ELECTRONIC CIRCUIT COMPONENT

专利名称：ELECTRONIC CIRCUIT COMPONENT 发明人：TANAHASHI SHIGEO,IWATA YASUTOSHI 申请号：JP18704387
申请日：19870727
公开号：JPS6430294A
公开日：
19890201
专利内容由知识产权出版社提供
摘要：PURPOSE:To obtain an electronic circuit component in which the excellent adhesiveness between an interlayer insulating film made of polymer material and a conductor layer for an electric wiring and, further, the excellent insulation reliability of the insulating film are provided by a method wherein a metal layer made of at least one of molybdenum and titanium and with a specific thickness is formed on the interlayer insulating film as the foundation layer of the conductor layer. CONSTITUTION:A metal layer made of at least one of molybdenum and titanium and with a thickness of 0.03-
0.5mum is formed on an interlayer insulating film made of polymer material as the foundation of a conductor layer for an electric wiring in an electronic circuit component. If the thickness of the metal layer is less than 0.03mum, mutual diffusion between the metal layer and the conductor layer made of copper is induced by heat and there is a possibility of creating adhesion defect. On the other hand, if the thickness of the metal film is above 0.50mum, a residual stress exceeds 2.5X10<5>dyne/cm and crackings are developed in the insulating layer. A lower layer conductor 2 is formed on the upper surface of an insulating substrate 1 by a conventional vapor growth method and polymer material such as polytetrafluoroethylene is applied to it by spin-coating and subjected to a heat treatment to form an insulating film 3.
申请人：KYOCERA CORP 更多信息请下载全文后查看。