IPC标准一览表

IPC标准、文件一览表
Updated May 24, 2000
IPC DOC # (IPC文件号) TITLE
名称
PUBLICATION/
REVISION DATES
出版/修订日期
Roadmap (指南)National Technology Roadmap for Electronic
Interconnections
(美国国家电子互联技术指南)
6/95 (orig. pub.)
SMC-TR-
001SMT An Introduction to Tape Automated Bonding & Fine
Pitch Technology(TAB和细间距SMT介绍)
1/89 (orig. pub.)
J-STD-001代替IPC-S-815Requirements for Soldered Electrical and Electronic
Assemblies
(电气、电子组件焊接技术要求)
4/92 (orig. pub.)
Revision: A 1/95
Amendment 1: 3/96
Revision B: 10/96
Revision C: 3/00
IPC-HDBK-001Handbook and Guide to the Requirements for Soldered
Electrical and Electronic Assemblies to Supplement J-
STD-001B
(J-STD-001B学习辅导书)
3/98 (orig. pub.)
J-STD-002代替IPC-S-805Solderability Tests for Component Leads,Terminations,
Lugs, Terminals and Wires (元件引线,焊端,接线端和导
线的可焊性
测试)
4/92 (orig. pub.)
A 10/98
J-STD-003
代替IPC-S-804Solderability Tests for Printed Boards(印制板可焊性测
试)
4/92 (orig. pub.)
Revision A: In process
J-STD-004
代替IPC-SF-818Requirements for Soldering Fluxes(助焊剂技术要求)
1/95 (orig. pub.)
Amendment 1 - 4/96
Revision A: In process
J-STD-005
代替IPC-SF-819Requirements for Soldering Pastes(焊膏技术要求)
1/95 (orig. pub.)
Amendment 1 - 1/95
J-STD-006Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic
Soldering Applications 1/95 (orig. pub.) Amendment 1 - 6/96 Revision A: In process
(电子级固态焊料技术要求)
J-STD-012
Implementation of Flip Chip and Chip Scale Technology
(FC和CSP器件的安装)
1/96 (orig. pub.)
J-STD-013Implementation of Ball Grid Array and Other High
Density Technology(BGA和HDI器件的安装)
7/96 (orig. pub.)
IPC-DRM-
18Component Identification Desk Reference Manual
(元器件封装辨认手册)
9/95 (orig. pub.)
Revision A: 4/96
Revision B: 2/97
Revision C: 7/98
J-STD-020Moisture/Reflow Sensitivity Classification of Plastic
Surface Mount Devices(塑封表面器件对潮湿和再流焊
的敏感度要求)
October 1996 (orig.
pub.)
Revision A: 3/99
IPC-DRM-
40Through-Hole Solder Joint Evaluation Desk Reference Manual
(通孔引线焊点评估参考手册)
IPC-DRM-
SMT Surface Mount Solder Joint Evaluation Desk Reference Manual
(表面组装焊点评估参考手册)
8/98
IPC-T-50Terms and Definitions Interconnecting and Packaging
Electronic Circuits(电子电路互连及封装术语和定义)
8/75 (orig. pub.)
A - 8/76
B - 6/80
C - 3/85
D - 11/88
E - 7/92
F - 6/96
IPC-SC-60Post Solder Solvent Cleaning Handbook (焊后溶剂清洗
手册)
4/87 (orig. pub.)
Revision A: In process
IPC-SA-61
Post-Solder Semi-Aqueous Cleaning Handbook
(焊后半水清洗手册)
7/95 (orig. pub.)
IPC-AC-62Post Solder Aqueous Cleaning Handbook (焊后水清洗手
册)
12/86 (orig. pub.)
IPC-CH-65
Guidelines for Cleaning of Printed Boards and Assemblies
(印制板及其组件清洗导则) 12/90 (orig. pub.) Revision A: In process
IPC-CS-70Guidelines for Chemical Handling Safety in Printed Board Manufacturing(印制板制造化学处理安全准则)
8/88 (orig. pub.)
IPC-CM-
78
被IPC-SM-780替
代Guidelines for Surface Mounting and Interconnecting
Chip Carriers
11/83 (orig. pub.)
