LED Parameter vs.Temperature

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深圳市天成照明有限公司 TX1812HC 智能外控 LED 光源规格书说明书

◆Description（描述）TX1812HC是一个集控制电路与发光电路于一体的智能外控LED光源。

其外型与一个3838LED灯珠相同，每个元件即为一个像素点。

像素点内部包含了智能数字接口数据锁存信号整形放大驱动电路，电源稳压电路，内置恒流电路，高精度RC振荡器，输出驱动采用专利PWM技术，有效保证了像素点内光的颜色高一致性。

数据协议采用单极性归零码的通讯方式，像素点在上电复位以后，DIN端接受从控制器传输过来的数据，首先送过来的24bit数据被第一个像素点提取后，送到像素点内部的数据锁存器，剩余的数据经过内部整形处理电路整形放大后通过DO端口开始转发输出给下一个级联的像素点，每经过一个像素点的传输，信号减少24bit。

像素点采用自动整形转发技术，使得该像素点的级联个数不受信号传送的限制，仅仅受限信号传输速度要求。

LED具有低电压驱动，环保节能，亮度高，散射角度大，一致性好，超低功率，超长寿命等优点。

将控制电路集成于LED上面，电路变得更加简单，体积小，安装更加简便。

◆Applications（领域)LED全彩发光字灯串,LED全彩模组,LED幻彩软硬灯条,LED护栏管，LED外观/情景照明。

LED点光源,LED像素屏,LED异形屏,各种电子产品,电器设备跑马灯。

◆Features（特征)LED内部集成高质量外控单线串行级联恒流IC。

控制电路与芯片集成在SMD3838元器件中，构成一个完整的外控像素点,色温效果均匀且一致性高。

内置数据整形电路，任何一个像素点收到信号后经过波形整形再输出，保证线路波形畸变不会累加。

内置上电复位和掉电复位电路，上电不亮灯。

灰度调节电路（256级灰度可调）。

默认输出恒流值12mA,便于降低灯珠功耗。

默认上电不亮灯。

数据传输频率可达800Kbps，当刷新速率30帧/秒时，级联数不小于1024点。

◆Package Dimensions（封装尺寸)注；1.所有标注尺寸的单位均为毫米2.除了特别注明,所有标注尺寸的公差均为±0.2mm3.封装尺寸：3.5x3.5x1.3mm◆Product naming principle（产品命名原则）◆Pin figure（引脚图）◆Pin function（引脚图）序号符号管脚名功能描述1GND地信号接地和电源接地2NC空脚PCB上做悬空处理3DIN数据输入控制数据信号输入4VDD电源供电管脚，PCB上两供电管脚可做连通处理5VDD电源供电管脚，PCB上两供电管脚可做连通处理6DO数据输出控制数据信号输出Electro-optical characteristics at Ta=25℃（电光特性）◆Absolute maximum ratings at Ta=25℃（绝对最大额定值）参数符号范围单位逻辑电源电压VDD 3.0～+7.5V R/G/B输出端口电压Lol15mA 工作温度Topt-40-85℃℃储存温度Tstg-40-120℃℃◆Electric Spec（电气参数）参数符号最小典型最大单位测试条件芯片输入电压VDD-- 5.07.5V--OUT输出电流Iout--12--mA--高电平输入电压Vin0.7V DD----V VDD=5.0V 低电平输入电压Vil----0.3V DD V VDD=5.0V PWM频率FPWM--4--KHZ--静态功耗IDD--0.3--mA--◆dynamic parameter （动态参数）参数符号最小典型最大单位测试条件数据速率F DIN --8001100KHZ --传输延迟时间Tpzl--500--nsDIN-DO◆The data transmissiontime （数据传输时间）◆Temporal waveform figure （时序波形图）输入码型：连接方式：码码码◆mode of data transmission（数据传输方式）◆mode of data transmission（数据传输方式）G7G6G5G4G3G2G1G0R7R6R5R4R3R2R1R0B7B6B5B4B3B2B1B0注：高位先发，按照GRB的顺序发送数据（G7→G6 0◆Typical application circuit（典型应用电路）◆Typical optical characteristics curves （典型光学特性曲线）1.21.00.80.60.40.20.0400 450 500 550 600 650 700Wavelength[nm]Spectral DistributionRelative Intensity vs.Wavelength(Ta=25。

Agilent HSMx-C120 C177 C197 C265 高性能片级LED数据手册说明书

Agilent H SMx-C120/C177/C197/C265High Performance Chip LEDsData SheetFeatures•High brightness AlInGaP material •0805 or 0603 industry standard footprint with 0.4 mm height for top emitting packages•Also available in right angle emitting and reverse mounting packages•Diffused optics•Operating temperature range of –30°C to +85°C•Compatible with IR soldering •Available in 4 colors•Available in 8 mm tape on 7"diameter reel•Reel sealed in zip locked moisture barrier bags Applications•Membrane switch indicator •LCD backlighting•Push button backlighting •Front panel indicator •Symbol backlighting •Keypad backlighting •Microdisplays•Small message panel signageDescriptionThese chip type LEDs utilize Aluminium Indium Galium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminousefficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber,605 nm Orange, 626 nm Red and 639 nm Deep Red.All packages are binned by both color and intensity, except for red and deep red color.These ChipLEDs come either in low profile top emitting packages (HSMx-C177/C197), in a sideemitting package (HSMx-C120)or in a reverse mount package (HSMx-C265). The right angle ChipLED is suitable for applica-tions such as LCD back lighting.The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct back-lighting of keypads and panels.The reverse mount ChipLED is suitable for space saving.In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMx-C120/C177/C197 and 3000 units per reel for HSMx-C265.These packages are compatible with IR soldering process.Device Selection GuideDimensions (mm)[1,2]Amber RedOrange Deep Red Package Description 1.6 x 0.6 x 1.0HSMA-C120HSMC-C120HSML-C120–Untinted, Non-diffused 2.0 x 1.25 x 0.4HSMA-C177HSMC-C177HSML-C177HSMT-C177Untinted, Diffused 1.6 x 0.8 x 0.4HSMA-C197HSMC-C197HSML-C197HSMT-C197Untinted, Diffused 3.4 x 1.25 x 1.1HSMA-C265HSMC-C265HSML-C265HSMT-C265Untinted, Non-diffusedPackage DimensionsPOLARITYTERMINAL0.40 ± 0.15HSMx-C177POLARITY0.30 ± 0.15TERMINALHSMx-C1970.50 ± 0.15POLARITY0.50 ± 0.15TERMINALHSMx-C265POLARITYTERMINALHSMx-C120NOTES:1. ALL DIMENSIONS IN MILLIMETERS (INCHES).2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.Absolute Maximum Ratings at T A = 25˚CParameter HSMx-Cxxx UnitsDC Forward Current [1]25mAPeak Pulsing Current[2]100mAPower Dissipation60mWReverse Voltage (I R = 100 µA)5VLED Junction Temperature95˚COperating Temperature Range–30 to +85˚CStorage Temperature Range–40 to +85˚CSoldering Temperature See reflow soldering profile (Figures 8 & 9)Notes:1. Derate linearly as shown in Figure 4.2. Pulse condition of 1/10 duty and 0.1 ms width.Electrical Characteristics at T A = 25˚CForward Voltage Reverse Breakdown Capacitance C ThermalV F (Volts)V R (Volts)(pF), V F = 0,Resistance@ I F = 20 mA@ I R = 100 µA f = 1 MHz RθJ–PIN(˚C/W) Part Number Typ.Max.Min.Typ.Typ.HSMA-C120 1.9 2.4511400HSMA-C177/197 1.9 2.4511300HSMA-C265 1.9 2.4511550HSMC-C120 1.9 2.4515400HSMC-C177/197 1.9 2.4515300HSMC-C265 1.9 2.4515550HSML-C120 1.9 2.4520400HSML-C177/197 1.9 2.4520300HSML-C265 1.9 2.4520550HSMT-C177/197 1.9 2.4515300HSMT-C265 1.9 2.4515550V F Tolerance: ± 0.1 VOptical Characteristics at T A = 25˚CLuminous Color,Viewing LuminousIntensity Peak Dominant Angle EfficacyI V (mcd)Wavelength Wavelength 2 θ1/2ηV@ 20 mA[1]λpeak (nm)λd[2](nm)Degrees[3](lm/w) Part Number Color Min.Typ.Typ.Typ.Typ.Typ. HSMA-C120Amber28.590595592155480 HSMA-C177/197Amber28.590595592130480 HSMA-C265Amber28.575595592150480 HSMC-C120Red28.590637626155155 HSMC-C177/197Red28.590637626130155 HSMC-C265Red28.575637626150155HSML-C120Orange28.590609605155370HSML-C177/197Orange28.590609605130370HSML-C265Orange28.575609605150370 HSMT-C177/197Deep Red11.23066063913070HSMT-C265Deep Red11.22566063915070Notes:1.The luminous intensity, I V, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.2.The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.3.θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.Light Intensity (Iv) Bin Limits [1]Intensity (mcd)Bin ID Min.Max.A 0.110.18B 0.180.29C 0.290.45D 0.450.72E 0.72 1.10F 1.10 1.80G 1.80 2.80H 2.80 4.50J 4.507.20K 7.2011.20L 11.2018.00M 18.0028.50N 28.5045.00P 45.0071.50Q 71.50112.50R 112.50180.00S 180.00285.00T 285.00450.00U 450.00715.00V 715.001125.00W 1125.001800.00X 1800.002850.00Y 2850.004500.00Note:1.Bin categories are established for classifica-tion of products. Products may not be avail-able in all categories. Please contact your Agilent representative for information on currently available bins.Amber Color Bins [1]Dom. Wavelength (nm)Bin ID Min.Max.A 582.0584.5B 584.5587.0C 587.0589.5D 589.5592.0E 592.0594.5F594.5597.0Orange Color Bins [1]Dom. Wavelength (nm)Bin ID Min.Max.A 597.0600.0B 600.0603.0C 603.0606.0D 606.0609.0E 609.0612.0F612.0615.0Tolerance: ± 0.5 nmNote:1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins.Tolerance: ± 1 nmTolerance: ± 15%Color Bin LimitsFigure 4. Maximum forward current vs.ambient temperature.Figure 3. Luminous intensity vs. forward current.I F – FORWARD CURRENT – mA00.41.0L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )0.60.20.81.41.2Figure 2. Forward current vs. forward voltage.Figure 1. Relative intensity vs. wavelength.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y – %500550600650700100101V F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T – m AI F M A X – M A X I M U M F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CFigure 5. Relative intensity vs. angle for HSMx-C120.100908070605040302010R E L A T I V E I N T E N S I T Y-90-80-70-60-50-40-30-20-100102030405060708090ANGLE100908070605040302010R E L A T I V E I N T E N S I T Y-90-80-70-60-50-40-30-20-100102030405060708090ANGLEFigure 6. Relative intensity vs. angle for HSMx-C177/197.Figure 9. Recommended Pb-free reflow soldering profile.Figure 10. Recommended soldering pattern for HSMx-C177.R E L A T I V E I N T E N S I T Y – %1000ANGLE806050702010304090-70-50-3002030507090-90-20-80-60-40-1010406080(0.035)0.8 (0.028)BOARDFigure 11. Recommended soldering pattern for HSMx-C197.Figure 7. Relative intensity vs. angle for HSMx-C265.R E L A T I V E I N T E N S I T Y – %1000ANGLE806050702010304090-70-50-3002030507090-90-20-80-60-40-1010406080NOTE:1. ALL DIMENSIONS IN MILLIMETERS (INCHES).TIMET E M P E R A T U R E* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.Figure 8. Recommended reflow soldering profile.T E M P E R A T U R EFigure 14. Reeling orientation.Figure 15. Reel dimensions.Figure 12. Recommended soldering pattern for HSMx-C120.Figure 13. Recommended soldering pattern for HSMx-C265.(0.031)(0.031)(0.047)Ø 20.20 MIN. (Ø 0.795 MIN.)Ø 13.1 ± 0.5 NOTE:1. ALL DIMENSIONS IN MILLIMETERS (INCHES).Figure 16. Tape dimensions.TABLE 1DIMENSIONS IN MILLIMETERS (INCHES)DIM. A ± 0.10 (0.004)DIM. B ± 0.10 (0.004)PART NUMBER DIM. C ± 0.10 (0.004)HSMx-C120 SERIES HSMx-C177 SERIES HSMx-C197 SERIES(0.020 ± 0.002)0.80 (0.031) 0.60 (0.024) 0.60 (0.024)1.90 (0.075)2.30 (0.091) 1.80 (0.071) 1.15 (0.045) 1.40 (0.055) 0.95 (0.037)NOTES:1. ALL DIMENSIONS IN MILLIMETERS (INCHES).2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)TABLE 1DIMENSIONS IN MILLIMETERS (INCHES)DIM. A ± 0.10 (0.004)DIM. B ± 0.10 (0.004)PART NUMBERDIM. C ± 0.10 (0.004)/semiconductorsFor product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5988-5501EN April 22, 20045989-0551ENConvective IR Reflow Soldering For more information on IR reflow soldering, refer toApplication Note 1060, Surface Mounting SMT LED Indicator Components .Storage Condition:5 to 30°C @ 60% RH max.Baking is required under the condition:a) the blue silica gel indicator becoming white/transparent colorb) the pack has been open for more than 1 weekBaking recommended condition:60 ± 5°C for 20 hours.Figure 17. Tape leader and trailer dimensions.END STARTSEALED WITH COVER TAPE.SEALED WITH COVER TAPE.OF CARRIER AND/ORCOVER TAPE.。

