MB6016中文资料
BD6020GU中文资料
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
EPF6016ATC100-2中文资料(Altera)中文数据手册「EasyDatasheet - 矽搜」
表3 显示FLEX 6000性能对于一些常见设计.都 性能值表明,使用新思科技DesignWare或获得 LPM功能.实行特殊设计方法不要求 该应用程序;设计人员只需推断或以实例化一个函数 Verilog HDL语言,VHDL,Altera硬件描述语言（AHDL）,或原理图 设计文件.
普通设计表 3. FLEX 6000设备性能
芯片中文手册,看全文,戳
®
2001年 3月版 . 4.1
FLEX 6000
可编程逻辑 器件系列
数据表
特征...
■ 提供一个理想低成本,可编程替代到高
卷闸门阵列应用程序,并允许快速设计变更
在原型设计或设计测试
■ 产品特点
– 登记丰富,查找表 - （LUT）架构
– OptiFLEX 体系结构,提高器件面产品效率
EPF6010A
EPF6016
典型门
(1)
10,000
16,000
逻辑单元（LE）
880
1,320
最大I / O引脚
102
204
电源电压（V
CCINT )
3.3 V
5.0 V
Note: (1) 嵌入式IEEE标准. 1149.1 JTAG电路增加1.4万个门,除列出典型大门.
EPF6016A
16,000 1,320 171 3.3 V
– FastTrack网络连续互连路由结构,可快速,
可预见互连延迟
– 专用进位链实现这种算法功能
作为快速加法器,计数器和比较器（自动使用
软件工具和宏功能）
– 专用级联链,实现高速,高扇
在逻辑功能（自动使用软件工具和
宏功能）
– 三态仿真实现内部三态网络
NFE61PTxxx资料
For High Speed Signal
For Standard (Low DC
Resistance Type)
For Standard
0603
For High Speed Signal (Sharp impedance characteristics)
* Please see P.58 "Derating of Rated Current".
60 (0.5A) 60 (3A)
50 (3A)
60 (6A)
33 (3A) 30 (1A)
30 (3A)
33 (6A)
22 22
10 10 10
10 10
555
mm 0603 1005 1608 2012 1005 1608 2012 1608 2012
EIA Code 0201 0402 0603 0805 0402 0603 0805 0603 0805
47 47
1800
1000 (1.5A) 1000
1000
1
600 (1.5A)
600
600
470 (2A)
470
390 (2A)
390
330 (1.5A)
330
220 (2A)
220
220
180 (1.5A)
180 (3A)
120 (2A)
120 (3A)
120
120
100
80 (1A)
75 (3A)
4516 1806
1005
1608
0402
0603
GHz Range Noise GHz Range Noise Suppression Type Suppression Type BLM15H/E BLM18H/E/G
MB90F562BPFM中文资料
The MB90560/565 series is a general-purpose 16-bit microcontroller designed for industrial, OA, and process control applications that require high-speed real-time processing. The device features a multi-function timer able to output a programmable waveform. The microcontroller instruction set is based on the same AT architecture as the F2MC-8L and F2MC-16L families with additional instructions for high-level languages, extended addressing modes, enhanced signed multiplication and division instructions, and a complete range of bit manipulation instructions. The microcontroller has a 32-bit accumulator for processing long word (32-bit) data.
