1SS383T1G;中文规格书,Datasheet资料
BD3841FS中文资料
Japan / (Internal Sales)
Tokyo Yokohama Nagoya Kyoto 2-1-1, Yaesu, Chuo-ku, Tokyo 104-0082 TEL : +81(3)5203-0321 FAX : +81(3)5203-0300 2-4-8, Shin Yokohama, Kohoku-ku, Yokohama, Kanagawa 222-8575 TEL : +81(45)476-2131 FAX : +81(45)476-2128 Dainagayo Building 9F 3-28-12, Meieki, Nakamura-ku, Nagoya,Aichi 450-0002 TEL : +81(52)581-8521 FAX : +81(52)561-2173 579-32 Higashi Shiokouji-cho, Karasuma Nishi-iru, Shiokoujidori, Shimogyo-ku, Kyoto 600-8216 TEL : +81(75)311-2121 FAX : +81(75)314-6559 TEL : +81(45)476-9270 FAX : +81(045)476-9271
(Contact address for overseas customers in Japan)
Yokohama
As of 18th. April 2005
Please contact our sales offices for details ;
U.S.A / San Diego Atlanta Dallas Germany / Dusseldorf TEL : +1(858)625-3630 TEL : +1(770)754-5972 TEL : +1(972)312-8818 TEL : +49(2154)9210 FAX : +1(858)625-3670 FAX : +1(770)754-0691 FAX : +1(972)312-0330 FAX : +49(2154)921400 FAX : +44(1)908-282-528
MBRS140T3G;中文规格书,Datasheet资料
(Note: Microdot may be in either location)
Lead and Mounting Surface Temperature for Soldering Purposes:
ORDERING INFORMATION
Device MBRS140T3G SBRS8140T3G Package SMB (Pb−Free) SMB (Pb−Free) Shipping† 2,500 / Tape & Reel 2,500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DC
3 10
0
1
2
3
4
5
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Power Dissipation
3
/
MBRS140T3G, SBRS8140T3G
PACKAGE DIMENSIONS
Figure 3. Typical Capacitance
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
10 9 8 7 6 5 4 3 2 1 0 30 40 50 60 70 80 90 100 TC, CASE TEMPERATURE (C) 110 120 130
IS31LT3360-SDLS3-TR;中文规格书,Datasheet资料
APPLICATION CIRCUIT
IS31LT3360
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
TSOP34838;中文规格书,Datasheet资料
IR Receiver Modules for Remote Control SystemsMECHANICAL DATAPinning for TSOP348.., TSOP344..:1 = OUT, 2 = GND, 3 = V SPinning for TSOP322.., TSOP324..:1 = OUT, 2 = V S , 3 = GNDFEATURES•Very low supply current•Photo detector and preamplifier in one package •Internal filter for PCM frequency •Improved shielding against EMI •Supply voltage: 2.5 V to 5.5 V•Improved immunity against ambient light •Insensitive to supply voltage ripple and noise•Material categorization: For definitions of compliance please see /doc?99912DESCRIPTIONThese products are miniaturized receivers for infrared remote control systems. A PIN diode and a preamplifier are assembled on a lead frame, the epoxy package acts as an IR filter.The demodulated output signal can be directly decoded by a microprocessor. The TSOP348.., TSOP322.. are compatible with all common IR remote control data formats. The TSOP324.., TSOP344.. are optimized to suppress almost all spurious pulses from energy saving fluorescent lamps but will also suppress some data signals.This component has not been qualified according to automotive specifications.BLOCK DIAGRAMAPPLICATION CIRCUITPARTS TABLECARRIER FREQUENCY STANDARD APPLICATIONS(AGC2)VERY NOISY ENVIRONMENTS(AGC4)PINNING1 = OUT,2 = GND,3 = V S1 = OUT,2 = V S ,3 = GND1 = OUT,2 = GND,3 = V S1 = OUT,2 = V S ,3 = GND30 kHz TSOP34830TSOP32230TSOP34430TSOP3243033 kHz TSOP34833TSOP32233TSOP34433TSOP3243336 kHz TSOP34836TSOP32236TSOP34436TSOP3243638 kHz TSOP34838TSOP32238TSOP34438TSOP3243840 kHz TSOP34840TSOP32240TSOP34440TSOP3244056 kHzTSOP34856TSOP32256TSOP34456TSOP32456Note•Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.TYPICAL CHARACTERISTICS (T amb = 25 °C, unless otherwise specified)Fig. 1 - Output Active Low Fig. 2 - Pulse Length and Sensitivity in Dark AmbientABSOLUTE MAXIMUM RATINGSPARAMETER TEST CONDITIONSYMBOLVALUE UNIT Supply voltage V S - 0.3 to + 6V Supply current I S 3mA Output voltage V O - 0.3 to (V S + 0.3)V Output current I O 5mA Junction temperature T j 100°C Storage temperature range T stg - 25 to + 85°C Operating temperature range T amb- 25 to + 85°C Power consumption T amb ≤ 85 °C P tot 10mW Soldering temperaturet ≤ 10 s, 1 mm from caseT sd260°CELECTRICAL AND OPTICAL CHARACTERISTICS (T amb = 25 °C, unless otherwise specified)PARAMETER TEST CONDITION SYMBOLMIN.TYP.MAX.UNIT Supply current E v = 0, V S = 3.3 V I SD 0.270.350.45mA E v = 40 klx, sunlightI SH 0.45mA Supply voltage V S 2.55.5V Transmission distance E v = 0, test signal see fig. 1,IR diode TSAL6200,I F = 250 mA d 45m Output voltage low I OSL = 0.5 mA, E e = 0.7 mW/m 2,test signal see fig. 1V OSL 100mV Minimum irradiance Pulse width tolerance:t pi - 5/f 0 < t po < t pi + 6/f 0,test signal see fig. 1E e min.0.10.25mW/m 2Maximum irradiance t pi - 5/f 0 < t po < t pi + 6/f 0,test signal see fig. 1E e max.30W/m 2DirectivityAngle of half transmissiondistanceϕ1/2± 45degE eV O V VFig. 3 - Output Function Fig. 4 - Output Pulse Diagram Fig. 5 - Frequency Dependence of Responsivity Fig. 6 - Sensitivity in Bright AmbientFig. 7 - Sensitivity vs. Supply Voltage DisturbancesFig. 8 - Sensitivity vs. Electric Field DisturbancesEV O V V OL0.00.20.40.60.81.01.20.70.9 1.1 1.3f/f 0 - Relative Frequency16925E /E - R e l. R e s p o n s i v i t y e m i n.eFig. 9 - Max. Envelope Duty Cycle vs. Burst Length Fig. 10 - Sensitivity vs. Ambient TemperatureFig. 11 - Relative Spectral Sensitivity vs. WavelengthFig. 12 - Horizontal DirectivityFig. 13 - Sensitivity vs. Supply VoltageSUITABLE DATA FORMATThese products are designed to suppress spurious output pulses due to noise or disturbance signals. Data and disturbance signals can be distinguished by the devices according to carrier frequency, burst length and envelope duty cycle. The data signal should be close to the band-pass center frequency (e.g. 38 kH z) and fulfill the conditions in the table below.When a data signal is applied to the IR receiver in the presence of a disturbance signal, the sensitivity of the receiver is reduced to insure that no spurious pulses are present at the output. Some examples of disturbance signals which are suppressed are:•DC light (e.g. from tungsten bulb or sunlight)•Continuous signals at any frequency•Strongly or weakly modulated noise from fluorescent lamps with electronic ballasts (see figure 14 or figure 15)Fig. 14 - IR Signal from Fluorescent Lampwith Low ModulationFig. 15 - IR Signal from Fluorescent Lampwith High ModulationNote•For data formats with short bursts please see the datasheet for TSOP323.., TSOP325.., TSOP343.., TSOP345..0101520Time (ms)16920I R S i g n a l50101520Time (ms)16921I R S i g n a l5TSOP322.., TSOP348..TSOP324.., TSOP344..Minimum burst length10 cycles/burst 10 cycles/burst After each burst of lengtha minimum gap time is required of10 to 70 cycles ≥ 10 cycles 10 to 35 cycles ≥ 10 cycles For bursts greater thana minimum gap time in the data stream is needed of 70 cycles > 4 x burst length35 cycles> 10 x burst lengthMaximum number of continuous short bursts/second 18001500Recommended for NEC code yes yes Recommended for RC5/RC6 code yes yes Recommended for Sony codeyes no Recommended for Thomson 56 kHz codeyes yes Recommended for Mitsubishi code (38 kHz, preburst 8 ms, 16 bit)yes no Recommended for Sharp codeyesyesSuppression of interference from fluorescent lampsMost common disturbance signals are suppressedEven extreme disturbance signals are suppressedPACKAGE DIMENSIONS in millimetersLegal Disclaimer Notice VishayDisclaimerALL PRODU CT, PRODU CT SPECIFICATIONS AND DATA ARE SU BJECT TO CHANGE WITHOU T NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.Material Category PolicyVishay Intertechnology, Inc. hereb y certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.分销商库存信息: VISHAYTSOP34838。
SS3P6L-M386A;SS3P5L-M387A;SS3P6LHM387A;SS3P5LHM387A;SS3P6L-M387A;中文规格书,Datasheet资料
For technical questions within your region, please contact one of the following: DiodesAmericas@, DiodesAsia@, DiodesEurope@ 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?91000 /
TYPICAL APvoltage high frequency inverters, freewheeling, DC/DC converters, and polarity protection applications.
