE+ according to the IEEE standard requires Cat5 cable or higher.The Molex PoE+ ICM complies to PoTec V2.0 with a standardized footprint and register set, allowing for simple drop-in upgrades and product expansion.The Integrated Module provides the customer with flexible port configurations and a fast migration path from non-PoE to fully integrated PoE+ designs. Simply provide a 51-56V and 3.3V power supply to automatically manage and control power to connected Ethernet devices such as voice over internet protocol (VOIP) phones, wireless access points and security cameras. Extra management can be achieved through I²C communication.Features and BeneFItsMarkets and applIcatIonsFully integrated design Gigabit Ethernet magneticsLow power consumption 30W PoE+ controllersiliconProtection circuitry2 Bi-color light emitting diodes (LED’s) per port Capability to indicate up to 8 operating states Thermally optimized design with excellent heatdissipationIEEE802.3at (draft) and PoETec V2.0 (draft)compliantFast time to market by using a drop-in solutionto add PoE+ technology to a customers switch High-speed data transfer to 1000BASE-T Increased range of PoE+ powered devices Sophisticated protection against variousexternal disturbances: ESD, EFT, EMIProvides 0 to 70°C operating temperatureratingPoE+ technology in an industry standardfootprintAuto, semi-auto and manual mode capabilityNetworking equipment with PoE function tosupport IP phones, security cameras, wireless access points, sensors and actuators, card readers and vision systems- Gigabit Ethernet Switches - Routers - Hubs - MidspansI n dustrial Ethernet Applications- Switches and Routers85719 12-port 2x6 Ganged Modular Jacks with leds85719 12-port 2x6 Ganged Modular Jacks with ledsElectricalHipot isolation: 2250.0V DC OCL: 350µH at 24.0mA min.Insertion loss: -0.8dB at 100 MHz (typical)Return loss: -13.5dB at 100 MHz (typical)NEXT: - 33dB at 100MHz (typical)CMR: -40dB at 100 MHz (typical)Input voltage: 51.0 to 56.0V MechanicalConnector insertion and removal force: 20N (4.5 lbf)Locking force: 50N (11 lbf) min.Durability: 750 cyclesPhysicalHousing: Thermoplastic UL94V-0, black Contact: Phosphor bronze PlatingContact Area: Gold (Au)S older Tail Area: Tin (Sn)Underplating: Nickel (Ni)PCB Thickness: 3.56 mm (.140")Ambient Operating Temperature: 0 to +70°CPoE Output PowerPower: 30W per port supplied over RJ-45 contacts 1 and 2 (-) and 3 and 6 (+)All PoE+ parameters according to IEEE802.3at LEDsConnection: Bi-polarColors: Green and reddish orange Forward voltage: 2.4V max at 20mA Reference Information Packaging: PK-85719-001cTUVus: CU72090061.01Mates with: Plugs according to IEC 60603-7 (series 95043, 44915, 85568)Designed-In: MillimetersorderInG InForMatIon/product/poe.htmlOrder No.Protocol Ports Power per Port Plant No. for Samples85719-0001PoE+1230 Watt6201americaLisle Illinois 60532 U.S.A.+1-800-78MOLEX amerinfo@ asia pacific north Yamato, Kanagawa, Japan +84-46-265-2325apninfo@ a sia pacific south Jurong, Singapore +65-6268-6868apsinfo@ europeWalldorf, Germany +49 6227-3091-0mxgermany@ corporate Headquarters 2222 Wellington Ct.Lisle, IL 60532 U.S.A.+630-969-4550Order No. 987650-2876 Europe/BvO/09.02© 2009, Molex。

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Technical InformationENGAGE™ 8107Polyolefin ElastomerOverview ENGAGE™8107Polyolefin Elastomer is an ethylene-octene copolymer that has excellent flow characteristics and performs well in a wide range of general purpose thermoplastic elastomer applications.ENGAGE8107provides superb impact properties in blends with polypropylene(PP)and polyethylene(PE).ENGAGE8107also provides high filler loading capability and outstanding peroxide cure capability.When cross-linked byperoxide,silane,or irradiation,it gives exceptional heat aging,compression set,and weather resistance properties,and may be used to produce high performance electrical insulation.Main Characteristics:•Pellet form•Excellent flow characteristics•Improved impact in polypropylene and polyethylene•High filler loading•Peroxide,silane,and radiation curable•Exceptional heat aging,compression set,and weather resistance when cured•Talc dusted(untreated,1µm)Applications:•General purpose thermoplastic elastomers•Wire and cable•Impact modificationPhysical Nominal Value(English)Nominal Value(SI)Test MethodDensity0.870g/cm³0.870g/cm³ASTM D792Melt Index(190°C/2.16kg) 1.0g/10min 1.0g/10min ASTM D1238 Mooney Viscosity(ML1+4,250°F(121°C))24MU24MU ASTM D1646Mechanical Nominal Value(English)Nominal Value(SI)Test MethodTensile Modulus-100%421psi 2.90MPa ASTM D638 1 Secant(Compression Molded)Tensile Strength(Break,Compression Molded)1420psi9.76MPa ASTM D638 1 Tensile Elongation ASTM D638 1 Break,Compression Molded810%810%Flexural Modulus ASTM D790 1%Secant:Compression Molded2070psi14.3MPa2%Secant:Compression Molded1900psi13.1MPaElastomers Nominal Value(English)Nominal Value(SI)Test