IRM-8753K-1;中文规格书,Datasheet资料

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IRM-8751K-1;中文规格书,Datasheet资料

InfraredRemote ControlReceiver ModuleIRM-8751K-1Features‧ High protection ability against EMI.‧ Circular lens to improve the receive characteristic. ‧ Line-up for various center carrier frequencies. ‧ Low voltage and low power consumption.‧ High immunity against ambient light. ‧ Photodiode with integrated circuit.‧ TTL and CMOS compatibility. ‧ Long reception distance. ‧ High sensitivity. ‧ Pb free1 23DescriptionThe IRM-8751K-1 device are miniature type infrared remote control system receiver which has been developed and designed by utilizing the most updated IC technology.Pin Configuration1. OUT2. GND3. V SThe PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as an IR filter.The demodulated output signal can directly be decoded by a microprocessor.Applications• Light detecting portion of remote control• AV instruments such as Audio, TV, VCR, CD, MD, etc. • Home appliances such as Air-conditioner, Fan, etc. • The other equipments with wireless remote control. • CATV set top boxes • Multi-media EquipmentBlock DiagramApplication CircuitRC Filter should be connected closely between Vcc pin and GND pin.Infrared Remote ControlReceiver ModuleIRM-8751K-1Parts TablePackage Dimenstions(Dimensions in mm)Notes:Tolerances unless dimensions ±0.3mm.Infrared Remote ControlReceiver ModuleIRM-8751K-1 Absolute Maximum Ratings (T a=25°C)Parameter Symbol Rating UnitSupply Voltage Vcc 6 VOperating Temperature Topr -25 ~ +85 ℃Storage Temperature Tstg -40 ~ +85 ℃Soldering Temperature *1Tsol 260 ℃*1 4mm from mold body less than 10 secondsElectro-Optical Characteristics (Ta=25℃ and Vcc=5.0V)Parameter SymbolMIN.TYP.MAX.UnitCondition Consumption Current Icc --- --- 2 mA No signal input B.P.F Center Frequency Fo --- 33 --- KHz Peak Wavelength λp--- 940 --- nmL08 --- ---Reception DistanceL45 4 --- ---mHalf Angle(Horizontal) Θh--- 45 --- deg At the ray axis*2.Half Angle(Vertical) Θv--- 45 --- degHigh Level Pulse Width T H400 --- 800 μs Low Level Pulse Width T L400 --- 800 μs At the ray axis*3.High Level Output Voltage V H 4.5 --- --- V Low Level Output Voltage V L --- 0.2 0.5 V*2. The ray receiving surface at a vertex and relation to the ray axis in the range of θ=0° and θ=45°. *3. A range from 30cm to the arrival distance. Average value of 50 pulses.Infrared Remote ControlReceiver ModuleIRM-8751K-1Test MethodThe specified electro-optical characteristics is satisfied under the following Conditions at the controllable distance.1. Measurement placeA place that is nothing of extreme light reflected in the room. 2. External lightProject the light of ordinary white fluorescent lamps which are not high Frequency lamps and must be less then 10 Lux at the module surface. (Ee 10L ≦ux)3. Standard transmitterA transmitter whose output is so adjusted as to Vo=400mVp-p and the output Wave form shown inFig.-1.According to the measurement method shown in Fig.-2 the standard transmitter is specified. However, the infrared photodiode to be used for the transmitter should be λp=940nm,Δλ=50nm. Also, photodiode isused of PD438B (Vr=5V). (Standard light / Light source temperature 2856°K). 4. Measuring system According to the measuring system shown in Fig.-3Fig.-1 Transmitter Wave Form D.U.T output PulseFig.-2 Measuring Method Fig.-3 Measuring SystemInfrared Remote ControlIRM-8751K-1Receiver ModuleInfrared RemotePacking Quantity1000 pcs / Box10 Boxes / CartonInfrared Remote ControlIRM-8751K-1 Receiver ModuleDISCLAIMER1. Above specification may be changed without notice. EVERLIGHT will reserve authority on material changefor above specification.2. When using this product, please observe the absolute maximum ratings and the instructions for useoutlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.3. These specification sheets include materials protected under copyright of EVERLIGHT. Reproduction inany form is prohibited without the specific consent of EVERLIGHT.分销商库存信息: EVERLIGHTIRM-8751K-1。

克罗韦尔 875 电容式接近传感器技术数据表

Technical DataOriginal Instructions875 Capacitive Proximity SensorsBulletin Number 875F, 875LSummary of ChangesThis publication contains the following new or updated information. This list includes substantive updates only and is not intended to reflect all changes.Topic Page875L DC Tubular IO-Link Capacitive Proximity Sensors2875L AC Tubular Capacitive Proximity Sensors6875F DC Rectangular Capacitive Proximity Sensors9Topic PageAdded product photos and updated 875L DC Tubular IO-Link Capacitive Proximity Sensors specification table2Added product photos to 875L AC Tubular Capacitive Proximity Sensors specification table6Updated Product Selection table7Added product photos to 875F DC Rectangular Capacitive Proximity Sensors specification table92Rockwell Automation Publication 875-TD001C-EN-P - October 2022875L DC Tubular IO-Link Capacitive Proximity SensorsSpecificationsAttributeValue Housing materialPlastic PBTRated operating distance (Sn)•875L-M8xx 18 (flush type): 0…8 mm (0…0.31 in.); adjustable distance 2…10 mm (0.08…0.39 in.)•875L-N12xx 18 (non-flush type): 0…12 mm (0…0.47 in.); adjustable distance 3…15 mm (0.12…0.59 in.)•875L-M16xx 30 (flush type): 0…16 mm (0…0.63 in.); adjustable distance 2…20 mm (0.08…0.79 in.)•875L-N25xx 30 (non-flush type): 0…25 mm (0…0.98 in.); adjustable distance 4…30 mm (0.16…1.18 in.)SensitivityAdjustable by potentiometer, external teach or by IO-Link settings •Potentiometer disabled •Potentiometer enabled •External teachFactory settings: Potentiometer enabled Effective operation distance (Sr)0.9 x Sn ≤ Sr ≤ 1.1 x Sn Usable operation distance (Su) 0.85 x Sr ≤ Su ≤ 1.15 x Sr Switching frequency 50 Hz Repeat accuracy (R)≤5%Hysteresis (H)Adjustable by IO-Link (1…100%)•875L-M8xx 18 factory settings: Typical 6%•875L-N12xx 18 factory settings: Typical 15% •875L-M16xx 30 factory settings: Typical 7%•875L-N12xx 18 factory settings: Typical 15%Rated operational volt (UB)10…40V DC (ripple included)Ripple≤10%Rated operating current (Ie) ≤200 mA (continuous)No load supply current (Io)≤20 mA Rated insulation voltage (UI)50V DC Power-ON delay (tv)≤300 ms Operational current (Im), min >0.5 mAVoltage drop (Ud)≤1.0V DC @ 200 mA DC Protection •Short circuit •Reverse polarity •Transients Power ON delay ≤300 ms Degree of protection•IP67•IP68/60 min•IP69K (NEMA 1, 2, 4, 4X, 5, 6, 6P, 12)•ECOLABTemperature •Operating: -30…+85 °C (-22…+185 °F)•Storage: -40…+85 °C (-40…+185 °F)Humidity rangeOperating and storage: 35…95%DC Micro Quick Disconnect Style18 mm and 30 mm Shielded and UnshieldedDC Cable Style 18 mm and 30 mm Shielded and UnshieldedRockwell Automation Publication 875-TD001C-EN-P - October 20223875 Capacitive Proximity Sensors Technical Data875L DC 18 mm (0.71 in.) Diameter SensorsProduct SelectionApproximate DimensionsDimensions are shown in mm (in.). Dimensions are not intended to be used for manufacturing purposes.Cat. No. (1)(1)All units come with two nuts to secure the unit on the mounting bracket.Barrel DiameterShieldedOutput Polarity ConnectionWiring DiagramDimensions875L-M8NP18-A218 mm (0.71 in.)YesN.O.PNP 2 m (6.6 ft) PVC cableFigure 10 on page 5Figure 1875L-M8NN18-A2NPN Figure 12 on page 5875L-M8CP18-A2N.C.PNP Figure 9 on page 5875L-M8CN18-A2NPN Figure 11 on page 5875L-M8NP18-D4N.O.PNP M12 Micro QDFigure 10 on page 5Figure 2875L-M8NN18-D4NPN Figure 12 on page 5875L-M8CP18-D4N.C.PNP Figure 9 on page 5875L-M8CN18-D4NPN Figure 11 on page 5875L-N12NP18-A2NoN.O.PNP 2 m (6.6 ft) PVC cableFigure 10 on page 5Figure 3875L-N12NN18-A2NPN Figure 12 on page 5875L-N12CP18-A2N.C.PNP Figure 9 on page 5875L-N12CN18-A2NPN Figure 11 on page 5875L-N12NP18-D4N.O.PNP M12 Micro QDFigure 10 on page 5Figure 4875L-N12NN18-D4NPN Figure 12 on page 5875L-N12CP18-D4N.C.PNP Figure 9 on page 5875L-N12CN18-D4NPNFigure 11 on page 5Figure 1 - Shielded 18 mm (0.71 in.) with Cable [mm (in.)]Figure 2 - Shielded 18 mm (0.71 in.) with M12 Micro QD [mm (in.)]Figure 3 - Unshielded 18 mm (0.71 in.) with Cable [mm (in.)][mm(in.)]4Rockwell Automation Publication 875-TD001C-EN-P - October 2022875 Capacitive Proximity Sensors Technical Data875L DC 30 mm (1.81 in.) Diameter SensorsProduct SelectionApproximate DimensionsDimensions are shown in mm (in.). Dimensions are not intended to be used for manufacturing purposes.Cat. No. (1)(1)All units come with two nuts to secure the unit on the mounting bracket.Barrel DiameterShieldedOutput Polarity ConnectionWiring DiagramDimensions875L-M16NP30-A230 mm (1.81 in.)YesN.O.PNP 2 m (6.6 ft) PVC cableFigure 10 on page 5Figure 5875L-M16NN30-A2NPN Figure 12 on page 5875L-M16CP30-A2N.C.PNP Figure 9 on page 5875L-M16CN30-A2NPN Figure 11 on page 5875L-M16NP30-D4N.O.PNP M12 Micro QDFigure 10 on page 5Figure 6875L-M16NN30-D4NPN Figure 12 on page 5875L-M16CP30-D4N.C.PNP Figure 9 on page 5875L-M16CN30-D4NPN Figure 11 on page 5875L-N25NP30-A2NoN.O.PNP 2 m (6.6 ft) PVC cableFigure 10 on page 5Figure 7875L-N25NN30-A2NPN Figure 12 on page 5875L-N25CP30-A2N.C.PNP Figure 9 on page 5875L-N25CN30-A2NPN Figure 11 on page 5875L-N25NP30-D4N.O.PNP M12 Micro QDFigure 10 on page 5Figure 8875L-N25NN30-D4NPN Figure 12 on page 5875L-N25CP30-D4N.C.PNP Figure 9 on page 5875L-N25CN30-D4NPNFigure 11 on page 5Figure 5 - Shielded 30 mm (1.81 in.) with Cable [mm (in.)]Figure 6 - Shielded 30 mm (1.81 in.) with M12 Micro QD [mm (in.)]Rockwell Automation Publication 875-TD001C-EN-P - October 20225875 Capacitive Proximity Sensors Technical Data875L DC Wiring DiagramsFigure 9 - Sourcing N.C.Figure 10 - Sourcing N.O.Figure 11 - Sinking N.C.Figure 12 - Sinking N.O.875L AC Tubular Capacitive Proximity SensorsSpecificationsAttribute ValueHousing material Plastic PBTRated operating dist. (Sn)•875L-F8x18: 3…8 mm (0.12…0.31 in.) - factory set at 8 mm (0.31 in.)•875L-G12x18: 3…12 mm (0.12…0.47 in.) - factory set at 12 mm (0.47 in)•875L-F16x30: 2…16 mm (0.08…0.63 in.) - factory set at 16 mm (0.63 in.)•875L-G25x30: 4…25 mm (0.16…0.98 in.) - factory set at 25 mm (0.98 in.)Sensitivity270° turn potentiometer (adjustable) Effective operation distance (Sr)0.9 x Sn ≤ Sr ≤ 1.1 x SnUsable operation distance (Su)0.8 x Sr ≤ Su ≤ 1.2 x Sr Switching frequency10 HzRepeat accuracy (R)≤5%Hysteresis (H)4…20% of sensing distance Rated operational volt (UB)20…250V AC (ripple included) Ripple≤10%Rated operating current (Ie)•Continuous: ≤500 mA •Short-time: <2.5 A (20 ms, max)Load current, min10 mAVoltage drop (Ud)≤10V AC (at loads ≥20 mA) Protection TransientsPower ON delay≤100 msFrequency of operating cycles (f)10 HzIndication for output ON Yellow status indicator Degree of protection IP67 (NEMA 1, 3, 4, 6, 13)Temperature •Operating: -25…+80 °C (-13…+176 °F)•Storage: -40…+85 °C (-40…+185 °F)AC Micro Quick Disconnect Style18 mm and 30 mmShielded and UnshieldedAC Cable Style18 mm and 30 mmShielded and Unshielded6Rockwell Automation Publication 875-TD001C-EN-P - October 2022Rockwell Automation Publication 875-TD001C-EN-P - October 20227875 Capacitive Proximity Sensors Technical Data875L 2-wire AC 18 mm (0.71 in.) and 30 mm (1.81 in.) Diameter SensorsProduct SelectionApproximate DimensionsDimensions are shown in mm (in.). Dimensions are not intended to be used for manufacturing purposes.Cat. No. (1)(1)All units come with two nuts to secure the unit on the mounting bracket.Barrel DiameterShieldedOutput Connection Wiring Diagram Dimensions 875L-F8N18-A218 mm (0.71 in.)YesN.O. 2 m (6.6 ft) PVC cableFigure 21 on page 8Figure 13875L-F8C18-A2N.C.Figure 22 on page 8875L-F8N18-R3N.O.AC Micro QD Figure 21 on page 8Figure 14875L-F8C18-R3N.C.Figure 22 on page 8875L-G12N18-A2NoN.O. 2 m (6.6 ft) PVC cableFigure 21 on page 8Figure 15875L-G12C18-A2N.C.Figure 22 on page 8875L-G12N18-R3N.O.AC Micro QD Figure 21 on page 8Figure 16875L-G12C18-R3N.C.Figure 22 on page 8875L-F16B30-A230 mm (1.81 in.)YesN.O. or N.C. 2 m (6.6 ft) PVC cableFigure 23 on page 8Figure 17 on page 8875L-F16B30-R3AC Micro QD Figure 23 on page 8Figure 18 on page 8875L-G25B30-A2NoN.O. or N.C.2 m (6.6 ft) PVC cableFigure 23 on page 8Figure 19 on page 8875L-G25B30-R3AC Micro QDFigure 23 on page 8Figure 20 on page 8Figure 13 - AC Shielded 18 mm (0.71 in.) with Cable [mm (in.)]Figure 14 - AC Shielded 18 mm (0.71 in.) with AC Micro QD [mm (in.)]Figure 15 - AC Unshielded 18 mm (0.71 in.) with Cable [mm (in.)]Figure 16 - AC Unshielded 18 mm (0.71 in.) with AC Micro QD[mm (in.)]71.5 (2.81)15.5(0.61)Status IndicatorSW 24Sensit 8(0.31)6 (0.24)25 (0.98)2000 (78.74)46.5 (1.83)52.3 (2.06)M18 X 1Ø 10(0.39)Ø 5.2(0.2)1/2 - 20 UNFM18 X 1Status IndicatorSensitSW 246(0.24)46.5 (1.83)52.3 (2.06)69.3 (2.73)14.2(0.56)22.8 (0.9)Status IndicatorSensitSW 2471.5 (2.81)6(0.24)25 (0.98)2000 (78.74)46.5 (1.83)52.3 (2.06)15.5(0.61)Ø 10(0.39)Ø 5.2(0.2)8(0.31)8(0.31)M18 X 1Status Indicator1/2 - 20 UNFSensitSW 248(0.31)M18 X 16(0.24)46.5 (1.83)52.3 (2.06)69.3 (2.73)14.2(0.56)22.8(0.9)8(0.31)8Rockwell Automation Publication 875-TD001C-EN-P - October 2022875 Capacitive Proximity Sensors Technical DataApproximate DimensionsDimensions are shown in mm (in.). Dimensions are not intended to be used for manufacturing purposes.875L 2-wire AC Wiring DiagramsFigure 17 - AC Shielded 30 mm (1.81 in.) with Cable [mm (in.)]Figure 18 - AC Shielded 30 mm (1.81 in.) with AC Micro QD [mm (in.)]Figure 19 - AC Unshielded 30 mm (1.81 in.) with Cable [mm (in.)]Figure 20 - AC Unshielded 30 mm (1.81 in.) with AC Micro QD[mm (in.)]Figure 21 - Wiring Diagram - Sourcing N.O.Figure 22 - Wiring Diagram - Sourcing N.C.Figure 23 - Wiring Diagram - N.C. or N.O. Selectable50(1.97)10 (0.39)Status Indicator M30 X 1.5 X 5013.6(0.54)15.4(0.61)Ø 36(1.42)Ø 28(1.1)Status Indicator10 (0.39)M30 X 1.5 X 50Ø 36(1.42)1/2 - 20 UNFØ 28(1.1)50(1.97)13.6(0.54)15.4(0.61)Status Indicator 62(2.44)Ø 28(1.1)Ø 36(1.42)M30 X 1.5 X 5013.6(0.54)15.4(0.61)10(0.39)12(0.47)Status Indicator 62(2.44)Ø 28(1.1)Ø 36(1.42)M30 X 1.5 X 5013.6(0.54)15.4(0.61)10(0.39)12(0.47)1/2 - 20 UNFRockwell Automation Publication 875-TD001C-EN-P - October 20229875F DC Rectangular Capacitive Proximity SensorsSpecificationsAttributeValue Housing materialPlastic PBTDetection•Pipes diameter: Ø8 mm (0.31 in.), minimum •Wall thickness (factory settings):–Plastic (non-conductive plastic wall): 0.5…6 mm (0.02…0.24 in.)–Glass (non-conductive glass wall): 0.5…4 mm (0.02…0.16 in.)•Wall thickness (manual setup):≤10 mm (0.39 in.) plastic wall (best case)≤10 mm (0.39 in.) glass wall (best case)•Liquids: Water-based liquids such as water, milk, syrup, honey, milkshakes, lubricates, acids, alkaline fluids, body fluids, and other high-conductive liquids (≤50 ms)Effective operation distance (Sr)0.9 x Sn ≤ Sr ≤ 1.1 x Sn Usable operation distance (Su) 0.85 x Sr ≤ Su ≤ 1.15 x Sr Switching frequency ≤10 Hz Repeat accuracy (R)≤5%Hysteresis (H)Adjustable by IO-Link (1… 100%)•875L-M8xx 18 factory settings: Typical 6%•875L-N12xx 18 factory settings: Typical 15%•875L-M16xx 30 factory settings: Typical 7%•875L-N12xx 18 factory settings: Typical 15%Rated operational volt (UB)10…30V DC (ripple included)Ripple≤10%Output functionsNPN or PNP by sensor type Output switching function N.O. and N.C by sensor type Rated operating current (Ie)≤100 mA No load supply current (Io)≤13 mA Rated insulation voltage (UI)75V DC Power-ON delay (tv)≤300 ms Voltage drop (Ud)≤1.5VProtection•Short circuit •Reverse polarity •Transients Degree of protection•IP65•IP66•IP67•*********(4.27ft)and24hr •IP69K (NEMA 1, 2, 4, 4x, 5, 12)•ECOLABTemperature •Operating: -25…+80 °C (-13…+176 °F)•Storage: -40…+85 °C (-40…+185 °F)Humidity rangeOperating and storage: 35…95%Pigtail cable with Integral Micro QD Connector Style34 x 16 x 8 mm ShieldedDC Cable Style 34 x 16 x 8 mm Shielded875F Capacitive Proximity Sensor in Universal Mounting BracketMounting Bracket and Adhesive Pads (Supplied with Sensor)10Rockwell Automation Publication 875-TD001C-EN-P - October 2022875 Capacitive Proximity Sensors Technical Data875F DC Flat Cap SensorsProduct SelectionApproximate DimensionsDimensions are shown in mm (in.). Dimensions are not intended to be used for manufacturing purposes.875F DC Wiring DiagramsCat. No.Sensing DistanceShieldedOutput ConfigurationConnectionWiring Diagram Dimensions875F-M10NP34-A2Out of box wall thickness:Plastic 0.5…6 mm (0.02…0.24 in.)Glass 0.5…4 mm (0.02…0.16 in.)Best Case (Taught) 10 mm (0.39 in.)Yes N.O.PNP2 m (6.6 ft.) PVC cableFigure 27Figure 24875F-M10NN34-A2NPN Figure 29875F-M10CP34-A2N.C.PNPFigure 26875F-M10CN34-A2NPN Figure 28875F-M10NP34-FP02N.O.PNP152 mm (6 in.) PVC cable with M8 pico quick disconnectFigure 27875F-M10NN34-FP02NPN Figure 29875F-M10CP34-FP02N.C.PNPFigure 26875F-M10CN34-FP02NPNFigure 28Figure 24 - SensorFigure 25 - Mounting BracketFigure 26 - Sourcing N.C.Figure 27 - Sourcing N.O.Figure 28 - Sinking N.C.Figure 29 - Sinking N.O.Pin Color Description 1BN (Brown)Supply (V+)2WH (White)Teach input 3BU (Blue)Supply (V-)4BK (Black)OutputIMPORTANTWhen not used, permanently connect the teach wire to V-.1.13416.3 3.6 6.6Rockwell Automation Publication 875-TD001C-EN-P - October 202211875 Capacitive Proximity Sensors Technical DataAdditional ResourcesThese documents contain additional information concerning related products from Rockwell Automation.You can view or download publications at rok.auto/literature .ResourceDescription Capacitive Sensors User Manual, publication 875-UM001Provides guidance on installation, configuration, and use for Bulletin 875F and 875L capacitive proximity sensors with IO-Link.Rectangular Capacitive Sensors Installation Instructions, publication 875F-IN001Describes how to install a rectangular capacitive sensor.System Security Design Guidelines Reference Manual, SECURE-RM001Provides guidance on how to conduct security assessments, implement Rockwell Automation products in a secure system, harden the control system, manage user access, and dispose of equipment.UL Standards Listing for Industrial Control Products, publication CMPNTS-SR002Assists original equipment manufacturers (OEMs) with construction of panels, to help ensure that they conform to the requirements of Underwriters Laboratories.American Standards, Configurations, and Ratings: Introduction to Motor Circuit Design, publication IC-AT001Provides an overview of American motor circuit design based on methods that are outlined in the NEC.Industrial Components Preventive Maintenance, Enclosures, and Contact Ratings Specifications, publication IC-TD002Provides a quick reference tool for Allen-Bradley industrial automation controls and assemblies.Safety Guidelines for the Application, Installation, and Maintenance of Solid-state Control, publication SGI-1.1Designed to harmonize with NEMA Standards Publication No. ICS 1.1-1987 and provides general guidelines for the application, installation, and maintenance of solid-state control in the form of individual devices or packaged assemblies incorporating solid-state components.Industrial Automation Wiring and Grounding Guidelines, publication 1770-4.1Provides general guidelines for installing a Rockwell Automation industrial system.Product Certifications website, rok.auto/certifications .Provides declarations of conformity, certificates, and other certification details.Publication 875-TD001C-EN-P - October 2022Supersedes Publication 875-TD001B-EN-P - September 2022Copyright © 2022 Rockwell Automation, Inc. All rights reserved. Printed in the U.S.A.Rockwell Automation SupportUse these resources to access support information.Documentation FeedbackYour comments help us serve your documentation needs better. If you have any suggestions on how to improve our content, complete the form at rok.auto/docfeedback .Technical Support CenterFind help with how-to videos, FAQs, chat, user forums, Knowledgebase, and product notification updates.rok.auto/support Local Technical Support Phone NumbersLocate the telephone number for your country.rok.auto/phonesupport Technical Documentation CenterQuickly access and download technical specifications, installation instructions, and user manuals.rok.auto/techdocs Literature LibraryFind installation instructions, manuals, brochures, and technical data publications.rok.auto/literature Product Compatibility and Download Center (PCDC)Download firmware, associated files (such as AOP, EDS, and DTM), and access product release notes.rok.auto/pcdc Rockwell Automation maintains current product environmental compliance information on its website at rok.auto/pec .Allen-Bradley, expanding human possibility, and Rockwell Automation are trademarks of Rockwell Automation, Inc.Trademarks not belonging to Rockwell Automation are property of their respective companies.Rockwell Otomasyon Ticaret A.Ş. Kar Plaza İş Merkezi E Blok Kat:6 34752, İçerenköy, İstanbul, Tel: +90 (216) 5698400 EEE Yönetmeliğine Uygundur。

