道康宁sc102散热膏技术规格书(TDS)
商品说明书中的产品最佳使用环境介绍
商品说明书中的产品最佳使用环境介绍商品名称：商品型号：商品品牌：生产日期：商品说明书编写日期：尊敬的用户：感谢您选择我们的产品。
为了让您更好地使用我们的商品，我们特别编写了这份商品说明书，详细介绍了我们产品的最佳使用环境。
请您仔细阅读，以便更好地了解如何使用我们的商品。
一、产品概述该商品是一款高性能、多功能的产品，适用于各种特定的使用环境。
它采用先进的技术，设计精良，质量可靠，能够满足您的不同需求。
二、最佳使用环境为了确保产品的正常运行和延长其使用寿命，请在以下最佳使用环境中使用该商品：1. 温度范围：商品适用的最佳温度范围为20°C-30°C。
超过此温度范围可能会影响商品的稳定性和性能，请避免将商品暴露于极端的高温或低温环境中。
2. 湿度范围：商品适用的最佳湿度范围为40%-60%。
高湿度或低湿度可能会导致商品内部的零部件受潮或失效，请确保商品在适宜的湿度条件下使用。
3. 气压范围：商品适用的最佳气压范围为900 hPa-1100 hPa。
高气压或低气压可能会对商品内部的电子元件产生不利影响，请避免在气压异常的环境中使用商品。
4. 通风条件：请确保商品在通风良好的环境中使用，避免商品受到灰尘、腐蚀性气体或其他污染物的侵入。
5. 安装位置：在安装商品时，请确保商品放置在平稳的表面上，以避免商品倾斜或摇晃造成的损坏。
6. 防护措施：根据商品的特性和使用环境的要求，可能需要采取一些额外的防护措施，例如防水、防尘、防震等。
请根据实际情况选择适当的防护措施。
三、特殊使用环境除了最佳使用环境外，我们的商品还可以在一些特殊的使用环境下正常工作。
以下是一些特殊使用环境的介绍：1. 高温环境：虽然我们的商品在正常使用温度范围内运行良好，但它也具备一定的抗高温能力。
在高温环境下使用商品时，请注意商品的散热情况，以避免过热造成的损坏。
2. 低温环境：在低温环境下使用商品时，请注意商品的耐寒性能。
道康宁硅油参数(英文)
Information About Dow Corning® Brand Thermally Conductive Materials
Thermally Conductive Materials
Long-term, reliable protection of sensitive circuits and components is important in many of today’s delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more compact electronic modules, the need for thermal management is growing. Dow Corning’s family of thermally conductive materials provides excellent thermal management options. Thermally conductive silicones function as heat transfer media, durable dielectric insulation, barriers against environmental contaminants and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range.
PRODUCT INFORMATION – THERMALLY CONDUCTIVE ADHESIVES
CoolTherm SC-1600 双组件热导膏说明书
CoolTherm® SC-1600 gap filler is a two-component thermally conductive silicone system designed to provide thermal conductivity for electronic applications, while retaining desirable properties associated with silicones. Features and Benefits:Low Stress – exhibits low shrinkage and stress on components as it cures.Durable – composed of an addition-curing polydimethylsiloxane polymer that will not depolymerize when heated in confined spaces.Environmentally Resistant – provides excellent resistance to thermal shock, high temperature, and humid environments.UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.Application:Mixing – Mix CoolTherm SC-1600 resin with CoolTherm SC-1600 hardener at a 1:1 ratio, by weight or volume. Handheld cartridges or automatic meter/mix/dispense equipment should be used to avoid any air entrapment in the material. Manual mixing is not recommended.Applying – Apply material using handheld cartridges or automatic meter/mix/dispense equipment.•H andheld Cartridges1. Load the cartridge into the applicator gun and removethe end caps.2. Level the plungers by expelling a small amount ofmaterial to ensure both sides are level.3. Attach mixing tip and expel a mixer’s length ofmaterial.4. Apply material to substrate and mate the parts withinthe working time of the gap filler. Clamp in positionuntil material reaches handling strength.• M eter/Mix/Dispense (MMD) EquipmentContact your Parker Lord representative if assistance is needed using this equipment.Avoid applying CoolTherm SC-1600 gap filler to surfaces that contain cure inhibiting ingredients, such as amines, sulfur, or tin salts. If bonding surface is in question, apply a test patch of gap filler to the surface and allow it to set for the normal cure time. A liquid layer of silicone will remain on the surface if an inhibitor is present.Curing – Allow material to cure for 24 hours at room temperature (25°C) or for 30 minutes at 100°C. Thistime-at-temperature profile refers to the time the material should be allowed to cure once it reaches the target temperature. Allowance should be made for oven ramp rates, parts with large thermal mass and other circumstances that may delay material reaching the target temperature.CoolTherm® SC-1600 Thermally Conductive Silicone Gap FillerTechnical Data Sheet**Time to tack-free.CoolTherm SC-1600 Thermally Conductive Silicone Gap Filler — Technical Data SheetParker LordEngineered Materials Group 111 LORD DriveCary, NC 27511-7923USAphone +1 877 275 /APSValues stated in this document represent typical values as not all tests are run on each lot of material produced. For formalized product specifications for specific product end uses, contact the Customer Support Center.Information provided herein is based upon tests believed to be reliable. In as much as Parker Lord has no control over the manner in which others may use this information, it does not guarantee the results to be obtained. In addition, Parker Lord does not guarantee the performance of the product or the results obtained from the use of the product or this information where the product has been repackaged by any third party, including but not limited to any product end-user. Nor does the company make any express or implied warranty of merchantability or fitness for a particular purpose concerning the effects or results of such use.WARNING — USER RESPONSIBILITY . FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE.This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized distributors provide product or system options for further investigation by users having technical expertise.The user, through its own analysis and testing, is solely responsible for making the final selection of the system and components and assuring that all performance, endurance, maintenance, safety and warning requirements of theapplication are met. The user must analyze all aspects of the application, follow applicable industry standards, and follow the information concerning the product in the current product catalog and in any other materials provided from Parker or its subsidiaries or authorized distributors.To the extent that Parker or its subsidiaries or authorized distributors provide component or system options based upon data or specifications provided by the user, the user is responsible for determining that such data and specifications are suitable and sufficient for all applications and reasonably foreseeable uses of the components or systems.©2023 Parker Hannifin - All Rights ReservedInformation and specifications subject to change without notice and without liability therefor. Trademarks used herein are the property of their respective owners.OD DS4450 10/23 Rev.4Shelf Life/StorageShelf life of each component is six months when stored at 5-30°C in original, unopened container.CoolTherm SC-1600 gap filler evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.Cautionary Information:Before using this or any Parker Lord product, refer to the Safety Data Sheet (SDS) and label for safe use and handling instructions.For industrial/commercial use only. Must be applied by trained personnel only. Not to be used in householdapplications. Not for consumer use.。
道康宁硅油产品说明
若道康宁违反该保证，您所能获得 的唯一补偿，仅限于退还购货价款 或替换不符合保证的任何产品。
道康宁特别声明，不作任何其他明 示或暗示对特定目的适用性或适销 性的保证。
道康宁声明，不对任何间接或附带性的 损害负任何赔偿责任。
XIAMETER® PMX-200 硅油，50-1,000 CS 2009 年 7 月 20 日 Ref. No. 95-516-40
XIAMETER® PMX-200 硅油，50-1,000 CS
无色、清澈的聚二甲基硅氧烷流体
特性
• 易于涂敷和擦除 • 易于抛光 • 改善颜色 • 高拒水性 • 高可压缩性 • 在不裂解的情况下具有高剪切性 • 高可铺展性和相容性 • 低环境危害 • 低火灾危险性 • 低反应性和蒸气压 • 低表面能 • 良好的热稳定性 • 本质上无嗅、无味、无毒 • 可溶于许多溶剂中
应用
