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卷烟和滤棒物理性能的测定 第3部分:圆周 非接触光学法-最新国标

卷烟和滤棒物理性能的测定  第3部分:圆周 非接触光学法-最新国标

卷烟和滤棒物理性能的测定第3部分:圆周非接触光学法1 范围本文件描述了一种非接触光学测量方法,用于测定杆状物横截面的圆周平均值、最大值、最小值以及椭圆度(或圆度),该杆状物具有由凸曲线构成的圆形或椭圆形横截面。

本文件适用于卷烟、滤棒以及类似于卷烟的圆柱形烟草制品圆周的测定。

注1:非接触测量技术见附录D。

注2:接触式或气动式测量方法也可用于卷烟和滤棒公称直径的测定,但应作为备选方法(见附录E),不属于本文件的范围。

2 规范性引用文件下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。

其中,注日期的引用文件,仅该日期对应的版本适用于本文件;不注日期的引用文件,其最新版本(包括所有的修改单)适用于本文件。

GB/T 8170 数值修约规则与极限数值的表示和判定GB/T 16447 烟草及烟草制品调节和测试的大气环境(ISO 3402:1999, IDT)ISO 5725-2:1994 测量方法与结果的准确度(正确度与精密度)第2部分确定标准测量方法重复性与再现性的基本方法3 术语和定义下列术语和定义适用于本文件。

3.1直径diameter按照本文件规定的方法测得某试样n个读数的算术平均值。

当横截面为凸面时,该值表示圆周与被测试样周长相同的圆的直径。

注:测量结果受n(采用的读数个数)的影响。

3.2凸横截面 convex cross section一种横截面,该截面上任意两点之间的直线也在该截面内。

3.3周长 perimeter横截面边界线的长度。

注:如果试样不是圆形的,周长估计值将存在误差,该误差随着椭圆度的增加而增大。

3.4圆周 circumference圆形横截面的周长。

3.5最小直径 minimum diameter某试样n个读数中的最小值。

3.6最大直径 maximum diameter某试样n个读数中的最大值。

3.7绝对椭圆度 absolute ovality杆状试样椭圆度的一种表示方法,由n个读数中最大直径和最小直径之间的算术差得到。

福特(Ford)探险(Explorer)车载拖车包(Tow Package)说明书

福特(Ford)探险(Explorer)车载拖车包(Tow Package)说明书

Explorer: I ncluded with Class II Trailer TowPackage – Option Code 52R Included with Class III Trailer Tow Package – Option Code 52TNote: S ee chart at right for the weight-carrying and weight-distributing capacities of this hitch receiver. (This capacity also is shown on a label affixed to each receiver.)Factory-Installed Trailer Hitch Receiver OptionsFrontal Area is the total area in square feet that a moving vehicle and trailer exposes to air resistance. The chart above shows the maximum trailer frontal area that must be considered for a vehicle/trailer combination. Exceeding these limitations may significantly reduce the performance of your towing vehicle.Frontal Area Limitations/Vehicle LineConsiderationsWithExplorer Base Vehicle Frontal Area (20 sq. ft.)Without Class II or Class III Trailer Tow Package 30 sq. ft.With Class II Trailer Tow Package40 sq. ft.With Class III Trailer Tow PackageFrontal Area ConsiderationsExplorer Explorer Model (Option Code)(52R)(1)(52T)(2)7-Wire Harness & 4-/7-Pin Connector – XTrailer Wiring Harness (4-Pin)X –Hitch Receiver X X Engine Oil Cooler – X (1) Requires 2.3L EcoBoost ® I4 engine. (2) Requires 3.5L/3.5L EcoBoost ® V6 engines.Trailer Towing PackageNotes: • C ontent may vary depending on model, trim and/or powertrain. See yourdealer for specific content information.• T railer Towing Package recommended for all light trucks that will beused for towing to help ensure easy, proper connection of trailer lights.Weight-Carrying Max. Tongue Weight-Distributing Max. TongueMax. Trailer Load Max. Trailer LoadVehicle Capacity (lbs.)(1) (lbs.) Capacity (lbs.)(1)(lbs.)Explorer2,000 200 5,000 500(1) Hitch receivers do not include a hitch ball or ball mounting. You are responsible for obtaining the proper hitch ball, ballmounting, weight-distributing equipment (i.e., equalizing arms and snap-up brackets, sway control system) and other appropriate equipment to tow both the trailer and its cargo load.Refer to the Trailer Towing Selector chart for Maximum Loaded Trailer Weights for this vehicle.Hitch Receiver Weight CapacityTRAILER TOWING SELECTORBrakesMany states require a separate braking system on trailers with a loaded weight of more than 1,500 pounds. For your safety, Ford Motor Company recommends that a separate functional brake system be used on any towed vehicle, including those dolly-towed or towbar-towed. There are several basic types of brake systems designed to activate trailer brakes:1. E lectronically Controlled Brakes usually provide automatic and manual control of trailer brakes. They require that the tow vehicle be equipped with a controlling device and additional wiring for electrical power. These brakes typically have a control box installed within reach of the driver and can be applied manually or automatically.2. E lectric-Over-Hydraulic (EOH) Trailer Brakes are operated by an electrically powered pump that pressurizes a hydraulic fluid reservoir built into the trailer’s brake system. Many of the available EOH trailer brake models are compatible with the Ford factory installed, dash-integrated Trailer Brake Controller (TBC).3. S urge Brakes are independent hydraulic brakes activated by a master cylinder at the junction of the hitch and trailer tongue. They are not controlled by the hydraulic fluid in the tow vehicle’s brake system, and the tow vehicle’s hydraulic system should never be connected directly to the trailer’s hydraulic system.Be sure your trailer brakes conform to all applicable stateregulations. See Towing Safely for All Vehicles on the next page for additional braking information.Trailer LampsMake sure the trailer is equipped with lights that conform to all applicable government regulations. The trailer lighting system should not be connected directly to the lighting system of the vehicle. See a local recreational vehicle dealer or rental trailer agency for correct wiring and relays for the trailer and heavy-duty flashers.Safety Chains– A lways use safety chains when towing. Safety chains are used to retain connection between the towing and towed vehicle in the event of separation of the trailer coupling or ball – C ross chains under the trailer tongue to prevent the tongue from contacting the ground if a separation occurs. Allow only enough slack to permit full turning – be sure they do not drag on the pavement – W hen using a frame-mounted trailer hitch, attach the safety chains to the frame-mounted hitch using the recommendations supplied by the hitch manufacturer – S ee your vehicle’s Owner’s Manual for safety chain attachment information – F or rental trailers, follow rental agency instructions for hookup of safety chainsTrailer Wiring Harness– S ome vehicles equipped with a factory-installed Trailer Tow Package include a trailer wiring harness and a wiring kit – T his kit includes one or more jumper harnesses (to connect to your trailer wiring connector) and installation instructionsAfter you buyBefore heading out on a trip, check your vehicle’s Owner’s Manual for break-in and severe-duty maintenance schedules (do not tow a trailer until your vehicle has been driven at least 1,000 miles). Be sure to have your fully-loaded vehicle (including passengers) and trailer weighed so as not to exceed critical weight limits. If any of these limits are exceeded, cargo should be removed from the vehicle and/or trailer until all weights are within the specified limits.Before you buyIf you are selecting a vehicle that will be used for towing, you should determine the approximate weight of the trailer you intend to tow, including the weight of any additional cargo and fluids that you will be carrying in the trailer. Also, be sure the vehicle has the proper optional equipment. Keep in mind that performance can be severely affected in hilly terrain when minimum acceptable powertrain combination is selected. Consider purchasing a vehicle with a more powerful engine.U TOW.TOWING SAFELY FOR ALL VEHICLES.Towing a trailer is demanding on your vehicle, your trailer and your personal driving skills. Follow some basic rules that will help you tow safely and have a lot more fun.Weight Distribution•F or optimum handling and braking, the load must be properly distributed•K eep center of gravity low for best handling•A pproximately 60% of the allowable cargo weight should be in the front half of the trailer and 40% in the rear (within limits of tongue load or king pin weight)•L oad should be balanced from side-to-side to optimize handling and tire wear•L oad must be firmly secured to prevent shifting during cornering or braking, which could result in a sudden loss of controlBefore Starting•B efore setting out on a trip, practice turning, stopping and backing up your trailer in an area away from heavy traffic•K now clearance required for trailer roof•C heck equipment (make a checklist) Backing Up•B ack up slowly, with someone spotting near the rear of the trailer to guide you•P lace one hand at bottom of steering wheel and move it in the direction you want the trailer to go •M ake small steering inputs – slight movement of steering wheel results in much greater movement in rear of trailerTurningWhen turning, be sure to swing wide enough to allow trailer to avoid curbs and other obstructions. Braking•A llow considerably more distance for stopping with trailer attached•R emember, the braking system of the tow vehicle is rated for operation at the GVWR, not GCWR •I f your tow vehicle is a F-150, F-Series Super Duty®, Transit or Expedition and your trailer has electric brakes, the optional Integrated Trailer Brake Controller (TBC) assists in smooth and effective trailer braking by powering the trailer’s electric or electric-over-hydraulic brakes with proportional output based on the towing vehicle’s brake pressure•I f your trailer starts to sway, apply brake pedal gradually. The sliding lever on the TBC shouldbe used only for manual activation of trailer brakes when adjusting the gain. Misuse, suchas application during trailer sway, could cause instability of trailer and/or tow vehicle Towing On Hills•D ownshift the transmission to assist braking on steep downgrades and to increase power (reduce lugging) when climbing hills•W ith TorqShift® transmission, select tow/haul mode to automatically eliminate unwanted gear search when going uphill and help control vehicle speed when going downhill Parking With A TrailerWhenever possible, vehicles with trailers should notbe parked on a grade. However, if it is necessary,place wheel chocks under the trailer’s wheels,following the instructions below.•A pply the foot service brakes and hold•H ave another person place the wheel chocksunder the trailer wheels on the downgrade side•O nce the chocks are in place, release brakepedal, making sure the chocks will hold thevehicle and trailer•A pply the parking brake•S hift automatic transmission into park, or manualtransmission into reverse•W ith 4-wheel drive, make sure the transfer case isnot in neutral (if applicable)Starting Out Parked On A Grade•A pply the foot service brake and hold•S tart the engine with transmission in park(automatic) or neutral (manual)•S hift the transmission into gear and release theparking brake•R elease the brake pedal and move the vehicleuphill to free the chocks•A pply the brake pedal while another personretrieves the chocksAcceleration And PassingThe added weight of the trailer can dramaticallydecrease the acceleration of the towing vehicle –exercise caution.•W hen passing a slower vehicle, be sure to allowextra distance. Remember, the added length ofthe trailer must clear the other vehicle before youcan pull back in•S ignal and make your pass on level terrain withplenty of clearance•I f necessary, downshift for improved accelerationDriving With An AutomaticOverdrive TransmissionWith certain automatic overdrive transmissions,towing – especially in hilly areas – may causeexcessive shifting between overdrive and the nextlower gear.•T o eliminate this condition and achieve steadierperformance, overdrive can be locked out (seevehicle Owner’s Manual)•I f excessive shifting does not occur, use overdriveto optimize fuel economy•O verdrive may also be locked out to obtain enginebraking on downgrades•W hen available, select tow/haul mode toautomatically eliminate unwanted gear searchand help control vehicle speed when goingdownhillDriving With Cruise ControlTurn off the cruise control with heavy loads orin hilly terrain. The cruise control may turn offautomatically when you are towing on long, steepgrades.Tire Pressure•U nderinflated tires get hot and may fail, leadingto possible loss of vehicle control•O verinflated tires may wear unevenly•T ires should be checked often for conformance torecommended cold inflation pressuresSpare Tire UseA conventional, identical full-size spare tire isrequired for trailer towing (mini, compact anddissimilar full-size spare tires should not be used;always replace the spare tire with the road tire assoon as possible).On The RoadAfter about 50 miles, stop in a protected locationand double-check:• Trailer hitch attachment• Lights and electrical connections• Trailer wheel lug nuts for tightness• Engine oil – check regularly throughout tripHigh Altitude OperationGasoline engines lose power by 3-4% per 1,000 ft.elevation. To maintain performance, reduce GVWsand GCWs by 2% per 1,000 ft. elevation starting atthe 1,000 ft. elevation point.Powertrain/Frontal AreaConsiderationsThe charts in this Guide show the minimum enginesize needed to move the GCW of tow vehicleand trailer.•U nder certain conditions, however, (e.g., whenthe trailer has a large frontal area that addssubstantial air drag or when trailering in hillyor mountainous terrain) it is wise to choose alarger engine•S electing a trailer with a low-drag, roundedfront design will help optimize performance andfuel economyNote: F or additional trailering information pertaining toyour vehicle, refer to the vehicle Owner’s Manual.For the latest RV/Towing information,check out /towing-guides or for Ford Dealers go to.Photography, illustrations and information presented herein were correct when approved for publishing. Ford Motor Company reserves the right to discontinue or change at any time the specifications or designs without incurring obligation. Some features shown or described are optional at extra cost. Some options are required in combination with other options. Consult your dealer for the latest, most complete information on models, features, prices and availability.Many of the recreational vehicles shown in this brochure are modified or manufactured by companies other than Ford Motor Company. Ford assumes no responsibility for such modifications or manufacturing.。

建筑专业英语试题及答案

建筑专业英语试题及答案

建筑专业英语试题及答案一、选择题(每题2分,共20分)1. What is the term for the main vertical structural element in a building?A. ColumnB. BeamC. SlabD. Foundation2. The process of applying plaster to walls is known as:A. TilingB. RenderingC. PlasteringD. Drywalling3. Which of the following is a type of roofing material?A. BrickB. ConcreteC. AsphaltD. Glass4. The term "architectural scale" refers to:A. A set of rules for building designB. A tool used for measuring distances on architectural drawingsC. A method of constructionD. A type of building material5. What is the function of a lintel in construction?A. To support a wallB. To support a door or window openingC. To provide insulationD. To prevent water infiltration6. The abbreviation "RC" in construction stands for:A. Reinforced CementB. Roof ConstructionC. Residential ConstructionD. Raw Concrete7. The term "load-bearing wall" is used to describe a wall that:A. Carries the weight of the roof and floorsB. Is used for decorationC. Is non-structuralD. Separates rooms8. What does "green building" refer to?A. A building covered in plantsB. A building made from recycled materialsC. A building designed to reduce environmental impactD. A building with a lot of windows for natural light9. The process of attaching a building to the ground is known as:A. AnchoringB. FoundationingC. GroundingD. Embedding10. What is the purpose of a "cantilever" in construction?A. To provide additional supportB. To allow a structure to extend beyond its supportC. To increase the height of a buildingD. To create a decorative effect二、填空题(每空1分,共10分)11. The structural system that uses a series of arches to distribute weight is known as a _______.12. The process of cutting and shaping stone is known as_______.13. A _______ is a type of joint that allows for some movement between connected parts.14. The term "facade" refers to the front of a building, which is often the _______ of the structure.15. The _______ is the part of a building that connects the roof to the walls.三、简答题(每题5分,共20分)16. Explain the difference between "load-bearing" and "non-load-bearing" walls.17. Describe the role of a "cantilever" in architectural design.18. What is the significance of "sustainability" in modern architecture?19. Discuss the importance of "thermal insulation" in building construction.四、翻译题(每题5分,共30分)20. Translate the following sentence into English:“悬挑结构能够创造出独特的建筑形态,但同时也需要精心的设计以确保结构的稳定性。