MMSD103T1G;中文规格书,Datasheet资料
TA = 150C
150C
TA = 25C TA = −55C 1 2 5 10 20 50 100 200 300
1
10
100
1000
FORWARD CURRENT (mA)
REVERSE VOLTAGE (V)
Figure 2. Forward Voltage
Figure 3. Reverse Leakage
Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 6
1
Publication Order Number: MMSD103T1/D
/
MMSD103T1G, SMMSD103T1G
Figure 1. Recovery Time Equivalent Test Circuit
2
/
MMSD103T1G, SMMSD103T1G
1200 FORWARD VOLTAGE (mV) REVERSE CURRENT (nA) 1000 800 600 400 200 1 TA = −55C 25C 7000 6000 5000 4000 3000 6 5 4 3 2 1 0
Features
AEC−Q101 Qualified and PPAP Capable S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements Compliant*
MAXIMUM RATINGS
Rating Continuous Reverse Voltage Peak Forward Current Peak Forward Surge Current
TMP320C6211GJL100资料
Table of Contents GHK BGA package (bottom view) . . . . . . . . . . . . . . . . . . . 3 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 device characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 functional and CPU (DSP core) block diagram . . . . . . . . . 6 CPU (DSP core) description . . . . . . . . . . . . . . . . . . . . . . . . 7 memory map summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 signal groups description . . . . . . . . . . . . . . . . . . . . . . . . . . 10 signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . documentation support . . . . . . . . . . . . . . . . . . . . . . . . . . . . clock PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . power-down mode logic . . . . . . . . . . . . . . . . . . . . . . . . . . . power-supply sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . absolute maximum ratings over operating case temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . recommended operating conditions . . . . . . . . . . . . . . . . . recommended operating conditions (PCI only) . . . . . . . . electrical characteristics over recommended rangesof supply voltage and operating case temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . electrical characteristics over recommended ranges of supply voltage and operating case temperature (PCI only) . . . . . . . . . . . . . . . . . . . . . . . 13 22 25 26 28 31 32 32 32 33 33 parameter measurement information . . . . . . . . . . . . . . . 34 input and output clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 asynchronous memory timing . . . . . . . . . . . . . . . . . . . . . 37 synchronous-burst memory timing . . . . . . . . . . . . . . . . . 40 synchronous DRAM timing . . . . . . . . . . . . . . . . . . . . . . . . 42 HOLD/HOLDA timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 reset timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 external interrupt timing . . . . . . . . . . . . . . . . . . . . . . . . . . 49 PCI I/O timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 PCI reset timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 PCI serial EEPROM interface timing . . . . . . . . . . . . . . . 52 multichannel buffered serial port timing . . . . . . . . . . . . . 53 DMAC, timer, power-down timing . . . . . . . . . . . . . . . . . . 63 JTAG test-port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
1SS302中文资料
TOSHIBA Diode Silicon Epitaxial Planar Type1SS302Ultra High Speed Switching Applicationsz Small package : SC-70z Low forward voltage : V F (3) = 0.90V (typ.) z Fast reverse recovery time : t rr = 1.6ns (typ.)z Small total capacitance : C T = 0.9pF (typ.)Absolute Maximum Ratings (Ta = 25°C )Characteristic Symbol Rating UnitMaximum (peak) reverse voltage V RM 85 V Reverse voltageV R 80 V Maximum (peak) forward current I FM 300 (*) mA Average forward current I O 100 (*) mA Surge current (10ms) I FSM 2 (*) A Power dissipation P100mWJunction temperature T j 125 °CStorage temperatureT stg−55~125 °CNote: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and thesignificant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). *: Unit rating. Total rating = unit rating × 0.7Electrical Characteristics (Ta = 25°C )Characteristic SymbolTestCircuitTest ConditionMinTyp.MaxUnitV F (1)― I F = 1mA ― 0.60 ― V F (2) ― I F = 10mA ― 0.72 ― Forward voltageV F (3)― I F = 100mA ― 0.90 1.20VI R (1) ― V R = 30V ― ― 0.1Reverse current I R (2) ― V R = 80V ―― 0.5μATotal capacitance C T ― V R = 0, f = 1MHz ― 0.9 3.0 pF Reverse recovery timet rr―I F = 10mA, Fig.1― 1.6 4.0 nsJEDEC ― EIAJ SC-70TOSHIBA 1-2P1CWeight: 0.006g Unit: mmMarkingFig.1 Reverse Recovery Time(t rr ) Test CircuitRESTRICTIONS ON PRODUCT USE20070701-EN GENERAL •The information contained herein is subject to change without notice.•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.。
SI2343DS-T1-GE3;中文规格书,Datasheet资料
Vishay SiliconixSi2343DSP-Channel 30-V (D-S) MOSFETFEATURES•Halogen-free According to IEC 61249-2-21Available•TrenchFET ® Power MOSFETAPPLICATIONS•Load Switch •PA SwitchPRODUCT SUMMARYV DS (V)R DS(on) (Ω)I D (A)- 300.053 at V GS = - 10 V - 4.00.086 at V GS = - 4.5 V- 3.1Notes:a. Surface Mounted on 1" x 1" FR4 board.b. Pulse width limited by maximum junction temperature.* Pb containing terminations are not RoHS compliant, exemptions may apply ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise notedParameterSymbol 5 s Steady State Unit Drain-Source Voltage V DS - 30VGate-Source VoltageV GS± 20Continuous Drain Current (T J = 150 °C)a, b T A = 25 °C I D - 4.0- 3.1AT A = 70 °C- 3.2- 2.5Pulsed Drain CurrentI DM - 15Continuous Source Current (Diode Conduction)a, b I S- 1.0- 0.6Maximum Power Dissipationa, bT A = 25 °C P D 1.250.75W T A = 70 °C0.80.48Operating Junction and Storage T emperature RangeT J , T stg- 55 to 150°C THERMAL RESISTANCE RATINGSParameter Symbol T ypical Maximum UnitMaximum Junction-to-Ambient a t ≤ 5 s R thJA 75100°C/WSteady State 120166Maximum Junction-to-Foot (Drain)Steady StateR thJF4050Vishay SiliconixSi2343DSNotes:a. Pulse test: PW ≤ 300 µs, duty cycle ≤ 2 %.b. For DESIGN AID ONLY, not subject to production testing.c. Switching time is essentially independent of operating temperature.