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Dell M系列刀片式服务器

戴尔Force10 MXL 10/40GbE刀片式交换机
高性能且功能全面的1/10/40GbE第2层和第3层交换机刀片
戴尔Force10 MXL 10/40GbE刀片式交换机
内部服务器连接端口最多32个GbE/10GbE - 2x40GbE固定端口 - 两个选配Flex I/O模块 40GbE端口 FTOS
Flex I/O
• 4端口SFP+模块 – – 1GbE和10GbE端口 10GbE光纤和DAC铜线 Twin-ax
外部端口
堆叠操作系统
• 4端口10GBASE-T模块
–
–
比M8024-k多2倍
1GbE和10GbE端口
可靠且可扩展的I/O性能、低延迟和高带宽支持本地40GbE端口
• 2端口QSFP+模块
iDRAC 和 vFlash 远程管理和嵌入式的虚拟化管理程序
网络架构连接器最多支持两个处理器易于使用的手柄
• • • • 最多12个千兆以太网端口最多6个万兆以太网端口最多4个 FC8 光纤通道最多4 个QDR InfiniBand
(支持两个Mezz插槽)
最多24个 DIMM内存插槽 (M710HD)
• 板载网卡(LOM)
• Dell的优选网络适配器是提供灵活的网络选择给客户, 业界第一个提供此功能的厂商, 模块化的设计更方便升级和变更.
• 支持的网卡
• M620
• • • 一个 2x10GbE Broadcom, Intel 或者 Qlogic CNA 2个 2x10GbE Broadcom, Intel 或者 Qlogic CNA 2个Broadcom 2x1GbE 或者 2个 2x10GbE CNA

MW810移动工作站R2.0 商品说明书

A police officer receives dispatch information, with audible directions and the incident location clearly marked on a map. An incident commander keeps track of firefighter locations and vitals as they search a burning apartment building. An EMS crew submits a report without leaving their vehicle. Detectives watchstreaming video of gang members loitering, while parked discreetly two blocks away.A deputy scans the plates of 300 parked cars in minutes – without slowing down.MW 810 MOBILE WORKSTATION R 2.0CONNECTED. POWERFUL. RUGGED.More and more first responders and field personnel are using their vehicle as an office. Aided by wireless broadband and motivated by the need to keep up with information and their workload, they performmore tasks in the vehicle, from report writing to video surveillance. This requires more than fast wireless broadband and the latest software – they also need a connected, powerful, rugged and ergonomic workstation that is designed for the challenges of their work day and the rigors of their environment.The fully rugged Motorola MW810 MobileWorkstation R2.0 provides reliable, cost-effective wireless connectivity and computing power formission critical applications.COMPUTERMW810 R2.0 Central Processing Unit offers powerful computing options so you can support more applications and find answers faster.Intel 3rd Generation Core i7-3610QE, Quad Core, 2.3GHz, 6M Cache (Option)Intel 3rd Generation Core i5-3610ME, Dual Core, 2.7GHz, 3M Cache (Standard)Intel Celeron B810, Dual Core, 1.6GHz, 2M Cache (Option)Chipset and Video Controller Intel ® Panther Point PCH QM77 with integrated video controllerInternal Memory 4GB DDR3 DRAM 1600MTs Single Slot (Standard). Expandable to 8 GB Dual Slot(Total usable memory may be less, depending on configuration)Mass Storage Options Heated removable 500GB Hard Drive with 3-dimensional shock absorbers (Standard)256GB Solid State Drive (Option, instead of Hard Drive)Also: 64GB internal SSD (mSATA) on main board (Option in addition to, or instead of, removable HD or SSD)Security and Protection TPM 1.2 (Trusted Platform Module) integrated in CPUOptional internal Smart Card Reader available in 12.1" displaysOperating System Microsoft Windows ® 7 Professional, Service Pack 1 (32 bit and 64-bit versions available)COMMUNICATION AND EXPANSION PORTSMW810 R2.0 offers a range of communications modules and expansion ports, supporting both wired and wireless peripherals.Display Interface USB Ports Bluetooth ® Primary port supports DVI or RGB, Secondary port support DVI/HDMI. Both with ports via 60 pin connector Up to 2 x USB3.0 (Depends on Expansion type) and up to 4 X USB2.0 (Depends on Expansion type)Optional Bluetooth module V2.1 plus EDR (Enhanced Data Rate). Available only with 12.1" displays.ExpressCard 1 ExpressCard slot, on front of CPUAuxiliary Port 26 pin connector. 4 Programmable General Purpose I/Os can be set to input or output, working at 5V orvehicle battery voltage. Ignition sense input, plus vehicle speed and direction inputs (latter two for use withDead Reckoning GPS). Configurable Output voltage (Battery voltage output to 5V) DC output (1A) for relaycontact wetting voltage.Audio Line out (non-amplified) for external speaker; external microphone in (non-amplified)SPECIFICATIONSI/O EXPANSION BOARD OPTIONSMW810 R2.0 offers multiple expansion board options, so you can add more ports for external modems, video cameras, or other vehicle peripherals as needed.R2.0 Expansion Board Options CPU without Expansion Board CPU with ALPR Expansion Board CPU with Comm and Video Expansion Board CPU with Serial andUSB Expansion BoardVideo Out (60 pins; also includes audio, USB 2.0, remote on/off)1st port DVI/RGB 2nd port - none 1st port DVI/RGB 2nd port – DVI/HDMI 1st port DVI/RGB 2nd port – DVI/HDMI 1st port DVI/RGB NoneRS2321123CPU USB 3.02222CPU USB 2.0 0112Ethernet LAN RJ45 1GbE 1331eSATAp 0001Dual Display Interface No Yes Yes NoVideo Input No Up to four (4) PIPS Slate™ ALPR digital Cameras1 Standard Composite Video inputNoWLAN Antenna Conn.3333DISPLAY OPTIONSMW810 R2.0 displays feature outstanding touchscreen capabilities, user programmable buttons, emergency button, and setting controls. The MW810 R2.0 CPU with Comm and Video or ALPR expansion board options support the dual display feature.MW810 R2.0 12.1" Displays 12.1" Standard Brightness (500 NIT) XGA, with RGB or DVI interfaces. Resistive tempered glasstouchscreen. Contrast Ratio (CR) 1: 700. Viewing Angles H=160, V=160 at CR >10.8 programmable buttons with backlit insets so you can custom label user functions. Speaker, 1W. 3 USB2.0 ports (1 keyboard, 2 general use).12.1" High Brightness (1500 NIT) XGA, with RGB or DVI interfaces. Resistive tempered glass touchscreen.Contrast Ratio (CR) 1: 600. Viewing Angles H=160, V=140 at CR >10.8 programmable buttons with backlit insets so you can custom label user functions. Speaker, 1W. 3 USB2.0 ports (1 keyboard, 2 general use).MW810 8.4" Display 8.4" High Brightness (800 NIT) SVGA, with RGB or DVI interfaces. Resistive tempered glass touchscreen.Contrast ratio (CR) 1:450. Viewing Angles H=120, V=100 at CR >10. 6 programmable buttons with insets.Speaker, 1W. 2 USB 2.0 ports (1 keyboard, 1 general use).Smart Card Reader Optional in 12.1" displays. Integrated FCI Smart Plus B Connector module with OMNIKEY ® 3121Embedded Reader Board USB. FIPS 201 Certified.INTERNAL RADIO OPTIONS AND COMMUNICATIONS PROTOCOLSOne internal PCI Express Mini Card slot allows for a Wireless Local Area Network option, plus two available wireless Wide Area Network slots, so you can stay in touch with remote applications via multiple networks. Our CPU with any WLAN option ships with three antenna connector ports. Antennae are sold separately, so customers may reuse existing MW antennae with proper connectors.WLAN Option Intel® Ultimate N WiFi Link 6300 (Quad-mode 802.11 a/b/g/n). Wi-Fi CERTIFIED®. 3 antenna ports available. WAN 1 Slot Options MC7750 LTE Band 13/3G module from Sierra Wireless. Supports either of the following based on firmwareload: LTE Band 13, or CDMA IS-856 (1xEV-DO Revision A) and CDMA IS-2000 networks. Two antenna portsavailable. Additional WAN options will be available, and will vary by country; contact your local MotorolaSolutions representative for details.WAN 2 Slot Options CPUs support dual-WAN radio board plus internal modem option supporting Band 14 (Public Safety) LTE.Two antenna ports available. Availability of factory option as well as field upgrade kit will vary by country;contact your local Motorola Solutions representative for details.Choose either the internal GPS receiver or internal Dead Reckoning GPS receiver to help pinpoint your vehicle location. Dead Reckoning option provides vehicle location assistance even where GPS reception is hindered.GPS Options SiRF IV Module option: supports NMEA 0183 (National Marine Electronics Association) protocol. OrTrimble Lassen iQ GPS Module option: supports NMEA 0183, TSIP (Trimble Standard Interface Protocol),TAIP (Trimble ASCII Interface Protocol), and DGPS (Differential Global Positioning System) protocols. Dead Reckoning GPS Option Sensor-based GPS Receiver, containing the U-Blox LEA 6R GPS positioning engine. Position output inNMEA 0183 (National Marine Electronics Association) and UBX (u-blox proprietary binary) protocols.Requires vehicle sensor signals for speed and direction – order an Auxiliary Cable accessory to connectCPU Aux Port to vehicle sensors.ELECTRICAL ENVIRONMENTFully operating in 12V and 24V car battery systems without converters, so you can install in a wider range of vehicles. Can also be configured to operate using a 9V sustainable power source. Low voltage cranking support. Graceful shutdown at low voltage thresholds.Input Voltages Wide input voltage range, 11-33VDC, with no loss of functionalityElectrical Transients Meets ISO7637-212V24VCurrent Consumption (CPU)OFF (main switch ON) 2mAStandby Mode 0.3A (fans OFF)Operation: Typical 3A; Max 7A OFF (main switch ON) 2mA Standby Mode 0.2A (fans OFF) Operation: Typical 1.7A; Max4.5ACurrent Consumption (CPU + ALPRboard with four imaging units)Operation: Max 9.5A Operation: Max 6ACurrent Consumption (12.1" Displays) OFF (main switch ON) 10mA6mA Standby Mode 0.4AOFF (main switch ON)Standby Mode 0.25AStd. Brightness Operation: Typical 1.5A; Max 2A Operation: Typical 0.8A; Max 1.2A High Brightness Operation: Typical 1.5A; Max 2.5A Operation: Typical 1A; Max 1.5ACurrent Consumption (8.4" Display) OFF: <10 mAStandby Mode: < 100 mAOperation: Typical 1.5A; Max 2.5A OFF: <6 mAStandby Mode: < 70mA Operation: Typical 1A; Max 1.5AGENERAL SPECIFICATIONSMW810 R2.0 system components have been designed to be backwards-compatible with MW810 Series mounts. Mounting trunnion included with CPU purchase. Check existing display mounts to ensure compatibility with optional Smart Card Reader and USB ports on sides of 12.1" displays. System Component CPU12.1 in Displays8.4 in Display Keyboard*Physical Size (H x W x D) 2.8 x 7.4 x 9.4 in7.2 x 18.9 x 24.0 cm 10.6 x 11.5 x 1.9 in27.0 x 29.2 x 4.9 cm7.1 x 9.1 x 1.7 in18.1 x 23.0 x 4.36 cm1.26 x 12.6 x 8.0 in3.2 x 32.0 x 20.3 cmWeight 8.8 lbs (4.0 kg)Std. Brightness 6.1 lbs(2.8 kg) (2.75 kg)High Brightness 6.6 lbs(3.0 kg)3.3 lbs (1.5 kg) 2.2 lbs (1.0 kg)*USB Backlit 85-Key Full Travel Keyboards (multiple language options)ACCESSORIESContact your Motorola Solutions representative for details on accessories and vehicle mounting options.WARRANTY3-Year Warranty is Standard; see User Guide for details. Additional coverage options are available. Contact your local Motorola Solutionsrepresentative for details.ENVIRONMENTAL AND DURABILITYMW810 R2.0 is tough enough to thrive in extreme environmental conditions. MW810 meets the most robust set of standards of any product in its class, including tests shown below as well as other Motorola-proprietary test methods; summary test reports available upon request. Altitude: Storage MIL-STD-810G Method 500.5 Procedure I, Non-OperatingAltitude: Operation MIL-STD-810G Method 500.5 Procedure II, OperatingHigh Temperature: Storage MIL-STD-810G Method 501.5 Procedure I, Climatic Category A1 - Hot Dry (Table 501.5-III), induced (Storageand Transit) conditions, cyclic exposure from 33°C (91.4°F) to 72°C (161.6°F), Non-Operating. Also to 85°C(185°F) per Motorola 12M.High Temperature: Operation MIL-STD-810G Method 501.5 Procedure II, Climatic Category A1 - Hot Dry (Table 501.5-III), cyclic exposurefrom 33°C (91.4°F) to 72°C (161.6°F), OperatingLow Temperature: Storage MIL-STD-810G Method 501.5 Procedure II, Climatic Category A1 - Hot Dry (Table 501.5-III), cyclic exposurefrom 33°C (91.4°F) to 72°C (161.6°F), OperatingLow Temperature: Operation MIL-STD-810G Method 502.5 Procedure II, constant exposure at -30°C (-22°F), Operating Temperature Shock MIL-STD-810G Method 503.5 Procedure I-C, multi-cycle shocks from constant extreme temperature, 3 cyclesof Figure 503.5-3, from -52°C (-61.6°F) to 94°C (201.2°F), Non-OperatingSolar Radiation (Sunshine)MIL-STD-810G Method 505.5 Procedure I, Non-OperatingRain MIL-STD-810G Method 506.5 Procedure I (Blowing) and Procedure III (Drip), OperatingHumidity MIL-STD-810G Method 507.5 Procedure II, Aggravated, Periodic Operation per Method. Also per TIA/EIA 603 Para.3.3.3 Salt Fog MIL-STD-810G Method 509.5, Non-OperatingSand MIL-STD-810G Method 510.5 Procedure II, Non-OperatingDust MIL-STD-810G Method 510.5 Procedure I, Non-OperatingVibration: Secured Cargo MIL-STD-810G Method 514.6 Procedure I Category 4: 10-500 Hz, 1 hour per axis, OperatingVibration: Loose Cargo MIL-STD-810G Method 514.6 Procedure II Category 5: 5Hz/300RPM, in package, Non-Operating Vibration MIL-STD-810G Method 514.6 Procedure I Category 24: 20-2000 Hz, 7.7 G rms, 1 hour per axis, Non-Operating Shock: Functional MIL-STD-810G Method 516.6 Procedure I, Operating. Also per TIA/EIA 603 Para. 3.3.5Freeze/Thaw MIL-STD-810G Method 524 Procedure III, Rapid Temperature Change, OperatingASTM Vibration ASTM D4169-04 Schedule E, Truck Assurance Level II, OperatingSealing IEC IP-54 Rating. “5” = Dust protected. “4” = Protected against splashing waterFlammability UL94ESD IEC EN61000-4-2. Motorola tests to 8 kV contact and 15 kV air, which is above required levels of 4 kV contactand 8 kV air.REGULATORY ACCEPTANCE NUMBERS AND STANDARDS REFERENCESMW810 R2.0 is tested for safety as well as optimal performance with multiple wireless networks. MW810 R2.0 components are RoHS compliant. FCC Acceptance NumbersMC7750 (from Sierra Wireless) WLAN RadioBluetooth FCC ID: N7NMC7750 FCC ID: PD9633ANH FCC ID:QDS-BRCM1043United StatesRadiated Emission Radio Acceptance (RF) SafetyCarrier Certifications FCC Part 15, Class BFCC 47 CFR Part 15 Subpart – B/C/E, Part 22 and Part 24 UL 60950-1 2nd EditionPendingCanadaRadiated Emission Radio Acceptance (RF) Safety ICES-003, Class BBluetooth: IC 4324A-BRCM1043, WLAN: IC 1000M-633ANH RSS-210, RSS-132 and RSS-133 cUL 60950-1 2nd EditionEuropeR&TTE Directive EMCRadio Acceptance (RF) Automotive Directive 1999/5/ECETSI EN 301 489WLAN: ETSI EN 300 328 (2.4 GHz), EN 301 893 (5 GHz), and EN 302 502 (5.8 GHz) WWAN: EN 301 511 (GSM) and EN 301 908 (UMTS) Safety, EN 60950-1 2nd Edition (eMark non immunity related) 2004/104/ECAustralia, New Zealand (C-Tick)Radiated Emission Radio Acceptance (RF) Safety AS/NZS CISPR, Class BAS/NZS 4268 & AS/ACIF S042-3 AS/NZS 60950-1 2nd EditionMotorola Solutions, Inc. 1301 E. Algonquin Road, Schaumburg, Illinois 60196 U.S.A. /mw810MOTOROLA, MOTO, MOTOROLA SOLUTIONS and the Stylized M Logo are trademarks or registered trademarks of Motorola Trademark Holdings, LLC and are used under license. Intel® is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries. Microsoft and Windows are registered trademarks of Microsoft Corporation. All other trademarks are the property of their respective owners.© 2012 Motorola Solutions, Inc. All rights reserved. G3-33-102。

