ENS2J-D28-L00064中文资料
供电局工业以太网交换机及网管系统招标技术书
云南电网公司玉溪供电局配电网自动化试点建设工程工业以太网交换机及综合网管系统招标技术标准书云南电网公司2021年04月目录1 总那么 (3)适用范围 (3)投标须知 (3)投标要求 (4)2 标准性引用文件 (5)3 使用条件 (6)环境条件 (6)电气条件 (6)4 一般要求 (7)产品要求 (7)网管系统要求 (7)5 技术要求 (7)根本功能要求 (7)二层工业以太网交换机 (9)三层工业以太网交换机 (10)物理接口 (10)硬件要求 (11)软件要求 (11)时间同步要求 (11)6 以太网功能要求 (11)根本要求 (11)VLAN功能 (13)VLAN堆叠功能 (14)三层设备性能要求 (15)二层设备性能要求 (15)IP业务组网方案 (16)7 电源要求 (16)三层工业以太网交换机 (16)7.2 二层工业以太网交换机 (16)防雷要求 (17)其他 (17)8 综合网管系统 (17)概况 (17)系统功能要求 (18)接口及要求 (25)9 光纤配线箱 (26)概述 (26)根本要求 (26)综合要求 (27)设备配置 (27)设备安装要求 (27)电磁兼容和抗电磁干扰 (27)接地方式 (27)10 质量保证 (28)根本要求 (28)质量保证体系要求 (28)附加质量保证要求 (28)达不到保证性能的处理 (28)11 试验 (28)根本要求 (28)试验工程 (29)12 测试和验收 (29)根本要求 (29)术语限定 (30)型式检验 (30)出厂检验 (31)现场检验 (32)竣工验收 (32)判定规那么 (32)13 包装、运输和存储 (33)产品交货标准 (33)铭牌交货标准 (33)测试报告要求 (33)14 技术文件要求 (34)根本要求 (34)交付要求 (34)其他 (34)15 效劳要求 (35)检验和验收要求 (35)质量保证及管理要求 (35)技术效劳要求 (36)16 供货要求 (38)根本要求 (38)供货清单 (38)交货时间 (40)交货地点 (40)17 其他事项 (40)18 附件 (40)1总那么1.1适用范围本标准规定了云南电网公司玉溪供电局配电网自动化试点通信建设工程工业以太网交换机和综合网管系统的招标技术标准和要求。
EN29LV641L-90WIP资料
This Data Sheet may be revised by subsequent versions ©2005 Eon Silicon Solution, Inc., or modifications due to changes in technical specifications.1FEATURES• Single power supply operation- Full voltage range: 2.7 to 3.6 volts for read, erase and program operations• Low power cons umption (typical values at 5 MHz)- 9 mA typical active read current- 20 mA typical program/erase current- Less than 1 µA current in standby or automatic sleep mode.• JEDEC standards compatible- Pinout and software compatible with single-power supply Flash standard• Manufactured on 0.18 m process technology• Flexible Sector Architecture:- One hundred and twenty-eight 32K-Word sectors.• Minimum 100K program/erase endurance cycles.• High performance for program and erase - Word program time: 8µs typical - Sector Erase time: 500ms typical - Chip Erase time: 64s typical • Package Options- 48-pin TSOP- 63 ball 11mm x 12mm FBGASoftware features: • Sector Group Protection- Provide locking of sectors to prevent program or erase operations within individual sectors - Additionally, temporary Sector GroupUnprotect allows code changes in previously protected sectors. • Standard DATA# polling and toggle bits feature• Unlock Bypass Program command supported • Sector Erase Suspend / Resume modes: Read and program another Sector during Sector Erase Suspend Mode• Support JEDEC Common Flash Interface (CFI).Hardware features: • RESET# hardware reset pin- Hardware method to reset the device to read mode. • WP# input pin- Write Protect (WP#) function allowsprotection of first or last 32K-word sector, regardless of previous sector protect status • ACC input pin- Acceleration (ACC) function provides accelerated program times for higher throughput for manufacturing.GENERAL DESCRIPTIONThe EN29LV641H/L / EN29LV640U is a 64-Megabit (4,194,304x16), electrically erasable, read/write non-volatile flash memory. Any word can be programmed typically in 8µs. This device is entirely command set compatible with the JEDEC single-power-supply Flash standard.The EN29LV641H/L / EN29LV640U is designed to allow either single Sector or full Chip erase operation, where each Sector Group can be protected against program/erase operations or temporarily unprotected to erase or program. The device can sustain a minimum of 100K program/erase cycles on each Sector.EN29LV641H/L EN29LV640U 64 Megabit (4096K x 16-bit) Flash Memory, CMOS 3.0 Volt-only Uniform Sector Flash MemoryPRODUCT SELECTOR GUIDEProduct Number EN29LV641H/L / EN29LV640URegulated Voltage Range: V CC=3.0 – 3.6 V 70R Speed OptionFull Voltage Range: V CC=2.7 – 3.6 V 90 Max Access Time (ns) 70 90Max CE# Access Time (ns) 70 90Max OE# Access Time (ns) 30 35BLOCK DIAGRAMCONNECTION DIAGRAMSNote: No RY/BY# pin for TSOP package , V IO should be tied directly to VCC. Note: No WP# pin for FBGA package V IO should be tied directly to VCC.TABLE 1. PIN DESCRIPTIONLOGIC DIAGRAMDQ15 – DQ0A21 – A0Note: WP# pins are for EN29LV641H/L only.RY/BY# is available for EN29LV640U only.Pin Name Function A21-A0 22 Address inputs DQ15-DQ0 16 Data Inputs/Outputs CE# Chip Enable Input OE# Output Enable Input WE# Write Enable InputWP#Hardware Write Protect InputACC Acceleration Input RY/BY# Ready/Busy status output RESET# Hardware Reset Input Pin V cc Supply Voltage (2.7-3.6V)V IO Output Buffer Power Supply this pinshould be tied directly to VCC V ss GroundNCNot Connected to anythingORDERING INFORMATIONEN29LV641 H 90 T I P PACKAGING CONTENT (Blank) = Conventional P = Pb FreeTEMPERATURE RANGE I = Industrial (-40°C to +85°C) C = Commercial (0°C to +70°C) PACKAGET = 48-pin TSOPW= 63-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 11mm x 12mm packageSPEED OPTIONSee Product Selector Guide and Valid Combinations SECTOR for WRITE PROTECT (WP#=0) H = highest address sector protected L = lowest address sector protectedBASE PART NUMBEREN29LV641 / EN29LV640U 64 Megabit(4M x 16-Bit) Uniform Sector Flash Optional Data I/O voltage3V Read, Erase and ProgramPRODUCT SELECTOR GUIDEValid Combinations for TSOP Packages Vcc EN29LV641H 90 EN29LV641L 90 V cc = 2.7V-3.6VEN29LV641H 70R, EN29LV641L 70RTI, TCV cc = 3.0V-3.6VValid Combinations for FBGA Packages Vcc EN29LV640U 90 V cc = 2.7V-3.6V EN29LV640U 70RWI, WCV cc = 3.0V-3.6VTable 2. Sector (Group) Address Tables Sector GroupProtect/UnprotectSector Address Range for Sector EraseSector Group A21-A17 Sector A21A20A19A18A17A16A15Address Range(hexadecimal) SA0 0 0 0 0 0 0 0 000000–007FFFSA1 0 0 0 0 0 0 1 008000–00FFFFSA2 0 0 0 0 0 1 0 010000–017FFFSG0 00000SA3 0 0 0 0 0 1 1 018000–01FFFFSA4 0 0 0 0 1 0 0 020000–027FFFSA5 0 0 0 0 1 0 1 028000–02FFFFSA6 0 0 0 0 1 1 0 030000–037FFF SG100001SA7 0 0 0 0 1 1 1 038000–03FFFFSA8 0 0 0 1 0 0 0 040000–047FFFSA9 0 0 0 1 0 0 1 048000–04FFFFSA10 0 0 0 1 0 1 0 050000–057FFF SG200010SA11 0 0 0 1 0 1 1 058000–05FFFFSA12 0 0 0 1 1 0 0 060000–067FFFSA13 0 0 0 1 1 0 1 068000–06FFFFSA14 0 0 0 1 1 1 0 070000–077FFF SG300011SA15 0 0 0 1 1 1 1 078000–07FFFFSA16 0 0 1 0 0 0 0 080000–087FFFSA17 0 0 1 0 0 0 1 088000–08FFFFSA18 0 0 1 0 0 1 0 090000–097FFF SG4 00100SA19 0 0 1 0 0 1 1 098000–09FFFFSA20 0 0 1 0 1 0 0 0A0000–0A7FFFSA21 0 0 1 0 1 0 1 0A8000–0AFFFFSA22 0 0 1 0 1 1 0 0B0000–0B7FFF SG5 00101SA23 0 0 1 0 1 1 1 0B8000–0BFFFFSA24 0 0 1 1 0 0 0 0C0000–0C7FFFSA25 0 0 1 1 0 0 1 0C8000–0CFFFFSA26 0 0 1 1 0 1 0 0D0000–0D7FFF SG6 00110SA27 0 0 1 1 0 1 1 0D8000–0DFFFFSA28 0 0 1 1 1 0 0 0E0000–0E7FFFSA29 0 0 1 1 1 0 1 0E8000–0EFFFFSA30 0 0 1 1 1 1 0 0F0000–0F7FFF SG700111SA31 0 0 1 1 1 1 1 0F8000–0FFFFFSector Group A21-A17 Sector A21 A20A19A18A17A16A15Address Range(hexadecimal) SA32 0 1 0 0 0 0 0 100000–107FFFSA33 0 1 0 0 0 0 1 108000–10FFFFSA34 0 1 0 0 0 1 0 110000–117FFFSG8 01000SA35 0 1 0 0 0 1 1 118000–11FFFFSA36 0 1 0 0 1 0 0 120000–127FFFSA37 0 1 0 0 1 0 1 128000–12FFFFSA38 0 1 0 0 1 1 0 130000–137FFF SG9 01001SA39 0 1 0 0 1 1 1 138000–13FFFFSA40 0 1 0 1 0 0 0 140000–147FFFSA41 0 1 0 1 0 0 1 148000–14FFFFSA42 0 1 0 1 0 1 0 150000–157FFF SG10 01010SA43 0 1 0 1 0 1 1 158000–15FFFFSA44 0 1 0 1 1 0 0 160000–167FFFSA45 0 1 0 1 1 0 1 168000–16FFFFSA46 0 1 0 1 1 1 0 170000–177FFF SG11 01011SA47 0 1 0 1 1 1 1 178000–17FFFFSA48 0 1 1 0 0 0 0 180000–187FFFSA49 0 1 1 0 0 0 1 188000–18FFFFSA50 0 1 1 0 0 1 0 190000–197FFF SG12 01100SA51 0 1 1 0 0 1 1 198000–19FFFFSA52 0 1 1 0 1 0 0 1A0000–1A7FFFSA53 0 1 1 0 1 0 1 1A8000–1AFFFFSA54 0 1 1 0 1 1 0 1B0000–1B7FFF SG13 01101SA55 0 1 1 0 1 1 1 1B8000–1BFFFFSA56 0 1 1 1 0 0 0 1C0000–1C7FFFSA57 0 1 1 1 0 0 1 1C8000–1CFFFFSA58 0 1 1 1 0 1 0 1D0000–1D7FFF SG14 01110SA59 0 1 1 1 0 1 1 1D8000–1DFFFFSA60 0 1 1 1 1 0 0 1E0000–1E7FFFSA61 0 1 1 1 1 0 1 1E8000–1EFFFFSA62 0 1 1 1 1 1 0 1F0000–1F7FFF SG15 01111SA63 0 1 1 1 1 1 1 1F8000–1FFFFFSector Group A21-A17 Sector A21A20A19A18A17A16A15Address Range(hexadecimal) SA64 1 0 0 0 0 0 0 200000–207FFFSA65 1 0 0 0 0 0 1 208000–20FFFFSA66 1 0 0 0 0 1 0 210000–217FFFSG16 10000SA67 1 0 0 0 0 1 1 218000–21FFFFSA68 1 0 0 0 1 0 0 220000–227FFFSA69 1 0 0 0 1 0 1 228000–22FFFFSA70 1 0 0 0 1 1 0 230000–237FFF SG1710001SA71 1 0 0 0 1 1 1 238000–23FFFFSA72 1 0 0 1 0 0 0 240000–247FFFSA73 1 0 0 1 0 0 1 248000–24FFFFSA74 1 0 0 1 0 1 0 250000–257FFF SG1810010SA75 1 0 0 1 0 1 1 258000–25FFFFSA76 1 0 0 1 1 0 0 260000–267FFFSA77 1 0 0 1 1 0 1 268000–26FFFFSA78 1 0 0 1 1 1 0 270000–277FFF SG1910011SA79 1 0 0 1 1 1 1 278000–27FFFFSA80 1 0 1 0 0 0 0 280000–287FFFSA81 1 0 1 0 0 0 1 288000–28FFFFSA82 1 0 1 0 0 1 0 290000–297FFF SG2010100SA83 1 0 1 0 0 1 1 298000–29FFFFSA84 1 0 1 0 1 0 0 2A0000–2A7FFFSA85 1 0 1 0 1 0 1 2A8000–2AFFFFSA86 1 0 1 0 1 1 0 2B0000–2B7FFF SG2110101SA87 1 0 1 0 1 1 1 2B8000–2BFFFFSA88 1 0 1 1 0 0 0 2C0000–2C7FFFSA89 1 0 1 1 0 0 1 2C8000–2CFFFFSA90 1 0 1 1 0 1 0 2D0000–2D7FFF SG2210110SA91 1 0 1 1 0 1 1 2D8000–2DFFFFSA92 1 0 1 1 1 0 0 2E0000–2E7FFFSA93 1 0 1 1 1 0 1 2E8000–2EFFFFSA94 1 0 1 1 1 1 0 2F0000–2F7FFF SG2310111SA95 1 0 1 1 1 1 1 2F8000–2FFFFFSector Group A21-A17 Sector A21A20A19A18A17A16A15Address Range(hexadecimal) SA96 1 1 0 0 0 0 0 300000–307FFFSA97 1 1 0 0 0 0 1 308000–30FFFFSA98 1 1 0 0 0 1 0 310000–317FFFSG24 11000SA99 1 1 0 0 0 1 1 318000–31FFFFSA100 1 1 0 0 1 0 0 320000–327FFFSA101 1 1 0 0 1 0 1 328000–32FFFFSA102 1 1 0 0 1 1 0 330000–337FFF SG25 11001SA103 1 1 0 0 1 1 1 338000–33FFFFSA104 1 1 0 1 0 0 0 340000–347FFFSA105 1 1 0 1 0 0 1 348000–34FFFFSA106 1 1 0 1 0 1 0 350000–357FFF SG26 11010SA107 1 1 0 1 0 1 1 358000–35FFFFSA108 1 1 0 1 1 0 0 360000–367FFFSA109 1 1 0 1 1 0 1 368000–36FFFFSA110 1 1 0 1 1 1 0 370000–377FFF SG27 11011SA111 1 1 0 1 1 1 1 378000–37FFFFSA112 1 1 1 0 0 0 0 380000–387FFFSA113 1 1 1 0 0 0 1 388000–38FFFFSA114 1 1 1 0 0 1 0 390000–397FFF SG28 11100SA115 1 1 1 0 0 1 1 398000–39FFFFSA116 1 1 1 0 1 0 0 3A0000–3A7FFFSA117 1 1 1 0 1 0 1 3A8000–3AFFFFSA118 1 1 1 0 1 1 0 3B0000–3B7FFF SG29 11101SA119 1 1 1 0 1 1 1 3B8000–3BFFFFSA120 1 1 1 1 0 0 0 3C0000–3C7FFFSA121 1 1 1 1 0 0 1 3C8000–3CFFFFSA122 1 1 1 1 0 1 0 3D0000–3D7FFF SG30 11110SA123 1 1 1 1 0 1 1 3D8000–3DFFFFSA124 1 1 1 1 1 0 0 3E0000–3E7FFFSA125 1 1 1 1 1 0 1 3E8000–3EFFFFSA126 1 1 1 1 1 1 0 3F0000–3F7FFF SG31 11111SA127 1 1 1 1 1 1 1 3F8000–3FFFFF Note: The sizes of all sectors are 