K3021P中文资料
M30302MEP-XXXFP中文资料
PRELIMINARYM16C/30P GroupSINGLE-CHIP 16-BIT CMOS MICROCOMPUTERNotice: This is not a final specification.Some parametric limits are subject to change.REJ03B0088-0080Rev.0.80Mar 18, 20051.OverviewThe M16C/30P Group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP.These single-chip microcomputers operate using sophisticated instructions featuring a high level of instruction efficiency. With 1M bytes of address space, they are capable of executing instructions at high speed. In addition, this microcomputer contains a multiplier and DMAC which combined with fast instruction processing capability, makes it suitable for control of various OA, communication, and industrial equipment which requires high-speed arithmetic/logic operations.1.1ApplicationsAudio, cameras, TV , home appliance, office/communications/portable/industrial equipment, etc.Specifications written in this manual are believed to be accurate,but are not guaranteed to be entirely free of error. Specifications in this manual may be changed for functional or performance improvements. Please make sure your manual is the latest edition.1.2Performance OutlineTable 1.1 lists Performance Outline of M16C/30P Group.NOTES:1.I 2C bus is a registered trademark of Koninklijke Philips Electronics N. V.2.IEBus is a registered trademark of NEC Electronics Corporation.e the M16C/30P on VCC1 = VCC2.Table 1.1Performance Outline of M16C/30P GroupItem PerformanceCPU Number of Basic Instructions 91 instructionsMinimum Instruction Execution Time 62.5ns(f(XIN)=16MHz, VCC1=VCC2=4.2 to 5.5V, no wait)100ns(f(XIN)=10MHz, VCC1=VCC2=2.7 to 5.5V, no wait)Operation Mode Single-chip Memory Space 1 Mbyte Memory Capacity See Table 1.2 Product ListPeripheral Function Port Input/Output : 87 pins, Input : 1 pin Multifunction Timer Timer A : 16 bits x 3 channels,Timer B : 16 bits x 3 channelsSerial Interface 3 channelsClock synchronous, UART, I 2C bus (1)1 channels IEBus (2)A/D Converter 10-bit A/D converter: 1 circuit, 18 channels DMAC 2 channels CRC Calculation Circuit CCITT-CRC Watchdog Timer 15 bits x 1 channel (with prescaler)Interrupt Internal: 20 sources, External: 7 sources, Software: 4sources, Priority level: 7 levelsClock Generating Circuit 2 circuitsMain clock generation circuit (*), Subclock generation circuit (*),(*)Equipped with a built-in feedback resistor.Electric Characteristics Supply Voltage VCC1=VCC2=3.0 to 5.5 V (f(XIN)=16MHz)VCC1=VCC2=2.7 to 5.5 V (f(XIN)=10MHz, no wait)Power Consumption 10 mA (VCC1=VCC2=5V, f(XIN)=16MHz)8 mA (VCC1=VCC2=3V, f(XIN)=10MHz)1.8 µA (VCC1=VCC2=3V, f(XCIN)=32kHz, wait mode)0.7 µA(VCC1=VCC2=3V, stop mode)Operating Ambient Temperature -20 to 85°C, -40 to 85°C Package 100-pin plastic mold QFP , LQFP1.3Block DiagramFigure 1.1 is a M16C/30P Group Block Diagram.1.4Product ListTable 1.2 lists the M16C/30P group products and Figure 1.2 shows the Type No., Memory Size, and Package.Table 1.2Product List As of Mar 2005 Type No.ROM Capacity RAM Capacity Package Type RemarksM30302MAP-XXXFP(D)96 Kbytes5 Kbytes100P6S-A MASK ROM version M30302MAP-XXXGP(D)100P6Q-AM30302MCP-XXXFP(D)128 Kbytes100P6S-AM30302MCP-XXXGP(D)100P6Q-AM30302MEP-XXXFP(D)192 Kbytes6 Kbytes100P6S-AM30302MEP-XXXGP(D)100P6Q-A(D): Under development(P): Under planning1.5Pin ConfigurationFigures 1.3 to 1.4 show the pin configurations (top view).1.6Pin DescriptionI : Input O : Output I/O : Input and outputTable 1.3Pin Description (1)Signal Name Pin Name I/O Type DescriptionPower supply input VCC1, VCC2VSS I Apply 2.7 to 5.5 V to the VCC1 and VCC2 pins and 0 V to the V SSpin. The VCC apply condition is that VCC1 = VCC2.Analog power supply input AVCC AVSS I Applies the power supply for the A/D converter. Connect the AVCCpin to VCC1. Connect the AVSS pin to VSS.Reset input RESET I The microcomputer is in a reset state when applying “L” to the thisVSSCNVSS I Connect this pin to VSS.External data bus width select input BYTE IMain clock input XIN I I/O pins for the main clock generation circuit. Connect a ceramic resonator or crystal oscillator between XIN and XOUT. To use the external clock, input the clock from XIN and leave XOUT open.Main clock output XOUT O Sub clock input XCIN I I/O pins for a sub clock oscillation circuit. Connect a crystaloscillator between XCIN and XCOUT. To use the external clock, input the clock from XCIN and leave XCOUT open.Sub clock output XCOUT O Clock output CLKOUT O The clock of the same cycle as fC, f8, or f32 is outputted.INT interrupt input INT0 to INT4I Input pins for the INT interrupt.NMI interrupt input NMI I Input pin for the NMI interrupt.Key input interrupt input KI0 to KI3I Input pins for the key input interrupt.Timer ATA0OUT to TA2OUTI/O These are timer A0 to timer A2 I/O pins. (except the output of TA0OUT for the N-channel open drain output.)TA0IN to TA2IN I These are timer A0 to timer A2 input pins.Timer BTB0IN to TB2IN I These are timer B0 to timer B2 input pins.Serial interfaceCTS0 to CTS2I These are send control input pins.RTS0 to RTS2 O These are receive control output pins.CLK0 to CLK2I/O These are transfer clock I/O pins.RXD0 to RXD2I These are serial data input pins.TXD0 to TXD2O These are serial data output pins. (except TXD2 for the N-channel open drain output.)CLKS1O This is output pin for transfer clock output from multiple pins function.I 2C mode SDA0 to SDA2I/O These are serial data I/O pins. (except SDA2 for the N-channel open drain output.)SCL0 to SCL2I/OThese are transfer clock I/O pins. (except SCL2 for the N-channel open drain output.)Table 1.4Pin Description (2)Signal Name Pin Name I/O Type DescriptionReferencevoltage inputVREF I Applies the reference voltage for the A/D converter.A/D converter AN0 to AN7,AN0_0 to AN0_7I Analog input pins for the A/D converter.ADTRG I This is an A/D trigger input pin.ANEX0I/O This is the extended analog input pin for the A/D converter, and is theoutput in external op-amp connection mode.ANEX1I This is the extended analog input pin for the A/D converter.I/O port P0_0 to P0_7,P1_0 to P1_7,P2_0 to P2_7,P3_0 to P3_7,P4_0 to P4_7,P5_0 to P5_7,P6_0 to P6_7,P7_0 to P7_7,P9_0 to P9_7,P10_0 to P10_7I/O8-bit I/O ports in CMOS, having a direction register to select an input or output.Each pin is set as an input port or output port. An input port can be setfor a pull-up or for no pull-up in 4-bit unit by program. (except P7_0 andP7_1 for the N-channel open drain output.)P8_0 to P8_4,P8_6, P8_7I/O I/O ports having equivalent functions to P0.Input port P8_5I Input pin for the NMI interrupt. Pin states can be read by the P8_5 bitin the P8 register.I : Input O : Output I/O : Input and output2.Central Processing Unit (CPU)Figure 2.1 shows the CPU registers. The CPU has 13 registers. Of these, R0, R1, R2, R3, A0, A1 and FB comprise a register bank. There are two register banks.2.1Data Registers (R0, R1, R2 and R3)The R0 register consists of 16 bits, and is used mainly for transfers and arithmetic/logic operations. R1 to R3 are the same as R0.The R0 register can be separated between high (R0H) and low (R0L) for use as two 8-bit data registers.R1H and R1L are the same as R0H and R0L. Conversely, R2 and R0 can be combined for use as a 32-bit data register (R2R0). R3R1 is the same as R2R0.2.2Address Registers (A0 and A1)The register A0 consists of 16 bits, and is used for address register indirect addressing and address register relative addressing. They also are used for transfers and logic/logic operations. A1 is the same as A0.In some instructions, registers A1 and A0 can be combined for use as a 32-bit address register (A1A0).2.3Frame Base Register (FB)FB is configured with 16 bits, and is used for FB relative addressing.2.4Interrupt Table Register (INTB)INTB is configured with 20 bits, indicating the start address of an interrupt vector table.2.5Program Counter (PC)PC is configured with 20 bits, indicating the address of an instruction to be executed.2.6User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)Stack pointer (SP) comes in two types: USP and ISP, each configured with 16 bits.Your desired type of stack pointer (USP or ISP) can be selected by the U flag of FLG.2.7Static Base Register (SB)SB is configured with 16 bits, and is used for SB relative addressing.2.8Flag Register (FLG)FLG consists of 11 bits, indicating the CPU status.2.8.1Carry Flag (C Flag)This flag retains a carry, borrow, or shift-out bit that has occurred in the arithmetic/logic unit.2.8.2Debug Flag (D Flag)The D flag is used exclusively for debugging purpose. During normal use, it must be set to “0”.2.8.3Zero Flag (Z Flag)This flag is set to “1” when an arithmetic operation resulted in 0; otherwise, it is “0”.2.8.4Sign Flag (S Flag)This flag is set to “1” when an arithmetic operation resulted in a negative value; otherwise, it is “0”.2.8.5Register Bank Select Flag (B Flag)Register bank 0 is selected when this flag is “0” ; register bank 1 is selected when this flag is “1”.2.8.6Overflow Flag (O Flag)This flag is set to “1” when the operation resulted in an overflow; otherwise, it is “0”.2.8.7Interrupt Enable Flag (I Flag)This flag enables a maskable interrupt.Maskable interrupts are disabled when the I flag is “0”, and are enabled when the I flag is “1”. The I flagis cleared to “0” when the interrupt request is accepted.M16C/30P Group 2. Central Processing Unit (CPU)2.8.8Stack Pointer Select Flag (U Flag)ISP is selected when the U flag is “0”; USP is selected when the U flag is “1”.The U flag is cleared to “0” when a hardware interrupt request is accepted or an INT instruction for softwareinterrupt Nos. 0 to 31 is executed.2.8.9Processor Interrupt Priority Level (IPL)IPL is configured with three bits, for specification of up to eight processor interrupt priority levels from level 0to level 7.If a requested interrupt has priority greater than IPL, the interrupt is enabled.2.8.10Reserved AreaWhen write to this bit, write “0”. When read, its content is indeterminate.M16C/30P Group 3. Memory3.MemoryFigure 3.1 is a Memory Map of the M16C/30P group. The address space extends the 1M bytes from address 00000h to FFFFFh.The internal ROM is allocated in a lower address direction beginning with address FFFFFh. For example, a 64-Kbyte internal ROM is allocated to the addresses from F0000h to FFFFFh.The fixed interrupt vector table is allocated to the addresses from FFFDCh to FFFFFh. Therefore, store the start address of each interrupt