SMD2835白色0.5W灯珠规格书

Tsld:260·C
2tines
0/20
回流焊
Thermal Shock 冷热冲击
-40·C 15min
100cgde
0/20
100·C15min
High Temperature 高低温循环
Ta:100·C
1000hrs
0/20
Environmental sequence
Low Temperature 低温测试
Applications Channel letter Decorative Lighting
应用 指示 装饰 照明
Absolute maximum ratings 最大限定参数(Ta-25·C)
Parameter 项目名称
Symbol 符号
Value 叁数
Unit 单位
Power dissipation 功率 Forward current 正向电流 Reverse Voltage 反向电压 Operating temperature range 工作温度范围 Storage temperature 存储温度范围 Pulse Forward Current 正向脉冲电流 Electrostatic Discharge 静电防护 Junction temperature 结温
SHENZHEN HEALTH LIGHTING TECH.CO;LTD 深圳市合莱特光电科技有限公司
SPECIFICATIONS 规格书
HLT TOP -2835 SERIES
Customer 客户确认
Approved 批准
Checked 审核
Prepared 编制
Features .Size(mm)3.5*2.8*0.8 .Viewing angle 120° .ROHS compliant lead-free soldering Compatible .White color (2835-0.5W)
Forward current 电流（mA)
Ambient Temperature vs.Forward Current 环境温度与正向电流曲线关系
Ambient Temperature Ta 环境温度（℃）
Ambient Temperature Ta 环境温度（℃）
Curves of beam angel and relative brightness
特点 外观尺寸(mm)3.5*2.8*0.8 发光角度 120°
符合 ROHS 无铅焊接的标准 白色(2835-0.5W)
Our 2835 is encapsulated by silicon gels which can improve the heat dissipation performance effectively. They are good reliability, high brightness,low light decay and uniform light color. 此 2835 产品使用硅胶封装,有效提高产品的散热性能,可靠性优,亮 度高,低光衰,颜色一致性好。
Notes for reflow soldering 回流焊注意事项 1，No more than twice for reflow soldering. 注意回流焊不可超过两次。 2,To ensure the quality of our LEDs, we encapsulate them with silica gels. So please do not put pressure on the LEDs. 为保证 LED 质量及可靠性我司采用硅胶封装，胶体表面较软，焊接加热过程中，不可施加 压力在 LED 表面。 3,Please choose the right nozzle to avoid the damage to products due to the pressure. 在吸嘴的选取上要选择吸嘴的大小和压力合适的吸嘴，以避免压力过大伤害产品。 4,Please put on the antistatic hand loop during the use. The worktable should be with antistatic finish. The equipments must be contacted with ground. 在使用 LED 时请带上防静电手环。工作台做好防静电处理。机器设备保证触地。
Ta:-40·C
1000hrs
0/20
环境变化
On5min -40·C＞15min
Power Temperature cycling
Off5min 100·C ＞ 100cgde
0/20
高温点亮循环测试
15min
Life Test
Ta:=25·C
Operation
常温大电流老化
1000hrs
0/20
IF=200mA
sequence
操作环境
High Humidity Heat Life Test
60·CRH=90%
1000hrs
0/20
高温高湿老化
IF=150mA
2,CRITERIA FOR JUDGING THE DAMAGE 判断受损标准
Type 项目
Test Item 测试项目
Test Conditions 测试条件
Storage conditions 存储条件
Before opening the package 打开包装袋前 1，The LEDs can be preserved for 1 year in condition of temperature no more than 30℃ and humidity no more than 60%RH. Recommended for moisture-proof foil bag with desiccant packaging methods and stored in the constant temperature and humidity box. 在温度不超过 30℃及湿度不超过 60%RH 条件下，LED 可以保存一年，建议采用带干燥剂 的防潮铝箔袋的包装方式，存放在恒温恒湿相中。 2,Stored for more than 7 days, next time must be dehumidification, the dehumidification conditions is 60℃ with 12hours. 存放时间超过 7 天的，下次使用时必须进行除湿，除湿条件为 60℃12 小时。
