LLU2C122MHLB中文资料

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UL C 中文版

NOVEMBER 29, 2001(Title Page Reprinted: November 5, 2002)1UL 746CStandard for Polymeric Materials – Use in Electrical EquipmentEvaluationsThe first edition was titled Test for Polymeric Enclosures of Portable ElectricalAppliances and numbered UL 746.51.First Edition – June, 1973Second Edition – March, 1978Third Edition – May, 1989Fourth Edition – December, 1995Fifth EditionNovember 29, 2001The most recent approval of UL 746C as an American National Standard (ANSI) occurred on September 23, 2002 and covers the Fifth Edition, including revisions through November 5, 2002. Approval of UL 746C as an American National Standard is maintained using the continuous maintenance process. Comments or proposals for revision on any part of the Standard may be submitted to UL at any time. Written comments are to be sent to the UL-MEL Standards Department, 1285 Walt Whitman Road, Melville, NY 11747.An effective date included as a note immediately following certain requirementsis one established by Underwriters Laboratories Inc.The Department of Defense (DoD) has adopted UL 746C on November 3, 1988. The publication of revised pages or a new edition of this Standard will not invalidate the DoD adoption.Revisions of this Standard will be made by issuing revised or additional pages bearing their date of issue. A UL Standard is current only if it incorporates the most recently adopted revisions, all of which are itemized on the transmittal notice that accompanies the latest set of revised requirements.ISBN 0-7629-0721-5COPYRIGHT © 1973, 2002 UNDERWRITERS LABORATORIES INC.ANSI/UL 746C-2002目录项目内容页码前言简介1 范围62 概述63 术语8外壳4 概述115 便携式無人看管家用電器 126 （刪除）7 （刪除）电气绝缘要求8 材料性能要求139 内垫板21性能要求10 概述22电性能11 概述2212 绝缘强度2213 大电流电弧引燃（HAI） 2314 灼热电阻丝引燃（HWI）-异常过载测试或整机电热棒测试 2315 斜面漏电起痕电压2316 体积电阻率23阻燃性17 阻燃性 - 12mm火焰 2518 阻燃性 - 20mm火焰 2519 阻燃性 -127mm（5”）火焰 2520 塑壳阻燃性 - 746 -5VS 2521 塑壳阻燃性- 大面积要求 2522 防火涂层26项目内容页码机械性能23 压缩强度2724 冲击强度27塑件的尺寸变化25 蠕变27性能26 性能2827 紫外光照射2828 浸水29特殊使用要求29 异常工作3030 恶劣条件30热性能31 成形应力松驰变形3032 马达输入3033 成形应力松驰变形后电源线拉力测试 3134 温度要求-总则3135 功能使用温度指数3136 普通热指数3237 相对热指数3538 相对热性能3539 相对热性能（第二方案） 3640 短时温度高于最高使用温度 38特殊应用41 概述 - 胶粘剂3942 功能分析3943 分析程序3944 线圈架4045 绝缘保护涂层40金属化零件46 概述4047 塑性镀层4148 脆性镀层41项目内容页码性能测试49 概述4150 整机耐电弧测试4251 异常过载测试4252 阻燃性 - 12mm火焰测试 4453 阻燃性 - 3/4”火焰测试 4554 阻燃性 -127mm（5”）火焰测试 4655 塑壳阻燃性 - 746 -5VS 测试 4656 防火涂层测试4857 压缩强度测试4958 冲击强度测试5059 紫外光照射测试5360 浸水测试5861 异常工作测试5862 恶劣条件测试5863 成形应力松驰变形测试 5964 整机球压测试5965 马达输入测试5966 相对热性能5967 相对热性能（第二方案） 6068 短时温度高于最高使用温度 6069 温度要求 - 举例说明 6270 温度要求 - 举例说明（第二方案） 6371 胶粘剂 - 特殊应用64线圈架72 绝缘保护涂层测试6873 胶带测试7274 漏电流测试7475 整机电热棒测试75标识76 概述77A.本标准包含“范围”所述产品的基本要求。

MPC-2121系列12英寸面板计算机操作指南说明书

P/N: 1802021210011 *1802021210011*MPC-2121 SeriesQuick Installation GuideVersion 1.1, January 2021Technical Support Contact Information/support2021 Moxa Inc. All rights reserved.OverviewThe MPC-2121 12-inch panel computers with E3800 Series processors deliver a reliable and durable platform of wide versatility for use in industrial environments. All interfaces come with IP66-rated M12 connectors to provide anti-vibration and waterproof connections. With a software selectable RS-232/422/485 serial port and two Ethernet ports, the MPC-2121 panel computers support a wide variety of serial interfaces as well as high-speed IT communications, all with native network redundancy.Package ChecklistBefore installing the MPC-2121, verify that the package contains the following items:• 1 MPC-2121 panel computer• 1 2-pin terminal block for DC power input• 6 panel mounting screws• 1 M12 phone jack power cable• 1 M12 Type A USB cable•Quick installation guide (printed)•Warranty cardNOTE: Please notify your sales representative if any of the above items are missing or damaged.Hardware InstallationFront ViewLeft Side ViewBottom ViewRight Side ViewAmbient Light SensorThe MPC-2121 comes with an ambient light sensor located on the upper part of the front panel.The ambient light sensor helps automatically adjust the brightness of the panel with the ambient light condition. This function is disabled by default and has to be enabled before it can be used. For details, refer to the MPC-2121 Hardware User’s Manual.The MPC-2121 can also be mounted using the front panel. Use the four screws on the front panel to attach the front panel of the computer to a wall. Refer to the following figures for the location of the screws.Refer to the figure on the right for thespecifications of the mounting screws.A panel-mounting kit consisting of 6 mounting units is provided in the MPC-2121 package. Refer to the following illustrations for the dimensions and the cabinet space required to panel mount the MPC-2121.To install the panel-mounting kit on the MPC-2121, follow these steps: 1.Place the mounting units in the holes provided on the rear panel andpush the units to the left as shown in the illustration below:2. Use a torque of 4Kgf-cm to fasten the mounting screws and securethe panel-mounting kit units onto a wall.Display-control ButtonsThe MPC-2121 is provided with two display-control buttons on the right panel.The display-control buttons can be used as described in the following table:Symbol and NameUsageFunctionPower Press• Power on• Enter Sleep or Hibernation mode•Wake upNOTE: You can change the function ofthe Power button in the OS settings menu.Press andhold for 4 secondsPower offBrightness + Press Manually increase the brightness of the panelBrightness -PressManually decrease the brightness of the panelConnector DescriptionDC Power InputThe MPC-2121 can be supplied power through a DC power input using an M12 connector. The DC pin assignments are as shown in the following figure:Pin Definition 1 V+ 2 – 3 V- 4 – 5 –Serial PortsThe MPC-2121 offers one software-selectable RS-232/422/485 serial portwith an M12 connector. The pin assignments for the ports are shown in the table below:Pin RS-232 RS-422RS-4851 RI – –2 RXD TX+ –3 DTR RX-D- 4 DSR – – 5 CTS – – 6 DCD TX- – 7 TXD RX+ D+ 8 RTS – – 9 GND GND GND 10 GND GND GND 11 GND GND GND 12–––Ethernet PortsThe pin assignments for the two Ethernet 10/100 Mbps ports with M12 connectors are shown in the following table:Pin Definition1 TD+2 RD+3 TD- 4RD-USB PortsA USB 2.0 port with an M12 connector is available on the rear panel. Use this port to connect a mass-storage drive or other peripheral.Pin Definition1 D-2 VCC3 –4 D+ 5GNDAudio PortThe MPC-2121 comes with an audio output port with an M12 connector. Refer to the following figure for the pin definitions.Pin Definition 1 Detect 2 Line out _L 3 Line out _R4 GND5 Speaker out-6 Speaker out+7 GND 8GNDDIO PortThe MPC-2121 is provided with a DIO port, which is an 8-pin M12connector that includes 4 DIs and 2 DOs. For wiring instructions, refer to the following diagrams and the pin assignment table.PinDefinition1 COM2 DI_03 DI_14 DI_25 DI_36 DO_07 GND 8DO_1Installing a CFast Card or an SD CardMPC-2121 provides two storage options—CFast card and SD card. The storage slots are located on the left panel. You can install the OS in the CFast card and save your data in the SD card. For a list of compatible CFast models, check the MPC-2121 component compatibility report available on Moxa’s website.To install the storage devices, do the following:1.Remove the two screws on the storage-socket cover.The top slot is for the CFast card while the lower slot is for the SD card, as indicated by the following illustration:2.Insert a CFast or SD card into the respective slot using the push-pushmechanism.CFast CardSD Card3. Reattach the cover and secure it with screws.Real-time ClockThe real-time clock (RTC) is powered by a lithium battery. We strongly recommend that you do not replace the lithium battery without help from a qualified Moxa support engineer. If you need to change the battery, contact the Moxa RMA service team. The contact details are available at: https:///en/support/repair-and-warranty/product-repair -service.Grounding the MPC-2121Proper grounding and wire routing help to limit the effects of noise from electromagnetic interference (EMI). Run the ground connection from the ground screw to the grounding surface prior to connecting the power source.Powering On/Off the MPC-2121Connect an M12 Connector to Power Jack Converter to theMPC-2121’s M12 connector and connect a 40 W power adapter to the converter. Supply power through the power adapter. After you have connected a power source, the system power turns on automatically. It takes about 10 to 30 seconds for the system to boot up. You can change the power-on behavior of your computer by changing the BIOS settings. To power off the MPC-2121, we recommend using the "shut down" function provided by the OS installed on the MPC. If you use the Power button, you may enter one of the following states depending on the power management settings in the OS: standby, hibernation, or system shutdown mode. If you encounter problems, you can press and hold the Power button for 4 seconds to force a hard shutdown of the system.- 11 -。

HLC_中文操作手册

ELECTRONIC ASSEMBLY & TEST SYSTEMS DIVISION SALES & MARKETING DEPT. 8-2-1, KOKURYO-CHO, CHOFU-SHI, TOKYO 182-8655, JAPAN PHONE: 81-3-3480-3371 FAX: 81-3-3488-1971
i
HLC 操作手册目录
Rev00
3-15 退出编辑程序 ...................................................... 3-38
第4章贴片模拟·················································································································4-1
4-1 启动贴片模拟··········································································································· 4-1 4-2 打开文件·················································································································· 4-2 4-3 测量生产时间··········································································································· 4-3 4-4 过程窗口·················································································································· 4-4 4-5 显示切换·················································································································· 4-5 4-6 选项 ························································································································· 4-6 4-7 保存文件·················································································································· 4-7 4-8 退出贴片模拟··········································································································· 4-7

PVII-12中文手册(版本号070502)

P/VⅡ-12交流金属封闭开关设备使用手册安全第一：在开关设备安装使用前请先仔细阅读本使用手册：●开关设备的使用场所应符合电气设备规定的使用条件的要求。

●安装、操作和维护均需由专职电气人员完成，该人员必须接受相应的培训。

●必须保证电气设备的联锁条件和工作规程的适用和安全性。

●有关开关设备的一切操作，都要遵守手册中的相关规定。

●不要超出开关设备正常工作条件下的技术参数中规定的数值。

●手册应放于安装、操作和维护人员方便拿到的地方。

用户的专职人员应对所有影响工作安全的事项负责，并正确管理开关设备。

严禁误用及滥用，包括盗版、篡改及断章取义并提供给第三方。

对所有其它渠道获取的咨讯，本公司概不负责。

目录产品概述概述符合标准技术参数外型尺寸和重量正常使用条件产品结构结构特点外壳与隔板手车功能隔室手车室母线室电缆室低压室防误闭锁装置压力释放装置储运与安装运输交货与保管安装安装现场的一般要求基础混凝土地坪上的基础框架柜体安装母线安装电缆连接电力电缆连接控制电缆连接开关装置接地其它事项运行与维护设备运行准备工作起动调试操作断路器手车断路器接地开关负荷开关组合式过电流继电器调试注意事项检查和维护概述检查和维护时间间隔检查维护主要附件VB2真空断路器手车典型接线图1 1 1 1 1 1 2 2 2 2 3 3 3 4 4 4 4 5 5 5 5 5 6 6 7 7 7 7 7 7 7 8 8 8 8 8 8 9 9 10 10 10 10 10 11 11 11 12概述P/VⅡ-12型铠装移开式户内交流金属封闭开关设备是上海通用电气广电有限公司最新一代的户内成套配电装置。

设备适用于标称系统电压3~10kV，额定电流4000A及以下，额定频率50Hz的单母线或单母线分段三相交流户内配电系统，用于接收和分配电能，并对电路实行控制、保护及监测。

BCR12PM-12LG中文资料

BCR12PM-12LGTriacMedium Power UseREJ03G1510-0100Rev.1.00Feb 14, 2007 Features• I T (RMS) : 12 A• V DRM : 600 V• I FGTI, I RGTI, I RGT III : 30 mA • V iso : 2000V • The Product guaranteed maximum junction temperature 150°C• Insulated Type• Planar Type• UL Recognized : Yellow Card No. E223904File No.E80271OutlineApplicationsSwitching mode power supply, light dimmer, electronic switch, hair dryer, Television, Stereo system, refrigerator,Washing machine, infrared kotatsu, and carper, small motor controller, SS relay, solenoid driver, copying machine,electric tool, electric heater control, and other general purpose control applicationsVoltage classParameter Symbol12UnitRepetitive peak off-state voltage Note1V DRM 600 V Non-repetitive peak off-state voltage Note1V DSM 720 VParameter Symbol Ratings Unit ConditionsRMS on-state current I T (RMS) 12 A Commercial frequency, sine full wave360°conduction, Tc = 92°CSurge on-state current I TSM 120 A 60Hz sinewave 1 full cycle, peak value,non-repetitiveI 2t for fusion I 2t 60 A 2s Value corresponding to 1 cycle of halfwave 60Hz, surge on-state currentPeak gate power dissipation P GM 5 W Average gate power dissipation P G (AV) 0.5 W Peak gate voltage V GM 10 V Peak gate current I GM 2 A Junction Temperature Tj –40 to +150 °C Storage temperature Tstg –40 to +150 °C Mass — 2.0 g Typical value Isolation voltage V iso 2000 V Ta = 25°C, AC 1 minute,T 1 • T 2 • G terminal to caseNotes: 1. Gate open.Electrical CharacteristicsParameter Symbol Min. Typ. Max. Unit Test conditions Repetitive peak off-state current I DRM — — 2.0 mA Tj = 150°C, V DRM applied On-state voltage V TM — — 1.6 V Tc = 25°C, I TM = 20 A,instantaneous measurementΙV FGT Ι — — 1.5V ΙΙ V RGT Ι — — 1.5 V Gate trigger voltage Note2ΙΙΙ V RGT ΙΙΙ — — 1.5 VTj = 25°C, V D = 6 V, R L = 6 Ω,R G = 330 Ω Ι I FGT Ι — — 30 mA ΙΙ I RGT Ι — — 30 mAGate trigger curent Note2ΙΙΙI RGT ΙΙΙ — — 30 mATj = 25°C, V D = 6 V, R L = 6 Ω, R G = 330 Ω Gate non-trigger voltageV GD 0.2/0.1 — — V Tj = 125°C/150°C, V D = 1/2 V DRM Thermal resistanceR th (j-c) — — 4.0 °C/W Junction to case Note3 Critical-rate of rise of off-statecommutation voltageNote4(dv/dt)c 10/1 —— V/µs Tj = 125°C/150°CNotes: 2. Measurement using the gate trigger characteristics measurement circuit.3. The contact thermal resistance R th (j-c) in case of greasing is 0.5°C/W.4. Test conditions of the critical-rate of rise of off-state commutation voltage is shown in the table below.Performance CurvesPackage DimensionsOrder CodeLead form Standard packing Quantity Standard order code Standard order code exampleStraight type Vinyl sack 100Type name BCR12PM-12LG Lead form Plastic Magazine (Tube) 50Type name – Lead forming code BCR12PM-12LG-A8 Note : Please confirm the specification about the shipping in detail.Refer to "/en/network " for the latest and detailed information.Renesas Technology America, Inc.450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501Renesas Technology Europe LimitedDukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900Renesas Technology (Shanghai) Co., Ltd.Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898Renesas Technology Hong Kong Ltd.7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071Renesas Technology Taiwan Co., Ltd.10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999Renesas Technology Singapore Pte. Ltd.1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001Renesas Technology Korea Co., Ltd.Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145Renesas Technology Malaysia Sdn. BhdUnit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510RENESAS SALES OFFICES。