C - 3/88
IPC-MP-
83
IPC Policy on Metrication(IPC公制化导则) 8/85 (orig. pub.)
IPC-PC-90General Requirements for Implementation of Statistical
Process Control(实施SPC的总技术规范)
10/90 (orig. pub.)
IPC-QS-95General Requirements for Implementation of ISO 9000
Quality Systems(实施ISO 9000质量体系的总技术规
范)
4/93 (orig. pub.)
IPC-L-108
被IPC-4101替代Specification for Thin Metal Clad Base Materials for
Multilayer Printed Boards
3/76 (orig. pub.)
A 10/80
B 6/90
IPC-L-109
被IPC-4101替代Specification for Resin Impregnated Fabric (Pregreg) for
Multilayer Printed Boards
3/76 (orig. pub.)
A 10/80
B 7/92
IPC-L-110 (已作废)Preimpregnated, B-Stage Epoxy-Glass Cloth for
Multilayer Printed Cicuit Boards
A
IPC-CC-
110 被IPC-4121替代Guidelines for Selecting Core Constructions for
Multilayer Printed Wiring Board Applications
1/94 (orig. pub.)
Revision A: 12/97
IPC-L-112 被IPC-4101替代Specification for Composite Metal Clad Base materials for
Printed Boards
7/81 (orig. pub.)
A 6/92
IPC-L-115 被IPC-4101替代Specification for Rigid Metal Clad Base Materials for
Printed Boards
3/77 (orig. pub.)
A 10/80
B 4/90
IPC-L-120 (己作废)Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates
IPC-L-125Specifications for Plastic Substrates Clad or Unclad for
High Speed/High Frequency Interconnections
(高速/高频塑性基板特性规范)
8/83 (orig. pub.)
A 7/92
IPC-L-130
(已作废)被IPC-L-108替代Specificaitons for Thin Laminates, Metal Clad, Primarily
for General-Purpose Multilayer Printed Boards
1/77 (orig. pub.)
IPC-EG-
140Specification for Finished Fabric Woven from "E" Glass
for Printed Boards("E"纤维织物印制板特性规范)
3/88 (orig. pub.)
A 6/97*
IPC-SG-
141Specification for Finished Fabric Woven from "S" Glass
for Printed Boards ("S"纤维织物印制板特性规范)
2/92 (orig. pub.)
IPC-A-142Specification for Finished Fabric Woven from Aramid for
Printed Boards(Aramid纤维织物印制板特性规范)
6/90 (orig. pub.)
IPC-QF-
143General Specification for Finished Fabric Woven from
Quartz (Pure Fused Silica) for Printed Boards
(石英纤维织物印制板特性规范)
2/92 (orig. pub.)
IPC-CF-
148Resin Coated Metal for Printed Boards (印制板涂树脂金
属箔)
6/90 (orig. pub.)
A 9/98
IPC-MF-
150Metal Foil for Printed Wiring Applications
(印制线路金属箔)
8/66 (orig.pub.)
A 9/67
B 2/71
C 8/74
D 3/76
E 5/81
F 10/91 , 8/92
G 5/99
IPC-CF-
152Composite Metallic Material Specification for Printed
Wiring Boards (印制板复合金属材料特性规范)
6/90 (orig. pub.)
A 1/94
B 3/98
IPC-FC-
203 (已作废)Specification for Flat Cable, Round Conductor, Ground
Plane
7/85 (orig. pub.)
IPC-FC-
210 (已作废)Performance Specification for Flat-Conductor
Undercarpet Power Cable (Type FCC)
9/85 (orig. pub.)
IPC-FC-
213 (已作废)Performance Specification for Flat Undercarpet Telephone
Cable
9/84 (orig. pub.)
IPC-FC-
217 (已作废)General Document for Connectors, Electric, Header,
Receptacle,Insulation Displacement for Use with Round
Conductor Flat Cable
8/82 (orig. pub.)
Reaffirmed 4/90
IPC-FC-
218B/ EIA-RS-
429 (已作废)General Specification for Connectors, Electrical Flat
Cable Type
7/76 (orig. pub.)