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.SPECIFICATIONS T J = 25 °C, unless otherwise notedParameter Symbol T est Conditions LimitsUnitMin.Typ.Max.StaticDrain-Source Breakdown Voltage V (BR)DSS V GS = 0 V , I D = - 250 µA - 30VGate-Threshold Voltage V GS(th) V DS = V GS , I D = - 250 µA - 1- 3Gate-Body LeakageI GSS V DS = 0 V , V GS = ± 20 V ± 100 nAZero Gate Voltage Drain Current I DSS V DS = - 24 V , V GS = 0 V - 1µA V DS = - 24 V, V GS = 0 V , T J = 55 °C- 10On-State Drain Current a I D(on) V DS ≤ - 5 V , V GS = - 10 V - 15A Drain-Source On-Resistance aR DS(on) V GS = - 10 V , I D = - 4.0 A 0.0430.053ΩV GS = - 4.5 V , I D = - 3.1 A 0.0680.086Forward T ransconductance a g fs V DS = - 5 V , I D = - 4.0 A 10S Diode Forward Voltage V SDI S = - 1.0 A, V GS = 0 V- 0.7- 1.2VDynamic bTotal Gate Charge Q g V DS = - 15 V , V GS = - 10 VI D ≅ - 4.0 A1421nCGate-Source Charge Q gs 1.9Gate-Drain Charge Q gd 3.7Input Capacitance C iss V DS = - 15 V, V GS = 0 V , f = 1 MHz540pFOutput CapacitanceC oss 131Reverse Transfer Capacitance C rss105Switching c Turn-On Time t d(on) V DD = - 15 V , R L = 15 ΩI D ≅ - 1.0 A, V GEN = - 10 VR G = 6 Ω1015nst r 1525Turn-Off Timet d(off) 3150t f2030Output CharacteristicsOn-Resistance vs. Drain CurrentGate ChargeCapacitanceOn-Resistance vs. Junction TemperatureSingle Pulse PowerVishay SiliconixSi2343DSTYPICAL CHARACTERISTICS 25°C, unless otherwise notedVishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?72079.Normalized Thermal Transient Impedance, Junction-to-AmbientVishay SiliconixPackage InformationSOT-23 (TO-236): 3-LEADDimMILLIMETERS INCHESMinMaxMinMaxA 0.89 1.120.0350.044A 10.010.100.00040.004A 20.88 1.020.03460.040b 0.350.500.0140.020c 0.0850.180.0030.007D 2.803.040.1100.120E 2.10 2.640.0830.104E 1 1.201.400.0470.055e 0.95 BSC 0.0374 Ref e 1 1.90 BSC0.0748 RefL 0.400.600.0160.024L 10.64 Ref 0.025 Ref S 0.50 Ref0.020 Refq3°8°3°8°ECN: S-03946-Rev. K, 09-Jul-01DWG: 5479AN807Vishay Siliconix Mounting LITTLE FOOT R SOT-23 Power MOSFETsWharton McDanielSurface-mounted LITTLE FOOT power MOSFET s use integrated circuit and small-signal packages which have been been modified to provide the heat transfer capabilities required by power devices. Leadframe materials and design, molding compounds, and die attach materials have been changed, while the footprint of the packages remains the same.See Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFET s, (/doc?72286), for the basis of the pad design for a LITTLE FOOT SOT-23 power MOSFET footprint . In converting this footprint to the pad set for a power device, designers must make two connections: an electrical connection and a thermal connection, to draw heat away from the package.The electrical connections for the SOT-23 are very simple. Pin 1 is the gate, pin 2 is the source, and pin 3 is the drain. As in the other LITTLE FOOT packages, the drain pin serves the additional function of providing the thermal connection from the package to the PC board. The total cross section of a copper trace connected to the drain may be adequate to carry the current required for the application, but it may be inadequate thermally. Also, heat spreads in a circular fashion from the heat source. In this case the drain pin is the heat source when looking at heat spread on the PC board.Figure 1 shows the footprint with copper spreading for the SOT-23 package. This pattern shows the starting point for utilizing the board area available for the heat spreading copper. T o create this pattern, a plane of copper overlies the drain pin and provides planar copper to draw heat from the drain lead and start the process of spreading the heat so it can be dissipated into the ambient air. This pattern uses all the available area underneath the body for this purpose.FIGURE 1.Footprint With Copper Spreading0.03941.00.0370.95Since surface-mounted packages are small, and reflow soldering is the most common way in which these are affixed to the PC board, “thermal” connections from the planar copper to the pads have not been used. Even if additional planar copper area is used, there should be no problems in the soldering process. The actual solder connections are defined by the solder mask openings. By combining the basic footprint with the copper plane on the drain pins, the solder mask generation occurs automatically.A final item to keep in mind is the width of the power traces. The absolute minimum power trace width must be determined by the amount of current it has to carry. For thermal reasons, this minimum width should be at least 0.020 inches. The use of wide traces connected to the drain plane provides a low-impedance path for heat to move away from the device.Application Note 826Vishay SiliconixA P P L I C A T I O N N O T RECOMMENDED MINIMUM PADS FOR SOT -23Legal Disclaimer Notice VishayDisclaimerALL PRODU CT, PRODU CT SPECIFICATIONS AND DATA ARE SU BJECT TO CHANGE WITHOU T NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.Material Category PolicyVishay Intertechnology, Inc. hereb y certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.分销商库存信息: VISHAYSI2343DS-T1-GE3。
SS39中文资料
SS32-S310SS32 - S310, Rev. B11999 Fairchild Semiconductor CorporationSS32 - S310, Rev. B11:1Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters]TRADEMARKSACEx™CoolFET™CROSSVOLT™E 2CMOS TM FACT™FACT Quiet Series™FAST ®FASTr™GTO™HiSeC™The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant intothe body, or (b) support or sustain life, or (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a lifesupport device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status DefinitionAdvance InformationPreliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.Formative or In DesignFirst ProductionFull ProductionNot In ProductionDISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.SyncFET™TinyLogic™UHC™VCX™ISOPLANAR™MICROWIRE™POP™PowerTrench QFET™QS™Quiet Series™SuperSOT™-3SuperSOT™-6SuperSOT™-8Rev. D。
SS-T资料
SS-T Series CS-2460 09/01/06Page 1 of 2Features•Sleek, low-profile, stylish design.•State-of-the-art thermistor technology for fast response.•SS-TR rate-of-rise model: 15°F (8.3°C)per minute.•SS-T fixed heat, Factory preset at 135°F (57°C).•SS-TH high temperature model of 190°F (88°C).•Addressable by devices via decade address switches.•Rotary, decimal addressing (1 – 99)•Two-wire SLC connection.•Visible LEDs “blink” every time the unit is addressed.•360°-field viewing angle of the visual alarm indicators (two bicolor LEDs).LEDs blink green in Normal condition and turn on steady red in Alarm.•Integral communications and built-in device-type identification.•Remote test feature from the panel.•Built-in functional test switch activated by external magnet.•Low standby current.•Built-in tamper-resistant feature.•Designed for direct-surface or electrical-box mounting.•Sealed against back pressure.•Plugs into separate base for ease of installation and maintenance. Separate base allows interchange of photoelec-tric, ionization and thermal sensors.•SEMS screws for wiring of the separate base.•Constructed of off-white Bayblend®,designed to commercial standards, and offers an attractive appearance.•94-5V plastic flammability rating.•Remote LED output connection tooptional RA400Z remote LED annuncia-tor.•Optional sounder, relay, and isolator bases.•Optional recessed (RMK400) or surface (SMK400) base mounting kits.ListingsListings and approvals below apply to the SS-T Series of intelligent, address-able thermal (heat) detectors. In some cases, certain detectors may not be listed by certain approval agencies, or listing may be in process. Consult factory for latest listing status.