B1212RU中文资料

232 Tosca Drive Stoughton, MA 02072 USA T: (781) 344-8226 F: (781) 344-8481 E: sales@ W:
Physical
Case Size Case Material Weight 2.0 x 1.0 x 0.40 Inches (50.8 x 25.4 x 10.2 mm) Metal with Non-Conductive Base (UL94-V0) 1.13 Oz (32g) Conditions MIL HDBK 217F, 25°C, Gnd Benign Min. Typ. Max. Units 700 kHours UL 1950, EN 60950, IEC 60950 UL, cUL; File No. E245422 Min. -0.7 -0.7 Typ. Max. 42.0 84.0 260.0 5,000 Units VDC °C mW
Parameter Input Start Voltage Input Filter Reverse Polarity Input Current Short Circuit Input Power
Conditions Min. Typ. Max. 24 VDC Input 8.0 8.5 9.0 48 VDC Input 14.0 16.0 18.0 (Pi) Filter (Complies with EN55022 Class “A”) 1.0 3,500 Conditions Dual Output , Balanced Loads Vin = Min to Max Iout = 10% to 100% Over Line, Load & Temp. 120 25% Load Step Change Continuous Conditions 60 Seconds Flash Tested For 1 Sec 500 VDC 100 kHz, 1V Min. 1,500 1,650 1,000 350 Conditions Typ. Max. 150 ±1.5 ±0.01 250 ±2.5 ±0.02 Min. Typ. ±0.5 ±0.5 ±0.1 ±0.2 50 Max. ±1.0 ±1.0 ±0.5 ±0.5 75 100 15

2MBI200U4B-120中文资料

o
Contact Thermal resistance Rth(c-f) with Thermal Compound 0.025 (1 device) (*4) (*4) This is the value which is defined mounting on the additional cooling fin with thermal compound.
(Aug.-2001 edition)
Mechanical Tests
Test Method 401 MethodⅠ Test Method 402 methodⅡ Test Method 403 Reference 1 Condition code B
3 Vibration
4 Shock
1 High Temperature Storage 2 Low Temperature Storage 3 Temperature Humidity Storage 4 Unsaturated Pressurized Vapor
C/W
6. Indication on module Logo of production
2MBI200U4B-120
200A 1200V
Lot.No. 7. Applicable category
Place of manufacturing (code)
This specification is applied to IGBT-Module named 2MBI200U4B-120.
MS5F6032
5 13
H04-004-03a
元器件交易网
11. Reliability test results
Reliability Test Items

HLMP-CB12中文资料

Agilent HLMP-CxxxT-13/4 (5mm) Extra Bright Precision Optical Performance InGaN LED Lamps Data SheetDescriptionThese high intensity blue and green LEDs are based on the most efficient and cost effective InGaN material technology. The 470 nm typical dominant wave–length for blue and 525 nm typical wavelength for green is well suited to color mixing in full color signs. The 505 nm typical dominant wavelength for cyan is suitable for traffic signal application.These LED lamps are untinted, non-diffused, T-13/4 packagesFeatures•Well defined spatial radiationpattern•High luminous output•Available in blue, green, and cyancolor•Viewing angle: 15°, 23°and 30°•Standoff or non-standoff leads•Superior resistance to moistureApplications•Traffic signals•Commercial outdoor advertising•Front panel backlighting•Front panel indicator incorporating second generationoptics which produce well-definedspatial radiation patterns atspecific viewing cone angles.These lamps are made with anadvanced optical grade epoxy,offering superior temperatureand moisture resistance inoutdoor signal and signapplications. The high maximumLED junction temperature limitof +110°C enables hightemperature operation in brightsunlight conditions.HLMP-CB11, HLMP-CB12, HLMP-CM11, HLMP-CM12, HLMP-CE11,HLMP-CE12, HLMP-CB26, HLMP-CB27, HLMP-CM26, HLMP-CM27,HLMP-CE26, HLMP-CE27, HLMP-CB36, HLMP-CB37, HLMP-CM36,HLMP-CM37, HLMP-CE36, HLMP-CE37CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.Package DimensionsPackage APackage B5.80 ± 0.20(0.228 ±∅ CATHODEFLATMIN.SQ. TYP.NOTES:1. MEASURED JUST ABOVE FLANGE.2. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).3. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.4. IF HEAT SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.Device Selection GuideTypicalViewing Angle,Intensity (cd) at 20 mA PackagePart Number Color2q1/2 (Degree)Min.Max.Standoff Dimension Lens HLMP-CB11-TW0xx Blue15 2.57.2No A Clear HLMP-CB11-UVAxx Blue15 3.2 5.5No A Clear HLMP-CB12-TW0xx Blue15 2.57.2Yes B Clear HLMP-CM11-Y20xx Green159.327.0No A Clear HLMP-CM11-Z1Cxx Green1512.021.0No A Clear HLMP-CM12-Y20xx Green159.327.0Yes B Clear HLMP-CE11-X10xx Cyan157.221.0No A Clear HLMP-CE12-X10xx Cyan157.221.0Yes B Clear HLMP-CB26-SV0xx Blue23 1.9 5.5No A Clear HLMP-CB26-TUDxx Blue23 2.5 4.2No A Clear HLMP-CB27-SV0xx Blue23 1.9 5.5Yes B Clear HLMP-CM26-X10xx Green237.221.0No A Clear HLMP-CM26-YZCxx Green239.316.0No A Clear HLMP-CM27-X10xx Green237.221.0Yes B Clear HLMP-CE26-WZ0xx Cyan23 5.516.0No A Clear HLMP-CE27-WZ0xx Cyan23 5.516.0Yes B Clear HLMP-CB36-QT0xx Blue30 1.15 3.2No A Clear HLMP-CB36-RSAxx Blue30 1.5 2.5No A Clear HLMP-CB37-RU0xx Blue30 1.5 4.2Yes B Clear HLMP-CB37-RSDxx Blue30 1.5 2.5Yes B Clear HLMP-CM36-X10xx Green307.221.0No A Clear HLMP-CM36-XYCxx Green307.212.0No A Clear HLMP-CM37-X10xx Green307.221.0Yes B Clear HLMP-CM37-XYCxx Green307.212.0Yes B Clear HLMP-CM37-XYDxx Green307.212.0Yes B Clear HLMP-CE36-WZ0xx Cyan30 5.516.0No A Clear HLMP-CE37-WZ0xx Cyan30 5.516.0Yes B ClearNotes:1.Tolerance for luminous intensity measurement is ±15%.2.The luminous intensity is measured on the mechanical axis of the lamp package.3.The optical axis is closely aligned with the package mechanical axis.4.LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without propersafety equipment.5. 2q1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.Part Numbering SystemHLMP-x x xx-x x x xxMechanical Options00: BulkDD: Ammo PackColor Bin Options0: Full Color Bin DistributionA: Color Bin 1 and 2C: Color Bin 3 and 4D: Color Bin 4 and 5Maximum Intensity Bin0: No Maximum Intensity Bin LimitationOthers: Refer to Device Selection GuideMinimum Intensity BinRefer to Device Selection GuideViewing Intensity Bin11: 15° Without Standoff12: 15°With Standoff26: 23°Without Standoff27: 23°With Standoff36: 30°Without standoff37: 30°With StandoffColorB: Blue 470 nmM: Green 525 nmE: Cyan 505 nmPackageC: T-13/4 (5 mm) Round LampAbsolute Maximum Rating at T A = 25°CParameters Value UnitDC Forward Current [1]30mAPeak Pulsed Forward Current[3]100mAAverage Forward Current30mAPower Dissipation120mWLED Junction Temperature110°COperating Temperature Range–40 to +85°CStorage Temperature Range–40 to +100°CWave Soldering Temperature[2]250 for 3 secs°CNotes:1.Derate linearly as shown in Figure2.2.1.59 mm (0.060 inch) below body.3.Duty factor 10%, frequency 1 KHz.Electrical/Optical CharacteristicsT A = 25o CBlue Green CyanParameters Symbol Min.Typ.Max.Min.Typ.Max.Min.Typ.Max.Units Test Condition Forward Voltage V F 3.5 4.0 3.6 4.0 3.5 4.0V I F = 20 mA Reverse Voltage[1]V R 5.0 5.0 5.0V I R = 10 µA Thermal Resistance R q J-PIN240240240o C/W LED Junction toAnode Lead Dominant l d460470480520525540490505510nm I F = 20 mA Wavelength[2]Peak Wavelength l PEAK464516501nm Peak of Wavelengthof Spectral Distribu-tion at I F = 20 mA Spectral Half Width Dl1/2233230nm Wavelength Widthat Spectral Distribu-tion Power Pointat I F = 20 mA Luminous Efficacy[3]h v74484319lm/W Emitted LuminousPower/EmittedRadiant Power Notes:1.The reverse voltage of the product is equivalent to the forward voltage of the protective chip at I R = 10 µA.2.The dominant wavelength, l d, is derived from the Chromaticity Diagram and represents the color of the lamp.3.The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/h v, where Iv is the luminous intensity in candelas and h v is theluminous efficacy in lumens/watt.Figure 5. Relative intensity vs. DC forward current.Figure 4. Relative dominant wavelength vs. DC forward current.DC FORWARD CURRENT – mAR E L A T I V E D O M I N A N T W A V E L E N G T H (N O R M A L I Z E D A T 20 m A )1020301.0250.9901.0151.0201.0101.0051.0000.995GREENBLUER E L A T I V E I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )FORWARD CURRENT – mAFigure 1. Relative intensity vs. wavelength.Figure 3. Forward current vs. forward voltage.Figure 2. Forward current vs. ambient temperature.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.0000.800.600.400.20030103.0202.01.0F O R W A R D C U R R E N T – m AFORWARD VOLTAGE – V 4.0CYANGREENBLUEI F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VOLTSFigure 6. Spatial radiation pattern for Cx11 and Cx12.R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090Figure 7. Spatial radiation pattern for Cx26 and Cx27.Figure 8. Spatial radiation pattern for Cx36 and Cx37.R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090R E L A T I V E L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.5-90-600-30306090Intensity Bin Limit TableIntensity (mcd) at 20 mA Bin Min MaxN680880P8801150Q11501500R15001900S1*******T25003200U32004200V42005500W55007200X72009300Y930012000Z1200016000 11600021000 Tolerance for each bin limit is ±15%.Blue Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1460.0464.00.14400.02970.17660.09660.18180.09040.13740.0374 2464.0468.00.13740.03740.16990.10620.17660.09660.12910.0495 3468.0472.00.12910.04950.16160.12090.16990.10620.11870.0671 4472.0476.00.11870.06710.15170.14230.16160.12090.10630.0945 5476.0480.00.10630.09450.13970.17280.15170.14230.09130.1327 Tolerance for each bin limit is ±0.5 nm.Cyan Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1490.0495.00.04540.29450.11640.38890.13180.3060.02350.4127 2495.0500.00.03450.41270.10570.47690.11640.38890.00820.5384 3500.0505.00.00820.53840.10270.55840.10570.47690.00390.6548 4505.0510.00.00390.65480.10970.62510.10270.55840.01390.7502 7498.0503.00.01320.48820.10280.52730.10920.44170.00400.6104 8503.0508.00.00400.61040.10560.60070.10280.52730.00800.7153 Tolerance for each bin limit is ±0.5 nm.Green Color Bin TableBin Min Dom Max Dom Xmin Ymin Xmax Ymax 1520.0524.00.07430.83380.18560.65560.16500.65860.10600.8292 2524.0528.00.10600.82920.20680.64630.18560.65560.13870.8148 3528.0532.00.13870.81480.22730.63440.20680.64630.17020.7965 4532.0536.00.17020.79650.24690.62130.22730.63440.20030.7764 5536.0540.00.20030.77640.26590.60700.24690.62130.22960.7543 Tolerance for each bin limit is ±0.5 nm./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. December 7, 20045989-1022EN。

2MBI100N-120中文资料

• Absolute Maximum Ratings ( Tc=25°C)
Items
Symbols
Ratings Units
Collector-Emitter Voltage Gate -Emitter Voltage
VCES VGES
1200
V
± 20
V
Collector Current
Max. Power Dissipation Operating Temperature Storage Temperature
Items
Symbols
Zero Gate Voltage Collector Current
ICES
Gate-Emitter Leackage Current
IGES
Gate-Emitter Threshold Voltage
VGE(th)
Collector-Emitter Saturation Voltage
Continuous 1ms Continuous 1ms
IC IC PULSE -IC -IC PULSE PC Tj Tstg
100
200
A
100
200
780
W
+150
°C
-40 ∼ +125 °C
Isolation Voltage Screw Torque
A.C. 1min.
Vis
2500
V
Mounting *1
trr
Test Conditions VGE=0V VCE=1200V VCE=0V VGE=± 20V VGE=20V IC=100mA VGE=15V IC=100A VGE=0V VCE=10V f=1MHz VCC=600V IC=100A VGE=± 15V RG=9.1Ω IF=100A VGE=0V IF=100A

2MBI150UC-120中文资料

2MBI150UC-1201200V / 150A 2 in one-packageFeatures· High speed switching· Voltage drive· Low inductance module structureApplications· Inverter for Motor drive· AC and DC Servo drive amplifier· Uninterruptible power supply· Industrial machines, such as Welding machinesMaximum ratings and characteristicsAbsolute maximum ratings (at Tc=25°C unless otherwise specified)ItemZero gate voltage collector currentGate-Emitter leakage currentGate-Emitter threshold voltageCollector-Emitter saturation voltageInput capacitanceTurn-on timeTurn-off timeForward on voltageReverse recovery timeLead resistance, terminal-chip*3I CESI GESV GE(th)V CE(sat)(terminal)V CE(sat)(chip)C iest ont rt r(i)t offt fV F(terminal)V F(chip)t rrR lead–– 2.0––4004.5 6.58.5– 1.85 2.20– 2.10–– 1.75 2.10– 2.00––17––0.36 1.20–0.210.60–0.03––0.37 1.00–0.070.30– 1.70 2.00– 1.80–– 1.60 1.90– 1.70–––0.35–0.53–V GE=0V, V CE=1200VV CE=0V, V GE=±20VV CE=20V, I C=150mAV GE=15V, I C=150AV CE=10V, V GE=0V, f=1MHzV CC=600VI C=150AV GE=±15VR G= 4.7 ΩV GE=0VI F=150AI F=150AmAnAVVnFµsVµsmΩElectrical characteristics (at Tj=25°C unless otherwise specified)Thermal resistance characteristicsThermal resistanceContact Thermal resistance––0.16––0.24–0.025 –IGBTFWDWith thermal compound°C/W°C/W°C/W*1 : All terminals should be connected together when isolation test will be done.*2 : Recommendable value : Mounting 2.5 to 3.5N·m(M5 or M6), Terminal 3.5 to 4.5 N·m(M6)Symbols Conditions Characteristics UnitMin.Typ. Max.Rth(j-c)Rth(j-c)Rth(c-f)*4IGBT Module U-Series*4 : This is the value which is defined mounting on the additional cooling fin with thermal compound.Tj=25°CTj=125°CTj=25°CTj=125°CTj=25°CTj=125°CTj=25°CTj=125°C*3:Biggest internal terminal resistance among arm.Items Symbols Conditions Characteristics UnitMin.Typ. Max.Item SymbolCollector-Emitter voltage V CESGate-Emitter voltage V GESCollector current I CI C p-I C-I C pulseCollector Power Dissipation P CJunction temperature T jStorage temperature T stgIsolation voltage between terminal and copper base *1V isoScrew Torque Mounting *2Terminals *2Rating1200±20200150400300150300780+150-40 to +12525003.54.5UnitVVAW°CVACN·mConditionsContinuous1ms1 deviceAC:1min.Tc=25°CTc=80°CTc=25°CTc=80°CCharacteristics (Representative)Collector current vs. Collector-Emitter voltage (typ.)Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)Tj= 125°C / chipCapacitance vs. Collector-Emitter voltage (typ.)Dynamic Gate charge (typ.)Collector current vs. Collector-Emitter voltage (typ.)Tj= 25°C / chipCollector current vs. Collector-Emitter voltage (typ.)VGE=15V / chipTj=25°C / chipVGE=0V, f= 1MHz, Tj= 25°CVcc=600V, Ic=150A, Tj= 25°C010020030040012345C o l l e c t o r c u r r e n t : I c [A ]Collector-Emitter voltage : VCE [V]VGE=20V 15V 12V10V8V010020030040012345C o l l e c t o r c u r r e n t : I c [A ]Collector-Emitter voltage : VCE [V]VGE=20V 15V12V10V8V010020030040012345C o l l e c t o r c u r r e n t : I c [A ]Collector-Emitter voltage : VCE [V]Tj=125°CTj=25°C 0246810510152025C o l l e c t o r - E m i t t e r v o l t a g e : V C E [ V ]Gate - Emitter voltage : VGE [ V ]Ic=300A Ic=150A Ic=75A0.11.010.0100.0102030C a p a c i t a n c e : C i e s , C o e s , C r e s [ n F ]Collector-Emitter voltage : VCE [V]300600900C o l l e c t o r -E m i t t e r v o l t a g e : V C E [ 200V /d i v ]G a t e - E m i t t e r v o l t a g e : V G E [ 5V /d i v ]Gate charge : Qg [ nC ]Vcc=600V, Ic=150A, VGE=±15V, Tj= 125°CReverse bias safe operating area (max.)Switching loss vs. Gate resistance (typ.)+VGE=15V,-VGE <= 15V, RG >= 4.7Ω ,Tj <= 125°CSwitching time vs. Collector current (typ.)Vcc=600V, VGE=±15V, Rg=4.7Ω, Tj= 25°CVcc=600V, Ic=150A, VGE=±15V, Tj= 25°CSwitching time vs. Collector current (typ.)Vcc=600V, VGE=±15V, Rg=4.7Ω, Tj=125°CSwitching time vs. Gate resistance (typ.)Switching loss vs. Collector current (typ.)Vcc=600V, VGE=±15V, Rg=4.7Ω10100100010000100200300S w i t c h i n g t i m e : t o n , t r , t o f f , t f [ n s e c ]Collector current : Ic [ A ]10100100010000100200300S w i t c h i n g t i m e : t o n , t r , t o f f , t f [ n s e c ]Collector current : Ic [ A ]101001000100001.010.0100.0S w i t c h i n g t i m e : t o n , t r , t o f f , t f [ n s e c ]Gate resistance : Rg [ Ω ]trtftoffton 0510152025300100200300S w i t c h i n g l o s s : E o n , E o f f , E r r [ m J /p u l s e ]Collector current : Ic [ A ]Eon(125°C)Eon(25°C)Eoff(125°Err(125°C)Err(25°C)Eoff(25°C)0501001501.010.0100.0S w i t c h i n g l o s s : E o n , E o f f , E r r [ m J /p u l s e ]Gate resistance : Rg [ Ω ]EoffErrEon01002003004004008001200C o l l e c t o r c u r r e n t : I c [ A ]Collector - Emitter voltage : VCE [ V ]Outline Drawings, mm M234Transient thermal resistance (max.)Reverse recovery characteristics (typ.)Vcc=600V, VGE=±15V, Rg=4.7ΩForward current vs. Forward on voltage (typ.)chip01002003004001234F o r w a r d c u r r e n t : I F [ A ]Forward on voltage : VF [ V ]Tj=125°CTj=25°C101001000100200300R e v e r s e r e c o v e r y c u r r e n t : I r r [ A ]R e v e r s e r e c o v e r y t i m e : t r r [ n s e c ]Forward current : IF [ A ]trr (125°C)Irr (125°C)Irr (25°C)trr (25°C)0.0010.0100.1001.0000.0010.0100.100 1.000T h e r m a l r e s i s t a n s e : R t h (j -c ) [ °C /W ]Pulse width : Pw [ sec ]FWDIGBT。