s FEATURES
• Clock • Internal oscillator circuit and PLL clock multiplication circuit • Oscillation clock Clock speed selectable from either the machine clock, main clock, or PLL clock. The main clock is the oscillation clock divided into 2 (0.5 MHz to 8 MHz for a 1 MHz to 16 MHz base oscillation) . The PLL clock is the oscillation clock multiplied by one to four (4 MHz to 16 MHz for a 4 MHz base oscillation) . • Minimum instruction execution time : 62.5 ns (for oscillation = 4 MHz, PLL clock setting = × 4, VCC = 5.0 V) • Maximum CPU memory space : 16 MB • 24-bit addressing • Bank addressing (Continued)
USB协议资料ppt课件
2024/1/26
26
B通信协议
• 3.1.3数据字段
同步字段（SYNC） PID字段 数据字段 CRC字段 包结尾字段（EOP）
– 帧序列号。当USB令牌包的PID为SOF时，其数 据字段必须为11位的帧序列号。帧序列号由主 机产生，且每个数据帧自动加一，最大数值为 0x7FF。当帧序列号达到最大数时将自动从0开 始循环。
14
B物理电气规范
• USB信号
– 差分传输
有利于降低噪声干扰
2024/1/26
15
B物理电气规范
信号电平
FS/LS电平
2024/1/26
16
USB 电气规范
数据信号发送
USB数据包采用差分信号传输； 低速/全速数据信号发送
2024/1/26
The start of a packet (SOP) is signaled by the originating port by driving the D+ and D- lines from the Idle state to the opposite logic level (K state). 8bit（L/F）/32bit(FULL) SYNC signal for a packet start； The SE0 state is used to signal an end-of-packet (EOP). EOP=2bit SE0+1 bit J state； then ,bus recover to Idle state；
17
USB 电气规范
挂起
所有的设备都必须能支持挂起状态，并可从任一电平状态进入挂起 态。当设备发现它们的上行总线上的空闲态持续时间超3.0ms时， 它们便进入挂起态。当设备的所有端口上的总线不活动时间不超过 10ms后，设备必须被真正的挂起，此时它仅从总线上获得挂起电流。 如果总线缺少其他的通信流量时，SOF令牌将在每（微）帧中出现 一次，以防止全速/高速设备被挂起。当任一低速设备缺乏通信流量 时，在SOF令牌出现的每一帧中至少有一个低速设备处于活动态， 以避免它们不被挂起。
AMMP-6120资料
Pin Function 1Vd 2Vg 34RF Out5678RF Intop viewpackage base: RF and DC GNDVg 756RFin 8 4 RFoutVd DescriptionAvago Technologies’ AMMP-6120 is an easy-to-use in-tegrated frequency multiplier (x2) in a surface mount package designed for commercial communication systems. The MMIC takes a 4 to 12 GHz input signal and doubles it to 8 to 24 GHz. It has integrated amplification, matching, harmonic suppression, and bias networks. The input/output are matched to 50 Ω and fully DC blocked. The MMIC is fabricated using PHEMT technology. The backside of the package is both RF and DC ground. This helps simplify the assembly process and reduces assembly related performance variations and costs. The surface mount package allows elimination of “chip & wire” assembly for lower cost. This MMIC is a cost effective alternative to hybrid (discrete-FET), passive, and diode doublers that require complex tuning and assembly processes.Features• 5x5mm Surface Mount Package • Frequency Range : 8-24 GHz output (Useable to 26 GHz)• Broad input power range: -11 to +5 dBm • Output Power : +16 to +18 dBm• Harmonic Suppression : 20 dBc (Fundamental)• DC requirements : -1.4V and 5V, 112 mA @ Pin= +3dBmApplications• Microwave Radio systems • Satellite VSAT and DBS systems • 802.16 & 802.20 WiMax BWA systems • WLL and MMDS loopsAMMP-61208-24 GHz x2 Frequency MultiplierData SheetAMMP-6120 Absolute Maximum Ratings [1]Note:1. Operation in excess of any one of these conditions may result in permanent damage to this device.Symbol Parameters/Conditions Unit MinimumMaximum Vd Positive Drain Voltage V 7Vg Gate Supply Voltage V -3.0 +0.5Id Drain Current mA 120Pin CW Input Power dBm 15Tch Operating Channel Temp. °C +150Tstg Storage Case Temp.°C -65 +150TmaxMaximum Assembly Temp.(60 sec. max.)°C+300AMMP-6120 DC Specifications/Physical Properties [1]RF Specifications (3,4) (T A =25°C, Vd=5V, Vg=-1.4V, Id (Q)=85mA, Zin=Zout=50Ω)Notes:3. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.4. Pre-assembly into package performance verified 100% on-wafer.5. This final package part performance is verified by a functional test correlated to actual performance at Fout=10GHz output, Pin=+3dBm.6. All tested parameters guaranteed with measurement accuracy ±0.5dBm for Pout and ±3dBc for FS.Notes:1. Ambient operational temperature TA=25°C unless otherwise noted.2. Channel-to-backside Thermal Resistance (T channel (Tc) = 34°C) as measured using infrared microscopy. Thermal Resistance at backside tempera-ture (Tb) = 25°C calculated from measured data.Symbol Parameters and Test ConditionsUnits Typ.Maximum Id Drain Supply Current (under any RF power drive and temperature) (Vd=5V)mA 85110Ig Gate CurrentmA 9q ch-bThermal Resistance [2](Backside temperature, Tb = 25°C)°C/W34Symbol Parameters and Test Conditions Units Minimum Typ.Pout Output Power [5]dBm 1316Rlin Input Return Loss dB -15RLout Output Return LossdB -10IP-1dB Input Power @ 1dB Gain Comp dBm 2Sup Fundamental Suppresion [5]dBc 1825Sup33rd Harmonic Suppression dBc 25Sup44th Harmonic SuppressiondBc35SSBPNSingle Side Band Phase Noise (@100kHz offset)dBc Hz -140 (fout=15.6GHz)AMMP-6120 Typical Performances(T A = 25°C,Z in = Z out = 50 Ω, Vd=5V, Vg=-1.4V)-30-25-20-15-10-5Output Frequency (GHz)O u t p u t P o w e r (d B m )10111213141516171819Output Frequency (GHz)O u t p u t P o w e r [2H ] (d B m )8101214161820222426Output Frequency [GHz]S u p p r e s s i o n [1H ] (d B c )Figure 3. Output Power [2H] vs. Output Freq. at variable Pin Figure 4. Fundamental Suppression at variable PinFigure 1. Output Power vs. Output Freq. @ Pin=+3dBmFrequncy (GHz)I /P & O /P R e t u r n L o s s (d B )Input Power [1H] (dBm)T o t a l D r a i n C u r r e n t [I d ] (m A )Figure 6. Variation of total drain current with input power-30-25-20-15-10-5101520Output Frequency (GHz)O u t p u t P o w e r (d B m )Figure 2. Output Power vs. Output Freq. over temp @ Pin=+3dBmFigure 5. Input and Output Return LossInput Power [1H] (dBm)O u t p u t P o w e r [2H ] (d B m )Input Power [1H] (dBm)S u p p r e s s i o n [1H ] (d B c )Figure 11. 2H Output Power Vs Input Power @ Fout=14GHzFigure 12. Fundamental Supp. Vs Input Power @ Fout=14GHzInput Power [1H] (dBm)O u t p u t P o w e r [2H ] (d B m )-11-9-7-5-3-11357911Input Power [1H] (dBm)S u p p r e s s i o n [1H ] (d B c )Figure 9. 2H Output Power Vs Input Power @ Fout=10GHz Figure 10. Fundamental Supp. Vs Input Power @ Fout=10GHzInput Power [1H] (dBm)O u t p u t P o w e r [2H ] (d B m )Input Power [1H] (dBm)S u p p r e s s i o n [1H ] (d B c )Figure 7. 2H Output Power Vs Input Power @ Fout=8GHz Figure 8. Fundamental Supp. Vs Input Power @ Fout=8GHz-11-9-7-5-3-11357911Input Power [1H] (dBm)O u t p u t P o w e r [2H ] (d B m )Input Power [1H] (dBm)S u p p r e s s i o n [1H ] (d B c )Input Power [1H] (dBm)O u t p u t P o w e r [2H ] (d B m )Input Power [1H] (dBm)O u t p u t P o w e r [2H ] (d B m )Input Power [1H] (dBm)S u p p r e s s i o n [1H ] (d B c )Input Power [1H] (dBm)S u p p r e s s i o n [1H ] (d B c )Figure 15. 2H Output Power Vs Input Power @ Fout=20GHz Figure 17. 2H Output Power Vs Input Power @ Fout=22GHz Figure 14. Fundamental Supp. Vs Input Power @ Fout=16GHzFigure 13. 