JM875 AC Current Probe模型的用户指南说明书

®I N S T R U M E N TSAC Current Probe Model JM875User ManualDESCRIPTIONThe JM875 (Catalog #2110.89) is designed for use in industrial environments. The “squared” jaws permit multiple conductor or bus bar positioning. The voltage output makes it the perfect tool for measurement with DMMs, recorders, power and harmonic meters. Three ranges allow you to obtain the best resolution even on low current measurement. The Model JM875 is compatible with any AC voltmeter, multimeter, or other voltage measuring instrument with an input impedance greater than 1 M . To achieve the stated accuracy, use the JM875 with a voltmeter having an accuracy of 0.75%.WARNINGThese safety warnings are provided to ensure the safety of personnel and proper operation of the instrument.•Read the instruction manual completely and follow all the safety information before attempting to use or service this instrument. •Use caution on any circuit: Potentially high voltages and currents may be present and may pose a shock hazard. •Read the Safety Specifications section prior to using the current probe. Never exceed the maximum voltage ratings given.• Safety is the responsibility of the operator.•ALWAYS connect the current probe to the display device before clamping the probe onto the sample being tested. •ALWAYS inspect the instrument, probe, probe cable, and output terminals prior to use. Replace any defective parts immediately. •NEVER use the current probe on electrical conductors rated above 600 V in overvoltage category III (CAT III). Use extreme caution when clamping around bare conductors or bus bars. INTERNATIONAL ELECTRICAL SYMBOLSThis symbol signifies that the current probe is protected by double or reinforced insulation. Use only factory specified replacement parts when servicing the instrument.This symbol signifies CAUTION! and requests that the user refer to the user manual before using the instrument.This is a type A current sensor. This symbol signifies that application around and removal from HAZARDOUS LIVE conductors is permitted.DEFINITION OF MEASUREMENT CATEGORIESCat. II: For measurements performed on circuits directly connected to the electrical distribution system.Examples are measurements on household appliances or portable tools. Cat. III: For measurements performed in the building installation at the distribution level such as onhardwired equipment in fixed installation and circuit breakers.Cat. IV: For measurements performed at the primary electrical supply (<1000V) such as on primaryovercurrent protection devices, ripple control units, or meters. RECEIVING YOUR SHIPMENTUpon receiving your shipment, make sure that the contents are consistent with the packing list. Notify your distributor of any missing items. If the equipment appears to be damaged, file a claim immediately with the carrier and notify your distributor at once, giving a detailed description of any damage .ELECTRICAL SPECIFICATIONS Current Range:100mA to 30A AC continuous cycle1 to 300A AC continuous cycle1 to 2000A AC continuous cycle for the full temperature range(2800 A if temperature is < 35°C or 95°F) Output Signal:100mV AC/A AC (3V at 30A) 90A peak10mV AC/A AC (3V at 300A) 900A peak 1mV AC/A AC (3V at 3000A) 9000A peak Accuracy and Phase Shift*:30A RANGEPrimary current 1.5A 6A 30A Accuracy % 2% ± 10mV (0.5A) Phase shift 15° 7° 5° Probe Impedance: 1000Ω300A RANGEPrimary current 15A 60A 300A Accuracy % 2% ± 2mV (0.2mA) Phase shift 3° 1.5° 1° Probe Impedance: 100Ω3000A RANGEPrimary current 150A 600A 3000A Accuracy % 2% ± 0.5 mV Phase shift 1.5° 1° 0.5° Probe Impedance: 10Ω(*Reference conditions: 23°C±3°K, 20 to 85% RH, 48 to 65 Hz, external magnetic field < 40 A/m, no DC component, no external current carrying conductor, test sample centered.) Load impedance ≥ 1 MΩ.Overload: 3200 A during 5 mnAccuracy: Per IEC 185-26-27Ampere Second Product: 100 A.sdV/Dt: 100 mV AC/A AC: dV/Dt = 400 mV/µs10 mV AC/A AC: dV/Dt = 50 mV/µs1 mV AC/A AC: dV/Dt - 5 mV/µs Frequency Range: 30Hz to 5kHz; current derating above 200Hz on the 3000A range Load Impedance: > 100kΩWorking Voltage: 600V ACCommon Mode Voltage: 600V ACOpen Secondary Voltage: 10V Max. Influence of Adjacent Conductor:0.005A/A ACInfluence of Conductor in Jaw Opening: 1.5% of readingInfluence of Frequency from 30Hz to 5kHz: ± 6% on all rangesInfluence of DC Current: 0.05% per A DCMECHANICAL SPECIFICATIONS Operating Temp.: 14° to 122°F (-10° to 50°C) Storage Temp.: -40° to 185°F (-40° to 85°C) Influence of Temperature: < 0.1% per 10°K Jaw Opening: 3.54" (90mm)Maximum Conductor Size:Cable: 2.52" ∅ max. (64mm)Bus bar: 1.97 x 5.31" (50 x 135mm)2.52 x3.94" (64 x 100mm)Envelope Protection: IP 20 (IEC 529)Drop Test: 500mm (IEC 68-2-32)Mechanical Shock: 100 g (IEC 68-2-27) Vibration: 10/55/10Hz, 0.15 mm (IEC 68-2-6) Polycarbonate Material:Handles:10% fiberglass chargedpolycarbonate UL 94 V0Jaws: ABS UL 94 V2Dimensions:4.72 x 12.40 x 1.89" (120 x 315 x 48 mm) Weight: 2.65 lbs. (1200 g)Colors: Dark gray handles with red jaws Output:Two standard safety banana jacks (4 mm) SAFETY SPECIFICATIONSElectrical:Double insulation or reinforced insulation between primary or secondary and outer case of handle upon IEC 1010-2-32Common Mode Voltage:600V Category III, Pollution: 2ORDERING INFORMATIONCurrent Probe JM875 ........................ Cat #2110.89 Accessories:Leads, set of 2, 5 ft. safety (1000V) .... Cat #2111.29 Lead No. 211 for Probe 5 A Series .....Cat #2950.06OPERATIONPlease make sure that you have already read and fully understand the WARNING section on page 1. Making Measurements with the AC Current Probe Model JM875•Connect the black and red terminals to the Volt AC range of your DMM or voltage measuring instrument. Select the appropriate voltage range. If the current magnitude is unknown, select the highest range (3000A AC / 3V AC) on the switch probe located inside the handle. Clamp the probe around the conductor to be tested. If the reading is less than 300mV or 30mV, select the lower range until you obtain the best resolution. Read the value display on the DMM (in mV) and divide it by the range selected. (If reading = 2.59V on the 10mV AC/A AC range, the current flowing through the probe is 2590mV ÷ 10 = 259A AC).•For best accuracy: carefully center the conductor inside the probe jaw, avoid if possible, the proximity of other conductors which may create noise.Tips for Making Precise Measurements•When using a current probe with a meter, it is important to select the range that provides the best resolution. Failure to do this may result in measurement errors.•Make sure that probe jaw mating surfaces are free of dust and contamination. Contaminants cause air gaps between the jaws, increasing the phase shift between primary and secondary. It is very critical for power measurement.MAINTENANCE:Warning• For maintenance use only original factory replacement parts.• To avoid electrical shock, do not attempt to perform any servicing unless you are qualified to do so.•To avoid electrical shock and/or damage to the instrument, do not get water or other foreign agents into the probe.To ensure optimum performance, it is important to keep the probe jaw mating surfaces clean at all times. Failure to do so may result in error in readings. The following is the recommended procedure for cleaning the probe jaws: Use a very fine sand paper (fine 600) to avoid scratching the jaw, then gently clean with a soft oiled cloth.REPAIR AND CALIBRATIONYou must contact our Service Center for a Customer Service Authorization number (CSA#). This will ensure that when your instrument arrives, it will be tracked and processed promptly. Please write the CSA# on the outside of the shipping container.Chauvin Arnoux®, Inc. d.b.a. AEMC® Instruments15 Faraday Drive Dover, NH 03820 USA(800)945-2362(Ext.360)•(603)749-6434(Ext.360)•***************(Or contact your authorized distributor)NOTE: All customers must obtain a CSA# before returning any instrument.TECHNICAL AND SALES ASSISTANCEIf you are experiencing any technical problems, or require any assistance with the proper use or application of this instrument, please contact our technical hotline:(800) 945-2362 (Ext. 351) • (603) 749-6434 (Ext. 351)•********************LIMITED WARRANTYThe current probe is warranted to the owner for a period of 2 year s from the date of original purchase against defects in manufacture. This limited warranty is given by AEMC®Instruments, not by the distributor from whom it was purchased. This warranty is void if the unit has been tampered with, abused or if the defect is related to service not performed by AEMC® Instruments.Full warranty coverage and product registration is available on our website at:/warranty.html.Please print the online Warranty Coverage Information for your records.99-MAN 100103.v6 02/18。