32K-word.USER MODE DEFINITIONSTABLE 3. BUS OPERATIONSOperation CE#OE#WE#RESET#WP# ACCA21-A0DQ15-DQ0 Read LLHHXXA IN D OUT Write LHLH(Note1)XA IN(Note 3)Accelerated Program L H L H (Note1)V HH A IN(Note 3)CMOS Standby V cc±0.3V X X V cc±0.3VX H X High-ZTTLStandby HXX H X H X High-Z OutputDisableLHH H X X X High-Z HardwareReset X X X L X X X High-ZSector Group Protect L H L V ID H XSA,A6=L,A1=H,A0=L(Note 3)Sector Group Unprotect L H L V ID H XSA,A6=H,A1=H,A0=L(Note 3)TemporarySector GroupUnprotectX X X V ID H X A IN(Note 3)L=logic low= V IL, H=Logic High= V IH, V ID= V HH = 11 ± 0.5V = 10.5 11.5V, X=Don’t Care (eitherL or H, but not floating!), SA=Sector Addresses (A21-A15), D IN=Data In, D OUT=Data Out,A IN=Address InNotes:1. If the system asserts V IL on the WP# pin, the device disables program and erase functions inthe first or last sector independent of whether those sectors were protected or unprotected; ifthe system asserts V IH on the WP# pin, the device reverts to whether the first or last sector waspreviously protected or unprotected. If ACC = V HH, all sectors will be unprotected.2. Please refer to “Sector Group Protection & Unprotection”, Flowchart 6a and Flowchart 6b.3. D IN or D OUT as required by command sequence, data polling, or sector protect algorithm.Read ModeThe device is automatically set to reading array data after device power-up or hardware reset. No commands are required to retrieve data. The device is also ready to read array data after completing an Embedded Program or Embedded Erase algorithmAfter the device accepts an Sector Erase Suspend command, the device enters the Sector Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erase-suspended sectors, the device outputs status data. After completing a programming operation in the Sector Erase Suspend mode, the system may once again read arraydata with the same exception. See “Sector Erase Suspend/Resume Commands” for more additional information.The system must issue the reset command to re-enable the device for reading array data if DQ5 goes high or while in the autoselect mode. See the “Reset Command” for additional details.Output Disable ModeWhen the OE# pin is at a logic high level (V IH), the output from the device is disabled. The output pins are placed in a high impedance state.Standby ModeThe device has a CMOS-compatible standby mode, which reduces the c urrent to < 1µA (typical). It is placed in CMOS-compatible standby when the CE# pin is at V CC± 0.5. RESET# and BYTE# pin must also be at CMOS input levels. The device also has a TTL-compatible standby mode, which reduces the maximum V CC c urrent to < 1mA. It is placed in TTL-compatible standby when the CE# pin is at V IH. When in standby modes, the outputs are in a high-impedance state independent of the OE# input.Automatic Sleep ModeThe device has an automatic sleep mode, which minimizes power consumption. The devices will enter this mode automatically when the states of address bus remain stable for t acc + 30ns. ICC4 in the DC Characteristics table shows the current specification. With standard access times, the device will output new data when addresses change.Writing Command SequencesTo write a command or command sequence to program data to the device or erase data, the system has to drive WE# and CE# to V IL, and OE# to V IH.The device has an Unlock Bypass mode to facilitate faster programming. Once the device enters the Unlock Bypass mode, only two write cycles are required to program a word, instead of four.The system can also read the autoselect codes by entering the autoselect mode, which need the autoselect command sequence to be written. Please refer to the “Command Definitions” for all the available commands.Autoselect Identification ModeThe autoselect mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on DQ15–DQ0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system through the command register.When using programming equipment, the autoselect mode requires V ID(10.5 V to 11.5 V) on address pin A9. Address pins A6, A1, and A0 must be as shown in Autoselect Codes table. In addition, when verifying sector group protection, the sector group address must appear on the appropriate highest order address bits. Refer to the corresponding Sector Address Tables. The “Command Definitions” table shows the remaining address bits that are don’t-care. When all necessary bits have been set as required, the programming equipment may then read the corresponding identifier code on DQ15–DQ0.To access the autoselect codes in-system; the host system can issue the autoselect command via the command register, as shown in the Command Definitions table. This method does not require V ID. See “Command Definitions” for details on using the autoselect mode. Note that a Reset command is required to return to read mode when the device is in the autoselect mode.TABLE 4. Autoselect Codes (Using High Voltage, V ID )L=logic low= V IL , H=Logic High= V IH , V ID =11 ± 0.5V, X=Don’t Care (either L or H, but not floating!), SA=Sector AddressesNote:1. A8=H is recommended for Manufacturing ID check. If a manufacturing ID is read with A8=L, the chip will output a configuration code 7Fh.2. A9 = V ID is for HV A9 Autoselect mode only. A9 must be ≤ Vcc (CMOS logic level) for Command AutoselectMode.ACC: Accelerated Program OperationThe device offers accelerated program operation which enables the programming in higher speed. When ACC is raised to V HH , the memory automatically enters the Unlock Bypass mode (please refer to “Command Definitions”), temporarily unprotects every protected sector groups , and reduces the time required for program operation. The system would use a two-cycle program command sequence as required by the Unlock Bypass mode. When ACC returns to V IH or V IL , normal operation resumes. The transitions from V IH or V IL to V HH and from V HH to V IH or V IL must be slower than t VHH , see Figure 5.Note that the ACC pin must not be left floating or unconnected. In addition, ACC pin must not be at V HH for operations other than accelerated program. It could cause the device to be damaged. Never raise this pin to V HH from any mode except Read mode; otherwise the memory may be left in an indeterminate state.A 0.1µF capacitor should be connected between the ACC pin and the V SS Ground pin to decouple the current surges from the power supply. The PCB track widths must be sufficient to carry the currents required during Unlock Bypass Program.RESET#: Hardware ResetWhen RESET# is driven low for t RP , all output pins are tristates. All commands written in the internal state machine are reset to reading array data.Please refer to timing diagram for RESET# pin in “AC Characteristics”.Sector Group Protection & UnprotectionThe hardware sector group protection feature disables both program and erase operations in any sector group. The hardware chip unprotection feature re-enables both program and erase operations in previouslyDescription CE# OE# WE# A21toA15 A14 to A10A92A8A7A6A5 to A2A1 A0 DQ15 to DQ0H1XX1Ch Manufacturer ID: Eon L L H X X V IDLX L XL LXX7FhAutoselect Device ID L L H X X V IDX X L X L H 22D7h Sector Protection VerificationL L H SA X V IDX X L X H LXX01h(Protected)XX00h(Unprotected)protected sector group. A sector group consists of four adjacent sectors that would be protected at the same time. Please see Table 2 which show the organization of sector groups.There are two methods to enable this hardware protection circuitry. The first one requires only that the RESET# pin be at V ID and then standard microprocessor timings can be used to enable or disable this feature. See Flowchart 6a and 6b for the algorithm and Figure 11 for the timings.When doing Sector Group Unprotect, all the unprotected sector groups must be protected prior to any unprotect write cycle.The second method is for programming equipment. This method requires V ID to be applied to both OE# and A9 pins and non-standard microprocessor timings are used. This method is described in a separate document, the Datasheet Supplement of EN29LV641H/L / EN29LV640U, which can be obtained by contacting a representative of Eon Silicon Solution, Inc.WP#: Write ProtectThe Write Protect function provides a hardware method to protect the first or last sector against erase and program without using V ID.When WP# is Low, the device protects the first or last sector regardless of whether these sectors were previously protected or unprotected using the method described in “Sector Group Protection & Unprotection”, Program and Erase operations in these sectors are ignored.When WP# is High, the device reverts to the previous protection status of the first or last sector. Program and Erase operations can now modify the data in those sectors unless the sector is protected using Sector Group Protection.Note that the WP# pin must not be left floating or unconnected.Temporary Sector Group UnprotectThis feature allows temporary unprotection of previously protected sector groups to change data while in-system. The Temporary Sector Group Unprotect mode is activated by setting the RESET# pin to V I D. During this mode, formerly protected sector groups can be programmed or erased by simply selecting the sector group addresses. Once V I D is removed from the RESET# pin, all the previously protected sector groups are protected again. See accompanying flowchart and timing diagrams in Figure 10 for more details.StartReset#=V ID(note 1) Perform Erase or ProgramOperationsRESET#=V IH Temporary Sector Group Unprotect Completed (note 2)Notes:1. All protected sector groups are unprotected. (If WP#=V IL, the first or last sector will remain protected.)2. Previously protected sector groups are protected again.COMMON FLASH INTERFACE (CFI)The common flash interface (CFI) specification outlines device and host systems software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and backward-compatible for the specified flash device families. Flash vendors can standardize their existing interfaces for long-term compatibility.This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address 55h, any time the device is ready