ae滤镜中英文对照文库

ae滤镜中英文对照文库

3D Channel (3D通道)3D Channel Extract-------------3D通道扩展Depth Matte--------------------深厚粗糙Depth of Field-----------------深层画面Fog 3D-------------------------3D 雾化ID Matte-----------------------ID 粗糙Adjust (调整)Brightness & Contrast----------亮度与对比度Channel Mixer------------------通道混合器Color Balance------------------色彩平衡Color Stabilizer---------------色彩稳压器Curves-------------------------曲线Hue/Saturation-----------------色饱和Levels-------------------------色阶Levels (Individual Controls)---色阶 (分色RGB的控制) posterize----------------------色调分离Threshold----------------------阈值Audio (音频)Backwards----------------------向后Bass & Treble------------------低音与高音Delay--------------------------延迟Flange & Chorus----------------边缘与合唱团 *High-Low Pass------------------高音/低音Modulator----------------------调幅器Parametric EQ------------------EQ参数Reverb-------------------------回音Stereo Mixer-------------------立体声混合器Tone---------------------------音调Blur & Sharpen (模糊与锐化)Clannel Blur-------------------通道模糊Compound Blur------------------复合的模糊Directional Blur---------------方向性的模糊Fast Blur----------------------快污模糊Gaussian Blur------------------高斯模糊Radial Blur--------------------径向模糊Sharpen------------------------锐化Unsharp Mask-------------------锐化掩膜 *Channel (通道)Alpha Levels-------------------ALPHA 层通道Arithmetic---------------------运算Bland--------------------------柔化Cineon Converter---------------间距转换器Compound Arithmetic------------复合运算Invert-------------------------反向Minimax------------------------像素化Remove Color Matting-----------去除粗颗粒颜色 *Set Channels-------------------调节通道Set Matte----------------------调节粗糙度Shift Channels-----------------转换通道Distort (变型)Bezier Warp--------------------Bezier 变型Bulge--------------------------鱼眼Displacement Map---------------画面偏移Mesh Warp----------------------网状变形Mirror-------------------------镜像Offset-------------------------偏移量Optics Compensation------------光学替换 (可制作球体滚动效果) Polar Coordinates--------------极坐标Reshape------------------------重塑Ripple-------------------------涟漪Smear--------------------------涂片Spherize-----------------------球型变形Transform----------------------变换Twirl--------------------------旋转变形Wave Warp----------------------波型变形Expression Controls (表达式控制)Angle Control------------------角度控制Checkbox Control---------------复选框控制Color Control------------------颜色控制Layer Control------------------图层控制Point Control------------------锐化控制Slider Control-----------------滑块控制Image Control (图像控制)Chaner Color-------------------改变颜色Color Balance (HLS)------------色彩平衡 (HLS)Colorama-----------------------着色剂Equalize-----------------------平衡Gamma/Pedestal/Gain------------GAMMA/电平/增益Median-------------------------中线PS Arbitrary MapPS-------------任意的映射Tint---------------------------去色Keying (键控制)Color Difference Key-----------差异的色键Color Key----------------------色键Color Range--------------------色键幅度Difference Matte---------------不同粗粗糙 (以粗颗粒渐变到下一张图) Extract------------------------扩展Inner Outer Key----------------内部、外部色键Linear Color Key---------------线性色键Luma Key-----------------------LUMA键Spill Suppressor---------------溢出抑制器Matte Tools (粗糙工具)Matte Cloker-------------------粗糙窒息物 *Simple Choker------------------简单的窒息物 *Paint (油漆)Vector Paint-------------------矢量油漆Perspective (透视)Basic 3D-----------------------基本的3DBevel Alpha--------------------倾斜 ALPHABevel Edges--------------------倾斜边Drop Shadow--------------------垂直阴影Render (渲染)4-Color Gradient---------------4色倾斜度Advanced Lightning-------------高级闪电Audio Spectrum-----------------音频光谱Audio Waveform-----------------音频波形Beam---------------------------射线Cell Pattern-------------------单元模式Ellipse------------------------椭圆Fill---------------------------填充Fractal------------------------分数维Fractal Noise------------------粗糙的分数维Grid---------------------------网格Lens Flare---------------------镜头光晕Lightning----------------------闪电Radio Waves--------------------音波Ramp---------------------------斜面Stroke-------------------------笔划 (与stylize-write on功能类似) Vegas--------------------------维加斯Simulation (模拟)Particle Playground------------粒子运动场Shatter------------------------粉碎Stylize (风格化)Brush Strokes------------------笔刷Color Emboss-------------------颜色浮雕Emboss-------------------------浮雕Find Edges---------------------查找边缘Glow---------------------------照亮边缘Leave Color--------------------离开颜色Mosaic-------------------------马赛克Motion Tile--------------------运动平铺Noise--------------------------噪音Roughen Edges------------------变粗糙边Scatter------------------------分散Strobe Light-------------------匣门光 *Texturize----------------------基底凸现Write-on-----------------------在.....上写 (与render-stroke功能类似)Text (文本)Basic Text---------------------基本的文本Numbers------------------------数字文本Path Text----------------------路径文本Time (时间)Echo---------------------------回响Posterize Time-----------------发布时间Time Difference----------------时间差别 *Time Displacement--------------时间偏移Transition (转场)Block Dissolve-----------------块溶解Gradient Wipe------------------斜角转场Iris Wipe----------------------爱丽斯转场 (三角形转场)Linear Wipe--------------------线性转场Radial Wipe--------------------半径转场Venetian Blinds----------------直贡呢的遮掩 (百叶窗式转场)Video (视频)Broadcast Colors---------------广播色Reduce Interlace Flicker-------降低频闪Timecode-----------------------时间码。

configuure参数

configuure参数

-- configuure参数iol_274x_ill_polygon= (Yes;No) -----------------是否检查/修正polygon他的意思是忽略检查多边形覆铜--选择no 如果多边形有错误,会被检查出来和修正注意:只有设定iol_enable_ill_polygon=Yes时才有作用----------------------------------------------------------------------------------------------------------------------------------------iol_274x_ko_polarity=(1;2) ------判断数据极性的时候用的,默认的即可输入Rs274x组合参数极性的方式1- 绝对, 依据写在KO参数的值来判断极性(忽略IP和LP) 2- 相对, 依据IP及LP后的值来判断极性. 注意:IP影象极性;LP层次极性----------------------------------------------------------------------------------------------------------------------------------------iol_274x_limit_dcode=(Yes;No)是否限制料号输入decode数的限制否:不做限制是:限制在10~999之间----------------------------------------------------------------------------------------------------------------------------------------iol_274x_set_octagon_rotation=(Yes;No)--设置8角形的pad的角度针对RS-274的输入数据定义RX-274的八角形有一些问题,因为没有明确定义0度八角形位置. 是:开始的角度是0度否:开始的角度是22.5度----------------------------------------------------------------------------------------------------------------------------------------iol_274X_set_polygon_rotation(Yes;No)RS-274X输入数据时polygon设定角度或是角落的问题是:开启设定开始角度0度否:开始角度为预设角度----------------------------------------------------------------------------------------------------------------------------------------iol_274x_sr_ij_scaled(Yes;No)RS-274x输出和输入I code 和J code是否带有排版涨缩指令否:排版IJ值没有带涨缩是:排版IJ值有带涨缩----------------------------------------------------------------------------------------------------------------------------------------ol_274X_sr_merge_pcb(Yes;No)--默认的是yes输入RS274X的数据是:输入时会试着配合PCB输入Rs274x , 强破打散排版. 否:输入274X毎一层会是不同的,允许排版数据input.----------------------------------------------------------------------------------------------------------------------------------------iol_accept_raw_data(Yes;No)---默认参数为no控制输入多边形自我相交点的问题否: 不用外框线取代SIP surface. 是: SIP < illegal surface> 部份用外框线来代替. 假如设成是会使iol_fix_ill_polygon或iol_274x_ill_polygon无效. 请用yes, no input 到不同层别, 同时显示两层比对.推断出正确的图形.----------------------------------------------------------------------------------------------------------------------------------------iol_clean_surface_min_brush(0-5)控制输入surface时是否减少不规则的边.假如在输入不规则形有许多边缘.可以由此参数来使边缘平滑. 范围:正的数值. 默认值为0.0不简化注意:值愈大会失真,只支持DPF输入----------------------------------------------------------------------------------------------------------------------------------------iol_compress_meas(Yes;No)在跑完CHECKLIST的结果,如果档案太大是否要压缩.----------------------------------------------------------------------------------------------------------------------------------------iol_diag_rect_line(1;2)输入矩形的线性如何处理 1.线就是线 2.线是不规则形(contour)----------------------------------------------------------------------------------------------------------------------------------------iol_dpf_output_cont_as_com(Yes;No)Define contours as complex in DPF output. 定义输出DPF的contour是否为复杂的对象----------------------------------------------------------------------------------------------------------------------------------------iol_dpf_output_zero_aper(Yes;No)是否允许输出DPF有尺寸是零.----------------------------------------------------------------------------------------------------------------------------------------iol_dpf_patt_borde(1;2;3)输出时使用者可以自定如何处理不规则形 1.线会有圆角,PAD接触边缘会被忽略 2.对象接触边缘会被削 3.外形会被加入边缘----------------------------------------------------------------------------------------------------------------------------------------iol_dpf_separate_letters(Yes;No)输入DPF时文字是否要分割否:文字为单一对象是:文字分割,每一文字为分割的对象----------------------------------------------------------------------------------------------------------------------------------------iol_dpf_text_width_factor(0.1-50)DFP输入文字时只有定义高度.以这一个为乘数计算宽度.dpf--他是ucam默认的一种光绘格式,和gerber类似的一种格式,ucam那个公司出品的光绘机和测试机,他们直接支持dpf格式----------------------------------------------------------------------------------------------------------------------------------------iol_drl_def_drill(0;1;2;3)当输入钻孔时如因数据不足.预设的格式. 0:Eexellon 1:Trudrill 2:Posalux 3:SM----------------------------------------------------------------------------------------------------------------------------------------iol_dxf_circle_to_pad(Yes;No)控制DXF输入的圆圏是:转为PAD 否:转为外框圆圏----------------------------------------------------------------------------------------------------------------------------------------iol_dxf_default_width(1-5)当输入DXF时有些对象的尺寸是零.这一个参数是在控制零尺寸的默认值.----------------------------------------------------------------------------------------------------------------------------------------iol_dxf_round_cap(Yes;No)DXF输入时的收边形是:边角为矩形否:边角为圆形----------------------------------------------------------------------------------------------------------------------------------------iol_dxf_round_line(0=No;1=Yes)是否方形的边为圆形0:预设为不转为圆形1:方形转为圆形----------------------------------------------------------------------------------------------------------------------------------------iol_dxf_separate_frozen_layers(Yes;No)输入DXF时被冻结的层次是否在Genesis分开层别. 否:不分开是:输入是分开当输入参数----------------------------------------------------------------------------------------------------------------------------------------iol_dxf_single_layer = "yes"时.假如被冻结的层次存在加入记录而且警告加入报告.----------------------------------------------------------------------------------------------------------------------------------------iol_dxf_single_layer(Yes;No)输入DXF时如何处理是:所有的层次合并为单一层别否:分开处理----------------------------------------------------------------------------------------------------------------------------------------iol_enable_ill_polygon(Yes;No) --选择yes输入IGI Par数据的相交不规则图形是:开启不规则图形违反规则的设定否:关闭不规则图形违反规则的设定,输入档案将停止注意:这一个程序的参数并没建议,除非有输入有先经过处理----------------------------------------------------------------------------------------------------------------------------------------iol_exc_g00_canc_comp(Yes;No)Excellon g00指令取消补偿是:G00为取消补偿否:G00仍保留补偿ol_exc_use_header(Yes;No)输入Excellon时是否使用表头否:输入识别时忽略表头是:识别时使用表头注意:很多的表头并不适当.Genesis输入时会自动确认.----------------------------------------------------------------------------------------------------------------------------------------iol_fill_abort_on_drop(Yes;No)填满不规则形时的处理方式是:填满时如有问题将中断否:填满时有问题继续.完成时警告加入记录文件.----------------------------------------------------------------------------------------------------------------------------------------iol_fill_use_break_arc_k(Yes;No)计算填满弧时所使用的值是:打散弧的线值为" out_break_arc_k" 否:打散弧的线值为内建的精确值----------------------------------------------------------------------------------------------------------------------------------------iol_fill_validation(Yes;No) Alerts the user that something went wrong during the fill process.输出时是否检查填满有问题的不规则形. 是:检查并有警告讯息否:不检查----------------------------------------------------------------------------------------------------------------------------------------iol_fix_ill_polygon(Yes;No)是否修正自我交错的不规则形否:不修正自我交错的不规则形是:修正自我交错的不规则形注意:这一个参数只有在" iol_enable_ill_polygon = Yes"时有用.----------------------------------------------------------------------------------------------------------------------------------------iol_gbr_arc_as_full_circle(Yes;No)输入G75指令时如有缺少角度时的处理方式是:零的角度转为完整的圆否:零的角度转为零长度的线----------------------------------------------------------------------------------------------------------------------------------------iol_gbr_brk_diag_sqrs(Yes;No)是否打散方形的线是:在输入Gerber,RS-274X和Autoplot格式时,打散方形线二个pad加一条线替代方形线. 否:不打散----------------------------------------------------------------------------------------------------------------------------------------iol_gbr_def_pentax(Yes;No) identify Gerber files as Pentax Gerber format by default预设的Gerber是否为Pentax格式----------------------------------------------------------------------------------------------------------------------------------------iol_gbr_diag_type(1;2)Gerber输入时方形线的处理方式1:线 2.外框形注意:这一个参数只有在"iol_gbr_brk_diag_sqrs = Yes"有做用.假如iol_gbr_brk_diag_sqrs = No时物件为线-----------------------------------------------------------------------------------------------------------1. get_confirm_undo=yes Demand user confirmation before undo operation.请求使用者在undo 操作前确认----------------------------------------------------------------------------------------------------------------------------------------2. get_def_units=inch Default units (Inch, MM) This parameter defines the default units for the Graphic Editor upon system startup. 这个参数定义关于Graphic Editor 系统启动时的预设单位。

