MCP3004
microchip 芯片大全介绍
MICROCHIP公司的芯片资料大全第一大部分:PIC micro微控制器资料大全。
比如:PIC12CXXX系列:PIC12C508A PIC12C509A PIC12CR509A PIC12CE518 PIC12CE519 等等等等PIC12FXXX系列:PIC12F629 PIC12F675PIC16C5X系列:PIC16C54C PIC16CR54C PIC16C55A PIC16C56A PIC16CR56A PIC16C57C 等等等等PIC16CXXX系列:PIC14000 PIC16C554 PIC16C558 PIC16C62B PIC16C63A PIC16CR63 PIC16C65B 等等等等PIC16FXXX系列:PIC16F87 PIC16F88 PIC16F627 PIC16F627A PIC16F628 PIC16F628A PIC16F630 PIC16F648A PIC16F676 等等等等PIC17CXXX系列:PIC17C42A PIC17CR42 PIC17C43 PIC17CR43 PIC17C44 PIC17C752 PIC17C756A PIC17C762 PIC17C766PIC18CXXX系列:PIC18C242 PIC18C252 PIC18C442 PIC18C452 PIC18C601 PIC18C801 PIC18C658 PIC18C858PIC18FXXX系列:PIC18F242 PIC18F248 PIC18F252 PIC18F258 PIC18F442 PIC18F448 PIC18F452 PIC18F458 PIC18F1220 PIC18F1320 PIC18F2220 PIC18F2320 PIC18F2439PIC18F2539PIC18F4220 PIC18F4320 PIC18F4439 PIC18F4539 PIC18F6520 PIC18F6620PIC18F6720 PIC18F8520 等等等等第二大部分:PIC射频器件产品资料大全比如:带有UHF RF发射器的rfPIC单片机系列:rfPIC12C509AG rfPIC12C509AF带有UHF RF发射器的rfHCS KEELOQ发送器系列:rfHCS362G rfHCS362FRFID射频卡产品系列:MCRF200 MCRF202 MCRF250 MCRF355 MCRF360 MCRF450等等等等第三大部分:KEELOQ?安全数据产品比如:KEELOQ编码器系列:HCS101 HCS200 HCS201 HCS300 HCS301 HCS320 HCS360 等等等等KEELOQ无线收发器系列:HCS410 HCS412 HCS473KEELOQ解码器系列:HCS500 HCS512 HCS515第四大部分:模拟与接口产品资料大全比如:温度控制产品-温度传感器系列:逻辑输出温度传感器TC6501 TC6502 TC6503 TC6504 TC07 TC620 等等等等电平输出温度传感器TC1046 TC1047 TC1047A 等等等等串行输出温度传感器TC77 TC72 TC74 TCN75 等等等等温度控制产品-直流无刷风扇控制器系列:TC642 TC646 TC647 TC648 TC649 TC650 TC651 TC652 TC653 TC654 TC664TC665 TC670 等等等等电源监控产品-线性调整器系列:50-250mA低压差线性调整器TC2014 TC1014 TC2054 TC1054 TC1070 TC1072 等等等等300mA低压差线性调整器TC1107 TC1108 TC1173 等等等等500-800mA低压差线性调整器TC1262 TC1263 TC1268 TC1264 等等等等特殊应用低压差线性调整器 TC1266 TC1267 TC57 TC59 等等等等电源监控混合产品 TC1300 TC1305 TC1306 TC1307 等等等等电源监控产品-开关调整器MCP1601 TC125 TC126 TC115 TC110 TC105等等等等电源监控产品-充电泵型DCtoDC转换器系列:负压与倍压充电泵TC1044S TC7660 TC7660H TC7660S TC7662B TC1219 TC1221 TC1222 TC1240 TC1240A 等等等等多功能充电泵TCM680 等等等等负倍压充电泵 TC682 TC1682 TC1683 等等等等线性充电泵 TC1142 MCP1252 MCP1253 等等等等电源监控产品-PWM控制器系列:TC170电源监控产品-CPU系统监控器系列:TC1272 TC1275 TCM809 TC1270 TCM811 MCP100 MCP809 TC1274 TC1277 TCM810 等等等等电源监控产品-电压检测器系列:TC51 21429b.pdf TC52 TC53 TC54 等等等等电源监控产品-MOSFET驱动器件系列:0.5A-1.22A峰值电流Low-Side驱动器TC1410 TC1410N TC1411 TC1411N 等等等等1.5A峰值电流Low-Side驱动器TC4426A TC4427A TC4403 等等等等2.0A-9.0A峰值电流Low-Side驱动器TC1412 TC1412N TC1413 TC1413N 等等等等High-Side/Low-Side驱动器TC4626 TC4627 TC4431 等等等等电源监控产品-电池充电器系列:MCP73826 MCP73827 MCP73828 等等等等线性器件产品-运算放大器系列:MCP6041 MCP6042 MCP6043 MCP6044 TC1034 TC1035等等等等线性器件产品-高精度运算放大器系列:高稳定运放 TC7650 TC7652自动调零运放TC913 等等等等线性器件产品-综合线性器件系列:TC1026C TC1043C 等等等等线性器件产品-音频放大器件系列:TC4864混合信号处理器产品-逐次逼近型A/D转换器系列:MCP3001 MCP3002 MCP3004 MCP3008 MCP3201 MCP3202 MCP3204 MCP3208 MCP3301 MCP3302 MCP3304 MCP3221 等等等等混合信号处理器产品-斜切累加型A/D转换器系列:TC3400 TC3401 TC3402 TC3403 TC3404 等等等等混合信号处理器产品-双积分型A/D转换器转换器系列:TC500 TC500A TC510 TC514 等等等等混合信号处理器产品-二、十进制输出型A/D转换器系列:TC835 TC850 TC7135 TC14433 等等等等混合信号处理器产品-显示式A/D转换器系列:TC820 TC826 TC7106 TC7106A TC7107 TC7107A TC7116 TC7116A等等等等混合信号处理器产品-数字电位器系列:MCP41010 MCP41050 MCP41100 MCP42010 MCP42050 MCP42100等等等等混合信号处理器产品-F/V和V/F转换器系列:TC9400 TC9401 TC9402 等等等等接口产品-CAN总线器件系列:MCP2510 MCP25020 MCP25025 MCP25050 等等等等接口产品-红外接口器件系列:MCP2120 MCP2150 MCP2155 等等等等接口产品-LIN总线器件系列:MCP201 等等等等接口产品-串行外围设备器件系列:MCP23016第五部分:串行EEPROM产品资料大全3线式串行EEPROM存储器系列:93C46A 93C46B 93C56A 93C56B 93C66A 93C66B 93C46 93C56 93C66 93C7693C86 等等等等2线式I2C串行EEPROM存储器系列:24C00 24LC00 24AA00 24C01C 24C02C 24LC01B 24LC02B 24LC04B 24LC08B 24LC16B 24AA01 24AA02 24AA04 24AA08 24AA16 24LC32A 24AA32A 24LC64 24AA64 24LC65 24AA65 24C65 24LC128 24AA128 等等等等ISO智能卡系列:25C040 25C080 25C160 25C320 25LC040 25LC080 25LC160等等等等ID卡产品系列:24ACR01 24ACR02 24LC09 24LC21 24LCS21 24LC21A 24LCS21A 24LCS22A 等等等等第六部分:dsPIC?数字信号控制器.......................................新兴的实用芯片资料太多,实在无法一一列出。
2014年西安交通大学本科生科研训练和实践创新-西安交通大学教务处
项目名称
点阵式骨科病人褥疮防治病床 肘部康复装置的机械结构创新设 计与制作 地震搜救机器人的设计制作 传动演示机器人 抛光机夹持装置 旋转智能桌椅 “Xjtuer-西交人” 开放式网络平 台的创立 基于超快编码光投影的便携式 3D 照相机开发与研究 机械原理展示台车转向系统的结构简化设计 立体影像展示机 一种挠度与转角测量装置的开发 节能车二级传动节能设计 基于微纳技术的非标记癌细胞散 射测量研究与光纤检测系统机构 基于能量自给型无线传感器网络 的振动信号采集方法研究 面向 ABU ROBOCON 2014 大赛的机 器人的设计与制作 大学生综合性多功能床的设计与 创新 新型多自由度模型投影黑板 手持式无标志点拼接 3D 扫描仪 的开发 面向 ABU ROBOCON 2014 大赛的爬 梯机器人的设计与制作 节能车车架焊接夹持装置的研究 多功能可调节桌椅
户外课堂 基于纳米材料的室内空气智能治 理仪 冰面垃圾清理小车的设计与制造 微冲击强化实验平台开发 节能车电控式离合器设计 气动肌肉驱动的肘部康复装置的 控制系统设计 双足机器人 Nao Robot 的行走研 究 磁悬浮定位控制系统 非标记早期癌细胞光学检测系统 集成电路设计 气动执行机构的位置检测与伺服 控制 自动贴合楼梯表面式履带型自动 上楼机 齿轮疲劳寿命预测 基于单片机无线通信的智能家居 中的全自动饮料机系统 机械式多功能粉笔绘图仪 机械制图专用削笔刀 凸轮运动规律的演示仪 多功能课桌 iStudy Space 设计与制作 教具收纳机 新型齿轮范成仪研发 水杯稳定装置 仿生机构的仿真研究与制作 车床主轴状态监测故障诊断 Fe3O4 磁性纳米粒子表面可视化 示踪修饰研究 陶瓷结合剂 cBN 陶瓷磨具的制备 及其磨削性能研究 单晶硼的纳米线制备及其表征 Li2S/C 复合材料做 Li-S 电池正 极研究 丙烯酸酯类无规共聚物的分子设
IP线地址分配
1460
1479
20
072
1500
1599
100
073
1600
1699
100
KP32输入 KP32输出
080 2000...2001 2000...2005
2002...2003 2006...2011
2004...2005
无
2006...2007 2012...2013
2050...2054 2050...2053
mcp-enc01enmcp-enc02en-
rcp-gw01-ets050
rcp-sw01-sca051 rcp-ue102-ue052 rcp-ue103-ue053 rcp-ue108-ue054 rcp-ue201-ue055
056
1180
1199
20
057
1200
1219
20
058
1220
2350...2354 2350...2353
085 2400...2401 2400...2405
2402...2403 2406...2411
2404...2405
2406...2407 2412...2413
2450...2454 2450...2453
086
2500
2599
100
rcp-ue202-ue056 rcp-ue203-ue057 rcp-ue204-ue058 rcp-ue205-ue059 rcp-ue301-ue060 rcp-ue302-ue061 rcp-ue303-ue062 rcp-ue304-ue063 rcp-ue305-ue064 rcp-ue306-ue065 rcp-ue401-ue066 rcp-ue403-ue067 rcp-ue404-ue068 rcp-ue406-ue069 rcp-ue407-ue070
MCP7300系列产品说明书
TREE 3: POWER MANAGEMENT 2Supervisors & Voltage Detectors Unique Strengths (So What)Broad Portfolio(It's likely we have your part)Small Packages: SOT-23 and SC-70 (Saves space)Industrial Standard Crosses (Replace high priced and poor delivery suppliers)Battery Management Unique Strengths (So What)Wide variety of charging solutions for Li-Ion batteries(We have the solution for you)Small SOT-23, MSOP, DFN and QFN packages (Saves space)DC-DC Converter (So What)Low-voltage operation (Saves Power)PFM/PWM Auto switch mode (PFM at low loads reduces current, saves power)Small SOT-23 packaging (Saves space)Step-down, Step-up (Efficiently increase or decrease voltage) Charge Pumps (So What)Low-voltage operation (Battery operation)Small SOT-23 packaging (Saves space)Step-down, Step-up (Efficiently increase or decrease voltage)Doubling & Inverting (Meets V OUT needs) Low-Frequency capable (Reduces EMI)Low-Current Operation (Saves power)LDO Unique Strengths (So What)Hundreds of voltages, currents, packages (We have a match for the need)0.5% V OUT accuracy (Fills precision need)Up to 1.5A output current(Able to power high load applications)Op Amp Unique Strengths (So What)Low current versus GBWP (Saves power)TC and MCP6XXX devices RR-I/O (Expands usable voltage range)MCP604X 1.4V operation(Two alkaline cells 90% used =1.8V)MCP644X, 450 nA operation (Use the batteries even longer)Comparators Unique Strengths (So What)Low current versus propagation delay (Saves power)Integrated Features (Saves space)1.8V and 1.4V operation (That stuff about the batteries)Programmable Gain Amplifier Unique Strengths (So What)MUX inputWide bandwidth (2 to 12 MHz) (Reduces demand on MCU I/O)System control of gain(Changes easier through software configurable hardware)TREE 5: LINEARTemperature Sensor Unique Strengths (So What)Wide variety of solutions: logic, voltage and digital output products(Multiple sensor needs met)Small packages (Saves space)Low operating current(Saves power, smaller supply)Field or factory programmable (Low cost vs. flexibility)Programmable hysteresis (Stop system cycling)Multi-drop capability (Great for large systems)Beta compensation (Compatible with processor substrate diodes)Resistance error correction (Compensates for measurement error from long PCB traces)Fan Controllers Unique Strengths (So What)Closed loop fan control (Adjust to meet target speed even on aging fans)Integrated temperature sensing (Consolidate thermal management)Multiple temperature measurements drive one fan (Consolidate thermal management)Built-in ramp rate control and spin up alogorithm (Quick time to market, lower acoustic noise)Ability to detect/predict failure of less expensive 2-wire fans (Saves system cost)Unique solutions for extending fan life and reducing acoustic noise(Less power, nuisance and long fan life)TREE 6: MIXED-SIGNALADC Unique Strengths (So What)Low current at max sampling rate (Saves power, system cost)Small SOT-23 and MSOP packages (Saves space)Up to 24-bit resolution(Ideal for precision sensitive designs)Differential & single ended inputs (Able to cover various design needs)Up to 6 ADC per device(Save board space, system cost)DAC Unique