to read array data.The system can read CFI information at the addresses given in Tables 5-8.The upper address bits (A7–MSB) must be all zeros. To terminate reading CFI data, the system must write the reset command.The system can also write the CFI query command when the device is in the autoselect mode. The device enters the CFI query mode and the system can read CFI data at the addresses given in Tables 5–8. The system must write the reset command to return the device to the autoselect mode.Table 5. CFI Query Identification StringAddresses Data Description10h 11h 12h 0051h0052h0059hQuery Unique ASCII string “QRY”13h 14h 0002h0000hPrimary OEM Command Set15h 16h 0040h0000hAddress for Primary Extended Table17h 18h 0000h0000hAlternate OEM Command set (00h = none exists)19h 1Ah 0000h0000hAddress for Alternate OEM Extended Table (00h = none exists)Table 6. System Interface StringAddresses Data Description1Bh 0027h Vcc Min (write/erase)DQ7-DQ4: volt, DQ3 –DQ0: 100 millivolt1Ch 0036h Vcc Max (write/erase)DQ7-DQ4: volt, DQ3 –DQ0: 100 millivolt1Dh 0000h Vpp Min. voltage (00h = no Vpp pin present)1Eh 0000h Vpp Max. voltage (00h = no Vpp pin present)1Fh 0003h Typical timeout per single byte/word write 2NµS20h 0000h Typical timeout for Min, size buffer write 2NµS (00h = not supported) 21h 000Ah Typical timeout per individual block erase 2N ms22h 0000h Typical timeout for full chip erase 2N ms (00h = not supported)23h 0005h Max. timeout for byte/word write 2N times typical24h 0000h Max. timeout for buffer write 2N times typical25h 0002h Max. timeout per individual block erase 2N times typical26h 0000h Max timeout for full chip erase 2N times typical (00h = not supported) Table 7. Device Geometry DefinitionAddresses Data Description27h 0017h Device Size = 2Nbytes 28h 29h 0001h0000h Flash Device Interface description (refer to CFI publication 100)2Ah 2Bh 0000h 0000h Max. number of byte in multi-byte write = 2N (00h = not supported) 2Ch 0002h Number of Erase Block Regions within device 2Dh 2Eh 2Fh 30h 0007h 0000h 0020h 0000h Erase Block Region 1 Information (refer to the CFI specification of CFI publication 100) 31h 32h 33h 34h 007Eh 0000h0000h 0001h Erase Block Region 2 Information35h 36h 37h 38h 0000h 0000h0000h 0000hErase Block Region 3 Information39h3Ah3Bh3Ch0000h 0000h 0000h 0000h Erase Block Region 4 InformationTable 8. Primary Vendor-specific Extended QueryAddresses Data Description40h 41h 42h 0050h 0052h 0049h Query-unique ASCII string “PRI” 43h 0031h Major version number, ASCII 44h 0033h Minor version number, ASCII45h 0004hAddress Sensitive Unlock0 = Required, 1 = Not Required 46h 0002hErase Suspend0 = Not Supported, 1 = To Read Only, 2 = To Read & Write 47h 0004hSector Protect0 = Not Supported, X = Number of sectors in per group 48h 0001hSector Temporary Unprotect00 = Not Supported, 01 = Supported 49h 0004h Sector Protect/Unprotect scheme01 = 29F040 mode, 02 = 29F016 mode,03 = 29F400 mode, 04 = 29LV800A mode 4Ah 0000hSimultaneous Operation00 = Not Supported, 01 = Supported 4Bh 0000hBurst Mode Type00 = Not Supported, 01 = Supported 4Ch 0000hPage Mode Type00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page 4Dh 00A5hMinimum ACC (Acceleration) Supply Voltage00 = Not Supported, DQ7-DQ4 : Volts, DQ3-DQ0 : 100mV 4Eh 00B5hMaximum ACC (Acceleration) Supply Voltage00 = Not Supported, DQ7-DQ4 : Volts, DQ3-DQ0 : 100mV4Fh 00XXh 00h = Uniform Sector DevicesHardware Data protectionThe command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes as seen in the Command Definitions table. Additionally, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by false system level signals during Vcc power up and power down transitions, or from system noise.Low V CC Write InhibitWhen V CC is less than V LKO, the device does not accept any write cycles. This protects data during V CC power up and power down. The command register and all internal program/erase circuits are disabled, and the device resets. Subsequent writes are ignored until V CC is greater than V LKO. The system must provide the proper signals to the control pins to prevent unintentional writes when V CC is greater than V LKO.Write Pulse “Glitch” protectionNoise pulses of less than 5 ns (typical) on OE#, CE# or WE# do not initiate a write cycle.Logical InhibitWrite cycles are inhibited by holding any one of OE# = V IL, CE# = V IH, or WE# = V IH. To initiate a write cycle, CE# and WE# must be a logical zero while OE# is a logical one. If CE#, WE#, and OE# are all logical zero (not recommended usage), it will be considered a read.Power-up Write InhibitDuring power-up, the device automatically resets to READ mode and locks out write cycles. Even with CE# = V IL, WE#= V IL and OE# = V IH, the device will not accept commands on the rising edge of WE#.COMMAND DEFINITIONSThe operations of the device are selected by one or more commands written into the command register. Commands are made up of data sequences written at specific addresses via the command register. The sequences for the specified operation are defined in the Command Definitions table (Table 9). Incorrect addresses, incorrect data values or improper sequences will reset the device to Read Mode.Table 9. EN29LV641H/L / EN29LV640U Command DefinitionsBus Cycles (Note 1-2)1stCycle 2ndCycle3rdCycle4thCycle5thCycle6thCycleCommand Sequence C y c l e sRead (Note 3)1RA RD Reset 1xxx F0 Manufacturer ID 4555 AA 2AA 55 55590000 1007F 1CDevice ID 4555 AA 2AA 55 55590 X01 22D7 A u t o s e l e c tSector Protect Verify (Note 4)4555 AA 2AA 55 55590(SA)X02XX00 XX01Program 4555 AA 2AA 55 555A0 PA PD Unlock Bypass 3555 AA 2AA 55 55520 Unlock Bypass Program2XXX A0 PA PD Unlock Bypass Reset 2XXX90XXX00Chip Erase 6555 AA 2AA 55 55580 555 AA 2AA 55 55510Sector Erase 6555 AA 2AA 55 55580 555 AA 2AA 55 SA 30 Sector Erase Suspend 1BA B0 Sector Erase Resume 1BA 30 CFI Query 15598Address and Data values indicated are in hex. Unless specified, all bus cycles are write cycles RA = Read Address: address of the memory location to be read. This is a read cycle. RD = Read Data: data read from location RA during Read operation. This is a read cycle. PA = Program Address: address of the memory location to be programmed. X = Don’t-Care PD = Program Data: data to be programmed at location PASA = Sector Address: address of the Sector to be erased or verified (in Autoselect mode).Address bits A21-A15 uniquely select any Sector.Notes:1. Data bits DQ15-DQ8 are don’t care in command sequences, except for RD and PD.2. Unless otherwise noted, address bits A21-A15 are don’t cares.3. No unlock or command cycles required when device is in read mode.4. The data is 00h for an unprotected sector group and 01h for a protected sector group.。
2x2和2x4型号LED设备说明书
Consult installation guide for exact dimensions.CEILING CUTOUT SIZE A B C D E F 2X223 3/4”23 3/4” 4 1/8”22 1/2”22 7/8”22 7/8”2X447 3/4”23 3/4”4 1/8”46 1/2”46 3/4”22 7/8”ATOP VIEW7/8” WIRING ACCESSEDCROSS SECTIONCBFHousingPrecision die formed and welded housing with specified material (see product ordering key).MountingFlange installation is supported by swing style mounting brackets. Grid installation suitable for 1” and 1.5” T-Bar ceilings.Door FrameSingle piece precision die formed with specified material (see product ordering key). Corners are TIG welded. Tamper resistant TORX® Head with center pin fasteners secure door frame to housing.LEDAvailable in two standard colour temperatures 3500K and 4000K.LensMultiple lens choices available (see product key for options). Lens sealed to door frame with continuous retention system and supported with stainless steel aircraft cables.FinishPolyester powder painted white finish features a high reflectivity coating for improved performance and efficiency.ElectricalLong life LED’s coupled with high efficiency drivers provide quality illumination. Rated to deliver an L80 performance >50,000 hours. The standard driver has a THD of <10%. Standard low-voltage dimming (0-10v). All electrical components are CSA or UL approved. A ½” EMT hole is provided for wiring connections.Warranty5 year limited warranty. For complete warranty terms visit:/assets/Viscor_LED_Warranty.pdfDimensionsApprovalsApproved CSA and UL Standards. UL listed for insulated ceilings, wet locations.ICRATEDProduct DescriptionThe VRU series by Certolux is a vandal resistant IC-rated specification grade recessed luminaire for grid or flange applications. The luminaire features tamper resistant fasteners to protect from unauthorized fixture penetration and security lenses to maximize impact resistance.Features• SPEEDShip in 5 days (limited quantity of 25 units)Features Options• IP65 RatingOrder KeyEXAMPLE: VRUI2X2A/ALED840K055LUNV-P13/P45PhotometricCRI8 - (80-89)8A AVoltageUNV - 120-277V347 - 347VCCT35K - 3500 K40K - 4000 KSize NominalLumens Watts 2x25500532x45500477000611000082LEDVRUSeriesSize(Width xLength)2x22x4 Door StyleI - InsetO - OverlappingDoorGaugeA - 18 Ga. CRS - PaintedHousingGaugeA - 18 Ga. CRS - PaintedInternal/ExternalLensP13 - .125 Prismatic AcrylicP45 - .125 Clear Polycarbonate/-/NominalLumens055L - 5500lm070L - 7000lm100L - 10000lm2x42x2VRUI-2X2-LED840K055LUNV-P82P08IES File:VRUI-2X2-LED840K055LUNV-P82P08Lumens:5569Wattage:52Efficacy:1070°10°20°30°40°50°60°70°80°90200 cd 400 cd 600 cd 800 cd 1000 cd 1200 cd 1400 cd 1600 cd 1800 cd 2000 cd 2200 cd 2400 cdZonal Lumen SummaryZone Lumens%Lamp0.0° - 30.0°1723-43,083.6%30.9%0.0° - 40.0°2764-69,091.0%49.6%0.0° - 60.0°4646-116,155.7%83.4%0.0° - 90.0°5569-139,225.4%100.0%Average Luminance Table (cd/m2)CP Summary0.00°45.00°90.00°0.00°63646364636445.00°52025147523255.00°46644579468165.00°39103791391575.00°26592559278085.00°79711701738Coefficients of Utilizationρc80%70%50%ρw70%50%30%70%50%30%70%50%30%0119119119116116116111111111111010510110710399102999621009386989185938782392827489807385777148473658272647869625786557766456726255672595070585067564976754456553456251448624941614841584740958453757453754443610554234534134514033Effective Floor Cavity Reflectance: 20%P13P45OptionsApproval OptionsX8 IP65 RatingOther options may be available, consult factory.Specifications and data subject to change without notice.。
