1206双色贴片LED-1206贴片灯珠规格书

Item
Forward voltage Reverse current
Luminous intensity
Wave length
Appearance
Symbol VF IR IV
λD/λP /
Test condition IF=Test Current
VR=5V IF=Test Current
IF=Test Current View check
承认书
SPECIFICATION FOR APPROVAL
客户 Customer：
客户品号 Customer P/N：
鑫光硕品号 Xgs Model：
规格 Specification :
XGS-PB3216UEUG-04 SMD 1206红翠绿双色 20MA
制作 Prepared By：
审核 Checked By：
Compatible with automatic placement equipment Compatible with reflow solder process Low power consumption and wide viewing angle This product doesn’t contain restriction Substance, comply ROHS standard.
High Temperature And Ta：85±5℃，RH:85±5%，IF=15mA High Humidity Working Test time=500HRS(-24HRS,+72HRS)
4
Low Temperature Storage
Ta：-40±5℃ Test time=1000HRS(-24HRS,+72HRS)
-40±5℃→25±5℃→100±5℃→25±5℃
1
Temperature Cycle
20
0/1
(30min，5min，30min，5min) 100 Cycles
2
High Temperature Storage
Ta：100±5℃ Test time=1000HRS(-24HRS,+72HRS)
3
Before opening the package: The LEDs should be kept at 5~30°C and 60%RH or less. The LEDs should be used within a year. After opening the package: The LED must be used within 24 hours, else should be kept at 5~30℃ and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.
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◆ Typical Electro-Optical Characteristics Curves：
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Reliability
(1) Test Items and Conditions
NO
Test Item
Test Conditions
Ac/ Sample
Re
一厂地址：广东省深圳市龙岗区嶂背创业二路18-1号
二厂地址：广东省东莞市石排镇庙边王村沙迳工业区
Tel: 13798585378
QQ:2373888283
Website ：Http://www.xgsled.cn
E-mail:xz@xgsled.cn
· Customer:
Technical Data Sheet
◆ Soldering Pad Dimensions:
◆ Soldering Conditions (Maximum allowable soldering conditions)
Reflow soldering profile
<Pb-free solder>
Temperature
3℃/sec.
210℃ Pre-heating 120~160℃
Water Clear --
Electrodes: Au Plating Encapsulating Resin: Epoxy Resin Package: BT Resin
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Unit:mm Tolerance:±0.1
Absolute Maximum Rating （Ta=25℃）
Customer confirm Approved by Checked by
Issued by
Part No.
XGS-PB3216UEUG-04
Emitted Color
Red
Blue
Len'sColor
Chip Material AlGaInP/GaAs InGaN/GaN
--
◆ Features:
◆ Cautions
1、Package When moisture is absorbed into the package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. So the moisture proof package is used to keep moisture to a minimum in the package. 2、Storage
Parameter
Value
Symbol
Unit
R
G
Power Dissipation
PM
60
80
Mw
Pulse Forward Current
IFP
125
mA
DC Forward Current
IF
20
mA
Reverse Voltage
VR
5
V
Operating Temperature Range
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◆ Package Tape Specifications: (4000 pcs/Reel)
Feeding, Direction
Dimensions of Reel ( Unit: mm)
Dimensions of Tape (Unit:mm)
Arrangement of Tape(Unit:mm)
◆ Applications:
Automotive and Telecommunication Flat backlight for LCD ,switch and symbol in telephone and fax General use for indicators
◆ Package Dimensions:
3℃/sec.
260℃ Max. 10sec.Max.
60~120sec.
-4℃/sec.
120se.c.Max.
Time
• Reflow soldering should not be done more than two times. • Do not stress its resin while soldering. • After soldering,do not warp the circuit board.
20
0/1
20
0/1
20
0/1
20
0/1
20
0/1
① 80 ℃② 100 ℃③ 120 ℃④ 160 ℃⑤
7 IR-Reflow Pb-Free Process 170℃⑥235℃⑦270℃⑧255℃，
20
0/1
60cm/min，2 times
(2)Criteria of judging the damage
Criteria for judgement
Min.
Max.
/
U.S.L*1.1
/
15uA
L.S.L*0.7
/
/
U.S.L±2nm
No mechanical damage
* U.S.L: Upper standard level
L.S.L: Lower standard level
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If the LEDs have exceeded the storage time, baking treatment should be performed more than 24hours at 60±5°C. 3、Soldering Iron Each terminal is to the tip of soldering iron temperature less than 300℃ for 3 seconds within once in less than the soldering iron capacity 25 W.Leave two seconds and more internals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 4、Repairing
Connect with a power IF=20mA
5
Operating Life Test
Ta=Under room temperature
Test time=1000HRS(-24HRS,+72HRS)
-40±5℃→100±5℃
6
Leabharlann Baidu
Thermal Shock
(15min，15min) 100 Cycles
PN: XGS-PB3216UEUG-04
For: IF=20mA
Contents 1.Features 2.Applications 3.Package dimensions 4.Absolute maximum rating 5.Electrical optical characteristics 6.BIN range 7.Package label 8.Soldering pad dimensions 9.Soldering conditions 10. Package tape specifications 11.Typical electro-optical characteristics curves 12.Reliability test items and conditions 13.Cautions 14.Note
Red
--
--
10
IR
uA VR=5V
Green --
--
10
Red 615 625 Dominant Wavelength λd
Green 515 530
-nm IF=20mA
--
Viewing Angle
Red
--
140
--
2θ1/2
Deg. IF =20mA
Green --
140
--
Notes: 1.Tolerance of Luminous Intensity ±10%
Topr
-40℃～85℃
℃
Storage Temperature Range
Tstg
-40℃～100℃
℃
IFP condition: pulse width ≤1ms ,duty cycle ≤1/10
Electrical Optical Characteristics（Ta=25℃）
Parameter
李忠
Customer Confirmation 客户确认
采购部Pur Dept By 品质部QA Dept By 工程部Eng Dept By
深圳市鑫光硕科技有限公司
SHEN ZHEN XIN GUANG SHUO TECHNOLOGY CO.,LTD
公司地址：广东省深圳市宝安区沙井万丰村前路31号8楼
2.Tolerance of Dominant Wavelength ±2nm 3. Tolerance of Forward Voltage ±0.05V 4. Luminous Intensity is measured by XGS’s equipment on bare chips
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Symbol
Test Min Typ. Max. Unit
Condition
Luminous Intensity
Red
70
150
IV
Green 320 600
-mcd IF =20mA
--
Forward Voltage
Red 1.8
--
2.4
VF
V IF =20mA
Green 2.8
--
3.4
Reverse Current