Reaffirmed 11/81
Reaffirmed 05/91
IPC-FC-
219Environment Sealed Flat Cable Connectors for use in
(已作废)Aerospace Applications 5/84 (orig. pub.) IPC-FC-
220 (已作废)Specification for Flat Cable, Flat Conductor, Unshielded
orig. pub 5/70
A 1/74
B 8/75
C 7/85
IPC-FC-
221 (已作废)Specification for Flat-Copper Conductors for Flat Cables
8/75 (orig. pub.)
A 5/84
IPC-FC-
222 (已作废)Specification of Flat Cable Round Conductor, Unshielded
6/80 (orig. pub.)
5/91 Reaffirmed
IPC-FC-
225 (已作废)Flat Cable Design Guide
8/75 (orig. pub.)
10/85 Reaffirmed
IPC-FC-
231Flexible Base Dielectrics for Use in Flexible Printed
Wiring
(柔性印制线路的绝缘基材)
orig. pub. 7/74
A 5/83
B 2/86
C 4/92
Amendment 10/95
IPC-FC-
232 代替IPC-FC-233A Adhesive Coated Dielectric Films for Use as Cover Sheets
for Flexible Printed Wiring and Flexible Bonding Films
(柔性电路绝缘涂覆胶粘剂)
7/74 (orig. pub.)
A 5/83
B 2/86
C 4/92
Amendment 10/95
IPC-FC-
233 (作废)-
Incorporated into IPC-
FC-232B
IPC-FC-
241 Flexible Metal-Clad Dielectrics for Use in Fabrication of
Flexible Printed Wiring(柔性印制电路镶嵌金属夹层的
绝缘基材)
7/74 (orig. pub.)
A 5/83
B 2/86
C 4/92
Amendment 10/95
IPC-RF-
245
被IPC-
6013
替代
Performance Specification for Rigid-Flex Printed Boards 4/87 (orig. pub.) IPC-D-249
被IPC-2223替代Design Standard for Flexible Single-and Double-Sided
Printed Boards
1/87 (orig. pub.)
IPC-FC-250A
被IPC-6013替代Specification for Single - and Double-Sided Flexible
Printed Wiring
9/86 (orig. pub.)
A 9/86
IPC-FA-
251Guidelines for Single and Double Sided Flex Circuits
(单、双面柔性电路指南)
2/92 (orig. pub.)
IPC-D-275 被IPC-
2221 and 2222替代Design Standard for Rigid Printed Boards and Rigid
Printed Board Assemblies
9/91 (orig. pub.)
Amend.1 4/96
IPC-RB-
276
被IPC-6011 和IPC-6012
替代Qualification and Performance Specification for Rigid
Printed Boards
3/92 (orig. pub.)
IPC-D-279Design Guidelines for Reliable Surface Mount
Technology Printed Board Assemblies
(可靠的印制板SMT设计指南)
7/96 (orig. pub.)
IPC-D-300
Printed Board Dimensions and Tolerances
(印制板的尺寸和容差) 8/60 (orig. pub.)
A 7/61
B 1/64
C 10/65
D 1/70
E 10/70
F 11/74 Editorial revision
G 1/84
IPC-D-310Guidelines for Phototool Generation and Measurement
Techniques (照相底板生成和测量技术指南)
9/69 (orig. pub.)
A 12/77
B 12/85
C 06/91
IPC-A-311Process Control Guidelines for Phototool Generation and
Use
(照相底板生成和使用过程的控制指南)
3/96 (orig. pub.)
IPC-D-316Design Guide for Microwave Circuit Boards Utilizing Soft
Substrates (软质基材的微波电路设计指南)
5/95 (orig. pub.)
IPC-D-317Design Guidelines for Electronic Packaging Utilizing
High-Speed Techniques(电子封装用于高速技术的设计
指南)
4/90 (orig. pub)
A 1/95
IPC-HF-
318
被IPC-6018替代Microwave End Product Board Inspection and Test
6/85 (orig. pub.)
A 12/91
IPC-D-319 (作废)Design Standard for Rigid Single-and Double-Sided
Printed Boards
1/87 (orig. pub.)
superseded by IPC-D-
275
IPC-D-
320A (作废)Printed Board, Rigid, Single- and Double-Side, End
Product Standard
1/77 (orig. pub.)