ENC28J60_cn中文手册
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VDDOSC
OSC2 OSC1 VSSOSC VSSPLL VDDPLL VDDRX
2006 Microchip Technology Inc.
高级信息
DS39662A_CN 第 1 页
ENC28J60
目录
1.0 概述 ... 2.0 外部连接 ... 3.0 存储器构成 ... 4.0 串行外设接口 (SPI) ... 5.0 以太网概述 ... 6.0 初始化 ... 7.0 发送和接收数据包 ... 8.0 接收过滤器 ... 9.0 双工模式配置和协商 ... 10.0 流量控制 ... 11.0 复位 ... 12.0 中断 ... 13.0 直接存储器访问控制器 ... 14.0 掉电 ... 15.0 内置自测试控制器 ... 16.0 电气特性 ... 17.0 封装信息 ... 索引 ... 客户支持 ... 系统信息和升级热线 ... 读者反馈表 ... 产品标识体系 ...
... 3 .. 5 .. 11 . 25 .. 31 . 33 . 39 .. 47 ... 53 ... 55 . 59 . 65 .. 75 . 77 . 79 ... 83 ... 89 .. 95 . 97 . 97 ... 98 .. 99
致客户
我们旨在提供᳔佳文档供客户正确使用 Microchip 产品。为此,我们将不断改进出版物的内容和质量,使之更好地满足您的要求。 出版 物的质量将随新文档及更新版本的推出而得到提升。 如果您对本出版物有任何问题和建议,请通过电子邮件联系我公司 TRC 经理,电子邮件地址为 CTRC@,或将本 数据手册 后附的 《读者反馈表》传真到 86-21-5407 5066。我们期待您的反馈。
基于窄带 OFDM 载波和微功率无线双模通信技术 低压电力用户集中抄表系统运行及维护手册说明书
低压电力用户集中抄表系统运行及维护手册基于窄带载波和微功率无线双模通信技术低压电力用户集中抄表系统运行及维护手册北京博维亚讯技术有限公司版本:1.02016年5月20日北京博维亚讯技术有限公司地址:北京市昌平区回龙观镇北京国际信息产业基地发展路1号集智达大厦3层邮编:102206电话:传真:第 2 页 共29 页目录1文档说明 (4)1.1文档范围 (4)1.2文档目的 (5)1.3参考文献 (5)1.4术语和定义 (5)1.5缩写词 (6)2关于博维亚讯 (7)3低压电力用户集中抄表系统简介 (7)4博维亚讯双模方案介绍 (9)4.1双模方案简介 (9)4.2博维亚讯双模模块技术特点 (10)4.2.1窄带OFDM载波技术特点 (10)4.2.2微功率无线技术特点 (11)5博维亚讯双模产品介绍 (11)6产品安装及注意事项 (13)6.1注意事项 (13)6.2集中器安装 (13)6.2.1安装位置要求 (13)6.2.2集中器设备安装 (14)6.2.3天线安装 (15)6.3采集器安装说明 (17)6.4双模智能电表模块安装 (22)7产品运行 (22)8产品维护 (23)8.1故障现象 (24)8.2故障原因 (25)第 3 页共29 页8.3排查方法 (26)8.4解决方案 (29)1文档说明1.1文档范围本文档适用于电力企业基于力合窄带OFDM载波和微功率无线双模通信技术低压电力用户集中抄表系统安装、运行和维护人员。
第 4 页共29 页1.2文档目的本文档目的为电力企业基于力合窄带OFDM载波和微功率无线通信技术低压电力用户集中抄表系统安装、运行和维护人员在日常工作过程中提供帮助和指导。
1.3参考文献介于本文档参考文件过多,在这里不详细列出,具体请按照下列描述内容查阅相关标准文献。
①电力行业标准 DL/T645-2007多功能电能表通信协议②Q/CSG 11109003-2013《中国南方电网有限责任公司低压电力用户集中抄表系统集中器技术规范》③Q/CSG 11109005-2013《中国南网电网有限责任公司低压电力用户集中抄表系统采集器技术规范》④北京博维亚讯技术有限公司2014年低压电力线窄带OFDM载波和微功率无线双模通信产品企业标准1.4术语和定义计量自动化主站:计量自动化主站是指具有选择终端并与终端进行信息交换功能的计算机设备,包括前置采集、数据维护存储、业务处理和综合应用四个部分,其中前置采集部分完成和终端进行通讯的功能。
KYN28开关柜资料
1.概述KYN28-12型户内交流金属铠装移开式开关设备(以下简称开关柜),适用于3.6~12kV 三相交流50Hz电力系统,用于接受和分配电能并对电路实行控制、保护及监测。
符合标准:GB 3906-91 《3~35kV交流金属封闭开关设备》GB 11022-89 《高压开关设备通用技术条件》IEC 298(1990)《额定电压1kV以上、50kV及以下交流金属封闭开关设备和控制设备》DL 404-91 《户内交流高压开关柜订货技术条件》2.型号及含义K Y N 28 - 12 / □1-□2□3□4□5产品名称K 金属封闭铠装开关设备结构特征Y 移开式(手车式)使用条件N 户内使用设计序号28额定电压12 kV额定电流□1 A额定短路开断电流□2kA一次方案号□3操动方式□4D-电磁式,T-弹簧式环境特征□5TH-湿热带,TA-干热带,G-高海拔断路器种类Z-真空,S(或不标)-少油,F-SF63.使用环境条件3.1环境温度:最高温度+40℃,最低温度-10℃。
3.2环境湿度:日平均相对湿度≤95%,月平均相对湿度≤90%。
3.3海拔高度:1000m以下。
3.4抗地震度:地震烈度不超过8度。
3.5周围空气应不受腐蚀性或可燃性气体、水蒸汽等明显污染。
3.6无经常性的剧烈振动场所。
3.7在超过GB 3096-91规定的正常的环境条件下使用式,由用户和制造厂协商。
4.技术参数4.1 开关设备技术参数见表1。
4.2 VD4、VS1真空断路器技术参数4.2.1 VD4、VS1真空断路器技术参数见表2。
4.2.2 VD4、VS1真空断路器机械特性见表3。
4.3 操动机构技术参数见表4。
表2 VD4、VS1真空断路器技术参数表3 VD4、VS1真空断路器机械特性要求由用户与制造厂联系协商;当断路器用于开断电容器组时,电容器组的额定电流不应大于断路器额定电流的80%。
5.结构特点开关设备按GB 3906-91中的金属铠装移开式开关设备而设计。
DS28EC20(MAXIM) 数据手册20KBIT TO92-3-qegoo
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
PIN CONFIGURATION
TYPICAL OPERATING CIRCUIT
VCC RPUP (300Ω to 2.2kΩ) PX.Y I/O DS28EC20
µC
GND
Commands, bytes, and modes are capitalized for clarity.
1-Wire is a registered trademark of Maxim Integrated Products, Inc.
5.0V SUPPLY ELECTRICAL CHARACTERISTICS
(VPUP = 5.0V ±5%, TA = -40°C to +85°C, unless otherwise noted.) (Note 1)
PARAMETER I/O PIN GENERAL DATA 1-Wire Pullup Resistance Input Capacitance Input Load Current High-to-Low Switching Threshold Input Low Voltage Low-to-High Switching Threshold Switching Hysteresis Output Low Voltage Recovery Time (Notes 2, 12) Rising-Edge Hold-off Time (Notes 5, 13) Timeslot Duration (Notes 2, 14) RPUP CIO IL VTL VIL VTH VHY VOL tREC tREH tSLOT (Notes 2, 3) (Notes 4, 5) I/O pin at VPUP (Notes 5, 6, 7) (Notes 2, 8) (Notes 5, 6, 9) (Notes 5, 6, 10) At 4mA (Note 11) Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed Standard speed Overdrive speed 2.5 0.30 5 5 0.5 Not applicable (0) 65 11 480 48 15 2 60 8 60 6 60 6 1 1 5 0.800 tRL + δ tRL + δ 640 80 60 6 240 24 75 10 120 15.5 15 2 15 - δ 2-δ 15 2.27 0.3 2000 0.05 1.6 3.5 VPUP 1.8 0.5 VPUP 1.1 1.30 0.20 2.2 kΩ pF µA V V V V V µs 5.0 µs µs SYMBOL CONDITIONS MIN TYP MAX UNITS
vestas电气参数
等级: I编号:944761zh.R92007-04-13电气参数V66-1.75 MWV80-2.0 MWV90-1.8/2.0 MW1.75/1.8/2.0 MW-690V-50Hz-VMP5000控制器维斯塔斯风力系统公司中文技术文件仅供参考,以英文版为准电气参数目录 ……………………………………………………………………………..…………..页码1. 1.75/1.8/2.0 MW风机 (1)2.VMP控制器 (1)3.高压联网 (2)4.高压开关柜 (2)5.高压开关柜接地 (2)6.变压器 (3)7.风机接地系统/防雷击保护 (3)8.发电机额定参数 (4)8.1V66-1.75MW无功功率的控制图 (5)8.2V80-2.0MW/V90-2.0MW无功功率的控制图 (6)8.3V90-1.8MW无功功率的控制图 (7)9.机舱控制器的短路保护 (8)10.电网监视 (9)11.选项 (9)12.电气保护 (9)13.图纸 (9)1. 1.75/1.8/2.0 MW风机VESTAS 1.75/1.8/2.0 MW是变桨距风机,因而运行和停机时,叶片总能保持最佳角度。
发电机是带绕组转子、滑环和VESTAS变频系统(VCS)的特殊异步电机,可使风机以不同的速度进行运转。
变速、变桨风机的优点包括以下几点:z在各种风况下优化出力z出力限定为1.75/1.8/2.0 MWz平稳且高质量的功率输出及低闪络率z无需电动机协助起动z无需使用机械刹车来停机z机械传动系统中,使载荷波动最小z可提供不同等级的噪声排放水平2.VMP控制器采用VMP(Vestas多处理器)控制器,风机运行自动化,其具有以下功能:z为限制起动电流,联网前使发电机转速与电网频率同步;z切入电流低于额定电流;z机舱可依据风向自动偏航z按照第10小节–电网监视,监视电网运行数据z监视运行z故障情况下停机VMP控制器包括一个机舱控制器、一个轮毂控制器和一个地面控制器。
211084149_含铀化合物中锂铯的等离子体质谱法测定
含铀化合物中锂铯的等离子体质谱法测定陈雪旭*林妍梅徐子安(中核建中核燃料元件有限公司四川宜宾644000)摘 要:本文介绍了一种对于含铀氧化物中锂铯杂质元素的等离子体质谱(ICP-MS)检测法,将试样用硝酸溶解后,用以CL-TBP萃淋树脂为固定相、硝酸溶液为流动相,使待测元素与铀分离后进行测定,配制一系列不同浓度锂铯的标准溶液,在ICP-MS优化条件下,锂的检出限能达到0.025ng/mL,铯的检出限能达到0.014ng/mL。
对方法进行加标回收实验,回收率在92%~111%,相对标准偏差优于5%。
关键词:铀化合物锂铯等离子体质谱法中图分类号:T L271.8文献标识码:A文章编号:1674-098X(2022)09(c)-0020-05 The Detection of Lithium and Cesium in Uranium CompoundBased on ICP-MSCHEN Xuexu* LIN Yanmei XU Zian( CNNC Jianzhong Nuclear Fuel Co., Ltd., YiBin, Sichuan Province, 644000 China ) Abstract: In this paper, a method to detect lithium and cesium in uranium compound based on ICP-MS is pro-posed. After the sample is dissolved in nitric acid, CL-TBP extraction resin is used as the stationary phase and nitric acid solution as the mobile phase to separate the element to be measured from uranium for determination. A series of standard solutions with different concentrations of lithium and cesium are prepared. Under the optimized condi-tions of ICP-MS, the detection limit of lithium can reach 0.025ng/mL and the detection limit of cesium can reach 0.014ng/mL. The recovery rate was 92%~111%, and the relative standard deviation was better than 5%.Key Words: Uranium compound; Lithium; Cesium; ICP-MS在核燃料元件生产过程中,对含铀产品中杂质元素的检测是一项非常重要的工作,杂质含量的种类和含量的多少会对后续反应堆的运行效率有害,所以,在生产中,对含铀产品中各杂质元素的含量都有限制要求。
[VIP专享]逆变器集装箱附件防尘网材料-G4聚酯合成纤维需求规格书
外购件技术要求逆变器集装箱附件防尘模块材料-G4聚酯合成纤维需求规格书主要起草人:野召忠审核人:张守宇会签人:周杰标准化审核人:周琴批准人:陈张锐2014-03-14发布2014-03-14实施华为技术有限公司发布HUAWEI TECHNOLOGIES CO., LTD.版本号更改说明主要起草人主要评审专家V1新归档野召忠张守宇、周杰1目的和适用范围1.1目的结构外购件技术要求是描述公司结构外购件的受控性文件,其作用为:●供应厂商进行产品设计、生产和检验的依据。
●品质部门验货、退货的依据。
●物料部门进行采购的依据。
●对供应厂商产品质量进行技术认证的依据。
●结构设计部门选用结构外购件的依据。
1.2适用范围本技术要求适用于21260326物料的选型、采购与检验。
2引用的相关标准下列文件中的条款通过本规范的引用而成为本规范的条款。
凡是注日期的引用文件,其随后所有的修改单(不包括勘误的内容)或修订版均不适用于本规范,然而,鼓励根据本规范达成协议的各方研究是否可使用这些文件的最新版本。
凡是不注日期的引用文件,其最新版本适用于本规范。
GB1804 未注公差的线性和角度尺寸的公差3项目编码3.1项目编码4功能描述空气过滤装置,用于过滤空气中杂质。
4.1一般要求4.1.1结构和外形尺寸防尘模块材料的结构如图1所示。
图1 防尘模块材料结构及外形尺寸因防尘模块材料较软,厚度可能有变化,但要求自然状态下18~25mm。
4.1.2环境要求防尘模块的工作温度范围-40℃~+70℃,能够在5%~~100%的相对湿度环境下可靠工作。
4.2物理化学性能4.2.1过滤介质聚酯合成纤维, 滤料应分布均匀。
4.2.2防水性能水浸干燥后不能变形,也不得影响防尘性能。
4.2.3过滤效率防尘等级要求达到G4(EN779),90%以上(含90%)的效率(ASHARE52.1-1992)。
4.2.4防霉性能防尘模块防霉性能应满足IEC 68-2-10试验28天后无长霉或腐蚀,产品功能无任何减弱。
电子控制系统手册 - ELC-PV28NNDR ELC-PV28NNDT说明书
ELC-PV28NNDR ELC-PV28NNDTELC that is micro, multi-functional, and with various instructionsInstruction SheetWARNINGx This instruc ion sheet only provides introductory information on electrical specification, functions, trouble-shoo ing and peripherals. For more information, please refer to “ELC System Manual ”.x This is an OPEN TYPE Controller. The ELC should be kept in an enclosure away from airborne dust, humidity, electric shock risk and vibration. Also, it is equipped with protective methods such as some special tools or keys to open the enclosure, so as to avoid the hazard to users and the damage to the ELC.x Never connect the AC main circuit power supply to any of the input/output terminals, as it will damage the ELC. Check all the wiring prior to power up. To avoid any electromagnetic noise, make sure the ELC is properly grounded. DO NOT touch terminals when power on.x Power, input and output (I/O) wiring must be in accordance wi h Class І, Division 2 wiring methods – Article 501-10(B)(1) of he National Electrical Code.x Suitable for use in Class І, Division 2, Groups A, B, C, D or non-hazardous loca ions only. x Explosion hazard - Substitution of components may impair suitability for Class І, Division 2.x Explosion hazard - DO NOT disconnect equipment unless power has been switched off or he area is known to be non hazardous. x Ambient temperature 55°C.xOperating Temperature Code T4A.1INTRODUCTION1.1 Model Name Explanation & PeripheralsThank you for choosing Eaton Logic Controller (ELC) series products. The ELC-PV series are 28-point (16 inputs + 12 outputs) controllers offering various instructions and 16K Steps program memory to connect with ELC series extension models which includes digital input/ output (max. 512 input/ output extension points), analog modules (A/D, D/A transforma ion and temperature units) and all kinds of new high-speed extension modules. Its 4-grouphigh-speed (200KHz) pulse outputs and the two new 2-axis interpola ion instructions satisfy all kinds of applications. ELC-PV