手机维修指南
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手机
维修指南
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目录
1目标··························································································错误!未定义书签。2注意事项····················································································错误!未定义书签。3一般性描述·················································································错误!未定义书签。
3.1产品概述 ················································································错误!未定义书签。
3.2产品性能指标要求 ····································································错误!未定义书签。
3.3主要装配器件 ··········································································错误!未定义书签。
3.4手机器件分解图 ·······································································错误!未定义书签。
3.5手机拆装图 ·············································································错误!未定义书签。4PCBA器件外观 ···········································································错误!未定义书签。5主要输出电源··············································································错误!未定义书签。
6. 电路原理与维修···········································································错误!未定义书签。
6.1接收电路原理 ·········································································错误!未定义书签。
6.2接收电路故障维修 ···································································错误!未定义书签。
6.3 发射电路的原理 ········································································错误!未定义书签。
6.4 发射电路的故障维修··································································错误!未定义书签。
6.5 基带部分维修指引·····································································错误!未定义书签。
错误!未定义书签。
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错误!未定义书签。
错误!未定义书签。
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6.5.7 不能检测到T-F卡 ································································错误!未定义书签。
6.5.9 拍照功能异常 ······································································错误!未定义书签。 LCD无背光 ·················································································错误!未定义书签。
LCD显示异常 ·············································································错误!未定义书签。 Speaker/Receiver功能异常···························································错误!未定义书签。
蓝牙功能异常··············································································错误!未定义书签。
7.测试代码中英文对照表 ···································································错误!未定义书签。
1目标
1.1此文档适用于指导手机生产车间维修人员使用。
1.2此文档适用于指导手机维修中心维修人员使用
2注意事项
2.1维修与调校只能由合格的技术人员进行。
2.2确保维修人员要佩戴静电带并在防静电区域内进行维修。
2.3确保所有螺丝，器件在完成维修和调校后都必须装好，并确保元件安装到位。
2.4静电是导致电子产品损坏的主要原因，因此维修作业环境，维修人员一定要注意静电防护，
符合静电防护的要求。
2.5本产品采用无铅工艺生产，请使用无铅工艺维修。
2.6产品维修过程中要尽量避免将IC误判并尽量少更换IC。当某颗IC的失效率达到生产总数
量的百分之三或以上时，维修人员须向公司相关人员反映该IC的失效情况并协同分析失效
原因.
2.7产品维修好功能后，一定要将助焊剂等维修残渣清理干净，保证产品外观良好。
3一般性描述
3.1 产品概述
本手册为双频手机，工作在GSM900、DCS1800 频段。CPU：MT6253，主频为104MHZ；FLASH (K5N2833A TB_AQ12)为128M bits Flash Memory 加32Mbits SRAM；PA ：SKY77542。
3.2 产品性能指标要求
表3-1列出了主要的PCBA 性能指标，产线所有PCBA 都要通过测试，只有通过了测试的PCBA 才能判定为合格产品，维修后的PCBA 必须要通过了测试才能判定为合格产品。
表3-1 PCBA 主要射频性能指标: