《Stepper简介》PPT课件
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– Offset: X , Y – Scaling: X , Y – Orthogonality – Wafer rotation – Shot scaling (Mag) – Shot rotation (Reticle rotation, RR)
10.曝光參數-2
11.Auto Feedback 系統
6.照明光源
• 光源波長
– I-line: 365 nm 的 Hg Lamp
– DUV(KrF): 波長 246nm 的 Laser
– DUV(ArF): 波長 193nm 的 Laser
• R= K*波長/NA
• Illumination ID
– DUV: ID1 -NA 0.6 Conv. (一般)
Focus detector
Baidu Nhomakorabea
Leveling detector
Focus light source
Leveling light source
i12,EX12: drive point i11 and previous: fixed point
8.Focus & Leveling 系統- I14型
2-dimensional multi-point focus sensors are used (Applicable for both Focusing &Leveling, Light source···White light)
is within the measurement range of focus sensors.
Tracking sensor 1
18mm 3mm
3mm
18mm
Leveling detection area 19mm
Tracking sensor 2
9.曝光程序
• 晶片傳送: Local, Inline • 晶片對準
– Notch 對準 – Search: 2 Shots – EGA: 6~10 Shots • 晶片曝光 – Focus (偵測值+Offset) – Leveling (偵測值+Offset) – 曝光 ( 曝光時間 *光源強度 Integrator)
10.曝光參數-1
• 曝光時間: DUV (mj) I-line (ms) • Focus offset • Leveling offset • AA 補值
–
ID4 -NA 0.6 Annular (Poly)
– I-line: ID7 -NA 0.57 Conv. (一般)
–
ID10 -NA 0.5 Conv. (DRAM Metal)
7.對準系統-1
• 間接對準 – 光罩對準: 光罩 => Stepper 對準 – Baseline check: Wafer Alignemt Sensor => 光罩 – 晶片對準: Search, EGA
Max. 9 points can be selected from total 49 points
(Tracking sensors are auxiliary combined.) *Tracking sensors: Check whether the height of the wafer surface
• Wafer Alignment Sensor
– LSA: Laser Step Alignment (光繞射) – FIA: Field Image Alignment ( 影像處理)
7.對準系統-2
8.Focus & Leveling 系統- I11型
Height detecting By focus sensor (light sourceWhite light) Field tilt detecting By leveling sensor (light sourceSingle wavelength)
ADI
AA
DP005
A A 量 測
SEM CD
C D 量 測
2.FAB 流程
P-WELL PLDD N+
SIN, POLY, ILD, METAL
THIN FILM
P+
PHOTO
DIFF
P+,N+ P-WELL
SIN, POLY CONT,METAL
POLY CONT METAL
ETCH
L7W01
• I-line(5x): 0.35um 以上可生產機台 – I14: I11-1, I7-7 – I12: F9-4, F9-5, F9-6 – I11: I7-1 ~ I7-6, I8-1 ~ I8-6
• I-line(2.5x): 簡單層機台 – 4425i: O9-1 ~ O9-3, O-R1 ~ O-R3
Stepper 機台結構原理簡介 及注意事項
IC3 / PMA3 / PHOTO 黃郁斌
9/2/1999
Index 1
1:Photo 區簡介 2.FAB 流程
3.Stepper 機台種類 4.機台外觀 5.操作方法 6.照明光源 7.對準系統
8.Focus & Leveling 系統 9.曝光程序 10.曝光參數
Light source
Position Detector
8.Focus & Leveling 系統- Sensor位置
<I11型> Inline multi-point focus sensors <I14型> 77 , 2-dimensional multi-point focus sensors,
SIN P-WELL P-FIELD POLY PLDD P+ N+ CONT METAL1 MVIA1 METAL2 MVIA2 METAL3 PAD
3.Stepper機台種類
• DUV: 0.25um 以上可生產機台 – EX14C: E11-2, E11-3, E11-4, E12-1 – EX12B: E8-7
Index2
11.Auto feedback 系統 12.機台 Alarm
13.Stepper 特殊 Function (Extended,Deep…) 14.DUV Stepper 15.晶邊曝光 16.日常測機 17.操作注意事項
曝光圖形
g
g
g
S
S
g
g
g
1.PHOTO 簡介
STEPPER 顯影機 光阻機
10.曝光參數-2
11.Auto Feedback 系統
6.照明光源
• 光源波長
– I-line: 365 nm 的 Hg Lamp
– DUV(KrF): 波長 246nm 的 Laser
– DUV(ArF): 波長 193nm 的 Laser
• R= K*波長/NA
• Illumination ID
– DUV: ID1 -NA 0.6 Conv. (一般)
Focus detector
Baidu Nhomakorabea
Leveling detector
Focus light source
Leveling light source
i12,EX12: drive point i11 and previous: fixed point
8.Focus & Leveling 系統- I14型
2-dimensional multi-point focus sensors are used (Applicable for both Focusing &Leveling, Light source···White light)
is within the measurement range of focus sensors.