is small in size and easy to install.1.2 Product Profile & Outline12345671410981312117039031718161560201921Unit: mm1 Status indicators of POWER, RUN, BAT LOW and ERROR2 COM1(RS-232) (Rx) indicator3 COM2(RS-485) (Tx) indicator 4/O point indicators 5 RUN/STOP switch6 VR0: Start-up by M1178/D1178 corresponding value7 VR1: Start-up by M1179/D1179 corresponding value 8/O terminal 9 COM1(RS-232) port10 D N rail clip11 Extension module positioning hole12 Extension port for wire to connect extension module/unit 13 D N rail track (35mm) 14 Extension unit clip15 RS-485 communication port (Master/Slave) 16 DC Power input17 3 pin removable terminal (standard component) 18 Power input cable (standard accessory)19 New high-speed extension module connection port 20 Nameplate21 Direct fastening hole2SPECIFICATIONStemSpecificationNoteOperation control method Stored program; cyclic scanning systemI/O control methodBatch processing and refresh /O status when ENDinstruction is executed With instruction that can immediately refresh I/O status Operation processing speed Basic instruction (min. 024 us) Application instruction Program language Instruction + ladder diagram + SFC With step instructionProgram capacity 15,872 STEPSSRAM + rechargeable battery + Flash Instruction type32 basic sequential instructions (including step ladder instructions)193 application instructionstemSpecificationNoteR e l a y (b i t )X External input relay X0 ~ X377, octal encoding; 256 points Total512 points Corresponds to external input pointsYExternal output relayY0 ~ Y377, octal encoding; 256 points Corresponds to external output pointsMAuxiliary relayGeneral purposeM0 ~ M499, 500 points (*2) Total4,096pointsThe contact can be On/Off in theprogram.Latched M500 ~ M999, 500 points (*3) M2000 ~ M4095, 2,096 points (*3) Special purposeM1000 ~ M1999, 1,000 points (part for latched)T Timer100 msT0 ~ T199, 200 points (*2) Total 256 points Timer indicated by TMR instruction. If timing reaches its target the T contact of the same No. will be On.T192 ~ T199 for subroutineT250 ~ T255, 6 accumulative points (*4) 10 ms T200 ~ T239, 40 points (*2)T240 ~ T245, 6 accumulative points (*4) 1 ms T246 ~ T249, 4 accumulative points (*4) C Counter16-bit counting up C0 ~ C99, 100 points (*2) Total253pointsCounter indicated by CNT (DCNT)instruction. If counting reaches itstarget, the C contact of the sameNo. will be On.C100 ~ C199, 100 points (*3) 32-bit counting up/downC200 ~ C219, 20 points (*2) C220 ~ C234, 15 points (*3)32-bit high-speedcounting up/downC235 ~ C244, 1 phase 1 input, 10 points (*3)C246 ~ C249, 1 phase 2 inputs, 4 points (*3)C251 ~ C254, 2 phase 2 inputs, 4 points (*3)S Step points InitialS0 ~ S9, 10 points (*2)Total 1,024 pointsUsed for SFCLatched area setup Start: D1214ΰK500α End: D1215ΰK899αFor zero returnS10 ~ S19, 10 points, used with IST instruction (*2)General purposeS20 ~ S499, 480 points (*2) Latched S500 ~ S899, 400 points (*3) For alarmS900 ~ S1023, 124 points (*3) R e g i s t e r (w o r d d a t a )T Present value in timer T0 ~ T255, 256 pointsWhen timing reaches the target, the contact continuity of timer appears. CPresent value in counterC0 ~ C199, 16-bit counter, 200 pointsWhen counting reaches the target, the contact continuity of counter appears.C200 ~ C254, 32-bit counter, 53 points DData registerGeneral purposeD0 ~ D199, 200 points (*2) Total 10,000 points Memory area for data storage can be used for special indirect indication.Latched D200 ~ D999, 800 points (*3) D2000 ~ D9999, 8,000 points (*3) Special purpose D1000 ~ D1999, 1,000 points For Indirect indicationE0 ~ E7, F0 ~ F7, 16 points (*1) N/A File register0 ~ 9,999 (10,000 points) (*4) Extension register for data storage I n d e xN For main control loop N0 ~ N7, 8 points Control point for main control loop PFor CJ, CALL instructions P0 ~ P255, 256 pointsPosition index of CJ and CALLII n t e r r u p t i o n s u b r o u t i n eExternal interruptionI0000/I0001(X0), I1000/I1001(X1), I2000/I2001(X2), I3000/I3001(X3), I4000/I4001(X4), I5000/I5001(X5),6 points (01: rising-edge trigger; 00: falling-edge trigger) Position index for interruption subroutineTime interruption I601~I699 (1ms), I701~I799 (1ms), I801~I899 (0.1ms) Interruption when high-speed counting reaches its target I010, I020, I030, I040, I050, 060, 6 points Interruption during pulse outputI110, I120, I130, I140, 4 points Interruption during communicationI150, I160, I170, 3 pointsC o n s t a n tK Decimal K-32,768 ~ K32,767 (16-bit operation)K-2,147,483,648 ~ K2,147,483,647ΰ32-bit operation αH HexH0000 ~ HFFFF (16-bit operation), H00000000 ~ HFFFFFFFF (32-bit operation) FFloating pointDisplaying floating points by the length of 32 bits with IEEE754 standard ±1.1755 × 10-38 ~ ±3.4028 × 10+38Serial communication ports (program write in/read out) COM1: RS-232; COM2: RS-485 (can be master or slave); COM1 and COM2 can be used at the same time Potentiometer / RTC Built-in 2 points VR / Built-in RTCSpecial extension moduleRight-side extension module and PB series share all modules (max. 8 modules extendable) Left-side can be connected with new high-speed extension modules (max. 8 module extendable)*1: Non-latched area cannot be modified.*2: The preset non-latched area can be modified into latched area by set ing up parameters. *3: The preset latched area can be modified into non-latched area by setting up parameters. *4: The fixed latched area cannot be modified.After the 24V DC power is switched off, the data in the latched area is stored in SRAM memory which is powered by he rechargeable battery. When the battery is damaged or cannot be changed, the data in the program and latched area will be lost. If the user needs to permanently save the data in he latched area in the program and device D, please refer to “Flash ROM permanently saved and recover mechanism ” as stated below. Permanently saved mechanism:The user can use ELCSoft (Options -> ELC<=>Flash) to indicate whether to permanently store the data in the latched area in the program (including password) and device D in Flash ROM memory (new indicated data will replace all data previously saved in the memory). Recover mechanism:If the rechargeable battery is in low voltage, resulting in the loss of data in the program, ELC will automatically restore he data in the latched area in the program and device D of Flash ROM into SRAM memory (M1176 = On) next time when 24V DC is re-powered. The ERROR LED flashing will remind the user that if the recorded program is able to resume its execution, the user only needs to shut down and re-power the ELC once to restart its operation (RUN).3ELECTRICAL SPECIFICATIONSInput pointTypeCurrent Motion levelResponding timeDC (Sink or Source)24VDC 5mAX0~X7,X12~X13,X16~X17Off On Ї165VDCX10~X11,X14~X15Off On Ї18.5VDCX0~X17 On Off І8VDCApprox. 10 ms (can be adjusted within the range of 10 ~ 60 ms by D1020 and D1021)Output pointType Current Voltage Max. loadingRespondingtimeMechani-cal life Electrical life relay-R1.5A/1 point (5A/COM)250VAC,Ї30VDC75VA (inductive) 90 W (resistive)Approx. 10 ms2×107times (without load)1.5×105times (5A 30VDC) 5×105 times (3A 120VAC)3×104 times (5A 250VAC)transistor-TGeneral: 0.3A/1 point @40ºCHigh-speed: І1kHz, 0.3A/1 point @ 40ºC; ≥ 1kHz,30mA/1point@40 ºC30VDCMax. 10kHz for Y5, Y7, Y10 ~ Y13Off On 20us On Off 30usMax. 200kHz for Y0, Y1, Y2, Y3, Y4, Y6Off On 0.2us On Off 0.2us4MODEL NAME & I/O CONFIGURATION5INSTALLATION & WIRING5.1 Mounting & WiringThe ELC can be secured to a cabinet by using the DIN rail of 35mm in height and 75mm in depth. When mounting ELC to DIN rail, be sure to use he end bracket to stop any side-to-side movement of ELC and reduce the chance of wires being loose. A small retaining clip is at the bottom of ELC. To secure ELC to DIN rail, place the clip onto he rail and gently push it up. To remove it, pull the retaining clip down and gently remove ELC from DIN rail, as shown in figure 1.Please use M4 screw (see figure 2) according to the dimension of the product. Please install ELC in an enclosurewith sufficient space around it to allow heat dissipation (see figure 3).9053.270101109.4D > 50 mmFigure 1Figure 2 (Unit: mm)Figure 35.2 Wiring1. Use 22-16AWG (1.5mm) single or multiple core wire on I/O wiring terminals. Thespecification of the terminal is shown in the figure on the left. The ELC terminalscrews shall be tightened to 1.95 kg-cm (1.7 in-lbs).2. DO NOT place the I/O signal wires and power supply wire in the same wiring duct.3. Use 60/75 ºC copper wires only.DO NOT install ELC in an environment with:1. Dust, smoke, metallic debris, corrosive or flammable gas2. High temperature, humidity3. Direct shock and vibration5.3 Power Input WiringThe power input of ELC-PV series is DC. When operating ELC-PV series, please make sure that:1. The power is connected to the two terminals, 24VDC and 0V, and the range of power is 20.4VDC ~28.8VDC. If the power voltage is less than 20.4VDC, ELC will stop running, all outputs will go “Off” andERROR indicator will flash continuously.2. A power shutdown of less than 10 ms will not affect the operation of ELC. However, power shutdown timethat is too long or a drop of power voltage will stop the operation of ELC and all outputs will go “Off”. When the power supplied again, ELC will automatically return to its operation. (Please be aware of the latched auxiliary relays and registers inside ELC when programming.)DC power input5.4 Input point wiringThere are two types of DC inputs, SINK and SOURCE.5.5 Output point wiring5.6 Relay (R) contact circuit wiring5.7 Transistor (T) contact circuit wiring6 TRIAL RUN■Preparation1. Prior to applying power, please verify that the power lines and the input/output wiring are correct. And beadvised not to supply 110V AC or 220V AC into he I/O terminals, or it might short-circuit the wiring and would cause direct damage to the ELC.2. After using the peripheral devices to write the program into he ELC and that the ERROR LED of the ELCis not on, it means that the program in use is legitimate, and it is now waiting for the user to give the RUN command.3. Use ELC-HHP to execute the forced On/Off test of the output contact.