针对新能源车核心部件的产品及解决方案：电机驱动、电池管理及辅助系统
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Li-Ion Battery Monitoring & Balancing IC Auxiliary System & DC/DC Solution Overview of Auxiliary System Easy Module Discrete – Cool MOS
Confidential!
2 2
3
Liquid cooled module 2
¬ Without base plate + thermal grease ¬ Thermal grease: 50 µ m
Strong liquid cooler
Heat transfer coefficient: a=20000 W/m²K
Life time modeling
Thermal simulation Temperature Profile
Tj max IGBT / diode / solder
Climatic conditions
Tambient
Calculation of DT occurrence
Number of required test cycles with fixed DT
Lasting Commitment to the Automotive Industry + Focus on Power Semiconductors = Ideal Match for XEV
Automotive Semiconductor*
1 2 2 2 2
Power Semiconductors**
Copyright © Infineon Technologies 2010. All rights reserved.
Page 9
Improved Traceability: Preparation for Single Component Tracking
Base plate:
DMX code chip
= = = = = =
electric vehicle hybrid electric vehicle high-voltage low-voltage alternating current direct current
Page 5
MOTOR CONTROL SOLUTION
Set date
Copyright © Infineon Technologies 2011. All rights reserved.
On demand On lot basis Single Temperature
Page 8
Base plate and DCB material selection
Coefficient of thermal expansion (CTE) [ppm/K]
Thermal Shock Test Results
Table of Contents
Overview Motor Drive Solution & Product Motor Drive IGBT IGBT Gate Driver IC
Future Trends in Hybrid- and Electric Vehicles Applications
Frontend
WAC (wafer acceptance criteria) Statistical Bin Alarm (SBA) PAT (Part Average Test) Pattern Recognition Defect Density
Backend
Scrap limits scrap requires 8D Re-work / Re-test Tracking EOL Test Coverage
¬ Without base plate + thermal grease ¬ Thermal grease: 50 µ m
2
Strong liquid cooler
Heat transfer coefficient: a=20000 W/m²K
Dr. Christmann
3
Copyright © Infineon Technologies 2010. All rights reserved.
Products and solutions for key components in xEV: Motor drive, BMS and auxiliary systems
来自百度文库
LIU Meng / 刘蒙 China Powertrain Segment Marketing ePChina, March 2012
DBC:
DMX code by supplier
Frame:
Module: DMX code label by final tester
DMX code by supplier
Confidential
Copyright © Infineon Technologies 2010. All rights reserved.
1 2
Direct cooled module
¬ base plate with PIN FIN structure
1
Liquid cooled module 1
¬ Flat base plate + thermal grease ¬ Thermal grease: 50 µ m
3
Liquid cooled module 2
Dr. Christmann
3
Copyright © Infineon Technologies 2010. All rights reserved.
Page 12
Module design - Cooling conditions Interface to coolant
3 types of module designs
80kW
Power
70kW 60kW 50kW 40kW 30kW 20kW 10kW
Inverter / Generator for Full Hybrids and Electric Vehicles
HybridPACKTM 2
HybridPACKTM 1 Pin-Fin Inverter / Generator for Mild Hybrids, Battery Charger Aux Drives, Aux DC&DC, Charger
Motor + drive control
Mission profile FTP 72
Loss Calculation
Loss profile Cooling conditions
Zth jc, Zth CH , Zth H ambient , IGBT / diode
Cycle numbers with different DT
Page 10
Calculation of equivalent test cycles from the given mission profile
Electrical characteristics
VCE sat, VF , Eon , Eoff , Erec VDC, phase current, m, cos j, fs
Page 6
MOTOR DRIVE IGBT
3/3/2012
Confidential
Page 7
General Differences between automotive and industrial power modules
General
Qualification Change Management / PCN
HV-LV
HV auxiliaries
M
Inverter DC/AC
DC/DC
High-voltage boardnet
Highpower DC/DC
Battery mgmt.