2H Output Power Vs Input Power @ Fout=16GHzFigure 16. Fundamental Supp. Vs Input Power @ Fout=20GHzFigure 18. Fundamental Supp. Vs Input Power @ Fout=22GHzFigure 22. Top Level Schematic of Frequency doublerFigure.21 SSB Phase Noise of frequency doubler (Pin=+2dBm, fout=15.6GHz)-170-160-150-140-130-120-110-100Offset Frequency [Hz]S S B P h a s e N o i s e (d B c /H z )Biasing and OperationThe frequency doubler MMIC consists of a balun. The outputs of this balun feed the gates of balanced FETs and the drains are connected to form the single-ended output. This results in fundamental frequency & odd harmonics cancellation. The even harmonic drain currents are in phase and thus add in phase. The input matching network (M/N) is designed to provide good match at fundamental frequencies and produces high impedance mismatch to higher harmonics.The AMMP-6120 is biased with a single positive drain supply Vdd and a single negative gate supply using separate bypass capacitors. It is normally biased with the drain supply connected to Vd and the gate supply connected to Vg. For most applications it is recommended to use a Vg =-1.2V to -1.4V and Vd=4.5V to 5.0V.The RF input and output ports are AC coupled thus no DC voltage is present at either port. The ground connection is made via the package base.”The AMMP-6120 performance changes with Drain Voltage (Vd) and Gate bias (Vg) as shown in the previous graphs. Improvements in output power or fundamental suppres-sion performance are possible by optimizing the Vg from -1.2V to -1.4V and/or Vd from 4.5 to 5.0V.A simplified schematic of the frequency multiplier is shown in figure 22. The active balun circuit and the output amplifier of the circuit are self biased. The Vg negative bias (below pinch off) is only applied to FETs ‘F1’ and ‘F2’. FETs ‘F1’ and ‘F2’ have no significant contribution to total drain current therefore Vg cannot be used to set drain current. It should only be used to optimize the output power and fundamental & higher harmonics suppression of the doubler.Refer to the Absolute Maximum Ratings table for allowed DC and thermal conditions.Figure. 19 2H Output Power Vs Input Power @ Fout=26GHzFigure. 20 Fundamental Supp. Vs Input Power @ Fout=26GHz2468101214161820Input Power [1H] (dBm)O u t p u t P o w e r [2H ] (d B m )-11-9-7-5-3-11357911Input Power [1H] (dBm)S u p p r e s s i o n [1H ] (-d B c )Recommended SMT AttachmentThe AMMP Packaged Devices are compatible with high volume surface mount PCB assembly processes.The PCB material and mounting pattern, as defined in the data sheet, optimizes RF performance and is strongly recommended. An electronic drawing of the land pattern is available from /view/rf or upon request from Avago Application Engineering.Evaluation Test Circuit (Demo Board)(Available to customer on qualified request)Suggested PCB Material and Land PatternOutline DrawingFront ViewSide ViewSymbol Min Max A 0.198 (5.03)0.213 (5.4)B0.0685 (1.74)0.088 (2.25)Dimensions are in inches (mm)Dimensional Tolerance for back view: 0.002” (0.05mm)Notes:1. * Indicates Pin 12. Dimensions are in inches [millimeters]3. All Grounds must be soldered to PCB RF GroundBack ViewSecondsT e m p (˚C )Manual Assembly1. Follow ESD precautions while handling packages.2. Handling should be along the edges with tweezers.3. Recommended attachment is conductive solder paste. Please see recommended solder reflow profile. Conduc-tive epoxy is not recommended. Hand soldering is not recommended.4. Apply solder paste using a stencil printer or dot place-ment. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical perfor-mance.5. Follow solder paste and vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room tempera-ture to the pre-heat temperature to avoid damage due to thermal shock.6. Packages have been qualified to withstand a peak tem-perature of 260°C for 20 seconds. Verify that the profile will not expose device beyond these limits.Solder Reflow ProfileThe most commonly used solder reflow method is ac-complished in a belt furnace using convection heat transfer. The suggested reflow profile for automated reflow processes is shown in Figure 23. This profile is designed to ensure reliable finished joints. However, the profile indicated in Figure 1 will vary among different solder pastes from different manufacturers and is shown here for reference only.Recommended solder reflow profileStencil Design GuidelinesA properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads. The recommended stencil layout is shown in Figure 24. The stencil has a solder paste deposi-tion opening approximately 70% to 90% of the PCB pad. Reducing stencil opening can potentially generate more voids underneath. On the other hand, stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the I/O pads. Considering the fact that solder paste thickness will directly affect the quality of the solder joint, a good choice is to use a laser cut stencil composed of 0.127 mm (5 mils) thick stainless steel which is capable of producing the required fine stencil outline. The combined PCB and stencil layout is shown in below .Figure 23. Suggested lead-free reflow profile for SnAgCu solder paste.Figure 24. Stencil outline drawing (mm).Figure 25. Combined PCB and stencil layouts (mm).For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0119EN AV02-0441EN - May 8, 2008Device Orientation (Top View)Carrier Tape and Pocket DimensionsAMMP-6120 Part Number Ordering InformationPart Number Devices Per Container Container AMMP-6120-BLK 10Antistatic bag AMMP-6120-TR11007” Reel AMMP-6120-TR25007” Reel。
1953606资料
Extract from the onlinecatalogMCDN 1,5/10-G1-3,5 RNP26THROrder No.: 1953606http://eshop.phoenixcontact.de/phoenix/treeViewClick.do?UID=1953606Headers with engagement nose, 3.5 mm pitch, pin length 2.6 mm, plug-in direction parallel to the PCBhttp://Please note that the data givenhere has been taken from theonline catalog. For comprehensiveinformation and data, please referto the user documentation. TheGeneral Terms and Conditions ofUse apply to Internet downloads. Technical dataDimensions / positionsLength13.3 mmHeight15.2 mmPitch 3.5 mmDimension a31.5 mmNumber of positions10Pin dimensions0,8 x 0,8 mm Pin spacing 3.5 mmHole diameter 1.4 mmTechnical dataInsulating material group IIIaRated surge voltage (III/3) 2.5 kVRated surge voltage (III/2) 2.5 kVRated surge voltage (II/2) 2.5 kVRated voltage (III/2)160 VRated voltage (II/2)250 V Connection in acc. with standard EN-VDE Nominal current I N8 ANominal voltage U N160 V Maximum load current8 A (per position) Insulating material LCP Inflammability class acc. to UL 94V0Certificates / ApprovalsApproval logoCULNominal voltage U N150 VNominal current I N8 AULNominal voltage U N150 VNominal current I N8 A Certification CUL, ULAccessoriesItem Designation DescriptionMarking0805030SK 3,5/2,8:SO Marker card, special printing, self-adhesive, labeled acc. tocustomer requirements, 14 identical marker strips per card, max.25-position labeling per strip, color: White0804109SK 3,81/2,8:FORTL.ZAHLEN Marker card, printed horizontally, self-adhesive, 10-section markerstrip, 14 identical decades marked 1-10, 11-20 etc. up to 91-(99)100, sufficient for 140 terminal blocksPlug/Adapter1734634CP-MSTB Coding profile, is inserted into the slot on the plug or invertedheader, red insulating materialDrawingsDrilling diagram*) ≤ 8-pos. = 1.3 / > 8-pos. = 1.4Dimensioned drawingAddressPHOENIX CONTACT GmbH & Co. KGFlachsmarktstr. 832825 Blomberg,GermanyPhone +49 5235 3 00Fax +49 5235 3 41200http://www.phoenixcontact.de© 2008 Phoenix ContactTechnical modifications reserved;。