Tracking sensor 1
18mm 3mm
3mm
18mm
Leveling detection area 19mm
Tracking sensor 2
9.曝光程序
• 晶片傳送: Local, Inline • 晶片對準
– Notch 對準 – Search: 2 Shots – EGA: 6~10 Shots • 晶片曝光 – Focus (偵測值+Offset) – Leveling (偵測值+Offset) – 曝光 ( 曝光時間 *光源強度 Integrator)
10.曝光參數-1
• 曝光時間: DUV (mj) I-line (ms) • Focus offset • Leveling offset • AA 補值
–
ID4 -NA 0.6 Annular (Poly)
– I-line: ID7 -NA 0.57 Conv. (一般)
–
ID10 -NA 0.5 Conv. (DRAM Metal)
7.對準系統-1
• 間接對準 – 光罩對準: 光罩 => Stepper 對準 – Baseline check: Wafer Alignemt Sensor => 光罩 – 晶片對準: Search, EGA
Max. 9 points can be selected from total 49 points
(Tracking sensors are auxiliary combined.) *Tracking sensors: Check whether the height of the wafer surface
• Wafer Alignment Sensor
– LSA: Laser Step Alignment (光繞射) – FIA: Field Image Alignment ( 影像處理)
7.對準系統-2
8.Focus & Leveling 系統- I11型
Height detecting By focus sensor (light sourceWhite light) Field tilt detecting By leveling sensor (light sourceSingle wavelength)
ADI
AA
DP005
A A 量 測
SEM CD
C D 量 測
2.FAB 流程
P-WELL PLDD N+
SIN, POLY, ILD, METAL
THIN FILM
P+
PHOTO
DIFF
P+,N+ P-WELL
SIN, POLY CONT,METAL
POLY CONT METAL
ETCH
L7W01
• I-line(5x): 0.35um 以上可生產機台 – I14: I11-1, I7-7 – I12: F9-4, F9-5, F9-6 – I11: I7-1 ~ I7-6, I8-1 ~ I8-6
• I-line(2.5x): 簡單層機台 – 4425i: O9-1 ~ O9-3, O-R1 ~ O-R3
Stepper 機台結構原理簡介 及注意事項
IC3 / PMA3 / PHOTO 黃郁斌
9/2/1999
Index 1
1:Photo 區簡介 2.FAB 流程
3.Stepper 機台種類 4.機台外觀 5.操作方法 6.照明光源 7.對準系統
8.Focus & Leveling 系統 9.曝光程序 10.曝光參數
Light source
Position Detector
8.Focus & Leveling 系統- Sensor位置
<I11型> Inline multi-point focus sensors <I14型> 77 , 2-dimensional multi-point focus sensors,
SIN P-WELL P-FIELD POLY PLDD P+ N+ CONT METAL1 MVIA1 METAL2 MVIA2 METAL3 PAD
3.Stepper機台種類
• DUV: 0.25um 以上可生產機台 – EX14C: E11-2, E11-3, E11-4, E12-1 – EX12B: E8-7
Index2
11.Auto feedback 系統 12.機台 Alarm
13.Stepper 特殊 Function (Extended,Deep…) 14.DUV Stepper 15.晶邊曝光 16.日常測機 17.操作注意事項
曝光圖形
g
g
g
S
S
g
g
g
1.PHOTO 簡介
STEPPER 顯影機 光阻機