温度报警程序

#define _NopempDelay (unsigned char idata us);
void Init18b20 (void);
void WriteByte (unsigned char idata wr); //单字节写入
void read_bytes (unsigned char idata j);
{
EA=1;
EX0=1;
IT0=0;
}
main()
{
delay(200);
system_Ini();
system_Int0();
while(1)
{
GetTemp(); //获取温度
LedNumVal=Temperature; //把实际温度送到LedNumVal变量中
if(LedNumVal>=Hset)//温度报警设备控制
sbit LS138C=P2^4;
sbit baojin=P1^5;
sbit led=P1^1;
sbit key1=P3^2; //报警温度设置键
sbit key2=P2^0;//温度加
sbit key3=P2^1;//温度减
sbit key4=P2^5;
sbit key5=P2^6;//复位启动温度监测
P0=0;
}
}
//main end
//延时程序
void delay(unsigned int i)
{
char j;
for(i; i > 0; i--)
for(j = 200; j > 0; j--);
}
//显示温度num
void display(unsigned int num)
{

Cree DS30 Luxeon V Star LED产品说明书

power light source Luxeon V Star• • • • • • • •TMTechnical Data DS302Portable (flashlight, bicycle) Architectural Detail Lighting DecorativeFiber Optic Alternative Medical ApplicationsLCD Backlights / Light GuidesLuxeon is a revolutionary, energy efficient and ultra compact new light source, combining the lifetime and reliability advantages of Light EmittingDiodes with the brightness of conventional lighting.Luxeon Power Light Sources give you total design freedom andunmatched brightness, creating a new world of light.The Luxeon V offers extreme luminous density, providing lumens per package of 4X a standard Luxeon or up to 50X that of alternative solid state light sources creating new opportunities for solid state lighting todisplace conventional lighting technologies.For high volume applications, custom Luxeon power light source designsare available upon request, to meet your specific needs.Luxeon V Star is available in green, blue,royal blue and cyan.Side EmittingOptical Characteristics at 700mA, Junction Temperature, T J = 25o CRadiation Dominant Wavelength [1] λD or Peak Wavelength [2] λP SpectralHalf-Width [3](nm )Temperature Coefficient of Dominant Wavelength(nm /oC) Pattern Color Min. Typ. Max. ∆λ1/2∆λD / ∆ΤJGreen 520 nm 530 nm 550 nm 35 0.04LambertianCyan 490 nm 505 nm 520 nm 30 0.04Blue460 nm 470 nm 490 nm 25 0.04Royal Blue [2]440 nm 455 nm 460 nm 20 0.04Green 520 nm 530 nm 550 nm 35 0.04 Side EmittingCyan 490 nm 505 nm 520 nm 30 0.04 Blue460 nm 470 nm 490 nm 25 0.04Royal Blue [2]440 nm 455 nm 460 nm 20 0.04Optical Characteristics at 700mA,Junction Temperature, T J = 25o C, ContinuedRadiation patternColor Total included angle [4](degree) θ0.90V viewing angle [5](degree) 2θ 1/2Green 150 150Lambertian Cyan 150 150Blue 150 150Royal Blue 150 150Notes: (for all three optical tables)1. Dominant wavelength is derived fromthe CI E 1931 Chromaticity diagram and represents the perceived color. Lumileds maintains a tolerance of ± 0.5nm for dominant wavelength measurements. 2. Royal Blue product is binned by radiometric power and peak wavelength rather than photometric lumens and dominant wavelength.Lumileds maintains a tolerance of ± 2nm for peak wavelength measurements. 3. Spectral width at ½ of the peakintensity.4. Total angle at which 90% of totalluminous flux is captured.5. θ½ is the off axis angle from lampcenterline where the luminous intensity is ½ of the peak value.6. Cumulative flux percent within ± 45°from optical axis.7. Off axis angle from lamp centerlinewhere the luminous intensityreaches the peak value. On axispeak may be higher than off axispeak.8. All products built with I ndium Gallium Nitride (I nGaN).9. Blue and Royal Blue power lightsources represented here are I EC825Class 2 for eye safety .Optical Characteristics at 700mA,Junction Temperature, T J = 25o C, ContinuedRadiation Typical total flux percentwithin first 45°[6]Typical angle ofpeak intensity [7]Pattern Color Cum Φ45° θPEAKGreen <30% 75° - 85° Side Emitting Cyan <30% 75° - 85° Blue <30% 75° - 85°Royal blue<30% 75° - 85°Electrical Characteristics at 700mA, Junction Temperature, T J = 25o CForward Voltage V F (V)[1] Dynamicresistance [2]Temperature coefficient of forwardvoltage [3](mV/o C) Thermal resistance, junction to board Color Min. Typ. Max. (Ω) R D ∆V F / ∆T J(o C/W) R θJ-BGreen5.436.84 8.31 1.0 -4.0 11 Cyan 5.43 6.84 8.31 1.0 -4.0 11 Blue 5.43 6.84 8.31 1.0 -4.0 11 Royal Blue 5.43 6.84 8.31 1.0 -4.011Absolute Maximum RatingsParameterGreen/Cyan/ Blue/Royal BlueDC Forward Current (mA) [1]700Peak Pulsed Forward Current (mA) 1000Average Forward Current (mA)700ESD Sensitivity [2]± 16,000V HBMLED Junction Temperature (oC)135Notes:1. Proper current derating must beobserved to maintain junctiontemperature below the maximum. For more information, consult Luxeon Design Guide, available upon request. 2. LEDs are not designed to be driven in reverse bias. Please consult Lumileds’ Application Brief AB11 for further information.3. Allowable board temperature toavoid exceeding maximum junction temperature at maximum V f limit at 700 mA based on thermal resistance of Star assembly.Aluminum-Core PCB Temperature (o C)[3]70Storage & Operating Temperature (oC) -40 to +120Wavelength Characteristics, T J = 25o C0.00.20.40.60.81.0400450500550600650700Wavelength (nm)R e l a t i v e S p e c t r a l P o w e r D i s t r i b u t i o nGREENCYANBLBLUEROYAL BLUENotes:1. Lumileds maintains a tolerance of± 0.06V on forward voltage measurements.2. Dynamic resistance is the inverse ofthe slope in linear forward voltage model for LEDs. See Figure 3. 3. Measured between 25o C ≤ TJ ≤110o C at I F = 700mA.Figure 1.Relative I ntensity vs. Wavelength.Light Output Characteristics5060708090100110120130140150-20020406080100120Junction Temperature, T J(oC)R e l a t i v e L i g h t O u t p u t (%)Green Photometric Cyan Photometric Blue Photometric Royal Blue RadiometricFigure 2.Relative Light Output vs. Junction Temperature.Figure 2a. Relative Light Output vs. Junction Temperature for White, Green, Cyan, Blue and Royal Blue.Forward Current Characteristics, T J = 25o C1002003004005006007008000.01.02.03.04.05.06.07.08.0V F - Forw ard Voltage (Volts)I F - A v e r a g e F o r w a r d C u r r e n t (m A )Figure 3.Forward Current vs. Forward Voltage.00.20.40.60.811.20I F - Average Forw ard Current (mA)N o r m a l i z e d R e l a t i v e L u m i n o u s F l u x100200300400200 400 600 800Figure 4.Relative Luminous Flux vs. Forward Current at T J = 25o C maintained.Current Derating Curve Figure 5.Maximum Forward Current vs. Ambient Temperature. Derating based on T JMAX = 135 o C.01002003004005006007008000255075100125150T A- Ambient Temperature (οC)I F - F o r w a r d C u r r e n t (m A )R θJ-A =20o C/WR θJ-A=15oC/WNote:Additional heatsinking is required, even for extremely brief periods. Please consult AB05, Luxeon Thermal Design Guide, for additional information.Representative Typical Spatial Radiation PatternLambertian Radiation Pattern 0 1020 30 40 5060 70 80 90 100 -100 -80 -60 -40 -20 0 20406080100Angular Displacement (Degrees) Typical Upper BoundTypical Lower Bound Figure 6.Representative Typical Spatial Radiation Pattern for Luxeon V Star.Side Emitting Radiation PatternFigure 7.Representative Typical Spatial Radiation Pattern for Luxeon V Star.102030405060708090100-120-100-80-60-40-2020406080100120Angular Displacement (Degrees)R e l a t i v e I n t e n s i t y (%)。