第二代AMD锐龙处理器

第二代AMD锐龙处理器作者：来源：《电脑爱好者》2018年第10期从规格上看，第二代AMD锐龙台式处理器最重要的变化就是制造工艺升级为12nm制程，因此得以获得更高的频率，而在架构、核心、缓存等方面并没有进行大的调整。

不过细微的调整还是相当多的，例如提供了第二代精准频率提升技术（Precision Boost 2）和第二代自适应动态扩频技术（XFR2），可以进行多核心频率提升，而不再是之前单核心的频率“冲刺”。

另外通过进一步增加IPC（每时钟周期运行指数）和降低缓存与内存延迟，其计算效率也会有明显提升。

Ryzen Master Utility超频与系统监控软件首批推出的第二代AMD锐龙台式处理器共有4款，均为中高端产品。

其旗舰型号Ryzen 7 2700X将TDP设置为105W，并且配有新的Wraith Prism（“幽灵”棱镜）风扇，拥有更好的扩频能力和超频潜力，还有现在DIYer最喜欢的、更华丽的灯效。

AMD还提供了Ryzen Master Utility软件，可以在操作系统中更方便地进行频率调整，支持单核心超频并且可以自动识别最快核心。

更大也更炫的Wraith Prism风扇AMD为第二代锐龙准备了新的芯片组，不过目前只推出了X470一款产品，未来的B450等型号据称会在下半年推出。

从X470芯片组来看，新一代平台主要增强了内存兼容性和超频功能，此外提供了全新的AMD StoreMI存储加速软件，与目前对手已有的“快速存储技术”一样，可以将高速的固态硬盘和大容量机械硬盘融合为一体，把固态硬盘作为一块大型缓存使用，大幅提升读写性能的同时还能使用到巨大的容量。

除了X470之外，现有的300系列主板在简单的BIOS更新后也可直接支持第二代AMD锐龙台式处理器。

目前市场上许多在售主板已经为用户提供了最新BIOS，其产品包装上标有“Ryzen Desktop 2000 Ready”标签，这些主板在B450、A420一类的主流和入门级芯片组出现前，显然是中端和入门级锐龙处理器更好的选择。

intel cpu型号大全

intel cpu型号大全2009年12月24日星期四 15:12intel cpu型号大全按照处理器支持的平台来分，Intel处理器可分为台式机处理器、笔记本电脑处理器以及工作站/服务器处理器三大类；下面我们将根据这一分类为大家详细介绍不同处理器名称的含义与规格。

由于Intel产品线跨度很长，不少过往产品已经完全或基本被市场淘汰（比如奔腾III和赛扬II），为了方便起见，我们的介绍也主要围绕P4推出后Intel发布的处理器产品展开。

台式机处理器Pentium 4（P4）第一款P4处理器是Intel在2000年11月21日发布的P4 1.5GHz处理器，从那以后到现在近四年的时间里，P4处理器随着规格的不断变化已经发展成了具有近10种不同规格的处理器家族。