routine here.The internal RAM is allocated in an upper address direction beginning with address 00400h. For example, a 10-Kbyte internal RAM is allocated to the addresses from 00400h to 02BFFh. In addition to storing data, the internal RAM also stores the stack used when calling subroutines and when interrupts are generated. The SFR is allocated to the addresses from 00000h to 003FFh. Peripheral function control registers are located here. Of the SFR, any area which has no functions allocated is reserved for future use and cannot be used by users.The special page vector table is allocated to the addresses from FFE00h to FFFDBh. This vector is used by the JMPS or JSRS instruction. For details, refer to the M16C/60 and M16C/20 Series Software Manual.4.Special Function Register (SFR)SFR(Special Function Register) is the control register of peripheral functions. Tables 4.1 to 4.5 list the SFR information.Table 4.1SFR Information(1) (1)Address Register Symbol After Reset 0000h0001h0002h0003h0004h Processor Mode Register 0 (2)PM000h0005h Processor Mode Register 1PM100XXX0XXb0006h System Clock Control Register 0CM001001000b0007h System Clock Control Register 1CM100100000b0008h0009h Address Match Interrupt Enable Register AIER XXXXXX00b000Ah Protect Register PRCR XX000000b000Bh000Ch000Dh000Eh Watchdog Timer Start Register WDTS XXh000Fh Watchdog Timer Control Register WDC00XXXXXXb0010h Address Match Interrupt Register 0RMAD000h0011h00h0012h X0h0013h0014h Address Match Interrupt Register 1RMAD100h0015h00h0016h X0h0017h0018h0019h001Ah001Bh001Ch001Dh001Eh001Fh0020h DMA0 Source Pointer SAR0XXh0021h XXh0022h XXh0023h0024h DMA0 Destination Pointer DAR0XXh0025h XXh0026h XXh0027h0028h DMA0 Transfer Counter TCR0XXh0029h XXh002Ah002Bh002Ch DMA0 Control Register DM0CON00000X00b002Dh002Eh002Fh0030h DMA1 Source Pointer SAR1XXh0031h XXh0032h XXh0033h0034h DMA1 Destination Pointer DAR1XXh0035h XXh0036h XXh0037h0038h DMA1 Transfer Counter TCR1XXh0039h XXh003Ah003Bh003Ch DMA1 Control Register DM1CON00000X00b003Dh003Eh003FhNOTES:1.The blank areas are reserved and cannot be accessed by users.2.The PM00 and PM01 bits do not change at software reset.X : Nothing is mapped to this bitTable 4.2SFR Information(2) (1)Address Register Symbol After Reset 0040h0041h0042h0043h0044h INT3 Interrupt Control Register INT3IC XX00X000b0045h0046h UART1 BUS Collision Detection Interrupt Control Register U1BCNIC XXXXX000b 0047h UART0 BUS Collision Detection Interrupt Control Register U0BCNIC XXXXX000b 0048h0049h INT4 Interrupt Control Register INT4IC XX00X000b004Ah UART2 Bus Collision Detection Interrupt Control Register BCNIC XXXXX000b004Bh DMA0 Interrupt Control Register DM0IC XXXXX000b004Ch DMA1 Interrupt Control Register DM1IC XXXXX000b004Dh Key Input Interrupt Control Register KUPIC XXXXX000b004Eh A/D Conversion Interrupt Control Register ADIC XXXXX000b004Fh UART2 Transmit Interrupt Control Register S2TIC XXXXX000b 0050h UART2 Receive Interrupt Control Register S2RIC XXXXX000b 0051h UART0 Transmit Interrupt Control Register S0TIC XXXXX000b 0052h UART0 Receive Interrupt Control Register S0RIC XXXXX000b 0053h UART1 Transmit Interrupt Control Register S1TIC XXXXX000b 0054h UART1 Receive Interrupt Control Register S1RIC XXXXX000b 0055h Timer A0 Interrupt Control Register TA0IC XXXXX000b 0056h Timer A1 Interrupt Control Register TA1IC XXXXX000b 0057h Timer A2 Interrupt Control Register TA2IC XXXXX000b 0058h0059h005Ah Timer B0 Interrupt Control Register TB0IC XXXXX000b005Bh Timer B1 Interrupt Control Register TB1IC XXXXX000b005Ch Timer B2 Interrupt Control Register TB2IC XXXXX000b005Dh INT0 Interrupt Control Register INT0IC XX00X000b005Eh INT1 Interrupt Control Register INT1IC XX00X000b005Fh INT2 Interrupt Control Register INT2IC XX00X000b0060hto024Fh0250h0251h0252h0253h0254h0255h0256h0257h0258h0259h025Ah025Bh025Ch025Dh025Eh Peripheral Clock Select Register PCLKR00000011b025Fh0260hto0335h0336h0337h0338h0339h033Ah033Bh033Ch033Dh033Eh033FhNOTES:1.The blank areas are reserved and cannot be accessed by users.X : Nothing is mapped to this bitTable 4.3SFR Information(3) (1)Address Register Symbol After Reset 0340h0341h0342h0343h0344h0345h0346h0347h0348h0349h034Ah034Bh034Ch034Dh034Eh034Fh0350h0351h0352h0353h0354h0355h0356h0357h0358h0359h035Ah035Bh035Ch035Dh035Eh Interrupt Factor Select Register 2IFSR2A00XXXXXXb035Fh Interrupt Factor Select Register IFSR00h0360h0361h0362h0363h0364h0365h0366h0367h0368h0369h036Ah036Bh036Ch UART0 Special Mode Register 4U0SMR400h036Dh UART0 Special Mode Register 3U0SMR3000X0X0Xb036Eh UART0 Special Mode Register 2U0SMR2X0000000b036Fh UART0 Special Mode Register U0SMR X0000000b0370h UART1 Special Mode Register 4U1SMR400h0371h UART1 Special Mode Register 3U1SMR3000X0X0Xb0372h UART1 Special Mode Register 2U1SMR2X0000000b0373h UART1 Special Mode Register U1SMR X0000000b0374h UART2 Special Mode Register 4U2SMR400h0375h UART2 Special Mode Register 3U2SMR3000X0X0Xb0376h UART2 Special Mode Register 2U2SMR2X0000000b0377h UART2 Special Mode Register U2SMR X0000000b0378h UART2 Transmit/Receive Mode Register U2MR00h0379h UART2 Bit Rate Generator U2BRG XXh037Ah UART2 Transmit Buffer Register U2TB XXh037Bh XXh037Ch UART2 Transmit/Receive Control Register 0U2C000001000b037Dh UART2 Transmit/Receive Control Register 1U2C100000010b037Eh UART2 Receive Buffer Register U2RB XXh037Fh XXhNOTES:1.The blank areas are reserved and cannot be accessed by users.X : Nothing is mapped to this bitTable 4.4SFR Information(4) (1)Address Register Symbol After Reset 0380h Count Start Flag TABSR000XX000b0381h Clock Prescaler Reset Fag CPSRF0XXXXXXXb 0382h One-Shot Start Flag ONSF00XXX000b0383h Trigger Select Register TRGSR XXXX0000b 0384h Up-Down Flag UDF XX0XX000b (2) 0385h0386h Timer A0 Register TA0XXh0387h XXh0388h Timer A1 Register TA1XXh0389h XXh038Ah Timer A2 Register TA2XXh038Bh XXh038Ch038Dh038Eh038Fh0390h Timer B0 Register TB0XXh0391h XXh0392h Timer B1 Register TB1XXh0393h XXh0394h Timer B2 Register TB2XXh0395h XXh0396h Timer A0 Mode Register TA0MR00h0397h Timer A1 Mode Register TA1MR00h0398h Timer A2 Mode Register TA2MR00h0399h039Ah039Bh Timer B0 Mode Register TB0MR00XX0000b039Ch Timer B1 Mode Register TB1MR00XX0000b039Dh Timer B2 Mode Register TB2MR00XX0000b039Eh039Fh03A0h UART0 Transmit/Receive Mode Register U0MR00h03A1h UART0 Bit Rate Generator U0BRG XXh03A2h UART0 Transmit Buffer Register U0TB XXh03A3h XXh03A4h UART0 Transmit/Receive Control Register 0U0C000001000b03A5h UART0 Transmit/Receive Control Register 1U0C100000010b03A6h UART0 Receive Buffer Register U0RB XXh03A7h XXh03A8h UART1 Transmit/Receive Mode Register U1MR00h03A9h UART1 Bit Rate Generator U1BRG XXh03AAh UART1 Transmit Buffer Register U1TB XXh03ABh XXh03ACh UART1 Transmit/Receive Control Register 0U1C000001000b03ADh UART1 Transmit/Receive Control Register 1U1C100000010b03AEh UART1 Receive Buffer Register U1RB XXh03AFh XXh03B0h UART Transmit/Receive Control Register 2UCON X0000000b03B1h03B2h03B3h03B4h03B5h03B6h03B7h03B8h DMA0 Request Factor Select Register DM0SL00h03B9h03BAh DMA1 Request Factor Select Register DM1SL00h03BBh03BCh CRC Data Register CRCD XXh03BDh XXh03BEh CRC Input Register CRCIN XXh03BFhNOTES:1.The blank areas are reserved and cannot be accessed by users.2.Bit 5 in the Up-down flag is “0” by reset. However, The values in these bits when read are indeterminate.X : Nothing is mapped to this bitTable 4.5SFR Information(5) (1)Address Register Symbol After Reset 03C0h A/D Register 0AD0XXh03C1h XXh03C2h A/D Register 1AD1XXh03C3h XXh03C4h A/D Register 2AD2XXh03C5h XXh03C6h A/D Register 3AD3XXh03C7h XXh03C8h A/D Register 4AD4XXh03C9h XXh03CAh A/D Register 5AD5XXh03CBh XXh03CCh A/D Register 6AD6XXh03CDh XXh03CEh A/D Register 7AD7XXh03CFh XXh03D0h03D1h03D2h03D3h03D4h A/D Control Register 2ADCON2XXX000X0b03D5h03D6h A/D Control Register 0ADCON0000X0XXXb03D7h A/D Control Register 1ADCON100000XXXb03D8h03D9h03DAh03DBh03DCh03DDh03DEh03DFh03E0h Port P0 Register P0XXh03E1h Port P1 Register P1XXh03E2h Port P0 Direction Register PD000h03E3h Port P1 Direction Register PD100h03E4h Port P2 Register P2XXh03E5h Port P3 Register P3XXh03E6h Port P2 Direction Register PD200h03E7h Port P3 Direction Register PD300h03E8h Port P4 Register P4XXh03E9h Port P5 Register P5XXh03EAh Port P4 Direction Register PD400h03EBh Port P5 Direction Register PD500h03ECh Port P6 Register P6XXh03EDh Port P7 Register P7XXh03EEh Port P6 Direction Register PD600h03EFh Port P7 Direction Register PD700h03F0h Port P8 Register P8XXh03F1h Port P9 Register P9XXh03F2h Port P8 Direction Register PD800X00000b03F3h Port P9 Direction Register PD900h03F4h Port P10 Register P10XXh03F5h03F6h Port P10 Direction Register PD1000h03F7h03F8h03F9h03FAh03FBh03FCh Pull-Up Control Register 0PUR000h03FDh Pull-Up Control Register 1PUR100h03FEh Pull-Up Control Register 2PUR200h03FFh Port Control Register PCR00hNOTES:1.The blank areas are reserved and cannot be accessed by users.X : Nothing is mapped to this bit5.Electrical CharacteristicsTable 5.1Absolute Maximum RatingsSymbol Parameter Condition Rated Value Unit V CC Supply Voltage(V CC1=V CC2)V CC1=V CC2=AV CC−0.3 to 6.5V AV CC Analog Supply Voltage V CC1=V CC2=AV CC−0.3 to 6.5V V I Input Voltage RESET, CNVSS, BYTE,P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_7,P9_0 to P9_7, P10_0 to P10_7,VREF, XIN−0.3 to V CC+0.3VP7_0, P7_1−0.3 to 6.5VV O OutputVoltage P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4,P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7,XOUT−0.3 to V CC+0.3V P7_0, P7_1−0.3 to 6.5VP d Power Dissipation−40°C<T opr≤85°C300mW T opr OperatingAmbientTemperatureWhen the Microcomputer is Operating−20 to 85 / −40 to 85°C T stg Storage Temperature−65 to 150°CNOTES:1.Referenced to V CC1 = V CC2 =2.7 to 5.5V at T opr = −20 to 85°C / −40 to 85°C unless otherwise specified.2.The Average Output Current is the mean value within 100ms.3.The total I OL(peak) for ports P0, P1, P2, P8_6, P8_7, P9 and P10 must be 80mA max. The total I OL(peak) for ports P3, P4, P5,P6, P7 and P8_0 to P8_4 must be 80mA max. The total I OH(peak) for ports P0, P1, and P2 must be −20mA max. The total I OH(peak) for ports P3, P4 and P5 must be −40mA max. The total I OH(peak) for ports P6, P7, and P8_0 to P8_4 must be −40mA max.The total I OH(peak) for ports P8_6, P8_7 and P9 must be −40mA max. Set Average Output Current to 1/2 of peak .4.Relationship between main clock oscillation frequency, and supply voltage.Table 5.2Recommended Operating Conditions (1)Symbol ParameterStandardUnit Min.Typ.Max.V CC Supply Voltage (V CC1=V CC2) 2.75.0 5.5V AV CC Analog Supply Voltage V CC V V SS Supply Voltage 0V AV SS Analog Supply Voltage 0V V IHHIGH Input VoltageP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_7,P9_0 to P9_7, P10_0 to P10_7,XIN, RESET, CNVSS, BYTE 0.8V CCV CC VP7_0, P7_10.8V CC6.5V V ILLOW InputVoltageP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7,P9_0 to P9_7, P10_0 to P10_7,XIN, RESET, CNVSS, BYTE0.2V CCVI OH(peak)HIGH Peak Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7−10.0mA I OH(avg)HIGH Average Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7−5.0mA I OL(peak)LOW Peak Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_710.0mA I OL(avg)LOW Average Output CurrentP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_75.0mA f(XIN)Main Clock Input Oscillation Frequency (4)V CC =4.2V to 5.5V 016MHz V CC =2.7V to 4.2V 04×V CC −0.8MHz f(XCIN)Sub-Clock Oscillation Frequency 32.76850kHz f(BCLK)CPU Operation Clock16MHzNOTES:1.Referenced to V CC =AV CC =V REF =3.3 to 5.5V, V SS =AV SS =0V at T opr = −20 to 85°C / −40 to 85°C unless otherwise specified.2.