• 各种膏体、乳液、溶剂型抛光剂以及气雾剂等形式的汽车、家具、金属 和特种抛光产品中的活性成分。
• 化妆品成分、弹性体和塑料润滑剂、电绝缘液、防泡和消泡剂、机械流 体、脱模剂、表面活性剂、溶剂型表面处理剂以及皮革脂肪液化剂等各 种应用。
描述
XIAMETER® PMX-200 硅油，501,000 CS 硅油是一种聚二甲基硅氧 烷聚合物，用于生产具有各种平均 运动粘度的实质线性聚合物。
酸值，BCP 熔点
°C (°F) °C (°F)1,2
0.969 1.4034
5 >326 (>620)
微量 -26 (-15)
0.970 1.4035
5 >326 (>620)
微量 -25 (-13)
1002规格书
客户：产品品牌：道康宁产品名称：可注塑有机硅产品料号：MS 1002客户品番：客户承认签章:长旭科技有限公司sales@金源大厦B栋3层中国 江苏 无锡新区 湘江路总机: 86（510）8522 6581传真: 86（510）8521 0148纳入式样书编号：道康宁中国区代理商长旭科技有限公司制作日期:纳 入 式 样 书制图审核Product InformationLED MaterialsDow Corning® MS-1002 MoldableSiliconeFEATURES•Good transparency•Medium viscosity for injection molding•Good mold flow for excellent feature reproductionBENEFITS•Lighter than glass•Easily molded into complex shapes •Better heat resistance than plastic •Less yellowing than some plastic COMPOSITION •Polydimethylsiloxane MS-1002 is a medium viscosity, high Shore A hardness, two-part, 1:1 ratio, fast curing optical molding resin for producing fine detail with good resistance to environmental aging.APPLICATIONS-Injection or compression molding for primary or secondary lenses, light pipes, light guides and other optic devicesTYPICAL PROPERTIESSpecification Writers: These values are not intended for use in preparing specifications. Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on this product.Property Unit ResultOne or Two Part - 2Viscosity (Part A) cPmPa-secPa-sec389503895039Viscosity (Part B) cPmPa-secPa-sec182501825018.3Viscosity (Mixed) cPmPa-secPa-sec262502625026.3Durometer Shore A - 74Refractive Index @ 632.8 nm - 1.41Working Time at 25ºC (Pot Life -hours)hr 48Tensile Strength psiMPakg/cm2162511.2112Elongation % 80Dielectric Strength volts/milkV/mm47519Volume Resistivity ohm*cm 4.5 e+15Linear CTE (by TMA) ppm/ºC 275Specific Heat @ 25C Btu/lb*ºFJ/gºCcal/gmºC0.3271.370.327Dow Corning is a registered trademark of Dow Corning Corporation.We help you invent the future is a trademark of Dow Corning Corporation.2011, November 16 XIAMETER is a registered trademark of Dow Corning Corporation.Form No. 11-2089-01© 2011 Dow Corning Corporation. All rights reserved.2Typical Properties (continued)PropertyUnitResultSpecific Heat @ 50CBtu/lb*ºF J/gºC cal/gmºC 0.337 1.41 0.337 Transmission @ 450 nm, 3.2 mm thick % 91 Transmission @ 760 nm, 3.2 mm thick%94DESCRIPTIONDow Corning ® brand Optical Molding materials are designed to meet the challenging needs of the Optical market; high purity, moisture resistance, thermalstability and optical transmittance. Injection moldable optical silicone materials from Dow Corning are two-part, heat-cure silicone resins that are especially suitable for precision molding applications, as micrometer-sized features can be replicated on the lens surface to direct light output. Silicone optical molding materials can be molded into complex shapes, withstand heat and resistyellowing better than plastic, and are lighter than glass. Parts have been fabricated using a variety of techniques, including injection molding, casting or cavity molding, transfer molding, and others.MIXING AND DE-AIRINGDow Corning silicone 1:1 Optical Molding materials are supplied in two parts that do not require lot matching. The 1:1 mix ratio, by weight or volume, simplifies the proportioning process. To ensure best properties Parts A and B must each be thoroughly mixed,inadequate mixing and may result in incomplete cure or reduced physical properties. Automated meter, mix and dispenseequipment may be utilized. In applications or molds that are sensitive to air entrapment, de-airing or vacuum application in the mold may be helpful.PROCESSING/CURINGThese products are compatible with commercially available equipment and industry standard processes. These materials can be pumped, meter mixed and molded similarly to Liquid Silicone Rubber. Mix at 1:1 ratio. They are lower in viscosity thantraditional LSR materials but they are not shear thinning as the LSR’s are. This allows forreduced pressure in the pumping and mixing areas but similar performance in the injection unit compared to LSR’s. In the mold the heat does thin the material dramatically allowing for good flow and reproduction in the mold cavity. Dow Corning ® brand OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.POT LIFE AND CURE RATECure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastoplastic material. Pot life is defined as the time required for viscosity to double after Parts A and B (base and curing agent) are mixed and is highly temperature dependent. Please refer to the data table. The cure time depends on the thickness and the cure temperature used.USEFULTEMPERATURE RANGESFor most uses, siliconeencapsulants and resins should be operational over a temperature range of -45 to 200°C (-49 to 392°F) for long periods of time. However, at both the low- and high-temperature ends of the spectrum, behavior of the materials and performance inparticular applications can become more complex and require additional considerations. For low-temperature performance, thermal cycling to conditions such as -55°C (-67°F) may be possible, but performance should be verified for your parts or assemblies. Factors that may influence performance areconfiguration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. At the high-temperature end, the durability of the cured silicone encapsulants and resins is time and temperature dependent. As expected, the higher thetemperature, the shorter the time the material will remain useable.COMPATIBILITYCertain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure molding materials. Most notable of these include: Organotin and other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur,polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbonplasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition ofDow Corning is a registered trademark of Dow Corning Corporation.We help you invent the future is a trademark of Dow Corning Corporation.2011, November 16 XIAMETER is a registered trademark of Dow Corning Corporation.Form No. 11-2089-01© 2011 Dow Corning Corporation. All rights reserved.3cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured material indicates incompatibility and inhibition of cure.USABLE LIFE AND STORAGEShelf life is indicated by the “Use Before” date found on the product label. Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life. Check the product label for specific storage conditions.LIMITATIONSThis product is neither tested nor represented as suitable for medical or pharmaceutical uses.HANDLING PRECAUTIONSPRODUCT SAFETYINFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFOREHANDLING, READ PRODUCT AND MATERIAL SAFETY DATA SHEETS ANDCONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTH HAZARD INFORMATION. THEMATERIAL SAFETY DATA SHEET IS AVAILABLE ON THE WEB SITE AT, ORFROM YOUR DOW CORNING REPRESENTATIVE, OR DISTRIBUTOR, OR BY CALLING YOUR GLOBAL DOW CORNING CONNECTION.HEALTH ANDENVIRONMENTAL INFORMATIONTo support Customers in theirproduct safety needs, Dow Corning has an extensive ProductStewardship organization and a team of Product Safety andRegulatory Compliance (PS&RC) specialists available in each area. For further information, please see our Web site, or consult your local Dow Corning representative.LIMITED WARRANTY INFORMATION – PLEASE READ CAREFULLYThe information contained herein is offered in good faith and isbelieved to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution forcustomer’s tests to ensure that our products are safe, effective, and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent.Dow Corning’s sole warranty is that our products will meet the sales specifications in effect at the time of shipment.Your exclusive remedy for breach of such warranty is limited to refund of purchase price orreplacement of any product shown to be other than as warranted. DOW CORNINGSPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR APARTICULAR PURPOSE OR MERCHANTABILITY. DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL ORCONSEQUENTIAL DAMAGES.FOR MORE INFORMATIONTo learn more about these and other products available from Dow Corning, please visit the Dow Corning Electronics web site at /electronics. We help you invent the future. ™Page No.: ˄˂ˊʳLast Revision Date: 2013/03/15Version No.: GHS 1.3DOW CORNING(R) MS-1002 MOLDABLE SILICONE PART A (PART Ainformation is below)!1. IDENTIFICATION OF THE PRODUCT AND OF THE COMPANY1.1Product Name:DOW CORNING(R) MS-1002 MOLDABLE SILICONE PART A (PART A information is below)1.2 Product Code:040929101.3 Chemical Classification:Silicone resin.1.4 Recommended Product Usage and Limited Use:EncapsulantOptical communication applications1.5 Company DetailsManufacturer/Supplier:Dow Corning (China) Holding Company LimitedAddress:1077 Zhangheng Road, Zhangjiang Hi-Tech Park, Shanghai, P.R.C, Postal Code: 201203Telephone Number: 400 880 7110 Fax Number: (86 21) 50796552 Email Address:@ Emergency Telephone Number:(86 512) 56732049 1.6 First Issuing Date:2010/05/242. HAZARD IDENTIFICATION2.1Hazard Classification:Not hazardous.2.2Label Elements Including Precautionary StatementsSymbol:None.Signal Word:None.Hazard Risk Statement:Not hazardous.Precautionary Statement:Avoid contact with skin and eyes.IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.IF ON SKIN: Wash with plenty of soap and water.2.3 Other Hazard: None known.3. COMPOSITION / INFORMATION ON INGREDIENTS3.1Chemical characterization:Mixture3.2Hazardous IngredientsChemical NameCAS No.% (w/w)Dimethylvinylated and trimethylated silica68988-89-630 - 60Page No.: ˅˂ˊʳLast Revision Date: 2013/03/15Version No.: GHS 1.3DOW CORNING(R) MS-1002 MOLDABLE SILICONE PART A (PART Ainformation is below)!Tetra (trimethylsiloxy) silane3555-47-3<10Ethylbenzene100-41-4<14. FIRST AID MEASURES4.1First Aid MeasuresEyes: Immediately flush with water. Skin:No first aid should be needed. Inhalation: No first aid should be needed. Oral:Get medical attention. Comments: Treat symptomatically.4.2 Important Symptoms and Hazard Effects:No significant adverse effects from normal use. 4.3 Personal Protection for First Aid or Rescue PersonnelRespiratory Protection:No respiratory protection should be needed. Eye Protection:Use proper protection - safety glasses as a minimum. Skin Protection:Washing at mealtime and end of shift is adequate.4.4 Note to physicians:Treat symptomatically. For further information, the medical practitioner should contact Dow Corning (China) Holding Company Limited.5. FIRE-FIGHTING MEASURES5.1Suitable ExtinguishingMedia:On large fires use dry chemical, foam or water spray. On small fires use carbon dioxide (CO2), dry chemical or water spray. Water can be used to cool fire exposed containers. 5.2 Unsuitable Extinguishing Media:None established. 5.3 Specific Hazards:None. 5.4 Special Fire FightingProcedures:Determine the need to evacuate or isolate the area according to your local emergency plan. Use water spray to keep fire exposed containers cool. 5.5 Special protectiveequipment for the FireFighters:Self-contained breathing apparatus and protective clothing should be worn in fighting large fires involving chemicals.6. ACCIDENTAL RELEASE MEASURES6.1Personal Precautions:Avoid eye contact. Do not take internally.Page No.: ˆ˂ˊʳLast Revision Date: 2013/03/15Version No.: GHS 1.3DOW CORNING(R) MS-1002 MOLDABLE SILICONE PART A (PART Ainformation is below)!6.2 EnvironmentalPrecautions:Prevent from spreading or entering into drains, ditches or rivers by using sand, earth orother appropriate barriers.6.3 Methods for Cleaning up:Determine whether to evacuate or isolate the area according to your local emergency plan. Observe all personal protective equipment recommendations described in this MSDS. If diked material can be pumped, store recovered material in appropriatecontainer. Clean up remaining materials from spill with suitable absorbant. Clean area as appropriate since spilled materials, even in small quantities, may present a slip hazard. Final cleaning may require use of steam, solvents or detergents. Dispose of saturated absorbant or cleaning materials appropriately, since spontaneous heating may occur. Laws and regulations may apply to releases and disposal of this material, as well as those materials and items employed in the cleanup of releases. You will need to determine which laws and regulations are applicable.7. HANDLING AND STORAGE7.1Handling Precautions:Use with adequate ventilation. Avoid eye contact. Do not take internally. Exercise good industrial hygiene practice. Wash after handling, especially before eating, drinking or smoking.7.2 Storage Conditions: Use reasonable care and store away from oxidizing materials.7.3 Unsuitable PackagingMaterials: None established.8. EXPOSURE CONTROLS / PERSONAL PROTECTION8.1Industrial Hygiene Standards:IngredientsCAS No. Exposure LimitsDimethylvinylated and trimethylated silica68988-89-6Dow Corning guide: 5 mg/m3 Ceiling (as dust).Tetra (trimethylsiloxy) silane3555-47-3None established.Ethylbenzene100-41-4China: TWA 100 mg/m3. STEL 150 mg/m3. Possible human carcinogen..OSHA PEL (final rule): TWA 100 ppm, 435 mg/m3. ACGIH TLV: TWA 20 ppm, STEL 125 ppm.8.2 Engineering ControlsLocal Ventilation:None should be needed. General Ventilation:Recommended.8.3 Personal Protective Equipment for Routine HandlingRespiratory protection: No respiratory protection should be needed.Suitable Respirator: None should be needed.Eye protection: Use proper protection - safety glasses as a minimum.Page No.: ˇ˂ˊʳLast Revision Date: 2013/03/15Version No.: GHS 1.3DOW CORNING(R) MS-1002 MOLDABLE SILICONE PART A (PART Ainformation is below)!Hand protection: No special protection needed.Skin protection: Washing at mealtime and end of shift is adequate.Hygiene Measures:Exercise good industrial hygiene practice. Wash after handling, especially before eating, drinking or smoking.8.4Personal Protective Equipment for SpillsRespiratory protection: No respiratory protection should be needed.Eye protection: Use proper protection - safety glasses as a minimum. Skin protection:Washing at mealtime and end of shift is adequate.Precautionary Measures: Avoid eye contact. Do not take internally. Use reasonable care.