A 3/81
IPC-SD-320B (作废)Performance Specification for Rigid Single- and Double-
Sided Printed Boards
(incorporates/supersedes
IPC-TC-500
superseded by IPC-RB-
276
1/77 (orig. pub.)
A 3/81
B 11/86
IPC-D-322Guidelines for Selecting Printed Wiring Board Sizes
Using Standard Panel Sizes(拼板中印制板迭用尺寸指
南)
8/84 orig. pub.
Reaffirmed 9/91
IPC-MC-
324Performance Specifications for Metal Core Boards
(金属芯电路板性能规范)
10/88 (orig. pub.)
IPC-D-325Documentation Requirements for Printed Boards,
Assemblies and Support Drawings (印制板、组件和支撑
件图纸文件要求)
1/87 (orig. pub.)
A 5/95
IPC-D-326Information Requirements for Manufacturing Printed
Board Assemblies(印制板组装制造的文件资料要求)
4/91 (orig. pub.)
IPC-D-330Design Guide Manual(设计指导手册)
IPC-PD-
335
(作废)
Electronic Packaging Handbook 12/89 (orig. pub.)
IPC-NC-
349Computer Numerical Control Formatting for Drillers and
Routers
(钻孔和布线器的计算机控制数据格式)
8/85 (orig. pub.)
IPC-D-350
Printed Board Description in Digital Form
(印制板的数字化表述) 8/72 (orig. pub.)
A 2/75
B 8/77
C 10/85 Reaffirmed
D
7/92 Technical Content Identical to IEC-1182-1
IPC-D-351
Printed Board Drawings in Digital Form
(印制板图形的数字化表述)
8/85 (orig. pub.)
IPC-D-352Electronic Design Data Description for Printed Boards in
Digital Form (印制板电子设计数椐的数字化表述)
8/85 (orig. pub.)
IPC-D-354Library Format Description for Printed Boards in Digital
Form
(印制板文件格式的数字化表述)
2/87 (orig. pub.)
IPC-D-355
Printed Board Assembly Description in Digital Form
(印制板组件的数字化表述)
1/95 (orig. pub.)
IPC-D-356
Bare Board Electrical Test Information in Digital Form
(印制裸板电测信息的数字化表述) 3/92 (orig. pub.)
A 1/98
IPC-AM-
361 (作废)Specification for Rigid Substrates for Additive Process
Printed Boards
1/82 (orig. pub.)
IPC-MB-
380Guidelines for Molded Interconnection Devices
(模制器件互连指南)
10/90 (orig. pub.)
IPC-D-390Automated Design Guidelines(自动设计指南) 7/74 (orig. pub.)
A 2/88
IPC-C-406Design and Application Guidelines for Surface Mount
Connectors (表面组装连接器设计和应用指南)
1/90 (orig. pub.)
IPC-CI-408Design and Application Guidelines for the Use of
Solderless Surface Mount Connectors
(非焊接表面组装连接器设计和应用指南)
1/94 orig. pub.
IPC-BP-General Specification for Rigid Printed Board Backplanes
with Press-Fit Contacts 10/80 (orig. pub.)
421(带压接连接器的刚性印制背板通用技术规范) Reaffirmed 4/90
IPC-D-422Design Guide for Press Fit Rigid Printed Board
Backplanes
(刚性压接印制背板设计指南)
9/82 (orig. pub.)
IPC-DW-
424General Specification for Encapsulated Discrete Wire
Interconnection Boards
(印制板分立包皮导线互连通用技术规范)
1/95 (orig. pub.)
IPC-DW-
425Design and End Product Requirements for Discrete
Wiring Boards(分立线路板设计和成品技术规范)
9/82 (orig. pub.)
A 5/90
IPC-DW-
426Specifications for Assembly of Discrete Wiring
(分立线路组装技术规范)
12/87 (orig. pub.)