■Operation & test1. If the ERROR indicator does not flash, you can use the RUN/STOP switch or a peripheral device(ELC-HHP or ELCSoft) to give a RUN instruction. The RUN indicator should be continuously on at thistime. That the RUN indicator does not flash indicates ELC has no program in it.2. When ELC is in operation, use ELC-HHP or ELCSoft to monitor the set value or temporarily saved valuein timer (T), counter (C), and register (D) and force On/Off of output contacts. That the ERROR indicator is on (not flashes) indicates that part of the program exceeds the preset time-out. In this case, you have to set the RUN/STOP switch as STOP first, check special register D1008 and obtain the location in theprogram where time-out takes place. Please refer to he WDT instruction to solve this problem.■Operation of ELC basic sequential instruc ions & application instruc ions1. The basic sequential instructions and application instructions of ELC-PV series are compatible with allELC series ELCs. See Eaton “ELC System Manual” for relevant information.2. All ELC series ELCs are compatible with ELC-HHP handheld programming panel, ELCSoft ladderdiagram for program editing and exclusive transmission cables to connect with ELC-PV for programtransmission, ELC control, program monitoring and so on.7 TROUBLESHOOTINGBased on the indicators on the front panel, please check the following for errors:☼POWER indicatorWhen ELC is powered, the POWER LED indicator on the front panel will be on (in green). If this indicator is not on or the ERROR indicator keeps flashing when ELC is powered indicates that the power supply +24V are insufficient or DC power supply 24V is overloaded. In this case, change another 24V DC power supply. If the indicator is still off at this time, your ELC is malfunctioned. Send your ELC back to your distributor for repair.☼RUN indicatorCheck your ELC status. When ELC is running, this indicator will be on. You can use ELC-HHP, the ladder diagram editing program or the switch on the panel to RUN or STOP ELC.☼ERROR indicatorIf you enter illegal program into ELC or use instructions or devices that exceed their range, this indicator will flash (approx. every 1 second). When this happens, you have to obtain the error code from D1004 and save the address where the error occurs in register D1137 (if the error is a general circuit error, the address of D1137 will be invalid). Find out the cause of the error, amend the program and resend the program to ELC. If you cannot connect to ELC and this indicator keeps flashing quickly (approx. every 0.2 second), it means that the 24VDC power voltage is insufficient. Please check if the 24V DC is overloaded.If the ERROR indicator is on, you have to check the special relay M1008. If M1008 is on indicates that the execution time of program loop exceeds the preset time-out (in D1000). In this case, turn the RUN/STOP switch to STOP, check the special register D1008 and obtain the location in the program where the time-out takes place. Please refer to the WDT instruction to solve this problem. After amending the program, you only need to resend the program to stop the indicator from flashing. If the indicator still keeps flashing at this time, switch off he power and check if there is any interference existing or conductive matter inside ELC.For details of error codes (in D1004, hex coding), see “ELC System Ma nual: Programming”.☼BAT.LOW indicatorThe rechargeable lithium-ion battery in ELC-PV is mainly used on the latched procedure and data storage.The lithium-ion battery has been fully charged in the factory and is able to retain the latched procedure and data storage for 12 months. If ELC-PV has not been powered and used for more than 12 months, the battery will be out of power upon normal consumption and the procedure and data will be lost.The lithium-ion battery has longer life span than ordinary battery; therefore there is no need to change battery very frequently. You can charge the battery at any time without having to worry about a decrease in chargeability.You can also recharge the battery even when there is still power in the battery.Please be aware of the date of manufacturing; the charged battery can sustain for 12 months from this date. If you find that the BAT.LOW indicator stays on after ELC is powered, the battery voltage is low and the battery is being charged. ELC-PV has to remain on for more than 24 hours to fully charge the battery. If the indicator turns from on to “flash” (every 1 second), it indicates that the battery cannot be charged anymore. Please correctly process your data in time and send the ELC back to Eaton for changing a new battery.Precision of calendar timer:At 0̓C/32̓F, less than –117 seconds error per month.At 25̓C/77̓F, less than 52 seconds error per month.At 55̓C/131̓F, less than –132 seconds error per month.☼Input indicatorOn/Off of input point is indicated by input indicator or monitored by ELC-HHP. When the action condition of the input point is true, this indicator will be on. If abnormality is identified, check if the indicator and input circuit are normal. Use of electronic switch with too much electricity leakage often results in unexpected actions of the input point.☼Output indicatorOn/Off of output point is indicated by the output indicator. When the output indicator (On/Off) does notcorrespond to the action of its load, please be aware of the following:1. The output contact may be melted or blocked due to an over loaded or short-circuited load, which will resultin poor contact.2. If you are suspicious that he output point may execute an undesired action, check the output wiring circuitand whether the screw is properly tightened.。
DS28C40 评估系统Lite版通用描述说明书
Evaluates: DS28C40DS28C40 Evaluation System Lite VersionGeneral DescriptionThe DS28C40 evaluation system (EV system) provides the hardware and software necessary to exercise the features of the DS28C40. The EV system consists of five DS28C40 devices in a 10-pin TDFN package, a DS9121CQ+ evaluation TDFN socket board, and a DS9481P-300# USB-to-I 2C/1-Wire ® adapter. The evaluation software runs under Windows ® 10, Windows 8, and Windows 7 operating systems, both 64- and 32-bit versions. It pro-vides a handy user interface to exercise the features of the DS28C40.Features●Demonstrates the Features of the DS28C40DeepCover Secure Authenticator●Logs 1-Wire/I 2C Communication to Aid FirmwareDesigners Understanding of DS28C40●1-Wire/I 2C USB Adapter Creates a Virtual COM Porton Any PC●Fully Compliant with USB Specification v2.0●Software Runs on Windows 10, Windows 8, andWindows 7 for Both 64- and 32-Bit Versions ● 3.3V ±3% I 2C Operating Voltage●Convenient On-Board Test Points, TDFN Socket ●Evaluation Software Available by RequestDeepCover is a registered trademark of Maxim Integrated Products, Inc. Windows is registered trademarks of Microsoft Corp.Windows is a registered trademark and registered service mark of Microsoft Corporation.Ordering Information appears at end of data sheet.319-100391; Rev 0; 6/19QTY DESCRIPTION5DS28C40Q+ DeepCover secure authenticator with (10 TDFN)1DS9121CQ+ socket board (10 TDFN)1DS9481P-300# USB to 1W/I 2C Adapter 1USB Type-A to USB Mini Type-B cableEV Kit ContentsDS28C40 EV System with a USB CableClick here for production status of specific part numbers.Lite VersionQuick StartThis section is intended to give the DS28C40 evaluator a list of recommended equipment and instructions on how to set up the Windows-based computer for the evaluation software.Recommended Equipment●DS9481P-300# USB to 1W/I2C Adapter●DS9121CQ+ TDFN socket board●DS28C40Q+ (five devices included)●USB Type A-to-USB Micro-Type B cable (included)●Computer with a Windows 10, Windows 8, orWindows 7 operating system (64- or 32-bit) and a spare USB 2.0 or higher port●DS28C40 EV kit software. If needed go to theMaxim website and search for the DS28C40 EV kit.Click the Design Resources link. Then click theDS28C40EVKIT Software Lite link to download theDS28C40_Evaluation_Kit_Lite_Version_Setup_V1_2_0.zip file or newer version software.Note: In the following sections, EV kit software related items are