Strengths (So What)Low Supply Current (Saves power)Low DNL & INL (Better accuracy)Extended Temperature Range(Suitable for wide temperature applications)Digital Potentiometers Unique Strengths (So What)64/256 tap (6-bit to 8-bit resolution)(Sufficient resolution for most applications)Non-volatile Memory(Remembers last wiper setting on power up)WiperLock™ Technology(Locks NV memory setting-better than OTP)Small SOT-23 and 2 × 3 DFN packages (Saves space)Low CostMOSFET Drivers (So What)4.5V up to 30V Supply voltages (Fills many application needs)Up to 12A Peak output current(Able to meet demanding design needs)Outstanding robustness and latch-upi mmunity (Ours work when the others burn up)Low-FOM MOSFETs(Support high-efficency applications)TREE 4: POWER MANAGEMENT 3LIN Unique Strengths(So What)Compliant with LIN Bus Specs 1.3, 2.0, 2.1 andSAE J2602 (Allows for reliable interoperability)High EMI Low EME (Meets OEM requirements)On-board V REG available(Saves space, allows for MCU V CC flexibility)CAN Unique Strengths(So What)Simple SPI CAN controller is an easy way toadd CAN Ports (Short design cycles)High speed transceiver meets ISO-11898 (Drop inreplacement for industry standard transceivers)Low-cost, easy-to-use development tools(Tools easy to buy/use, quick design)I/O Expanders Unique Strengths(So What)Configurable inputs (interrupt configuration flexibility)Interrupt on pin change, or change fromregister default (interrupt source flexibility)Can disable automatic address incrementingwhen accessing the device(allows continual access to the port)The 16-bit devices can operate in 8-bit or 16-bitmode (easy to interface to 8-bit or 16-bit MCUs)IrDA Unique Strengths (So What)IrDA protocol handler embedded on chip(Complex design issue solved)Low cost developer's kit available to assistInfrared design-in (Quick design cycle)Small, cost-effective way of replacing serial links(No more wires)Enables system to wirelessly communicatewith PDA (Wireless connectivity solution) TREE 8: INTERFACEAnalog & InterfaceQuestion TreesAnalog & Interface Development ToolsDemonstration Boards, Evaluation Kits and AccessoriesAnalog & Interface LiteratureADM00313EV: MCP73830L 2 × 2 TDFN Evaluation BoardADM00352: MCP16301 High Voltage Buck Converter 600 mA Demonstration BoardADM00360: MCP16301 High Voltage Buck Coverter 300 mA D2PAK Demonstration BoardADM00427: MCP16323 Evaluation Board (Supports MCP16321 and MCP16322)ARD00386: MCP1640 12V/50 mA Two Cells Input Boost Converter Reference DesignMCP1252DM-BKLT: MCP1252 Charge Pump Backlight Demonstration BoardMCP1256/7/8/9EV: MCP1256/7/8/9 Charge Pump Evaluation BoardMCP1630RD-LIC1: MCP1630 Li-Ion Multi-Bay Battery Charger Reference DesignMCP1630DM-NMC1: MCP1630 NiMH Battery Charger Demonstration BoardMCP1640EV-SBC: MCP1640 Sync Boost Converter Evaluation BoardMCP1640RD-4ABC: MCP1640 Single Quad-A Battery Boost Converter Reference DesignMCP1650DM-LED1: MCP165X 3W White LED Demonstration BoardMCP1726EV: MCP1726 LDO Evaluation BoardMCP73831EV: MCP73831 Evaluation KitMCP7383XEV: MCP73837/8 AC/USB Dual Input Battery Charger Evaluation BoardMCP7383XRD-PPM: MCP7383X Li-Ion System Power Path Management Reference DesignMCP7384XEV: MCP7384X Li-Ion Battery Chager Evaluation BoardMCP73871EV: MCP73871 Load Sharing Li-Ion Battery Charger Evaluation BoardTC1016/17EV: TC1016/17 LDO Evaluation BoardVSUPEV: SOT-23-3 Voltage Supervisor Evaluation BoardPowerManagementThermalManagementMCP9700DM-PCTL: MCP9700 Thermal Sensor PICtail Demonstration BoardMCP9800DM-PCTL: MCP9800 Thermal Sensor PICtail Demonstration BoardTC72DM-PICTL: TC72 Digital Temperature Sensor PICtail Demonstration BoardTC74DEMO: TC74 Serial Daughter Thermal Sensor Demonstration BoardTC1047ADM-PCTL: TC1047A Temperature-to-Voltage Converter PICtail™ Demonstration BoardSerial GPIODM-KPLCD: GPIO Expander Keypad and LCD Demonstration BoardMCP23X17: MCP23X17 16-bit GPIO Expander Evaluation BoardInterface MCP2515DM-BM: MCP2515 CAN Bus Monitor Demonstration BoardMCP2515DM-PTPLS: MCP2515 PICtail™ Plus Daughter BoardMCP2515DM-PCTL: MCP2515 CAN Controller PICtail Demonstration BoardMCP215XDM: MCP215X/40 Data Logger Demonstration BoardMCP2140DM-TMPSNS: MCP2140 IrDA® Wireless Temp Demonstration BoardLinear ADM00375: MCP6H04 Evaluation BoardARD00354: MCP6N11 Wheatstone Bridge Reference DesignMCP651EV-VOS: MCP651 Input Offset Evaluation BoardMCP661DM-LD: MCP661 Line Driver Demo BoardMCP6S22DM-PCTL: MCP6S22 PGA PICtail Demonstration BoardMCP6S2XEV: MCP6S2X PGA Evaluation BoardMCP6SX2DM-PCTLPD: MCP6SX2 PGA Photodiode PICtail Demonstration BoardMCP6SX2DM-PCTLTH: MCP6SX2-PGA Thermistor PICtail Demonstration BoardMCP6V01RD-TCPL: MCP6V01 Thermocouple Auto-Zero Ref DesignMCP6XXXDM-FLTR: Active Filter Demo BoardPIC16F690DM-PCTLHS: Humidity Sensor PICtail Demonstration BoardMixed-Signal MCP3221 DM-PCTL: MCP3221 12-bit A/D PICtail Demonstration BoardMCP3421DM-BFG: MCP3421 Battery Fuel Gauge Demonstration BoardMCP3551DM-PCTL: MCP3551 PICtail Demonstration BoardMCP355XDM-TAS: MCP355X Tiny Application Sensor Demonstration BoardMCP355XDV-MS1: MCP3551 Sensor Demonstration BoardMCP402XEV: MCP402X Digital Potentiometer Evaluation BoardMCP4725EV: MCP4725, 12-bit Non-Volatile DAC Evaluation Board (Preferred One)MCP4725DM-PTPLS: MCP4725, 12-bit Non-Volatile DAC PICtail Demonstration BoardADM00398: MCP3911 ADC Evaluation Board for 16-bit MicrocontrollersCorporate Microchip Product Line Card - DS00890Brochures Analog and Interface Product Selector Guide - DS21060Low Cost Development Tools Solutions Guide - DS51560Analog and Interface Guide (Volume 1) - DS00924Analog and Interface Guide (Volume 2) - DS21975Cards Analog Highlights Card - DS21972Microchip Op Amp Discovery Card - DS21947Analog & Interface Question Trees - DS21728Mirochip SAR and Delta-Sigma ACD Discovery Card - DS22101Software Tools MAPS - Microchip Advanced Product SelectorAnalog & Interface Treelink Products PresentationDesign Guides Analog-to-Digital Converter Design Guide - DS21841Digital Potentiometers Design Guide - DS22017Programmable Gain Amplifiers (PGAs), Operational Amplifiersand Comparators Design Guide - DS21861Interface Products Design Guide - DS21883Signal Chain Design Guide - DS21825Power Solutions Design Guide - DS21913Temperature Sensor Design Guide - DS21895Voltage Supervisors Design Guide - DS51548DS21728JPowerManagementLDO & SwitchingRegulatorsCharge PumpDC/DC ConvertersPower MOSFETDriversPWM ControllersSystem SupervisorsVoltage DetectorsVoltage ReferencesLi-Ion/Li-PolymerBattery ChargersUSB Port PowerControllersMixed-SignalA/D ConverterFamiliesDigitalPotentiometersD/A ConvertersV/F and F/VConvertersEnergyMeasurement ICsCurrent/DC PowerMeasurement ICsInterfaceCAN PeripheralsInfraredPeripheralsLIN TransceiversSerial PeripheralsEthernet ControllersUSB PeripheralLinearOp AmpsInstrumentationAmpsProgrammableGain AmplifiersComparatorsSafety & SecurityPhotoelectricSmoke DetectorsIonization SmokeDetectorsIonization SmokeDetector Front EndsPiezoelectricHorn DriversThermalManagementTemperatureSensorsFan Control& HarwareManagementMotor DriveStepper and DC3Ф BrushlessDC Motor DriverTREE 7: MOTOR DRIVE Stepper Unique Strenghts(So What)Industrial standard footprint(Footprint compatible to industrial leaders)Perfect PIC® MCU companion chip(Solid field support)Micro-stepping ready(Enhanced performance)Integration protections(Simplify software development)3-Phase BLDC Unique Strengths(So What)Full-wave sinusoidal(Quiet operation, low mechanical vibration)Sensorless operation (Minimum externalcomponents, no software required)Thin form factor(Fits space concerned applications)Information subject to change. The Microchip name and logo, the Microchip logo, dsPIC, PIC are registered trademarks and MiWi, PICtail and ZENA are trademarks ofMicrochip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies.© 2012, Microchip Technology Incorporated. All Rights Reserved.。
料号级对应申报要素
4016931000
1:品名
XX361800285000CA
4016931000 橡胶垫圈
鋼鐵 2:用途 UPT1000
Material
9013803010
1:品名
2:用途
XX319400003001C
9013803010
液晶顯示屏
POS機面板
Material
3919909090
XX363300493000CA
支撑
3468130800
8504909090
電源轉換器用 支架
支撑
Material
7320209000
品名
用途(汽车用、铁道车辆用等)
3468502600
7320209000 螺旋彈簧
汽车用,减震
Material
7318190000
品名
材质
3463401400
7318190000 鋼鐵螺紋撥桿
Material
0143822803
8533219000
Material 203877520365H 203838730205
Material
8542319000
1:品名
2:用途(如半导体晶圆制造用等)
塑料遮光贴
UPT1000 POS機
1:品名
2:用途(如半导体晶圆制造用等)
塑料遮光贴
UPT1000 POS機
1:品名
2:材质(钢铁)
螺丝D 1:品名 双面胶带A 1:品名
连接器A
1:品名
鋼鐵 2:用途 黏貼於LCM上防水 2:用途
8542319000 3506100090
3506100090
3506100090
ADDA转换器元件集.