• UL Listed: file S2527.• CSFM approved: file 3240-1288:166.• MEA approved: file 383-02-E Vol. V.DescriptionGamewell’s Smart Scan TM intelli-gent plug-in smoke detectors with integral communication provide features that surpass conven-tional detectors. Detector sensi-tivity can be programmed in the control panel software. Sensitiv-ity is continuously monitored andreported to the panel. Point ID capability allows each detector’s address to be set with decadeaddress switches, providing exact detector locations for selective maintenance and troubleshooting. SS-T Series thermal detectors use an innovative ther-mistor sensing circuit to produce 135°F/57°C fixed-temperature (SS-T ) and rate-of-rise thermal detection (SS-TR ) in a low-profile package. SS-TH provides fixed high-temperature detection at 190°F/88°C in a low-profile package as well. These thermal detectors provide cost effective, intelligent property protection in a vari-ety of applications. SS-T Series addressable detectors are compatible with Gamewell’s 602, 610, 632, 654 and 658 addressable fire alarm control panels with a Smart Scan TM SLC.InstallationThe SS-T Series of plug-in intelligent, addressable thermal detectors use a sepa-rate base to simplify installation, service, and maintenance. Installation instruc-tions are shipped with each detector.Mount base (all base types) on an electrical backbox which is at least 1.5" (3.81cm) deep. Suitable back boxes include:• 4.0" (10.16 cm) square box.• 3.5" (8.89 cm) or 4.0" (10.16 cm) octagonal box.•Single-gang box (except relay or isolator base).•With B501BH or B501BHT base, use a 4.0" (10.16 cm) square box.•With B224RB or B224BI base, use a 3.5" (8.89 cm) or 4.0" (10.16 cm) oc-tagonal box, or a 4.0" (10.16 cm) square box.NOTES: 1) Because of the inherent supervision provided by the SLC loop, end-of-line resis-tors are not required. Wiring “T-taps” or branches are permitted for Style 4 (Class “B”) wiring.2) When using relay or sounder bases , consult the SS-LI data sheet for device limitations between isolator modules and isolator bases.ApplicationsUse thermal detectors for protection of property. For further information, go to for manual I56-407-00, Applications Manual for System Smoke Detectors, which provides detailed information on detector spacing, place-ment, zoning, wiring, and special applications.Bayblend® is a registered trademark of Bayer Corporation.6936pho1.jpgSS-T in SS-B6 baseSS-T SeriesIntelligent Addressable Plug-In Thermal (Heat) DetectorsSS-T Series CS-2460 09/01/06Page 2 of 2Gamewell-FCI 12 Clintonville Road Northford, CT 06472-1610Phone: 203-484-7161Fax: A Honeywell Company © 2006 Gamewell-FCIProduct Line InformationWiring DiagramsSize2.1" (5.3 cm) high x 4.1" (10.4 cm)diameter installed in B501 base, 6.1"(15.5 cm) diameter installed in SS-B6base.Shipping weight 4.8 oz. (137 g).Operating temperature rangeSS-T, SS-TR: –20°C to 38°C (–4°F to 100°F)SS-TH: –20°C to 66°C (–4°F to 150°F).Detector spacingUL approved for 50 ft. (15.24 m) centerto center. FM approved for 25 x 25 ft.(7.62 x 7.62 m) spacing.Relative humidity10% – 93% noncondensing.Thermal ratingsFixed-temperature setpoint 135°F (57°C),rate-of-rise detection 15°F (8.3°C) per minute, high temperature heat 190°F (88°C).ELECTRICAL SPECIFICATIONS:Voltage range15 - 32 volts DC peak.Standby current (max. avg.)200 µA @ 24 VDC (without communica-tion); 300 µA @ 24 VDC (one communi-cation every 5 seconds with LED en-abled).LED current (max.)6.5 mA @ 24 VDC (“ON”).BASES AVAILABLE:SS-B6: 6.1" (15.5 cm) diameter.B501: 4.1" (10.4 cm) diameter.B501BH or B501BHT: Sounder base assembly. Includes B501 base.B224RB Relay Base: Screw terminals:up to 14 AWG (2.0 mm²). Relay type:Form-C. Rating: 2.0 A @ 30 VDCresistive; 0.3 A @ 110 VDC inductive; 1.0A @ 30 VDC inductive. Dimensions: 6.2"(15.748 cm) x 1.2" (3.048 cm).B224BI Isolator Base: Dimensions: 6.2"(15.748 cm) x 1.2" (15.748 cm). Maxi-mum: 25 devices between isolatorbases. See Note 2 under Installation on page 1.SS-T : Intelligent, addressable thermal detector. Must be mounted to one of the bases listed below.SS-TR : Same as SS-T with rate-of-rise feature.SS-TH : Intelligent, addressable high-temperature thermal (190°F/88°C) detector.Bases:SS-B6: Standard U.S. low-profile base, UL Listing.B501BP : Standard European flangeless base, pkg. of 10.B501BH : Sounder base, includes B501base above.B501BHT : Same as B501BH, but includes temporal sounder.B224RB : Intelligent relay base.B224BI : Intelligent isolator base. Isolates SLC from loop shorts.Accessories:RA400Z : Remote LED annunciator. 3 – 32VDC. Fits U.S. single-gang electrical box.Supported by SS-B6 and B501 bases only.SMK400: Surface mounting kit provides for entry of surface wiring conduit. For use with B501 base only .RMK400: Recessed mounting kit. For use with B501 base only .SMB600: Surface mounting kit for use withAddress dial on back of detector.SS-B6.BCK-200B : Black detector covers, box of 10.M02-04-01: Test magnet.M02-09-00: Test magnet with telescope stick.XR2B : Detector removal tool. Allowsinstallation and/or removal of SS-T Series thermal detector heads from base in high ceiling installations.T55-127-000: Detector removal tool without pole.XP-4: Extension pole for XR2B. Comes in three 5-ft. sections.Detector Guards:NOTE: The following guards are not UL listed with the SS-T detectors. Consult with AHJ.STI 9601: Low-profile, flush-mount smoke detector guard, wire.STI 9602: Low-profile, surface-mount, smoke detector guard, wire.STI 9609: High-profile, flush-mount, smoke detector guard, wire.STI 9605: High-profile, surface-mount, smoke detector guard, wire.STI 9604: Flush-mount heat detector guard, wire.STI 9610: Surface-mount heat detector guard, wire.STI-8200-SS : Flush-mount stainless steel smoke detector guardSTI-8230-SS : Surface-mount stainless steel smoke detector guard。
SBAV70LT1G;SBAV70LT3G;中文规格书,Datasheet资料
Site and Control Change Requirements These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant*
SOT−23 (TO−236) CASE 318 STYLE 9 ANODE 1
MAXIMUM RATINGS (EACH DIODE)
3
/
BAV70LT1G, SBAV70LT1G, BAV70LT3G, SBAV70LT3G
PACKAGE DIMENSIONS
SOT−23 (TO−236) CASE 318−08 ISSUE AP
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A A1 b c D E e L L1 HE q MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10 0 MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 −−− 10 MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083 0 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094 −−− MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104 10
TC15-11SRWA, 规格书,Datasheet 资料
Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V.