在这里面，“P4 XXGHz”是最简单的P4处理器型号。

这其中，早期的P4处理器采用了Willamette核心和Socket 423封装，具256KB二级缓存以及400MHz前端总线。

之后由于接口类型的改变，又出现了采用illamette核心和Socket478封装的 P4产品。

而目前我们所说的“P4”一般是指采用了Northwood核心、具有400MHz前端总线以及512KB二级缓存、基于Socket 478封装的P4处理器。

虽然规格上不一样，不过这些处理器的名称都采用了“P4 XXGHz”的命名方式，比如P4 1.5GHz、P4 1.8GHz、P4 2.4GHz。

Pentium 4 A（P4 A）有了P4作为型号基准，那么P4 A就不难理解了。

在基于Willamette核心的P4处理器推出后不久，Intel为了提升处理器性能，发布了采用Northwood 核心、具有 400MHz前端总线以及512KB二级缓存的新一代P4。

由于这两种处理器在部分频率上发生了重叠，为了便于消费者辨识，Intel就在出现重叠的、基于Northwood核心的P4处理器后面增加一个大写字母“A”以示区别，于是就诞生了P4 1.8A GHz、P4 2.0A GHz这样的处理器产品。

4种固定破膜试剂盒检测人调节性 T 淋巴细胞的结果比较

4种固定破膜试剂盒检测人调节性 T 淋巴细胞的结果比较王方芳;黄巧容;张传芬;朱国念;孟文彤【摘要】目的比较4种固定破膜试剂盒检测人调节性 T淋巴细胞的效果.方法选择CD4、CD25和叉状头转录因子3(Foxp3)3种抗体建立流式调节性T淋巴细胞检测方案.采集10例健康人的新鲜外周血分离单个核细胞 ,先标记膜表面抗体CD4与CD25 ,再分别用BD Pharmingen、eBioscience、Invitrogen及Beckman Coulter 4种的固定破膜试剂盒对细胞固定破膜 ,最后标记Foxp3抗体上机检测.结果与未固定破膜的相应样品比较 ,4种试剂盒均对细胞的形态有较明显的影响 ,但对膜表面抗体CD4和CD25的表达没有明显影响.采用eBioscience固定破膜试剂检测调节性 T 淋巴细胞(CD4+ CD25+ Foxp3+ )的比例为(8 .22 ±2 .75)% ;Beckman Coulter为(0 .54 ± 0 .48)% ;BD Pharmingen为(0 .69 ±0 .33)% ;Invitrogen为(0 .41 ± 0 .24)% .结论 4种试剂盒的固定效果相近 , eBioscience固定破膜试剂盒对胞内Foxp3具有较好的检测效果 ,更适合用于检测调节性T淋巴细胞.%Objective To compare the effects of four kinds of fixation permeabilization reagent kit for detec-ting regulatory T(Treg) lymphocytes .Methods Three kinds of antibody of CD4 ,CD25 and Foxp3 were selected to establish the flow Treg lymphocytes detectionscheme .The fresh peripheral blood samples from 10 healthy individu-als were collected for separating mononuclear cells .The membrane surface antibodies CD4 and CD25 were firstly la-beled .T hen the four kinds of fixation permeabilization reagent kit ,BDPharmingen ,eBioscience ,Invitrogen and Beck-man Coulter ,were used for performing the fixation and permeabilization on cells .Finally Foxp3antibody was labelled and detected on machine .Results Compared with the unfixation pemeabilization corresponding samples ,the four kinds of reagent kit had a obvious impact on the morphology of the cells ,but no obvious effect on the expression of CD4 and and CD25 .The detected proportions (CD4+ CD25+ Foxp3+ ) were(8 .22 ± 2 .75)% for the eBioscienc fixa-tion permeabilization reagent kit ,(0 .54 ± 0 .48)% for the Beckman Coulter reagent kit ,(0 .69 ± 0 .33)% for the BD Pharmingen reagent kit and (0 .41 ± 0 .24)% for the Invitrogen reagent kit .Conclusion The four kinds of reagent kit have similar fixation effect .The eBioscience fixation permeabilization reagent kit has better detection effect and is more suitable for detecting Treg lymphocytes .【期刊名称】《检验医学与临床》【年(卷),期】2016(013)002【总页数】4页(P160-162,165)【关键词】调节性T淋巴细胞;叉状头转录因子3;固定破膜【作者】王方芳;黄巧容;张传芬;朱国念;孟文彤【作者单位】四川大学华西医院血液学研究室,成都 610041;四川大学华西医院干细胞生物学研究室,成都 610041;四川大学华西医院科研基地管理科 ,成都 610041;四川大学华西医院科研基地管理科 ,成都 610041;四川大学华西医院干细胞生物学研究室,成都 610041【正文语种】中文调节性T淋巴细胞是一类控制体内免疫反应性的T淋巴细胞亚群，对多种自身免疫性疾病的发生和发展都具有重要的意义[1]。