ADDA转换器元件集第一部分A/D、D/A转换器基本知识第1章A/D转换器基本原理1.1 A/D转换器概述1.1.1 A/D转换器的作用1.1.2 A/D转换器的编码1.2 A/D转换器的常用术语及性能指标1.3 A/D转换器误差及其对系统性能的影响1.3.1 数据采集系统的误差分配1.3.2 A/D转换器自身的误差1.3.3 数据采集系统的噪声第2章A/D转换器的种类及结构2.1 逐次逼近型A/D转换器2.2 流水线型A/D转换器-型A/D转换器2.4 闪速A/D转换器2.5 积分型A/D转换器2.6 压频转换器2.7 智能A/D转换器2.7.1 智能A/D转换器还是带A/D转换器的控制器2.7.2 作为智能A/D转换器的MSC1210第3章A/D转换器外围电路3.1 信号调理电路3.1.1 电桥3.1.2 信号放大或衰减3.1.3 信号隔离3.1.4 滤波3.2 电压基准的特性及选用3.2.1 电压基准的主要参数3.2.2 常用电压基准的类型3.2.3 电压基准的选用第4章D/A转换器基本原理及分类4.1 D/A转换器基本概念及常用术语4.1.1 D/A转换器的用途4.1.2 D/A转换器的常用术语4.2 D/A转换器的误差及失真4.3 D/A转换器的种类及结构4.3.1 D/A转换器结构简介4.3.2 Kelvin分压器(Kelvin Divider)4.3.3 全解码型D/A转换器4.3.4 二进制加权型D/A转换器(Binary-Weighted DAC)4.3.5 倒T形D/A转换器4.3.6 分段型D/A转换器4.3.7 过采样/内插D/A转换器第二部分A/D、D/A转换器手册A/D转换器选型表D/A转换器选型表A/D、D/A转换器手册ICL7126MAX138/MAX139/MAX140MAX1492/MAX1494TC14433/TC14433AICL7135ICL7135C/TLC7135CTC7135AD570/AD571AD7466/AD7467/AD7468AD7476/AD7477/AD7478AD7476A/AD7477A/AD7478AADCS7476/ADCS7477/ADCS7478AD7813ADC0801/ADC0802/ADC0803/ADC0804/ADC0805 ADC0820TLC0820AC/TLC0820AIAD7820ADC08031/ADC08032/ADC08034/ADC08038 ADC08060ADC08L060ADC08100ADC08200ADC1173ADC1175ADC1175-5ADC08061/ADC08062ADC08161ADC08131/ADC08134/ADC08138ADC08351ADC08831/ADC08832ADCV0831ADS830/ADS831ADS930/ADS931ADS7826/ADS7827/ADS7829MAX100MAX101AMAX104MAX106MAX108MAX152MAX165/MAX166TLC5510/TLC5510A/TLC5540TLC548/TLC549AD876AD578/AD579AD7451/AD7441AD7470/AD7472AD7910/AD7920AD9060AD7810ADC1005ADC1001ADC1061ADC10030ADC10040ADC10065ADC10080ADC10061/ADC10062/ADC10064ADC10461/ADC10462/ADC10464ADC10321ADC10221ADC10731/ADC10732/ADC10734/ADC10738 ADS820/ADS821ADS822/ADS823/ADS825/ADS826/ADS828 ADS5102/ADS5103LTC1091/LTC1092/LTC1093/LTC1094LTC1197/LTC1197L/LTC1199/LTC1199L LTC1392TLV1572MAX151MAX1444MAX1446MAX1448MAX1449MAX1426MAX1425MCP3001THS1030/THS1031THS1040/THS1041TLC1549C/TLC1549I/TLC1549MTLV1549C/TLC1549I/TLC1549MAD572AD574AAD674BAD774BAD678AD871AD1671AD1672AD7450/AD7450A/AD7440AD7452/AD7453AD7457AD7475/AD7495AD7482AD7490AD7492/AD7492-5AD7572AD7572AAD7853/AD7853LAD7854/AD7854LAD7870/AD7875/AD7876AD7870AAD7878AD7893AD7895AD7896AD7898AD9221/AD9223/AD9220ADC912AADC12L066ADC12L063ADC1241ADC1251ADC12010ADC12020ADC12040ADC12H030/ADC12H032/ADC12H034/ADC12H038 ADC12030/ADC12032/ADC12034/ADC12038ADC12041ADC12081ADC12181/ADC12191ADC12281ADC12441ADC12451ADS807ADS1286ADS5410ADS800/ADS801/ADS802 ADS803/ADS804/ADS805 ADS808/ADS809ADS1286ADS5220/ADS5221ADS5410ADS7804ADS7806ADS7808ADS7810ADS7812ADS7816ADS7817ADS7818ADS7822ADS7823ADS7834ADS7835ADS7881CLC5957ICL7109TC7109/TC7109ALTC1272LTC1273/LTC75/LTC76 LTC1274/LTC1277LTC1278LTC1279LTC1282LTC1285/LTC1288LTC1286/LTC1298ADS1286LTC1287LTC1292/LTC1297LTC1400LTC1401LTC1402LTC1404LTC1405LTC1409LTC1410LTC1412LTC1415LTC1420LTC1860/LTC1861LTC1860L/LTC1861LMAX162/MX7572MAX170MAX1211MCP3201TC7109/TC7109ATHS1215/THS1230ADC14061ADC14071ADC14161MAX194MAX1156/MAX1158/MAX1174 MAX1157/MAX1159/MAX1175 ADS850AD679AD7484AD7485AD7871/AD7872AD7894AD7940AD9241AD9243AD7851TLC3541/TLC3545ADS850ADS5421ADS8324THS1401/THS1403/THS1408 THS14F01/THS14F03THS1401-EP/03-EP/08-EPAD676AD1376/AD1377AD9260AD7701AD7715AD7720AD7722AD7723AD7725ADC16061ADS1202ADS7805TLC4541/TLC4545ADS1100/ADS1110ADS1605/ADS1606ADS7807ADS7809ADS7811/ADS7815ADS7813ADS8320/ADS8321ADS8322/ADS8323ADS8325ADS8371ADS8401/ADS8402ADS8411/ADS8412LTC1603LTC1608LTC1864/LTC1865LTC2433-1MAX195MAX1162MAX1165/MAX1166MAX1169MAX1178/MAX1188MAX1179/1187/1189MAX1460MAX1462TC3400TC500/TC500A/TC510/TC514 AD7703LTC2421/LTC2422AD1555/AD1556LTC2401/LTC2402MAX105MAX107MAX1197MAX1198THS0842ADC10D020ADC10D040ADS5203/ADS5204AD7866ADC10D040MAX133/MAX134AD7904/AD7914/AD7924 AD7908/AD7918/AD7928ADC0808/ADC0809ADC0816/ADC0817ADC0844/ADC0848MAX1191MAX1193MAX1195MAX1196TLC0834/TLC0838LTC0831/LTC0832TLC540/TLC541/TLC542AD7911/AD7921AD7912/AD7922AD7934/AD7933AD7936/AD7935AD7938/AD7939AD7994/AD7993AD7998/AD7997AD7776/AD7777/AD7778AD7811/AD7812AD7816/AD7817/AD7818ADC10154/ADC10158ADC10662/ADC10664ADS5120/ADS5121/ADS5122 LTC1090LTC1283LTC1852/LTC1853MAX1090/MAX1092MAX1091/MAX1093MCP3002MCP3004/MCP3008THS1007/THS1009THS10064/THS10082TLC1550I/TLC1550M/TLC1551I TLC1541/TLC1542/TLC1543 TLC1514/TLC1518TLV1571/TLV1578TLV1570TLV1562TLV1543C/TLV1543I/TLV1543M TLV1504/TLV1508AD7858/AD7858LAD7859/AD7859LAD7862AD7864AD7873AD7874AD7880AD7886AD7887AD7888AD7890AD7891AD7892AD7923AD7927AD7992ADC12L030/ADC12L032/ADC12L034/ADC12L038 ADC78H89ADC12048ADC12062ADC12130/ADC12132/ADC12138ADC12662ADS2806/ADS2807ADS7800ADS7824ADS7828ADS7841ADS7842ADS7844ADS7852ADS7861ADS7862ADS7864ADS7870LM12L458LM12454/LM12458/LM12H458LTC1289LTC1290LTC1291LTC1293/LTC1294/LTC1296LTC1594L/LTC1598LMAX115/MAX116MAX186/MAX188MAX197MAX1226/MAX1228/MAX1230MAX1290/MAX1292MAX1291/MAX1293MAX1294/MAX1296MAX1295/MAX1297MAX1304~MAX1306/MAX1308~MAX1310/MAX1312~MAX1314 MCP3202MCP3204/MCP3208THS12082THS1206THS1207/THS1209TLV2553/TLV2556TLV2544/TLV2548TLC2543C/TLC2543I/TLC2543MTLV2541/TLV2542/TLV2545TLC3574/TLC3578/TLC2574/TLC2578TLC2554/TLC2558TLC2551/TLC2552/TLC2555AD7856AD7863AD7865AD7899AD7729ADS7871MAX110/MAX111MAX125/MAX126MAX1067/MAX1068TLC3544/TLC3548AD7654AD73360AD7705/AD7706AD7707AD7709AD7721AD7724ADS1112ADS7825ADS8341/ADS8343ADS8342ADS8344/ADS8345ADS8361ADS8364LTC2436-1MAX1167/MAX1168TC3401TC3402TC3403TC3404TC3405TC530/TC534MAX1400MAX1401MAX1402MAX1403LTC2424/LTC2428LTC2404/LTC2408LTC2412LTC2414/LTC2418LTC1426DAC0800/DAC0802DAC0808DAC0830/DAC0832LTC1329-10/LTC1329-50/LTC1329A-50 LTC1428-50MAX5186/MAX5189AD8600DS1851LTC1665/LTC1660LTC1427-50MAX5180/MAX5183MAX5858LTC1661LTC1662LTC1663LTC1664LTC1669MAX5354/MAX5355MAX5158/MAX5159LTC8043LTC7541ALTC7543/LTC8143LTC1590LTC1666/LTC1667/LTC1668LTC1257MAX5886LTC1456LTC1450/LTC1450LLTC1451/LTC1452/LTC1453LTC1659MAX5120/MAX5121MAX5122/MAX5123MAX5174/MAX5176MAX5175/MAX5177MAX5352/MAX5353MX7845AD7237A/AD7247ALTC1446/LTC1446LLTC1448LTC1454/LTC1454LLTC2602/LTC2612/LTC2622 MAX5154/MAX5155MAX5156/MAX5157MX7837/MX7847LTC1458/LTC1458LLTC2600/LTC2610/LTC2620 MAX535/MAX5351MAX5130/MAX5131MAX5132/MAX5133MAX5150/MAX5151MAX5152/MAX5153MAX5839MX7839DAC14135LTC1591/LTC1597MAX5887LTC1654LTC1658MAX5170/MAX5172MAX5171/MAX5173MAX5195MX7841LTC1595/LTC1596/LTC1596-1 LTC1599MAX5888LTC1650LTC1655/LTC1655LLTC1657/LTC1657LLTC1821MAX5200/MAX5203MAX5204/MAX5207MAX5621/MAX5622/MAX5623 MAX5631/MAX5632/MAX5633。
热敏打印机 MCP300 开发手册
便携式热敏蓝牙打印机型号:MCP300开发手册目录第一章简介 (3)第二章使用 (3)打印测试 (3)指示灯指示 (3)第三章打印命令集 (3)1、打印命令一览表 (3)2、打印命令详解 (5)2.1打印命令 (5)2.2行间距设置命令 (6)2.3字符设置命令 (7)2.4图形打印命令 (10)2.5按键控制命令 (13)2.6初始化命令 (13)2.7状态传输命令 (13)2.8条码打印命令 (14)2.9控制板参数命令 (16)附录1:代码页 (18)附录B:国际字符集 (19)第一章简介MCP300系列列打印机是专门设计的蓝牙打印机,具有如下特点:打印控制板内置GB18030中文字库,彻底免除生僻字的苦恼。
打印速度快,噪声低工作电压范围宽5.0~9.0V机械尺寸小,便于用户安装第二章使用打印测试上电后,按开关键后,按进纸键,打印机将打印一张测试页。
指示灯指示上电后,指示灯将亮灭2次,间隔1秒,表示启动正常,随后指示灯如下显示:闪1次:自检正常。
闪2次:未检测到打印机。
闪3次:打印机缺纸。
闪5次:打印机芯的加热片过热。
闪10次:未检测到中文字库芯片。
第三章打印命令集1、打印命令一览表命令速查命令说明打印命令LF打印并换行HT跳到下一个TAB位置FF打印缓冲区数据ESC FF打印缓冲区数据ESC J n打印缓冲区数据并走纸n点行ESC d n打印缓冲区数据并走纸n行ESC=n设置打印在线、离线格式设置命令ESC2设置行间距为32点ESC3n设置行间距为n点行ESC a n设置对齐方式,左对齐,右对齐,居中对齐GS L nL nH设置左边距ESC$设置页的左边距字符设置命令ESC!n设置打印字符格式GS!n设置取消字体加宽加高ESC E n设置取消字体加粗ESC SP n设置字符间距ESC SO设置字符倍宽打印ESC DC4取消字符倍宽打印ESC{n设置/取消字符上下倒置GS B n设置/取消字符反白打印ESC-n设置下划线的点高度ESC%n设置/取消用户自定义字符ESC&设定用户自定义字符ESC?取消用户自定义字符ESC R n选择国际字符集ESC t n选择字符代码页图形设置命令ESC*打印一点行图形GS*下装点图设置GS/打印下装点图GS v打印指定宽度高度位图DC2*位图打印DC2V打印MSB位图DC2v打印LSB位图初始化命令ESC@打印机初始化状态传输命令ESC v n向主机传送打印机状态ESC u n向主机传送周边设置状态GS a n允许/禁止状态自动上传条码设置命令GS H选择HRI打印方式GS h设置条码高度GS x设置条码打印左边距GS w设置条码横向宽度GS k打印条码控制板参数命令ESC7n1n2设置打印参数ESC8设置睡眠参数DC2#n设置打印浓度DC2T打印测试页说明:黑标相关命令并不是所有控制板都支持。
MCP37220-200和MCP37D20-200双通道高速ADC数据手册说明书
2016 Microchip Technology Inc.DS20005396A_CN 第1页MCP37220-200MCP37D20-200特性• 采样速率:200 Msps• f IN = 15 MHz 且幅值为-1 dBFS 时的信噪比(Signal-to-Noise Ratio ,SNR ):-200 Msps 时为67.8 dBFS (典型值)• f IN = 15 MHz 且幅值为-1 dBFS 时的无杂散动态范围(Spurious-Free Dynamic Range ,SFDR ):-200 Msps 时为96 dBc (典型值) • 使用LVDS 数字I/O 时的功耗:-200 Msps 时为348mW• 使用CMOS 数字I/O 时的功耗:-200 Msps 时为306 mW ,输出时钟 = 100 MHz • 不使用数字I/O 时的功耗:-200 Msps 时为257mW • 节能模式:-待机期间功耗为80 mW -关断期间功耗为33 mW • 供电电压:-数字部分:1.2V 和1.8V -模拟部分:1.2V 和1.8V• 可选择的满量程输入范围:最高为1.8 V P-P • 模拟输入带宽:650 MHz • 输出接口:-并行CMOS 和DDR LVDS • 输出数据格式:-二进制补码或偏移二进制• 可选的输出数据随机数发生器• 数字信号后处理(Digital Signal Post-Processing ,DSPP )选项:-用于提高SNR 的抽取滤波器-失调和增益调整-数字下变频(Digital Down-Conversion ,DDC ),可产生I/Q 或f S /8输出(MCP37D20-200)• 内置ADC 线性校准算法:-谐波失真校正(Harmonic Distortion Correction ,HDC )-DAC 噪声消除(DAC Noise Cancellation ,DNC )-动态元件匹配(Dynamic Element Matching ,DEM )-闪存误差校准• 串行外设接口(Serial Peripheral Interface ,SPI ) • 封装选项:-VTLA-124(9 mm x 9 mm x 0.9 mm )-TFBGA-121(8 mm x 8 mm x 1.08 mm )• TFBGA 封装不需要外部参考电压去耦电容• 工业级温度范围:-40°C 至+85°C典型应用• 通信仪器• 微波数字无线电• 蜂窝基站• 雷达• 扫描仪和低功耗便携式仪器•工业和消费类数据采集系统器件产品(1)部件编号采样速率分辨率数字抽取(FIR 滤波器)数字下变频噪声整形再量化器MCP37220-200200 Msps 14有无无MCP37D20-200200 Msps 14有有无MCP37210-200200 Msps 12有无有MCP37D10-200200 Msps12有有有注1:对于TFBGA 封装,请与Microchip Technology Inc.联系来了解供货情况。
Modicon M340自动化平台BMXP341000处理器模块说明书
DEL-BMXP341000i s c l a im e r : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n sProduct datasheetCharacteristicsBMXP341000processor module M340 - max 512 discrete + 128analog I/O - ModbusMainRange of productModicon M340 automation platform Product or component type Processor module Number of racks 2Number of slots11Discrete I/O processor capacity 512 I/O single-rack configuration Analogue I/O processor capacity 128 I/O multi-rack configuration 66 I/O single-rack configuration Number of application specific channel 20MonitoringDiagnostic counters Modbus Event counters ModbusComplementaryControl channelsProgrammable loopsIntegrated connection typeUSB port 12 Mbit/sNon isolated serial link RJ45 character mode asynchronous in baseband RS232C full duplex 0.3...19.2 kbit/s 2 twisted shielded pairsNon isolated serial link RJ45 character mode asynchronous in baseband RS485 half duplex 0.3...19.2 kbit/s 1 twisted shielded pairNon isolated serial link RJ45 Modbus master/slave RTU/ASCII asynchronous in baseband RS232C half duplex 0.3...19.2 kbit/s 1 twisted shielded pairNon isolated serial link RJ45 Modbus master/slave RTU/ASCII asynchronous in baseband RS485half duplex 0.3...19.2 kbit/s 1 twisted shielded pair Communication module processor 2 Ethernet communication module 2 AS-Interface module Number of devices per segment 0...32 character mode 0...32 ModbusNumber of devices 2 point-to-point character mode 2 point-to-point ModbusBus length0...10 m serial link non isolated character mode segment 0...10 m serial link non isolated Modbus segment0...1000 m serial link isolated character mode segment 0...1000 m serial link isolated Modbus segment 0...15 m character mode point-to-point0...15 m Modbus point-to-pointTap links length0...15 