identified in bold. Windows operating system related items are identified in bold and underline. Hardware Setup andDriver Installation Quick StartThe following steps were performed on a Windows 7 PCto setup the DS28C40 EV kit hardware/software:1) Obtain and unpack DS28C40_Evaluation_Kit_Lite_Version_Setup_V1_2_0.zip file or newer version.2) In a file viewer, double click on the DS28C40_Evaluation_Kit_Lite_Version_Setup_V1_2_0 to begin the installation.Figure 1. File ViewerLite Version3) The setup wizard opens. Click on Next (Figure 2):4) Click Next (Figure 3) to install to the default folder.Figure 2. DS28C40 Setup WizardFigure 3. Install Folder LocationLite Version5) Click Next to install shortcuts to the default folder (Figure 4).6) Unplug any Maxim adapter and click on Next (Figure 5) with the default settings checked. This action installs theDS9481P-300 driver that is needed to communicate through the USB by a virtual COM port.Figure 4. Program Shortcuts LocationFigure 5. Select to Install the DriverLite Version7) Next click on Install (Figure 6). A new window pops up to show progress of the installation.8) Click on Next (Figure 7) when the Device Driver Installation Wizard appears.Figure 6. Ready to InstallFigure 7. Device DriverLite Version9) Click on Finish (Figure 8) to close the final windowconfirming the driver was installed correctly.10) Now that the driver is installed, connect the hardwareby doing the following:a) Open the socket and insert a DS28C40 into oneof the cavities, as shown in Figure 9. Note: Theplus (+) on the package must be on aligned withthe top of the marker in the socket.b) Close the clamshell socket.c) Connect the DS9121CQ J2, 10-pin male plug,into the DS9481P-300#, 10-pin female socket (Figure 10).d) For the DS9121CQ+, insert jumper JB1 to useVCC (Figure 10).e) Plug-in the DS9481P-300# using USB Type-A toUSB Micro Type-B cable into the PC.Figure 8. Device Driver Installed FinishedFigure 9. Orientation of the DS28C40 in the Clamshell SocketLite Version11) Click on Finish (Figure 11) to close the final window confirming the software was installed correctly.Figure 10. DS9481QA-300 and DS9121CQFigure 11. Software Installation FinishedLite Version12) The DS28C40 EV kit program now opens and con-nects to the DS9481P-300 COM port. This can be verified in the lower right corner of the window as shown in Figure 12.Available OptionsThe DS28C40 EV Kit Lite Program is designed as a usage example to show step by step how to use the DS28C40 device. This version includes options to write, read, and run a compute authentication page using SHA2 or ECDSA. To access the full potential of the DS28C40, request the full version available under NDA request. The GUI displays all the I2C sequences for each step performed to assist the firmware engineer.Figure 12. DS28C40 EV Kit Program (Default View upon Opening)Lite VersionUsage Example—Feature Write Memory and Read Memory1) Select the General Commands tab (Figure 13).2) Select the Write Memory command from the combo box selection (Figure 13).Figure 13. Selecting CommandLite Version3) Write the desired data on the Page Data textbox (Figure 14).Figure 14. Write DataLite Version4) Select the page for writing (Figure 15).Figure 15. Select PageLite Version5) Click the Execute Command button (Figure 16). The I2C communication is displayed on the Log window and aids tounderstand how the command is executed.6) To perform a memory read, in the General Commands tab, select the command from the Select Command drop-down menu (Figure 13).7) From the Select Page drop-down menu, select the desired page to read (Figure 15).8) Click the Execute Command button (Figure 16).Figure 16. Execute CommandLite VersionUsage Example—SHA2 Compute and Read Page Authentication1) Under the General Commands tab, in the Select Command drop-down menu, select Write Memory (Figure 13).2) Select the Secret A or B from Select Page drop-down menu for writing (Figure 17).3) Write the desired secret on the Page Data text box and click Execute Command button (Figure 18).4) Select the SHA2 Commands tab.5) Select the Compute and Read Page Authentication command from the Select Command drop-down menuselection (Figure 19).Figure 17. Selecting SHA2 CommandLite Version Figure 19. Selecting SHA2 CommandFigure 18. Selecting SHA2 CommandLite Version6) From the Select Page drop-down menu, select a page to execute the command (Figure 20).Figure 20. Select PageLite Version7) In the AT: Authentication Type combo box, select a secret to compute the HMAC on selected page (Figure 21).Figure 21. Select SecretLite Version8) Click the Generate Challenge button to create a random challenge for command (Figure 22).Figure 22. Generate ChallengeLite Version9) Click the Execute Command button to run the sequence (Figure 23). The command result is displayed on the Logbox.Figure 23. Execute CommandLite VersionUsage Example—ECDSA Compute and Read Page Authentication1) Select the ECDSA Commands tab (Figure 24).2) From the Select Command drop-down menu, select the Generate ECC-256Key Pair and select the desired Public/Private Key from the Key Selection combo box (Figure 24).Figure 24. Generate ECC Key pairLite Version3) Click the Execute Command button (Figure 25).Figure 25. Execute Generate ECC KeyLite Version4) In the Select Command drop-down menu, select the Compute and Read Page Authentication command and thePublic/Private Key from the Key Selection combo box (Figure 26).Figure 26. Selecting CommandLite Version5) From the Select Page drop-down menu, select the desired page and public key (Figure 27).6) From the AT: Authentication Type combo box, select the private key (Figure 27).7) Click the Generate Challenge button and then click Execute Command button to perform the sequence (Figure 28).Results are displayed in the Log box.Figure 27. Selecting Page and KeyFigure 28. Execute CommandLite VersionNavigatingThe DS28C40 EV Kit Lite Program is divided in five sec-tions: the top menu bar, Setup panel, tab control, Log, and the status bar.●Menu Bar: Provides additional software features andinformation used to support the software operation.●Setup Panel: Information for hardware connectionand device status.●Command Panel: Main section for command execu-tion and command option selection.●Log: Software communication results for all com-mands and software transaction. Shows the I2C results and command’s inputs and results.●Status Bar: Displays the state of the software afterconnection the hardware necessary for operation Connecting and Detecting HardwareThe DS28C40 EV Kit Lite Program detects automati-cally the required hardware on initialization. To exercise a different DS28C40, open the DS9121CQ socket and replace the device (Figure 9). Then click the Search Device button to detect then new DS28C40.If, for any reason, the DS9481P-300 is not detected dur-ing the initial software load, click the Search Adapter button to detect and initialize the USB adapter.Lite Version#Denotes RoHS compliance.PART TYPE DS28C40EVKIT# EV SystemDESIGNATION QTY DESCRIPTIONPack-Out1I2C AUTHENTICATOR AUTO, EV KITDS28C40EVKIT#Pack-Out 5AUTOMOTIVE I2CAUTHENTICATOR, 6Kb DS28C40G/V+Pack-Out 1CABLE, USB A-TO-MICRO-B CABLE (1M)68784-0001Pack-Out 11W/I2C 4x3MM TDFN SOCKET BOARDDS9121CQ+Pack-Out 1BOX, BROWN, 9 3/16” X 7” X 1 1/4”Pack-Out 1FOAM, ANTI-STATIC PE 12X12X3.175MMPack-Out 2LABEL, SATIN 1-3/4” X 1-3/8”Pack-Out 12X3”, STATISHIELDING, ZIPTOP Pack-Out 1INSERT+, MAXIM WEB INSTRUCTIONPack-Out1DS9481P-300 EVAL KIT#DS9481P-300#Pack-Out 11W/I2C 4X3MM TDFN SOCKET BOARD DS9121CQ+DS9121CQ+PCB1PCB+, DS9121CQ+J41CONN HEADER VERT 10POS 2.54MM 22284103J20.1CONN+,HEADER,50PS, 100 SGL, R/A, AUTSW-150-08-G-S-RADESIGNATIONQTY DESCRIPTIONJ11CONN+, RCPT, 100” 6POS, R/A GOLDPPPC061LGBN-RCU11SOCKET+, IC, TDFN10, 4X3MM, CLAMSHELL10QH50A14030-DPACK-OUT 1LABEL BLANK THT-1-423 0.75 X 0.25PACK-OUT1BAG, STATIC SHIELDZIP4X6, W/ESD LOC11CAP+, 0.1µF, 10%, 10V, X7R, 0603C0603C104K8RACTU D11LED+,GREEN CLEAR, 3.2V,20MA,0603598-8081-107F JB10.1HEADER 36-40 PINS (CUT TO FIT)22-28-4363Populate toJB11SHUNT+, LP W/HANDLE 2 POS 30AU 881545-2Q11MOSFET, N-CH ENHANCEMENT BSS138LT1GR313.3KΩ 1% RESISTOR (0603 PB FREE)ERJ-3EKF3301V R1, R52RES,10KΩ 1% 0603ERJ-3EKF1002VOrdering InformationDS9121CQ EV Kit Bill of MaterialsLite VersionDS28C40 EV Kit SchematicDS28C40 EV Kit PCB Layout DiagramsDrill and Mechanical Layer (1 of 3)Lite VersionDS28C40 EV Kit PCB Layout Diagrams (continued)Drill and Mechanical Layer (2 of 3)Drill and Mechanical Layer (3 of 3)Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time.Lite VersionREVISION NUMBERREVISION DATE DESCRIPTIONPAGES CHANGED6/19Initial release—Revision HistoryFor pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https:///en/storefront/storefront.html.。
NT28L 有线定位器 2022 产品手册说明书
NT28L 有线定位器2022 产品手册Product user Manual产品特色产品功能特性认识产品技术参数介绍目录01020304声明:本手册可能包含技术上不准确的地方或印刷错误。
本手册的内容将做不定期的更新,恕不另行通知;更新的内容将会在本手册的新版本中加入。
本公司随时会改进或更新手册中描述的产品或程序。
若存在手册中对产品的描述与实物不符,一律以实物为准。
本公司拥有本手册的最终解释权。