戴尔易安信 PowerEdge 服务器第二代 AMD EPYC 处理器的平衡内存说明书

WhitepaperBalanced Memory with 2nd GenerationAMD EPYC TM Processorsfor PowerEdge ServersOptimizing Memory PerformanceRevision: 1.4Issue Date: 4/21/2020AbstractProperly configuring a server with balanced memory is critical to ensure memorybandwidth is maximized and latency is minimized. When server memory is configured incorrectly, unwanted variables are introduced into the memory controllers’ algorithm, which inadvertently slows down overall system performance. To mitigate this risk of reducing or even bottlenecking system performance, it is important to understand what constitutes balanced, near balanced and unbalanced memory configurations.Dell EMC has published this brief to educate PowerEdge customers on what balanced memory means, why it is important and how to properly populate memory to 2ndGeneration AMD EPYC TM server processors for a balanced configuration.RevisionsDate Description12 September 2019 Initial release for 1st wave of AMD CPUs21 April 2020Includes all AMD CPU SKUs AcknowledgementsThis paper was produced by the following people:Name RoleMatt Ogle Technical Product Marketing, Dell EMC Trent Bates Product Management, Dell EMCJose Grande Software Senior Principal Engineer, Dell EMC Andres Fadul Software Senior Principal Engineer, Dell EMCTable of Contents1.Introduction (4)2.Memory Topography and Terminology (5)3.Memory Interleaving (6)3.1NPS and Quadrant Pairing (6)4.Memory Population Guidelines (9)4.1Overview (9)4.2Memory Channel Population (9)4.3Identical CPU and DIMM Parts (10)4.4Identical Memory Configurations for Each CPU (10)5.Balanced Configurations (Recommended) (11)6.Near Balanced Configurations (12)7.Unbalanced Configurations (13)8.Conclusion (19)9. References (19)1. IntroductionUnderstanding the relationship between a server processor (CPU) and its memory subsystem is critical when optimizing overall server performance. Every processor generation has a unique architecture, with volatile controllers, channels and slot population guidelines, that must be satisfied to attain high memory bandwidth and low memory access latency.2nd Generation AMD EPYC TM server processors, which will be referred to by their code name throughout this white paper, Rome processors, offer a total of eight memory channels with up to two memory slots per channel.1 This presents numerous possible permutations for configuring the memory subsystem with traditional Dual In-Line Memory Modules (DIMMs), yet there are only a couple of balanced configurations that will achieve the peak memory performance for Dell EMC PowerEdge servers.Memory that has been incorrectly populated is referred to as an unbalanced configuration. From a functionality standpoint, an unbalanced configuration will operate adequately, but introduces significant additional overhead that will slow down data transfer speeds. Similarly, a near balanced configuration does not yield fully optimized data transfer speeds but it is only suboptimal to that of a balanced configuration. Conversely, memory that has been correctly populated is referred to as a balanced configuration and will secure optimal functionality and data transfer speeds.This white paper explains how to balance memory configured for Rome processors within Dell EMC PowerEdge servers.2. Memory Topography and TerminologyFigure 1: CPU-to-memory subsystem connectivity for Rome processorsTo understand the relationship between the CPU and memory, terminology illustrated in Figure 1 must first be defined:•Memory controllers are digital circuits that manage the flow of data going from the computer’s main memory to the corresponding memory channels.2 Romeprocessors have eight memory controllers in the processor I/O die, with onecontroller assigned to each channel.•Memory channels are the physical layer on which the data travels between the CPU and memory modules.3 As seen in Figure 1, Rome processors have eightmemory channels designated A, B, C, D, E, F, G and H. These channels wereintended to be organized into pairs such as two-way (AB, CD, EF, GH), four-way (ABCD, EFGH) or eight-way (ABCDEFGH).•The memory slots are internal ports that connect the individual DIMMs to their respective channels.4 Rome processors have two slots per channel, so there are a total of sixteen slots per CPU for memory module population. DIMM 1 slots are the first eight memory modules to be populated while DIMM 0 slots are the last eight.In the illustrations ahead, DIMM 1 slots will be represented with black text marked A1-A8 and DIMM 0 slots will be represented with white text marked A9-A16.•The memory subsystem is the combination of all the independent memory functions listed above.3. Memory InterleavingMemory interleaving allows a CPU to efficiently spread memory accesses across multiple DIMMs. When memory is put in the same interleave set, contiguous memory accesses go to different memory banks. Memory accesses no longer must wait until the prior access is completed before initiating the next memory operation. For most workloads, performance is maximized when all DIMMs are in one interleave set creating a single uniform memory region that is spread across as many DIMMs as possible.5 Multiple interleave sets create disjointed memory regions.3.1 NPS and Quadrant PairingRome processors achieve memory interleaving by using Non-Uniform Memory Access (NUMA) in Nodes Per Socket (NPS).6 There are four NPS options available in the Dell EMC BIOS:1. NPS 0– One NUMA node per system (on two processors systems only). Thismeans all channels in the system are using one interleave set.2. NPS 1– One NUMA node per socket (on one processor systems). This means allchannels in the socket are using one interleave set.3. NPS 2– Two NUMA nodes per socket (one per left/right half). This means eachhalf containing four channels is using one interleave set; a total of two sets.4. NPS 4– Up to four NUMA nodes per socket (one per quadrant). This means eachquadrant containing two channels is using one interleave set; a total of four sets. The simplest visual aid for understanding the NPS system is to divide the CPU into four quadrants. We see below in Figure 2 that each quadrant contains two paired DIMM channels that can host up to two DIMMs. The paired DIMM channels in each quadrant were designed to group and minimize the travel distance for interleaved sets. NPS 1 would correlate to all four quadrants being fully populated. NPS 2 would correlate to having either the left or right half quadrant being fully populated. NPS 4 would correlate to having any one quadrant being fully populated.Figure 2: Quadrant layout of Rome processors3.2 NPS and Quadrant PairingNPS 0 and NPS 1 will typically yield the best memory performance, followed by NPS 2 and then NPS 4. The Dell EMC default setting for BIOS NUMA NPS is NPS 1 and mayneed to be manually adjusted to match the NPS option that supports the CPU model. As seen below in Figure 3 there are various CPUs that will not support NPS 2 or 4 that require awareness of which memory configurations are optimized for each CPU. Figure 4 below shows our recommended NPS setting for each # of DIMMs per CPU:Figure 3: A full list of 2nd Gen AMD EPYC™ CPUs and their respectivesupported NPS models. The CPUs with an asterisk have been optimizedto reduce the performance impact of only filling four DIMM channels.Figure 4: Recommended NPS setting for each# of DIMMs per CPUIf the NPS setting for a memory configuration will limit performance (as seen in Figure 5), Dell EMC BIOS will return the following informative prompts to the user:UEFI0391: Memory configuration supported but not optimal for the enabledNUMA node Per Socket (NPS) setting. Please consider the following actions:1) Changing NPS setting under System Setup>System BIOS>ProcessorSettings>NUMA Nodes Per Socket, if supported.2) For optimized memory configurations please refer to the General MemoryModule Installation Guidelines section in the Installation and ServiceManual, of the respective server model available on the support site.In layman’s terms, a different NPS setting or memory configuration will result in better memory performance. The system is fully functional when this message appears, but it is not fully optimized for best performance.Figure 5: Color-coded table illustrating whenan informative message will occur (yellow) orno message (green)4. M emory Population Guidelines4.1 OverviewDIMMs must be populated into a balanced configuration to yield the highest memory bandwidth and lowest memory access latency. Various factors will dictate whether a configuration is balanced or not. Please follow the guidelines below for best results 7:o Memory Channel Population•Balanced Configuration-All memory channels must be fully populated with one or two DIMMs for best performance; a total of eight or sixteen DIMMs per CPU•Near Balanced Configuration-Populate four or twelve DIMMs per socket-Populate DIMMs in sequential order (A1-A8)o CPU and DIMM parts must be identicalo Each CPU must be identically configured with memory4.2 Memory Channel PopulationTo achieve a balanced configuration, populate either eight or sixteen DIMMs per CPU. By loading each channel with one or two DIMMs, the configuration is balanced and has data traveling across channels most efficiently on one interleave set. Following this guideline will yield the highest memory bandwidth and the lowest memory latency. If a balanced configuration of sixteen or eight DIMMs per CPU cannot be implemented, then the next best option is a near balanced configuration. To obtain a near balanced population, populate four or twelve DIMMs per CPU in sequential order. When any number of DIMMs other than 4, 8, 12 or 16 is populated, disjointed memory regions are created making NPS 4 the only supported BIOS option to select.The last guideline is that DIMMs must be populated in an assembly order because Rome processors have an organized architecture for each type of CPU core count. To simplify this concept, the lowest core count was used as a common denominator, so the assembly order below will apply across all Rome processor types. Populating in this order ensures that for every unique Rome processor, any DIMM configuration is guaranteed the lowest NPS option, therefore driving the most efficient interleave sets and data transfer speeds. Figure 6 illustrates the assembly order in which individual DIMMs should be populated, starting with A1 and ending with A16:Figure 6: DIMM population order, starting with A1 and ending with A164.3 Identical CPU and DIMM PartsIdentical DIMMs must be used across all DIMM slots (i.e. same Dell part number). Dell EMC does not support DIMM mixing in Rome systems. This means that only one rank, speed, capacity and DIMM type shall exist within the system. This principle applies to the processors as well; multi-socket Rome systems shall be populated with identical CPUs.4.4 Identical Memory Configurations for Each CPUEvery CPU socket within a server must have identical memory configurations. When only one unique memory configuration exists across both CPU sockets within a server, memory access is further optimized. Figure 7 below illustrates the expected memory bandwidth curve when these rules are followed:Figure 7: Bar graph illustrating expected performance variation as # of dimms increases 16151413121110987654321M e m o r y B a n d w i d t h #DIMMs per CPU populatedR6525 Memory Bandwidth per DIMM Population BalancedNear-Balanced Unbalanced5. Balanced Configurations (Recommended)Balanced configurations satisfy NPS 0/1 conditions by requiring each memory channel to be populated with one or two identical DIMMs. By doing this, one interleave set can optimally distribute memory access requests across all the available DIMM slots; therefore, maximizing performance. Memory controller logic was designed around fullypopulated memory channels, so it should come as no surprise thateight or sixteen populated DIMMs are recommended. Having eight DIMMs will reap the highestmemory bandwidth while having sixteen DIMMs will yield the highest memory capacity.Figure 8: Eight DIMMs are populated in a balanced configuration, producing the highest memorybandwidth while at a lower capacity than sixteenFigure 9: Sixteen DIMMs are populated in a balanced configuration, producing the highest memorycapacity while at a lower bandwidth than eight6. Near Balanced ConfigurationsNear balanced configurations satisfy NPS 1 or 2 conditions by populating either four or twelve identical DIMMs per CPU. These configurations are not optimized because the channels are partially populated, which creates disjointed memory regions that reduce performance (making it near balanced). Performance for near balanced configurationswill undergo degradation when compared to balanced configurations. Although the below configurations are adequate for implementation, they are not highly recommended. *Note that CPUs 7282, 7252, 7232P and 7272 were designed to reduce the performance impact of populating four DIMM channels.Figure 10: Four DIMMs are populated in a near balanced configurationFigure 11: Twelve DIMMs are populated in a near balanced configuration7. U nbalanced ConfigurationsUnbalanced configurations can only satisfy NPS 4 conditions. More than two interleave sets can now be introduced to the memory controller algorithm which causes very disjointed regions. Memory performance for the unbalanced configurations below are significantly less than balanced or near balanced and are not recommended.Figure 12: One DIMM is populated in an unbalanced configurationFigure 13: Two DIMMs are populated in an unbalanced configurationFigure 14: Three DIMMs are populated in an unbalanced configurationFigure 15: Five DIMMs are populated in an unbalanced configurationFigure 16: Six DIMMs are populated in a near balanced configurationFigure 17: Seven DIMMs are populated in an unbalanced configurationFigure 18: Nine DIMMs are populated in an unbalanced configurationFigure 19: Ten DIMMs are populated in a near balanced configurationFigure 20: Eleven DIMMs are populated in an unbalanced configurationFigure 21: Thirteen DIMMs are populated in an unbalanced configurationFigure 22: Fourteen DIMMs are populated in a near balanced configurationFigure 23: Fifteen DIMMs are populated in an unbalanced configuration8. ConclusionBalancing memory with 2nd Generation EPYC TM server processors increases memory bandwidth and reduces memory access latency. When memory modules are configured in such a way that the memory subsystems are identical, and channels are fully populated with one or two DIMMs, one interleave set will create a single uniform memory region that is spread across as many DIMMs as possible. This allows the distribution of data to perform most efficiently on Dell EMC PowerEdge servers. Applying the balanced memory guidelines demonstrated in this brief will ensure that both memory bandwidth and memory access latency are optimized, therefore ensuring peak memory performance within Dell EMC PowerEdge servers.9. References1 https:///wp-content/resources/56301_1.0.pdf2 https:///travel_guide/124468/hardware/computer_memory_controllers_how_they_work.html3 https:///jargon/d/dual-channel-memory.htm4 https:///jargon/m/memoslot.htm5 https:///memory-interleaving/6 https:///system/files/2018-03/AMD-Optimizes-EPYC-Memory-With-NUMA.pdf7 https:///wp-content/resources/56301_1.0.pdfThe information in this publication is provided “as is.” Dell Inc. makes no representations or warranties of any ki nd withrespect to the information in this publication, and specifically disclaims implied warranties of merchantability or fitness for a particular purpose.Use, copying, and distribution of any software described in this publication requires an applicable software license.© 2020 Dell Inc. or its subsidiaries. All Rights Reserved. Dell, EMC, Dell EMC and other trademarks are trademarks of DellInc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.Dell believes the information in this document is accurate as of its publication date. The information is subject to changewithout notice.。

惠普1910、2010、2210、2310、2510 和 2710 LCD 显示器用户指南说明书

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第二版（2010 年 1 月)文档部件号：594300-AA2关于本指南本指南提供与安装显示器、安装驱动程序、使用屏幕显示菜单、故障排除和技术规范有关的信息。