vray_中英文对照

vray_中英文对照

Vray中英文对照Global Switches(全局光照开关设置)Materials(材质)Reflection/Refraction(反射/折射)Max Depth(最大深度)2 Max Transp.Level(最大透明级别)50Transp. Cutoff(透明终止值)0.001 Maps(帖图)Filter Maps(过滤贴图)Glossy Effects(光滑效果)Override materials(覆盖材质)Indirect Illumination(间接照明)Don't render final image(不渲染最终的图象)Raytracing(光线跟踪)Secondary ray bias(二级光线偏移)0Render(渲染)Batch render(批量渲染)Low thread priority(低线程优先权)Show progress window(显示步进窗口)Lighting(照明)Lights(灯光)Hidden Lights(隐蔽灯光)Default Lights(缺省灯光)Shadows(阴影)Show GI Only(只显示全局光照)Gamma Correction(伽玛值修正)Output(导出)2.2 Input(导入)2.2 LCorrect RGB(修正三原色)Correct LDR Textures(修正LDR材质)System(系统设置)Raycaster Params(光线追踪参数)Max Depth(最大深度)60 Min Leaf(最小树叶)0Face/Level(面/级)2 Mem Limit(限制)400Distributed Rendering(分布式渲染设置)Distributed Rendering(分布式渲染)Settings(设置)Region Division(区域分割)Width(宽)48 Height(高)48Means(方法):Region W/H(区域宽/高)▲Sequence(排序):Triangulation(三角剖分)▲Reverse Sequence(区域排序)Camera(照相机设置)Default Camera(缺省照相机)Type(类型):Standard(标准)▲Height(高度)400 Delta(深度)2Override FOV(视野)45 Auto Fit Curve(自动适合曲线)1Physical Camera(物理照相机)On(开)Type(类型):Still camera(静止照相机)▲Override Focal Length(焦距)40Shutter speed(快门速度)125 Film Width(宽)36 Distortion(矢真)0Shutter angle(快门角度)180 Zoom(焦距缩放)1 Lens shift(焦距移动)0Shutter offset(快门位移)0 F-number(焦距比数)11 White balance(白平衡)Latency(潜伏)0 Film speed (ISO)(感光度)125Exposure(曝光)Vignetting(渐晕)Depth of Field(景深)On(开)Aperture(光圈)0.1 Sides(段数)5 Rotation(旋转)0 Center Bias(中心偏移)0 Anisotropy(各向异性)0 Subdivs(细分)6 Override Focal Dist.(焦距)200Motion Blur(运动模糊)On(开)Duration(持续时间)1 Interval Center(间隔中心)0.5 Subdivs(细分)6Bias(偏移)0 Geometry samples(几何结构采样)2Output(导出设置)Output Size(导出大小)Override Viewport(替代视窗)Width(宽)320 640x480 / 1024x768 / 1600x1200Height(高)240 800x600 / 1280x960 / 2048x1536Image Aspect(图像比率)1.3333 L Pixel Aspect(像素)1 LRender Output(渲染导出)Save file(保存文件)V-Ray Raw Image File(VRay专用RAW格式图像文件)Render to VRImage(渲染到VRay图像)Animation(动画)On(开)Frame Rate(框架率)NTSC / PAL / Film(电影)/ Custom(自定义)FPS(帧)30Environment(环境设置)GI (Skylight)(全局光照(天空光))1 M Reflection(反射)1 mBackground(背景)1 M Refraction(折射)1 mImage Sampler(图像采样设置)Image Sampler(图像采样)Fixed Rate(固定细分)■Subdivs(细分)1Adaptive QMC(自适应准蒙特卡罗)■Min Subdivs(最小细分)1 Max Subdivs(最大细分)16Adaptive Subdivision(自适应细分)■Min Rate(最小比率)-1 Max Rate(最大比率)2 Threshold(极限值)0.1 Normaks (法线)0.1Antialiasing filter(边缘抗齿锯过滤)On(开)Area(面积):Size(大小)1.5▲QMC Sampler(准蒙特卡罗采样设置)QMC Sampler(准蒙特卡罗采样)Adaptive Amount(自适应数量)1 Min Samples(最小采样值)8Noise Threshold(噪波极限值)0.01 Subdiv Mult(细分倍增)1Path Sampler(路径采样器):Randomized Halton(使随机化)▲Color Mapping(颜色映射设置)Color Mapping(颜色映射)Type(类型):Reinhard()▲Multiplier(倍增)1 Burn Value(曝光值)0.8 Affect Background(影响背景)Clamp Output(加强输出)Sub-pixel(子像素贴图)VFB Channels(VFB通道设置)VFB Channels(VFB通道):Atmosphere(空气)▲Diffuse(漫反射)Shadow(阴影)Lighting(照明)GI(全局光照)Caustics(散焦)Raw GI(RAW全局光照)Raw Shadow(RAW阴影)Z-Depth(Z轴深度)Normals(法向)Background (背景)Displacement(置换设置)Displacement(置换)Edge Length(pix)(边界长度)4 Max Subdivs(最大细分)256 Amount(数量)1 Relative to bbox(相对边界盒)View-Dependent(依靠视图)Tight Bounds(紧密跳跃`)Indirect Illumination(间接照明设置)GI(全局光照)On(开)Reflect Caustics(反射)Refract Caustics(折射)Post-Processing(布置数据处理)Saturation(饱和度)1 Contrast Base(基本对比度)0.5Contrast(对比度)1 Save maps per frame(保存每帖贴图)Primary Engine(首次反弹)Multiplier(倍增)1 Quasi Monte-Carlo(准蒙特卡罗算法)■▲Secondary Engine(二次反弹)Multiplier(倍增)1 Light Cache(灯光缓冲)■▲Quasi-Monte Carlo GI(准蒙特卡罗全局光照设置)■QMC GI(准蒙特卡罗全局光照)Subdivs(细分)8 Secondary Bounces(二次反弹)3Light Cache(灯光缓冲设置)■Calculation Parameters(计算参数)Subdivs(细分)1000 Scale(比例):Screen(屏幕)▲Sample Size(采样大小)0.02 Num.Phases(进程数量)4Store Direct Light(存储直接灯光)Show Calc.Phase(显示计算相位)Adaptive(自适应)Reconstruction Parameters(重建参数)Pre-filter(预滤器)10 Use For Glossy Rays(使用灯光缓冲光滑光线)Filter(过滤):Nearest(接近)▲Interp.Samples(插补采样)5Mode(方式)Single Frame(单帧)Fly Through(通过)Path Tracing(路径跟踪)From File(来自文件)Current Map(当前贴图)Save(保存)Reset(清除)Post Render(渲染后)Don't Delete(不删除)Auto Save(自动保存)Irradiance Map(发光贴图)■Basic Parameters(基本参数)Min Rate(最小比率)-3 Max Rate(最大比率)0 Color Threshold(色彩极限值)0.3 HSph.Subdivs(半球细分)50 Samples(采样)20 Normal Threshold(法线极限值)0.1Distance Threshold(距离极限值)0.1Basic Options(基本选项)Show Calculation Phase(显示计算相位)Show Samples(显示采样点)Show Direct Light(存储直接灯光)Detail enhancement(细节增强)On(开)Scale(比例):Screen(屏幕)▲Radius(半径)60 Subdiv mult(细分倍增)0.3 Advanced Options(高级选项)Interpolation Type(插值类型):Least Squares Fit(最小平方适应)▲Sample Lookup Type(采样查找类型):Density Based(基于密度)▲Calc Samples(计算采样)15 Multipass(多重预计算)Randomize Samples(随机采样)Check Sample Visibility(检查样本可见性)Mode(方式)Single Frame(单帧)Incremental add to current map(添加方式增加到当前贴图)Bucket Mode(块模式)From File(来自文件)Current Map(当前贴图)Save(保存)Reset(清除)Post Render(渲染后)Don't Delete(不删除)Auto Save(自动保存)Photon Map(光子贴图)■Basic Parameters(基本参数)Bounces(反弹)10 Max Photons(最大光子)30Search Distance(搜寻距离)20 Multiplier(倍增)1Retrace Threshold(反射极限值)0 Max Density(最大密度)0Retrace Bounces(反射反弹数)10 Interp. Samples(插值采样)10Convex Hull Estimate(凸起表面区域评估)Store Direct Light(存储直接灯光)Mode(方式)New Map(新贴图)From File(来自文件)Current Map(当前贴图)Save(保存)Reset(清除)0 samples(采样)Post Render(渲染后)Don't Delete(不删除)Auto Save(自动保存)Caustics(散焦设置)Caustics(散焦)On(开)Max Photons(最大光子)50 Multiplier(倍增)1Max Density(最大密度)0 Search Distance(搜索距离)20Mode(方式)New Map(新贴图)From File(来自文件)Current Map(当前贴图)Save(保存)Reset(清除)0 samples(采样)Post Render(渲染后)Don't Delete(不删除)Auto Save(自动保存)Material Editor(材质编辑)Material Preview(材质预览)Update Preview(更新查阅)Material Workspace(材质预览)Scene Materials(场材质)Default_VRay_Material(默认材质)Add material(增加材质)*Add VrayMld(增加VRay专用材质)*Add VRay2SidedMld(增加VRat双面材质)[ Front(正面)Back(背面)Color(颜色)]*Add VRaySKp2SidedMld(增加VRaySKp双面材质)[ Front(正面)Back(背面)] Import new material(导入新材质)Purge unused materials(清除不用的材质)Rename(改名)Remove(移除)Duplicate(副本复制)Import(导入)Export(导出)Select objects by material(选择对象到材质)Apply material to object(s)(应用到物体)Apply material to layer(s)(应用到层)Add new layer(增加新的层)Emissive(发光)Color(颜色)Intensity(强度)1 Transparency(透明度)Reflection(反射)Reflection(反射)Filter(过滤)Highlight Glossiness(高光光泽)1 Reflection Glossiness(反射光泽)1Subdivs(细分)8 Anisotropy(各向异性)0Shader Type(阴影类型):Blinn(材质)▲Rotation(旋转)0Diffuse(漫反射)Color(颜色)Transparency(透明度)Refraction(折射)Refraction(折射)Transparency(透明度)Glossiness(光泽度)1 IOR(折射率)1.55 Subdivs(细分)8Translucency(透明)Translucent(半透明)Fog Color(雾色)Thickness(厚度)1000 Fog Multiplier(雾强度)1Scatter coeff(扩散系数)0 Affect Shadows(影响阴影)Fwd/bck coeff(前向/后向系数)1 Affect Alpha(影响通道)Options(选项)Trace Reflections(追踪反射)Double-Sided(双面)Trace Refractions(追踪折射)Reflect on Backside(内表面反射)Cutoff(终止)0.001 Disable V olume Fog(禁止体积雾)Maps(贴图)Bump(凹凸)Background(背景)Reflection(反射)Displacement(置换)GI(全局光照明)Refraction(折射)Keep continuity(保持连续性)Spotlight(聚光灯)Intensity(强度)On(开)Color(颜色)Multiplier(倍增)1Options(选项)Decay(衰退):Linear(线状的)▲Hardness(坚硬)0.5Sampling(采样)Photon Subdivs(光子细分)500 Caustic Subdivs(腐蚀细分)1000 Shadows(阴影)Enabled(开启)Bias(偏移)0 Radius(半径)0 Subdivs(细分)8Point light(点光源)Intensity(强度)On(开)Color(颜色)Multiplier(倍增)1Options(选项)Decay(衰退):Linear(线状的)▲Sampling(采样)Photon Subdivs(光子细分)500 Caustic Subdivs(腐蚀细分)1000 Shadows(阴影)Enabled(开启)Bias(偏移)0 Radius(半径)0 Subdivs(细分)8Directional light(平行光)Intensity(强度)On(开)Color(颜色)Multiplier(倍增)1Sampling(采样)Photon Subdivs(光子细分)500 Caustic Subdivs(腐蚀细分)1000 Shadows(阴影)Enabled(开启)Bias(偏移)0 Radius(半径)0 Subdivs(细分)8Rectangular light(区域光)Intensity(强度)On(开)Color(颜色)Multiplier(倍增)1Options(选项)Light Portal(光线入口)Invisible(不可见)Double Sided(双面)No Decay(不衰减)Store with Irradiance Map(存储发光贴图)Ignore Light Normals(忽略灯光法向)Sampling(采样)Subdivs(细分)8 Photon Subdivs(光子细分)500 Caustic Subdivs (腐蚀细分)1000Shadows(阴影)Enabled(开启)Bias(偏移)0Linear light(管状光)Color(颜色)On(开)Shadows intensity(阴影厚度)100 Spotlight hardness(聚光灯锐利度)100Displacement(置换)On(开)Advanced controls(高级控制器)Texture(材质)Mapping channel(映射通道)1Displacement(置换)Black point(黑点)0.00 White point(白点)1.00 Ignore creases (忽略皱痕)Subdivision(细分)Subdivide(细分)Contrast(对比度)20% Max steps(最大步幅)4。

3ds试题1

3ds试题1

3Ds Max 考证试题(官方题目截图)2010-04-01 17:45:30| 分类:其他| 标签:3d 3dmax 考证考证试题|字号大中小订阅3DMAX考试试题括号内为官方题库公布的答案第001题:(a)如图0401A_002所示,在场景中使用了一盏目标聚光灯进行照明,其在场景中照射区域为锥形,那么截面A与B之间显示的区域应该是目标聚光灯的第002题:(b)如图0202A_019所示,如果需要将左边的样条线图形,生成右边的三维实体模型,应该使用哪个修改器?第003题:(a)如图0702A_003所示,这两幅图中,要想使图A达到图B的效果,应该使用_效果。

第004题:(c)下图0304A_002应该使用的是_贴图。

第005题:(b)如下图0302A_001所示,对于标准材质而言,要做出图中类似甲壳虫表面的七彩反光效果,下列哪种方法最简单有效?第006题:(b)图0204A_013中在多边形子对象层级下已经选定了一些面,使用选择卷展栏下的收缩命令后,产生的选择结果是下列选项中的哪一个?第007题:(c)仔细观察下图09A_005,该粒子使用了——空间扭曲。

第008题:(c)下图0702A_008中左边的对象使用哪种效果可以达到图中右边对象的效果?第009题:(a)我们对右边的样条线应该使用了——修改器可以得到图0202A_001中的模型。

第010题:(a)如下图0803A_001所示,红色曲线说明下面的球体在哪个轴向上被赋予了动画运动?第011题:(a)如下图所示,添加哪种效果可以使左图0702A_006达到右图0702A_007的效果?第012题:(b)如图0203A_007所示,想要对粒子系统中的网格粒子实体化并且进行修改,可以使用下列选项中的哪个命令?第013题:(d)如果想使左图0204A_005达到右图0204A_006所示的效果,使用以下哪一个命令可以直接完成?第014题:(a)如下图0203A_002所示,将茶杯把和茶杯连接起来应该使用的是复合对象——命令。

VRay中英文对照

VRay中英文对照

VRay 材质VRay渲染器提供了一种特殊的材质-VrayMtl-VRay材质。

在场景中使用该材质能够获得更加准确的物理照明(光能分布),更快的渲染,发射和折射参数调节更方便.使用VrayMtl,你可以应用不同的纹理贴图,控制其反射和折射,增加凹凸贴图和置换贴图,强制直接全局照明计算,选择用于材质的BRDF。

该材质的参数都列入以下部分。

Basic parametersDiffuse –这是该材质的漫射颜色。

你可以在texture maps部分中的折射贴图栏中,使用一种贴图来覆盖它。

Reflect –漫反射颜色的倍增器。

你可以在texture maps部分中的反射贴图栏中,使用一种贴图来覆盖它。

Glossiness –该值表示该材质的光泽度。

当该值为0。

0时表示特别模糊的反射.当该值为1.0时将关闭材质的光泽(VRay将产生一种特别尖锐的反射)。

注意,提高光泽度将增加渲染时间。

Subdivs –控制发射的光线数量来估计光滑面的反射。

当该材质的Glossiness (光泽度)值为1.0时,本选项无效。

(VRay不会发出任何用于估计光滑度的光线)Fresnel reflection –当该选项选中时,光线的反射就象真实世界的玻璃反射一样.这意味着当光线和表面法线的夹角接近0o时,反射光线将减少至消失。

(当光线与表面几乎平行时,反射将是可见的,当光线垂直于表面时将几乎没有反射.)Max depth –贴图的最大光线发射深度。

大于该值时贴图将反射回黑色。

Refract –折射倍增器。

你可以在texture maps部分中的折射贴图栏中,使用一种贴图来覆盖它。

Glossiness —该值表示该材质的光泽度。

当该值为0.0时表示特别模糊的折射。

当该值为1.0时将关闭材质的光泽(VRay将产生一种特别尖锐的折射).注意,提高光泽度将增加渲染时间。

Subdivs -控制发射的光线数量来估计光滑面的折射。

当该材质的Glossiness (光泽度)值为1.0时,本选项无效。

SAP2000中文版中的英文翻译

SAP2000中文版中的英文翻译

SAP(Structural Analysis Program)2000 v14.1.0 集成化通用结构分析和设计软件中文版中的英文翻译目录(Ⅰ)SAP2000 V14.1.0中文版图形界面一、菜单(14个菜单项)二、单位制(Ⅱ)建模功能一、坐标系与轴网二、单元库三、材料与截面四、对象绘制与修改五、荷载工况和施加六、特殊功能指定七、视图功能八、快速建模及导入导出(Ⅲ)分析功能一、分析工况二、模态分析及反应谱分析三、线性动力分析四、结果与输出(Ⅳ)设计功能一、荷载组合二、混凝土框架结构设计及壳设计三、钢结构设计和优化过程(Ⅴ)高级分析功能一、屈曲分析二、Pushover(推倒) 分析及阶段施工分析三、非线性动力分析四、频域分析(Ⅵ)附件附A:英制单位与公制、国际制单位的换算表附B:主要常用量的公制单位与国际制单位换算表附C:钢结构材料规格附D:常用字母表附E:英语国际音标附F:右手准则附F:关于SAP2000中质量源的概念2010年5月SAP(Structural Analysis Program)2000 v14.1.0集成化通用结构分析和设计软件中文版中的英文翻译一般步骤:建立模型(创建或修改模型,定义结构的几何、材料、荷载和分析参数)→模型分析→查看分析结果→检查和优化结构设计。

×÷+-SAP2000 V14.1.0中文版图形界面第一部分SAP2000 V14.1.0中文版图形界面一、菜单(14个菜单项)⒈File[faɪl]文件New Model新模型Open打开Save保存Save As另存为Import导入SAP2000 MS Access Database .mdb File…SAP2000 MS Access数据库.mdb 文件SAP2000 MS Excel Spreadsheet.xls File…SAP2000 MS Excel电子表格.xls 文件SAP2000.s2k Text File…SAP2000.s2k文本文件SAP2000v6 or v7.s2k File…SAP2000v6或v7.s2k文件SAP90 Text File…SAP90文本文件CIS/2 STEP File…CIS/2 STEP文件Steel Detailing Neutral File…Steel Detailing Neutral文件Prosteel Exchangs Database File…Prosteel交换数据文件Frame Work Plul File…Frame Work Plul文件Auto CAD.dxf File…Auto CAD.dxf文件IFC.igs File…IFC.igs文件IGES.igs File…IGES.igs文件NASTRAN.dat File…NASTRAN.dat文件STAAD/GTSTRUDL.std/.gti File…STAAD/GTSTRUDL.std/.gti文件Stru CAD*3D File…Export导出SAP2000 MS Access Database .mdb File…SAP2000 MS Access数据库.mdb 文件SAP2000 MS Excel Spreadsheet.xls File…SAP2000 MS Excel电子表格.xls 文件SAP2000.s2k Text File…SAP2000.s2k文本文件SAFE.F2k Text File…SAFE.F2k文本文件Cis/2 STEP File …Cis/2 STEP文件Steel Detailing Neutral File …Steel Detailing Neutral文件Auto CAD.dxf File …Auto CAD.dxf文件Frame Work Plul File …Frame Work Plul文件IGES.igs File …IGES.igs文件SASSI House File …SASSI House文件Prosteel Exchangs Database File…Prosteel交换数据文件IFC.ifc File …IFC.ifc文件Perform3D Text File…Perform3D文本文件Batclc File Control…批处理文件控制Create Video…生成视图Create Multi-Step Animation Video…生成多步动画视频Create Cyclic Animation Video生成循环动画视频Print Setup forGraphics…图形打印设置Print Graphics…打印图形Print Tables…打印表格Report Setup报告设置Create Report创建报告Advanced Report Writer…高级报告书写器Capture Enhanced Metafile获取增强型图元文件Capture Picture获取图片Entire Screen全屏幕SAP2000 Main Window SAP2000主窗口Current Window W/ Titlebar当前窗口(带标题栏)Current Window W/o Titlebar当前窗口(不带标题栏)User Region in Current Window当前窗口用户区Modify/Show Priject Information…修正/显示项目信息Modify/Show Comments and Log…修正/显示注释和日志Show Input/Log Files…显示输入/日志文件Exit退出⒉Edit ['ɛdɪt]编辑⒊View[vju]视图⒋Define[dɪ'faɪn]定义⒌Bridge[brɪdʒ]桥梁Bridge Wizard…桥梁向导Layout Lines…轴线线型Deck Sections…主梁截面Bridge Diaphragms…桥梁横隔板Bestrainers…自由度约束Bearings…支座Foundation Springs…基础弹簧Abutments…桥台Bents…桥墩ParametricVariations…参数变化Bridge Objects…桥对象Update Linked Bridge Model…更新桥模型Auto Update Linked Bridge Objects…自动更新桥对象Lanes…车道Vehicles…车辆Vehicle Classes…车辆类别Load Definitions…荷载定义Temperature Gradient Definitions…温度梯温定义Moving Load Case Results Saved…移动荷载工况结果保存Construction Scheduler…施工过程定义⒍Draw[drɔ]绘图⒎Select[sə'lɛkt]选择⒏Assign[ə'saɪn]指定⒐Analyze['æn!,aɪz]分析⒑Display[dɪ'sple]显示⒒Design[dɪ'zaɪn]设计⒓Options[ˈɑpʃən]选项⒔Tools工具Add/Show Plug Ins…添加/显示插件⒕Help[hɛlp]帮助Contents and Index内容和索引Documentation文档CSI on the Web CSI网站SAP2000 Version14 News SAP2000版本14新闻About SAP2000关于SAP2000Change Lanuage to English(Chinese)二、单位制㈠力:Kg:kilogram['kɪlə,græm]公斤,仟克Lb:pound[paund]英磅1Ld=0.4536公斤Kip.千磅(等于455公斤)Psi:Pounds per square inch,磅/吋2,或Ld/in2。