IPC-TR-
460Trouble-Shooting Checklist for Wave Soldering Printed
Wiring Boards (印制板波峰焊故障检查表)
1973 (orig. pub)
A 2/84
IPC-TR-
461Solderability Evaluation of Thick and Thin Fused
Coatings
(厚、薄热涂层的可焊性评估)
3/79 (orig. pub.)
IPC-TR-
462Solderability Evaluation of Printed Boards with Protective
Coatings Over Long Term Storage
(具有持效保护涂层的印制板可焊性评估)
10/87 (orig. pub.)
IPC-TR-
464Accelerated Aging for Solderability Evaluations
(可焊性的加速老化评估)
orig. pub.4/84
A 12/87
IPC-TR-465-1Round Robin Test on Steam Ager Temperature Control Stability
(恒温蒸汽老化的联合测试报告)
1993
IPC-TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Results
(蒸汔老化时间和温度对可焊性测试结果的影响)
1993
IPC-TR-465-3Evaluation of Steam Aging on Alternative Finishes, Phase
IIA
( 对不同处理剂的蒸汽老化评估,Phase IIA)
7/96
IPC-TR-
466Wetting Balance Standard Weight Comparison Test
(润湿平衡标准称重比较测试)
4/95 (orig. pub.)
IPC-TR-
467Supporting Data and Numerical Examples for ANSI/J-
STD-001 Appendix D(ANSI/J-STD-001附件D的支持数
据和数字举例)
10/96 (orig. pub.)
IPC-TR-
468Factors Affecting Insulation Resistance Performance of
Printed Boards(印制板绝缘电阻的影响因素)
3/79 (orig. pub.)
IPC-TR-
470Thermal Characteristics of Multilayer Interconnection
Boards
(多层互连板的热特性)
1/74 (orig. pub.)
IPC-TR-
474An Overview of Discrete Wiring Techniques(分立线路综
观)
3/79 (orig. pub.)
Reprint 1984
IPC-TR-
476How to Avoid Metallic Growth Problems on Electronic
Hardware(如何避免电子硬件的合金化生长)
9/77 (orig. pub.)
A 6/84
IPC-TR-
480 (作废)Results of Multilayer Test Program Round Robin IV
Phase I
9/75 (orig. pub.)
IPC-TR-
481Results of Multilayer Test Program Round Robin V
(多层V循环测试程序的结果)
4/81 (orig. pub.)
IPC-TR-
483Dimensional Stability Testing of Thin Laminates - Report
on Phase I International Round Robin Test Program
(薄层压板尺寸稳定性测试---- )
4/84 (orig. pub.)
10/87 Addendums
Revised 3/91
IPC-TR-
484Results of IPC Cooper Foil Ductility Round Robin Study
(IPC Cooper 箔延展性研究联合报告)
4/86 (orig. pub.)
IPC-TR-
485Results of Cooper Foil Rupture Strength Test Round
Robin Study (Cooper 箔断裂强度研究联合报告)
3/85 (orig. pub.)
IPC-TR-
549
Measles in Printed Wiring Boards(印制板内的粉点) 11/73 (orig. pub.)
IPC-TR-
551Quality Assessment of Printed Boards Used for Mounting
and Interconnecting Electronic Components
(电子元件安装互连印制板的质量评定)
7/93 (orig. pub.)
IPC-DR-
570General Specification for 1/8 Inch Diameter Shank
Carbide Drills for Printed Boards(1/8英寸印制板硬质合
金钻头总技术规范)
1/79 (orig. pub.)
A 4/84
IPC-DR-
572
Drilling Guidelines for Printed Boards(印制板钻孔指南) 4/88 (orig. pub.) IPC-TR-
576
(已作废)
Additive Process Evaluation 9/77 (orig. pub.)
IPC-TR-
578Leading Edge Manufacturing Technology Report -
Resulting of a Round Robin Study on Minimum
Conductor Width and Plated-Through Holes in Rigid,
Bare Copper, Double-Sided Printed Wiring Boards(前沿
制造技术报告---- )
9/84 (orig. pub.)
IPC-TR-
579Round Robin Reliability Evaluation of Small Diameter
Plated Through Holes in Printed Wiring Boards
(印制板小孔金属化可靠性评估联合报告)
9/88 (orig. pub.)