QS6M4TR;中文规格书,Datasheet资料

TransistorsRev.B 1/52.5V Drive Nch+Pch MOSFETQS6M4z StructureSilicon P-channel MOSFET Silicon N-channel MOSFETz Features1) The QS6M4 combines Pch MOSFET with a Nch MOSFET in a single TSMT6 package.2) Low on-state resistance with a fast switching. 3) Low voltage drive (2.5V).z ApplicationsLoad switch, inverterz Dimensions (Unit : mm)z Packaging specificationsz Absolute maximum ratings (T a=25°C)ParameterV DSS Symbol V GSS I D I DP I S I SP P D °C Tch °CTstgNchannel 150−55 to +150PchannelLimitsUnit ∗1 Pw ≤10µs, Duty cycle ≤1%∗2 Mounted on a ceramic boardDrain-source voltage Gate-source voltage Drain current Total power dissipation Channel temperature Storage temperatureContinuous Pulsed Continuous Source current (Body diode)Pulsed∗1V 30V ±12A ±1.5A ±6.0A 0.8A6.0W / TOTAL −20±12±1.5±6.0−0.75−6.01.25∗1∗2W / ELEMENT0.9z Thermal resistanceRth (ch-a)100ParameterSymbol Limits Unit Channel to ambient°C / W / TOTAL 139°C / W / ELEMENT∗∗ Mounted on a ceramic boardTransistorsRev.B 2/5z Electrical characteristics (T a=25°C) <Tr1. N-ch MOSFET>z Body diode characteristics (Source-Drain) <Tr1. N-ch MOSFET>V SD −− 1.2V I S =3.2A / V GS =0VParameterSymbol Min.Typ.Max.Unit Conditions∗Forward voltage∗PulsedTransistorsRev.B 3/5z Electrical characteristics (T a=25°C) <Tr2. P-ch MOSFET>z Body diode characteristics (Source-Drain) <Tr2. P-ch MOSFET>V SD−−−1.2VI S = −0.75A / V GS =0VParameterSymbol Min.Typ.Max.Unit ConditionsForward voltageTransistorsRev.B 4/5N-chz Electrical characteristic curvesDRAIN-SOURCE VOLTAGE : V DS (A)C A P A C I T A N C E : C (p F )Fig.1 Typical Capacitancevs. Drain-Source VoltageDRAIN CURRENT : I D (A)S W I T C H I N G T I M E : t (n s )Fig.2 Switching CharacteristicsTOTAL GATE CHARGE : Qg (nC)G A T E -S O U R C E V O L T A G E : V G S (V )Fig.3 Dynamic Input CharacteristicsGATE-SOURCE VOLTAGE : V GS (V)D R A I N C U R R E N T : I D (A )Fig.4 Typical Transfer CharacteristicsGATE-SOURCE VOLTAGE : V GS (V)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.5 Static Drain-SourceOn-State Resistance vs. Gate-Source VoltageSOURCE-DRAIN VOLTAGE : V SD (V)S O U R C E C U R R E N T : I s (A )Fig.6 Source Current vs.Source-Drain VoltageDRAIN CURRENT : I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.7 Static Drain-SourceOn-State Resistance vs. Drain Current (Ι)DRAIN CURRENT : I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.8 Static Drain-SourceOn-State Resistance vs. Drain Current (ΙΙ)DRAIN CURRENT : I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.9 Static Drain-SourceOn-State Resistance vs. Drain Current (ΙΙΙ)TransistorsRev.B 5/5P-chz Electrical characteristic curvesDRAIN-SOURCE VOLTAGE : −V DS (V)C A P A C I T A N C E : C (p F )Fig.1 Typical Capacitancevs. Drain-Source VoltageDRAIN CURRENT : −I D (A)S W I T C H I N G T I M E : t (n s )Fig.2 Switching CharacteristicsTOTAL GATE CHARGE : Qg (nC)G A T E -S O U R C E V O L T A G E : −V G S (V )Fig.3 Dynamic Input CharacteristicsGATE-SOURCE VOLTAGE : −V GS (V)D R A I N C U R RE N T : −I D (A )Fig.4 Typical Transfer CharacteristicsGATE-SOURCE VOLTAGE : −V GS (V)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A NC E : RD S (o n ) (m Ω)Fig.5 Static Drain-SourceOn-State Resistance vs. Gate-Source VoltageSOURCE-DRAIN VOLTAGE : −V SD (V)S O U R C E C U R R E N T : −I S (A )Fig.6 Source Current vs.Source-Drain VoltageDRAIN CURRENT : −I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.7 Static Drain-SourceOn-State Resistance vs. Drain Current (Ι)DRAIN CURRENT : −I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.8 Static Drain-SourceOn-State Resistance vs. Drain Current (ΙΙ)DRAIN CURRENT : −I D (A)S T A T I C D R A I N -S O U R C E O N -S T A T E R E S I S T A N C E : R D S (o n ) (m Ω)Fig.9 Static Drain-SourceOn-State Resistance vs. Drain Current (ΙΙΙ)Appendix1-Rev2.0Thank you for your accessing to ROHM product informations.More detail product informations and catalogs are available, please contact your nearest sales office.ROHM Customer Support SystemTHE AMERICAS / EUPOPE / ASIA / JAPANContact us : webmaster@rohm.co.jpAppendix分销商库存信息: ROHMQS6M4TR。

Datasheet MLX90614 中文数据手册 rev008

MLX90614 系列
单区视场和双区视场 TO-39 封装红外温度传感器
特性和优点
尺寸小，成本低易集成在极宽温度范围内工作，带出厂校准：传感器工作温度范围：-40…+125˚C 被测目标温度范围：-70…+380˚C Ta 和 To 在 0 到 50° C 时，测量精度可达 0.5° C 高(医疗)精度校准测量值分辨率 0.02° C 单区视场和双区视场可选 SMBus 兼容数字接口可配置 PWM 连续输出 3V 或 5V 供电，也可使用 8…16V 供电调制支持睡眠模式适合不同应用领域的多种封装方式和测试方式车用级别标准
3901090614 Rev 008
第 2ห้องสมุดไป่ตู้/ 52 页
数据手册 2013/2/28
MLX90614 系列
单区视场和双区视场 TO-39 封装红外温度传感器
3 目录
1 功能图 ........................................................................................................................................................................................................ 1 2 概述 ......................................................................................................................................................................

IRF8721TRPBF;IRF8721PBF;中文规格书,Datasheet资料

107/30/07IRF8721PbFHEXFET ®Power MOSFETBenefitsl Very Low Gate Charge l Low R DS(on) at 4.5V V GS l Low Gate Impedancel Fully Characterized Avalanche Voltage and Currentl 20V V GS Max. Gate Rating l Lead-Free Applicationsl Control MOSFET of Sync-BuckConverters used for Notebook Processor Powerl Control MOSFET for Isolated DC-DC Converters in Networking Systems SO-8PD - 97119DescriptionThe IRF8721PbF incorporates the latest HEXFET Power MOSFET Silicon Technology into the industry standard SO-8 package The IRF8721PbF has been optimized for parameters that are critical in synchronous buck operation including Rds(on) and gate charge to reduce both conduc-tion and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors for Notebook and Netcom applications.IRF8721PbFStatic @ T = 25°C (unless otherwise specified)IRF8721PbF 3Fig 4. Normalized On-ResistanceVs. TemperatureFig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics Fig 3. Typical Transfer CharacteristicsV DS , Drain-to-Source Voltage (V)T J , Junction Temperature (°C)R D S (o n ) , D r a i n -t o -S o u r c e O n R e s i s t a n c e(N o r m a l i z e d )V GS , Gate-to-Source Voltage (V)V DS , Drain-to-Source Voltage (V)IRF8721PbFFig 8. Maximum Safe Operating AreaFig 6. Typical Gate Charge Vs.Gate-to-Source VoltageFig 5. Typical Capacitance Vs.Drain-to-Source VoltageFig 7. Typical Source-Drain DiodeForward Voltage110100V DS , Drain-to-Source Voltage (V)100100010000C , C a p a c i t a n c e (p F )0.11101001000I S D , R e v e r s e D r a i n C u r r e n t (A )0.1110100V DS , Drain-to-Source Voltage (V)0.11101001000I D , D r a i n -t o -S o u r c e C u r r e n t (A)510152025Q g , Total Gate Charge (nC)0481216V G S , G a t e -t o -S o u r c e V o l t a g e (V )IRF8721PbF 5Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-AmbientFig 9. Maximum Drain Current Vs.Case TemperatureFig 10. Threshold Voltage Vs. Temperature255075100125150T A , Ambient Temperature (°C)0481216I D , D r a i n C u r r e n t (A)T J , Temperature ( °C )V G S (t h ) G a t e t h r e s h o l d V o l t a g e (V )t 1, Rectangular Pulse Duration (sec)T h e r m a l R e s p o n s e ( Z t h J A )Fig 13. Maximum Avalanche Energyvs. Drain CurrentFig 12. On-Resistance vs. Gate VoltageFig 15b. Switching Time WaveformsFig 14b. Unclamped Inductive WaveformsFig 14a. Unclamped Inductive Test CircuitI ASFig 15a. Switching Time Test Circuit6810121416R D S (o n ), D r a i n -t o-S o u r c e O n R e s i s t a n c e (m Ω)V DDStarting T J , Junction Temperature (°C)V V d(on)rd(off)fV DDIRF8721PbF7DSCurrent Sampling ResistorsFig 16a. Gate Charge Test CircuitFig 16b. Gate Charge WaveformFig 17. Peak Diode Recovery dv/dt Test Circuit for N-ChannelHEXFET ® Power MOSFETs* V GS = 5V for Logic Level DevicesIdQgs1Qgs2Qgd QgodrIRF8721PbFSO-8 Package OutlineDimensions are shown in milimeters (inches)IRF8721PbF 9Notes:Repetitive rating; pulse width limited by max. junction temperature. Starting T J = 25°C, L = 1.09mH, R G = 25Ω, I AS = 11A. Pulse width ≤ 400μs; duty cycle ≤ 2%.When mounted on 1 inch square copper board. R θ is measured at T J of approximately 90°C.Data and specifications subject to change without notice.This product has been designed and qualified for the Consumer market.Qualification Standards can be found on IR’s Web site.IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105TAC Fax: (310) 252-7903Visit us at for sales contact information .07/2007Note: For the most current drawing please refer to IR website at /package/330.00(12.992) MAX.14.40 ( .566 )12.40 ( .488 )NOTES :1. CONTROLLING DIMENSION : MILLIMETER.2. OUTLINE CONFORMS TO EIA-481 & EIA-541.FEED DIRECTIONTERMINAL NUMBER 112.3 ( .484 )11.7 ( .461 )8.1 ( .318 )7.9 ( .312 )NOTES:1. CONTROLLING DIMENSION : MILLIMETER.2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).3. OUTLINE CONFORMS TO EIA-481 & EIA-541.SO-8 Tape and ReelDimensions are shown in milimeters (inches)分销商库存信息:IRIRF8721TRPBF IRF8721PBF。

调频1KW发射机技术说明书

+10dBm；
第6页
GME1F13D 调频发射机技术说明书
第三章发射机面板与接口说明第一节前面板
从发射机的前方，从上到下分别是： [1] 主控制单元（显示单元） [2] 激励器 [3] 电控单元 [4] 功放单元 [5] 开关电源
1 2 3
4
5
图 3-1
第7页
各部分前面板具体说明如下：
一、电源面板说明
北京吉兆电子有限公司
GME1F13 调频 1KW 发射机技术说明书
公司地址
售后服务热线免费咨询热线营销部电话营销部传真 E-mail Web
北京市海淀区王庄路 1 号清华同方科技大厦 A 座 26 层
(100083) 010-82916768 010-800-810-8463 010-82399620 010-82399617 gme@
五、激励器、功放均带有检测、控制接口，可以根据用户要求增加控制单元，实现微机联网控制，并实现遥控开关机、定时开关机等功能。
六、具有防雷击、交流欠压、直流过压、电源过热、功放过热、发射机超载等各种保护功能，使发射机性能稳定可靠。
七、功放具有很强的自保护功能，在出现功放过热、激励器过激励、天线超载时，功放中的控制电路可以立即作出判断，并作出相应的动作关断信号保护功放。
相对湿度：≤ 95%；海拔高度：≤2000 米； *输入特性 [1]音频输入阻抗：600Ω（平衡）或 10KΩ可选 [2]音频输入接口： XLR [3]音频输入电平：-13dBm---- +14dBm； [4]MPX 输入接口：BNC 、不平衡 [5]SCA/RDS 输入接口：BNC、不平衡
第5页
GME1F13D 调频发射机技术说明书

8752A-U硬件规格书 v 1.0

8752A-U低功耗蓝牙Mesh模组硬件规格书V1.0修改记录修改记录修改日期修改内容修改人审核人版本2018.8.20首次发行Allen V1.0目录前言 (4)版权声明 (4)1.引言 (5)2.模组结构图 (5)3.模组外观图 (6)4.模组主要特性 (7)5.引脚分配（正面图） (9)6.模组引脚描述 (10)7.硬件设计部分： (12)电源设计 (12)复位电路 (12)Uart通信接口 (13)I2C接口 (15)模数转换接口 (15)PWM接口 (16)天线接口 (16)订购信息 (19)推荐回流曲线 (20)附录：模组尺寸图 (21)前言非常感谢您选择并使用我公司的模组，此模组主要用于蓝牙数据通讯和Mesh组网的智能控制，是一款超紧凑、高性能、低功耗的带有Mesh组网功能的蓝牙通信组件。

模组由一颗高集成度的蓝牙芯片RTL8752CMF和少量的外围电路构成，内置了蓝牙网络通信协议栈和丰富的库函数，用户可在此基础上轻松实现蓝牙应用的开发，缩短研发周期。