Absolute Maximum Ratings at TA=25°C
Parameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating / Storage Temperature Lead Solder Temperature[2]
SPEC NO: DSAD2448 APPROVED: WYNEC
REV NO: V.9 CHECKED: Joe Lee
DATE: APR/02/2011 DRAWN: J.Yu
PAGE: 2 OF 6 ERP: 1332000540
芯天下--/
Super Bright Red
PACKING & LABEL SPECIFICATIONS
TC15-11SRWA
SPEC NO: DSAD2448 APPROVED: WYNEC
REV NO: V.9 CHECKED: Joe Lee
DATE: APR/02/2011 DRAWN: J.Yu
PAGE: 4 OF 6 ERP: 1332000540
Notes: 1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted. 2. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
ss38二极管参数
ss38二极管参数
SS38是一种快恢复二极管，通常用于电源、开关电源和其他电子设备中。
它具有以下主要参数：
1. 最大正向电压（Vrrm），SS38的最大正向电压为80V，这意味着在正向工作时，其电压不应超过80V。
2. 平均整流电流（Io），SS38的平均整流电流为3A，这是指在特定工作条件下，它能够连续承受的平均电流。
3. 最大反向漏电流（Ir），SS38的最大反向漏电流为5uA，这表示在反向工作时，其反向漏电流不超过5微安。
4. 正向压降（Vf），在额定电流条件下，SS38的正向压降通常为0.55V，这是指在正常工作时，器件的正向压降。
5. 封装类型，SS38通常采用DO-214AB（SMC）封装，这是一种表面贴装封装，便于在电路板上进行安装和焊接。
总的来说，SS38二极管具有较高的最大正向电压和平均整流电
流，适合在一些对电压和电流要求较高的场合使用。
在实际应用中，还需要根据具体的电路设计和要求来选择合适的二极管，以确保电
路的稳定性和可靠性。
TMP320C6211GJL120资料
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. VelociTI, TMS320C62x, and MicroStar BGA are trademarks of Texas Instruments. Motorola is a trademark of Motorola, Inc. † IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Copyright 2004, Texas Instruments Incorporated
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
1
元器件交易网
TMS320C6205 FIXED-POINT DIGITAL SIGNAL PROCESSOR
元器件交易网
TMS320C6205 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS106E − OCTOBER 1999 − REVISED MARCH 2004
D High-Performance Fixed-Point Digital
D 32-Bit/33-MHz
DLeabharlann D D D D DPeripheral Component Interconnect (PCI) Master/Slave Interface Conforms to: PCI Specification 2.2 Power Management Interface 1.1 Meets Requirements of PC99 − PCI Access to All On-Chip RAM, Peripherals, and External Memory (via EMIF) − Four 8-Deep x 32-Wide FIFOs for Efficient PCI Bus Data Transfer − 3.3/5-V PCI Operation − Three PCI Bus Address Registers: Prefetchable Memory Non-Prefetchable Memory I/O − Supports 4-Wire Serial EEPROM Interface − PCI Interrupt Request Under DSP Program Control − DSP Interrupt Via PCI I/O Cycle Two Multichannel Buffered Serial Ports (McBSPs) − Direct Interface to T1/E1, MVIP, SCSA Framers − ST-Bus-Switching Compatible − Up to 256 Channels Each − AC97-Compatible − Serial-Peripheral-Interface (SPI) Compatible (Motorola) Two 32-Bit General-Purpose Timers IEEE-1149.1 (JTAG†) Boundary-Scan-Compatible 288-Pin MicroStar BGA Package (GHK Suffix) 0.15-µm/5-Level Metal Process − CMOS Technology 3.3-V I/Os, 1.5-V Internal, 5-V Voltage Tolerance for PCI I/O Pins
SSQE48T15033-NAA0G;中文规格书,Datasheet资料
Applications• Telecommunications • Data communications • Wireless communications • Servers, workstations Benefits• High efficiency – no heat sink required • Cost effective, single board design • Small size and low-profile Features• RoHS lead-free solder and lead-solder-exempted products are available• Industry-standard DOSA pinout • Output: 3.3 V at 15 A• On-board input differential LC-filter • Start-up into pre-biased load • No minimum load required • Weight: 0.44 oz [12.3 g]•Meets Basic Insulation requirements of EN60950 • Withstands 100 V input transient for 100 ms • Fixed-frequency operation • Hiccup overcurrent protection• Fully protected (OTP, OCP, OVP, UVLO) • Remote sense• Remote ON/OFF positive or negative logic option • Output voltage trim range: +10%/−20% with industry-standard trim equations • Low height of 0.374” (9.5mm)• Industry standard 1/16th brick footprint: 0.9” by 1.3” • High reliability: MTBF = 16.23 million hours,calculated per Telcordia TR-332, Method I Case 1 • UL60950 recognized in US and Canada and DEMKO certified per IEC/EN60950• Designed to meet Class B conducted emissions per FCC and EN55022 when used with external filter • All materials meet UL94, V-0 flammability ratingDescriptionThe new SSQE48T15033 DC-DC converter is an open frame sixteenth-brick DC-DC converter that conforms to the Distributed Open Standards Architecture (DOSA) specifications. The converter operates over an input voltage range of 36 to 75 VDC, and provides a tightly regulated output voltage with an output current up to 15 A. The output is fully isolated from the input and the converter meets Basic Insulation requirements permitting a positive or negative output configuration.The converter is constructed using a single-board approach with both planar and discrete magnetics. The standard feature set includes remote On/Off (positive or negative logic), input undervoltage lockout, output overvoltage, overcurrent, and short circuit protections, output voltage trim, and overtemperature shutdown with hysteresis.With standard pinout and trim equations and excellent thermal performance, the SSQE48T15033 converters can replace in most cases existing eighth-brick converters. Inclusion of this converter in a new design can result in significant board space and cost savings.Electrical SpecificationsConditions: T A = 25 ºC, Airflow = 300 LFM (1.5 m/s), Vin = 48 VDC, Cin=33 µF, unless otherwise specified.Parameter NotesMinTypMaxUnitsAbsolute Maximum RatingsInput Voltage Continuous 0 80 VDCOperating Ambient Temperature-4085°C Storage Temperature -55 125 °CIsolation CharacteristicsI/O Isolation 2250 VDCIsolation Capacitance 150 pFIsolation Resistance 10 MΩFeature CharacteristicsSwitching Frequency 440 kHzOutput Voltage Trim Range1Industry-standard equations (3.3V) -20 +10 %Remote Sense Compensation1Percent of V OUT(NOM) +10%Output Over-voltage Protection Non-latching 120 130 140 %Over-temperature Shutdown (PCB) Non-latching 125 °CPeak Backdrive Output Current during startup into prebiased output Sinking current from external voltagesource equal V OUT(NOM) – 0.6V andconnected to output via 1Ω resistor50mADCBackdrive Output Current in OFF stateConverter is OFF;External voltage=5 VDC10 mADCAuto-Restart Period Applies to all protection features 200 msTurn-On Time See Figures E, F, and G 5 msON/OFF Control (Positive Logic)Converter Off (logic low) -20 0.8 VDCConverter On (logic high) 2.4 20 VDCON/OFF Control (Negative Logic)Converter Off (logic high) 2.4 20 VDCConverter On (logic low) -20 0.8 VDCMechanicalWeight12.3gReliabilityMTBF Telcordia SR-332, Method I Case 150% electrical stress, 40°C ambient16.23 MHrsAdditional Notes:1Vout can be increased up to 10% via the sense leads or 10% via the trim function. However, the total output voltage trim from all sources shall not exceed 10% of V OUT(NOM) in order to ensure specified operation of overvoltage protection circuitry.Electrical Specifications (continued)Conditions: T A = 25 ºC, Airflow = 300 LFM (1.5 m/s), Vin = 48 VDC, Cin=33 µF, unless otherwise specified.Parameter NotesMinTypMaxUnitsInput CharacteristicsOperating Input Voltage Range 36 48 75 VDCInput Under-voltage LockoutTurn-on Threshold 33 34 35 VDCTurn-off Threshold 31 32 33 VDCInput Voltage Transient 100 ms 100 VDCMaximum Input Current V IN = 36VDC , I OUT=15ADC 1.56ADCInput Stand-by Current Vin = 48V, converter disabled 10 mAInput No Load Current (0 load on the output) Vin = 48V, converter enabled 43 mAInput Reflected-Ripple Current,i s Vin = 48V, 25 MHz bandwidth 10 20 mA PK-PKInput Voltage Ripple Rejection 120 Hz 90 dBOutput CharacteristicsExternal Load Capacitance Plus full resistive load20,000µFOutput Current Range 3.3 VDC015ADCCurrent Limit Inception Non-latching, for 3.3 VDC16.518.7521ADCPeak Short-Circuit Current Non-latching, Short = 10 mΩ21 ARMS Short-Circuit Current Non-latching5 