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iiiiv 关于本指南目录1 产品特性 (1)HP LCD 显示器 (1)2 安全和维护准则 (3)重要安全信息 (3)安全预防措施 (4)维护准则 (5)清洁显示器 (5)装运显示器 (5)3 安装显示器 (6)打开显示器包装 (6)安装显示器 (6)连接显示器电缆 (10)高带宽数字内容保护 (HDCP) (11)连接音频电缆 (12)连接电源线 (13)调整显示器的倾斜角度 (13)调整扭转角度 (14)键盘存放 (15)4 操作显示器 (16)CD 软件和实用程序 (16)安装驱动程序 (16)使用自动调整功能 (17)前面板控制按钮 (18)使用屏幕显示 (OSD) (19)选择视频输入接口 (23)识别显示器状况 (23)调整屏幕质量 (24)省电功能 (24)v附录 A 故障排除 (26)解决常见问题 (26)从获取支持 (27)准备致电技术支持 (27)查找额定值标签 (28)附录 B 技术规格 (29)HP LCD 显示器 (29)预设视频模式 (33)LCD 显示器质量和像素策略 (35)附录 C 机构规定注意事项 (36)（美国）联邦通信委员会注意事项 (36)修改 (36)电缆 (36)标有 FCC 徽标的产品的一致性声明（仅适用于美国） (36)适用于加拿大的注意事项 (37)Avis Canadien (37)欧盟规程通告 (37)德国人机工程学通告 (38)适用于日本的注意事项 (38)适用于韩国的注意事项 (38)电源线配件要求 (38)适用于日本的电源线要求 (38)产品环境注意事项 (39)废弃物品的处理 (39)日常处理废旧器件的注意事项（适用于欧盟） (39)化学物质 (39)HP 回收办法 (39)有害物质的限制 (RoHS) (39)土耳其 EEE 法规 (40)vi1产品特性HP LCD 显示器HP LCD（液晶显示）显示器采用具备有源矩阵和下列特性的薄膜晶体管 (TFT) 屏幕：●大尺寸屏幕●最大图像分辨率：◦1910m：1366x768@60 赫兹◦2010f：1600x900@60 赫兹◦2010i：1600x900@60 赫兹◦2010m1600x900@60 赫兹◦2210i：1920x1080@60 赫兹◦2210m：1920x1080@60 赫兹◦2310i：1920x1080@60 赫兹◦2310m：1920x1080@60 赫兹◦2510i：1920x1080@60 赫兹◦2710m：1920x1080@60 赫兹◦且支持较低分辨率的全屏显示●VGA 模拟信号●DVI 数字信号●高清晰度多媒体接口 (HDMI)（适用于部分型号）●反应迅捷，玩核心游戏和图形制作时可获得更佳效果●视角宽广，无论是坐着、站着还是从显示器的两侧，均易于观看●动态对比度，提供更深的黑度和更亮的白度以实现出众的色差效果，令玩游戏和观看电影更具特色●倾斜度调整●扭转角度调整HP LCD 显示器1●可拆卸式的底座和符合视频电子标准协会 (Video Electronics Standards Association,VESA) 标准的安装孔，便于进行灵活的安装（包括墙上安装）●安全锁定插槽，用于连接安全锁定电缆（需要单独购买安全电缆）●即插即用功能（如果您的计算机系统支持此功能）●屏幕显示 (OSD) 可调，便于设置和优化屏幕（可选择英文、简体中文、繁体中文、法文、德文、意大利文、西班牙文、荷兰文、日文或巴西葡萄牙文）●内置立体声低音炮扬声器●键盘存放装置●节能装置，有助于减少能源消耗●“快速查看”设置显示●DVI 和 HDMI 输入具有 HDCP（高带宽数字内容保护）（适用于部分型号）●软件和实用程序 CD，其中包含以下内容：◦驱动程序◦自动调整软件◦相关文档2第 1 章产品特性2安全和维护准则重要安全信息本显示器已附带电源线。

中兴设备常用无线参数介绍(看完)

目录第1章小区参数.......................................................................................................................................... 1-31.1 基本参数1 ....................................................................................................................................... 1-31.2 基本参数2 ....................................................................................................................................... 1-61.3 基本参数3 ....................................................................................................................................... 1-91.4 可选特征参数 ............................................................................................................................... 1-181.5 小区选择参数 ............................................................................................................................... 1-211.6 业务进程附加参数 ....................................................................................................................... 1-281.7 系统参数 ....................................................................................................................................... 1-321.8 小区可选参数 ............................................................................................................................... 1-361.9 其它参数 ....................................................................................................................................... 1-38 第2章小区对象参数................................................................................................................................ 2-422.1 收发信机参数 ............................................................................................................................... 2-422.2 干扰小区参数 ............................................................................................................................... 2-432.3 载频频率参数 ............................................................................................................................... 2-442.4 功率控制参数 ............................................................................................................................... 2-462.4.1 功率测量参数 ..................................................................................................................... 2-462.4.2 功率调整门限参数 ............................................................................................................. 2-502.4.3 功率控制参数 ..................................................................................................................... 2-552.4.4 其他参数 ............................................................................................................................. 2-562.5 切换控制参数 ............................................................................................................................... 2-602.5.1 切换预处理参数 ................................................................................................................. 2-602.5.2 切换门限参数 ..................................................................................................................... 2-642.5.3 切换条件参数 ..................................................................................................................... 2-722.5.4 切换控制参数 ..................................................................................................................... 2-752.5.5 其他参数 ............................................................................................................................. 2-762.5.6 切换算法参数 ..................................................................................................................... 2-792.5.7 子小区参数 ......................................................................................................................... 2-822.6 邻接小区切换并重选参数 ........................................................................................................... 2-842.7 邻接小区切换参数....................................................................................................................... 2-91 2.8 邻接小区重选参数....................................................................................................................... 2-91 2.9 跳频系统参数............................................................................................................................... 2-92第1章小区参数摘要本章主要介绍了小区参数。

pxi1050、1052说明书

Installation
The PXI-1050 and PXI-1052 have differentiated designs that make them ideally suited for different environments. For benchtop use, the PXI-1052 has supporting feet that easily tilt up. You can also set the feet to level the chassis with the benchtop, or completely remove them. The PXI-1050 comes with removable rubber feet for benchtop applications. Both chassis offer mounting points located on each side of the chassis, to which you can attach optional rack-mount kits. You can also use them to recess the PXI-1050 or PXI-1052 chassis in your instrument cabinet. The PXI-1052 is well suited for portable applications, with a built-in carrying handle. It also has the SCXI high-voltage analog back plane (HVAB) built in. All of these configurations can be assembled or disassembled without accessing the interior of the chassis.

NUC微控制器产品系列说明书

112 µA/MHz @ 正常模式 1.5 µA @ 掉电模式
M251 Feature
。 Arm® Cortex®-M23 。运行速度可达 48 MHz
M252 Feature
。 USB 2.0 全速设备无需外挂晶振
M253 Feature
。 USB 2.0 全速设备无需外挂晶振
。高达五路 UART 。 CAN FD x1
2
Low Power
TrustZone
AEC-Q100
Market Trend
随着电子应用对低功耗或电池供电的需求日益增加，现今的应用必须尽量降低能源消耗，甚至在极端情况下，可能需要倚赖单颗电池来维持长达 15 至 20 年运转
低功耗应用情景包含手持式设备、居家、 AIoT、IIoT (工业物联网) 等应用情景，使用范围十分广泛
(Programmable Serial I/O) • USB 2.0 全速装置无需外挂晶振 • 独立的 RTC 电源 VBAT 管脚
Highlight
• 支持 1.8 V ~ 5.5 V 串行接口，可连接不同电压装置
*USCI: Universal Serial Control Interface Controller
C
1.8 3.3 5 M253
CU
3.3 5 M071
1.8 3.3 5 M252
U
3.3 5 M051
1.8 3.3 5 M251
3.3 5 Mini51
3.3 5 3.3 5
1.8 3.3 Nano100
M480 M460 M471 M453 M452 M451
E CU E CU
U C
U
Arm9™