m serial link non isolated character mode segment0...15 m serial link non isolated Modbus segment0...40 m serial link isolated character mode segment0...40 m serial link isolated Modbus segmentNumber of addresses0...248 character mode0...248 ModbusRequests 1 K data bytes per request character mode252 data bytes per RTU request Modbus504 data bytes per ASCII request ModbusControl parameter One CRC on each frame (RTU) ModbusOne LRC on each frame (ASCII) character modeOne LRC on each frame (ASCII) ModbusMemory description2048 kB internal RAM128 kB internal RAM for data1792 kB internal RAM for program constants and symbolsSupplied memory card (BMXRMS008MP) for backup of programs, constants, symbols and data Maximum size of object areas128 kB unlocated internal data16250 %Mi located internal bits32464 %MWi internal words located internal data32760 %KWi constant words located internal dataDefault size of object areas128 %KWi constant words located internal data256 %Mi located internal bits512 %MWi internal words located internal dataApplication structure 1 periodic fast task1 cyclic/periodic master taskNo auxiliary task32 event tasksExecution time per instruction0.18 µs Boolean0.26 µs double-length words0.38 µs single-length words1.74 µs floating pointsNumber of instructions per ms 4.2 Kinst/ms 65 % Boolean + 35 % fixed arithmetic5.4 Kinst/ms 100 % BooleanSystem overhead0.2 ms fast task1.05 ms master taskCurrent consumption72 mA 24 V DCSupply Internal power supply via rackMarking CEStatus LED 1 LED green processor running (RUN)1 LED red I/O module fault (I/O)1 LED red memory card fault (CARD ERR)1 LED red processor or system fault (ERR)1 LED yellow activity on Modbus (SER COM)Product weight0.2 kgEnvironmentAmbient air temperature for operation0...60 °CRelative humidity10...95 % without condensationIP degree of protection IP20Protective treatment TCStandards UL 508IEC 61131-2EN 61131-2CSA C22.2 No 213 Class I Division 2CSA C22.2 No 142Offer SustainabilitySustainable offer status Green Premium productRoHS (date code: YYWW)Compliant - since 0722 - Schneider Electric declaration of conformitySchneider Electric declaration of conformityREACh Reference contains SVHC above the threshold - Go to CaP for more detailsGo to CaP for more detailsProduct environmental profile AvailableProduct environmental Product end of life instructionsAvailableEnd of life manualContractual warrantyWarranty period18 monthsProduct datasheetDimensions DrawingsBMXP341000Modules Mounted on RacksDimensions(1)With removable terminal block (cage, screw or spring).(2)With FCN connector.DEL-BMXP341000。
TIPTOP-物料需求计划解析
MRP 必要字段之OVERVIEW
重要字段
料件基本资料 - 来源码 - 低阶码 Run MRP 前需执行低阶码
重计作业
采购资料 - 补货策略码
订单式生产及期间采购
- 采购单位批量 - 最少采购数量 - 采购损耗率
说
明
P,M,C,D,T,S..... 料件愈上层, 阶数越低
➢ 采购料件 =>请购单 ➢ 自制料件 =>工单
取消建议(amrr540) MRP版本比较表(amrr570) MRP-PLP与PR数量比较表(amrr580)
MRP定期检查
数据完整性
a.库存正确与否,实际与账面正确率在 95% 以上 b.生产及采购订单的有效性在 95% 以上 c.BOM准确性在 98% 以上 d.MPS可行性在 95% 以上 e.制程(Routing)准确性在 98% 以上 f.料件基本数据正确性在 98%以上 g.ECN正确反应,实时更新 h.定案检讨批量政策,损耗率,Lead Time
**指定厂牌之管理( abmi310/abmi650)
~主件料号需依客户需求作区分, 组件可指定特定之厂牌
**独立需求之模拟
**MPS( Master Production Schedule )之维护
物料需求仿真流程
料件数据检视 调整
amri600
是否有 取替代料件
N
是否有指定 厂牌组件
N
组件替代料件
6.工单完工日期要正确
产品结构数据维护作业 工程变异单维护作业 工程变异单维护作业 替代料数据维护作业 一般订单维护作业 订单变更单维护作业 订单结案作业 采购单维护作业 采购单更单维护作业 采购单结案作业 料件基本数据维护-采购 料件基本数据维护-采购 请购单维护作业 请购单结案作业 料件基本数据维护-生管 料件基本数据维护-生管 厂内工单-逐张结案作业 厂内工单-整批结案作业 工单维护作业
MICROCHIP MCP4021 2 3 4 数据手册
参数
符号 最小值 典型值 最大值
单位
条件
电阻端接输入电压范围 (A、 B 和 W 端) 流经 A、 W 或 B 端的最大电流 注入 A、 W 或 B 端的泄漏电流
电容 (PA) 电容 (Pw) 电容 (PB) 带宽 -3 dB 数字输入 / 输出 (CS, U/D) 输入高电平 输入低电平 高电平输入下限 高电平输入上限 CS 上拉 / 下拉电阻 CS 弱上拉 / 下拉电流 输入泄漏电流 CS 和 U/D 引脚电容 RAM (电刷)值 值域 EEPROM 耐久性 EEPROM 范围 初始出厂设置 电源要求 输入电源敏感度 (仅 MCP4021 和 MCP4023)
应用
• 电源的调整和校准 • 可在新设计中取代传统机械电位计 • 仪表、偏置和增益调节
说明
MCP4021/2/3/4 系列器件是 6 位分辨率的非易失性数字 电位计,它既可以配置成电位计,也可以配置成变阻 器。通过简单的 Up/Down (U/D)串行接口对电刷设置 进行控制。
该系列器件采用了 Microchip 的 WiperLock 技术,它允 许在 EEPROM 中保存应用特定的校准设置,而不需要 使用额外的写保护引脚。
2006 Microchip Technology Inc.
DS21945C_CN 第 3 页
MCP4021/2/3/4
AC/DC 特性 (续)
电气规范:除非另有说明,否则所有参数适用于规定的工作范围。 TA = -40°C 至 +125°C, 2.1kΩ, 5 kΩ, 10kΩ 和 50 kΩ 器件。典型值参数条件是在 VDD = 5.5V, VSS = 0V, TA = +25°C。
更多相关信息。 8: 外部连接 MCP4021,以符合 MCP4022 和 MCP4024 的配置,然后进行测试。
微芯,DSPIC30F系列,规格书,Datasheet 资料
© 2010 Microchip Technology Inc.DS70102K-page1dsPIC30F1.0OVERVIEW AND SCOPEThis document defines the programming specification for the dsPIC30F family of Digital Signal Controllers (DSCs). The programming specification is required only for the developers of third-party tools that are used to program dsPIC30F devices. Customers using dsPIC30F devices should use development tools that already provide support for device programming.This document includes programming specifications for the following devices:•dsPIC30F2010/2011/2012•dsPIC30F3010/3011/3012/3013/ 3014•dsPIC30F4011/4012/4013•dsPIC30F5011/5013/5015/5016•dsPIC30F6010/6011/6012/6013/6014/6015•dsPIC30F6010A/6011A/6012A/6013A/6014A2.0PROGRAMMING OVERVIEW OF THE dsPIC30FThe dsPIC30F family of DSCs contains a region of on-chip memory used to simplify device programming. This region of memory can store a programming executive, which allows the dsPIC30F to be programmed faster than the traditional means. Once the programming executive is stored to memory by an external programmer (such as Microchip’s MPLAB ®ICD 2, MPLAB PM3, PRO MATE ® II, or MPLAB REAL ICE™), it can then interact with the external programmer to efficiently program devices.The programmer and programming executive have a master-slave relationship, where the programmer is the master programming device and the programming executive is the slave, as illustrated in Figure 2-1.FIGURE 2-1:OVERVIEW OF dsPIC30F PROGRAMMINGTwo different methods are used to program the chip in the user’s system. One method uses the Enhanced In-Circuit Serial Programming™ (Enhanced ICSP™) protocol and works with the programming executive. The other method uses In-Circuit Serial Programming (ICSP) protocol and does not use the programming executive.The Enhanced ICSP protocol uses the faster, high-voltage method that takes advantage of the programming executive. The programming executive provides all the necessary functionality to erase, program and verify the chip through a small command set. The command set allows the programmer to program the dsPIC30F without having to deal with the low-level programming protocols of the chip.The ICSP programming method does not use the programming executive. It provides native, low-level programming capability to erase, program and verify the chip. This method is significantly slower because it uses control codes to serially execute instructions on the dsPIC30F device.This specification describes the ICSP and Enhanced ICSP programming methods. Section 3.0 “Programming Executive Application” describes the programming executive application and Section 5.0 “Device Programming” describes its application programmer’s interface for the hostprogrammer.Section 11.0 “ICSP™ Mode”describes the ICSP programming method.2.1 Hardware RequirementsIn ICSP or Enhanced ICSP mode, the dsPIC30F requires two programmable power supplies: one for V DD and one for MCLR. For Bulk Erase programming, which is required for erasing code protection bits, V DD must be greater than 4.5 volts. Refer to Section 13.0 “AC/DC Characteristics and Timing Requirements”for additional hardware parameters.Programmer dsPIC30F DeviceProgramming Executive On-chip Memory 2dsPIC30F Flash Programming SpecificationdsPIC30F Flash Programming SpecificationDS70102K-page 2© 2010 Microchip Technology Inc.2.2Pins Used During ProgrammingThe pins identified in Table 2-1 are used for device programming. Refer to the appropriate device data sheet for complete pin descriptions.TABLE 2-1:dsPIC30F PIN DESCRIPTIONS DURING PROGRAMMINGPin Name Pin TypePin Description MCLR/V PP P Programming Enable V DD P Power Supply V SS P Ground PGC I Serial Clock PGDI/OSerial Data2.3Program Memory MapThe program memory space extends from 0x0 to 0xFFFFFE. Code storage is located at the base of the memory map and supports up to 144 Kbytes (48K instruction words). Code is stored in three, 48 Kbyte memory panels that reside on-chip. Table 2-2 shows the location and program memory size of each device.Locations 0x800000 through 0x8005BE are reserved for executive code memory. This region stores either the programming executive or debugging executive. The programming executive is used for device programming, while the debug executive is used for in-circuit debugging. This region of memory cannot be used to store user code.Locations 0xF80000 through 0xF8000E are reserved for the Configuration registers. The bits in these registers may be set to select various device options, and are described in Section 5.7 “Configuration Bits Programming”.Locations 0xFF0000 and 0xFF0002 are reserved for the Device ID registers. These bits can be used by the programmer to identify what device type is being programmed and are described in Section 10.0 “Device ID”. The device ID reads out normally, even after code protection is applied.Figure 2-2 illustrates the memory map for the dsPIC30F devices.2.4Data EEPROM MemoryThe Data EEPROM array supports up to 4 Kbytes of data and is located in one memory panel. It is mapped in program memory space, residing at the end of User Memory Space (see Figure 2-2). Table 2-2 shows the location and size of data EEPROM in each device.TABLE 2-2:CODE MEMORY AND DATA EEPROM MAP AND SIZE DeviceCode Memory map (Size in Instruction Words)Data EEPROM Memory Map(Size in Bytes)dsPIC30F20100x000000-0x001FFE (4K)0x7FFC00-0x7FFFFE (1K)dsPIC30F20110x000000-0x001FFE (4K)None (0K)dsPIC30F20120x000000-0x001FFE (4K)None (0K)dsPIC30F30100x000000-0x003FFE (8K)0x7FFC00-0x7FFFFE (1K)dsPIC30F30110x000000-0x003FFE (8K)0x7FFC00-0x7FFFFE (1K)dsPIC30F30120x000000-0x003FFE (8K)0x7FFC00-0x7FFFFE (1K)dsPIC30F30130x000000-0x003FFE (8K)0x7FFC00-0x7FFFFE (1K)dsPIC30F30140x000000-0x003FFE (8K)0x7FFC00-0x7FFFFE (1K)dsPIC30F40110x000000-0x007FFE (16K)0x7FFC00-0x7FFFFE (1K)dsPIC30F40120x000000-0x007FFE (16K)0x7FFC00-0x7FFFFE (1K)dsPIC30F40130x000000-0x007FFE (16K)0x7FFC00-0x7FFFFE (1K)dsPIC30F50110x000000-0x00AFFE (22K)0x7FFC00-0x7FFFFE (1K)dsPIC30F50130x000000-0x00AFFE (22K)0x7FFC00-0x7FFFFE (1K)dsPIC30F50150x000000-0x00AFFE (22K)0x7FFC00-0x7FFFFE (1K)dsPIC30F50160x000000-0x00AFFE (22K)0x7FFC00-0x7FFFFE (1K)dsPIC30F60100x000000-0x017FFE (48K)0x7FF000-0x7FFFFE (4K)dsPIC30F6010A 0x000000-0x017FFE (48K)0x7FF000-0x7FFFFF (4K)dsPIC30F60110x000000-0x015FFE (44K)0x7FF800-0x7FFFFE (2K)dsPIC30F6011A 0x000000-0x015FFE (44K)0x7FF800-0x7FFFFE (2K)dsPIC30F60120x000000-0x017FFE (48K)0x7FF000-0x7FFFFE (4K)dsPIC30F6012A 0x000000-0x017FFE (48K)0x7FF000-0x7FFFFE (4K)dsPIC30F60130x000000-0x015FFE (44K)0x7FF800-0x7FFFFE (2K)dsPIC30F6013A 0x000000-0x015FFE (44K)0x7FF800-0x7FFFFE (2K)dsPIC30F60140x000000-0x017FFE (48K)0x7FF000-0x7FFFFE (4K)dsPIC30F6014A 0x000000-0x017FFE (48K)0x7FF000-0x7FFFFE (4K)dsPIC30F60150x000000-0x017FFE (48K)0x7FF000-0x7FFFFE (4K)Legend:I = Input, O = Output, P = Power© 2010 Microchip Technology Inc.DS70102K-page 3dsPIC30F Flash Programming SpecificationFIGURE 2-2:PROGRAM MEMORY MAPU s e r M e m o r y S p a c e000000Configuration RegistersUser Flash Code Memory 018000017FFE C o n f i g u r a t i o n M e m o r y S p a c eData EEPROM (48K x 24-bit)(2K x 16-bit)800000F80000(8 x 16-bit)F8000E F80010Device ID FEFFFE FF0000FFFFFEReservedF7FFFE Reserved7FF0007FEFFE 8005BE 8005C0Executive Code Memory7FFFFE ReservedFF0002FF0004Reserved(2 x 16-bit)(Reserved)Note:The address boundaries for user Flash code memory and data EEPROM are device-dependent.Unit ID (32 x 24-bit)8005FE 800600dsPIC30F Flash Programming SpecificationDS70102K-page 4© 2010 Microchip Technology Inc.3.0PROGRAMMING EXECUTIVE APPLICATION3.1Programming Executive OverviewThe programming executive resides in executive memory and is executed when Enhanced ICSP Programming mode is entered. The programming exec-utive provides the mechanism for the programmer (host device) to program and verify the dsPIC30F, using a simple command set and communication protocol.The following capabilities are provided by the programming executive:•Read memory-Code memory and data EEPROM -Configuration registers -Device ID •Erase memory-Bulk Erase by segment -Code memory (by row)-Data EEPROM (by row)•Program memory -Code memory-Data EEPROM-Configuration registers •Query-Blank Device-Programming executive software versionThe programming executive performs the low-level tasks required for erasing and programming. This allows the programmer to program the device by issuing the appropriate commands and data.The programming procedure is outlined in Section 5.0 “Device Programming”.3.2Programming Executive Code MemoryThe programming executive is stored in executive code memory and executes from this reserved region of memory. It requires no resources from user code memory or data EEPROM.3.3Programming Executive Data RAMThe programming executive uses the device’s data RAM for variable storage and program execution. Once the programming executive has run, no assumptions should be made about the contents of data RAM.4.0CONFIRMING THE CONTENTS OF EXECUTIVE MEMORYBefore programming can begin, the programmer must confirm that the programming executive is stored in exec-utive memory. The procedure for this task is illustrated in Figure 4-1.First, ICSP mode is entered. The unique application ID word stored in executive memory is then read. If the programming executive is resident, the application ID word is 0xBB, which means programming can resume as normal. However, if the application ID word is not 0xBB, the programming executive must be programmed to Executive Code memory using the method described in Section 12.0 “Programming the Programming Executive to Memory”.Section 11.0 “ICSP™ Mode” describes the process for the ICSP programming method. Section 11.13 “Reading the Application ID Word” describes the procedure for reading the application ID word in ICSP mode.FIGURE 4-1:CONFIRMING PRESENCE OF THE PROGRAMMING EXECUTIVEIsStartEnter ICSP™ ModeApplication ID0xBB?Resident in MemoryYesNoProg. Executive is Application ID Read the be ProgrammedProg. Executive must from Address 0x8005BEFinishdsPIC30F Flash Programming Specification5.0DEVICE PROGRAMMING5.1Overview of the ProgrammingProcessOnce the programming executive has been verified in memory (or loaded if not present), the dsPIC30F can be programmed using the command set shown in Table 5-1. A detailed description for each command is provided in Section 8.0 “Programming Executive Commands”.TABLE 5-1:COMMAND SET SUMMARY Command DescriptionSCHECK Sanity checkREADD Read data EEPROM, Configurationregisters and device IDREADP Read code memoryPROGD Program one row of data EEPROMand verifyPROGP Program one row of code memory andverifyPROGC Program Configuration bits and verify ERASEB Bulk Erase, or erase by segment ERASED Erase data EEPROMERASEP Erase code memoryQBLANK Query if the code memory and dataEEPROM are blankQVER Query the software versionA high-level overview of the programming process is illustrated in Figure 5-1. The process begins by enter-ing Enhanced ICSP mode. The chip is then bulk erased, which clears all memory to ‘1’ and allows the device to be programmed. The Chip Erase is verified before programming begins. Next, the code memory, data Flash and Configuration bits are programmed. As these memories are programmed, they are each verified to ensure that programming was successful. If no errors are detected, the programming is complete and Enhanced ICSP mode is exited. If any of the verifications fail, the procedure should be repeated, starting from the Chip Erase.If Advanced Security features are enabled, then individual Segment Erase operations need to be performed, based on user selections (i.e., based on the specific needs of the user application). The specific operations that are used typically depend on the order in which various segments need to be programmed for a given application or system.Section 5.2 “Entering Enhanced ICSP Mode”through Section 5.8 “Exiting Enhanced ICSP Mode”describe the programming process in detail.FIGURE 5-1:PROGRAMMING FLOWStartProgram andProgram andProgram and verifyConfiguration bitsFinishverify codeverify dataEnter EnhancedExit Enhanced ICSPModePerform ChipEraseProgramConfigurationregisters toICSP™ modedefault value© 2010 Microchip Technology Inc.DS70102K-page 5dsPIC30F Flash Programming SpecificationDS70102K-page 6© 2010 Microchip Technology Inc.5.2Entering Enhanced ICSP ModeThe Enhanced ICSP mode is entered by holding PGC and PGD high, and then raising MCLR/V PP to V IHH (high voltage), as illustrated in Figure 5-2. In this mode, the code memory, data EEPROM and Configuration bits can be efficiently programmed using the program-ming executive commands that are serially transferred using PGC and PGD.FIGURE 5-2:ENTERING ENHANCED5.3Chip EraseBefore a chip can be programmed, it must be erased. The Bulk Erase command (ERASEB ) is used to perform this task. Executing this command with the MS command field set to 0x3 erases all code memory, data EEPROM and code-protect Configuration bits. The Chip Erase process sets all bits in these three memory regions to ‘1’.Since non-code-protect Configuration bits cannot be erased, they must be manually set to ‘1’ using multiple PROGC commands. One PROGC command must be sent for each Configuration register (see Section 5.7 “Configuration Bits Programming”).If Advanced Security features are enabled, then indi-vidual Segment Erase operations would need to be performed, depending on which segment needs to be programmed at a given stage of system programming. The user should have the flexibility to select specific segments for programming.Note:The Device ID registers cannot be erased. These registers remain intact after a Chip Erase is performed.5.4Blank CheckThe term “Blank Check” means to verify that the device has been successfully erased and has no programmed memory cells. A blank or erased memory cell reads as ‘1’. The following memories must be blank checked: •All implemented code memory •All implemented data EEPROM•All Configuration bits (for their default value)The Device ID registers (0xFF0000:0xFF0002) can be ignored by the Blank Check since this region stores device information that cannot be erased. Additionally, all unimplemented memory space should be ignored from the Blank Check.The QBLANK command is used for the Blank Check. It determines if the code memory and data EEPROM are erased by testing these memory regions. A ‘BLANK’ or ‘NOT BLANK’ response is returned. The READD command is used to read the Configuration registers. If it is determined that the device is not blank, it must be erased (see Section 5.3 “Chip Erase”) before attempting to program the chip.Note 1:The sequence that places the device intoEnhanced ICSP mode places all unused I/Os in the high-impedance state.2:Before entering Enhanced ICSP mode,clock switching must be disabled using ICSP , by programming the FCKSM<1:0> bits in the FOSC Configuration register to ‘11’ or ‘10’.3:When in Enhanced ICSP mode, the SPIoutput pin (SDO1) will toggle while the device is being programmed.dsPIC30F Flash Programming Specification5.5Code Memory Programming5.5.1OVERVIEWThe Flash code memory array consists of 512 rows ofthirty-two, 24-bit instructions. Each panel stores 16Kinstruction words, and each dsPIC30F device haseither 1, 2 or 3 memory panels (see Table 5-2).TABLE 5-2:DEVICE CODE MEMORY SIZEDevice Code Size(24-bitWords)NumberofRowsNumberofPanelsdsPIC30F20104K1281 dsPIC30F20114K1281 dsPIC30F20124K1281 dsPIC30F30108K2561 dsPIC30F30118K2561 dsPIC30F30128K2561 dsPIC30F30138K2561 dsPIC30F30148K2561 dsPIC30F401116K5121 dsPIC30F401216K5121 dsPIC30F401316K5121 dsPIC30F501122K7042 dsPIC30F501322K7042 dsPIC30F501522K7042 dsPIC30F501622K7042 dsPIC30F601048K15363 dsPIC30F6010A48K15363 dsPIC30F601144K14083 dsPIC30F6011A44K14083 dsPIC30F601248K15363 dsPIC30F6012A48K15363 dsPIC30F601344K14083 dsPIC30F6013A44K14083 dsPIC30F601448K15363 dsPIC30F6014A48K15363 dsPIC30F601548K153635.5.2PROGRAMMING METHODOLOGY Code memory is programmed with the PROGP command. PROGP programs one row of code memory to the memory address specified in the command. The number of PROGP commands required to program a device depends on the number of rows that must be programmed in the device.A flowchart for programming of code memory is illus-trated in Figure 5-3. In this example, all 48K instruction words of a dsPIC30F6014A device are programmed. First, the number of commands to send (called ‘RemainingCmds’ in the flowchart) is set to 1536 and the destination address (called ‘BaseAddress’) is set to ‘0’. Next, one row in the device is programmed with a PROGP command. Each PROGP command contains data for one row of code memory of the dsPIC30F6014A. After the first command is processed successfully, ‘RemainingCmds’ is decremented by 1 and compared to 0. Since there are more PROGP commands to send, ‘BaseAddress’ is incremented by 