元件封装尺寸图2

DIP SOT27-1 SOT38-1(1) SOT102-1 SOT146-1 SOT101-1 SOT117-1 SOT129-1
CDIP SOT73-1 SOT74-1 SOT133-1 SOT152-2 SOT94-1 SOT135-1
plastic small outline package; 14 leads; body width 3.9 mm plastic small outline package; 16 leads; body width 3.9 mm plastic small outline package; 16 leads; body width 7.5 mm plastic small outline package; 20 leads; body width 7.5 mm plastic small outline package; 24 leads; body width 7.5 mm plastic small outline package; 28 leads; body width 7.5 mm
Package outlines
INDEX
PACKAGE VERSIONS
DESCRIPTION
SO SOT108-1 SOT109-1 SOT162-1 SOT163-1 SOT137-1 SOT136-1
SSOP SOT337-1 SOT338-1 SOT339-1 SOT340-1 SOT341-1
OUTLINE VERSION
SOT109-1
IEC 076E07S
REFERENCES
JEDEC
EIAJ
MS-012AC
EUROPEAN PROJECTION
ISSUE DATE
95-01-23 97-05-22
January 1995
4
Philips Semiconductors
Package information
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
பைடு நூலகம்
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.30 0.10
2.45 2.25
OUTLINE VERSION
SOT108-1
IEC 076E06S
REFERENCES
JEDEC
EIAJ
MS-012AB
EUROPEAN PROJECTION
ISSUE DATE
95-01-23 97-05-22
January 1995
3
Philips Semiconductors
Package information
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.30 0.10
2.45 2.25
plastic dual in-line package; 14 leads (300 mil) plastic dual in-line package; 16 leads (300 mil); long body plastic dual in-line package; 18 leads (300 mil) plastic dual in-line package; 20 leads (300 mil) plastic dual in-line package; 24 leads (600 mil) plastic dual in-line package; 28 leads (600 mil) plastic dual in-line package; 40 leads (600 mil)
OUTLINE VERSION
SOT162-1
IEC 075E03
REFERENCES
JEDEC
EIAJ
MS-013AA
EUROPEAN PROJECTION
ISSUE DATE
95-01-24 97-05-22
January 1995
5
Philips Semiconductors
Package information
0.16 0.15
0.050
0.244 0.228
0.041
0.039 0.016
0.028 0.024
0.01
0.01
0.004
0.028 0.012
0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
SO16: plastic small outline package; 16 leads; body width 3.9 mm
Package outlines
SOT109-1
D
y Z 16
pin 1 index 1
e
E
A
X
c HE
vM A
9
A2 A1
8 bp
wM
Q
(A 3)
A
θ Lp L
detail X
SO SO14: plastic small outline package; 14 leads; body width 3.9 mm
Package outlines
SOT108-1
D
y Z 14
pin 1 index 1
e
E
A
X
c HE
vM A
8
A2 A1
7 bp
wM
Q
(A 3)
A
θ Lp L
detail X
0.16 0.15
0.050
0.244 0.228
0.041
0.039 0.016
0.028 0.020
0.01
0.01
0.004
0.028 0.012
0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
Note 1. Corrected 26 June 1997.
PAGE
3 4 5 6 7 8
9 10 11 12 13
14 15 16 17 18 19 20
21 22 23 24 25 26
January 1995
2
Philips Semiconductors
Package information
ceramic dual in-line package; 14 leads; glass seal ceramic dual in-line package; 16 leads; glass seal ceramic dual in-line package; 18 leads; glass seal ceramic dual in-line package; 20 leads; glass seal ceramic dual in-line package; 24 leads; glass seal ceramic dual in-line package; 28 leads; glass seal
0.25
0.49 0.36
0.32 0.23
10.5 10.1
7.6 7.4
1.27
10.65 10.00
1.4
1.1 0.4
1.1 1.0
0.25 0.25
0.1
0.9 0.4
8o
inches
0.10
0.012 0.096 0.004 0.089
0.01
0.019 0.013 0.014 0.009
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.75
0.25 0.10
1.45 1.25
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D(1) E(1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.75
0.25 0.10
1.45 1.25
0.25
0.49 0.36
0.32 0.23