ArmsOutput Voltage Setpoint Accuracy (no load)-1.5+1.5%V OUTOutput RegulationOver Line±2±5mVOver Load ±2 ±5 mVOverall Output Voltage Regulation Over line, load and temperature2-2.5+2.5%VoutOutput Ripple and Noise – 25 MHz bandwidth Full load + 10 µF tantalum + 1 µFceramic70mV PK-PKDynamic ResponseLoad Change50%-75%-50%of Iout Max, di/dt = 0.1 A/µs Co = 1 µF ceramic + 10 uF tantalumFigure 840 mVSettling Time to 1% of Vout50 µsLoad Change50%-75%-50%of Iout Max , di/dt = 5 A/µs Co = 470 µF POS + 1 µF ceramicFigure 9100 mVSettling Time to 1% of Vout50 µs Efficiency100% Load V OUT = 3.3 VDC 90 % 50% Load V OUT = 3.3 VDC 89.4 %Additional Notes:2Operating ambient temperature range is -40 ºC to 85 ºCOperationsInput and Output ImpedanceThese power converters have been designed to be stable with no external capacitors when used in low inductance input and output circuits.However, in some applications, the inductance associated with the distribution from the power source to the input of the converter can affect the stability of the converter. A 33 µF electrolytic capacitor with an ESR < 1 Ω across the input is recommended to ensure stability of the converter over the wide range of input source impedance. In many applications, the user has to use decoupling capacitance at the load. The power converter will exhibit stable operation with external load capacitance up to 20,000 µF. ON/OFF (Pin 2)The ON/OFF pin is used to turn the power converter on or off remotely via a system signal. There are two remote control options available, positive and negative logic, both referenced to Vin(-). A typical connection is shown in Fig. A.Fig. A: Circuit configuration for ON/OFF function.The positive logic version turns on when the ON/OFF pin is at a logic high and turns off when the pin is at a logic low. The converter is on when the ON/OFF pin is left open. See the Electrical Specifications for logic high/low definitions.The negative logic version turns on when the pin is at a logic low and turns off when the pin is at a logic high. The ON/OFF pin can be hard wired directly to Vin(-) to enable automatic power up of the converter without the need of an external control signal.The ON/OFF pin is internally pulled up to 5 V through a resistor. A properly de-bounced mechanical switch, open-collector transistor, or FET can be used to drive the input of the ON/OFF pin. The device must be capable of sinking up to 0.2 mA at a low level voltage of ≤ 0.8 V. An external voltage source (±20 V maximum) may be connected directlyto the ON/OFF input, in which case it must be capable of sourcing or sinking up to 1 mA depending on the signal polarity. See the Startup Information section for system timing waveforms associated with use of the ON/OFF pin. Remote Sense (Pins 5 and 7)The remote sense feature of the converter compensates for voltage drops occurring between the output pins of the converter and the load. The SENSE(-) (Pin 5) and SENSE(+) (Pin 7) pins should be connected at the load or at the point where regulation is required (see Fig. B).RloadFig. B: Remote sense circuit configuration.CAUTIONIf remote sensing is not utilized, the SENSE(-) pin must be connected to the Vout(-) pin (Pin 4), and the SENSE(+) pin must be connected to the Vout(+) pin (Pin 8) to ensure the converter will regulate at the specified output voltage. If these connections are not made, the converter will deliver an output voltage that is slightly higher than the specified data sheet value.Because the sense leads carry minimal current, large traces on the end-user board are not required. However, sense traces should be run side by side and located close to a ground plane to minimize system noise and ensure optimum performance. The converter’s output overvoltage protection (OVP) senses the voltage across Vout(+) and Vout(-), and not across the sense lines, so the resistance (and resulting voltage drop) between the output pins of the converter and the load should be minimized to prevent unwanted triggering of the OVP.When utilizing the remote sense feature, care must be taken not to exceed the maximum allowable output power capability of the converter, which is equal to the product of the nominal output voltage and the allowable output current for the given conditions.When using remote sense, the output voltage at the converter can be increased by as much as 10% above the nominal rating in order to maintain the required voltage across the load. Therefore, the designer must, if necessary, decrease the maximum current (originally obtained from the derating curves)by the same percentage to ensure the converter’s actual output power remains at or below the maximum allowable output power. Output Voltage Adjust /TRIM (Pin 6)The output voltage can be adjusted up 10% or down 20%.The TRIM pin should be left open if trimming is not being used. To minimize noise pickup, a 0.1 µF capacitor is connected internally between the TRIM and SENSE(-) pins.To increase the output voltage, refer to Fig. C. A trim resistor, R T-INCR , should be connected between the TRIM (Pin 6) and SENSE(+) (Pin 7), with a value of:10.221.225∆626∆)V 5.11(100R NOM O INCR T −−+=−− [k Ω],where,=−INCR T R Required value of trim-up resistor [k Ω]=−NOM O V Nominal value of output voltage [V]100X V )V (V∆ NOM- O NOM -O REQ -O −=[%]=−REQ O V Desired (trimmed) output voltage [V].When trimming up, care must be taken not to exceed the converter‘s maximum allowable output power. See the previous section for a complete discussion of this requirement.Fig. C: Configuration for increasing output voltage.To decrease the output voltage (Fig. D), a trim resistor, R T-DECR , should be connected between the TRIM (Pin 6) and SENSE(-) (Pin 5), with a value of:10.22|∆|511R DECR T −=− [k Ω] where,R T-DECR = Required value of trim-down resistor [k Ω] and ∆ is defined above. Note:The above equations for calculation of trim resistor values match those typically used in conventional industry-standard quarter-bricks, eighth-bricks and sixteenth-bricks.RloadFig. D: Configuration for decreasing output voltage.Trimming/sensing beyond 110% of the rated output voltage is not an acceptable design practice, as this condition could cause unwanted triggering of the output overvoltage protection (OVP) circuit. The designer should ensure that the difference between the voltages across the converter’s output pins and its sense pins does not exceed 10% of V OUT (nom), or:X NOM -O SENSE SENSE OUT OUT 10%V )](V )([V )](V )([V ≤−−+−−−+[V]This equation is applicable for any condition of output sensing and/or output trim.Protection FeaturesInput Undervoltage LockoutInput undervoltage lockout is standard with this converter. The converter will shut down when the input voltage drops below a pre-determined voltage. The input voltage must be typically 35 V for the converter to turn on. Once the converter has been turned on, it will shut off when the input voltage drops typically below 33 V. This feature is beneficial in preventing deep discharging of batteries used in telecom applications.Output Overcurrent Protection (OCP)The converter is protected against overcurrent or short circuit conditions. Upon sensing an overcurrent condition, the converter will switch to constant current operation and thereby begin to reduce output voltage. During short circuit, when the output voltage drops significantly below 50% its nominal value, the converter will shut down.Once the converter has shut down, it will attempt to restart nominally every 200 ms with a very