φAD frequency must be 10 MHz or less.3.When sample & hold function is disabled, φAD frequency must be 250 kHz or more, in addition to the limitation in Note 2.When sample & hold function is enabled, φAD frequency must be 1MHz or more, in addition to the limitation in Note 2.Table 5.3A/D Conversion Characteristics (1)Symbol ParameterMeasuring ConditionStandard Unit Min.Typ.Max.−ResolutionV REF =V CC 10Bits INLIntegral Non-Linearity Error10bitV REF =V CC =5V AN0 to AN7 input,AN0_0 to AN0_7 input, ANEX0, ANEX1 input ±5LSBV REF =V CC =3.3VAN0 to AN7 input,AN0_0 to AN0_7 input, ANEX0, ANEX1 input ±7LSB8bitV REF =V CC =3.3V ±2LSB −Absolute Accuracy 10bitV REF =V CC =5V AN0 to AN7 input,AN0_0 to AN0_7 input, ANEX0, ANEX1 input ±5LSBV REF =V CC =3.3VAN0 to AN7 input,AN0_0 to AN0_7 input, ANEX0, ANEX1 input±7LSB8bitV REF =V CC =3.3V ±2LSB −Tolerance Level Impedance 3k ΩDNL Differential Non-Linearity Error ±2LSB −Offset Error ±5LSB −Gain Error ±5LSB R LADDER Ladder ResistanceV REF =V CC1040k Ωt CONV 10-bit Conversion Time, Sample & Hold Function AvailableV REF =V CC =5V, φAD=10MHz 3.3µs t CONV 8-bit Conversion Time, Sample & Hold Function Available V REF =V CC =5V, φAD=10MHz2.8µs t SAMP Sampling Time 0.3µs V REF Reference Voltage3.0V CC V V IAAnalog Input VoltageV REF VTable 5.4Power Supply Circuit Timing CharacteristicsSymbol Parameter Measuring ConditionStandardUnit Min.Typ.Max.t d(P-R)Time for Internal Power Supply StabilizationDuring Powering-OnV CC=2.7V to 5.5V2ms t d(R-S)STOP Release Time1500µs t d(W-S)Low Power Dissipation Mode Wait ModeRelease Time1500µsNOTES:1.Referenced to V CC1=V CC2=4.2 to 5.5V, V SS = 0V at T opr = −20 to 85°C / −40 to 85°C, f(XIN)=16MHz unless otherwisespecified.2.With one timer operated using fC32.3.This indicates the memory in which the program to be executed exists.Table 5.5Electrical Characteristics (1)Symbol ParameterMeasuring ConditionStandard UnitMin.Typ.Max.V OHHIGH Output Voltage P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7I OH =−5mA V CC −2.0V CCVV OHHIGH Output VoltageP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7I OH =−200µA V CC −0.3V CC VV OH HIGH Output Voltage XOUT HIGHPOWER I OH =−1mA V CC −2.0V CC V LOWPOWER I OH =−0.5mA V CC −2.0V CCHIGH Output Voltage XCOUTHIGHPOWER With no load applied 2.5VLOWPOWERWith no load applied 1.6V OLLOW Output Voltage P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7I OL =5mA2.0VV OLLOW Output VoltageP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7I OL =200µA0.45VV OL LOW Output Voltage XOUT HIGHPOWER I OL =1mA 2.0V LOWPOWER I OL =0.5mA2.0LOW Output Voltage XCOUTHIGHPOWER With no load applied 0VLOWPOWERWith no load appliedV T+-V T-HysteresisTA0IN to TA2IN, TB0IN to TB2IN,INT0 to INT4, NMI, ADTRG, CTS0 to CTS2, CLK0 to CLK2, TA0OUT to TA2OUT, KI0 to KI3, RXD0 to RXD2, SCL0 to SCL2, SDA0 to SDA20.2 1.0V V T+-V T-Hysteresis RESET 0.2 2.5V V T+-V T-HysteresisXIN0.20.8VI IHHIGH Input Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, XIN, RESET, CNVSS, BYTE V I =5V5.0µAI IL LOW Input CurrentP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, XIN, RESET, CNVSS, BYTEV I =0V−5.0µAR PULLUP Pull-UpResistanceP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7V I =0V 3050170k ΩR fXIN Feedback Resistance XIN 1.5M ΩR fXCIN Feedback Resistance XCIN 15M ΩV RAM RAM Retention Voltage At stop mode2.0V I CCPower Supply Current(V CC1=V CC2=4.2V to 5.5V)In single-chip mode, the output pins are open and other pins are V SSMask ROM f(XIN)=16MHz No division10mA f(XCIN)=32kHz Low power dissipation mode,ROM (3)25µA f(XCIN)=32kHz Wait mode (2),Oscillation capacity High 7.5µA f(XCIN)=32kHz Wait mode (2),Oscillation capacity Low 2.0µAStop mode Topr =25°C0.83.0µA。
LT3021中文资料
LT3021 - 500mA、低电压、非常低压差线性稳压器特点•V IN范围：0.9V 至10V•压差电压：160mV (典型值)•输出电流：500mA•可调输出(V REF = V OUT(MIN) = 200mV)•固定输出电压：1.2V、1.5V、1.8V•可在采用低ESR、陶瓷输出电容器(最小电容值为3.3μF) 时实现稳定•0.2% 负载调整率(从0mA 至500mA)•静态电流：120μA (典型值)•停机模式中的典型静态电流为3μA•电流限制保护功能•反向电池保护•无反向电流•具迟滞的热限制•16 引脚DFN (5mm x 5mm) 和8 引脚SO 封装典型应用•低电流稳压器•电池供电型系统•蜂窝电话•寻呼机•无线调制解调器描述LT®3021 是一款非常低压差电压(VLDO TM) 线性稳压器，工作输入电源电压低至0.9V。
该器件可提供500mA 的输出电流和一个160mV 的典型压差电压。
LT3021 非常适合于低输入电压至低输出电压应用，并提供了可与开关稳压器相媲美的电效率。
LT3021 稳压器采用低ESR、小至3.3μF 的陶瓷输出电容器优化了稳定性和瞬态响应。
LT3021 的其他特点包括0.05% 的典型电压调整率和0.2% 的典型负载调整率。
在停机模式中，静态电流通常减小至3μA。
内部保护电路包括反向电池保护、电流限制、具迟滞的热限制和反向电流保护。
LT3021可被用作一款输出可调型器件，并具有一个低至200mV 基准的输出范围。
另外，该器件还提供了 3 种固定输出电压，即：1.2V、1.5V 和1.8V。
LT3021 稳压器采用具裸露衬垫的扁平(高度仅0.75mm)、16 引脚(5mm x 5mm) DFN 封装和8 引脚SO 封装。
1.8V至1.5V, 500mA VLDO调整器。
最低输入电压最大绝对参数：输入脚电压 ............................................... ±10V输出脚电压 ................................................±10V输入到输出不同电压……………………………… ........................±10VADJ/SENSE Pin Voltage ....................................... ±10V Pin Voltage ...................................... ±10V输出短路电流持续时间......................... 不确定操作温度范围 (E, I 等级)(Notes 2, 3) .................–40°C 到 125°C 存储温度范围 DH .....................................–65°C to 125°C S8 ................................................–65°C to 150°C 铅温 (焊接, 10秒, S8) ............ 300°C需订购信息电气特性：表示在整个操作过程中应用的特殊金属离子，其它特殊的金属离子在T J = 25°C 温度范围内.符号条件最小值典型最大值 单位最小输入电压 (Notes 5,14) I LOAD = 500mA, T J > 0°C I LOAD = 500mA, T J < 0°C0.9 0.9 1.05 1.10 V V ADJ 脚电压 (Notes 4, 5)V IN = 1.5V, I LOAD = 1mA1.15V < V IN < 10V, 1mA < I LOAD < 500mA196193 200 200204 206mV mV额定输出电压 (Note 4)LT3021-1.2 V IN = 1.5V, I LOAD = 1mA 1.5V < V IN < 10V, 1mA < I LOAD < 500mA 1.176 1.157 1.200 1.200 1.224 1.236 V V LT3021-1.5 V IN = 1.8V, I LOAD = 1mA 1.8V < V IN < 10V, 1mA < I LOAD < 500mA 1.470 1.447 1.500 1.500 1.5301.545 V V LT3021-1.8 V IN =2.1V, I LOAD = 1mA 2.1V < V IN < 10V, 1mA < I LOAD < 500mA1.764 1.737 1.800 1.800 1.8361.854 V V 线性控制 (Note 6)LT3021 ΔV IN = 1.15V to 10V, I LOAD = 1mALT3021-1.2 ΔV IN = 1.5V to 10V, I LOAD = 1mALT3021-1.5 ΔV IN = 1.8V to 10V, I LOAD = 1mALT3021-1.8 ΔV IN = 2.1V to 10V, I LOAD = 1mA–1.75–10.5 –13 –15.80 0 0 0+1.75 10.5 13 15.8mV mV mV mV负载控制 (Note 6)LT3021 V IN = 1.15V, ΔI LOAD = 1mA to 500mALT3021-1.2 V IN = 1.5V, ΔI LOAD = 1mA to 500mALT3021-1.5 V IN = 1.8V, ΔI LOAD = 1mA to 500mALT3021-1.8 V IN = 2.1V, ΔI LOAD = 1mA to 500mA–2 –6 –7.5 –90.4 1 1.5 2 2 6 7.5 9 mV mV mV mV 压差 (Notes 7, 12)I LOAD = 10mA I LOAD = 10mA 45 75 110 mV mV I LOAD = 500mA I LOAD = 500mA155 190 285 mV mV GND 脚电流 V IN = V OUT(NOMINAL) + 0.4V(Notes 8, 12) I LOAD = 0mA I LOAD = 10mA I LOAD = 100mA I LOAD = 500mA110 920 2.25 6.20250 10μA μA mA mA 输出电压噪声 C OUT = 4.7μF, I LOAD = 500mA, BW = 10Hz to 100kHz, V OUT = 1.2V 300μV RMS ADJ 脚偏置电流 V ADJ = 0.2V, V IN = 1.2V (Notes 6, 9) 20 50 nA 关闭阈值V OUT = Off to On V OUT = On to Off0.250.61 0.610.9V V的时候是100%测试的。
BK2新产品培训
注：对于符合公差带E的产品制造厂应增加字母E加以指示
1
BK2M智能型
1、 主电路进线接线端子 2、 本体辅助接线端子 3、 电磁铁和脱扣器电源端子 Ⅱ 产 品 介 绍 4、 合闸、分闸指示窗口 5、 手柄断开位置锁 6、 手柄
2 3
4 5
7 8 9 10
17
6
7、 复位试验按钮
8、 智能脱扣器 9、 功能端子接线端 10、主体出线接线端子
Ⅰ
基 础 知 识
护开关电器》。
◎电气符号
2
功能特点
采用模块化单一结构型式，将断路器、接触器、 热继电器、隔离开关等多元器件集成。
◎具有远距离自动控制和就地直接人力控制功能
Ⅰ
基 础 知 识
◎具有面板指示及机电信号报警功能 ◎具有过压欠压保护功能 ◎具有断相缺相保护功能 ◎具有协调配合的时间－电流保护特性 （具有反时限、定时限和瞬时三段保护特性）
20
2
BK2附件
1、主体开关
1
3
2、隔离模块
Ⅱ 产 品 介 3、外置辅助模块 4、外挂信报模块 5、可逆模块
4
绍
（大图）
5
21
BK2隔离模块
◎实现主电路安全、可视的隔离断点，标配1组隔离 触头。
◎可与产品本体配套安装（进线侧），亦可独立安装。
Ⅱ 产 品 介 绍 ◎产品本体分断状态下，方可进行隔离模块的安全操 作，可实现与产品本体机械联锁，隔离模块连接和断 开位置均可加锁防护。 ◎订货单号：WKGL1。
不够用时，可增选此模块，固定于产品本体
Ⅱ 产 品 介 绍
左侧（上） ◎外置辅助模块提供两种形式： 两开一闭的辅助接点 一开两闭的辅助接点 ◎订货单号：WKFZ21或WKFZ12
施乐复印机3030维修手册（中文）：第5章零件表
施乐复印机3030维修⼿册（中⽂）：第5章零件表第5章零件表⽬录5.1 前⾔ (2)5.1.1 零件表的⽤法 (2)5.1.2 使⽤需知 (2)5.1.3 板的构成 (2)5.1.4 术语/符号的说明 (2)5.2 PARTS LIST (4)PL 1 DRIVE (4)PL1.1 Drive-Paper (4)PL1.2 Drive-Deve. Xero (5)PL 2 PAPER Hand (6)PL2.1 Paper Hand Component (6)PL2.2 Lower Baffle Component (7)PL2.3 Manual Feed Baffle-3, Vertical Front Baffle Component (8)PL2.4 Horizontal Lower Baffle Component (9)PL2.5 Horizontal Lower Baffle Component (10)PL 3 IIT (11)PL 3.1 IIT Document Transport (11)PL3.2 IIT-Electrical (12)PL3.3 Upper Document Transport (13)PL 4 LPH (14)PL4.1 LPH Accessory (14)PL 5 DEVE (15)PL5.1 Developer Assembly Accessory (15)PL5.2 Developer Assembly Component (16)PL 6 XERO (17)PL6.1 XERO Accessory (17)PL6.2 Xero Module Component (18)PL6.3 BTR Housing Component (19)PL6.4 Xero Housing Component (20)PL 7 Fuser (21)PL7.1 Fuser Assembly Accessory (21)PL7.2 Fuser Assembly Component-Roll (22)PL7.3 Fuser Assembly Component-Chute (23)PL7.4 Upper Exit Baffle Component (24)PL7.5 Thermistor Plate Component (25)PL 8 ELEC (26)PL8.1 Electrical-Rear 1 (26)PL8.2 Electrical-Rear 2 (27)PL8.3 Electrical-Right Lower (28)PL8.4 Electrical-Right Upper (29)PL8.5 Electrical-Left (30)PL8.6 Consol Component (31)PL9 Cover (32)PL9.1 Cover-Front, Right, Top (32)PL9.2 Cover-Rear, Left (33)PL9.3 Document Shelf Component (34)PL9.4 Document Shelf Component (35)PL 10 RFC (36)PL10.1 2-RFC Type Accessory (36)PL10.2 1-RFC Type Accessory (37)PL10.3 RFC A-Type Accessory (38)PL10.4 RFC B-Type Accessory (39)PL10.5 RFC Component-Paper Feed (40)PL10.6 RFC Component-Latch , Roll Paper Tube Support (41)PL10.7 Paper Heater / Paper Size Sensor Housing Component (42)PL10.8 Take Away Baffle Component (43)PL 11 Frame (44)PL 11.1 Swing Frame Latch Accessory (44)PL11.2 Swing Frame Latch Component (45)5.3 Adjustment/Consumables Area Code (47)第5章零件表5.1 前⾔ 5-25.1 前⾔5.1.1 零件表的⽤法零件表包含关于备⽤零件的信息。
计算机字符集
55
7
56
8
57
9
58
:
59
;
60
<
61
=
62
>
63
?
