胶粘剂用环氧固化剂
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6
For Adhesive: substrate>=adhesive+10dynes/cm
Substrate Surface Tension
7
Easy
Possible
Difficult
Handling Characteristics
Mix Ratio
Viscosity
Gel Time Open time
Ancamine 2337
High Reactivity
• 40 phr as sole curative • Lower activation temp (80 oC) • Rapid green strength development • Good latency (> 1 month)
Long latency
resistance
DICY
14
DICY Accelerator
1K Automotive Structural Adhesive (Body in White) Key Requirements • High strength and modulus • Tropical aging performance • Middle to long latency • High Tg Technology & Market Trend • Low temp and fast cure (e.g. 150C/20min) • Long latency (~ 9 months)
Ancamine 2014AS
• 100- 120C cured as sole curative • Balance of latency and
reactivity
Imicure AMI 2
• 70C -100C activation temp
as sole curing agent
• Short latency
Adhesive product positioning
- Body in White structural adhesive (1K)（汽车白车身结构胶的应用） - Auto electronic adhesive (2K) （汽车电子的应用） - EV battery adhesive (2K) （新能源车用电池的应用） - Wind blade structural adhesive introduction and product positioning （2K）（风能结构胶的应用） - Transportation adhesive introduction and product positioning （2K）（轨道交通的应用）
Product PositioningCuring Agent & Accelerators for 1K Adhesive Overview
1K adhesive
DICY
Standard
Amicure CG1200
• D90 < 30 um • Easily dispersed in liquid
Adhesive basics and Adhesive product positioning
Liyin Zhou Apr 2020
1
AgendaΒιβλιοθήκη Baidu
Adhesive basics(胶粘剂基本概念）
- Advantages of epoxy adhesives（环氧胶粘剂的优势） - Markets and Application（环氧胶的应用市场） - Key Considerations in Epoxy Adhesives（环氧胶关键技术指标）
Ancamide 502
• Low viscosity (~300 cps) • Long pot life • Low react exotherm
Metal to Metal Bending (Doors, Hoods, etc.) SMC to Metal (Frame Construction) SMC to SMC (Exterior Body Panels) Aerospace and Defense Market
Composite Repair
Ancamine 2337S
• Lowest activation temp (80C) • Short latency
Ancamine 2441
• Higher Tg • Better latency than 2014AS
15
Product Positioning-
2K Automotive Electronics Adhesive
Toughness Acc.
Ancamine 2441
• Blocked amine • Better shelf stability (> 3 months) • 20 phr as sole curative • Higher Tg
IMICURE UR-2T
• Substituted Urea • Similar to Dyhard UR500 • Good peel strength and impact
resins
• Good shelf stability
Fine grade
Dicyanex 1400F
• D90< 10 um • High reactivity • Good shelf stability
DICY accelerator
Substituted Urea
Standard
Amicure UR-D
2
Advantages of Epoxy Adhesives
Excellent Shear Strength No Volatile Products Evolved During Cure Low Shrinkage During Cure Good Moisture and Chemical Resistance Good Surface Wetting Ability Curing Can Often Be Achieved at Room Temperature Versatile Handling and Performance Characteristics
above activation temp (120-130 oC)
1K Electronics Adhesive - SMT
Key Requirements • High reactivity • Good adhesion strength • Tropical aging performance • Short to middle latency Technology & Market Trend • Low temp and fast cure • Modified imidazole alternative (e.g. Ajicure PN-23)
Long latency Acc.
