LM3900D中文资料
LM339D中文资料
• MOS clock generator ORDERING INFORMATION• Hihg voltage logic gate • MultivibratorsDESCRIPTIONThe LM339 consists of four independent precision voltage comparators, with an offset voltagespecification as low as 20• max for each comparator, which were designed specifically to operate from a single power supply over a wide range of voltages.Operation from split power supplies is also possible and the low power supply current drain is independent of the magnitude of the power supply voltage.These comparators also have a unique characteristic in that the input common-mode voltage range includes ground, even though they are operated from a single power supply voltage.The LM339 series was designed to directly interface with TTL and CMOS.When operated from both plus and minus power supplies, the LM339 series will directly interface with MOS logic where their low power drain is a distinct advantage over standard comparators.Device Package LM339D 14 SOP LM339N 14 DIPFor more information, or to purchase call E.C.C. Inc @ 1-800-214-8769QUAD VOLTAGE COMPARATORLM339ABSOLUTE MAXIMUM RATINGSCHARACTERISTIC Supply VoltageDifferential Input Voltage Input VoltageOutput Short Circuit to GND Power DissipationOperating Temperature Storage TemperatureElectrical characterisitics at specified free-air temperature, V CC =5V(unless otherwise noted)V IOV CC =5V to 30V Input Offset VoltageV IC =V ICR MIN, V O =1.4V I IOInput Offset CurrentI IB Input Bias CurrentV ICRCommon-Mode Input Voltage Range**A VDV CC =15V, Large-Signal DifferentialV O =1.4V to 11.4V, Voltage AmplificationR L •15• to V CC I OH V OH =5V, V ID =1V High-Level Output Current V OH =30V, V ID =1V V OL Low-Level Output VoltageI OLLow-Level Output CurrentI CC V CC =5V Supply CurrentV CC =30V input voltage unless otherwise specified.** The voltage at either input or common-mode should not be allowed to go negative by more than 0.3V.The upper end of the common-mode voltage range is V CC -1.5V, but either or both inputs can go to 30V without damage.Switching characteristics, V CC =5V, T A =25•RL Connected to 5V 100-• Input Step with 5-• Through 5.1•,OverdriveC L =15•*(See Note 1)TTL-Level Input StepL Note 1 : The response time specified is the interval between the input step function and the instant when the output crosses 1.4V.HTC-0.3 to +36•V I(DIFF)570•T OPR •0~+70P D 36•±18 or 36V CC UNIT VALUE SYMBOL ContinuousV Response Time1.30.32•2.5PARAMETERTEST CONDITIONSLM339UNIT MINTYP MAXRL=•25•0.8Full Range 400•700 V OL =1.5V, V ID =-1V 25•6•I OL =4•, V ID =-1V25•150Full Range •Full Range 1•25•0.150V25•50200V/•-40025•0toV CC -1.5Full Range 0toV CC -2•150 V O =1.4V25•-25-250•Full Range 5 V O =1.4V25•5Full Range 50TYP MAX •Full Range925•2PARAMETERTEST CONDITION*LM339V V I-65 to +150T STGFor more information, or to purchase call E.C.C. Inc @ 1-800-214-8769V UNIT MINQUAD VOLTAGE COMPARATOR LM339 TYPICAL PERFORMANCE CHARACTERISTICSHTCFor more information, or to purchase call E.C.C. Inc @ 1-800-214-8769QUAD VOLTAGE COMPARATOR LM339 TYPICAL APPLICATIONSFor more information, or to purchase call E.C.C. Inc @ 1-800-214-8769。
LM29中文资料
TL H 7936LM2900 LM3900 LM3301Quad AmplifiersFebruary 1995LM2900 LM3900 LM3301Quad AmplifiersGeneral DescriptionThe LM2900series consists of four independent dual input internally compensated amplifiers which were designed specifically to operate off of a single power supply voltage and to provide a large output voltage swing These amplifi-ers make use of a current mirror to achieve the non-invert-ing input function Application areas include ac amplifiers RC active filters low frequency triangle squarewave and pulse waveform generation circuits tachometers and low speed high voltage digital logic gatesFeaturesY Wide single supply voltage 4V DC to 32V DCRange or dual suppliesg 2V DC to g 16V DC Y Supply current drain independent of supply voltage Y Low input biasing current 30nA Y High open-loop gain 70dB Y Wide bandwidth 2 5MHz (unity gain)Y Large output voltage swing (V ab 1)Vp-p Y Internally frequency compensated for unity gain YOutput short-circuit protectionSchematic and Connection DiagramsTL H 7936–1Dual-In-Line and S OTL H 7936–2Top ViewOrder Number LM2900N LM3900M LM3900N or LM3301NSee NS Package Number M14A or N14AC 1995National Semiconductor Corporation RRD-B30M115 Printed in U S AAbsolute Maximum RatingsIf Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specificationsLM2900 LM3900LM3301 Supply Voltage32V DC28V DCg16V DC g14V DC Power Dissipation(T A e25 C)(Note1)Molded DIP1080mW1080mWS O Package765mWInput Currents I IN a or I IN b20mA DC20mA DC Output Short-Circuit Duration One Amplifier Continuous ContinuousT A e25 C(See Application Hints)Operating Temperature Range b40 C to a85 C LM2900b40 C to a85 CLM39000 C to a70 CStorage Temperature Range b65 C to a150 C b65 C to a150 C Lead Temperature(Soldering 10sec )260 C260 C Soldering InformationDual-In-Line PackageSoldering(10sec )260 C260 C Small Outline PackageVapor Phase(60sec )215 C215 C Infrared(15sec )220 C220 CSee AN-450‘‘Surface Mounting Methods and Their Effect on Product Reliability’’for other methods of soldering surface mount devicesESD tolerance(Note7)2000V2000V Electrical Characteristics T A e25 C V a e15V DC unless otherwise statedParameter ConditionsLM2900LM3900LM3301Units Min Typ Max Min Typ Max Min Typ MaxOpen Voltage Gain Over TempV mV Loop Voltage Gain D V O e10V DC1 22 81 22 81 22 8Input Resistance Inverting Input111M XOutput Resistance889k XUnity Gain Bandwidth Inverting Input2 52 52 5MHzInput Bias Current Inverting Input V a e5V DC302003020030300nAInverting InputSlew Rate Positive Output Swing0 50 50 5V m s Negative Output Swing202020Supply Current R L e%On All Amplifiers6 2106 2106 210mA DCOutput V OUT High R L e2k I IN b e013 513 513 5Voltage V a e15 0V DC I IN a e0Swing VOUT Low I IN b e10m A0 090 20 090 20 090 2I IN a e0V DCV OUT High V a e Absolute I IN b e0Maximum Ratings I IN a e029 529 526 0R L e%Output Source618610518Current Sink(Note2)0 51 30 51 30 51 3mADC CapabilityI SINK V OL e1V I IN b e5m A5552Electrical Characteristics(Note6) V a e15V DC unless otherwise stated(Continued)Parameter ConditionsLM2900LM3900LM3301Units Min Typ Max Min Typ Max Min Typ MaxPower Supply Rejection T A e25 C f e100Hz707070dB Mirror Gain 20m A(Note3)0 901 01 10 901 01 10 9011 10m A m A 200m A(Note3)0 901 01 10 901 01 10 9011 10D Mirror Gain 20m A to200m A(Note3)252525% Mirror Current(Note4)105001050010500m A DC Negative Input Current T A e25 C(Note5)1 01 01 0mA DC Input Bias Current Inverting Input300300nA Note1 For operating at high temperatures the device must be derated based on a125 C maximum junction temperature and a thermal resistance of92 C W which applies for the device soldered in a printed circuit board operating in a still air ambient Thermal resistance for the S O package is131 C WNote2 The output current sink capability can be increased for large signal conditions by overdriving the inverting input This is shown in the section on Typical CharacteristicsNote3 This spec indicates the current gain of the current mirror which is used as the non-inverting inputNote4 Input V BE match between the non-inverting and the inverting inputs occurs for a mirror current(non-inverting input current)of approximately10m A This is therefore a typical design center for many of the application circuitsNote5 Clamp transistors are included on the IC to prevent the input voltages from swinging below ground more than approximately b0 3V DC The negative input currents which may result from large signal overdrive with capacitance input coupling need to be externally limited to values of approximately1mA Negative input currents in excess of4mA will cause the output voltage to drop to a low voltage This maximum current applies to any one of the input terminals If more than one of the input terminals are simultaneously driven negative smaller maximum currents are allowed Common-mode current biasing can be used to prevent negative input voltages see for example the‘‘Differentiator Circuit’’in the applications sectionNote6 These specs apply for b40 C s T A s a85 C unless otherwise statedNote7 Human body model 1 5k X in series with100pFApplication HintsWhen driving either input from a low-impedance source alimiting resistor should be placed in series with the inputlead to limit the peak input current Currents as large as20mA will not damage the device but the current mirror onthe non-inverting input will saturate and cause a loss of mir-ror gain at mA current levels especially at high operatingtemperaturesPrecautions should be taken to insure that the power supplyfor the integrated circuit never becomes reversed in polarityor that the unit is not inadvertently installed backwards in atest socket as an unlimited current surge through the result-ing forward diode within the IC could cause fusing of theinternal conductors and result in a destroyed unitOutput short circuits either to ground or to the positive pow-er supply should be of short time duration Units can bedestroyed not as a result of the short circuit current causingmetal fusing but rather due to the large increase in IC chipdissipation which will cause eventual failure due to exces-sive junction temperatures For example when operatingfrom a well-regulated a5V DC power supply at T A e25 C with a100k X shunt-feedback resistor(from the output tothe inverting input)a short directly to the power supply willnot cause catastrophic failure but the current magnitude willbe approximately50mA and the junction temperature willbe above T J max Larger feedback resistors will reduce thecurrent 11M X provides approximately30mA an open cir-cuit provides1 3mA and a direct connection from the out-put to the non-inverting input will result in catastrophic fail-ure when the output is shorted to V a as this then places thebase-emitter junction of the input transistor directly acrossthe power supply Short-circuits to ground will have magni-tudes of approximately30mA and will not cause cata-strophic failure at T A e25 CUnintentional signal coupling from the output to the non-in-verting input can cause oscillations This is likely only in breadboard hook-ups with long component leads and can be prevented by a more careful lead dress or by locating the non-inverting input biasing resistor close to the IC A quick check of this condition is to bypass the non-inverting input to ground with a capacitor High impedance biasing resis-tors used in the non-inverting input circuit make this input lead highly susceptible to unintentional AC signal pickupOperation of this amplifier can be best understood by notic-ing that input currents are differenced at the inverting-input terminal and this difference current then flows through the external feedback resistor to produce the output voltage Common-mode current biasing is generally useful to allow operating with signal levels near ground or even negative as this maintains the inputs biased at a V BE Internal clamp transistors(see note5)catch-negative input voltages at ap-proximately b0 3V DC but the magnitude of current flow has to be limited by the external input network For operation at high temperature this limit should be approximately100m A This new‘‘Norton’’current-differencing amplifier can be used in most of the applications of a standard IC op amp Performance as a DC amplifier using only a single supply is not as precise as a standard IC op amp operating with split supplies but is adequate in many less critical applications New functions are made possible with this amplifier which are useful in single power supply systems For example biasing can be designed separately from the AC gain as was shown in the‘‘inverting amplifier ’’the‘‘difference integra-tor’’allows controlling the charging and the discharging of the integrating capacitor with positive voltages and the‘‘fre-quency doubling tachometer’’provides a simple circuit which reduces the ripple voltage on a tachometer output DC voltage3Typical Performance CharacteristicsOpen Loop Gain Voltage Gain Voltage GainLarge Signal Frequency Input Current Supply Current ResponseOutput Sink Current Output Class-A Bias Current Output Source CurrentSupply Rejection Mirror Gain Maximum Mirror CurrentTL H 7936–94Typical Applications(V a e15V DC)Inverting AmplifierV ODC e V a 2A V j b R2R1TL H 7936–3Triangle Square GeneratorTL H 7936–4Frequency-Doubling TachometerTL H 7936–5Low V IN b V OUT Voltage RegulatorTL H 7936–6 Non-Inverting AmplifierV ODC e V a 2A V j R2R1TL H 7936–7Negative Supply BiasingV ODC eR2R3V bTL H 7936–8A V jR2R15Typical Applications (V a e 15V DC )(Continued)Low-Drift Ramp and Hold CircuitTL H 7936–10Bi-Quad Active Filter(2nd Degree State-Variable Network)TL H 7936–11Q e 50f O e 1kHz6Typical Applications(V a e15V DC)(Continued)Voltage-Controlled Current Source(Transconductance Amplifier)TL H 7936–12Hi V IN Lo(V IN b V O)Self-RegulatorQ1 Q2absorb Hi V INTL H 7936–13Ground-Referencing a Differential Input SignalTL H 7936–147Typical Applications(V a e15V DC)(Continued)Voltage Regulator(V O e V Z a V BE)TL H 7936–15Fixed Current SourcesI2e R1R2I1TL H 7936–16Voltage-Controlled Current Sink(Transconductance Amplifier)TL H 7936–17Buffer AmplifierV IN t V BETL H 7936–18TachometerTL H 7936–19V ODC e A f INAllows V O to go to zero8Typical Applications (V a e 15V DC )(Continued)Low-Voltage ComparatorNo negative voltage limit if properly biasedTL H 7936–20Power ComparatorTL H 7936–21Comparator TL H 7936–22Schmitt-TriggerTL H 7936–23Square-Wave Oscillator TL H 7936–24Pulse GeneratorTL H 7936–25Frequency Differencing TachometerV ODC e A (f 1b f 2)TL H 7936–269Typical Applications(V a e15V DC)(Continued)Frequency Averaging TachometerV ODC e A(f1a f2)TL H 7936–27Squaring Amplifier(W Hysteresis)TL H 7936–28Bi-Stable MultivibratorTL H 7936–29Differentiator(Common-Mode Biasing Keeps Input at a V BE)A V e 1 2TL H 7936–30‘‘OR’’Gatef e A a B a CTL H 7936–31‘‘AND’’Gatef e A B CTL H 7936–32Difference IntegratorTL H 7936–33 10Typical Applications (V a e 15V DC )(Continued)Low Pass Active Filterf O e 1kHzTL H 7936–34Staircase GeneratorTL H 7936–35V BE BiasingA V j bR2R1TL H 7936–36Bandpass Active FilterTL H 7936–37f o e 1kHz Q e 2511Typical Applications(V a e15V DC)(Continued)Low-Frequency MixerTL H 7936–38Free-Running Staircase Generator Pulse CounterTL H 7936–3912Typical Applications(V a e15V DC)(Continued)Supplying I IN with Aux Amp(to Allow Hi-Z Feedback Networks)TL H 7936–40One-Shot MultivibratorPW j2c106CSpeeds recoveryTL H 7936–41Non-Inverting DC Gain to(0 0)TL H 7936–4213Typical Applications(V a e15V DC)(Continued)Channel Selection by DC Control(or Audio Mixer)TL H 7936–4314Typical Applications (V a e 15V DC )(Continued)Power AmplifierTL H 7936–44One-Shot with DC Input ComparatorTL H 7936–45Trips at V IN j 0 8VaV IN must fall 0 8Vaprior to t 2High Pass Active FilterTL H 7936–4615Typical Applications(V a e15V DC)(Continued)Sample-Hold and Compare with New a V INTL H 7936–47Sawtooth GeneratorTL H 7936–4816Typical Applications(V a e15V DC)(Continued)Phase-Locked LoopTL H 7936–49Boosting to300mA LoadsTL H 7936–5017Split-Supply Applications(V a e a15V DC V b e b15V DC)Non-Inverting DC GainTL H 7936–51AC AmplifierTL H 7936–5218Physical Dimensions inches(millimeters)Small Outline Package(M)Order Number LM3900MNS Package Number M14A19L M 2900 L M 3900 L M 3301Q u a d A m p l i f i e r sPhysical Dimensions inches (millimeters)(Continued)Molded Dual-In-Line Package (N)Order Number LM2900N LM3900N or LM3301NNS Package Number N14ALIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a)are intended for surgical implant support device or system whose failure to perform can into the body or (b)support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectivenessbe reasonably expected to result in a significant injury to the userNational Semiconductor National Semiconductor National Semiconductor National Semiconductor CorporationEuropeHong Kong LtdJapan Ltd1111West Bardin RoadFax (a 49)0-180-530858613th Floor Straight Block Tel 81-043-299-2309。
完整word版,l293d中文资料
介绍几种机器人驱动芯片在自制机器人的时候，选择一个合适的驱动电路也是非常重要的，本文详细介绍了几种常用的机器人驱动芯片。
介绍几种机器人驱动芯片(注：本文已经投稿至《电子制作》)在自制机器人的时候，选择一个合适的驱动电路也是非常重要的。
最初，通常选用的驱动电路是由晶体管控制继电器来改变电机的转向和进退，这种方法目前仍然适用于大功率电机的驱动，但是对于中小功率的电机则极不经济，因为每个继电器要消耗20~100mA的电力。
当然，我们也可以使用组合三极管的方法，但是这种方法制作起来比较麻烦，电路比较复杂，因此，我在此向大家推荐的是采用集成电路的驱动方法：马达专用控制芯片LG9110芯片特点：✍✍低静态工作电流；✍✍宽电源电压范围：2.5V-12V ；✍✍每通道具有800mA 连续电流输出能力；✍✍较低的饱和压降；✍✍TTL/CMOS 输出电平兼容，可直接连CPU ；✍✍输出内置钳位二极管，适用于感性负载；✍✍控制和驱动集成于单片IC 之中；✍✍具备管脚高压保护功能；✍✍工作温度：0 ℃-80 ℃。
描述：LG9110 是为控制和驱动电机设计的两通道推挽式功率放大专用集成电路器件，将分立电路集成在单片IC之中，使外围器件成本降低，整机可靠性提高。
该芯片有两个TTL/CMOS 兼容电平的输入，具有良好的抗干扰性；两个输出端能直接驱动电机的正反向运动，它具有较大的电流驱动能力，每通道能通过750 ～800mA 的持续电流，峰值电流能力可达1.5 ～2.0A ；同时它具有较低的输出饱和压降；内置的钳位二极管能释放感性负载的反向冲击电流，使它在驱动继电器、直流电机、步进电机或开关功率管的使用上安全可靠。
LG9110 被广泛应用于玩具汽车电机驱动、步进电机驱动和开关功率管等电路上。
管脚定义：1 A 路输出管脚、2和3 电源电压、4 B 路输出管脚、5和8 地线、6 A 路输入管脚、7 B 路输入管脚2、恒压恒流桥式1A驱动芯片L293图2是其内部逻辑框图 图3是其与51单片机连接的电路原理图L293是著名的SGS公司的产品，内部包含4通道逻辑驱动电路。
L293D集成电路说明
L293D采用16引脚DIP封装，其内部集成了双极型H-桥电路，所有的开量都做成n型。
这种双极型脉冲调宽方式具有很多优点，如电流连续；电机可四角限运行；电机停止时有微振电流，起到“动力润滑”作用，消除正反向时的静摩擦死区：低速平稳性好等。
L293D通过内部逻辑生成使能信号。
H-桥电路的输入量可以用来设置马达转动方向，使能信号可以用于脉宽调整（PWM）。
另外，L293D 将2个H-桥电路集成到1片芯片上，这就意味着用1片芯片可以同时控制2个电机。
每1个电机需要3个控制信号EN12、IN1、IN2，其中EN12是使能信号，IN1、IN2为电机转动方向控制信号，IN1、IN2分别为1，0时，电机正转，反之，电机反转。
选用一路PWM连接EN12引脚，通过调整PWM的占空比可以调整电机的转速。
选择一路I/O口，经反向器74HC14分别接IN1和IN2引脚，控制电机的正反转L293D集成电路说明L293DPUSH-PULL FOUR CHANNEL DRIVER WITH DIODES推拉4通道驱动带二极管600mA. OUTPUT CURRENT CAPABILITY PER CHANNEL600mA输出电流每通道1.2A PEAK OUTPUT CURRENT (NON REPETITIVE) PER CHANNEL1.2A峰值输出电流每通道(不可重复，估计将会损坏)ENABLE FACILITY使用简易OVERTEMPERATURE PROTECTION温度过高保护LOGICAL ”0” INPUT VOLTAGE UP TO 1.5v(HIGH NOISE IMMUNITY逻辑"0"输入电压为1.5V,可以免除1.5V以下的干扰INTERNAL CLAMPS DIODES内置钳位二极管DESCRIPTION描述The L293D is a monolithic integrated high voltage,high current four channel vriver designed to acceptstandard DTL or TTL logic levels and drive induc-tiveloads (such as relays solenoides, DC andstepping motors) and switching power transistors.L293D 是单块集成电路，高电压，高电流，四通道驱动，设计用来接受DTL或者TTL逻辑电平，驱动感性负载(比如继电器，直流和步近马达)，和开关电源晶体管。
ISD3900 Datasheet v0.80
ISD3900Multi-Message Record/Playback Devices with Digital Audio InterfaceTABLE OF CONTENTS1 GENERAL DESCRIPTION (3)2 FEATURES (3)3 BLOCK DIAGRAM (5)4 PINOUT CONFIGURATION (7)5 PIN DESCRIPTION (8)6 ELECTRICAL CHARACTERISTICS (11)6.1 O PERATING C ONDITIONS (11)6.2 DC P ARAMETERS (11)6.3 AC P ARAMETERS (12)6.3.1 Internal Oscillator (12)6.3.2 Inputs (12)6.3.3 Outputs (13)6.3.4 SPI Timing (14)6.3.5 I2S Timing (16)7 APPLICATION DIAGRAM (17)8 PACKAGE SPECIFICATION (18)8.1 48L EAD LQFP(7X7X1.4MM FOOTPRINT 2.0MM) (18)9 ORDERING INFORMATION (19)10 REVISION HISTORY (20)1 GENERAL DESCRIPTIONThe ISD3900 is a multi-message ChipCorder® featuring digital compression, comprehensive memory management, and integrated analog/digital audio signal paths. The message management feature is designed to make message recording simple and address-free as well as make code development easier for playback-only applications. The ISD3900 utilizes winbond’s 25X series flash memory to provide non-volatile audio record/playback for a two-chip solution. Unlike other ChipCorder series, the ISD3900 provides an I2S digital audio interface, faster digital recording, higher sampling frequency, and a signal path with SNR equivalent to 12bit resolution.The ISD3900 can take digital audio data via I2S or SPI interface. When I2S input is selected, it will replace the analog audio inputs and will support sample rates of 32, 44.1 or 48 kHz depending upon clock configuration. When SPI interface is chosen, the sample rate of the audio data sent must be one of the ISD3900 supported sample rates.The ISD3900 has built-in analog audio inputs, analog audio line driver, and speaker driver output. The two analog audio inputs to the device are: (1) AUXIN has a fixed gain configured by SPI command, and (2) ANAIN/ANAOUT has a fixed gain amplifier with the gain set by two external resistors. ANAIN/ANAOUT can also be used as a microphone differential input (ANAIN/ANAOUT becomes MIC+/MIC-) in conjunction with an automatic gain control (AGC) circuit configured by SPI command. Analog outputs are available in three forms: (1) AUXOUT is a single-ended voltage output; (2) AUDOUT can be configured as either a single-ended voltage output or a single-ended current output;(3) BTL (bridge-tied-load) is a differential voltage output.2 FEATURES•External Memory: support winbond’s 25X SpiFlash.o The addressing ability of ISD3900 is up to 128Mbit, which is 64-minute recording time based on 8kHz/4bit ADPCM.•Fast Digital Programmingo Programming rate can go up to 1Mbits/second mainly limited by the flash memory write rate. •Message Managemento Perform address-free recording: The ISD3900 allocates memory for new recording requests and upon completion, returns a start address to the host via SPI interfaceo Store pre-recorded audio (Voice Prompts) using high quality digital compressiono Use a simple index based command for playbacko Execute pre-programmed macro scripts (Voice Macros) designed to control the configuration of the device and play back Voice Prompts sequences and message recordings.• Sample Rateo Seven record and playback sampling frequencies are available for a given master sample rate. For example, the record and playback sampling frequencies of 4, 5.3, 6.4, 8, 12.8, 16and 32kHz are available when the device is clocked at a 32kHz master sample rate.o For I2S operation, 32, 44.1 and 48kHz master sample rates are available with record and playback sampling frequencies scaling accordingly.•Compression Algorithmso For recordingADPCM: 2, 3, 4 or 5 bits per sampleµ-Law: 6, 7 or 8 bits per sampleDifferential µ-Law: 6, 7 or 8 bits per samplePCM: 8, 10 or 12 bits per sample. Each sampled value is stored as a code, offering no compression but preserving maximum resolutiono For Pre-Recorded Voice Promptsµ-Law: 6, 7 or 8 bits per sampleDifferential µ-Law: 6, 7 or 8 bits per samplePCM: 8, 10 or 12 bits per sampleEnhanced ADPCM: 2, 3, 4 or 5 bits per sampleVariable-bit-rate optimized compression. This allows best possible compression given a metric of SNR and background noise levels.• Oscillatoro Internal oscillator with internal reference: 2.048 MHz with ±10% deviationo Internal oscillator with external resistor: 2.048 MHz with ±5% deviation when Rosc is 80k-ohm o External crystal or clock inputo I2S bit clock inputo Crystals and resonators support standard audio sampling rates of 2.048, 4.096, 8.192, 12.288 and11.2896MHz• Inputso AUXIN: Analog input with 2-bit gain control configured by SPI commando ANAIN/ANAOUT:Analog input with the gain set by two external resistors from ANAOUT to ANAIN, orMicrophone differential input (ANAIN/ANAOUT becomes MIC+/MIC-) o Digital AGC:Automatic gain control of digitized data from the analog input• Outputso PWM: Class D speaker driver to direct drive an 8Ω speaker or buzzero AUDOUT: configurable as a current or voltage single-ended line drivero AUXOUT: a single-ended voltage outputo BTL: a differential voltage output• I/Oso SPI interface: MISO, MOSI, SCLK, SSB for commands and digital audio datao I2S interface: I2S_CLK, I2S_WS, I2S_SDI, I2S_SDO for digital audio datao8 GPIO pins (4 of the 8 GPIO pins share with I2S).•Three 8-bit Volume Control set by SPI command for flexible mixingo VOLA: volume control for the digital audio data from I2S or analog inputso VOLB: volume control for the digital audio data from decompression block or SPIo VOLC: master volume control for PWM, AUDOUT, AUXOUT and I2S outputs•Operating Voltage: 2.7-3.6V•Standby Current: 1uA typical•Package: Pb-free 48L-LQFP• Temperature Options:o Industrial: -40°C to 85°C4 PINOUT CONFIGURATIONFigure 4-1 ISD3900 48-Lead LQFP Pin Configuration.5 PIN DESCRIPTIONPinNumberPin Name I/O Function1 NC This pin should be left unconnected.2 CSB O Chip Select Bar of the external serial flash interface.3 DI I Serial data input to external serial flash interface. Connects to dataoutput (DO) of external flash memory.4 I2S_SDI/GPIO7 I Serial Data Input of the I2S interface (If I2S is not used, this pin shouldbe grounded).Or, can be configured as a GPIO pin.5 I2S_SCK/GPIO6 I/O Clock input in slave mode or clock output in master mode. This pin can be configured as an external clock buffer if I2S is not used (If I2S is not used, this pin should be grounded).Or, can be configured as a GPIO pin.6 I2S_WS/GPIO5 I/O Word Select (WS) input in slave mode or WS output in master mode (If I2S is not used, this pin should be grounded).Or, can be configured as a GPIO pin.7 I2S_SDO/GPIO4 O Serial Data Output of the I2S Interface (If I2S is not used, this pin should be left unconnected).Or, can be configured as a GPIO pin.8 NC This pin should be left unconnected.9 NC This pin should be left unconnected.10 V SSD IDigitalGround.11 V CCD I Digital power supply.12 VREG O A 1.8V regulator to supply the internal logic. A 0.1uF capacitor shouldbe connected to this pin for supply decoupling and stability.13 MISO O Master-In-Slave-Out. Serial output from the ISD3900 to the host. Thispin is in tri-state when SSB=1.14 SCLK I Serial Clock input to the ISD3900 from the host.15 SSB I Slave Select input to the ISD3900 from the host. When SSB is lowdevice is selected and responds to commands on the SPI interface.16 MOSI I Master-Out-Slave-In. Serial input to the ISD3900 from the host.17 V CCD_PWM I Digital Power for the PWM Driver.Pin Name I/O FunctionPinNumber18 SPK+ O PWM driver positive output. This SPK+ output, together with SPK- pin,provide a differential output to drive 8Ω speaker or buzzer. Duringpower down this pin is in tri-state.Or, can be configured as BTL which, together with SPK- pin, provide adifferential voltage output.Or, can independently switch to AUDOUT or AUXOUT.19 V SSD_PWM I Digital Ground for the PWM Driver.20 SPK- O PWM driver negative output. This SPK- output, together with SPK+pin, provides a differential output to drive 8Ω speaker or buzzer.During power down this pin is tri-state.Or, can be configured as BTL which, together with SPK+ pin, provide adifferential voltage output.Or, can independently switch to AUDOUT or AUXOUT.21 V CCD_PWM I Digital Power for the PWM Driver.22 NC This pin should be left unconnected.23 NC This pin should be left unconnected.24 NC This pin should be left unconnected.25 INTB O Active low interrupt request pin. This pin is an open-drain output.26 RDY/BSYB O An output pin to report the status of data transfer on the SPI interface.“High” indicates that ISD3900 is ready to accept new SPI commandsor data.27 RESET I Applying power to this pin will reset the chip. (A high pulse of 50ms ormore will reset the chip.)28 DO O Serial data output of the external serial flash interface. Connects todata input (DI) of external serial flash.29 CLK O Serial data CLK of the external serial flash interface.30 GPIO3 I/O GPIO31 GPIO2 I/O GPIO32 GPIO1 I/O GPIO33 NC This pin should be left unconnected.34 NC This pin should be left unconnected.35 XTALOUT O Crystal interface output pin.PinNumberPin Name I/O Function36 XTALIN I The CLK_CFG register determines one of the following threeconfigurations: (1) A crystal or resonator connected between theXTALOUT and XTALIN pins. (2) A resistor connected to GND as areference current to the internal oscillator and left the XTALOUTunconnected. (3) An external clock input to the device and left theXTALOUT unconnected.37 NC This pin should be left unconnected.38 GPIO0 I/O GPIO39 NC This pin should be left unconnected.40 NC This pin should be left unconnected.41 AUDOUT O Audio Out. This pin can be either a voltage output or a current outputconfigured by the internal registers via SPI command.If AUDOUT is not used, this pin should be left unconnected.42 AUXOUT O Aux Out. This pin is an analog voltage output.If AUXOUT is not used, this pin should be left unconnected.43 V CCA I Analog power supply pin.44 V SSA I Analog ground pin.45 ANAOUT/MIC- O Variable gain analog output with the gain set by feedback resistance to ANAIN.Or, can be configured as MIC- which, together with MIC+, provides amicrophone differential input.If ANAIN/ANAOUT is not used, this pin should be left unconnected.46 ANAIN/MIC+ I Variable gain analog input.Or, can be configured as MIC+ which, together with MIC-, provides a microphone differential input.If ANAIN/ANAOUT is not used, this pin should be left unconnected.47 AUXIN I Auxiliary input with the gain set by SPI commandIf AUXIN is not used, this pin should be left unconnected.48 NC This pin should be left unconnected.6 ELECTRICAL CHARACTERISTICS6.1 O PERATING C ONDITIONSOPERATING CONDITIONS (INDUSTRIAL PACKAGED PARTS)CONDITIONS VALUESOperating temperature range (Case temperature) -40°C to +85°CSupply voltage (V DD) [1]+2.7V to +3.6VGround voltage (V SS) [2] 0V Input voltage (V DD) [1]0V to 3.6VVoltage applied to any pins (V SS –0.3V) to (V DD +0.3V)NOTES: [1] V DD = V CCA = V CCD = V CCPWM[2]VSS= V SSA = V SSD = V SSPWM6.2 DC P ARAMETERSPARAMETER SYMBOL MIN TYP [1]MAX UNITS CONDITIONSSupply Voltage V DD 2.7 3.6 VInput Low Voltage V IL V SS-0.3 0.3xV DD VInput High Voltage V IH 0.7xV DD V DD VOutput Low Voltage V OL V SS-0.3 0.3xV DD V I OL = 1mAOutput High Voltage V OH 0.7xV DD V DD VI OH = -1mAINTB Output Low Voltage V OH10.4 VRecord Current I DD_Record40 mAV DD= 3.6V, No load,Sampling freq = 16 kHzPlayback Current I DD_Playback30 mA Standby Current I SB 1 10µAV DD= 3.6V Input Leakage Current I IL±1 µA ForceV DD Notes: Conditions V DD=3V, T A=25°C unless otherwise stated6.3 AC P ARAMETERS6.3.1 Internal OscillatorPARAMETER SYMBOL MIN TYP MAX UNITS CONDITIONSInternal Oscillator with internal reference F INT -10%2.048MHz+10%MHz Vdd = 3V.At room temperatureInternal Oscillator with external resistor [1]F Ext -5%2.048MHz+5% MHz With 1% precisionresistor, 80k-ohm.Vdd = 3V.At room temperatureNotes:[1] Characterization data shows that frequency deviation is +/- 5% across temperature and voltageranges.6.3.2 InputsANAIN & MICINPARAMETER SYMBOL MIN TYP [1]MAX UNITS CONDITIONS ANAIN Input Voltage V ANAIN 10-1000mV Peak-to-Peak[2] ANAIN Feed Back Resistance R ANA(FB) 40 100 KΩMICIN Input Voltage V MICIN5-500 mV Peak-to-Peak[2] Notes: Conditions V DD=3V, T AB=25°C unless otherwise stated[2] Depends on Gain SettingAUXINPARAMETER SYMBOL MIN TYP[1]MAX UNITS CONDITIONS AUXIN Input Voltage V AUXIN 1000 mVPeak-to-Peak[2]Gain from AUXIN to AUXOUT/ANAOUT A AUXIN GAIN0 to 9 dB 4 Gain Steps of 3dbeachAUXIN Gain Accuracy A AUXIN (GA) -0.5 +0.5 dBAUXIN Input Resistance R AUXIN20-40 KΩ DependingonAUXIN Gain SettingNotes: Conditions V DD=3V, T A=25°C unless otherwise stated.