月石三色高性能能效LED光源数据表说明书

ASMT-MT00Moonstone™ Tri-Color Power LED Light SourceData SheetDescriptionThe Moonstone™ T ri-Color Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design enables excellent heat transfer from the package to the motherboard.The low profile package design is suitable for a wide variety of applications especially where height is a constraint. The package is compatible with reflow soldering process. This will give more freedom and flexibility to the light source designer.Applications•Contour lighting•Cove lighting•Architectural lighting•Garden lighting•Decorative lighting•Commercial lighting•Mood lighting Features•Available in Tri-color.•Energy efficient.•Exposed pad for excellent heat transfer.•Suitable for reflow soldering process.•High current operation.•Long operation life.•Wide viewing angle.•Silicone encapsulation.•Non-ESD sensitive (threshold > 16KV).•MSL 5a products. Specifications• 4.0 V (max) at 350 mA for InGaN• 3.0 V (max) at 350 mA for AlInGaP•120° viewing anglePackage DimensionsDevice Selection Guide (T j = 25°C)Part NumberColorLuminous Flux, ΦV [1,2] (lm)Test Current (mA)Dice TechnologyMin.Typ.Max.ASMT-MT00Red 33.040.056.0350AlInGaP Green 43.055.073.0InGaN Blue11.513.019.5InGaNNotes:1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.2. Flux tolerance is ±10%.Notes:1. All dimensions in millimeters.2. Tolerance is ±0.1 mm unless otherwise specified.3. Metal slug is connected to the anode of Red.Part Numbering SystemColor Bin SelectionNumber of Flux Bins Starting from Selected x 2Minimum Flux BinASMT-MT00 – 0 x 1 x 2 x 3 x 4Packaging Option Note:1. Please refer to Page 6 for selection details.Absolute Maximum RatingsParameterAllnGaPInGaNUnitsDC Forward Current [1]350350mA Power Dissipation 10501400mW LED Junction Temperature125125°C Operating Metal Slug Temperature Range at 350 mA -40 to +105-40 to +105°C Storage Temperature Range -40 to +120-40 to +120°CSoldering TemperatureRefer to Figure. 10Note:1. Derate linearly based on Figure. 7 for InGaN and Figure. 8 for AlInGaP .Optical Characteristics at 350 mA (T J = 25°C)Part NumberColorPeak Wavelength,λPEAK (nm)Dominant Wavelength, λD [1] (nm)Viewing Angle, 2θ½ [2] (°)Luminous Efficiency (lm/W)Typ.Typ.Typ.Typ.ASMT-MT00Red 63662512048Green 52252712045Blue46547012011Notes:1. The dominant wavelength, λD , is derived from the CIE Chromaticity Diagram and represents the color of the device.2. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.Electrical Characteristic at 350 mA (T J = 25°C)Dice TypeForward Voltage,V F (Volts) at I F = 350mAReverse Voltage,V R [1]Thermal Resistance, R θj-ms (°C/W) [2]Min.Typ.Max.Typ.AllnGaP 1.8 2.4 3.0Not recommended23InGaN3.23.54.020Notes:1. Not designed for reverse bias operation.2. R θj-ms is Thermal Resistance from LED junction to metal slug. All 3 colors are lighted up at once during measurement.0.00.10.20.30.40.50.60.70.80.91.0WAVELENGTH - nmR E L A T I V E I N T E N S I T Y00.20.40.60.811.21.41.6DC FORWARD CURRENT - mAR E L A T I V E L U M I N O U S F L U X (N O R M A L I Z E D A T 350 m A )05010015020025030035001234FORWARD VOLTAGE - VF O R W A R D C U R R E N T - m AAlInGaP InGaN0.10.20.30.40.50.60.70.80.91-90-60-300306090ANGULAR DISPLACEMENT - DEGREESN O R M A L I Z E D I N T E N S I T Y-0.30-0.20-0.100.000.100.200.30JUNCTION TEMPERATURE,T J - °CF O R W A R D V O L T AG E SHI F T - V (N O R M A L I Z E D A T 25°C )0.020.040.060.080.0100.0120.0140.0160.0180.0JUNCTION TEMPERATURE,T J - °CR E L A T I V E L I G H T O U T P U T - %(N O R M A L I Z E D A T 25°C )Figure 1. Relative Intensity vs. Wavelength.Figure 2. Relative Luminous Flux vs. Mono Pulse Current.Figure 3. Forward Current vs. Forward Voltage.Figure 4. Radiation Pattern.Figure 5. Forward Voltage Shift vs. Junction Temperature.Figure 6. Relative Light Output vs. Junction Temperature.Figure 7. Maximum Forward Current vs. Ambient Temperature for InGaN. Derated based on T JMAX = 125°C, R θJ-A = 30°C/W, 40°C/W and 50°C/W.Figure 8. Maximum Forward Current vs. Ambient Temperature for AlInGaP . Derated based on T JMAX = 125°C, R θJ-A = 30°C/W, 40°C/W and 50°C/W.Figure 9. Maximum Forward Current vs. Metal Slug Temperature. Derated based on T JMAX = 125°C, R θJ-MS = 20°C/W for InGaN and R θJ-MS = 23°C/W for AlInGaP .050100150200250300350400AMBIENT TEMPERATURE, T A - °CM A X AL L O W A B L E D C C UR R E N T - m A 050100150200250300350400AMBIENT TEMPERATURE, T A - °CM A X A L L O W A B L E D C C U R R E N T - m A050100150200250300350400METAL SLUG TEMPERATURE, T MS - °CM A X A L L O W A B L E D C C U R R E N T -m A T E M P E R A T U R E(Acc. to J-STD-020C)Figure 11. Recommended soldering land pattern.Figure 10. Recommended Reflow Soldering [1].Note:For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components.Option Selection DetailsASMT-MT00 – 0 x1 x2 x3 x4x1 – Minimum Flux Binx2 – Number of Flux Bins Starting from Selected x1 x3 – Color Bin Selectionx4 – Packaging OptionFlux Bin Selection [x1, x2]Individual reel will contain part from 1 bin only.x1Minimum Flux BinRed Green Blue0Full DistributionA H J Dx2Number of Flux Bins Starting from Selected x1 Red Green Blue0 Full DistributionA222Flux Bin LimitBin IDLuminous Flux (lm) at I F = 350 mAMin.Max.A 5.57.0B7.09.0C9.011.5D11.515.0E15.019.5F19.525.5G25.533.0H33.043.0J43.056.0K56.073.0 Tolerance for each bin limits is ±10%Color Bin Selection [x3]Individual reel will contain part from 1 bin only.x3Color Bin CombinationRed Green Blue0 Full Distribution A, B, C and D B and C Color Bin LimitColor Bin ID Min.Max. Red Full Distribution620.0635.0 Green A515.0520.0B520.0525.0C525.0530.0D530.0535.0 Blue B465.0470.0C470.0475.0 Tolerance: ±1 nmPackaging Option [x4]Selection Option1Tape and Reel ExampleASMT-MT00-00001X1 = 0 – Full DistributionX2 = 0 – Full DistributionX3 = 0 – Red (Full Distribution), Green (A, B, C and D), Blue (B and C)X4 = 1 – Tape and Reel OptionTape and Reel – Option 1Figure 12. Carrier tape dimensions.DimValueA 08.80 ±0.10B 016.45 ±0.10K 0 3.60 ±0.1E 1.75 ±0.10F 11.50 ±0.10W 24.0 ±0.10P 16.0 ±0.10Q'ty/Reel250 unitsAll dimensions in mm.Figure 13. Carrier tape leader and trailer dimensions.POCKETS SEALED WITH COVER TAPE.*Note:Tape & Reel Packaging only applicable as per this datasheet only.+1.00Figure 14. Reel dimensions.For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Handling PrecautionThe encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN5288 for detail information.Moisture SensitivityThis product is qualified as Moisture Sensitive Level 5a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details.A. Storage before use– Unopened moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating.– It is not recommended to open the (MBB) prior to assembly (e.g. for IQC).B. Control after opening the MBB– The humidity indicator card (HIC) shall be read immediately upon opening of MBB.– The LEDs must be kept at <30°C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 24 hours.C. Control for unfinished reel– For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH.D. Control of assembled boards– If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 24 hours.E. Baking is required if:– HIC “10%” indicator is not blue and “5%” indicator is pink.– The LEDs are exposed to condition of >30°C/60% RH at any time.– The LEDs floor life exceeded 24 hours.Recommended baking condition: 60±5°C for 20hrs.Disclaimer: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.。