IPC中文名称解释
IPC标准中英名称对照(76个)2006-09-24刚性印制板设计手册IPC-D-325A Documentation Requirements for Printed Boards印制板设计文件图册要求IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除IPC-6010 Series IPC-6010 Qualification and Performance SeriesIPC-6010印制电路板质量标准和性能规范系列手册IPC-6011 Generic Performance Specification for Printed Boards印制板通用性能规范IPC-6013A Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)挠性印制板的鉴定与性能规范（包括修改单1）IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards高密度互连(HDI)层或印制板的鉴定与性能规范IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1刚性印制板的鉴定与性能规范 (包括修改单1)IPC-6018A Microwave End Product Board Inspection and Tech微波成品印制板的检验和测试IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范IPC-A-600F Acceptability of Printed Boards印制板验收条件IPC-QE-605A Printed Board Quality Evaluation Handbook印制板质量评价IPC-QE-605A-KIT Hard Copy and CD印制板质量评价书和光盘(CD)IPC-HM-860 Specification for Multilayer Hybrid Circuits多层混合电路规范IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards 聚合物厚膜印制板的鉴定与性能IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范IPC-TR-481 Results of Multilayer Tests Program Round Robin多层印制板联合试验计划结果IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components用于电子元件安装与互连的印制板质量评价IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs印制板中小直径镀覆孔可靠性评价联合试验IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards印制电路板表面非电镀镍/沉金规范IPC-DR-572 Drilling Guidelines for Printed Boards印制板钻孔导则IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias印制板通孔机加工方案的改进和优选手册IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers 钻床和铣床用计算机数字控制格式IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines施加阻焊前及施加后清洗导则IPC-HDI-1 High Density Interconnect Microvia Technology Compendium高密度(HDI)互连微通孔技术纲要IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and MicroviaMaterials高密度互连(HDI)及微导通孔材料规范IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards高密度互连(HDI)层或印制板的鉴定与性能规范IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection积层/高密度互连的术语和定义、试验方法与设计例IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules多芯片组件内层有机绝缘材料的鉴定试验IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1高密度印制板微通孔评价指标手册, 第一期第一版IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2高密度印制板微通孔评价指标手册, 第一期第二版IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3高密度印制板微通孔评价指标手册, 第一期第三版IT-98123 Microvia Manufacturing Technology Cost Analysis Report微通孔制作技术成本核算报告IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design控制阻抗电路板与高速逻辑设计IPC-2252 Design Guide for RF/Microwave Circuit Boards射频/微波电路板设计指南IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications高速高频用基材规范IPC-6018A Microwave End Product Board Inspection and Test微波成品印制板的检验和测试IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques采用高速技术电子封装设计导则IPC-M-102 Flexible Circuits Compendium挠性电路纲要IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry 挠性印制线路用挠性绝缘基底材料IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films挠性印制线路覆盖层用涂粘接剂绝缘薄膜IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry挠性金属箔去电应用于柔性电路组装IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1挠性印制板的鉴定与性能规范（包括修改单1）IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring BoardsIPC/JPCA单双面挠性印制板性能手册IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits 单面和双面挠性电路组装导则IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范IPC-MB-380 Guidelines for Molded Interconnection