[2] With 0db Gain setting.6.3.3 OutputsAUXOUTPARAMETER SYMBOL MIN TYP[1]MAX UNITS CONDITIONS SINAD, AUXIN to AUXOUT SINAD AUXIN_AUXOUT 80 dBLoad5K[2][3]SINAD, ANAIN to AUXOUT SINAD ANAIN_AUXOUT 80 dBLoad5K[2][3]PSRR PSRR AUXOUT-40 dB [4]DC Bias V BIAS_AUXOUT 1.2VMinimum Load Impedance R L(AUXOUT) 5 KΩMaximum Load Capacitance C L(AUXOUT) 0.1nF Notes: Conditions V DD=3V, T A=25°C unless otherwise stated.[2] 1 Vpp 1KHz signal applied at AUXIN/ANAIN with 0db Gain setting.[3] All measurements are C-message weighted.[4] Measured with 1KHz, 100 mVpp sine wave applied to VCCApins.AUDOUTPARAMETER SYMBOL MIN TYP[1]MAX UNITS CONDITIONS SINAD, AUXIN to AUDOUT[5] SINAD AUXIN_AUDOUT80 dB Load5K[2][3]SINAD, ANAIN to AUDOUT[5] SINAD ANAIN_AUDOUT80 dB Load5K[2][3]PSRR[5] PSRR AUDOUT-40 dB [4]DC Bias[5]V BIAS_AUDOUT 1.2VMinimum Load Impedance[5]R L(AUDOUT) 5 KΩMaximum Load Capacitance[5]C L(AUDOUT)0.1nFOutput Current [6]I AUDOUT 036mA[2][6]Notes: Conditions V cc=3V, T A=25°C unless otherwise stated.[2] 1 Vpp 1KHz signal applied at AUXIN/ANAIN with 0db Gain setting.[3] All measurements are C-message weighted.[4] Measured with 1Khz, 100 mVpp sine wave applied to VCCA pins.[5] Configured as AUDOUT(Voltage Output).[6] Configured as AUDOUT(Current Output).SPEAKER OUTPUTSPARAMETER SYMBOL MIN TYP[1]MAX UNITS CONDITIONS150Ω [2][3] SNR, AUXIN to SPK+/SPK- SNR AUXIN_SPK 60 dBLoad150Ω [2][3] SNR, ANAIN to SPK+/SPK- SNR ANAIN_SPK 60 dBLoad8Ω [2] Output Power P OUT_SPK VCC=3.0 360 mW Load THD, AUXIN to SPK+/SPK- THD % <1%Load 8Ω [2]ΩMinimum Load Impedance R L(SPK) 48 Notes: Conditions V cc=3V, T A=25°C unless otherwise stated.[2] 1 Vpp 1KHz signal applied at AUXIN/ANAIN with 0db Gain setting.[3] All measurements are C-message weighted.6.3.4 SPI TimingSYMBOL DESCRIPTION MIN TYP MAX UNIT T SCK SCLK Cycle Time 60 --- --- nsT SCKH SCLK High Pulse Width 25 --- --- nsT SCKL SCLK Low Pulse Width 25 --- --- nsT RISE Rise Time for All Digital Signals --- --- 10 nsSYMBOL DESCRIPTION MIN TYP MAX UNIT T FALL Fall Time for All Digital Signals --- --- 10 ns30 --- --- nsT SSBS SSB Falling Edge to 1st SCLK Falling Edge SetupTimeT SSBH Last SCLK Rising Edge to SSB Rising Edge Hold30ns --- 50us --- TimeT SSBHI SSB High Time between SSB Lows 20 --- --- ns T MOS MOSI to SCLK Rising Edge Setup Time 15 --- --- ns T MOH SCLK Rising Edge to MOSI Hold Time 15 --- --- ns T ZMID Delay Time from SSB Falling Edge to MISO Active -- -- 12 ns T MIZD Delay Time from SSB Rising Edge to MISO Tri-state -- -- 12 ns T MID Delay Time from SCLK Falling Edge to MISO --- --- 12 ns-- -- 12 ns T CRBD Delay Time from SCLK Rising Edge to RDY/BSYBFalling Edge0 -- -- nsT RBCD Delay Time from RDY/BSYB Rising Edge to SCLKFalling Edge6.3.5 I2S TimingFigure 6-2 I2S TimingSYMBOL DESCRIPTION MIN TYP MAX UNIT T SCK IS_SCK Cycle Time 60 --- --- ns T SCKH IS_SCK High Pulse Width 25 --- --- ns T SCKL IS_SCK Low Pulse Width 25 --- --- ns T RISE Rise Time for All Digital Signals --- --- 10 ns T FALL Fall Time for All Digital Signals --- --- 10 ns T WSS WS to IS_SCK Rising Edge Setup Time 20 --- --- ns T WSH IS_SCK Rising Edge to IS_WS Hold Time 20 --- --- ns T SDIS IS_SDI to IS_SCK Rising Edge Setup Time 15 --- --- ns T SDIH IS_SCK Rising Edge to IS_SDI Hold Time 15 --- --- ns T SDOD Delay Time from IS_SCLK Falling Edge to IS_SDO --- --- 12 ns8 PACKAGE SPECIFICATION8.1 48L EAD LQFP(7X7X1.4MM FOOTPRINT 2.0MM)9 ORDERING INFORMATIONI3900 FYI10 REVISION HISTORYVersion Date Description0.71 May 28, 2008 Initial release.•Reset pulse: 50ms.•Add a 270-ohm resistor between XTALOUT andcrystal.•Update spec of internal oscillator.•Industrial temp.0.75 Sep 10, 2008 Update:•SPI timing: T SSBH maximum 50us.•MICIN input signal: 500mV•Revise Block Diagram; add BTL block.•Revise Application Diagram.0.80 Feb 10, 2009 Updates:•Remove the Preliminary watermark.•Output low/high voltage.ISD3900 Nuvoton products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Nuvoton products are not intended for applications wherein failure of Nuvoton products couldresult or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Nuvoton customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nuvoton for any damages resulting from such improper use or sales.The contents of this document are provided only as a guide for the applications of Nuvoton products. Nuvoton makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Nuvoton or others is granted by this publication. Except as set forth in Nuvoton's Standard Terms and Conditions of Sale, Nuvoton assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property.The contents of this document are provided “AS IS”, and Nuvoton assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. In no event, shall Nuvoton be liable for any damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this documents, even if Nuvoton has been advised of the possibility of such damages.Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Nuvoton makes no representation or warranty that such applications shall be suitable for the use specified.The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the Nuvoton Reliability Report, and are neither warranted nor guaranteed by Nuvoton.This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder®product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is subject to change without notice.Copyright© 2005, Nuvoton Technology Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of Nuvoton Technology Corporation. All other trademarks are properties of their respective owners.Headquarters Nuvoton Technology Corporation America Nuvoton Technology (Shanghai) Ltd.No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai,Science-Based Industrial Park, CA 95134, U.S.A. 200336 ChinaHsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998FAX: 886-3-5665577 //Taipei Office Nuvoton Technology Corporation Japan Nuvoton Technology (H.K.) Ltd.9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City,Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd.,Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong KongTEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-********FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-********Please note that all data and specifications are subject to change without notice.All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.Publication Release Date: Feb 10, 2009 - 21 - Revision 0.80。
LM2904DR,LM2904DR,LM2904DR,LM2904DGKR,LM2904DGKR,LM2904DGKR,LM258DR,LM258DR, 规格书,Datasheet 资料
Low Input Bias and Offset Parameters:− Input Offset Voltage ...3mV TypA Versions ...2mV Typ− Input Offset Current ...2 nA Typ − Input Bias Current ...20 nA TypA Versions ...15 nA TypD Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage ...32V (26 V for LM2904)D Open-Loop Differential Voltage Amplification ...100 V/mV Typ DInternal Frequency Compensationdescription/ordering information These devices consist of two independent,high-gain frequency-compensated operational amplifiers designed to operate from a singlesupply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904), and V CC is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supplyvoltage.Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example,these devices can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional ±5-V supplies.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication d ate.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.3212019910111213456781817161514NC 2OUT NC 2IN−NCNC 1IN−NC 1IN+NCLM158, LM158A ...FK PACKAGE(TOP VIEW)N C 1O U T N C N CN CN C G N D N C C C +V 2I N +NC − No internal connectionOn products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted . On all other prod ucts, prod uction processing does not necessarily include testing of all parameters.ORDERING INFORMATION {T AV IO max AT 25°CMAX TESTED V CCPACKAGE }ORDERABLEPART NUMBER TOP-SIDE MARKING PDIP (P)Tube of 50LM358P LM358P Tube of 75LM358D Reel of 2500LM358DR SOIC (D)Reel of 2500LM358DRG3LM358SOP (PS)Reel of 2000LM358PSR L3587 mV30 VTube of 150LM358PW Reel of 2000LM358PWR °°CTSSOP (PW)Reel of 2000LM358PWRG3L3580C to 70MSOP/VSSOP (DGK)Reel of 2500LM358DGKR M5_§PDIP (P)Tube of 50LM358AP LM358AP SOIC (D)Tube of 75LM358AD 3mV 30V SOIC (D)Reel of 2500LM358ADR LM358A 3 mV30 VTSSOP (PW)Tube of 150LM358APW TSSOP (PW)Reel of 2000LM358APWR L358A MSOP/VSSOP (DGK)Reel of 2500LM358ADGKR M6_§PDIP (P)Tube of 50LM258P LM258P Tube of 75LM258D Reel of 2500LM258DR 5 mV30 VSOIC (D)Reel of 2500LM258DRG3LM258−25°°MSOP/VSSOP (DGK)Reel of 2500LM258DGKR M2_§25C to 85CPDIP (P)Tube of 50LM258AP LM258AP 3mV 30V SOIC (D)Tube of 75LM258AD 3 mV30 VSOIC (D)Reel of 2500LM258ADR LM258A MSOP/VSSOP (DGK)Reel of 2500LM258ADGKR M3_§PDIP (P)Tube of 50LM2904P LM2904P Tube of 75LM2904D Reel of 2500LM2904DR SOIC (D)Reel of 2500LM2904DRG3LM2904SOP (PS)Reel of 2000LM2904PSR L29047 mV26 VTube of 150LM2904PW −40°°Reel of 2000LM2904PWR 40C to 125CTSSOP (PW)Reel of 2000LM2904PWRG3L2904MSOP/VSSOP (DGK)Reel of 2500LM2904DGKR MB_§7mV 32V SOIC (D)Reel of 2500LM2904VQDR L2904V 7 mV 32 V TSSOP (PW)Reel of 2000LM2904VQPWR L2904V 2mV 32V SOIC (D)Reel of 2500LM2904AVQDR L2904AV 2 mV 32 V TSSOP (PW)Reel of 2000LM2904AVQPWR L2904AV 5mV 30V CDIP (JG)Tube of 50LM158JG LM158JG 55°C to 125°C5 mV30 V LCCC (FK)Tube of 55LM158FK LM158FK −55C to 1252mV 30V CDIP (JG)Tube of 50LM158AJG LM158AJG 2 mV30 VLCCC (FK)Tube of 55LM158AFKLM158AFK†For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at .‡Package drawings, thermal data, and symbolization are available at /packaging.§The actual top-side marking has one additional character that designates the wafer fab/assembly site.symbol (each amplifier)IN+IN−OUTschematic (each amplifier)V CC+OUTGND (or V CC−)IN−IN+Epi-FET Diodes Resistors Transistors CapacitorsCOMPONENT COUNT 127512absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†LM158, LM158ALM258, LM258ALM358, LM358ALM2904VLM2904UNITSupply voltage, V CC (see Note 1)±16 or 32±13 or 26V Differential input voltage, V ID (see Note 2)±32±26V Input voltage, V I (either input)−0.3 to 32−0.3 to 26V Duration of output short circuit (one amplifier) to groundat (or below) 25°C free-air temperature (V CC≤ 15 V) (see Note 3)Unlimited UnlimitedD package9797DGK package172172q P package8585°C/W Package thermal impedance, JA (see Notes 4 and 5)PS package9595PW package149149Package thermal impedance q(see Notes6and7)FK package 5.61C/WPackage thermal impedance, JC (see Notes 6 and 7)JG package14.5°LM158, LM158A−55 to 125Operating free air temperature range T LM258, LM258A−25 to 85Operating free-air temperature range, T ALM358, LM358A0 to 70°CLM2904−40 to 125−40 to 125 Operating virtual junction temperature, T J150150°C Case temperature for 60 seconds FK package260°C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds JG package300300°C Storage temperature range, T stg−65 to 150−65 to 150°C†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.All voltage values, except differential voltages and V CC specified for measurement of I OS, are with respect to the network ground terminal.2.Differential voltages are at IN+ with respect to IN−.3.Short circuits from outputs to V CC can cause excessive heating and eventual destruction.4.Maximum power dissipation is a function of T J(max), q JA, and T A. The maximum allowable power dissipation at any allowableambient temperature is P D = (T J(max) − T A)/q JA. Operating at the absolute maximum T J of 150°C can affect reliability.5.The package thermal impedance is calculated in accordance with JESD 51-7.6.Maximum power dissipation is a function of T J(max), q JC, and T C. The maximum allowable power dissipation at any allowable casetemperature is P D = (T J(max) − T C)/q JC. Operating at the absolute maximum T J of 150°C can affect reliability.7.The package thermal impedance is calculated in accordance with MIL-STD-883.electrical characteristics at specified free-air temperature, V CC = 5 V (unless otherwise noted)†‡LM158LM258LM358PARAMETERTEST CONDITIONS T A MINTYP §MAXMINTYP §MAXUNITInput offset voltage V CC = 5 V to MAX,V 25°C 3537V IOInput offset voltage V IC = V ICR(min),V O = 1.4 VFull range 79mV a V IOAverage temperature coefficient ofinput offset voltage Full range 77µV/°CInput offset current =14V25°C 230250I IO Input offset current V O = 1.4 V Full range 100150nA a I IOAverage temperature coefficient ofinput offset current Full range 1010pA/°CInput bias current =14V 25°C −20−150−20−250I IBInput bias currentV O = 1.4 V Full range −300−500nACCommon-mode=5V to MAX 25°C0 to V CC − 1.50 to V CC − 1.5V ICR Common mode input voltage rangeV CC = 5 V to MAXFull range0 to V CC − 20 to V CC − 2VR L ≥ 2 k Ω25°C V CC − 1.5V CC − 1.5High-levelR L ≥ 10 k Ω25°C V OHHigh level output voltage =MAX R L = 2 k ΩFull range 2626Vp g V CC = MAX R L ≥ 10 k ΩFull range 27282728V OL Low-leveloutput voltage R L ≤ 10 k ΩFull range 520520mVLarge-signal V CC = 15 V, 1V to 11V 25°C 5010025100A VD differentialvoltage amplification V O = 1 V to 11 V,R L ≥2 k ΩFull range 2515V/mV CMRR Common-mode rejection ratio V CC = 5 V to MAX,V IC = V ICR(min)25°C 70806580dB k SVR Supply-voltage rejection ratio (∆V DD /∆V IO )V CC = 5 V to MAX 25°C 6510065100dB V O1/V O2Crosstalk attenuationf = 1 kHz to 20 kHz 25°C 120120dBV CC = 15 V,1V 25°C −20−30−20−30Output current V ID = 1 V,V O = 0Source Full range −10−10I OOutput currentV CC = 15 V,1V25°C 10201020mAV ID = −1 V,V O = 15 VSink Full range 55I O Output current V ID = −1 V, V O = 200 mV 25°C 12301230µA I OS Short-circuit output current V CC at 5 V, GND at −5 V,V O = 025°C ±40±60±40±60mASupply current V O = 2.5 V, No load Full range 0.7 1.20.7 1.2I CCSupply current (two amplifiers)V CC = MAX, V O = 0.5 V,No loadFull range1212mA All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V CC for testing purposes is 26 V for the LM2904 and 30 V for others.‡Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904.