ʳComments:If this product is heated to > 150 degrees C, trace quantities of formaldehyde may be released, and adequate ventilation is required.Note:These precautions are for room temperature handling. Use at elevated temperature or aerosol/spray applications may require added precautions. For further information regarding aerosol inhalation toxicity, please refer to the guidance document regarding the use of silicone-based materials in aerosol applications that has been developed by the silicone industry () or contact the Dow Corning customer service group.9. PHYSICAL AND CHEMICAL PROPERTIES9.1Physical Form:Viscous Liquid9.2 Color:Clear to slightly hazy, colorless9.3 Odor:Almost odorless 9.4 pH:Not determined. 9.5 Melting Point:Not determined. 9.6 Boiling point/range:> 65 °C9.7 Flash Point:150 °C(Closed Cup)9.8 Explosive Limit:Not determined. 9.9 Vapor Pressure @ 25°C:Not determined. 9.10 Vapour Density (air=1):Not determined. 9.11 Specific Gravity:1 g/cm39.12 Water Solubility:Not determined. 9.13 Partition Coefficient(n-Octanol/Water):Not determined.9.14 Autoignition temperature:Not determined. 9.15 DecompositionTemperature :Not determined. 9.16 Odor Threshold:Not determined. 9.17 Evaporation Rate: Not determined.Page No.: ˈ˂ˊʳLast Revision Date: 2013/03/15Version No.: GHS 1.3DOW CORNING(R) MS-1002 MOLDABLE SILICONE PART A (PART Ainformation is below)!9.18 Flammability (Solid, Gas):Not applicable.The above information is not intended for use in preparing product specifications. Contact Dow Corning before writing specifications.10. STABILITY AND REACTIVITY10.1Stability:Stable. 10.2 Possibility of HazardousReactions:Hazardous polymerization will not occur. 10.3 Conditions to Avoid:None.10.4 Materials to Avoid:Can react with strong oxidising agents.10.5 Hazardous DecompositionProducts:Carbon oxides and traces of incompletely burned carbon compounds. Silicon dioxide. Formaldehyde.11. TOXICOLOGICAL INFORMATION11.1Route of Exposure:Inhalation, skin contact and accidental ingestion.11.2 Signs and Symptoms ofOverexposure:No significant adverse effects from normal use.11.3 Acute Toxicity:Chemical NameCAS No.LD50 (Oral)LD50 (Dermal)LC50 (Inhalation)Tetra (trimethylsiloxy) silane3555-47-3> 2,000 mg/kg (Rat)> 2,000 mg/kg (Rat)> 2350 PPM (Rat; 4hr vapor)Ethylbenzene100-41-43,500 mg/kg (Rat)15,354 mg/kg (Rabbit)17.2 mg/l (Rat; 4hr vapor)3961 ppm (Rat; 4hr vapor)Eyes: Direct contact may cause temporary redness and discomfort.Skin:No significant irritation expected from a single short-term exposure. Ingestion: Low ingestion hazard in normal use.Inhalation:No significant effects expected from a single short-term exposure.11.4 Chronic ToxicitySkin:No known applicable information.Ingestion: Repeated ingestion or swallowing large amounts may injure internally. Inhalation: No known applicable information.11.5Other Health Hazard Information:No known applicable information.The above listed potential effects of overexposure are based on actual data, the results of studies performed upon similar compositions, component data, and/orPage No.: ˉ˂ˊʳLast Revision Date: 2013/03/15Version No.: GHS 1.3DOW CORNING(R) MS-1002 MOLDABLE SILICONE PART A (PART Ainformation is below)!expert review of the products.12. ECOLOGICAL INFORMATION12.1Aquatic and Terrestrial EcotoxicityEcotoxicity Effects:Acute:No adverse effects on aquatic organisms. Chronic:No adverse effects on aquatic organisms.Fate and Effects in WasteWater Treatment Plants:No adverse effects on bacteria. Removed > 90% by binding onto sewage sludge. The siloxanes in this product do not contribute to the BOD.12.2 Persistence and DegradabilityDegradation:In soil, siloxanes are degraded.12.3 Bioaccumulative PotentialBioaccumulation:No bioaccumulation potential.12.4 Mobility in Soil: Siloxanes are removed from water by sedimentation or binding to sewage sludge.12.5 Additional EnvironmentalInformation: Additional environmental information on the silicone component is available on request.13. DISPOSAL CONSIDERATIONS13.1Product Disposal:Dispose of in accordance with local regulations.13.2 Packaging Disposal: Dispose of in accordance with local regulations.14. TRANSPORT INFORMATION14.1Road and Rail TransportNot applicable.14.2Sea Transport (IMDG)Not subject to IMDG code.14.3Air Transport (IATA)Not subject to IATA regulations.14.4Special Requirements and Additional Information :None.Dow Corning (China) Holding Company LimitedMaterial Safety Data SheetPage No.: ˊ˂ˊʳLast Revision Date: 2013/03/15Version No.: GHS 1.3DOW CORNING(R) MS-1002 MOLDABLE SILICONE PART A (PART A information is below)!15. REGULATORY INFORMATION15.1 Applicable Laws:Provisions of the Regulations for the Safe Handling of Chemicals in the WorkplaceGeneral rule for classification and hazard communication of chemicals [GB13690-2009]15.2 Chemical Inventories EINECS: All ingredients listed or exempt.TSCA: All chemical substances in this material are included on or exempted from listing on theTSCA Inventory of Chemical Substances.AICS: All ingredients listed or exempt.IECSC: All ingredients listed or exempt.ENCS/ISHL: All components are listed on ENCS/ISHL or its exempt rule.KECL: All ingredients listed, exempt or notified.DSL: All chemical substances in this material are included on or exempted from the DSL.PICCS: Not determined.HSNO:Not determined.16. OTHER INFORMATION16.1Contact Point:Technical Information Center 400 880 7110 16.2 Prepared by:Dow Corning (China) Holding Company LimitedLegend:- No specific information availableThis information is offered in good faith as typical values and not as a product specification. No warranty, expressed or implied, is hereby made. The recommended industrial hygiene and safe handling procedures are believed to be generally applicable. However, each user should review these recommendations in the specific context of the intended use and determine whether they are appropriate.(R) indicates Registered Trademark。
导热硅脂产品说明
导热系数
1.8W/m-k
针入度
350-380℃
工作温度
-55℃-300℃
锥入度
260±18（25℃）0.1mm
挥发份
≤1.0（200℃，24h）%
油离度
≤1.5（200℃，24h）%
电压击穿强度
≥9.0 KV/mm
2.产品说明:
本公司产品导热系数有1.0,1.2,-3.8W/m-K可供选择,无味、无毒、无刺激、无腐蚀,在-50℃-300℃条件下不硬化，也不流淌，耐温性好；该系列产品皆通过SGS国际环保认证，符合欧盟ROHS检测标准.
CAS
112926-00-8
使用说明：
1、施工：用刮刀、刷子、玻璃棒或注射器等方法将导热硅脂均匀涂敷于处理过的固体接触面后，再将二表面略施压锁紧即可。
如有挤出的硅脂可用布擦净。每次用完应密封以备后用。由于硅脂不固化，不影响接触面的装卸，拆装后可重新涂脂。
注意事项
贮存及运输
1、在阴凉干燥处贮存，贮存期：12个月（25℃）。
3.主要应用:主要用于电子电器（电磁炉、电冰箱、饮水机、电热水壶等）、电气（开关电源、继电器、变频器、可控硅等）、电脑CPU、控制板、显卡、液晶显示、光纤通讯器材、LED等极为广泛的电子电器领域。
4.使用指南：
Ⅰ、清洗待涂覆表面，除去油污。
Ⅱ、然后将导热硅脂直接挤出，均匀的涂覆在待涂覆表面即可。
Ⅲ、注意施工表面应该均匀一致，只要涂敷薄薄一层即可。
2、本产品属于非危险品，可按一般化学品运输。
3、超过保存期产品应确认有无异常后方可使用。
包装:
针管装：0.5g-50g
罐装：500g,1000g
桶装：5kg,10kg,20kg
Sn99Ag0.3Cu0.7锡膏TDS
Al
Fe
Ni
Zn
Ge
As
Cd
Sb
Pb
Bi
0.001
0.02
0.04
0.001 0.003
0.03
0.01
0.1
0.1
0.1
Max
Max
Max
Max
Max
Max
Max
Max
Max
Max
3.2 焊料合金之物理性質 Solder alloy physical properties
熔融溫度 Melting Points (°C)
5. 有效保存期限 Shelf Life
如果本產品保持密封狀態，並儲存在0-10°C範圍內，其有效使用期限為6個月。 The guarantee period of this product shall be
6 months from the manufacturing date if kept sealed in refrigerating(0-10°C)
回流焊接後極好的焊點和殘留物外觀，包括使用長/高溫度浸潤曲線。減少不規則錫珠數量， 減少返工和提高 直通率。優秀的回流時元器件重新定位性能，包括最苛刻的回流設定。 Excellent solder and flux cosmetics after reflow soldering even with a long/high thermal soaking. Reduction in random solder balling levels, minimizing rework and increasing first time yield. Excellent component placement re-alignment during reflow, even with most demanding reflow setting.