Intel CPU型号规格大全

格大全Intel CPU型号规格大全规格术语Processor Number: 处理器号Architecture: 架构(制造工艺)Cache: 高速缓存Clock Speed: 时钟速度Power: 功耗Front Side Bus: 前端总线Intel(R)VT±: 英特尔虚拟化技术Intel(R) 64Φ: 英特尔64位技术Quad-core: 四核Dual-core: 双核Enhanced Intel SpeedStep(R) Technology: 增强的英特尔加速技术Execute Disable Bit: 执行取消位HT Technology: 超线程技术nm: 纳米HZ: 赫兹G: 吉, 频率为10^9M: 兆, 频率为10^6, CACHE为2^20K: 千, 频率为10^3, CACHE为2^10B: 字节W: 瓦UP: 单核DP: 双核QP: 四核L3: 三级缓存L2: 二级缓存X: 具备该特性0: 不具备该特性1. 至强系列All Intel(R) Xeon(R) processors feature:Intel(R) Virtualization Technology±Intel(R) Extended Memory 64 TechnologyΦ格大全Execute Disable Bit°Intel Xeon 至强所有至强处理器都支持虚拟化技术, 64位和执行取消位Processor NumberArchitectureCacheClock SpeedFront Side BusPowerSystem TypeQuad-CoreDual-CoreHT Technology3070 65 nm 4 MB L2 2.66 GHz 1066 MHz 65W UP 0 X 03060 65 nm 4 MB L2 2.40 GHz 1066 MHz 65W UP 0 X 03050 65 nm 2 MB L2 2.13 GHz 1066 MHz 65W UP 0 X 03040 65 nm 2 MB L2 1.86 GHz 1066 MHz 65W UP 0 X 0X3230 65 nm 8 MB L2 2.66 GHz 1066 MHz 95W UP X 0 0X3220 65 nm 8 MB L2 2.40 GHz 1066 MHz 105W UP X 0 0X3210 65 nm 8 MB L2 2.13 GHz 1066 MHz 105W UP X 0 07150N 65 nm 16 MB L3 2x1 MB L2 3.50 GHz 667 MHz 150W MP 0 X X7140M 65 nm 16 MB L3 2x1 MB L2 3.40 GHz 800 MHz 150W MP 0 X X7140N 65 nm 16 MB L3 2x1 MB L2 3.33 GHz 667 MHz 150W MP 0 X X7130M 65 nm 8 MB L3 2x1 MB L2 3.20 GHz 800 MHz 150W MP 0 X X7130N 65 nm 8 MB L3 2x1 MB L2 3.16 GHz 667 MHz 150W MP 0 X X7120M 65 nm 4 MB L3 2x1 MB L2 3.00 GHz 800 MHz 95W MP 0 X X7120N 65 nm 4 MB L3 2x1 MB L2 3.00 GHz 667 MHz 95W MP 0 X X7110M 65 nm 4 MB L3 2x1 MB L2 2.60 GHz 800 MHz 95W MP 0 X X7110N 65 nm 4 MB L3 2x1 MB L2 2.50 GHz 667 MHz 95W MP 0 X X7041 90 nm 2x2 MB 3.00 GHz 800 MHz N/A MP 0 X X7040 90 nm 2x2 MB 3.00 GHz 667 MHz N/A MP 0 X X7030 90 nm 2x1 MB 2.80 GHz 800 MHz N/A MP 0 X X7020 90 nm 2x1 MB 2.66 GHz 667 MHz N/A MP 0 X X格大全X5355 65 nm 8 MB L2 2.66 GHz 1333 MHz 120W DP X 0 0L5320 65 nm 8 MB L2 1.86 GHz 1066 MHz 50W DP X 0 0L5310 65 nm 8 MB L2 1.60 GHz 1066 MHz 50W DP X 0 0E5345 65 nm 8 MB L2 2.33 GHz 1333 MHz 80W DP X 0 0E5335 65 nm 8 MB L2 2.00 GHz 1333 MHz 80W DP X 0 0E5320 65 nm 8 MB L2 1.86 GHz 1066 MHz 80W DP X 0 0E5310 65 nm 8 MB L2 1.60 GHz 1066 MHz 80W DP X 0 05160 65 nm 4 MB 3.00 GHz 1333 MHz 80W DP 0 X 05150 65 nm 4 MB 2.66 GHz 1333 MHz 65W DP 0 X 05148LV 65 nm 4 MB 2.33 GHz 1333 MHz 40W DP 0 X 05140 65 nm 4 MB 2.33 GHz 1333 MHz 65W DP 0 X 05130 65 nm 4 MB 2.00 GHz 1333 MHz 65W DP 0 X 05120 65 nm 4 MB 1.86 GHz 1066 MHz 65W DP 0 X 05110 65 nm 4 MB 1.60 GHz 1066 MHz 65W DP 0 X 05080 65 nm 2x2 MB 3.73 GHz 1066 MHz 130W DP 0 X X5063 65 nm 2x2 MB 3.20 GHz 1066 MHz 95W DP 0 X X5060 65 nm 2x2 MB 3.20 GHz 1066 MHz 130W DP 0 X X5050 65 nm 2x2 MB 3.00 GHz 667 MHz 95W DP 0 X X5030 65 nm 2x2 MB 2.67 GHz 667 MHz 95W DP 0 X X2. 酷睿2系列2.1 Extreme系列Intel(R) Core(TM) 2 Extreme processorProcessor NumberArchitectureCacheClock SpeedFront Side BusQuad-coreDual-coreIntel(R)VT±Enhanced Intel SpeedStep(R) TechnologyIntel(R) 64ΦExecute Disable Bit°格大全QX6850 65 nm 8MB L3 3.00 GHz 1333 MHz X 0 X X X XQX6800 65 nm 8MB L2 2.93 GHz 1066 MHz X 0 X X X XQX6700 65 nm 8MB L2 2.66 GHz 1066 MHz X 0 X X X XX7800 65 nm 4MB L2 2.60 GHz 800 MHz 0 X X X X XX6800 65 nm 4MB L2 2.93 GHz 1066 MHz 0 X X X X X2.2 桌面4核Intel(R) Core(TM)2 Quad processorProcessor NumberArchitectureCacheClock SpeedFront Side BusQuad-coreIntel(R) VT±Enhanced Intel SpeedStep(R)TechnologyIntel(R) 64ΦExecute Disable Bit°Q6700 65 nm 8MB L21 2.66 GHz 1066 MHz X X X X XQ6600 65 nm 8MB L21 2.40 GHz 1066 MHz X X X X X2.3 桌面双核Intel(R) Core(TM)2 Duo processorProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R) Virtualization Technology(Intel(R) VT)±Enhanced Intel SpeedStep(R) TechnologyIn tel(R) 64ΦExecute Disable Bit°格大全E6850 65 nm 4MB L2 3.00 GHz 1333 MHz X X X X XE6750 65 nm 4MB L2 2.66 GHz 1333 MHz X X X X XE6700 65 nm 4MB L2 2.66 GHz 1066 MHz X X X X XE6600 65 nm 4MB L2 2.40 GHz 1066 MHz X X X X XE6550 65 nm 4MB L2 2.33 GHz 1333 MHz X X X X XE6540 65 nm 4MB L2 2.33 GHz 1333 MHz X X X X XE6420 65 nm 4MB L2 2.13 GHz 1066 MHz X X X X XE6400 65 nm 2MB L2 2.13 GHz 1066 MHz X X X X XE6320 65 nm 4MB L2 1.86 GHz 1066 MHz X X X X XE6300 65 nm 2MB L2 1.86 GHz 1066 MHz X X X X XE4500 65 nm 2MB L2 2.29 GHz 800 MHz X 0 X X XE4400 65 nm 2MB L2 2.00 GHz 800 MHz X 0 X X XE4300 65 nm 2MB L2 1.80 GHz 800 MHz X 0 X X X2.4 笔记本双核Processor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R) Virtualization Technology(Intel(R) VT)±Enhanced Intel SpeedStep(R) TechnologyIntel(R) 64ΦExecute Disable Bit°T7700 65 nm 4MB L2 2.40 GHz 800 MHz X X X X XT7600 65 nm 4MB L2 2.33 GHz 667 MHz X X X X XT7500 65 nm 4MB L2 2.20 GHz 800 MHz X X X X XT7400 65 nm 4MB L2 2.16 GHz 667 MHz X X X X XT7300 65 nm 4MB L2 2.00 GHz 800 MHz X X X X XT7200 65 nm 4MB L2 2.00 GHz 667 MHz X X X X XT7100 65 nm 2MB L2 1.80 GHz 800 MHz X X X X XT5600 65 nm 2MB L2 1.83 GHz 667 MHz X X X X XT5500 65 nm 2MB L2 1.66 GHz 667 MHz X 0 X X X格大全T5470 65 nm 2MB L2 1.60 GHz 800 MHz X 0 X X XT5450 65 nm 2MB L2 1.66 GHz 667 MHz X 0 X X XT5250 65 nm 2MB L2 1.50 GHz 667 MHz X 0 X X XT5300 65 nm 2MB L2 1.73 GHz 533 MHz X 0 X X XT5200 65 nm 2MB L2 1.60 GHz 533 MHz X 0 X X X2.5 笔记本双核低压版Intel(R) Core2 Duo Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R) Virtualization Technology(Intel(R) VT)±Enhanced Intel SpeedStep(R) TechnologyIntel(R) 64ΦExecute Disable Bit°L7500 65 nm 4MB L2 1.60 GHz 800 MHz X X X X XL7400 65 nm 4MB L2 1.50 GHz 667 MHz X X X X XL7300 65 nm 4MB L2 1.40 GHz 800 MHz X X X X XL7200 65 nm 4MB L2 1.33 GHz 667 MHz X X X X X2.6 笔记本双核超低压版Intel(R) Core(TM)2 Duo Ultra Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R) Virtualization Technology(Intel(R) VT)±Enhanced Intel SpeedStep(R) Technology格大全Intel(R)64ΦExecute Disable Bit°U7600 65 nm 2MB L2 1.20 GHz 533 MHz X X X X XU7500 65 nm 2MB L2 1.06 GHz 533 MHz X X X X X3. 酷睿1系列3.1 笔记本酷睿双核Intel(R) Core(TM) Duo processorProcessor NumberArchitectureCacheClockSpeedFront Side BusPowerDual-coreIntel(R)VT± Enhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°T2700 65 nm 2 MB L2 2.33 GHz 667 MHz 31W X X X 0T2600 65 nm 2 MB L2 2.16 GHz 667 MHz 31W X X X XT2500 65 nm 2 MB L2 2.00 GHz 667 MHz 31W X X X XT2450 65 nm 2 MB L2 2.00 GHz 533 MHz 31W X 0 X XT2400 65 nm 2 MB L2 1.83 GHz 667 MHz 31W X X X XT2350 65 nm 2 MB L2 1.86 GHz 533 MHz 31W X 0 X XT2300 65 nm 2 MB L2 1.66 GHz 667 MHz 31W X X X XT2250 65 nm 2 MB L2 1.73 GHz 533 MHz 31W X 0 X XT2050 65 nm 2 MB L2 1.60 GHz 533 MHz 31W X 0 X XT2300E 65 nm 2 MB L2 1.66 GHz 667 MHz 31W X 0 X X3.2 笔记本酷睿双核低压版Intel(R) Core(TM) Duo processor Low VoltageProcessor NumberArchitecture格大全CacheClockSpeedFront Side BusPowerDual-coreIntel(R)VT±Enhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°L2500 65 nm 2MB L2 1.83 GHz 667 MHz 15W X X X XL2400 65 nm 2MB L2 1.66 GHz 667 MHz 15W X X X XL2300 65 nm 2MB L2 1.50 GHz 667 MHz 15W X X X X3.3 笔记本酷睿双核超低压版Intel(R) Core(TM) Duo processor Ultra Low VoltageProcessor NumberArchitectureCacheClockSpeedFront Side BusPowerDual-coreIntel(R)VT± Enhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°U2500 65 nm 2MB L2 1.20 GHz 533 MHz 9W X X X XU2400 65 nm 2MB L2 1.06 GHz 533 MHz 9W X X X X3.4 酷睿单核Intel(R) Core(TM) Solo processorProcessor NumberArchitecture格大全CacheClock SpeedFront Side BusPowerEnhanced Intel SpeedStep(R) TechnologyExecute Disable BitT1400 65 nm 2 MB L2 1.83 GHz 667 MHz 27W X XT1300 65 nm 2 MB L2 1.66 GHz 667 MHz 27W X X3.5 酷睿单核超低压版Intel(R) Core(TM) Solo processor Ultra Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusPowerIntel(R) VT±Enhanced Intel SpeedStep(R) TechnologyExecute Disable BitU1500 65 nm 2 MB L2 1.33 GHz 533 MHz 5.5W X X XU1400 65 nm 2 MB L2 1.20 GHz 533 MHz 5.5W X X XU1300 65 nm 2 MB L2 1.06 GHz 533 MHz 5.5W X X X4. 