Maya 菜单中英文对照+教学网址

Maya 菜单中英文对照+教学网址

Maya 菜单中英文对照Standard标准菜单File文件New Scene建立新场景Open Scene打开场景Save Scene存盘场景Save Scene As改名存盘Import导入Export All导出所有Export Selection导出选定物体Create Reference引入场景文件Reference Editor引入场景编辑器Project项目New建立新项目Edit Current编辑当前项目Set指定当前项目Exit退出Edit编辑Undo取消上一次*作Redo恢复上一次*作Repeat重复最后一次*作Keys关键帧Cut Keys裁剪关键帧Copy Keys拷贝关键帧Paste Keys粘贴关键帧Delete Keys删除关键帧Scale Keys缩放关键帧Bake Simulation模拟复制Delete删除Delete by Type根据类型删除History构造历史Channels通道Static Channels静帧通道Motion Paths运动路径Expressions表达式Constraints约束Rigid Bodies刚体Delete All by Type根据类型删除所有History构造历史Channels通道Static Channels静帧通道Motion Paths运动路径Expressions表达式Constraints约束Unused Transforms未用变形Joints连接IK Handles逆向运动控制柄Lattices车削Clusters族Sculpt Objects雕刻物体Wires网格Lights灯光Cameras照相机Image Planes图像板Shading Groups and Materials阴影组和材质Particles粒子Rigid Bodies刚体物体Rigid Constraints刚体约束Select All选择所有Select All by Type根据类型选择所有Joints连接IK Handles逆向运动控制柄Lattices车削Clusters族Sculpt Objects雕刻物体Wires网格Transforms变形Geometry几何体NURBS Geometry NURBS几何体Polygon Geometry多边形几何体Lights灯光Cameras照相机Image Planes图像板Particles粒子Rigid Bodies刚体物体Rigid Constraints刚体约束Quick Select Set快速选择集Layers层New Layers建立新层Rename Layer更改层名称Remove Current Layer移去当前层Layer Editor层编辑器Transfer to Layer转化为层Select All on Layer选择层上所有物体Hide Layer隐藏层Hide All Layers隐藏所有层Show Layer显示层Show All Layers显示所有层Template Layer临时层Untemplate Layer解除临时层Hide Inactive Layers隐藏非活动层Template Inactive Layers临时非活动层Duplicate复制Group成组Ungroup解成组Create Empty Group建立空成组Parent建立父物体Unparent解除父物体Modify修改Transformation Tools变形工具Move Tool移动工具Rotate Tool旋转工具Scale Tool缩放工具Show Manipulator Tool显示手动工具Default Object Manipulator默认调节器Proportional Modi Tool比例修改工具Move Limit Tool移动限制工具Rotate Limit Tool旋转限制工具Scale Limit Tool缩放限制工具Reset Transformations重新设置变形控制Freeze Transformations冻结变形控制Enable Nodes授权动画节点All所有IK solvers逆向运动连接器Constraints约束Expressions表达式Particles粒子Rigid Bodies刚体Snapshots快照Disable Node废弃动画节点Make Live激活构造物Center Pivot置中枢轴点Prefix Hierarchy Names定义前缀Add Attribute增加属性Measure测量Distance Tool距离工具Parameter Tool参数工具Arc Length Tool弧度工具Animated Snapshot动画快照Animated Sweep由动画曲线创建几何体曲面Display显示Geometry几何体Backfaces背面Lattice Points车削点Lattice Shape车削形Local Rotation Axes局部旋转轴Rotate Pivots旋转枢轴点Scale Pivots缩放枢轴点Selection Handles选定句柄NURBS Components NURBS元素CVs CV曲线Edit Points编辑点Hulls可控点Custom定制NURBS Smoothness NURBS曲面光滑处理Hull物体外壳Rough边框质量Medium中等质量Fine精细质量Custom定制Polygon Components多边形元素Custom Polygon Display定制多边形显示Fast Interaction快速交错显示Camera/Light Manipulator照相机/灯光*作器Sound声音Joint Size关节尺寸IK Handle Size IK把手尺寸Window窗口General Editors通用编辑器Set Editor系统设置编辑器Attribute Spread Sheet属性编辑器Tool Settings工具设置Filter Action Editor滤镜动作编辑器Channel Control通道控制信息Connection Editor连接编辑器Performance Settings性能设置Script Editor Script编辑器Command Shell命令窗口Plug-in Manager滤镜管理器Rendering Editors渲染编辑器Rendering Flags渲染标记Hardware Render Buffer硬件渲染缓冲区Render View渲染视图Shading Groups Editor阴影组编辑器Texture View质地视图Shading Group Attributes阴影组属性Animation Editors动画编辑器Graph Editor图形编辑器Dope SheetBlend Shape融合形Device Editor设备编辑器Dynamic Relationships动态关系Attribute Editor属性编辑器Outliner框架Hypergraph超图形Multilister多功能渲染控制Expression Editor表达式编辑器Recent Commands当前命令Playblast播放预览View Arangement视图安排Four四分3 Top Split上三分3 Left Split左三分3 Right Split右三分3 Bottom Split底部三分2 Stacked二叠分2 Side By Side二平分Single单图Previous Arrangement前次安排Next Arrangement下次安排Saved Layouts保存布局Single Perspective View单透视图Four View四分图Persp/Graph/Hyper透视/图形/超图形Persp/Multi/Render透视/多功能/渲染Persp/Multi/Outliner透视/多功能/轮廓Persp/Multi透视/多功能Persp/Outliner透视/轮廓Persp/Graph透视/图形Persp/Set Editor透视/组编辑器Edit Layouts编辑布局Frame Selected in All Views所有视图选定帧Frame All in All Views所有视图的所有帧Minimize Application最小化应用Raise Application Windows移动窗口向前Options可选项General Preferences一般设置UI Preferences用户界面设置Customize UI定制用户界面Hotkeys快捷键Colors颜色Marking Menus标记菜单Shelves书架Panels面板Save Preferences保存设置Status Line状态栏Shelf书架Feedback Line反馈栏Channel Box通道面板Time Slider时间滑动棒Range Slider范围滑动棒Command Line命令行Help Line帮助行Show Only Viewing Panes仅显示视图面板Show All Panes显示所有面板Modeling建模系统Primitives基本物体Create NURBS创建NURBS物体Sphere球体Cube立方体Cylinder圆柱体Cone圆台(锥)体Plane平面物体Circle圆Create Polygons创建多边形物体Sphere球体Cube立方体Cylinder圆柱体Cone圆台(锥)体Plane平面物体Torus面包圈Create Text创建文本Create Locator创建指示器Construction Plane构造平面Create Camera创建照相机Curves创建曲线CV Curve Tool CV曲线工具EP Curve Tool EP曲线工具Pencil Curve Tool笔曲线工具Add Points Tool加点工具Curve Editing Tool曲线编辑工具Offset Curve曲线移动Offset Curve On Surface曲线在表面移动Project Tangent曲线切线调整Fillet Curve带状曲线Rebuild Curve重建曲线Extend Curve扩展曲线Insert Knot插入节点Attach Curves连接曲线Detach Curves断开曲线Align Curves对齐曲线Open/Close Curves打开/关闭曲线Reserse Curves反转曲线Duplicate Curves复制曲线CV Hardness硬化曲线Fit B-spline适配贝塔曲线Surfaces曲面Bevel斜角Extrude凸出Loft放样Planar曲面Revolve旋转Boundary边界Birail 1 Tool二对一工具Birail 2 Tool二对二工具Birail 3+ Tool二对三工具Circular Fillet圆边斜角Freeform Fillet自由形斜角Fillet Blend Tool斜角融合工具Edit Surfaces编辑曲面Intersect Surfaces曲面交叉Project Curve投影曲线Trim Tool修整曲线工具Untrim Surfaces撤消修整Rebuild Surfaces重建曲面Prepare For Stitch准备缝合Stitch Surface Points点缝合曲面Stitch Tool缝合工具NURBS to Polygons NURBS转化为多边形Insert Isoparms添加元素Attach Surfaces曲面结合Detach Surfaces曲面分离Align Surfaces曲面对齐Open/Close Surfaces打开/关闭曲面Reverse Surfaces反转曲面Polygones多边形Create Polygon Tool创建多边形工具Append to Polygon Tool追加多边形Split Polygon Tool分离多边形工具Move Component移动元素Subdivide多边形细化Collapse面转点Edges边界Soften/Harden柔化/硬化Close Border关闭边界Merge Tool合并工具Bevel斜角Delete and Clean删除和清除Facets面Keep Facets Together保留边线Extrude凸出Extract破碎Duplicate复制Triangulate三角分裂Quadrangulate四边形合并Trim Facet Tool面修整工具Normals法向Reverse倒转法向Propagate传播法向Conform统一法向Texture质地Assign Shader to Each Projection指定投影Planar Mapping平面贴图Cylindrical Mapping圆柱体贴图Spherical Mapping球体贴图Delete Mapping删除贴图Cut Texture裁剪纹理Sew Texture斜拉纹理Unite联合Separate分离Smooth光滑Selection Constraints选定限定工具Smart Command Settings改变显示属性Convert Selection转化选定Uninstall Current Settins解除当前设定Animation动画模块Keys关键帧Settings设置关键帧Auto Key自动设置关键帧Spline样条曲线式Linear直线式Clamped夹具式Stepped台阶式Flat平坦式Other其他形式Set Driven Key设置驱动关键帧Set设置Go To Previous前移Go To Next后退Set Key设置帧Hold Current Keys保留当前帧Paths路径Set Path Key设置路径关键帧Attach to Path指定路径Flow Path Object物体跟随路径Skeletons骨骼Joint Tool关节工具IK Handle Tool反向动力学句柄工具IK Spline Handle Tool反向动力学样条曲线句柄工具Insert Joint Tool添加关节工具Reroot Skeleton重新设置根关节Remove Joint去除关节Disconnect Joint解除连接关节Connect Joint连接关节Mirror Joint镜向关节Set Preferred Angle设置参考角Assume Preferred AngleEnable IK Solvers反向动力学解算器有效EIk Handle Snap反向动力学句柄捕捉有效ESelected IK Handles反向动力学句柄有效DSelected IK Handles反向动力学句柄无效Deformations变形Edit Menbership Tool编辑成员工具Prune Membership变形成员Cluster簇变形Lattice旋转变形Sculpt造型变形Wire网格化变形Lattice旋转Sculpt造型Cluster簇Point On Curve线点造型Blend Shape混合变形Blend Shape Edit混合变形编辑Add增加Remove删除Swap交换Wire Tool网格化工具Wire Edit网格编辑Add增加Remove删除Add Holder增加定位曲线Reset重置Wire Dropoff Locator网线定位器Wrinkle Tool褶绉变形工具Edit Lattice编辑旋转Reset Lattice重置旋转Remove Lattice Tweeks恢复旋转Display I-mediate Objects显示中间物体Hide Intermediate Objects隐藏中间物体Skinning皮肤Bind Skin绑定蒙皮Detach Skin断开蒙皮Preserve Skin Groups保持皮肤组Detach Skeleton分离骨骼Detach Selected Joints分离选定关节Reattach Skeleton重新连接骨骼Reattach Selected Joints重新连接关节Create Flexor创建屈肌Reassign Bone Lattice Joint再指定骨头关节Go to Bind Pose恢复骨头绑定Point关节Aim目标Orient方向Scale缩放Geometry几何体Normal法向RenderingLighting灯光Create Ambient Light创建环境光Create Directional Light创建方向灯Create Point Light创建点光源Create Spot Light创建聚光灯Relationship Panel关系面板Light Linking Tool灯光链接工具Shading 阴影Shading Group Attributes阴影组属性Create Shading Group创建阴影组Lambert朗伯材质Phong Phong材质Blinn布林材质Other其他材质Assign Shading Group指定阴影组InitialParticleSE初始粒子系统InitialShadingGroup初始阴影组Shading Group Tool阴影组工具Texture Placement Tool纹理位移工具Render渲染Render into New Window渲染至新窗口Redo Previous Render重复上次渲染Test Resolution测试分辨率Camera Panel照相机面板Render Globals一般渲染Batch Render批渲染Cancel Batch Render取消批渲染Show Batch Render显示批渲染Dynamics动力学系统Settings设置Initial State初始状态Set For Current当前设置Set For All Dynamic设置总体动力学特性Rigid Body Solver刚体解算器Dynamics Controller动力学控制器Particle Collision Events粒子爆炸Particle Caching粒子缓冲Run-up and Cache执行缓冲Cache Current Frame缓冲当前帧Set Selected Particles设置选定粒子Dynamics On动力学开Dynamics Off动力学关Set All Particles设置所有粒子Particles All On When Run执行时粒子系统开Auto Create Rigid Body自动创建刚体Particles粒子Particle Tool粒子工具Create Emitter创建发射器Add Emitter增加发射器Add Collisions增加碰撞Add Goal增加目标Fields场Create Air创建空气动力场Create Drag创建拖动场Create Gravity创建动力场Create Newton创建牛顿场Create Radial创建辐射动力场Create Turbulence创建震荡场Create Uniform创建统一场Create Vortex创建涡流场Add Air增加空气动力场Add Newton增加牛顿场Add Radial增加辐射场Add Turbulence增加震荡场Add Uniform增加统一场Add Vortex增加涡流场Connect连接Connect to Field场连接Connect to Emitter发射器连接Connect to Collision碰撞连接Bodies柔体和刚体Create Active Rigid Body创建正刚体Create Passive Rigid Body创建负刚体Create Constraint创建约束物体Create Soft Body创建柔体Create Springs创建弹簧Set Active Key设置正向正Set Passive Key设置负向正脸部模型建造/animatemade/maya/maya3.htmMAYA3 nurbs做快打旋风的怪兽Blanka头型/3DBIBLE/maya/Blanka.htm人体建模和动画/3DBIBLE/maya/Character%20Animation1_1.htmMAYA的简易教学/3DBIBLE/maya/EARY.htm片头动画制作一例/3DBIBLE/maya/avi%20head1.htmMAYA之NURBS做太空船模型/~xmchang/3ds/maya/mayatut.htm利用贯穿动态拉出一造型物/animatemade/maya/maya10.htmMaya NURBS建模/xianfong/maya/nurbs1.htmNURBS人头建模教程/xianfong/maya/head1.htmMaya常用材质学习/maltm/maya/6/1.htm论Maya的2D纹理(一)/maltm/maya/5/1.htm论Maya粒子渲染形态/maltm/maya/4/1.htm2000 年千禧兽/3design/maya/teach/weird1.htm用MAYA做铠甲/3design/maya/teach/loricae.htm模拟百叶窗光影射入/3design/maya/teach/lightshot.htm 如何制作时下流行的辐射爆炸/3design/maya/teach/fs.htm如何制作旋转楼梯/3design/maya/teach/stair.htm多层材质应用—小巷外墙 (有所需模型、贴图文件下载)/3design/maya/teach/wall1.htm如何使用MEL Scripts英文教程/tutorials.htm毛毛的初级教程(很不错)/pcedu/sj/media/maya/10202/36928.html龙卷风制作/ab.htm使用粒子产生云/study/particle.htm建立手部的骨架/study/hend.htmDeepPaint3D 三维彩绘软件介绍/3design/maya/teach/teach2/deeppaint3d.htm NURBS倒角命令解析/3design/maya/teach/teach2/text.htmNURBS曲面填角命令解析/3design/maya/teach/teach2/nurbs%27Fillet.htm角色建模技术/3design/maya/teach/teach2/checrete.htm野生大象贴图训练/3design/maya/teach/teach2/elephant1.htmNURBS茶壶/3design/maya/teach/nurbsteapor.htm细分曲面制作吹风机/3design/maya/teach/teach2/maya%27sub.htmNURBS重建曲面命令解析/3design/maya/teach/teach2/nurbsreb 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NEC 移动投影仪产品介绍说明书