0x40 to point to the next row of memory.On the second PROGP command, the second row of each memory panel is programmed. This process is repeated until the entire device is programmed. No special handling must be performed when a panel boundary is crossed.FIGURE 5-3:FLOWCHART FORPROGRAMMINGdsPIC30F6014A CODEMEMORYIsPROGP responsePASS?IsRemainingCmds0?BaseAddress = 0x0RemainingCmds = 1536RemainingCmds =RemainingCmds – 1FinishBaseAddress =BaseAddressNoNoYesYes+ 0x40StartFailureReport ErrorSend PROGPCommand to ProgramBaseAddress© 2010 Microchip Technology Inc.DS70102K-page 7dsPIC30F Flash Programming SpecificationDS70102K-page 8© 2010 Microchip Technology Inc.5.5.3PROGRAMMING VERIFICATIONOnce code memory is programmed, the contents of memory can be verified to ensure that programming was successful. Verification requires code memory to be read back and compared against the copy held in the programmer’s buffer.The READP command can be used to read back all the programmed code memory.Alternatively, you can have the programmer perform the verification once the entire device is programmed using a checksum computation, as described in Section 6.8 “Checksum Computation”.5.6Data EEPROM Programming5.6.1OVERVIEWThe panel architecture for the data EEPROM memory array consists of 128 rows of sixteen 16-bit data words. Each panel stores 2K words. All devices have either one or no memory panels. Devices with data EEPROM provide either 512 words, 1024 words or 2048 words of memory on the one panel (see Table 5-3).TABLE 5-3:DATA EEPROM SIZEDevice Data EEPROM Size (Words)Number of RowsdsPIC30F201051232dsPIC30F201100dsPIC30F201200dsPIC30F301051232dsPIC30F301151232dsPIC30F301251232dsPIC30F301351232dsPIC30F301451232dsPIC30F401151232dsPIC30F401251232dsPIC30F401351232dsPIC30F501151232dsPIC30F501351232dsPIC30F501551232dsPIC30F501651232dsPIC30F60102048128dsPIC30F6010A 2048128dsPIC30F6011102464dsPIC30F6011A 102464dsPIC30F60122048128dsPIC30F6012A 2048128dsPIC30F6013102464dsPIC30F6013A 102464dsPIC30F60142048128dsPIC30F6014A 2048128dsPIC30F601520481285.6.2PROGRAMMING METHODOLOGYThe programming executive uses the PROGD command to program the data EEPROM. Figure 5-4 illustrates the flowchart of the process. Firstly, the number of rows to program (RemainingRows) is based on the device size, and the destination address (DestAddress) is set to ‘0’. In this example, 128 rows (2048 words) of data EEPROM will be programmed.The first PROGD command programs the first row of data EEPROM. Once the command completes successfully, ‘RemainingRows’ is decremented by 1 and compared with 0. Since there are 127 more rows to program, ‘BaseAddress’ is incremented by 0x20 to point to the next row of data EEPROM. This process is then repeated until all 128 rows of data EEPROM are programmed.FIGURE 5-4:FLOWCHART FOR PROGRAMMINGdsPIC30F6014A DATA EEPROMIsPROGD responsePASS?IsRemainingRows0?Remaining Rows = 128BaseAddress = 0RemainingRows =RemainingRows – 1FinishBaseAddress =BaseAddress NoNoYes Yes+ 0x20StartSend PROGD Command with BaseAddressFailure Report ErrordsPIC30F Flash Programming Specification5.6.3PROGRAMMING VERIFICATIONOnce the data EEPROM is programmed, the contents of memory can be verified to ensure that the programming was successful. Verification requires the data EEPROM to be read back and compared against the copy held in the programmer’s buffer. The READD command reads back the programmed data EEPROM. Alternatively, the programmer can perform the verification once the entire device is programmed using a checksum computation, as described in Section 6.8 “Checksum Computation”.Note:TBLRDL instructions executed within a REPEAT loop must not be used to readfrom Data EEPROM. Instead, it isrecommended to use PSV access.5.7Configuration Bits Programming5.7.1OVERVIEWThe dsPIC30F has Configuration bits stored in seven 16-bit registers. These bits can be set or cleared to select various device configurations. There are two types of Configuration bits: system-operation bits and code-protect bits. The system-operation bits determine the power-on settings for system-level components such as the oscillator and Watchdog Timer. The code- protect bits prevent program memory from being read and written. The FOSC Configuration register has three different register descriptions, based on the device. The FOSC Configuration register description for the dsPIC30F2010 and dsPIC30F6010/6011/6012/6013/ 6014 devices are shown in Table 5-4.Note:If user software performs an erase opera-tion on the configuration fuse, it must befollowed by a write operation to this fusewith the desired value, even if the desiredvalue is the same as the state of theerased fuse.The FOSC Configuration register description for the dsPIC30F4011/4012 and dsPIC30F5011/5013 devicesis shown in Table 5-5.The FOSC Configuration register description forall remaining devices (dsPIC30F2011/2012, dsPIC30F3010/3011/3012/3013, dsPIC30F3014/ 4013, dsPIC30F5015 and dsPIC30F6011A/6012A/ 6013A/ 6014A) is shown in Table 5-6. Always use the correct register descriptions for your target processor.The FWDT, FBORPOR, FBS, FSS, FGS and FICD Configuration registers are not device-dependent. The register descriptions for these Configuration registersare shown in Table 5-7.The Device Configuration register maps are shown in Table 5-8 through Table 5-11.TABLE 5-4:FOSC CONFIGURATION BITS DESCRIPTION FOR dsPIC30F2010 ANDdsPIC30F6010/6011/6012/6013/6014Bit Field Register DescriptionFCKSM<1:0>FOSC Clock Switching Mode1x =Clock switching is disabled, Fail-Safe Clock Monitor is disabled01 =Clock switching is enabled, Fail-Safe Clock Monitor is disabled00 =Clock switching is enabled, Fail-Safe Clock Monitor is enabledFOS<1:0>FOSC Oscillator Source Selection on POR11 =Primary Oscillator10 =Internal Low-Power RC Oscillator01 =Internal Fast RC Oscillator00 =Low-Power 32 kHz Oscillator (Timer1 Oscillator)FPR<3:0>FOSC Primary Oscillator Mode1111 = ECIO w/PLL 16X – External Clock mode with 16X PLL. OSC2 pin is I/O1110 = ECIO w/PLL 8X – External Clock mode with 8X PLL. OSC2 pin is I/O1101 = ECIO w/PLL 4X – External Clock mode with 4X PLL. OSC2 pin is I/O1100 = ECIO – External Clock mode. OSC2 pin is I/O1011 = EC – External Clock mode. OSC2 pin is system clock output (F OSC/4)1010 = Reserved (do not use)1001 = ERC – External RC Oscillator mode. OSC2 pin is system clock output(F OSC/4)1000 = ERCIO – External RC Oscillator mode. OSC2 pin is I/O0111 = XT w/PLL 16X – XT Crystal Oscillator mode with 16X PLL0110 = XT w/PLL 8X – XT Crystal Oscillator mode with 8X PLL0101 = XT w/PLL 4X – XT Crystal Oscillator mode with 4X PLL0100 = XT – XT Crystal Oscillator mode (4 MHz-10 MHz crystal)001x = HS – HS Crystal Oscillator mode (10 MHz-25 MHz crystal)000x = XTL – XTL Crystal Oscillator mode (200 kHz-4 MHz crystal)© 2010 Microchip Technology Inc.DS70102K-page 9dsPIC30F Flash Programming SpecificationTABLE 5-5:FOSC CONFIGURATION BITS DESCRIPTION FOR dsPIC30F4011/4012 AND dsPIC30F5011/5013Bit Field Register DescriptionFCKSM<1:0>FOSC Clock Switching Mode1x =Clock switching is disabled, Fail-Safe Clock Monitor is disabled01 =Clock switching is enabled, Fail-Safe Clock Monitor is disabled00 =Clock switching is enabled, Fail-Safe Clock Monitor is enabledFOS<1:0>FOSC Oscillator Source Selection on POR11 =Primary Oscillator10 =Internal Low-Power RC Oscillator01 =Internal Fast RC Oscillator00 =Low-Power 32 kHz Oscillator (Timer1 Oscillator)FPR<3:0>FOSC Primary Oscillator Mode1111 =ECIO w/PLL 16X – External Clock mode with 16X PLL. OSC2 pin is I/O1110 =ECIO w/PLL 8X – External Clock mode with 8X PLL. OSC2 pin is I/O1101 =ECIO w/PLL 4X – External Clock mode with 4X PLL. OSC2 pin is I/O1100 =ECIO – External Clock mode. OSC2 pin is I/O1011 =EC – External Clock mode. OSC2 pin is system clock output (F OSC/4)1010 =FRC w/PLL 8x – Internal fast RC oscillator with 8x PLL. OSC2 pin is I/O1001 =ERC – External RC Oscillator mode. OSC2 pin is system clock output(F OSC/4)1000 =ERCIO – External RC Oscillator mode. OSC2 pin is I/O0111 =XT w/PLL 16X – XT Crystal Oscillator mode with 16X PLL0110 =XT w/PLL 8X – XT Crystal Oscillator mode with 8X PLL0101 =XT w/PLL 4X – XT Crystal Oscillator mode with 4X PLL0100=XT – XT Crystal Oscillator mode (4 MHz-10 MHz crystal)0011 =FRC w/PLL 16x – Internal fast RC oscillator with 16x PLL. OSC2 pin is I/O0010=HS – HS Crystal Oscillator mode (10 MHz-25 MHz crystal)0001 =FRC w/PLL 4x – Internal fast RC oscillator with 4x PLL. OSC2 pin is I/O0000=XTL – XTL Crystal Oscillator mode (200 kHz-4 MHz crystal)DS70102K-page 10© 2010 Microchip Technology Inc.dsPIC30F Flash Programming Specification TABLE 5-6:FOSC CONFIGURATION BITS DESCRIPTION FOR dsPIC30F2011/2012,dsPIC30F3010/3011/3012/3013/3014, dsPIC30F4013, dsPIC30F5015/5016,dsPIC30F6010A/6011A/6012A/6013A/6014A AND dsPIC30F6015 Bit Field Register DescriptionFCKSM<1:0>FOSC Clock Switching Mode1x =Clock switching is disabled, Fail-Safe Clock Monitor is disabled01 =Clock switching is enabled, Fail-Safe Clock Monitor is disabled00 =Clock switching is enabled, Fail-Safe Clock Monitor is enabledFOS<2:0>FOSC Oscillator Source Selection on POR111 = Primary Oscillator110 = Reserved101 = Reserved100 = Reserved011 = Reserved010 = Internal Low-Power RC Oscillator001 = Internal Fast RC Oscillator (no PLL)000 = Low-Power 32 kHz Oscillator (Timer1 Oscillator)FPR<4:0>FOSC Primary Oscillator Mode (when FOS<2:0> = 111b)11xxx = Reserved (do not use)10111 = HS/3 w/PLL 16X – HS/3 crystal oscillator with 16X PLL(10 MHz-25 MHz crystal)10110 = HS/3 w/PLL 8X – HS/3 crystal oscillator with 8X PLL(10 MHz-25 MHz crystal)10101 = HS/3 w/PLL 4X – HS/3 crystal oscillator with 4X PLL(10 MHz-25 MHz crystal)10100 = Reserved (do not use)10011 = HS/2 w/PLL 16X – HS/2 crystal oscillator with 16X PLL(10 MHz-25 MHz crystal)10010 = HS/2 w/PLL 8X – HS/2 crystal oscillator with 8X PLL(10 MHz-25 MHz crystal10001 = HS/2 w/PLL 4X – HS/2 crystal oscillator with 4X PLL(10 MHz-25 MHz crystal)10000 = Reserved (do not use)01111 = ECIO w/PLL 16x – External clock with 16x PLL. OSC2 pin is I/O01110 = ECIO w/PLL 8x – External clock with 8x PLL. OSC2 pin is I/O01101 = ECIO w/PLL 4x – External clock with 4x PLL. OSC2 pin is I/O01100 = Reserved (do not use)01011 = Reserved (do not use)01010 = FRC w/PLL 8x – Internal fast RC oscillator with 8x PLL. OSC2 pin is I/O01001 = Reserved (do not use)01000 = Reserved (do not use)00111 = XT w/PLL 16X – XT crystal oscillator with 16X PLL00110 = XT w/PLL 8X – XT crystal oscillator with 8X PLL00101 = XT w/PLL 4X – XT crystal oscillator with 4X PLL00100 = Reserved (do not use)00011 = FRC w/PLL 16x – Internal fast RC oscillator with 8x PLL. OSC2 pin is I/O00010 = Reserved (do not use)00001 = FRC w/PLL 4x – Internal fast RC oscillator with 4x PLL. OSC2 pin is I/O00000 = Reserved (do not use)© 2010 Microchip Technology Inc.DS70102K-page 11。