ILQ2中文资料

FEATURES•Current Transfer Ratio at I F =10 mA ILD/Q1, 20% Min.ILD/Q2, 100% Min.ILD/Q5, 50% Min.•High Collector-Emitter Voltage ILD/Q1: BV CEO =50 VILD/Q2, ILD/Q5: BV CEO =70 V•Field-Effect Stable by TRansparent IOn Shield (TRIOS) Isolation Test Voltage, 5300 VAC RMS• Underwriters Lab File #E52744• VDE 0884 Available with Option 1Maximum Ratings (Each Channel)EmitterReverse Voltage ................................................6 V Forward Current ...........................................60 mA Surge Current................................................. 2.5 A Power Dissipation.......................................100 mW Derate Linearly from 25 ° C..................... 1.3 mW/ ° C DetectorCollector-Emitter Reverse VoltageILD/Q1........................................................... 50 V ILD/Q2, ILD/Q5...............................................70 V Collector Current.......................................... 50 mA Collector Current (t<1 ms)...........................400 mA Power Dissipation.......................................200 mW Derate Linearly from 25 ° C......................2.6 mW/ ° C PackageIsolation Test Voltage (between emitter and detector referred to standard climate 23 ° C/50%RH,DIN 50014)....................................5300 VAC RMS Creepage...............................................min. 7 mm Clearance...............................................min. 7 mm Isolation ResistanceV IO =500 V , T A =25 ° C .........................R IO =10 12 Ω V IO =500 V , T A =100 ° C .......................R IO =10 11 Ω Package Power Dissipation ...................... 250 mW Derate Linearly from 25 ° C..................... 3.3 mW/ ° C Storage Temperature................... –40 ° C to +150 ° C Operating Temperature................–40 ° C to +100 ° C Junction Temperature....................................100 ° C Soldering Temperature(2 mm from case bottom)..........................260 ° CV D E DESCRIPTIONThe ILD/Q1/2/5 are optically coupled isolated pairs employing GaAs infrared LEDs and silicon NPN phototransistor. Signal information, including a DC level, can be transmitted by the drive while maintaining a high degree of electrical isolation between input and output. The ILD/Q1/2/5 are especially designed for driving medium-speed logic and can be used to eliminate trou-blesome ground loop and noise problems. Also these couplers can be used to replace relays and transformers in many digital interface applica-tions such as CRT modulation. The ILD1/2/5 has two isolated channels in a single DIP package and the ILQ1/2/5 has four isolated channels per pack-age.See Appnote 45, “How to Use Optocoupler Normalized Curves.”Dimensions in inches (mm).268 (6.81).255 (6.48).790 (20.07).779 (19.77 ).045 (1.14).030 (.76).100 (2.54) Typ.3°–9°.305 Typ. (7.75) Typ..022 (.56).018 (.46).012 (.30).008 (.20).135 (3.43).115 (2.92)Pin One I.D.Pin One I.D..150 (3.81).130 (3.30).040 (1.02).030 (.76 ).268 (6.81).255 (6.48)3465.390 (9.91).379 (9.63).045 (1.14).030 (.76)4° Typ.4° Typ..100 (2.54) Typ.10° Typ.10° Typ.3°–9°.305 Typ.(7.75) Typ..022 (.56).018 (.46).012 (.30).008 (.20).135 (3.43).115 (2.92)1287.150 (3.81).130 (3.30).040 (1.02).030 (.76 )12348765Emitter Collector Collector EmitterAnode Cathode Cathode Anode 16151413121110 912345678Emitter Collector Collector Emitter Emitter Collector Collector EmitterAnode Cathode Cathode Anode Anode Cathode Cathode Anode Quad ChannelDual ChannelDUAL CHANNEL ILD1/2/5 QUAD CHANNEL ILQ1/2/5PHOTOTRANSISTOROPTOCOUPLER元器件交易网元器件交易网CharacteristicsSymbol Min.Typ.Max.Unit ConditionEmitterForward Voltage V F 1.25 1.65V I F=60 mAReverse Current I R0.0110µA V R=6 VCapacitance C025pF V R=0 V, f=1 MHzThermal Resistance, Junction to Lead R THJL750°C/WDetectorCapacitance C CE 6.8pF V CE=5 V, f=1 MHzLeakage Current, Collector-Emitter I CEO550nA V CE=10 VSaturation Voltage, Collector-Emitter V CESAT0.250.4I CE=1 mA, I B=20 µADC Forward Current Gain HFE2006501800V CE= 10 V, I B=20 µASaturated DC Forward Current Gain HFE SAT120400600V CE= 0.4 V, I B=20 µAThermal Resistance, Junction to Lead R THJL500°C/WPackage Transfer Characteristics (Each Channel)Symbol Min.Typ.Max.Unit Condition ILD/Q1Saturated Current Transfer Ratio (Collector-Emitter)CTR CESAT75%I F=10 mA, V CE=0.4 VCurrent Transfer Ratio (Collector-Emitter)CTR CE2090300%I F=10 mA, V CE=10 VILD/Q2Saturated Current Transfer Ratio (Collector-Emitter)CTR CESAT170%I F=10 mA, V CE=0.4 VCurrent Transfer Ratio (Collector-Emitter)CTR CE100200500%I F=10 mA, V CE=10 VILD/Q5Saturated Current Transfer Ratio (Collector-Emitter)CTR CESAT100%I F=10 mA, V CE=0.4 VCurrent Transfer Ratio (Collector-Emitter)CTR CE50130400%I F=10 mA, V CE =10 VIsolation and InsulationCommon Mode Rejection, Output High C MH5000V/µs V CM=50 V P-P, R L=1 kΩ, I F=0 mA Common Mode Rejection, Output Low C ML5000V/µs V CM=50 V P-P, R L=1 kΩ, I F=10 mA Common Mode Coupling Capacitance C CM0.01pFPackage Capacitance C IO0.8pF V IO=0 V, f=1 MHzTypical Switching TimesFigure 1. Non-saturated switching timingFigure 2. Non-saturated switching timingFigure 3. Saturated switching timingFigure 4. Saturated switching timingV O V CC =5 VR L =75 ΩF=10 KHz,DF=50%I F =10 mA I FV Ot Dt R50%PHL t PLHt St Ft V OV CC =5 V R L F=10 KHz,DF=50%I F =10 mAI FV Ot Dt RV TH =1.5 Vt PHLt PLHt St FFigure 5. Normalized non-saturated and saturated CTR at T A =25 ° C versus LED currentFigure 6. Normalized non-saturated and saturated CTR at T A =25 ° C versus LED currentCharacteristic ILD/Q1I F =20 mA ILD/Q2I F =5 mA ILD/Q5I F =10 mA Unit ConditionDelay, t D 0.8 1.7 1.7 µ s V CE =5 V R L =75 k Ω 50% of V PPRise time, t R 1.9 2.6 2.6 µ s Storage, t S 0.20.40.4 µ s Fall Time, t F1.42.2 2.2 µ s Propagation H-L, t PHL 0.7 1.2 1.1 µs Propagation L-H, t PLH1.42.32.5µsCharacteristicILD/Q1I F =20 mA ILD/Q2I F =5 mA ILD/Q5I F =10 mA Unit ConditionDelay, t D 0.81 1.7µs V CE =0.4 V R L =1 k ΩV CC =5 V V TH =1.5 VRise time, t R 1.227µs Storage, t S 7.4 5.4 4.6µs Fall Time, t F7.613.520µs Propagation H-L, t PHL 1.6 5.4 2.6µs Propagation L-H, t PLH8.67.47.2µs.11101000.70.80.91.01.11.21.31.4If - Forward Current - mAV f -F o r w a r d V o l t a g e - VTa = -55°CTa = 25°CTa = 100°C.11101000.00.51.01.5NCTR(SAT)NCTRIF - LED Current - mAC T R N F - N o r m a l i z e d C T R F a c t o rNormalized to:Vce = 10V, IF = 10mA Ta = 25°CCTRce(sat) Vce = 0.4V元器件交易网Figure 10. Collector-emitter current versus tempera-ture and LED currentFigure 11. Collector-emitter leakage current versus temperatureFigure 12. Propagation delay versus collector load resistor60504030201000510152025303550°C70°C85°CIF - LED Current - mAI c e - C o l l e c t o r C u r r e n t - m A25°C10080604020-2010-210-1100101102103104105Ta - Ambient Temperature - °CI c e o - C o l l e c t o r -E m i t t e r - n ATYPICALVce = 10V .11101001101001000 1.01.52.02.5RL - Collector Load Resistor - K Ωt P L H - P r o p a g a t i o n L o w -H i g h - µst P H L - P r o p a g a t i o n H i g h -L o w - µstPLHtPHLTa = 25°C, IF = 10mA Vcc = 5V, Vth = 1.5V Figure 7. Normalized non-saturated and saturated CTR at T A =50°C versus LED currentFigure 8. Normalized non-saturated and saturated CTR at T A =70°C versus LED currentFigure 9. Normalized non-saturated and saturated CTR at T A =85°C versus LED current.11101000.00.51.01.5NCTR(SAT)NCTRIF - LED Current - mAC T R N F - N o r m a l i z e d C T R F a c t o rNormalized to:Vce = 10V, IF = 10mA, Ta = 25°C Ta = 50°CCTRce(sat) Vce = 0.4V.11101000.00.51.01.5NCTR(SAT)NCTRIF - LED Current - mAC T R - N o r m a l i z e d C T R F a c t o rNormalized to:Vce = 10V, IF = 10mA Ta = 25°CTa = 70°CCTRce(sat) Vce = 0.4V100101.10.00.51.01.5NCTR(SAT)NCTRNormalized to:Vce = 10V, IF = 10mA, Ta = 25°C Ta = 85°C CTRce(sat) Vce = 0.4VIF - LED Current - mAN C T R - N o r m a l i z e d C T R元器件交易网。