同时模组尺寸紧凑，功能丰富，能最大限度地满足终端设备对小尺寸模组产品的需求，有效地帮助客户减小产品尺寸并优化产品成本。

使用前请仔细阅读本产品规格书，您将了解本模块的功能和简洁的操作方法。

本公司不承担由于用户不正常操作造成的财产损失或者人身伤害责任。

请用户按照手册中的技术规格和参考设计开发相应的产品。

引言本文档描述了模组的硬件应用接口，包括相关应用场合的电路连接以及射频接口等，可以帮助用户快速了解模组的接口定义、电气性能和结构尺寸等详细信息。

结合本文档和其他的应用文档，用户可以快速使用该模组来完成应用方案设计。

2.模组结构图图18752A-U模组结构图3.模组外观图图28752A-U模组外观图4.模组主要特性5.引脚分配（正面图）图38752A-U模组管脚图6.模组引脚描述I/O参数定义：IO双向端口DI数字输入DO数字输出PI电源输入PO电源输出AI模拟输入AO模拟输出7.硬件设计部分：电源设计8752A-U模组只需一路1.8~3.3V的电源连接相应的模块引脚即可工作,供电引脚如下：引脚名引脚编号I/O描述特性备注VBAT8PI模块供电Vmin=1.8vVtyp=3.0vVmax=3.3v 电源必须能够提供不小于50mA的电流GND2，5GNDGND模块VBAT的电压输入范围是1.8V到3.3V，推荐电压为3.0V。

飞利浦 INTELIA Type HD8753 说明书

Register your product and get support at /welcome E N0202l i s Type HD8753OPERATING INSTRUCTIONSREAD THESE INSTRUCTIONS CAREFULLY BEFORE USING THE MACHINE.IMPORTANT SAFEGUARDSWhen using electrical appliances, basic safety precautions should always be followed, including the following:1. Read all instructions.2. Do not touch hot surfaces. Use handles or knobs.3. To protect against fire, electric shock and injury to persons do not immerse cord, plugs, or appliance in water or other liquid.4. Close supervision is necessary when the appliance is used by or near children.5. Unplug from outlet when not in use and before cleaning. Allow to cool before putting on or taking off parts, and before cleaning the appliance.6. Do not operate any appliance with a damaged cord or plug or after the appliance malfunctions, or has been damaged in any manner. Return appliance to the nearest authorized service facility for examination, repair or adjustment.7. The use of accessory attachments not recommended by the appliance manufacturer may result in fire, electric shock or injury to persons.8. Do not use outdoors.9. Do not let cord hang over edge of table or counter, or touch hot surfaces.10. Do not place on or near a hot gas or electric burner, or in a heated oven.11. A lways attach plug to appliance first, then plug cord into wall outlet. To disconnect, turn any control to “off”, then remove plug from wall outlet.12. D o not use appliance for other than intended use.13. S ave these instructions.SAVE THESE INSTRUCTIONSCAUTIONThis appliance is for household use only. Any servicing, other than cleaning and user maintenance, should be performed by an authorized service center. Do not immerse machine in water. To reduce the risk of fire or electric shock, do not disassemble the machine. There are no parts inside the machine serviceable by the user. Repair should be done by authorized service personnel only.1. Check voltage to be sure that the voltage indicated on the nameplate corresponds with your voltage.2.Never use warm or hot water to fill the water tank. Use cold water only.3.Keep your hands and the cord away from hot parts of the appliance during operation.4.Never clean with scrubbing powders or harsh cleaners. Simply use a soft cloth dampened with water.5. For optimal taste of your coffee, use purified or bottled water. Periodic descaling is still recommended every 2-3 months.6.Do not use caramelized or flavored coffee beans. INSTRUCTIONS FOR THE POWERSUPPL Y CORDA. A short power-supply cord (or detachable power-supply cord) is to be provided to reduce risks resulting from becoming entangled in or tripping over a longer cord.B. Longer detachable power-supply cords or extension cords are available and may used if care is exercised in their use.C. If a long detachable power-supply cord or extension cord is used,1. The marked electrical rating of the detachable power-supply cord orextension cord should be at least as great as the electrical rating of the appliance2. If the appliance is of the grounded type, the extension cord should be agrounding-type 3-wire cord, and3. The longer cord should be arranged so that it will not drape over thecounter top or table top where it can be pulled on by children or tripped over.3 Introduction (4)General Description (fi g. 1) (4)Important (5)Intended Use (5)Power Supply - Power Cord (5)For the Safety of Others (5)Danger of Burns (5)Machine Location - Suitable Location for Operation and Maintenance (6)Cleaning and Storing the Machine (6)Malfunction (6)Fire Safety Precautions (6)First Use (7)Packaging (7)Preliminary Operations (7)Circuit Priming (9)Rinse/Self-Cleaning Cycle (10)For a perfect Espresso: Rinse the coff ee circuit if using the machine for the fi rst time or after along period of inactivity. (10)"INTENZA+" Water Filter (Optional) (12)"INTENZA+" Water Filter Installation (12)Measuring Water Hardness (13)Espresso Coff ee: Brewing and Adjustments (15)Pre-brewing Technology: Enhancing the Aroma (15)Adjustable Ceramic Coff ee Grinder: a Full Aroma Preservation (15)"Aroma" Adjustment: Select Your Favourite Amount (16)Brewing Coff ee (17)Adjusting the Dispensing Spout (17)Using Coff ee Beans (18)Using Pre-ground Coff ee (18)Adjusting the Coff ee Length (MEMO Function) (19)Milk Carafe (20)Filling the Milk Carafe (20)Inserting the Milk Carafe (21)Removing the Milk Carafe (22)Emptying the Milk Carafe (22)Cappuccino (23)Adjusting the Cappuccino Length (MEMO Function) (24)Hot Milk (25)Adjusting the Amount of Hot Milk in the Cup (MEMO Function) (26)Hot Water Dispensing (27)Eco-friendly: Stand-by (28)Stand-by (28)Cleaning and Maintenance (29)General Cleaning (29)Cleaning the Milk Carafe (After Each Use) (31)Weekly Cleaning of the Carafe (Carafe Lid) (32)Monthly Cleaning of the Carafe (thorough Cleaning) (34)Brew Group (36)Weekly Cleaning - Brew Group (36)Brew Group Cleaning with "Coff ee Clean Tablets": (38)Brew Group Lubrication (40)Descaling (41)Programming (44)Enter the “Menu” (44)Programming Controls (45)Exiting the Programming Mode (45)Functions (46)Programming Example (46)Control Panel Display (48)Troubleshooting (50)Technical Specifi cations (51)Service (52)6ENGLISHENGLISH78ENGLISHPress the "" button. Wait until the dispensing procedure is complete and empty the water tank.Press the "" button. The following icon is displayed.Press the "" button to start dispensing hot water. Dispense water until the no water signal appears.ll the water tank again. Then the products can be brewedlter in the ma-3 The numbers correspond to the settings that are found for the water hardness adjustment, shown in the programming chapter. More precisely: 1 = 1 (very soft water) 2 = 2 (soft water) 3 = 3 (hard water)4 = 4 (very hard water)4 Once you know this value, set the water hardness value. Press the "" button and scroll the pages by pressing the "" but-ton until the following page is displayed.Note: The machine is supplied with a standard adjustment suitable for most of the uses.5 Press: The "" button to increase the value or the "" button to reduce the value.6 Press the "" button to confi rm the adjustment.7 Press the "" button to exit and brew the products.- Remove the "INTENZA+" water fi lter (or remove the small whitefi lter if you have not yet installed the "INTENZA+" water fi lter) from the water tank and wash it under running drinking water;- Reposition the "INTENZA+" water fi lter (or the small white fi lter ifyou have not yet installed the "INTENZA+" water fi lter) in its hous-ing by gently pressing and turning it at the same time;- Fill the water tank with fresh drinking water.ee grounds drawer it is also necessary to ee residues drawer. Open the service door, ee grounds.ee compartment, clean it every week3 Press on the bottom to remove the dispenser.4 Slide the milk frothing device upwards.5 Pulling the fi tting outwards.6 Remove the suction tube.7 Wash all the components with lukewarm water.Note: After washing all the components, reassemble the parts on the lid follow-ing the same procedure used for disassembly, but in reverse order.Important note: As highlighted at point (2) the dispenser can be inserted in thelid only when it is in the position ().be used for rinsing.11 Insert the carafe with the rinsing water into the machine and placea container under the coff ee dispensing spout and under the milkdispenser.12 Press the "" button. The following icon is displayed.13 Press the “” button to start hot milk dispensing.14 The following icon is displayed during the preheating time required bythe machine.15 Once the warm-up phase is off, the machine starts dispensing water tobe used for rinsing.16 When all the water has been dispensed, repeat the operations frompoint (12) until all water in the carafe has been poured off.17 When the water is fi nished, repeat the operations from point (10) onemore time. At the end of the second rinsing cycle, the thorough clean-ing is fi nished.Once cleaning is off, disassemble and wash all the components as de-scribed in the "Weekly Cleaning" section.rmly press the "PUSH" button.ee grounds drawer. Close the service door.ee residues drawer.ee residues drawer and then the Brew Group.ee residues drawer.Press and release the "" button one or more times to activate theee function without adding any coff ee to the compart-ee brewing cycle pressing the "" button.ll it up to 2/3rds withect for about 30 minutes,2 Press the "" button and, if necessary, scroll the pages by pressing the "" button until the following page is displayed.3 Press the "" button to enter the descaling menu.8 At this point the machine will start dispensing the descaling solution at intervals (the bar shows the cycle progress).Note: If you press the "" button by mistake, press the "" to quit.to complete it before brewing coff ee.5 Fill with fresh drinking water up to the MAX level. Place the tank back in the machine.6 Place an empty container under the coff ee dispensing spout and under the milk dispenser.Note: Use a container of at least 1.5 litre capacity. If you do not have a con-tainer of this capacity, pause the cycle by pressing the "" button, empty the container, place it under the dispensing spout and restart the cycle by pressing the same button again.7 Only after adding the descaling solution in the tank, press the "" button to start the descaling cycle.4 Pour the entire content of Saeco concentrated descaling solution into the appliance water tank.Note: The descaling cycle may be paused by pressing the "" button. To re-sume the cycle, press the button again. This allows you to empty the container or to go away for a short period of time.9 When the solution in the tank is fi nished, the icon on the side is dis-played. The icon indicates that the tank must be rinsed and fi lled. 10 Rinse the water tank thoroughly and refi ll it with fresh drinking water.11 Empty the container used to collect the liquid dispensed by the ma-chine and place it back under the dispensing spout.12 When inserting the tank fi lled with water the icon on the side is dis-played.13 Press the "" button to start the rinse cycle of the machine.14 When the water in the tank is fi nished, the icon on the side is displayed to indicate that the tank must be rinsed and fi lled with fresh drinking water to fi nish the cycle.15 Empty the container used to collect the liquid dispensed by the ma-chine and place it under the dispensing spout.16 When inserting the tank fi lled with water the icon on the side is dis-played.17 Press the "" button to start the rinse cycle of the machine.Note: The rinse cycle may be paused by pressing the "" button. To resume the cycle, press the button again. This allows you to empty the container or to go away for a short period of time.Press the "" button until the CONTRAST function is displayed. Press the "" button once to increase the contrast.Press the "" button to confi rm.Press the "" button to exit programming.。

MT7873规格书-中文 _Rev1.10

MT7873 Rev. 1.10
R2 的取值一般在 30Kohm ~ 100Kohm 之间。（参考下面的电路图，公式 (6) 成立的条件为： Rs1=Rs2，R1 >> Rs1. 一般 Rs1 与 Rs2 的阻值为 200K 欧姆左右， R1 为几兆欧姆左右。） LED 开路后，一旦 LED 两端电压超过 OVP 阈值， MT7873 将停止开关动作。直到 VCC 电压降低到 UVLO 的阈值，系统重启。
MT7873 Rev. 1.10
管脚号 1 2 3 4 5/6 7 8 芯片地开路保护设置引脚及线电压补偿芯片电源，内部限压 15.5V 内部高压功率MOS管源端内部高压功率MOS管漏端悬空脚电流采样端，接采样电阻到地
描述
版权 © 2014 美芯晟科技有限公司
第2页
MT7873
简洁高功率因数降压型 LED 恒流驱动器
电气参数
(除非特别说明，测试条件为: VCC=13V, TA=25° C) 符号 ISTART VCC_UV VSTART VCC-CLAMP 电源电流 Iop 电流检测（CS 脚） VCS-TH LEB1 热保护 OTP 驱动电路 TOFF_MIN TON_MIN RDSON BVDSS 最小截止时间最小导通时间内部高压功率管导通阻抗内部高压功率管击穿电压 VGS=10V/IDS=1.5A VGS=0V/IDS=250uA 300 3.5 1.0 3 uS uS Ω V 过热保护温度阈值过热保护释放的迟滞温度 155 30 ℃ ℃ 峰值电流检测阈值 CS 脚内置前沿消隐时间 390 400 500 410 mV nS 工作电流 0.3 mA 参数启动电流欠压锁定电压 (UVLO) 启动电压 VCC 钳位电压 VCC< VCC_UV VCC 脚电压下降 VCC 脚电压上升 IDD<5mA Min Typ 60 5.5 12 15.5 Max Unit μA V V V 启动与电源电压（VCC 脚）