64
@
65
A
66
B
67
C
68
D
69
E
70
F
71
G
72
H
73
I
74
J
75
K
76
L
77
M
78
N
79
O
80
P
81
Q
82
R
83
S
84
T
85
U
86
V
87
W
88
X
89
Y
90
Z
91
[
92
\
93
]
94
^
95
_
96
`
97
a
98
b
99
c
100
d
101
e
102
f
103
GB2312的编码范围是0xA1A1-0x7E7E，去掉未定义的区域之后可以理解为实际编码范围是0xA1A1-0xF7FE。
上面这句有误，应该说GB2312的每一个汉字由两个字节构成，其中每一个字节的范围都在0xA1~0xFE，正好每一个字节都有94个编码范围，与区位码个数完全对应。
EUC-CN可以理解为GB2312的别名，和GB2312完全相同。
GBK的整体编码范围是为：高字节范围是0×81-0xFE，低字节范围是0x40-7E和0x80-0xFE，不包括低字节是0×7F的组合。
NTP30N20中文资料
IDSS
mAdc
−
−
5.0
−
−
125
IGSS
−
−
± 100 nAdc
VGS(th)
Vdc
2.0
2.9
4.0
−
−8.9
−
mV/°C
Static Drain−to−Source On−State Resistance (VGS = 10 Vdc, ID = 15 Adc) (VGS = 10 Vdc, ID = 10 Adc) (VGS = 10 Vdc, ID = 15 Adc, TJ = 175°C)
VSD
trr ta tb QRR
−
75
100
nC
−
48
−
−
20
−
−
16
−
−
32
−
−
0.91
1.1
Vdc
−
0.80
−
−
230
−
ns
−
140
−
−
85
−
−
1.85
−
mC
2
ID, DRAIN CURRENT (AMPS)
RDS(on), DRAIN−TO−SOURCE RESISTANCE (W)
Drain Current − Continuous @ TA 25°C − Continuous @ TA 100°C − Pulsed (Note 1)
Total Power Dissipation @ TA = 25°C Derate above 25°C
VDSS VDGR
VGS VGSM
ID ID IDM PD
8位AD转换器MK7A21P资料
8Bit Microcontroller with 8bit ADC12007/6/15 Rev.17概述MK7A21P 是带8位A/D 转换器的RISC 高性能8位微控制器。
它内部包含2K 字节的一次性可编程只读存储器、128字节数据存储器、定时器/计数器、捕捉、中断、LVR （低电压复位）、I/O 口和PWM 输出。
1. 基本特性● ROM ：2K ×16 bits● RAM ：37×8 bits （特殊寄存器）+ 128×8 bits （一般寄存器） ● 椎栈：8级● 一个指令周期由两个系统时钟组成 ● 复位模式：(a) 上电复位 (b) 低电压复位(c) RESETB/PC1（如果设置成复位脚位）输入一个负脉冲 (d) 看门狗定时器计数溢出复位 ● 双时钟模式- 外部RC 或晶振振荡器 - 内部4MHz RC 振荡器 ● 定时器/计数器- TM1：16-bit ，捕捉 & 定时器- TM2：8-bit ，PWM （period ）& 定时器 - TM3：8-bit ，PWM （duty ）& 定时器 - TO ：TM2（PWM ）时钟输出● 看门狗定时器：芯片内WTD 是基于一个内部RC 振荡器（仅WDT 使用）。
有8个周期可供选择。
使用者可通过使用预分频器来延长WDT 溢出周期。
● 中断结果：(a) 外部中断（PA7~PA0）(b) 内部定时器/结果计数器中断（TM1~TM3） (c) ADC 结束转换中断 ● I/O 口：16脚位 ● PWM ：一个通道● ADC ：最多8-bit 及4通道，至少7-bit 精度。
它能在转换模式或比较模式下使用 ● 唤醒模式：A 口（PA7~PA0）脚位变化唤醒8Bit Microcontroller with 8bit ADC2. 图表RESETOSC 1OSC 2PA 0 ~7 PB 0 ~3VDDGNDPWMEXT _CLK TO8Bit Microcontroller with 8bit ADC3. 脚位定义 & 管脚分配封装类型：18脚DIP 或SOPPA4/EXT_CLK PA5OSC2/PC3OSC1/PC2VDDPB2/AN2PB1/AN1PB0/AN0VSS RESETB/PC1PWM/PC0PA3/TOPA2PB3/AN3封装类型：14脚DIP 或SOP8Bit Microcontroller with 8bit ADC4. 脚位说明脚位名称 I/O说 明PA0~2 PA5~7I/O1. I/O 口（输入模式下会有上拉电阻）2. 脚位改变时唤醒（选择）3. 外部中断输入（选择）PA3/TO I/O1. I/O 口（输入模式下会有上拉电阻）2. 脚位改变时唤醒（选择）3. 外部中断输入（选择）4. TO 时钟输出PA4/EXT_CLK I/O1. I/O 口（输入模式下会有上拉电阻）2. EXT_CLK 时钟输入（或捕捉输入）3. 脚位改变时唤醒（选择）4. 外部中断输入（选择）PB3/AN3 I/OPB2/AN2 I/O PB1/AN1 I/O PB0/AN0 I/O1. I/O 口（输入模式下会有上拉电阻）2. 相似体输入 PWM/PC0 I/O1. I/O 口（输入模式下会有上拉电阻）2. PWM 输出 RESETB/PC1 I1. 复位脚位2. 输入口OSC1/PC2 I, I/O1. 振荡器输入2. I/O 口（输入模式下会有上拉电阻） OSC2/PC3 O, I/O1. 振荡器输出2. I/O 口（输入模式下会有上拉电阻） VDD P 电源输入 VSS P 接地输入8Bit Microcontroller with 8bit ADC5. 存储器映象MK7A21P芯片带有两种存储器，分别是程序存储器（ROM）和数据存储器（RAM）。
LNK302-306中文资料
D Package (SO-8C)
S1 S2 BP 3 FB 4
8S 7S
5D
3a
BP 1 FB 2
D4
8S 7S 6S 5S
3b
图 3. 引脚布局
PI-5422-041509
LinkSwitch-TN 功能描述
LinkSwitch-TN在一个器件上结合了一个高压功率MOSFET 开关及一个电源控制器。与传统的PWM(脉宽调制)控制器 不同，LinkSwitch-TN采用简单的开/关控制器来调节输出 电压。LinkSwitch-TN的控制器包括一个振荡器、反馈电 路(检测及逻辑电路)、5.8 V稳压电路、旁路引脚欠压电 路、过温保护、频率调制、限流电路、前沿消隐电路及 一个700 V的功率MOSFET。LinkSwitch-TN还另外集成了 用于自动重启动的保护电路。
降低系统成本 • 具有精确的限流点且工作在66 kHz — 可使用普通的
1 mH 电感达到120 mA的输出电流 • 严格的参数公差与微小的可以忽略不计的温度漂移 • 高达700 V的击穿电压提供了良好的抵抗输入浪涌的
能力 • 频率调制技术极大地降低了EMI(~10 dB) — 降低了
EMI滤波器的成本 • 很高的过温关断保护点(最小+135 °C)
图 5. 采用LinkSwitch-TN器件、宽电压输入12 V、120 mA恒压输出的电源
4
版本J 04/09
LNK302/304-306
AC INPUT
RF1
D3
L2
C4
C5
D4
LinkSwitch-TN
D
FB
R1 BP
S
S
C1 R3
C3
中文摩斯编码表
中文摩斯编码表我把全部中文电报码给你发在下面,你最好打印下来.以便随时可以查阅:、9977 。
9975 .9978 .9992 .9993 —9994 —9995 (9991)‘9984 ’9985 “9986 ”9987 《9996 》9997 ×9973 ×9999÷9974 □9998 Ⅰ9941 Ⅱ9942 Ⅲ9943 Ⅳ9944 Ⅴ9945 Ⅵ9946Ⅶ9947 Ⅷ9948 Ⅸ9949 Ⅹ9950 ！9982 （9988 ）9989 ＋9971，9976 －9972 ／9970 09960 19961 29962 39963 4996459965 69966 79967 89968 99969 ：9980 ；9979 ＝99839981 A9874 B9875 C9876 D9877 E9878 F9879 G9880H9881 I9882 J9883 K9884 L9885 M9886 N9887 O9888O9800 P9889 Q9890 R9891 S9892 T9893 U9894 V9895W9896 X9897 Y9898 Z9899 Ω9959 А9768 Б9769 В9770Г9771 Д9772 Е9773 Ж9774 З9775 И9776 Й9799 К9777Л9778 М9779 Н9780 О9781 П9782 Р9783 С9784 Т9785У9786 Ф9787 Х9788 Ц9789 Ч9790 Ш9791 Щ9792 Ъ9796Ы9797 Ь9798 Э9793 Ю9794 Я9795 ㄅ9720 ㄆ9721 ㄇ9722ㄈ9723 ㄉ9724 ㄊ9725 ㄋ9726 ㄌ9727 ㄍ9728 ㄎ9729 ㄏ9730ㄐ9731 ㄑ9732 ㄒ9733 ㄓ9734 ㄔ9735 ㄕ9736 ㄖ9737 ㄗ9738ㄘ9739 ㄙ9740 ㄚ9744 ㄛ9745 ㄜ9746 ㄝ9747 ㄞ9748 ㄟ9749ㄠ9750 ㄡ9751 ㄢ9752 ㄣ9753 ㄤ9754 ㄥ9755 ㄦ9756 ㄧ9741ㄨ9742 ㄩ9743 ━9990 啊0759 阿7093 埃1002 挨2179 哎0740唉0780 哀0755 皑4114 癌4074 蔼5676 矮4253 艾5337 碍4293爱1947 隘7137 鞍7254 氨8637 安1344 俺0219 按2174 暗2542岸1489 胺5143 案2714 肮7542 昂2491 盎4138 凹0425 敖2407熬3581 翱5063 袄5984 傲0277 奥1159 懊2020 澳3421 芭5359捌2193 扒2091 叭0665 吧0721 笆4576 八9908 八9808 八0360八9708 疤4002 巴1572 拔2149 跋6405 靶7249 把2116 耙5090坝8218 坝1056 霸7218 霸6011 罢5007 爸3640 白4101 柏2672百4102 摆2369 佰0184 败2408 拜2157 稗4458 斑2432 班3803搬2289 扳2104 般5301 颁7317 板2647 版3652 扮2101 拌2142伴0133 瓣3904 半0584 办6586 绊4810 邦6721 帮1620 梆2735榜2831 膀5218 绑4834 棒2761 磅4319 蚌5732 镑6967 傍0266谤6196 苞5383 胞5165 包0545 褒5988 剥0475 薄5631 雹7192保0202 堡1027 饱7394 宝1405 抱2128 报1032 暴2552 豹6283鲍7637 爆3915 爆3615 杯2637 碑4301 悲1896 卑0585 北0554辈6543 背5154 贝6296 倍0223 狈3709 备0271 惫1994 焙3538被5926 奔1149 苯0058 本2609 笨4570 崩1514 绷4855 甭8005泵3119 蹦6498 迸6618 逼6656 鼻7865 比3024 鄙6766 笔4581彼1764 碧4310 蓖5557 蔽5599 毕3968 毙2426 毖3025 币1578庇1642 痹4036 闭7028 敝2411 弊1705 必1801 辟6582 壁1084 臂5242 避6699 陛7103 鞭7267 边6708 编4882 贬6312 扁2078 便0189 变6239 卞0593 辨6587 辩6589 辫4947 遍6664 标2871 彪1753 膘9136 表5903 鳖7667 别0446 瘪4085 彬1755 斌2430 濒3464 滨3453 宾6333 摈2363 兵0365 冰0393 柄2671 丙0014 秉4426 饼7399 炳3521 病4016 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们0226 萌5492 蒙5536 檬2916 盟4145 锰7021 猛3718 梦1125 孟1322 眯4183 醚5721 靡7238 糜4745 迷6617 谜6193 弥1736 米4717 秘4434 觅6017 泌3125 蜜5778 密1378 幂0389 棉2758 棉7258 眠4177 绵4875 冕0380 免0346 勉0517 娩1231 缅4884 面7240 苗5379 描2249 瞄4178 藐5662 秒4432 渺3267 庙1680 妙1181 蔑5583 灭3319 民3046 抿2129 皿4129 敏2404 悯2006 闽7044 明2494 螟5820 鸣7686 铭6900 名0682 命0730 谬6208 摸2307 摹2308 蘑5704 模2875 膜5229 磨4333 摩2302 魔7621 抹2130 末2608 莫5459 墨1075 默7817 沫3106 漠3351 寞1389 陌7099 谋6180 牟3664 某2673 拇2136 牡3665 亩3965 姆1191 母3018 墓1045 暮2550 幕1612 募0927 慕1970 木2606 目4158 睦4207 牧3668 穆4476 拿2169 哪0763 呐0704 钠6871 那6719 娜1226 纳4780 氖6036 乃0035 奶1168 耐5082 奈1143 南0589 男3948 难7181 囊0926 挠2321 脑5207 恼1925 闹9527 闹7593 淖8681 呢0716 馁7407 内0355 嫩1282 能5174 妮1200 霓7206 倪0242 泥3136 尼1441 拟2362 你0132 匿0574 腻5232 逆6627 溺3312 蔫5576 拈2138 年1628 碾4317 撵2365 捻2214 念1819 娘1224 酿6840 鸟7680 尿1443 捏2250 聂5119 孽5642 啮0909 镊7015 镊7105 镍6996 涅3206 您1849 柠2899 狞3761 狞3461 凝0413 宁1337 拧2349 泞3438 牛3662 扭2100 钮6873 纽4781 脓5240 浓3426 农3593 农6593 弄1702 奴1167 努0505 怒1829 女1166 暖2541 虐5707 疟4061 挪2180 懦2032 糯4754 诺6179 欧2962 鸥7743 殴3016 藕5665 呕0868 偶0260 沤3371 爬3632 帕1584 怕1830 琶3831 拍2143 排2226 牌3654 徘1780 湃3269 派3175 攀2372潘3382 盘4149 磐4323 盼4162 畔3961 判0445 叛0651 乓8004 庞1690 旁2460 耪6590 胖5160 抛2141 咆0733 刨0442 炮3517 袍5916 跑6410 泡3133 胚5162 培1014 裴5952 赔6341 陪7111 配6792 佩0160 沛3099 喷0899 盆4133 砰4280 抨2125 烹3534 澎3403 彭1756 蓬5570 棚2766 硼4296 篷4659 膨5191 朋2590 鹏7720 捧2201 碰4314 坯0999 砒4268 霹7219 批2106 披2126 劈0490 琵3832 毗3026 啤0802 脾5196 疲4006 皮4122 匹0572 痞4028 僻0306 屁1445 譬6229 篇4638 偏0252 片3651 骗7499 飘7373 漂3343 瓢3903 票4384 撇2317 瞥4224 拼2178 频7340 贫6302 品0756 聘5111 乒8003 坪0988 苹5393 萍5493 平1627 凭0417 瓶3910 评6097 屏1456 坡0980 泼3380 颇7324 婆1237 破4275 魄7611 迫6612 粕4722 剖0472 扑2090 铺6917 仆0091 莆5455 葡5515 菩5476 蒲5543 埔1033 朴2613 圃0944 普2528 浦3184 谱6225 曝2566 瀑3462 期2601 欺2952 栖2722 戚2058 妻1189 七9707 七9807 七9907 七0003 凄0401 漆3344 柒2675 其0366 棋2759 奇1142 歧2978 畦3971 崎1505 脐5247 齐7871 旗2475 祈4362 祁4359 骑7494 起6386 岂6259 乞0047 企0120 启0796 契1148 砌4265 器0892 气3049 迄6597 弃2757 汽3086 泣3135 讫6066 掐2225 恰1874 洽3174 牵3677 扦8422 钎7244 铅6884 千0578 迁6692 签4687 仟0107 谦6197 乾0051 黔7816 钱6929 钳6883 前0467 潜3383 遣6680 浅3239 谴6232 堑1058 嵌1523 欠2944 歉2959 枪2847 呛0850 腔5204 羌5018 墙8255 蔷5638 强1730 抢2293 橇8587 锹6942 敲2418 悄1877 桥2890 瞧4225 乔0821 乔0829 侨0294 巧1564 撬2334 翘5062 峭1495 俏0195 窍4534 切0434 茄5401 且0011 怯1845 窃4537 钦2953 侵0187 亲6024 秦44英文字母篇：A：（短·长）B：（长·短·短·短）C：（长·短·长·短）D：（长·短·短）E：（短）F：（短·短·长·短）G：（长·长·短）H：（短·短·短·短）I：（短·短）J：（短·长·长·长）K：（长·短·长）L：（短·长·短·短）M：（长·长）N：（长·短）O：（长·长·长）P：（短·长·长·短）Q：（长·长·短·长）R：（短·长·短）S：（短·短·短）T：（长）U：（短·短·长）V：（短·短·短·长）W：（短·长·长）X：（长·短·短·长）Y：（长·短·长·长）Z：（长·长·短·短）数字篇：1：（短·长·长·长·长）2：（短·短·长·长·长）3：（短·短·短·长·长）4：（短·短·短·短·长）5：（短·短·短·短·短）6：（长·短·短·短·短）7：（长·长·短·短·短）8：（长·长·长·短·短）9：（长·长·长·长·短）0：（长·长·长·长·长）符号篇：“.”：（短·长·短·长·短·长）“，”：（长·长·短·短·长·长）“：”：（长·长·长·短·短·短）“?”：（短·短·长·长·短·短）“－”：（长·短·短·短·短·长）“/”：（长·短·短·长·短）“（）”：（长·短·长·长·短·长）特殊用语篇：引对方注意并使其回复：（长·短·长·长·短·长）对方收到并回复信号：（长·长）发出信息前的开始命令（己方，并提示叫对方接收）：（长·短·长·短·长）发信错误并更正（使对方知道你发送错误）：（短·短·短·短·短·短）发信结束：（短·短·短·长·短）间隔时间：滴，1t；答,3t；滴答间,1t；字母间,3t；字间,5t。
计算机字符集
由于GB2312原始编码与ASCII编码的字节有重叠，现在通行的GB2312编码是在原始编码的两个字节上各加128修改而形成。例如：汉字“啊”，编号为16区01位。它的原始编码为0x3021，通行编码为0xB0A1。
如果不另加说明，GB2312常指这种修改过的编码。
291DGS组分隔符
301ERS记录分隔符
311FUS单位分隔符
ASCII码对照表
ASCII码
键盘
ASCII码
键盘
ASCII码
键盘
ASCII码
键盘
27
ESC
32
SPACE
33
!34Leabharlann "35#
36
$
37
%
38
&
39
'
40
(
41
)
42
*
43
+
44
'
45
-
46
.