Devices模压互连器件导则IPC-M-107 Standards for Printed Board Materials Manual印制板材料标准手册IPC-MI-660 Incoming Inspection of Raw Materials Manual原材料接收检验手册IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards刚性及多层印制板用基材规范IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications多层印制板用芯板结构选择导则IPC-4562 Metal Foil for Printed Wiring Applications印制线路用金属箔IPC-CF-148A Resin Coated Metal for Printed Boards印制板用涂树脂金属箔IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范IPC-TR-482 New Developments in Thin Copper Foils薄铜箔的新发展IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin StudyIPC铜箔延展性联合研究结果IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study 铜箔断裂强度试验联合研究结果IPC-4412 Specification for Finished Fabric Woven from ”E” Glass for PrintedBoards“E”类精纺玻璃纤维层印制板技术规范IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass MaterialsE 玻璃纤维非织布材料规范及性能确定方法IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards印制板用纤维纸规范及性能确定方法IPC-4411-K Specification and Characterization Methods for Non-WovenPara-Aramid Reinforcement, with Amendment 1聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1IPC-4411-AM1 Specification and Characterization Methods for Non-WovenPara-Aramid Reinforcement, Amendment 1关于聚芳基酰胺非织布规范及性能确定方法的修改单 1IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards印制板用经处理S玻璃纤维织物规范IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用经处理聚芳酰胺纤维编织物规范IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards印制板用经处理石英（熔融纯氧化硅）纤维编织物规范IPC-2524 PWB Fabrication Data Quality Rating System印制板制造数据质量定级体系IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database印制板工艺, 容量, 质量,可靠性试验标准和数据库IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC)实施统计过程控制(SPC)的通用导则IPC-9199 Statistical Process Control (SPC) Quality Rating统计分析控制IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards未组装印制板电测试要求和指南IT-97061 PWB Hole to Land Misregistration: Causes and Reliability印制线路板通孔与焊盘的错位: 原因和可靠性IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels多层板内部无焊盘层互连错位的可靠性IPC-MS-810 Guidelines for High Volume Microsection大批量显微剖切导则IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials印制板、元器件及材料检验试验设备的认证IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation内层分离的互连应力测试(IST)与显微剖切相关性联合研究。
MB4206中文资料
.244±.010 (6.20±0.25)
.323±.012 (8.20±0.30)
+.012 .060 -0 (1.52 +0.30 )
-0
.020±.003 (0.50±.0.08)
.157±.012 (4.00±0.30)
.128±.010 (3.26±0.25)
.010±.002 (0.25±0.05)
*3 The current flows from IC. *4 If VCC is lower than VR, use (VCC-2).
3
元器件交易网
MB4206
Fig. 3 — TEST CIRCUIT
1
2
MB4206
V O(C)
8
V CC
3Leabharlann 4567f IN
VO(F)
8-LEAD PLASTIC SINGLE IN-LINE PACKAGE (CASE No.: SIP-8P-M03)
INDEX-1
INDEX-2 +.012
.039 -0 (0.99+0.30 )
-0 .100(2.54)
TYP
+.006
+0.15
.774 -.014 (19.65 -0.35 )
V CC 1
5K
IN(F) 2
5.4V
Charge Pump
+
5.4V
5.4V
4
3
6
7
TC
+IN(C)
VO(F) /-IN(C)
85 OUT(C) V R
VO(F)
FIG. 2 — TYPICAL HOOKUP AND OPERATING PARAMETERS
BLM31PG601SN1中文资料
-
Continued on the following page.
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!Impedance Map
2700
2500
2250
2200 2200
1800 1800 1800
1500 1500
1000
1000 1000 1000 1000 1000 1000 1000 1000
750
600 600 600 600 600 600 600 600
470 470 470 470 470 470 470
For Standard BLMppA/T
For High Speed For Digital
Signal
Interface
BLMppB BLMppR
10 (1A)
1005 0402
22 (6A)
1608
2012
3216
0603
0805
1206
For Large Current BLMppP
( )=Rated Current
-
1800±25%
-
6MBP100RTB060资料
Recommendable value
Item DC Bus Voltage Operating Supply Voltage of Pre-Driver Screw torque (M5)
Symbol VDC VCC -
Weight Item
Weight *9 : (For 1 device, Case is under the device)
0.2
Typ.