S102L中文资料

Document Number: 63001For any questions, contact: foil@S SeriesVishay Foil ResistorsHigh Precision Foil Resistor with TCR of ± 2.0 ppm/°C,Tolerance of ± 0.005 % and Load Life Stability of ± 0.005 %Any value at any tolerance available within resistance rangeINTRODUCTIONBulk Metal ® Foil (BMF) technology outperforms all other resistor technologies available today for applications that require high precision and high stability.This technology has been pioneered and developed by VISHAY, and products based on this technology are the most suitable for a wide range of applications. BMF technology allows us to produce customer orientated products, designed to satisfy challenging and specific technical requirements.Model S Series made from Vishay BMF offers low TCR,excellent load life stability, tight tolerance, fast response time, low current noise, low thermal EMF and low voltage coefficient, all in one resistor.The S Series is virtually insensitive to destabillizing factors.The resistor element is a solid alloy that displays the desirable bulk properties of its parent material, thus it is inherently stable and noise free.Vishay’s Bulk Metal ® S Series resistors are the modern generation of precision resistors. The standard design of these resistors provides a unique combination of characteristics found in no other single resistor.Our Application Engineering D epartment is available to advise and to make recommendations. For non-standard technical requirements and special applications, please contact us.FEATURES•Temperature coefficient of resistance (TCR):- 55 °C to + 125 °C, 25 °C ref.− S102C series: ± 2 ppm/°C typical (see table 1)− S102K series: ± 1 ppm/°C typical (see table 1)•Rated power: to 1 W at + 125 °C•Tolerance: ± 0.005 %•Load life stability: to ± 0.005 % at 70 °C, 2000 h at rated power•Resistance range: 0.5 Ω to 1 M Ω (higher or lower values of resistance are available)•Electrostatic discharge above 25 000 V •Non inductive, non capacitive design •Rise time: 1 ns without ringing •Current noise: < - 40 dB•Thermal EMF: 0.05 µV/°C typical •Voltage coefficient: < 0.1 ppm/V •Low inductance: < 0.08 µH typical •Non hot spot design•Terminal finishes available:lead (Pb)-freetin/lead alloy•Matched sets are available per request (TCR Tracking: to 0.5 ppm/°C)•For better TCR and PCR performances please review the Z201 datasheetAPPLICATIONS•High precision amplifiers•Down-hole (high temperature)•High precision instrumentation •Medical and test equipment •Industrial•Audio (high end stereo equipment)•EB applications (electron beam scanning and recording equipment, electron microscopes)•Military, airborne•Measurement instrumentation* Pb containing terminations are not RoHS compliant, exemptions may applyTABLE 1 -RESISTANCE VERSUS TCR(- 55 °C to + 125 °C, + 25 °C Ref.)RESISTOR RESISTANCE VALUE (Ω)TYPICAL TCR AND MAX SPREAD (ppm/°C)S102(C)80 to < 150K ± 2 ± 2.5S102(K)80 to < 100K ± 1 ± 2.5S102(C)50 to < 80± 2 ± 3.5S102(K)± 1 ± 3.5S102(C) 1 to < 50± 2 ± 4.5S102(K)± 1 ± 4.5RoHS*COMPLIANTS SeriesVishay Foil Resistors High Precision Foil Resistor with TCR of ± 2.0 ppm/°C,Tolerance of ± 0.005 % and Load Life Stability of ± 0.005 % For any questions, contact: foil@Document Number: 63001Notes1.S104F and S105F have different package dimensions (see last column). All other specifications are the same.2.0.200" (5.08 mm) lead spacing available - specify S102J for S102C, and S102L for S102K.TABLE 2 - MODEL SELECTIONMODELNUMBERRESISTANCE RANGE (Ω)MAXIMUMWORKING VOLTAGE AMBIENT POWER RATING AVERAGE WEIGHT IN GRAMSDIMENSIONSTIGHTEST TOLERANCE VS. LOWEST RESISTANCEVALUEat + 70 °Cat + 125 °CINCHES mm F 1)(INCHES)S102C(S102J)2) 1 to 150K3000.6 W 0.3 W 0.6W: 0.105 ± 0.010L: 0.300 ± 0.010H: 0.326 ± 0.010ST: 0.010 min.SW: 0.035 ± 0.010LL: 1.000 ± 0.125LS: 0.150 ± 0.0054 2.67 ± 0.257.62 ± 0.258.28 ± 0.250.254 min.1.02 ± 0.1325.4 ± 3.183.81 ± 0.130.005 %/50 Ω0.01 %/25 Ω0.02 %/12 Ω0.05 %/5 Ω0.1 %/2 Ω0.25 %/2 Ω0.50 %/1 Ω1.0 %/1 Ωup to 100K S102K (S102L)2) 1 to 100K0.4 W 0.2 W over 100K S104D (S104F)1) 1 to 500K3501.0 W 0.5 W 1.4W: 0.160 max.L: 0.575 max.H: 0.413 max.ST: 0.035 ± 0.005SW: 0.050 ± 0.005LL: 1.000 ± 0.125LS: 0.400 ± 0.020 4.06 max.14.61 max.10.49 max.0.889 ± 0.131.27 ± 0.1325.4 ± 3.1810.16 ± 0.51(0.138)(0.565)(0.413)up to 200K S104K 1 to 300K0.6 W 0.3 W over 200K S105D (S105F)1)1 to 750K3501.5 W 0.75 W 1.9W: 0.160 max.L: 0.820 max.H: 0.413 max.ST: 0.035 ± 0.005SW: 0.050 ± 0.005LL: 1.000 ± 0.125LS: 0.650 ± 0.020 4.06 max.20.83 max.10.49 max.0.889 ± 0.131.27 ± 0.1325.4 ± 3.1816.51 ± 0.51(0.138)(0.890)(0.413)(0.7 ± 0.02)up to 300K S105K 1 to 500K0.8 W 0.4 W over 300K S106D 0.5 to 1M5002.0 W 1.0 W 4.0W: 0.260 max.L: 1.200 max.H: 0.413 max.ST: 0.035 ± 0.005SW: 0.050 ± 0.005LL: 1.000 ± 0.125LS: 0.900 ± 0.0206.60 max.30.48 max.10.49 max.0.889 ± 0.131.27 ± 0.1325.4 ± 3.1822.86 ± 0.51up to 400K S106K 0.5 to 600K1.0 W 0.5 W over 400KDocument Number: 63001For any questions, contact: foil@S SeriesHigh Precision Foil Resistor with TCR of ± 2.0 ppm/°C, Tolerance of ± 0.005 % and Load Life Stability of ± 0.005 %Vishay Foil ResistorsTABLE 3 - ENVIRONMENTAL PERFORMANCE COMPARISONMIL-PRF-55182CHAR JS-SERIES MAXIMUM ΔRS-SERIES TYPICAL ΔRTest Group IThermal shock, 5 x (- 65 °C to + 150 °C)± 0.2 %± 0.01 % (100 ppm)± 0.002 % (20 ppm)Short time overload, 6.25 x rated power ± 0.2 %± 0.01 % (100 ppm)± 0.003 % (30 ppm)Test Group IIResistance temperature characteristics ± 25 ppm/°C± 4.5 ppm/°C± 2.0 ppm/°CCharacteristicLow temperature storage (24 h at - 65 °C)± 0.15 %± 0.01 % (100 ppm)± 0.002 % (20 ppm)Low temperature operation(45 min, rated power at - 65 °C)± 0.15 %± 0.01 % (100 ppm)± 0.002 % (20 ppm)T erminal strength ± 0.2 %± 0.01 % (100 ppm)± 0.002 % (20 ppm)Test Group III DWV± 0.15 %± 0.01 % (100 ppm)± 0.002 % (20 ppm)Resistance to solder heat ± 0.1 %± 0.01 % (100 ppm)± 0.005 % (50 ppm)Moisture resistance ± 0.4 %± 0.05 % (500 ppm)± 0.01 % (100 ppm)Test Group IV Shock ± 0.2 %± 0.01 % (100 ppm)± 0.002 % (20 ppm)Vibration ± 0.2 %± 0.01 % (100 ppm)± 0.002 % (20 ppm)Test Group VLife test at 0.3 W/+ 125 °C 2000 h ± 0.5 %± 0.015 % (150 ppm)± 0.01 % (100 ppm)10000 h ± 2.0 %± 0.05 % (500 ppm)± 0.03 % (300 ppm)Test Group VaLife test at 0.6 W (2 x rated power)/+ 70 °C, 2000 h ± 0.5 %± 0.015 % (150 ppm)± 0.01 % (100 ppm)Test Group VIHigh temperature exposure (2000 h at + 175 °C)± 2.0 %± 0.1 % (1000 ppm)± 0.05 % (500 ppm)Test Group VII Voltage coefficient5 ppm/V< 0.1 ppm/V< 0.1 ppm/VS SeriesVishay Foil Resistors High Precision Foil Resistor with TCR of ± 2.0 ppm/°C,Tolerance of ± 0.005 % and Load Life Stability of ± 0.005 % For any questions, contact: foil@Document Number: 63001STANDARD OPERATIONS AND TEST CONDITIONSA. Standard Test Operations:By 100 % Inspection •Short-time overload (6.25 x rated power for 5 s)•Resistance – tolerance check•Visual and mechanical By Sample Inspection •TCR•Environmental tests per table 3 on a quarterly basis to establish performance by similarity B. Standard Test Conditions:•Lead test point: 0.5" (12.7 mm) from resistor body •Temperature: + 23 °C ± 2 °C •Relative humidity: per MIL-STD-202IMPROVED PERFORMANCE TESTING (IPT)The preceding information is based on product directly off the production line. Improved performance (meaning increased time stability with load and other stresses) is available through factory conducted “Improved Performance Testing”. The test routine is usually tailored to the users stability objectives and product that has been screened can be brought down to a potential load life of less than 50 ppm.Various screen test routines are available and all anticipated stresses must be taken into account before settling on one specific test routine. Our Applications Engineering D epartment is prepared to discuss and recommend appropriate routines given the full spectrum of anticipated stresses and stability requirements.Notes1.Load life ΔR maximum can be reduced by 80 %, please contact Applications Engineering Department.2.Inductance (L) due mainly to the leads.3.The resolution limit of existing test equipment (within the measurement capability of the equipment, or “essentially zero”.)4.µV/°C relates to EMF due to lead temperature difference and µV/watt due to power applied to the resistor.TABLE 4 - “S” SERIES SPECIFICATIONSStability 1)Load life at 2000 h± 0.015 % (150 ppm)Maximum ΔR at 0.3 W/+ 125 °C ± 0.005 % (50 ppm)Maximum ΔR at 0.1 W/+ 70 °C Load life at 10000 h± 0.05 % (500 ppm)Maximum ΔR at 0.3 W/+ 125 °C ± 0.01 % (100 ppm)Maximum ΔR at 0.05 W/+ 125 °C Current Noise0.010 µV(RMS)/V of applied voltage (- 40 dB)High Frequency Operation Rise time 1.0 ns at 1 k ΩInductance (L)2)0.1 µH maximum; 0.08 µH typical Capacitance (C) 1.0 pF maximum; 0.5 pF typical Voltage Coefficient < 0.1 ppm/V 3)Thermal EMF 4)0.1 µV/°C Maximum; 0.05 µV/°C typical 1 µV/W(Model S102C)Document Number: 63001For any questions, contact: foil@S SeriesHigh Precision Foil Resistor with TCR of ± 2.0 ppm/°C, Tolerance of ± 0.005 % and Load Life Stability of ± 0.005 %Vishay Foil Resistors Note* For non-standard requests, please contact application engineering.TABLE 5 - GLOBAL PART NUMBER INFORMATIONNEW GLOBAL PART NUMBER:Y000780K5000V9L (preferred part number format)DENOTES PRECISIONVALUE AER*YR = ΩK = k ΩM = M Ω0 = standard9 = lead (Pb)-free 1 - 999 = customPRODUCT CODE RESIST ANCE TOLERANCEPACKAGING 0007 = S102C 0785 = S102J 0062 = S102K 0786 = S102L 0011 = S104D 5011 = S104F 0101 = S104K 4101 = S104L 0012 = S105D 4012 = S105F 0102 = S105K 4102 = S105L 0013 = S106D 0103 = S106KV = ± 0.005 %T = ± 0.01 %Q = ± 0.02 %A = ± 0.05 %B = ± 0.1 %C = ± 0.25 %D = ± 0.5 %F = ± 1.0 %L = bulk packFOR EXAMPLE: ABOVE GLOBAL ORDER Y0007 80K5000 V 9 L:TYPE: S102C VALUE: 80.5 k ΩABSOLUTE TOLERANCE: ± 0.005 %TERMINATION: lead (Pb)-free PACKAGING: bulk packHISTORICAL PART NUMBER:S102C T 250R00V B (will continue to be used)S102C T250R00V B MODEL TERMINATION RESISTANCE VALUE TOLERANCE P ACKAGING S102C S102J S102K S102L S104D S104F S104K S104L S105D S105F S105K S105L S106D S106KT = lead (Pb)-free None = tin/lead alloy250R00 = 250.00 Ω5K2310 = 5.231 k Ω1M000 = 1 M ΩV = ± 0.005 %T = ± 0.01 %Q = ± 0.02 %A = ± 0.05 %B = ± 0.1 %C = ± 0.25 %D = ± 0.5 %F = ± 1.0 %B = bulk pack0078K 500Y 0V 90LDisclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。

VB2 Plus-12 中文样本(090301-C) 2010-10-16

额定电缆充电开断电流 Rated cable-charging breaking current 电机电压
motor voltage 分闸合闸装置电压
Rated supply voltage of closing and opening devices
执行标准 Relevant standarder
‫܌ۨܮ‬ୟਸ܏‫ୁۉ‬ Rated short-circuit breaking current(Isc)
‫้܌ۨܮ‬ఱ๴‫ୁۉ‬ Rated short time withstand current (4s)
‫ۉۨܮ‬મ؊‫ۉ‬ਸ܏‫ୁۉ‬ Rated cable-charging breaking current
Type designation 出厂编号 Serial number 额定电压
Rated voltage(Ur) 额定电流
Rated normal current(Ir) 额定频率
Rated frequency 额定雷电冲击耐压 (峰值)
Rated lightning impulse withstand voltage(Up) 额定短路开断电流 Rated short-circuit breaking current(Isc) 额定短时耐受电流 Rated short time withstand current (4s)
247、256
308
308
308
5
操动机构与闭锁电磁铁的技术数据
额定电压(V)
110 交流
220
110 直流
220
储能电动机功率(VA/W) 140 140 140 140
合闸线圈(A) 2.9 1.5 2.9 1.5

LLN2C122MELB30中文资料

Code LLN2D331MELY25 LLN2D391MELY30 LLN2D391MELZ25 LLN2D471MELY35 LLN2D471MELZ30 LLN2D471MELA25 LLN2D561MELZ30 LLN2D561MELA25 LLN2D681MELZ35 LLN2D681MELA30 LLN2D681MELB25 LLN2D821MELZ40 LLN2D821MELA35 LLN2D821MELB25 LLN2D102MELA40 LLN2D102MELB30 LLN2D102MELC25 LLN2D122MELA45 LLN2D122MELB35 LLN2D122MELC30 LLN2D152MELA50 LLN2D152MELB40 LLN2D152MELC30 LLN2D182MELB45 LLN2D182MELC35 LLN2D222MELB50 LLN2D222MELC40 LLN2D272MELC50
tan δ 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15
680
820
LS
Smaller
LN
Smaller
Specifications
Item
LG
Performance Characteristics
Category Temperature Range Rated Voltage Range Rated Capacitance Range Capacitance Tolerance Leakage Current