Low reactivity Accelerator
Ancamine 2014FG
• Blocked amine • Good balance between reactivity and
shelf stability
• 5 phr as DICY accelerator • Long latency with DICY (> 3 months)
13
Product Positioning-
1K Automotive Structural Adhesive (Body in White)
Dicyanex 1400F • DICY • 6-10 phr as curing agent • Fine grade (D90 < 10 um) • Easily dispersed in liquid resins • Good Shelf stability
• Not used as sole curative • Similar to Diuron • Good flexibility
Fast cure
Toughness
Amicure UR 7/10
• Similar to Dyhard UR300 • Fast cured • Lower latency than UR-D
3
Markets and Application
Industrial Market
General bonding (e.g. wind blade, etc) Electronics (under fill, SMT, etc) Recreational Equipment
Automotive Market
and wood
Snap cured
Sunmide LH-210
• 120-130C activation temp. • Longer latency than AMI 2 • Snap cured above activation
temp
Low temp cured
Heat resistance
Fine grade
Ancamine 2014FG
• Smaller particle size • 100-120C cured as sole curative • Short latency than 2014AS
Liquid
Imicure EMI 24
• Long pot life • Excellent adhesion to metal
Curing agent
epoxy Resins additive
5
Substrates Surface Wetting
Increased Surface Wetting Increases Chemical and Physical Bond Strength Higher the Surface Energy of a Substrate (70 dynes/cm) Easier it is to Wet Substrates With Low Surface Energy (25 dynes/cm) are More Difficult to Wet and Tend to be Difficult to Bond
Latency(For 1K)
8
Cure Conditions
9
Performance Characteristics
Tensile strength
Peel Strength
Shear Strength
10
Environmental resistance
11
Cost Consideration
Aluminum Skins to Aircraft Body Air Craft Engines (High Performance Adhesives)
4
Epoxy Adhesives by component
One component(1K)
Epoxy CA
additive
Two component(2K)
Snap cure
Ancamine 2014AS
• Better shelf stability (> 3 months) • 20 phr as sole curative • Higher Tg
Sunmide LH-210
• Modified imidazole • 10-25 cured as sole curative • Very rapid strength development
Amicure UR-2T
• Similar to Dyhard UR500 • Good peel strength and
impact resistance
Solo curing agent or DICY accelerator
Blocked amine
Imidazole
Standard
Standard
12
Customer visit record adhesive EN
Product Positioning-
1K Electronics Adhesive - Surface Mounting Technology (SMT)
Ancamine 2014FG
• 20 phr as sole curative • 100-120C cured as sole curative • Good latency (> 1 month)
For Adhesive: substrate>=adhesive+10dynes/cm
Substrate Surface Tension
7
Easy
Possible
Difficult
Handling Characteristics
Mix Ratio
Viscosity
Gel Time Open time
Ancamine 2337
High Reactivity
• 40 phr as sole curative • Lower activation temp (80 oC) • Rapid green strength development • Good latency (> 1 month)
Long latency
resistance
DICY
14
DICY Accelerator
1K Automotive Structural Adhesive (Body in White) Key Requirements • High strength and modulus • Tropical aging performance • Middle to long latency • High Tg Technology & Market Trend • Low temp and fast cure (e.g. 150C/20min) • Long latency (~ 9 months)
Ancamine 2014AS
• 100- 120C cured as sole curative • Balance of latency and
reactivity
Imicure AMI 2
• 70C -100C activation temp
as sole curing agent
• Short latency
Adhesive product positioning
- Body in White structural adhesive (1K)（汽车白车身结构胶的应用） - Auto electronic adhesive (2K) （汽车电子的应用） - EV battery adhesive (2K) （新能源车用电池的应用） - Wind blade structural adhesive introduction and product positioning （2K）（风能结构胶的应用） - Transportation adhesive introduction and product positioning （2K）（轨道交通的应用）
Product PositioningCuring Agent & Accelerators for 1K Adhesive Overview
1K adhesive
DICY
Standard
Amicure CG1200
• D90 < 30 um • Easily dispersed in liquid
Adhesive basics and Adhesive product positioning
Liyin Zhou Apr 2020
1
AgendaΒιβλιοθήκη Baidu
Adhesive basics(胶粘剂基本概念）
- Advantages of epoxy adhesives（环氧胶粘剂的优势） - Markets and Application（环氧胶的应用市场） - Key Considerations in Epoxy Adhesives（环氧胶关键技术指标）
Ancamide 502
• Low viscosity (~300 cps) • Long pot life • Low react exotherm
Metal to Metal Bending (Doors, Hoods, etc.) SMC to Metal (Frame Construction) SMC to SMC (Exterior Body Panels) Aerospace and Defense Market
Composite Repair
Ancamine 2337S
• Lowest activation temp (80C) • Short latency
Ancamine 2441
• Higher Tg • Better latency than 2014AS
15
Product Positioning-
2K Automotive Electronics Adhesive
Toughness Acc.