low duty cycle. The attempted restart will continue indefinitely until the overload or short circuit conditions are removed.Once the output current is brought back into its specified range, the converter automatically exits the hiccup mode and continues normal operation. Output Overvoltage Protection (OVP)The converter will shut down if the output voltage across Vout(+) (Pin 8) and Vout(-) (Pin 4) exceeds the threshold of the OVP circuitry. The OVP circuitry contains its own reference, independent of the output voltage regulation loop. Once the converter has shut down, it will attempt to restart every 200 ms until the OVP condition is removed.Overtemperature Protection (OTP)The converter will shut down under an overtemperature condition to protect itself from overheating caused by operation outside the thermal derating curves, or operation in abnormal conditions such as system fan failure. Converter will automatically restart after it has cooled to a safe operating temperature. Safety RequirementsThe converters meet North American and International safety regulatory requirements perUL60950 and EN60950. Basic Insulation is provided between input and output.The converters have no internal fuse. If required, the external fuse needs to be provided to protect the converter from catastrophic failure. Refer to the “Input Fuse Selection for DC/DC converters” application note on www.power-one-com for proper selection of the input fuse. Both input traces and the chassis ground trace (if applicable) must be capable of conducting a current of 1.5 times the value of the fuse without opening. The fuse must not be placed in the grounded input line.Abnormal and component failure tests were conducted with the input protected by a 20A fuse. If a fuse rated greater than a 20A is used, additional testing may be required. To protect a group of converters with a single fuse, the rating can be increased from the recommended value above. Electromagnetic Compatibility (EMC)EMC requirements must be met at the end-product system level, as no specific standards dedicated to EMC characteristics of board mounted component DC-DC converters exist. However, Power-One tests its converters to several system level standards, primary of which is the more stringent EN55022, Information technology equipment - Radio disturbance characteristics-Limits and methods of measurement.An effective internal LC differential filter significantly reduces input reflected ripple current, and improves EMC.With the addition of a simple external filter, all versions of the SSQE48T15033 converters pass the requirements of Class B conducted emissions per EN55022 and FCC requirements. Please contact Power-One Applications Engineering for details of this testing.(ii) The temperature of the transformer does not exceed 125 °C, orCharacterization General Information(iii) The nominal rating of the converter.The converters have been characterized for many operational aspects, to include thermal derating (maximum load current as a function of ambient temperature and airflow) for vertical and horizontal mounting, efficiency, startup and shutdown parameters, output ripple and noise, transient response to load step-change, overload, and short circuit.During normal operation, derating curves with maximum FET temperature less or equal to 125 °C should not be exceeded. Temperature at thermocouple location shown in Fig. H should not exceed 100 °C in order to operate inside the derating curves.Test ConditionsAll data presented were taken with the converter soldered to a test board, specifically a 0.060” thick printed wiring board (PWB) with four layers. The top and bottom layers were not metallized. The two inner layers, comprised of two-ounce copper, were used to provide traces for connectivity to the converter. The lack of metallization on the outer layers as well as the limited thermal connection ensured that heat transfer from the converter to the PWB was minimized. This provides a worst-case but consistent scenario for thermal derating purposes.Fig. H: Locations of the thermocouple for thermal testing.EfficiencyFigure 2 shows the efficiency vs. load current plot for ambient temperature of 25 ºC, airflow rate of 300 LFM (1.5 m/s) with vertical mounting and input voltages of 36 V, 48 V, and 75 V. Also, a plot of efficiency vs. load current, as a function of ambient temperature with Vin=48 V, airflow rate of 200 LFM (1 m/s) with vertical mounting is shown in Figure 3.All measurements requiring airflow were made in the vertical and horizontal wind tunnel using Infrared (IR) thermography and thermocouples for thermometry. Ensuring components on the converter do not exceed their ratings is important to maintaining high reliability. If one anticipates operating the converter at or close to the maximum loads specified in the derating curves, it is prudent to check actual operating temperatures in the application. Thermographic imaging is preferable; if this capability is not available, then thermocouples may be used. The use of AWG #40 gauge thermocouples is recommended to ensure measurement accuracy. Careful routing of the thermocouple leads will further minimize measurement error. Refer to Fig. H for the recommended measuring thermocouple location. Power DissipationFigure 4 shows the power dissipation vs. load current plot for Ta = 25 ºC, airflow rate of 300 LFM (1.5 m/s) with vertical mounting and input voltages of 36 V, 48 V, and 75 V. Also, a plot of power dissipation vs. load current, as a function of ambient temperature with Vin = 48 V, airflow rate of 200 LFM (1 m/s) with vertical mounting is shown in Figure 5.StartupOutput voltage waveforms during the turn-on transient using the ON/OFF pin for full rated load currents (resistive load) are shown without and with external load capacitance in Figure 6 and Figure 7, respectively. Thermal DeratingLoad current vs. ambient temperature and airflow rates are given in Figure 1. Ambient temperature was varied between 25 °C and 85 °C, with airflow rates from 30 to 500 LFM (0.15 to 2.5 m/s).Ripple and NoiseFor each set of conditions, the maximum load current was defined as the lowest of: Figure 10 shows the output voltage ripple waveform, measured at full rated load current with a 10 µF tantalum and 1 µF ceramic capacitor across the output. Note that all output voltage waveforms are measured across a 1 µF ceramic capacitor.(i) The output current at which any FET junction temperature does not exceed a maximum specified temperature of 125 °C as indicated by the thermographic image, orThe input reflected-ripple current waveforms are obtained using the test setup shown in Figure 11.Figure 1. Available load current vs. ambient air temperature and airflow rates for SSQE48T15033 converter mounted vertically withair flowing from pin 1 to pin 3, Vin = 48 V. Note: NC – Natural convectionFigure 2.Efficiency vs. load current and input voltage for SSQE48T15033 converter mounted vertically with air flowing from pin 1 to pin 3 at a rate of 300 LFM (1.5 m/s) and Ta=25°C.Figure 3. Efficiency vs. load current and ambient temperaturefor SSQE48T15033 converter mounted vertically with Vin=48V and air flowing from pin 1 to pin 3 at a rate of 200LFM (1.0m/s).Figure 4. Power dissipation vs. load current and inputvoltage for SSQE48T15033 converter mounted vertically with air flowing from pin 1 to pin 3at a rate of 300 LFM (1.5 m/s) and Ta = 25 °C.Figure 5. Power dissipation vs. load current and ambienttemperature for SSQE48T15033 converter mounted vertically with Vin = 48 V and air flowing from pin 1 to pin 3at a rate of 200 LFM (1.0 m/s).Figure 6. Turn-on transient at full rated load current(resistive) with no output capacitor at Vin = 48 V, triggered via ON/OFF pin. Top trace: ON/OFF signal (5 V/div.). Bottom trace: Output voltage (1.0 V/div.). Time scale: 5 ms/div.Figure 7. Turn-on transient at full rated load current(resistive) plus 20,000 µF at Vin = 48 V, triggered via ON/OFF pin. Top trace: ON/OFF signal (5 V/div.). Bottom trace: Output voltage (1 V/div.). Time scale: 5 ms/div.Figure 8. Output voltage response to load current step-change (7.5A–10.25A–7.5A) at Vin=48V. Top trace:output voltage (100 mV/div.). Bottom trace: load current (5A/div.). Current slew rate: 0.1A/µs. Co=1µF ceramic + 10µF tantalum. Time scale: 0.2ms/div.Figure 9. Output voltage response to load current step-change (7.5A–10.25A–7.5A) at Vin=48V. Top trace:output voltage (100 mV/div.). Bottom trace: load current (5A/div.). Current slew rate: 5A/µs. Co= 470µF POS + 1µF ceramic. Time scale: 0.2 ms/div.分销商库存信息: POWER-ONESSQE48T15033-NAA0G。