城市LED灯光数据手册 10W-500W 黄色 CLU048-1818C4-22AL1K3说明书

DATA SHEETIntroduction Performance Characteristics Mechanical Dimensions Characteristic Curves ReliabilityPacking Specification PrecautionP 2P 3P 5P 6P 9P 10P 11 CITILED COB SeriesAmber ModelCLU048-1818C4-22AL1K31. Introduction1-1. Product Description1-2. FeaturesCITIZEN ELECTRONICS is the first COB manufacture. Our advanced knowledge and packaging technology for many years has excellent reliability and high quality of our products. CITILED COB Series covers a wide range of luminous flux from a 10W incandescent bulb to a 500W mercury lamp in general lighting sources. The element arrangement of LED package is capable of utilizing light more effectively and higher performance. The new version of CITILED COB Series succeed to reduce the thermal resistance significantly. New version creates more options to match luminaire's products design (ex. High performance , Cost effective , Higher lumen density ,Increased allowable max. If). The outline and LES size is same since version 1. 3-step MacAdam ellipse color definition at Tj=85℃ is available.・ Mechanical Dimensions :28.0×28.0×1.4 (mm)・ Package Structure :Aluminum Base Chip on Board ・ Reference Assembly :M3 screw, Connector ・ CRI (Ra):65 Typ.・ Nominal CCT :2,200K ・ Chromaticity Range :ANSI C78.377:2015.・ Thermal Resistance :0.17C/W ・ Maximum drive current :3240 mA ・ RoHS compliant・ Better die arrangement for optics・ Wide range of luminous flux and high efficacy・ Improved lumen density compared with previous version ・ UL recognized component (E358566)CLU048-1818C4-22A L1K3[1][2][3][4][5][1][2][3][4][5]Product NomenclatureCRI (Ra)CLU04818182200K Typ.65Product shape Die count in series Die count in parallel Nominal CCT2. Performance Characteristics2-1. Electro Optical Characteristics2-2. Absolute Maximum RatingsSymbol RatingPi 202.8*1If 3240*1Ir 1Top -40 ~ +100Tst -40 ~ +100Tc 105*2Tj140*3*1. Input power and forward current are the values when the LED is used within the range of the derating curve in this data sheet.*2. Refer to 3. Outline drawing for Tc measurement point.ParameterInput Power (W)Forward Current (mA)Reverse Current (mA)*3. D.C. Current : Tj = Tc + Rj-c × PiStorage Temperature (C)Case Temperature (C)Junction Temperature (C)Operating Temperature (C)( Tj=85C )R9Tc=25C*Min.Typ.Min.Min.Typ.Max Typ.Typ.Min.Typ.Max.CLU048-1818C4-22AL1K32200K-65-10,19311,583-12,6641381,62047.852.056.20.17Notes :1. Citizen Electronics maintains forward voltage +/-3%, luminous flux +/-10%,Ra and R9 +/-1.*Values of Luminous flux at Tc=25C are provided as reference only.Product codeForward Current ( mA )ThermalResistanceRj-c ( C/W )Nominal CCT Luminous flux( lm )Efficacy ( lm/W )Voltage( V )Ra T ｊ=85CCRI2-3. Chromaticity CharacteristicsNote : Citizen Electronics maintains chromaticity ( x, y ) +/-0.0050.350.400.450.500.400.450.500.55yxx-y chart CIE19312,200KBlack Body LocusANSIANSI C78. 377:20152,200K( 0.5018, 0.4153)* The chromaticity center refers to ANSI C78.377:2015. Please refer to ANSI C78. 377 for the chromaticity center.0.52590.43420.50450.43440.47990.39670.49930.3967Color Region Nominal CCT Center Point ( x, y )ANSI parametera ( x, y )b ( x, y )c ( x, y )d ( x, y ) ( Rated current , Tj=85℃ )3. Mechanical DimensionsUnit : mmTolerances unless otherwise specified : +/-0.3・Internal Circuit18 s 18 p Protection deviceLED deviceCathodeAnodeMarking 1 : Serial No.Marking 2 : CRI CCTDies count in parallel Dies count in series CLU048H 18 18 ** **4. Characteristic Curves4-1. Forward Current Characteristics / Temperature CharacteristicsForward Current vs. Forward VoltageForward Current vs. Relative Luminous FluxTc=25C Tc=25CCase Temperature vs. Forward VoltageCase Temperature vs. Relative Luminous FluxIf=1620mAIf=1620mA48.050.052.054.056.058.060.001000200030004000V f [V ]If [mA]0%20%40%60%80%100%120%140%160%180%200%01000200030004000R e l a t i v e L u m i n o u s F l u x [a .u .]If [mA]50.051.052.053.054.055.056.00255075100V f [V ]Tc [C]0%20%40%60%80%100%120%0255075100R e l a t i v e L u m i n o u s F l u x [a .u .]Tc [C]4-2. Optical CharacteristicsSpectrumTj=85℃If=1620mA0%10%20%30%40%50%60%70%80%90%100%380430480530580630680730780R a d i a t i v e I n t e n s i t yWave length [nm]2,200KRadiation Characteristic 0%20%40%60%80%100%X Y80°70°60°50°40°30°20°10°-80°-70°-60°-50°-20°-30°-40°-10°90°-90°Case Temperaturevs. Allowable Forward Current05001000150020002500300035000255075100125I f [m A ]Tc [C]4-2. Optical Characteristics (continued)4-3. Derating Characteristics5. Reliability5-1. Reliability Test5-2. Failure Criteria-40 C × 30 minutes – 100 C × 30 minutes, 100 cycle85 C, 85 %RH for 500 hoursThermal Shock TestContinuous Operation Test High Temperature Storage TestLow Temperature Storage Test Moisture-proof Test IF=1620mA Tj=140C (with Al-fin) ×1000hrsTest Item100 C × 1000 hours -40 C × 1000 hours Test ConditionIF=1620mA Ta=25C (with Al-fin) ×1000hrs ( Tc=25C )U defines the upper limit of the specified characteristics. S defines the initial value.Note : Measurement shall be taken between 2 hours and 24 hours, and the test pieces should be return to the normal ambient conditions after the completion of each test.Total Luminous FluxΦvIf=1620mA<S × 0.85Measuring Item Symbol Measuring ConditionFailure CriteriaForward Voltage Vf If=1620mA >U × 1.11675001(2)(1)(3)Example of indication label1. TYPE e.g. CLU048-1818C4-22AL1K32. P.No. ( Cutomer's P/N )3. Lot No.e.g. 4. Quantity(1) Last two digit of the year 16 : year 2016(2) Production month 7 : JuryNote: October, November and December are designated X,Y and Z.(3) CE's control number 6. Packing Specification6-1. PackingAn empty tray is placed on top of a 6-tier tray which contain 30 pieces each.(Smallest packing unit: 180 pieces)A label with product name, quantity and lot number is placed on the upper empty tray.Tray (Dimensions: 310 x 210 x 12 mm / Materials: Electrically conductive PS)Unit : mmProduct 30 pcs/trayCUSTOMERTYPEP.NO Lot No Q'ty: CLU***-******-******* : ****** : ******* : ***--- ( 1 ) --- ( 2 ) --- ( 3 ) --- ( 4 )7. Precaution7-1. Handling with care for this product-Both the light emitting area and white rim around the light emitting area is composed of resin materials.Please avoid the resin area from being pressed, stressed, rubbed, come into contact with sharp metal nail(e.g. edge of reflector part) because the function, performance and reliability of this product are negatively impacted.-Please be aware that this product should not come into contact with any other parts while incorporating in your lightingapparatus or your other products.-Please be aware that careful handling is required after the attachment of lead wires to prevent the application of any loadto the connections.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-2. Countermeasure against static electricity-Handling of this product needs countermeasures against static electricity because this is a semiconductor product.-Please take adequate measures to prevent any static electricity being produced such as the wearing of a wristband oranti-static gloves when handling this product.-Every manufacturing facility in regard to the product (plant, equipment, machine, carrier machine and conveyance unit)should be connected to ground and please avoid the product to be electric-charged.-ESD sensitivity of this product is over 1,000V (HBM, based on JEITA ED-4701/304).-After assembling the LEDs into your final product(s), it is recommended to check whether the assembled LEDs aredamaged by static electricity (electrical leak phenomenon) or not.-It is easy to find static damaged LED dies by a light-on test with the minimum current value.7-3. Caution of product assembly-Regarding this product assembling on the heat sink, it is recommended to use M3 screw.It might be good for screw tightening on the heat sink to do temporary tightening and final tightening.In addition, please don’t press with excess stress on the product.-The condition of the product assembling on the heat sink and the control of screw tightening torque needs to be optimized according to the specification of the heat sink.-Roughness, unevenness and burr of surface negatively impact thermal bonding between the product and heat sink andincrease heat thermal resistance between them.Confidence of thermally and mechanical coupling between the product and heat sink are confirmed by checkingthe mounting surface and measuring the case temperature of the product.-In order to reduce the thermal resistance at assembly, it might be good to use TIM (Thermal Interface Material) on whole contact surface of the product.In case of using thermal grease for the TIM, it might be good to apply uniformly on the contact surface of the product.In case of using thermal sheet for the TIM, it might be good to make sure that the product is NOT strained by stress when the screws are tightened for assembly.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-4. Thermal Design-The thermal design to draw heat away from the LED junction is most critical parameter for an LED illumination system. High operating temperatures at the LED junction adversely affect the performance of LED’s light output and lifetime. Therefore the LED junction temperature should not exceed the absolute maximum rating in LED illumination system. -The LED junction temperature while operation of LED illumination system depends upon thermal resistance of internal LED package (Rj-c), outer thermal resistances of LED package, power loss and ambient temperature. Please take both of the thermal design specifications and ambient temperature conditions into consideration for the setting of driving conditions.-For more information, please refer to application note "Thermal Management", "Instruction Manual(COB LED Package)".7-5. Driving Current-A constant current is recommended as an applying driving current to this product.In the case of constant voltage driving, please connect current-limiting resistor to each products in series and control the driving current to keep under the absolute maximum rating forward current value.-Electrical transient might apply excess voltage, excess current and reverse voltage to the product(s).They also affect negative impact on the product(s) therefore please make sure that no excess voltage, no excess current and no reverse voltage is applied to the product(s) when the LED driver is turn-on and/or turn-off.-For more information, please refer to application note "Driving", "Instruction Manual(COB LED Package)".7-6. Lighting at a minimum current value-A minimum current value of lighting of all dice is 15mA.When a minimum current is applied, LED dice may look different in their brightness due to the individual difference of the LED element, and it is not a failed product.7-7. Electrical Safety-This product is designed and produced according to IEC 62031:2008(IEC 62031:2008 LED modules for general lighting. Safety specification)-Dielectric voltage withstand test has been conducted on this product to see any failure after applyingvoltage between active pads and aluminum section of the product, and to pass at least 500V.-Considering conformity assessment for IEC62031:2008, almost all items of the specification depend uponyour final product of LED illumination system.Therefore, please confirm with your final product for electrical safety of your product.As well, the products comply with the criteria of IEC62031:2008 as single LED package.- A minimum current value of lighting of all dice is 90 mA. When a minimum current is applied, LED dice may look different in their brightness due tothe individual difference of the LED element, and it is not a failed product.7-8. Recommended soldering Condition (This product is not adaptable to reflow process.) -For manual solderingPlease use lead-free soldering.Soldering shall be implemented using a soldering bit at a temperature lower than 350C, and shall befinished within 3.5 seconds for one land.No external force shall be applied to resin part while soldering is implemented.Next process of soldering should be carried out after the product has return to ambient temperature.Contacts number of soldering bit should be within twice for each terminal.* Citizen Electronics cannot guarantee if usage exceeds these recommended conditions.Please use it after sufficient verification is carried out on your own risk if absolutely necessary.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-9. Eye Safety-The International Electrical Commission (IEC) published in 2006 IEC 62471”2006 Photobiological safety of lamps and lamp systems ” which includes LEDs within its scope.When sorting single LEDs according to IEC 62471, almost all white LEDs can be classifiedas belonging to either Exempt Group (no hazard) or Risk Group 1 (low risk).-However, Optical characteristics of LEDs such as radiant flux, spectrum and light distribution are factorsthat affect the risk group determination of the LED, and especially a high-power LED, that emits lightcontaining blue wavelengths,might have properties equivalent to those of Risk Group 2 (moderate risk).-Great care should be taken when directly viewing an LED that is driven at high current, has multipleuses as a module or when focusing the light with optical instruments, as these actions might greatlyincrease the hazard to your eyes.-It is recommended to regard the evaluation of stand-alone LED packages as a referenceand to evaluate your final product.7-10. This product is not designed for usage under the following conditions.If the product might be used under the following conditions, you shall evaluate its effect and appropriate them. In places where the product might:-directly and indirectly get wet due to rain and/or at place with the fear.-be damage by seawater and/or at place with the fear-be exposed to corrosive gas (such as Cl2, H2S, NH3, SOx, NOx and so on) and/or at place with the fear.-be exposed to dust, fluid or oil and/or at place with the fear.Precautions with regard to product use(1) This document is provided for reference purposes only so that CITIZEN ELECTRONICS' products are used as intended. CITIZEN ELECTRONICS neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of CITIZEN ELECTRONICS or any third party with respect to the information in this document. (2) All information included in this document such as product data, diagrams, charts, is current as of the date this document is issued.Such information, however, is subject to change without any prior notice.Before purchasing or using any CITIZEN ELECTRONICS' products listed in this document, please confirm the latest product information with a CITIZEN ELECTRONICS' sales office, and formal specifications must be exchanged and signed by both parties prior to mass production.(3) CITIZEN ELECTRONICS has used reasonable care in compiling the information included in this document, but CITIZEN ELECTRONICS assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document.(4) Absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, CITIZEN ELECTRONICS assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness fora particular purpose, accuracy of information, or no infringement.(5) Though CITIZEN ELECTRONICS works continually to improve products' quality and reliability, products can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards to minimize risk and avoid situations in which a malfunction or failure of a product could cause loss of human life, bodily injury or damage to property, including data loss or corruption.In addition, customers are also responsible for determining the appropriateness of use of any information contained in this document such as application cases not only with evaluating by their own but also by the entire system.CITIZEN ELECTRONICS assumes no liability for customers' product design or applications.(6) Please contact CITIZEN ELECTRONICS' sales office if you have any questions regarding the information contained in this document, or if you have any other inquiries.CITIZEN Micro HumanTech is a registered trademark of Citizen Holding Co., Japan.CITILED is a registered trademark of CITIZEN ELECTRONICS CO., LTD. Japanand are trademarks or registered trademarks of CITIZEN HOLDINGS CO., LTD. JAPAN.is a trademark or a registered trademark of CITIZEN ELECTRONICS CO., LTD. JAPAN.。

欧司朗LED规格书

F4152AHigh Efficiency 40 mil ThinGaN ®LED (455nm)2007-09-131Features •High efficiency due to new ThinGaN ® concept •Lambertian Emission pattern•Ideal for LCD backlighting and coupling in light guides •Polarity: n-side up•Wavelength (typ.): 455 nm •Technology: ThinGaN ®•Grouping parameters: luminous intensity, wavelengthApplications •Outdoor displays •Optical indicators•Backlighting (LCD, switches, keys, displays, illuminated advertising, general lighting)•Marker lights (e.g. steps, exit ways, etc.)•Signal and symbol luminaireType Ordering Code DescriptionF4152AQ65110A704040 mil high efficiency ThinGaN ® chip, 450 - 465 nmElectrical values1)(T A = 25 °C)Parameter Symbol Value2)Unitmin.typ.max. Dominant wavelengthI F = 350 mA, pulsedλdom450465nm Reverse voltageI R = 10µAV R10VForward voltageI F = 350 mA, pulsed VF2.73.8VRadiant PowerI F = 350 mA, pulsedΙV32 a.u.1)Measurement limits describe actual settings and do not include measurement uncertainties. Each wafer and fragmentof a wafer is subject to final testing. The wafer or its pieces are individually attached on foils (rings). All el. values are referenced to the vendor's measurement system (correlation to customer product(s) is required). Measurement uncertainty +/-15% for brightness, +/- 1nm for wavelength and +/- 0.1V for voltage.2)Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations oftechnical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.2007-09-1322007-09-133Binning Maximum Ratings 1)Radiant Power 450 - 455 nm455 - 460 nm460 - 465 nm28.0 - 35.2 a.u.A1B1C135.2 - 41.2 a.u.A2B2C241.2 - 48.4 a.u.A3B3C348.4 - 56.8 a.u.A4B4C4> 56.8 a.u.A5B5C5ParameterSymbol Value Unit Maximum Operating temperature range T op -40...+100°C Maximum forward current (T A = 25°C)I F 700mA Minimum forward current (T A = 25°C)I F100mA Maximum surge Current (T A = 25°C)t p = 10 µs, D = 0.05I peak0.7A Maximum junction temperatureT j125°C1)Maximum ratings are strongly package dependent and may differ between different packages. The values given represent the chip in an OSRAM Opto Semiconductor’s Platinum Dragon® package.Mechanical values1)Parameter Symbol Value2)Unitmin.typ.max.Length of chip edge (x-direction)L x0.95 1.00 1.05mm Length of chip edge (y-direction)L y0.95 1.00 1.05mm Diameter of the wafer D50.8mmDie height H170190210µm Diameter of bondpad d130150170µm Additional informationMetallization frontside Gold partialMetallization backside AuDie bonding Epoxy bonding1)All chips are checked according to the following procedure and the OSRAM OS specification of the visual inspectionA63501-Q0013-N001-*-76G3:Unless otherwise described below, the quality level of the final visual inspection shall comply to an AQL 0,4 (according MIL-STD-105D, level II), if the customer performes an incoming visual inspection of a shipment. The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure by QM after the final visual inspection is not installed.2)Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations oftechnical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice2007-09-1342007-09-135Chip OutlinesDimensions are specified as typicalvalues as follows: mm (inch).Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved.Attention please!The information generally describes the type of component and shall not be considered as assured characteristics or detailed specification.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our sales organization.Handling and Storage Conditions:Storage time for wafers in sealed condition shall not exceed 6 months (storage ambient conditions: Ta=15...30°C;relative humidity: < 60%).The hermetically sealed shipment lot shall be opened under temperature and moisture controlled cleanroom environment only. Customer has to follow the according rules for disposition of material that can be hazardous for humans and environment. Dice have to be handled ESD sensitive.PackingChips are placed on a blue foil with minimum size of 18 x 18 cm².For shipment the wafers of a shipment lot are arranged to stacks. The stack is put in a plastic ESD bag with a maximum of 14 wafers in one bag. A maximum of 4 bags is put in a packaging box. A maximum of 5 packaging boxes is put in a shipping carton which is sealed for storage and shipment.Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You will have to bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.Label and shipping documentsEach wafer is identified with a sticker, which is attached to each wafer. The label shows chip type, wafer number, quantity, binning and the minimum, average and maximum values of voltage, luminous intensity and wavelength. Each wafer shipment includes an additional document, which summarizes the content.Design objectives a) workabilityThe chip design was developed and released based on the the vendor’s standard assembly procedures and packaging. Bond strength properties are in accordance to MIL_STD-750D, method 2037. Whether the chip fits to the customer’s product(c) with its according die and wire bond procedures and packaging must be evaluated by the customer himself. If workability problems arise after this release a mutually conducted problem solving procedure has to be set up, if thechips are suspected of contributing to the problemsb) chip characteristicsThe chips are produced by the vendor with best effort, but on chip level a subset of the chip characteristics can be determined only. Performance of the chip in the customer’s product(s) can only be determined by the customer himself. Returns/ComplaintsTo return material because of technical or logistical reasons a RMA-number is necessary. Samples for analysis purposes can be send to OSRAM OS without credit.Shipping Conditions:If not otherwise arranged, the “General Conditions for the supply of products and services of the electrical and electronics industry” apply for any shipment. If these documents are not familiar to you, please request them at our nearest sales office.Components used in life-support devices or systems must be expressly authorized by us for such purpose! Critical components2), may only be used in life-support devices or systems3) with the express written approval of OSRAM OS.1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information. This is not a specified value.2)A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.3)Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.2007-09-136。