RC-87535中文资料

Type:RC-875/35, RC-875/50, RC-875/75, RC-875XProduct Description8.3•7.5mm Max. (L•W), 11.5mm Max. height (RC-875/35,RC-875/50,RC-875/75)8.3•7.3mm Max. (L•W), 11.8mm Max. height (RC-875X)Inductance Range: 100ƒH•47mHRated Current Range :10•400mAFeatureMagnetically unshielded construction.Ideally Used in Printers, LCD TV, Copy Machine, Mainboard of the compounding machines ,Adapters, etc as Power Supplies’s inductors or DC-DC Converter inductors.RoHS ComplianceDimensions (mm)RC-875/35,RC-875/50,RC-875/75Dimension: RC-875X+1.0 RC-875/35 3.5-0.5+1.0 RC-875/50 5.0-0.5+1.0 RC-875/75 7.5-0.511.0•0.5.7.17.2•0.3.38..35.8..3 11.3•}0.5 4.8+1.0-0.55..83.67.0•0.32.1.7.1Type:RC-875/35, RC-875/50, RC-875/75, RC-875X Specification(RC-875/35 –1)Part Name Stamp Inductance［Within］※1Qu[Min.]※1D.C.R.(Ω)[Max.](at 20℃)Rated Current(ｍＡ) [Ref.]※2S.R.F.[Min.]RC875NP-1Ø1K-35 101K100ƒH • 10% 50 0.37 400 4.5MHz RC875NP-121K-35 121K120ƒH • 10% 50 0.42 400 4.1MHz RC875NP-151K-35 151K150ƒH • 10% 50 0.50 370 3.7MHz RC875NP-181K-35 181K180ƒH • 10% 50 0.64 335 3.3MHz RC875NP-221K-35 221K220ƒH • 10% 55 0.75 300 3.0MHz RC875NP-271K-35 271K270ƒH • 10% 60 0.84 275 2.7MHz RC875NP-331K-35 331K330ƒH • 10% 65 1.09 230 2.5MHz RC875NP-391K-35 391K390ƒH • 10% 65 1.20 205 2.3MHz RC875NP-471K-35 471K470ƒH • 10% 70 1.52 180 2.1MHz RC875NP-561K-35 561K560ƒH • 10% 70 1.76 160 1.9MHz RC875NP-681K-35 681K680ƒH • 10% 70 2.00 130 1.7MHz RC875NP-821K-35 821K820ƒH • 10% 75 2.82 115 1.6MHz RC875NP-1Ø2K-35 102K 1.0mH 10% 50 3.22 105 1.4MHz RC875NP-122K-35 122K 1.2mH 10% 50 3.55 85 1.3MHz RC875NP-152K-35 152K 1.5mH 10% 50 5.12 70 1.2MHz RC875NP-182K-35 182K 1.8mH 10% 50 5.92 55 1.0MHz RC875NP-222K-35 222K 2.2mH 10% 50 6.75 50 950kHz RC875NP-272K-35 272K 2.7mH 10% 50 9.50 45 870kHz RC875NP-332K-35 332K 3.3mH 10% 55 10.9 40 790kHz RC875NP-392K-35 392K 3.9mH 10% 55 12.2 33 720kHz RC875NP-472K-35 472K 4.7mH 10% 50 17.3 30 660kHz RC875NP-562K-35562K 5.6mH • 10% 50 18.9 28 600kHz RC875NP-682K-35 682K 6.8mH 10% 50 24.6 25 550kHz RC875NP-822K-35 822K8.2mH 10% 50 28.4 23 500kHz RC875NP-1Ø3K-35 103K10mH 10% 60 26.0 19.5 450kHz RC875NP-123K-35 123K12mH 10% 60 35.6 18.0 410kHz RC875NP-153K-35 153K15mH 10% 60 41.2 16.0 370kHz RC875NP-183K-35 183K18mH 10% 60 54.5 15.0 330kHz RC875NP-223K-35 223K22mH 10% 60 62.0 13.0 300kHz RC875NP-273K-35273K27mH • 10% 55 83.2 12.5 270kHz RC875NP-333K-35 333K33mH 10% 55 95.9 11.5 250kHz RC875NP-393K-35 393K39mH 10% 50 156 11.0 230kHz RC875NP-473K-35 473K47mH 10% 50 177 10.0 210kHzType:RC-875/35, RC-875/50, RC-875/75, RC-875X Specification(RC-875/35 –2)Part Name Stamp Inductance［Within］※1Qu[Min.]※1D.C.R.(Ω)[Max.](at 20℃)Rated Current(ｍＡ) [Ref.]※2S.R.F.[Min.]RC875NP-1Ø1J-35 101J 100ƒH • 5% 50 0.37 400 4.5MHz RC875NP-121J-35 121J 120ƒH • 5% 50 0.42 400 4.1MHz RC875NP-151J-35 151J 150ƒH • 5% 50 0.50 370 3.7MHz RC875NP-181J-35 181J 180ƒH • 5% 50 0.64 335 3.3MHz RC875NP-221J-35 221J 220ƒH • 5% 55 0.75 300 3.0MHz RC875NP-271J-35 271J 270ƒH • 5% 60 0.84 275 2.7MHz RC875NP-331J-35 331J 330ƒH • 5% 65 1.09 230 2.5MHz RC875NP-391J-35 391J 390ƒH • 5% 65 1.20 205 2.3MHz RC875NP-471J-35 471J 470ƒH • 5% 70 1.52 180 2.1MHz RC875NP-561J-35 561J 560ƒH • 5% 70 1.76 160 1.9MHz RC875NP-681J-35 681J 680ƒH • 5% 70 2.00 130 1.7MHz RC875NP-821J-35 821J 820ƒH • 5% 75 2.82 115 1.6MHz RC875NP-1Ø2J-35 102J 1.0mH 5% 50 3.22 105 1.4MHz RC875NP-122J-35 122J 1.2mH 5% 50 3.55 85 1.3MHz RC875NP-152J-35 152J 1.5mH 5% 50 5.12 70 1.2MHz RC875NP-182J-35 182J 1.8mH 5% 50 5.92 55 1.0MHz RC875NP-222J-35 222J 2.2mH 5% 50 6.75 50 950kHz RC875NP-272J-35 272J 2.7mH 5% 50 9.50 45 870kHz RC875NP-332J-35 332J 3.3mH 5% 55 10.9 40 790kHz RC875NP-392J-35 392J 3.9mH 5% 55 12.2 33 720kHz RC875NP-472J-35 472J 4.7mH 5% 50 17.3 30 660kHz RC875NP-562J-35562J 5.6mH5% 50 18.9 28 600kHz RC875NP-682J-35 682J 6.8mH 5% 50 24.6 25 550kHz RC875NP-822J-35 822J 8.2mH 5% 50 28.4 23 500kHz RC875NP-1Ø3J-35 103J 10mH 5% 60 26.0 19.5 450kHz RC875NP-123J-35 123J 12mH 5% 60 35.6 18.0 410kHz RC875NP-153J-35 153J 15mH 5% 60 41.2 16.0 370kHz RC875NP-183J-35 183J 18mH 5% 60 54.5 15.0 330kHz RC875NP-223J-35 223J 22mH 5% 60 62.0 13.0 300kHz RC875NP-273J-35273J 27mH5% 55 83.2 12.5 270kHz RC875NP-333J-35 333J 33mH 5% 55 95.9 11.5 250kHz RC875NP-393J-35 393J 39mH 5% 50 156 11.0 230kHz RC875NP-473J-35 473J 47mH 5% 50 177 10.0 210kHzType:RC-875/35, RC-875/50, RC-875/75, RC-875X Specification(RC-875/50)Part Name Stamp Inductance［Within］※1Qu[Min.]※1D.C.R.(Ω)[Max.](at 20℃)Rated current(ｍＡ) [Ref.]※2S.R.F.[Min.]RC875NP-1Ø1J-5Ø 101J 100ƒH • 5% 50 0.37 400 4.5MHz RC875NP-121J-5Ø 121J 120ƒH • 5% 50 0.42 400 4.1MHz RC875NP-151J-5Ø 151J 150ƒH • 5% 50 0.50 370 3.7MHz RC875NP-181J-5Ø 181J 180ƒH • 5% 50 0.64 335 3.3MHz RC875NP-221J-5Ø 221J 220ƒH • 5% 55 0.75 300 3.0MHz RC875NP-271J-5Ø 271J 270ƒH • 5% 60 0.84 275 2.7MHz RC875NP-331J-5Ø 331J 330ƒH • 5% 65 1.09 230 2.5MHz RC875NP-391J-5Ø 391J 390ƒH • 5% 65 1.20 205 2.3MHz RC875NP-471J-5Ø 471J 470ƒH • 5% 70 1.52 180 2.1MHz RC875NP-561J-5Ø 561J 560ƒH • 5% 70 1.76 160 1.9MHz RC875NP-681J-5Ø 681J 680ƒH • 5% 70 2.00 130 1.7MHz RC875NP-821J-5Ø 821J 820ƒH • 5% 75 2.82 115 1.6MHz RC875NP-1Ø2J-5Ø 102J 1.0mH5% 50 3.22 105 1.4MHz RC875NP-122J-5Ø 122J 1.2mH5% 50 3.55 85 1.3MHz RC875NP-152J-5Ø 152J 1.5mH5% 50 5.12 70 1.2MHz RC875NP-182J-5Ø 182J 1.8mH5% 50 5.92 55 1.0MHz RC875NP-222J-5Ø 222J 2.2mH5% 50 6.75 50 950kHz RC875NP-272J-5Ø 272J 2.7mH5% 50 9.50 45 870kHz RC875NP-332J-5Ø 332J 3.3mH5% 55 10.9 40 790kHz RC875NP-392J-5Ø 392J 3.9mH5% 55 12.2 33 720kHz RC875NP-472J-5Ø 472J 4.7mH5% 50 17.3 30 660kHz RC875NP-562J-5Ø562J 5.6mH5% 50 18.9 28 600kHz RC875NP-682J-5Ø 682J 6.8mH5% 50 24.6 25 550kHz RC875NP-822J-5Ø 822J 8.2mH5% 50 28.4 23 500kHz RC875NP-1Ø3J-5Ø 103J 10mH5% 60 26.0 19.5 450kHz RC875NP-123J-5Ø 123J 12mH5% 60 35.6 18.0 410kHz RC875NP-153J-5Ø 153J 15mH5% 60 41.2 16.0 370kHz RC875NP-183J-5Ø 183J 18mH5% 60 54.5 15.0 330kHz RC875NP-223J-5Ø 223J 22mH5% 60 62.0 13.0 300kHz RC875NP-273J-5Ø273J 27mH5% 55 83.2 12.5 270kHz RC875NP-333J-5Ø 333J 33mH5% 55 95.9 11.5 250kHz RC875NP-393J-5Ø 393J 39mH5% 50 156 11.0 230kHz RC875-NP-473J-5Ø 473J 47mH 5% 50 177 10.0 210kHzType:RC-875/35, RC-875/50, RC-875/75, RC-875X Specification(RC-875/75 –1)Part Name Stamp Inductance［Within］※1Qu[Min.]※1D.C.R.(Ω)[Max.](at 20℃)RatedCurrent(mA) [Ref.]※2S.R.F.[Min.]RC875NP-1Ø1K-75 101K 100ƒH • 10% 50 0.37 400 4.5MHzRC875NP-121K-75 121K 120ƒH • 10% 50 0.42 400 4.1MHzRC875NP-151K-75 151K 150ƒH • 10% 50 0.50 370 3.7MHzRC875NP-181K-75 181K 180ƒH • 10% 50 0.64 335 3.3MHzRC875NP-221K-75 221K 220ƒH • 10% 55 0.75 300 3.0MHzRC875NP-271K-75 271K 270ƒH • 10% 60 0.84 275 2.7MHzRC875-NP-331K-75 331K 330ƒH • 10% 65 1.09 230 2.5MHzRC875NP-391K-75 391K 390ƒH • 10% 65 1.20 205 2.3MHzRC875NP-471K-75 471K 470ƒH • 10% 70 1.52 180 2.1MHzRC875NP-561K-75 561K 560ƒH • 10% 70 1.76 160 1.9MHzRC875NP-681K-75 681K 680ƒH • 10% 70 2.00 130 1.7MHzRC875NP-821K-75 821K 820ƒH • 10% 75 2.82 115 1.6MHzRC875NP-1Ø2K-75 102K 1.0mH 10% 50 3.22 105 1.4MHzRC875NP-122K-75 122K 1.2mH10% 50 3.55 85 1.3MHzRC875NP-152K-75 152K 1.5mH10% 50 5.12 70 1.2MHzRC875NP-182K-75 182K 1.8mH10% 50 5.92 55 1.0MHzRC875NP-222K-75 222K 2.2mH10% 50 6.75 50 950kHzRC875NP-272K-75 272K 2.7mH10% 50 9.50 45 870kHzRC875NP-332K-75 332K 3.3mH10% 55 10.9 40 790kHzRC875NP-392K-75 392K 3.9mH10% 55 12.2 33 720kHzRC875NP-472K-75 472K 4.7mH10% 50 17.3 30 660kHzRC875NP-562K-75562K 5.6mH10% 50 18.9 28 600kHzRC875NP-682K-75 682K 6.8mH10% 50 24.6 25 550kHzRC875NP-822K-75 822K 8.2mH10% 50 28.4 23 500kHzRC875NP-1Ø3K-75 103K 10mH 10% 60 26.0 19.5 450kHzRC875NP-123K-75 123K 12mH10% 60 35.6 18.0 410kHzRC875NP-153K-75 153K 15mH10% 60 41.2 16.0 370kHzRC875NP-183K-75 183K 18mH10% 60 54.5 15.0 330kHzRC875NP-223K-75 223K 22mH10% 60 62.0 13.0 300kHzRC875NP-273K-75273K 27mH10% 55 83.2 12.5 270kHzRC875NP-333K-75 333K 33mH10% 55 95.9 11.5 250kHzRC875NP-393K-75 393K 39mH10% 50 156 11.0 230kHzRC875NP-473K-75 473K 47mH • 10% 50 177 10.0 210kHzType:RC-875/35, RC-875/50, RC-875/75, RC-875X Specification(RC-875/75 –2)Part Name Stamp Inductancem Within•n1Qu[Min.]1D.C.R.(ƒ)[Max.](at 20•)Rated Current(mA) [Ref.]2S.R.F.[Min.]RC875NP-1Ø1J-75 101J 100ƒH • 5% 50 0.37 400 4.5MHzRC875NP-121J-75 121J 120ƒH • 5% 50 0.42 400 4.1MHzRC875NP-151J-75 151J 150ƒH • 5% 50 0.50 370 3.7MHzRC875-NP-181J-75 181J 180ƒH • 5% 50 0.64 335 3.3MHzRC875NP-221J-75 221J 220ƒH • 5% 55 0.75 300 3.0MHzRC875NP-271J-75 271J 270ƒH • 5% 60 0.84 275 2.7MHzRC875NP-331J-75 331J 330ƒH • 5% 65 1.09 230 2.5MHzRC875NP-391J-75 391J 390ƒH • 5% 65 1.20 205 2.3MHzRC875NP-471J-75 471J 470ƒH • 5% 70 1.52 180 2.1MHzRC875NP-561J-75 561J 560ƒH • 5% 70 1.76 160 1.9MHzRC875NP-681J-75 681J 680ƒH • 5% 70 2.00 130 1.7MHzRC875NP-821J-75 821J 820ƒH • 5% 75 2.82 115 1.6MHzRC875NP-1Ø2J-75 102J 1.0mH5% 50 3.22 105 1.4MHzRC875NP-122J-75 122J 1.2mH5% 50 3.55 85 1.3MHzRC875NP-152J-75 152J 1.5mH5% 50 5.12 70 1.2MHzRC875NP-182J-75 182J 1.8mH5% 50 5.92 55 1.0MHzRC875NP-222J-75 222J 2.2mH5% 50 6.75 50 950kHzRC875NP-272J-75 272J 2.7mH5% 50 9.50 45 870kHzRC875NP-332J-75 332J 3.3mH5% 55 10.9 40 790kHzRC875NP-392J-75 392J 3.9mH5% 55 12.2 33 720kHzRC875NP-472J-75 472J 4.7mH5% 50 17.3 30 660kHzRC875NP-562J-75562J 5.6mH5% 50 18.9 28 600kHzRC875NP-682J-75 682J 6.8mH5% 50 24.6 25 550kHzRC875NP-822J-75 822J 8.2mH5% 50 28.4 23 500kHzRC875NP-1Ø3J-75 103J 10mH5% 60 26.0 19.5 450kHzRC875NP-123J-75 123J 12mH5% 60 35.6 18.0 410kHzRC875NP-153J-75 153J 15mH5% 60 41.2 16.0 370kHzRC875NP-183J-75 183J 18mH5% 60 54.5 15.0 330kHzRC875NP-223J-75 223J 22mH5% 60 62.0 13.0 300kHzRC875NP-273J-75273J 27mH • 5% 55 83.2 12.5 270kHz RC875NP-333J-75 333J 33mH • 5% 55 95.9 11.5 250kHz RC875NP-393J-75 393J 39mH • 5% 50 156 11.0 230kHz RC875NP-473J-75 473J 47mH • 5% 50 177 10.0 210kHzType:RC-875/35, RC-875/50, RC-875/75, RC-875X Specification(RC-875X)Part Name Stamp Inductancem Within•n1Qu[Min.]1D.C.R.(ƒ)[Max.](at 20•)Rated Current(mA) [Ref.]2S.R.F.[Min.]RC875XNP-1Ø1K 101K 100ƒH • 10% 50 0.37 400 4.5MHz RC875XNP-121K 121K 120ƒH • 10% 50 0.42 400 4.1MHz RC875XNP-151K 151K 150ƒH • 10% 50 0.50 370 3.7MHz RC875XNP-181K 181K 180ƒH • 10% 50 0.64 335 3.3MHz RC875XNP-221K 221K 220ƒH • 10% 55 0.75 300 3.0MHz RC875XNP-271K 271K 270ƒH • 10% 60 0.84 275 2.7MHz RC875XNP-331K 331K 330ƒH • 10% 65 1.09 230 2.5MHz RC875XNP-391K 391K 390ƒH • 10% 65 1.20 205 2.3MHz RC875XNP-471K 471K 470ƒH • 10% 70 1.52 180 2.1MHz RC875XNP-561K 561K 560ƒH • 10% 70 1.76 160 1.9MHz RC875XNP-681K 681K 680ƒH • 10% 70 2.00 130 1.7MHz RC875XNP-821K 821K 820ƒH • 10% 75 2.82 115 1.6MHz RC875XNP-1Ø2K 102K 1.0mH • 10% 50 3.22 105 1.4MHz RC875XNP-122K 122K 1.2mH • 10% 50 3.55 85 1.3MHz RC875XNP-152K 152K 1.5mH • 10% 50 5.12 70 1.2MHz RC875XNP-182K 182K 1.8mH • 10% 50 5.92 55 1.0MHz RC875XNP-222K 222K 2.2mH • 10% 50 6.75 50 950kHz RC875XNP-272K 272K 2.7mH • 10% 50 9.50 45 870kHz RC875XNP-332K 332K 3.3mH • 10% 55 10.9 40 790kHz RC875XNP-392K 392K 3.9mH • 10% 55 12.2 33 720kHz RC875XNP-472K 472K 4.7mH • 10% 50 17.3 30 660kHz RC875XNP-562K562K 5.6mH • 10% 50 18.9 28 600kHz RC875XNP-682K 682K 6.8mH • 10% 50 24.6 25 550kHz RC875XNP-822K 822K 8.2mH • 10% 50 28.4 23 500kHz RC875XNP- 1Ø3K 103K 10mH • 10% 60 26.0 19.5 450kHz RC875XNP-123K 123K 12mH • 10% 60 35.6 18.0 410kHz RC875XNP-153K 153K 15mH • 10% 60 41.2 16.0 370kHz RC875XNP-183K 183K 18mH • 10% 60 54.5 15.0 330kHz RC875XNP-223K 223K 22mH • 10% 60 62.0 13.0 300kHz RC875XNP-273K273K 27mH • 10% 55 83.2 12.5 270kHz RC875X-NP-333K 333K 33mH • 10% 55 95.9 11.5 250kHz RC875XNP-393K 393K 39mH • 10% 50 156 11.0 230kHz RC875XNP-473K 473K 47mH • 10% 50 177 10.0 210kHzThe named of this part is very specially please pay attention to it1 Measuring frequency 100ƒH • 820ƒH Inductance: at 1 kHz ; Qu: at 100 kHz1.0 mH • 47 mH Inductance: at 1 kHz ; Qu: at 50 kHz2. Rated currentThe DC current at which the temperature rise is•t•40•(Ta•20•).(for 101K and 121K )The DC current at which the inductance decreases to 95% of it’s nominal value.(for the other Part Numbers)。