道康宁密封圈润滑脂应用参数
·低挥发性
·抗湿汽
·热氧化安定性和化学稳定性
·符合军标MIL-S-8660C
·工作温度-55－200ºC
·无臭味
·与金属、陶瓷、橡胶、塑料、密封胶相容
物理／化学数据
颜色
浅灰透明
未工作锥入度
mm/10
220
工作锥入度，最大
mm/10
310
分油量，200ºC，24小时，最大
%
6
挥发，200ºC，24小时，最大
%
2
工作温度
ºC
-55－200
熔点
ºC
无
密度，25ºC
g/ml
1
电学性质
介电常数
100hz3Biblioteka 1100khz3.1
损耗因子
100hz
0.0025
100khz
0.0025
介电常数，1.27mm
kv/mm
16
体积电阻，23ºC
ohm.cm
1.1×1015
耐电弧
秒
120
保质期，年
5
使用方法
清洁表面，用刷子、注射枪或自动润滑装置添加，也可用于集中润滑系统
道康宁密封润滑脂Dow corning4有机硅润滑脂
品牌；道康宁。
产品；Dow corning4
经销；铭翔润滑油。
类型；有机硅复合物。
应用；用于防湿汽的密封件，如气杀轧、自动化海洋导航系统和火花塞的连接件，电子打印系统的分离连接部件，也用于电子组装机和终端；
用于密封、润滑，如按键、电池终端、橡胶密封、开关/橡胶/塑料O型圈中金属/塑料中金属/橡胶连接的组装润滑剂。
包装
管装：150g
桶装：3.6kg,18.1kg
道康宁产品应用技术手册
第一章 产品
第一章 产品
道康宁具有配套齐全的高性能硅酮结构密封胶，这些密封胶可以根据其各自具有的独特性能 被用于不同的应用中。具体的产品数据信息例如物理性能、应用和限制等都能在产品数据表 中找到或登录公司网站查询。
结构性装配硅酮密封胶
道康宁 993N结构性装配硅酮密封胶
道康宁产品应用技术手册
目录
道康宁产品应用技术手册
第一章 产品 ................................................................................................................................. 1 结构性装配硅硐密封胶 ......................................................................................................................................................................................................................... 2 中空玻璃专用硅酮密封胶 ................................................................................................................. 3 底涂液 ................................................................................................................................................. 4 表面处理指南 ..................................................................................................................................... 5
DC 1-2577技术规格书TDS
特性∙可以通过轻微加热加速固化过程，缩短固化时间∙优异的耐磨损性能∙耐湿气以及其它恶劣环境∙良好的介电性能∙固化后形成牢固、干燥的表面，易于操作∙挥发性有机物豁免型溶剂∙中等粘度∙UL 94 V0，V1成分∙单组分室温固化有机硅树脂∙半透明液体，固化后成为透明的弹性树脂涂层产品描述1-2577低挥发性有机物敷形涂料是一种单组分、自打底的涂料，固化后形成一种柔韧的、透明的弹性塑料涂料，非常适合于太阳能应用，特别是那些需要一定韧性和耐磨损性的应用。
如何使用1-2577低挥发性有机物敷形涂料可以通过喷涂、刷涂、流动涂布、浸涂或自动方式进行涂敷。
喷涂操作时，建议用溶剂稀释到最多不超过60%。
对于浸涂操作，可以直接采用供货的材料；如果希望得到较薄的涂层时，也可用溶剂进行稀释。
应当小心确保溶剂中没有水分，浸涂罐不用时应当盖上。
稀释时建议使用道康宁® OS-20硅油。
1-2577低挥发性有机物敷形涂料应用于太阳能电池和组件的保护涂料应用∙用于太阳能电池和组件的耐磨保护涂料∙可用于组件划痕、切口或磨损的修复典型物性规格制定者：制订本产品规格之前，请联系当地的道康宁销售处或道康宁全球联络处。
物性单位数值颜色透明粘度Centipoise或mPa.s 1250硬度，Shore D 25比重0.88室温表干时间minutes6室温固化时间minutes160加热固化时间minutes 2 @ 60°C/15% RH2,3UL 耐燃等级494 V0, V1介电强度volts/mil340kV/mm13.4100 Hz时的介电常数 2.34100 kHz 时的介电常数 2.33体积电阻率，ohm-cm 1.90 x 1014100 Hz时的耗散因子0.0011100 kHz时的耗散因子<0.0011 5密耳厚度样品在180º剥离测试下的典型数值。
2 在180º剥离测试中发生内聚失败的时间。
超齐全散热膏横向评测
超齊全散熱膏橫向評測想了想，本刊好久沒有做散熱膏專題了，一來現今零組件發熱設計得宜，散熱問題早已不可同P4噴火龍時代而語；二來現今網路發達，口耳相傳的「神膏」已不復見，散熱膏原理與材料講穿了也不過幾句話，消費者變聰明了，廠商自然少了施力空間。
即便如此，對散熱膏這玩意充滿疑惑的讀者仍不在少數，到底價差相差許多的高價散熱膏是不是真有神效？什麼時候才需要更換散熱膏？又應該怎麼塗抹散熱膏才是最適當的？本著DIY精神，我們特意搜集了市面上常見的、買取得的散熱膏，總數多達27款，並且一一加以評測，希望給大伙儿有一個參考的方向與依據。
■散熱膏的功用簡單來說，散熱膏只為了一個目的而存在──作為熱源與散熱器中間熱傳導的「介質」。
這邊我們就以系統一大熱源－CPU來說好了，CPU產生的廢熱傳送途徑是這樣的：第一內部晶片運作所產生的熱度，會先傳導至CPU外蓋，外蓋再傳導至散熱器底座接觸面，不同形式的散熱器再經由不同的傳導方式（熱導管、銅、鋁、水冷液），傳導至一片一片的鰭片上，鰭片最後再與冷空氣進行熱交換，達成散熱的目的。
由於外蓋以下的熱傳導處理方式我們無法得知，因此CPU廢熱所見的第一道關卡确实是外蓋，讀者應該看過CPU外蓋長什麼樣子，CPU外蓋除打上型號、代號、時脈等資訊之外，還滿佈了許多肉眼可見的直線髮絲紋研磨痕跡，表面處理相當不平整。
而且即便是GPU或是PCH等沒有外層金屬外蓋的晶片，也不會是完全滑腻的表面。
圖/ CPU外蓋充滿了許多肉眼可見的研磨痕跡再來，确实是與外蓋接觸的散熱器底座了，拆裝過散熱器的讀者必然明白，很明顯的，底座接觸面平整度並不比CPU外蓋要來得好上多少。
即便許多廠商推出標榜鏡面的底座接觸面，但以高倍數顯微鏡來看，仍然充滿了細小的溝槽和间隙，不可能完美無缺。
因此，當CPU與散熱器底座兩個異質材料、而且凹凸不平的接觸面相貼之後，即便施加的扣具壓力再大，中間還是存在著許多縫隙，而這些縫隙当中，便充滿著許多「空氣」。
MS0210 MS0213 MS0207 温度套卡 使用手册说明书
MS0210/MS0213/MS0207温度套卡使用手册警告1.禁止用户自行拆装温度套卡。
2.请用户自行检查温度套卡供电电压是否符合使用手册中的供电电压要求。
版本：V1.3免责声明已经检查过此手册的内容，确认所描述的硬件和软件的一致性。
由于无法完全排除误差，不能保证绝对一致。
然而我们将定期检查此手册中的数据，并在后续版本中予以必要的修正。
欢迎任何关于改进的建议。
Microcyber Corporation2016技术数据随时有变。
公司简介沈阳中科博微科技股份有限公司是由中国科学院沈阳自动化研究所发起创建的一家高新技术企业，主要从事网络化控制系统、工业通信及仪表、开发、生产和应用。
中科博微承担了多个国家科技重大专项、国家高技术研究发展计划（863计划）、智能制造装备发展专项等国家科技计划项目，是国家网络化控制系统工程研究中心建设依托单位。
中科博微成功地开发了国内第一个通过国际认证的现场总线协议主栈、第一个通过国家认证的现场总线仪表、国内第一个通过德国TüV认证的安全仪表，与其它单位共同主持了制定国内第一个工业以太网协议标准EPA、第一个工业无线通信协议标准WIA-PA，并成为IEC国际标准。
中科博微的产品和技术曾荣获国家科技进步二等奖两项、国家科技发明奖一项、中国科学院科技进步一等奖一项、辽宁省科技进步一等奖一项，产品出口欧美等发达国家，美国Emerson、英国Rotork、英国Bifold等业内顶尖企业都在其产品中采用了博微的关键技术或关键部件，成功完成了200多项大型自动化工程项目。
中科博微是FCG组织成员；是Profibus用户组织（PNO）成员。
中科博微成功通过了ISO9001:2008质量管理体系认证和汽车行业的ISO/TS16949质量体系认证。
优秀的研发团队，丰富的自动化工程设计与实施经验，业界领先的产品，庞大的市场网络，优秀的企业文化，都为公司的创业和持续发展奠定了坚实基础。
H12012 可靠的整数百分比控制器加热带说明书
HTWC100 Series Starts at
$103
ߜ Reliable ߜ Integral Percentage
Controller ߜ Silicone Rubber
Encapsulated Heating Tape ߜ Maximum Exposure Temperature up to 230°C (450°F)
SPECIFICATIONS
Power: 120 or 240 V
Wattage: 72 watts/lineal foot
HTWC101-006-60F, $122, shown smaller than actual size.