§All typical values are at T A= 25°C.electrical characteristics at specified free-air temperature, V CC = 5 V (unless otherwise noted)TEST CONDITIONS LM2904PARAMETERTEST CONDITIONS †T A ‡MINTYP §MAXUNITNon A devices 25°C 37Input offset voltage V CC = 5 V to MAX,V Non-A devices Full range 10V IOInput offset voltageV IC = V ICR(min), A suffix devices 25°C 12mVV O = 1.4 VA-suffix devicesFull range 4a VIOAverage temperature coefficient of input offset voltageFull range7µV/°CNon V device 25°C 250Input offset current 14VNon-V deviceFull range 300I IOInput offset currentV O = 1.4 V V suffix device 25°C 250nAV-suffix deviceFull range 150a IIOAverage temperature coefficientof input offset current Full range 10pA/°C Input bias current 14V 25°C −20−250I IBInput bias currentV O = 1.4 VFull range −500nACommon-mode input voltage 5V to MAX 25°C0 to V CC − 1.5V ICRCommon mode input voltage rangeV CC = 5 V to MAXFull range0 to V CC − 2VR L ≥ 10 k Ω25°CV CC − 1.5V R L = 2 k ΩFull range 22V High-level output voltage CC = MAX,Non-V device R L ≥ 10 k ΩFull range 2324VOHHigh level output voltageV R L = 2 k ΩFull range 26CC = MAX,V-suffix deviceR L ≥ 10 k ΩFull range 2728V OL Low-level output voltage R L ≤ 10 k ΩFull range 520mV Large-signal differential V 25°C 25100A VD Large signal differential voltage amplificationCC = 15 V, V O = 1 V to 11 V,R L ≥2 k ΩFull range 15V/mV Common mode rejection ratio Non-V device 25°C 5080CMRR Common-mode rejection ratio V CC = 5 V to MAX,V IC = V ICR(min)V-suffix device25°C 6580dB k SVR Supply-voltage rejection ratio (∆V DD /∆V IO )V CC = 5 V to MAX 25°C 65100dB V O1/V O2Crosstalk attenuationf = 1 kHz to 20 kHz 25°C120dB 25°C −20−30mA V CC = 15 V,V ID = 1 V, V O = 0SourceFull range −10mA Output current V CC = 15 V,1V 25°C1020mA I OOutput currentV ID = −1 V,V O = 15 V SinkFull range 5mA V = −1 V,Non-V device 25°C 30ID = 1 V,V O = 200 mVV-suffix device25°C 1240µA I OS Short-circuit output current V CC at 5 V, GND at −5 V, V O = 025°C ±40±60mA Supply current (two amplifiers)V O = 2.5 V, No loadFull range 0.7 1.2I CCSupply current (two amplifiers)V CC = MAX, V O = 0.5 V, No loadFull range12mA†All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V CC fortesting purposes is 26 V for the LM2904, 32 V for the LM2904V, and 30 V for others.‡Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904.§All typical values are at T A= 25°C.electrical characteristics at specified free-air temperature, V CC = 5 V (unless otherwise noted)TEST CONDITIONS LM158A LM258APARAMETER TEST CONDITIONS†T A‡MIN TYP§MAX MIN TYP§MAXUNITInput offset voltage V CC = 5 V to 30 V,V25°C223V IO Input offset voltage V IC = V ICR(min),V O = 1.4 V Full range44mVa VIO Averagetemperaturecoefficient ofinput offset voltageFull range715*715µV/°C Input offset current=14V25°C210215I IO Input offset current V O = 1.4 VFull range3030nAa IIO Averagetemperaturecoefficient ofinput offset currentFull range1020010200pA/°C Input bias current=14V25°C−15−50−15−80I IB Input bias current V O = 1.4 VFull range−100−100nAC Common-mode=30V25°C0 toV CC − 1.50 toV CC − 1.5V ICR Common modeinput voltage rangeV CC = 30 VFull range0 toV CC − 20 toV CC − 2V High levelR L≥ 2 kΩ25°C V CC − 1.5V CC − 1.5High-leveloutput voltage V=30VR L= 2 kΩFull range2626V OH output voltageCC = 30 V RL≥ 10 kΩFull range27282728VV OL Low-leveloutput voltageR L≤ 10 kΩFull range520520mV Large-signal V CC = 15 V,1V to11V25°C5010050100A VD differentialvoltage amplification V O = 1 V to 11 V,R L≥2 kΩFull range2525V/mVCMRR Common-moderejection ratio25°C70807080dBk SVR Supply-voltagerejection ratio(∆V DD/∆V IO)25°C6510065100dBV O1/V O2Crosstalkattenuationf = 1 kHz to 20 kHz25°C120120dBV CC = 15 V,1V25°C−20−30−60−20−30−60V ID = 1 V,V O = 0SourceFull range−10−10I O Output current V CC = 15 V,1V 25°C10201020mAV ID = −1 V, V O = 15SinkFull range55V ID = −1 V, V O = 200 mV25°C12301230µAI OS Short-circuit outputcurrentV CC at 5 V, GND at −5 V,V O = 025°C±40±60±40±60mA Supply current(twoV O = 2.5 V, No load Full range0.7 1.20.7 1.2I CC Supply current (twoamplifiers)V CC = MAX, V O = 0.5 V,No loadFull range1212mA*On products compliant to MIL-PRF-38535, this parameter is not production tested.†All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V CC for testing purposes is 26 V for LM2904 and 30 V for others.‡Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A.§All typical values are at T A = 25°C.electrical characteristics at specified free-air temperature, V CC = 5 V (unless otherwise noted)TEST CONDITIONS LM358A PARAMETERTEST CONDITIONS †T A ‡MINTYP §MAXUNIT Input offset voltage V 25°C 23V IO Input offset voltageCC = 5 V to 30 V,V IC = V ICR(min), V O = 1.4 VFull range 5mV a V IOAverage temperature coefficient of input offset voltage Full range720µV/°C Input offset current 14V25°C 230I IO Input offset currentV O = 1.4 V Full range 75nA a IIO Average temperature coefficient of input offset current Full range10300pA/°C Input bias current 14V25°C −15−100I IB Input bias currentV O = 1.4 V Full range −200nACommon mode input voltage range V 30V25°C0 to V CC − 1.5V ICRCommon-mode input voltage rangeCC = 30 V Full range0 to V CC − 2VR L ≥ 2 k Ω25°CV CC − 1.5High-level output voltage 30V R L = 2 k ΩFull range 26V OH High level output voltage V CC = 30 V R L ≥ 10 k ΩFull range 2728V V OL Low-level output voltage R L ≤ 10 k ΩFull range 520mV Large-signal differential V 25°C 25100A VD Large signal differential voltage amplificationCC = 15 V, V O = 1 V to 11 V,R L ≥2 k ΩFull range 15V/mV CMRR Common-mode rejection ratio 25°C 6580dB k SVR Supply-voltage rejection ratio (∆V DD /∆V IO )25°C65100dB V O1/V O2Crosstalk attenuationf = 1 kHz to 20 kHz 25°C 120dBV CC = 15 V,1V 25°C −20−30−60V ID = 1 V,V O = 0SourceFull range −10I OOutput currentV CC = 15 V,1V 25°C1020mAV ID = −1 V,V O = 15 VSinkFull range 5V ID = −1 V, V O = 200 mV25°C 30µA I OS Short-circuit output current V CC at 5 V, GND at −5 V, V O = 025°C ±40±60mA Supply current (two amplifiers)V O = 2.5 V, No loadFull range 0.7 1.2I CCSupply current (two amplifiers)V CC = MAX, V O = 0.5 V, No loadFull range12mA†All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V CC fortesting purposes is 26 V for LM2904 and 30 V for others.‡Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A.§All typical values are at T A= 25°C.operating conditions, V CC = ±15 V, T A = 25°CPARAMETER TEST CONDITIONS TYP UNITSR Slew rate at unity gain R L= 1 MΩ, C L= 30 pF, V I= ±10 V(see Figure 1)0.3V/µs B1Unity-gain bandwidth R L= 1 MΩ, C L= 20 pF (see Figure 1)0.7MHz V n Equivalent input noise voltageR S= 100 Ω, V I= 0 V, f = 1 kHz(see Figure 2)40nV/√HzV OFigure 1. Unity-Gain AmplifierV O900 ΩFigure 2. Noise-Test Circuit23-May-2012 PACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)5962-87710012A ACTIVE LCCC FK201TBD Call TI Call TI5962-8771001PA ACTIVE CDIP JG81TBD Call TI Call TI5962-87710022A ACTIVE LCCC FK201TBD Call TI Call TI5962-8771002PA ACTIVE CDIP JG81TBD Call TI Call TILM158AFKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg Type LM158AJG ACTIVE CDIP JG81TBD A42N / A for Pkg Type LM158AJGB ACTIVE CDIP JG81TBD A42N / A for Pkg Type LM158FKB ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg Type LM158JG ACTIVE CDIP JG81TBD A42N / A for Pkg Type LM158JGB ACTIVE CDIP JG81TBD A42N / A for Pkg Type LM258AD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258ADE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258ADG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258ADGKR ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258ADGKRG4ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258ADR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258ADRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258ADRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LM258AP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM258APE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM258D ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258DE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM23-May-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)LM258DG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258DGKR ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258DGKRG4ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258DR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258DRE4ACTIVE SOIC D8Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM258DRG3ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU SN Level-1-260C-UNLIMLM258DRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LM258P ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM258PE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM2904AVQDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904AVQDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904AVQPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904AVQPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904D ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904DE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904DG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904DGKR ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904DGKRG4ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904DR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM23-May-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)LM2904DRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904DRG3ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU SN Level-1-260C-UNLIMLM2904DRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LM2904P ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM2904PE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM2904PSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904PSRE4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904PSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904PW ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904PWE4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904PWG4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LM2904PWLE OBSOLETE TSSOP PW8TBD Call TI Call TILM2904PWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904PWRG3ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU SN Level-1-260C-UNLIM LM2904QD OBSOLETE SOIC D8TBD Call TI Call TILM2904QDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904QDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LM2904QP OBSOLETE PDIP P8TBD Call TI Call TILM2904VQDR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904VQDRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM23-May-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)LM2904VQPWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM2904VQPWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358AD ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358ADE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358ADG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358ADGKR ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358ADGKRG4ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358ADR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358ADRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358ADRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LM358AP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM358APE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM358APW ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358APWE4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358APWG4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358APWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358APWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358APWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358D ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM23-May-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)LM358DE4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358DG4ACTIVE SOIC D875Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358DGKR ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358DGKRG4ACTIVE MSOP DGK82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358DR ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358DRE4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358DRG3ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU SN Level-1-260C-UNLIMLM358DRG4ACTIVE SOIC D82500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LM358P ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM358PE3ACTIVE PDIP P850Pb-Free (RoHS)CU SN N / A for Pkg Type LM358PE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type LM358PSLE OBSOLETE SO PS8TBD Call TI Call TILM358PSR ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358PSRE4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358PSRG4ACTIVE SO PS82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358PW ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358PWE4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358PWG4ACTIVE TSSOP PW8150Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM LM358PWLE OBSOLETE TSSOP PW8TBD Call TI Call TILM358PWR ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM23-May-2012Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)LM358PWRE4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMLM358PWRG3ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU SN Level-1-260C-UNLIMLM358PWRG4ACTIVE TSSOP PW82000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF LM258A, LM2904 :•Automotive: LM2904-Q1•Enhanced Product: LM258A-EP。
LM35D中文资料