IPC-TR-
580Cleaning and Cleanliness Test Program Phase 1 Test
Results
(清洗和洁净度测试程序第1阶段测试结果)
10/89 (orig. pub.)
IPC-TR-
581IPC Phase 3 Controlled Atmosphere Soldering Study
IPC Phase 3 可控气氛焊接研究)
8/94 (orig. pub.)
IPC-TR-
582IPC Phase 3 No-Clean Flux Study(IPC Phase 3免洗助焊
剂研究)
11/94 (orig pub.)
IPC-A-600Acceptability of Printed Boards(印制板可接收条件) orig pub. '64
A '70
B '74
C '78
D '89
E 8/95
F 11/99
IPC-QE-605A Printed Board Quality Evaluation Handbook
(印制板质量评定手册)
Revision A: 2/99
IPC-SS-605Printed Board Quality Evaluation Slide Set (印制板质量评定,幻灯片)
IPC-A-610
Acceptability of Electronic Assemblies
(电子组装的可接收条件) 8/83 (orig. pub.) 2nd printing 1/86 3rd printing 5/88
A 3/90
B 12/94 Amendment 1/96 Revision C: 1/00
IPC-QE-
615Assembly Quality Evaluation Handbook(组装质量评定手
册)
3/93 (orig. pub.)
IPC-SS-Assembly Quality Evaluation Slide Set(组装质量评定,幻3/93 (orig. pub.)
615灯片) Revision A: 2/99
IPC-AI-
640 (已作废)User's Guidelines for Automated Inspection of
Unpopulated Thick Film Hybrid Substrates
1/87 (orig. pub.)
IPC-AI-641User's Guidelines for Automated Solder Joint Inspection
(自动焊点检查用户指南)
1/87 (orig. pub.)
IPC-AI-642User's Guidelines for Automated Inspection of Artwork,
Interlayers, and Unpopulated PWB's
(照相底图,内层和PCB裸板自动检查用户指南)
10/88 (orig. pub.)
IPC-OI-645Standard for Visual Optical Inspection Aids
(光学检查目测标准)
10/93 (orig. pub.)
IPC-TM-
650
Test Methods Manual(测试方法手册) Updated per test method
IPC-ET-
652Guidelines and Requirements for Electrical Testing of
Unpopulated Printed Boards
(PCB裸板电气测试要求和导则)
10/90 (orig. pub.)
IPC-QL-
653Qualification of Facilities that Inspect/Test Printed
Boards, Components, and Material
(检查/测试印制板,元件和材料的设备鉴定)
8/88 (orig. pub.)
A 11/97
IPC-MI-
660Incoming Inspection of Raw Materials Manual
(原材料来料检查手册)
2/84 (orig. pub.)
IPC-R-700C
被IPC-7711 and 7721替代Suggested Guidelines for Modification, Rework and
Repair of Printed Boards and Assemblies
9/67 (orig. pub.)
A 12/71
B 9/77
C 1/88
IPC-TA-
720Technology Assessment Handbook on Laminates (层压板技术评估手册)
IPC-TA-
721Technology Assessment Handbook on Multilayer Boards (多层板技术评估手册)
IPC-TA-
722
Technology Assessment of Soldering(焊接技术评估)
IPC-TA-
723Technology Assessment Handbook on Surface Mounting (表面组装技术评估手册)
IPC-TA-
724Technology Assessment Series on Cleanrooms
(净化间技术评估)
4/98
IPC-PE-
740Troubleshooting Guide for Printed Board Manufacture
and Assembly(印制板制造及组装故障修理指南)
1/85 (orig pub.)
A 12/97
IPC-CM-
770Printed Board Component Mounting(印制板元件安装)
9/68 (orig. pub.)
A 3/76
B 10/80
C 1/87
D 1/96
IPC-SM-
780Component Packaging and Interconnecting with Emphasis
on Surface Mounting(片式元件SMC的封装和互连)
3/88 (orig. pub.)
IPC-SM-
782Surface Mount Design and Land Pattern Standard
(表面组装设计和焊盘图形标准)
3/87 (orig. pub.)