CS42L52中文资料

Low Power, Stereo CODEC w/Headphone & Speaker AmpsStereo CODECHigh Performance Stereo ADC & DAC–98dB Dynamic Range (A-wtd) –-88dB THD+N Flexible Stereo Analog Input Architecture–4:1 Analog Input MUX –Analog Input Mixing–Analog Passthru with Volume Control–Analog Programmable Gain Amplifier (PGA) Programmable Automatic Level Control (ALC)–Noise Gate for Noise Suppression–Programmable Threshold & Attack/ReleaseRates Dual MIC Inputs–Differential or Single-Ended–+16dB to +32dB w/1dB step MIC Pre-Amplifiers–Programmable, Low Noise MIC Bias Levels Digital Signal Processing Engine–Bass & Treble Tone Control, De-Emphasis–Master Vol. and Independent PCM SDIN + ADC SDOUT Mix Volume Control–Soft-Ramp & Zero-Cross Transitions –Programmable Peak-Detect and Limiter –Beep Generator w/Full Tone ControlClass D Stereo/Mono Speaker AmplifierNo External Filter RequiredHigh Stereo Output Power at 10% THD+N– 2 x 1.00 W into 8Ω @ 5.0V – 2 x 550mW into 8Ω @ 3.7V – 2 x 230mW into 8Ω @ 2.5V High Mono Output Power at 10% THD+N– 1 x 1.90W into 4Ω @ 5.0V – 1 x 1.00W into 4Ω @ 3.7V – 1 x 350mW into 4Ω @ 2.5V Direct Battery Powered Operation–Battery Level Monitoring & Compensation 82% Efficiency at 800 mWPhase-Aligned PWM Output Reduces IdleChannel CurrentSpread Spectrum Modulation Low Quiescent CurrentStereo Headphone AmplifierGround Centered Outputs–No DC-Blocking Capacitors Required –Integrated Negative Voltage Regulator High Power Output at -75dB THD+N– 2 x 23mW Into 16Ω @ 1.8V – 2 x 44mW Into 16Ω @ 2.5V (Features continued on page 2)CS42L52CS42L52System Features12, 24, and 27MHz Master Clock Support inAddition to Typical Audio Clock Rates High Performance 24-bit Converters–Multi-bit Delta Sigma Architecture–Very Low 64Fs Oversampling Clock Reduces Power ConsumptionLow Power Operation–Stereo Analog Passthru: 10 mW @ 1.8 V –Stereo Playback: 14 mW @ 1.8 V–Stereo Rec. and Playback: 23 mW @ 1.8V Variable Power Supplies– 1.8 V to 2.5 V Digital & Analog – 1.6V to 5V Class D Amplifier– 1.8V to 2.5V Headphone Amplifier – 1.8 V to 3.3V Interface LogicPower Down Management–ADC, DAC, CODEC, MIC Pre-Amplifier, PGA,Headphone Amplifier, Speaker Amplifier Analog & Digital Routing/Mixes:–Line/Headphone Out =Analog In (ADCBypassed)–Line/Headphone/SpeakerOut =ADC +Digital In–Digital Out =ADC +Digital In –Internal Digital Loopback –Mono Mixes Flexible Clocking Options–Master or Slave Operation–High Impedance Digital Output Option (for easyMUXing between CODEC & other data sources)–Quarter-Speed Mode - (i.e. allows 8 kHz Fswhile maintaining a flat noise floor up to 16kHz)– 4 kHz to 96 kHz Sample Rates I²C ® Control Port OperationTemp. Monitor w/Thermal Foldback &ShutdownHeadphone/Speaker Detection Input Pop and Click SuppressionApplicationsDigital Voice Recorders, Digital Cameras &Camcorders PDA’sPersonal Media Players Portable Game ConsolesGeneral DescriptionThe CS42L52 is a highly integrated, low power stereo CODEC with headphone and Class D speaker amplifiers. The CS42L52 offers many features suitable for low power, porta-ble system applications.The ADC input path allows independent channel control of a number of features. Input summing amplifiers mix and select line-level and/or microphone level inputs for each channel.The microphone input path includes a selectable programma-ble-gain pre-amplifier stage and a low noise MIC bias voltage supply. A PGA is available for line or microphone inputs and provides analog gain with soft ramp and zero cross transi-tions. The ADC also features a digital volume control with soft ramp transitions. A programmable ALC and Noise Gate mon-itor the input signals and adjust the volume levels appropriately. To conserve power, the ADC may be bypassed while still allowing full analog volume control.The DAC output path includes a digital signal processing en-gine with various fixed function controls.Tone Control provides bass and treble adjustment of four selectable corner frequen-cies. The Digital Mixer provides independent volume control for both the ADC output and PCM input signal paths, as well as a master volume control. Digital Volume controls may be configured to change on soft ramp transitions while the analog controls can be configured to occur on every zero crossing.The DAC also includes de-emphasis, limiting functions and a BEEP generator delivering tones selectable across a range of two full octaves.The stereo headphone amplifier is powered from a separate positive supply and the integrated charge pump provides a negative supply. This allows a ground-centered analog output with a wide signal swing and eliminates external DC-blocking capacitors.The Class D stereo speaker amplifier does not require an external filter and provides the high efficiency amplification re-quired by power sensitive portable applications. The speaker amplifier may be powered directly from a battery while the in-ternal DC supply monitoring and compensation provides a constant gain level as the battery’s voltage decays. An internal temperature monitor alerts the user and automatically atten-uates and/or shuts down the PWM speaker output when an overload condition causes temperatures to exceed safe oper-ating levels.In addition to its many features, the CS42L52 operates from a low voltage analog and digital core making it ideal for portable systems that require extremely low power consumption in a minimal amount of space.The CS42L52 is available in a 40-pin QFN package in both Commercial (-40 to +85 °C) and Automotive (-40 to +105 °C)grades. The CS42L52 Customer Demonstration board is also available for device evaluation and implementation sugges-tions. Please refer to “Ordering Information” on page 82 for complete ordering information.CS42L52 TABLE OF CONTENTS1. PIN DESCRIPTIONS (8)1.1 I/O Pin Characteristics (9)2. TYPICAL CONNECTION DIAGRAM (10)3. CHARACTERISTIC AND SPECIFICATIONS (11)RECOMMENDED OPERATING CONDITIONS (11)ABSOLUTE MAXIMUM RATINGS (11)ANALOG INPUT CHARACTERISTICS (COMMERCIAL - CNZ) (12)ANALOG INPUT CHARACTERISTICS (AUTOMOTIVE - DNZ) (13)ADC DIGITAL FILTER CHARACTERISTICS (14)ANALOG OUTPUT CHARACTERISTICS (COMMERCIAL - CNZ) (15)ANALOG OUTPUT CHARACTERISTICS (AUTOMOTIVE - DNZ) (16)ANALOG PASSTHRU CHARACTERISTICS (17)PWM OUTPUT CHARACTERISTICS (Note 9) (17)LINE OUTPUT VOLTAGE LEVEL CHARACTERISTICS (18)HEADPHONE OUTPUT POWER CHARACTERISTICS (19)COMBINED DAC INTERPOLATION & ON-CHIP ANALOG FILTER RESPONSE (20)SWITCHING SPECIFICATIONS - SERIAL PORT (21)SWITCHING SPECIFICATIONS - I²C CONTROL PORT (22)DC ELECTRICAL CHARACTERISTICS (23)DIGITAL INTERFACE SPECIFICATIONS & CHARACTERISTICS (23)POWER CONSUMPTION (24)4. APPLICATIONS (25)4.1 Overview (25)4.1.1 Basic Architecture (25)4.1.2 Line & MIC Inputs (25)4.1.3 Line & Headphone Outputs (25)4.1.4 Speaker Driver Outputs (25)4.1.5 Fixed Function DSP Engine (25)4.1.6 Beep Generator (25)4.1.7 Power Management (25)4.2 Analog Inputs (26)4.2.1 MIC Inputs (27)4.2.2 Automatic Level Control (ALC) (27)4.2.3 Noise Gate (28)4.3 Analog Outputs (29)4.3.1 Beep Generator (30)4.3.2 Limiter (31)4.4 Analog In to Analog Out Passthru (32)4.4.1 Overriding the ADC Power Down (32)4.4.2 Overriding the PGA Power Down (33)4.5 PWM Outputs (33)4.5.1 Mono Speaker Output Configuration (33)4.5.2 VP Battery Compensation (33)4.5.2.1 Maintaining a Desired Output Level (34)4.6 Serial Port Clocking (34)4.7 Digital Interface Formats (36)4.7.1 DSP Mode (36)4.8 Initialization (36)4.9 Recommended Power-Up Sequence (37)4.10 Recommended Power-Down Sequence (37)4.11 Control Port Operation (38)4.11.1 I²C Control (38)CS42L524.11.2 Memory Address Pointer (MAP) (39)4.11.2.1 Map Increment (INCR) (39)5. REGISTER QUICK REFERENCE (40)6. REGISTER DESCRIPTION (42)6.1 Chip I.D. and Revision Register (Address 01h) (Read Only) (42)6.1.1 Chip I.D. (Read Only) (42)6.1.2 Chip Revision (Read Only) (42)6.2 Power Control 1 (Address 02h) (42)6.2.1 Power Down ADC Charge Pump (42)6.2.2 Power Down PGAx (42)6.2.3 Power Down ADCx (43)6.2.4 Power Down (43)6.3 Power Control 2 (Address 03h) (43)6.3.1 Power Down ADC Override (43)6.3.2 Power Down MICx (43)6.3.3 Power Down MIC Bias (43)6.4 Power Control 3 (Address 04h) (44)6.4.1 Headphone Power Control (44)6.4.2 Speaker Power Control (44)6.5 Clocking Control (Address 05h) (44)6.5.1 Auto-Detect (44)6.5.2 Speed Mode (45)6.5.3 32kHz Sample Rate Group (45)6.5.4 27 MHz Video Clock (45)6.5.5 Internal MCLK/LRCK Ratio (45)6.5.6 MCLK Divide By 2 (46)6.6 Interface Control 1 (Address 06h) (46)6.6.1 Master/Slave Mode (46)6.6.2 SCLK Polarity (46)6.6.3 ADC Interface Format (46)6.6.4 DSP Mode (46)6.6.5 DAC Interface Format (47)6.6.6 Audio Word Length (47)6.7 Interface Control 2 (Address 07h) (47)6.7.1 SCLK equals MCLK (47)6.7.2 SDOUT to SDIN Digital Loopback (47)6.7.3 Tri-State Serial Port Interface (48)6.7.4 Speaker/Headphone Switch Invert (48)6.7.5 MIC Bias Level (48)6.8 Input x Select: ADCA and PGAA (Address 08h), ADCB and PGAB (Address 09h) (48)6.8.1 ADC Input Select (48)6.8.2 PGA Input Mapping (49)6.9 Analog & HPF Control (Address 0Ah) (49)6.9.1 ADCx High-Pass Filter (49)6.9.2 ADCx High-Pass Filter Freeze (49)6.9.3 Ch. x Analog Soft Ramp (49)6.9.4 Ch. x Analog Zero Cross (49)6.10 ADC HPF Corner Frequency (Address 0Bh) (50)6.10.1 HPF x Corner Frequency (50)6.11 Misc. ADC Control (Address 0Ch) (50)6.11.1 ADC Channel B=A (50)6.11.2 Digital MUX (50)6.11.3 Digital Sum (50)6.11.4 Invert ADC Signal Polarity (50)CS42L526.11.5 ADC Mute (51)6.12 Playback Control 1 (Address 0Dh) (51)6.12.1 Headphone Analog Gain (51)6.12.2 Playback Volume Setting B=A (51)6.12.3 Invert PCM Signal Polarity (51)6.12.4 Master Playback Mute (51)6.13 Miscellaneous Controls (Address 0Eh) (52)6.13.1 Passthru Analog (52)6.13.2 Passthru Mute (52)6.13.3 Freeze Registers (52)6.13.4 HP/Speaker De-Emphasis (52)6.13.5 Digital Soft Ramp (53)6.13.6 Digital Zero Cross (53)6.14 Playback Control 2 (Address 0Fh) (53)6.14.1 Headphone Mute (53)6.14.2 Speaker Mute (53)6.14.3 Speaker Volume Setting B=A (54)6.14.4 Speaker Channel Swap (54)6.14.5 Speaker MONO Control (54)6.14.6 Speaker Mute 50/50 Control (54)6.15 MICx Amp Control:MIC A (Address 10h) & MIC B (Address 11h) (54)6.15.1 MIC x Select (54)6.15.2 MICx Configuration (55)6.15.3 MICx Gain (55)6.16 PGAx Vol. & ALCx Transition Ctl.:ALC, PGA A (Address 12h) & ALC, PGA B (Address 13h) (55)6.16.1 ALCx Soft Ramp Disable (55)6.16.2 ALCx Zero Cross Disable (55)6.16.3 PGAx Volume (56)6.17 Passthru x Volume: PASSAVOL (Address 14h) & PASSBVOL (Address 15h) (56)6.17.1 Passthru x Volume (56)6.18 ADCx Volume Control: ADCAVOL (Address 16h) & ADCBVOL (Address 17h) (57)6.18.1 ADCx Volume (57)6.19 ADCx Mixer Volume: ADCA (Address 18h) & ADCB (Address 19h) (58)6.19.1 ADC Mixer Channel x Mute (58)6.19.2 ADC Mixer Channel x Volume (58)6.20 PCMx Mixer Volume: PCMA (Address 1Ah) & PCMB (Address 1Bh) (58)6.20.1 PCM Mixer Channel x Mute (58)6.20.2 PCM Mixer Channel x Volume (58)6.21 Beep Frequency & On Time (Address 1Ch) (59)6.21.1 Beep Frequency (59)6.21.2 Beep On Time (60)6.22 Beep Volume & Off Time (Address 1Dh) (60)6.22.1 Beep Off Time (60)6.22.2 Beep Volume (61)6.23 Beep & Tone Configuration (Address 1Eh) (61)6.23.1 Beep Configuration (61)6.23.2 Beep Mix Disable (61)6.23.3 Treble Corner Frequency (62)6.23.4 Bass Corner Frequency (62)6.23.5 Tone Control Enable (62)6.24 Tone Control (Address 1Fh) (62)6.24.1 Treble Gain (62)CS42L526.24.2 Bass Gain (63)6.25 Master Volume Control: MSTA (Address 20h) & MSTB (Address 21h) (63)6.25.1 Master Volume Control (63)6.26 Headphone Volume Control: HPA (Address 22h) & HPB (Address 23h) (63)6.26.1 Headphone Volume Control (63)6.27 Speaker Volume Control: SPKA (Address 24h) & SPKB (Address 25h) (64)6.27.1 Speaker Volume Control (64)6.28 ADC & PCM Channel Mixer (Address 26h) (64)6.28.1 PCM Mix Channel Swap (64)6.28.2 ADC Mix Channel Swap (64)6.29 Limiter Control 1, Min/Max Thresholds (Address 27h) (65)6.29.1 Limiter Maximum Threshold (65)6.29.2 Limiter Cushion Threshold (65)6.29.3 Limiter Soft Ramp Disable (65)6.29.4 Limiter Zero Cross Disable (66)6.30 Limiter Control 2, Release Rate (Address 28h) (66)6.30.1 Peak Detect and Limiter (66)6.30.2 Peak Signal Limit All Channels (66)6.30.3 Limiter Release Rate (66)6.31 Limiter Attack Rate (Address 29h) (67)6.31.1 Limiter Attack Rate (67)6.32 ALC Enable & Attack Rate (Address 2Ah) (67)6.32.1 ALCx Enable (67)6.32.2 ALC Attack Rate (67)6.33 ALC Release Rate (Address 2Bh) (68)6.33.1 ALC Release Rate (68)6.34 ALC Threshold (Address 2Ch) (68)6.34.1 ALC Maximum Threshold (68)6.34.2 ALC Minimum Threshold (69)6.35 Noise Gate Control (Address 2Dh) (69)6.35.1 Noise Gate All Channels (69)6.35.2 Noise Gate Enable (69)6.35.3 Noise Gate Threshold and Boost (70)6.35.4 Noise Gate Delay Timing (70)6.36 Status (Address 2Eh) (Read Only) (70)6.36.1 Serial Port Clock Error (Read Only) (70)6.36.2 DSP Engine Overflow (Read Only) (71)6.36.3 PCMx Overflow (Read Only) (71)6.36.4 ADCx Overflow (Read Only) (71)6.37 Battery Compensation (Address 2Fh) (71)6.37.1 Battery Compensation (71)6.37.2 VP Monitor (71)6.37.3 VP Reference (72)6.38 VP Battery Level (Address 30h) (Read Only) (72)6.38.1 VP Voltage Level (Read Only) (72)6.39 Speaker Status (Address 31h) (Read Only) (72)6.39.1 Speaker Current Load Status (Read Only) (72)6.39.2 SPKR/HP Pin Status (Read Only) (73)6.39.3 Thermal Warning Status (Read Only) (73)6.39.4 Thermal Error Status (Read Only) (73)6.40 Temperature Monitor Control (Address 32h) (73)6.40.1 Temperature Acknowledge & Release (73)6.40.2 Thermal Foldback (Address 33h) (73)6.40.3 Thermal Foldback (73)CS42L526.40.4 Speaker Attenuation (74)6.41 Charge Pump Frequency (Address 34h) (74)6.41.1 Charge Pump Frequency (74)7. ANALOG PERFORMANCE PLOTS (75)7.1 Headphone THD+N versus Output Power Plots (75)8. EXAMPLE SYSTEM CLOCK FREQUENCIES (77)8.1 Auto Detect Enabled (77)8.2 Auto Detect Disabled (77)9. PCB LAYOUT CONSIDERATIONS (78)9.1 Power Supply, Grounding (78)9.2 QFN Thermal Pad (78)10. ADC & DAC DIGITAL FILTERS (79)11. PARAMETER DEFINITIONS (80)12. PACKAGE DIMENSIONS (81)THERMAL CHARACTERISTICS (81)13. ORDERING INFORMATION (82)14. REFERENCES (82)15. REVISION HISTORY (82)LIST OF FIGURESFigure 1. Typical Connection Diagram (10)Figure 2. Headphone Output Test Load (19)Figure 3. Serial Audio Interface Timing (21)Figure 4. Control Port Timing - I²C (22)Figure 5. Analog Input Signal Flow (26)Figure 6. Single-Ended MIC Configuration (27)Figure 7. Differential MIC Configuration (27)Figure 8. ALC (28)Figure 9. Noise Gate Attenuation (28)Figure 10. DSP Engine Signal Flow (29)Figure 11. PWM Output Stage (30)Figure 12. Analog Output Stage (30)Figure 13. Beep Configuration Options (31)Figure 14. Peak Detect & Limiter (32)Figure 15. Battery Compensation (34)Figure 16. I²S Format (36)Figure 17. Left-Justified Format (36)Figure 18. Right-Justified Format (DAC only) (36)Figure 19. DSP Mode Format) (36)Figure 20. Control Port Timing, I²C Write (38)Figure 21. Control Port Timing, I²C Read (38)Figure 22. THD+N vs. Output Power per Channel at 1.8V (16 Ω load) (75)Figure 23. THD+N vs. Output Power per Channel at 2.5V (16 Ω load) (75)Figure 24. THD+N vs. Output Power per Channel at 1.8V (32 Ω load) (76)Figure 25. THD+N vs. Output Power per Channel at 2.5V (32 Ω load) (76)Figure 26. ADC Passband Ripple (79)Figure 27. ADC Stopband Rejection (79)Figure 28. ADC Transition Band (79)Figure 29. ADC Transition Band Detail (79)Figure 30. DAC Passband Ripple (79)Figure 31. DAC Stopband (79)Figure 32. DAC Transition Band (79)Figure 33. DAC Transition Band (Detail) (79)CS42L52 1.PIN DESCRIPTIONSPin Name#Pin DescriptionSDA1Serial Control Data (Input/Output) - SDA is a data I/O in I²C Mode.SCL2Serial Control Port Clock (Input) - Serial clock for the serial control port.TSTN 3Test In - This pin is an input used for test purposes only. It must be tied to ground for normal oper-ation.SPKR_OUTA-SPKR_OUTB+ SPKR_OUTB-679PWM Speaker Output (Output) - Full-bridge amplified PWM speaker outputs.VP 58Power for PWM Drivers (Input)-Power supply for the PWM output driver stages.-VHPFILTpump that provides the negative rail for the headphone/line amplifiers.FLYN 11Charge Pump Cap Negative Node (Output)- Negative node for the inverting charge pump’s fly-ing capacitor.FLYPcapacitor.+VHP13Positive Analog Power for Headphone (Input)-Positive voltage rail and power for the internal headphone amplifiers and inverting charge pump.SDOUTMCLKSCLKSDINSDALRCKFLYN+VHPHP/LINE_OUTBHP/LINE_OUTAVQMICBIASAIN4A/MIC1+/MIC2AAIN2ATSTNSPKR_OUTA+VPVPVDSPKR_OUTB--VHPFILTAIN4B/MIC2+/MIC2BAIN1BAIN2BAFILTBAIN3B/MIC2-/MIC1BAFILTAAIN1AAIN3A/MIC1-/MIC1ASPKR_OUTB+SCLDGNDSPKR_OUTA-FLYPVAAGNDFILT+RESETVLSPKR/HPCS42L521.1I/O Pin CharacteristicsInput and output levels and associated power supply voltage are shown in the table below. Logic levels should not exceed the corresponding power supply voltage.FILT+cuits.VQ 19Quiescent Voltage (Output ) - Filter connection for the internal quiescent voltage.MICBIAS 20Microphone Bias (Output ) - Low noise bias supply for an external microphone. Electrical charac-teristics are specified in the DC Electrical Characteristics table.AIN3A,B 23,24Line-Level Analog Inputs (Input ) - Single-ended stereo line-level analog inputs. MIC1+,-MIC2+,-21,2322,24Differential Microphone Inputs (Input ) - Differential stereo microphone inputs. MIC1A,B 23,24Single-Ended Microphone Inputs (Input ) - Single-ended stereo microphone inputs.AIN2A,B AIN1A,B 25,2629,30Line-Level Analog Inputs (Input ) - Single-ended stereo line-level analog inputs.SPKR/HP and/or headphone outputs.RESET 32Reset (Input ) - The device enters a low power mode when this pin is driven low.VL face and host control port.VD 34Digital Power (Input ) - Positive power for the internal digital section. DGND 35Digital Ground (Input ) - Ground reference for the internal digital section.SDOUT 36Serial Audio Data Output (Output ) - Output for two’s complement serial audio data.MCLK 37Master Clock (Input ) - Clock source for the delta-sigma modulators.SCLK 38Serial Clock (Input/Output ) - Serial clock for the serial audio interface.SDIN 39Serial Audio Data Input (Input ) - Input for two’s complement serial audio data.LRCK40Left Right Clock (Input/Output ) - Determines which channel, Left or Right, is currently active on the serial audio data line.GND/Thermal Paddissipation.Power SupplyPin Name I/O DriverReceiverVLRESET Input - 1.65 V - 3.47 V, with Hysteresis SCL Input - 1.65 V - 3.47 V, with Hysteresis SDA Input/Output 1.65 V - 3.47 V, CMOS/Open Drain1.65 V - 3.47 V, with HysteresisMCLK Input - 1.65 V - 3.47 V LRCK Input/Output 1.65 V - 3.47 V, CMOS 1.65 V - 3.47 V SCLK Input/Output 1.65 V - 3.47 V, CMOS 1.65 V - 3.47 VSDOUT Output 1.65 V - 3.47 V V, CMOSSDIN Input - 1.65 V - 3.47 V VA SPKR/HP Input - 1.65 V - 2.63 VVPSPKR_OUTA+Output 1.6V - 5.25V Power MOSFET -SPKR_OUTA-Output1.6V - 5.25V Power MOSFET -SPKR_OUTB+Output 1.6V - 5.25V Power MOSFET -SPKR_OUTB-Output1.6V - 5.25V Power MOSFET-CS42L52 2.TYPICAL CONNECTION DIAGRAMFigure 1. Typical Connection DiagramCS42L523.CHARACTERISTIC AND SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS(AGND=DGND=0 V, all voltages with respect to ground.)ABSOLUTE MAXIMUM RATINGS(AGND = DGND = 0 V; all voltages with respect to ground.)WARNING:Operation at or beyond these limits may result in permanent damage to the device. Normal operationis not guaranteed at these extremes.Notes:1.Any pin except supplies. Transient currents of up to ±100 mA on the analog input pins will not causeSCR latch-up.2.The maximum over/under voltage is limited by the input current.ParametersSymbol Min MaxUnitsDC Power Supply AnalogVA 1.65 2.63V Headphone Amplifier +VHP 1.65 2.63V Speaker Amplifier VP 1.60 5.25V DigitalVD 1.65 2.63V Serial/Control Port Interface VL1.65 3.47V Ambient TemperatureCommercial - CNZ Automotive - DNZT A-40-40+85+105°C °CParametersSymbolMinMaxUnitsDC Power SupplyAnalog Speaker DigitalSerial/Control Port InterfaceVA, VHP VP VD VL -0.3-0.3-0.3-0.3 3.05.53.04.0V V V V Input Current(Note 1)I in-±10mAAnalog Input Voltage(Note 2)V INAGND-0.7VA+0.7VDigital Input Voltage(Note 2)V IND -0.3VL+ 0.4V Ambient Operating Temperature (power applied)T A -50+115°C Storage TemperatureT stg-65+150°CCS42L52ANALOG INPUT CHARACTERISTICS (COMMERCIAL - CNZ)(Test Conditions (unless otherwise specified): Input sine wave (relative to digital full-scale): 1kHz through passive input filter; VL = VD = VHP = 1.8 V; T A = +25°C; Measurement Bandwidth is 10Hz to 20kHz unless otherwise specified. Sample Fre-quency = 48kHz)3.Measured with DAC delivering full-scale output into specified load.4.Measured between analog input and AGND.VA = 2.5V VA = 1.8V Parameters MinTypMaxMinTypMaxUnitAnalog In to ADC (PGA bypassed)Dynamic RangeA-weighted unweighted 93909996--90879693--dB dB Total Harmonic Distortion + Noise-1dBFS -20dBFS -60dBFS ----86-76-36-80--30----84-73-33-78--27dB dB dB Analog In to PGA to ADC Dynamic Range PGA Setting: 0 dB A-weighted unweighted 92899895--89869592--dB dB PGA Setting: +12 dBA-weighted unweighted85829188--82798885--dB dB Total Harmonic Distortion + Noise PGA Setting: 0 dB -1dBFS -60dBFS ---88-35-82-29---86-32-80-26dB dB PGA Setting: +12 dB -1dBFS --85-79--83-77dB Analog In to MIC Pre-Amp (+16 dB) to PGA to ADC Dynamic Range PGA Setting: 0 dB A-weighted unweighted --8683----8380--dB dB Total Harmonic Distortion + Noise PGA Setting: 0 dB -1dBFS --76---74-dB Analog In to MIC Pre-Amp (+32 dB) to PGA to ADC Dynamic Range PGA Setting: 0 dB A-weighted unweighted --7874----7571--dB dB Total Harmonic Distortion + Noise PGA Setting: 0 dB -2dBFS --74---71-dB Other Characteristics DC AccuracyInterchannel Gain Mismatch -0.2--0.2-dB Gain Drift -±100--±100-ppm/°C Offset Error SDOUT Code with HPF On -352--352-LSB InputInterchannel Isolation -90--90-dB HP Amp to Analog Input Isolation R L = 10 k Ω(Note 3)R L = 16 Ω--10070----10070--dB dB Speaker Amp to Analog Input Isolation -60--60-dB Full-scale Input Voltage ADC PGA (0 dB)PGA (+12 dB)MIC (+16 dB)MIC (+32 dB)0.73•VA0.73•VA 0.769•VA 0.770•VA 0.194•VA 0.115•VA 0.019•VA0.83•VA0.83•VA 0.73•VA 0.73•VA0.769•VA 0.770•VA 0.194•VA 0.115•VA 0.019•VA 0.83•VA 0.83•VAVpp Vpp Vpp Vpp Input Impedance (Note 4)ADC PGA MIC ---203950------203950---k Ωk Ωk ΩCS42L52 ANALOG INPUT CHARACTERISTICS (AUTOMOTIVE - DNZ)(Test Conditions (unless otherwise specified): Input sine wave (relative to full-scale): 1 kHz through passive input filter;VL = VD = VHP = 1.8 V; T A = -40 to +85°C; Measurement Bandwidth is 10Hz to 20kHz unless otherwise specified. Sample Frequency = 48kHz)VA = 2.37 - 2.63 V VA = 1.65 - 1.89 VParameters Min Typ Max Min Typ Max Unit Analog In to ADCDynamic Range A-weightedunweighted 91889996--88859693--dBdBTotal Harmonic Distortion + Noise -1dBFS -20dBFS-60dBFS ----86-76-36-78--28----84-73-33-76--25dBdBdBAnalog In to PGA to ADC Dynamic RangePGA Setting: 0 dB A-weightedunweighted 90879895--87849592--dBdBPGA Setting: +12 dB A-weightedunweighted 83809188--80778885--dBdBTotal Harmonic Distortion + NoisePGA Setting: 0 dB -1dBFS -60dBFS ---88-35-80-27---86-32-78-24dBdBPGA Setting: +12 dB -1dBFS--85-77--83-75dB Analog In to MIC Pre-Amp (+16 dB) to PGA to ADCDynamic RangePGA Setting: 0 dB A-weightedunweighted --8683----8380--dBdBTotal Harmonic Distortion + NoisePGA Setting: 0 dB -1dBFS--76---74-dB Analog In to MIC Pre-Amp (+32 dB) to PGA to ADCDynamic RangePGA Setting: 0 dB A-weightedunweighted --7874----7571--dBdBTotal Harmonic Distortion + NoisePGA Setting: 0 dB -2dBFS--74---71-dB Other CharacteristicsDC AccuracyInterchannel Gain Mismatch-0.1--0.1-dB Gain Drift-±100--±100-ppm/°C Offset Error SDOUT Code with HPF On-352--352-LSB InputInterchannel Isolation-90--90-dBHP Amp to Analog Input Isolation R L = 10 kΩ(Note 3)R L = 16 Ω--10070----10070--dBdBSpeaker Amp to Analog Input Isolation-60--60-dBFull-scale Input Voltage ADCPGA (0 dB)PGA (+12 dB)MIC (+16 dB)MIC (+32 dB)0.73•VA0.73•VA0.769•VA0.770•VA0.194•VA0.115•VA0.019•VA0.83•VA0.83•VA0.73•VA0.73•VA0.769•VA0.770•VA0.194•VA0.115•VA0.019•VA0.83•VA0.83•VAVppVppVppVppInput Impedance (Note 4)ADCPGAMIC 184050------184050------kΩkΩkΩCS42L52ADC DIGITAL FILTER CHARACTERISTICS5.Response is clock-dependent and will scale with Fs. Note that the response plots (Figures 26to 29 onpage 79) have been normalized to Fs and can be de-normalized by multiplying the X-axis scale by Fs.HPF parameters are for Fs = 48 kHz.Parameters (Note 5)MinTypMaxUnitPassband (Frequency Response) to -0.1 dB corner0-0.4948Fs Passband Ripple -0.09-0.17dB Stopband0.6--Fs Stopband Attenuation 33--dB Total Group Delay-7.6/Fs -s High-Pass Filter Characteristics (48 kHz Fs)Frequency Response -3.0 dB -0.13 dB-- 3.624.2--Hz Hz Phase Deviation @ 20Hz-10-Deg Passband Ripple --0.17dB Filter Settling Time-105/Fss。