Ancamine 2441
• Blocked amine • Better shelf stability (> 3 months) • 20 phr as sole curative • Higher Tg
IMICURE UR-2T
• Substituted Urea • Similar to Dyhard UR500 • Good peel strength and impact
resins
• Good shelf stability
Fine grade
Dicyanex 1400F
• D90< 10 um • High reactivity • Good shelf stability
DICY accelerator
Substituted Urea
Standard
Amicure UR-D
2
Advantages of Epoxy Adhesives
Excellent Shear Strength No Volatile Products Evolved During Cure Low Shrinkage During Cure Good Moisture and Chemical Resistance Good Surface Wetting Ability Curing Can Often Be Achieved at Room Temperature Versatile Handling and Performance Characteristics
above activation temp (120-130 oC)
1K Electronics Adhesive - SMT
Key Requirements • High reactivity • Good adhesion strength • Tropical aging performance • Short to middle latency Technology & Market Trend • Low temp and fast cure • Modified imidazole alternative (e.g. Ajicure PN-23)
Long latency Acc.
Low reactivity Accelerator
Ancamine 2014FG
• Blocked amine • Good balance between reactivity and
shelf stability
• 5 phr as DICY accelerator • Long latency with DICY (> 3 months)
13
Product Positioning-
1K Automotive Structural Adhesive (Body in White)
Dicyanex 1400F • DICY • 6-10 phr as curing agent • Fine grade (D90 < 10 um) • Easily dispersed in liquid resins • Good Shelf stability
• Not used as sole curative • Similar to Diuron • Good flexibility
Fast cure
Toughness
Amicure UR 7/10
• Similar to Dyhard UR300 • Fast cured • Lower latency than UR-D
3
Markets and Application
Industrial Market
General bonding (e.g. wind blade, etc) Electronics (under fill, SMT, etc) Recreational Equipment
Automotive Market
and wood
Snap cured
Sunmide LH-210
• 120-130C activation temp. • Longer latency than AMI 2 • Snap cured above activation
temp
Low temp cured
Heat resistance
Fine grade
Ancamine 2014FG
• Smaller particle size • 100-120C cured as sole curative • Short latency than 2014AS
Liquid
Imicure EMI 24
• Long pot life • Excellent adhesion to metal
Curing agent
epoxy Resins additive
5
Substrates Surface Wetting
Increased Surface Wetting Increases Chemical and Physical Bond Strength Higher the Surface Energy of a Substrate (70 dynes/cm) Easier it is to Wet Substrates With Low Surface Energy (25 dynes/cm) are More Difficult to Wet and Tend to be Difficult to Bond
Latency(For 1K)
8
Cure Conditions
9
Performance Characteristics
Tensile strength
Peel Strength
Shear Strength
10
Environmental resistance
11
Cost Consideration
Aluminum Skins to Aircraft Body Air Craft Engines (High Performance Adhesives)
4
Epoxy Adhesives by component
One component(1K)
Epoxy CA
additive
Two component(2K)
Snap cure
Ancamine 2014AS
• Better shelf stability (> 3 months) • 20 phr as sole curative • Higher Tg
Sunmide LH-210
• Modified imidazole • 10-25 cured as sole curative • Very rapid strength development
Amicure UR-2T
• Similar to Dyhard UR500 • Good peel strength and
impact resistance
Solo curing agent or DICY accelerator
Blocked amine
Imidazole
Standard
Standard
12
Customer visit record adhesive EN
Product Positioning-
1K Electronics Adhesive - Surface Mounting Technology (SMT)
Ancamine 2014FG
• 20 phr as sole curative • 100-120C cured as sole curative • Good latency (> 1 month)