9/89
A 8/93
Amendment 1 10/96
IPC-EM-
782Surface Mount Design and Land Pattern Spreadsheet
(表面组装设计和焊盘图形电子表格)
9/94 (orig. pub.)
Addendum 12/95
IPC-SM-
784Guidelines for Chip-on-Board Technology
Implementation
(COB技术应用指南)
11/90 (orig. pub.)
IPC-SM-
785Guidelines for Accelerated Reliability Test of Surface
Mount Solder Attachments (表面组装焊接可靠性加速试
验指南)
11/92 (orig. pub.)
IPC-SM-
786
已被J-STD-020替
代Procedures for Characterizing and Handling of Moisture/
Reflow Sensitive ICs
12/90 (orig. pub.)
A 1/95
IPC-MC-
790Guidelines for Multichip Module Technology Utilization
(多芯片模块技术应用指南)
8/92 (orig. pub.)
IPC-S-804
(已作废) 被J-STD-
003
替代Solderability Test Methods for Printed Wiring Boards
1/82 (orig. pub.)
A 1/87
IPC-S-805
(已作废)被J-STD-
002
替代Solderability Tests for Component Leads and
Terminations
1/85 (orig. pub.)
IPC-MS-
810Guidelines for High Volume Microsection( 显微切面指
南)
10/93 (orig. pub.)
IPC-S-815
(已作废) 被J-STD-
001
替代General Requirements for Soldering Electronic
Interconnections
(已废除,由J-STD-001替代)
11/77 (orig. pub.)
A 6/81
B 12/87
IPC-S-816SMT Process Guideline and Checklist( SMT工艺指南和
检查表)
7/93 (orig. pub.)
IPC-SM-
817General Requirements for Dielectric Surface Mounting
Adhesives (绝缘性表面组装胶粘剂通用规范)
11/89 (orig. pub.)
IPC-SF-818
(作废)被J-STD-
004
替代General Requirement for Electronic Soldering Fluxes
(用于电子组件焊接的助焊剂通用技术要求)
2/88 (orig. pub.)
12/91
IPC-SP-819
(作废)被J-STD-005
替代General Requirements and Test Methods for Electronic
Grade Solder Paste
10/88 (orig. pub.)
IPC-AJ-
820
Assembly and Joining Manual(组装和连接手册) 8/96 (orig. pub.)
IPC-CA-
821General Requirements for Thermally Conductive
Adhesives
(热导胶粘剂通用技术要求)
1/95 (orig. pub.)
IPC-CC-
830Qualification and Performance of Electronic Insulating
Compound for Printed Board Assemblies
(印制板组装电绝缘材料的鉴定和性能)
1/84 (orig. pub.)
4/90 Reaffirmed
A 10/98
Pre and Post Solder Mask Application Cleaning
IPC-SM-
839Guidelines
(焊接前,后阻焊膜的清洗指南)
4/90 (orig. pub.)
IPC-SM-
840Qualification and Performance of Permanent Polymer
Coating (Solder Mask) for Printed Boards
(印制板阻焊膜的鉴定和性能)
11/77 (orig. pub.)
A 7/83
B 5/88
C 1/96
IPC-H-855
(己作废)Hybrid Microcircuit Design Guide 10/82 (orig. pub.)
IPC-D-859Design Standard for Thick Film Multilayer Hybrid
Circuits
(厚膜多层混合电路设计标准)
12/89 (orig. pub.)
IPC-HM-
860Specification for Multilayer Hybrid Circuits
(多层厚膜电路技术规范)
1/87 (orig. pub.)
IPC-TF-
870Qualification and Performance of Polymer Thick Film
Printed Boards(聚合物厚膜印制板的鉴定和性能)
11/89 (orig. pub.)
IPC-D-949
(作废)被IPC-D-
275
替代Design Standard for Rigid Multilayer Printed Boards
1/87 (orig. pub.)
IPC-ML-
950
(已作废) 被IPC-RB-276替
代Performance Specification for Rigid Multilayer Printed
Boards
1/66 (orig. pub.)
A 9/70
B 12/77
C 11/86
IPC-ML-
960Qualification and Performance Specification for Mass
Laminated Panels for Multilayer Printed Boards
(多层印制板预制内层敷箔板的鉴定和性能规范)
7/94 (orig. pub.)