47
/
48
0
49
1
50
2
51
3
52
4
53
5
54
IBM的个人计算机和工作站操作系统不使用它们所有的EBCDIC编码。相反的，它们使用文本的工业标准编码，ASCII码。转化程序允许不同的操作系统从一种编码到另一种编码的转化。
也可参见统一的字符编码标准。Name=earandmouthCName=听说接口Site=searchEnterpriseVoiceCategory=Def=
GB2312将所收录的字符分为94个区，编号为01区至94区；每个区收录94个字符，编号为01位至94位。GB2312的每一个字符都由与其唯一对应的区号和位号所确定。例如：汉字“啊”，编号为16区01位。
RFC3021
<网络号>由网络管理员分配，在本地路由域中是唯一的 。目标IP地址是否进行直接广播取
决于与目标段直接相连的路由器。当前的转发方案和算法不会在远程路由器受到影响。
本文的目的在于探讨点对点连接31位前缀的实用性和操作。没有考虑对其它类型接口的影
响（如果有的话）。
2.2.1.直接广播（Directed Broadcast）
{-1, -1}
{0, 0}
有限广播的{0，0}形式已经过时了，但还可以在网络上见到。
使用31位长度的前缀只留下两种编号的可能性（见节2.1），从而排除了连接中直接广播
的使用（见节2.2.1）。分配了31位字网掩码的点对点连接必须使用有限广播进行所有的广播
位掩码的点对点连接的一个端点。路由器可以发生网络直接广播（Network
Directed Broadcast）包。路由器可以由一个接收直接广播包的配ห้องสมุดไป่ตู้选项，但必
须关闭缺省值，这样除非最终用户专门设置路由器不得接收网络直接广播包。
上述文字包含[RFC2644]所作的更新。
增加一个新的小节（编号4.2.2.11 (f)）：
译文发布时间：2001-4-24
版权：本中文翻译文档版权归中国互动出版网所有。可以用于非商业用途自由转载，但必
须保留本文档的翻译及版权信息。
Network Working Group A. Retana
Request for Comments: 3021 R. White
本文基于这样一种观点，即在点对点连接中节约IP地址（使用超过30位的子网掩码），
而同时保持可维护性和标准的交互是可能的。现存的文档[RFC950]已经暗示了使用1位宽的主
MOC3021M(双向光控晶闸管)
MOC301XM, MOC302XM — 6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)MOC3020M, MOC3021M, MOC3022M, MOC3023M6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)Features■Excellent I FT Stability—IR Emitting Diode Has Low Degradation■High Isolation Voltage—Minimum 5300 V AC(RMS)■Underwriters Laboratory (UL) Recognized—File #E90700■Peak Blocking Voltage– 250 V, MOC301XM– 400 V, MOC302XM■VDE Recognized (File #94766)– Ordering Option V (e.g., MOC3023VM)Applications ■Industrial Controls■Solenoid/Valve Controls■Traffic Lights■Static AC Power Switch■Vending Machines■Incandescent Lamp Dimmers■Solid State Relay■Motor Control■Lamp Ballasts Description The MOC301XM and MOC302XM series are optically isolated triac driver devices. These devices contain a GaAs infrared emitting diode and a light activated silicon bilateral switch, which functions like a triac. They are designed for interfacing between electronic controls and power triacs to control resistive and inductive loads for115 V AC operations.Schematic Package Outlines MAIN TERM.NC*N/C123ANODE CATHODE456MAIN TERM.MOC301XM, MOC302XM — 6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)Table 1 For Rated Mains Voltage < 150 V RMS I–IV For Rated Mains Voltage < 300 V RMS I–IV Climatic Classification40/85/21Pollution Degree (DIN VDE 0110/1.89)2CTI Comparative Tracking Index175V PR Input to Output Test Voltage, Method b, V IORM x 1.875 = V PR, 100% Production Test with t m = 1 s, Partial Discharge < 5 pC1594Input to Output Test Voltage, Method a, V IORM x 1.5 = V PR, Type and Sample Test with t m = 60 s, Partial Discharge < 5 pC1275V IORM Maximum Working Insulation Voltage850V peak V IOTM Highest Allowable Over Voltage6000V peak External Creepage7mm External Clearance7mm External Clearance (for Option T, 0.4” Lead Spacing)10.16mm Insulation Thickness0.5mm R IO Insulation Resistance at T S, V IO = 500 V109ΩMOC301XM, MOC302XM — 6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)Note:1.Isolation surge voltage, V ISO, is an internal device dielectric breakdown rating. For this test, pins 1 and 2 are common, and pins 4, 5 and 6 are common.TOTAL DEVICE T STG Storage Temperature All-40 to +150°C T OPR Operating Temperature All-40 to +85°C T SOL Lead Solder Temperature All260 for 10 seconds°C T J Junction Temperature Range All-40 to +100°C V ISO Isolation Surge Voltage(1)(Peak AC Voltage, 60 Hz, 1 Second Duration)All7500Vac(pk)P D T otal Device Power Dissipation at 25°C Ambient Derate Above 25°C All330mW4.4mW/°C EMITTER I F Continuous Forward Current All60mA V R Reverse Voltage All3V P D T otal Power Dissipation at 25°C Ambient Derate Above 25°C All100mW1.33mW/°C DETECTOR V DRM Off-State Output Terminal Voltage MOC3010M/1M/2M MOC3020M/1M/2M/3M250400V I TSM Peak Repetitive Surge Current (PW = 100 μs, 120 pps)All1A P D T otal Power Dissipation at 25°C Ambient Derate Above 25°C All300mW4mW/°CMOC301XM, MOC302XM — 6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)Transfer Characteristics Notes:2.Test voltage must be applied within dv/dt rating.3.All devices are guaranteed to trigger at an I F value less than or equal to max I FT. Therefore, recommended operating I F lies between max I FT (30 mA for MOC3020M, 15 mA for MOC3010M and MOC3021M, 10 mA for MOC3011M and MOC3022M, 5 mA for MOC3012M and MOC3023M) and absolute maximum I F (60 mA).EMITTER V F Input Forward Voltage I F = 10 mA All 1.15 1.50V I R Reverse Leakage Current V R = 3 V, T A = 25°C All0.01100μA DETECTOR I DRM Peak Blocking Current, Either Direction Rated V DRM, I F = 0(2)All10100nA V TM Peak On-State Voltage, Either Direction I TM = 100 mA peak, I F = 0All 1.8 3.0V Symbol DC Characteristics Test Conditions Device Min.Typ.Max.Units I FT LED Trigger Current Voltage = 3 V(3)MOC3020M30mA MOC3010M15MOC3021M MOC3011M10MOC3022M MOC3012M5MOC3023M I H Holding Current, Either Direction All100μAMOC301XM, MOC302XM — 6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)AMBIENT TEMPERATURE - T A (o C)-40-20020406080100I T M-T R I G G E R C U R R E N T(N O R M A L I Z E D)0.60.70.80.91.01.11.21.31.4I F - LED FORWARD CURRENT (mA)110100V F-F O R W A R D V O L T A G 1.01.11.21.31.41.5T A = -55o C T A = 25o C T A = 100o C V TM - ON-STATE VOLTAGE (V)-3-2-10123I T M-O N-S T A T E C U R R E N T-800-600-400-2000200I D R M-L E A K A G E C U R R E N T(n A)110100100010000NORMALIZED TO T A = 25°C Figure 3. LED Forward Voltage vs. Forward Current Figure 5. Trigger Current vs. Ambient Temperature PW in - LED TRIGGER WIDTH (μs)125102050100I F T-T R I G G E R C U R R E N T(N O R M A L I Z E D)0510152025NORMALIZED TO:PW in≥ 100 μs Figure 6. LED Current Required to Trigger vs. LED Pulse Width Figure 4. On-State Characteristics S T A T I C d v/d t(V/μs)24681012STATIC dv/dt CIRCUIT IN FIGURE 9MOC301XM, MOC302XM — 6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)Note:This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.Figure 9. Static dv/dt Test Circuit Figure 10. Resistive Load X100SCOPE PROBE PULSE INPUT MERCURY WETTED RELAY DUT252 V (MOC302X)158 V (MOC301X)0 VOLTS APPLIED VOLT AGE WAVEFORM V max =dv/dt = 0.63 V max = 252RC RC RC 400 V (MOC302X)= 250 V (MOC301X)(MOC302X)= 158RC(MOC301X)by triggering the DUT with a normal LED input current, then removing the current. The variable R TEST allows the dv/dt to be gradually increased until the DUT continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the DUT stops triggering. τRC is measured at this point and recorded.V CC R in123654120 V60 Hz180 ΩR L MOC3010M MOC3011M MOC3012M V CC R in1236540.1 μF180 ΩC1 2.4 kΩZ L120 V60 Hz MOC3010M MOC3011M MOC3012MMOC301XM, MOC302XM — 6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)Figure 12. Inductive Load with sensitive Gate Triact (IGT ≤ 15 mA)Figure 13. Typical Application Circuit23540.2 μF C1120 V60 Hz MOC3010M MOC3011M MOC3012M V CC R in1236540.05 μF0.01 μF LOAD360 Ω39470 Ω240V AC HOT GROUND MOC3020M MOC3021M MOC3022M MOC3023M In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.The 39 Ω resistor and 0.01 μF capacitor are for snubbing of the triac, and the 470 Ω resistor and 0.05 μF capacitor are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.MOC301XM, MOC302XM — 6-Pin DIP Random-Phase Optoisolators Triac Driver Output (250/400 Volt Peak)Figure 15. 6-Pin DIP Through Hole Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.。
LT3020中文资料
12ELECTRICAL CHARACTERISTICSThe ● denotes specifications which apply over the full operating temperature range, otherwise specifications are T J = 25°C. PARAMETER CONDITIONS MIN TYP MAX UNITS Minimum Input Voltage I LOAD = 500mA, T J > 0°C0.9 1.05V (Notes 5,14)I LOAD = 500mA, T J < 0°C0.9 1.10V ADJ Pin Voltage (Notes 4, 5)V IN = 1.5V, I LOAD = 1mA196200204mV1.15V < V IN < 10V, 1mA < I LOAD < 500mA●193200206mV Regulated Output Voltage LT3021-1.2V IN = 1.5V, I LOAD = 1mA 1.176 1.200 1.224V (Note 4) 1.5V < V IN < 10V, 1mA < I LOAD < 500mA● 1.157 1.200 1.236V LT3021-1.5V IN = 1.8V, I LOAD = 1mA 1.470 1.500 1.530V1.8V < V IN < 10V, 1mA < I LOAD < 500mA● 1.447 1.500 1.545VLT3021-1.8V IN = 2.1V, I LOAD = 1mA 1.764 1.800 1.836V2.1V < V IN < 10V, 1mA < I LOAD < 500mA● 1.737 1.800 1.854V Line Regulation (Note 6)LT3021∆V IN = 1.15V to 10V, I LOAD = 1mA●–1.750+1.75mV LT3021-1.2∆V IN = 1.5V to 10V, I LOAD = 1mA●–10.5010.5mVLT3021-1.5∆V IN = 1.8V to 10V, I LOAD = 1mA●–13013mVLT3021-1.8∆V IN = 2.1V to 10V, I LOAD = 1mA●–15.8015.8mV Load Regulation (Note 6)LT3021V IN = 1.15V, ∆I LOAD = 1mA to 500mA–20.42mV LT3021-1.2V IN = 1.5V, ∆I LOAD = 1mA to 500mA–616mVLT3021-1.5V IN = 1.8V, ∆I LOAD = 1mA to 500mA–7.5 1.57.5mVLT3021-1.8V IN = 2.1V, ∆I LOAD = 1mA to 500mA–929mV Dropout Voltage (Notes 7, 12)I LOAD = 10mA4575mVI LOAD = 10mA●110mVI LOAD = 500mA155190mVI LOAD = 500mA●285mV GND Pin Current I LOAD = 0mA●110250µA V IN = V OUT(NOMINAL) + 0.4V I LOAD = 10mA920µA (Notes 8, 12)I LOAD = 100mA 2.25mAI LOAD = 500mA● 6.2010mA Output Voltage Noise C OUT = 4.7µF, I LOAD = 500mA, BW = 10Hz to 100kHz, V OUT = 1.2V300µV RMS ADJ Pin Bias Current V ADJ = 0.2V, V IN = 1.2V (Notes 6, 9)2050nA Shutdown Threshold V OUT = Off to On●0.610.9V V OUT = On to Off●0.250.61V SHDN Pin Current (Note 10)V SHDN = 0V, V IN = 10V●±1µA V SHDN = 10V, V IN = 10V●3 9.5µA Quiescent Current in Shutdown V IN = 6V, V SHDN= 0V39µA Ripple Rejection (Note 6)LT3021V IN – V OUT = 1V, V RIP = 0.5V P-P, f RIPPLE = 120Hz,70dBI LOAD = 500mALT3021-1.2V IN – V OUT = 1V, V RIPPLE = 0.5V P-P, f RIPPLE = 120Hz,60dBI LOAD = 500mALT3021-1.5V IN – V OUT = 1V, V RIPPLE = 0.5V P-P, f RIPPLE = 120Hz,58dBI LOAD = 500mALT3021-1.8V IN – V OUT = 1V, V RIPPLE = 0.5V P-P, f RIPPLE = 120Hz,56dBI LOAD = 500mA3 3021fa45678910113021faThe LT3021 regulator has internal thermal limiting (with hysteresis) designed to protect the device during overload conditions. For normal continuous conditions, do not exceed the maximum junction temperature rating of 125°C.Carefully consider all sources of thermal resistance from junction to ambient including other heat sources mounted in proximity to the LT3021.The underside of the LT3021 DH package has exposed metal (14mm 2) from the lead frame to where the die is attached.This allows heat to directly transfer from the die junction to the printed circuit board metal to control maximum operating junction temperature. The dual-in-line pin ar-rangement allows metal to extend beyond the ends of the package on the topside (component side) of a PCB. Con-nect this metal to GND on the PC B. The multiple IN and OUT pins of the LT3021 also assist in spreading heat to the PCB.The LT3021 S8 package has pin 4 fused with the lead frame. This also allows heat to transfer from the die to the printed circuit board metal, therefore reducing the thermal resistance. Copper board stiffeners and plated through-holes can also be used to spread the heat generated by power devices.The following tables list thermal resistance for several different board sizes and copper areas for two different packages. Measurements were taken in still air on 3/32"FR-4 board with one ounce copper.Table 1. Measured Thermal Resistance For DH PackageCOPPER AREA THERMAL RESISTANCETOPSIDE*BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)2500mm22500mm22500mm 230°C/W 900mm 22500mm 22500mm 235°C/W 225mm 22500mm 22500mm 250°C/W 100mm 22500mm 22500mm 255°C/W 50mm 22500mm 22500mm 265°C/WTable 2. Measured Thermal Resistance For S8 PackageCOPPER AREATHERMAL RESISTANCE TOPSIDE*BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)2500mm 22500mm 22500mm 270°C/W 1000mm 22500mm 22500mm 270°C/W 225mm 22500mm 22500mm 278°C/W 100mm 22500mm 22500mm 284°C/W 50mm22500mm22500mm296°C/W*Device