FLOEFD LED热分析

32.9901671
背板里面局部温度分布
Parameter Solid Temperature [°C]
Minimum
Maximum
Average
25.1312481
50.519461
32.9901671
背板温度分布
灯条温度分布
灯条温度分布（局部）
灯条上表面温度
Parameter
Minimum Maximum Average
4
已知边界条件和材料
部份结构材质说明表（螺丝、线材等小部材可省略掉）
部材背板胶框
材质
AL5052 ABS
导热系数 139
0.17
铝挤灯条双面胶反射片导光板扩散片
灌孔导热材料 AL6063
FR4
PMMA
PMMA
PMMA
200
0.8
0.7
0.13
0.13
0.13
导热系数的单位为W/m.K
Solid Temperature [°C] 41.5167458 77.7635193 58.6127385
灯条下表面温度
Parameter
Minimum Maximum Average
Solid Temperature [°C] 41.3906453 53.6849057 50.6993782
背板网格
背板局部网格
光源表面网格
运行求解后自动收敛得到结果
• 结果分析
后部温度分布
内部温度分布
内部温度分布（无背板）
内部温度分布（局部）
背板温度分布
Parameter Solid Temperature [°C]
Minimum

深圳市拓展光电有限公司 TZ35UVA+UVC02-016说明书

Model: TZ35UVA+UVC02-016Date:2020/10/10NO:SZTZ-DS-041Par NO : F.35.00041SPECIFICATION承制方确认制作审核业务品质接受方确认工程制定工程审核采购品质深圳市拓展光电有限公司SHENZHEN DEVELOPMENT PHOTOELECTRIC CO., LTD曹雪军版本修订日期文件修订内容备注A02020/10/10首次发行魏峰制作胡满意日期2020年10月10日核准魏峰日期2020年10月10日版本号A0受控日期2020年10月10日TZ35UVA+UVC02-016DatasheetThe 3535LED light source is a high-performance energy-saving device that can handle high heat and high drive current.此款3535LED 光源是一种高性能节能器件，可以处理高热量和高驱动电流。

The Purple LED light source with peak wavelength ranging from 270nm to 280nm and 390-400nm.紫外LED 光源峰值波长为270nm ~280nm,390-400nm.This part has a foot print that is compatible to most of the same size LED in the market today.此器件的焊盘兼容当今市场上大部分相同大小的LED 。

FEATURES/特点◼Deep UV LED with emissionwavelength between 270nm to 280nm and 390-400nm具有发射波长的深紫外光LED 在270nm 至280nm 和390-400nm.◼Compatible with reflow soldering process兼容回流焊工艺◼Low thermal resistance/热阻低◼Wide viewing angle at 120°120°大发光角度◼Superior ESD protection 优越的ESD 保护◼Environmental friendly, RoHS compliance材质环保，符合RoHS 要求Note: The information in this document is subject to change without notice.注：本文件中的信息如有变更，恕不另行通知。

蓝光固体激光器的热效应问题和温度控制

学校编码：10384 分类号密级学号：S*********UDC硕士学位论文蓝光固体激光器的热效应问题和温度控制 Heat Effect Problem of Blue Laser and It’s Temperature Control 黄剑平答辩委员会主席：评阅人：2006 年 5月指导教师姓名：许惠英副教授专业名称：无线电物理论文提交日期：2006年5 月论文答辩时间：2006年5 月学位授予日期：2006年月蓝光固体激光器的热效应问题和温度控制黄剑平指导教师许惠英副教授厦门大学厦门大学学位论文原创性声明兹呈交的学位论文，是本人在导师指导下独立完成的研究成果。

本人在论文写作中参考的其他个人或集体的研究成果，均在文中以明确方式标明。

本人依法享有和承担由此论文产生的权利和责任。

声明人（签名）：年月日厦门大学学位论文著作权使用声明本人完全了解厦门大学有关保留、使用学位论文的规定。

厦门大学有权保留并向国家主管部门或其指定机构送交论文的纸质版和电子版，有权将学位论文用于非赢利目的的少量复制并允许论文进入学校图书馆被查阅，有权将学位论文的内容编入有关数据库进行检索，有权将学位论文的标题和摘要汇编出版。

保密的学位论文在解密后适用本规定。

本学位论文属于1、保密（），在年解密后适用本授权书。

2、不保密（）（请在以上相应括号内打“√”）作者签名：日期：年月日导师签名：日期：年月日摘要目前，激光领域中蓝光固体激光器由于自身具有效率高、结构紧凑、输出稳定、寿命长等优点，加上其在许多领域具有广泛的应用前景而倍受关注。

但目前输出功率达到瓦级水平的蓝光激光器的技术还不够成熟，因而进行这方面的研究具有重要的现实意义。

本论文的课题是研制瓦级蓝光固体激光器。

由于影响蓝光激光器工作性能的最主要的一个因素就是其晶体的工作温度，本文就蓝光固体激光器工作晶体的热效应问题进行探讨，并介绍了激光晶体温度控制器的设计。

LED显示设备指令手册

LED Display Device Command© 2020 Hangzhou Hikvision Digital Technology Co., Ltd. All rights reserved.This Manual (hereinafter referred to be “the Manual”) is the property of Hangzhou Hikvision Digital Technology Co., Ltd. or its affiliates (hereinafter referred to as “Hikvision”), and it cannot be reproduced, changed, translated, or distributed, partially or wholly, by any means, without the prior written permission of Hikvision. Unless otherwise expressly stated herein, Hikvision does not make any warranties, guarantees or representations, express or implied, regarding to the Manual, any information contained herein.About this ManualPictures, charts, images and all other information hereinafter are for description and explanation only. The information contained in the Manual is subject to change, without notice, due to updates or other reasons. Please use this Manual with the guidance and assistance of professionals trained in supporting the Product. LEGAL DISCLAIMERTO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, THE MANUAL IS PROVIDED "AS IS" AND “WITH ALL FAULTS AND ERRORS”. HIKVISION MAKES NO REPRESENTATIONS OR WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT. IN NO EVENT WILL HIKVISION BE LIABLE FOR ANY SPECIAL, CONSEQUENTIAL, INCIDENTAL, OR INDIRECT DAMAGES INCLUDING, AMONG OTHERS, DAMAGES FOR LOSS OF BUSINESS PROFITS, BUSINESS INTERRUPTION, OR LOSS OF DATA, CORRUPTION OF SYSTEMS, OR LOSS OF DOCUMENTATION, WHETHER BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), OR OTHERWISE, IN CONNECTION WITH THE USE OF THE MANUAL, EVEN IF HIKVISION HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR LOSS.Command Type（Optional ）Command NameCommand Function Format More Information Usage Example (Optional)t1 modeEnter production test program [0] testAllExternalDeviceTest all external device [1] testSPI_FLASHRead and write flash when get jffs2 file system,verify whether succeeds [2] test+B24DDR[0x55555555]Test emory chip read and write [3] testPS_PLTransmissionARM and FPGA communication verification [4] enableFPGALoad FPGA [5] getLocalLANInfoLAN IP [6] testRawFlashNo file system read and write flash [7] testI2CTest I2C [8] testRTCClockTest RTC clock [9] testSerialPortTest serial port, none actually [a] testTemperatureSensorTest temperature sensor [b] phytestNetworkChipTest network chip phy [c] testGPPortRegisterReadAndWriteTest GP port register read and write [d] test88E1543ReadAndWriteTest 88E1543 read and write [e] resetSPIFlashReset SPI Flash [f] setSPIFlashAddressModeSet SPI Flash address mode [g] testButtonInterruptionTest button interruption [h] testGPIOTest GPIO [i] testEncryptionTest encryption [j] testPS-PLInterruptionTest PS-PL interruption [k] getSGMIIPHYChipLinkStatusGet SGMII PHY chip link status [l] setSGMIIChipComboPortModeSet SGMII chip combo port mode [m] getDebugPHYlLinkStatus Get debug PHY chip link status [n] getSGMII PHY RJ45 ComboPortStatusGet SGMII PHY chip RJ45 combo port status [o] testWatchdogWatchdog test, real hardware is not connected [p] getPressAndHoldButtonStatusGet press and hold button status [r] testRTL8214ResetTest RTL8214 reset [s] getSGMIIandFPGAStatusGet SGMII and FPGA status [t] getSGMII PHYChipTypeGet SGMII PHY chip type [u] getSGMII 8218 PHY LinkStatusGet SGMII 8218 PHY link status [v] readRawPartitionRead from raw partition [w] writeRawPartitionWrite to raw partition [x] cutdieCut die [y] print8218ConfigurationRegisterValuePrint 8218 configuration register value [z] getfbAddressInfoGet fb address information getLedDispCfgGet display brightness and color temperature getAttributeDisplay size, width and height of receiving card getScreenModelScreen type, and driver IC getEdidGet EDID configuration getRunTimeSending card running time resourceusagecpu, memory, network usage fpga xxRead FPGA xx register value versionFPGA version information recvcardversionReceiving card version information fdestsizeZoom target parameter ftestFPGA read and write test register fparaminitFPGA parameter is successfully configurated or not.fvideowhVideo input source resolution information fdisplayenEnable display on video wall fvoutfrmView input and output framerate fsourcetypeSource type fdectcontrolLamp no-current detection fsrcsizeInput source size fmarginScaling parameter fmakevsaxi_clk count value frgballView brightness status frgb3chRGB brightness adjust coefficient falignhv Pre-crop, aligned width and heightProduction/TestStatus Viewingfdma2drdparam Receiving card horizontal length fdmawrmode Memory read and write mode mdio_read SMI bus read PHY register tool getColorInfo Color temperatureuploadChip Trigger ps176 upgrade debugMenu Operate OSDunpack Non-4K board updatek upgrade tool unpack_4K4K board updatek upgrade toolupdate_kernel_part Non-4K board BSP program separately upgrade toolupdate_kernel_part_4K 4K board BSP program separately upgrade toolt1Semi-finished test tool, basic external device testpsh psh service program, dubug login serial port dropbear ssh service program, ssh loginping Customize ping command, specify NIC, and force send arp packageopen_telnet Open telnet service, disable current service connection, cannot be usedopen_ssh ssh service open toolmemdev Physical address read and write test tool mdio_write SMI bus line write PHY register tooliperf Network code test toolfb_test fb loading read and write test toolflash_erase flash formatting tool for formatting upgrade flash_monitor System mirror production command hostapd、hostapd_cliiwconfig、iwlist、iwpriv wifi、wpa_cli、wpa_supplicant WIFI configuration and background service programParameters Configuration。