Heating Element: Fine gage stranded resistance wires insulated with fiberglass yarn and completely enclosed in a silicone rubber extrusion
HTW101-010-60F, heating tape, 25.4 x 3048 mm (1 x 120"), 120 volt, 522 watts, with a thermostat set at 16°C (60°F), $184.
HEATING TAPES
With Percentage Controller
Model No.
Price Length mm (in) Wattage Voltage
HTWC101-002
$103
610 (24)
144
120
HTWC101-004
111
1220 (48)
288
120
MOLYKOTE(道康宁)MSDS
2. 危险性概述!
紧急情况概述!
外观与性状! 颜色! 气味!
非危险物质或混合物。!
GHS危险性类别! 非危险物质或混合物。!
GHS标签要素! 非危险物质或混合物。! !
#! 油脂! #!! 黑色! #!! 略微的!
$!%!$&!
化学品安全技术说明书!
!
按照GB/T 16483、GB/T 17519编制!
#! 未见报道。!
#! 对于急救员，不需要特定的预防措施。! !
#! 对症辅助治疗。!
'!%!$&!
化学品安全技术说明书!
!
按照GB/T 16483、GB/T 17519编制!
!
MOLYKOTE(R) LONGTERM 2 PLUS EXTREME
PRESSURE BEARING GREASE!
!
撤离现场。! ! #! 如有必要，佩戴自给式呼吸器进行消防作业。!
使用个人防护装备。! !
6. 泄漏应急处理!
人员防护措施、防护装备和应 急处置程序! ! 环境保护措施! !
泄漏化学品的收容、清除方法 及所使用的处置材料! !
#! 遵循安全处置建议和个人防护装备建议。! !
#! 避免排放到周围环境中。! 如能确保安全，可采取措施防止进一步的泄漏或溢出。! 保留并处置受污染的洗涤水。! 如果无法围堵严重的溢出，应通报当地主管当局。! !
!!!!过滤器类型! !
眼面防护! !
皮肤和身体防护! ! 手防护! ! !!!!备注! ! 卫生措施! !
SDS编号#!! 537510-00006!
前次修订日期#!2015/09/04! 最初编制日期#!2014/09/05!
SCKF102通用说明书解读
SCKF102型微量水分测定仪使用说明书淄博盛康电气有限公司目录一、前言 (2)二、功能特点 (2)三、技术参数 (4)四、仪器结构与装配 (5)五、工作原理 (8)六、菜单及按键操作说明 (9)七、进样操作 (15)八、维护与保养 (17)九、常见故障处理 (19)十、使用时注意事项 (20)一、前言：感谢您选用淄博盛康电气有限公司的产品，为此本公司将为您提供全面的技术支持和服务保障。
本产品需由具备使用资格的人士使用，在使用本产品之前，请您仔细阅读产品使用说明书，并理解所述内容，了解设备自身的技术参数、性能及操作使用方法，严格遵守电气高压试验相关标准和电业安全工作规程进行操作。
请将本使用说明书置于容易获取的位置，以便于以后参考使用。
使用本产品还需遵守当地关于该类设备的相关使用要求（如有），以及相关的试验要求、标准、规程等，并在遵守当地关于电力作业安全相关要求的前提下使用本产品。
二、功能特点卡尔—菲休库仑滴定法用于精确测量样品中微量水分含量，此方法具有精度高、测试成本低廉的优点而被广泛应用。
本仪器基于卡尔—菲休库仑滴定法原理，精确测定液体、固体、气体中的微量水分，用于电力、石油、化工、制药、食品等行业。
符合国家标准GB7600。
卡尔—菲休SCKF102微量水分测定仪主要技术特点及功能：仪器采用了功能强大的新一代处理器及全新的外围电路，优异的低功耗性能使得小体积的蓄电池供电成为可能,实现了便携功能；测量电极信号作为电解结束的判据，其稳定性、准确性是影响测量精度的关键因素，由于使用了先进的器件和方法，实现了测量电极信号的精确探测；进一步深入了解电解液特性，提出了新的软件补偿修正算法，提高了测量精度；汉字图形液晶显示屏，显示界面直观友好。
主要有以下功能特点：●使用了改进型的PWM电解电路，进一步降低了仪器功耗；●高精度的测量电极信号发生及检测电路，使得电解终点的判断快速而准确，并具有极强的抗干扰能力；●使用电解液空白电流补偿、电解液平衡点漂移补偿两种方法来修正测量结果；●内置三条计算公式，报告单自动计算生成；●按键调节搅拌速度，分为0-9共10个档位；●具有测量电极开路故障、短路故障自动检测功能；●带时间标记的历史纪录，最多存储256个；●带温度补偿的万年历时钟，走时准确，自动记录测定的日期和时间，在掉电的状态下可运行10年以上；●具有屏幕保护功能，长时间不操作仪器，自动关掉液晶显示屏，延长液晶使用寿命，按任意键退出屏幕保护状态；三、技术参数1、仪器精度电解水量精度10ug～1000ug ±3ug>1000ug 0.3%2、一般电气参数测量范围 0-100mg分辨率： 0.1ug电解电流： 0~400mA最大电解速度： 2.4mg/min电源电压： AC220V±20%最大功耗： 30W使用环境温度： 5～35℃使用环境湿度：≤85%外形尺寸： 270×210×125mm 重量： 5kg四、仪器结构与装配一、主机:图4-1 主机（1）按键（4）电解电极接口（2）液晶显示窗口（5）测量电极接口（3）电解池（6）电解池支架二﹑电解池:图4-2 电解池分解图图4-3 电解池总装图(1)测量电极(8)干燥剂(2)测量电极引线 (9)进样口(旋塞)(3)电解电极(10)电解池密封塞(4)电解电极引线(11)搅拌子 (5)电解电极密封塞(12)阳极室 (6)半透膜(13)阴极室(7)干燥管三、装配 １、将蓝色硅胶粒装入干燥管内（4-2中７、８）旋紧下部白色螺帽。
道康宁硅胶资料电子版
SE4704U RC-4(50P) 0.60 170/10 200/4 1.11
40
95
650
20
3.6 17(150C/22hr)
SE4705U RC-4(50P) 0.60 170/10 200/4 1.11
50
95
450
20
3.7
8(150C/22hr)
SE4706U RC-4(50P) 0.60 170/10 200/4 1.11
60
80
280 20(JISB)
3.0 12(180C/22hr)
B6670 INT RC-4(50P) 0.45 170/10 200/4 1.34
70
60
280 18(JISB)
2.7 12(180C/22hr)
B6680 INT RC-4(50P) 0.40 170/10 200/4 1.34
80
95
140 18(JISB)
3.7 32(180C/22hr)
DY32-
RC-4(50P) 0.50 170/10 200/4 1.26
70
71
160
9
3.4
-
k-730
RC-4(50P) 1.00 170/10 200/4 1.11
30
80
700
13
3.8
-
k-740
RC-4(50P) 1.00 170/10 200/4 1.14
44
100
650
21
DY32-
RC-4(50P) 0.80 170/10 200/4 1.13
50
110
600
28
DY32-
RC-4(50P) 0.80 170/10 200/4 1.18
道康宁JCR6101硅胶规格书
Product InformationLED MaterialsDow Corning®JCR 6101 UPTYPICAL PROPERTIESSpecification Writers: Please contact your local Dow Corning sales office or your GlobalDow Corning Connection before writing specifications on this product.Property UnitValue Viscosity cPmPa-secPa-sec194001940019.4Specific Gravity (Uncured) - 1.04Durometer Shore A (JIS) - 35Dielectric Strength volts/milkV/mm62524Volume Resistivity ohm*cm 2.9 E+15Shelf Life @ -5ºC months 6STORAGE AND SHELF LIFEShelf life is indicated by the “Use Before” date found on the product label. For best results, Dow Corning one-part products require cold storage at or below -5°C (23°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Check the product label for specific storage conditions.DESCRIPTIONDow Corning® brand silicone LED (light emitting diode) encapsulants are designed to meet the challenging needs of the LED market, including high adhesion, high purity, moisture