奔腾系列4.1 笔记本奔腾双核Intel(R) Pentium(TM) dual-core processorProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreEnhanced Intel SpeedStep(R) Technology?格大全Execute Disable Bit°Intel(R) 64ΦE2160 65 nm 1MB L2 1.80 GHz 800 MHz X X X XE2140 65 nm 1MB L2 1.60 GHz 800 MHz X X X XT2130 65 nm 1MB L2 1.86 GHz 533 MHz X X X 0T2080 65 nm 1MB L2 1.73 GHz 533 MHz X X X 0T2060 65 nm 1MB L2 1.60 GHz 533 MHz X X X 04.2 笔记本奔腾移动版FeaturingIntel(R) Pentium(TM) M processorProcessor NumberArchitectureCacheClock SpeedFront Side BusEnhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°780 90 nm 2 MB L2 2.26 GHz 533 MHz X X770 90 nm 2 MB L2 2.13 GHz 533 MHz X X765 90 nm 2 MB L2 2.10 GHz 400 MHz X 0760 90 nm 2 MB L2 2.00 GHz 533 MHz X X755 90 nm 2 MB L2 2.00 GHz 400 MHz X 0750 90 nm 2 MB L2 1.86 GHz 533 MHz X X745 90 nm 2 MB L2 1.80 GHz 400 MHz X 0740 90 nm 2 MB L2 1.73 GHz 533 MHz X X735 90 nm 2 MB L2 1.70 GHz 400 MHz X 0730 90 nm 2 MB L2 1.60 GHz 533 MHz X X725 90 nm 2 MB L2 1.60 GHz 400 MHz X 0715 90 nm 2 MB L2 1.50 GHz 400 MHz X 0705 130 nm 1 MB L2 1.50 GHz 400 MHz X 04.3 笔记本奔腾移动低压版Intel(R) Pentium(TM) M processor Low Voltage格大全Processor NumberArchitectureCacheClock SpeedFront Side BusEnhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°778 90 nm 2MB L2 1.60 GHz 400 MHz X X758 90 nm 2MB L2 1.50 GHz 400 MHz X X738 90 nm 2MB L2 1.40 GHz 400 MHz X 0718 130 nm 1MB L2 1.30 GHz 400 MHz X 04.4 笔记本奔腾移动超低压版Intel(R) Pentium(TM) M processor Ultra Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusEnhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°773 90 nm 2MB L2 1.30 GHz 400 MHz X X753 90 nm 2MB L2 1.20 GHz 400 MHz X X733J 90 nm 2MB L2 1.10 GHz 400 MHz X X733 90 nm 2MB L2 1.10 GHz 400 MHz X 0723 90 nm 2MB L2 1.00 GHz 400 MHz X 0713 130 nm 1MB L2 1.10 GHz 400 MHz X 04.5 奔腾Extreme版Intel(R) Pentium(TM) processor Extreme EditionProcessor NumberArchitectureCache格大全Clock SpeedFront Side BusDual-coreIntel(R)VT±HT Technology?Intel(R)64ΦExecute Disable Bit°965 65 nm 2x2 MB L2 3.73 GHz 1066 MHz X X X X X955 65 nm 2x2 MB L2 3.46 GHz 1066 MHz X X X X X840 90 nm 2x1 MB L2 3.20 GHz 800 MHz X 0 X X X4.6 奔腾双核Intel(R) Pentium(TM) D processorProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R)VT±Enhanced Intel SpeedStep(R)Technology?Intel(R) 64ΦExecute Disable Bit°960 65-nm technology 2x2 MB L2 3.60 GHz 800 MHz X X X X X950 65-nm technology 2x2 MB L2 3.40 GHz 800 MHz X X X X X945 65-nm technology 2x2 MB L2 3.40 GHz 800 MHz X 0 X X X940 65-nm technology 2x2 MB L2 3.20 GHz 800 MHz X X X X X935 65-nm technology 2x2 MB L2 3.20 GHz 800 MHz X 0 X X X930 65-nm technology 2x2 MB L2 3.00 GHz 800 MHz X X X X X925 65-nm technology 2x2 MB L2 3.00 GHz 800 MHz X 0 X X X920 65-nm technology 2x2 MB L2 2.80 GHz 800 MHz X X X X X915 65-nm technology 2x2 MB L2 2.80 GHz 800 MHz X 0 X X X840 90-nm technology 2x1 MB L2 3.20 GHz 800 MHz X 0 X X X格大全830 90-nm technology 2x1 MB L2 3.00 GHz 800 MHz X 0 X X X820 90-nm technology 2x1 MB L2 2.80 GHz 800 MHz X 0 0 X X805 90-nm technology 2x1 MB L2 2.66 GHz 533 MHz X 0 0 X X4.7 带超线程的奔腾4Intel(R) Pentium(TM) 4 processor HTProcessor NumberArchitectureCacheClock SpeedFront Side BusHT Technology?Enhanced Intel SpeedStep(R) Technology?Intel(R) 64ΦExecute Disable Bit°670 90 nm 2 MB L2 3.80 GHz 800 MHz X X X X661 65 nm 2 MB L2 3.60 GHz 800 MHz X X X X660 90 nm 2 MB L2 3.60 GHz 800 MHz X X X X651 65 nm 2 MB L2 3.40 GHz 800 MHz X X X X650 90 nm 2 MB L2 3.40 GHz 800 MHz X X X X641 65 nm 2 MB L2 3.20 GHz 800 MHz X X X X640 90 nm 2 MB L2 3.20 GHz 800 MHz X X X X631 65 nm 2 MB L2 3.00 GHz 800 MHz X X X X630 90 nm 2 MB L2 3.00 GHz 800 MHz X X X X551 90 nm 1 MB L2 3.40 GHz 800 MHz X 0 X X541 90 nm 1 MB L2 3.20 GHz 800 MHz X 0 X X531 90 nm 1 MB L2 3.00 GHz 800 MHz X 0 X X524 90 nm 1 MB L2 3.06 GHz 533 MHz X 0 X X521 90 nm 1 MB L2 2.80 GHz 800 MHz X 0 X X4.8 奔腾4Mobile Intel(R) Pentium(TM) 4 processorProcessor Number格大全ArchitectureCacheClock SpeedFront Side BusHT technologyEnhanced Intel SpeedStep(R) Technology552 90 nm 1 MB L2 3.46 GHz 533 MHz X X548 90 nm 1 MB L2 3.33 GHz 533 MHz X X538 90 nm 1 MB L2 3.20 GHz 533 MHz X X532 90 nm 1 MB L2 3.06 GHz 533 MHz X X518 90 nm 1 MB L2 2.80 GHz 533 MHz X X5. 赛扬系列5.1 笔记本赛扬MIntel(R) Celeron(TM) M processorProcessor NumberArchitectureCacheClock SpeedFront Side BusIntel(R) 64ΦExecute Disable Bit°530 65 nm 1 MB L2 1.73 GHz 533 MHz X X520 65 nm 1 MB L2 1.60 GHz 533 MHz X X450 65 nm 1 MB L2 2.00 GHz 533 MHz 0 X440 65 nm 1 MB L2 1.86 GHz 533 MHz 0 X430 65 nm 1 MB L2 1.73 GHz 533 MHz 0 X420 65 nm 1 MB L2 1.60 GHz 533 MHz 0 X410 65 nm 1 MB L2 1.46 GHz 533 MHz 0 X390 90 nm 1 MB L2 1.70 GHz 400 MHz 0 X380 90 nm 1 MB L2 1.60 GHz 400 MHz 0 X370 90 nm 1 MB L2 1.50 GHz 400 MHz 0 X格大全360J 90 nm 1 MB L2 1.40 GHz 400 MHz 0 X360 90 nm 1 MB L2 1.40 GHz 400 MHz 0 X350J 90 nm 1 MB L2 1.30 GHz 400 MHz 0 X350 90 nm 1 MB L2 1.30 GHz 400 MHz 0 0340 130 nm 512 KB L2 1.50 GHz 400 MHz 0 0330 130 nm 512 KB L2 1.40 GHz 400 MHz 0 0320 130 nm 512 KB L2 1.30 GHz 400 MHz 0 0310 130 nm 512 KB L2 1.20 GHz 400 MHz 0 05.2 笔记本赛扬M超低压版Intel(R) Celeron(TM) M processor Ultra Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusExecute Disable Bit°443 65 nm 1 MB L2 1.20 GHz 533 MHz X423 65 nm 1 MB L2 1.06 GHz 533 MHz X383 90 nm 1 MB L2 1.00 GHz 400 MHz X373 90 nm 512 KB L2 1.00 GHz 400 MHz X353 90 nm 512 KB L2 900 MHz 400 MHz 0333 130 nm 512 KB L2 900 MHz 400 MHz 05.3 赛扬双核Intel(R) Celeron(TM) D processorProcessor NumberArchitectureCacheClock SpeedFront Side BusIntel(R) 64Φ格大全Execute Disable Bit°365 65 nm 512 KB L2 3.60 GHz 533 MHz X X360 65 nm 512 KB L2 3.46 GHz 533 MHz X X356 65 nm 512 KB L2 3.33 GHz 533 MHz X X355 90 nm 256 KB L2 3.33 GHz 533 MHz X X352 65 nm 512 KB L2 3.20 GHz 533 MHz X X351 90 nm 256 KB L2 3.20 GHz 533 MHz X X350 90 nm 256 KB L2 3.20 GHz 533 MHz 0 0347 65 nm 512 KB L2 3.06 GHz 533 MHz X X346 90 nm 256 KB L2 3.06 GHz 533 MHz X X345J 90 nm 256 KB L2 3.06 GHz 533 MHz 0 X345 90 nm 256 KB L2 3.06 GHz 533 MHz 0 X341 90 nm 256 KB L2 2.93 GHz 533 MHz X X340J 90 nm 256 KB L2 2.93 GHz 533 MHz 0 X340 90 nm 256 KB L2 2.93 GHz 533 MHz 0 X336 90 nm 256 KB L2 2.80 GHz 533 MHz X X335J 90 nm 256 KB L2 2.80 GHz 533 MHz 0 X335 90 nm 256 KB L2 2.80 GHz 533 MHz 0 X331 90 nm 256 KB L2 2.66 GHz 533 MHz X X330J 90 nm 256 KB L2 2.66 GHz 533 MHz 0 X330 90 nm 256 KB L2 2.66 GHz 533 MHz 0 X326 90 nm 256 KB L2 2.53 GHz 533 MHz X X325J 90 nm 256 KB L2 2.53 GHz 533 MHz 0 X325 90 nm 256 KB L2 2.53 GHz 533 MHz 0 0320 90 nm 256 KB L2 2.40 GHz 533 MHz 0 0315 90 nm 256 KB L2 2.26 GHz 533 MHz 0 0310 90 nm 256 KB L2 2.13 GHz 533 MHz 0 05.4 赛扬Intel(R) Celeron(TM) processorProcessor NumberArchitectureCache格大全Clock SpeedFront Side BusIntel(R) 64ΦExecute Disable Bit°540 65 nm 1 MB L2 1.86 GHz 533 MHz X X440 65 nm 512 KB L2 2.00 GHz 800 MHz X X430 65 nm 512 KB L2 1.80 GHz 800 MHz X X420 65 nm 512 KB L2 1.60 GHz 800 MHz X X6. 安腾系列Intel(R) Itanium(TM) 2 processorProcessor NumberPowerFront Side BusClock SpeedL3 CacheDual-Core64-BitIntel(R)VT±Intel(R) Cache SafeTechnology9050 104W 400/533 MHz 1.60 GHz 24 MB X X X X9040 104W 400/533 MHz 1.60 GHz 18 MB X X X X9030 104W 400/533 MHz 1.60 GHz 8 MB X X X X9020 104W 400/533 MHz 1.42 GHz 12 MB X X X X9015 104W 400 MHz 1.40 GHz 12 MB X X X X9010 75W 400/533 MHz 1.60 GHz 6 MB 0 X 0 X。