5 -
20 -
20 0.5
Max. Unit
- -A
-
µs
8
µs
- - °C
-
°C
125
°C
-
12.5 V
-
Thermal characteristics( Tc=25°C)
Item
Junction to Case thermal resistance
INV
Case to fin thermal resistance with compound
Common mode lightning surge
Condition Pulse width 1µs, polarity ±,10minuets Judge : no over-current, no miss operating Rise time 1.2µs, Fall time 50µs Interval 20s, 10 times Judge : no over-current, no miss operating
MB6S中文资料_数据手册_参数
TA = 25°C
Reverse Current At Rated DC Blocking
IR
10 µA TA = 25°C
Voltage
Typical Junction Capacitance
CJ
25pF Measured at
1.0MHz, VR=4.0V
Note1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
0.8Amp Single Phase Glass Passivated Bridge Rectifier 50 to 1000 Volts
Maximum Ratings
• Operating Temperature: -55°C to +150°C • Storage Temperature: -55°C to +150°C
Maximum RMS
Voltage
35V 70V 140V 280V 420V 560V 700V
Maximum DC
Blocking Voltage
50V
100V 200V 400V 600V 800V 1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
.050 .014
6.40 0.45 2.30 0.10 0.53 1.40 ----
1.02 0.15
6.91 0.75 2.70 0.20 0.58 1.65 5.08
1.27 0.35
UMW R
UMW MB05S-MB10S
T520A226M006ATE100中文资料
Design a KEMET Tantalum Chip into Your Next Project . . . .KEMET is offering six Tantalum Chip Engineering Kits to meet your diverse design needs for the future. KEMET’s line of Engineering Kits for Tantalum Chips will include a T495, T510 Low ESR Kit, an Extended Range T491 Kit, a Standard T491 Kit, a T494 Low-profile, Low-ESR Kit, T520, T530, A700 Polymer Kit and a High Temperature T498, T499 Kit.Our current tantalum engineering kit offering includes the following categories:TAN ENG KIT04- T495, T510 Low ESR, Surge RobustTAN ENG KIT05- T491 Extended RangeTAN ENG KIT06- T491 StandardTAN ENG KIT07- T494 Low Profile, Low ESRTAN ENG KIT08- T520, T530, A700 - Low ESR PolymerNew TAN ENG KIT09- T498, T499 High TemperatureEach Tantalum Engineering Kit contains Tantalum Surface Mount parts: 10 or 20 pieces for each part number in a strip of carrier tape clearly labeled with the KEMET part number. Also included with the Engineering Kit will be a Surface Mount catalog with outline drawings, dimensions, marking format, recommended mounting pad dimensions, and ordering information.Experience the quality and performance of KEMET surface mount capacitors. Order one of KEMET’s Tantalum Chip Kits and see how our finest surface mount devices handle your most challenging appli-cation now and in the future. All Engineering Kits are available through KEMET and your local distrib-utor. A complete listing of all part numbers for each kit is available on the back of this page.F3217F 12/06Kit Part Number: TAN ENG KIT 04 - T495, T510(Low ESR, Surge Robust) 10 pcs.Kit Part Number: TAN ENG KIT 05 - T491(Extended Range) 20 pcs.Kit Part Number: TAN ENG KIT 06 - T491Kit Part Number: TAN ENG KIT 07 - T494(Low Profile, Low ESR) 20 pcs.Kit Part Number: POLYMER ENG KIT 08 - T520, T530, A700Kit Part Number: TAN ENG KIT 09 - T498, T499(High Temperature) 10 pcs.Notice: KEMET reserves the right to make changes or substitutions to the Engineering Kits at any time without notice.。