is mounted on topside.Calculating Junction TemperatureExample: Given an output voltage of 1.2V, an input voltage range of 1.8V ±10%, an output current range of 1mA to 500mA, and a maximum ambient temperature of 70°C,what will the maximum junction temperature be for an application using the DH package?The power dissipated by the device is equal to:I OUT(MAX)(V IN(MAX) – V OUT ) + I GND (V IN(MAX))whereI OUT(MAX) = 500mA V IN(MAX) = 1.98VI GND at (I OUT = 500mA, V IN = 1.98V) = 10mA soP = 500mA(1.98V – 1.2V) + 10mA(1.98V) = 0.41W The thermal resistance is in the range of 35°C /W to 70°C/W depending on the copper area. So the junction temperature rise above ambient is approximately equal to:0.41W(52.5°C/W) = 21.5°CThe maximum junction temperature equals the maximum junction temperature rise above ambient plus the maxi-mum ambient temperature or:T JMAX = 21.5°C + 70°C = 91.5°C Protection FeaturesThe LT3021 incorporates several protection features that make it ideal for use in battery-powered circuits. In addi-tion to the normal protection features associated with monolithic regulators, such as current limiting and ther-mal limiting, the device also protects against reverse-input voltages, reverse-output voltages and reverse output-to-input voltages.Current limit protection and thermal overload protection protect the device against current overload conditions at the output of the device. For normal operation, do not exceed a junction temperature of 125°C.The IN pins of the device withstand reverse voltages of 10V. The LT3021 limits current flow to less than 1µA and no negative voltage appears at OUT. The device protects both itself and the load against batteries that are plugged in backwards.APPLICATIO S I FOR ATIOW UUU123021faThe LT3021 incurs no damage if OUT is pulled below ground. If IN is left open circuit or grounded, OUT can be pulled below ground by 10V. No current flows from the pass transistor connected to OUT. However, current flows in (but is limited by) the resistor divider that sets the output voltage. C urrent flows from the bottom resistor in the divider and from the ADJ pin’s internal clamp through the top resistor in the divider to the external circuitry pulling OUT below ground. If IN is powered by a voltage source,OUT sources current equal to its current limit capability and the LT3021 protects itself by thermal limiting. In this case, grounding SHDN turns off the LT3021 and stops OUT from sourcing current.The LT3021 incurs no damage if the ADJ pin is pulled above or below ground by 10V. If IN is left open circuit or grounded and ADJ is pulled above ground, ADJ acts like a 25k resistor in series with a 1V clamp (one Schottky diode in series with one diode). ADJ acts like a 25k resistor in series with a Schottky diode if pulled below ground. If IN is powered by a voltage source and ADJ is pulled below its reference voltage, the LT3021 attempts to source its current limit capability at OUT. The output voltage in-creases to V IN – V DROPOUT with V DROPOUT set by whatever load current the LT3021 supports. This condition can potentially damage external circuitry powered by the LT3021 if the output voltage increases to an unregulated high voltage. If IN is powered by a voltage source and ADJ is pulled above its reference voltage, two situations can occur. If ADJ is pulled slightly above its reference voltage,the LT3021 turns off the pass transistor, no output current is sourced and the output voltage decreases to either the voltage at ADJ or less. If ADJ is pulled above its no load recovery threshold, the no load recovery circuitry turns on and attempts to sink current. OUT is actively pulled low and the output voltage clamps at a Schottky diode above ground. Please note that the behavior described above applies to the LT3021 only. If a resistor divider is con-nected under the same conditions, there will be additional V/R current.In circuits where a backup battery is required, several different input/output conditions can occur. The output voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage or is left openAPPLICATIO S I FOR ATIOW UUU circuit. In the case where the input is grounded, there is less than 1µA of reverse output current.If the LT3021 IN pin is forced below the OUT pin or the OUT pin is pulled above the IN pin, input current drops to less than 10µA typically. This occurs if the LT3021 input is connected to a discharged (low voltage) battery and either a backup battery or a second regulator circuit holds up the output. The state of the SHDN pin has no effect on the reverse output current if OUT is pulled above IN.Input Capacitance and StabilityThe LT3021 is designed to be stable with a minimum capacitance of 3.3µF placed at the IN pin. Ceramic capaci-tors with very low ESR may be used. However, in cases where a long wire is used to connect a power supply to the input of the LT3021 (and also from the ground of the LT3021 back to the power supply ground), use of low value input capacitors combined with an output load current of 20mA or greater may result in an unstable application. This is due to the inductance of the wire forming an LC tank circuit with the input capacitor and not a result of the LT3021 being unstable.The self-inductance, or isolated inductance, of a wire is directly proportional to its length. However, the diameter of a wire does not have a major influence on its self-inductance. For example, the self inductance of a 2-AWG isolated wire with a diameter of 0.26 in. is about half the inductance of a 30-AWG wire with a diameter of 0.01 in.One foot of 30-AWG wire has 465nH of self inductance.The overall self-inductance of a wire can be reduced in two ways. One is to divide the current flowing towards the LT3021 between two parallel conductors and flows in the same direction in each. In this case, the farther the wires are placed apart from each other, the more inductance will be reduced, up to a 50% reduction when placed a few inches apart. Splitting the wires basically connects two equal inductors in parallel. However, when placed in close proximity from each other, mutual inductance is added to the overall self inductance of the wires. The most effective way to reduce overall inductance is to place the forward and return-current conductors (the wire for the input and the wire for ground) in very close proximity. Two 30-AWG wires separated by 0.02 in. reduce the overall self-induc-tance to about one-fifth of a single isolated wire.133021faAPPLICATIO S I FOR ATIOW UUU If the LT3021 is powered by a battery mounted in close proximity on the same circuit board, a 3.3µF input capaci-tor is sufficient for stability. However, if the LT3021 is powered by a distant supply, use a larger value input capacitor following the guideline of roughly 1µF (in addi-tion to the 3.3µF minimum) per 8 inches of wire length. As power supply output impedance may vary, the minimum input capacitance needed to stabilize the application mayalso vary. Extra capacitance may also be placed directly on the output of the power supply; however, this will require an order of magnitude more capacitance as opposed to placing extra capacitance in close proximity to the LT3021.Furthermore, series resistance may be placed between the supply and the input of the LT3021 to stabilize the appli-cation; as little as 0.1Ω to 0.5Ω will suffice.14Information furnished by Linear Technology C orporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.15163021faPART NUMBER DESCRIPTIONCOMMENTSLT1121/LT1121HV 150mA, Micropower LDOs V IN : 4.2V to 30V/36V, V OUT : 3.75V to 30V, V DO = 0.42V, I Q = 30µA,I SD = 16µA, Reverse-Battery Protection, SOT-223, S8, Z Packages LT1129700mA, Micropower LDOV IN : 4.2V to 30V, V OUT : 3.75V to 30V, V DO = 0.4V, I Q = 50µA, I SD = 16µA,DD, SOT-223, S8, TO220-5, TSSOP20 PackagesLT1761100mA, Low Noise Micropower LDOV IN : 1.8V to 20V, V OUT : 1.22V to 20V, V DO = 0.3V, I Q = 20µA, I SD < 1µA,Low Noise: < 20µV RMSP-P , Stable with 1µF Ceramic Capacitor,ThinSOT PackageLT1762150mA, Low Noise Micropower LDO V IN : 1.8V to 20V, V OUT : 1.22V to 20V, V DO = 0.3V, I Q = 25µA, I SD < 1µA,Low Noise: <20µV RMSP-P , MS8 PackageLT1763500mA, Low Noise Micropower LDO V IN : 1.8V to 20V, V OUT : 1.22V to 20V, V DO = 0.3V, I Q = 30µA, I SD < 1µA,Low Noise: < 20µV RMSP-P , S8 PackageLT1764/LT1764A3A, Low Noise, Fast Transient Response LDOsV IN : 2.7V to 20V, V OUT : 1.21V to 20V, V DO = 0.34V, I Q = 1mA, I SD < 1µA,Low Noise: <40µV RMSP-P , “A” Version Stable with Ceramic Capacitors,DD, TO220-5 PackagesLTC1844150mA, Low Noise, Micropower VLDO V IN : 1.6V to 6.5V, V OUT(MIN) = 1.25V, V DO = 0.09V, I Q = 35µA,I SD < 1µA, Low Noise: < 30µV RMS , ThinSOT PackageLT1962300mA, Low Noise Micropower LDOV IN : 1.8V to 20V, V OUT : 1.22V to 20V, V DO = 0.27V, I Q = 30µA, I SD < 1µA,Low Noise: < 20µV RMSP-P , MS8 PackageLT1963/LT1963A1.5A, Low Noise, Fast Transient Response LDOsV IN : 2.1V to 20V, V OUT : 1.21V to 20V, V DO = 0.34V, I Q = 1mA, I SD < 1µA,Low Noise: < 40µV RMSP-P , “A” Version Stable with Ceramic Capacitors,DD, TO220-5, SOT223, S8 PackagesLT301050mA, High Voltage, Micropower LDOV IN : 3V to 80V, V OUT : 1.275V to 60V, V DO = 0.3V, I Q = 30µA, I SD < 1µA,Low Noise: <100µV RMSP-P , Stable with 1µF Output Capacitor, Exposed MS8 PackageLT3020100mA, Low Voltage LDOV IN : 0.9V to 10V, V OUT : 0.2V to 5V (min), V DO = 0.15V, I Q = 120µA,Noise: <250µV RMSP-P , Stable with 2.2µF Ceramic Capacitors,DFN-8, MS8 PackagesLTC3025300mA, Low Voltage Micropower LDO V IN : 0.9V to 5.5V, V OUT : 0.4V to 3.6V (min), V DO = 0.05V, I Q = 54µA,Stable with 1µF Ceramic Capacitors, DFN-6 PackageLTC30261.5A, Low Input Voltage VLDO RegulatorV IN : 1.14V to 3.5V (Boost Enabled), 1.14V to 5.5V (with External 5V),V DO = 0.1V, I Q = 950µA, Stable with 10µF Ceramic Capacitors, 10-Lead MSOP and DFN-10 PackagesLT3150Low V IN , Fast Transient Response, VLDO ControllerV IN : 1.1V to 10V, V OUT : 1.21V to 10V, V DO = Set by External MOSFET R DS(ON), 1.4MHz Boost Converter Generates Gate Drive, SSOP16 PackageLT/TP 0705 500 • PRINTED IN USA© LINEAR TECHNOLOGY CORPORA TION 2005Linear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● RELATED PARTS。
mspg2231中文资料
MSP430G2x31-Q1MSP430G2x21-Q1 ZHCS351A–NOVEMBER2011–REVISED DECEMBER2011混合信号微控制器特性•符合汽车应用要求•具有2个捕捉/比较寄存器的16位Timer_A•低电源电压范围：1.8V至3.6V•支持SPI和I2C的通用串行接口（请见表1）•超低功耗•欠压检测器–运行模式：220μA（在1MHz频率和2.2V电•带内部基准、采样与保持、和自动扫描功能的10压条件下）位200每秒千次采样(ksps)模数(A/D)转换器（请见表1）–待机模式：0.5μA•串行板上编程，–关闭模式（RAM保持）：0.1μA无需外部编程电压，•5种节能模式利用安全熔丝实现可编程代码保护•可在不到1μs的时间里超快速地从待机模式唤醒•具有两线制(Spy-Bi-Wire)接口的片上仿真逻辑电•16位精简指令集(RISC)架构，62.5ns指令周期时路间•系列产品成员详细信息，请见表1和表2•基本时钟模块配置•采用14引脚塑料小外形尺寸薄型封装–具有一个校准频率并高达16MHz的内部频率(TSSOP)(PW)和16引脚四方扁平无引线(QFN)封–内部极低功率低频(LF)振荡器装(RSA)–32kHz晶振•完整的模块说明，请见《MSP430x2xx系列产品用–外部数字时钟源户指南》（）说明德州仪器(TI)MSP430系列超低功耗微控制器包含多种器件，它们特有面向多种应用的不同外设集。
这种架构与5种低功耗模式相组合，专为在便携式测量应用中延长电池使用寿命而优化。
该器件具有一个强大的16位RISC CPU，16位寄存器和有助于获得最大编码效率的常数发生器。
数字控制振荡器(DCO)可在不到1µs的时间里完成从低功耗模式至运行模式的唤醒。
MSP430G2x21/G2x31系列产品是一款超低功率混合信号微控制器，此微控制器装有一个内置的16位定时器和10个I/O引脚。
K3022P资料