产品特色第一章01●NT28E为特种定位产品;●可在有线和无线之间切换;●内置5200mAh聚合物锂电池,接线情况下使用实时定位;●支持卫星定位、AGPS定位、基站定位等;●通讯支持:LTE-FDD:B1/B3/B5/B8;LTE-TDD:B34/B38/B39/B40/B41;GSM:900/1800MHz●扩展接口,可接入胎压传感、温度传感器、载重传感、门磁、压力开关等,扩展支持蓝牙外设;●支持远程固件升级;●支持多协议,兼容多种标准平台;●IP68最高级防水;技术参数第二章02工作电压DC9V~36V,适用于12V/24V车辆工作电流平均电流<100mA@12V主电休眠电流<15mA@12V电池休眠电流<**********(长待机模式)内置电池聚合物锂电池,容量3.7V/5200mAH 充电内置电池支持快充通讯制式LTE-FDD:B1/B3/B5/B8;LTE-TDD:B34/B38/B39/B40/B41 GSM: 900/1800MHz定位模式支持北斗/GPS双模定位,AGPS辅助定位及LBS定位天线内置内置GSM天线和定位天线数据存储4MB FLASH(可选不同容量)I/O接口2路输入,1路输出AD接口2路ADC输入,输入电压0~5VUART接口两路RS232及一路RS485远程升级支持远程FOTA升级固件休眠唤醒定时唤醒、开盒报警唤醒开盒报警支持拆壳唤醒报警多链路支持多IP多链路同时连接外观尺寸118mm*106mm*36mm温度范围工作温度:-25℃~70℃;存储温度:-40℃~+85℃;防护等级IP68名称描述主机1台3P电源线1条说明书1本保修卡1本合格证1本可选配件门磁胎压温度传感器湿度传感器产品功能特性第三章033.1●定时监控包括定时回传、盲区补偿、速度里程统计、区域监控等功能,系统下发定位指令,终端回传包含经度、纬度、速度、方向、状态信息等数据。
GENSET基础知识.Jensonn..6.262
1.1、捷森发电机组主要产品及命名规则
• 1、捷森经营的发动机主要品牌有:
Cummins
Lister
Isuzu
Perkins lovol
Perkins
发动机
Shenzhen Jensonn Power System Co.,Limited
1.1、捷森发电机组主要产品及命名规则
• 2、捷森经营的发电机主要品牌有:
所以
永不放
弃
Shenzhen Jensonn Power System Co.,Limited
所以
Shenzhen Jensonn Power System Co.,Limited
目录
1、捷森产品概况。 2、柴油发动机基本知识。 3、同步交流发电机基本知识。 4、发电机组相关部分。 5、发动机机组装配注意事项 6、紧急情况处理
Shenzhen Jensonn Power System Co.,Limited
2.4、柴油发动机的基本构造
柴油发动机的基本构造
无论是单缸柴油机还是复杂的多缸柴油机,其基本结构都是一样的。主要 由下列两大机构和五大系统组成: ✓ 1.曲柄连杆机构(机体、曲轴连杆、传动机构、活塞缸套、缸盖等) ✓ 2.配气机构(凸轮轴、进排气门、挺柱、摇臂等部件) ✓ 3.供油系统(高压泵、喷油器、柴油虑、柴油管路等部件) ✓ 4.润滑系统(机油泵、机油池、机油管道、机油滤等部件) ✓ 5.冷却系统(水泵、风扇、散热器、冷却水管路等部件) ✓ 6.进排气系统(进排气管、空气滤、消声器、废气涡轮增压器(增压柴
Shenzhen Jensonn Power System Co.,Limited
2.3、柴油发动机的工作原理
2.3.2 、四冲程柴油机的工作原理 四冲程柴油机的一个工作循环是在曲轴旋转两圈内完成的。即实现进气、 压缩、膨胀和排气这四个步骤是在720° 曲轴转角范围内完成的。这种柴 油机的进气、压缩、膨胀和排气四个步骤各占有一个完整的活塞行程,也 即180° 曲轴转角,所以称为四冲程柴油机。相对二冲程柴油机而言,这 种柴油机的进气和排气比较充分,热负荷较低,工作更为可靠。
SDE-28D双频测深仪操作手册
南方测深仪产品系列之S D E-28D双频测深仪操作与应用手册(第一版)广州南方卫星导航仪器有限公司2010年9月精选模板目录第一章原理介绍和参数说明 (1)§1.1 测深仪简介 (1)§1.2测深仪的基本原理 (2)§1.2.1水底信号识别技术 (3)§1.2.2水底门跟踪技术(时间门跟踪技术) (3)§1.2.3发射脉宽选择 (3)§1.2.4信号门限 (3)§1.2.5自动增益控制(AGC) (4)§1.2.6时间增益控制(TVG) (4)§1.2.7包络信号识别技术 (4)§1.2.8 DSP数字处理技术 (5)§1.3 测深仪的相关名词 (5)§1.3.1 水深数据分类 (5)§1.3.2 水深数据格式 (6)§1.3.3 测量周期 (7)§1.3.4 吃水设置 (8)§1.3.5 声速设置 (9)第二章SDE-28D的硬件介绍 (11)§2.1 技术特点与性能指标 (11)§2.2 SDE-28D主机介绍 (13)§2.2.1 SDE-28D面板说明 (13)§2.2.2 SDE-28D接口说明 (14)§2.2.3 SDE-28D附件说明 (16)§2.3 SDE-28D测量系统安装要点 (17)第三章SDE-28D操作软件介绍 (19)§3.1 SDE-28D操作软件界面 (19)3.2水深图像窗口和波形窗口 (20)3.2.1水深图像窗口 (20)3.2.2量程标尺 (20)3.3控制软件的主菜单 (22)3.3.1文件栏: (22)3.3.2设置栏: (23)精选模板3.3.3视图栏: (24)3.3.4帮助栏: (25)3.3.5快捷工具栏功能与说明: (27)3.3.6水深数据回放: (28)3.3.7回放状态的控制键界面: (30)3.3.8视图设置: (30)3.3.9测量参数设置 (31)3.3.10测深仪参数设置: (32)3.3.11测深仪档位设置 (35)3.3.12系统设置: (36)第四章SDE-28D实地操作步骤 (39)4.1.测深仪的现场安装: (39)4.2.水深测量系统的连接: (39)4.2.1与GPS设备的连接安装 (39)4.2.2连接安装的注意事项 (40)4.3.软件的操作: (41)4.3.1测量导航软件的主要操作要点 (41)4.3.1.1自由行测量软件中的主要设置: (41)4.4、测深仪的设置与操作: (46)4.4.1测深仪控制程序操作: (47)4.4.2 测深仪的测量功能选项 (48)4.5水深测量过程中应注意的事项: (50)第五章SDE-28D测量实例说明 (51)5.1快捷参数调节方式: (51)5.2测深仪需要调整和设置的参数有: (53)5.3 SDE-28D双频测深仪在疏浚工地中的测量记录图 (53)第六章SDE-28D 外业测量快速配置指南 (58)精选模板第一章原理介绍和参数说明§1.1 测深仪简介首先,感谢您选择了南方SDE-28D型全数字化双频测深仪。
最新jstd020d(中英文对照版)资料
J-STD-020DMoisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices非密封固态表面贴装元件湿度/回流焊敏感度分级1 PURPOSE(目的)The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.本标准旨在识别非密封固态表面贴装元件的湿度敏感等级以便其能合适的封装,储存,作业以避免在回流和维修作业中被损伤. This standard may be used to determine what classification/preconditioning level should be used for SMD package qualification. Passing the criteria in this test method is not sufficient by itself to provide assurance of long-term reliability本标准用于判定合格的SMT封装应使用何种等级/预处理水平.依据本测试方法且通过对应判定标准的元件并不能保证其长期可靠性1.1 Scope(范围)This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices, and by board assembly operations to ensure that proper handling precautions are applied to moisture/reflow sensitive devices. If no major changes have been made to a previously qualified SMD package, this method may be used for reclassification according to 4.2.此分类程序适用于所有非密封固体表面贴装元件,此部分元件由于吸收湿气而在回流焊接中容易损伤. 本文件所提及的术语“SMD”指的是塑封或本体为吸湿材料的元件.分类的目的是为了让元件制造商能告知元件使用者(PCBA组装)其产品的湿敏等级,确保元件使用者能恰当作业,如果对之前认证过的SMD封装没有重大更改,依据4.2此方法亦可用于元件的再次分类.This standard cannot address all of the possible component, board assembly and product design combinations. However, the standard does provide a test method and criteria for commonly used technologies. Where uncommon or specialized components or technologies are necessary, the development should include customer/manufacturer involvement and the criteria should include an agreed definition of product acceptance.此标准不能涵盖所有与设计,组装相关联的元件.但是,此标准为通用技术提供了一个测试方法和标准. 如果使用特殊技术或特殊元件,则需客户以及相关的制造方定义一个双方同意的产品接受标准.SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version ofJ-STD-020, JESD22-A112 (rescinded), or IPC-SM-786 (rescinded) do not need to be revision unless a change in classification level or a higher peak classification temperature is desired. Annex B provides an overview of major changes from Revision C to Revision D of this document.在使用之前版本J-STD-020,JESD22-A112(已作废),IPC-SM-786(已作废)标准中已分级的湿敏元件除非敏感等级变更或耐温峰值提高,否则无须重新分级.附件B提供了版本C升级到版本D的主要变更.Note: If the procedures in this document are used on packaged devices that are not included in this specification’s scope, the fail ure criteria for such packages must be agreed upon by the device supplier and their end user备注:当封装元件未在本标准规格范围内,如需使用此文件中的流程判定,则不良标准需元件供应商和其客户同意.1.2 Background(背景)The vapor pressure of moisture inside a nonhermetic package increases greatly when the package is exposed to the high temperature of solder reflow. Under certain conditions, this pressure can cause internal delamination of the packaging materials from the die and/or leadframe/substrate, internal cracks that do not extend to the outside of the package, bond damage, wire necking, bond lifting, die lifting, thin film cracking, or cratering beneath the bonds. In the most severe case, the stress can result in external package cracks. This iscommonly referred to as the ‘‘popcorn’’ phenomenon because the internal stress causes the package to bulge and then crack wit h an audible ‘‘pop.’’ SMDs are more susceptible to this problem than through-hole parts because they are exposed to higher temperatures during reflow soldering. The reason for this is that the soldering operation must occur on the same side of the board as the SMD device. For wave-soldered through-hole devices, the soldering operation occurs under the board that shields the devices from the hot solder through-hole devices, the soldering operation occurs under the board that shields the devices from the hot solder Throughhole devices that are soldered using intrusive soldering or ‘‘pin in paste’’ processes may experience the same type of moisture-induced failures as SMT devices.非密封元件封装在回流高温条件下,其内部水蒸气压力猛增.在某一件下,压力将导致封装从内部分层或者内裂,邦定受损。
斯维尔暖通负荷用户使用手册
1
暖通负荷用户使用手册
BEC空调设计中,设计师大多采用单位面积负荷指标估算的方法进行负荷计算,由于计算方式偏 于保守,计算结果偏大。致使主机、系统选型偏大,相应的初投资、运行、维护成本增加,造成资源的浪 费。鉴于这种情况,在2004年 4月1日开始实施的《采暖通风与空气调节设计规范》(GB50019-2003)中明 确规定“…除方案设计或初步设计阶段可使用冷负荷指标进行必要的估算之外,应对空气调节区进行逐项 逐时的冷负荷计算...(6.2.1)”。同时,在《公共建筑节能设计标准》(GB50189-2005)中明确规定: “。。。施工图设计阶段,必须进行热负荷和逐项逐时的冷负荷计算”。 Bech正是为了满足这一需求而设计的,软件提供了逐项逐时冷负荷、采暖热负荷和空调热负荷的的计 算功能。作为补充,软件仍然提供了负荷估算功能。以满足不同设计深度的需求。 市面上也有许多同类软件,提供了类似的负荷计算功能。但这些软件在进行负荷计算前,往往需要输 入大量的基础数据,不能直接利用已有的建筑模型,使负荷计算效率低下,编辑、调整繁琐。 Bech掘弃了以往繁琐的计算过程,使暖通空调专业的负荷计算变得简单易行。软件可以自动提取模型 中的围护结构数据。构件也提供了丰富的属性已满足复合计算的需要。在负荷计算时,只需为构件对象设 定相应属性,便可完成负荷计算过程。
1.1 文档自述 .................................................................................................................................. 2 1.1.1 本书内容 ........................................................................................................................... 2 1.1.2 术语解释 ........................................................................................................................... 2 1.2 入门知识 .................................................................................................................................. 3 1.2.1 必备知识 ........................................................................................................................... 3 1.2.2 软硬件环境 ....................................................................................................................... 3 1.2.3 安装和启动 ....................................................................................................................... 3 1.3 用户界面 .................................................................................................................................. 4 1.3.1 屏幕菜单 ........................................................................................................................... 4 1.3.2 右键菜单 ........................................................................................................................... 4 1.3.3 工具条 ............................................................................................................................... 5 1.3.4 命令行按钮 ....................................................................................................................... 5 1.3.5 文档标签 ........................................................................................................................... 5 1.3.6 模型视口 ........................................................................................................................... 5 1.4 本章小结 .................................................................................................................................. 5