IRMCK311TR;中文规格书,Datasheet资料

Data Sheet No. PD60338IRMCK311 Dual Channel Sensorless Motor Control IC forAppliancesFeaturesMCE TM (Motion Control Engine) - Hardware based computation engine for high efficiency sinusoidal sensorless control of permanent magnet AC motor Integrated Power Factor Correction controlSupports both interior and surface permanent magnet motorsBuilt-in hardware peripheral for single shunt current feedback reconstructionNo external current or voltage sensing operational amplifier requiredDual channel three/two-phase Space Vector PWM Three-channel analog output (PWM)Embedded 8-bit high speed microcontroller (8051) for flexible I/O and man-machine controlJTAG programming port for emulation/debugger Two serial communication interface (UART)I2C/SPI serial interfaceWatchdog timer with independent analog clockThree general purpose timers/countersTwo special timers: periodic timer, capture timer Internal ‘One-Time Programmable’ (OTP) memory and internal RAM for final production usagePin compatible with IRMCF311 RAM version1.8V/3.3V CMOS Product SummaryMaximum crystal frequency 60 MHz Maximum internal clock (SYSCLK) frequency 128 MHz Maximum 8051 clock frequency 33 MHz Sensorless control computation time 11 μsec typ MCE TM computation data range 16 bit signed 8051 OTP Program memory 56K bytes MCE program and Data RAM 8K bytes GateKill latency (digital filtered) 2 μsec PWM carrier frequency counter 16 bits/ SYSCLK A/D input channels 6 A/D converter resolution 12 bits A/D converter conversion speed 2 μsec 8051 instruction execution speed 2 SYSCLK Analog output (PWM) resolution 8 bits UART baud rate (typ) 57.6K bps Number of I/O (max) 14 Package (lead-free) QFP64 Operating temperature -40°C ~ 85°CDescriptionIRMCK311 is a high performance OTP based motion control IC designed primarily for appliance applications. IRMCK311 is designed to achieve low cost and high performance control solutions for advanced inverterized appliance motor control. IRMCK311 contains two computation engines. One is Motion Control Engine (MCE TM) for sensorless control of permanent magnet motors; the other is an 8-bit high-speed microcontroller (8051). Both computation engines are integrated into one monolithic chip. The MCE TM contains a collection of control elements such as Proportional plus Integral, Vector rotator, Angle estimator, Multiply/Divide, Low loss SVPWM, Single Shunt IFB. The user can program a motion control algorithm by connecting these control elements using a graphic compiler. Key components of the sensorless control algorithms, such as the Angle Estimator, are provided as complete pre-defined control blocks implemented in hardware. A unique analog/digital circuit and algorithm to fully support single shunt current reconstruction is also provided. The 8051 microcontroller performs 2-cycle instruction execution (16MIPS at 33MHz). The MCE and 8051 microcontroller are connected via dual port RAM to process signal monitoring and command input. An advanced graphic compiler for the MCE TM is seamlessly integrated into the MATLAB/Simulink environment, while third party JTAG based emulator tools are supported for 8051 developments. IRMCK311 comes with a small QFP64 pin lead-free package.TABLE OF CONTENTS1 Overview (5)2 IRMCK311 Block Diagram and Main Functions (6)3 Pinout (8)4 Input/Output of IRMCK311 (9)4.1 8051 Peripheral Interface Group (10)4.2 Motion Peripheral Interface Group (10)4.3 Analog Interface Group (11)4.4 Power Interface Group (11)4.5 Test Interface (12)5 Application Connections (13)6 DC Characteristics (14)6.1 Absolute Maximum Ratings (14)6.2 System Clock Frequency and Power Consumption (14)6.3 Digital I/O DC Characteristics (15)6.4 PLL and Oscillator DC Characteristics (15)6.5 Analog I/O DC Characteristics (16)6.6 Under Voltage Lockout DC Characteristics (17)6.7 AREF Characteristics (17)7 AC Characteristics (18)7.1 PLL AC Characteristics (18)7.2 Analog to Digital Converter AC Characteristics (19)7.3 Op Amp AC Characteristics (19)7.4 SYNC to SVPWM and A/D Conversion AC Timing (20)7.5 GATEKILL to SVPWM AC Timing (21)7.6 Interrupt AC Timing (21)7.7 I2C AC Timing (22)7.8 SPI AC Timing (23)7.8.1 SPI Write AC timing (23)7.8.2 SPI Read AC Timing (24)7.9 UART AC Timing (25)7.10 CAPTURE Input AC Timing (26)7.11 JTAG AC Timing (27)7.12 OTP Programming Timing (28)8 I/O Structure (29)9 Pin List (32)Dimensions (35)10 Package11 Part Marking Information (36)Information (36)12 OrderingTABLE OF FIGURESFigure 1. Typical Application Block Diagram Using IRMCK311 (5)Figure 2. IRMCK311 Internal Block Diagram (6)Figure 3. IRMCK311 Pin Configuration (8)Figure 4. Input/Output of IRMCK311 (9)Figure 5. Application Connection of IRMCK311 (13)Figure 6. Clock Frequency vs. Power Consumption (14)Figure 7 Crystal oscillator circuit (18)Figure 8 Voltage droop of sample and hold (19)Figure 9 SYNC to SVPWM and A/D conversion AC Timing (20)Figure 10 GATEKILL to SVPWM AC Timing (21)Figure 11 Interrupt AC Timing (21)Figure 12 I2C AC Timing (22)Figure 13 SPI AC Timing (23)Figure 14 SPI Read AC Timing (24)Figure 15 UART AC Timing (25)Figure 16 CAPTURE Input AC Timing (26)Figure 17 JTAG AC Timing (27)Figure 18 OTP Programming Timing (28)Figure 19 All digital I/O except motor PWM output (29)Figure 20 RESET, GATEKILL I/O (29)Figure 21 Analog input (30)Figure 22 Analog operational amplifier output and AREF I/O structure (30)Figure 23 VPP programming pin I/O structure (30)Figure 24 VSS and AVSS pin structure (31)Figure 25 VDD1 and VDDCAP pin structure (31)Figure 26 XTAL0/XTAL1 pins structure (31)TABLE OF TABLESTable 1. Absolute Maximum Ratings (14)Table 2. System Clock Frequency (14)Table 3. Digital I/O DC Characteristics (15)Table 4. PLL DC Characteristics (15)Table 5. Analog I/O DC Characteristics (16)Table 6. UVcc DC Characteristics (17)Table 7. AREF DC Characteristics (17)Table 8. PLL AC Characteristics (18)Table 9. A/D Converter AC Characteristics (19)Table 10. Current Sensing OP Amp AC Characteristics (19)Table 11. SYNC AC Characteristics (20)Table 12. GATEKILL to SVPWM AC Timing (21)Table 13. Interrupt AC Timing (21)Table 14. I2C AC Timing (22)Table 15. SPI Write AC Timing (23)Table 16. SPI Read AC Timing (24)Table 17. UART AC Timing (25)Table 18. CAPTURE AC Timing (26)Table 19. JTAG AC Timing (27)Table 20. OTP Programming Timing (28)Table 21. Pin List (32)1 OverviewIRMCK311 is a new International Rectifier integrated circuit device primarily designed as a one-chip solution for complete inverter controlled appliance dual motor control applications. Unlike a traditional microcontroller or DSP, the IRMCK311 provides a built-in closed loop sensorless control algorithm using the unique Motion Control Engine (MCE TM) for permanent magnet motors. The MCE TM consists of a collection of control elements, motion peripherals, a dedicated motion control sequencer and dual port RAM to map internal signal nodes. IRMCK311 also employs a unique single shunt current reconstruction circuit to eliminate additional analog/digital circuitry and enables a direct shunt resistor interface to the IC. The sensorless control is the same for both motors with a single shunt current sensing capability. Motion control programming is achieved using a dedicated graphical compiler integrated into the MATLAB/Simulink TM development environment. Sequencing, user interface, host communication, and upper layer control tasks can be implemented in the 8051 high-speed 8-bit microcontroller. The 8051 microcontroller is equipped with a JTAG port to facilitate emulation and debugging tools. Figure 1 shows a typical application schematic using IRMCK311.IRMCK311 is intended for volume production purpose and contains 64K bytes of OTP (One Time Programming) ROM, which can be programmed through a JTAG port. For a development purpose use, IRMCF311 contains a 48k byte of RAM in place of program OTP to facilitate an application development work. Both IRMCF311 and IRMCK311 come in the same 64-pin QFP package with identical pin configuration to facilitate PC board layout and transition to mass productionFigure 1. Typical Application Block Diagram Using IRMCK3112 IRMCK311 Block Diagram and Main FunctionsM o t i o n C o n t r o l B u sFigure 2. IRMCK311 Internal Block DiagramIRMCK311 contains the following functions for sensorless AC motor control applications:• Motion Control Engine (MCE TM )o Proportional plus Integral block o Low pass filtero Differentiator and lag (high pass filter) o Ramp o Limito Angle estimate (sensorless control) o Inverse Clark transformation o Vector rotator o Bit latch o Peak detect o Transitiono Multiply-divide (signed and unsigned)o Divide (signed and unsigned)o Addero Subtractoro Comparatoro Countero Accumulatoro Switcho Shifto ATAN (arc tangent)o Function block (any curve fitting, nonlinear function)o16-bit wide Logic operations (AND, OR, XOR, NOT, NEGATE)o MCE TM program and data memory (6K byte). Note 1o MCE TM control sequencer• 8051 microcontrollero Three 16-bit timer/counterso16-bit periodic timero16-bit analog watchdog timero16-bit capture timero Up to 36 discrete I/Oso Eleven-channel 12-bit A/DFive buffered channels (0 – 1.2V input)One unbuffered channel (0 – 1.2V input)o JTAG port (4 pins)o Up to three channels of analog output (8-bit PWM)o Two UARTo I2C/SPI porto 64K byte Note 1program One-Time Programmable memoryo2K byte data RAM. Note 2Note 1: Total size of OTP memory is 64K byte, however MCE program occupiesmaximum 8K byte which will be loaded into internal RAM at a powerup/bootprocess. Therefore only 56K byte OTP memory area is usable for 8051microcontroller.Note 2: Total size of RAM is 8K byte including MCE program, MCE data, and 8051data. Different sizes can be allocated depending on applications.3 PinoutXTAL0XTAL1P1.1/RXD P1.2/TXDVDD1VSS VDD2P1.3/SYNC/SCKP1.4/CAPP 3.6/R X D 1P 3.7/T X D 1FPWMVL FPWMUL V S SV D D 2A V D DA V S SA I N 0A R E FP 2.7/A O P W M 1P 2.6/A O P W M 0CPWMUH CPWMVH CPWMWH CPWMUL CPWMVL CPWMWL CGATEKILL VDD1VSS I F B C OI F B C +I F B C -P L L V S SP L L V D DR E S E TN CT C KP 5.3/T D IP 5.2/T D OP 5.1/T M SS D A /C S 0S C L /S O -S I /V P PP 5.0/P F C G K I L LP F C P W M V S SFGATEKILL FPWMWL VAC-VAC+VACO IPFCO IPFC+IPFC-I F B F OI F B F +I F B F -P3.0/INT2/CS1C M E X TFPWMVH FPWMUHFPWMWH A I N 1P 3.2/I N T 0Figure 3. IRMCK311 Pin Configuration4 Input/Output of IRMCK311All I/O signals of IRMCK311 are shown in Figure 4. All I/O pins are 3.3V logic interface except A/D interface pins.Figure 4. Input/Output of IRMCK3114.1 8051 Peripheral Interface GroupUART InterfaceP1.1/RXD Input, Receive data to IRMCK311, can be configured as P1.1P1.2/TXD Output, Transmit data from IRMCK311, can be configured as P1.22nd channel Receive data to IRMCK311, can be configured as P3.6 P3.6/RXD1 Input,P3.7/TXD1 Output,2nd channel Transmit data from IRMCK311, can be configured as P3.7Discrete I/O InterfaceP1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clock P1.4/CAP Input/output port 1.4, can be configured as Capture Timer inputP3.0/INT2/CS1 Input/output port 3.0, can be configured as external interrupt 2 or SPIchip select 1P3.2/INT0 Input/output port 3.2, can be configured as external interrupt 0Analog Output InterfaceP2.6/AOPWM0 Input/output, can be configured as 8-bit PWM output 0 withprogrammable carrier frequencyP2.7/AOPWM1 Input/output, can be configured as 8-bit PWM output 1 withprogrammable carrier frequencyCrystal InterfaceXTAL0 Input, connected to crystalXTAL1 Output, connected to crystalReset InterfaceRESET Inout, system reset, needs to be pulled up to VDD1 but doesn’t requireexternal RC time constantI2C/SPI InterfaceSCL/SO-SI/VPP Output, I2C clock output, SPI SO-SII2C Data line, Chip Select 0 of SPISDA/CS0 Input/output,P3.0/INT2/CS1 Input/output port 3.0, can be configured as external interrupt 2 or SPIchip select 1P1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clock 4.2 Motion Peripheral Interface GroupPWMCPWMUH Output, motor 1 PWM phase U high side gate signalCPWMUL Output, motor 1 PWM phase U low side gate signalCPWMVH Output, motor 1 PWM phase V high side gate signalCPWMVL Output, motor 1 PWM phase V low side gate signalCPWMWH Output, motor 1 PWM phase W high side gate signalCPWMWL Output, motor 1 PWM phase W low side gate signalFPWMUH Output, motor 2 PWM phase U high side gate signalFPWMUL Output, motor 2 PWM phase U low side gate signal分销商库存信息: IRIRMCK311TR。