LED调光器MOS管资料

P-Channel 30-V (D-S) MOSFETFEATURES•Halogen-free Option Available •TrenchFET ® Power MOSFETAPPLICATIONS•Load Switch for Portable DevicesPRODUCT SUMMARYV DS (V)R DS(on) (Ω)I D (A)a, b Q g (Typ.)- 300.088 at V GS = - 10 V - 2.7 4.1 nC0.130 at V GS = - 4.5 V- 2.2GTO-236(SOT-23)SDTop ViewDTS3401Notes:a.Surface Mounted on 1" x 1" FR4 board.b.t = 5 s.c.Maximum under Steady State conditions is 166 °C/W.ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise notedParameterSymbol Limit Unit Drain-Source Voltage V DS - 30VGate-Source VoltageV GS± 20Continuous Drain Current (T J = 150 °C)a, bT C = 25 °CI D- 3.5AT C = 70 °C - 2.8T A = 25 °C - 2.7a, b T A = 70 °C- 2.2a, bPulsed Drain Current (10 µs Pulse Width)I DM - 12Continuous Source-Drain Diode Current a, bT C = 25 °C I S- 1.5T A = 25 °C - 0.91a, bMaximum Power Dissipationa, bT C = 25 °CP D 1.8WT C = 70 °C 1.14T A = 25 °C 1.1a, b T A = 70 °C0.7a, b Operating Junction and Storage T emperature Range T J , T stg- 55 to 150°CSoldering Recommendations (Peak Temperature)c260THERMAL RESISTANCE RATINGSParameterSymbol Typical Maximum Unit Maximum Junction-to-Ambient a, c t ≤ 5 s R thJA 90115°C/WMaximum Junction-to-Foot (Drain)Steady StateR thJF5570Notes:a.Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.b.Guaranteed by design, not subject to production testing.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.SPECIFICATIONS T J = 25 °C, unless otherwise notedParameter Symbol Test Conditions Min.Typ.Max.UnitStaticDrain-Source Breakdown Voltage V DS V GS = 0 V , I D = - 250 µA- 30V V DS Temperature Coefficient ΔV DS /T J I D = - 250 µA - 32mV/°C V GS(th) Temperature Coefficient ΔV GS(th)/T J 4.5Gate-Source Threshold Voltage V GS(th) V DS = V GS , I D = - 250 µA - 1- 3VGate-Source LeakageI GSS V DS = 0 V , V GS = ± 20 V - 100nA Zero Gate Voltage Drain Current I DSS V DS = - 30 V , V GS = 0 V - 1µA V DS = - 30 V , V GS = 0 V , T J = 55 °C- 10On-State Drain Current aI D(on)V DS ≤ 5 V , V GS = - 10 V - 6A Drain-Source On-State Resistance a R DS(on) V GS = - 10 V , I D = - 3.5 A 0.0730.088ΩV GS = - 4.5 V , I D = - 2.5 A 0.1100.138Forward T ransconductance a g fsV DS = - 10 V, I D = - 3.5 A7SDynamic bInput Capacitance C iss V DS = - 15 V , V GS = 0 V, f = 1 MHz340pFOutput CapacitanceC oss 67Reverse Transfer Capacitance C rss 51Total Gate Charge Q g V DS = - 15 V , V GS = - 4.5 V , ID = - 2.5 A 4.1 6.2nC Gate-Source Charge Q gs 1.3Gate-Drain Charge Q gd 1.8Gate Resistance R g f = 1 MHz10ΩTurn-On Delay Time t d(on) V DD = - 15 V, R L = 15 Ω I D ≅ - 1 A, V GEN = - 4.5 V , R g = 1 Ω4060ns Rise Timet r 4060Turn-Off Delay Time t d(off) 2040Fall Timet f 1730Turn-On Delay Time t d(on) V DD = - 15 V, R L = 15 Ω I D ≅ - 1 A, V GEN = - 10 V, R g = 1 Ω 5.510Rise Timet r 1325Turn-Off Delay Time t d(off) 1730Fall Timet f7.715Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current I S T C = 25 °C- 1.5A Pulse Diode Forward Current I SM - 12Body Diode VoltageV SD I S = - 0.75 A, V GS = 0 V- 0.8- 1.2V Body Diode Reverse Recovery Time t rr I F = - 2.5 A, dI/dt = 100 A/µs, T J = 25 °C1730ns Body Diode Reverse Recovery Charge Q rr 1120nC Reverse Recovery Fall Time t a 12nsReverse Recovery Rise Timet b5On-Resistance vs. Drain Current and Gate VoltageGate ChargeCapacitanceOn-Resistance vs. Junction TemperatureTYPICAL CHARACTERISTICS 25Source-Drain Diode Forward VoltageThreshold VoltageOn-Resistance vs. Gate-to-Source VoltageSingle Pulse Power, Junction-to-AmbientSafe Operating Area, Junction-to-AmbientTHERMAL RATINGS (T A = 25 °C, unless otherwise noted)No t e•The characteristics shown in the two graphs- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)- Normalized Transient Thermal Impedance Junction-to-Foot (25°C)are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part ca pab ili t i es can widely vary depending on actual application parameters and operating co nditio ns.SOT-23 (TO-236): 3-LEADDimMILLIMETERS INCHESMinMaxMinMaxA 0.89 1.120.0350.044A 10.010.100.00040.004A 20.88 1.020.03460.040b 0.350.500.0140.020c 0.0850.180.0030.007D 2.803.040.1100.120E 2.10 2.640.0830.104E 1 1.201.400.0470.055e 0.95 BSC 0.0374 Ref e 1 1.90 BSC0.0748 RefL 0.400.600.0160.024L 10.64 Ref 0.025 Ref S 0.50 Ref0.020 Refq3°8°3°8°ECN: S-03946-Rev. K, 09-Jul-01DWG: 5479A P P L I C A T I O N N O T ERECOMMENDED MINIMUM PADS FOR SOT-231DisclaimerALL PRODUCT, PRODUCT SPE CIFICATIONS AND DATA ARE SUBJE CT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Din-Tek Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Din-Tek ”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Din-Tek makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Din-Tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Din-Tek ’s knowledge of typical requirements that are often placed on Din-Tek products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Din-Tek ’s terms and conditions of purchase,including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Din-Tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Din-Tek product could result in personal injury or death.Customers using or selling Din-Tek products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Din-Tek personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Din-Tek . Product names and markings noted herein may be trademarks of their respective owners.Material Category PolicyDin-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European P arliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.Please note that some Din-Tek documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.Din-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Din-Tek documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21conform to JEDEC JS709A standards.P-Channel 30-V (D-S) MOSFETFEATURES•Halogen-free Option Available •TrenchFET ® Power MOSFETAPPLICATIONS•Load Switch for Portable DevicesPRODUCT SUMMARYV DS (V)R DS(on) (Ω)I D (A)a, b Q g (Typ.)- 300.088 at V GS = - 10 V - 2.7 4.1 nC0.130 at V GS = - 4.5 V- 2.2GTO-236(SOT-23)SDTop ViewDTS3401。

C3535绿色贴片式LED灯珠参数

Parramtter(参数）
sxmbol标准
Min最小值
typ中间值
Max最大值
Unit单位
Test couditian测试条件
Luminous Intensity(亮度)
IV
mcd
IF=350mA
Luminous flux(光通量）
Φ
90
100
LM
IF=350mA
wave Lemgth(波长)
入
515
Parramtter(参数）
sxmbol标准
Min最小值
typ中间值
Max最大值
Unit单位
Test couditian测试条件
Luminous Intensity(亮度)
IV
mcd
IF=350mA
Luminous flux(光通量）
Φ
80
90
LM
IF=350mA
wave Lemgth(波长)
入
515
520
525
nm
rature(色温）
CCT
K
IF=350mA
Forward Voltage（正向电压）
VF
3.0
3.5
V
IF=350mA
Reverse Current(反向电流)
IR
5
μ A
VR=5V
Color renderinging dex（显色指数）
CRI (Ra)
350
mA
Reverse Voltage(反向电压）
5
V
Operation Temperature Range(工作温度）
70
℃
Storage TemPerature Range(储存温度）

LED背光源3014规格书

The suggestion pick-up head is as same as follow the Sketch Map.
About the downward pressure of Pick-up Head, Please consult the Absolute Maximum Ratings.
45° 60°
75° 90°
60 715.0 90
Radiation Angle
7
Relative Luminosity
Absolute Maximum Ratings
Parameter
Symbol Rating
Reverse Voltage
Vr
5
Forward Current
If
30
Power Dissipation
** The luminous intensity tolerance is ± 7%. *** Life time means that estimated time to 50% degradation of initial luminous intensity.
Life test board information, please refer to appendix II.
Temperature Humidity
No
Items[1]
Other
(℃)
(பைடு நூலகம்)
condition
High temperature
1
100
-----
storage
Criteria for judgment
Hrs Times Sampling LED
Vf @