LM35Precision Centigrade Temperature SensorsGeneral DescriptionThe LM35series are precision integrated-circuit temperature sensors,whose output voltage is linearly proportional to the Celsius (Centigrade)temperature.The LM35thus has an advantage over linear temperature sensors calibrated in ˚Kelvin,as the user is not required to subtract a large con-stant voltage from its output to obtain convenient Centigrade scaling.The LM35does not require any external calibration or trimming to provide typical accuracies of ±1⁄4˚C at room temperature and ±3⁄4˚C over a full −55to +150˚C tempera-ture range.Low cost is assured by trimming and calibration at the wafer level.The LM35’s low output impedance,linear output,and precise inherent calibration make interfacing to readout or control circuitry especially easy.It can be used with single power supplies,or with plus and minus supplies.As it draws only 60µA from its supply,it has very low self-heating,less than 0.1˚C in still air.The LM35is rated to operate over a −55˚to +150˚C temperature range,while the LM35C is rated for a −40˚to +110˚C range (−10˚with im-proved accuracy).The LM35series is available packaged inhermetic TO-46transistor packages,while the LM35C,LM35CA,and LM35D are also available in the plastic TO-92transistor package.The LM35D is also available in an 8-lead surface mount small outline package and a plastic TO-220package.Featuresn Calibrated directly in ˚Celsius (Centigrade)n Linear +10.0mV/˚C scale factorn 0.5˚C accuracy guaranteeable (at +25˚C)n Rated for full −55˚to +150˚C range n Suitable for remote applicationsn Low cost due to wafer-level trimming n Operates from 4to 30volts n Less than 60µA current drain n Low self-heating,0.08˚C in still air n Nonlinearity only ±1⁄4˚C typicalnLow impedance output,0.1Ωfor 1mA loadTypical ApplicationsTRI-STATE ®is a registered trademark of National Semiconductor Corporation.DS005516-3FIGURE 1.Basic Centigrade Temperature Sensor(+2˚C to +150˚C)DS005516-4Choose R 1=−V S /50µAV OUT =+1,500mV at +150˚C=+250mV at +25˚C =−550mV at −55˚CFIGURE 2.Full-Range Centigrade Temperature SensorJuly 1999LM35Precision Centigrade Temperature Sensors©1999National Semiconductor Corporation Connection DiagramsTO-46Metal Can Package*DS005516-1*Case is connected to negative pin(GND)Order Number LM35H,LM35AH,LM35CH,LM35CAH orLM35DHSee NS Package Number H03HTO-92Plastic PackageDS005516-2Order Number LM35CZ,LM35CAZ or LM35DZSee NS Package Number Z03ASO-8Small Outline Molded PackageDS005516-24*Tab is connected to the negative pin(GND).Note:The LM35DT pinout is different than the discontinued LM35DP.Order Number LM35DTSee NS Package Number TA03F2Absolute Maximum Ratings(Note10) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.Supply Voltage+35V to−0.2V Output Voltage+6V to−1.0V Output Current10mA Storage Temp.;TO-46Package,−60˚C to+180˚C TO-92Package,−60˚C to+150˚C SO-8Package,−65˚C to+150˚C TO-220Package,−65˚C to+150˚C Lead Temp.:TO-46Package,(Soldering,10seconds)300˚CTO-92and TO-220Package,(Soldering,10seconds)260˚C SO Package(Note12)Vapor Phase(60seconds)215˚C Infrared(15seconds)220˚C ESD Susceptibility(Note11)2500V Specified Operating Temperature Range:T MIN to T MAX (Note2)LM35,LM35A−55˚C to+150˚C LM35C,LM35CA−40˚C to+110˚C LM35D0˚C to+100˚CElectrical Characteristics(Notes1,6)LM35A LM35CA Parameter Conditions Tested Design Tested Design UnitsTypical Limit Limit Typical Limit Limit(Max.)(Note4)(Note5)(Note4)(Note5)Accuracy T A=+25˚C±0.2±0.5±0.2±0.5˚C (Note7)T A=−10˚C±0.3±0.3±1.0˚C T A=T MAX±0.4±1.0±0.4±1.0˚CT A=T MIN±0.4±1.0±0.4±1.5˚C Nonlinearity T MIN≤T A≤T MAX±0.18±0.35±0.15±0.3˚C (Note8)Sensor Gain T MIN≤T A≤T MAX+10.0+9.9,+10.0+9.9,mV/˚C (Average Slope)+10.1+10.1Load Regulation T A=+25˚C±0.4±1.0±0.4±1.0mV/mA (Note3)0≤I L≤1mA T MIN≤T A≤T MAX±0.5±3.0±0.5±3.0mV/mA Line Regulation T A=+25˚C±0.01±0.05±0.01±0.05mV/V (Note3)4V≤V S≤30V±0.02±0.1±0.02±0.1mV/V Quiescent Current V S=+5V,+25˚C56675667µA (Note9)V S=+5V10513191114µA V S=+30V,+25˚C56.26856.268µAV S=+30V105.513391.5116µA Change of4V≤V S≤30V,+25˚C0.2 1.00.2 1.0µA Quiescent Current4V≤V S≤30V0.5 2.00.5 2.0µA (Note3)Temperature+0.39+0.5+0.39+0.5µA/˚C Coefficient ofQuiescent CurrentMinimum Temperature In circuit of+1.5+2.0+1.5+2.0˚Cfor Rated Accuracy Figure1,I L=0Long Term Stability T J=T MAX,for±0.08±0.08˚C 1000hours3Electrical Characteristics(Notes1,6)LM35LM35C,LM35D Parameter Conditions Tested Design Tested Design UnitsTypical Limit Limit Typical Limit Limit(Max.)(Note4)(Note5)(Note4)(Note5) Accuracy,T A=+25˚C±0.4±1.0±0.4±1.0˚C LM35,LM35C T A=−10˚C±0.5±0.5±1.5˚C (Note7)T A=T MAX±0.8±1.5±0.8±1.5˚C T A=T MIN±0.8±1.5±0.8±2.0˚CAccuracy,LM35D (Note7)T A=+25˚C±0.6±1.5˚C T A=T MAX±0.9±2.0˚C T A=T MIN±0.9±2.0˚CNonlinearity T MIN≤T A≤T MAX±0.3±0.5±0.2±0.5˚C (Note8)Sensor Gain T MIN≤T A≤T MAX+10.0+9.8,+10.0+9.8,mV/˚C (Average Slope)+10.2+10.2Load Regulation T A=+25˚C±0.4±2.0±0.4±2.0mV/mA (Note3)0≤I L≤1mA T MIN≤T A≤T MAX±0.5±5.0±0.5±5.0mV/mA Line Regulation T A=+25˚C±0.01±0.1±0.01±0.1mV/V (Note3)4V≤V S≤30V±0.02±0.2±0.02±0.2mV/V Quiescent Current V S=+5V,+25˚C56805680µA (Note9)V S=+5V10515891138µA V S=+30V,+25˚C56.28256.282µAV S=+30V105.516191.5141µA Change of4V≤V S≤30V,+25˚C0.2 2.00.2 2.0µA Quiescent Current4V≤V S≤30V0.5 3.00.5 3.0µA (Note3)Temperature+0.39+0.7+0.39+0.7µA/˚C Coefficient ofQuiescent CurrentMinimum Temperature In circuit of+1.5+2.0+1.5+2.0˚C for Rated Accuracy Figure1,I L=0Long Term Stability T J=T MAX,for±0.08±0.08˚C 1000hoursNote1:Unless otherwise noted,these specifications apply:−55˚C≤T J≤+150˚C for the LM35and LM35A;−40˚≤T J≤+110˚C for the LM35C and LM35CA;and 0˚≤T J≤+100˚C for the LM35D.V S=+5Vdc and I LOAD=50µA,in the circuit of Figure2.These specifications also apply from+2˚C to T MAX in the circuit of Figure1.Specifications in boldface apply over the full rated temperature range.Note2:Thermal resistance of the TO-46package is400˚C/W,junction to ambient,and24˚C/W junction to case.Thermal resistance of the TO-92package is 180˚C/W junction to ambient.Thermal resistance of the small outline molded package is220˚C/W junction to ambient.Thermal resistance of the TO-220package is90˚C/W junction to ambient.For additional thermal resistance information see table in the Applications section.Note3:Regulation is measured at constant junction temperature,using pulse testing with a low duty cycle.Changes in output due to heating effects can be com-puted by multiplying the internal dissipation by the thermal resistance.Note4:Tested Limits are guaranteed and100%tested in production.Note5:Design Limits are guaranteed(but not100%production tested)over the indicated temperature and supply voltage ranges.These limits are not used to cal-culate outgoing quality levels.Note6:Specifications in boldface apply over the full rated temperature range.Note7:Accuracy is defined as the error between the output voltage and10mv/˚C times the device’s case temperature,at specified conditions of voltage,current, and temperature(expressed in˚C).Note8:Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line,over the device’s rated temperature range.Note9:Quiescent current is defined in the circuit of Figure1.Note10:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions.See Note1.Note11:Human body model,100pF discharged through a1.5kΩresistor.Note12:See AN-450“Surface Mounting Methods and Their Effect on Product Reliability”or the section titled“Surface Mount”found in a current National Semicon-ductor Linear Data Book for other methods of soldering surface mount devices.4Typical Performance CharacteristicsThermal ResistanceJunction to AirDS005516-25Thermal Time ConstantDS005516-26Thermal Responsein Still AirDS005516-27Thermal Response inStirred Oil BathDS005516-28Minimum SupplyVoltage vs.TemperatureDS005516-29Quiescent Currentvs.Temperature(In Circuit of Figure1.)DS005516-30Quiescent Currentvs.Temperature(In Circuit of Figure2.)DS005516-31Accuracy vs.Temperature(Guaranteed)DS005516-32Accuracy vs.Temperature(Guaranteed)DS005516-33 5Typical Performance Characteristics(Continued)ApplicationsThe LM35can be applied easily in the same way as other integrated-circuit temperature sensors.It can be glued or ce-mented to a surface and its temperature will be within about 0.01˚C of the surface temperature.This presumes that the ambient air temperature is almost the same as the surface temperature;if the air temperature were much higher or lower than the surface temperature,the ac-tual temperature of the LM35die would be at an intermediate temperature between the surface temperature and the air temperature.This is expecially true for the TO-92plastic package,where the copper leads are the principal thermal path to carry heat into the device,so its temperature might be closer to the air temperature than to the surface tempera-ture.To minimize this problem,be sure that the wiring to the LM35,as it leaves the device,is held at the same tempera-ture as the surface of interest.The easiest way to do this is to cover up these wires with a bead of epoxy which will in-sure that the leads and wires are all at the same temperature as the surface,and that the LM35die’s temperature will not be affected by the air temperature.The TO-46metal package can also be soldered to a metal surface or pipe without damage.Of course,in that case the V−terminal of the circuit will be grounded to that metal.Alter-natively,the LM35can be mounted inside a sealed-end metal tube,and can then be dipped into a bath or screwed into a threaded hole in a tank.As with any IC,the LM35and accompanying wiring and circuits must be kept insulated and dry,to avoid leakage and corrosion.This is especially true if the circuit may operate at cold temperatures where conden-sation can occur.Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to in-sure that moisture cannot corrode the LM35or its connec-tions.These devices are sometimes soldered to a small light-weight heat fin,to decrease the thermal time constant and speed up the response in slowly-moving air.On the other hand,a small thermal mass may be added to the sen-sor,to give the steadiest reading despite small deviations in the air temperature.Temperature Rise of LM35Due To Self-heating (Thermal Resistance,θJA )TO-46,TO-46*,TO-92,TO-92**,SO-8SO-8**TO-220no heat sinksmall heat fin no heat sink small heat fin no heat sink small heat fin no heat sink Still air 400˚C/W 100˚C/W 180˚C/W 140˚C/W 220˚C/W 110˚C/W 90˚C/W Moving air 100˚C/W 40˚C/W 90˚C/W 70˚C/W 105˚C/W90˚C/W26˚C/WStill oil 100˚C/W 40˚C/W 90˚C/W 70˚C/W Stirred oil50˚C/W30˚C/W45˚C/W40˚C/W(Clamped to metal,Infinite heat sink)(24˚C/W)(55˚C/W)*Wakefield type 201,or 1"disc of 0.020"sheet brass,soldered to case,or similar.**TO-92and SO-8packages glued and leads soldered to 1"square of 1/16"printed circuit board with 2oz.foil or similar.Noise VoltageDS005516-34Start-Up ResponseDS005516-35 6Typical ApplicationsCAPACITIVE LOADSLike most micropower circuits,the LM35has a limited abilityto drive heavy capacitive loads.The LM35by itself is able todrive50pf without special precautions.If heavier loads areanticipated,it is easy to isolate or decouple the load with aresistor;see Figure3.Or you can improve the tolerance ofcapacitance with a series R-C damper from output toground;see Figure4.When the LM35is applied with a200Ωload resistor asshown in Figure5,Figure6or Figure8it is relatively immuneto wiring capacitance because the capacitance forms a by-pass from ground to input,not on the output.However,aswith any linear circuit connected to wires in a hostile environ-ment,its performance can be affected adversely by intenseelectromagnetic sources such as relays,radio transmitters,motors with arcing brushes,SCR transients,etc,as its wiringcan act as a receiving antenna and its internal junctions canact as rectifiers.For best results in such cases,a bypass ca-pacitor from V IN to ground and a series R-C damper such as75Ωin series with0.2or1µF from output to ground are oftenuseful.These are shown in Figure13,Figure14,andFigure16.DS005516-19FIGURE3.LM35with Decoupling from Capacitive LoadDS005516-20FIGURE4.LM35with R-C DamperDS005516-5FIGURE5.Two-Wire Remote Temperature Sensor(Grounded Sensor)DS005516-6FIGURE6.Two-Wire Remote Temperature Sensor(Output Referred to Ground)DS005516-7FIGURE7.Temperature Sensor,Single Supply,−55˚to+150˚CDS005516-8FIGURE8.Two-Wire Remote Temperature Sensor(Output Referred to Ground)DS005516-9FIGURE9.4-To-20mA Current Source(0˚C to+100˚C)7Typical Applications(Continued)DS005516-10FIGURE 10.Fahrenheit ThermometerDS005516-11FIGURE 11.Centigrade Thermometer (Analog Meter)DS005516-12FIGURE 12.Fahrenheit ThermometerExpanded ScaleThermometer(50˚to 80˚Fahrenheit,for Example Shown)DS005516-13FIGURE 13.Temperature To Digital Converter (Serial Output)(+128˚C Full Scale)DS005516-14FIGURE 14.Temperature To Digital Converter (Parallel TRI-STATE ™Outputs forStandard Data Bus to µP Interface)(128˚C Full Scale) 8Typical Applications(Continued)DS005516-16*=1%or2%film resistorTrim R B for V B=3.075VTrim R C for V C=1.955VTrim R A for V A=0.075V+100mV/˚C x T ambientExample,V A=2.275V at22˚CFIGURE15.Bar-Graph Temperature Display(Dot Mode)DS005516-15FIGURE16.LM35With Voltage-To-Frequency Converter And Isolated Output(2˚C to+150˚C;20Hz to1500Hz)9Block DiagramDS005516-23 10Physical Dimensions inches(millimeters)unless otherwise notedTO-46Metal Can Package(H)Order Number LM35H,LM35AH,LM35CH,LM35CAH,or LM35DHNS Package Number H03HSO-8Molded Small Outline Package(M)Order Number LM35DMNS Package Number M08A11Physical Dimensions inches(millimeters)unless otherwise noted(Continued)Power Package TO-220(T)Order Number LM35DTNS Package Number TA03FTO-92Plastic Package(Z)Order Number LM35CZ,LM35CAZ or LM35DZNS Package Number Z03A12NotesLIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices orsystems which,(a)are intended for surgical implant into the body,or(b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a lifesupport device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor CorporationAmericasTel:1-800-272-9959 Fax:1-800-737-7018 Email:support@ National SemiconductorEuropeFax:+49(0)180-5308586Email:europe.support@Deutsch Tel:+49(0)180-5308585English Tel:+49(0)180-5327832Français Tel:+49(0)180-5329358Italiano Tel:+49(0)180-5341680National SemiconductorAsia Pacific CustomerResponse GroupTel:65-2544466Fax:65-2504466Email:sea.support@National SemiconductorJapan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507 LM35 Precision Centigrade Temperature SensorsNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.。
梅洛-威德尔光学公司产品说明书