WM8731中文资料

WM8731带有集成耳机驱动器的低功耗音频编码解码器(CODEC)描述WM8731是一款带有集成耳机驱动器的极低功耗、高质量音频编码解码器，专为便携数字音频应用而设计。

该器件能够提供CD音质的音频录音和回放，为16欧姆的负载提供50mW的输出功率。

该器件的数字部份运行的最低电源电压为，同时模拟部份要求的电压最小为。

WM8731具有多种功耗降低模式，为用户幸免电池功率消耗。

WM8731在回放模式下的典型功率消耗为，同步录音和回放时)的功率消耗为24mW。

待机模式下，供电电流可降低到50μA。

WM8731带有一个片上时钟发生器，支持多种时钟模式。

通过一个12MHz时钟，该器牛能够直接生成、48kHz和96kHz等采样率，和MP3标准概念的其他采样率，完全不需要一个独立的锁相环或晶振。

支持其他公用的主时钟频率，例如。

特色带有集成耳机驱动器的立体声音编解码器(50mV on 16W @数字电源电压模拟电源电压(标准版)模拟电源电压(‘L’版)回放模式下功耗<=18mW100dB信噪比(‘A’weighted @48kHz)的数模转换器90dB信噪比(‘A’weighted @48kHz)的模数转换器采样率范围：8kHz-96kHz主时钟或从时钟模式USB时钟模式能够从USB时钟直接生成一样的MP3的所有采样率输出问题是和静间操纵麦克风输入和带有侧音混频器的驻极体偏压可选择的模数转换器(ADC)高能滤波器2线和3线微处置器(MPU)串行操纵接口可编程音频数据接口模式28接脚SSOP封装 28接脚QFN封装芯片框图应用便携MP3播放器和录音器CD和小型唱片录音管脚图管脚描述28PIN SSOP 28PINQFNNAME种类描述15DBVDD电源带数字缓冲器 VDD26CLKOUT数字输出带缓冲的时钟输出37BCLK数字输入/输出数字音频位时钟，下拉(见标注1)48DACDAT数字输入DAC数字音频数据输入59DACLRC数字输入/输出DAC采样率左/右时钟，下拉(见标注1) 610ADCDAT数字输出ADC数字音频数据输出711ADCLRC数字输入/输出ADC采样率左/右时钟，下拉(见标注1) 812HPVDD电源耳机VDD913LHPOUT模拟输出左声道耳机输出1014RHPOUT模拟输出右声道耳机输出1115HPGND地耳机接地1216LOUT模拟输出左声道线性输出1317ROUT模拟输出右声道线性输出1418AVDD电源模拟 VDD1519AGND地模拟 GND1620VMID模拟输出中间轨切入点标注：1．上拉/下拉仅当操纵寄放器字ACTIVE=0时显现最大绝对额定值最大绝对额定值仅是危险额定。

AP4313中文规格书,AP4313KTR-G1中文datasheet翻译

0.200(0.008)
2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067)
引脚1含有圆点标注
1
2
3
0.950(0.037)典型
1.800(0.071) 2.000(0.079)
0.700(0.028)参考值
0.000(0.000) 0.150(0.006)
GND
R5
ICTRL
VSENSE
R1
R6 500
Rss
VOUT
= VREF
× R1+ R2 R1
(V)
限流电流 = VSENSE (A) RSS
图 10. AP4313的典型应用1
VOUT+ IL Load
VOUT-
2010年5月版本2. 0
BCD 新进半导体制造有限公司 8
恒压恒流控制器典型应用 (续页)
产品规格书 AP4313
I (mA)
OS
I (mA)
CC
60
50
40
30
20
V =12V
CC
V =5V
CC
V =2.5V
10
CC
0
-40
-20
0
20
40
60
80
100
120
环境温度(oC)
图 8. 输出引脚的短路电流 – 环境温度关系图
1.4
1.0
0.8
0.6
0.4
0.2
0.0
-40
-20
0
CC
V =5V CC
BCD 新进半导体制造有限公司 1
恒压恒流控制器引脚信息

5833中文资料

5833中⽂资料Designed to reduce logic supply current, chip size, and system cost, the UCN5833A/EP integrated circuits offer high-speed operation for thermal printers. These devices can also be used to drive multi-plexed LED displays or incandescent lamps within their 125 mA peak output current rating. The combination of bipolar and MOS technolo-gies gives BiMOS II smart power ICs an interface flexibility beyond the reach of standard buffers and power driver circuits.These 32-bit drivers have bipolar open-collector npn Darlington outputs, a CMOS data latch for each of the drivers, a 32-bit CMOS shift register, and CMOS control circuitry. The high-speed CMOS shift registers and latches allow operation with most microprocessor-based systems at data input rates above 3.3 MHz. Use of these drivers with TTL may require input pull-up resistors to ensure an input logic high.The UCN5833A is supplied in a 40-pin dual in-line plastic package with 0.600" (15.24 mm) row spacing. At an ambient temperature of +75°C, all outputs of the DlP-packaged device will sustain 50 mA continuously. For high-density applications, the UCN5833EP is available. This 44-lead plastic chip carrier (quad pack) is intended for surface-mounting on solder lands with 0.050" (1.27 mm) centers.CMOS serial data outputs permit cascading for applications requiring additional drive lines.FEATURESI To 3.3 MHz Data Input Rate I 30 V Minimum Output Breakdown I Darlington Current-Sink Outputs I Low-Power CMOS Logic and LatchesBiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVERAlways order by complete part number:Part Number Package UCN5833A 40-Pin DIP UCN5833EP 44-Lead PLCCData Sheet 26185.16A*58335833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVER115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000SERIAL DATA IN POWER STROBE OUT OUT OUT OUT OUT OUT 123456OUT7OUT 8OUT 9OUTOUT OUTOUT OUTLOGIC SUPPLY OUT OUT Dwg. No. A-13,051TYPICAL OUTPUT DRIVERSUBOUT115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000Copyright ? 1986, 1995, Allegro MicroSystems, Inc.5833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVERTRUTH TABLEL = Low Logic Level H = High Logic Level X = Irrelevant P = Present State R = Previous StateELECTRICAL CHARACTERISTICS at T A = +25°C, V DD = 5 V (unless otherwise noted).Limits CharacteristicSymbol Test Conditions Min.Max.Units Output Leakage Current I CEX V OUT = 30 V, T A = 70°C —10µA Collector-Emitter V CE(SAT)l OUT = 50 mA — 1.2V l OUT = 100 mA— 1.7V Input VoltageV IN(1) 3.5 5.3V V IN(0)-0.3+0.8V Input Currentl IN(1)V IN = 5.0 V — 1.0µA l IN(0)V IN = 0 V —-1.0µA Serial Output VoltageV OUT(1)I OUT = -200 µA 4.5—V V OUT(0)I OUT = 200 µA—0.3V Supply Currentl DD One output ON, l OUT = 100 mA — 1.0mA All outputs OFF—50µA Output Rise Time t r l OUT = 100 mA, 10% to 90%—500ns Output Fall Timet fl OUT = 100 mA, 90% to 10%—500nsNOTE: Positive (negative) current is defined as going into (coming out of) the specified device pin.Saturation Voltage5833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVER115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000TIMING CONDITIONS(V DD = 5.0 V, Logic Levels are V DD and Ground)A.Minimum Data Active Time Before Clock Pulse(Data Set-Up Time)..........................................................................75 ns B.Minimum Data Active Time After Clock Pulse(Data Hold Time).............................................................................75 ns C.Minimum Data Pulse Width ................................................................150 ns D.Minimum Clock Pulse Width...............................................................150 nsE.Minimum Time Between Clock Activation and Strobe.......................300 nsF.Minimum Strobe Pulse Width .............................................................100 nsG.Typical Time Between Strobe Activation andOutput Transition ...........................................................................500 nsDwg. No. A-12,276ASerial Data present at the input is transferred to the shift register on the logic “0” to logic “1” transition of the CLOCK input pulse. On succeeding CLOCK pulses, the registers shift data information towards the SERIAL DATA OUTPUT. The SERIAL DATA must appear at the input prior to the rising edge of the CLOCK input waveform.Information present at any register is transferred to its respective latch when the STROBE is high (serial-to-parallel conversion). The latches will continue to accept new data as long as the STROBE is held high. Applications where the latches are bypassed (STROBE tied high) will require that the OUTPUT ENABLE input be low during serial data entry.When the OUTPUT ENABLE input is low, all of the output buffers are disabled (OFF) without affecting the information stored in the latches or shift register. With the OUTPUT ENABLE input high, the outputs are controlled by the state of the latches.CLOCK DATA INSTROBE NOUTPUT ENABLEOUT5833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVERNOTES:1.Exact body and lead configuration at vendor’s option within limits shown.2.Lead spacing tolerance is non-cumulative.3.Lead thickness is measured at seating plane or below.UCN5833ADimensions in Inches (controlling dimensions)Dimensions in Millimeters (for reference only)123Dwg. MA-003-40 mm20421123Dwg. MA-003-40 in2045833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVER115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000UCN5833EPDimensions in Inches (controlling dimensions)Dimensions in Millimeters (for reference only)Dwg. MA-005-44A mm0.53340Dwg. MA-005-44A in0.021740NOTES:1.Exact body and lead configuration at vendor’s option within limits shown.2.Lead spacing tolerance is non-cumulative.5833BiMOS II 32-BITSERIAL-INPUT,LATCHED DRIVERThe products described here are manufactured under one or more U.S. patents or U.S. patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi-bility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. 5833BiMOS II 32-BIT SERIAL-INPUT,LATCHED DRIVER115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000POWERINTERFACE DRIVERSFunctionOutput Ratings*Part Number ?SERIAL-INPUT LATCHED DRIVERS8-Bit (saturated drivers)-120 mA 50 V?58958-Bit 350 mA 50 V 58218-Bit 350 mA 80 V 58228-Bit 350 mA 50 V?58418-Bit 350 mA 80 V?58428-Bit (constant-current LED driver)75 mA 17 V 62758-Bit (DMOS drivers)250 mA 50 V 65958-Bit (DMOS drivers)350 mA 50 V?6A5958-Bit (DMOS drivers)100 mA 50 V 6B59510-Bit (active pull-downs)-25 mA 60 V 5810-F and 6809/1012-Bit (active pull-downs)-25 mA 60 V 5811 and 681116-Bit (constant-current LED driver)75 mA 17 V 627620-Bit (active pull-downs)-25 mA 60 V 5812-F and 681232-Bit (active pull-downs)-25 mA 60 V 5818-F and 681832-Bit100 mA 30 V 583332-Bit (saturated drivers)100 mA 40 V 5832PARALLEL-INPUT LATCHED DRIVERS4-Bit350 mA 50 V?58008-Bit -25 mA 60 V 58158-Bit350 mA 50 V?58018-Bit (DMOS drivers)100 mA 50 V 6B2738-Bit (DMOS drivers)250 mA 50 V 6273SPECIAL-PURPOSE DEVICESUnipolar Stepper Motor Translator/Driver 1.25 A 50 V?5804Addressable 8-Bit Decoder/DMOS Driver 250 mA 50 V6259Addressable 8-Bit Decoder/DMOS Driver 350 mA 50 V?6A259Addressable 8-Bit Decoder/DMOS Driver 100 mA 50 V 6B259Addressable 28-Line Decoder/Driver 450 mA30 V6817*Current is maximum specified test condition, voltage is maximum rating. See specification for sustaining voltagelimits.Negative current is defined as coming out of (sourcing) the output.Complete part number includes additional characters to indicate operating temperature range and package style. Internal transient-suppression diodes included for inductive-load protection.。