K3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors1PbP b -freee3Optocoupler, Phototriac Output, 400 V V DRMFeatures•Isolation materials according to UL 94-VO •Pollution degree 2 (DIN/VDE 0110 resp. IEC 60664)•Climatic classification 55/100/21 (IEC 60068 part 1)•Special construction: Therefore, extra low cou-pling capacity of typical 0.2 pF, high C ommon M ode R ejection •I FT offered into 4 groups•Rated impulse voltage (transient overvoltage) V IOTM = 6 kV peak•Isolation test voltage (partial discharge test volt-age) V pd = 1.6 kV•Rated isolation voltage (RMS includes DC) V IOWM = 600 V RMS (848 V peak)•Rated recurring peak voltage (repetitive) V IORM = 600 V RMS•Thickness through insulation ≥ 0.75 mm •Creepage current resistance according to VDE 0303/IEC 60112 C omparative T racking I ndex: CTI = 275•Lead-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECAgency Approvals•UL1577, File No. E76222 System Code C, Double Protection•BSI: BS EN 41003, BS EN 60095 (BS 415), BS EN 60950 (BS 7002), Certificate number 7081 and 7402•DIN EN 60747-5-2 (VDE0884)DIN EN 60747-5-5 pending•FIMKO (SETI): EN 60950, Certificate No. 12398ApplicationsMonitorsAir conditioners Line Switches Solid state relay MicrowaveCircuits for safe protective separation against electri-cal shock according to safety class II (reinforced iso-lation):• For appl. class I - IV at mains voltage ≤ 300 V• For appl. class I - III at mains voltage ≤ 600 V accord-ing to DIN EN 60747-5-2(VDE0884)/ DIN EN 60747-5-5 pending, table 2, suitable for.Order InformationG = Leadform 10.16 mm; G is not marked on the bodyDescriptionThe K3020P/ K3020PG series consists of a pho-totransistor optically coupled to a gallium arsenide infrared-emitting diode in a 6-lead plastic dual inline package.Part RemarksK3020P I FT < 30 mA, V DRM = 400 V, DIP-6 300 mil K3021P I FT < 15 mA, V DRM = 400 V, DIP-6 300 mil K3022PI FT < 10 mA, V DRM = 400 V, DIP-6 300 mil K3023P I FT < 5 mA, V DRM = 400 V, DIP-6 300 mil K3036P I FT < 3.6 mA, V DRM = 400 V, DIP-6 300 mil K3020PG I FT < 30 mA, V DRM = 400 V, DIP-6 400 mil K3021PG I FT < 15 mA, V DRM = 400 V, DIP-6 400 mil K3022PG I FT < 10 mA, V DRM = 400 V, DIP-6 400 mil K3023PG I FT < 5 mA, V DRM = 400 V, DIP-6 400 mil K3036PGI FT < 3.6 mA, V DRM = 400 V, DIP-6 400 mil 2Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsVDE StandardsThese couplers perform safety functions according to the following equipment standards:DIN EN 60747-5-2(V DE0884)/ DIN EN 60747-5-5pendingOptocoupler for electrical safety requirementsIEC 60950/EN 60950Office machines (applied for reinforced isolation for mains voltage≤ 400 VRMS)VDE 0804Telecommunication apparatus and data processingIEC 60065Safety for mains-operated electronic and related household appa-ratus.Absolute Maximum RatingsT amb = 25°C, unless otherwise specifiedStresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Rating for extended periods of the time can adversely affect reliability.InputOutputCoupler1) Related to standard climate 23/50 DIN 50014ParameterTest conditionSymbol Value Unit Reverse voltage V R 5V Forward current I F 80mA Forward surge current t p ≤ 10 µsI FSM 3A Power dissipation P diss 100mW Junction temperatureT j100°CParameterTest conditionSymbol Value Unit Off state output terminal voltage V DRM 400V On state RMS current I TRM 100mA Peak surge current, non-repetitive t p ≤ 10 msI TSM 1.5A Power dissipation P diss 300mW Junction temperatureT j100°CParameterTest condition Symbol Value Unit Isolation test voltage (RMS)V ISO 1)3750V RMS Total power dissipation P tot 350mW Ambient temperature range T amb - 40 to + 85°C Storage temperature range T stg - 55 to + 100°C Soldering temperature2 mm from case, t ≤ 10 sT sld260°CK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors3Electrical CharacteristicsT amb = 25°C, unless otherwise specifiedMinimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements.InputOutput1)Test voltage must be applied within dv/dt ratingsCouplerNote: I FT is defined as a minimum trigger currentParameterT est conditionSymbol MinT yp.Max Unit Forward voltage I F = 50 mA V F 1.25 1.6V Junction capacitanceV R = 0, f = 1 MHzC j50pFParameterT est conditionSymbol Min T yp.Max Unit Forward peak off-state voltage (repetitive)I DRM = 100 nA V DRM 1)400VPeak on-state voltage I TM = 100 mA V TM 1.53V Critical rate of rise of off-state voltageI FT = 0, I FT = 30 mAdV/dt cr 10V/µs dV/dt crq0.10.2V/µsParameterT est conditionPart Symbol MinT yp.Max Unit Emitting diode trigger currentV S = 3 V , R L = 150 ΩK3020P I FT 1530mA K3020PG I FT 1530mA K3021P I FT 815mA K3021PG I FT 815mA K3022P I FT 510mA K3022PG I FT 510mA K3023P I FT 25mA K3023PG I FT 25mA K3036P I FT 2 3.6mA K3036PGI FT 2 3.6mA Holding currentI F = 10 mA, V S ≥ 3 VI H100µA 4Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsFigure 1. Test circuit for dV/dt cr and dV/dt crqFigure 2.Figure 3. Motor control circuitTest condition:dV/dt crV S =2/3V DRM (Sine wave)R L =33k dV/dt crq V eff =30V (Sine wave)R L =2k9510815~K3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors5Maximum Safety Ratings(according to DIN EN 60747-5-2(VDE0884)/ DIN EN 60747-5-5 pending) see figure 1 This optocoupler is suitable for safe electrical isolation only within the safety ratings.Compliance with the safety ratings shall be ensured by means of suitable protective circuits.InputOutputCouplerInsulation Rated ParametersParameterT est conditionSymbol MinT yp.Max Unit Forward currentI F130mAParameterT est conditionSymbol MinT yp.Max Unit Power dissipationP diss600mWParameterT est conditionSymbol MinT yp.Max Unit Rated impulse voltage V IOTM 6kV Safety temperatureT si150°CParameterT est conditionSymbol Min T yp.Max Unit Partial discharge test voltage - Routine test100 %, t test = 1 s V pd 1.6kV Partial discharge test voltage - Lot test (sample test)t Tr = 60 s, t test = 10 s, (see figure 5)V IOTM 6kV V pd 1.3kV Insulation resistanceV IO = 500 VR IO 1012ΩV IO = 500 V , T amb = 100°C R IO 1011ΩV IO = 500 V , T amb = 150°C(construction test only)R IO109ΩFigure 4. Derating diagram0751502253003754505256006750255075100125150T amb (°C )9510925Figure 5. Test pulse diagram for sample test according to DIN EN60747-5-2(VDE0884)/ DIN EN 60747-; IEC6074713930V IOTMV Pd V IOWM V 6Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsTypical Characteristics (Tamb = 25 °C unless otherwise specified)Figure 6. Total Power Dissipation vs. Ambient Temperature Figure 7. Forward Current vs. Forward Voltage Figure 8. Relative Threshold Forward Current vs. AmbientTemperature0100200300400020406080100P –T o t a l P o w e r D i s s i p a t i o n (m W )T amb –Ambient T emperature (°C )9611701t o t0.1110100100000.20.40.60.81.01.21.41.61.82.0V F -Forward Voltage (V )9611862F I -F o r w a r d C u r r e n t (m A )0.50.60.70.80.91.01.11.21.31.41.5–30–20–1001020304050607080T amb –Ambient T emperature (°C )9611922I –R e l a t i v e T h r e s h o l d F o r w a r d C u r r e n tF T r e l Figure 9. Relative On - State vs. Ambient TemperatureFigure 10. Off - State Current vs. Ambient TemperatureFigure 11. On - State Current vs. Ambient Temperature0.50.60.70.80.91.01.11.21.31.41.5–30–20–1001020304050607080T amb –Ambient T emperature (°C )9611923V –R e l a t i v e O n –S t a t e V o l t a g eTM r e l 1101002030405060708090100T amb –Ambient Temperature(°C)9611924I –O f f –S t a t e C u r r e n t (n A )D R M –250–200–150–100–50050100150200250–2.5–2.0–1.5–1.0–0.50.00.51.01.52.02.5V TM –On–State Voltage (V )9611926I –O n –S t a t e C u r r e n t (mA )T MK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors7Package Dimensions in mm–250–200–150–100–50050100150200250–2.5–2.0–1.5–1.0–0.50.00.51.01.52.02.5V TM –On–State Voltage (V )9611925I –O n –S t a t e C u r r e n t (m A )TM Figure12. On - State Current vs. Ambient Temperature 8Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG Series Vishay SemiconductorsPackage Dimensions in mmK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors9Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution andoperatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personaldamage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyTelephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423Document Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。
PADAUK Technology Co. Ltd PMC232 PMS232系列 12位ADC双核
PMC232/PMS232系列带12位ADC、采用FPPA TM技术双核心8位单片机数据手册第0.03版2017年3月27日Copyright 2017 by PADAUK Technology Co., Ltd., all rights reserved10F-2, No. 1, Sec. 2, Dong-Da Road, Hsin-Chu 300, Taiwan, R.O.C.重要声明应广科技保留权利在任何时候变更或终止产品，建议客户在使用或下单前与应广科技或代理商联系以取得最新、最正确的产品信息。
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目录1. 单片机特点 (8)1.1. 系列特点 (8)1.2. 高性能RISC CPU架构 (8)1.3. 系统功能 (8)1.4. 封装信息 (9)2. 系统概述和方框图 (10)3. PMC232系列引脚功能描述 (11)4. PMS232系列引脚功能描述 (12)5. 器件电气特性 (15)5.1. 直流/交流特性 (15)5.2. 最大范围 (17)5.3. ILRC频率与VDD、温度关系的曲线图 (18)5.4. IHRC频率与VDD、温度关系的曲线图 (19)5.5. 工作电流量测值@系统时钟=ILRC÷N (20)5.6. 工作电流量测值@系统时钟=IHRC÷N (20)5.7. 工作电流量测值@系统时钟=4MH Z晶振EOSC÷N (21)5.8. 工作电流量测值@系统时钟=32K H Z晶振EOSC÷N (21)5.9. IO引脚输出驱动电流(I OH)和灌电流(I OL)曲线图 (22)5.10. 测量的IO输入阈值电压(V IH/V IL) (22)5.11. IO引脚拉高阻抗曲线图 (22)5.12. 输出(VDD/2)偏置电压与VDD关系的曲线图 (23)5.13. 开机时序图 (23)6. 功能概述 (24)6.1. 处理单元 (24)6.1.1程序计数器 (25)6.1.2 堆栈指针 (25)6.1.3 一个处理单元工作模式 (26)6.2. OTP程序存储器 (27)6.2.1 程序存储器分配 (27)6.2.2 两个处理单元工作模式下程序存储器分配例子 (27)6.2.3 一个处理单元工作模式下程序存储器分配例子 (28)6.3 程序结构 (29)6.3.1 两个处理单元工作模式下程序结构 (29)6.3.2 一个处理单元工作模式下程序结构 (29)6.4 启动程序 (30)6.5 数据存储器 (31)6.6 算术和逻辑单元 (31)6.7 振荡器和时钟 (32)6.7.1 内部高频振荡器（IHRC）和低频振荡器（ILRC） (32)6.7.2 单片机校准 (32)6.7.3 IHRC频率校准和系统时钟 (32)6.7.4 晶体振荡器 (34)6.7.5 系统时钟和LVR水平 (35)6.7.6 系统时钟切换 (36)6.8 16位定时器(T IMER16) (37)6.9 8位PWM定时器(T IMER2) (39)6.9.1 使用Timer2产生定期波形 (40)6.9.2 使用Timer2产生8位PWM波形 (41)6.9.3 使用Timer2产生6位PWM波形 (43)6.10 看门狗定时器 (44)6.11 中断 (45)6.12 掉电模式 (47)6.12.1 省电模式（stopexe） (47)6.12.2 掉电模式（stopsys） (48)6.12.3 唤醒 (49)6.13 IO端口 (50)6.14 复位和LVR (51)6.14.1 复位 (51)6.14.2 LVR (51)6.15 VDD/2偏置电压 (51)6.16 数字转换（ADC）模块 (52)6.16.1 AD转换的输入要求 (53)6.16.2 ADC分辨率选择 (54)6.16.3 ADC 时钟选择 (54)6.16.4 AD转换 (54)6.16.5 模拟引脚的配置 (54)6.16.6 使用ADC (54)7. IO寄存器 (55)7.1 算术逻辑状态寄存器（FLAG），IO地址=0X00 (55)7.2 FPP单元允许寄存器（FPPEN），IO地址=0X01 (55)7.3 堆栈指针寄存器（SP），IO地址=0X02 (55)7.4 时钟控制寄存器（CLKMD），IO地址=0X03 (56)7.5 中断允许寄存器（INTEN），IO地址=0X04 (56)7.6 中断请求寄存器（INTRQ），IO地址=0X05 (56)7.7 T IMER16控制寄存器（T16M），IO地址=0X06 (57)7.8 通用数据输入/输出寄存器（GDIO），IO地址=0X07 (57)7.9 外部晶体振荡器控制寄存器（EOSCR），IO地址=0X0A (57)7.10 内部高频RC振荡器控制寄存器（IHRCR，只写），IO地址=0X0B (58)7.11 中断边沿选择寄存器（INTEGS，只写），IO地址=0X0C (58)7.12 端口A数字输入禁止寄存器（PADIER，只写），IO地址=0X0D (58)7.13 端口B数字输入禁止寄存器（PBDIER，只写），IO地址=0X0E (59)7.14 端口A数据寄存器（PA），IO地址=0X10 (59)7.15 端口A控制寄存器（PAC），IO地址=0X11 (59)7.16 端口A上拉控制寄存器（PAPH），IO地址=0X12 (59)7.17端口B数据寄存器（PB），IO地址=0X14 (59)7.18端口B控制寄存器（PBC），IO地址=0X15 (59)7.19 端口B上拉控制寄存器（PBPH），IO地址=0X16 (60)7.20 端口C数据寄存器（PC），IO地址=0X17 (60)7.21 端口C控制寄存器（PCC），IO地址=0X18 (60)7.22 端口C上拉控制寄存器（PCPH），IO地址=0X19 (60)7.23 ADC控制寄存器（ADCC），IO地址=0X20 (60)7.24 ADC模式控制寄存器（ADCM,只写），IO地址=0X21 (61)7.25 ADC数据高位寄存器（ADCRH，只读），IO地址=0X22 (61)7.26 ADC数据低位寄存器（ADCRL，只读），IO地址=0X23 (61)7.27 杂项寄存器(MISC)，IO地址=0X3B (62)7.28 T IMER2控制寄存器(TM2C),IO地址=0X3C (63)7.29 T IMER2计数寄存器(TM2CT),IO地址=0X3D (63)7.30 T IMER2分频器寄存器(TM2S),IO地址=0X37 (63)7.31 T IMER2上限寄存器(TM2B),IO地址=0X09 (64)8. 指令 (65)8.1 数据传输类指令 (65)8.2 算术运算类指令 (69)8.3 移位运算类指令 (71)8.4 逻辑运算类指令 (72)8.5 位运算类指令 (74)8.6 条件运算类指令 (75)8.7 系统控制类指令 (77)8.8 指令执行周期综述 (79)8.9 指令影响标志的综述 (80)9. 特别注意事项 (81)9.1 警告 (81)9.2 使用IC时 (81)9.2.1 IO使用与设定 (81)9.2.2 中断 (82)9.2.3 切换系统时钟 (82)9.2.4 掉电模式、唤醒以及看门狗 (83)9.2.5 TIMER溢出时间 (84)9.2.6 ADC使用注意事项 (84)9.2.7 LVR (84)9.2.8 IHRC (84)9.2.9 单/双核模式下指令周期差异 (85)9.3 使用ICE时 (85)9.3.1 PMC232/PMS232系列于仿真器PDK3S-I-001/002/003上仿真时 (85)9.3.2 使用PDK3S-I-001/002/003仿真PMC232/PMS232系列功能時注意事項 (86)修订历史：修订日期描述0.01 2015/8/1 初版。
CA-IS3020, CA-IS3021 I2C 隔离器 数据手册说明书
CA-IS3020, CA-IS3021上海川土微电子有限公司ObjectiveCopyright © 2020, Chipanalog Incorporated上海川土微电子有限公司CA-IS302x 低功耗双向通讯I 2C 总线隔离器1. 产品特性• 隔离双向通讯，兼容I 2C 总线通讯协议 • 信号传输速率：DC to 1MHz • 宽电源电压范围：3V to 5.5V • 宽温度范围： -55°C to 125°C •开漏输出• A 侧具有3.5mA 电流下拉能力 • B 侧具有35mA 电流下拉能力 • 优异的电磁抗扰度 • CMTI:：±150kV/µS • 浪涌：10kV • ESD ：8kV• 高达5kV RMS 的隔离电压 • 隔离栅寿命: >40年• 封装：SOIC8、宽体SOIC8 •符合RoHS 标准2. 应用• 隔离I 2C 总线• SMBus 和 PMBus 接口 • 电机驱动系统 •I 2C 电平转换3. 概述CA-IS3020和CA-IS3021芯片为兼容I 2C 接口的双向通讯低功耗隔离器，隔离器的输入侧与输出侧具备电气隔离特性，该电气隔离屏障由二氧化硅构成的高压隔离电容构成。