中文操作手册MELOS 530订货号： 235 601关于我们北京宝御德科技有限公司在中国大陆地区独家代理并技术支持：德国Moller-Wedel Optical GmbH自准直仪、激光干涉仪、球径仪、测角仪、焦距/曲率半径/角度组合测量仪、相机镜头测试仪德国OEG GmbHMTF测试仪、手机镜头测试仪、FLATSCAN平面度扫描仪、表面张力仪激光干涉条纹分析软件、显微镜分析软件德国Mikroskop Technik Rathenow工业显微镜详细资料请访问中文网站，或直接垂询：北京宝御德科技有限公司地址：北京海淀区增光路27号增光佳苑2号楼1座2105室邮编：100037电话：***********/36传真：***********网站：Email:*********************目录1. 保证及有限责任________________________________________________________41.1 维护_____________________________________________________________________41.2 功能及损害的责任_________________________________________________________42. 介绍__________________________________________________________________53. 测量原理介绍__________________________________________________________63.1 一般说明_________________________________________________________________63.2 测量有效焦距_____________________________________________________________73.3 测量后焦距_______________________________________________________________83.4 测量曲率半径_____________________________________________________________93.5 平面角度的公差测量________________________________________________________ 94. 主要部件介绍_________________________________________________________11垂直支架、焦点模块及X－Y平台____________________________________124.1.1 4.14.1.2 42 智能控制器_______________________________________________________145. 组装_________________________________________________________________165.1 仪器的开箱及检验________________________________________________________165.2 仪器的组装______________________________________________________________166. 操作_________________________________________________________________176.1 菜单指引的控制器________________________________________________________176.1.1 模式_________________________________________________________________186.1.2 单位_________________________________________________________________196.1.3 公差_________________________________________________________________196.1.4 声音_________________________________________________________________206.1.5 语言_________________________________________________________________206.1.6 系统参数_____________________________________________________________206.2 测量模式的功能__________________________________________________________216.2.1 焦点测量模式的功能___________________________________________________216.2.2 后焦距测量模式的功能_________________________________________________226.2.3 曲率半径测量模式的功能_______________________________________________226.2.4 表格模式的功能_______________________________________________________236.3 RS-232 读数_____________________________________________________________236.3.1 协议的结构___________________________________________________________24针定义________________________________________________________276.3.2 RS-2327. 如何进行实际测量_____________________________________________________287.1 有效焦距的测量步骤______________________________________________________287.1.1 正有效焦距测量_______________________________________________________297.1.2 负有效焦距测量_______________________________________________________307.2 后焦距的测量步骤________________________________________________________307.2.1 正透镜的后焦距测量___________________________________________________307.2.2 负透镜的后焦距测量___________________________________________________317.3 曲率半径的测量步骤___________________________________________________317.4 测量平面角度_________________________________________________________337.4.1 测量平行平板_________________________________________________________ 34 7.4.2 测量90°棱镜的角度____________________________________________________ 357.4.3 借助棱镜系统测量光束的位移___________________________________________ 398. 技术数据_____________________________________________________________408.1 带测量准直仪的支架______________________________________________________408.2 焦点模块________________________________________________________________408.3 角度模块1（仅适用于组合4、5）__________________________________________408.4角度模块2（仅适用于组合4、5）___________________________________________418.5智能控制器（MELOS 530控制器）__________________________________________428.6电源插头_________________________________________________________________ 429. 维护和小心___________________________________________________________4310. 保证_________________________________________________________________43 附件一、重启控制器1. 保证及有限责任维护更改或维修必须仅可由MÖLLER-WEDEL OPTICAL GmbH明确授权的人员进行。
常用三极管参数大全
玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理玉林万顺达电脑芯片级维修资料 2010-07-20整理。
LM385D资料
LM285, LM385BMicropower Voltage Reference DiodesThe LM285/LM385 series are micropower two−terminal bandgap voltage regulator diodes. Designed to operate over a wide current range of 10 m A to 20 mA, these devices feature exceptionally low dynamic impedance, low noise and stable operation over time and temperature. Tight voltage tolerances are achieved by on−chip trimming. The large dynamic operating range enables these devices to be used in applications with widely varying supplies with excellent regulation. Extremely low operating current make these devices ideal for micropower circuitry like portable instrumentation, regulators and other analog circuitry where extended battery life is required.The LM285/LM385 series are packaged in a low cost TO−226 plastic case and are available in two voltage versions of 1.235 V and 2.500 V as denoted by the device suffix (see Ordering Information table). The LM285 is specified over a −40°C to +85°C temperature range while the LM385 is rated from 0°C to +70°C.The LM385 is also available in a surface mount plastic package in voltages of 1.235 V and 2.500 V.Features•Operating Current from 10 m A to 20 mA•1.0%, 1.5%, 2.0% and 3.0% Initial Tolerance Grades•Low Temperature Coefficient•1.0 W Dynamic Impedance•Surface Mount Package Available•Pb−Free Packages are AvailableFigure 1. Representative Schematic DiagramSee detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.ORDERING INFORMATIONMAXIMUM RATINGS (T A = 25°C, unless otherwise noted)Rating Symbol Value Unit Reverse Current I R30mA Forward Current I F10mAOperating Ambient Temperature RangeLM285LM385T A−40 to +850 to +70°COperating Junction Temperature T J+150°C Storage Temperature Range T stg−65 to + 150°CElectrostatic Discharge Sensitivity (ESD) Human Body Model (HBM)Machine Model (MM)Charged Device Model (CDM)ESD40004002000VMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.ELECTRICAL CHARACTERISTICS (T A = 25°C, unless otherwise noted)Characteristic SymbolLM285−1.2LM385−1.2/LM385B−1.2Unit Min Typ Max Min Typ MaxReverse Breakdown Voltage (I Rmin v I R v 20 mA) LM285−1.2/LM385B−1.2T A = T low to T high (Note 1)LM385−1.2T A = T low to T high (Note 1)V(BR)R1.2231.200−−1.235−−−1.2471.270−−1.2231.2101.2051.1921.235−1.235−1.2471.2601.2601.273VMinimum Operating Current T A = 25°CT A = T low to T high (Note 1)I Rmin−−8.0−1020−8.0−1520m AReverse Breakdown Voltage Change with Current I Rmin v I R v 1.0 mA, T A = +25°CT A = T low to T high (Note 1)1.0 mA v I R v 20 mA, T A = +25°CT A = T low to T high (Note 1)D V(BR)R−−−−−−−−1.01.51020−−−−−−−−1.01.52025mVReverse Dynamic Impedance I R = 100 m A, T A = +25°C Z−0.6−−0.6−WAverage Temperature Coefficient10 m A v I R v 20 mA, T A = T low to T high (Note 1)D V(BR)/D T−80−−80−ppm/°CWideband Noise (RMS)I R = 100 m A, 10 Hz v f v 10 kHz n−60−−60−m VLong Term StabilityI R = 100 m A, T A = +25°C ± 0.1°C S−20−−20−ppm/kHRReverse Breakdown Voltage (I Rmin v I R v 20 mA) LM285−2.5/LM385B−2.5T A = T low to T high (Note 1)LM385−2.5T A = T low to T high (Note 1)V(BR)R2.4622.415−−2.5−−−2.5382.585−−2.4622.4362.4252.4002.5−2.5−2.5382.5642.5752.600VMinimum Operating Current T A = 25°CT A = T low to T high (Note 1)I Rmin−−13−2030−−13−2030m A1.T low= −40°C for LM285−1.2, LM285−2.5T high=+85°C for LM285−1.2, LM285−2.5T low= 0°C for LM385−1.2, LM385B−1.2, LM385−2.5, LM385B−2.5 T high=+70°C for LM385−1.2, LM385B−1.2, LM385−2.5, LM385B−2.5ELECTRICAL CHARACTERISTICS (T A = 25°C, unless otherwise noted)Characteristic SymbolLM285−1.2LM385−1.2/LM385B−1.2Unit Min Typ Max Min Typ MaxReverse Breakdown Voltage Change with Current I Rmin v I R v 1.0 mA, T A = +25°CT A = T low to T high (Note 2)1.0 mA v I R v 20 mA, T A = +25°CT A = T low to T high (Note 2)D V(BR)R−−−−−−−−1.01.51020−−−−−−−−2.02.52025mVReverse Dynamic Impedance I R = 100 m A, T A = +25°C Z−0.6−−0.6−WAverage Temperature Coefficient20 m A v I R v 20 mA, T A = T low to T high (Note 2)D V(BR)/D T−80−−80−ppm/°CWideband Noise (RMS)I R = 100 m A, 10 Hz v f v 10 kHz n−120−−120−m VLong Term StabilityI R = 100 m A, T A = +25°C ± 0.1°C S−20−−20−ppm/kHR2.T low= −40°C for LM285−1.2, LM285−2.5T high=+85°C for LM285−1.2, LM285−2.5T low= 0°C for LM385−1.2, LM385B−1.2, LM385−2.5, LM385B−2.5 T high=+70°C for LM385−1.2, LM385B−1.2, LM385−2.5, LM385B−2.5t, TIME (ms)1.251.500.750.5005.00.251001.00O U T P U T (V )I N P U T (V )√1008751.0 K100 k10 K100125250375750625500f, FREQUENCY (Hz)e n , N O I S E (n V /H z )125T A , AMBIENT TEMPERATURE (°C)1.2101.2201.2301.2401.2501007550025−25−50V (B R )R , R E V E R S E V O L T A G E (V )1.21.00.80.60.40.20I F , FORWARD CURRENT (mA)V F , F O R W A R D V O L T A G E (V )101.00.1V(BR), REVERSE VOLTAGE (V), R E V E R S E C U R R E N T ( A )μI R 8.06.04.02.00−2.010I R , REVERSE CURRENT (mA)V (B R )R , R E V E R S E V O L T A G E C H A N G E (m ΔFigure 2. Reverse Characteristics Figure 3. Reverse CharacteristicsFigure 4. Forward Characteristics Figure 5. Temperature DriftFigure 6. Noise VoltageFigure 7. Response Timet, TIME (ms)√0250500750150012501000f, FREQUENCY (Hz)e n , N O I S E (n V /H z )1.21.00.80.60.40.20V F , F O R W A R D V O L T A G E (V )101.00.1, R E V E R S E C U R R E N T ( A )μI R Figure 12. Noise Voltage Figure 13. Response TimeDevice Operating Temperature Range Voltage Package Shipping†LM285D−1.2T A = −40°C to +85°C 1.235 VSOIC−898 Units / RailLM285D−1.2G SOIC−8(Pb−Free)98 Units / Rail LM285D−1.2R2SOIC−82500 / Tape & ReelLM285D−1.2R2G SOIC−8(Pb−Free)2500 / Tape & ReelLM285D−2.52.500 V SOIC−898 Units / RailLM285D−2.5G SOIC−8(Pb−Free)98 Units / Rail LM285D−2.5R2SOIC−82500 / Tape & ReelLM285D−2.5R2G SOIC−8(Pb−Free)2500 / Tape & ReelLM285Z−1.21.235 V TO−922000 Units / BagLM285Z−1.2G TO−92(Pb−Free)2000 Units / BagLM285Z−2.52.500 V TO−922000 Units / BagLM285Z−2.5G TO−92(Pb−Free)2000 Units / BagLM285Z−1.2RA1.235 V TO−922000 / Tape & ReelLM285Z−1.2RAG TO−92(Pb−Free)2000 / Tape & ReelLM285Z−2.5RA2.500 V TO−922000 / Tape & ReelLM285Z−2.5RAG TO−92(Pb−Free)2000 / Tape & Reel LM285Z−2.5RP TO−922000 Units / Fan−FoldLM285Z−2.5RPG TO−92(Pb−Free)2000 Units / Fan−Fold LM385BD−1.2T A = 0°C to +70°C 1.235 VSOIC−898 Units / RailLM385BD−1.2G SOIC−8(Pb−Free)98 Units / Rail LM385BD−1.2R2SOIC−82500 / Tape & ReelLM385BD−1.2R2G SOIC−8(Pb−Free)2500 / Tape & ReelLM385BD−2.52.500 V SOIC−898 Units / RailLM385BD−2.5G SOIC−8(Pb−Free)98 Units / Rail LM385BD−2.5R2SOIC−82500 / Tape & ReelLM385BD−2.5R2G SOIC−8(Pb−Free)2500 / Tape & ReelLM385BZ−1.21.235 V TO−922000 Units / BagLM385BZ−1.2G TO−92(Pb−Free)2000 Units / BagLM385BZ−1.2RA TO−922000 / Tape & Reel LM385BZ−1.2RAG TO−92(Pb−Free)2000 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.Device Shipping †Package VoltageOperating Temperature RangeLM385BZ−2.5T A = 0°C to +70°C2.500 VTO−922000 Units / Bag LM385BZ−2.5G TO−92(Pb−Free)2000 Units / Bag LM385BZ−2.5RA TO−922000 / Tape & Reel LM385BZ−2.5RAG TO−92(Pb−Free)2000 / Tape & Reel LM385D−1.2 1.235 V SOIC−898 Units / Rail LM385D−1.2G SOIC−8(Pb−Free)98 Units / Rail LM385D−1.2R2SOIC−82500 / Tape & Reel LM385D−1.2R2G SOIC−8(Pb−Free)2500 / Tape & Reel LM385D−2.5 2.500 V SOIC−898 Units / Rail LM385D−2.5G SOIC−8(Pb−Free)98 Units / Rail LM385D−2.5R2SOIC−82500 / Tape & Reel LM385D−2.5R2G SOIC−8(Pb−Free)2500 / Tape & Reel LM385Z−1.2 1.235 VTO−922000 Units / Bag LM385Z−1.2G TO−92(Pb−Free)2000 Units / Bag LM385Z−1.2RA TO−922000 / Tape & Reel LM385Z−1.2RAG TO−92(Pb−Free)2000 / Tape & Reel LM385Z−1.2RP TO−922000 / Ammo Box LM385Z−1.2RPG TO−92(Pb−Free)2000 / Ammo Box LM385Z−2.5 2.500 V TO−922000 Units / Bag LM385Z−2.5G TO−92(Pb−Free)2000 Units / Bag LM385Z−2.5RP TO−922000 / Ammo Box LM385Z−2.5RPGTO−92(Pb−Free)2000 / Ammo Box†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.SOIC−8 NB CASE 751−07 ISSUE AGNOTES:1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A AND B DO NOT INCLUDEMOLD PROTRUSION.4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.5.DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.127 (0.005) TOTALIN EXCESS OF THE D DIMENSION ATMAXIMUM MATERIAL CONDITION.6.751−01 THRU 751−06 ARE OBSOLETE. NEWSTANDARD IS 751−07.DIMAMIN MAX MIN MAXINCHES4.805.000.1890.197MILLIMETERSB 3.80 4.000.1500.157C 1.35 1.750.0530.069D0.330.510.0130.020G 1.27 BSC0.050 BSCH0.100.250.0040.010J0.190.250.0070.010K0.40 1.270.0160.050M0 8 0 8N0.250.500.0100.020S 5.80 6.200.2280.244 YM0.25 (0.010)Z S X S____ǒmminchesǓSCALE 6:1*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED.4.LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.DIMMIN MAX MIN MAX MILLIMETERSINCHES A 0.1750.205 4.45 5.20B 0.1700.210 4.32 5.33C 0.1250.165 3.18 4.19D 0.0160.0210.4070.533G 0.0450.055 1.15 1.39H 0.0950.105 2.42 2.66J 0.0150.0200.390.50K 0.500−−−12.70−−−L 0.250−−− 6.35−−−N 0.0800.105 2.04 2.66P −−−0.100−−− 2.54R 0.115−−− 2.93−−−V0.135−−−3.43−−−CASE 29−11ISSUE ALTO−92 (TO−226)ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
PCM-3900 用户手册说明书
PCM-3900 USER MANUALCopyright noticeThis document is copyrighted, 2000, by Advantech Co., Ltd. All rights are reserved. The original manufacturer reserves the right to make improvements to the products described in this manual at anytime without notice.No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means without the prior written permission of the original manufacturer. Information provided in thismanual is intended to be accurate and reliable. However, the original manufacturer assumes no responsibility for its use, nor for any infringements upon the rights of third parties which may result from its use.AcknowledgementsAMD is a trademark of Advanced Micro Devices, Inc.Award is a trademark of Award Software International, Inc.Cyrix is a trademark of Cyrix Corporation.IBM, PC/AT, PS/2 and VGA are trademarks of International Business Machines Corporation.Intel and Pentium are trademarks of Intel Corporation.Microsoft Windows ® is a registered trademark of Microsoft Corp.RTL is a trademark of Realtek Semiconductor Co., Ltd.C&T is a trademark of Chips and Technologies, Inc.UMC is a trademark of United Microelectronics Corporation.Winbond is a trademark of Winbond Electronics Corp.For more information on this and other Advantech products, please visit our website at: For technical support and service, please visit our support website at: /supportThis manual is for the PCM-3291.Part No. 20063900001st Edition Printed in Taiwan October 2001Introduction.PC/104 IDE RAID Module is an IDE to IDE Disk Array Controller. A “Real-Time-Backup” device designed for Enterprises, Schools, and Personal Using. It provides a solution for low cost, high performance and redundant Disk Array function.-✦Data Mirroring: RAID Level 1 data mirror function. Backup data from one hard disk drive to another automatically, ensure your OS and important data to be safe.✦Plug and Play: No need to install any device driver.✦OS Independence: Supports all PC operating systems.✦Auto Rebuild: Under system execution, if one hard disk drive is replaced, PC/104 IDE RAID Module will auto rebuild data to the new hard disk drive.✦Hot Swap: When one hard disk drive crashes, PC/104 IDE RAID Module allows you to remove it at once without power off. And by the mean while, your system can work as usual.✦Firmware Upgradable: On-line WWW service, you can get newest firmware version via Internet.✦High Performance: System with PC/104 IDE RAID Module provides similar performance as with one single hard disk drive and provides high data security for users.✦High Capacity: Hard disk drive capacity is no limitation.✦Easy Maintenance: Special DIY design. End-user can handle normal errors, and reduce MIS loading.✦System Indicators: Show system status by LEDs and the Buzzer.✦Host Compatibility: Supports IBM PCs, and compatible with most mainboards and chipsets.✦Hard Disk Compatibility: Supports all major brands’ IDE hard disk drives.✦Support Multi-boot System: Such as System Commander, IBM OS/2 Boot Manager, …….etc.✦RAID Manager: A software that operates with RAID system and allow user to Monitor and Remote Monitor the status of RAID systems.✦System: IBM PC Compatible Computer.✦CPU: Support Intel, AMD, Cyrix.