Maxim_Integrated-DS32KHZ_DIP-datasheet.1.pdf - DS

DS32kHz32.768kHz Temperature-CompensatedCrystal OscillatorGENERAL DESCRIPTIONThe DS32kHz is a temperature-compensated crystal oscillator (TCXO) with an output frequency of 32.768kHz. This device addresses applications requiring better timekeeping accuracy, and can be used to drive the X1 input of most Dallas Semiconductor real-time clocks (RTCs), chipsets, and other ICs containing RTCs. This device is available in commercial (DS32kHz) and industrial (DS32kHz-N) temperature versions.APPLICATIONSGPS Receivers TelematicsNetwork Timing and Synchronization in Servers, Routers, Hubs, and Switches Automatic Power MetersFEATURESAccurate to ±4 Minutes/Year (-40°C to +85°C) Accurate to ±1 Minute/Year (0°C to +40°C) Battery Backup for Continuous Timekeeping V BAT Operating Voltage: 2.7V to 5.5V with V CCGroundedV CC Operating Voltage: 4.5V to 5.5V Operating Temperature Range:0°C to +70°C (Commercial) -40°C to +85°C (Industrial)No Calibration Required Low-Power ConsumptionSurface Mountable Using BGA Package UL RecognizedORDERING INFORMATIONPARTTEMP RANGEPIN-PACKAGETOP MARK*DS32KHZ/DIP 0ºC to +70ºC 14 DIP DS32KHZ DS32KHZN/DIP -40ºC to +85ºC 14 DIPDS32KHZ-N DS32KHZS 0ºC to +70ºC 16 SO (0.300”) DS32KHZS DS32KHZS# 0ºC to +70ºC 16 SO (0.300”) DS32KHZS DS32KHZSN -40ºC to +85ºC 16 SO (0.300”) DS32KHZSN DS32KHZSN# -40ºC to +85ºC 16 SO (0.300”) DS32KHZSN DS32KHZ/WBGA 0ºC to +70ºC 36 BGA DS32KHZ DS32KHZN/WBGA-40ºC to +85ºC36 BGADS32KHZ-N#Denotes a RoHS-compliant device that may include lead that is exempt under the RoHS requirements. The lead finish is JESD97 category e3, and is compatible with both lead-based and lead-free soldering processes.*A “#” anywhere on the top mark denotes a RoHS-compliant device. An “N” denotes an industrial device.PIN CONFIGURATIONSABSOLUTE MAXIMUM RATINGSVoltage Range on Any Pin Relative to Ground………………………………………………………………-3.0V to +7.0V Operating Temperature Range (Noncondensing)Commercial:…………………………………………………………………………………………………..0°C to +70°CIndustrial:……………………………………………………………………………………………………-40°C to +85°CStorage Temperature Range………………………………………………………………………………….-40°C to +85°C Soldering Temperature (BGA, SO)……………………….See the Handling, PC Board Layout, and Assembly section. Soldering Temperature, Leads (DIP)……………………………………………………..+260°C for 10 seconds (Note 1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications isnot implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.RECOMMENDED DC OPERATING CONDITIONS(T A = -40°C to +85°C) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITS Power-Supply Voltage V CC(Note2) 4.5 5.0 5.5 VBattery Voltage V BAT(Notes 2, 3) 2.7 3.0 3.5,5.5VDC ELECTRICAL CHARACTERISTICS(Over the operating range, unless otherwise specified.) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITSActive Supply Current I CC V BAT = 0V or2.7V ≤ V BAT≤3.5V(Notes 3, 4)150 220 μABattery Input-Leakage Current I BATLKG V CC MIN≤ V CC≤ V CC MAX -50 +50 nAHigh Output Voltage (V CC) V OH I OH = -1.0mA (Note 2) 2.4 VLow Output Voltage V OL I OL = 2.1mA (Note 2) 0.4 VHigh Output Voltage (V BAT) V OH I OH = -0.1mA (Note 2) 2.4 VBattery Switch Voltage V SW(Note 2) V BAT V(V CC = 0V, T A = -40°C to +85°C.) (Note 1)PARAMETER SYMBOL CONDITIONS MINTYPMAXUNITS Active Battery Current I BAT V BAT = 3.3V (Notes 4, 5, 6) 1 4 μABattery Current DuringTemperature MeasurementI BATCNV V BAT = 3.3V (Notes 4, 5, 7) 450 μANote 1:Limits at -40°C are guaranteed by design and are not production tested.Note 2:All voltages are referenced to ground.Note 3:V BAT must be no greater than 3.5V when the device is used in the dual-supply operating modes.Note 4:Typical values are at +25°C and 5.0V V CC, 3.0 V BAT, unless otherwise indicated.Note 5:These parameters are measured under no output load conditions.Note 6:This current is the active-mode current sourced from the backup supply/battery.Note 7: A temperature conversion lasts 122ms (typ) and occurs on power-up and then once every 64 seconds.AC TIMING CHARACTERISTICS(Over the operating range, unless otherwise specified.)PARAMETER SYMBOLCONDITIONSMINTYPMAXUNITSOutput Frequency f OUT32.768kHz0°C to +40°C -2.0 +2.0Frequency Stability vs. Temperature ∆f/f O-40°C to +85°C or0°C to +70°C-7.5 +7.5ppmDuty Cycle t W/t 45 50 55 % Cycle Time t CYC(Note 8) 30.518 μsHigh/Low Time t H/t L(Note8) 15.06 μsRise Time t R(Note 8) 200 nsFall Time t F(Note8) 60 ns Oscillator Startup Time t OSC(Note 8) 1 secondsFrequency Stability vs. Operating Voltage ∆f/VV CC = 5.0V orV BAT = 3.0V, V CC = 0V(Notes 4, 9)+2.5 ppm/VCrystal Aging (First Year) ∆f/f O(Notes 4, 10) ±1.0 ppmNote 8:These parameters are measured using a 15pF load.Note 9:Error is measured from the nominal supply voltage of whichever supply is powering the device.Note 10:After reflow.TYPICAL OPERATING CHARACTERISTICSPIN DESCRIPTIONPINSO BGA DIPNAME FUNCTION1 C4, C5, D4, D5 12 32kHz 32.768kHz Push-Pull Output2 C2, C3, D2, D3 13 V CC Primary Power Supply3–12, 15, 16 A7, A8, B7, B8,C7, C8, D7, D81, 6–11, 14 N.C. No Connection (Must be grounded)13 All remainingballs4 GNDGround14 A4, A5, B4, B5 5 V BAT +3V Nominal Supply Input. Used to operate the device when V CC is absent.Figure 2. Delta Time and Frequency vs. TemperatureFUNCTIONAL DESCRIPTIONThe DS32kHz is a temperature-compensated crystal oscillator (TCXO) that outputs a 32,768Hz square wave. While the DS32kHz is powered by either supply input, the device measures the temperature every 64 seconds and adjusts the output frequency. The device requires four pins for operation: V CC, GND, V BAT, and 32kHz. (See Figure 4 for connection schemes.) Power is applied through V CC and GND, while V BAT is used to maintain the 32kHz output in the absence of power. Once every 64 seconds, the DS32kHz measures the temperature and adjusts the output frequency. The output is accurate to ±2ppm (±1 min/yr) from 0°C to +40°C and to ±7.5ppm (±4 min/year) from -40°C to 0°C and from +40°C to +85°C.The DS32kHz is packaged in a 36-pin ball grid array (BGA). It also is available in a 16-pin 0.300” SO and a 14-pin encapsulated DIP (EDIP) module.The additional PC board space required to add the DS32kHz as an option for driving a RTC is negligible in many applications (see Figure 6) Therefore, adding the DS32kHz to new designs and future board revisions allows the use of the DS32kHz where applications require improved timekeeping accuracy.Figure 3. Block DiagramOPERATIONThe DS32kHz module contains a quartz tuning-fork crystal and an IC. When power is first applied, and when the device switches between supplies, the DS32kHz measures the temperature and adjusts the crystal load to compensate the frequency. The power supply must remain at a valid level whenever a temperature measurement is made, including when V CC is first applied. While powered, the DS32kHz measures the temperature once every 64 seconds and adjusts the crystal load.The DS32kHz is designed to operate in two modes. In the dual-supply mode, a comparator circuit, powered by V CC, monitors the relationship between the V CC and V BAT input levels. When V CC drops below a certain level compared to V BAT, the device switches over to V BAT (Figure 4A). This mode uses V CC to conserve the battery connected to V BAT while V CC is applied.In the single-supply mode, V CC is grounded and the unit is powered by V BAT. Current consumption is less than V CC, because the comparator circuit is unpowered (Figure 4B).Figure 4A shows how the DS32kHz should be connected when using two power supplies. V CC should be between 4.5V and 5.5V, and V BAT should be between 2.7V and 3.5V. Figure 4B shows how the DS32kHz can be used when only a single-supply system is available. V CC should be grounded and V BAT should then be held between 2.7V and 5.5V. The V BAT pin should be connected directly to a battery. Figure 4C shows a single-supply mode where V CC is held at +5V. See the frequency stability vs. operating voltage for information about frequency error vs. supply voltage.Figure 4. Power-Supply ConnectionsFigure 5 illustrates how a standard 32.768kHz crystal and the DS32kHz should be connected to address the interchangeable option. Using this connection scheme and the recommended layout provides a solution, which requires no hardware modifications. Only one device should be used at a time, and both layouts should be located very close together if the recommended layout is not used.The DS32kHz I CC and I BAT currents are specified with no output loads. Many RTC oscillator circuits use a quartz crystal or resonator. Driving the oscillator circuit with the rail-to-rail output of the DS32kHz can increase the I CC and I BAT currents significantly and increase the current consumption of the RTC as well. Figure 6 shows one circuit that can be used to reduce the current consumption of a DS32kHz and an RTC. The values of R1 and C1 may vary depending on the RTC used. However, values of 1.0MΩ and 100pF are recommended as a starting point. R2 is used to shift the input waveform to the proper level. The recommended value for R2 is 33kΩ.Figure 5. DS32kHz ConnectionsFigure 6. DS32kHz and RTC ConnectionsRELATED APPLICATION NOTES(Go to /RTCapps to find these application notes and more.)Application Note 58: Crystal Considerations with Dallas Real-Time ClocksApplication Note 701: Using the DS32kHz with Dallas RTCsHANDLING, PC BOARD LAYOUT, AND ASSEMBLYThese packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent damage to the crystal.Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line. All N.C. (no connect) pins must be connected to ground.The BGA package may be reflowed as long as the peak temperature does not exceed 240°C. Peak reflow temperature (≥230°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed 40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that the internal crystal is not exposed to temperatures above 150°C.Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package label must be followed to prevent damage during reflow. Refer to IPC/JEDEC J-STD-020 standard for moisture-sensitive device (MSD) classifications.PACKAGE INFORMATION(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package information,o to /DallasPackInfo.)gPACKAGE TYPE DOCUMENT NUMBER THETA-J A(°C/W)THETA-J C(°C/W)14-pin Encapsulated DIP 56-G0001-00216-pin SO (300 mils) 56-G4009-00173 23 36-pin BGA 56-G6023-00143.9 18.48 of 8Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product. No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time. Maxim In tegrated P roducts, 120 S an Gabriel D rive, Sun nyvale, CA94086 408-737-7600。

AU1PD-M384A;AU1PG-M384A;AU1PJ-M384A;AU1PD-M385A;AU1PG-M385A;中文规格书,Datasheet资料

Rated VR
μA ns pF
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A 4.0 V, 1 MHz
Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width 40 ms
New Product
AU1PD thru AU1PM

Vishay General Semiconductor
Surface Mount Ultrafast Avalanche Rectifiers
FEATURES
eSMP Series
®
• Very low profile - typical height of 1.0 mm • Ideal for automated placement • Glass passivated chip junction • Ultrafast recoveray times for high frequency • Low reverse current • Meets MSL level 1, per LF maximum peak of 260 °C J-STD-020,
TYPICAL APPLICATIONS
For use in secondary rectification and freewheeling for ultrafast switching speeds of AC/AC and DC/DC converters in high temperature conditions for both consumer and automotive applications.

8753E8753ES8753D说明书

HP8753E 射频网络分析仪★频率范围：30kHz~3或6GHz★带有固态转换的集成化S参数测试装置★达110dB的动态范围★快的测量速度和数据传递速率★大屏幕LCD显示器加上供外部监视器用的VGA输出★同时显示所有4个S参数★将仪器状态和数据存储/调用到内置软盘驱动器★可选用的时域测量和扫描谐波测量HP 8753E射频网络分析仪为满足研制实验室或生产制造的测试需求，在速度、性能和方便使用上提供了无与伦比的结合。

8753E以其覆盖3或6GHz频率范围的集成化S参数测试装置、达110dB的动态范围以及频率扫描和功率扫描，为表征有源或无源网络、元器件和子系统的线性和非线性特性提供了圆满的解决方案。

所使用的新型微处理器使测量和数据传递速率比以往的型号快达7倍之多。

网络分析仪的特点是有2个独立的测量通道，可同时测量和显示所有4个S参数。

可以选择用幅度、相位、群延迟、史密斯圆图、极坐标、驻波比或时域格式来显示反射和传输参数的任意组合。

便于使用的专用功能键能迅速访问各个测量功能。

可以利用达4个刻度格子在高分辩率的LCD彩色显示器上以重叠或分离屏面的形式来观察测量结果。

为了驱动更大的外部监视器，以便于观察，增加了与VGA兼容的输出。

较好的通用性和性能一个集成化的合成源提供了达10mW的输出功率(用选件011可达100mW)，1Hz的频率分辩率和线性频率，对数频率，列表频率，CW和功率扫描功能。

三个调谐接收机可以在6GHz(带有选件006频率扩展)处105dB或3GHz(标准)110dB的宽动态范围内进行独立的功率测量或同时比值测量。

集成化的测试装置可以在不使用倍频器的情况下，测量达6GHz装置的传输和反射特性。

为了在非同轴系统中进行方便而精确的测量，特提供了TRL*/LRM*1校准。

利用内置适配器移去校准技术，还能实现对非插入式器件的高精度测量。

高稳定度的频率基准(选件1D5)提高了对高Q器件，如表面声波(SAW)器件、晶体谐振器或介质谐振滤波器的频率测量精度。

IR313中文资料

元器件交易网Technical Data Sheet 4.7mm Round Non-flange Infrared LEDIR313Features․High reliability ․High radiant intensity ․Peak wavelength λp=940nm ․2.54mm Lead spacing ․Low forward voltage ․Pb free ․The product itself will remain within RoHS compliant version.Descriptions․EVERLIGHT’S Infrared Emitting Diode(IR313) is a high intensity diode , molded in a blue transparent plastic package. ․The device is spectrally matched with phototransistor , photodiode and infrared receiver module.Applications․Free air transmission system ․Infrared remote control units with high power requirement ․Smoke detector ․Infrared applied systemDevice Selection Guide LED Part No.IRChip MaterialGaAlAsLens ColorBlueEverlight Electronics Co., Ltd. Device No：DIR-031-191http:\\ Prepared date：03-30-2007Rev 2Page: 1 of 7Prepared by：Jaine Tsai元器件交易网IR313Package DimensionsNotes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.25mmAbsolute Maximum Ratings (Ta=25℃)Parameter Continuous Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature *2 Power Dissipation at(or below) 25℃Free Air Temperature *1 Symbol IF IFP VR Topr Tstg Tsol Pd Rating 100 1.0 5 -40 ~ +85 -40 ~ +85 260 150 Units mA A V ℃ ℃ ℃ mWNotes: *1:IFP Conditions--Pulse Width≦100μs and Duty≦1%. *2:Soldering time≦5 seconds.Everlight Electronics Co., Ltd. Device No：DIR-031-191http:\\ Prepared date：03-30-2007Rev 2Page: 2 of 7Prepared by：Jaine Tsai元器件交易网IR313Electro-Optical Characteristics (Ta=25℃)Parameter Symbol Condition IF=20mA IF=100mA Radiant Intensity IEPulse Width≦100μs ,Duty≦1%Min. 7.8 -----Typ. 15 75 700 940 45 1.2Max. -----1.5 1.8 4.0 10 --UnitsmW/srIF=1APulse Width≦100μs ,Duty≦1%.Peak Wavelength Spectral Bandwidthλp ΔλIF=20mA IF=20mA IF=20mA IF=100mAnm nmForward VoltageVFPulse Width≦100μs ,Duty≦1%-----1.4 2.6 -25VIF=1APulse Width≦100μs ,Duty≦1%.Reverse Current View AngleIR 2θ1/2VR=5V IF=20mAμA degRankCondition：IF=20mA Unit：mW/sr Bin Number Min Max M 7.80 12.5 N 11.0 17.6 P 15 24Everlight Electronics Co., Ltd. Device No：DIR-031-191http:\\ Prepared date：03-30-2007Rev 2Page: 3 of 7Prepared by：Jaine Tsai元器件交易网IR313Typical Electro-Optical Characteristics CurvesFig.1 Forward Current vs. Ambient Temperature140 120 100 80 60 40 200Fig.2 Spectral Distribution100 80 60 40 20 0IF=20mA Ta=25°C-40 -20 020406080100Fig.3 Peak Emission Wavelength Ambient TemperatureFig.4 Forward Current vs. Forward Voltage980104960109403109202900 -251 100 25 50 75 10001234Everlight Electronics Co., Ltd. Device No：DIR-031-191http:\\ Prepared date：03-30-2007Rev 2Page: 4 of 7Prepared by：Jaine Tsai元器件交易网IR313Typical Electro-Optical Characteristics CurvesFig.5 Relative Intensity vs. Forward Current Fig.6 Relative Radiant Intensity vs. Angular Displacement1000Ie-Radiant Intensity(mW/sr)-20-1001020 301001.0 0.940 50 60 70 80 0.6 0.4 0.2 0 0.2 0.4 0.6100.8 0.71 10010110210310 4IF-Forward Current (mA)Fig.7 Relative Intensity vs. Ambient Temperature(°C) Fig.8 Forward Current vs. Ambient Temperature(°C)20Ie-Radiant Intensity (mW/sr)1.315IF=20mA1.2IF=20mA101.1525 50 75 100 120125 50 75 100 120Everlight Electronics Co., Ltd. Device No：DIR-031-191http:\\ Prepared date：03-30-2007Rev 2Page: 5 of 7Prepared by：Jaine Tsai元器件交易网IR313Reliability Test Item And ConditionThe reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% NO. Item Test Conditions Test Hours/ Sample Cycles Sizes 10secs 22pcs IR≧U×2 IE≦L×0.8 VF≧U×1.2 U：Upper 1000hrs 1000hrs 1000hrs 1000hrs 22pcs 22pcs 22pcs 22pcs Specification Limit L：Lower Specification Limit 0/1 0/1 0/1 0/1 Failure Judgement Criteria Ac/Re1 Solder HeatTEMP.：260℃±5℃0/1 0/12 Temperature Cycle H : +100℃ L : -40℃ 3 Thermal Shock H :+100℃ L :-10℃ 4 High Temperature Storage 5 Low Temperature Storage15mins 300Cycles 22pcs 5mins 15mins 5mins 10secs 5mins 300Cycles 22pcs0/1TEMP.：+100℃ TEMP.：-40℃6 DC Operating Life IF=20mA 7 High Temperature/ 85℃ / 85% R.H High HumidityEverlight Electronics Co., Ltd. Device No：DIR-031-191http:\\ Prepared date：03-30-2007Rev 2Page: 6 of 7Prepared by：Jaine Tsai元器件交易网IR313Packing Quantity Specification1.500PCS/1Bag，5Bags/1Box 2.10Boxes/1CartonLabel Form SpecificationCPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production PlaceRoHSIR313Notes1. Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.CTel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http:\\Everlight Electronics Co., Ltd. Device No：DIR-031-191http:\\ Prepared date：03-30-2007Rev 2Page: 7 of 7Prepared by：Jaine Tsai。