MethodTear Strength228lbf/in40.0kN/m ASTM D624 2Hardness Nominal Value(English)Nominal Value(SI)Test MethodDurometer Hardness ASTM D2240 Shore A,1sec,Compression Molded73 73Shore D,1sec,Compression Molded22 22Thermal Nominal Value(English)Nominal Value(SI)Test MethodGlass Transition Temperature(DSC)-61.6°F-52.0°C Dow Method Vicat Softening Temperature113°F45.0°C ASTM D1525 Melting Temperature(DSC)140°F60.0°C Dow Method 3 Peak Crystallization Temperature(DSC)113°F45.0°C Dow Method Additional InformationProperties measured on product without talc dusting.NotesThese are typical properties only and are not to be construed as ers should confirm results by their own tests.1 20in/min(510mm/min)2 Die C3 10°C/minProduct Stewardship The Dow Chemical Company and its subsidiaries(“Dow”)has a fundamental concern for all who make, distribute,and use its products,and for the environment in which we live.This concern is the basis for our Product Stewardship philosophy by which we assess the safety,health,and environmental information on our products and then take appropriate steps to protect employee and public health and our environment. The success of our Product Stewardship program rests with each and every individual involved with Dow products─from the initial concept and research,to manufacture,use,sale,disposal,and recycle of each product.Customer Notice Dow strongly encourages its customers to review both their manufacturing processes and their applications of Dow products from the standpoint of human health and environmental quality to ensure that Dow products are not used in ways for which they are not intended or tested.Dow personnel are available to answer your questions and to provide reasonable technical support.Dow product literature, including safety data sheets,should be consulted prior to use of Dow products.Current safety data sheets are available from Dow.Medical Applications Policy NOTICE REGARDING MEDICAL APPLICATION RESTRICTIONS:Dow will not knowingly sell or sample any product or service(“Product”)into any commercial or developmental application that is intended for: a.long-term or permanent contact with internal bodily fluids or tissues.“Long-term”is contact whichexceeds72continuous hours;e in cardiac prosthetic devices regardless of the length of time involved(“cardiac prosthetic devices”include,but are not limited to,pacemaker leads and devices,artificial hearts,heart valves,intra-aortic balloons and control systems,and ventricular bypass-assisted devices);e as a critical component in medical devices that support or sustain human life;ore specifically by pregnant women or in applications designed specifically to promote or interfere withhuman reproduction.Dow requests that customers considering use of Dow products in medical applications notify Dow so that appropriate assessments may be conducted.Dow does not endorse or claim suitability of its products for specific medical applications.It is the responsibility of the medical device or pharmaceutical manufacturer to determine that the Dow product is safe,lawful,and technically suitable for the intended use.DOW MAKES NO WARRANTIES,EXPRESS OR IMPLIED,CONCERNING THE SUITABILITY OF ANY DOW PRODUCT FOR USE IN MEDICAL APPLICATIONS.Disclaimer NOTICE:No freedom from infringement of any patent owned by Dow or others is to be inferred.Because use conditions and applicable laws may differ from one location to another and may change with time,theCustomer is responsible for determining whether products and the information in this document areappropriate for the Customer’s use and for ensuring that the Customer’s workplace and disposal practicesare in compliance with applicable laws and other governmental enactments.Dow assumes no obligationor liability for the information in this document.NO WARRANTIES ARE GIVEN;ALL IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE AREEXPRESSLY EXCLUDED.NOTICE:If products are described as“experimental”or“developmental”:(1)product specifications maynot be fully determined;(2)analysis of hazards and caution in handling and use are required;(3)there isgreater potential for Dow to change specifications and/or discontinue production;and(4)although Dowmay from time to time provide samples of such products,Dow is not obligated to supply or otherwisecommercialize such products for any use or application whatsoever.Additional Information North America Europe/Middle East+800-3694-6367 U.S.&Canada:1-800-441-4369+32-3-450-22401-989-832-1426Italy:+800-783-825 Mexico:+1-800-441-4369Latin America South Africa+800-99-5078 Argentina:+54-11-4319-0100Brazil:+55-11-5188-9000Colombia:+57-1-219-6000Asia Pacific+800-7776-7776 Mexico:+52-55-5201-4700+603-7965-5392 This document is intended for use within Asia Pacific,Europe,Latin America,North AmericaPublished:2002-06-27©2010The Dow Chemical Company。

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