PowerEdge_R910服务器产品介绍.

英特尔 ®高级 RAS (可靠性、可用性、可维护性技术、用于实现虚拟机管理程序冗余的内置双 SD 模块,再加上与戴尔生命周期控制器相匹配的设计和组件质量,使技术人员不必从其他介质加载诊断程序。

戴尔产品内在的可靠性能够节省宝贵的时间,并最大限度地减少执行关键任务期间的停机。

为可靠性而构建PowerEdge R910通过工厂集成和验证提高了可靠性。

戴尔的“单人负责制” (one-touch流程可确保由一个人全权监督服务器的整个构建过程,执行更严格的质量控制。

每台配置完整的戴尔服务器在出厂之前都经过反复测试,确保客户拿到的是一台配置完整、经过全方位测试并可立即投入使用的服务器。

内置双 SD 模块为虚拟机管理程序提供了故障转移功能,这项功能是戴尔根据客户在可靠性方面的反馈而专门设计的。

戴尔乐于倾听意见并付诸实施。

PowerEdge R910率先在行业标准服务器上采用英特尔高级 RAS 技术,可以自动监控、报告并修复硬件错误,以维护数据完整性,保证任务关键型服务的持续性。

高效的基础架构性能资源、电源效率、 I/O和内存扩展能力对于最大限度地提高数据中心的工作负载至关重要。

PowerEdge R910配备性能极佳的英特尔 ®至强 ®处理器,提供高达 1 TB的DDR3内存、 2个 10 Gb可选 LOM ,并可通过 10个 PCIe 插槽整合低效工作负载。

高能效的系统设计采用了多项智能节能技术,包括针对您特定环境的功率封顶、功率清点和功率预算的电源管理功能。

内部组件的合理布局有利于空气流通,帮助服务器散热。

智能的平台,互联的基础PowerEdge R910遵循第 11代 PowerEdge 行为规范,秉承与整个产品组合一致的系统设计通用性和可用性。

所有第 11代服务器均以方便用户使用、节省时间和资金为设计理念。

戴尔系统管理解决方案专注于简化管理、提高效率、控制并降低成本,且遵循开放式标准。

Intel-英特尔-移动处理器参数表

2M
667MHz
65nm
35W
Merom
√
√
Core 2 Duo T5750
1000～2000MHz
2M
667MHz
65nm
35W
Merom
√
√
Core 2 Duo T5550
1000～1833MHz
2M
667MHz
65nm
35W
Merom
√
√
Core 2 Duo T5450
1000～1677MHz
1000～1600MHz
4M
800MHz
65nm
17W
Merom
√
√
√
Core 2 Duo L7300
1000～1400MHz
4M
800MHz
65nm
17W
Merom
√
√
√
Core 2 Duo U7700
1000～1333MHz
2M
533MHz
65nm
10W
Merom
√
√
√
Core 2 Duo U7600
65nm
25W
Merom
√
Celeron M 575
2.00 GHz
1M
667MHz
65nm
25W
Merom
√
英特尔赛扬超低电压版移动处理器:
Celeron M 723
1.20 GHz
1M
800MHz
65nm
10W
Merom
√
*注：早期上市的T5800/T3200笔记本产品搭配GM/PM965芯片组。
英特尔移动处理器参数表

DELL1 0G Blade Server PPT

10U Chassis Houses 16 x 2-socket blades
• • • •
Provision for additional blade form factors
Interactive Chassis LCD/control panel Deployment “Wizard” Chassis, blade, & I/O module information & alerts Front VGA and 2 USB ports for KVM
–
Mezz cards are also known as HBAs (for Fibre Channel) or HCAs (for Infiniband)
CMC (Chassis Management Controller) –The 10G equivalent to the DRAC/MC (MMB) from Glacier. This is the brains of the whole chassis. KVM (Keyboard/Video/Mouse Controller) – Module that consolidates all keyboard/video/mice functions into a single interface. SERDES (SERializer DESerializer) – Describes the type of electrical connection from the mezz cards to the IOMs. LOM (Lan On Motherboard) – This is the integrated networking device. NIC (Network Interface Controller) – Another name for a networking device.

MUNF7808C17C04 AMD Socket AM2(940-pin)处理器 nVidia M

用户说明书AMD Socket AM2(940-pin)处理器nVidia MCP61\MCP68\MCP78主板商标所有的产品注册商标及公司名称皆属其公司所有产品内容若有更改，恕不另行通知V1.0 中文版 2009年7月MUNF7808C17C04常用除错卡代码表以下列出一些常见的自检代码，对一些可能出现的问题以及解决方式的列表，如果想了解更多的关于自检代码的信息，请参考本说明书后面的附录。

目录第1章配件 (1)1-1 包装内容 (1)1-2 主板介绍 (2)1-3 主板规格 (3)1-4 系统模块图 (6)第2章安装 (7)2-1 CPU安装 (7)2-2 跳线设置 (8)2-3 系统内存 (9)2-4 背部I/O接口 (10)2-5 主板内部接口介绍 (10)第3章常用BIOS设置 (14)3-1 主菜单 (14)3-2 标准CMOS设置 (15)3-3 BIOS高级属性设置 (16)3-4 芯片组高级属性设置 (18)3-5 集成的周边设备设置 (19)3-6 电源管理设置 (21)3-7 PNP/PCI配置设定 (23)3-8 系统状态侦测设置（可选） (24)3-9 Q-Tune Bios超频功能设置 (25)3-10 默认菜单 (27)3-11 超级用户/用户密码设定 (28)3-12 退出BIOS (28)第4章驱动以及应用程序 (29)第5章常见问题解答 (30)附录：磐正超磐手主板保修条例 (31)1-1包装内容内容可选设备 A.主板 G.软驱数据线B.用户说明书 H.额外的USB2.0扩展端口连接C.CD I. 探温头D.I/O 挡板E.SATA II 数据线F.硬盘数据线A注：若您的包装内物品有任何的损坏或短缺情形，请与经销商联络。

E D H I CD1-2主板介绍●Socket AM2/AM2+Socket AM2/AM2+(940针)是AMD 高性能的Athlon AM2/AM2+处理器(AM2+处理器仅MCP78芯片支持)的接口，让用户体验到高效性能的执行能力。

华擎x370mhdv说明书

华擎x370mhdv说明书华擎X370MHDV是一款主板产品，该产品具有多种功能和特点，为用户提供了丰富的使用体验。

本文将从主要特点、规格参数、注意事项等方面对华擎X370MHDV进行详细介绍。

一、主要特点1. 支持AMD Ryzen系列处理器：华擎X370MHDV主板采用AMD X370芯片组，支持AMD Ryzen系列处理器，为用户提供强大的计算性能和稳定的系统运行。

2. 强化供电系统：华擎X370MHDV采用了数字供电设计，具备高效的供电能力，确保处理器运行稳定，提升系统的性能表现。

3. 支持双通道DDR4内存：该主板支持双通道DDR4内存，最高支持3200+(OC)频率，提供更快的数据传输速度和更稳定的系统运行。

4. PCIe 3.0接口：华擎X370MHDV具备一个PCIe 3.0 x16插槽和一个PCIe 2.0 x16插槽，支持多款显卡配置，满足不同用户的游戏和工作需求。

5. M.2插槽：该主板还配备了一个M.2插槽，支持高速NVMe SSD，提供更快的数据读写速度和更高的存储容量。

6. USB 3.1 Gen1和USB 3.0接口：华擎X370MHDV提供了多个USB接口，包括4个USB 3.1 Gen1接口和6个USB 3.0接口，方便用户连接外部设备。

7. 内置高清音频芯片：该主板内置Realtek ALC887高清音频芯片，提供清晰的音频输出，为用户带来沉浸式的音频体验。

二、规格参数1. 主板尺寸：Micro ATX尺寸（24.4厘米 x 24.4厘米）2. CPU支持：支持AMD Socket AM4的Ryzen系列处理器3. 内存支持：支持双通道DDR4内存，最高支持3200+(OC)频率，最大支持容量32GB4. 存储接口：4个SATA3接口，1个M.2插槽5. 扩展插槽：1个PCIe 3.0 x16插槽，1个PCIe 2.0 x16插槽，1个PCIe 2.0 x1插槽6. 后置I/O接口：1个PS/2键盘/鼠标接口，1个VGA接口，1个DVI-D接口，1个HDMI接口，4个USB 3.1 Gen1接口，2个USB 2.0接口，1个RJ-45网口，3个音频接口7. 网络：千兆以太网8. 音频：Realtek ALC887高清音频芯片三、注意事项1. 在安装前，请确保断开电源并接地保护，以免发生静电损坏主板。