ADC122S051CIMMNOPB;ADC122S051CIMMXNOPB;中文规格书,Datasheet资料

ADC122S051/ADC122S051QJanuary 5, 2012 2 Channel, 200 ksps to 500 ksps 12-Bit A/D ConverterGeneral DescriptionThe ADC122S051/ADC122S051Q is a low-power, two-chan-nel CMOS 12-bit analog-to-digital converter with a high-speed serial interface. Unlike the conventional practice of specifying performance at a single sample rate only, the AD-C122S051/ADC122S051Q is fully specified over a sample rate range of 200 ksps to 500 ksps. The converter is based on a successive-approximation register architecture with an internal track-and-hold circuit. It can be configured to accept one or two input signals at inputs IN1 and IN2.The output serial data is straight binary, and is compatible with several standards, such as SPI™, QSPI™, MICROWIRE, and many common DSP serial interfaces.The ADC122S051/ADC122S051Q operates with a single supply that can range from +2.7V to +5.25V. Normal power consumption using a +3V or +5V supply is 3.0 mW and 10 mW, respectively. The power-down feature reduces the pow-er consumption to just 0.14 µW using a +3V supply, or 0.32µW using a +5V supply.The ADC122S051/ADC122S051Q is packaged in an 8-lead MSOP package. Operation over the industrial temperature range of −40°C to +85°C is guaranteed.Features■Specified over a range of sample rates.■Two input channels■Variable power management■Single power supply with 2.7V - 5.25V range■Tested per AEC-Q100 and qualified for automotive applications■Meets AEC-Q100-011 C2 CDM classificationKey Specifications■DNL+0.7 / −0.4 LSB (typ)■INL± 0.50 LSB (typ)■SNR72.5 dB (typ)■Power Consumption■—3V Supply 3.0 mW (typ)—5V Supply10 mW (typ) Applications■Portable Systems■Remote Data Acquisition■Instrumentation and Control SystemsPin-Compatible Alternatives by Resolution and SpeedAll devices are fully pin and function compatible.Resolution Specified for Sample Rate Range of:50 to 200 ksps200 to 500 ksps500 ksps to 1 Msps12-bit ADC122S021ADC122S051ADC122S10110-bit ADC102S021ADC102S051ADC102S1018-bit ADC082S021ADC082S051ADC082S101 Connection Diagram20106405Ordering InformationOrder Code Temperature Range Top Mark DescriptionADC122S051CIMM−40°C to +85°C X06C8-Lead MSOP PackageADC122S051CIMMX−40°C to +85°C X06C8-Lead MSOP Package, Tape & ReelADC122S051QIMM−40°C to +85°C X06Q8-Lead MSOP Package, AEC-Q100 (Note 11)ADC122S051QIMMX−40°C to +85°C X06Q8-Lead MSOP Package, Tape & Reel, AEC-Q100 (Note 11) ADC122S051EVAL Evaluation BoardTRI-STATE® is a trademark of National Semiconductor CorporationQSPI™ and SPI™ are trademarks of Motorola, Inc.© 2012 Texas Instruments Incorporated201064 SNAS257D ADC122S051/ADC122S051Q 2 Channel, 200 ksps to 500 ksps 12-Bit A/D ConverterBlock Diagram20106407Pin Descriptions and Equivalent CircuitsPin No.SymbolDescriptionANALOG I/O5,4IN1 and IN2Analog inputs. These signals can range from 0V to V A .DIGITAL I/O8SCLK Digital clock input. This clock directly controls the conversion and readout processes.7DOUT Digital data output. The output samples are clocked out of this pin on falling edges of the SCLK pin.6DIN Digital data input. The ADC122S051/ADC122S051Q's Control Register is loaded through this pin on rising edges of the SCLK pin.1CSChip select. On the falling edge of CS, a conversion process begins. Conversions continue as long as CS is held low.POWER SUPPLY2V A Positive supply pin. This pin should be connected to a quiet +2.7V to +5.25V source and bypassed to GND with a 1 µF capacitor and a 0.1 µF monolithic capacitor located within 1 cm of the power pin.3GNDThe ground return for the die. 2A D C 122S 051/A D C 122S 051QAbsolute Maximum Ratings (Note 1, Note 2)If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.Analog Supply Voltage VA−0.3V to 6.5VVoltage on Any Pin to GND−0.3V to VA+0.3V Input Current at Any Pin (Note 3)±10 mA Package Input Current (Note 3)±20 mAPower Consumption at TA= 25°C See (Note 4)ESD Susceptibility (Note 5) Human Body ModelMachine ModelCharged Device Model 2500V 250V 500VJunction Temperature+150°C Storage Temperature−65°C to +150°C Operating Ratings (Note 1, Note 2) Operating Temperature Range−40°C ≤ T A≤ +85°C VASupply Voltage+2.7V to +5.25V Digital Input Pins Voltage Range−0.3V to V A Clock Frequency50 kHz to 16 MHz Analog Input Voltage0V to V A Package Thermal ResistancePackageθJA8-lead MSOP250°C / WS o ldering pr o cess must c o mply with Nati o nal Semiconductor's Reflow Temperature Profile specifications. Refer to /packaging. (Note 6)ADC122S051/ADC122S051Q Converter Electrical Characteristics (Note 9)The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK= 3.2 MHz to 8 MHz, fSAMPLE= 200 ksps to 500 ksps,C L = 35 pF unless otherwise noted. Boldface limits apply for TA= TMINto TMAX: all other limits TA= 25°C.Symbol Parameter Conditions TypicalLimits(Note 7)UnitsSTATIC CONVERTER CHARACTERISTICSResolution with No Missing Codes12Bits INL Integral Non-Linearity±0.5±1.1LSB (max)DNL Differential Non-Linearity +0.7 1.3LSB (max)−0.4−1.0LSB (min)VOFFOffset Error+0.3±1.3LSB (max) OEM Channel to Channel Offset Error Match±0.1±1.0LSB (max) FSE Full Scale Error−0.5±1.5LSB (max)FSEM Channel to Channel Full-Scale ErrorMatch+0.01±1.0LSB (max)DYNAMIC CONVERTER CHARACTERISTICSSINAD Signal-to-Noise Plus Distortion Ratio VA= +2.7 to 5.25VfIN= 40.2 kHz, −0.02 dBFS7269.2dB (min)SNR Signal-to-Noise Ratio VA= +2.7 to 5.25VfIN= 40.2 kHz, −0.02 dBFS72.570.6dB (min)THD Total Harmonic Distortion VA= +2.7 to 5.25VfIN= 40.2 kHz, −0.02 dBFS−84−75dB (max)SFDR Spurious-Free Dynamic Range VA= +2.7 to 5.25VfIN= 40.2 kHz, −0.02 dBFS8676dB (min)ENOB Effective Number of Bits V A = +2.7 to 5.25V11.711.2Bits (min)Channel-to-Channel Crosstalk VA= +5.25VfIN= 40.2 kHz−86dBIMD Intermodulation Distortion, SecondOrder TermsVA= +5.25V,fa= 40.161 kHz, fb= 41.015 kHz−87dB Intermodulation Distortion, Third OrderTermsVA= +5.25Vfa= 40.161 kHz, fb= 41.015 kHz−88dBFPBW-3 dB Full Power Bandwidth VA= +5V11MHzVA= +3V8MHzADC122S051/ADC122S051QSymbol Parameter Conditions TypicalLimits (Note 7)UnitsANALOG INPUT CHARACTERISTICS V IN Input Range 0 to V A V I DCL DC Leakage Current±0.02±1µA (max)C INAInput CapacitanceTrack Mode 33pF Hold Mode 3 pF DIGITAL INPUT CHARACTERISTICS V IH Input High Voltage V A = +5.25V 2.4 V (min)V A = +3.6V 2.1V (min)V IL Input Low Voltage0.8 V (max)I IN Input CurrentV IN = 0V or V IN = V A ±0.02±10µA (max)C INDDigital Input Capacitance24pF (max)DIGITAL OUTPUT CHARACTERISTICS V OH Output High Voltage I SOURCE = 200 µA V A − 0.03V A − 0.5V (min)I SOURCE = 1 mA V A − 0.10 V V OL Output Low VoltageI SINK = 200 µA 0.020.4V (max)I SINK = 1 mA 0.1 V I OZH , I OZL TRI-STATE® Leakage Current 0.005±1µA (max)C OUT TRI-STATE® Output Capacitance 24pF (max)Output CodingStraight (Natural) BinaryPOWER SUPPLY CHARACTERISTICS (C L = 10 pF)V AAnalog Supply Voltage2.7V (min)5.25V (max)I ASupply Current, Normal Mode (Operational, CS low)V A = +5.25V,f SAMPLE = 500 ksps, f IN = 40 kHz 1.9 2.4mA (max)V A = +3.6V,f SAMPLE = 500 ksps, f IN = 40 kHz 0.84 1.2mA (max)Supply Current, Shutdown (CS high)V A = +5.25V,f SAMPLE = 0 ksps 60nA V A = +3.6V,f SAMPLE = 0 ksps 38nAP DPower Consumption, Normal Mode (Operational, CS low)V A = +5.25V 1012.6mW (max)V A = +3.6V 3.0 4.3mW (max)Power Consumption, Shutdown (CS high)V A = +5.25V 0.32µW V A = +3.6V0.14µWAC ELECTRICAL CHARACTERISTICS f SCLK Maximum Clock Frequency (Note 8) 3.2MHz (min)8MHz (max)f S Sample Rate (Note 8) 200ksps (min)500ksps (max)t CONV Conversion Time13SCLK cycles DC SCLK Duty Cyclef SCLK = 8 MHz 5030% (min)70% (max)t ACQ Track/Hold Acquisition Time Full-Scale Step Input3SCLK cyclesThroughput TimeAcquisition Time + Conversion Time16SCLK cycles 4A D C 122S 051/A D C 122S 051QADC122S051/ADC122S051Q Timing SpecificationsThe following specifications apply for V A = +2.7V to 5.25V, GND = 0V, f SCLK = 3.2 MHz to 8 MHz, f SAMPLE = 200 ksps to 500 ksps,C L = 35 pF, Boldface limits apply for T A = T MIN to T MAX : all other limits T A = 25°C.Symbol ParameterConditionsTypical Limits (Note 7)Units t CSU Setup Time SCLK High to CS Falling Edge (Note 10)V A = +3.0V −3.510ns (min)V A = +5.0V −0.5t CLH Hold time SCLK Low to CS Falling Edge (Note 10)V A = +3.0V +4.510ns (min)V A = +5.0V +1.5t EN Delay from CS Until DOUT activeV A = +3.0V +430ns (max)V A = +5.0V +2t ACC Data Access Time after SCLK Falling Edge V A = +3.0V +14.530ns (max)V A = +5.0V+13t SU Data Setup Time Prior to SCLK Rising Edge +310ns (min)t H Data Valid SCLK Hold Time +310ns (min)t CH SCLK High Pulse Width 0.5 x t SCLK 0.3 x t SCLK ns (min)t CLSCLK Low Pulse Width0.5 x t SCLK 0.3 x t SCLK ns (min)t DISCS Rising Edge to DOUT High-ImpedanceOutput FallingV A = +3.0V 1.820ns (max)V A = +5.0V 1.3Output RisingV A = +3.0V 1.0V A = +5.0V 1.0Note 1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.Note 2:All voltages are measured with respect to GND = 0V, unless otherwise specified.Note 3:When the input voltage at any pin exceeds the power supply (that is, V IN < GND or V IN > V A ), the current at that pin should be limited to 10 mA. The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the V A pin. The current into the V A pin is limited by the Analog Supply Voltage specification.Note 4:The absolute maximum junction temperature (T J max) for this device is 150°C. The maximum allowable power dissipation is dictated by T J max, the junction-to-ambient thermal resistance (θJA ), and the ambient temperature (T A ), and can be calculated using the formula P D MAX = (T J max − T A )/θJA . The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.Note 5:Human body model is 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is 220 pF discharged through zero ohms Note 6:Reflow temperature profiles are different for lead-free and non-lead-free packages.Note 7:Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).Note 8:This is the frequency range over which the electrical performance is guaranteed. The device is functional over a wider range which is specified under Operating Ratings.Note 9:Min/max specification limits are guaranteed by design, test, or statistical analysis.Note 10:Clock may be either high or low when CS is asserted as long as setup and hold times t CSU and t CLH are strictly observed.Note 11:PPAP (Production Part Approval Process) documentation of the device technology, process and qualification is available from Texas Instruments upon request.ADC122S051/ADC122S051QTiming Diagrams20106451Operational Timing Diagram20106408Timing Test Circuit20106406Serial Timing Diagram20106450SCLK and CS Timing Parameters 6A D C 122S 051/A D C 122S 051QSpecification DefinitionsACQUISITION TIME is the time required to acquire the input voltage. That is, it is time required for the hold capacitor to charge up to the input voltage.APERTURE DEL AY is the time between the fourth falling SCLK edge of a conversion and the time when the input signal is acquired or held for conversion.CONVERSION TIME is the time required, after the input volt-age is acquired, for the ADC to convert the input voltage to a digital word.CROSSTALK is the coupling of energy from one channel into the other channel, or the amount of signal energy from one analog input that appears at the measured analog input.DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB.DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The specifi-cation here refers to the SCLK.EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as (SINAD − 1.76) /6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits.FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input.FULL SCALE ERROR (FSE) is a measure of how far the last code transition is from the ideal 1½ LSB below V REF + and is defined as:V FSE = V max + 1.5 LSB – V REF +where V max is the voltage at which the transition to the maxi-mum code occurs. FSE can be expressed in Volts, LSB or percent of full scale range.GAIN ERROR is the deviation of the last code transition (111...110) to (111...111) from the ideal (V REF − 1.5 LSB), af-ter adjusting for offset error.INTEGRAL NON-LINEARITY (INL) is a measure of the de-viation of each individual code from a line drawn from negative full scale (½ LSB below the first code transition) through pos-itive full scale (½ LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value.INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two sinusoidalfrequencies being applied to the ADC input at the same time.It is defined as the ratio of the power in the second and third order intermodulation products to the sum of the power in both of the original frequencies. IMD is usually expressed in dB.MISSING CODES are those output codes that will never ap-pear at the ADC outputs. These codes cannot be reached with any input value. The ADC122S051/ADC122S051Q is guar-anteed not to have any missing codes.OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (i.e. GND + 0.5 LSB).SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal at the converter output to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including d.c. or harmonics included in the THD specification.SIGNAL TO NOISE PL US DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral com-ponents below half the clock frequency, including harmonics but excluding d.c.SPURIOUS FREE DYNAMIC RANGE (SFDR) is the differ-ence, expressed in dB, between the desired signal amplitude to the amplitude of the peak spurious spectral component,where a spurious spectral component is any signal present in the output spectrum that is not present at the input and may or may not be a harmonic.TOTAL HARMONIC DISTORTION (THD) is the ratio, ex-pressed in dB or dBc, of the rms total of the first five harmonic components at the output to the rms level of the input signal frequency as seen at the output. THD is calculated aswhere A f1 is the RMS power of the input frequency at the out-put and A f2 through A f6 are the RMS power in the first 5harmonic frequencies. Accurate THD measurement requires a spectrally pure sine wave (monotone) at the ADC input.THROUGHPUT TIME is the minimum time required between the start of two successive conversion. It is the acquisition time plus the conversion and read out times. In the case of the ADC122S051/ADC122S051Q, this is 16 SCLK periods.ADC122S051/ADC122S051QTypical Performance CharacteristicsT A = +25°C, f SAMPLE = 200 ksps to 500 ksps, f SCLK = 3.2 MHz to8 MHz, f IN = 40.2 kHz unless otherwise stated.DNL - V A = 3.0V20106420INL - V A = 3.0V20106421DNL - V A = 5.0V 20106462INL - V A = 5.0V20106463DNL vs. Supply 20106422INL vs. Supply20106423 8A D C 122S 051/A D C 122S 051QDNL vs. Clock Frequency20106424INL vs. Clock Frequency20106425DNL vs. Clock Duty Cycle20106426INL vs. Clock Duty Cycle20106427DNL vs. Temperature20106428INL vs. Temperature20106429ADC122S051/ADC122S051QSNR vs. Supply 20106430THD vs. Supply20106435SNR vs. Clock Frequency 20106431THD vs. Clock Frequency20106436SNR vs. Clock Duty Cycle 20106432THD vs. Clock Duty Cycle20106437 10A D C 122S 051/A D C 122S 051Q分销商库存信息: NATIONAL-SEMICONDUCTORADC122S051CIMM/NOP B ADC122S051CIMMX/NO PB。

VCL2 紧凑导线系统文档说明书

YOUR VISION – OUR SOLUTION3D | EN | Rev.022SAFETY INFORMATIONTo avoid pinching, ensure that the arrangement of the conductor sys-tem and current collectors / tow arms provides a minimum distance of 0.5 m between fixed and mobile plant parts.GENERALThe two-pole compact conductor system VCL2 was developed specifical -ly for various intralogistics applications. With its compact size and dura-bility, the VCL2 possesses the ideal properties for small parts warehouse shuttle applications or for other transfer carriages. Additionally, installing VCL2 is simple due to minimal parts and an easy clip-fastening system.SAFETYThe compact conductor system, VCL2, has been designed according to VDE 0100. It complies with current conductor system safety require-ments and is protected against accidental contact according to VDE 0470, part 1 (protection class IP 2X).The current collectors are protected against contact only if the carbon brushes are fully located in the conductor rails. For conductor rail sys-tems located at arm’s length, where under normal operation the current collectors leave the conductor rails, contact protection must be provided on site, e. g. by means of barriers or by switching off. This, however, only applies to voltages above 25 volts AC or 60 volts DC.Fig. 1 shows that the VDE finger cannot touch live parts. The insulation rail covering the conductor rail offers good insulation for maximum safe -ty. Any number of conductors can be installed side by side at minimum space requirement.Standard rail sections are 4 m long, but short-er sections are available. The ground conduc-tor is yellow, marked with a continuous green stripe at the insulating housing.APPLICATIONFor indoor systems with travel speeds of up to 300 m/min.HANGERSThe maximum support distance between the hangers is 0.8 m.JOINTSJoints are used for the electrical and mechanical connection of the con-ductor rail sections. Every joint is protected against contact with a joint capAPPROVALSUL approval in preparation.EXPANSIONSystem lengths of up to 150 meters can be installed without additional expansion sectons.FEEDSThe feeds can be realized as an end feed via the transfer guides or on the line as a line feed.TRANSFER GUIDESTransfer guides are the contact-protected ends of the conductor rails at the end of the lines and mechanical line interruptions (switches, dropout sections, etc.). Transfer guides are available with or without feed capa-bility.CURRENT COLLECTORSThe current collectors are manufactured from impact-resistant plastic and stainless steel parts. The current is drawn via a carbon brush.The length of the current collector connection cable may not exceed 3 m if the downstream overcurrent protection device is not designed to han-dle the capacity of the connection cable. Refer also to DIN VDE 0100, part 430 and DIN EN 60204-32. (Note: this is often the case if more than one collector is used in the system).The cross section of the supplied connecting cables is designed for the stated nominal currents. The reduction factors according to DIN VDE 0298-4 must be observed for the various laying procedures.According to DIN EN 60204-1 and DIN EN 60204-32, the continuity ofthe ground conductor system via sliding contacts must be ensured using suitable measures. As a simple and suitable measure, it is recommend-ed to double the PE current collector.Fig 1: VDE finger3STANDARD DESIGN FOR SHUTTLE APPLICATION48 V DC, 50 AEXAMPLE OF 80 METER LINEFixed end segment Conductor system Conductor systemSliding end segment21 102 2 x end segment ESM-VCL2-100-C-SSD1 x transfer guide with fi xpoint US-VCL2-7-F 1 x transfer guide without fi xpoint US-VCL2-7x conductor system VCL2-100C-4000SSD*incl. 1 piece as fi tting lengthInscribing with dimensions* For applications permanently below 0°C (cold storage), please inquire separately.**C = conductor material copper; F = conductor material galvanized steel ***At phase spacing of 15 mm and frequency of 50 Hz.****VCL2 / 40F max. feed length 100 metersLENGTH4 m standard length,shorter sections are availableSUPPORT SPACING0.8 m for installation in straight runsCONDUCTOR SPACING15 mmAPPLICATIONOnly for indoor systemsVCL2ISOLATING PROFILEElectrical values: Dielectric strength according to DIN 53481Specific resistance according to IEC 60093Surface resistance according to IEC 60093Comparative tracking index according to IEC 60112Servicetemperature*Flammability>22.4 kV/mm>8 x 1015 ohm x cm2 x 1013 ohm x cmCTI > 400–30°C to +55°CFlame-retardant, self-extinguishing, UL 94 V0TypeWeight kg/m Length m Order No. phase Order No. phase + PE VCL2/100C-4000SSD 2.40640281524-VCL2/100C-4000HSC 2.4064-0281534VCL2/40F-4000SSD 2.19040281544-VCL2/40F-4000HSC2.1904-0281554SECTIONTypeConductor cross section ** mm²Creepage distance of insulation mm max. voltage V max. continuous current A Resistance ohm/1000 m Impedance *** ohm/1000 m VCL2/100C 253248 V AC/DC 500 V AC 1000.7210.723VCL2/40F ****253248 V AC/DC 500 VAC403.8443.846CONDUCTOR SYSTEM VALUES5ACCESSORIES VCL2TRANSFER GUIDE **with or without feed(also used as end caps and as a fixpoint in connection with the provided carrier profile)max. vertical and lateral offset ±3 mm to each other,please contact us for greater tolerances,for use as infeed max 50 ampereEND SEGMENT **Application: for line start and end with transfer guideTypeWeight kg/m Length m Order No. phase Order No. phase + PE ESM-VCL2-100C-SSD 0.32410281510-ESM-VCL2-100C-HSC-R *1-0281515ESM-VCL2-100C-HSC-L *1-0281518ESM-VCL2-40F-SSD 0.29710281516-ESM-VCL2-40F-HSC-R *1-0281517ESM-VCL2-40F-HSC-L *1-0281519Type DescriptionWeight kg Order No.VM-VCL2-7Joint connector, plug-in0.0240281559CONNECTING MATERIAL100 Ampere6EXPANSION JOINTmax. current 50ATypeWeight kg/m Straight section length Order No. phase Order No. phase + PE DT-DVCL2/100C-SSD 0.32410281506-DT-DVCL2/100C-HSC 1-0281507DT-DVCL2/40F-SSD 0.29710281508-DT-DVCL2/40F-HSC1-0281509Type Description Weight kg Order No.AH-VCL2-7Support0.0040281520Customer-specific supports on requestLINE FEED *max. current 50 ATypeWeight kg/m Straight section length Order No. phase Order No. phase + PE ES-VCL2/100C-SSD 0.32410281502-ES-VCL2/100C-HSC 1-0281503ES-VCL2/40F-SSD 0.29710281504-ES-VCL2/40F-HSC1-0281505*100 ampere on request**Pre-assembled straight section with connection on request7LOCATING CLAMP *Permissible only for voltages up to 48 voltDRILL TEMPLATEFor fixpoint terminalASSEMBLY SAFETY DEVICEType Description Weight kg Order No.FK-AH-VCL2Locating clamp VCL20.0200281527TypeDescriptionWeight kg Order No.MZ-BS-AH-VCL2Drilling template for fixpoint0.05002815258CURRENT COLLECTORS VCL2CURRENT COLLECTOR SET D-EASSuitable for funnel Phase spacing: 15 mm Max. current: 30 ACURRENT COLLECTOR SET EASLPhase spacing: 15 mm Max. current: 20 ALift ±15 mm, Swifel ±20 mmContact pressure: approx. 4 N per carbon brush HS version with PE current collectorTypeNumber of poles Weight kg Order No.SA-EASL-20-2-SS-0-2-PA-V.E 20.0982823982/00-0SA-EASL-20-2-HS-0-2-2-PA-V.E.2 (PE)0.0982823997/00-0X = +/- 12Y = +/- 201055181529Y X8018153075YXX = +/- 12Y = +/- 20TypeDescription RH/mm Weight kg Order No.SK-EK-DEAS-2/30-PH-32-6.3-H Rear collector brush 0.50.0162808580SK-EK-DEAS-2/30-PH-32-6.3-V Front collector brush 0.50.0162808575SK-EK-DEAS-2/30-PE-36-6.3-H Rear collector brush 0.50.0162808581SK-EK-DEAS-2/30-PE-36-6.3-V Front collector brush 0.50.0162808576SK-EK-EAS-20-PH-36-6.3-PA Collector brush 0.50.0142820750/00-PA SK-EK-EAS-20-PE-36-6.3-HG-PACollector brush0.50.0142820751/00-PAWEAR PARTS FOR CURRENT COLLECTORCOLLECTOR BRUSHES FOR CURRENT COLLECTOREAS DEAS DEASTypeCross section mm 2 A Ø mm Weight kg Order No.Phase black Order No.PE green/yellow AL-WFLA2.5PH1-6.3 2.54.50.038 2 809 179-AL-WFLA2.5PE1-6.30.034-2809183AL-FLA2.5PH1-6.3 2.54.50.078 2 809 171-AL-FLA2.5PE1-6.30.034-2809175AL-FLA4PH2-6.3 4.05.30.064 2 823 085-AL-FLA4PE1-6.30.058-2823086CONNECTING CABLE, DOUBLE INSULATED, FLEXIBLEFor transfer guide with cable lug M5, cable length: 1 m mm 2Phase black PE green/yellow AL-RKLA2.5PH1-M5 2.54.50.0382808971-AL-RKLA2.5PE1-M50.036-2808958AL-RKLA4PH1-M5-HL 4.05.30.0592821809AL-RKLA4PE1-M5-HL 2821810AL-RKLA6PH1-M5-HL 6.06.50.1102808965AL-RKLA6PE1-M5-HL2808967CONNECTING CABLE, DOUBLE INSULATED, FLEXIBLEFor line feed with cable lug M6, cable length: 1 m TypeCross section mm 2 A Ø mm Weight kg Order No.Phase black Order No.PE green/yellow AL-RKLA2.5PH1-M6 2.54.50.038 2 808 979-AL-RKLA2.5PE1-M60.036-2808978AL-RKLA4PH1-M6-HL 4.05.30.058 2 808 751-AL-RKLA4PE1-M60.052-2808752AL-RKLA6PH1-M6 6.06.50.084 2 808 745-AL-RKLA6PE1-M6-HL0.086-2808759WFLAFLATypeWeight kg Order No.Table saw KS 10 6.500165276Spare Blade SB0.070165263MOUNTING HANDLE FOR PLUG-IN JOINT CONNECTORType Weight kg Order No.MZ-MGF1000.0102809348SCREW DRIVER PH1TypeWeight kg Order No.Phillips screwdriver PH 10.0142812963HEXAGON SOCKET SW 4TypeWeight kg Order No.Hexagon screwdriver 4 mm0.0362812962DEBURRING TOOL FLAT BLUNT FILE FSFFor deburring the outside of the conductor rail in case of shorter sections.TypeWeight kg Order No.Flat blunt file FSF 150 x 16 x 40.085281296411QUESTIONNAIRECompany: ___________________________________________________ Date: _______________________________________________________Phone: ______________________________________________________Fax: ________________________________________________________Email: ______________________________________________________ Website: _____________________________________________________1.Number of wiper line systems: _______________________________________________________________________________________________2.Type of crane or device to be fed: ____________________________________________________________________________________________3.Operating voltage: ________ volt Phases: ________frequency: ________ HzThree-phase voltageAC voltageDC voltage4.Line length: ______________________________________________________________________________________________________________5.Number of phase rails: ________ N-rails: ________ Control rails: ________ Ground conductor: ________6.Installation position of the wiper line:Hanging wiper line / current collector cable downwards Hanging wiper line / current collector cable lateral entry (1) Hanging distance ________ m (max. 2 m) Other: _________________________________________________________________________7.Number of cranes or devices in a wiper line system: ____________________________________________________________________________8.Indoor systemOutdoor system9.Special operating conditions (moisture, dust, chemical influences, etc) _____________________________________________________________10.Ambient temperature: ________°C min. ________°C max.11.Position and number of feeds (1): _____________________________________________________________________________________________12.Position and number of disconnecting points (e. g. for repair zones) (1): ______________________________________________________________13.Where is the wiper line to be positioned? (1): ____________________________________________________________________________________14.Screw consoles to be supplied:yesnoD istance middle of carrier – middle of wiper line _____________________________________ Flange width of carrier: ___________________________________________________________15.Travel speed for longitudinal travel: ________ in bends: ________ at transfers: ________16.C urrent consumption of the individual electricity consumers: _____________________________________________________________________(Please use the table below.)17. M ax. voltage drop from conductor rail feed to the current collectors and considering the start-up currents:3 %or ________ % in relation to nominal current.Motor dataCrane/device 1Crane/device 2PowerkWNominal current Start-up current Drive type (2)Power kWNominal current Start-up current Drive type (2)Acos ϕN% dutyAcos ϕAAcos ϕN% dutyAcos ϕALifting device Auxiliary lifting device CarriageTrolley traveling winchPAUL VAHLE GmbH & Co. KGWesticker Str. 5259174 Kamen Germany Phone: +49 2307 704-0*************VAHLE Incorporated 407 Cane Island Pkwy Katy, TX, 77494, USA Phone: +1 713-465-9796 ******************connect with us! @vahleincW 2526140/e n | 0 | R e v .02 | 02/20 |E r r o r s a n d t e c h n i c a l m o d i f i c a t i o n s u b j e c t t o c h a n g e。