resistance, thermal stability and optical transmittance. Silicone materials can absorb stresses caused by thermal cycling inside the package, protecting the chip and thebonding wires. And with theelectronics industry quickly movingtoward lead-free processing, siliconeencapsulants, with theirdemonstrated, excellent stability atreflow temperatures, are a natural fitfor LED applications.PREPARING SURFACESSurfaces should be clean and dry.Recommended cleaning methodsinclude Dow Corning® brand OSFluids, naphtha, mineral spirits,methyl ethyl ketone (MEK) or othersuitable solvent. Rougher surfacestend to promote adhesion of siliconesto other surfaces.PROCESSING/CURINGThese products are also compatiblewith commercially availableequipment and industry standardprocesses. These materials can bedispensed or molded depending onthe product and application. DowCorning OS Fluids are recommendedto clean cured or uncured siliconeresidue from application equipment.ADHESIONDow Corning LED materials arespecially designed for adhesion tocommonly used LED substrates.Surface treatments such as chemicaletching or plasma treatment mayprovide a reactive surface andimprove adhesion to these types ofsubstrates. In general, increasing thecure temperature and/or cure timewill improve the ultimate adhesion.USEFUL TEMPERATURERANGESFor most uses, silicone encapsulantsand resins should be operational overa temperature range of -45 to 200°C(-49 to 392°F) for long periods oftime. However, at both the low- andhigh-temperature ends of thespectrum, behavior of the materialsand performance in particularapplications can become moreDow Corning and Sylgard are registered trademarks of Dow Corning Corporation. All other trademarks or brand names are the property of their respective owners. ©2008 Dow Corning Corporation. All rights reserved. Printed in USA Form No. 11-1300A-01complex and require additionalconsiderations. For low-temperature performance, thermal cycling toconditions such as -55°C (-67°F) may be possible, but performance should be verified for your parts or assemblies. Factors that may influence performance areconfiguration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. At the high-temperature end, the durability of the cured silicone encapsulants and resins is time and temperature dependent. As expected, the higher the temperature, the shorter the time the material will remain useable.COMPATIBILITYCertain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: Organotin and other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, polysulfides, polysulfones or other sulfurcontaining materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a givenapplication. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicatesincompatibility and inhibition of cure.HEALTH ANDENVIRONMENTAL INFORMATIONTo support customers in theirproduct safety needs, Dow Corning has an extensive Product Stewardship organization and a team of ProductSafety and Regulatory Compliance (PS&RC) specialists available in each area. For further information, please see our website,, or consult your local Dow Corning representative.LIMITATIONSThese products are neither tested nor represented as suitable for medical or pharmaceutical uses.LIMITED WARRANTY INFORMATION PLEASE READ CAREFULLYThe information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer’s tests to ensure that Dow Corning’s products are safe, effective, and fullysatisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent. Dow Corning’s sole warranty is that the product will meet the DowCorning sales specifications in effect at the time of shipment. Yourexclusive remedy for breach of such warranty is limited to refund ofpurchase price or replacement of any product shown to be other than as warranted. DOW CORNINGSPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR MERCHANTABILITY. DOW CORNING DISCLAIMS LIABILITY FOR ANY INCIDENTAL ORCONSEQUENTIAL DAMAGES.SAFE HANDLING INFORMATIONPRODUCT SAFETYINFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND MATERIAL SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTHHAZARD INFORMATION. THE MATERIAL SAFETY DATA SHEET IS AVAILABLE ON THE DOW CORNING WEBSITE AT , OR FROM YOUR DOW CORNING REPRESENTATIVE, ORDISTRIBUTOR, OR BY CALLING YOUR GLOBAL DOW CORNING CONNECTION.For More InformationTo learn more about these and other products available from Dow Corning, please visit the Dow Corning Electronics website at / electronics.。