KS383资料
PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74CB3T3383DBQRE4ACTIVE SSOP/QSOP DBQ 242500Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR 74CB3T3383DBQRG4ACTIVE SSOP/QSOP DBQ 242500Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR 74CB3T3383DGVRE4ACTIVE TVSOP DGV 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CB3T3383DGVRG4ACTIVE TVSOP DGV 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383DBQR ACTIVE SSOP/QSOP DBQ 242500Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74CB3T3383DGVR ACTIVE TVSOP DGV 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383DW ACTIVE SOIC DW 2425Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383DWE4ACTIVE SOIC DW2425Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383DWG4ACTIVE SOIC DW 2425Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383DWR ACTIVE SOIC DW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383DWRE4ACTIVE SOIC DW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383DWRG4ACTIVE SOIC DW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383PW ACTIVE TSSOP PW 2460Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383PWE4ACTIVE TSSOP PW 2460Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383PWG4ACTIVE TSSOP PW 2460Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383PWR ACTIVE TSSOP PW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383PWRE4ACTIVE TSSOP PW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T3383PWRG4ACTIVETSSOPPW242000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die andPACKAGE OPTION ADDENDUM24-May-2007Addendum-Page 1元器件交易网package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM24-May-2007TAPE AND REEL INFORMATIONDevice Package Pins Site ReelDiameter(mm)ReelWidth(mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantSN74CB3T3383DBQR DBQ24MLA33016 6.59.0 2.1816Q1 SN74CB3T3383DGVR DGV24MLA330127.0 5.6 1.6812Q1 SN74CB3T3383DWR DW24TAI3302410.7515.7 2.71224Q1 SN74CB3T3383PWR PW24MLA33016 6.958.3 1.6816Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length(mm)Width(mm)Height(mm) SN74CB3T3383DBQR DBQ24MLA346.0346.033.0SN74CB3T3383DGVR DGV24MLA346.0346.029.0SN74CB3T3383DWR DW24TAI346.0346.041.0SN74CB3T3383PWR PW24MLA346.0346.033.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI)reserve the right to make corrections,modifications,enhancements,improvements,and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreementspecifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products Applications AmplifiersAudioDataConvertersAutomotiveDSPBroadband Interface Digital Control Logic MilitaryPower Mgmt Optical Networking Microcontrollers Security RFID Telephony Low Power Video &Imaging WirelessWirelessMailing Address:Texas Instruments,Post Office Box 655303,Dallas,Texas 75265Copyright ©2007,Texas Instruments Incorporated元器件交易网。
BD140G;BD136G;BD138G;BD136;BD140;中文规格书,Datasheet资料
BD136, BD138, BD140 Plastic Medium Power Silicon PNP TransistorThis series of plastic, medium−power silicon PNP transistors are designed for use as audio amplifiers and drivers utilizing complementary or quasi complementary circuits.Features•Pb−Free Packages are Available*•DC Current Gain − h FE = 40 (Min) @ I C = 0.15 Adc•BD 136, 138, 140 are complementary with BD 135, 137, 139 MAXIMUM RATINGSMaximum ratings are those values beyond which device damage can oc-cur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.THERMAL CHARACTERISTICS*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.Device Package Shipping†BD136TO−225AA500 Units/Box 1.5 A POWER TRANSISTORSPNP SILICON45, 60, 80 V, 12.5 WBD138TO−225AA500 Units/Box BD140TO−225AA500 Units/Box BD136G TO−225AA(Pb−Free)500 Units/Box ORDERING INFORMATION†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.BD138G TO−225AA(Pb−Free)500 Units/BoxBD140G TO−225AA(Pb−Free)500 Units/BoxELECTRICAL CHARACTERISTICS (T= 25_C unless otherwise noted)*Pulse Test: Pulse Width x 300 m s, Duty Cycle x 2.0%.10Figure 1. Active−Region Safe Operating AreaV CE , COLLECTOR−EMITTER VOLTAGE (VOLTS)5.02.01.00.50.010.10.05I C , C O L L E C T O R C U R R E N T (A M P )0.020.2PACKAGE DIMENSIONSTO−225AACASE 77−09ISSUE ZPIN 1.EMITTER2.COLLECTOR3.BASEhttp ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息:ONSEMIBD140G BD136G BD138G BD136BD140BD138。
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© Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 21Publication Order Number:1SS383T1G/D1SS383T1GPreferred DeviceDual Schottky DiodeDual 40 V, 300 mA Low V F Schottky Diodes in 4−lead SC−82 package.Features•Low Forward V oltage: V F = 0.48 V (typ) @ I F = 100 mA •Low Reverse Current: I R = 5 m A (max)•This is a Pb−Free Device*MAXIMUM RATINGS (T A = 25°C)Rating Symbol Max Unit Continuous Reverse Voltage V R40V Maximum Peak Forward Current*I FM300mA Peak Forward Surge CurrentPulse Width = 10 m sI FM(surge)500mA THERMAL CHARACTERISTICSCharacteristic(Both Junctions Heated)Symbol Max UnitTotal Device Dissipation T A = 25°CDerate above 25°C P D200(Note 1)1.6(Note 1)mWmW/°CThermal Resistance, Junction-to-Ambient R q JA625(Note 1)°C/WJunction and StorageTemperatureT J, T stg−55 to +150°CStresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.*Both Devices Active1.FR−4 @ Minimum Pad.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) Characteristic SymbolMin Typ Max UnitForward Voltage (I F = 1.0 mA) (I F = 10 mA) (I F = 100 mA)V F−−−280360540−−600mVReverse Current (V R = 40 V)IR−−5m ACapacitance(V R = 0, f = 1.0 MHz)C D−−25pF*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.Preferred devices are recommended choices for future use and best overall value.21Device Package Shipping†ORDERING INFORMATION1SS383T1G SC−82(Pb−Free)3000/T ape & Reel34†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.1SS383T1GPACKAGE DIMENSIONSSC−82, 4 LEAD, GULL WINGCASE 900AA−01ISSUE ONOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETERS3.MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUMTHICKNESS OF BASE MATERIAL.4.DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.STYLE 1:PIN 1.ANODE 12.ANODE 23.CATHODE 24.CATHODE 1DIM MIN NOM MAX MILLIMETERS A 0.800.90 1.00A 0−−−0.10b 0.100.200.30C 0.100.180.25D 1.80 2.00 2.20E 1.15 1.25 1.35e 1.30 BSC 2.00 2.10 2.20L0.100.200.300.0320.0350.040−−−0.0040.0040.0080.0120.0040.0070.0100.0710.0790.0870.0450.0490.0530.051 BSC 0.0790.0830.0870.0040.0080.012MIN NOM MAX INCHES1H E ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息: ONSEMI1SS383T1G。