NEC 移动投影仪产品介绍说明书

From Digital Cinema to Mobile Convenience - NEC Projector is the Best SolutionPortable ProjectorVT700/VT695/VT595/VT590VT491/VT59/VT49•DVI input connector (DVI-I) and HDCP compatible (VT700 / VT695 and VT595 only)•Quick start & quick cool down•Auto Vertical Keystone Correction (VT700 / VT695 and VT595 only)•Wall Colour Correction •Very quiet operation•Built-in speaker (5W for VT700 / VT695 / VT595 and 1W for VT590 / VT491 / VT59 / VT49)•Security functionHigh-performance, cost-effective projector offers easy, multifunction operation perfect for business and education.*1 : LCD Panel technology consists of fine picture cells with more than 99.99% of the cells being active.*2 : Lamp life is defined as the average time span for the brightness of the lamp to be reduced by half, it dose not refer to the warranty period for the lamp.*3 : VT700 : 3.3/1.5A(100/240V AC), VT700G/VT700+ : 1.7A(200/240V AC)*4 : VT700 : 100-240V AC(50/60Hz), VT700G/VT700+ : 200-240V AC(50/60Hz)*5 : VT700/VT695/VT595/VT590/VT491/VT49 only.All specifications are subject to change without notice.WLPJ-0706-011RRRemote ControlAll other trademarks are the property of their respective owners.The images in this brochure are samples.This brochure uses recycled paper.Throwing Distance and Image SizeThe actual throwing distance may vary within plus or minus 5%. The indicated distance is a design value only.Wide-0.720.871.171.772.372.973.574.475.375.977.178.97Tele 0.730.871.051.412.132.853.574.295.376.457.178.6110.7756710141924293643485771Screen Size (inch)212530406080100120150180200240300Throwing distance(m)BottomHeight(cm)Wide-0.740.901.211.832.453.073.694.625.546.167.409.26Tele 0.750.901.091.462.202.943.694.435.546.667.408.8911.125679131822273340445366Screen Size (inch)212530406080100120150180200240300Throwing distance(m)BottomHeight(cm)-0.891.071.442.182.923.654.395.506.617.348.8211.03-679131822273340445366Screen Size (inch)212530406080100120150180200240300Throwing distance(m)BottomHeight(cm)DimensionsAlthough the appearance is slightly different, the VT700, VT695, VT595, VT590, VT491, VT59 and VT49 are the same in dimensions.120.8258.365.3308.771.3583Lens CentreLens CentreUnit: mmThrowing DistanceScreen Centre Lens CentreScreen BottomProjector BottomReplacement lampVT85LP (VT695/VT595/VT590/VT491)VT80LP (VT59/VT49)Soft Case (basic accessory)OptionsReplacement lamp NP05LP (VT700)SpecificationsVT700VT695VT595VT590VT491VT59VT49200W DC 2500 ANSI lumens (Approx.75% in Eco Mode)285W 35dB 0.7m to 10.7m 210W DC 172W 3000 ANSI lumens (Approx.80% in Eco Mode)500 : 1295W240W 8W3.3/1.5A(100/240V AC)*33.1kg 270W XGA (1024 x 768)–SVGA (800 x 600)XGA (1024 x 768)2Same with Computer 10.5Vrms/22k Ω or overVariable Output Level. Selected Computer & Video, S-Video with Audio Signal Output 1Same with Video–SVGA (800 x 600)(Range 1.8)(f=22.4mm)Digital (Ratio:1.2)25 to 300 inches 0.9m to 11.0m8.4° to 8.7°0.6inches p-Si TFT active-matrix with MLA0.63inches p-Si TFT active-matrix with MLA 190W DC 2000 ANSI lumens(Approx.80% in Eco Mode)34dB2000H 3000H 29dB150W DC 120W3000H 4000H1600 ANSI lumens (Approx.80% in Eco Mode)32dB 25dB 1–Same with Video–205W 170W 2.4/1.0A(100/240V AC)2.8kg LCD Panel *1Resolution Lens Lamp Lamp Life *2Light OutputContrast Ratio (White/Black)Fan NoiseImage SizeProjection Distance Projection Angle Colour Reproduction Maximum ResolutionKeystone Correction Vertical Scan RateInput Signal BandwidthInput TerminalsOutput Terminals Control Terminals Built-In Speaker Environment Power Consumption Input CurrentPower Requirement RegulationsNet WeightDimensions (WxHxD)Computer Input (VT700/VT695/VT595/VT491: 2 Inputs)Component Input (Sharing withComputer 1Input)Video Input S-Video Input Computer OutputAudio output PC ControlRGBH/V SyncComposite Sync Sync on G DVI digital DVI analog Stereo L/RYCb · Cr ( Pb · Pr)Compatible signals Composite VideoStereo L(MONO)/R Y CStereo L(MONO)/R Normal Mode Eco Mode Standby ModeNumberD-Sub Mini 15pin (Computer 1)DVI-I 29pin (Computer 2)D-Sub Mini 15pin (Computer 2)Audio Input (Sharing with Computer 1&2)Stereo Mini Jack D-Sub Mini 15pin(Sharing With Computer 1 Input)Audio Input (Sharing with Computer)RCA pin 2 RCA pin Mini DIN-4pinAudio Input (Sharing with Video)D-Sub Mini 15pin Stereo Mini Jack Mini DIN-8pinManual Focus ZoomNormal Mode Eco Mode Normal Mode Eco ModeNormal Mode Eco Mode Horizontal VerticalOperational Temperatures Storage TemperaturesFor United States *5For Canada *5For Australia/New Zealand *5For China *5For Europe Manual ±30degrees –1W Monaural (Range 1.5 to 1.8)(f=18.9mm to 22.7mm)Manual (Ratio:1.2)21 to 300 inches8.3° to 8.6° (Tele) , 9.9° to 10.3° (Wide)Manual/Automatic ±30degrees2T.M.D.S Specifications with H.D.C.PSame with Computer 10.5Vrms/22k Ω or overVariable Output Level. Selected Computer & Video, S-Video with AudioSignal Output5W Monaural150W 3.1/1.3A(100/240V AC)220W3.0kgFull Colour, 16.77Million Colours SimultaneouslyUXGA (1600 x 1200)15kHz to 100kHz (RGB : 24kHz or over)50Hz to 120HzRGB : 80MHz/Video : 6.5MHz0.7Vp-p/75Ω positive 4.0Vp-p/TTL Level polarity 4.0Vp-p/TTL Level polarity1.0Vp-p/75Ω(With Sync)Negative polarity1.0Vp-p/75Ω(With Sync)0.7Vp-p/75ΩDTV : 480i, 480p, 720p, 1080i (60Hz) / 576i, 576p, 1080i (50Hz)DVD : Progressive (50/60Hz)Same with ComputerNTSC/NTSC4.43/PAL/PAL-N/PAL-M/PAL-60/SECAM1.0Vp-p/75Ω(With Sync)0.5Vrms/22k Ω or over 1.0Vp-p/75Ω(With Sync)0.286Vp-p/75ΩSame with VideoOnly Computer1 can be outputRS-232C5°C to 40°C, 20% to 80% Humidity (Non-Condensing) Eco mode selected automatically at 35°C to 40°C-10°C to 50°C, 20% to 80% Humidity (Non-Condensing)255W 205W 100 - 240V AC (50/60Hz)*4UL Approved(UL 60950-1), Meets FCC Class B RequirementsUL Approved(CSA 60950-1), Meets DOC Canada Class B RequirementsMeets IEC60950-1, Meets AS/NZS CISPR.22 Class BGB4943, GB9254,GB17625.1Meets EMC Directive(EN55022, EN55024, EN61000-3-2, EN61000-3-3), Meets Low Voltage Directive (EN60950-1, TÜV GS Approved)2.9kg 309mm x 112mm x 258mm (Not Including Protrusions)600 : 10.7m to 11.1m 9WVT700/VT695/VT595/VT590VT491/VT59/VT49DVI input connector (DVI-I) and HDCP compatible (VT700 / VT695 and VT595 only)With the DVI-I input connector (DVI-I), the projector can display digital RGB images. By using the DVI-RGB adapter, analogue RGB signals can be connected from two computers. The DVI-I input connector supports HDCP .Quick start & quick cool downEight seconds after turning on the power, the projector is ready to display PC or video images. Powering down, the fans stop 30 seconds after turning off the power from the remote control or cabinet control panel. The projector can be stored immediately after powering down.The main power for the projector can be turned off by either pressing the main power switch or by unplugging the power cable, even during the cool down period after the projector is turned off.Auto Vertical Keystone Correction adjusts the trapezoidal distortion to correct the projected image (VT700 / VT695 and VT595 only)If the position of the screen is too high or low, the projector must be installed at an angle, resulting in trapezoidal distortion of the projected images. The acceleration sensor built into the main unit senses the inclination of the unit in the vertical direction and then corrects for any trapezoidal distortion in the projected image automatically to project square images (+/- 30 degrees from the projection angle). Projector setup is quick and easy as manual correction is not necessary. Manual vertical Keystone Correction is available on the VT590/VT491/VT59/VT49.Wall Colour Correction for vivid images even without a screenWithout a screen, projected images are affected because of the colour of the wall or blackboard you are projecting on to. The built-in colour correction for projecting images on a coloured wall or blackboard in this projector means that the colour tones of the projected image is approximate to those that are projected on to a white screen. The following eight colour options are available : blackboard, blackboard (grey), light yellow, light green, light blue, sky blue,light rose, and pink.Very quiet operation in Eco ModeEco Mode operation drops projector noise to 25 dB for very quiet operation (VT59/VT49) and extends the lamp replacement period up to a maximum of 4000 hours (VT59/VT49). In this mode, total cost of ownership can be effectively reduced. The projector can be put in to Eco Mode very easily with a button on the remote control.Easy to UseQuick StartDigital Zoom VT49Terminal PanelVT700/VT695/VT595 Terminal Panel VT590/VT59/VT49Terminal Panel VT491From Digital Cinema to Mobile Convenience - NEC Projector is the Best SolutionQuiet OperationManual ZoomVT700/695/595/590/491/59•Auto startTurns the projector on automatically when the power cable is inserted into an active power outlet. This eliminates the need to use the POWER button on the remote control or projector cabinet. *To use Auto Start, first set the main power switch to "On" before plugging in the power cable.•Built-in speaker for integrated audio solutionsThe built-in monaural speaker (5W for VT700/VT695/VT595 and 1W for VT590/VT491/VT59/VT49) on the main unit outputs audio from computer, video, and S-video inputs.•Security function prevents unauthorized use or theftPassword access prevents unauthorized use of the projector. Once the security function is activated, a message requesting the password is displayed when the power of the main unit is turned on. It is not possible to project an image unless the correct password is entered.•Carrying handle for easy transport The supplied carrying handle can be installed on the main unit for easy transportation. (VT700/VT695/VT595/VT590/VT491 only)•Remote Mouse OperationYou can use the supplied wireless remote control and the optional remote mouse receiver to control your PC from across the room. The optional remote mouse receiver (NP01MR) supports almost any PC with a USB connection.•High Altitude ModeThe high altitude mode, allows operation of the projector in low air pressure / high altitudes, eg. venues located over 1,600m above sea level.(VT700)•Supports component signals•Preset function for setting and storing your favorite colour settings •HDTV (1080i, 720p) and SDTV (576p, 480p) compatibility •Short focal length lensModel VT700VT695VT595VT590VT491VT59VT49Speaker5W 5W 5W 1W 1W 1W 1WResolutionXGA XGA XGA XGA SVGA XGA SVGAZoomManual Zoom Manual Zoom Manual Zoom Manual Zoom Manual Zoom Manual Zoom Digital ZoomComputer InputAnalog with DVI-I Analog with DVI-I Analog with DVI-IAnalog Analog Analog AnalogBrightness3000 ANSI lumens 2500 ANSI lumens 2000 ANSI lumens 2000 ANSI lumens 2000 ANSI lumens 1600 ANSI lumens 1600 ANSI lumens。