高功率UV-A LED数据手册说明书

FEATURESzHigh power UV-A LEDz Dimensions: 3.45 mm x 3.45 mm x 2.0 mm z Small package with high efficiency z Surface mount technology z Package: 1000pcs / reelz Soldering methods: IR reflow soldering z Moisture sensitivity level: 1 z RoHS compliantAPPLICATIONSzPhotocatalytic Purificationz Blood and Counterfeit money detectionz UV curing in nail salon, dental, and poster printing applications z UV Sensor LightPACKAGE MATERIALSzMaterial as follows: Package: CeramicsEncapsulating resin: Silicone resin Electrodes: Au platingATTENTIONObserve precautions for handlingelectrostatic discharge sensitive devicesPACKAGE DIMENSIONSSELECTION GUIDEKTDS-3534UV405B3.45 x 3.45 mm UV LED With Ceramic SubstrateRECOMMENDED SOLDERING PATTERN(units : mm; tolerance : ± 0.1)Notes:1. All dimensions are in millimeters (inches).2. Tolerance is ±0.2(0.008") unless otherwise noted.3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.4. The device has a single mounting surface. The device must be mounted according to the specifications.Notes:1. θ1/2 is the angle from optical centerline where the radiant intensity is 1/2 of the optical peak value.2. *Radiant flux with asterisk is measured at 700mA; Radiant flux: +/-15%.3. Radiant flux value is traceable to CIE127-2007 standards.Part NumberEmitting Color (Material)Lens TypeΦe(mW) [2] @500mA*700mA Viewing Angle [1]Code. Min. Max. Typ. 2θ1/2KTDS-3534UV405BUltraviolet (InGaN)Water ClearC14 640 740 120°C15740850C16 850 1000 ---*1100800ABSOLUTE MAXIMUM RATINGS at T A =25°CELECTRICAL / OPTICAL CHARACTERISTICS at T A =25°CNotes:1. Forward voltage: ±0.1V.2. Wavelength value is traceable to CIE127-2007 standards.3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.ParameterSymbol Value UnitWavelength at Peak Emission I F = 500mA [Min.] λpeak 400Wavelength at Peak Emission I F = 500mA [Typ.] 405 Wavelength at Peak Emission I F = 500mA [Max.] 410Spectral Bandwidth at 50% Φ REL MAX I F = 500mA [Typ.] Δλ15 nmForward Voltage I F = 500mA [Typ.]V F [1]3.4VForward Voltage I F = 500mA [Max.] 3.9 Allowable Reverse Current [Max.] I R 85 mA Temperature Coefficient of V FI F = 500mA, -10°C ≤ T ≤ 100°CTC V-3.0mV/°CnmParameterSymbolValueUnitPower Dissipation P D 2.8 W Reverse Voltage V R 5 V Junction Temperature T j [1] 115 °C Operating Temperature T op -40 to +100 °C Storage Temperature T stg -40 to +115°C DC Forward Current I F [1] 700 mA Peak Forward CurrentI FM [2] 1000 mA Thermal Resistance (Junction / Ambient) R th JA [1] 10 °C/W Thermal Resistance (Junction / Solder point)R th JS [1]5°C/WNotes:1. Results from mounting on metal core PCB, mounted on pc board-metal core PCB is recommend for lowest thermal resistance.2. 1/10 Duty Cycle, 0.1ms Pulse Width.3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.TECHNICAL DATAULTRAVIOLETTAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm)HANDLING PRECAUTIONSCompare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry.2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.1. Handle the component along the side surfaces by using forceps or appropriate tools.Designing the Position of LED on a Board1. No twist / warp / bent / or other stress shall be applied to the board after mounting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED.3. Do not split board by hand. Split with exclusive special tool.4. If an aluminum circuit board is used, a large stress by thermal shock might cause a solder crack. For this reason, it is recommended an appropriate verification should be taken before use.Appropriate LED mounting is to place perpendicularly against the stress affected side . 2. Depending on the position and direction of LED,the mechanical stress on the LED package can be changed.Refer to the following figure.JEDEC Moisture SensitivityLevelFloor LifeSoak RequirementsStandardAccelerated Equivalent Time ConditionsTime (hours) Conditions Time (hours)Conditions1Unlimited≤ 30 °C / 85% RH168 + 5 / - 085 °C / 85% RH--Kingbright recommends keeping the LEDs in the sealed moisture-barrier packaging until immediately prior to use. Any unused LEDs should be returned to the moisture-barrier bag and closed immediately after use.4-1. There should be enough space inside the nozzle to avoid contact with the dome lens during pick up. 4-2. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4-3. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4-4. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production.5. As silicone encapsulation is permeable to gases, some corrosive substances such as H 2S might corrode silver plating of lead-frame. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.ESD Protection During ProductionElectric static discharge can result when static-sensitive products come in contact with the operator or other conductors.The following procedures may decrease the possibility of ESD damage:1. Minimize friction between the product and surroundings to avoid static buildup.2. All production machinery and test instruments must be electrically grounded.3. Operators must wear anti-static bracelets.4. Wear anti-static suit when entering work areas with conductive machinery.5. Set up ESD protection areas using grounded metal plating for component handling.6. All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less.7. Maintain a humidity level of 50% or higher in production areas.8. Use anti-static packaging for transport and storage.9. All anti-static equipment and procedures should be periodically inspected and evaluated for proper functionality.Heat Generation1. Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design.The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in thisspecification.2. Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Permissible Forward Current vs. Ambient temperature on characteristics in this specification.Please also take measures to remove heat from the area near the LED to improve the operational characteristics on the LED.3. The equation ①indicates correlation between T j and T a, and the equation ② indicates correlation between T j and T sT j = T a + R th JA *W ……… ①T j = T s + R th JS *W ……… ②T j = dice junction temperature: °CT a = ambient temperature: °CT s = solder point temperature: °CR th JA = heat resistance from dice junction temperature to ambient temperature: °C / WR th JS = heat resistance from dice junction temperature to Ts measuring point: °C / WW = inputting power (I F x V F): WREFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESSNotes:1. Don't cause stress to the LEDs while it is exposed to high temperature.2. The maximum number of reflow soldering passes is 2 times.3. Reflow soldering is recommended. Other soldering methods are not recommended as they mightcause damage to the product.Criteria For Judging DamageItemSymbol Test Conditions Criteria for JudgementMin. Max. Forward Voltage V F I F = 500mA -Initial Level x 1.1Radiant FluxΦeI F = 500mAInitial Level x 0.7-Note: The test is performed after the board is cooled down to the room temperature.RELIABILITY TEST ITEMS AND CONDITIONSThe reliability of products shall be satisfied with items listed below Lot Tolerance Percent Defective (LTPD) : 10%No. Test ItemStandardsTest ConditionTest Times / CyclesNumber of Damaged 1 Continuous operating test - T a = 25°C +10/-5°C, RH = 55+/-20%RHI F = maximum rated current*1,000 h0 / 22 2 High Temp. operating test - T a = 100°C(+/-10°C)I F = maximum rated current*1,000 h0 / 22 3 Low Temp. operating test -T a = -40°C+3/-5°CI F = maximum rated current*1,000 h0 / 22 4 High temp. storage test JEITA ED-4701/200 201 T a = 100°C(+/-10°C)T a = maximum rated storage temperature1,000 h0 / 22 5 Low temp. storage test JEITA ED-4701/200 202 T a = -40°C+3/-5°C1,000 h 0 / 22 6 High temp. & humidity storage testJEITA ED-4701/100 103T a = 60°C+5/-3°C, RH = 90+5/-10%RH 1,000 h 0 / 22 7 High temp. & humidity operating test-T a = 60°C+5/-3°C, RH = 90%+5/-10%RHI F = maximum rated current*1,000 h 0 / 22 8 Resistance to Soldering Heat(Reflow Soldering)JEITA ED-4701/300 301Tsld = 260°C, 10sec 2 times 0 / 22 9Solderability(Reflow Soldering)JEITA ED-4701/303 303ATsld = 245°C+/-5°C, 5+/-1sec 1 time over 95%0 / 2210 Temperature Cycle operating test--40°C(30min) ~ 25°C(5min) ~ 100°C(30min) ~ 25°C(5min) I F = derated current at 100°C 10 cycles 0 / 2211 Temperature Cycle JEITA ED-4701/100 105-40°C(30min) ~ 25°C(5min) ~ 100°C(30min) ~ 25°C(5min) 100 cycles 0 / 22 12 Thermal shock testMIL-STD-202G T a = -40°C(15min) ~ 100°C(15min) 500 cycles 0 / 22 13Electric Static Discharge (ESD)JEITA ED-4701/300 304C = 100pF, R = 1.5K Ω V = 8000V3 times Negative / Positive0 / 2214 Vibration test JEITA ED-4701/400 403100 ~ 2000 ~ 100HZ Sweep 4min.200m/s²3directions, 4cycles48 min. 0 / 22Note: Refer to forward current vs. derating curve diagram.PACKING & LABEL SPECIFICATIONSPackaging1.The LEDs are packed in cardboard boxes after taping.2.The label on the minimum packing unit shows: Part Number, Lot Number, Ranking, Quantity.3.In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.4.The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautionsmust be taken to prevent any damage.5.The boxes are not water resistant and therefore must be kept away from water and moisture.6.When the LEDs are transported, we recommend that you use the same packing methods as Kingbright’s.PRECAUTIONARY NOTES1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer tothe latest datasheet for the updated specifications.3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. Ifcustomer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threateningliabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.6. All design applications should refer to Kingbright application notes available at /application_notes。

温润光电有限公司LED灯产品说明书

SpecificationClient Name:Client P/N:Wenrun P/N:LUE50333Date:Customer confirm Approved by Checked by Issued by尹亭亭Jiangsu Wenrun Optoelectronic Co. Rev:1Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1Tel:*************Fax ：*************Page 1of 7◆Features:●High speed response.●High reliability and long life.●Low power consumption.●Available in red,blue,white ,green,yellow colors.●Suitable for pulse operation.●This product doesn’t contain restriction Substance,comply ROHS standard.◆Descriptions:●The LED lamps are available with different colors,intensities,epoxy colors,etc.●The series specially designed for applications requiring higher brightness.●Superior performance in outdoor environment.◆Applications:●These lamp are widely used for various application.●Board for display.●Indication of all kinds.●Traffic Signal.◆Selection Guide:Part No.ChipLens Type Material Emitting Color LUE50333AlGaInPHigh Super RedWater Clear◆Package Dimensions:NOTES ：1、All dimensions are in millimetres (mm).2、Tolerance is ±0.25mm(0.01”)unless otherwise noted.1.0min2.54typ0.5typ1.5max5.81.07.74.925.0min1.ANODE2.CATHODE21Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1Tel:*************Fax ：*************Page 2of 7◆Absolute Maximum Rating （Ta=25℃）ParameterSymbolHigh Super RedUnitPower Dissipation P d 70mW Pulse Forward Current I FP 100mA DC Forward Current I F 25mA Reverse Voltage V R 6V Electrostatic Discharge(HBM )ESD 2000V Operating Temperature Range Topr -40～+85℃Storage Temperature Range Tstg -40～+100℃Soldering TemperatureTsol260±5℃Notes ：Soldering time ≤5seconds.I FP condition:pulse width ≤1ms ,duty cycle ≤1/10.Tsol condition :3mm for the base of the epoxy bulb.◆Electrical Optical Characteristics （Ta=25℃）Parameter Symbol High Super RedUnit Test Condition Min.Typ.Max.Luminous Intensity I V 4200--22500mcd I F =20mA Forward Voltage V F 1.8-- 2.3V I F =20mA Reverse Current I R ----50uA V R =6V Dominant Wavelength λd 618--628nm I F =20mA Peak Emission WavelengthλP --635--nm I F =20mA Viewing Angle2θ1/2--10--deg I F =20mA Spectral Line Half Width Δλ--20--nm I F =20mARecommond forward currentI F (rec)--20--mA--Notes:1.Tolerance of Luminous Intensity±10%2.Tolerance of Dominant Wavelength ±2nm3.Tolerance of Forward voltage ±0.05V4.Luminous Intensity is measured by WENRUN’s equipment on bare chips◆BIN rangeLuminous intensity(tolerance is±10%@I F=20mA):BIN CODE Min.(mcd)Max.(mcd)U42005500V55007000W70009000X900011500Y1150015000Z1500022500Dominant Wavelength(tolerance is±2nm@I F=20mA):BIN CODE Min.(nm)Max.(nm)K618620L620622M622625N625628Forward voltage(tolerance is±0.05V@I F=20mA):BIN CODE Min.(V)Max.(V)F 1.8 1.9G 1.9 2.0H 2.0 2.1J 2.1 2.2K 2.2 2.3Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel:*************Fax：*************Page3of7Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1Tel:*************Fax ：*************Page 4of 7◆Reliability(1)Test Items and ConditionsNO Test Item Test ConditionsSample Ac/Re 1Temperature Cycle -40±5℃→25±5℃→100±5℃→25±5℃(30min ，5min ，30min ，5min)100Cycles 200/12High Temperature Storage Ta ：100±5℃Test time=1000HRS(-24HRS,+72HRS)200/13High Temperature And High Humidity Working Ta ：85±5℃，R H :85±5%，I F =20mA Test time=500HRS(-24HRS,+72HRS)200/14Low Temperature Storage Ta ：-40±5℃Test time=1000HRS(-24HRS,+72HRS)200/15Operating Life Test Connect with a power I F =20mA Ta=Under room temperatureTest time=1000HRS(-24HRS,+72HRS)200/16Solder Resistance T.Sol=260±5℃one time Dwell Time=10±1Secs 200/17Thermal Shock-40±5℃→100±5℃(15min ，15min)100Cycles200/1(2)Criteria of judging the damageItem Symbol Test condition Criteria for judgement Min.Max.Forward voltage V F I F =20mA /U.S.L*1.1Reverse current I R V R =5V /15uA Luminous intensity I V I F =20mA L.S.L*0.7/Wave length λD/λPI F =20mA /U.S.L ±2nmAppearance/View checkNo mechanical damage*U.S.L:Upper standard levelL.S.L:Lower standard levelJiangsu Wenrun Optoelectronic Co.,LTD Rev:1Tel:*************Fax ：*************Page 5of 7◆Typical Electro-Optical Characteristics Curves ：Ta=25℃2.2 2.41.82.0Ta=25℃Relative Luminous Intensity Vs. WavelengthTa=25℃40302010Forward Current (mA)1.46800752550600560Wavelength (nm)520Forward Current Vs Ambient Temperature640Relative Luminous Intensity (%)10050Forward Current Vs Relative LuminosityForward Voltage (V)1.6Forward VoltageForward Current Vs.40502030175125150255075Relative Luminosity(%)1000010040301020Forward Current(mA)6020400Ambient Temperature Ta (°C)Relative Luminosity Vs Ambient Temperature80100Relative Luminosity (%)501002001506020400Ambient Temperature Ta (°C)80If=20mAForward Current (mA)105020020°0°-20°-10°10°50°70°60°40°1.080°90°0.500.5Radiation Angle-60°-70°1.0-80°-90°-50°-40°-30°30°Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1Tel:*************Fax ：*************Page 6of 7◆Label Form Specification◆Storage and application notices1、Storage1.Before opening package:the LEDs should be kept at 18-30℃,related humility:30-70%RH.They should beused out within 3moths;2.The internal and esterand boxes can not be contacted with ground to prevent absorption of moisture;3.No acid,alkali,salt,corrosive and explosive gas;away from sunlight and keep the environment clean;2、Application1.Do not use any unknown chemical liquid to clean LED,it will damage the LED resin surface;use the alcohol under the room temperature if necessary but less than 1min;2.When forming lead frame,the lead frame should be bent at a point at least 2mm from the base of epoxy.The forming should be done before soldering which can avoid epoxy’s broken and internal structure’s damage.Forming must be operated by the specific jig or the qualified operator to make sure the lead frame and distance are as same as the circuit board.Specific is shown as below,Mark:“○”means cor rect ，“×”means incorrect.3.Do not apply any bending stress to the base of the LED.The stress to the base may damage the internal connection which causes the electric character’s failure.Manufacturer Part No.QuantityClassing Marking Code Sealing Date (year-month-day)WENRUN OPTO.TYPE ：LUE50333QUTY ：xxxxPCS CODE ：xxxxxxxx DATE ：xxxxxx4.a.Soldering iron power:under30W;soldering temperature:295℃±5℃;soldering time:within3sec.(only1time);b.Soldering temperature in solder machine:250℃±10℃;soldering time:within5sec.c.Soldering temperature during wave soldering process:235℃±10℃,soldering time:within5sec.5.The LEDs should be soldered at the coordinated position on the PCB;the distance from soldering point toepoxy resin should be3mm at least.If the2nd soldering process required,3mins must be left to ensure the high temperature status can return to room temperature.But the recommended soldering time is only 1time in principle.6.If solder LEDs on one PCB by the soldering iron,do not solder the2lead frames of one LED at the sametime.7．Note of Electrical matter:1One-way conduction,LED does not allow the reverse driving;2LED is a kind of constant current component which can not be lighted by the constant voltage mode;a smaller voltage fluctuation can cause the large current fluctuation which causes the failure ofLED;Each LED should be drove under constant current mode if in a parallel circuit design,otherwise,the colour and brightness will be nonuniform;When the environmental temperature ris ing,the LED junction temperature will rise,internal resistance will decrease,so the current will be increased by the constant voltage power which short the life span;3If the brightness of lighting source can meet the requirement,we recommend using the driving current less than the rated current,in order to improve the product’s reliability;8.LED is a kind of electrostatic sensitive devises,anti-static measures have to be processed during storage and operation:1LED production workshop should lay anti-static floor and ground connection,the work table have to use the anti-static materials and cover a table mater with the surface resistance of106-109Ω2Production machine:REFLOW,SMT equipment,electric iron,test equipment;all the equipments must be well grounded,and the grounding alternating current impedance should be less than1.0Ω.A fan need to be installed on the equipments and production processes that easy to generate staticelectricity;the operators must wear anti-static clothing,shoes,wristband,and gloves,etc.in theprocess;3LEDs must be contained in the anti-static box,and all the package material should be the anti-static materials;9.The details electronic characters can refer to our product specification.◆Notes:1、Above specification may be changed without notice.We will reserve authority on material change for above specification.2、When using this product,please observe the absolute maximum ratings and the instructions for the specification sheets.We assume no responsibility for any damage resulting from use of the product which does not comply with the instructions included in the specification sheets.Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel:*************Fax：*************Page7of7。