控创CPCI_3U模块cp3004-sa
CP3004-SA②5TH GEN. Intel® Core™ 3U CompactPCI CPU BOARDHIGH PERFORMANCE RANGE, HIGH-END GRAPHICS, HIGH CONNECTIVITY◆Core TM i7 Quadcore and Dualcore (4th gen) versions ◆DirectX® 11, OpenGL 4, three independent outputs ◆USB 3.0, SATA 6Gbit/s, 3x Gbit Ethernet, PCI Express ◆rugged VITA47 EAC3, extended temperature// 2 With CP3004-SA, the fi fth Generation of Intel® Core™ technology has been made available in Kontron’s CompactPCI product portfolio. The high density design off ers extraordinary performance-per-watt values based on the 14 nanometer technology, and is an ideal backbone for powerful network-intensive applications providing virtualization (VT-X, VT-D) and highest graphics performance. The new-generation graphics controller has up to 40 execution units providing OpenCL 1.2 / OpenGL 4 and triple independent display support. The Intel® Advanced Vector Extensions AVX 2.0 enhancements provide a huge performance improvement in fl oating-point-intensive computations, which are a key part of digital signal and image processing applications.CP3004-SA is prepared to be used in demanding and harsh environments. Dual-Core versions (4th gen CPU) provide for low heat dissipation. The processor’s TDP can be adjusted dynamically to a desired performance and power envelope. Typical applications can be found in the markets - Military / Defence: radar, sonar, general- Industrial Automation: plant control, machine control - Energy: demanding environments - Medical: imagingLong term availability and Kontron’s commitment to a rich CompactPCI portfolio make CP3004-SA a safe investment with low total-cost-of-ownership.CP3004-SA is available with dual- and quad-core CPU performance scalable from the 1.8 GHz Intel® Core™ i3-4112E up to the 2.6 GHzi7-5700EQ processor. Intel® Celeron® processors will be off ered on request. Memory-demanding applications can make use of up to 16GB 1600 MT/s DDR3 SDRAM with Error Checking and Correction (ECC). For onboard data storage, the CP3004-SA off ers up to 32GB on a dedicated SLC SATA Flash module or a H DD/SSD and CFast option on the 8HP extension module. On the system side, CP3004-SA supports a PCI 32-bit, 33MHz (66MHz on request) CompactPCI interface, enabling the peripheral mode feature. When installed in a system master slot, the CompactPCI interface is enabled, whereas the CompactPCI interface will be isolated when installed in a peripheral slot.Variety of Interfaces and OptionsThe CP3004-SA comes with a comprehensive I/O feature set supporting known and established interfaces such as VGA, USB2.0, Gigabit Ethernet and serial ports as well as the new high-speed interfaces USB3.0 and SATA 6Gb/s. By adding one of the three extension modules - XMC Carrier, Legacy I/O or SATA/USB extension – the CP3004-SA’s I/O capabilities will be further extended. Backwards compatibiliy is also granted - the optional Rear I/O interface is compatible with previous CPU board series.System SecurityOptions for write protection and TPM2.0 are provided. The Trusted Platform Module (TPM) provides hardware-based encryption mechanisms to create, seal or store keys, passwords and or other critical data.CP3004-SAFIFTH GENERATION INTEL® CORE™ 3U COMPACTPCI CPU BOARDPROCESSOR5th Generation Intel® Core™ i7 processor (14nm technology):- i7-5700EQ Quad-Core up to 2.6 GHz, 6MB L3 cacheMoreover 4th generation:- i5-4410E: Dual-Core 2.9 GHz, 3MB L3 cache- i3-4112E: Dual-Core 1.8 GHz, 3MB L3 cacheAll boards are passive cooled with a heatsink in 4HP heightForced air cooling at specifi c fl ow rate is required depending on theprocessor versionMEMORY SYSTEM MEMORYBOOT FLASH (UEFI)SATA NAND FLASHHDDCFAST Up to 16GB dual channel DDR3L SDRAM running at 1600 MHz, with ECC, via two SODIMM socketsTwo redundant 16 MB SPI boot fl ashes with fail-over functionalityUp to 32GB SLC NAND Flash on a dedicated SATA NAND Flash module The SATA NAND Flash option is only available on a 4HP CP3004-SA Onboard 2.5” SATA SSD/HDD installation via CP3004-HDD extension, optionally available with two SSD/HDDOnboard CFast installation via 8HP extensionONBOARD CONTROLLER PLATFORM CONTROLLER HUBGRAPHICSGIGABIT ETHERNETUARTWATCHDOGRTCTRUSTED PLATFORM MODULE(TPM)Mobile Intel® QM87 Platform Controller Hub featuring:- U SB host interface with eight USB2.0 and six USB3.0 ports(5x USB2.0 and 1x USB3.0 ports are used)- S ATA host controller with six SATA total (max four ports SATA 6Gb/s) with RAID 0/1/5/10 supportIntel® HD Graphics 5600 integrated (Quad-Core).- Support for up to 3x independent graphics outputs- max. resolution (HDMI 1.4) 2560 x 1600 @ 60 Hz- max. resolution (DP) 4096 x 2304 @ 60 Hz- Supports DirectX ® 11.2, OpenGL® 4.3Intel® HD Graphics 4600 integrated (Dual-Core).- Support for up to 3x independent graphics outputs- max. resolution 2560 x 1600 @ 60 Hz- Supports DirectX ® 11.1, OpenGL® 4.0Up to three 1000BASE-T interfaces, two front/rear switchable with WOL (Wake-on-LAN) support, third available via extension CP3004-HDD, Intel® i210 Ethernet controllerdual UART, 16C550-compatibleFPGA-based, timeout ranging from 125ms to 4096s programmable in16 steps, IRQ, reset, dual-stage confi gurationIntegrated in PCH, with 256 Byte CMOS RAMAtmel AT97SC3204 TPM 1.2 controllerFRONT INTERFACES 4HP VGAUSBETHERNETLED’s 1x VGA-CRT 15-pin D-Sub connector2x USB 2.0 ports, 4-pin standard USB connectors 2x RJ-45 with integrated LEDs (ACT, SPEED)6x LEDs: 4x POST Code or General Purpose, WD, THONBOARD INTERFACES SATA CABLE CONNECTORHIGH-SPEED EXTENSIONCONNECTORSSATA EXTENSION CONNECTOR 1x onboard standard 7-pin SATA connector with locking mechanism,SATA 6Gb/s2x high-speed connectors holding:- PCI Express- One SATA 3Gb/s- One SATA 6Gb/s- 2x USB 2.0/3.0- 2x DisplayPort- COM1 (TTL)- HDA- LPC1x 18-pin connector holding one SATA port for the SATA NAND Flash moduleREAR I/O VIA J2The CP3004-SA supports:- 2x SATA 3Gb/s ports- 2x Gigabit Ethernet ports without LED signals- 2x USB 2.0 ports- 1x VGA analog port- 2x COM port RS-232 (LVTTL signal level)- 5x GPIs and 3x GPOs (LVTTL signal level)- Reset and Power Management signals- Option to write protect non-volatile RAMs via a special pinCOMPACTPCI BUS INTERFACE PICMG 2.0 Rev. 3.0 compatible, 32-bit/33MHz (66MHz on request),version with rear I/O via J2Universal 5V and 3.3V PCI signalling voltage supported,7 Req/Gnt & clock linesOperating in system slot as system master and in peripheral slot inPCI passive mode// 3 SUPERVISORY FUNCTIONS Watchdog, software confi gurable, 125ms to 4096s in 16 steps,generates IRQ or hardware reset or dual-stage confi guration SOFTWARE SUPPORT- A MI uEFI, setup console redirection to serial port (VT100 mode) withCMOS setup access, EFI Shell support, board confi guration via Shell,diskless, keyboardless, videoless operation- LAN boot support- Board identifi cation number accessible via EEPROM- S upport for Windows® 7, Windows® Embedded Standard 7, Windows® 8,Windows® Server 2008R2, Linux, VxWorks®(Other OSs may also be used with the CP3004. Please contact Kontron forfurther information)COMPLIANCY- CompactPCI Core Specifi cation PICMG 2.0 Rev. 3.0- CompactPCI Hot Swap Specifi cation PICMG 2.1 Rev. 2.0Designed to meet or exceed:- Safety: UL 60950-1, CSA 22.2 No 60950, EN 60950-1, IEC 60950-1- EMI/EMC: EN 55022 / EN 55024, EN 61000-6-3 / EN 61000-6-2GENERAL DIMENSIONSWEIGHTMTBF 3U 4HP/8HP/12HP CompactPCI, 100 x 160 mmCP3004-SA 4HP: 320 g234 051 hrs acc. to MIL-HDBK-217 FN2, Ground Benign, controlled at 30°CPOWER CONSUMPTION CP3004-SA with i3-4112E: Dual-Core 1.8 GHz typ. W tbdCP3004-SA with i5-4410E: Dual-Core 2.9 GHz typ.W tbdCP3004-SA with i7-5700QE QC up to 2.6 GHz typ. W tbdENVIRONMENTAL OPERATING TEMPERATURESTORAGE TEMPERATURECLIMATIC HUMIDITY 0°C to +60°C, standard-40° to +85°C, extended temp. E2 depending on CPU and Wattage (ask) -40°C to +85ºC (without additional components)93% RH at 40°C, non-condensing (acc. to IEC 60068-2-78)CP3004-SA EXPANSION CAPABILITIESThe CP3004-SA provides various expansion capabilities via specifically designed modules such as the SATA Flash Module, the Smart Extension Module, the CP3004-HDD module and the CP3004-XMC module. The 4HP CP3004-SA can accommodate two modules, the SATA Flash Module and the Smart Extension module. The SATA Flash Module is available with up to 32 GB SLC NAND fl ash memory and can be used as storage device for onboard data or operating system data. The SATA Flash Module is specifi cally designed and optimized for embedded systems providing high performance, reliability and security. The Smart Extension Module expands the onboard I/O capability and provides one additional SATA cable connector plus one USB 2.0 connector thereby facilitating the connection to system-internal USB and SATA devices. Furthermore, two extension modules are available to expand the CP3004-SA to a doubleslot 8H P version, the CP3004-H DD module and the CP3004-XMC module.If more interfaces to the front are needed, the CP3004-HDD is the right choice. This module provides one USB 3.0 port, one Gigabit Ethernet interface, two DiplayPorts, and one COM interface on the front panel. In addition, the CP3004-HDD module provides support for a 2.5” SATA HDD/SSD and a CFast card. As a further extension capability of the CP3004-SA to 12H P, a SATA adapter module is available with the CP3004-H DD to provide an additional SATA connector for 2.5” SATA H DD/SSD devices. The 12 H P CP3004-SA does not provide a CFast socket. The CP3004-XMC module provides one x8 (or less) PCI Express 2.0-compliant interface with up to 5 GT/s for one XMC module. In addition, the CP3004-XMC module is capable of accommodating a CFast card.