射频卡协议ISO4443(中文)
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elementary time unit（etu） ..............................................3
3.16 帧 frame ...................................................................................................................3
3.3
无触点集成电路卡 Contactless integrated circuit(s) card ...................................... 3
3.4
接近式卡 Proximity card（PICC） ........................................................................ 3
3.19 唯一识别符 Unique identifier（UID） .................................................................. 4
3.7
二进制移相键控 Binary phase shift keying ............................................................ 3
3.8
调制指数 Modulation index .................................................................................... 3
3.11 防冲突环 anticollision loop ..................................................................................... 3
3.12 比特冲突检测协议 bit collision detection protocol ................................................ 3
2 参考资料...................................................................................................................................2
3 定义...........................................................................................................................................3
3.13 字节 byte..................................................................................................................3
3.14 冲突 collision ...........................................................................................................3
3.5
接近式耦合设备 Proximity coupling device（PCD） ........................................... 3
3.6
位持续时间 Bit duration..........................................................................................3
3.1
集成电路 Integrated circuit(s)（IC） ..................................................................... 3
3.2
无触点的 Contactless .............................................................................................. 3
3.17 高层 higher layer......................................................................................................4
3.18 时间槽协议 time slot protocol.................................................................................4
3.9
不归零电平 NRZ-L ................................................................................................. 3
3.10 副载波 Subcarrier .................................................................................................... 3
中国金融集成电路(IC)卡 与应用无关的非接触式规范
中国金融集成电路（IC）卡标准修订工作组 二零零四年九月
目次
1 范围...........................................................................................................................................1
3.16 帧 frame ...................................................................................................................3
3.3
无触点集成电路卡 Contactless integrated circuit(s) card ...................................... 3
3.4
接近式卡 Proximity card（PICC） ........................................................................ 3
3.19 唯一识别符 Unique identifier（UID） .................................................................. 4
3.7
二进制移相键控 Binary phase shift keying ............................................................ 3
3.8
调制指数 Modulation index .................................................................................... 3
3.11 防冲突环 anticollision loop ..................................................................................... 3
3.12 比特冲突检测协议 bit collision detection protocol ................................................ 3
2 参考资料...................................................................................................................................2
3 定义...........................................................................................................................................3
3.13 字节 byte..................................................................................................................3
3.14 冲突 collision ...........................................................................................................3
3.5
接近式耦合设备 Proximity coupling device（PCD） ........................................... 3
3.6
位持续时间 Bit duration..........................................................................................3
3.1
集成电路 Integrated circuit(s)（IC） ..................................................................... 3
3.2
无触点的 Contactless .............................................................................................. 3
3.17 高层 higher layer......................................................................................................4
3.18 时间槽协议 time slot protocol.................................................................................4
3.9
不归零电平 NRZ-L ................................................................................................. 3
3.10 副载波 Subcarrier .................................................................................................... 3
中国金融集成电路(IC)卡 与应用无关的非接触式规范
中国金融集成电路（IC）卡标准修订工作组 二零零四年九月
目次
1 范围...........................................................................................................................................1