✦Hard disk drive: Support most famous IDE hard disk drives, the capacity can be more than 30 Gbytes; Please make sure your device support LBA Mode if it is smaller than 1 Gbytes.Host Interface EIDE, IBM PC CompatibleHDD Interface EIDE, Supports UDMA 33/66/100 HDD (Only UDMA33 for Maxtor HDD) Card Interface PC/104 StandardRAID! RAID 1 (Mirror)Transfer Rate! 16.67MB/S (PIO mode 4) and 33.3MB/S (UDMA2)Hot-Swap! Taking off HDD without shutdown the systemAuto-Rebuild! Automatically doing HDD's data reconstructionLED ! 1st HDD and 2nd HDD activity ! Re-built! HDD FailManual Rebuild! FAT Copy or Sector Copy (FAT Copy Include FAT16, FAT32, NTFS)HDD Connector ! 3 * 90degree 2.54mm 40pin BOX header for 1 Host IDE and 2 Driver IDE ! 2 * 180 degree 2.00mm 44pin header for 2 Driver IDEPower Connector ! 90 degree small 4 pin Speaker ! 1* Alarm SpeakerEXT connector ! EXT 1st HDD and 2nd HDD activity LED ! EXT Re-built LED! EXT HDD Fail LED! EXT Speaker! Hot swap buttonSupply Voltages! +5VOperating Temperature! 0℃~ 70℃Cable! Host IDE × 1, Driver IDE × 2Supports Operation Systems ! Windows NT Server and Workstation, DOS6.22, Windows 98/95/3.1x ! NetWare 3.12/4.11/5.0,! SCO UNIX System V! OS/2! Linux (RedHat, Slack Ware, Debian, SuSe, OpenLinux, Turbo Linux) ! Free BSD3.1! Solaris 2.xReliability ! MTBF > 250,000 hoursHow to InstallPC/104 IDE RAID Module is very easy to install. All you need is to install it the way just like what you may have done with a hard disk drive. Please read the descriptions bellow in detail.When you use PC/104 IDE RAID Module, please keep the follwing descriptions in mind. Must means you have to follow the instruction; and Note means please read it carefully:✦Using 2 New Hard Disks Note It is better for PC/104 IDE RAID Module to use two hard disk drives with the same brand and model.✦System Installation Note The user may install OS on one hard disk drive first, and then copy to another one by using “Auto Rebuild”✦Install a New Hard Disk Drive Must If you buy a new hard disk drive and want to use it with the original hard disk drive, the new hard disk’s capacity must be equal or larger than the original one’s.✦Hard Disk Setup Must Please setup both of two hard disk drives in master mode, which is the default factory-setting mode.PC/104 IDE RAID Module Layout and Parts:Figure 2.1 PC/104 IDE RAID Module1. Host IDE Use an IDE ribbon cable to connect host onboard IDE slot2. HDD1 IDE Use one IDE ribbon cable to connect the hard disk drive HDD13. HDD2 IDE Use one IDE ribbon cable to connect the hard disk drive HDD24. 2.5’’ true HDD form factor5. 2.5’’ true HDD form factor6. 1st LED status indicator, shows HDD1’s status( Failed or Normal )7. HDD1 access LED8. 2nd LED status indicator, shows HDD2’s status( Failed or Normal )9. HDD2 access LED10. Rebuild LED11. External LED connector12. Jumper Setting13. Buzzer setting External Buzzer：Pin 1 ＋, pin 3 － ; Internal Buzzer：Pin 3 , 4 On14. RS-232 Connector15. IDE and Buzzer Switch ( See Table 2.2 )16. Buzzer Indicate warning or other message17. Power In Connect to power supplyTable2.2 PC/104 IDE RAID Module Jumper Setting descriptionHowUsetoAfter the installation of PC/104 IDE RAID Module is completed, users may select the function conveniently just by altering Jumper setting.Figure3.1 PC/104 IDE RAID Module Jupmer setting✦Jumper Setting Description:Table3.1 PC/104 IDE RAID Module Jumper Setting description✦Using FDISK Note If you want to reinstall OS in two used hard disk drives synchronously, please first use FDISK to delete partitions of the two hard disk drives respectivelyAuto-RebuildYou may install software into one hard disk drive first, and then use “Auto-Rebuild Function” described in this chapter, to copy the content of the first hard disk drive into another one.Reference Section 3.1 “Jumper Setting” to select “Mirror” mode. You may check system status by 1st and 2nd LED indicators and Buzzer (Please reference Figure2.1 to check 1st and 2nd LED indicators). The meaning of LED indicators and Buzzer are as follows.4.1✦ When Booting , 1 st and 2nd LEDs will blink once and Buzzer will alert once, and RAID Level 1 data mirror function already operates. This willsynchronize the two hard disk drives, and protect your operating system and important data on time.✦ When one hard disk drive is broken-down The Buzzer will alert, you may know which hard disk drive is broken down by 1st and 2nd LED indicators.If 1st LED indicator is red, it implies that HDD1 is broken down. If 2nd LED indicator is red, it implies that HDD2 is broken down. We suggest to change the broken one to a normal one, to make sure your operating system and data to be safe.✦ Auto-Rebuild When one hard disk drive is broken-down, user may replace it with a new one, our system will go into “Auto-Rebuild” mode. At this time,the LED indicator of the hard disk drive that you just changed will blink. When “Auto-Rebuild” function is completed, the LED indicator will return to the normal status.✦ If one hard disk LED indicator doesn’t work, please check your LED firstly, you may reboot the system to check if it’s broken✦ Make sure your HDD1 and HDD2 are set at Master mode 。
BD3930FP中文资料
Appendix1-Rev1.1
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IM3319 3320 三相互感式电能质量检测仪 产品手册说明书
IM3319/3320 三相互感式电能质量检测仪 产品手册 V1.1IM3319/3320 三相互感式电能质量检测仪产品介绍 一、1.1 简介 1.2 功能特点 1.3 技术参数 二、 应用2.1 外形及安装 2.2 端子定义 2.3 典型接线 2.4 应用说明 三、 Modbus 寄存器 四、 MODBUS 通讯规约 五、 注意事项一、产品介绍1.1、 简介IM3319/3320三相互感式电能质量检测仪系我公司采用微电子技术与专用大规模集成电路，应用数字采样处理技术及SMT 工艺等先进技术研制开发的拥有完全自主知识产权的三相电能质量检测仪。
该检测仪技术性能完全符合IEC 62053-21国标标准中0.5S 级三相有功电能表的相关技术要求，能直接精确地测量额定频率为50HZ 或60HZ 三相交流电网中的电压、电流、功率、功率因数、电量及总量等电参数。
该检测仪内置2路RS485通讯接口、1路开关量输出（可选）、1路点阵液晶显示输出口、MODBUS-RTU 通讯协议方便与各种AMR 系统联接，具有可靠性好、体积小、重量轻、外形美观、安装方便等特点。
IM3319/3320三相互感式电能质量检测仪可广泛应用于节能改造、电力、通信、铁路、交通、环保、石化、钢铁等行业中，用于监测交流设备的电流和电量消耗情况。
1.2、 功能特点1.2.1. 采集三相交流电参数，包括电压、电流、功率、电能等多个电参量，信息全 1.2.2. 采用专用测量芯片，有效值测量方式，测量精度高 1.2.3. 带2路RS-485通讯接口1.2.4. 通信规约采用标准Modbus-RTU ，兼容性好，方便编程1.2.5. 带ESD 保护电路的RS-485通信接口 1.2.6. 多种供电方式可选1.2.7. 宽工作电压AC80～240V 或DC5V ，并具防接反保护功能，接反电源不会损坏模块1.2.8. 采用工业级芯片，内置看门狗，并具有完善的防雷抗干扰措施，保证可靠性1.2.9. 高隔离电压，耐压达AC:2000V 1.2.10. 可选配1路开关量输出1.2.11. 带外接LCD 显示通讯接口、可实时查看测量数据参数 1.2.12. 可选配不同规格单匝穿心互感器或开合式互感器，方便易用(注：开合式电流互感器主要应用于工业中城网、电力传输系统、农村项目改造，具有 安装方便，无需拆卸一次母线，亦可带电操作，并且不影响客户正常用电，为用户改造 项目节省大量的人力、物力、财力，提高改造效率。
华为WCDMA3900系列化基站产品概述
华为WCDMA 3900系列化基站产品概述2019年11月目录1 产品定位和特点 (1)1.1产品定位 (1)1.2产品特点 (1)2 产品架构 (3)2.1概述 (3)2.2硬件结构 (3)2.2.1 BBU3900 (3)2.2.2 RRU (5)2.2.3 MRFU (6)2.2.4 配套设备 (7)3 产品和应用场景 (10)3.1概述 (10)3.2应用场景 (10)3.2.1 分布式基站DBS3900 (10)3.2.2 室内宏基站BTS3900 (12)3.2.3 双模共柜基站 (13)4 技术指标 (14)4.1BTS3900技术规格 (14)4.2DBS3900技术指标 (17)5 缩略语表 (20)1 产品定位和特点1.1 产品定位在移动通信技术日新月异发展的今天，如何利用创新的技术优化无线网络的建网方式，如何融合多元技术，降低运营商的投资风险，助力构建面向未来的移动网络，无疑将成为运营商选择合作伙伴和网络建设投资的关注点。
3900系列基站，是华为秉承“基于客户需求持续创新”的理念，整合无线平台资源，融合多元技术，面向未来移动网络发展的基站产品解决方案。
3900系列基站采用了优化的硬件和系统设计，创新的功放和功耗管理等节能技术，可分别从温控节能和绿色新能源利用等方面帮助运营商实现“节能减排”，构建绿色通信网络。
3900系列基站的推出，将有效推动移动网络的发展，使之呈现出“融合、宽带、绿色、演进”的典型特征，帮助运营商更好地构筑面向未来的移动网络。
3900系列化基站，采用了业界领先的宽带化、多制式、模块化设计理念，基本功能模块数量仅为三种，具有体积小、集成度高、功耗低、易于快速部署特点。
通过功能模块与安装配套件的灵活组合，可形成多样化的产品形态。
同时，运营商可将不同制式的模块混插在同一机柜，构建适应多种应用场景的基站，加快新频段和新技术的引入，有效解决移动网络多制式融合的发展需求。
LM3900中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
DS3900中文资料
General DescriptionThe DS3900 provides bidirectional communication with 2-wire and 3-wire devices using a PC’s serial port. In addition, it can also be used as a general-pur-pose digital I/O interface with 11 I/O signals that can evaluate a wide variety of ICs.The DS3900 is intended for evaluation purposes only.ApplicationsPrototyping 2-Wire and 3-Wire Device Designs Evaluating 2-Wire and 3-Wire Devices Building Test Software for Systems Containing 2-Wire or 3-Wire DevicesCommunicating With ICs that Require up to 11 I/O SignalsFeatures♦Communicates from PCs to ICs Through a Serial Port ♦Fast Communication to 2-Wire Devices ♦Eleven General-Purpose Digital I/O Pins,Including SDA and SCL ♦Built-in Pullup Resistors for SDA and SCL Minimize Required External Hardware♦Connection to Standard Prototyping Boards Possible Using Header Connectors ♦Operates from 3.0V to 5.5VDS3900Serial Communications ModuleFor Evaluation Kits______________________________________________Maxim Integrated Products1Ordering InformationRev 1; 7/04For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Typical Operating Circuit appears at end of data sheet.DS3900 PhotoPin ConfigurationD S 3900Serial Communications Module For Evaluation Kits 2_____________________________________________________________________RECOMMENDED OPERATING CHARACTERISTICS(V CC = 3.0V to 5.5V, T A = +25°C.)Note 2:Devices are only functionally tested; all of the DC parametric values listed are designed parameters.DS3900Serial Communications ModuleFor Evaluation Kits_____________________________________________________________________3Detailed DescriptionThe DS3900 communicates with ICs using a PC’s serial port. It utilizes a MAX3223 RS232 transceiver to trans-late the serial port signal levels from ±12V to accept-able levels for a microprocessor. The microprocessor is then able to communicate to the PC by using its univer-sal asynchronous receiver transmitter.In addition to the serial communication channel that is routed through the MAX3223, the data terminal ready (DTR) signal is routed through the secondary channel to produce a control signal that can reset the DS3900from software. The software-reset function primarily allows the PC to search its available serial ports to find the DS3900.After a reset occurs, the DS3900 writes a banner over the serial port that allows the PC to detect its presence.Once it has been detected, the PC sends simple 2-byte commands over the serial connection, which provides instruction and data for the DS3900 to communicate with 2-wire parts, or to read or write a specific pin of the DS3900. All of the pins, with the exception of P3, have tristate drivers. P3 has an open-drain output, and can be read as an input pin as well; however, its default function is a system pulse that provides a visual indica-tion (through an LED) that the DS3900 is operating properly. The P3 pin defaults to a slow-pulsing output,but this can be disabled, enabling P3 as an I/O pin, or it can be adjusted to a faster pulse rate as an indicator for the application.Because it is rated to work with supply voltages ranging from +3.0V to +5.5V, the DS3900 operates from thesame voltage supply as the IC that it is controlling in most cases.Resetting the DS3900The DTR signal of the serial port (pin 4 of a DB9 con-nector) is routed through the second channel of the MAX3223 transceiver. DTR controls an NMOS, which is connected to the reset signal of the microprocessor.This allows the PC to hold the DS3900 in reset until it is ready for operation, or to reset the DS3900 in the event an error occurs. Although the reset signal is accessible through the DS3900’s connector, it should be left dis-connected so it can be controlled through software.When DTR transitions to ON, the DS3900 exits its reset state and executes its initialization code. The initializa-tion routine writes a banner (see DS3900 Revisions sec-tion), “DSIO r2.0” over the serial connection to the PC,which can be used by the PC to identify that the DS3900 is present. After it has left the reset state, all of the DS3900 signals, except P3, are configured as inputs (the output drivers are disabled). P3 appears as an output and begins to pulse slowly. If the switches enable SDA’s and SCL’s pullups, those signals float high, and all the other pins float to an undetermined state if they are not being driven by external signals.Designing Hardware to Utilize the Built-inSupport for 2-Wire DevicesThe DS3900 has custom firmware that enables fast communication to 2-wire devices. To utilize this firmware, connect the SCL bus to P10 and the SDA bus to P11. Additionally, it has built-in pullup resistors that can be utilized by turning both switches on (see UsingFigure 1. Functional DiagramD S 3900Serial Communications Module For Evaluation Kits 4_____________________________________________________________________Integral Pullups section). This connects 4.7k Ωresistors to both 2-wire buses.For designs that only use the DS3900 to communicate to 2-wire devices, the following items must be account-ed for in the hardware design:1)Place the mating connectors on the circuit board (see Figure 5).2)Connect V CC and all three ground terminals.3)Connect the SCL bus to pin P10, and the SDA bus to P11 of the DS3900.4)If the application board does not have pullup resistors, turn the switches on to enable the on-board pullups; otherwise, turn the switches off to disconnect the integrated pullups.5)Optional: connect an LED to P3 for the pulse func-tion (see Typical Operating Circuit ).6)Drive the DS3900 with either evaluation software pro-vided by Dallas Semiconductor or custom-designed software for the end application (see Writing Software to Interface with the DS3900 section).Designing Hardware to Utilize the General-Purpose Bit I/O SignalsUtilizing the DS3900 for general-purpose bit I/O is equally simple as using it for 2-wire applications. All of the I/O pins with the exception of P3 have tristate out-puts. These signals can be written to a ‘0’ or a ‘1’, and they can be read as inputs. P3 has an open-drain out-put, and can also be read as input. Because it defaults to a pulsing output, P3 is generally connected to an LED as shown in the Typical Operating Circuit . Writing it to a ‘1’ turns off the pulldown transistor, which turns the LED off, and writing it to a ‘0’ turns the pulldown and the LED on. This can also be used as an open-col-lector I/O pin with an external pullup resistor and no LED, making the pin appear as a normal output. The pulse function can be disabled in software, but designs using P3 for I/O should be conscious that the DS3900could attempt to blink P3 before the pulse function is disabled. As long as the IC connected to P3 is tolerant of this behavior, P3 can be used as an additional I/O.Additionally, designs using P10 and P11 should be conscious of the built-in pullup resistors that are intend-ed for use with 2-wire devices (see Using Integral Pullups section for details).The general procedure for connecting the DS3900 for bit I/O applications is as follows:1)Place the mating connectors on the circuit board(see Recommended PC Board Connection ).2)Connect V CC and all three GND ground terminals.3)Connect P1 through P11 to the application. If the application is using 2-wire devices in addition to the remaining bit I/O signals, make sure to reserve P10 and P11 for the 2-wire application. Use P3only if the application is able to tolerate the pulse function until it is disabled.4)Optional: connect an LED to P3 for the pulse func-tion (see Typical Operating Circuit ).5)Write software to allow the DS3900 to communi-cate with the target IC.Writing Software to Interfacewith the DS3900The DS3900 interprets 2-byte instructions (see Table 1)sent from a PC to determine what to do. After a valid command is received, it will begin to