IPC-ML-
975
被IPC-D-325
替代End Product Documentation Specification for Multilayer
Printed Wiring Boards
9/69 (orig. pub.)
IPC-ML-
990
Performance Specification for Flexible Multilayer Wiring 9/72 (orig. pub.)
(作废)
IPC-1402/IPC-H-855 Hybrid Microcircuit Design Guide(混合微波电路设计指
南)
10/82 (orig. pub.)
IPC-1710OEM Standard for Printed Board Manufacturers'
Qualification
Profile (MQP) (印制板OEM制造商资格鉴定一览表)
2/94 (orig. pub.)
12/97 updated
IPC-1720Assembly Qualification Profile (AQP)
(印制板组装制造商资格鉴定一览表) 7/96 (orig. pub.)
IPC-1730
Laminator Qualification Profile (LQP)
(层压板制造商资格鉴定一览表)
1/98
IPC-2141Controlled Impedance Circuit Boards and High Speed
Logic Design(阻抗调制电路板和高速逻辑电路设计)
4/96 (orig. pub.)
IPC-2221 代替IPC-D-275Generic Standard on Printed Board Design
(印制板设计通用标准)
2/98(orig. pub.)
IPC-2222 代替IPC-D-275Sectional Design Standard for Rigid Organic Printed
Boards
(刚性有机印制板设计标准)
2/98(orig. pub.)
IPC-2223
Sectional Design Standard for Flexible Printed Boards
(柔性印制板设计标准)
11/98
IPC-3406Guidelines for Electrically Conductive Surface Mount
Adhesives
(表面组装导电胶导则)
7/96 (orig. pub.)
IPC-3408General Requirements for Anistropically Conductive
Adhesive Films(各向异性导电胶粘剂通用技术要求)
11/96 (orig.pub.)
IPC-4101
代替IPC-L-108 IPC-L-109 IPC-L-112 IPC-L-115Specification for Base Materials for Rigid and Multilayer
Boards
(刚性及多层印制板基材特性规范)
12/97 (orig. pub.)* Specification and Characterization Methods for
IPC-4110
Nonwoven Cellulose Based Paper for Printed Boards
(非织物纤维纸印制板的特性和规格)
8/98*
IPC-4130Specification and Characterization Methods for
Nonwoven "E" Glass Mat(非织物‘E’玻璃垫规范)
9/98*
IPC-6011
Generic Performance Specification for Printed Boards
(印制板通用性能规范)
7/96 (orig. pub.)*
IPC-6012Qualification and Performance Specification for Rigid
Printed Boards(刚性印制板的鉴定与性能规范)
7/96 (orig. pub.)
A 10/99
IPC-6013Qualification and Performance Specification for Flexible Printed Boards (柔性印制板的鉴定与性能规范)
11/98
IPC-6015Qualification and Performance Specification for Organic
Multichip Module (MCM-L) Mounting and
Interconnecting Structures
(有机多芯片模块(MCM-L)组装及互连结构的鉴定和性
能规范)
2/98 (orig. pub.)
IPC-6018
Microwave End Product Board Inspection and Test
(微波产品电路板的检查和测试)
1/98(orig. pub.)
IPC/JPCA-
6202Performace Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
(单、双面柔性印制电路板性能指导手册)
2/99
IPC-7711
代替IPC-
R-700C
Rework of Electronic Assemblies (电子组件的返修) 4/98 (orig. pub.) IPC-7721
代替IPC-R-700C Repair and Modification of Printed Boards and Electronic
Assemblies(印制板和电子组件的修理和调整)
4/98 (orig. pub.)
IPC-9191
代替
IPC-PC-90 General Guideline for implementation of Statistical
Process Control (SPC) (SPC实施通则)
11/99 (orig.pub)
IPC-9201
Surface Insulation Resistance Handbook
(表面绝缘电阻手册)
7/96 (orig. pub.)
IPC-9501PWB Assembly Process Simulation for Evaluation of
Electronic Components(电子元件组装工艺仿真的评价)
7/95 (orig. pub.)
Revision A: In process。