Inherently robust repair process for thin film cir
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专利名称：Inherently robust repair process for thin
film circuitry using UV laser
发明人：Peter A. Franklin,Arthur G. Merryman,Rajesh
S. Patel,Thomas A. Wassick
申请号：US09114790
申请日：19980713
公开号：US06427324B1
公开日：
20020806
专利内容由知识产权出版社提供
专利附图：
摘要：A multilayer thin film structure having defined strap repair lines thereon and a method for repairing interconnections in the multilayer thin film structure (MLTF) and/or
making engineering changes (EC) are provided. The method comprises determining interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, defining the top surface metallization including a series of orthogonal X conductor lines and Y conductor lines using photoresist and lithography and additive or phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization.
申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION
代理机构：DeLio & Peterson, LLC
代理人：John J. Tomaszewski,Margaret A. Pepper
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