IPC-7351B & PCBL Land Pattern Naming Convention

IPC-7351B & PCBL Land Pattern Naming Convention

I P C-7351B N a m i n g C o n v e n t i o n f o r S t a n d a r d S M T L a n d P a t t e r n sSurface Mount Land PatternsComponent, Category Land Pattern Name Ball Grid Array’s...............................BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA w/Dual Pitch.BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA w/Staggered Pins..................BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA Note: The C or N = Collapsing or Non-collapsing BallsCapacitors, Chip, Array, Concave..........................................................CAPCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Capacitors, Chip, Array, Flat..................................................................CAPCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Capacitors, Chip, Non-polarized.................................................................................................CAPC + Body Length + Body Width X Height Capacitors, Chip, Polarized.....................................................................................................CAPCP + Body Length + Body Width X Height Capacitors, Chip, Wire Rectangle........................................................................................CAPCWR + Body Length + Body Width X Height Capacitors, Molded, Non-polarized...........................................................................................CAPM + Body Length + Body Width X Height Capacitors, Molded, Polarized.................................................................................................CAPMP + Body Length + Body Width X Height Capacitors, Aluminum Electrolytic ............................................................................................................CAPAE + Base Body Size X Height Ceramic Flat Packages.....................................................................................................CFP127P + Lead Span Nominal X Height - Pin Qty Column Grid Array’s.....................................................CGA + Pitch P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty Crystals (2 leads)........................................................................................................................XTAL + Body Length X Body Width X Height Dual Flat No-lead..........................................................................................................DFN + Body Length X Body Width X Height – Pin Qty Diodes, Chip................................................................................................................................DIOC + Body Length + Body Width X Height Diodes, Molded...........................................................................................................................DIOM + Body Length + Body Width X Height Diodes, MELF................................................................................................................................DIOMELF + Body Length + Body Diameter Fuses, Molded............................................................................................................................FUSM + Body Length + Body Width X Height Inductors, Chip.............................................................................................................................INDC + Body Length + Body Width X Height Inductors, Molded........................................................................................................................INDM + Body Length + Body Width X Height Inductors, Precision Wire Wound................................................................................................INDP + Body Length + Body Width X Height Inductors, Chip, Array, Concave..............................................................INDCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Inductors, Chip, Array, Flat......................................................................INDCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Land Grid Array, Round Lead............................LGA + Pin Qty - Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height Land Grid Array, Square Lead........................LGAS + Pin Qty - Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height LED’s, Molded............................................................................................................................LEDM + Body Length + Body Width X Height Oscillators, Side Concave........................................................................OSCSC + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, J-Lead.......................................................................................OSCJ + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, L-Bend Lead.............................................................................OSCL + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, Corner Concave....................................................................................................OSCCC + Body Length X Body Width X Height Plastic Leaded Chip Carriers..................................................PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Plastic Leaded Chip Carrier Sockets Square.......................PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat Packages..................................................................QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Ceramic Quad Flat Packages.................................................CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat No-lead................................................................QFN + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Pull-back Quad Flat No-lead..............................................PQFN + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Quad Leadless Ceramic Chip Carriers..........................................................LCC + Pitch P + Body Width X Body Length X Height - Pin Qty Quad Leadless Ceramic Chip Carriers (Pin 1 on Side)...............................LCCS + Pitch P + Body Width X Body Length X Height - Pin Qty Resistors, Chip...........................................................................................................................RESC + Body Length + Body Width X Height Resistors, Molded......................................................................................................................RESM + Body Length + Body Width X Height Resistors, MELF...........................................................................................................................RESMELF + Body Length + Body Diameter Resistors, Chip, Array, Concave............................................................RESCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Convex, E-Version (Even Pin Size)...............RESCAXE + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Convex, S-Version (Side Pins Diff)................RESCAXS + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Flat.....................................................................RESCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Small Outline Diodes, Flat Lead...................................................................................SODFL + Lead Span Nominal + Body Width X Height Small Outline IC, J-Leaded........................................................................................SOJ + Pitch P +Lead Span Nominal X Height - Pin Qty Small Outline Integrated Circuit, (50 mil Pitch SOIC)......................................................SOIC127P +Lead Span Nominal X Height - Pin Qty Small Outline Packages............................................................................................SOP + Pitch P +Lead Span Nominal X Height - Pin Qty Small Outline No-lead...........................................................SON + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Pull-back Small Outline No-lead.........................................PSON + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Small Outline Transistors, Flat Lead....................................................................SOTFL + Pitch P + Lead Span Nominal X Height - Pin Qty SOD (Example: SOD3717X135 = JEDEC SOD123)........................................................SOD + Lead Span Nominal + Body Width X Height SOT89 (JEDEC Standard Package).......................................................................................................................................................SOT89 SOT143 & SOT343 (JEDEC Standard Package)..............................................................................................................SOT143 & SOT343 SOT143 & SOT343 Reverse (JEDEC Standard Package)...........................................................................................SOT143R & SOT343R SOT23 & SOT223 Packages (Example: SOT230P700X180-4)...............................SOT + Pitch P + Lead Span Nominal X Height - Pin Qty TO (Generic DPAK - Example: TO228P970X238-3).................................................................TO + Pitch P + Lead Span X Height - Pin QtyI P C-7351B L a n d P a t t e r n N a m i n g C o n v e n t i o n N o t e s•All dimensions are in Metric Units•All Lead Span and Height numbers go two places past the decimal point and “include” trailing Zeros•All Lead Span and Body Sizes go two place before the decimal point and “remove” leading Zeros•All Chip Component Body Sizes are one place to each side of the decimal point•Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros N a m i n g C o n v e n t i o n S p e c i a l C h a r a c t e r U s e f o r L a n d P a t t e r n sThe _ (underscore) is the separator between pin Qty in Hidden & Deleted pin componentsThe – (dash) is used to separate the pin qty.The X (capital letter X) is used instead of the word “by” to separate two numbers such as height X width like “Quad Packages”.P C B L i b r a r i e s S u f f i x N a m i n g C o n v e n t i o n f o r L a n d P a t t e r n sCommon SMT Land Pattern to Describe Environment Use (This is the last character in every name)Note: This excludes the BGA component family as they only come in the Nominal Environment Condition •M.................Most Material Condition (Level A)•N..................Nominal Material Condition (Level B)•L.................Least Material Condition (Level C)Alternate Components that do not follow the JEDEC, EIA or IEC Standard•A..................Alternate Component (used primarily for SOP & QFP when Component Tolerance or Height is different) •B..................Second Alternate ComponentReverse Pin Order•-20RN..........20 pin part, Reverse Pin Order, Nominal EnvironmentHidden Pins•-20_24N......20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped. The schematic symbol displays up to 24 pins.Deleted Pins•-24_20N......20 pin part in a 24 pin package. The pins are numbered 1 – 20. The schematic symbol displays 20 pins. JEDEC and EIA Standard parts that have several alternate packages•AA, AB, AC.JEDEC or EIA Component IdentifierGENERAL SUFFIXES_HS.........................HS = Land Pattern with Heat Sink attachment requiring additional holes or padsExample: TO254P1055X160_HS-6N_BEC......................BEC = Base, Emitter and Collector (Pin assignments used for three pin Transistors)Example: SOT95P280X160_BEC-3N_SGD......................SGD = Source, Gate and Drain (Pin assignments used for three pin Transistors)Example: SOT95P280X160_SGD-3N_213........................213 = Alternate pin assignments used for three pin TransistorsExample: SOT95P280X160_213-3NP C B L i b r a r i e s N a m i n g C o n v e n t i o n f o r N o n-S t a n d a r d S M T L a n d P a t t e r n s Surface Mount Land PatternsComponent, Category Land Pattern Name Amplifiers....................................................................................................................................................AMP_ Mfr.’s Part Number Batteries......................................................................................................................................................BAT_ Mfr.’s Part Number Capacitors, Variable..................................................................................................................................CAPV_Mfr.’s Part Number Capacitors, Chip, Array, Concave (Pins on 2 or 4 sides)..............................................................CAPCAV_Mfr Series No. - Pin Qty Capacitors, Chip, Array, Flat (Pins on 2 sides)..............................................................................CAPCAF_Mfr Series No. - Pin Qty Capacitors, Miscellaneous............................................................................................................................CAP_Mfr.’s Part Number Crystals......................................................................................................................................................XTAL_Mfr.’s Part Number Diodes, Miscellaneous...................................................................................................................................DIO_Mfr.’s Part Number Diodes, Bridge Rectifiers............................................................................................................................DIOB_Mfr.’s Part Number Ferrite Beads..................................................................................................................................................FB_Mfr.’s Part Number Fiducials......................................................................................................................................FID + Pad Size X Solder Mask Size Filters..............................................................................................................................................................FIL_Mfr.’s Part Number Fuses..........................................................................................................................................................FUSE_Mfr.’s Part Number Fuse, Resettable.....................................................................................................................................FUSER_Mfr.’s Part Number Inductors, Miscellaneous...............................................................................................................................IND_Mfr.’s Part Number Inductors, Chip, Array, Concave (Pins on 2 or 4 sides)..................................................................INDCAV_Mfr Series No. - Pin Qty Inductors, Chip, Array, Flat (Pins on 2 sides).................................................................................INDCAF_Mfr Series No. - Pin Qty Keypad.................................................................................................................................................KEYPAD_Mfr.’s Part Number LEDS............................................................................................................................................................LED_Mfr.’s Part Number LEDS, Chip...................................................................................................................................................LED_Mfr.’s Part Number Liquid Crystal Display...................................................................................................................................LCD_Mfr.’s Part Number Microphones..................................................................................................................................................MIC_Mfr.’s Part Number Opto Isolators............................................................................................................................................OPTO_Mfr.’s Part Number Oscillators......................................................................................................................................OSC_Mfr.’s Part Number - Pin Qty Quad Flat Packages w/Bumper Corners, Pin 1 Side.............BQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat Packages w/Bumper Corners, 1 Center..............BQFPC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Resistors, Chip, Array, Concave (Pins on 2 or 4 sides).................................................................RESCAV_Mfr Series No. - Pin Qty Resistors, Chip, Array, Convex Type E (Pins on 2 sides)...........................................................RESCAXE_Mfr Series No. - Pin Qty Resistors, Chip, Array, Convex Type S (Pins on 2 sides)...........................................................RESCAXS_Mfr Series No. - Pin Qty Resistors, Chip, Array, Flat (Pins on 2 sides)................................................................................RESCAF_Mfr Series No. - Pin Qty Relays.....................................................................................................................................................RELAY_Mfr.’s Part Number Speakers....................................................................................................................................................SPKR_Mfr’s Part Number Switches........................................................................................................................................................SW_Mfr.’s Part Number Test Points, Round......................TP + Pad Size (1 place left of decimal and 2 places right of decimal, Example TP100 = 1.00mm) Test Points, Square...............................................................TPS + Pad Size (1 place left of decimal and 2 places right of decimal) Test Points, Rectangle....................................TP + Pad Length X Pad Width (1 place left of decimal and 2 places right of decimal) Thermistors.............................................................................................................................................THERM_Mfr.’s Part Number Transceivers.............................................................................................................................................XCVR_ Mfr.’s Part Number Transducers (IRDA’s)................................................................................................................................XDCR_Mfr.’s Part Number Transient Voltage S_Mfr.’s Part Number Transient Voltage Suppressors, SP_Mfr.’s Part Number Transistor Outlines, Custom....................................................................................................................TRANS_Mfr.’s Part Number Transformers.............................................................................................................................................XFMR_Mfr.’s Part Number Trimmers & Potentiometers........................................................................................................................TRIM_Mfr.’s Part Number Tuners.....................................................................................................................................................TUNER_Mfr.’s Part Number Varistors.......................................................................................................................................................VAR_Mfr.’s Part Number Voltage Controlled Oscillators.....................................................................................................................VCO_Mfr.’s Part Number Voltage Regulators, Custom......................................................................................................................VREG_Mfr.’s Part NumberI P C-7251N a m i n g C o n v e n t i o n f o r T h r o u g h-H o l e L a n d P a t t e r n sThe land pattern naming convention uses component dimensions to derive the land pattern name.The first 3 – 6 characters in the land pattern name describe the component family.The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.All numbers that follow the Lead Spacing are component dimensions.These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers –P = Pitch for components with more than two leadsW = Maximum Lead Width (or Component Lead Diameter)L = Body Length for horizontal mountingD = Body Diameter for round component bodyT = Body Thickness for rectangular component bodyH = Height for vertically mounted componentsQ = Pin Quantity for components with more than two leadsR = Number of Rows for connectorsA, B & C = the fabrication complexity level as defined in the IPC-2221 and IPC-2222Notes:All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.All Complexity Levels used in the examples are “B”.Component, Category Land Pattern Name Capacitors, Non Polarized Axial Diameter Horizontal Mounting.........CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPAD800W52L600D150BCapacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Capacitors, Non Polarized Axial Rectangular.........CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPAR800W52L600T50H70BCapacitors, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70Capacitors, Non Polarized Axial Diameter Vertical Mounting .........CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPADV300W52L600D150BCapacitors, Non Polarized Axial; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50mmCapacitors, Non Polarized Axial Rect. Vert. Mtg.CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height Example: CAPARV300W52L600T50H70BCapacitors, Non Polarized Axial Rect. Vertical; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70 Capacitors, Non Polarized Radial Diameter.......................................CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height Example: CAPRD200W52D300H550BCapacitors, Non Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50Capacitors, Non Polarized Radial Rectangular.......CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPRR200W52L50T70H550BCapacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50 Capacitors, Non Polarized Radial Disk Button........CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPRB200W52L50T70H550BCapacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50 Capacitors, Polarized Axial Diameter Horizontal Mounting................CAPPA + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPPAD800W52L600D150BCapacitors, Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Capacitor, Polarized Radial Diameter.................................................CAPPR + Lead Spacing + W Lead Width + D Body Diameter + H Body Height Example: CAPPRD200W52D300H550BCapacitors, Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50Diodes, Axial Diameter Horizontal Mounting.......................................DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: DIOAD800W52L600D150BCapacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Diodes, Axial Diameter Vertical Mounting .........................................DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: DIOADV300W52L600D150BCapacitors, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Dual-In-Line Packages...................................DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty Example: DIP762W52P254L1905H508Q14BDual-In-Line Package: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14Component, Category Land Pattern Name Dual-In-Line Sockets....................................DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty Example: DIPS762W52P254L1905H508Q14BDual-In-Line Package Socket: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14Headers, Vertical....... HDRV + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Component HeightExample: HDRV200W52P200R2L4400T400H900BHeader, Vertical: Lead Span 2.00; Lead Width 0.52; Pin Pitch 2.00; 2 Rows; Body Length 44.00; Body Thickness 4.00; Body Height 9.00 Headers, Right Angle...............HDRRA + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Component HeightExample: HDRRA200W52P200R2L4400T400H900BHeader, Vertical: Lead Span 2.00; Lead Width 0.52; Pin Pitch 2.00; 2 Rows; Body Length 44.00; Body Thickness 4.00; Body Height 9.00 Inductors, Axial Diameter Horizontal Mounting....................................INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: INDAD800W52L600D150BInductors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Inductors, Axial Diameter Vertical Mounting .....................................INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: INDADV300W52L600D150BInductors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Jumpers, Wire...................................................................................................................................................JUMP + Lead Spacing + W Lead Width Example: JUMP500W52BJumper; Lead Spacing 5.00; Lead Width 0.52Mounting Holes Plated With Support Pad..........................................................................MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size Example: MTGP700H400Z520This is a Mounting hole for a #6-32 screw using a circular 7.00 land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter.Mounting Holes Non-Plated With Support Pad................................................................MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size Example: MTGNP700H400Z520This is a Mounting hole for a #6-32 screw using a circular 7.00 land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter.Mounting Holes Non-Plated Without Support Pad.....................MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter Example: MTGNP100H400Z520K700This is a Mounting hole for a #6-32 screw using a circular 1mm land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter and a 7.00 diameter keep-out.Mounting Holes Plated with 8 Vias .....................................................................MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias Example: MTGP700H400Z520V8This is a Mounting hole for a #6-32 screw using a circular 7mm land on the primary and secondary side of the board, a 4mm diameter hole with the internal lands are smaller that the external and are also circular 5.2mm in diameter, with 8 vias.Pin Grid Array’s.............................PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height Example: PGA84P254C10R10L2500X2500H300BPin Grid Array: Pin Qty 84; Pin Pitch 2.54; Columns 10; Rows 10; Body Length 25.00 X 25.00; Component Height 3.00Resistors, Axial Diameter Horizontal Mounting...................................RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: RESAD800W52L600D150BResistors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Resistors, Axial Diameter Vertical Mounting ....................................RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: RESADV300W52L600D150BResistors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Resistors, Axial Rectangular Horizontal Mounting...RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: RESAR800W52L600T50H70BResistors, Axial Rectangular; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70Test Points, Round Land......................................................................................................................................................................TP + Lead Width Example: TP52Test Points, Square Land..................................................................................................................................................................TPS + Lead Width Example: TPS52Test Points, Top Land Round & Bottom Land Square.....................................................................................................................TPRS + Lead Width Example: TPRS52 Wire....................................................................................................................................................................................................PAD + Wire Width Example: PAD52。

vray中英对照及各种材质参数设置

vray中英对照及各种材质参数设置

下面是我对VARY的总结,包含了中英文对照,及各类材质参数的设置,还有草图参数设置及最终效果图设置。

十分齐全,对VARY初学者及不知道如何设置材质球的同志们有很大的帮助。

VR材质参数Diffuse (漫反射)- 材质的漫反射颜色。

能够在纹理贴图部分(texture maps)的漫反射贴图通道凹槽里使用一个贴图替换这个倍增器的值。

Reflect(反射)- 反射表要用于石材金属玻璃等材质,一个反射倍增器,通过颜色来控制反射,能够在纹理贴图部分(texture maps)的反射贴图通道凹槽里使用一个贴图替换这个倍增器的值)。

黑色表面没有任何反射,值越大反射越强,白色表面完全反射。

Hilight glossiness-反射出的光点,也就是高光, 控制着模糊高光,只能在有灯光的情况下有效果,值越低越模糊,高光范围越大)Glossiness(光泽度、平滑度)-这个值表示材质的光泽度大小。

值为意味着得到非常模糊的反射效果。

值为,将关掉光泽度,VRay将产生非常明显的完全反射)。

注意:打开光泽度(glossiness)将增加渲染时间。

Subdivs(细分)-控制光线的数量,作出有光泽的反射估算。

当光泽度Glossiness值为时,这个细分值会失去作用,VRay不会发射光线去估算光泽度。

Fresnel reflection(菲涅尔反射)-不勾选(当这个选项给打开时,反射将具有真实世界的玻璃反射。

这意味着当角度在光线和表面法线之间角度值接近0度时,反射将衰减(当光线几乎平行于表面时,反射可见性最大。

当光线垂直于表面时几乎没反射发生。

) Max depth(最大深度)-光线跟踪贴图的最大深度。

光线跟踪更大的深度时贴图将返回黑色(左边的黑块)。

Refract(折射)-一个折射倍增器。

你能够在纹理贴图部分(texture maps)的折射贴图通道凹槽里使用一个贴图替换这个倍增器的值。

Glossiness(光泽度、平滑度)- 这个值表示材质的光泽度大小。

美国律考干货:CABar备考全解析

美国律考干货:CABar备考全解析

美国律考⼲货:CABar备考全解析美国律考⼲货:CA Bar备考全解析在公众号“西太平洋的风”上的⼀篇关于CA Bar备考攻略,其中有很多内容对⽐了之前NY Bar的⽆论是以上哪种情况,若是选择了CA bar,就要有针对性地进⾏准备。

⽽如果要⽤⼀句话概括CA bar相较NY bar难在哪⼉,那⼀定是占了极⼤⽐重的写作部分。

考试情况,⾮常推荐有过NY Bar备考经历的同学服⽤,对于直接考CA Bar的同学,很多内容也⾮常有参考价值。

个⼈理解通常只有三种中国考⽣选择CA bar:(1) 没有美国LL.M./JD教育背景但有国内律师证的中国执业律师(这种情况⽆法通过NY bar的资格审核);(2) 希望在加州发展(由于美国法律具有很强的地域性,持NY bar在加州执业受到极⼤的限制);(3) 就读LL.M.期间选课未能达到NY bar要求的学⽣(⼤部分学校都会在开学前就多次强调NY bar要求的课程学分,因此只要事先注意就不会发⽣这种情况。