cycloneII的中文资料

本科生毕业设计（论文）外文资料译文（ 2011 届）译文题目Cyclone II器件系列的简介论文题目Cyclone II Device Family Data Sheet学生姓名学号专业电子信息科学班级指导教师职称信息科学与工程学院教务科制/literature/hb/cyc2/cyc2_cii51001.pdf 外文资料译文规范说明一、外文资料译文：Cyclone II器件系列简介关键词：cyclone II器件；特点；简介；在非常成功的第一代Cyclone器件系列之后，Altera的Cyclone II FPGA系列扩大低成本的FPGA的密度，最多达68，416个逻辑单元（LE），提供622个可用的输入/输出引脚和1.1M比特的嵌入式寄存器。

Cyclone II器件的制造基于300毫米晶圆，采用台积电90nm、低K值电介质工艺，这种工艺技术是使用低绝缘体过程以确保了快速有效性和低成本。

通过使硅片面积最小化，Cyclone II器件可以在单芯片上支持复杂的数字系统，而在成本上则可以和ASIC竞争。

不像其他用电力功耗和性能来换取低成本的FPGA卖主，Altera 最新一代低价位的FPGA——cyclone II FPGA系列，和同类90nmFPGA器件相比，它提高了百分之六十的性能和降低了一半的功耗。

低成本和优化特征使Cyclone II FPGA系列为各种各样的汽车、消费、通讯、视频处理、测试与测量、和其他最终市场提供理想的解决方案。

在参考设计、系统图,和IP,使用cyclone II FPGA系列可以帮助你迅速实现最总市场方案开发。

低成本的嵌入式解决方案Cyclone II 器件支持Nio s II 嵌入式处理器，能够自己完成自定义的嵌入式处理器。

Cyclone II器件还能够扩展各种外部存储器和I/O口或者嵌入式处理器的性能。

单个或多个NiosII嵌入式系统中嵌入式处理器也可以设计成cyclone II设备以提供一些额外的同时处理的能力或者甚至取代已经在你的系统中存在的嵌入式处理器。

LCB软件资料

0
DRIVE
0-18
16
驱动类型
1
C-TYPE
0-3
3
控制柜类型
2
1AT
100ms
0-255
5
1A时间
3
2AT
100ms
0-255
5
2A时间
4
DDP
1s
0-255
32
DDP时间（快速）
5
3P
1s
0-255
32
DDP时间（慢速）
6
SPEED
cm/s
25-250
100
25,40,63,100,160,175,250
下方向延时时间
6
T-BASE
0,1
0
"0":100ms-units "1":4ms-units
基本时间单位
7
IPU-D
T-BASE
0-255
0
上脉冲延时
8
IPD-D
T-BASE
0-255
0
下脉冲延时
9
1LS-D
T-BASE
0-255
0
1LS延时
10
2LS-D
T-BASE
0-255
0
2LS延时
11
EN-RLV
4msunits基本时间单位上脉冲延时下脉冲延时1ls延时2ls延时允许再平层再平层操作类型再平层操作次数上再平层时间dis丢失789102lsd11enrlv12rlvty13rlcnt14rldis15rluisipudipdd1lsdtbasetbasetbasetbase02550255025502550255010100001032552554msforhydraulicdrives100ms02554100ms0255otherwise100ms下再平层时间uis丢失上再平层延时时间下再平层延时时间16rlud17rldd4ms4ms025502550007cargoparameterssvtkeysequencem1317goon01234camodbitbotmvutmvdt4ms4ms4ms4ms02025502550255025500000载重模式5pls4t4ms0255008emergencyparameterssvtkeysequencem1318goon紧急参数012345678910efomp11efompt12efosd13aslp14efsty15efsdo16efsini17efscld18efsopd19efsex20efsrt21efsrc22efilt23enbak24hdwpos25epop26epodc27epodo28epopr29eqo30epstyp31ehstestypeslrcuesslowefopefoncefodcefodoefoopefondgeforev100ms025503001急停类型efo操作楼层efo操作关门时间efo操作开门时间消防备用楼层efs类型efs开门类型断电消防记忆硬件位置参考epo楼层epo关门时间epo开门时间epo优先efoefseqo操作类型特别优先服务类型ehs退出时间1s01031255001025502030102070600303125525501002031063015030000000001s100ms0255200000000001s06301501030322552550255020101025502550000001s09securityparameterssvtkeysequencem1319goon安全参数0123456enfpdenististpencroenhcroemssecgcbtyp0106

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Leakage Current (mA) 0.66 0.73 0.73 0.79 0.79 0.87 0.87 0.87 0.95 0.95 0.95 1.04 1.04 1.04 1.15 1.15 1.15 1.15 1.27 1.27 1.27 1.27 1.39 1.39 1.39 1.55 1.55 1.70 1.70 1.88 2.09
The other terminal is also available upon request. Please refer to page 197 for schematic of dimensions.
Frequency coefficient of rated ripple current
Frequency (Hz) 160~ 250V 400~ 450V 50 0.81 0.77 60 0.85 0.82 120 1.00 1.00 300 1.17 1.16 1k 1.32 1.30 10k 1.45 1.41 50k~ 1.50 1.43 Coeff.
Marking
Printed with white color letter on black sleeve.
Drawing
Bottom plate (code HL only) Polarity bar Sleeve (P.E.T.)
Type numbering system ( Example : 400V 270µF)
Minimum order quantity : 50pcs.
Dimension table in next page.
CAT.8100S
元器件交易网 ALUMINUM ELECTROLYTIC CAPACITORS
LU
Cap.(µF) 0330 0390 0470
series
1230 1770 1420 1840 1840 1910 1910 2080 2150 2250 2250 2500 2500 2460 2750 2750 2750 2600 2800 2860 3000 2800 3460 3380 3320 3900 3830 4330 4320 4800 5050
160 ~ 250 3 12
400 ~ 450 8 —
Endution of DC voltage (in the range of rated DC voltage even after over-lapping the specified ripple current) for 3000 hours at 85°C, capacitors meet the characteristic requirements listed at right.
4.0±0.5
10± 0.1
2.5
EL 2-2φ ±0.1 (PC board hole dimensions) 1.5 +0.2 -0.1 (Terminal dimensions)
HL
Please contact to us if other configurations are required.
Dimensions
160V (2C) Size φD × L(mm) 20 × 25 20 × 30 22 × 25 20 × 35 22 × 30 25 × 25 20 × 40 22 × 30 25 × 25 22 × 35 25 × 30 30 × 25 22 × 40 25 × 35 30 × 25 22 × 45 25 × 40 30 × 30 35 × 25 25 × 45 30 × 35 35 × 25 25 × 50 30 × 40 35 × 30 30 × 45 35 × 35 30 × 50 35 × 40 35 × 45
Withstanding 3000 hours application of ripple current at 85°C. Higher production efficiency due to 4.0mm long terminal.
LU
Smaller
LS
Specifications
Item Performance Characteristics
400 0.15 450 0.20
160 0.15
180 0.15
200 0.15
250 0.15
Measurement frequency : 120Hz
Stability at Low Temperature
Rated voltage(V) Impedance ratio ZT/Z20 (MAX.) Z—25°C/ Z+20°C Z—40°C/ Z+20°C
(mA)
tan δ 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15
After leaving capacitors under no load at 85°C for 1000 hours, they meet the requirements listed at right.
Capacitance change tan δ Leakage current
Within ±15% of initial value 150% or less of initial specified value Initial specified value or less
0560
0680
0820
1000
1200
1500 1800 2200 2700
1220 1550 1550 1810 1770 1770 2040 2110 2110 2250 2250 2220 2500 2750 2500 2750 2860 2900 2900 3270 3300 3100 3600 3770 3600 4200 4100 4700 4700 4780
Capacitance change tan δ Leakage current
Within ± 20% of initial value 200% or less of initial specified value Initial specified value or less
Shelf Life
Rated ripple
180V (2Z) Leakage Current (mA) 0.68 0.74 0.74 0.82 0.82 0.82 0.89 0.89 0.89 0.98 0.98 0.98 1.08 1.08 1.08 1.20 1.20 1.20 1.20 1.31 1.31 1.31 1.46 1.46 1.46 1.60 1.60 1.77 1.77 1.97 Code LLU2C331MELY LLU2C391MELY LLU2C391MELZ LLU2C471MELY LLU2C471MELZ LLU2C471MELA LLU2C561MELY LLU2C561MELZ LLU2C561MELA LLU2C681MELZ LLU2C681MELA LLU2C681MELB LLU2C821MELZ LLU2C821MELA LLU2C821MELB LLU2C102MELZ LLU2C102MELA LLU2C102MELB LLU2C102MELC LLU2C122MELA LLU2C122MELB LLU2C122MELC LLU2C152MELA LLU2C152MELB LLU2C152MELC LLU2C182MELB LLU2C182MELC LLU2C222MELB LLU2C222MELC LLU2C272MELC Cap.(µF) 0270 0330 0390 0470 Size φD × L (mm) 20 × 25 20 × 30 22 × 25 20 × 30 22 × 25 20 × 35 22 × 30 25 × 25 20 × 40 22 × 35 25 × 30 22 × 40 25 × 30 30 × 25 22 × 45 25 × 35 30 × 30 35 × 25 22 × 50 25 × 40 30 × 35 35 × 25 25 × 50 30 × 35 35 × 30 30 × 45 35 × 35 30 × 50 35 × 40 35 × 45 35 × 50
0560
0680
0820
1000
1200 1500 1800 2200 2700
In case of Sn-Pb lead finishing · PVC sleeve contain Pb product, H L will be put at 10th and 11th digit of code.
160 ~ 450V 56 ~ 2700µF
±20% at 120Hz, 20°C I
3 CV (µA) (After 5 minutes' application of rated voltage)
Rated voltage (V) tan δ (MAX.)
[C : Rated Capacitance (µF) V : Voltage(V)] Measurement frequency :120Hz, Temperature : 20°C
Code LLU2Z271MELY LLU2Z331MELY LLU2Z331MELZ LLU2Z391MELY LLU2Z391MELZ LLU2Z471MELY LLU2Z471MELZ LLU2Z471MELA LLU2Z561MELY LLU2Z561MELZ LLU2Z561MELA LLU2Z681MELZ LLU2Z681MELA LLU2Z681MELB LLU2Z821MELZ LLU2Z821MELA LLU2Z821MELB LLU2Z821MELC LLU2Z102MELZ LLU2Z102MELA LLU2Z102MELB LLU2Z102MELC LLU2Z122MELA LLU2Z122MELB LLU2Z122MELC LLU2Z152MELB LLU2Z152MELC LLU2Z182MELB LLU2Z182MELC LLU2Z222MELC LLU2Z272MELC