High-voltage battery
Charger AC/DC
EV HEV HV LV AC DC
Confidential Copyright © Infineon Technologies 2010. All rights reserved.
Jedec According Jedec 46
Lead time: 3 months Industry
80% automatic scrap 60% stop / disposition Optional Optional Optional DD monitoring critical layers; no scrap limits
Automotive
Based on electrical test yield and assembly step yield On demand
Industry
Implemented for most package types. Goal: 100% 1st pass yield For individual material Multi Temperature / D-PAT
3 types of module designs
1 2
Direct cooled module
¬ base plate with PIN FIN structure
1
Liquid cooled module 1
¬ Flat base plate + thermal grease ¬ Thermal grease: 50 µ m
Module design and Cooling conditions were varied
Dr. Christmann Copyright © Infineon Technologies 2010. All rights reserved. Page 11
Module design - Cooling conditions Interface to coolant
´95 ´98 ´01 ´03 ´05 ´07 ´09
05.07.2010
Confidential
Page 4
Electric Vehicle (EV) architectures drive demand for automotive power semiconductors
Lowvoltage battery
HybridPACKTM 1 Easy Modules
1 1 1 1
4 5 5
Perfect Match for xEV Application
8 8
´95 ´98 ´02 ´03 ´05 ’06 ‘09
** Power * Application-specific
semiconductor Source: Strategy Analytics
Semiconductor Source: IMS; Including power semis for automotive
Automotive
Industry
AEC-Q 101
According ZVEI Lead time: 6 months, customer approval required Automotive
100% automatic scrap 80%stop / disposition Required Required Required assessment for DD (screening + monitoring) required.
/ Copyright © Infineon Technologies 2007. All rights reserved.
Page 2
OVERVIEW
Set date
Copyright © Infineon Technologies 2011. All rights reserved.
Page 3
Page 13
Target Applications for Electric Drive Train Product Portfolio
Application 100kW 90kW Bare Die IGBTs, Diodes, MosFETs Driver IC for IGBTs, MosFETs Product
Confidential!
2 2
3
Liquid cooled module 2
¬ Without base plate + thermal grease ¬ Thermal grease: 50 µ m
Strong liquid cooler
Heat transfer coefficient: a=20000 W/m²K
Life time modeling
Thermal simulation Temperature Profile
Tj max IGBT / diode / solder
Climatic conditions
Tambient
Calculation of DT occurrence
Number of required test cycles with fixed DT
Lasting Commitment to the Automotive Industry + Focus on Power Semiconductors = Ideal Match for XEV
Automotive Semiconductor*
1 2 2 2 2
Power Semiconductors**
Copyright © Infineon Technologies 2010. All rights reserved.
Page 9
Improved Traceability: Preparation for Single Component Tracking
Base plate:
DMX code chip
= = = = = =
electric vehicle hybrid electric vehicle high-voltage low-voltage alternating current direct current
Page 5
MOTOR CONTROL SOLUTION
Set date
Copyright © Infineon Technologies 2011. All rights reserved.
On demand On lot basis Single Temperature
Page 8
Base plate and DCB material selection
Coefficient of thermal expansion (CTE) [ppm/K]
Thermal Shock Test Results
Table of Contents
Overview Motor Drive Solution & Product Motor Drive IGBT IGBT Gate Driver IC
Future Trends in Hybrid- and Electric Vehicles Applications
Frontend
WAC (wafer acceptance criteria) Statistical Bin Alarm (SBA) PAT (Part Average Test) Pattern Recognition Defect Density
Backend
Scrap limits scrap requires 8D Re-work / Re-test Tracking EOL Test Coverage
¬ Without base plate + thermal grease ¬ Thermal grease: 50 µ m
2
Strong liquid cooler
Heat transfer coefficient: a=20000 W/m²K
Dr. Christmann
3
Copyright © Infineon Technologies 2010. All rights reserved.