// 4 // 5 TECHNICAL INFORMATIONTECHNICAL INFORMATION②②SATA FLASH MODULE SMART EXTENSION MODULE MEMORYCAPACITYNAND FLASH MEMORY BANDWITHUp to 32 GB SLC-based NAND Flash memory 32nm Toshiba Single Level Cell Components Up to 60 MB/s read rate Up to 55 MB/s write rateGENERALDIMENSIONS WEIGHT MTBFPOWER CONSUMPTION 38 x 27mm Ca. 7 grams3,848,557 h acc. to MIL-HDBK-217 FN2, Ground Benign, controlled at 30°C Typ. 0.5W, 3.3V supplyENVIRONMENTALOPERATING TEMPERATURE STORAGE TEMPERTURE CLIMATIC HUMIDITY0°C to +60°C, standard-40°C to +85°C, extended temperature -40°C to +85ºC93% RH at 40°C, non-condensing (acc. to IEC 60068-2-78)ONBOARD INTERFACES SATA USBOne onboard angled standard SATA connector One onboard angled standard USB 2.0 connectorGENERALDIMENSIONS WEIGHT MTBF34 x 49 mm Ca. 11 grams6,534,579 h acc. to MIL-HDBK-217 FN2, Ground Benign, controlled at 30°C ENVIRONMENTALOPERATING TEMPERATURE STORAGE TEMPERTURE CLIMATIC HUMIDITY0°C to +60°C, standard-40°C to +85°C, extended temperature -40°C to +85ºC93% RH at 40°C, non-condensing (acc. to IEC 60068-2-78)// CP3004-SA WITH SATA FLASH MODULE // CP3004-SA WITH SMART EXTENSION MODULETECHNICAL INFORMATIONFRONT INTERFACES (8HP)DISPLAYPORTETHERNETUSBSERIAL PORTCONTROL 2x 20-pin DisplayPort connectors, DVI/HDMI capable through passive cable adapter1x RJ-45 with integrated LEDs (ACT, SPEED)1x USB 3.0 port, 9-pin type-A connector1x 16C550-compatible serial port, RS232 signalling, RJ-45Reset button and HDD activiy LEDONBOARD INTERFACES SATACFAST 1x SATA connector for connecting a SATA 2.5” HDD/SSD (SATA 6Gb/s), Option to add 2nd SATA HDD/SSD (results in 12HP stacking height and CFast socket won’t be available)1x CFast card socketGENERAL WEIGHTMTBFPOWER CONSUMPTION CP3004-SA 8HP: 460 g, CP3004-SA 12HP: 520 g1,120,458 h acc. to MIL-HDBK-217 FN2, Ground Benign, controlled at 30°C typ. 0.5W, without peripheral devices connectedENVIRONMENTAL OPERATING TEMPERATURESTORAGE TEMPERTURECLIMATIC HUMIDITY 0°C to +60°C, standard-40°C to +85°C, extended temperature-40°C to +85ºC (without additional components)93% RH at 40°C, non-condensing (acc. to IEC 60068-2-78) // CP3004-SA 12HP// 6 TECHNICAL INFORMATIONFRONT INTERFACES (8HP)XMCCONTROL XMC front panel bezel cutout Reset button and CFast activity LEDONBOARD INTERFACES XMCCFAST 1x onboard XMC connector (P15),1x x8 PCI Express 2.0-compliant interface with up to 5 GT/s 1x CFast card socketGENERAL WEIGHTMTBFPOWER CONSUMPTION CP3004-SA 8HP: 430 g2,017,352 h acc. to MIL-HDBK-217 FN2, Ground Benign, controlled at 30°C Depends on XMC module, typ. 0W without XMCENVIRONMENTAL OPERATING TEMPERATURESTORAGE TEMPERTURECLIMATIC HUMIDITY 0°C to +60°C, standard-40°C to +85°C, extended temperature-40°C to +85ºC (without additional components)93% RH at 40°C, non-condensing (acc. to IEC 60068-2-78)// 7 // 8 EUROPE, MIDDLE EAST & AFRICALise-Meitner-Str. 3-586156 Augsburg GermanyTel.: + 49 821 4086 0Fax: + 49 821 4086 111info@CORPORATE OFFICESNORTH AMERICA 14118 Stowe DrivePoway, CA 92064-7147USATel.: + 1 888 294 4558Fax: + 1 858 677 0898info@ ②ASIA PACIFIC1~2F, 10 Building, No. 8 Liangshuihe 2nd Street, Economical & Technological Development Zone, Beijing, 100176, P.R.China Tel.: +86 10 63751188Fax: +86 10 83682438info@C o p y r i g h t © 2015 K o n t r o n A G . A l l r i g h t s r e s e r v e d . A l l d a t a i s f o r i n f o r m a t i o n p u r p o s e s o n l y a n d n o t g u a r a n t e e d f o r l e g a l p u r p o s e s . I n f o r m a t i o n h a s b e e n c a r e f u l l y c h e c k e d a n d i s b e l i e v e d t o b e a c c u r a t e ;h o w e v e r , n o r e s p o n s i b i l i t y i s a s s u m e d f o r i n a c c u r a c i e s . K o n t r o n a n d t h e K o n t r o n l o g o a n d a l l o t h e r t r a d e m a r k s o r r e g i s t e r e d t r a d e m a r k s a r e t h e p r o p e r t y o f t h e i r r e s p e c t i v e o w n e r s a n d a r e r e c o g n i z e d .S p e c i fi c a t i o n s a r e s u b j e c t t o c h a n g e w i t h o u t n o t i c e . C P 3004-S A -20150924 - W M HORDERING INFORMATION②ARTICLEDESCRIPTIONCP3003-SAPREFERRED CONFIGURATIONS CP3004-SA-1.8D-8-4F-T CP3004-SA Dual Core i3, 8GB, 4HP, Front IO, TPM CP3004-SA-1.8D-8-4R-T CP3004-SA Dual Core i3, 8GB, 4HP, Rear IO, TPM CP3004-SA-2.9D-8-4F-T CP3004-SA Dual Core i5, 8GB, 4HP, Front IO, TPMCP3004-SA-2.9D-8-8R-T CP3004-SA Dual Core i5, 8GB, 8HP, Rear IO, HDD Mezzanine, TPM CP3004-SA-2.6Q-16-4F-T CP3004-SA Quad Core i7, 16GB, 4HP, Front IO, TPM CP3004-SA-2.6Q-16-4R-TCP3004-SA Quad Core i7, 16GB, 4HP, Rear IO, TPMPlease contact your local sales representative for other confi guration options:CPU variant, RAM size, rear I/O support, HDD I/O mezzanine option, XMC mezzanine option,extended temperature option, conformal coating option)FLASH STORAGE(as separate items, not mounted on the CPU)FLASH-SATA-XGB-CP300X SATA NAND Flash module, various sizes available CFASTxIndustrial grade CFast, various sizes availableREAR TRANSITION MODULES CP-RIO3-044HP rear I/O module (2x Ethernet, 2x USB, VGA, 2x SATA connectors) CP-RIO3-048HP rear I/O module (in addition to 4HP: COM1/2)CP-RIO3-04S 4HP rear I/O module (2x Ethernet, COM, VGA, 2x SATA connectors)SOFTWAREVXW-BSP-CP3004-SA-V6.9.x VxWorks 6.9.x Board Support PackageLINUX BSPAvailable as download on the webpage WINDOWS PACKAGES Available as download on the webpageNOTESThe SATA NAND Flash module cannot be used in conjunction with the CP3004-HDD/CP3004-XMC module。
MCP41010中文 数字电位器
0
LSB 编码 FFh, VDD = 3V,请参见图 2-25
+2
LSB 编码 00h, VDD = 5V,请参见图 2-25
+2
LSB 编码 00h, VDD = 3V,请参见图 2-25
电压范围
VA,B,W
0
电容 (CA 或 CB) 电容
-
CW
-
动态特性 (测试所有动态特性时 VDD = 5V)
带宽 -3dB
BW
-
稳定时间
tS
-
-
VDD
注4
15
-
pF f = 1 MHz,编码 80h,请参见图 2-30
5.6
-
pF f = 1 MHz,编码 80h,请参见图 2-30
1
-
MHz VB = 0V,在编码为 80h,输出负载 = 30 PF 时测得
2
-
µS VA = VDD, VB = 0V,误差范围为 ±1%,编码从 00h 过
施密特触发器高电平输入电压
VIH
0.7VDD
-
-
V
施密特触发器低电平输入电压
VIL
-
-
.3VDD
V
施密特触发器输入迟滞
VHYS
-
.05VDD
-
低输出电压
VOL
-
-
高输出电压
VOH
VDD - 0.5
-
输入泄漏电流
ILI
-1
-
引脚电容 (所有输入 / 输出)
CCIONU和T
-
10
电源要求
0.40 - +1 -
封装类型
PDIP/SOIC
MP4034隔离集成MOS低成本LED驱动IC
MP4034 ReO DO TE G NF RN AO I NO A X DE T L U INY NT DI S U IA ST E A L RI ON N BU L Y TE
At no load condition, VCC=20V 60kHz, VCC=20V VCC=0V16V, Drain float VCC=20V, VFB=7V VCC=4V, VDrain=100V VDS=500Vdc ID=10mA, Tj=20 degree 700 450 550 1 10 650 10 13 VFB=-0.5V 365 230 380 300 395 370 VFB=4V 80 -0.22 3.93 6.2 0.2 120 -0.15 4 6.35 3.5 150 120 0.5 160 -0.08 4.07 6.5
MP4034 – OFFLINE LED DRIVER
MPS CONFIDENTIAL AND PROPRIETARY INFORMATION - HUAGAOXINYUAN INTERNAL USE ONLY
ELECTRICAL CHARACTERISTICS
VCC = 15V, TA = 25°C, unless otherwise noted.
(4)
θJA
θJC
SOIC8-7A .............................. 76 ...... 45... °C/W
(3)
Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-toambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB.
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DS21295C_CN 第 2 页
2007 Microchip Technology Inc.
MCP3004/3008
电气规范 (续)
电气特性:除非另外指明,否则所有参数均适用于以下条件:VDD = 5V, VREF = 5V, TAMB = -40°C 至 +85°C , fSAMPLE = 200 ksps 且 fCLK = 18*fSAMPLE。典型值的适用条件:VDD = 5V 且 TAMB = 25°C 。 参数 模拟输入 单端模式下, CH0 或 CH1 通道的 输入电压范围 伪差分模式下, IN+ 的输入电压范 围 伪差分模式下, IN- 的输入电压范 围 泄漏电流 开关电阻 采样电容 数字输入 / 输出 数据编码格式 高电平输入电压 低电平输入电压 高电平输出电压 低电平输出电压 输入泄漏电流 输出泄漏电流 引脚电容 (所有输入 / 输出引脚) 时序参数 时钟频率 时钟高电平时间 时钟低电平时间 CS 下降至 CLK 出现第一个上升 沿的时间 CS 下降至 CLK 下降沿的时间 数据输入建立时间 数据输入保持时间 CLK 下降至输出数据有效的时间 CLK 下降至输出使能的时间 CS 上升至输出禁止的时间 CS 禁止时间 Dout 上升时间 Dout 下降时间 注 fCLK tHI tLO tSUCS tCSD tSU tHD tDO tEN tDIS tCSH tR tF - 125 125 100 - - - - - - 270 - - - - - - - - - - - - - - - 3.6 1.35 - - - 0 50 50 125 200 125 200 100 - 100 100 MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns 见测试电路图 1-2 (注 1) 见测试电路图 1-2 (注 1) VDD = 5V,见图 1-2 VDD = 2.7V,见图 1-2 VDD = 5V,见图 1-2 VDD = 2.7V,见图 1-2 见测试电路图 1-2 VDD = 5V (注 3) VDD = 2.7V (注 3) VIH VIL VOH VOL ILI ILO CIN, COUT 4.1 - -10 -10 - 0.7 VDD 标准二进制 - - - - - - - - .3 VDD - 0.4 10 10 10 V V V V µA µA pF IOH = -1 mA, VDD = 4.5V IOL = 1 mA, VDD = 4.5V VIN = VSS 或 VDD VOUT = VSS 或 VDD VDD = 5.0V (注 1) TAMB = 25°C, f = 1 MHz VSS INVSS-100 - - - - - - 0.001 1000 20 VREF VREF+INVSS+100 ±1 - - mV µA Ω pF 见图 4-1 见图 4-1 V 符号 最小值 典型值 最大值 单位 条件
功能框图
VREF CH0 CH1 CH7* 采样 和 保持 输入 通道 最大值 VDD VSS
应用
• • • • 传感器接口 过程控制 数据采集 电池供电系统
DAC 比较器 10 位 SAR
封装类型
PDIP、 SOIC 和 TSSOP
CH0 CH1 CH2 CH3 NC NC DGND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD VREF AGND CLK DOUT DIN CS/SHDN
说明
Microchip 的 MCP3004/3008 器件是具有片上采样和保 持电路的 10 位逐次逼近型模数(Analog-to-Digital ,A/ D) 转换器。 MCP3004 可被编程为提供 2 组伪差分输入 对或 4 个单端输入。而 MCP3008 则可提供 4 组伪差分 输入 对或 8 个单端输 入。差分非 线性 (differential Nonlinearity, DNL)和 积 分 非 线 性 (Integral Nonlinearity,INL)均被指定为 ±1 LSB。它使用与 SPI 协议兼容的简单串行接口与器件通信。器件的转换速率 最高为 200 ksps。 MCP3004/3008 器件具有较宽的工作 电压范围:2.7V 至 5.5V。低电流设计使器件能在典型 待机电流为 5 nA 或典型工作电流为 320 µA 的条件下工 作。 MCP3004 以 14 引脚 PDIP、 SOIC (150 mil) 和 TSSOP 封装形式提供,而 MCP3008 以 16 引脚 PDIP 和 SOIC 封装形式提供。
DS21295C_CN 第 3 页
MCP3004/3008
电气规范 (续)
电气特性:除非另外指明,否则所有参数均适用于以下条件:VDD = 5V, VREF = 5V, TAMB = -40°C 至 +85°C , fSAMPLE = 200 ksps 且 fCLK = 18*fSAMPLE。典型值的适用条件:VDD = 5V 且 TAMB = 25°C 。 参数 电源要求 工作电压 工作电流 VDD IDD 2.7 - - 425 225 5.5 550 V µA VDD = VREF = 5V, DOUT 空载 VDD = VREF = 2.7V, DOUT 空载 CS = VDD = 5.0V 符号 最小值 典型值 最大值 单位 条件
待机电流 温度范围 指定温度范围 工作温度范围 存储温度范围 封装热阻 热阻, 14L-PDIP 热阻, 14L-PDIP 热阻, 14L-PDIP 热阻, 14L-PDIP 热阻, 14L-PDIP 注
IDDS TA TA TA θJA θJA θJA θJA θJA
- -40 -40 -65 - - - - -
VDD = VREF = 5V VDD = VREF = 2.7V
1:此参数是周期性采样得到的,并未经过 100% 测试。 2:请参见 Vref 电平的线性性能曲线图。 3:因为采样电容终将释放电荷,因此低于 10 kHz 的有效时钟速率可能会影响线性性能,尤其是在温度升高的 情况下。更多信息,请参见第 6.2 节 “保持最小时钟速率” 。
* 注:如果器件工作条件超过上述 “绝对最大值”,可能会对 器件造成永久性损坏。上述值仅为运行条件极大值,我们不建 议器件在该条件下或该规范规定的范围以外运行。器件长时间 工作在最大值条件下,其可靠性会受到影响。
电气规范
电气特性:除非另外指明,否则所有参数均适用于以下条件:VDD = 5V, VREF = 5V, TAMB = -40°C 至 +85°C , fSAMPLE = 200 ksps 且 fCLK = 18*fSAMPLE。典型值的适用条件:VDD = 5V 且 TAMB = 25°C 。 参数 转换速率 转换时间 模拟输入采样时间 吞吐率 DC 精度 分辨率 积分非线性误差 差分非线性误差 失调误差 增益误差 动态性能 总谐波失真 信噪比和失真 (SINAD) 无失真动态范围 参考输入 电压范围 漏电流 注 0.25 - - 100 0.001 VDD 150 3 V µA µA 注 2 CS = VDD = 5V - - - -76 61 78 dB dB dB VIN = 0.1V 至 4.9V @ 1 kHz VIN = 0.1V 至 4.9V @ 1 kHz VIN = 0.1V 至 4.9V @ 1 kHz INL DNL - - - - 10 ±0.5 ±0.25 - - ±1 ±1 ±1.5 ±1.0 位 LSB LSB LSB LSB 温度变化时不丢失编码 tCONV tSAMPLE fSAMPLE - - - 1.5 - 200 75 10 时钟 周期 时钟 周期 ksps ksps 符号 最小值 典型值 最大值 单位 条件
TCSH CS TSUCS THI TLO
CLK TSU DIN THD
MSB 输入 TEN TDO 空位 MSB 输出 TR TF TDIS LSB
DOUT
图 1-1:
串行接口时序
DS21295C_CN 第 4 页
2007 Microchip Technology Inc.
0.005 - - - 70 108 100 70 90
2 +85 +85 +150 - - - - -
µA °C °C °C °C/W °C/W 是周期性采样得到的,并未经过 100% 测试。 2:请参见 Vref 电平的线性性能曲线图。 3:因为采样电容终将释放电荷,因此低于 10 kHz 的有效时钟速率可能会影响线性性能,尤其是在温度升高的 情况下。更多信息,请参见第 6.2 节 “保持最小时钟速率” 。
MCP3004/3008
带有SPI串行接口的2.7V, 4通道/8通道 10 位 A/D 转换器
特性
• • • • • • • • • • • • • • • 10 位分辨率 ±1 LSB DNL (最大值) ±1 LSB INL (最大值) 4 (MCP3004)或 8 路 (MCP3008)输入通道 模拟输入可编程为单端输入或伪差分输入对 片上采样和保持电路 SPI 串行接口 (模式 0,0 和模式 1,1) 单电源供电的电压范围: 2.7V 至 5.5V 在 VDD = 5V 时的最大采样速率为 200 ksps 在 VDD = 2.7V 时的最大采样速率为 75 ksps 低功耗 CMOS 技术 5 nA 典型待机电流,最大 2 µA。 5V 时,工作电流的最大值为 500µA 工业级温度范围: -40°C 至 +85°C 封装形式有:PDIP、 SOIC 和 TSSOP
2007 Microchip Technology Inc.
MCP3008
DS21295C_CN 第 1 页
MCP3004/3008
1.0 电气特性 引脚功能表
名称 VDD DGND AGND CH0 至 CH7 CLK DIN DOUT CS/SHDN VREF 数字地 模拟地 模拟输入 串行时钟 串行数据输入 串行数据输出 片选 / 关断输入 参考电压输入 功能 +2.7V 至 5.5V 电源