但我在CA bar的考场上确实遇到⼀个国外LL.M.因此被迫参加CA bar的考试)。

⽆论是以上哪种情况,若是选择了CA bar,就要有针对性地进⾏准备。

⽽如果要⽤⼀句话概括CA bar相较NY bar难在哪⼉,那⼀定是占了极⼤⽐重的写作部分。

另外,有很多已经通过NY bar考试的同学都有疑问,是否能直接转CA bar。

答案很明确的是不能。

另外,虽然CA bar和NY bar都有MBE部分,CA bar也不接受直接将之前NY bar 的MBE成绩转到CA bar。

除⾮是在美国其他州已执业超过4年的律师,才能参加CA bar专门为执业律师准备的Attorney Exam。

Attorney Exam和General Exam唯⼀的区别是参加Attorney Exam的考⽣只需参加第⼀和第三天的写作部分考试并以此评分,⽽不需参加第⼆天的MBE考试。

CA Bar简介下⾯⼀段的内容仅适⽤于2017年7⽉之前的考试。

Cesium原理篇:Property

Cesium原理篇:Property

Cesium原理篇:Property之前主要是Entity的一个大概流程,本文主要介绍Cesium的属性,比如defineProperties,Property(ConstantProperty,CallbackProperty,ConstantPositionProperty)以及createPropertyDescriptor的相关内容,研究一下Cesium对Object的属性设计和使用方式。

我们以Entity为例,看看它是如何封装自己的属性:复制代码function Entity(options) {var id = options.id;if (!defined(id)) {id = createGuid();}this._id = id;this._name = ;this._description = undefined;this._position = undefined;this._rectangle = undefined;}// Key 1:definePropertiesdefineProperties(Entity.prototype, {id : {get : function() {return this._id;}},// Key 2:createRawPropertyDescriptorname : createRawPropertyDescriptor('name'),// Key 3:createPropertyDescriptordescription : createPropertyDescriptor('description'),// Key 4:createPositionPropertyDescriptorposition : createPositionPropertyDescriptor('position'),// Key 5:createPropertyTypeDescriptorrectangle : createPropertyTypeDescriptor('rectangle', RectangleGraphics)});复制代码如上,我截取了五个属性:id,name,description,position,rectangle。

建筑设计常用英语词汇汇总

建筑设计常用英语词汇汇总

请一定记住:任何时候Google 和Google Image 搜图都是我们最好的翻译工具!记住翻译重要的是理解,然后用自己的语言来解释,而不是一个英文单词对应一个中文词。

sentences句子:1) camera angle of the aerial鸟瞰图的相机角度2) Keep as much of this project CG as possible.3) on hold for now暂时等待4) we have not flown this project yet 我们还没有航拍这个项目5) 30 Sec Polished Animation by Thursday October 30秒精美制作过的动画6) the frames per second should be 29.97 not 25. 应该是29.97帧/秒而不是25帧/秒。

7) Structural grid coffer ceiling with recess lighting. 内嵌有灯的天花板格子8) This material shimmers with silver specs. 这种材质是带有银质金属片闪闪发光的9) the overhang in the back and in the front 屋顶前后挑出的部分10) this is how it is now 这是现在的样子11) colored site plan of the project 项目颜色平面图12) artists colored perspective of the project 彩色手绘透视图13) Please have several sample cameras for the bedroom14) 请做几个卧室的相机角度小样15) Use a gas range top for the cook top.炉灶用平式煤气炉16) The idea is that xx的想法17) Apply this edit to the model 用这些修改意见来改模型。

pcl曲面重建模块-贪婪三角形投影算法实例

pcl曲面重建模块-贪婪三角形投影算法实例

pcl曲⾯重建模块-贪婪三⾓形投影算法实例贪婪三⾓形投影算法在pcl-1.8测试#include <pcl/point_types.h>#include <pcl/io/pcd_io.h>#include <pcl/io/vtk_io.h>#include <pcl/kdtree/kdtree_flann.h>#include <pcl/features/normal_3d.h>#include <pcl/surface/gp3.h>#include <pcl/visualization/pcl_visualizer.h>#include <boost/thread/thread.hpp>#include <fstream>#include <iostream>#include <stdio.h>#include <string.h>int main(int argc, char** argv){// 点云模型读⼊,此处读⼊为PCD格式点云⽂件.数据类型为PointXYZ.pcl::PointCloud<pcl::PointXYZ>::Ptr cloud(new pcl::PointCloud<pcl::PointXYZ>);if (pcl::io::loadPCDFile<pcl::PointXYZ>(argv[1], *cloud) == -1){PCL_ERROR("Couldn't read file mypointcloud.pcd\n"); //若读取失败将提⽰return -1;}std::cerr << "点云读⼊完成" << std::endl;//sensor_msgs::PointCloud2 cloud_blob;//pcl::io::loadPCDFile ("bun0.pcd", cloud_blob);//pcl::fromROSMsg (cloud_blob, *cloud);//* the data should be available in cloud// Normal estimation(法向量估计)pcl::NormalEstimation<pcl::PointXYZ, pcl::Normal> n;//创建法向估计对象pcl::PointCloud<pcl::Normal>::Ptr normals(new pcl::PointCloud<pcl::Normal>);//创建法向数据指针pcl::search::KdTree<pcl::PointXYZ>::Ptr tree(new pcl::search::KdTree<pcl::PointXYZ>);//创建kdtree⽤于法向计算时近邻搜索tree->setInputCloud(cloud);//为kdtree输⼊点云n.setInputCloud(cloud);//为法向估计对象输⼊点云n.setSearchMethod(tree);//设置法向估计时采⽤的搜索⽅式为kdtreen.setKSearch(20);//设置法向估计时,k近邻搜索的点数pute(*normals); //进⾏法向估计std::cerr << "法线计算完成" << std::endl;// 创建同时包含点和法向的数据结构的指针pcl::PointCloud<pcl::PointNormal>::Ptr cloud_with_normals(new pcl::PointCloud<pcl::PointNormal>);//将已获得的点数据和法向数据拼接pcl::concatenateFields(*cloud, *normals, *cloud_with_normals);// 创建另⼀个kdtree⽤于重建pcl::search::KdTree<pcl::PointNormal>::Ptr tree2(new pcl::search::KdTree<pcl::PointNormal>);//为kdtree输⼊点云数据,该点云数据类型为点和法向tree2->setInputCloud(cloud_with_normals);// 创建贪婪三⾓形投影重建对象pcl::GreedyProjectionTriangulation<pcl::PointNormal> gp3;//创建多边形⽹格对象,⽤来存储重建结果pcl::PolygonMesh triangles;//设置参数gp3.setSearchRadius(25); // 设置连接点之间的最⼤距离(最⼤边长)⽤于确定k近邻的球半径(默认为0)gp3.setMu(2.5); // 设置最近邻距离的乘⼦,已得到每个点的最终搜索半径(默认为0)gp3.setMaximumNearestNeighbors(100); //设置搜索的最近邻点的最⼤数量gp3.setMaximumSurfaceAngle(M_PI / 2); // 45 degrees 最⼤平⾯⾓gp3.setMinimumAngle(M_PI / 18); // 10 degrees 每个三⾓的最⼤⾓度gp3.setMaximumAngle(2 * M_PI / 3); // 120 degreesgp3.setNormalConsistency(false); //若法向量⼀致,设为true// 设置点云数据和搜索⽅式gp3.setInputCloud(cloud_with_normals);gp3.setSearchMethod(tree2);//开始重建gp3.reconstruct(triangles);std::cerr << "重建完成" << std::endl;//将重建结果保存到硬盘⽂件中,重建结果以VTK格式存储pcl::io::saveVTKFile("mymesh.vtk", triangles);// Additional vertex informationstd::vector<int> parts = gp3.getPartIDs();std::vector<int> states = gp3.getPointStates();fstream fs;fs.open("partsID.txt", ios::out);if (!fs){return -2;}fs << "点云数量为:" << parts.size() << "\n";for (int i = 0; i < parts.size(); i++){if (parts[i] != 0){fs << parts[i] << "\n"; //这的fs对吗?}}std::cerr << "开始显⽰ ........" << std::endl;//图形显⽰模块//创建显⽰对象指针boost::shared_ptr<pcl::visualization::PCLVisualizer> viewer(new pcl::visualization::PCLVisualizer("3D Viewer")); viewer->setBackgroundColor(0, 0, 0.6); //设置窗⼝颜⾊viewer->addPolygonMesh(triangles, "my"); //设置所要显⽰的⽹格对象viewer->addCoordinateSystem(0.1); //设置坐标系,参数为坐标显⽰尺⼨viewer->initCameraParameters();while (!viewer->wasStopped()){viewer->spinOnce(100);boost::this_thread::sleep(boost::posix_time::microseconds(100000));}// Finishreturn 0;}。

three.js使用卷积法实现物体描边效果

three.js使用卷积法实现物体描边效果
这三步就可以实现了,很简单吧。下面我们将详细介绍实现方法,不想看的可以直接去看完整实现代码: 完整代码: 详细的实现过程: 1. 使用three.js正常绘制场景,得到下图,这里不介绍了。
2. 创建着色器材质,隐藏所有不需要描边的物体。将需要描边的物体绘制成白色,其他地方绘制成黑色。
隐藏不需要描边的物体后,将整个场景材质替换。
}
效果图:
3. 创建着色器材质进行卷积计算,每四个像素颜色求平均值得到一个像素。描边物体内部是白色,外部是黑色,物体边缘处会得到灰色。灰 色就是我们所需的边框。
const edgeMaterial = new THREE.ShaderMaterial({ vertexShader: EdgeVertex, fragmentShader: EdgeFragment, uniforms: { maskTexture: { value: this.maskBuffer.texture }, texSize: { value: new THREE.Vector2(width, height) }, color: { value: selectedColor }, thickness: { type: 'f', value: 4 }, transparent: true }, depthTest: false
}
CopyFragmentShader:
uniform float opacity;
uniform sampler2D tDiffuse; varying vec2 vUv; void main() {
vec4 texel = texture2D( tDiffuse, vUv ); gl_FragColor = opacity * texel; }

锚框的参数

锚框的参数

锚框的参数全文共四篇示例,供读者参考第一篇示例:锚框是目标检测领域中的重要概念,通常用于辅助模型定位目标位置。

在目标检测任务中,锚框的参数设置直接影响模型的性能和准确性。

本文将介绍关于锚框参数的一些常见概念和设置方法。

一、什么是锚框锚框(Anchor Box)是在目标检测中用来预测目标位置和大小的一种辅助框。

在深度学习模型中,锚框通常是预先定义好的一些固定大小和长宽比的框,用来覆盖输入图像的不同区域。

通过对图像进行锚框的多尺度和多长宽比采样,模型可以更好地对目标进行位置和尺寸的精准预测。

二、锚框的参数1. 尺度(Scale)锚框的尺度是指锚框的大小,在目标检测任务中通常会定义多个不同尺度的锚框来覆盖不同大小的目标。

尺度的选择需要根据具体的数据集和目标进行调整,通常会根据目标的平均大小和数据集中目标的尺度分布进行选择。

2. 长宽比(Aspect Ratio)3. 位置(Location)锚框的位置是指锚框在特征图上的位置。

在目标检测任务中,通常会在特征图上采样一定数量的锚框来覆盖不同位置的目标。

位置的选择需要根据目标的位置分布和特征图的大小来确定。

4. 密集采样(Dense Sampling)在一些高精度目标检测任务中,通常会采用密集采样的方式来生成更多的锚框,以提高模型对小目标和密集目标的检测能力。

密集采样需要更多的计算资源和训练时间,但能够提升模型的性能和准确性。

5. 比例因子(Scale Factor)比例因子是指在不同尺度和长宽比的锚框之间进行调整时所使用的系数。

比例因子的选择需要根据具体的任务和模型来确定,通常会根据目标的大小和形状来进行调整。

三、锚框参数设置方法1. 根据目标的大小和形状来选择合适的尺度和长宽比;3. 通过交叉验证等方法来调整锚框的参数,以获得最佳的模型性能;4. 在训练过程中动态调整锚框的参数,以提高模型对不同大小和形状的目标的检测能力。

锚框的参数设置是目标检测任务中的一个重要环节,合理的锚框参数可以帮助模型更好地定位目标位置和大小,提升模型的性能和准确性。

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REAL PROPERTYPOSSESSORY INTERESTS-PRESENT INTERESTSo FEE SIMPLE ABSOLUTE▪Absolute infinite ownershipo DEFEASIBLE FEES▪FEE SIMPLE DETERMINABLE∙“for so long as,” “while,” “during,” “until”∙NOT created by “for the purpose of” or “to be used for” → words of motive only ▪FEE SIMPLE SUBJECT TO CONDITION SUBSEQUENT∙Owner retains ability to reenter and retake∙“Upon condition that,” “provided that,” “but if,” “if it happens that”▪FEE SIMPLE SUBJECT TO EXECUTORY LIMITATION∙Passes to a third party on the happening of a stated evento LIFE ESTATES▪Dower/curtesy – life estate in favor of widow/widower▪Duties of life tenant∙Make ordinary repairs∙Pay INTEREST on mortgage but not principal∙Pay taxes∙Don’t commit wasteo Taking natural resources▪Exception: Open mines doctrine▪Can also take natural resources if land is suitable ONLY for such use ORif the grantor said soo Demolish/change buildings▪Exception: OK IF:∙Market value of future interests not harmed AND EITHER∙The remaindermen do not object OR∙There has been a substantial and permanent change in theneighborhood conditions, which deprives the property of itsreasonable usefulness.-FUTURE INTERESTSo IN GRANTOR▪POSSIBILITY OF REVERTER∙Follows fee simple determinable▪RIGHT OF ENTRY▪REVERSIONo IN THIRD PERSON▪EXECUTORY INTERESTS∙These are NOT vested for RAP purposes∙Typeso Springing executory interest▪Grantor has the property until the condition happenso Shifting executory interest▪ A grantee has the property, and it switches to a different grantee whencondition happens▪REMAINDERS∙Passes to a third person upon the natural expiration of the preceding estate∙NEVER follows a time gap from preceding estate∙Types:o Indefeasibly vested remainder▪In an existing person, not subject to any condition precedent OR subject todivestmento Vested remainder subject to open▪Class giftso Vested remainder subject to total divestment▪Subject to a condition subsequento Contingent remainders▪Unascertained or unborn people OR▪Subject to a condition precedent▪Destructability of contingent remainders – destroyed if it failed to vestbefore the preceding estate ended (now abolished most places → insteadgoes back to grantor, then springs up when remainderman is ready).o Alternative contingent remainders▪To A for life, then to B if he marries C, if not, to D.o MERGER▪If one person acquires all present and future interests in land EXCEPT a contingent remainder, the contingent remainder is destroyed.▪BUT if the life estate and the next vested interest were created by the same instrument, there is no merger (would thwar t grantor’s intent)▪Example: X conveys “To Y for life, then to Z’s children.” Z does not yet have children. X then acquires Y’s life estate and already has a reversion. Merger →Z’s unborn children’s interests aredestroyed.o VALIDITY▪SHELLEY’S CASE∙If you convey to “A for life, then A’s heirs,” this just becomes a straight conveyance to A.▪WORTHIER TITLE∙ A remainder in the grantor’s heirs is invalid, and becomes a reversion, but ONLY applies tointer vivos transfers NOT wills.∙Example: A conveys “to B for life, then to A’s heirs” →becomes “to B for life.” A has areversion.▪RESTRAINTS ON MARRIAGE∙Public policy issues▪RESTRAINTS ON ALIENATION∙Restraints on a fee simple interest are void UNLESS for a limited time and reasonablepurpose∙Restraints on life estates and/or future interests are VALID▪RULE AGAINST PERPETUITIES∙Must vest or fail within 21 years after the death of some person in being at the time theinterest is created.∙Applies only to non-vested interests – i.e. NOT vested remainders (no condition precedent),reversions.∙Does NOT apply to charity-to-charity shifts.o CLASS GIFTS▪Rule of convenience – class closes when first member is eligible to take▪Babies in gestation when the class closes, and later born alive, are considered members of the class CONCURRENT ESTATES-JOINT TENANCYo Creation▪TTIP: Time, Title, Interest, Possessiono Severance▪Inter vivos conveyance of ENTIRE interest but not necessarily partial interest▪Title theory states only – mortgage of interest▪Lease to a third party – states are split▪Some jurisdictions have severance if one JT murders another (to prevent killer from taking the whole) -TENANCY BY THE ENTIRETYo Same as JT but JTs must be married –interest CANNOT be severed w/o other’s permission-TENANTS IN COMMONo Joint devises presumed to be TIC-RIGHTS & DUTIES OF CO-TENANTSo Cannot oust other JTso Can retain profits from her OWN use of the property absent ouster – but must share NET rents from THIRD PARTIES or natural resource exploitation (i.e. mining)o Contributions for necessary repairs, but must first notify other tenants of need for the repairs.o Cannot get contribution for improvements to the property, but may get credit for their expenditures at partition.o Can get reimbursed for taxes or mortgage payments – UNLESS co-tenant is in sole possession. Then can only get expenditures minus rental value of her use.o Duty of fair dealing to each other.LANDLORD TENANTLeases must be in writing if for more than one year! (SOF)-NATURE OF LEASEHOLDo TENANCY FOR YEARSo PERIODIC TENANCY▪Renews automatically if not terminated.▪Requires one period’s termination notice, or if more than one year, 6 monthso TENANCY AT WILLo TENANCY AT SUFFERANCE▪Landlord may move to evict OR hold T to a new periodic tenancy on the same terms as old lease (unless had previous notice of i.e. rent increase).∙Exceptions:o Delay not T’s fault (i.e. severe illness)o It is a seasonal leaseo Lease for multiple years – then new period is max of 1 year.-TENANT’S DUTIESo DUTY TO REPAIR▪T has no duty to repair, but if the lease provides he will repair, then he must fix ordinary wear and tear but NOT complete structural failures (i.e. house burns down)▪AFFIRMATIVE WASTE – T cannot damage property or exploit natural resources▪PERMISSIVE WASTE – T must take reasonable steps to protect premises from damage from the elements (i.e. hole in roof)▪DESTRUCTION OF PREMISES – T must still pay rent, but L has no duty to repair (usuallychanged by statute)▪DEFENSES▪TENANTS DUTY TO REPORT PROBLEMSo DUTY NOT TO USE PREMISES FOR ILLEGAL PURPOSES▪If this is breached, T can obtain injunction, damages, or terminate lease▪Occasional unlawful conduct not grounds for terminationo DUTY TO PAY RENT▪If T surrenders and L accepts, duty to pay rent is terminated▪The duty to pay rent is a covenant that runs w/the lando ABANDONMENT OF PREMISES BY TENANT▪L must mitigate damages by trying to re-rent. If L accepts surrender, T has no more liability, but no surrender → T liable for any deficiency.∙If L moves back in, that’s accepting surrender.▪Constructive eviction and tenant remedies∙If T moved out b/c L did something that rendered the property uninhabitable, T can leaveand seek damages. Must be L’s FAULT and T must VACATE w/in a reasonable time.-LANDLORD’S DUTIESo DUTY TO DELIVER POSSESSION▪Majority: It’s L’s job to get holdove r out, must deliver actual possession▪Minority: It’s T’s problem if previous T holds overo COVENANT OF QUIET ENJOYMENT▪Ways this may be breached:∙Actual eviction∙Partial eviction by L (part of property) → T can stop paying rent on WHOLE property!∙Partial eviction by 3d party → T must pay a proportionate amount of rent∙Constructive eviction →must be L’s fault, T must vacate promptly and sue o IMPLIED WARRANTY OF HABITABILITY▪Applies only to residential leases and CANNOT be waived▪T’s rights if L breaches:∙Can terminate the lease∙Make repairs and subtract it from future rent∙Abate the rent to FMV w/defects∙Keep paying full rent & sue for damages▪Retailiatory eviction → L cannot evict for reporting housing/building code violations (w/in 3-6 months of complaint, retaliation presumed)o SAFETY▪At the start of lease, L must warn of latent defects he knows of and must conduct a reasonable inspection.▪L may be liable in tort for injuries to 3d parties caused by defects of the property if:∙L knows or should know of a dangerous condition AND∙Has reason to believe T may admit the public before repairing the condition AND∙Fails to repair the condition.∙NOTE that this is the only case where L must repair and can’t just warn.▪For common areas (i.e. halls of an apartment building) L must take reasonable care to maintain.▪For short-term, furnished rentals, L may be liable for injuries from ANY defect even if he didn’t know about it-ASSIGNMENTS AND SUBLEASESo Original T is in privity of contract w/L, assignor T on premises is in privity of estate w/L & can get sued by L.▪BUT if it’s only a sublease, there is no privity of estate or K – BUT L is a third party beneficiary of the T-subT contract.o Covenant to pay rent runs w/ the land and attaches to all sublessees/assignees-CONDEMNATIONo If whole property condemned by eminent domain, T’s liability for rent is extinguished.o If condemnation is temporary or partial, T is NOT discharged from rent, but is entitled to a proportionate share of the condemnation award-FIXTURESo Chattels that are incorporated into the structure (i.e. bricks in a wall) are fixtures definitelyo T can remove other fixtures if removal would not damage the premises or destroy the chattel.▪BUT if T leaves the fixture there after tenancy ends, it becomes L’s property.▪AND trespassers (i.e. failed adverse possession) CANNOT remove fixtureso Trade fixtures can always be removed, but T must put fix any damage.-CROPSo Growing crops not severed by the T before he vacates become property of the L.EASEMENTS-GENERAL DOCTRINEo An ea sement holder has the right to use another’s land for a special purpose, but has no right to possess or enjoy the land.o Easement appurtenant▪Benefits the owner of an adjacent piece of land▪Passes with the transfer of the BENEFITED land, even w/o notice▪Passes with the transfer of the SERVIENT land, UNLESS the new owner is a BFP for value without actual or constructive notice.▪Cannot be conveyed apart from the land itself (unless sold to the owner of the servient land to extinguish it)o Easement in gross▪Independent of another piece of land (i.e. easement to put a billboard up)▪Easements for fun are NOT transferrable, whereas those for an economic or commercial interest (i.e.right to put up a billboard) are.o Grants of easements must be in writing unless they are for one year or less (SoF)▪Must comply with all the formal requirements of a deedo Easements can be granted by reservation → O conveys land but reserves the right to use some part of it.▪An easement can be reserved ONLY FOR the grantor – NOT a third party.-AFFIRMATIVE EASEMENTo Right to do something on the land-NEGATIVE EASEMENTo Generally allowed only for:▪Light▪Air▪Lateral and subjacent support▪Flow of an artificial stream-CREATION BY IMPLICATIONo Implied from existing use▪Must have been used prior to the division of a single tract,▪Which was apparent and continuous, and▪Is reasonably necessary for enjoyment of the dominant part, and▪The parties intended the use continue after the land was divided.o Implied without any existing use▪Available when:∙Lots are sold in a subdivision are sold w/ reference to a recorded plat – there is an easementimplied that the places marked as streets can be used by the homeowners.∙You have a profit, and need to get on the land to use the profit.-CREATION BY NECESSITYo When land is divided, and one part is sold, and there’s no other way to access a ROAD or UTILITY LINE.o The owner of the servient land has a right to locate the easement where he wants.-CREATION BY PRESCRIPTIONo Elements▪Open and notorious,▪Adverse,▪Hostile,▪Continuous for the statutory periodo CANNOT be acquired in public land.-SCOPEo Easements are assumed to include increases to use that were foreseeable at the time the easement was created.o Overuse does NOT extinguish the easement, instead servient owner can get an injunction.-ENFORCEMENT-TERMINATIONo Releaseo Mergero Condemnation of the servient estate▪Courts split over whether easement holder entitled to compensationo Involuntary destruction of the servient estateo End of necessity (for easements created by necessity only)o Prescriptiono Abandonment → must show intent to abandon by a PHYSICAL act (i.e. building a fence across it). Mere non-use not enougho Estoppel → Servient landowner reasonably relies on oral promise of abandonmentLICENSES, PROFITS, COVENANTS & SERVITUDES-LICENSEo License estoppel▪Licenses are normally revocable at will, but if a licensee invests substantial amount of money or labor in reliance on the license, it can become an easement by estoppel, but lasts ONLY UNTIL thelicensee gets sufficient benefit to recoup his investment.▪Will be revocable as long as the interest lastso License coupled w/ interesto Failed attempt to create an easement may create a license-PROFITSo CAN be extinguished if they are overused (unlike easements)o Same rules for creation and extinguishment of easements apply to profits-COVENANTSo Covenants get damages, equitable servitudes get an injunction.o Affirmative covenant – maintain a fenceo Negative covenant –Don’t build commercial buildings on ito MUST BE IN WRITINGo Requirements for successors to the BURDENED land to be bound by the covenant:▪Intent for covenant to run w/land▪Notice (actual, inquiry, or record notice) UNLESS they took w/o giving value – then they may be bound ABSENT notice!▪Horizontal privity (original parties shared some interest in the land independent of the covenant)▪Vertical privity▪Touch and concern the lando Requirements for successors to the BENEFITED land to get the advantage of the covenant:▪Intent for covenant to run w/land▪Vertical privity▪Touch and concern the lando Covenants not to compete and covenants to pay $$$ (i.e. rent) are considered to “touch and concern” the land. -EQUITABLE SERVITUDESo Covenants get damages, equitable servitudes get an injunction.o Must be in writing OR implied by common scheme of developmento Reciprocal negative servitudes will be implied IF:▪When sales in the subdivision began,▪The developer had a plan that all parcels would be subject to the restriction, which is evidenced by: ∙ A recorded plat OR∙ A general pattern of restrictions OR∙Oral representations to early buyers.o Requirements for successors to the BURDENED land to be bound by the EQ:▪Intent that the EQ run▪Notice (actual, inquiry, or record)▪Touches and concerns the lando Requirements for successors to the BENEFITED land to get the advantage of the EQ:▪Intent that the EQ run▪Touches and concerns the lando Equitable servitudes are subject to the equity defenses:▪Unclean hands▪Laches▪Estoppel▪Holder acquiesced to violations▪Neighborhood has changed so significantly that enforcement would be inequitable.SUPPORT & WATER RIGHTS-LATERAL SUPPORTo Support of land in natural state → Strict liabilityo Support of land with buildings → Negligence only, unless would have collapsed despite buildings-SUBJACENT SUPPORTo Strict liability for support of land with buildings on the land when the mining rights were severed but NOT new buildingso Interference w/ underground waters-WATER RIGHTSo LAKES AND STREAMS (RIPARIAN)▪Natural Flow theory →Can’t cause substantial or material diminution of the water’s quantity, quality, or velocity▪Reasonable use theory →All riparians have a right to “reasonable use” of the water, as long as it does not interfere with others’ reasonable use (balance harms)▪Natural use v. Artificial use theory → Natural uses (household, gardening) prevail over artificial uses (irrigation, manufacturing)▪Prior appropriation doctrine → First in time can do whatevero GROUND WATER (WELLS)▪Absolute ownership doctrine (12 states) → Owner of overlying land can take all the water she wants, including for export.▪Reasonable use doctrine (25 states) → Exporting is allowed only if does not harm other owners above the same aquifer.▪Correlative rights doctrine (California) → Owners of overlying land own the aquifer as joint tenants.Each is allowed a reasonable amount for his own use.▪Appropriative rights doctrine → Priority of use is determinativeo SURFACE WATERS (RUNOFF) – Anyone can capture as much runoff as they want. These rules apply to diversion.▪Natural flow theory → Owners cannot alter natural drainage patterns▪Common enemy theory → Do whatever you want▪Reasonable use theory → Balancing of harmsCONVEYANCING-LAND SALE CONTRACTSo Statute of frauds▪Must be IN WRITING▪Signed by the party to be charged▪And contain the essential terms∙Parties∙Price∙Sufficiently specific description of the land▪BUT SoF will be satisfied if there is 2 of 3:∙Part or full payment∙Possession∙Valuable improvements to lando Specific performance▪Either S or B can get specific performance b/c land is uniqueo Equitable conversion▪Once the land sale contract is signed, B is the equitable land owner and S owns the purchase money, so risk of loss shifts to B then.o Implied condition to convey marketable title▪Things that will make title unmarketable:∙Defects in chain of title (defective deeds, missing deeds)∙Adverse possession∙Future interests in unborn or unascertained parties∙Significant encumbrances (mortages or easements)∙EXISTING violations of a zoning ordinance∙Anything that poses an UNREASONABLE risk of litigation▪If title is not marketable, B must notify S and give him reasonable time to cure.▪If B still wants to buy despite unmarketable title, court can order an abatement in purchase price.o New construction ONLY – warranty of fitness of quality is implied in sale contract from builder.▪Not new construction →Liability for defects S fraudulently covered up (“active concealment”) and for serious, latent defects he knows of, that wouldn’t be discovered by an ordinary inspection.∙Liability for fraud canNOT be disclaimed with an “as is” warranty unless it’s specific, suchas “S disclaims any warranty on defects in roof.”-DEEDSo Requirements for validity:▪Sufficient description∙Blank land description → deed is void∙Good enough if it provides a good lead to the identity of the property (all my land inStockton)∙Order of priority for conflicting descriptive items:o Natural monumentso Artificial monumentso Courses (angles)o Distanceso Nameo Quantity (5 acres)▪Signed by grantor∙If name of grantee is left blank, that’s OK.∙BUT grantee can’t be a dead person → deed to a dead person is VOID▪Delivery AND acceptance∙Title passes on delivery, it can’t be “cancelled” → NO GIVEBACKS, must reconvey withformal deed & delivery∙Oral conditions given at delivery don’t count if not in deed∙Delivery to an third party w/instructions to give to grantee counts.o BUT if there are no instructions, and the 3d party is found to be an AGENT ofgrantee, there is no delivery.∙Delivery as a dedication to the public (i.e. for a public park) is only effected when the cityformally resolves/approves it, or starts maintaining the land.o Void deeds → as if they never existed▪Obtained by fraud in the factum (O didn’t realize she was signing a deed)▪Were never delivered▪Forgedo Voidable deeds → Cannot be voided against a BFP!▪By a minor/incompetent▪Obtained through fraud in the inducement (lying)▪Duress▪Undue influence▪Mistake▪Breach of fiduciary duty▪Fraudulent conveyances∙To avoid creditors∙For negligible consideration right before S went bankrupto Deeds/wills problems▪ A deed that doesn’t become effective until O’s death, but is delivered, is valid but reserves a life estate for O, remainder to grantee.o Types of deeds▪General warranty deed → has all covenants▪Special warranty deed →Promises also that S hasn’t sold the same estate t o somebody else, and that S doesn’t have any encumbrances on the land.▪Quitclaim deed → Conveys whatever interest grantor has, no covenants of title are warranted.o Estoppel by deed▪X does not own but sells it to Y. Later, X gets title to the property. It passes directly to Y UNLESS the X-Y deed was a quitclaim deed.▪BUT Y will not prevail against a BFP.-COVENANTS OF TITLEo Covenant of seisin → owns the lando Covenant of right to convey → has a right to convey ito Covenant against encumbranceso Covenant of quiet enjoyment → promise that no 3d party from back in the chain of title will pop up and sue o Covenant of warranty → promise to defend against reasonable claims from such 3d partieso Covenant of further assurances → promises to perform acts necessary to perfect title-RECORDINGo Types▪Race → First in time always wins▪Race-notice → Last BFP who took w/o notice wins IF he records before challenger.▪Notice → Last BFP w/o notice always wins regardless of recordation.o Judgment creditors▪Split of authority on whether a judgment creditor who records wins against a prior unrecorded conveyance. Majority says NO → prior interest will wino Shelter rule▪Anyone who takes from a BFP is sheltered by their lack of notice.▪Exception: Will not protect people who owned the property before (A → B → A) o A deed recorded too early (before person took title) is not in the chain of title under the MAJORITY view.o A deed that references an instrument outside the chain of title might put someone on notice of that instrument.o A subsequent purchaser is charged with notice of a wrongly indexed deed, BUT has a cause of action against the recorder’s office.-MORTGAGEo Effect of foreclosure▪Anytime before the foreclosure sale, the mortgagor can get the property back by paying the amount due.▪Some statutes allow redemption for a certain amount of time even AFTER the foreclosure sale.▪Some states bar deficiency judgments after foreclosure.o Purchase money lenders have priority even if the non-purchase money lender recorded first.o Equitable mortgage doctrine▪Court will treat it as a mortgage rather than a conveyance when A owned the land and conveyed it toB as a security interest.▪ A sale/leaseback arrangement may also be treated as a disguised mortgage.ADVERSE POSSESSION-REQUIREMENTSo Open and notoriouso Actual and exclusive possessiono Continuous possession for statutory length of time▪Filing a lawsuit does NOT stop the clock until there’s a judgment!▪Clock does not begin to run against future interest holders until their interest becomes possessory o Hostile-If an adverse possessor uses the land in violation of a restrictive covenant in the owner’s deed for the statutory period, she takes W/O the covenant!-Public land can’t be acquired via AP。

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