3,Avoid using sharp objects to compress products Colloidal Party directly. 避免使用尖锐的物体直接接触产品胶体部分。 4,Please put on the antistatic hand loop during the use.The worktable should be with antistatic finish.The equipments must be contacted with ground. LED 为静电敏感产品，使用时请佩带防静电手环，工作台做好防静电处理，机台设备等保 证接地。
Forward Voltage vs. Forward Current Ta=25℃ 电流与电压曲线关系
Forward Voltage vs. Relative intensity Ta=25℃ 电流与亮度曲线关系
Forward voltage 电压（V）
Relative Intensity vs. Ambient temperature 环境温度与相对亮度曲线关系
Requirements for application and reflow soldering 应用及回流焊要求
REFLOW PROFILE
120 SEX.MAX
Recommended Curve
About 220℃ 60sec max
TIME(SECONDS)
Reflow soldering curve 回流焊曲线
Handwork soldering 手工焊接 1，During the soldering, the electronic soldering iron must be kept under the temperature of 300℃ and the soldering time must not be beyond 3 seconds. No touch between the electronic soldering iron and colloid. 手工焊接时，要保持电烙铁温度在 300 摄氏度以下，并且焊接时间小于 3 秒，电烙铁不可 接触胶体。 2,Handwork soldering is only allowed once.We won’t take responsibility for more than that. 手工焊接只可进行一次，重复焊接不保证产品是否完好。
PD
If Vr TOP Tatg Ifp ESD Tj
500
mW
150
mA
5
V
-40-+85
·CΒιβλιοθήκη -40-+100·C
200
mA
8000
V
135
·C
Electro-optical characteristics 光电参数(Ta-25·C)
Parameter 项目名称
Test Condition Symbol
Life Test:
Affect of Ti on Luminous Maintenance (If=20mA) (Dot line: Expected Life)
Tj=55℃ Tj=85℃ Tj=105℃
Mechanical Dimensions 外观尺寸:Unit 单位(mm)
For reflow soldering 建议焊盘尺寸.
Packaging 包装：Unit 单位（mm)
Cathode side
Printed label
DESICCANT*2
Note 注意：
1,Empty component pockets are sealed with top cover tape. 预留载带空位也贴有上封带。 2,The maximum number of missing lamps is two. 最多缺失的 LED 数量不超过两颗。 3,The cathode is oriented towards the tape sprocked hole in accordance with ANSI/EIA RS-481 specifications. 根据 ANSI/EIA RS-481 的规格，产品的负极指向卷带的导孔。
Reliability:可靠性
1,TESTITEMS AND RESULTS 测试务件和结果
Type
Test Item
Test Conditions
项目
测试项目
测试条件
Note 记录
Number of Damaged 受损数量
Resistance to Soldering
Hest (reflow soldering)
λd
W
445
Viewing angle at50%Iv 半宽角
1/2
120
Reverse current
Vt=5V
Ir
反向电流
460
nm
Deg
10
uA
NOTES 注意:
公差:光强±10%.主波长±2nm.正向电压±0.05V.色坐标±0.01 Tolerance:Iv±10%.λd±2nm.Vf±0.05V.X.Y±0.01 峰值电流条件:脉冲范围≤10 毫秒.占空比≤1/10. Typical optical characteristics curves 光电特性曲线
测试条件
符号
Color 颜色
MIN 最小值
Value 参数
TYP 典型值
MAX 最大值
Unit 单位
Forward Voltage 正向电压
If=60mA
Vf
W
3.0
3.4
V
Luminous intensity 亮度
If=60mA
Iv
W
8000
mcd 11000
Wavelength 波长
If=60mA
Criteria judgment 判断标准
MIN 最小值
MAX 最大值
Forward Voltage 正向电压
Vf
If=150mA
U.S.L*1.1
Reverse current 反向电流
IR
VR=5V
U.S.L*2.0
Luminous Intensity 光强
IV
IF=150mA
L.S.L*0.7