Products and solutions for key components in xEV: Motor drive, BMS and auxiliary systems
来自百度文库
LIU Meng / 刘蒙 China Powertrain Segment Marketing ePChina, March 2012
DBC:
DMX code by supplier
Frame:
Module: DMX code label by final tester
DMX code by supplier
Confidential
Copyright © Infineon Technologies 2010. All rights reserved.
1 2
Direct cooled module
¬ base plate with PIN FIN structure
1
Liquid cooled module 1
¬ Flat base plate + thermal grease ¬ Thermal grease: 50 µ m
3
Liquid cooled module 2
Dr. Christmann
3
Copyright © Infineon Technologies 2010. All rights reserved.
Page 12
Module design - Cooling conditions Interface to coolant
3 types of module designs
80kW
Power
70kW 60kW 50kW 40kW 30kW 20kW 10kW
Inverter / Generator for Full Hybrids and Electric Vehicles
HybridPACKTM 2
HybridPACKTM 1 Pin-Fin Inverter / Generator for Mild Hybrids, Battery Charger Aux Drives, Aux DC&DC, Charger
Motor + drive control
Mission profile FTP 72
Loss Calculation
Loss profile Cooling conditions
Zth jc, Zth CH , Zth H ambient , IGBT / diode
Cycle numbers with different DT
Page 10
Calculation of equivalent test cycles from the given mission profile
Electrical characteristics
VCE sat, VF , Eon , Eoff , Erec VDC, phase current, m, cos j, fs
Page 6
MOTOR DRIVE IGBT
3/3/2012
Confidential
Page 7
General Differences between automotive and industrial power modules
General
Qualification Change Management / PCN
HV-LV
HV auxiliaries
M
Inverter DC/AC
DC/DC
High-voltage boardnet
Highpower DC/DC
Battery mgmt.
High-voltage battery
Charger AC/DC
EV HEV HV LV AC DC
Confidential Copyright © Infineon Technologies 2010. All rights reserved.
Jedec According Jedec 46
Lead time: 3 months Industry
80% automatic scrap 60% stop / disposition Optional Optional Optional DD monitoring critical layers; no scrap limits
Automotive
Based on electrical test yield and assembly step yield On demand
Industry
Implemented for most package types. Goal: 100% 1st pass yield For individual material Multi Temperature / D-PAT
3 types of module designs
1 2
Direct cooled module
¬ base plate with PIN FIN structure
1
Liquid cooled module 1
¬ Flat base plate + thermal grease ¬ Thermal grease: 50 µ m
Module design and Cooling conditions were varied
Dr. Christmann Copyright © Infineon Technologies 2010. All rights reserved. Page 11
Module design - Cooling conditions Interface to coolant
´95 ´98 ´01 ´03 ´05 ´07 ´09
05.07.2010
Confidential
Page 4
Electric Vehicle (EV) architectures drive demand for automotive power semiconductors
Lowvoltage battery
HybridPACKTM 1 Easy Modules
1 1 1 1
4 5 5
Perfect Match for xEV Application
8 8
´95 ´98 ´02 ´03 ´05 ’06 ‘09
** Power * Application-specific
semiconductor Source: Strategy Analytics
Semiconductor Source: IMS; Including power semis for automotive
Automotive
Industry
AEC-Q 101
According ZVEI Lead time: 6 months, customer approval required Automotive
100% automatic scrap 80%stop / disposition Required Required Required assessment for DD (screening + monitoring) required.
/ Copyright © Infineon Technologies 2007. All rights reserved.
Page 2
OVERVIEW
Set date
Copyright © Infineon Technologies 2011. All rights reserved.
Page 3
Page 13
Target Applications for Electric Drive Train Product Portfolio
Application 100kW 90kW Bare Die IGBTs, Diodes, MosFETs Driver IC for IGBTs, MosFETs Product