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粘结混合电路或微处理器与散热器
自动或手工点胶 自动或手工点胶 自动装置，双组份无气式混合设备；手工混 合及多脱泡 自动或手工点胶 自动或手工点胶 自动或手工点胶 自动或手工点胶 自动或手工点胶
张力强度
介电强度
道康宁® 产品
1-4173 热传 导粘合剂
1.9 900 6.2 63.3 20 126 425 16.7 4.98 4.86
0.008
1-4174 热传
导粘合剂
1.9 900 6.2 63.3 22 – 425 16.7 – 4.63
–
3-6605 热传 导粘合剂
0.85 850 5.9 59.8 90 225 455 17.9 4.51 4.5
NA
NA NA
NA
NA NA NA NA
340 散热器复
合物
单组份 白色 不流动 NA NA 2.1
NA NA NA
NA
NA NA NA NA
热传导凝胶
SE4440-LP 热
传导凝胶
两组份 灰色 3,600
120°C 时 – 58 2.01 24 小时 – – 30分钟 – NA NA NA
SE4445CV 热
热传导粘合剂 类别 无腐蚀性，单组份，室温湿气固化，以及单或两组份加热 固化硅酮弹性体
外观 非流动的及流动的两种选择；固化成柔性弹性体
特性 室温或快速热固化；各种不同的热传导性；抵受湿气及其 它恶劣环境影响；良好的介电性能；自粘合；低应力
可考虑的应用范围 散热器或基板连接；灌封电源供应器
类别 两组份硅酮弹性体
自动或手工点胶 自动或手工点胶 自动或手工点胶 自动或手工点胶
灌封高电压变压器及传感器；连接混合 电路基材与散热器
粘合电源供应器元件，油墨打印机压 头；粘结ICs与散热器
自动或手工点胶 自动或手工点胶
电子热源和散热器之间的间隙充填材料 电子热源和散热器之间的间隙充填材料 电子热源和散热器之间的间隙充填材料
除了可在广泛的操作条件下保持其物理及电气性能外， 硅酮还可抵受臭氧及紫外线的裂解，并具有良好的化学 稳定性。道康宁热控制材料系列包括：粘合剂、灌封 胶、复合物及凝胶。
良好的热传导性能取决于介于产生热的器件和热传导媒 介间的良好介面。硅酮具有低表面张力的特性，能湿润 大部分表面，以降低基材和材料间的接触热阻。
导粘合剂
0.9 725
5 50.9 90 162 370 14.6 3.96 3.87 0.00525
0.0058
Q3-3600 热
传导粘合剂 0.77 957 6.6 67.3 55 – 660 26 –
–
–
SE4400 热传
导粘合剂
0.92 841 5.8 580 90 –
25
4.2
–
SE4402 CV
热传导粘合剂 0.92 885 6.1 62.2 120 – 660 26 – 4.8
–பைடு நூலகம்
SE4420 热传
热传导性，瓦特/米-K/平方厘米 磅／平方英寸 MPa 公斤力/平方厘米 延伸率，% 线性热膨胀系数 , 微米/米 摄氏度或百万分之一 伏特/密耳 千伏/毫米 介电常数在100 赫兹 介电常数在100 千赫兹 损耗因子在100 赫兹 损耗因子在100 千赫兹 体积电阻系数，欧姆-厘米 产品在室温下，由生产日期 起的保质期，月
两组份；灰色；1:1 两组份；低粘度
快速加热固化；较长的适用期；优异的流动 性；自粘合
加热固化；中等热传导性；UL 94 V-0 等级
不固化；热传导硅酮润滑膏 不固化；热传导硅酮膏 不固化；热传导硅酮膏
中等热传导性；低渗油率；高温时具稳定性 高热传导性；低渗油率；高温时具稳定性 低渗油率；高温时具稳定性
可考虑的应用范围
应用方法
粘结混合式集成电路基材；粘合盖子与 外壳；底板连接；散热器连接
粘结混合式集成电路基材；粘合盖子与 外壳；底板连接；散热器连接
粘结混合式集成电路基材；粘合盖子与 外壳；底板连接；散热器连接
灌封高电压变压器及传感器；连接基材 与散热器
粘结混合电路或微处理器与散热器
粘合电源供应器元件，油墨打印机压 头；粘结ICs与散热器 粘合电源供应器元件，油墨打印机压 头；粘结ICs与散热器 粘合电源供应器元件，油墨打印机压 头；粘结ICs与散热器；密封煤气热水器 燃烧炉
热传导灌封胶
外观 流动性液体；固化成柔性弹性体
特性 恒定的固化速率，与灌封厚度或密封程度无关；无需 后固化
可考虑的应用范围 灌封高电压变压器及传感器；安装基材与散热器；作为热 源和散热器之间的间隙充填材料
热传导复合物 类别 不固化；热传导硅酮膏
特性 高热传导性；低渗油率；高温稳定性
可考虑的应用范围 热源和散热器之间的间隙充填材料
SE4400 热传导粘合剂 SE4402 CV 热传导粘合剂 SE4420 热传导粘合剂 SE4422 热传导粘合剂
SE4450 热传导粘合剂 SE4486 CV 热传导粘合剂
SE9184 CV 热传导粘合剂
Q1-9226 热传导粘合剂 热传导灌封胶 Q3-3600 热传导灌封胶
SE4410 热传导灌封胶 热传导复合物 SC102 热传导复合物 SE4490CV 热传导复合物 340 热传导复合物 热传导凝胶 SE4440-LP 热传导凝胶 SE4445CV 热传导凝胶 SE4446CV 热传导凝胶
说明
性能
单组份；低流动性；灰色 单组份；低流动性；灰色 两组份；灰色；1:1 混合比率；中等粘度 两组份；灰色；1:1 混合比率
两组份；半流动性 单组份；灰色 单组份湿气固化粘合剂 单组份湿气固化粘合剂
单组份；灰色 流动性；单组份湿气固化粘合剂
单组份；不流动
两组份；半流动性
快速加热固化；高热传导性 快速加热固化；高热传导性 加热固化；良好的流动性 快速加热固化；较长的适用期；优异的流动 性；自粘合 较长的适用期；快速加热固化；自粘合 加热固化；中等热传导性；精炼型 可流动并具有中等的热传导性；快速表干 高粘度并具有中等的热传导性；UL 94V-1 等级；快速表干 加热固化；高热传导性 可流动并具有良好的热传导性，精炼型 (D4-D10 < 0.002)；快速表干 室温固化；中等热传导性；UL 94 V-0 等 级；精炼型；快速表干 较长的适用期；快速加热固化；自粘合
热传导粘合剂
道康宁提供多种无腐蚀性、热传导硅酮粘合剂，是用于 固定混合集成电路基材、功率半导体元器件与散热器的 理想材料。另外还可用于其它需要兼顾柔软性及热传导 性的粘结作业中。流动性产品同时也是需要改善散热的 变压器、电源供应器、线圈、继电器等其它电子元器件 的理想灌封材料。
热传导粘合剂可湿气固化或加热固化成耐用、相对低应 力的弹性体。单组份室温固化型材料不会产生腐蚀性的 副产品，并可提供多种粘度。室温固化型热传导粘合剂 可提供包含精炼型及UL-列表的产品。
传导凝胶
两组份 灰色 14,000 – 57 2.36 5 小时 – –
45
– NA NA NA
SE4446CV 热
120°C 时
传导凝胶
两组份 灰色 22,000 – 55 2.14 4 小时 – – 30分钟
NA NA NA
NA=不能提供 1 比初始混合时粘度增加一倍所需的时间 2 达到硬度及产生粘合强度所需的时间
单组份 灰色 34,000 74 A – 2.16
NA
––
–
30 485 335 34
SE4420 热传
导粘合剂
单组份 白色 108,000 74 A – 2.26 <10 分钟 48 NA
NA
NA 500 345 35
SE4422 热传
导粘合剂
单组份 灰色 200,000 69 A – 2.17 <10 分钟 48 NA
道康宁® 产品
热传导粘合剂
1-4173 热传导
粘合剂
单组份 灰色 58,000 92 A – 2.7
NA
– 90
30
20 640 440 45
1-4174 热传导
粘合剂
单组份 灰色 58,000 92 A – 2.71 NA
– 90
30
20 590 405 41
3-6605 热传导
弹性体
两组份 灰色 47,000 78 A – 2.14 >24 小时 – 90
无底涂粘合强度， 剪切
产品形态 颜色 粘度／流动性厘泊 (粘度单位) 或 mPa*s 硬度 针入度 (1/10 of mm) 比重 室温下的操作时间1 室温下的固化时间2， 小时 在100°C (212°F) 时 在125°C (257°F) 时 在150°C （302°F）时 磅／平方英寸 牛顿/平方厘米 公斤力/平方厘米
PRODUCT
INFORMATION
道康宁 ®热传导材料产品信息
Thermally Conductive Adhesives
热传导材料
长期、可靠保护敏感电路及元器件，在当今众多灵敏的 电子产品应用中变得越来越重要。随着处理功率的增加 及趋向于更小、更高密度电子模块的趋势，对于热控制 的需要也不断增加，道康宁的热传导材料系列产品提供 了优异的热控制选择。在大的温度及湿度范围内，热传 导硅酮可作为传热媒介、耐用的介电绝缘材料，抵受环 境污染、及应力和震动的消除。
传导粘合剂
单组份 白色 不流动 72 A – 2.22
NA
48 NA
NA
NA 300 205 21
Q1-9226 热传
导粘合剂