execute the com-mand. Upon completion, it will return any data associat-ed with the command, plus a unique acknowledgement byte that informs the PC that the command completed successfully. If an invalid command was received or the command did not complete successfully, the DS3900 will return error code (0xFA).Because the DS3900 could return 0xF A as data, it is important that the PC software is aware of the amount of data that it should expect to be returned. For exam-ple, if a 2-wire read operation is performed and a signal byte, 0xF A, is returned, then the PC is receiving an error code because the 2-wire read command should return first the data, then the acknowledgement. If the data was 0xFA, the DS3900 would return 0xFA followed by the command acknowledgment 0xB2.DS3900 RevisionsRevisions yielding significant changes and/or improve-ments can be tracked by reading the banner after a reset or by calling the Read Revisions command (0xC2). The Read Revisions command (added in Rev.2.0) will return three bytes: the major revision, the minor revision, and a command acknowledgement (0xD2).For example, if the DS3900's revision is 2.0, it will return a major revision of 2, a minor revision of 0, and the command acknowledgement 0xD2.Knowing the revision allows the software to both utilize new functions that are not available in previous ver-sions of the DS3900's firmware and to avoid using com-mands that are not present in prior versions. Although there are no plans to change the firmware at this time,Dallas Semiconductor reserves the right to change the firmware at any time without notice.DS3900Serial Communications ModuleFor Evaluation Kits_____________________________________________________________________5**See Using the DS3900's General-Purpose Bit I/O Signals section.D S 3900Serial Communications Module For Evaluation Kits 6_____________________________________________________________________Using the DS3900 with 2-Wire DevicesThere are two modes that can be used to communicate with 2-wire devices. There is an individual command mode that allows the PC to control exactly what is writ-ten over the 2-wire bus, and a packet-based mode that automatically sends the start, device address, data address, and the stop commands.When using the individual command mode, the PC sends out individual commands to issue 2-wire start conditions, stop conditions, write data, and read data with or without acknowledgement. After each command is sent, the DS3900 executes the command and returns the individual 2-wire command's acknowledgement code. If an error occurs, the DS3900 will return 0xF A.For a complete listing of commands see Table 1.To help with using the individual commands, two exam-ples showing writing to and reading from a DS1803 are shown in Tables 4 and 5. The assumption made for addressing the DS1803 is that all three addressing pins (A0, A1, and A2) are grounded. Packet mode was added in revision 2.0 of the firmware, and it is support-ed by 3 new commands: Set Packet Device Address (0xA5); Packet Write (0x8%); and Packet Read (0x9%).The Set Packet Device Address command is used to set the 2-wire device address used by the Packet Read and Packet Write commands. The Set Packet Device Address command should be called before any packet reads or writes to ensure that communications are initi-ated at the intended device address. Once the packet device address is set, it will remain set until it is changed again by calling the Set Packet Device Address function, or the power is cycled. Upon initial power-up, this value is indeterminate, so it should be reset to the desired value when there is any doubtchanged, the DS3900 will return an acknowledgement of 0xB5, and if an error occurs, 0xFA will be returned. Note:The value sent to the DS3900 with the Set Packet Device Address command should always be an even value (e.g. 0xA0, 0xA2). The DS3900 automatically controls the read/write bit of the device address during packet read and write operations. Failure to send even values will result in communication problems.The Packet Write command allows up to 16 data bytes to be sent from the PC to a 2-wire device with a single command. The data will be written to the device address set using the Set Packet Device Address com-mand. To initiate a Packet Write command, the first byte sent to the DS3900 is 0x8%, where % is one less than the number of bytes to be written (e.g. 0x80 hex writes one byte). The second byte sent to the DS3900is the starting memory address to write the data, which is followed immediately by %+1 data bytes. Once the DS3900 has received the entire packet of data, it will begin sending it to the 2-wire device. The Packet Write command monitors the 2-wire communication to ensure that the 2-wire device is acknowledging every byte of the data transmission. If every byte of the Packet Write is acknowledged, the DS3900 sends 0x8% back to the PC. If all bytes are not acknowledged, the DS3900returns 0xFA.Because the Packet Write forces the following order of events during the 2-wire communication to be: start condition, write the device address, write the memory address, write the data[1...16], stop condition, it may not work with all devices. Use the individual 2-wire commands if the packet write is not compatible with a particular 2-wire device.Table 2. Bit I/O AddressesTable 3. DS3900 RevisionsDS3900Serial Communications ModuleFor Evaluation Kits_____________________________________________________________________7Example: Sending the byte sequence {0x82, 0x20,0x45, 0x67, 0x89} to DS3900 causes it to:1.Send a 2-wire Start condition.2.Write the device address R/W =0 (previously setusing Set Packet Device Address).3.Write the memory address (0x20).4.Write data 0x45 (to address 0x20).5.Write data 0x67 (to address 0x21).6.Write data 0x89 (to address 0x22).7.Send a 2-wire Stop condition.8.If the 2-wire device acknowledges all bytes of the data transmission, the DS3900 will return (0x82);otherwise it will return an error code (0xFA).The Packet Read command allows up to 16 data bytes to be read with a single 2-byte instruction. The read operation will be sent to the device operating at the device address set using the Set Packet Device Address command. The first byte sent for a Packet Read command is 0x9%, where % is one less than the number of bytes to read (e.g. 0x95 reads 6 bytes). The second byte sent determines the memory address to begin reading from within the device that is being addressed. After the second byte is received, the DS3900 will begin a dummy write cycle that will address the part as if writing, and write out the deviceaddress followed by the memory address. Then a restart condition is generated, and the device's read address is sent to start the read operation. The DS3900will begin reading the data from the 2-wire part and sending it back to the PC. The DS3900 will acknowl-edge all but the last data byte sent from the 2-wire part.The last byte is Not Acknowledged, which is a standard 2-wire practice. Once it has read %+1 data bytes and sent them to the PC, the DS3900 will send 0x9% if the read occurred without error, or 0xF A if a problem did occur.Example: Sending the byte sequence {0x91, 0x20} to the DS3900 will cause it to:1.Send a 2-wire Start command.2.Write the device address R/W =0 (set previouslyusing Set Packet Device Address).3.Write the memory address 0x20.4.Send a 2-wire Start command (repeated-start).5.Write the device address R/W =1 (set previouslyusing Set Packet Device Address).6.Read the data (at address 0x20), send 2-wireAcknowledge on 9th clock cycle, and send the data read back to the PC.7.Read the data (at address 0x21), send 2-wire NotAcknowledge on 9th clock cycle, and send the data read back to the PC.Table 4. Example of Writing to a DS1803D S 3900Serial Communications Module For Evaluation Kits 8_____________________________________________________________________8.Send a 2-wire Stop command.9.If the transmission occurred without errors detect-ed, return the command acknowledgement (0x91),else return the error code (0xFA).Because the Packet Read command assumes that the memory address should be sent out with a dummy write cycle before a restart with the read device address, it may not work with some devices. In cases where it is not appropriated, use the individual 2-wire commands.Resetting the 2-Wire BusThe only 2-wire command that is in Table 1 and not list-ed in either example of the 2-wire section is toggle SCL nine times. This is used to reset the 2-wire bus in the event that there is a communications breakdown while the slave is holding SDA low.When a slave holds SDA low, a stop command cannot be issued since it requires SDA to transition from low-to-high while the clock is high. F or the transition from low-to-high to happen, both the slave and the master have to release their SDA pulldown transistors. To reset the bus, send out the command to toggle SCL nine times followed by a stop command. This clocks the 2-wire bus nine times, so if a read operation was dis-turbed, the slave is clocked until it is expecting acknowledgement from the master. At the time it isexpecting acknowledgement, it releases the bus, and is clocked at least once more, providing a NAck condi-tion. Once the nine clock cycles are sent, the slave should no longer be controlling SDA signal. This allows the DS3900 to issue a stop command. When the stop command occurs, all slaves on the 2-wire bus should respond to their addresses.The Pulse CommandsThe pulse commands enable or disable the pulse func-tion, and set the pulse rate to either fast (7.37Hz) or slow (0.92Hz). If P3 was last used as an input, P3 must be written to either a 1 or a 0 to make it appear as an out-put for the pin to toggle. If left as an input, the register controlling P3 will toggle, but the pin will not because the driver is not enabled. On power-up P3 is set to an output, and the pulse will begin at the slow ing the DS3900’s General-Purpose Bit I/O Signals Reading and writing individual DS3900 pins is done by using the bit I/O commands 0xE# and 0xF# respective-ly, where # (Table 2) represents an individual pin on the DS3900. For example, the command 0xE2, places the P2 output driver in a high-impedance state and reads the pin as an input.Writing to a pin sets it to the desired state and leaves it there until it is written to the opposite state or a read command issued. When a read is performed, the driverTable 5. Example of Reading from a DS1803DS3900Serial Communications ModuleFor Evaluation Kits_____________________________________________________________________9is tristated and the input is read. The pin remains in a high-impedance state until a write operation is per-formed. As mentioned before, all I/O pins, except P3,are inputs on power-up.Note:If an I/O pin is being used for both reads and writes, take care to avoid bus contention.Since software can only change a single pin at a time,the DS3900 is much slower when communicating using the bit I/O commands. F or some applications, this is acceptable since the 57600 baud communications along with the streamline 2-byte command system allow pins to be changed hundreds of times a second. If the design requires higher performance than 100s of pin changes per second the DS3900 may not be a good choice for that general-purpose bit I/O application.Application InformationDecoupling the DS3900’s V CC SupplyThe DS3900 has decoupling on its PC board, but due to the high periodic current draw of the RS232 transceiver.It is recommended to place a decoupling capacitor (47µF, Tantalum capacitor) next to the connector on the board that the DS3900 will be mounted.Using the Integral PullupsMoving the switches to the on (labeled “ON” on the switch) position enables the integral pullups. This con-nects 4.7k Ωpullup resistors to the SDA and SCL buses, and it eliminates the need to place external pullup resistors on the application board for 2-wirecommunication. In the event that the application board already has pullups present, disconnect the integral pullups by placing the switches in the off position. This eliminates the extra (unnecessary) pullup strength,because having both the integral pullup and the appli-cation board’s pullup on at the same time could poten-tially cause problems for either the DS3900 or the 2-wire slaves, which are required to pull the buses low.Additionally, when P10 and P11 are used as bit I/O pins, it can be advantageous to disconnect the pullups to reduce the through current when either signal is dri-ven low. For bit I/O operations, writing the signal to a ‘1’enables a PMOS driver that drives the signal high.However, it is also possible to use P10 and P11 as open-collector I/O pins by enabling the pullups and performing only read and write ‘0’ operations. As long as a ‘1’ is never written to P10 or P11 it appears as an open-collector output. This is how the firmware manufac-tures the open-collector output for the 2-wire interface.Intended UseThe DS3900 module and the bundled software are intended only to be used to evaluate Maxim and Dallas Semiconductor’s integrated circuits. The software is pro-vided “as is”, without warranty of any kind, express or implied, including but not limited to the warranties of merchantability, fitness for a particular purpose and non-infringement. In no event shall Dallas Semiconductor be liable for any claim, damages or other liability, whether in an action of contract, tort or otherwise, arising from, out of, or in connection with the software or the use or other dealings in the software.D S 3900Serial Communications Module For Evaluation Kits 10____________________________________________________________________For technical support email MixedSignal.Apps@.DS3900For Evaluation Kits____________________________________________________________________11Figure 2. DS3900 SchematicD S 3900For Evaluation Kits 12____________________________________________________________________TOP LAYOUTP1P2P3(N.C.) RESETGND GNDP4P5P11P10GND V CC P9P6P8P7BOTTOM LAYOUTDS3900For Evaluation Kits____________________________________________________________________13Figure 4. DS3900 DimensionsNote:The DS3900 mates with standard 2.54mm (0.100in) 2 x 8 male header connectors. These connectors do not come standard with the board (see Figure 5).D S 3900For Evaluation Kits 14____________________________________________________________________Figure 5. Recommended PC Board Connection for DS3900DS3900For Evaluation KitsMaxim cannot assume responsib ility for use of any circuitry other than circuitry entirely emb odied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________15©2004 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.is a registered trademark of Dallas Semiconductor Corporation.Typical Operating Circuit。