CA-IS302x 系列隔离器具有高达5kVrms 的超高绝缘能力，可以防止数据总线或其他电路上的噪声和浪涌进入本地接地端而干扰或损坏敏感电路。
高达150kV/µS 的CMTI 抗干扰的能力可以保证信号在恶劣噪声环境下的正确传输。
CA-IS3020芯片的数据传输通道（SDA ）和时钟传输通道（SCK ）均具有双向传输功能；CA-IS3021芯片的数据传输通道支持双向通信而时钟通道为单向通道。
CA-IS3020芯片适用于多主机（Master ）应用而CA-IS3021芯片适用于单主机应用。
如果在实际应用场景中，存在从机（Slave ）下拉时钟线的可能性，则需要使用CA-IS3020芯片。
LT3021中文资料
LT3021 - 500mA、低电压、非常低压差线性稳压器特点•V IN范围：0.9V 至10V•压差电压：160mV (典型值)•输出电流：500mA•可调输出(V REF = V OUT(MIN) = 200mV)•固定输出电压：1.2V、1.5V、1.8V•可在采用低ESR、陶瓷输出电容器(最小电容值为3.3μF) 时实现稳定•0.2% 负载调整率(从0mA 至500mA)•静态电流：120μA (典型值)•停机模式中的典型静态电流为3μA•电流限制保护功能•反向电池保护•无反向电流•具迟滞的热限制•16 引脚DFN (5mm x 5mm) 和8 引脚SO 封装典型应用•低电流稳压器•电池供电型系统•蜂窝电话•寻呼机•无线调制解调器描述LT®3021 是一款非常低压差电压(VLDO TM) 线性稳压器，工作输入电源电压低至0.9V。
该器件可提供500mA 的输出电流和一个160mV 的典型压差电压。
LT3021 非常适合于低输入电压至低输出电压应用，并提供了可与开关稳压器相媲美的电效率。
LT3021 稳压器采用低ESR、小至3.3μF 的陶瓷输出电容器优化了稳定性和瞬态响应。
LT3021 的其他特点包括0.05% 的典型电压调整率和0.2% 的典型负载调整率。
在停机模式中，静态电流通常减小至3μA。
内部保护电路包括反向电池保护、电流限制、具迟滞的热限制和反向电流保护。
LT3021可被用作一款输出可调型器件，并具有一个低至200mV 基准的输出范围。
另外，该器件还提供了 3 种固定输出电压，即：1.2V、1.5V 和1.8V。
LT3021 稳压器采用具裸露衬垫的扁平(高度仅0.75mm)、16 引脚(5mm x 5mm) DFN 封装和8 引脚SO 封装。
1.8V至1.5V, 500mA VLDO调整器。
最低输入电压最大绝对参数：输入脚电压 ............................................... ±10V输出脚电压 ................................................±10V输入到输出不同电压……………………………… ........................±10VADJ/SENSE Pin Voltage ....................................... ±10V Pin Voltage ...................................... ±10V输出短路电流持续时间......................... 不确定操作温度范围 (E, I 等级)(Notes 2, 3) .................–40°C 到 125°C 存储温度范围 DH .....................................–65°C to 125°C S8 ................................................–65°C to 150°C 铅温 (焊接, 10秒, S8) ............ 300°C需订购信息电气特性：表示在整个操作过程中应用的特殊金属离子，其它特殊的金属离子在T J = 25°C 温度范围内.符号条件最小值典型最大值 单位最小输入电压 (Notes 5,14) I LOAD = 500mA, T J > 0°C I LOAD = 500mA, T J < 0°C0.9 0.9 1.05 1.10 V V ADJ 脚电压 (Notes 4, 5)V IN = 1.5V, I LOAD = 1mA1.15V < V IN < 10V, 1mA < I LOAD < 500mA196193 200 200204 206mV mV额定输出电压 (Note 4)LT3021-1.2 V IN = 1.5V, I LOAD = 1mA 1.5V < V IN < 10V, 1mA < I LOAD < 500mA 1.176 1.157 1.200 1.200 1.224 1.236 V V LT3021-1.5 V IN = 1.8V, I LOAD = 1mA 1.8V < V IN < 10V, 1mA < I LOAD < 500mA 1.470 1.447 1.500 1.500 1.5301.545 V V LT3021-1.8 V IN =2.1V, I LOAD = 1mA 2.1V < V IN < 10V, 1mA < I LOAD < 500mA1.764 1.737 1.800 1.800 1.8361.854 V V 线性控制 (Note 6)LT3021 ΔV IN = 1.15V to 10V, I LOAD = 1mALT3021-1.2 ΔV IN = 1.5V to 10V, I LOAD = 1mALT3021-1.5 ΔV IN = 1.8V to 10V, I LOAD = 1mALT3021-1.8 ΔV IN = 2.1V to 10V, I LOAD = 1mA–1.75–10.5 –13 –15.80 0 0 0+1.75 10.5 13 15.8mV mV mV mV负载控制 (Note 6)LT3021 V IN = 1.15V, ΔI LOAD = 1mA to 500mALT3021-1.2 V IN = 1.5V, ΔI LOAD = 1mA to 500mALT3021-1.5 V IN = 1.8V, ΔI LOAD = 1mA to 500mALT3021-1.8 V IN = 2.1V, ΔI LOAD = 1mA to 500mA–2 –6 –7.5 –90.4 1 1.5 2 2 6 7.5 9 mV mV mV mV 压差 (Notes 7, 12)I LOAD = 10mA I LOAD = 10mA 45 75 110 mV mV I LOAD = 500mA I LOAD = 500mA155 190 285 mV mV GND 脚电流 V IN = V OUT(NOMINAL) + 0.4V(Notes 8, 12) I LOAD = 0mA I LOAD = 10mA I LOAD = 100mA I LOAD = 500mA110 920 2.25 6.20250 10μA μA mA mA 输出电压噪声 C OUT = 4.7μF, I LOAD = 500mA, BW = 10Hz to 100kHz, V OUT = 1.2V 300μV RMS ADJ 脚偏置电流 V ADJ = 0.2V, V IN = 1.2V (Notes 6, 9) 20 50 nA 关闭阈值V OUT = Off to On V OUT = On to Off0.250.61 0.610.9V V的时候是100%测试的。
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K3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors1PbP b -freee3Optocoupler, Phototriac Output, 400 V V DRMFeatures•Isolation materials according to UL 94-VO •Pollution degree 2 (DIN/VDE 0110 resp. IEC 60664)•Climatic classification 55/100/21 (IEC 60068 part 1)•Special construction: Therefore, extra low cou-pling capacity of typical 0.2 pF, high C ommon M ode R ejection •I FT offered into 4 groups•Rated impulse voltage (transient overvoltage) V IOTM = 6 kV peak•Isolation test voltage (partial discharge test volt-age) V pd = 1.6 kV•Rated isolation voltage (RMS includes DC) V IOWM = 600 V RMS (848 V peak)•Rated recurring peak voltage (repetitive) V IORM = 600 V RMS•Thickness through insulation ≥ 0.75 mm •Creepage current resistance according to VDE 0303/IEC 60112 C omparative T racking I ndex: CTI = 275•Lead-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECAgency Approvals•UL1577, File No. E76222 System Code C, Double Protection•BSI: BS EN 41003, BS EN 60095 (BS 415), BS EN 60950 (BS 7002), Certificate number 7081 and 7402•DIN EN 60747-5-2 (VDE0884)DIN EN 60747-5-5 pending•FIMKO (SETI): EN 60950, Certificate No. 12398ApplicationsMonitorsAir conditioners Line Switches Solid state relay MicrowaveCircuits for safe protective separation against electri-cal shock according to safety class II (reinforced iso-lation):• For appl. class I - IV at mains voltage ≤ 300 V• For appl. class I - III at mains voltage ≤ 600 V accord-ing to DIN EN 60747-5-2(VDE0884)/ DIN EN 60747-5-5 pending, table 2, suitable for.Order InformationG = Leadform 10.16 mm; G is not marked on the bodyDescriptionThe K3020P/ K3020PG series consists of a pho-totransistor optically coupled to a gallium arsenide infrared-emitting diode in a 6-lead plastic dual inline package.Part RemarksK3020P I FT < 30 mA, V DRM = 400 V, DIP-6 300 mil K3021P I FT < 15 mA, V DRM = 400 V, DIP-6 300 mil K3022PI FT < 10 mA, V DRM = 400 V, DIP-6 300 mil K3023P I FT < 5 mA, V DRM = 400 V, DIP-6 300 mil K3036P I FT < 3.6 mA, V DRM = 400 V, DIP-6 300 mil K3020PG I FT < 30 mA, V DRM = 400 V, DIP-6 400 mil K3021PG I FT < 15 mA, V DRM = 400 V, DIP-6 400 mil K3022PG I FT < 10 mA, V DRM = 400 V, DIP-6 400 mil K3023PG I FT < 5 mA, V DRM = 400 V, DIP-6 400 mil K3036PGI FT < 3.6 mA, V DRM = 400 V, DIP-6 400 mil 2Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsVDE StandardsThese couplers perform safety functions according to the following equipment standards:DIN EN 60747-5-2(V DE0884)/ DIN EN 60747-5-5pendingOptocoupler for electrical safety requirementsIEC 60950/EN 60950Office machines (applied for reinforced isolation for mains voltage≤ 400 VRMS)VDE 0804Telecommunication apparatus and data processingIEC 60065Safety for mains-operated electronic and related household appa-ratus.Absolute Maximum RatingsT amb = 25°C, unless otherwise specifiedStresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Rating for extended periods of the time can adversely affect reliability.InputOutputCoupler1) Related to standard climate 23/50 DIN 50014ParameterTest conditionSymbol Value Unit Reverse voltage V R 5V Forward current I F 80mA Forward surge current t p ≤ 10 µsI FSM 3A Power dissipation P diss 100mW Junction temperatureT j100°CParameterTest conditionSymbol Value Unit Off state output terminal voltage V DRM 400V On state RMS current I TRM 100mA Peak surge current, non-repetitive t p ≤ 10 msI TSM 1.5A Power dissipation P diss 300mW Junction temperatureT j100°CParameterTest condition Symbol Value Unit Isolation test voltage (RMS)V ISO 1)3750V RMS Total power dissipation P tot 350mW Ambient temperature range T amb - 40 to + 85°C Storage temperature range T stg - 55 to + 100°C Soldering temperature2 mm from case, t ≤ 10 sT sld260°CK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors3Electrical CharacteristicsT amb = 25°C, unless otherwise specifiedMinimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements.InputOutput1)Test voltage must be applied within dv/dt ratingsCouplerNote: I FT is defined as a minimum trigger currentParameterT est conditionSymbol MinT yp.Max Unit Forward voltage I F = 50 mA V F 1.25 1.6V Junction capacitanceV R = 0, f = 1 MHzC j50pFParameterT est conditionSymbol Min T yp.Max Unit Forward peak off-state voltage (repetitive)I DRM = 100 nA V DRM 1)400VPeak on-state voltage I TM = 100 mA V TM 1.53V Critical rate of rise of off-state voltageI FT = 0, I FT = 30 mAdV/dt cr 10V/µs dV/dt crq0.10.2V/µsParameterT est conditionPart Symbol MinT yp.Max Unit Emitting diode trigger currentV S = 3 V , R L = 150 ΩK3020P I FT 1530mA K3020PG I FT 1530mA K3021P I FT 815mA K3021PG I FT 815mA K3022P I FT 510mA K3022PG I FT 510mA K3023P I FT 25mA K3023PG I FT 25mA K3036P I FT 2 3.6mA K3036PGI FT 2 3.6mA Holding currentI F = 10 mA, V S ≥ 3 VI H100µA 4Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsFigure 1. Test circuit for dV/dt cr and dV/dt crqFigure 2.Figure 3. Motor control circuitTest condition:dV/dt crV S =2/3V DRM (Sine wave)R L =33k dV/dt crq V eff =30V (Sine wave)R L =2k9510815~K3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors5Maximum Safety Ratings(according to DIN EN 60747-5-2(VDE0884)/ DIN EN 60747-5-5 pending) see figure 1 This optocoupler is suitable for safe electrical isolation only within the safety ratings.Compliance with the safety ratings shall be ensured by means of suitable protective circuits.InputOutputCouplerInsulation Rated ParametersParameterT est conditionSymbol MinT yp.Max Unit Forward currentI F130mAParameterT est conditionSymbol MinT yp.Max Unit Power dissipationP diss600mWParameterT est conditionSymbol MinT yp.Max Unit Rated impulse voltage V IOTM 6kV Safety temperatureT si150°CParameterT est conditionSymbol Min T yp.Max Unit Partial discharge test voltage - Routine test100 %, t test = 1 s V pd 1.6kV Partial discharge test voltage - Lot test (sample test)t Tr = 60 s, t test = 10 s, (see figure 5)V IOTM 6kV V pd 1.3kV Insulation resistanceV IO = 500 VR IO 1012ΩV IO = 500 V , T amb = 100°C R IO 1011ΩV IO = 500 V , T amb = 150°C(construction test only)R IO109ΩFigure 4. Derating diagram0751502253003754505256006750255075100125150T amb (°C )9510925Figure 5. Test pulse diagram for sample test according to DIN EN60747-5-2(VDE0884)/ DIN EN 60747-; IEC6074713930V IOTMV Pd V IOWM V 6Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsTypical Characteristics (Tamb = 25 °C unless otherwise specified)Figure 6. Total Power Dissipation vs. Ambient Temperature Figure 7. Forward Current vs. Forward Voltage Figure 8. Relative Threshold Forward Current vs. AmbientTemperature0100200300400020406080100P –T o t a l P o w e r D i s s i p a t i o n (m W )T amb –Ambient T emperature (°C )9611701t o t0.1110100100000.20.40.60.81.01.21.41.61.82.0V F -Forward Voltage (V )9611862F I -F o r w a r d C u r r e n t (m A )0.50.60.70.80.91.01.11.21.31.41.5–30–20–1001020304050607080T amb –Ambient T emperature (°C )9611922I –R e l a t i v e T h r e s h o l d F o r w a r d C u r r e n tF T r e l Figure 9. Relative On - State vs. Ambient TemperatureFigure 10. Off - State Current vs. Ambient TemperatureFigure 11. On - State Current vs. Ambient Temperature0.50.60.70.80.91.01.11.21.31.41.5–30–20–1001020304050607080T amb –Ambient T emperature (°C )9611923V –R e l a t i v e O n –S t a t e V o l t a g eTM r e l 1101002030405060708090100T amb –Ambient Temperature(°C)9611924I –O f f –S t a t e C u r r e n t (n A )D R M –250–200–150–100–50050100150200250–2.5–2.0–1.5–1.0–0.50.00.51.01.52.02.5V TM –On–State Voltage (V )9611926I –O n –S t a t e C u r r e n t (mA )T MK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors7Package Dimensions in mm–250–200–150–100–50050100150200250–2.5–2.0–1.5–1.0–0.50.00.51.01.52.02.5V TM –On–State Voltage (V )9611925I –O n –S t a t e C u r r e n t (m A )TM Figure12. On - State Current vs. Ambient Temperature 8Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG Series Vishay SemiconductorsPackage Dimensions in mmK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors9Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution andoperatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personaldamage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyTelephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423Document Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。