led 驱动函数

led 驱动函数
LED驱动函数是用来控制LED亮灭的函数。

它通常包含以下参数和功能：
1. 引脚控制参数：指示要控制的LED所连接的引脚。

这可以是数字引脚或模拟引脚，具体取决于使用的硬件平台。

2. 亮度控制参数：用来设置LED的亮度级别。

这可以是一个数字值，通常范围在0到255之间，其中0表示LED完全关闭，255表示LED以最大亮度点亮。

3. 开启和关闭功能：用来控制LED的开启和关闭。

开启功能将引脚设置为高电平，从而点亮LED；关闭功能将引脚设置为低电平，从而关闭LED。

具体的LED驱动函数实现方式可能因硬件平台和编程语言而异。

以下是一个示例C语言的LED驱动函数：
```c
void ledControl(int pin, int brightness) {
pinMode(pin, OUTPUT); // 设置引脚为输出模式
analogWrite(pin, brightness); // 设置LED的亮度级别
}
```
在上述示例中，函数ledControl接受两个参数：pin表示LED连接的引脚，brightness表示LED的亮度级别。

该函数首先将引脚设置为输出模式，然后使用analogWrite函数设置LED的亮度级别。

这样就可以通过调用ledControl函数来控制LED的亮灭。

LED调光器用到的MOS管

Power MOSFETFEATURES•Isolated Package•High Voltage Isolation = 2.5 kV RMS (t = 60 s;f = 60 Hz)•Sink to Lead Creepage Distance = 4.8 mm •P-Channel•175 °C Operating Temperature •Dynamic dV/dt Rating •Low Thermal Resistance •Lead (Pb)-free AvailableNotes a.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).b.V DD = - 25 V, starting T J = 25 °C, L = 5.0 mH, R G = 25 Ω, I AS = - 5.3 A (see fig. 12).c.I SD ≤ - 6.7 A, dI/dt ≤ 90 A/µs, V DD ≤ V DS , T J ≤ 175 °C.d.1.6 mm from case.PRODUCT SUMMARYV DS (V)- 60R DS(on) (Ω)V GS = - 10 V0.40Q g (Max.) (nC)12Q gs (nC) 3.8Qgd (nC) 5.1ConfigurationSingleABSOLUTE MAXIMUM RATINGS T C = 25 °C, unless otherwise notedPARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DS - 60V Gate-Source Voltage VGS ±20Continuous Drain Current V GS at - 10 VT C = 25 °C I D - 5.2A T C = 100 °C- 3.8Pulsed Drain Current aI DM -21Linear Derating Factor0.18W/°C Single Pulse Avalanche Energy b E AS 120mJ Repetitive Avalanche Current a I AR - 5.2 A Repetitive Avalanche Energy a E AR 2.7mJ Maximum Power Dissipation T C = 25 °CP D 27W Peak Diode Recovery dV/dt cdV/dt -4.5V/ns Operating Junction and Storage Temperature Range T J , Tstg- 55 to + 175°C Soldering Recommendations (Peak Temperature)for 10 s 300d Mounting Torque 6-32 or M3 screw10 lbf · in 1.1N · mG TO-236(SOT-23)S DTop V ie wNotesa.Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).b.Pulse width ≤ 300 µs; duty cycle ≤ 2 %.THERMAL RESISTANCE RATINGSPARAMETERSYMBOL TYP.MAX.UNIT Maximum Junction-to-Ambient R thJA -65°C/WMaximum Junction-to-Case (Drain)R thJC- 5.5TYPICAL CHARACTERISTICS 25 °C, unless otherwise notedFig. 1 - Typical Output Characteristics, T C= 25 °CFig. 2 - Typical Output Characteristics, T C = 175 °CFig. 3 - Typical Transfer CharacteristicsFig. 4 - Normalized On-Resistance vs. TemperatureFig. 5 - Typical Capacitance vs. Drain-to-Source VoltageFig. 6 - Typical Gate Charge vs. Gate-to-Source VoltageFig. 7 - Typical Source-Drain Diode Forward VoltageFig. 8 - Maximum Safe Operating AreaFig. 9 - Maximum Drain Current vs. Case Temperature Fig. 10a - Switching Time Test Circuit Fig. 10b - Switching Time WaveformsFig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-CaseFig. 12b - Unclamped Inductive WaveformsFig. 12c - Maximum Avalanche Energy vs. Drain CurrentFig. 13a - Basic Gate Charge WaveformFig. 13b - Gate Charge Test CircuitC u rrent reg Same type as D.U.T.SOT-23 (TO-236): 3-LEADDimMILLIMETERS INCHES MinMax Min Max A0.89 1.120.0350.044 A10.010.100.00040.004 A20.88 1.020.03460.040b0.350.500.0140.020c0.0850.180.0030.007D 2.803.040.1100.120E 2.10 2.640.0830.104E1 1.20 1.400.0470.055e0.95 BSC0.0374 Refe1 1.90 BSC0.0748 RefL0.400.600.0160.024L10.64 Ref0.025 RefS0.50 Ref0.020 Refq3°8°3°8°ECN: S-03946-Rev. K, 09-Jul-01DWG: 5479A P P L I C A T I O N N O T ERECOMMENDED MINIMUM PADS FOR SOT-23Power MOSFETFEATURES•Isolated Package•High Voltage Isolation = 2.5 kV RMS (t = 60 s;f = 60 Hz)•Sink to Lead Creepage Distance = 4.8 mm •P-Channel•175 °C Operating Temperature •Dynamic dV/dt Rating •Low Thermal Resistance •Lead (Pb)-free AvailablePRODUCT SUMMARYV DS (V)- 60R DS(on) (Ω)V GS = - 10 V0.40Q g (Max.) (nC)12Q gs (nC) 3.8Q gd(nC) 5.1ConfigurationSingleG TO-236(SOT-23)S DTop V iew。

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Affected by the path from die to heat sink
• Convection – Important!
Heat dissipated from the heat sink to ambient
• Radiation – Not Applicable
12-Jul-13
12-Jul-13
Future Electronics – Proprietary and Confidential
=
lD T
(lD2-lD1) (T2-T1) = .09 nm/ C
5
Heat Transfer Basics
Heat Transfer Modes: • Conduction – Important!
4
Dominant l vs. Temperature
λD T ( nm/ C )
K
As LED’s get hotter, colors shift to longer wavelengths.
Example: What is the color shift of an amber LED whose Tj is 40C? What will lD be at Tj 40 C? lD1 = 590 nm (@T1= 25 C) lD2 = ? nm (@T2= 40 C)
Color Amber Red Blue Green Cyan
K (nm/º C) .09 .03 .04 .04 .04
lD = (.09 nm/ C)* (T2-T1) = (.09 nm/ C)*(40 -25 C) = 1.35 nm Therefore, lD2 = 591.35 nm
12-Jul-13
Future Electronics – Proprietary and Confidential
15
Arrays - Parallel Thermal Resistances
Pd - Total Array
Total_Array_RQ = LED_Emitter_RQ N
Pd - Emitter
Q = Dissipated Power (Pd) = Pd = Vf * If Heat transfer from a Luxeon LED emitter takes place primarily through conduction
Future Electronics – Proprietary and Confidential
RQJ -A = RQ J - S + RQ S - B + RQ B -A Epoxy Di-electric layer
Tslug
RQSlug - Board
Tboard
RQBoard -Ambient
Tambient
Metal-core PCB Board - Heat Sink Interface
LuxeonI/III/V Circa 1997 If = 350 ~ 1000 mA RQ = 15
Thermal Design Evolution of LED Packages
12-Jul-13
Future Electronics – Proprietary and Confidential
12
Thermal Management
TSMA 2004
Presented by: Tian Pei Sze
12-Jul-13
Future Electronics – Proprietary and Confidential
1
Thermal Management
Heat Transfer Basics Steady State Thermal Model Examples Thermal Overstress
+25°C +85°C
1
100 V -2mV / °C f 50 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage (V)
0 570
580
590
lpeak 600
610
620
630
Wavelength [nm]
12-Jul-13
Future Electronics – Proprietary and Confidential
12-Jul-13
Future Electronics – Proprietary and Confidential
10
Heat Transfer and LEDs
LED Energy
Visible Light 15%
Heat 85%
100 Watt GLS Incandescent Bulb Energy
IR 83%
12-Jul-13
11
Thermal Characteristics of LED’s
L E D C h i p
C a t h o d e L e a d
P C B o a r d
-
+
Heat
5mm Lamp Circa 1970 If = 30 mA RQ = 240
SuperFlux Circa 1992 If = 70 mA RQ = 120
13
Node Temperature Formula
T1 = T2 + (Pd)(RQ 1-2) Example: T1 = TJunction T2 = TBoard Pd = Power Dissipated (W) = (If) * (Vf) RQ1-2 = RQJunction-Board
Future Electronics – Proprietary and Confidential
6
Conduction - Fouriers Law
l
Q=
k * Ac
l
Ac
(T1 - T2)
T1
Q
k
T2
– Q = heat flow [W] – k = thermal conductivity [W/mK] – Ac = cross-sectional area [m2] – l = length through which the heat flows [m] – T1, T2 = temperature at boundaries [°C]
Thermal Resistance
Universal Definition of Thermal Resistance:
Q = 1 RQ1-2 (T1 - T2)
Electronic Circuit Analogy
RQ1-2 = (T1 – T2) Q
R=V/I
v
R
12-Jul-13
Future Electronics – Proprietary and Confidential
T1
TJ
= T2 + (Pd)(RQ 1-2)
= TB + (Pd)(RQ J-B)
12-Jul-13
Future Electronics – Proprietary and Total Thermal Resistance
Pd = Vf * If
Tjunction
RQJunction - Slug
Heat Losses 12% Visible Light 5%
How much heat is generated in LED? Which heat transfer modes are most important? In LED, electrical energy is converted to light and heat; Most of the energy is converted to heat (Q), which is different from incandescent bulbs; Q has to be transferred to ambient to avoid damage to the semiconductor die; LED maximum junction temperature, specified in data sheets, should not be exceeded; For thermal analysis:
12-Jul-13
Future Electronics – Proprietary and Confidential
2
Importance of Thermal Design
• 1st Goal: Higher Flux
– Increase LED Efficiency – Increase Forward Current (Power)
Thermal Conductivity Units are in W/mK.
12-Jul-13
Future Electronics – Proprietary and Confidential
Al: k=170 Copper: k=400
100
50 0
8
Conduction
LED Chip Plastic Lens Body
As temperature rises: • Light Output decreases • Wavelength increases (towards red) • Forward Voltage decreases
-20
0 20 40 60 80 Junction Temperature TJ [°C]
Cathode Lead Anode Lead